Laser repair monitoring device, method, storage medium and program product

Abstract

The application discloses a kind of laser repair monitoring device, method, storage medium and program product, it is related to laser repair technical field, device includes: industrial control system;Pulse laser, pulse laser is connected with industrial control system communication, and industrial control system controls pulse laser and issues repair laser;Laser repair light path, repair laser converges to sample through laser repair light path, and sample is repaired;Detection module, detection module is connected with industrial control system communication, and detection light emitted by detection module reaches the repair position of sample through laser repair light path, and is reflected back in detection module from repair position through laser repair light path;Detection module includes detector, and detector real-time detection reflected detection light.The application can realize the real-time monitoring of laser repair process, improve laser repair effect.

Description

Technical Field

[0001] This application relates to the field of laser repair technology, and in particular to a laser repair monitoring device, method, storage medium, and program product. Background Technology

[0002] Laser repair technology is a technique that uses a high-energy laser beam to heat, melt, and solidify the surface of materials to repair surface defects or improve their performance. By precisely controlling laser parameters, this technology can achieve localized modification of materials at the micrometer or even nanometer scale, and is applicable to various materials such as metals, ceramics, and plastics. Laser repair technology has advantages such as being non-contact, having a small heat-affected zone, high precision, and being capable of automated operation, and has been applied in many industries, such as the repair of display panels, semiconductor panels, and optical components.

[0003] To ensure the quality and efficiency of repairs, real-time monitoring of the repair results during laser repair is crucial. This not only helps in the immediate detection and correction of problems but also reduces material waste and improves production efficiency. Although existing technologies can meet some basic monitoring needs, in certain situations, especially for the detection of minute or deep defects, the accuracy and resolution of existing technologies are still insufficient. Furthermore, real-time monitoring is not possible due to slow processing speeds or data transmission delays. Summary of the Invention

[0004] The main purpose of this application is to provide a laser repair monitoring device, method, storage medium, and program product, which aims to solve the technical problem that the existing laser repair monitoring technology is not accurate enough and cannot achieve real-time monitoring.

[0005] To achieve the above objectives, this application proposes a laser repair monitoring device, which includes:

[0006] Industrial control systems;

[0007] A pulsed laser, which is communicatively connected to the industrial control system, wherein the industrial control system controls the pulsed laser to emit a repair laser, and the repair laser is a pulsed laser;

[0008] A laser repair optical path is provided, wherein the repair laser is focused onto the sample through the laser repair optical path to repair the sample;

[0009] The detection module is communicatively connected to the industrial control system. The detection light emitted by the detection module reaches the repair position of the sample through the laser repair optical path, and is reflected back to the detection module from the repair position through the laser repair optical path.

[0010] The detection module includes a detector that detects the reflected detection light in real time.

[0011] In some embodiments, the detection module further includes a laser pointer, a beam splitter, and a first converging lens;

[0012] The laser pointer emits the detection light, which enters the laser repair optical path after passing through the beam splitter.

[0013] The reflected detection light passes through the laser repair optical path to the beam splitter, is reflected by the beam splitter to the first converging mirror, and is then converged to the detector.

[0014] In some embodiments, the detection light emitted by the laser pointer is a continuous laser with a diameter of less than 1 mm.

[0015] In some embodiments, the laser repair optical path includes a first reflecting mirror, an x-direction galvanometer, a y-direction galvanometer, a first beam splitter, a z-direction driver, and a second converging mirror;

[0016] The x-direction galvanometer controls the deflection of the beam in the x-direction, the y-direction galvanometer controls the deflection of the beam in the y-direction, and the z-direction driver drives the second converging mirror to move in the z-direction.

[0017] The repair laser is reflected by the first reflector to the x-direction galvanometer, reflected by the x-direction galvanometer to the y-direction galvanometer, reflected by the y-direction galvanometer, and then passes through the first beam splitter to reach the second converging lens, where it is focused onto the sample.

[0018] The detection light is reflected by the first reflector to the x-direction galvanometer, then reflected by the x-direction galvanometer to the y-direction galvanometer, reflected by the y-direction galvanometer, and passes through the first beam splitter to reach the second converging lens. It is obliquely incident on the sample, reflected at the repair position, and returns to the detection module.

[0019] In some embodiments, the laser repair monitoring device further includes a microscopic imaging module, which includes an imaging light source, a collimating and beam expanding lens group, a second beam splitter, a tube mirror, and a camera.

[0020] The imaging light source emits imaging light rays, which pass through the collimating and expanding lens group and the second beam splitter into the laser repair optical path, reach the sample, are reflected by the sample to the second beam splitter, and then enter the tube mirror under the reflection of the second beam splitter, reaching the camera for imaging.

[0021] In some embodiments, the laser repair monitoring device further includes a beam shaping module, a second reflector, and a third beam splitter.

[0022] The beam shaping module shapes the pulsed laser into a flat-top pulsed laser. The flat-top pulsed laser is reflected by the second reflector to the third beam splitter and then reflected by the third beam splitter into the laser repair optical path.

[0023] In some embodiments, the laser repair monitoring device further includes a motion stage, which is communicatively connected to the industrial control system. The motion stage carries the sample and moves in position under the control of the industrial control system.

[0024] Furthermore, to achieve the above objectives, this application also proposes a laser repair monitoring method, applied to the laser repair monitoring device described above, comprising:

[0025] Determine the repair location for the sample;

[0026] The laser repair parameters are set by the industrial control system, and the pulsed laser is controlled to emit a repair laser. The repair laser is focused to the repair position through the laser repair optical path for repair.

[0027] The detection module monitors the axial height change at the repair location in real time;

[0028] If the height of the repair position reaches a preset height, stop the repair, or determine the next repair position for the sample.

[0029] In addition, to achieve the above objectives, this application also proposes a storage medium, which is a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, it implements the steps of the laser repair monitoring method described above.

[0030] In addition, to achieve the above objectives, this application also provides a computer program product, which includes a computer program that, when executed by a processor, implements the steps of the laser repair monitoring method described above.

[0031] The laser repair monitoring device proposed in this application includes: an industrial control system; a pulsed laser, which is communicatively connected to the industrial control system, and the industrial control system controls the pulsed laser to emit a repair laser; a laser repair optical path, through which the repair laser is focused onto the sample to repair it; and a detection module, which is communicatively connected to the industrial control system, and whose emitted detection light reaches the repair position on the sample via the laser repair optical path, and is reflected back to the detection module from the repair position. The detection module includes a detector that detects the reflected detection light in real time. As the laser repair process proceeds, the repair position of the sample gradually changes from a defective state to a complete state. With the change in the height of the defect position, the detection light emitted by the detection module is focused onto the repair position. The change in the height of the repair position leads to a change in the final reflection position of the detection light. The detector can calculate the change in the height of the repair position by detecting this positional change, thereby achieving monitoring of the repair status in the depth direction of the sample, improving monitoring accuracy, and enabling real-time detection. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 A general framework diagram of a laser repair monitoring device provided in this application embodiment;

[0034] Figure 2 This is a schematic diagram of the structure of a laser repair monitoring device provided in an embodiment of this application;

[0035] Figure 3 This is a flowchart illustrating an embodiment of the laser repair monitoring method of this application;

[0036] Figure 4 A schematic diagram illustrating the principle of a detection module for detecting changes in the axial height of a repair location, provided in an embodiment of this application;

[0037] Figure 5 This is a schematic diagram of the equipment structure of the hardware operating environment involved in the laser repair monitoring method in this application embodiment.

[0038] Explanation of icon numbers:

[0039] 10. Laser repair monitoring device;

[0040] 100. Industrial control systems; 200. Pulsed lasers;

[0041] 300. Laser repair optical path; 310. First reflecting mirror; 320. X-axis galvanometer; 330. Y-axis galvanometer; 340. First beam splitter; 350. Z-axis driver; 360. Second converging mirror;

[0042] 400. Detection module; 410. Detector; 420. Laser pointer; 430. Beam splitter; 440. First converging lens;

[0043] 500. Microscopic imaging module; 510. Imaging light source; 520. Collimating and beam-expanding lens group; 530. Second beam splitter; 540. Tube lens; 550. Camera;

[0044] 600. Beam shaping module; 700. Second reflecting mirror; 800. Third beam splitter; 900. Motion stage;

[0045] S, Sample.

[0046] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0047] It should be understood that the specific embodiments described herein are merely illustrative of the technical solutions of this application and are not intended to limit this application.

[0048] Current laser repair monitoring technologies include optical imaging, laser scattering detection, and infrared thermal imaging. Each technology has its advantages and disadvantages. For example, optical imaging is very effective for detecting surface defects, but its ability to detect deep defects is limited; laser scattering detection can detect subtle surface changes, but its application on complex surfaces may be limited. Although existing technologies can meet some basic monitoring needs, in certain situations, especially for detecting minute or deep defects, the accuracy and resolution of existing technologies are still insufficient. Furthermore, due to slow processing speeds or data transmission delays, real-time monitoring is not possible.

[0049] The main solution of this application embodiment is to provide a laser repair monitoring device and method. The detection module in the laser repair monitoring device can detect the axial height change of the sample repair position in real time, which can monitor the change of the laser repair position in real time and provide feedback on the laser repair process, thereby improving the accuracy of laser repair.

[0050] This application provides a laser repair monitoring device. Figure 1 A general framework diagram of a laser repair monitoring device provided in this application embodiment is shown below. Figure 1As shown, the laser repair monitoring device 10 includes: an industrial control system 100; a pulsed laser 200, which is communicatively connected to the industrial control system 100, and the industrial control system 100 controls the pulsed laser 200 to emit a repair laser, which is a pulsed laser; a laser repair optical path 300, through which the repair laser is focused onto the sample S to repair the sample S; and a detection module 400, which is communicatively connected to the industrial control system 100, and the detection light emitted by the detection module 400 reaches the repair position of the sample S through the laser repair optical path 300, and is reflected back to the detection module 400 from the repair position through the laser repair optical path 300; the detection module 400 includes a detector 410, which detects the reflected detection light in real time.

[0051] The industrial control system 100 is communicatively connected to the pulsed laser 200, and can control the pulsed laser 200 to emit repair lasers to repair defects in sample S. The industrial control system 100 is also communicatively connected to the detection module 400, which can adjust the detection parameters of the detection module 400 and receive data collected by the detection module 400 for analysis and processing to monitor the repair status of sample S. The industrial control system 100 can be an electronic device with data analysis and processing capabilities; this application embodiment does not impose specific limitations on the form of the electronic device.

[0052] The pulsed laser 200 is used to emit a pulsed laser to repair the sample S. The laser repair optical path 300 is equipped with optical devices with different functions to form an optical path that can propagate the beam to the location of the sample S.

[0053] The detection module 400 is used to monitor the repair status of the sample repair site in real time. The detection module 400 includes a detector 410. As the sample depth changes, the position of the reflected detection light on the surface of the detector 410 also changes. The detector 410 can detect the change in the reflection position of the detection light emitted from the detection module 400. Combined with the optical components in the laser repair optical path 300, the height change of the sample repair site corresponding to the change in the reflection position of the detection light is calculated.

[0054] It is understandable that detector 410 can detect changes in the position of light rays in a linear direction. Specifically, any optical detector capable of performing this function can serve as detector 410, such as a linear array sensor or an area array sensor. The detection light rays reflected back to the detection module 400 can form a light spot on the surface of detector 410, and the change in the position of the light spot reflects the height change of the repair position of sample S. Both linear array sensors and area array sensors can detect changes in the position of the light spot in a one-dimensional direction; for cost considerations, linear array sensors can be preferred.

[0055] In some feasible ways, refer to Figure 2 , Figure 2 This is a schematic diagram of a laser repair monitoring device provided in an embodiment of this application. The detection module 400 further includes a laser pointer 420, a beam splitter 430, and a first converging mirror 440. The laser pointer 420 emits a detection beam, which enters the laser repair optical path 300 after passing through the beam splitter 430. The reflected detection beam passes through the laser repair optical path 300 and reaches the beam splitter 430, where it is reflected to the first converging mirror 440 and converged to the detector 410.

[0056] During the repair process of sample S by the pulsed laser 200 emitting a repair laser, the laser pointer 420 can also emit a detection beam, which also reaches the repair position of sample S through the laser repair optical path 300. It is understood that the repair laser has a relatively large diameter, thus the energy is focused on the repair position of sample S for additive or subtractive processing through the converging effect of the laser repair optical path 300. In designing the optical path of the detection beam, the detection beam is incident from a position offset from the axis of the focal point in the laser repair optical path 300. After being reflected back into the detection module 400, it is reflected by the beam splitter 430 to the first converging mirror 440, and then reaches the detector 410 under the converging effect of the first converging mirror 440.

[0057] In some feasible implementations, the detection beam emitted by the laser pointer 420 is a continuous laser with a diameter of less than 1 mm. For example, the diameter of this continuous laser can be 0.5 mm, 0.6 mm, or 0.8 mm. It is understood that a smaller diameter continuous laser can meet the needs of real-time monitoring and provides high detection accuracy. The wavelength of this continuous laser can be a common laser wavelength, for example, 405 nm, 532 nm, 633 nm, or 1064 nm.

[0058] In some feasible implementations, the laser repair optical path 300 includes a first reflecting mirror 310, an x-direction galvanometer 320, a y-direction galvanometer 330, a first beam splitter 340, a z-direction driver 350, and a second converging mirror 360. The arrangement of the laser repair optical path 300 allows light rays incident from different positions to be converged onto the sample S, thus meeting the different needs for repairing, observing, and monitoring the sample S. The second converging mirror 360 can be a microscope objective.

[0059] The x-axis galvanometer 320 controls the deflection of the light beam in the x-direction, the y-axis galvanometer 330 controls the deflection of the light beam in the y-direction, and the z-axis actuator 350 drives the second converging mirror 360 to move in the z-direction. It is understood that the x, y, and z directions in this embodiment are three mutually perpendicular directions in space. Typically, the z-direction represents the direction perpendicular to the ground, while the specific directions of the x and y directions can be arbitrarily selected. The focal length of the second converging mirror 360 is relatively fixed. Driving the second converging mirror 360 in the z-direction with the z-axis actuator 350 allows the focal point to coincide with the repair position of the sample S, fully utilizing the laser energy.

[0060] In the optical path of the laser repair process, after the repair laser is incident, it is reflected by the first reflecting mirror 310 to the x-direction galvanometer 320, reflected by the x-direction galvanometer 320 to the y-direction galvanometer 330, reflected by the y-direction galvanometer 330, and then passes through the first beam splitter 340 to reach the second converging mirror 360, which converges to the sample S.

[0061] In the monitoring optical path, after the detection light is incident, it is reflected by the first reflecting mirror 310 to the x-direction galvanometer 320, reflected by the x-direction galvanometer 320 to the y-direction galvanometer 330, reflected by the y-direction galvanometer 330, and passes through the first beam splitter 340 to reach the second converging mirror 360. It is obliquely incident on the sample S, and is reflected at the repair position, returning to the detection module 400 along the original optical path.

[0062] It is understood that in this embodiment, both the repair laser and the detection light are incident on the laser repair optical path 300 from the position of the first reflecting mirror 310. However, it is not limited to this. Other optical devices with similar functions can also be set in the laser repair optical path 300 so that the repair laser and the detection light can be incident on the laser repair optical path 300 from different positions and finally propagate to the sample S.

[0063] In some feasible embodiments, the laser repair monitoring device 10 further includes a microscopic imaging module 500, which comprises an imaging light source 510, a collimating and beam expander group 520, a second beam splitter 530, a tube lens 540, and a camera 550. The microscopic imaging module 500 is used to perform microscopic observation of the sample S, assisting in judging the repair status of the sample S and determining the repair location of the sample S.

[0064] In the microscopic observation optical path, the imaging light source 510 emits imaging rays. These rays pass through the collimating and beam-expanding lens group 520 and the second beam splitter 530 into the laser repair optical path 300, reach the sample S, are reflected by the sample S back to the second beam splitter 530, and then enter the tube mirror 540 under the reflection of the second beam splitter 530, reaching the camera 550 for imaging. The collimating and beam-expanding lens group 520 can expand the diameter of the imaging rays, reduce the divergence angle, and adjust the imaging rays to a parallel state, thereby improving the imaging quality. The imaging rays can enter the laser repair optical path 300 from the first beam splitter 340, be reflected at the sample S, and then be reflected along the original optical path by the first beam splitter 340 back to the second beam splitter 530, returning to the microscopic imaging module 500.

[0065] In some feasible implementations, the laser repair monitoring device 10 also includes a beam shaping module 600, a second reflector 700, and a third beam splitter 800. The beam shaping module 600 shapes the pulsed laser into a flat-top pulsed laser, which is reflected by the second reflector 700 to the third beam splitter 800, and then reflected by the third beam splitter 800 into the laser repair optical path 300. The shaped flat-top pulsed laser spot is similar to a square spot, has a large single-pulse energy, and is suitable for use in laser repair scenarios.

[0066] In some feasible embodiments, the laser repair monitoring device 10 also includes a motion stage 900, which is communicatively connected to the industrial control system 100. The motion stage 900 carries the sample S and moves in position under the control of the industrial control system 100. The motion stage 900 can have three degrees of freedom of movement in the forward, backward, left, right, and up / down directions, and can also be equipped with a rotation axis to rotate within a certain angle range to facilitate the repair of the sample S.

[0067] In this embodiment, as the laser repair process proceeds, the repair position of sample S gradually changes from a defective state to a complete state. With the change in the height of the defect position, the detection light emitted by the detection module 400 is focused to the repair position. The change in the height of the repair position will cause the final reflection position of the detection light to change. The detector 410 can calculate the change in the height of the repair position by detecting this position change, thereby realizing the monitoring of the repair status in the depth direction of sample S, improving the monitoring accuracy, and realizing real-time detection.

[0068] This application also provides a laser repair monitoring method, applied to the laser repair monitoring device 10 described in this application embodiment, with reference to... Figure 3 , Figure 3 This is a flowchart illustrating an embodiment of the laser repair monitoring method of this application.

[0069] In this embodiment, the laser repair monitoring method includes steps S10 to S40:

[0070] Step S10: Determine the repair location of the sample;

[0071] It is understood that the laser repair monitoring device 10 can be equipped with a moving stage or other components capable of supporting the sample S, so that the sample S is close to the exit position of the laser repair optical path 300. The laser repair in this embodiment can include different repair methods such as additive and subtractive manufacturing, achieved by controlling parameters such as the wavelength and energy of the laser. The location of the sample S can be observed through the microscopic imaging module 500 or other components with imaging capabilities to determine the repair position of the sample S. The sample S can also be moved so that the repair position is at the center of the imaging field of view.

[0072] Step S20: The laser repair parameters are set through the industrial control system, and the pulsed laser is controlled to emit a repair laser. The repair laser is focused to the repair position through the laser repair optical path for repair.

[0073] Laser repair parameters refer to the relevant parameters of the repair laser emitted by the pulsed laser 200, which may include parameters such as the wavelength and energy of the repair laser. The industrial control system 100 is communicatively connected to both the pulsed laser 200 and the detection module 400, and can control the pulsed laser 200 to emit the repair laser, while the detection module 400 begins monitoring.

[0074] Step S30: The detection module detects the axial height change at the repair location in real time;

[0075] It is understandable that both additive and subtractive manufacturing of sample S will result in height changes, and the detection light emitted by the detection module 400 can detect these changes in real time. Figure 4 A schematic diagram illustrating the principle of a detection module 400 for detecting changes in the axial height of a repair location, as provided in this application embodiment. Figure 4 As shown, assuming that during the laser repair process, the axial height change of the sample S due to addition or subtraction is s, the change in the center position of the light spot detected by the detector 410 is p, the focal length of the second converging mirror 360 is f1, the focal length of the first converging mirror 440 is f2, the vertical distance between the detector 410 and the focal point of the first converging mirror 440 is d, and the distance of the incident light relative to the optical axis is h. Based on ray tracing, the following formula 1 can be derived.

[0076] Formula 1:

[0077] Therefore, based on the change p of the center position of the light spot detected by detector 410, the change of the S-axis height of the sample can be obtained in real time with reference to the following formula 2.

[0078] Formula 2:

[0079] Step S40: If the height of the repair position reaches the preset height, stop the repair, or determine the next repair position of the sample.

[0080] The preset height refers to the target height that sample S needs to reach for additive or subtractive manufacturing. Referring to Formulas 1 and 2 above, when s reaches the preset target value s0, the height of the repair position also reaches the preset height. Based on the overall repair status of sample S, you can choose to stop the laser repair or determine the next repair position for sample S and repeat the above repair process.

[0081] The laser repair monitoring method provided in this embodiment, combined with the laser repair monitoring device 10, allows the sample S to gradually change from a defective state to a complete state as the laser repair process progresses. With the change in the height of the defective position, the detection light emitted by the detection module 400 is focused to the repair position. The change in the height of the repair position will cause the final reflection position of the detection light to change. The detector 410 can calculate the change in the height of the repair position by detecting this position change, thereby realizing the monitoring of the repair status in the depth direction of the sample S, improving the monitoring accuracy, and realizing real-time detection.

[0082] This application also provides an electronic device that can be used as an industrial control system 100. The electronic device includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the laser repair monitoring method in the above embodiments.

[0083] The following is for reference. Figure 5 The diagram illustrates a structural schematic of an electronic device suitable for implementing embodiments of this application. The electronic devices in these embodiments may include, but are not limited to, mobile terminals such as mobile phones, laptops, digital broadcast receivers, PDAs (Personal Digital Assistants), PADs (Portable Application Descriptions), PMPs (Portable Media Players), in-vehicle terminals (e.g., in-vehicle navigation terminals), and fixed terminals such as digital TVs and desktop computers. Figure 5 The electronic device shown is merely an example and should not impose any limitation on the functionality and scope of use of the embodiments of this application.

[0084] like Figure 5As shown, the electronic device may include a processing unit 1001 (e.g., a central processing unit, a graphics processing unit, etc.), which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 1002 or a program loaded from a storage device 1003 into a random access memory (RAM) 1004. The RAM 1004 also stores various programs and data required for the operation of the electronic device. The processing unit 1001, ROM 1002, and RAM 1004 are interconnected via a bus 1005. An input / output (I / O) interface 1006 is also connected to the bus. Typically, the following systems can be connected to the I / O interface 1006: input devices 1007 including, for example, touchscreens, touchpads, keyboards, mice, image sensors, microphones, accelerometers, gyroscopes, etc.; output devices 1008 including, for example, liquid crystal displays (LCDs), speakers, vibrators, etc.; storage devices 1003 including, for example, magnetic tapes, hard disks, etc.; and communication devices 1009. Communication device 1009 allows electronic devices to communicate wirelessly or wiredly with other devices to exchange data. While electronic devices with various systems are shown in the figures, it should be understood that implementation or possession of all the systems shown is not required. More or fewer systems may be implemented alternatively.

[0085] Specifically, according to the embodiments disclosed in this application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments disclosed in this application include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing program code for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via a communication device, or installed from storage device 1003, or installed from ROM 1002. When the computer program is executed by processing device 1001, it performs the functions defined in the methods of the embodiments disclosed in this application.

[0086] The electronic device provided in this application, employing the laser repair monitoring method described in the above embodiments, can solve the technical problem of insufficient accuracy and inability to achieve real-time monitoring in existing laser repair monitoring technologies. Compared with the prior art, the beneficial effects of the electronic device provided in this application are the same as those of the laser repair monitoring method provided in the above embodiments, and other technical features of the electronic device are the same as those disclosed in the methods of the above embodiments, and will not be repeated here.

[0087] It should be understood that the various parts disclosed in this application can be implemented using hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0088] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

[0089] This application provides a computer-readable storage medium having computer-readable program instructions (i.e., a computer program) stored thereon, the computer-readable program instructions being used to execute the laser repair monitoring method in the above embodiments.

[0090] The computer-readable storage medium provided in this application may be, for example, a USB flash drive, but is not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems or devices, or any combination thereof. More specific examples of computer-readable storage media may include, but are not limited to: electrical connections having one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this embodiment, the computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system or device. The program code contained on the computer-readable storage medium may be transmitted using any suitable medium, including but not limited to: wires, optical cables, RF (Radio Frequency), etc., or any suitable combination thereof.

[0091] The aforementioned computer-readable storage medium may be included in an electronic device or may exist independently without being assembled into an electronic device.

[0092] The aforementioned computer-readable storage medium carries one or more programs that, when executed by an electronic device, cause the electronic device to: determine the repair position of the sample; set laser repair parameters through an industrial control system, control a pulsed laser to emit a repair laser, the repair laser being focused to the repair position via a laser repair optical path for repair; a detection module detects the axial height change of the repair position in real time; and, when the height of the repair position reaches a preset height, stop the repair, or determine the next repair position of the sample.

[0093] Computer program code for performing the operations of this application can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, and conventional procedural programming languages ​​such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a Local Area Network (LAN) or a Wide Area Network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0094] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0095] The modules described in the embodiments of this application can be implemented in software or hardware. The names of the modules do not necessarily limit the functionality of the unit itself.

[0096] The readable storage medium provided in this application is a computer-readable storage medium that stores computer-readable program instructions (i.e., a computer program) for executing the above-described laser repair monitoring method. This solves the technical problem that existing laser repair monitoring technologies lack sufficient accuracy and cannot achieve real-time monitoring. Compared with the prior art, the beneficial effects of the computer-readable storage medium provided in this application are the same as those of the laser repair monitoring method provided in the above embodiments, and will not be repeated here.

[0097] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the laser repair monitoring method described above.

[0098] The computer program product provided in this application can solve the technical problem that existing laser repair monitoring technologies lack accuracy and cannot achieve real-time monitoring. Compared with the prior art, the beneficial effects of the computer program product provided in this application are the same as those of the laser repair monitoring method provided in the above embodiments, and will not be repeated here.

[0099] The above description is only a part of the embodiments of this application and does not limit the patent scope of this application. All equivalent structural transformations made under the technical concept of this application and using the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included in the patent protection scope of this application.

Claims

1. A laser repair monitoring device, characterized in that, The laser repair monitoring device includes: Industrial control systems; A pulsed laser, which is communicatively connected to the industrial control system, wherein the industrial control system controls the pulsed laser to emit a repair laser, and the repair laser is a pulsed laser; A laser repair optical path is provided, wherein the repair laser is focused onto the sample through the laser repair optical path to repair the sample; The detection module is communicatively connected to the industrial control system. The detection light emitted by the detection module reaches the repair position of the sample through the laser repair optical path, and is reflected back to the detection module from the repair position through the laser repair optical path. The detection module includes a detector that detects the reflected detection light in real time; The detection module also includes a laser pointer, a beam splitter, and a first converging lens; The laser pointer emits the detection light beam, which enters the laser repair optical path after passing through the beam splitter. The detection light beam is a continuous laser with a diameter of less than 1 mm. The reflected detection light beam passes through the laser repair optical path to the beam splitter, is reflected by the beam splitter to the first converging mirror, and is then converged to the detector; The laser repair optical path includes a first reflecting mirror, an x-direction galvanometer, a y-direction galvanometer, a first beam splitter, a z-direction driver, and a second converging mirror; The x-direction galvanometer controls the deflection of the beam in the x-direction, the y-direction galvanometer controls the deflection of the beam in the y-direction, and the z-direction driver drives the second converging mirror to move in the z-direction. The repair laser is reflected by the first reflector to the x-direction galvanometer, reflected by the x-direction galvanometer to the y-direction galvanometer, reflected by the y-direction galvanometer, and then passes through the first beam splitter to reach the second converging lens, where it is focused onto the sample. The detection light is reflected by the first reflector to the x-direction galvanometer, then reflected by the x-direction galvanometer to the y-direction galvanometer, reflected by the y-direction galvanometer, and passes through the first beam splitter to reach the second converging lens. It is obliquely incident on the sample, reflected at the repair position, and returns to the detection module.

2. The laser repair monitoring device as described in claim 1, characterized in that, The laser repair monitoring device also includes a microscopic imaging module, which includes an imaging light source, a collimating and beam expanding lens group, a second beam splitter, a tube mirror, and a camera. The imaging light source emits imaging light rays, which pass through the collimating and expanding lens group and the second beam splitter into the laser repair optical path, reach the sample, are reflected by the sample to the second beam splitter, and then enter the tube mirror under the reflection of the second beam splitter, reaching the camera for imaging.

3. The laser repair monitoring device as described in claim 1, characterized in that, The laser repair monitoring device also includes a beam shaping module, a second reflector, and a third beam splitter. The beam shaping module shapes the pulsed laser into a flat-top pulsed laser. The flat-top pulsed laser is reflected by the second reflector to the third beam splitter and then reflected by the third beam splitter into the laser repair optical path.

4. The laser repair monitoring device as described in claim 1, characterized in that, The laser repair monitoring device also includes a motion stage, which is communicatively connected to the industrial control system. The motion stage carries the sample and moves under the control of the industrial control system.

5. A laser repair monitoring method, characterized in that, The laser repair monitoring device used in any one of claims 1 to 4 comprises: Determine the repair location for the sample; The laser repair parameters are set by the industrial control system, and the pulsed laser is controlled to emit a repair laser. The repair laser is focused to the repair position through the laser repair optical path for repair. The detection module monitors the axial height change at the repair location in real time; If the height of the repair position reaches a preset height, stop the repair, or determine the next repair position for the sample.

6. A storage medium, characterized in that, The storage medium is a computer-readable storage medium, and a computer program is stored on the storage medium. When the computer program is executed by a processor, it implements the steps of the laser repair monitoring method as described in claim 5.

7. A computer program product, characterized in that, The computer program product includes a computer program that, when executed by a processor, implements the steps of the laser repair monitoring method as described in claim 5.

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