A four-in-one foam box for silicon wafer packaging

By designing a four-in-one foam box with mixing, frame, and sliding packaging modules, the problem of low space utilization in silicon wafer packaging was solved, achieving efficient silicon wafer transportation and protection.

CN119683142BActive Publication Date: 2025-11-11云南宇泽新能源股份有限公司
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Patent Information

Application Number
CN202510130128.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-02-05
Publication Date
2025-11-11
Estimated Expiration
2045-02-05

AI Technical Summary

Technical Problem

The existing silicon wafer packaging foam boxes have low space utilization, resulting in fewer silicon wafers that can be transported by transportation equipment, which increases packaging and transportation costs.

Method used

Design a four-in-one foam box, comprising a hybrid packaging module, a frame packaging module, and a sliding packaging module, which improves space utilization and protection through flexible partitions, combined frames, and a stable frame.

Benefits of technology

It increases the number of silicon wafers loaded per box, reduces transportation costs, enhances the protection of silicon wafers, simplifies the packaging process, and reduces the risk of stacked boxes tipping over.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention discloses a four-in-one foam box for silicon wafer packaging, relating to the field of packaging technology. The four-in-one foam box for silicon wafer packaging includes a foam box base plate made of polyethylene foam. The base plate includes a board body, with two support strips fixedly connected to the bottom of the board body. A trapezoidal groove is formed on the top of the board body, and a hybrid packaging module, a frame packaging module, and a sliding packaging module are fixedly connected to the top of the board body. This four-in-one foam box for silicon wafer packaging, by setting up frame packaging components and a stable frame, improves the utilization rate of the box space and the protection of the silicon wafers. At the same time, the flexible loading method improves the utilization rate of the cargo space, reduces transportation costs, and reduces the risk of the box tipping over during transportation.
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Description

Technical Field

[0001] This invention relates to the field of packaging technology, specifically to a four-in-one foam box for silicon wafer packaging. Background Technology

[0002] Silicon wafers are thin sheets cut from monocrystalline or polycrystalline silicon, with a thickness generally ranging from tens to hundreds of micrometers. They are the basic material for manufacturing semiconductor devices such as integrated circuits and solar cells. In the transportation packaging of silicon wafers, foam boxes are one of the most commonly used packaging methods, which are suitable for small-scale transportation of silicon wafers or for transportation with high protection requirements.

[0003] Patent application CN209177292U discloses a foam box for a polygonal silicon wafer, including an upper cover and a lower cover, which are fitted together. The upper cover includes an upper cover fastening part, an upper cover support part, and an upper cover receiving part, which are connected in sequence. The lower cover includes a lower cover fastening part, a lower cover support part, and a lower cover receiving part, which are connected in sequence. The upper cover fastening part is fitted together with the lower cover fastening part.

[0004] The foam box provided by this patent has low space utilization, which in turn results in a lower number of silicon wafers that can be transferred using transport equipment of the same volume, thus increasing packaging and transportation costs. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a four-in-one foam box for silicon wafer packaging, thereby solving the problems mentioned in the background section.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solution: a four-in-one foam box for silicon wafer packaging, comprising a foam box base plate, the foam box base plate being made of polyethylene foam, the foam box base plate comprising a plate body, two support strips being fixedly connected to the bottom of the plate body, a trapezoidal groove being provided on the top of the plate body, and a mixed packaging module, a frame packaging module, and a sliding packaging module being fixedly connected to the top of the plate body;

[0007] The hybrid packaging module includes an integrated housing and hybrid partition components, which are used to improve packaging space utilization by combining horizontally placed silicon wafers with flatly placed silicon wafers.

[0008] The frame packaging module includes a combined frame and sub-divider boxes, which are used to flexibly load the packaged foam boxes into the cargo space by cooperating with the frame. This improves the space utilization of the packaging boxes and the cargo space, thereby increasing the transportation volume and reducing transportation costs.

[0009] The sliding packaging module includes a combined outer shell and a stable frame, which improves the vertical placement of silicon wafers, increases the utilization of space inside the box, and enhances the reliability of the foam box in protecting the silicon wafers.

[0010] Preferably, the integrated housing is used to absorb external impacts and protect the silicon wafer from the outside. The integrated housing includes a main housing with a hollow interior. A trapezoidal protrusion is fixedly connected to the bottom of the main housing, and the bottom of the main housing is inserted into a trapezoidal groove on the top of the plate through the trapezoidal protrusion. The main housing has a hollow interior and a rectangular sliding groove on the front. Rectangular through holes are connected to the front, back, and left and right sides of the main housing. Triangular blind holes are provided on the front and back of the inner wall of the main housing to improve the structural strength of the main housing. A sliding cover is slidably connected to the top of the main housing through a rectangular sliding groove. Two rectangular blind holes are provided on the top of the sliding cover. The size of the rectangular blind holes is the same as that of the support strip. A mixing and separating component is inserted inside the main housing. The integrated housing is made of polyethylene foam.

[0011] Preferably, the hybrid partition assembly includes a flexible four-part plate and a hybrid placement rack disposed within the partition space of the flexible four-part plate. The top of the flexible four-part plate has a hexagonal through hole for providing installation compression space and absorbing impact vibration. The flexible four-part plate is located inside the main enclosure. The flexible four-part plate includes a longitudinal hollow plate. The front of the longitudinal hollow plate is inserted into a rectangular through hole on the back of the main enclosure, and the front of the longitudinal hollow plate is inserted into a rectangular through hole on the front of the main enclosure. A transverse hollow plate is inserted into a rectangular through hole on the left side of the main enclosure. The front of the transverse hollow plate is inserted into the longitudinal hollow plate, and the right side of the transverse hollow plate is inserted into a rectangular through hole on the right side of the main enclosure. The longitudinal hollow plate, the transverse hollow plate, and the inner wall of the main enclosure form four partition compartments. Fixing rubber straps are fitted on the front, back, and left and right sides of the main enclosure. The fixing rubber straps are used to reinforce the main enclosure and the flexible four-part plate. The flexible four-part plate and the fixing rubber straps are made of rubber to achieve reusability and improve packaging stability.

[0012] Preferably, the hybrid placement rack includes a frame made of plastic for reusability. The frame is located within the compartment of the main enclosure. A C-shaped plate is fixedly connected to the top of the frame, and an elastic partition plate is fixedly connected inside the C-shaped plate. Semi-circular rubber strips are fixedly connected to the top and bottom of the elastic partition plate. The elastic partition plate and the C-shaped plate of the frame form a horizontal placement compartment. The back of the C-shaped plate, together with the longitudinal hollow plate and the transverse hollow plate, form a transverse placement compartment. There are four hybrid placement racks, which are placed in the four compartments of the main enclosure.

[0013] Preferably, the combined frame includes a main frame, the main frame includes a base frame, a trapezoidal protrusion is fixedly connected inside the base frame, the trapezoidal protrusion is inserted into the trapezoidal groove of the plate body through the trapezoidal protrusion, a cross plate is fixedly connected to the top of the base frame, triangular prisms are fixedly connected to the four corners of the top of the cross plate, a rectangular column is fixedly connected to the center of the top of the cross plate, the cross plate of the base frame and the top of the plate body cooperate to form four bases, a support column is fixedly connected to the top of the base frame, and a side reinforcement plate is fixedly connected to the surface of the support column. The reinforcing plate is fixedly connected to the top triangular prism of the bottom frame. A polymer skeleton is sleeved inside the bottom frame and fitted inside the support column. The bottom frame, support column, and side reinforcing plate are all made of polyethylene foam. The polymer skeleton is made of plastic. A top frame is inserted into the top of the support column and is inserted into the polymer skeleton. The top frame is also inserted into the top triangular prism of the bottom frame. A strip is fixedly connected to the top of the top frame. A rectangular blind hole is opened on the top of the strip. The size of the rectangular blind hole is the same as that of the support strip. The top frame is made of polyethylene foam.

[0014] Preferably, the sub-divider box is made of polyethylene foam. The sub-divider box includes a dividing box body, which includes a box body main body. The box body main body has a hollow structure inside. A trapezoidal groove is opened on the top of the box body main body. A dividing box cover is inserted into the top of the box body main body through the trapezoidal groove. A bottom pad is fixedly connected to the bottom of the box body main body. The bottom of the bottom pad is located at the top of the box body.

[0015] Preferably, the sub-dividing boxes are placed inside the main frame to cooperate with the combined frame for stable fixation. The four corners of the main body of the box are attached to the main frame. The dividing box is located at the bottom of the top frame, and the bottom of the dividing box is placed on the base inside the main frame. There are a total of four sub-dividing boxes.

[0016] Preferably, the top of the plate has a rectangular groove, the combined shell is made of polyethylene foam, and the combined shell includes a long side panel. Trapezoidal blocks are fixedly connected to the top and bottom of the long side panel. The bottom of the long side panel is inserted into the top of the plate through the trapezoidal blocks. Two symmetrically distributed rectangular grooves are formed on the back of the long side panel. There are two long side panels, symmetrically distributed about the top of the plate. A wide side panel is inserted into the back of the long side panel through the trapezoidal grooves. The wide side panel includes a panel body, the front and back of which are inserted into the rectangular grooves of the long side panel. Next, trapezoidal protrusions are fixedly connected to the top and bottom of the enclosure. The bottom of the enclosure is inserted into the trapezoidal groove at the top of the enclosure through the trapezoidal protrusion. An isolation strip is fixedly connected to the back of the enclosure to form a gap between the inside of the box and the outside of the silicon wafer. There are two wide-side enclosures, which are symmetrically distributed on the left and right sides of the enclosure. A top panel is inserted into the top of the long-side enclosure through the trapezoidal protrusion. The bottom of the top panel is inserted into the trapezoidal protrusion at the top of the wide-side enclosure. Two symmetrically distributed rectangular blind holes are opened on the top of the top panel. The size of the rectangular blind holes is the same as that of the support strip.

[0017] Preferably, the stabilizing frame is made of polyethylene foam. The stabilizing frame includes a recessed base, the bottom of which is slidably connected to a rectangular groove on the top of the plate. A rectangular blind hole is provided on the top of the recessed base for placing a silicon wafer. Two support side plates are fixedly connected to the top of the recessed base and are symmetrically distributed on the top of the recessed base. Two triangular through holes are connected to the front of the support side plates to reduce weight while improving structural strength. A top cover is inserted into the top of the support side plates.

[0018] Preferably, the number of stabilizing frames is four, and they are evenly arranged inside the combined housing. The stabilizing frames are used to stabilize the longitudinally placed silicon wafers and to offset the impact of vibration during transportation by slightly sliding.

[0019] This invention provides a four-in-one foam box for silicon wafer packaging. It has the following beneficial effects:

[0020] 1. This four-in-one foam box for silicon wafer packaging, by setting up a hybrid packaging module, uses elastic partitions to reduce the space occupied by the internal partitions while using the hollow structure of the partitions to further increase the usable space inside the box. Combined with a hybrid placement rack, the elastic deformation absorbs the vibration and impact during transportation, increasing the number of silicon wafers that can be loaded in a single box, thereby improving the space utilization rate of the foam box. At the same time, it improves the protective effect of the foam box on the silicon wafers, and can reduce packaging production and procurement costs through the recycling of the hybrid partition components.

[0021] 2. This four-in-one foam box for silicon wafer packaging uses a frame packaging component to load silicon wafers by combining sub-boxes with the frame. This increases the overall silicon wafer loading capacity and packaging stability of the box. At the same time, it allows for flexible placement of independent sub-boxes according to the actual cargo space, thereby increasing the carrying capacity of a single shipment. This improves the utilization rate of the box's internal space and the cargo space, thus reducing transportation costs.

[0022] 3. This four-in-one foam box for silicon wafer packaging improves the convenience of the silicon wafer packaging process by setting a sliding and stable frame in conjunction with a base plate, thereby optimizing the packing process. The detachable combined shell and stable frame further reduce the packing difficulty and improve packing efficiency. At the same time, the slight sliding of the stable frame during transportation offsets the vibration and impact during transportation, thereby improving the protection of the silicon wafer.

[0023] 4. This four-in-one foam box for silicon wafer packaging, through the support strips on the bottom plate of the foam box and the rectangular blind holes reserved on the top of the module, realizes the vertical connection between the boxes when stacked. While reducing the height of the stacked boxes, increasing the loading capacity and simplifying the packaging process, it also reduces the risk of the boxes tipping over, thereby improving the protection of the silicon wafers. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of the first embodiment of the present invention;

[0025] Figure 2 This is a schematic diagram of the overall structure of the foam box base plate of the present invention;

[0026] Figure 3 This is a schematic diagram showing the positional relationship between the integrated outer shell and the hybrid partition component of the present invention;

[0027] Figure 4 This is a schematic diagram showing the positional relationship between the flexible quarter plate and the hybrid placement rack of the present invention;

[0028] Figure 5 For the present invention Figure 4 Enlarged schematic diagram of the structure at point A in the diagram;

[0029] Figure 6 This is a schematic diagram of the overall structure of the second embodiment of the present invention;

[0030] Figure 7 This is a schematic diagram showing the positional relationship between the main frame and the foam box bottom plate of the present invention;

[0031] Figure 8 This is a schematic diagram showing the positional relationship between the combined frame and the sub-divider boxes of the present invention;

[0032] Figure 9This is a schematic diagram showing the positional relationship between the sub-divider box and the bottom frame of the present invention;

[0033] Figure 10 This is a schematic diagram of the overall structure of the third embodiment of the present invention;

[0034] Figure 11 This is a schematic diagram of the internal overall structure of the third embodiment of the present invention;

[0035] Figure 12 This is a schematic diagram showing the positional relationship between the stabilizing frame and the foam box base plate of the present invention;

[0036] Figure 13 For the present invention Figure 12 Enlarged schematic diagram of the structure at point B in the diagram.

[0037] In the diagram: 1. Foam box base; 11. Board body; 12. Support strip; 2. Integrated outer shell; 21. Main enclosure; 22. Sliding cover; 3. Mixing partition assembly; 31. Flexible quarter board; 311. Longitudinal hollow board; 312. Transverse hollow board; 32. Fixing rubber strip; 33. Mixing rack; 331. Frame body; 332. Flexible partition board; 4. Combined frame; 41. Main frame; 411. Base frame; 412. Support column ; 413, Side reinforcement plate; 414, Polymer skeleton; 42, Top frame; 5, Sub-division box; 51, Divider box body; 511, Box body main body; 512, Bottom pad; 52, Divider box cover; 6, Combined shell; 61, Long side panel; 62, Wide side panel; 621, Panel body; 622, Isolation strip; 63, Top panel; 7, Stabilizing frame; 71, Recessed base; 72, Supporting side panel; 73, Top cover. Detailed Implementation

[0038] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0039] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the invention, and should not be construed as limiting the invention.

[0040] Example 1, please refer to Figure 1-5The present invention provides a technical solution: a four-in-one foam box for silicon wafer packaging, including a foam box bottom plate 1, the foam box bottom plate 1 being made of polyethylene foam, the foam box bottom plate 1 including a plate body 11, two support strips 12 being fixedly connected to the bottom of the plate body 11, a trapezoidal groove being provided on the top of the plate body 11, and a mixed packaging module being fixedly connected to the top of the plate body 11.

[0041] The hybrid packaging module includes an integrated shell 2 and a hybrid partition component 3, which are used to improve the utilization of packaging space by combining horizontally placed silicon wafers with flatly placed silicon wafers. The integrated shell 2 is used to absorb external impacts from the outside to protect the silicon wafers. The integrated shell 2 includes a main shell 21, which has a hollow structure inside. A trapezoidal protrusion is fixedly connected to the bottom of the main shell 21. The bottom of the main shell 21 is inserted into the trapezoidal groove at the top of the plate 11 through the trapezoidal protrusion. The main shell 21 has a hollow structure inside. A rectangular sliding groove is opened on the front of the main shell 21. Rectangular through holes are connected to the front, back, left and right sides of the main shell 21. Triangular blind holes are opened on the front and back of the inner wall of the main shell 21 to improve the structural strength of the main shell 21. A sliding cover 22 is slidably connected to the top of the main shell 21 through a rectangular sliding groove. Two rectangular blind holes are opened on the top of the sliding cover 22. The size of the rectangular blind holes is the same as that of the support strip 12. The hybrid partition component 3 is inserted inside the main shell 21. The integrated shell 2 is made of polyethylene foam.

[0042] The hybrid partition assembly 3 includes a flexible four-part plate 31 and a hybrid placement rack 33 disposed within the partition space of the flexible four-part plate 31. The top of the flexible four-part plate 31 has a hexagonal through-hole for providing installation compression space and absorbing impact vibration. The flexible four-part plate 31 is located inside the main enclosure 21. The flexible four-part plate 31 includes a longitudinal hollow plate 311. The front of the longitudinal hollow plate 311 is inserted into a rectangular through-hole on the back of the main enclosure 21, and the front of the longitudinal hollow plate 311 is inserted into a rectangular through-hole on the front of the main enclosure 21. A transverse hollow plate is inserted into a rectangular through-hole on the left side of the main enclosure 21. Plate 312, the front of the transverse hollow plate 312 is inserted into the longitudinal hollow plate 311, and the right side of the transverse hollow plate 312 is inserted into the rectangular through hole on the right side of the main shell 21. The longitudinal hollow plate 311, the transverse hollow plate 312 and the inner wall of the main shell 21 form four compartments. The front, back and left and right sides of the main shell 21 are all fitted with fixing rubber straps 32. The fixing rubber straps 32 are used to reinforce the main shell 21 and the elastic quarter plate 31. The elastic quarter plate 31 and the fixing rubber straps 32 are both made of rubber to achieve reusability and improve the stability of the packaging.

[0043] The hybrid placement rack 33 includes a frame 331 made of plastic for reusability. The frame 331 is located in the compartment of the main enclosure 21. A C-shaped plate is fixedly connected to the top of the frame 331. An elastic partition plate 332 is fixedly connected inside the C-shaped plate. Semi-circular rubber strips are fixedly connected to the top and bottom of the elastic partition plate 332. The elastic partition plate 332 and the C-shaped plate of the frame 331 form a horizontal placement compartment. The back of the C-shaped plate, the longitudinal hollow plate 311, and the transverse hollow plate 312 form a transverse placement compartment. There are four hybrid placement racks 33, which are placed in the four compartments of the main enclosure 21 respectively.

[0044] In use, before packaging, the silicon wafers need to be individually packaged according to the internal partition dimensions of the mixing placement rack 33, and then initially packaged with film. After the initial packaging is completed, the mixing placement rack 33 is removed from the main housing 21. After removing the mixing placement rack 33, the packaged silicon wafers are placed into the partitions at the bottom and top of the elastic partition plate 332 respectively. After placement, the mixing placement rack 33 is put back into the partition compartment inside the main housing 21. After the mixing placement rack 33 is put into the partition compartment inside the main housing 21, it compresses the elastic partition plate 31 and the inside of the main housing 21. After being squeezed, the elastic quarter plate 31 undergoes elastic deformation, compressing the hexagonal through-hole space inside it while applying a reverse elastic force to the mixing placement rack 33. At the same time, after being squeezed, the fixing rubber band 32 also applies a reverse elastic force to the mixing placement rack 33 through the main enclosure 21. Thus, without damaging the silicon wafer, the silicon wafer inside the main enclosure 21 is stably fixed. Then, the remaining packaged silicon wafers are placed in the partition between the C-shaped plate and the longitudinal hollow plate 311 of the rack 331. Then, the sliding cover 22 is slidably installed into the top of the main enclosure 21 to complete the boxing.

[0045] During stacking and loading, in the vertical direction, the support strips 12 of the upper foam box are inserted into the rectangular blind hole at the top of the sliding cover 22 of the lower foam box to achieve a stable connection. During transportation, the vibration transmitted to the foam box is mainly absorbed by the main enclosure 21, the elastic quarter plate 31 and the hybrid placement rack 33, thereby protecting the silicon wafer.

[0046] Example 2, please refer to Figure 6-9 The present invention provides another technical solution: a four-in-one foam box for silicon wafer packaging, including a foam box bottom plate 1, the foam box bottom plate 1 is made of polyethylene foam, the foam box bottom plate 1 includes a plate body 11, two support strips 12 are fixedly connected to the bottom of the plate body 11, a trapezoidal groove is opened on the top of the plate body 11, and a frame packaging module is fixedly connected to the top of the plate body 11.

[0047] The frame packaging module includes a combined frame 4 and sub-divider boxes 5. These sub-divider boxes work in conjunction with the frame to flexibly load the packaged foam boxes into the cargo space. This improves the utilization rate of the packaging space and, by improving the utilization rate of the cargo space, increases the quantity of goods transported and reduces transportation costs. The combined frame 4 includes a main frame 41, which includes a bottom frame 411. Trapezoidal protrusions are fixedly connected inside the bottom frame 411, and the bottom frame 411 is inserted into the trapezoidal grooves of the plate 11 via these protrusions. A cross plate is fixedly connected to the top of the bottom frame 411, and triangular prisms are fixedly connected to the four corners of the top of the cross plate. A rectangular prism is fixedly connected to the center of the top of the cross plate. The cross plate of the bottom frame 411 and the top of the plate 11 cooperate to form four bases. A support column 412 is fixedly connected to the top of the support column 412. A side reinforcement plate 413 is fixedly connected to the surface of the support column 412. The side reinforcement plate 413 is fixedly connected to the triangular prism at the top of the bottom frame 411. A polymer skeleton 414 is sleeved inside the bottom frame 411. The polymer skeleton 414 is sleeved inside the support column 412. The bottom frame 411, support column 412, and side reinforcement plate 413 are all made of polyethylene foam. The polymer skeleton 414 is made of plastic. A top frame 42 is inserted into the top of the support column 412. The top frame 42 is inserted into the polymer skeleton 414. The top frame 42 is inserted into the triangular prism at the top of the bottom frame 411. A strip is fixedly connected to the top of the top frame 42. A rectangular blind hole is opened on the top of the strip. The size of the rectangular blind hole is the same as that of the support strip 12. The top frame 42 is made of polyethylene foam.

[0048] The sub-dividing box 5 is made of polyethylene foam. The sub-dividing box 5 includes a dividing box body 51, which includes a box body 511. The box body 511 has a hollow structure inside. A trapezoidal groove is opened on the top of the box body 511. A dividing box cover 52 is inserted into the top of the box body 511 through the trapezoidal groove. A bottom pad 512 is fixedly connected to the bottom of the box body 511. The bottom of the bottom pad 512 is located on the top of the plate 11. The sub-dividing box 5 is placed inside the main frame 41 to cooperate with the combined frame 4 for stable fixation. The four corners of the box body 511 are all attached to the main frame 41. The dividing box 51 is located at the bottom of the top frame 42. The bottom of the dividing box 51 is placed on the base inside the main frame 41. There are a total of four sub-dividing boxes 5.

[0049] In use, the silicon wafers are initially packaged with a film before being boxed. After initial packaging, the partition box cover 52 is removed, and the packaged silicon wafers are arranged horizontally and placed inside the partition box 51. Then, the partition box cover 52 is put back in place, and the bottom of the main frame 41 is inserted into the top of the plate 11 through the bottom frame 411. Then, the bottom of the partition box 51 is placed on the base formed by the bottom of the main frame 41 and the plate 11, so that the four corners of the surface of the box body 511 are in contact with the delta and rectangular column at the top of the bottom frame 411. After all four base positions at the bottom of the main frame 41 are filled with sub-partition boxes 5, the top frame 42 is inserted into the top of the main frame 41 through the support strip 12. After the insertion is secure, it can be stacked and loaded onto the vehicle. After loading, the sub-partition boxes 5 can be placed separately in the cargo space according to the remaining space size to increase the amount of silicon wafers transported in a single trip. During transportation, the combined frame 4 and the sub-partition boxes 5 absorb the impact and vibration during transportation. The polymer skeleton 414 is inside the combined frame 4 to maintain the structural stability of the entire combined frame 4.

[0050] Example 3, please refer to Figure 10-13 The present invention provides a third technical solution: a four-in-one foam box for silicon wafer packaging, including a foam box bottom plate 1, the foam box bottom plate 1 being made of polyethylene foam, the foam box bottom plate 1 including a plate body 11, a rectangular sliding groove being provided on the top of the plate body 11, two support strips 12 being fixedly connected to the bottom of the plate body 11, a trapezoidal groove being provided on the top of the plate body 11, and a sliding packaging module being fixedly connected to the top of the plate body 11;

[0051] The sliding packaging module includes a combined outer shell 6 and a stable frame 7, which are used to improve the vertical placement of silicon wafers, thereby increasing the utilization of internal space and enhancing the reliability of the foam box in protecting the silicon wafers. The combined outer shell 6 is made of polyethylene foam and includes a long side panel 61. Trapezoidal blocks are fixedly connected to the top and bottom of the long side panel 61. The bottom of the long side panel 61 is inserted into the top of the plate 11 through the trapezoidal blocks. Two symmetrically distributed rectangular slots are opened on the back of the long side panel 61. There are two long side panels 61, which are symmetrically distributed about the top of the plate 11. A wide side panel 62 is inserted into the back of the long side panel 61 through the trapezoidal slots. The wide side panel 62 includes a panel body 621. Both the front and back sides are inserted into the rectangular slots of the long side panel 61. The top and bottom of the panel body 621 are fixedly connected with trapezoidal protrusions. The bottom of the panel body 621 is inserted into the trapezoidal slot at the top of the plate body 11 through the trapezoidal protrusions. The back of the panel body 621 is fixedly connected with an isolation strip 622, which is used to form a gap between the inside of the box and the outside of the silicon wafer. There are two wide side panels 62, which are symmetrically distributed on the left and right sides of the plate body 11. The top of the long side panel 61 is inserted into the top of the trapezoidal protrusions. The bottom of the top panel 63 is inserted into the trapezoidal protrusions at the top of the wide side panel 62. The top of the top panel 63 has two symmetrically distributed rectangular blind holes. The size of the rectangular blind holes is the same as that of the support strip 12.

[0052] The stabilizing frame 7 is made of polyethylene foam. The stabilizing frame 7 includes a recessed base 71. The bottom of the recessed base 71 is slidably connected to a rectangular groove on the top of the plate 11. A rectangular blind hole is opened on the top of the recessed base 71 for placing silicon wafers. Two support side plates 72 are fixedly connected to the top of the recessed base 71 and are symmetrically distributed on the top of the recessed base 71. Two triangular through holes are connected to the front of the support side plates 72 to reduce weight and improve structural strength. A top cover 73 is inserted into the top of the support side plates 72. There are four stabilizing frames 7, which are evenly arranged inside the combined shell 6. The stabilizing frames 7 are used to stabilize the vertically placed silicon wafers and offset the vibration during transportation by slight sliding.

[0053] In use, the silicon wafers are initially packaged with a thin film before being boxed. After initial packaging, the top cover 73 is opened, and the packaged silicon wafers are placed into the stabilizing frame 7 from the top of the support side plate 72, allowing the silicon wafers to be placed vertically on the top of the recessed base 71. Then, the top cover 73 is reset, and the silicon wafers are initially fixed vertically by the cooperation of the top cover 73 and the recessed base 71. After the silicon wafers are installed into the stabilizing frame 7, the bottom of the recessed base 71 slides into the rectangular groove at the top of the plate 11. Then, the four stabilizing frames 7 are slid into the top of the plate 11 in sequence. After the arrangement is completed, the long side plate 61 and the wide side plate 6 are inserted. 2. The top of the board 11 is then inserted, and the top panel 63 is then inserted into the top of the long side panel 61 and the wide side panel 62 to complete the boxing process. During the stacking and loading process, the support strip 12 at the bottom of the upper foam box is inserted into the rectangular through hole at the top of the wide side panel 62 of the lower foam box. During transportation, the stabilizing frame 7 slides slightly along the rectangular groove at the top of the board 11 under the fluctuation of the transportation equipment to offset the vibration impact. Since the silicon wafer is in the rectangular blind hole at the top of the recessed base 71 and there is a certain gap between it and the silicon wafer of the adjacent stabilizing frame 7, there will be no collision that causes the silicon wafer to break.

[0054] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A four-in-one foam box for silicon wafer packaging, comprising a foam box base plate (1), characterized in that: The foam box bottom plate (1) is made of polyethylene foam. The foam box bottom plate (1) includes a plate body (11). The bottom of the plate body (11) is fixedly connected with a support strip (12). There are two support strips (12) and they are fixedly connected to the bottom of the plate body (11). A trapezoidal groove is opened on the top of the plate body (11). A mixed packaging module, a frame packaging module, and a sliding packaging module are fixedly connected to the top of the plate body (11). The hybrid packaging module includes an integrated shell (2) and a hybrid partition assembly (3) for improving packaging space utilization by combining horizontally placed silicon wafers with horizontally placed silicon wafers; the integrated shell (2) is used to absorb external impacts and protect the silicon wafers from the outside; the integrated shell (2) includes a main enclosure (21); the main enclosure (21) has a hollow structure inside; a trapezoidal protrusion is fixedly connected to the bottom of the main enclosure (21); the bottom of the main enclosure (21) is inserted into the trapezoidal groove at the top of the plate (11) through the trapezoidal protrusion; the main enclosure (21) has a hollow structure inside; the main enclosure (21) The front of the main shell (21) has a rectangular groove. The front, back and left and right sides of the main shell (21) are connected by rectangular through holes. The front and back of the inner wall of the main shell (21) are provided with triangular blind holes to improve the structural strength of the main shell (21). The top of the main shell (21) is slidably connected to a sliding cover (22) through a rectangular groove. The top of the sliding cover (22) has two rectangular blind holes. The size of the rectangular blind holes is the same as that of the support strip (12). A hybrid partition component (3) is inserted inside the main shell (21). The material of the integrated shell (2) is polyethylene foam. The frame packaging module includes a combined frame (4) and sub-divider boxes (5), which are used to flexibly load the packaged foam boxes into the cargo space by cooperating with the frame. This improves the space utilization of the packaging boxes and the cargo space, thereby increasing the transportation volume and reducing transportation costs. The combined frame (4) includes a main frame (41), which includes a bottom frame (411). The bottom frame (411) is fixedly connected with trapezoidal protrusions. The bottom frame (411) is inserted into the trapezoidal groove of the plate (11) through the trapezoidal protrusions. The top of the bottom frame (411) is fixedly connected with a cross plate. The four corners of the top of the cross plate of the bottom frame (411) are fixedly connected with triangular prisms. The center of the top of the cross plate of the bottom frame (411) is fixedly connected with a rectangular prism. The cross plate of the bottom frame (411) and the top of the plate (11) cooperate to form four bases. The top of the bottom frame (411) is fixedly connected with... A support column (412) is fixedly connected to a side reinforcement plate (413). The side reinforcement plate (413) is fixedly connected to the top triangular column of the bottom frame (411). A polymer skeleton (414) is sleeved inside the bottom frame (411). The polymer skeleton (414) is sleeved inside the support column (412). The bottom frame (411), support column (412), and side reinforcement plate (413) are all made of polyethylene foam. The polymer skeleton (414) is made of plastic. A top frame (42) is inserted into the top of the support column (412). The top frame (42) is inserted into the polymer skeleton (414). The top frame (42) is inserted into the top triangular column of the bottom frame (411). A strip is fixedly connected to the top of the top frame (42). A rectangular blind hole is opened on the top of the strip. The size of the rectangular blind hole is the same as that of the support strip (12). The top frame (42) is made of polyethylene foam. The sliding packaging module includes a combined outer shell (6) and a stabilizing frame (7) for vertically placing silicon wafers to improve the utilization of space inside the box while enhancing the reliability of the foam box in protecting the silicon wafers.

2. The four-in-one foam box for silicon wafer packaging according to claim 1, characterized in that: The hybrid partition assembly (3) includes a flexible four-part plate (31) and a hybrid placement rack (33) disposed within the partition space of the flexible four-part plate (31). The top of the flexible four-part plate (31) has a hexagonal through hole for providing installation compression space and absorbing impact vibration. The flexible four-part plate (31) is located inside the main enclosure (21). The flexible four-part plate (31) includes a longitudinal hollow plate (311). The front of the longitudinal hollow plate (311) is inserted into a rectangular through hole on the back of the main enclosure (21), and the back of the longitudinal hollow plate (311) is inserted into a rectangular through hole on the front of the main enclosure (21). A transverse hollow plate is inserted into a rectangular through hole on the left side of the main enclosure (21). The transverse hollow plate (312) is inserted into the longitudinal hollow plate (311) on the front side. The right side of the transverse hollow plate (312) is inserted into the rectangular through hole on the right side of the main shell (21). The longitudinal hollow plate (311), the transverse hollow plate (312) and the inner wall of the main shell (21) form four compartments. The front, back and left and right sides of the main shell (21) are fitted with fixing rubber strips (32). The fixing rubber strips (32) are used to reinforce the main shell (21) and the elastic quarter plate (31). The elastic quarter plate (31) and the fixing rubber strips (32) are both made of rubber to achieve reusability and improve the stability of packaging.

3. A four-in-one foam box for silicon wafer packaging according to claim 2, characterized in that: The hybrid placement rack (33) includes a frame (331) made of plastic for reusability. The frame (331) is located in the compartment of the main shell (21). A C-shaped plate is fixedly connected to the top of the frame (331), and an elastic partition plate (332) is fixedly connected inside the C-shaped plate. Semi-circular rubber strips are fixedly connected to the top and bottom of the elastic partition plate (332). The elastic partition plate (332) and the C-shaped plate of the frame (331) form a horizontal placement compartment. The back of the C-shaped plate forms a horizontal placement compartment with the longitudinal hollow plate (311) and the transverse hollow plate (312). There are four hybrid placement racks (33), which are placed in the four compartments of the main shell (21).

4. A four-in-one foam box for silicon wafer packaging according to claim 1, characterized in that: The sub-dividing box (5) is made of polyethylene foam. The sub-dividing box (5) includes a dividing box body (51). The dividing box body (51) includes a box body main body (511). The box body main body (511) has a hollow structure inside. A trapezoidal groove is opened on the top of the box body main body (511). A dividing box cover (52) is inserted into the top of the box body main body (511) through the trapezoidal groove. A bottom pad (512) is fixedly connected to the bottom of the box body main body (511). The bottom of the bottom pad (512) is located on the top of the plate (11).

5. A four-in-one foam box for silicon wafer packaging according to claim 4, characterized in that: The sub-dividing box (5) is placed inside the main frame (41) to cooperate with the combined frame (4) for stable fixation. The four corners of the box body (511) are attached to the main frame (41). The dividing box (51) is located at the bottom of the top frame (42). The bottom of the dividing box (51) is placed on the base inside the main frame (41). There are a total of four sub-dividing boxes (5).

6. A four-in-one foam box for silicon wafer packaging according to claim 1, characterized in that: The top of the plate (11) is provided with a rectangular groove. The combined shell (6) is made of polyethylene foam. The combined shell (6) includes a long side panel (61). The top and bottom of the long side panel (61) are fixedly connected with trapezoidal blocks. The bottom of the long side panel (61) is inserted into the top of the plate (11) through the trapezoidal blocks. The back of the long side panel (61) is provided with two symmetrically distributed rectangular grooves. There are two long side panels (61) and they are symmetrically distributed about the top of the plate (11). The back of the long side panel (61) is inserted into a wide side panel (62) through the trapezoidal grooves. The wide side panel (62) includes a panel body (621). The front and back of the panel body (621) are both connected to the rectangular grooves of the long side panel (61). The top and bottom of the enclosure plate (621) are fixedly connected with trapezoidal protrusions. The bottom of the enclosure plate (621) is connected to the trapezoidal slot at the top of the plate (11) through the trapezoidal protrusions. The back of the enclosure plate (621) is fixedly connected with an isolation strip (622) to form a gap between the inside of the box and the outside of the silicon wafer. There are two wide-side enclosure plates (62) and they are symmetrically distributed on the left and right sides of the plate (11). The top of the long-side enclosure plate (61) is connected to a top panel (63) through trapezoidal protrusions. The bottom of the top panel (63) is connected to the trapezoidal protrusion at the top of the wide-side enclosure plate (62). The top of the top panel (63) has two symmetrically distributed rectangular blind holes with the same size as the support strip (12).

7. A four-in-one foam box for silicon wafer packaging according to claim 6, characterized in that: The stabilizing frame (7) is made of polyethylene foam. The stabilizing frame (7) includes a recessed base (71). The bottom of the recessed base (71) is slidably connected to a rectangular groove on the top of the plate (11). A rectangular blind hole is opened on the top of the recessed base (71) for placing silicon wafers. A support side plate (72) is fixedly connected to the top of the recessed base (71). There are two support side plates (72), which are symmetrically distributed on the top of the recessed base (71). Two triangular through holes are opened on the front of the support side plate (72) to reduce weight and improve structural strength. A top cover (73) is inserted into the top of the support side plate (72).

8. A four-in-one foam box for silicon wafer packaging according to claim 7, characterized in that: The number of the stabilizing frames (7) is four, and they are evenly arranged inside the combined housing (6). The stabilizing frames (7) are used to stabilize the longitudinally placed silicon wafers and to counteract the vibration during transportation by slightly sliding.

Citation Information

Patent Citations

  • Foam box of polygonal structure size silicon wafer

    CN209177292U

  • Packing apparatus for plate display module

    CN101020524A

  • Cassette for holding at least one disc in which information has been stored or will be stored with high recording density

    CN1154531A