Diamond copper uniform temperature plate preparation method and diamond copper uniform temperature plate

Abstract

The present disclosure relates to the technical field of uniform temperature plates, and provides a diamond copper uniform temperature plate preparation method and a diamond copper uniform temperature plate. The method can use a diamond sheet as a base carrier, plate copper on the surface through metallization, sinter a liquid absorption structure, cover and inject ionized water to seal, and finally form a diamond copper uniform temperature plate. Alternatively, the method can use copper as a base carrier, mix a diamond molten salt mixture into the copper base carrier, sinter a liquid absorption structure, cover and inject ionized water to seal, and finally form a diamond copper uniform temperature plate. The diamond copper uniform temperature plate preparation method is simple, can prepare a uniform temperature plate with excellent thermal conductivity, small density and total weight, and high and reliable uniform temperature performance, and can fully meet the lightweight use requirements of existing electronic equipment.

Description

Technical Field

[0001] This disclosure relates to the field of heat exchanger technology, and in particular to a method for preparing a diamond copper heat exchanger and the diamond copper heat exchanger itself. Background Technology

[0002] Currently, vapor chambers are common heat dissipation devices in high-power cooling modules. Taking laptops as an example, vapor chambers used in laptops are mostly made of copper as the shell material. Copper is a commonly used material with excellent thermal conductivity, having a thermal conductivity of 380 W / (m·K), but it also has a thermal conductivity of 8.9 g / cm³. 3 When used extensively in some high-power laptops, the high density of copper vapor chambers, while providing good thermal conductivity, also makes the cooling module very heavy, directly affecting the overall weight of the machine and making it difficult to meet the requirements for lightweight use.

[0003] Therefore, there is an urgent need in the market for a new type of heat dissipation vapor chamber to solve the problem that the existing copper vapor chambers have a high density and cannot meet the requirements for lightweight use. Summary of the Invention

[0004] This disclosure provides a method for preparing a diamond copper heat exchanger and a diamond copper heat exchanger, in order to solve the problem that copper heat exchangers in the prior art have a high density and are difficult to meet the requirements for lightweight applications.

[0005] The method for preparing a diamond copper heat spreader provided in this embodiment includes the following steps:

[0006] Diamond copper sheets are made by plating copper onto the surface of diamond sheets, and then made into plate-shaped diamond copper cover plates.

[0007] The sintered material is heated and sintered on one side of the diamond copper cover plate to form a liquid-absorbing structure;

[0008] The diamond copper cover plate is welded together to form an inner cavity surrounding the liquid-absorbing structure;

[0009] Ionized water is injected into the inner cavity, a vacuum is drawn, and then the inner cavity is welded and sealed to form a diamond copper heat spreader.

[0010] In one embodiment, the preparation process of the liquid-absorbing structure specifically includes:

[0011] Copper powder, copper mesh and copper fiber are mixed as sintering material and sintered at a high temperature of 900℃~1000℃ in a nitrogen and hydrogen gas environment to form the liquid-absorbing structure.

[0012] In one embodiment, the diamond copper cover plate manufacturing process specifically includes:

[0013] A copper layer with a thickness greater than 1 μm is deposited on the surface of a diamond sheet using chemical copper plating, and then manufactured into a diamond copper cover plate through mechanical milling, wire cutting, or laser cutting.

[0014] In one possible implementation, the diamond copper cover plate welding and sealing process specifically includes:

[0015] The diamond copper cover plate is placed in a welding furnace and formed into a diamond copper shell plate with an inner cavity by silver-based brazing, high-pressure diffusion welding and an environment of 800℃~900℃.

[0016] In one possible embodiment, the process further includes the following steps after the diamond copper shell plate is manufactured:

[0017] The injection tube welding step involves placing the injection tube in the pre-drilled hole inside the diamond copper shell and fixing the injection tube using a silver-based welding ring and induction coil heating.

[0018] The liquid injection, vacuuming, sealing, and welding steps involve injecting deionized water into the inner cavity of the diamond copper shell through the injection tube, evacuating the inner cavity of the diamond copper shell for 20 to 30 seconds, and then sealing the injection tube.

[0019] In addition, this disclosure also provides another method for preparing a diamond copper heat spreader, which includes the following steps:

[0020] Diamond powder is mixed with metal powder and sintered to form a diamond molten salt mixture;

[0021] The diamond molten salt mixture is washed and desalted to obtain diamond particles, and then the diamond particles are mixed with copper powder and sintered under high pressure to form a diamond copper cover plate.

[0022] The sintered material is heated and sintered on one side of the diamond copper cover plate to form a liquid-absorbing structure;

[0023] The diamond copper cover plate is welded together to form an inner cavity surrounding the liquid-absorbing structure;

[0024] Ionized water is injected into the inner cavity, and a vacuum is drawn before the inner cavity is welded and sealed to form a diamond copper heat spreader.

[0025] In one embodiment, the sintering process of the diamond molten salt mixture specifically includes:

[0026] Diamond powder, tungsten powder, or chromium powder are mixed, and the mixture is sintered at 950°C in a vacuum heating environment for at least 100 minutes to obtain the diamond molten salt mixture.

[0027] In one possible implementation, the sintering process of the diamond copper cover plate specifically includes:

[0028] The diamond copper cover plate is formed by mixing a diamond molten salt mixture with copper powder in a certain proportion and sintering it under high pressure at 800℃~900℃.

[0029] In addition, the diamond copper heat spreader improved in this embodiment can be prepared by the above-described diamond copper heat spreader preparation method, and includes a first plate cover, a second plate cover, and a liquid absorption structure.

[0030] The first and second cover plates are fitted together to form an inner cavity;

[0031] The liquid-absorbing structure is filled in the inner cavity, and the liquid-absorbing structure is formed by sintering copper powder, copper mesh and copper fiber.

[0032] Both the first plate cover and the second plate cover are made of diamond copper sheet.

[0033] The diamond copper sheet includes a diamond core and a copper plating layer plated on the surface of the diamond core.

[0034] Alternatively, the diamond copper sheet may include a copper matrix and diamond particles disposed in the copper matrix.

[0035] In one embodiment, the diamond copper heat exchanger further includes a support and a liquid injection pipe;

[0036] The support body is disposed in the inner cavity, and its two ends are respectively supported and connected to the first plate cover and the second plate cover;

[0037] One end of the injection tube is electrically connected to the inner cavity, and is used to add working fluid to the inner cavity and to create a vacuum.

[0038] The technical solution provided in this disclosure has the following advantages compared with the prior art:

[0039] The diamond copper vapor chamber preparation method provided in this disclosure can use a diamond sheet as a base carrier, and then form a diamond copper vapor chamber by metallization copper plating, sintering a liquid-absorbing structure, and sealing with injected ionized water. Alternatively, it can use a base copper as a base carrier, mix and embed a diamond molten salt mixture into the copper base carrier, and then sinter a liquid-absorbing structure and seal with injected ionized water to form a diamond copper vapor chamber. Both of these methods have the advantages of simple steps, producing vapor chambers with excellent thermal conductivity, low density and total weight, and efficient and reliable temperature uniformity, which can fully meet the lightweight requirements of existing electronic devices.

[0040] In addition, the diamond copper heat spreader provided in the embodiments of this disclosure, which is prepared by the above-mentioned diamond copper heat spreader preparation method, also has the beneficial effects of excellent thermal conductivity, low density and total weight, and efficient and reliable heat spreader performance.

[0041] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0042] The above and other objects, features, and advantages of this disclosure will become readily apparent from the following detailed description of exemplary embodiments, taken in conjunction with the accompanying drawings. Several embodiments of this disclosure are illustrated in the drawings by way of example and not limitation, in which:

[0043] In the accompanying drawings, the same or corresponding reference numerals indicate the same or corresponding parts.

[0044] Figure 1 A flowchart of the first method for preparing a diamond copper heat spreader provided in this disclosure is shown;

[0045] Figure 2 A flowchart of the second method for preparing a diamond copper heat spreader provided in this disclosure embodiment is shown;

[0046] Figure 3 An exploded view of a diamond copper vapor chamber provided in an embodiment of this disclosure is shown.

[0047] The labels in the diagram are as follows: 1. First cover plate; 2. Second cover plate; 3. Liquid absorption structure; 4. Support body; 5. Injection tube. Detailed Implementation

[0048] To make the objectives, features, and advantages of this disclosure more apparent and understandable, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0049] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0050] Combination Figure 1 As shown in the figure, this disclosure provides a method for preparing a diamond copper heat spreader, which includes the following steps:

[0051] Diamond copper sheets are made by plating copper onto the surface of diamond sheets, and then made into plate-shaped diamond copper cover plates.

[0052] The sintered material is heated and sintered on one side of the diamond copper cover plate to form a liquid-absorbing structure;

[0053] The diamond copper cover plate is welded together to form an inner cavity surrounding the liquid-absorbing structure;

[0054] Ionized water is injected into the inner cavity, a vacuum is drawn, and then the inner cavity is welded and sealed to form a diamond copper heat spreader.

[0055] The method for preparing the diamond copper vapor chamber involves using diamond sheets as the substrate and forming a "copper-diamond-copper" sandwich structure by metallizing copper on the surface. Because the diamond copper sheet is the main component, the thermal conductivity of the diamond copper sheet can be increased from 380W / (m·k) to 800W / (m·k) compared to copper sheet. After the diamond copper vapor chamber is finally prepared, the thermal resistance of the material can be greatly reduced, and the overall performance of the module can be significantly improved when it is applied to the heat dissipation module.

[0056] Furthermore, the method for preparing the diamond copper heat spreader also involves setting a sintering material on one side of the diamond copper sheet and sintering the sintering material to form a liquid-absorbing structure with dense capillary pores. After the diamond copper cover plate is welded together to form an inner cavity, the liquid-absorbing structure set therein can fully absorb ionized water. The liquid-absorbing structure can fully evaporate the locally heated ionized water through capillary effect and absorb and replenish it in time, thereby ensuring the uniform temperature and heat conduction effect of the diamond copper heat spreader.

[0057] In addition, the density of diamond-coated copper plates is 8.9 g / cm³ compared to copper plates. 3 Reduced to 5g / cm 3 After being fabricated into a diamond copper heat spreader, the weight of the diamond copper heat spreader will be reduced by about 40%, which can significantly reduce the weight of the heat dissipation module when applied to it.

[0058] In summary, the diamond copper vapor chamber preparation method provided in this disclosure can use a diamond sheet as a base carrier, and then form a diamond copper vapor chamber by metallization copper plating, sintering a liquid-absorbing structure, and sealing with injected ionized water. This method has the advantages of simple steps, producing a vapor chamber with excellent thermal conductivity, low density and total weight, and efficient and reliable temperature uniformity, which can fully meet the lightweight requirements of existing electronic devices.

[0059] In one embodiment, the preparation process of the liquid-absorbing structure specifically includes:

[0060] Copper powder, copper mesh and copper fiber are mixed as sintering material and sintered at a high temperature of 900℃~1000℃ in a nitrogen and hydrogen gas environment to form a liquid-absorbing structure.

[0061] Copper powder, copper mesh, and copper fiber are mixed as sintering material. After high-temperature sintering, a liquid-absorbing structure is formed, which can form dense capillaries. This liquid-absorbing structure can fully adsorb ionized water through capillary effect and evaporate it when locally heated. Moreover, sintering at a high temperature of 900℃~1000℃ in a nitrogen and hydrogen gas environment can ensure the sintering effect and avoid oxidation during the sintering process.

[0062] In one embodiment, the diamond copper cover plate manufacturing process specifically includes:

[0063] A copper layer with a thickness greater than 1 μm is deposited on the surface of a diamond sheet using chemical copper plating, and then manufactured into a diamond copper cover plate through mechanical milling, wire cutting, or laser cutting.

[0064] Chemical copper plating ensures uniform thickness and strong adhesion of the copper layer on the diamond sheet surface. Furthermore, mechanical milling, wire cutting, or laser cutting can ultimately produce diamond copper cover plates that meet the required dimensions and assembly specifications.

[0065] In one possible implementation, the diamond copper cover plate welding and sealing process specifically includes:

[0066] At least one diamond copper cover plate is placed in a welding furnace and formed into a diamond copper shell plate with an inner cavity by silver-based brazing, high-pressure diffusion welding and an environment of 800℃~900℃.

[0067] The diamond copper cover plate is placed in a welding furnace and then processed into a diamond copper shell plate by silver-based brazing and high-pressure diffusion welding at an temperature of 800℃~900℃. This ensures the weld strength, the sealing of the weld joint, and the thermal conductivity of the weld joint.

[0068] In one possible embodiment, the process further includes the following steps after the diamond copper shell plate is fabricated:

[0069] The injection tube welding process involves placing the injection tube into the pre-drilled hole inside the diamond copper shell and fixing it in place using a silver-based welding ring and induction coil heating.

[0070] The liquid injection, vacuuming, sealing, and welding steps involve injecting deionized water into the inner cavity of the diamond copper shell through an injection tube, evacuating the inner cavity of the diamond copper shell for 20 to 30 seconds, and then sealing the injection tube.

[0071] The injection tube can be made of copper and is fixed by welding with a silver-based welding ring and induction coil heating. This ensures the welding strength of the injection tube and the thermal conductivity of the weld. After the injection tube is welded, ionized water can be injected into the inner cavity of the diamond copper shell through the injection tube. After injection, the inner cavity of the diamond copper shell is evacuated for 20 to 30 seconds to ensure that there are no impurities in the inner cavity. Finally, the injection tube is sealed to complete the final diamond copper heat spreader.

[0072] In addition, this disclosure also provides another method for preparing a diamond copper heat spreader, which includes the following steps:

[0073] Diamond powder is mixed with metal powder and sintered to form a diamond molten salt mixture;

[0074] Diamond particles are obtained by cleaning and desalting the diamond molten salt mixture, and then the diamond particles are mixed with copper powder and sintered under high pressure to form a diamond copper cover plate.

[0075] The sintered material is heated and sintered on one side of the diamond copper cover plate to form a liquid-absorbing structure;

[0076] The diamond copper cover plate is welded together to form an inner cavity surrounding the liquid-absorbing structure;

[0077] Ionized water is injected into the inner cavity, and a vacuum is drawn before the inner cavity is welded and sealed to form a diamond copper heat spreader.

[0078] Specifically, in combination Figure 2 In further detail, the method for preparing the diamond copper heat spreader involves using copper as a base carrier and embedding a diamond molten salt mixture into the copper base carrier. In the specific production process, diamond powder and metal powder are first mixed and sintered to form a diamond molten salt mixture. After cleaning and desalting, diamond particles are obtained. Finally, the diamond particles are mixed with copper powder and sintered under high pressure to form a diamond copper cover plate. The diamond copper cover plate is then used to finally manufacture the diamond copper heat spreader, and the steps are consistent with the above-mentioned method for preparing the diamond copper heat spreader.

[0079] Similarly, the method for preparing the diamond copper heat spreader can also increase the thermal conductivity from 380W / (m·k) to 800W / (m·k), significantly improving the overall heat dissipation performance of the module. Moreover, the diamond copper heat spreader has a lower density than the copper plate, which can also significantly reduce the weight of the heat dissipation module, thereby fully meeting the lightweight requirements of existing electronic devices.

[0080] In addition, the specific proportions of diamond and copper in the diamond copper heat exchanger prepared by the above two methods can be denoted as diamond proportion = X, copper proportion = 1-X, where X = 0.4 to 0.6.

[0081] In one embodiment, the sintering process of the diamond molten salt mixture specifically includes:

[0082] Diamond powder, tungsten powder, or chromium powder are mixed and sintered at 950°C in a vacuum heating environment for at least 100 minutes to obtain a diamond molten salt mixture.

[0083] The metal powder is specifically set as tungsten powder or chromium powder. Both tungsten and chromium have the characteristics of high melting point and stable chemical properties. After being mixed with diamond powder, they can be sintered at 950°C in a vacuum heating environment for at least 100 minutes to obtain a diamond molten salt mixture with large particles.

[0084] In one embodiment, the sintering process of the diamond copper cover plate specifically includes:

[0085] A diamond copper cap plate is formed by mixing a diamond molten salt mixture with copper powder in a certain proportion and sintering it under high pressure at 800℃~900℃.

[0086] Sintering under high pressure at 800℃~900℃ allows copper powder to melt accordingly. The molten copper then acts as a binder to encapsulate the diamond molten salt mixture. After cooling, it forms a smooth diamond copper cover plate.

[0087] In addition, this disclosure also provides a diamond copper heat exchanger, which can be prepared by the above-described diamond copper heat exchanger preparation method. It includes a first plate cover 1, a second plate cover 2, and a liquid-absorbing structure 3. The first plate cover 1 and the second plate cover 2 are correspondingly closed to form an inner cavity. The liquid-absorbing structure 3 is filled in the inner cavity and is formed by sintering copper powder, copper mesh, and copper fiber.

[0088] The first cover 1 and the second cover 2 are both made of diamond copper sheet; the diamond copper sheet includes a diamond core and a copper plating layer plated on the surface of the diamond core; or the diamond copper sheet includes a copper matrix and diamond particles disposed in the copper matrix.

[0089] Specifically, in combination Figure 3 In further detail, this diamond copper heat spreader can be prepared by the above-mentioned diamond copper heat spreader preparation method, and therefore has the characteristics of excellent thermal conductivity, low density and total weight, and efficient and reliable heat spreader performance.

[0090] Moreover, the inner cavity formed by the first cover shell 1 and the second cover shell 2 of the diamond copper heat spreader can completely seal and enclose the liquid absorption structure 3, ensuring the sealing and heat uniformity of the liquid absorption structure 3 and the working fluid in the diamond copper heat spreader.

[0091] In one embodiment, the diamond copper heat exchanger plate further includes a support body 4 and a liquid injection pipe 5; the support body 4 is disposed in the inner cavity, and its two ends are respectively supported and connected to the first plate cover 1 and the second plate cover 2; one end of the liquid injection pipe 5 is electrically connected to the inner cavity and is used to add working fluid to the inner cavity and to draw a vacuum.

[0092] Specifically, in combination Figure 3 In further detail, the aforementioned support 4 can be specifically, but not limited to, set as copper cylindrical columns of equal height. By supporting multiple support 4 in the inner cavity, the structural stability of the diamond copper heat spreader can be ensured, and problems such as bulging or collapse of the diamond copper heat spreader during use can be avoided.

[0093] The injection tube 5 can also be made of copper. One end of the injection tube 5 is connected to the inner cavity for adding working fluid and evacuating the inner cavity. After adding working fluid and evacuating the vacuum, the injection tube 5 can be sealed, welded and cut off accordingly.

[0094] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means two or more, unless otherwise explicitly specified.

[0095] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A method for manufacturing a diamond-copper uniform heat plate, characterized by, The method comprises the following steps: A diamond copper sheet is prepared by plating copper on the surface of a diamond sheet, and a diamond copper cover plate is prepared in the form of a sheet; A sintering material is heated and sintered on one side of the diamond copper cover plate to form a liquid absorbing structure; The diamond copper cover plate is welded to form an inner cavity surrounding the liquid absorbing structure; Ionized water is injected into the inner cavity, and the inner cavity is welded and sealed after vacuumizing to form a diamond copper uniform temperature plate; The preparation process of the liquid absorbing structure comprises the following steps: Copper powder, copper mesh and copper fiber are mixed as a sintering material, and the sintering material is sintered at a high temperature of 900-1000 ℃ in a nitrogen-hydrogen gas environment to form the liquid absorbing structure.

2. The diamond-copper uniform heat plate manufacturing method according to claim 1, wherein, The preparation process of the diamond copper cover plate comprises the following steps: A copper layer with a thickness greater than 1 um is plated on the surface of a diamond sheet by chemical copper plating, and the diamond copper cover plate is prepared by mechanical milling, wire cutting or laser cutting.

3. The diamond-copper uniform heat plate manufacturing method according to claim 1, wherein The welding process of the diamond copper cover plate comprises the following steps: The diamond copper cover plate is placed in a welding furnace, and silver-based brazing and high-pressure diffusion welding are adopted to form a diamond copper shell plate with an inner cavity at a temperature of 800-900 ℃.

4. The diamond-copper uniform heat plate manufacturing method according to claim 3, wherein The method further comprises the following steps after the preparation of the diamond copper shell plate: An injection pipe is welded in a reserved hole of the inner cavity of the diamond copper shell by silver-based welding and inductive coil heating; Ionized water is injected into the inner cavity of the diamond copper shell through the injection pipe, and the inner cavity of the diamond copper shell is vacuumized for 20-30 s, and then the injection pipe is sealed.

5. A method for manufacturing a diamond-copper uniform heat plate, characterized by, The method comprises the following steps: Diamond powder and metal powder are mixed, and a diamond molten salt mixture is formed by sintering; The diamond molten salt mixture is washed to remove salt to obtain diamond particles, and the diamond particles are mixed with copper powder and sintered at a high pressure to form a diamond copper cover plate; A sintering material is heated and sintered on one side of the diamond copper cover plate to form a liquid absorbing structure; The diamond copper cover plate is welded to form an inner cavity surrounding the liquid absorbing structure; Ionized water is injected into the inner cavity, and the inner cavity is welded and sealed after vacuumizing to form a diamond copper uniform temperature plate; The preparation process of the liquid absorbing structure comprises the following steps: Copper powder, copper mesh and copper fiber are mixed as a sintering material, and the sintering material is sintered at a high temperature of 900-1000 ℃ in a nitrogen-hydrogen gas environment to form the liquid absorbing structure. The diamond powder and the metal powder are mixed, and a diamond molten salt mixture is formed by sintering; The metal powder is tungsten powder or chromium powder, the diamond powder and the metal powder are mixed, and the mixture is sintered at 950 ℃ in a vacuum heating environment for at least 100 min to obtain the diamond molten salt mixture.

6. The diamond-copper uniform heat plate manufacturing method according to claim 5, wherein The sintering process of the diamond copper cover plate comprises the following steps: The diamond molten salt mixture and copper powder are mixed in a certain proportion, and the diamond copper cover plate is sintered at a high temperature of 800-900 ℃.

7. A diamond-copper uniform heat plate, which can be produced by the method for producing a diamond-copper uniform heat plate according to claim 1 or 5, characterized by, It comprises: A first plate cover shell (1) and a second plate cover shell (2) are correspondingly combined to form an inner cavity. A liquid absorbing structure (3) is filled in the inner cavity, and the liquid absorbing structure (3) is formed by sintering of copper powder, copper mesh and copper fiber; The first plate cover shell (1) and the second plate cover shell (2) are both made of diamond copper sheets; The diamond copper sheet comprises a diamond sheet core and a copper plating layer plated on the surface of the diamond sheet core; Or the diamond copper sheet comprises a copper base body and diamond particles arranged in the copper base body.

8. The diamond-copper TEG of claim 7, wherein, The diamond copper vapor chamber further comprises: A support body (4) is arranged in the inner cavity and supports the first plate cover shell (1) and the second plate cover shell (2) at two ends, respectively; A liquid injection pipe (5) is in conductive connection with the inner cavity at one end and is used for adding working fluid and vacuumizing in the inner cavity.

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