An integrated optoelectronic detection system

Abstract

The present application provides an integrated optoelectronic detection system, comprising: a first displacement platform, which is at least movably arranged along a first direction; a micro-region detection module and a light source module are integrated above the first displacement platform and arranged adjacent to each other; a wide-field imaging module is located on one side of the circumferential direction of the first displacement platform, and a sample platform is located on the other side. In the imaging mode, the first displacement platform is displaced to a first position, and the wide-field imaging module, the light source module and the sample platform are arranged in alignment along a second direction. In the optoelectronic detection mode, the first displacement platform is displaced to a second position, and the micro-region detection module and the sample platform are arranged in alignment along the second direction. For the integrated optoelectronic detection system provided in the first aspect embodiment of the present application, the light source module and the micro-region detection module are integrated on the same first displacement platform. On the premise of keeping the positions of other devices relatively unchanged, the switching between the imaging function and the optoelectronic detection function is realized by moving the first displacement platform, and it is convenient for automatic control.

Description

Technical Field

[0001] This application relates to the field of optoelectronic technologies, and particularly to an integrated optoelectronic detection system. Background Art

[0002] In the entire production and quality control processes, semiconductor detection and photovoltaic device detection need to ensure both high precision and high reliability of products, and also meet the increasing requirements for detection speed and cost control. Therefore, optoelectronic performance detection technologies have received much attention in the fields of semiconductor and photovoltaic device detection. However, existing technologies are all detection devices with single functions or means, and cannot complete the task of comprehensively evaluating the overall performance of optoelectronic materials. Summary of the Invention

[0003] An embodiment of this application provides an integrated optoelectronic detection system, which can integrate multiple different detection functions on the same platform to achieve comprehensive detection of samples using multiple detection means.

[0004] In a first aspect, an integrated optoelectronic detection system provided by an embodiment of this application includes: a first displacement platform, movably arranged and at least capable of being movably arranged along a first direction; a light source module, integrated above the first displacement platform; a micro-region detection module, integrated above the first displacement platform and arranged adjacent to the light source module along the first direction; a wide-field imaging module, located on one side of the circumference of the first displacement platform; a sample platform, used to carry a sample to be detected, located on the other side of the first displacement platform away from the wide-field imaging module. In an imaging mode, the first displacement platform is displaced to a first position, and the wide-field imaging module, the light source module, and the sample platform are aligned along a second direction. In an optoelectronic detection mode, the first displacement platform is displaced to a second position, and the micro-region detection module is aligned with the sample platform along the second direction. The first direction intersects with the second direction.

[0005] The integrated optoelectronic detection system provided by the first aspect embodiment of this application integrates the light source module for imaging function and the micro-region detection module for optoelectronic detection function on the same first displacement platform. On the premise of keeping the relative positions of the sample platform and the wide-field imaging module unchanged, smooth switching between the imaging function and the optoelectronic detection function is achieved by moving the first displacement platform along the first direction, and it is convenient to implement automatic control.

[0006] According to one aspect of an embodiment of the present application, the light source module also includes a first coaxial light source and a second coaxial light source, the size of the first coaxial light source is larger than the size of the second coaxial light source, the wide-field imaging module also includes a first imaging module and a second imaging module, the resolution of the first imaging module is smaller than the resolution of the second imaging module; in a low-resolution imaging mode, the first displacement platform is displaced to a first sub-position, and the first imaging module, the first coaxial light source and the sample platform are aligned along the second direction; in a high-resolution imaging mode, the first displacement platform is displaced to a second sub-position, and the second imaging module, the second coaxial light source and the sample platform are aligned along the second direction.

[0007] According to one aspect of the embodiments of the present application, the first coaxial light source and the second coaxial light source are arranged on both sides of the micro-area detection module along the first direction, and the first imaging module and the second imaging module are arranged adjacent to each other along the first direction.

[0008] According to one aspect of an embodiment of the present application, it also includes a second displacement platform, which is movably arranged and at least movably arranged along a second direction, the wide-field imaging module is integrated on the second displacement platform, and the first imaging module and the second imaging module are arranged adjacent to each other along the first direction on the second displacement platform.

[0009] According to one aspect of an embodiment of the present application, the sample platform includes a sample clamp and a sample displacement platform, the sample clamp is used to clamp the sample to be tested, the sample displacement platform is located on the side of the sample clamp away from the first displacement platform, and is used to control the displacement of the sample to be tested along the first direction and the third direction, and the third direction intersects with the plane formed by the first direction and the second direction.

[0010] According to one aspect of an embodiment of the present application, it also includes a filter module, which includes a rotating mechanism and a non-filter module and a filter module arranged along the circumference of the rotating mechanism, and the filter module is arranged on the side of the wide-field imaging module close to the first displacement platform along the second direction; in the bright field imaging mode, the rotating mechanism rotates to the first rotation position, and the wide-field imaging module, the non-filter module, the light source module and the sample platform are aligned along the second direction; in the photoelectric imaging mode, the rotating mechanism rotates to the second rotation position, and the wide-field imaging module, the filter module, the light source module and the sample platform are aligned along the second direction.

[0011] According to one aspect of an embodiment of the present application, it also includes an electrical control module, the electrical control module includes an electrical control platform, and the sample platform also includes a sample clamp and electrode modules arranged at both ends of the sample clamp; in the photoluminescence imaging mode, the electrical control platform disconnects the electrical connection with the electrode module, and the wide-field imaging module, the light source module and the sample platform are aligned along the second direction; in the electroluminescence imaging mode, the electrical control platform is electrically connected to the electrode module, and the wide-field imaging module, the light source module and the sample platform are aligned along the second direction.

[0012] According to one aspect of the embodiments of the present application, the electronic control module further includes an industrial computer and a data acquisition card. The industrial computer is electrically connected to the first displacement platform, the light source module, the micro-region detection module, the wide-field imaging module, and the sample platform, and is used to realize the automatic control of an integrated optoelectronic detection system. The data acquisition card is connected to the industrial computer, the micro-region detection module, and the wide-field imaging module, and is used to transmit the data collected by the micro-region detection module and the wide-field imaging module to the industrial computer.

[0013] According to one aspect of the embodiments of the present application, the micro-region detection module includes a laser, a dichroic mirror, a spectrometer, and an electrical signal acquisition card; in the spectral analysis mode, the light source generated by the laser propagates along the first optical path, passes through the dichroic mirror and irradiates the surface of the sample to be detected. The fluorescence generated by the excitation of the surface of the sample to be detected enters the dichroic mirror and propagates along the second optical path and is transmitted to the spectrometer; in the photocurrent scanning mode, the light source generated by the laser propagates along the first optical path, passes through the dichroic mirror and irradiates the surface of the sample to be detected, and the current change generated on the surface of the sample to be detected is transmitted into the electrical signal acquisition card.

[0014] According to one aspect of the embodiments of the present application, the micro-region detection module further includes a piezoelectric adjustment stage and a rotary mirror mount; in the photocurrent scanning mode, the laser controls the intensity of the light source, the piezoelectric adjustment stage controls the focal length of the light source focus, and the rotary mirror mount controls the direction of the first optical path. Description of the Drawings

[0015] The features, advantages, and technical effects of the exemplary embodiments of the present application will be described below with reference to the drawings.

[0016] Figure 1 It is a schematic diagram of the overall structure of an integrated optoelectronic detection system provided by the first aspect embodiment of the present application.

[0017] Figure 2 It is a partially enlarged schematic diagram of the structure of an integrated optoelectronic detection system provided by the first aspect embodiment of the present application in the low-resolution imaging mode;

[0018] Figure 3 It is a partially enlarged schematic diagram of the structure of an integrated optoelectronic detection system provided by the first aspect embodiment of the present application in the high-resolution imaging mode;

[0019] Figure 4 It is a partially enlarged schematic diagram of the structure of an integrated optoelectronic detection system provided by the first aspect embodiment of the present application in the optoelectronic detection mode;

[0020] Figure 5 It is a separately enlarged schematic diagram of the structure of the sample fixture in an integrated optoelectronic detection system provided by the first aspect embodiment of the present application;

[0021] Figure 6 It is an enlarged schematic diagram of the separate structure of the filter module in an integrated optoelectronic detection system provided by an embodiment of the first aspect of the present application;

[0022] Figure 7 It is an enlarged schematic diagram of the separate structure of the micro-region detection module in an integrated optoelectronic detection system provided by an embodiment of the first aspect of the present application.

[0023] Reference numerals:

[0024] 100 - An integrated optoelectronic detection system;

[0025] 110 - The first displacement platform; 120 - The second displacement platform;

[0026] 130 - The light source module; 130a - The first coaxial light source; 130b - The second coaxial light source;

[0027] 140 - The micro-region detection module; 140a - The laser; 140b - The spectrometer; 140c - The first optical fiber; 140d - The second optical fiber; 140e - The first mirror mount; 140f - The third mirror mount; 140g - The rotating mirror mount; 140h - The second mirror mount; 140i - The fourth mirror mount; 140j - The excitation filter; 140k - The collection filter; 140l - The high-reflection mirror; 140m - The dichroic mirror; 140n - The piezoelectric adjustment mount; 140p - The objective lens; 140q - The transmission cable; 140r - The electrical signal acquisition card;

[0028] 150 - The wide-field imaging module; 150a - The first imaging module; 150b - The second imaging module;

[0029] 160 - The sample platform; 160a - The sample clamp; 160b - The sample displacement stage; 160c - The electrode module;

[0030] 170 - The filter module; 170a - The rotating mechanism; 170b - The filterless module; 170c - The filter module;

[0031] 180 - The electronic control module; 180a - The electrical control platform; 180b - The industrial control computer; 180c - The acquisition card;

[0032] 190 - The housing;

[0033] X - The first direction; Y - The second direction; Z - The third direction.

[0034] In the drawings, the same components are denoted by the same reference numerals. The drawings are not drawn to actual scale. Detailed implementation manners

[0035] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the following detailed description, many specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to those skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is only intended to provide a better understanding of the present application by showing examples of the present application. In the drawings and the following description, at least some of the well-known structures and technologies are not shown in order to avoid unnecessarily obscuring the present application; and, for clarity, the dimensions of some structures may be exaggerated. In addition, the features, structures, or characteristics described below may be combined in any suitable manner in one or more embodiments.

[0036] The orientation terms appearing in the following description are all the directions shown in the figures, and do not limit an integrated photoelectric detection system provided by the embodiments of the present application. In the description of the present application, it should also be noted that, unless otherwise clearly defined and limited, the terms "mounted" and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be directly connected or indirectly connected. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0037] In the related art, in the fields of semiconductor material detection and photovoltaic device material detection, optical testing technology has always been the main means. However, the optical detection equipment provided in the related art can only include a single detection function. Now, with the continuous development of optoelectronic conversion materials, the testing requirements for optoelectronic conversion materials are constantly emerging. In particular, a comprehensive understanding of the overall characteristics of new optoelectronic conversion materials is needed. Therefore, it has become a new testing requirement to comprehensively characterize the material properties by using multiple detection means for the same sample.

[0038] Common characterization means, in addition to using imaging technology to obtain the surface image of the sample for observation, also include Raman testing, fluorescence testing, and photoelectric effect testing. Raman testing can detect the Raman reflected light in the reflected light of the sample to characterize the molecular structure and chemical composition of the material. Fluorescence testing is used to detect the fluorescence spectrum generated by the sample excited by the laser to reflect the material characteristics. The photoelectric effect testing detects the working performance of the device after the optoelectronic conversion material is made into a device.

[0039] Among them, for semiconductor materials such as silicon carbide, gallium nitride, and gallium oxide, it is necessary to use photoelectric effect testing and Raman testing to comprehensively characterize the material properties.

[0040] For photovoltaic device materials represented by perovskite solar cells, it is also necessary to use fluorescence testing, Raman testing, and photoelectric effect testing to complete the comprehensive characterization of the material properties.

[0041] Therefore, semiconductor materials and materials such as perovskites need to adopt a variety of optical testing technologies to achieve a comprehensive characterization of the overall performance of the materials. However, in the related technologies, the detection means of the detection equipment are single, and for the same sample, multiple equipment are required to achieve the comprehensive detection of multiple optical detection technologies. It is impossible to achieve automated multi-means detection, which increases the labor intensity of the operators. At the same time, it is impossible to automatically configure different sets of detection functions according to the differences of the samples, resulting in low detection efficiency and difficulty in achieving a comprehensive characterization of the performance of the sample materials.

[0042] In consideration of solving the above technical problems and technical needs, the embodiments of the present application provide an integrated optical testing platform, which can integrate a variety of different detection functions on the same platform to achieve a comprehensive detection of a sample by a variety of detection means.

[0043] Figure 1 Shows the overall structure of an integrated optoelectronic detection system 100 provided by the embodiments of the first aspect of the present application. Figure 2 Shows a partially enlarged structure of an integrated optoelectronic detection system 100 provided by the embodiments of the first aspect of the present application in a low-resolution imaging mode. Figure 3 Shows a partially enlarged structure of an integrated optoelectronic detection system 100 provided by the embodiments of the first aspect of the present application in a high-resolution imaging mode. Figure 4 Shows a partially enlarged structure of an integrated optoelectronic detection system 100 provided by the embodiments of the first aspect of the present application in an optoelectronic detection mode.

[0044] Please refer to Figures 1 to 4 , in the first aspect, the embodiments of the present application provide an integrated optoelectronic detection system 100, including a first displacement platform 110, a light source module 130, a micro-region detection module 140, a wide-field imaging module 150, and a sample platform 160.

[0045] The first displacement platform 110 is movably arranged and can be at least movably arranged along the first direction X.

[0046] The light source module 130 and the micro-region detection module 140 are integrated above the first displacement platform 110, and the micro-region detection module 140 and the light source module 130 are arranged adjacent to each other along the first direction X.

[0047] The wide-field imaging module 150 is located on one side in the circumferential direction of the first displacement platform 110.

[0048] The sample platform 160 is used to carry the sample to be detected, on the other side of the first displacement platform 110 away from the wide-field imaging module 150. In the imaging mode, the first displacement platform 110 is displaced to the first position, and the wide-field imaging module 150, the light source module 130, and the sample platform 160 are arranged in alignment along the second direction Y. In the optoelectronic detection mode, the first displacement platform 110 is displaced to the second position, and the micro-region detection module 140 is arranged in alignment with the sample platform 160 along the second direction Y. The first direction X intersects with the second direction Y.

[0049] An integrated optoelectronic detection system 100 provided by an embodiment of the first aspect of the present application integrates the light source module 130 for imaging functions and the micro-region detection module 140 for optoelectronic detection functions on the same first displacement platform 110. On the premise of keeping the relative positions of the sample platform 160 and the wide-field imaging module 150 unchanged, smooth switching between the imaging function and the optoelectronic detection function is achieved by moving the first displacement platform 110 along the first direction X, and it is convenient to realize automatic control.

[0050] The first displacement platform 110 is a movable platform, and the platform itself can at least reciprocally slide along the slide rail arranged along the first direction X.

[0051] Optionally, the slide rail itself can be controlled by a motor to facilitate automatic control.

[0052] Optionally, the first displacement platform 110 can also adjust its own position circumferentially. The circumferential direction should be understood as the circumferential direction in the cylindrical coordinate system established with the first direction X as the axial direction, that is, in addition to being movably arranged along the first direction X, the first displacement platform 110 can also adjust its own position around the first direction X, which is convenient for flexible adjustment to achieve the alignment of the micro-region detection module 140 with the sample platform 160, and the alignment of the wide-field imaging module 150, the light source module 130, and the sample platform 160 along the second direction Y.

[0053] The light source module 130 and the micro-region detection module 140 are integrated above the first displacement platform 110 and are adjacent to each other. It should be understood that the light source module 130 and the micro-region detection module 140 are arranged on the same surface determined by the first displacement platform 110, and the light source module 130 and the micro-region detection module 140 are integrated into a part of the structure of the first displacement platform 110 and can move simultaneously with the displacement of the first displacement platform 110.

[0054] The light source module 130 and the micro-region detection module 140 can at least move back and forth along the first direction X to adjust their own positions, which is convenient for the alignment of the micro-region detection module 140 with the sample platform 160, and the alignment of the wide-field imaging module 150, the light source module 130, and the sample platform 160 along the second direction Y.

[0055] Optionally, the light source module 130 and the micro-area detection module 140 can also adjust their positions along the circumferential direction, which further facilitates flexible adjustment.

[0056] The wide-field imaging module 150 and the sample platform 160 are arranged in such a way that the wide-field imaging module 150 is located on one side of the first displacement platform 110 in the circumferential direction, and the sample platform 160 is located on the other side of the first displacement platform 110 away from the wide-field imaging module 150. It should be understood that the wide-field imaging module 150 is arranged around one side of the first displacement platform 110 with the first direction X as the axis, and the first displacement platform 110 is arranged between the sample platform 160 and the wide-field imaging module 150, so as to facilitate the alignment of the micro-area detection module 140 on the first displacement platform 110 with the sample platform 160 along the second direction Y, and the alignment of the wide-field imaging module 150, the light source module 130 on the first displacement platform 110, and the sample platform 160 along the second direction Y.

[0057] In the imaging mode, the light source module 130 is disposed between the wide-field imaging module 150 and the sample platform 160, and the wide-field imaging module 150, the light source module 130 and the sample platform 160 are aligned along the second direction Y, and the light emitted by the light source module 130 and the light received by the sample platform 160 and the wide-field imaging module 150 are always maintained on an axis along the second direction Y. Since the light is always propagated on the same axis, it is convenient to automatically control the alignment, and the transmission loss and reflection loss of the light source and the light in the optical path are minimized, and the light irradiated on the sample can be evenly distributed, which can provide high-quality lighting.

[0058] In the photoelectric detection mode, since the micro-area detection module 140 needs to be close to the sample to be detected on the sample platform 160, the micro-area detection module 140 is set on the first displacement platform 110. It is not only convenient to control the distance between the micro-area detection module 140 and the sample to be detected, but also compared with the wide-field imaging module 150 used to obtain imaging information in the imaging mode, the micro-area detection module 140 can be set closer to the sample to be detected, and the detection effect is better.

[0059] The optical testing platform provided in the first aspect of the present application can conveniently realize switching between the imaging mode and the photoelectric detection mode by moving the first displacement platform 110 to a specific first position and a second position, thereby facilitating the realization of automatic control.

[0060] The provision of the first displacement platform 110 can reduce the displacement amplitude of the sample to be detected, thereby further reducing the size of the housing 190 of the integrated photoelectric detection system 100 and facilitating subsequent integration of other detection functions.

[0061] The second direction Y intersects with the first direction X. It should be understood that the second direction Y includes multiple directions and can be adjusted at any time along the circumferential direction of the first displacement platform 110 as long as it intersects with the first direction X.

[0062] Exemplarily, the first direction X and the second direction Y are perpendicularly intersecting.

[0063] Optionally, the second direction Y in which the wide-field imaging module 150, the light source module 130, and the sample platform 160 are aligned in the imaging mode and the second direction Y in which the micro-region detection module 140 and the sample platform 160 are aligned in the photoelectric detection mode are not the same second direction Y, which further facilitates flexible adjustment and avoids the risk of interference between different devices in the imaging mode and the photoelectric detection mode.

[0064] Optionally, the integrated optical platform is installed inside a closed mechanical housing 190. The housing 190 serves to provide light shielding and protect the devices on the integrated optical platform. The mechanical housing 190 adopts a structure of mutually coupled splicing to ensure that all the testing processes on the integrated optical platform are carried out in a darkroom environment to avoid external light interference.

[0065] Please refer to Figure 2 and Figure 3 , in some embodiments, the light source module 130 further includes a first coaxial light source 130a and a second coaxial light source 130b. The size of the first coaxial light source 130a is larger than that of the second coaxial light source 130b. The wide-field imaging module 150 further includes a first imaging module 150a and a second imaging module 150b. The resolution of the first imaging module 150a is less than that of the second imaging module 150b.

[0066] In the low-resolution imaging mode, the first displacement platform 110 is displaced to the first sub-position, and the first imaging module 150a, the first coaxial light source 130a, and the sample platform 160 are aligned along the second direction Y.

[0067] In the high-resolution imaging mode, the first displacement platform 110 is displaced to the second sub-position, and the second imaging module 150b, the second coaxial light source 130b, and the sample platform 160 are aligned along the second direction Y.

[0068] In these embodiments, by dividing the wide-field imaging module 150 into the first imaging module 150a and the second imaging module 150b with different resolutions, and dividing the light source module 130 into the first coaxial light source 130a and the second coaxial light source 130b with different sizes, two different resolution imaging modes are realized in the imaging mode. And for the switching between the high-resolution imaging mode and the low-resolution imaging mode, it only needs to displace the first displacement platform 110 to specific first and second sub-positions, which further facilitates the realization of automatic control.

[0069] The first coaxial light source 130a and the second coaxial light source 130b are used for precise illumination of the wide-field imaging module 150 to achieve the imaging function. The first coaxial light source 130a and the second coaxial light source 130b use internal mirrors to align the light beam emitted by the light source with the imaging optical path of the sample to be detected. While reducing the deviation, the light irradiated on the sample to be detected can be evenly distributed, ensuring that the sample to be detected can obtain high-quality clear imaging.

[0070] The sizes of the first coaxial light source 130a and the second coaxial light source 130b have a significant impact on the beam quality, spot size, and illumination uniformity of the light beam generated by the first coaxial light source 130a and the second coaxial light source 130b when irradiating on the sample to be detected.

[0071] The second coaxial light source 130b with a smaller size has a light source with a smaller size, which is better in the clarity of the focus and the focusing ability, can generate better beam quality, is conducive to focusing the light beam into a spot with higher quality and smaller size, and is suitable for the high-resolution imaging mode.

[0072] The first coaxial light source 130a with a larger size has a light source with a larger size, can generate a larger-size spot, can provide a wider illumination area, and achieve a wider illumination range.

[0073] At the same time, the first imaging module 150a that cooperates with the first coaxial light source 130a to achieve the low-resolution imaging mode includes a camera and a low-magnification optical lens to achieve large-range and large-area imaging.

[0074] The second imaging module 150b that cooperates with the second coaxial light source 130b to achieve the high-resolution imaging mode includes a camera and a high-magnification optical lens, and can achieve high-resolution imaging in the sub-micron to micron scale.

[0075] Optionally, the cameras in the first imaging module 150a and the second imaging module 150b can be set as Charge-Coupled Device Cameras (CCDs). A CCD camera is an imaging device based on a CCD image sensor, which mainly uses the CCD image sensor to convert the optical signal into an electrical signal to capture images.

[0076] Optionally, the first coaxial light source 130a and the second coaxial light source 130b integrated on the first displacement platform 110 can install light sources of different types, wavelengths, and powers according to the materials, excitation wavelengths, etc. of different samples to be detected, which is convenient for flexible adjustment.

[0077] The optical test platform provided by the first aspect embodiment of the present application can conveniently switch between a high-resolution imaging mode and a low-resolution imaging mode by moving the first displacement platform 110 to specific first and second sub-positions, further facilitating the implementation of automatic control.

[0078] Exemplarily, the first direction X and the second direction Y are perpendicular to each other.

[0079] Optionally, the second direction Y in which the first imaging module 150a, the first coaxial light source 130a, and the sample platform 160 are aligned in the low-resolution imaging mode is not the same second direction Y as that in which the second imaging module 150b, the second coaxial light source 130b, and the sample platform 160 are aligned in the high-resolution imaging mode, further facilitating flexible adjustment and avoiding the risk of interference between different devices in the high-resolution imaging mode and the low-resolution imaging mode.

[0080] Please continue to refer to Figure 2 and Figure 3 , in some embodiments, the first coaxial light source 130a and the second coaxial light source 130b are arranged on both sides of the micro-region detection module 140 along the first direction X, and the first imaging module 150a and the second imaging module 150b are arranged adjacent to each other along the first direction X.

[0081] In these embodiments, the first displacement platform 110 is displaced towards the second coaxial light source 130b to the first sub-position to achieve the low-resolution imaging mode, and the second displacement platform 120 is displaced towards the first coaxial light source 130a to the second sub-position to achieve the high-resolution imaging mode.

[0082] Exemplarily, please refer to Figure 2 , the first displacement platform 110 is displaced towards the second coaxial light source 130b to the limit position. When the platform of the first displacement platform 110 abuts against the slide rail, it is the first sub-position. At this time, the first imaging module 150a, the first coaxial light source 130a, and the sample platform 160 are aligned along the second direction Y, further facilitating the implementation of automatic control.

[0083] Please refer to Figure 3 , the second displacement platform 120 is displaced towards the first coaxial light source 130a to the limit position. When the platform of the second displacement platform 120 abuts against the slide rail, it is the second sub-position. At this time, the second imaging module 150b, the second coaxial light source 130b, and the sample platform 160 are aligned along the second direction Y, further facilitating the implementation of automatic control.

[0084] Please refer to Figure 1, in some embodiments, an integrated optoelectronic detection system 100 further includes a second displacement platform 120, which is movably arranged and at least movably arranged along a second direction Y. The wide-field imaging module 150 is integrated on the second displacement platform 120, and the first imaging module 150a and the second imaging module 150b are arranged adjacent to each other along a first direction X on the second displacement platform 120.

[0085] In these embodiments, the first imaging module 150a and the second imaging module 150b are arranged on the second displacement platform 120. By moving the second displacement platform 120 along the second direction Y, the focal planes of the first imaging module 150a and the second imaging module 150b are aligned with the plane of the sample to be detected in different high-resolution imaging modes and low-resolution imaging modes, without directly adjusting the focal length of the imaging module. Focusing can be achieved by controlling the movement of the second displacement platform 120, which further facilitates the realization of automatic control.

[0086] Exemplarily, the low-magnification lens and the high-magnification lens in the first imaging module 150a and the second imaging module 150b are fixed-focus lenses. Therefore, due to the setting of the high-magnification lens, the length dimension of the second imaging module 150b is larger than that of the first imaging module 150a, and the focal planes of the first imaging module 150a and the second imaging module 150b are located in two different planes. They need to be fixed on the same second displacement platform 120 along the first direction X, and the position is adjusted by moving the second displacement platform 120 along the second direction Y. While avoiding interference, the adjustment of different focal length requirements in high-resolution imaging mode and low-resolution imaging mode is realized.

[0087] Exemplarily, a large-area low-resolution imaging of the surface of the sample to be detected can be first performed in the low-resolution imaging mode to find a local area that needs to be imaged with high precision, and then switched to the high-resolution imaging mode to perform high-resolution imaging on a specific area, and the microscopic structure and morphology of the surface of the sample to be detected are analyzed in detail, which is convenient for quickly confirming the defects on the surface of the sample to be detected.

[0088] Optionally, it can also start from the high-resolution imaging mode and then be adjusted and switched to the low-resolution imaging mode according to requirements.

[0089] Move the first displacement platform 110 to the second sub-position, and the second displacement platform 120 adjusts the distance along the second direction Y to align the focal plane of the second imaging module 150b with the sample plane, and enter the high-resolution imaging mode.

[0090] When switching from the high-resolution imaging mode to the low-resolution imaging mode, directly moving the first displacement platform 110 to align the first coaxial light source 130a and the sample platform 160 in the second direction Y may cause interference between the first coaxial light source 130a and the second imaging module 150b. Therefore, it is necessary to first move the second displacement platform 120 a certain distance along the second direction Y away from the first displacement platform 110, then move the first displacement platform 110 to the first sub-position, and then adjust the distance of the second displacement platform 120 along the second direction Y to align the focal plane of the first imaging module 150a with the sample plane and enter the low-resolution imaging mode.

[0091] Figure 6 Fig. shows an enlarged structure of the sample fixture 160a in an integrated optoelectronic detection system 100 provided by an embodiment of the first aspect of the present application.

[0092] Please refer to Figure 1 and Figure 6 , in some embodiments, the sample platform 160 includes a sample fixture 160a and a sample displacement stage 160b. The sample fixture 160a is used to hold the sample to be detected, and the sample displacement stage 160b is located on the side of the sample fixture 160a away from the first displacement platform 110 and is used to control the displacement of the sample to be detected along the first direction X and the third direction Z. The third direction Z intersects the plane formed by the first direction X and the second direction Y.

[0093] In these embodiments, the sample fixture 160a can facilitate holding samples of different sizes to be detected, and the motor-driven sample displacement stage 160b can also control the sample to be detected to be adjusted to a specific area under the wide-field imaging module 150 and the micro-area detection module 140 to achieve high-quality imaging and optoelectronic performance detection of the local area.

[0094] Exemplarily, the sample shape is usually a plate-like structure. The sample displacement stage 160b controls the displacement of the sample to be detected along the first direction X and the third direction Z to align a specific local area of the sample with the light source module 130 and the micro-area detection module 140 on the first displacement platform 110 in the second direction Y, so as to achieve more accurate imaging and optoelectronic performance detection of the local area.

[0095] Optionally, the sample displacement stage 160b is also equipped with a grating scale to achieve good displacement accuracy while the sample displacement stage 160b has a large-range displacement.

[0096] The third direction Z intersects the plane formed by the first direction X and the second direction Y. It should be understood that the second direction Y includes multiple directions, and the third direction Z can be adjusted at any time as long as it intersects the first direction X.

[0097] Exemplarily, the third direction Z perpendicularly intersects with the plane formed by the first direction X and the second direction Y.

[0098] Exemplarily, the third direction Z perpendicularly intersects with the plane formed by the first direction X and the second direction Y, the first direction X perpendicularly intersects with the second direction Y, and the first direction X, the second direction Y, and the third direction Z form a right - angled coordinate system with pairwise perpendicular intersections.

[0099] Figure 5 The figure shows an enlarged structure of the filter module 170 in an integrated optoelectronic detection system 100 provided by an embodiment of the first aspect of the present application.

[0100] Please refer to Figure 1 and Figure 5 In some embodiments, an integrated optoelectronic detection system 100 further includes a filter module 170. The filter module 170 includes a rotating mechanism 170a and a non - filter module 170b and a filter module 170c arranged circumferentially along the rotating mechanism 170a. The filter module 170 is arranged along the second direction Y on the side of the wide - field imaging module 150 close to the first displacement platform 110.

[0101] In the bright - field imaging mode, the rotating mechanism 170a rotates to the first rotation position, and the wide - field imaging module 150, the non - filter module 170b, the light source module 130, and the sample platform 160 are arranged in alignment along the second direction Y.

[0102] In the optoelectronic imaging mode, the rotating mechanism 170a rotates to the second rotation position, and the wide - field imaging module 150, the filter module 170c, the light source module 130, and the sample platform 160 are arranged in alignment along the second direction Y.

[0103] In these embodiments, by switching the non - filter module 170b and the filter module 170c in the filter module 170, the filter module 170c can selectively filter the light of a specific wavelength reflected and emitted from the surface of the sample to be detected, so that the wide - field imaging module 150 can only capture the light signal of the specific wavelength, thereby realizing the switching between the bright - field imaging mode and the optoelectronic imaging mode.

[0104] In the bright - field imaging mode, the light source module 130 mainly emits a uniform illumination light source, and the camera in the wide - field imaging module 150 mainly captures the reflected light imaging on the surface of the sample to be detected without using a filter.

[0105] In the optoelectronic imaging mode, after the sample to be detected is subjected to optoelectronic stimulation, active emission light is excited. The camera in the wide - field imaging module 150 mainly captures the light signal of the emission light of a specific wavelength. Therefore, a filter module 170c that can selectively filter a specific wavelength is required.

[0106] Exemplarily, the filterless module 170b on the rotation mechanism 170a includes two groups of flat glass, and the filter module 170c includes two groups of filter lenses. The flat glass and the filter lenses are arranged at intervals along the axial direction of the rotation mechanism 170a. By rotating the rotation mechanism 170a, it is possible to simultaneously realize the switching of the flat glass and the filter lenses on the side of the first imaging module 150a and the second imaging module 150b in the wide-field imaging module 150 close to the first displacement platform 110, so as to facilitate the switching between the first imaging module 150a and the second imaging module 150b in the wide-field imaging module 150 between the bright-field imaging mode and the optoelectronic imaging mode, thereby realizing automatic control.

[0107] Please continue to refer to Figure 1 and Figure 6 , in some embodiments, an integrated optoelectronic detection system 100 further includes an electric control module 180. The electric control module 180 includes an electrical control platform 180a. The sample platform 160 further includes a sample clamp 160a and electrode modules 160c arranged at both ends of the sample clamp 160a.

[0108] In the photoluminescence imaging mode, the electrical control platform 180a disconnects the electrical connection with the electrode module 160c, and the wide-field imaging module 150, the light source module 130, and the sample platform 160 are arranged in alignment along the second direction Y.

[0109] In the electroluminescence imaging mode, the electrical control platform 180a is electrically connected to the electrode module 160c, and the wide-field imaging module 150, the light source module 130, and the sample platform 160 are arranged in alignment along the second direction Y.

[0110] In these embodiments, in the photoluminescence imaging mode, the light source of the light source module 130 emits light of a specific wavelength to excite the surface of the sample to be detected to actively emit light, and the emitted light enters the wide-field imaging module 150 to achieve photoluminescence imaging; in the electroluminescence imaging mode, the electrode module 160c on the sample clamp 160a energizes the sample to be detected to excite the surface of the sample to be detected to actively emit light, and the emitted light enters the wide-field imaging module 150 to achieve electroluminescence imaging.

[0111] The electric control module 180 is the computing center for realizing the automatic control of the entire integrated optoelectronic detection system 100, the electrical connection center with each device of the integrated optoelectronic detection system 100, and the data center for collecting and analyzing data.

[0112] The electrical control platform 180a in the electric control module 180 is used to control the on-off of the electrical connection between the power supply and each device, manage and adjust the electrical working state of the electronic components in the integrated optoelectronic detection system 100, and is the electrical connection center of the integrated optoelectronic detection system 100.

[0113] The electrode module 160c on the sample fixture 160a can achieve power-on and power-off of the sample to be detected, so as to actively emit light on the surface of the sample to be detected under the electroluminescence imaging mode.

[0114] In the photoluminescence imaging mode, the light source module 130 emits excitation light of a specific wavelength. When the excitation light reaches the surface of the sample to be detected, the sample to be detected will be excited to a higher energy level. When the sample to be detected transitions from the excited state back to the ground state, it will actively emit emission light of a specific wavelength. Therefore, a filter module 170c needs to be set in front of the wide-field imaging module 150 to selectively filter out the excitation light and retain the emission light of the light entering the wide-field imaging module 150, so that the camera in the wide-field imaging module 150 can capture the emission light signal of a specific wavelength and complete the photoluminescence imaging.

[0115] In the electroluminescence imaging mode, the electrode module 160c is powered on to power on the surface of the sample to be detected. After the surface of the sample to be detected is powered on, an external electric field is applied, causing electrons in the sample to be detected to collide with the luminescence center. As a result, electrons transition, change between energy levels, and electrons recombine with holes, etc., exciting the surface of the sample to be detected to actively emit emission light of a specific wavelength. Therefore, a filter module 170c needs to be set in front of the wide-field imaging module 150 to selectively filter out the electromagnetic wave signal of a specific wavelength of the electric field generated by current or voltage excitation from the light entering the wide-field imaging module 150, and retain the emission light, so that the camera in the wide-field imaging module 150 can capture the emission light signal of a specific wavelength and complete the electroluminescence imaging.

[0116] The control of the excitation light of a specific wavelength of the light source module 130 and the power-on and power-off of the electrode module 160c can be achieved through automatic control.

[0117] Please continue to refer to Figure 1 , in some embodiments, the electronic control module 180 further includes an industrial computer 180b and an acquisition card 180c. The industrial computer 180b is electrically connected to the first displacement platform 110, the light source module 130, the micro-region detection module 140, the wide-field imaging module 150, and the sample platform 160, and is used to realize the automatic control of an integrated optoelectronic detection system 100. The acquisition card 180c is connected to the industrial computer 180b, the micro-region detection module 140, and the wide-field imaging module 150, and is used to transmit the data collected by the micro-region detection module 140 and the wide-field imaging module 150 to the industrial computer 180b.

[0118] In these embodiments, the industrial control computer 180b serves as the computing center of an integrated optoelectronic detection system 100, capable of realizing parameter adjustment and automatic configuration under different detection functions, adjusting the position of the first displacement platform 110, etc.; the industrial control computer 180b can also provide an input and output window for the operator. The operator can obtain real-time feedback data through the control software integrated on the industrial control computer 180b, and can set different working modes to start or stop relevant detection tasks.

[0119] The acquisition card 180c can collect and transmit the image data, spectral data or original optoelectronic signals from different modules to the industrial control computer 180b in real time and efficiently, ensuring that an integrated optoelectronic detection system 100 can efficiently acquire data and transmit it to the industrial control computer 180b for real-time processing.

[0120] Exemplarily, in the pre-startup stage of an integrated optoelectronic detection system 100, different preset positions need to be pre-input into the industrial control computer 180b, including but not limited to the first sub-position, the second sub-position and the second position of the first displacement platform 110, the first rotation position and the second rotation position of the rotation mechanism 170a of the filter module 170, the preset positions where the focal planes of the first imaging module 150a and the second imaging module 150b in the second displacement platform 120 are aligned with the sample surface, etc., to ensure that when switching different detection functions, the integrated optical detection platform can be quickly and accurately adjusted to the appropriate working distance.

[0121] Optionally, the sample displacement stage 160b in the sample platform 160 can be manually controlled by the operator in subsequent local precise imaging and detection functions, or the displacement position can be preset in the pre-startup stage of an integrated optoelectronic detection system 100 to achieve automated local area imaging and detection.

[0122] Figure 7 Shows the separate enlarged structure of the micro-region detection module 140 in an integrated optoelectronic detection system 100 provided by the first aspect embodiment of the present application.

[0123] Please refer to Figure 4 and Figure 7 , in some embodiments, the micro-region detection module 140 includes a laser 140a, a dichroic mirror 140m, a spectrometer 140b and an electrical signal acquisition card 140r.

[0124] In the spectral analysis mode, the light source generated by the laser 140a propagates along the first optical path, passes through the dichroic mirror 140m and irradiates the surface of the sample to be detected. The fluorescence generated by the excitation of the surface of the sample to be detected enters the dichroic mirror 140m and propagates along the second optical path and is transmitted to the spectrometer 140b.

[0125] In the photocurrent scanning mode, the light source generated by the laser 140a propagates along the first optical path, passes through the dichroic mirror 140m, and irradiates the surface of the sample to be detected. The current change generated on the surface of the sample to be detected is transmitted into the electrical signal acquisition card 140r.

[0126] In these embodiments, the spectral analysis mode and the photocurrent scanning mode share the first optical path, enabling the micro-region detection module 140 to simultaneously perform optoelectronic detection functions such as spectral analysis and photocurrent scanning.

[0127] Exemplarily, a fluorescence detection function can be achieved in the spectral analysis mode. To achieve the fluorescence detection function, high-energy laser light is irradiated onto the surface of the sample to be detected, exciting the material of the sample to be detected to transition to the excited state, and then transitioning back to the ground state to release energy and emit fluorescence. The molecular structure and chemical composition of the sample are analyzed by analyzing the spectrum of the fluorescence.

[0128] When implementing the fluorescence detection function, the laser 140a of the micro-region detection module 140 generates a continuous and stable core light source, which is introduced into the system through the first optical fiber 140c. The first mirror mount 140e fixes the first optical fiber 140c to adjust the incident direction, and the laser light passes through the filter in the rotating mirror mount 140g for attenuation. The second mirror mount 140h fixes the collimating lens to collimate and expand the laser light. The expanded laser light passes through the excitation filter 140j, the high-reflection mirror 140l, and the dichroic mirror 140m in sequence, and finally passes through the piezoelectric adjustment mount 140n and the objective lens 140p to form an adjustable focused spot on the surface of the sample to be detected.

[0129] The fluorescence generated by the sample to be detected after excitation is collected and collimated by the objective lens 140p, reflected by the dichroic mirror 140m, enters the second optical path, and the excitation laser is filtered out by the collection filter 140k. After passing through the collection lens fixed by the fourth mirror mount 140i, it is focused on the front end face of the second optical fiber 140d fixed on the third mirror mount 140f. Finally, the fluorescence signal is transmitted through the second optical fiber 140d to the spectrometer 140b for analysis.

[0130] Optionally, a Raman test function can also be performed in the spectral analysis mode. The principle of the Raman test is the same as that of the fluorescence test. By selecting laser light sources with different wavelengths to excite Raman scattered light, and selectively filtering out other scattered light through the filter module 170, only the Raman scattered light is ensured to enter the wide-field imaging module 150.

[0131] For the photocurrent scanning function, the photocurrent value generated by the sample to be detected under the irradiation of light with a specific wavelength is measured to analyze its optoelectronic performance. In particular, for the optoelectronic response performance of semiconductor devices and optoelectronic devices that have been fabricated, the optoelectronic performance characterization is comprehensively analyzed to analyze the characteristics of photo-generated carriers in optoelectronic materials.

[0132] When implementing the photocurrent scanning function, the laser 140a in the micro-region detection module 140 generates a continuous and stable core light source, which is introduced into the system through the first optical fiber 140c. The first mirror mount 140e fixes the first optical fiber 140c to adjust the incident direction, and passes through the filter in the motorized rotary mirror mount 140g for attenuation. The second mirror mount 140h fixes the collimating lens to collimate and expand the laser. The expanded laser passes through the excitation filter 140j, the high-reflection mirror 140l, and the dichroic mirror 140m in sequence, and finally passes through the piezoelectric adjustment mount 140n and the objective lens 140p, and is focused on the sample surface.

[0133] The voltage and current values generated on the surface of the sample to be detected are transmitted to the electrical signal acquisition card 140r through the transmission cable 140q, and finally transmitted to the industrial control computer 180b for analysis.

[0134] Optionally, the photocurrent scanning imaging function can also be implemented in the photocurrent scanning mode. An integrated photoelectric detection system 100 adjusts the position of the light spot on the sample to be detected by moving the sample displacement stage 160b, performs a serpentine scan on the sample to be detected, collects the real-time voltage of each point, and uploads it to the industrial control computer 180b for data reconstruction, and outputs the corresponding pseudo-color image and three-dimensional image.

[0135] Please continue to refer to Figure 7 , in some embodiments, the micro-region detection module 140 further includes a piezoelectric adjustment mount 140n and a rotary mirror mount 140g.

[0136] In the photocurrent scanning mode, the laser 140a controls the intensity of the light source, the piezoelectric adjustment mount 140n controls the focal length of the light source focus, and the rotary mirror mount 140g controls the direction of the first optical path.

[0137] In these embodiments, in the photocurrent scanning mode, in order to accurately simulate the effect of sunlight or other test conditions, it is necessary to adjust the piezoelectric adjustment mount 140n, the laser 140a, and the motorized rotary mirror mount 140g to control the spot size and power density of the light spot on the sample surface.

[0138] Exemplarily, the embodiment of the present application further provides a detection method for an integrated photoelectric detection system 100, and corresponding steps in different imaging modes can be selected according to the test requirements.

[0139] Step 1: Preparation. After the whole machine is powered on, it is necessary to check whether the appearance of the sample to be detected is intact and whether the electrode module 160c is damaged. After confirmation, place the sample to be detected in the sample fixture 160a and ensure good contact between the sample to be detected and the electrode module 160c. Close the cabinet door of the whole machine mechanical housing 190 to ensure that there is no extra light source in the chamber. Then, turn on the control software of the industrial control computer 180b, select appropriate preset parameters according to different samples to be detected, and select the number of shooting times according to the size of the sample to be detected.

[0140] Step 2: Auto-focus and preset parameters. When an integrated optoelectronic detection system 100 is powered on for the first time or different types of samples are replaced, an auto-focus program needs to be used to find the focal plane of the wide-field imaging module 150. The second displacement platform 120 will evaluate and give a feedback value according to the imaging result, and find the best position for the current imaging. This position will be used as the preset position and transmitted to the subsequent shooting process.

[0141] Step 3: Bright-field imaging mode. In the bright-field imaging mode, the filter module 170 is not used. The filter module 170 rotates to the first rotation position, and the first displacement platform 110 moves horizontally to the first sub-position to align the first coaxial light source 130a and the first imaging module 150a. The second displacement platform 120 performs auto-focus to ensure that the focal plane of the first imaging module 150a is aligned with the sample plane, and low-resolution large-area bright-field imaging is performed.

[0142] Step 4: Optoelectronic imaging mode. After the test of the bright-field imaging mode is completed, the tests of the electroluminescence imaging mode and the photoluminescence imaging mode will be started. The filter module 170 rotates and switches to the second rotation position, and the first displacement platform 110 moves horizontally to the first sub-position to align the first coaxial light source 130a and the first imaging module 150a. The second displacement platform 120 performs auto-focus to ensure that the focal plane of the first imaging module 150a is aligned with the sample plane. Then, turn on the switch of the first coaxial light source 130a to perform low-resolution large-area photoluminescence imaging. Subsequently, based on the same imaging module and filter module 170c, turn on the power supply of the electrical control platform 180a and set appropriate terminal voltage and current values. After power-on, electroluminescence imaging can be performed with preset parameters.

[0143] Step 5: Fluorescence spectrum detection mode. In order to measure the fluorescence spectrum of the sample to be detected, the control software of the industrial control computer 180b can select the position to be detected on the picture based on the results of the bright-field imaging mode, photoluminescence imaging mode, and electroluminescence imaging mode taken. Then, the first displacement platform 110 moves to the second position to align the micro-region detection module 140 with the center of the sample to be detected. The sample displacement stage 160b moves the region to be measured of the sample to be detected to directly below the light spot. Subsequently, the fluorescence spectrum of the sample to be detected is collected with preset parameters.

[0144] Step Six: Photocurrent Scanning Imaging Mode. The first displacement platform 110 moves to the second position to align the micro-region detection module 140 with the center of the sample. The sample displacement stage 160b moves the region to be detected of the sample to be directly below the light spot. When the light spot passes through each point, the real-time voltage generated by the sample to be detected is collected. The sample displacement stage 160b moves the sample to be detected for serpentine scanning, and thus photocurrent scanning imaging can be achieved.

[0145] Step Seven: High-Resolution Bright-Field Imaging Mode. Without using a filter, the filter module 170 rotates to the first rotation position. The first displacement platform 110 moves to the second position to align the second coaxial light source 130b and the second imaging module 150b. The second displacement platform 120 performs autofocusing to ensure that the focal plane of the second imaging module 150b is aligned with the sample plane, and high-resolution large-area bright-field imaging is performed.

[0146] Step Eight: High-Resolution Photoluminescence Imaging Mode. The filter module 170 rotates and switches to the first rotation position. The first displacement platform 110 horizontally moves to the second position to align the second coaxial light source 130b and the second imaging module 150b. The second displacement platform 120 performs autofocusing to ensure that the focal plane of the second imaging module 150b is aligned with the sample plane. The switch of the second coaxial light source 130b is turned on, and high-resolution photoluminescence imaging is performed.

[0147] Step Nine: High-Resolution Electroluminescence Imaging Mode. The power supply of the electrical control platform 180a is turned on, and appropriate terminal voltage and current values are set. The settings of the filter module 170, the first displacement platform 110, and the second displacement platform 120 are the same as the set parameters in the photoluminescence imaging mode. After the second imaging module 150b is turned on, high-resolution electroluminescence imaging is performed.

[0148] Although the present application has been described with reference to the preferred embodiments, various improvements can be made to it and components therein can be replaced with equivalents without departing from the scope of the present application. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.

Claims

1. An integrated photoelectric detection system, characterized in that: include: A first displacement platform, which is movably arranged and can be moved at least along a first direction; A second displacement platform, movably disposed and movable at least along a second direction, wherein the first direction intersects the second direction; A light source module is integrated above the first displacement platform, the light source module comprises a first coaxial light source and a second coaxial light source, the size of the first coaxial light source is larger than the size of the second coaxial light source; A micro-area detection module, integrated above the first displacement platform and disposed adjacent to the light source module along the first direction, wherein the micro-area detection module is disposed between the first coaxial light source and the second coaxial light source along the first direction; a wide-field imaging module, located at one side of the first displacement platform in the circumferential direction and integrated on the second displacement platform, the wide-field imaging module comprising a first imaging module and a second imaging module arranged adjacent to each other along the first direction, the resolution of the first imaging module being smaller than the resolution of the second imaging module; A sample platform, used for carrying a sample to be detected, and located on the other side of the first displacement platform away from the wide-field imaging module; In the low-resolution imaging mode, the first displacement platform is displaced to a first sub-position, and the first imaging module, the first coaxial light source and the sample platform are aligned along the second direction; In the high-resolution imaging mode, the first displacement platform is displaced to a second sub-position, and the second imaging module, the second coaxial light source and the sample platform are aligned along the second direction; In the photoelectric detection mode, the first displacement platform is displaced to a second position, and the micro-area detection module is aligned with the sample platform along the second direction; When switching from the high-resolution imaging mode to the low-resolution imaging mode, the second displacement platform is displaced a first preset distance along the second direction toward a side away from the first displacement platform, the first displacement platform is displaced to the first sub-position, and the second displacement platform is displaced again along the second direction by a second preset distance, and the focal plane of the first imaging module is flush with the plane where the sample platform is located.

2. An integrated photoelectric detection system according to claim 1, characterized in that: The sample platform includes a sample fixture and a sample displacement platform, wherein the sample fixture is used to clamp the sample to be detected, and the sample displacement platform is located on the side of the sample fixture away from the first displacement platform, and is used to control the displacement of the sample to be detected along the first direction and a third direction, wherein the third direction intersects with a plane formed by the first direction and the second direction.

3. The integrated photoelectric detection system according to claim 1, characterized in that: It also includes a filter module, the filter module includes a rotating mechanism and a non-filter module and a filter module arranged along the circumference of the rotating mechanism, and the filter module is arranged on a side of the wide-field imaging module close to the first displacement platform along the second direction; In the bright field imaging mode, the rotating mechanism rotates to a first rotating position, and the wide field imaging module, the non-filtering module, the light source module and the sample platform are aligned along the second direction; In the optoelectronic imaging mode, the rotating mechanism rotates to a second rotating position, and the wide-field imaging module, the filter module, the light source module and the sample platform are aligned along the second direction.

4. The integrated photoelectric detection system according to claim 1, characterized in that: It also includes an electric control module, the electric control module includes an electric control platform, and the sample platform also includes a sample fixture and electrode modules arranged at both ends of the sample fixture; In the photoluminescence imaging mode, the electrical control platform is disconnected from the electrode module, and the wide-field imaging module, the light source module and the sample platform are aligned along the second direction; In the electroluminescent imaging mode, the electrical control platform is electrically connected to the electrode module, and the wide-field imaging module, the light source module and the sample platform are aligned along the second direction.

5. The integrated photoelectric detection system according to claim 4, characterized in that: The electric control module also includes an industrial computer and an acquisition card. The industrial computer is electrically connected to the first displacement platform, the light source module, the micro-area detection module, the wide-field imaging module and the sample platform, and is used to realize automatic control of the integrated photoelectric detection system. The acquisition card is connected to the industrial computer, the micro-area detection module and the wide-field imaging module, and is used to transmit the data collected by the micro-area detection module and the wide-field imaging module to the industrial computer.

6. The integrated photoelectric detection system according to claim 1, characterized in that: The micro-area detection module includes a laser, a dichroic mirror, a spectrometer and an electrical signal acquisition card; In the spectrum analysis mode, the light source generated by the laser propagates along the first light path, passes through the dichroic mirror and irradiates the surface of the sample to be detected, and the fluorescence generated by the excitation of the surface of the sample to be detected enters the dichroic mirror and propagates along the second light path and is transmitted to the spectrometer; In the photocurrent scanning mode, the light source generated by the laser propagates along the first optical path, passes through the dichroic mirror and irradiates the surface of the sample to be detected, and the current changes generated on the surface of the sample to be detected are transmitted to the electrical signal acquisition card.

7. An integrated photoelectric detection system according to claim 6, characterized in that: The micro-area detection module also includes a piezoelectric adjustment frame and a rotating mirror frame; In the photocurrent scanning mode, the laser controls the intensity of the light source, the piezoelectric adjustment frame controls the focal length of the light source, and the rotating mirror frame controls the direction of the first optical path.

Images