An intelligent monitoring and control system for applying antioxidant silver-filled glass millet bead UV glue

Abstract

The present invention belongs to the technical field of antioxidant silver-filled glass millet bead UV glue application monitoring, and discloses an intelligent monitoring and control system for antioxidant silver-filled glass millet bead UV glue application, including a glue application process data acquisition module, a glue application process abnormality analysis module, a glue application abnormality cause identification module, a curing process data acquisition module, a curing process abnormality analysis module, and a curing abnormality determination module. The present invention divides the UV glue application into a glue application process and a curing process, and then conducts quality analysis respectively. This analysis method can accurately locate quality problems and can formulate precise quality standards for the glue application and curing links respectively. At the same time, from the perspectives of production efficiency and cost, the defective rate and rework rate are greatly reduced, and the troubleshooting of equipment failures and production capacity planning are more accurate, thereby effectively improving production efficiency and reducing costs, bringing comprehensive improvement and significant benefits to the glue application process of antioxidant silver-filled glass millet beads.

Description

Technical Field

[0001] The present invention belongs to the technical field of antioxidant silver-filled glass millet bead UV glue application monitoring, and relates to an intelligent monitoring and control system for antioxidant silver-filled glass millet bead UV glue application. Background Technique

[0002] Antioxidant silver-filled glass millet beads are a special type of glass beads, which are commonly used materials for DIY jewelry. They can be paired with other beads, gemstones, metal accessories, etc. to make various personalized jewelry. By applying UV glue, a protective film can be formed on the surface of antioxidant silver-filled glass millet beads, which can prevent silver from directly contacting harmful factors in the external environment (such as oxygen, moisture, corrosive gases, etc.), and reduce the oxidation of silver. The glue application process usually includes two main steps: glue application and curing. The analysis and monitoring of this process are important prerequisites for ensuring that the glue application effect meets the requirements. Therefore, the research on intelligent monitoring and control of antioxidant silver-filled glass millet bead UV glue application is of great significance.

[0003] The existing analysis of the glue application process usually monitors the products produced or the glue application parameters, while ignoring the analysis of the process data of specific steps such as glue application and curing. This analysis method cannot accurately judge the specific reasons, and it is difficult to take targeted solutions. Without analyzing the process data of glue application and curing, it is impossible to detect the small changes in the process in a timely manner. For example, small fluctuations in the glue application speed or slight changes in the curing temperature may gradually accumulate, resulting in fluctuations in product quality. Summary of the Invention

[0004] In view of this, to solve the problems raised in the above background technique, an intelligent monitoring and control system for antioxidant silver-filled glass millet bead UV glue application is proposed.

[0005] The object of the present invention can be achieved by the following technical solutions: An intelligent monitoring and control system for antioxidant silver-filled glass millet bead UV glue application, including: a glue application process data acquisition module, which is used to record the antioxidant silver-filled glass millet beads corresponding to each glue application head in the current production batch as monitoring objects, and obtain the glue application process data of each glue application head corresponding to each monitoring object. The glue application process data includes the glue application amount and the glue application duration. At the same time, a high-definition camera is used to collect the post-glue application images of each glue application head corresponding to each monitoring object.

[0006] A glue application process abnormality analysis module, which is used to analyze the glue liquid quality evaluation situation, equipment quality evaluation situation, and process quality evaluation situation of each glue application head corresponding to each monitoring object based on the glue application process data and the post-glue application images of each glue application head corresponding to each monitoring object.

[0007] The sizing anomaly cause identification module is used to determine whether there is a sizing anomaly for each sizing head based on the sizing liquid quality evaluation, equipment quality evaluation, and process quality evaluation of each sizing head corresponding to each monitoring object. If there is an anomaly, it further identifies the specific cause of the anomaly. The specific causes of the anomaly include sizing liquid anomaly, equipment anomaly, and process anomaly.

[0008] The curing process data acquisition module is used to obtain the curing process quality data of each sizing head corresponding to each monitoring object, specifically including glossiness and transparency, and collect the curing temperature and curing humidity of the current batch of products during the curing process.

[0009] The curing process anomaly analysis module is used to analyze the curing quality of each sizing head corresponding to each monitoring object based on the curing process quality data of each sizing head corresponding to each monitoring object, and then determine whether each sizing head corresponding to each monitoring object is qualified. The monitoring objects determined to be unqualified are recorded as abnormal monitoring objects, and further analyze the curing quality of the current production batch.

[0010] The curing anomaly situation judgment module is used to judge whether there is a curing quality anomaly in the current production batch based on the curing quality of the current production batch. If there is an anomaly, it issues a warning.

[0011] Compared with the prior art, the beneficial effects of the present invention are as follows: (1) The present invention divides the UV sizing into a sizing process and a curing process, and then conducts quality analysis respectively. This analysis method can accurately locate quality problems and can formulate precise quality standards for the sizing and curing links respectively. At the same time, from the perspective of production efficiency and cost, the defective rate and rework rate are greatly reduced, the troubleshooting of equipment failures and production capacity planning are more accurate, thereby effectively improving production efficiency and reducing costs, bringing comprehensive improvement and significant benefits to the sizing process of antioxidant silver-filled glass millet beads.

[0012] (2) When analyzing the sizing process, the present invention conducts comprehensive analysis through aspects such as sizing liquid quality evaluation, equipment quality evaluation, and process quality evaluation, and then further identifies the specific cause of the anomaly. This analysis method can comprehensively and accurately locate problems, cover multi-factor troubleshooting and can accurately determine the root cause. It can effectively optimize the sizing process, formulate targeted improvement measures to promote the improvement of the overall process. It can also ensure production stability and benefits, reduce production interruptions and reduce production costs.

[0013] (3) When analyzing the curing process, the present invention determines whether each sizing head corresponding to each monitoring object is qualified based on the curing quality of each sizing head corresponding to each monitoring object, and then further analyzes the curing quality of the current production batch. This analysis method can timely discover and solve problems, optimize production batch management, promote continuous optimization of the process, thereby effectively improving the quality and efficiency of the curing process, providing strong guarantee for production and helping the process to continuously develop and improve. Brief Description of the Drawings

[0014] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for describing the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0015] Figure 1 It is a schematic diagram of the connection of each module of the system of the present invention.

[0016] Figure 2 It is a schematic diagram of the analysis process of a process quality evaluation provided by the present invention.

[0017] Figure 3 It is a judgment flowchart corresponding to an embodiment of identifying the reasons for sizing abnormalities provided by the present invention.

[0018] Reference numerals: 1 - center point of the millet bead, 2 - monitoring line segment, 3 - millet bead, 4 - colloid boundary line. Detailed Embodiments

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0020] Please refer to Figure 1 As shown, the present invention provides an intelligent monitoring and control system for sizing antioxidant silver-filled glass millet beads with UV glue, including a sizing process data acquisition module, a sizing process anomaly analysis module, a sizing anomaly cause identification module, a curing process data acquisition module, a curing process anomaly analysis module, and a curing anomaly situation judgment module. Among them, the sizing process data acquisition module is connected to the sizing process anomaly analysis module, the sizing process anomaly analysis module is connected to the sizing anomaly cause identification module, the sizing anomaly cause identification module is connected to the curing process data acquisition module, the curing process data acquisition module is connected to the curing process anomaly analysis module, and the curing process anomaly analysis module is connected to the curing anomaly situation judgment module.

[0021] The sizing process data acquisition module is used to record each sizing head corresponding to each antioxidant silver-filled glass millet bead in the current production batch as a monitoring object, obtain the sizing process data of each sizing head corresponding to each monitoring object, the sizing process data including the sizing amount and the sizing duration, and at the same time collect the post-sizing images of each sizing head corresponding to each monitoring object by using a high-definition camera.

[0022] It should be noted that the reason for analyzing the gluing process corresponding to the antioxidant silver-filled glass millet bead UV glue gluing: The gluing process directly affects the adhesion amount, distribution uniformity, and droplet shape of the glue on the surface of the millet beads. Analyzing this process can ensure precise control of the glue amount, avoid affecting the product performance and appearance due to excessive or insufficient glue amount, and at the same time can promptly detect potential problems in the gluing equipment and process, such as glue pump precision deviation, gluing head blockage, or improper parameter settings, to ensure the stable and efficient gluing link.

[0023] The abnormal gluing process analysis module is used to analyze the glue liquid quality evaluation situation, equipment quality evaluation situation, and process quality evaluation situation corresponding to each monitoring object of each gluing head based on the gluing process data and post-gluing images of each gluing head corresponding to each monitoring object.

[0024] It should be noted that the reasons for analyzing the glue liquid quality evaluation situation, equipment quality evaluation situation, and process quality evaluation situation corresponding to each gluing head corresponding to each monitoring object are as follows: 1. The quality of the glue liquid is one of the core elements of gluing. Its viscosity, component stability, purity, etc. directly determine the flowing characteristics, curing effect, and performance of the final product of the glue. By evaluating the glue liquid quality, it can be ensured that it meets the gluing requirements and potential problems such as glue liquid deterioration and impurity mixing can be promptly detected. 2. The quality of the equipment plays a key role in the accuracy and stability of gluing. Analyzing the equipment quality can ensure that the equipment is in good operating condition and avoid uneven gluing quality caused by equipment failures or deviations. 3. Appropriate process parameters are a necessary condition for achieving high-quality gluing. Evaluating them helps to determine the optimal process combination, improve production efficiency, and reduce quality defects such as uneven glue layer thickness and irregular glue droplet shape caused by unreasonable processes.

[0025] In a preferred embodiment of the present invention, the analysis of the glue liquid quality evaluation situation requires constructing a glue liquid quality evaluation index corresponding to each gluing head corresponding to each monitoring object. The specific method is as follows: Extract the post-gluing images of each gluing head corresponding to each monitoring object, obtain the glue liquid area of each gluing head corresponding to each monitoring object, and then calculate the absolute value of the difference from the pre-set reference glue liquid area respectively to obtain the glue liquid area deviation value of each gluing head corresponding to each monitoring object, and then calculate the ratio with the reference glue liquid area to obtain the glue liquid viscosity abnormality index of each gluing head corresponding to each monitoring object.

[0026] Extract the post-gluing images of each gluing head corresponding to each monitoring object, and then obtain the number of defects and the defect area corresponding to each defect of each gluing head corresponding to each monitoring object, which are respectively recorded as X ij 、S ijk, where \(i\) represents the number of each sizing head, \(i = 1, 2,\cdots, I\), \(I\) represents the number of sizing heads, \(j\) represents the number of each monitoring object, \(j = 1, 2,\cdots, J\), \(J\) represents the number of monitoring objects, \(k\) represents the number of each defect, \(k = 1, 2,\cdots, K\), and \(K\) represents the number of defects.

[0027] Exemplarily, the defects may be bubbles and impurities.

[0028] Using the formula the abnormal index \(G_{spai}\) of the glue liquid purity corresponding to each sizing head for each monitoring object is obtained by analysis ij , where \(X\) 0 represents the preset reference number of defects, \(S\) 0 represents the preset reference defect area, and \(\alpha\) 1 , \(\alpha\) 2 respectively represent the influence weight factors corresponding to the preset number of defects and defect area.

[0029] Exemplarily, \(\alpha\) 1 = 0.6, \(\alpha\) 2 = 0.4.

[0030] Substitute the abnormal index of the glue liquid viscosity and the abnormal index of the glue liquid purity corresponding to each sizing head for each monitoring object into the formula and analyze to obtain the glue liquid quality evaluation index \(G_{qei}\) corresponding to each sizing head for each monitoring object ij , where \(G_{svai}\) ij represents the abnormal index of the glue liquid viscosity corresponding to each sizing head for each monitoring object.

[0031] It should be noted that the reasons for selecting the abnormal index of the glue liquid viscosity and the abnormal index of the glue liquid purity as the influencing factors of the glue liquid quality evaluation index are as follows: 1. The viscosity of the glue liquid directly affects its fluidity. During the sizing process, an appropriate viscosity can ensure that the glue liquid flows out of the sizing head with a stable flow rate and shape. If the viscosity is abnormal, for example, too high, the glue liquid may not flow smoothly through the needle, resulting in uneven glue droplet sizes or even clogging of the sizing head. This will seriously affect the sizing accuracy, making it difficult to control the amount of glue on the glass microbeads, resulting in too much glue on some beads and too little glue on some beads. 2. The purity of the glue liquid directly determines the appearance quality of the glue layer. If there are impurities in the glue liquid, such as dust, fibers or other particles, the impurities may have a negative impact on the performance of the glue layer. Some impurities may absorb ultraviolet light, reducing the efficiency of the photoinitiator and resulting in incomplete curing of the glue. At the same time, the impurities may also become stress concentration points. When the glue layer is subjected to external forces, cracks or peeling are likely to occur around the impurities, affecting the adhesion and overall strength of the glue layer.

[0032] In a preferred embodiment of the present invention, the analysis of the equipment quality evaluation situation requires constructing an equipment quality evaluation index for each sizing head corresponding to each monitoring object, and the specific method is as follows: Extract the sizing amount of each sizing head corresponding to each monitoring object, denoted as M ij , and use the formula to analyze and obtain the glue amount stability anomaly index Gmsai for each sizing head corresponding to each monitoring object ij , where M 0 represents the preset reference sizing amount

[0033] Exemplarily, M 0 = 0.5 ml

[0034] Extract the post-sizing images of each sizing head corresponding to each monitoring object, obtain the uncovered glue area of each sizing head corresponding to each monitoring object, and then calculate the ratio with the preset reference glass millet bead area respectively to obtain the positioning accuracy anomaly index Paai for each sizing head corresponding to each monitoring object ij .

[0035] Substitute the glue amount stability anomaly index and the positioning accuracy anomaly index of each sizing head corresponding to each monitoring object into the formula to analyze and obtain the equipment quality evaluation index Eqei for each sizing head corresponding to each monitoring object ij .

[0036] It should be noted that the reasons for selecting the glue amount stability anomaly index and the positioning accuracy anomaly index as the influencing factors of the equipment quality evaluation index are as follows: 1. The glue amount stability is an important indicator to measure the performance of the glue supply system (such as equipment like glue pumps and glue hoses). The accuracy of the glue pump and the smoothness of the glue hose will affect the glue amount stability. 2. The positioning accuracy reflects the working state of the sizing equipment (such as the moving device and positioning sensor of the sizing head). If there are faults in the positioning system, such as a decrease in the accuracy of the sensor or wear of the transmission components of the moving device, it will lead to abnormal positioning accuracy. By monitoring the positioning accuracy anomaly index, these equipment problems can be discovered in time, the equipment can be repaired and adjusted to ensure the normal operation of the equipment and the accuracy of sizing

[0037] In a preferred embodiment of the present invention, please refer to Figure 2 shown. The analysis of the process quality evaluation situation requires constructing a process quality evaluation index for each sizing head corresponding to each monitoring object, and the specific method is as follows: Extract the post-sizing images of each sizing head corresponding to each monitoring object, locate the center points of the millet beads of each sizing head corresponding to each monitoring object, and then emit a number of monitoring rays at equal intervals of angles around the center points, and then intersect with the corresponding colloid boundary lines to obtain a number of monitoring line segments, and obtain the lengths of the monitoring line segments of each sizing head corresponding to each monitoring object

[0038] It should be explained that the millet beads mentioned in the present invention are the abbreviations of antioxidant silver-filled glass millet beads.

[0039] Compare the lengths of the monitoring line segments corresponding to each sizing head for each monitoring object to obtain the maximum length and minimum length of the monitoring line segments corresponding to each sizing head for each monitoring object, which are respectively denoted as maxL ij and minL ij .

[0040] Using the formula Analyze to obtain the process quality evaluation index Pqei corresponding to each sizing head for each monitoring object ij , where L 0 represents the pre-set reference line segment length.

[0041] The sizing anomaly cause identification module is used to judge whether there is a sizing anomaly for each sizing head based on the glue quality evaluation situation, equipment quality evaluation situation, and process quality evaluation situation corresponding to each sizing head for each monitoring object. If there is an anomaly, further identify the specific anomaly cause. The specific anomaly causes include glue anomaly, equipment anomaly, and process anomaly.

[0042] In a preferred embodiment of the present invention, the specific process of judging whether there is a sizing anomaly for each sizing head is as follows: Extract the glue quality evaluation index, equipment quality evaluation index, and process quality evaluation index corresponding to each sizing head for each monitoring object, and then perform a weighted summation calculation to obtain the sizing process quality evaluation index corresponding to each sizing head for each monitoring object.

[0043] Exemplarily, the weights corresponding to the glue quality evaluation index, equipment quality evaluation index, and process quality evaluation index are 0.3, 0.4, and 0.3 respectively.

[0044] Calculate the mean value of the sizing process quality evaluation index corresponding to each sizing head for each monitoring object to obtain the average sizing process quality evaluation index of each sizing head.

[0045] Compare the average sizing process quality evaluation index of each sizing head with the pre-set sizing process quality evaluation index threshold. If the average sizing process quality evaluation index of a certain sizing head is greater than the sizing process quality evaluation index threshold, it is judged that there is no sizing anomaly for this sizing head. Otherwise, it is judged that there is a sizing anomaly for this sizing head.

[0046] Exemplarily, the sizing process quality evaluation index threshold is 0.8.

[0047] In a preferred embodiment of the present invention, please refer to Figure 3As shown in the figure, the specific method for identifying the specific abnormal reasons is as follows: Denote the sizing heads determined to have sizing abnormalities as abnormal sizing heads, extract the sizing quality evaluation indices, equipment quality evaluation indices, and process quality evaluation indices of each abnormal sizing head corresponding to each monitoring object, and then calculate the average sizing quality evaluation index, average equipment quality evaluation index, and average process quality evaluation index of each abnormal sizing head respectively through mean value calculation.

[0048] Compare the average sizing quality evaluation index, average equipment quality evaluation index, and average process quality evaluation index of each abnormal sizing head with the pre-set sizing quality evaluation index threshold, equipment quality evaluation index threshold, and process quality evaluation index threshold respectively to obtain the specific abnormal reasons corresponding to the abnormal sizing heads.

[0049] It should be added that the method for obtaining the specific abnormal reasons corresponding to the abnormal sizing heads is as follows: Compare the average sizing quality evaluation index, average equipment quality evaluation index, and average process quality evaluation index of each abnormal sizing head with the pre-set sizing quality evaluation index threshold, equipment quality evaluation index threshold, and process quality evaluation index threshold respectively.

[0050] Exemplarily, the sizing quality evaluation index threshold, equipment quality evaluation index threshold, and process quality evaluation index threshold are 0.75, 0.8, and 0.85 respectively.

[0051] If the average sizing quality evaluation index of a certain abnormal sizing head is less than the sizing quality evaluation index threshold, it is determined that the abnormal reason for this abnormal sizing head is sizing abnormality.

[0052] If the average equipment quality evaluation index of a certain abnormal sizing head is less than the equipment quality evaluation index threshold, it is determined that the abnormal reason for this abnormal sizing head is equipment abnormality.

[0053] If the average process quality evaluation index of a certain abnormal sizing head is less than the process quality evaluation index threshold, it is determined that the abnormal reason for this abnormal sizing head is process abnormality.

[0054] It should be noted that when analyzing the sizing process of the present invention, comprehensive analysis is carried out through aspects such as sizing quality evaluation, equipment quality evaluation, and process quality evaluation, and then specific abnormal reasons are further identified. This analysis method can comprehensively and accurately locate problems, cover multi-factor investigation, and accurately determine the root cause. It can effectively optimize the sizing process, formulate targeted improvement measures to promote the improvement of the overall process. It can also ensure production stability and efficiency, reduce production interruptions, and lower production costs.

[0055] The curing process data acquisition module is used to obtain the curing process quality data of each sizing head corresponding to each monitoring object, specifically including glossiness and transparency, and collect the curing temperature and curing humidity of the current batch of products during the curing process.

[0056] It should be noted that the reason for analyzing the curing process corresponding to the antioxidant silver-implanted glass millet bead UV glue sizing: The curing process is crucial for whether the glue can be fully cross-linked to form an ideal glue layer, ensuring complete curing of the glue, enabling the glue layer to have good physical properties such as hardness, adhesion, elasticity, and toughness, as well as chemical properties such as chemical resistance and antioxidant properties. It can also avoid problems such as glue layer defects and product quality degradation caused by poor curing, and overall improve the product quality and production efficiency of antioxidant silver-implanted glass millet beads, providing key basis and guarantee for the optimization of the production process and quality control.

[0057] It should be noted that the reasons for selecting glossiness and transparency as the curing process quality data: 1. Glossiness is a key indicator of the appearance quality of the cured glue layer. For antioxidant silver-implanted glass millet beads, good glossiness can make the product more visually appealing. A glue layer with high glossiness will make the millet beads look brighter and more delicate, which is particularly important when used for decorative purposes (such as making jewelry). 2. Transparency can well reflect problems during the curing process. During the curing process, factors such as the generation of bubbles, the mixing of impurities, or incomplete curing of the glue will reduce transparency. For example, when the glue contains unreacted monomers or solvents, it may make the glue layer appear turbid and reduce transparency. And if air is mixed in to form bubbles during the curing process, the glue layer will also become opaque.

[0058] It should be noted that the reasons for selecting curing temperature and curing humidity as influencing factors for analysis: 1. Different UV glues have specific requirements for the curing temperature range. If the temperature is too low, the curing speed of the glue will slow down, and it may even not reach the fully cured state. On the contrary, too high a temperature may cause problems such as thermal deformation and bubbles in the glue during the curing process. 2. The curing humidity will interfere with the curing process of the glue. A high humidity environment may cause the glue to absorb moisture, affecting the performance of the glue. For example, moisture may react with some active groups in the glue, consuming the free radicals generated by the photoinitiator, resulting in incomplete curing reactions.

[0059] The curing process anomaly analysis module is used to analyze the curing quality of each sizing head corresponding to each monitoring object based on the curing process quality data of each sizing head corresponding to each monitoring object, and then judge whether each sizing head corresponding to each monitoring object is qualified. Mark the unqualified monitoring objects as abnormal monitoring objects, and further analyze the curing quality of the current production batch.

[0060] In a preferred embodiment of the present invention, to analyze the curing quality of each sizing head corresponding to each monitoring object, it is necessary to construct a curing quality index for each sizing head corresponding to each monitoring object. The specific method is as follows: Extract the glossiness and transparency of each sizing head corresponding to each monitoring object, and record them as GZ ij , TM ij .

[0061] Using the formula Analyze to obtain the curing quality index Cqi of each sizing head corresponding to each monitoring object ij , where GZ 0 represents the preset reference glossiness, TM 0 represents the preset reference transparency, e represents the natural constant, T represents the curing temperature of the current batch of products corresponding to the curing process, H represents the curing humidity of the current batch of products corresponding to the curing process, T 0 represents the preset appropriate curing temperature, H 0 represents the preset appropriate curing humidity.

[0062] In a preferred embodiment of the present invention, the specific method for judging whether each sizing head corresponding to each monitoring object is qualified is as follows: Extract the curing quality index of each sizing head corresponding to each monitoring object, and then compare it with the preset curing quality index threshold respectively. If the curing quality index of a certain sizing head corresponding to a certain monitoring object is greater than or equal to the preset curing quality index threshold, it is judged that the sizing head corresponding to the monitoring object is qualified; otherwise, it is judged that the sizing head corresponding to the monitoring object is unqualified.

[0063] Exemplarily, the curing quality index threshold is 0.85.

[0064] In a preferred embodiment of the present invention, to analyze the curing quality of the current production batch, it is necessary to construct a curing quality index for the current production batch. The specific method is as follows: Record the monitoring objects judged to be qualified in the current production batch as qualified monitoring objects, count the number of qualified monitoring objects and the number of monitoring objects in the current production batch, and then calculate the ratio to obtain the curing quality index of the current production batch.

[0065] The curing abnormality judgment module is used to judge whether there is a curing quality abnormality in the current production batch based on the curing quality of the current production batch, and issue a warning if there is an abnormality.

[0066] In a preferred embodiment of the present invention, the specific method for determining whether there is an abnormal curing quality in the current production batch is as follows: extract the curing quality index of the current production batch, and then compare it with a pre-set reference curing quality index threshold. If the curing quality index of the current production batch is greater than or equal to the pre-set reference curing quality index threshold, it is determined that there is no abnormal curing quality in the current production batch; otherwise, it is determined that there is an abnormal curing quality in the current production batch.

[0067] It should be noted that when analyzing the curing process of the present invention, it is determined whether each glue application head corresponding to each monitoring object is qualified based on the curing quality of each glue application head corresponding to each monitoring object, and then the curing quality of the current production batch is further analyzed. This analysis method can timely discover and solve problems, optimize the production batch management, promote the continuous optimization of the process, so as to effectively improve the quality and efficiency of the curing process, provide a strong guarantee for production and help the process to develop and improve continuously.

[0068] It should be noted that the present invention divides the UV glue application into a glue application process and a curing process, and then conducts quality analysis respectively. This analysis method can accurately locate quality problems, and precise quality standards can be formulated for the glue application and curing links respectively. At the same time, from the perspectives of production efficiency and cost, the defective rate and rework rate are greatly reduced, and the equipment fault troubleshooting and production capacity planning are more accurate, so as to effectively improve the production efficiency and reduce the cost, bringing comprehensive improvement and significant benefits to the glue application process of antioxidant silver-filled glass millet beads.

[0069] The above content is only an example and illustration of the concept of the present invention. Those skilled in the art of the present technology can make various modifications or supplements to the described specific embodiments or use similar methods to replace them, as long as they do not deviate from the concept of the invention or exceed the scope defined by the present invention, they should fall within the protection scope of the present invention.

Claims

1. An intelligent monitoring and control system for UV glue application of anti-oxidation silver-filled glass millet beads, characterized in that: include: The gluing process data acquisition module is used to record each oxidized silver-filled glass millet bead corresponding to each gluing head of the current production batch as a monitoring object, obtain the gluing process data of each gluing head corresponding to each monitoring object, the gluing process data includes the gluing amount and the gluing time, and use a high-definition camera to collect the images of each monitoring object after gluing by each gluing head; The glue application process abnormality analysis module is used to analyze the glue liquid quality evaluation, equipment quality evaluation and process quality evaluation of each glue application head corresponding to each monitoring object based on the glue application process data of each glue application head corresponding to each monitoring object and the images after glue application; The glue application abnormality cause identification module is used to determine whether each glue application head has glue application abnormality based on the glue liquid quality evaluation, equipment quality evaluation and process quality evaluation of each glue application head corresponding to each monitoring object, and if so, further identify the specific abnormal cause, which specifically includes glue liquid abnormality, equipment abnormality and process abnormality; The curing process data collection module is used to obtain the curing process quality data of each monitoring object corresponding to each glue head, including glossiness and transparency, and collect the curing temperature and curing humidity of the curing process corresponding to the current batch of products; The curing process abnormality analysis module is used to analyze the curing quality of each monitoring object corresponding to each gluing head based on the curing process quality data of each monitoring object corresponding to each gluing head, and then judge whether each monitoring object corresponding to each gluing head is qualified, record the unqualified monitoring object as an abnormal monitoring object, and further analyze the curing quality of the current production batch; The curing abnormality judgment module is used to judge whether the curing quality of the current production batch is abnormal based on the curing quality of the current production batch, and issue an early warning if there is an abnormality.

2. The intelligent monitoring and control system for UV glue application of anti-oxidation silver-filled glass millet beads as claimed in claim 1, characterized in that: The analysis of the glue liquid quality evaluation situation requires the construction of a glue liquid quality evaluation index for each glue application head corresponding to each monitoring object, and the specific method is as follows: Extract the glue application images of each glue application head corresponding to each monitoring object, obtain the glue liquid area of ​​each glue application head corresponding to each monitoring object, and then calculate the glue liquid area deviation value of each glue application head corresponding to each monitoring object by taking the absolute value after subtracting it from the preset reference glue liquid area, and then calculate the glue liquid viscosity abnormality index of each glue application head corresponding to each monitoring object by taking the ratio with the reference glue liquid area; Extract the glue-applied images of each glue-applying head corresponding to each monitoring object, and then obtain the number of defects of each glue-applying head corresponding to each monitoring object and the defect area corresponding to each defect, which are recorded as X ij , S ijk , where i represents the number of each glue application head, i=1, 2...I, I represents the number of glue application heads, j represents the number of each monitoring object, j=1, 2...J, J represents the number of monitoring objects, k represents the number of each defect, k=1, 2...K, K represents the number of defects; Using the formula The analysis results show that the glue purity abnormality index Gspai of each glue head corresponding to each monitoring object is ij , where X0 represents the preset reference defect quantity, S0 represents the preset reference defect area, α1 and α2 represent the influence weight factors corresponding to the preset defect quantity and defect area, respectively; Substitute the glue viscosity abnormality index and glue purity abnormality index of each monitoring object corresponding to each glue head into the formula The glue quality evaluation index Gqei of each glue head corresponding to each monitoring object is obtained by analysis. ij , where Gsvai ij It indicates the abnormal viscosity index of the glue liquid corresponding to each monitoring object of each glue application head.

3. An anti-oxidation silver-filled glass millet bead UV glue gluing intelligent monitoring and control system as claimed in claim 2, characterized in that: The analysis of the equipment quality evaluation situation requires the construction of an equipment quality evaluation index for each glue dispensing head corresponding to each monitoring object, and the specific method is as follows: Extract the glue application amount of each glue application head corresponding to each monitoring object, recorded as M ij , using the formula The glue quantity stability abnormality index Gmsai of each glue application head corresponding to each monitoring object is obtained by analysis. ij , where M0 represents the preset reference glue application amount; Extract the glue-applied images of each glue-applied head corresponding to each monitored object, obtain the uncoated glue area of ​​each glue-applied head corresponding to each monitored object, and then calculate the ratio with the preset reference glass millet bead area to obtain the positioning accuracy anomaly index Paai of each glue-applied head corresponding to each monitored object. ij ; Substitute the glue quantity stability abnormality index and positioning accuracy abnormality index of each glue head corresponding to each monitoring object into the formula The equipment quality evaluation index Eqei corresponding to each monitoring object of each glue head is obtained by analysis. ij .

4. The intelligent monitoring and control system for UV glue application of anti-oxidation silver-filled glass millet beads as claimed in claim 3, characterized in that: The analysis of the process quality evaluation situation requires the construction of a process quality evaluation index for each sizing head corresponding to each monitoring object, and the specific method is as follows: Extract the glue-applied image of each monitoring object corresponding to each glue-applying head, locate the center point of the millet bead corresponding to each monitoring object of each glue-applying head, and then emit a number of monitoring rays at equal intervals around the center point as the starting point, and then intersect with the corresponding colloid boundary line to obtain a number of monitoring line segments, and obtain the length of the monitoring line segment corresponding to each monitoring object of each glue-applying head; The lengths of the monitoring line segments of each glue head corresponding to each monitoring object are compared to obtain the maximum length and minimum length of the monitoring line segments of each glue head corresponding to each monitoring object, which are recorded as maxL ij 、minL ij ; Using the formula The process quality evaluation index Pqei of each glue head corresponding to each monitoring object is obtained by analysis. ij , where L0 represents the preset reference line segment length.

5. An intelligent monitoring and control system for UV glue application of anti-oxidation silver-filled glass millet beads as claimed in claim 4, characterized in that: The specific process of judging whether each glue dispensing head has glue dispensing abnormality is as follows: Extract the glue liquid quality evaluation index, equipment quality evaluation index and process quality evaluation index of each monitoring object corresponding to each glue dispensing head, and then sum and calculate according to the weight to obtain the glue dispensing process quality evaluation index of each monitoring object corresponding to each glue dispensing head; The gluing process quality evaluation index of each gluing head corresponding to each monitoring object is averaged to obtain the average gluing process quality evaluation index of each gluing head; The average gluing process quality evaluation index of each gluing head is compared with the pre-set gluing process quality evaluation index threshold. If the average gluing process quality evaluation index of a gluing head is greater than the gluing process quality evaluation index threshold, it is judged that there is no gluing abnormality in the gluing head. Otherwise, it is judged that there is gluing abnormality in the gluing head.

6. An intelligent monitoring and control system for UV glue application of anti-oxidation silver-filled glass millet beads as claimed in claim 5, characterized in that: The specific method of identifying the specific abnormal cause is as follows: The glue heads that are judged to have glue application abnormalities are recorded as abnormal glue heads, and the glue liquid quality evaluation index, equipment quality evaluation index and process quality evaluation index corresponding to each monitoring object of each abnormal glue head are extracted, and then the average glue liquid quality evaluation index, average equipment quality evaluation index and average process quality evaluation index of each abnormal glue head are obtained by respectively calculating the average value; The average glue liquid quality evaluation index, average equipment quality evaluation index and average process quality evaluation index of each abnormal glue dispensing head are compared with the pre-set glue liquid quality evaluation index threshold, equipment quality evaluation index threshold and process quality evaluation index threshold respectively to obtain the specific abnormal cause of the corresponding abnormal glue dispensing head.

7. The intelligent monitoring and control system for UV glue application of anti-oxidation silver-filled glass millet beads as claimed in claim 1, characterized in that: The analysis of the curing quality of each glue dispensing head corresponding to each monitoring object requires the construction of a curing quality index of each glue dispensing head corresponding to each monitoring object, and the specific method is as follows: Extract the gloss and transparency of each monitoring object corresponding to each glue head, and record them as GZ ij ,TM ij ; Using the formula The curing quality index Cqi of each glue head corresponding to each monitoring object is obtained by analysis. ij , where GZ0 represents the preset reference gloss, TM0 represents the preset reference transparency, e represents the natural constant, T represents the curing temperature of the current batch of products corresponding to the curing process, H represents the curing humidity of the current batch of products corresponding to the curing process, T0 represents the preset suitable curing temperature, and H0 represents the preset suitable curing humidity.

8. An anti-oxidation silver-filled glass millet bead UV glue application intelligent monitoring and control system as claimed in claim 7, characterized in that: The specific method of judging whether each glue dispensing head is qualified for each monitoring object is as follows: The curing quality index of each glue head corresponding to each monitored object is extracted, and then compared with the preset curing quality index threshold. If the curing quality index of a glue head corresponding to a monitored object is greater than or equal to the preset curing quality index threshold, the glue head is judged to be qualified for the monitored object; otherwise, the glue head is judged to be unqualified for the monitored object.

9. The intelligent monitoring and control system for UV glue application of anti-oxidation silver-filled glass millet beads as claimed in claim 1, characterized in that: The analysis of the curing quality of the current production batch requires the construction of a curing quality index of the current production batch, and the specific method is as follows: The qualified monitoring objects judged in the current production batch are recorded as qualified monitoring objects, and the number of qualified monitoring objects and the number of monitoring objects in the current production batch are obtained by statistics, and then the proportion is calculated to obtain the curing quality index of the current production batch.

10. The intelligent monitoring and control system for UV glue application of anti-oxidation silver-filled glass millet beads as claimed in claim 9, characterized in that: The specific method for determining whether the curing quality of the current production batch is abnormal is as follows: The curing quality index of the current production batch is extracted, and then compared with the preset reference curing quality index threshold. If the curing quality index of the current production batch is greater than or equal to the preset reference curing quality index threshold, it is judged that the current production batch has no curing quality abnormality. Otherwise, it is judged that the current production batch has curing quality abnormality.

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