Display device

Abstract

A display device includes a display panel including a light emitting region, an input sensor, and a conductive pattern. The conductive pattern includes: a first sensing electrode including first sensing patterns provided along a first direction and a bridge pattern connecting two adjacently disposed first sensing patterns; a second sensing electrode spaced apart from the first sensing electrode and including a second sensing pattern provided along a second direction crossing the first direction; and a dummy pattern overlapping one of the first sensing electrode and the second sensing electrode on a plane. Each of the first sensing pattern and the second sensing pattern includes a grid line in which an opening overlapping the light emitting region is defined. Each of the bridge patterns includes: a first bridge pattern connected to a corresponding first sensing pattern; and a second bridge pattern disposed in a different layer from the first bridge pattern and connected to the first bridge pattern.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2023-0122985, filed on September 15, 2023, and all rights arising therefrom, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] The present invention relates to a display device, and more particularly, to a display device having improved visibility. Background Art

[0003] A multimedia device such as a television, a mobile phone, a tablet computer, a navigation system, or a game console includes a display device that displays an image to a user through a display screen. The display device may include a display panel that generates an image and an input sensor that detects a user's touch.

[0004] The input sensor may include a conductor that detects an external input, and the conductor of the input sensor disposed on the display panel may affect light emitting efficiency of the display device or external light reflectivity of the display device. Summary of the invention

[0005] The present invention provides a display device with improved visibility.

[0006] An embodiment of the present invention provides a display device, comprising: a display panel, comprising a plurality of light-emitting areas; and an input sensor, which is disposed on the display panel and comprises a plurality of conductive patterns, wherein the plurality of conductive patterns comprise: a first sensing electrode, comprising a plurality of first sensing patterns provided along a first direction and a plurality of bridge patterns connecting two adjacently disposed first sensing patterns among the plurality of first sensing patterns; a second sensing electrode, which is spaced apart from the first sensing electrode and comprises a plurality of second sensing patterns provided along a second direction intersecting the first direction; and a plurality of dummy patterns, which overlap with at least one of the first sensing electrode and the second sensing electrode on a plane, wherein each of the plurality of first sensing patterns and the plurality of second sensing patterns comprises a plurality of grid lines, in which a plurality of openings overlapping the plurality of light-emitting areas are defined, and wherein each of the plurality of bridge patterns comprises: a first bridge pattern, which is connected to a corresponding first sensing pattern among the plurality of first sensing patterns through a first contact hole; and a second bridge pattern, which is disposed at a different layer from the first bridge pattern and is connected to the first bridge pattern through the second contact hole.

[0007] In an embodiment, the plurality of first sensing patterns may include a 1-1th sensing pattern and a 1-2th sensing pattern disposed adjacent to the 1-1th sensing pattern along a first direction, and the first bridging pattern may include a 1-1th bridging pattern connected to the 1-1th sensing pattern and a 1-2th bridging pattern connected to the 1-2th sensing pattern, wherein the 1-1th bridging pattern and the 1-2th bridging pattern may be spaced apart from each other.

[0008] In an embodiment, the second bridge pattern may include a 2-1st bridge pattern connected to the 1-1th bridge pattern and a 2-2nd bridge pattern connected to the 1-2th bridge pattern.

[0009] In an embodiment, the 2-1st bridge pattern and the 2-2nd bridge pattern may be connected to each other to have an integrated shape.

[0010] In an embodiment, each of the plurality of bridge patterns may further include a third bridge pattern disposed at a different layer from the second bridge pattern and connected to at least one of the 2-1st bridge pattern and the 2-2nd bridge pattern.

[0011] In an embodiment, the third bridge pattern may partially overlap the second sensing electrode on a plane.

[0012] In an embodiment, the third bridge pattern may be connected to each of the 2-1st bridge pattern and the 2-2nd bridge pattern.

[0013] In an embodiment, the third bridge pattern may be disposed on the same layer as the first bridge pattern.

[0014] In an embodiment, a length of the first bridge pattern in the first direction may be substantially the same as a length of the third bridge pattern in the first direction.

[0015] In an embodiment, the second bridge pattern may be disposed on the same layer as the first sensing pattern and the second sensing pattern.

[0016] In an embodiment, the second sensing electrode may further include: a connecting pattern, which is arranged between two adjacent second sensing patterns among the plurality of second sensing patterns and has an integral shape with the plurality of second sensing patterns, a second bridging pattern may be arranged adjacent to the connecting pattern, and a cutting portion may be defined between the second bridging pattern and the connecting pattern.

[0017] In an embodiment, the input sensor may further include an insulating sensing layer disposed between the first bridge pattern and the plurality of first sensing patterns, wherein the first contact hole and the second contact hole may be defined in the insulating sensing layer.

[0018] In an embodiment, a boundary portion may be defined between the first sensing pattern and the second sensing electrode, wherein the first bridge pattern may partially overlap the boundary portion.

[0019] In an embodiment, a length of the first bridge pattern in the first direction may be substantially the same as a length of each of the plurality of dummy patterns in the first direction.

[0020] In an embodiment, the first bridge pattern may extend in the first direction, and the second bridge pattern may extend in the second direction.

[0021] In an embodiment, the plurality of first sensing patterns may include a 1-1th sensing pattern and a 1-2th sensing pattern disposed adjacent to the 1-1th sensing pattern along a first direction, wherein the plurality of bridging patterns may include: a first sub-bridging pattern connecting the 1-1th sensing pattern and the 1-2th sensing pattern; and a second sub-bridging pattern connecting the 1-1th sensing pattern and the 1-2nd sensing pattern.

[0022] In an embodiment, the plurality of light-emitting zones may include: a first light-emitting zone emitting a first color light; a second light-emitting zone emitting a second color light different from the first color light; and a third light-emitting zone emitting a third color light different from the first color light and the second color light, wherein the first light-emitting zones and the second light-emitting zones may be alternately arranged along the second direction, and the third light-emitting zone may be arranged to be spaced apart from the first light-emitting zones and the second light-emitting zones along the first direction.

[0023] In an embodiment, a display device includes: a display panel including a plurality of light-emitting areas; and an input sensor disposed on the display panel and including a plurality of conductive patterns, wherein the plurality of conductive patterns include: a first sensing electrode including a plurality of first sensing patterns provided along a first direction and a plurality of bridge patterns connecting two adjacently disposed first sensing patterns among the plurality of first sensing patterns; and a second sensing electrode spaced apart from the first sensing electrode and including a plurality of second sensing patterns provided along a second direction intersecting the first direction, wherein each of the plurality of first sensing patterns and the plurality of second sensing patterns includes a plurality of grid lines defining a plurality of openings overlapping the plurality of light-emitting areas, and each of the plurality of bridge patterns includes: a first bridge pattern connected to a corresponding first sensing pattern among the plurality of first sensing patterns through a first contact hole and extending along the first direction; and a second bridge pattern connected to the first bridge pattern through a second contact hole and extending along the second direction.

[0024] In an embodiment, the second bridge pattern may be disposed at the same layer as the first sensing pattern and the second sensing pattern, and the first bridge pattern may be disposed at a different layer from the second bridge pattern.

[0025] In an embodiment, a display device includes: a display panel including a plurality of light emitting areas; and an input sensor disposed on the display panel and including a plurality of conductive patterns, wherein the plurality of conductive patterns include: a first sensing electrode including a plurality of first sensing patterns provided along a first direction and a plurality of bridge patterns connecting two adjacently disposed first sensing patterns of the plurality of first sensing patterns; and a second sensing electrode spaced apart from the first sensing electrode and including a plurality of second sensing patterns provided along a second direction intersecting the first direction, wherein each of the plurality of first sensing patterns and the plurality of second sensing patterns includes a plurality of grid lines in which a plurality of openings overlapping the plurality of light emitting areas are defined, and each of the plurality of bridge patterns includes: a first bridge pattern connected to a corresponding first sensing pattern of the plurality of first sensing patterns through a first contact hole; and a second bridge pattern at least partially disposed at the same layer as the second sensing electrode and connected to the first bridge pattern through a second contact hole, and wherein a cutting portion is defined between the second bridge pattern and the second sensing electrode. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification. The accompanying drawings illustrate embodiments of the present invention and together with the description serve to explain the principles of the present invention. In the drawings:

[0027] Figure 1 is a perspective view of a display device according to an embodiment;

[0028] Figure 2 is a cross-sectional view of a display device according to an embodiment;

[0029] Figure 3 is a plan view of a display panel according to an embodiment;

[0030] Figure 4A is an enlarged plan view of a display area according to an embodiment;

[0031] Figure 4B is an enlarged plan view of a display area according to an embodiment;

[0032] Figure 4C is an enlarged plan view of a display area according to an embodiment;

[0033] Figure 5 is a cross-sectional view of a display device according to an embodiment;

[0034] Fig. 6A is a plan view of an input sensor according to an embodiment;

[0035] Figure 6B is a plan view illustrating some configurations of an input sensor according to an embodiment;

[0036] Figure 7 is an enlarged plan view of a portion of an input sensor according to an embodiment;

[0037] Figure 8 is an enlarged plan view of a portion of an input sensor according to an embodiment;

[0038] Fig. 9A is a plan view illustrating some configurations of an input sensor according to an embodiment;

[0039] Fig. 9B is a plan view illustrating some configurations of an input sensor according to an embodiment;

[0040] Fig. 10A is a cross-sectional view of a portion of an input sensor according to an embodiment;

[0041] Fig. 10B is a cross-sectional view of a portion of an input sensor according to an embodiment;

[0042] Fig. 10C is a cross-sectional view of a portion of an input sensor according to an embodiment; and

[0043] Fig.11 is an enlarged plan view of a portion of an input sensor according to an embodiment. DETAILED DESCRIPTION

[0044] In this specification, when a component (or region, layer, part, etc.) is referred to as being "on", "connected" or "coupled to" another component, it means that it is directly placed on, directly connected or directly coupled to the other component, or a third component may be disposed between them.

[0045] In the specification, "directly disposed" may mean that there is no layer, film, region, plate, etc. added between one part and another part such as a layer, film, region or plate. For example, "directly disposed" may mean placing two layers or two members without using an additional member such as an adhesive member therebetween.

[0046] In the specification, the same reference numerals or symbols refer to the same elements. In addition, in the drawings, for the effective description of the technical content, the thickness, proportion and size of the components are exaggerated. "And / or" includes all combinations of one or more that the associated elements can define.

[0047] In the specification, terms such as first and second may be used to describe various components, but the components should not be limited by these terms. These terms are only used for the purpose of distinguishing one component from other components. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component. Unless the context clearly indicates otherwise, a singular expression includes a plural expression.

[0048] In addition, in the specification, terms such as "below", "lower", "above", and "upper" are used to describe the relationship between components shown in the drawings. These terms are relative concepts and are described based on the directions indicated in the drawings.

[0049] In the specification, terms such as “include” or “have” are intended to indicate the presence of features, quantities, steps, operations, components, parts, or a combination thereof described in the specification, and it should be understood that they do not exclude the possibility of the presence or addition of one or more other features, quantities, steps, operations, components, parts, or a combination thereof.

[0050] Unless otherwise defined, all terms (including technical terms and scientific terms) used in this specification have the same meaning as those generally understood by ordinary technicians in the field to which the present invention belongs. In addition, terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the relevant technology, and unless clearly defined here, should not be interpreted as being too ideal or too formal.

[0051] The present invention will now be more fully described below with reference to the accompanying drawings in which various embodiments are shown. However, the present invention can be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that this disclosure is thorough and complete, and these embodiments will fully convey the scope of the present invention to those skilled in the art.

[0052] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0053] Figure 1 is a perspective view of a display device DD according to an embodiment. Figure 1 As shown in FIG. 1 , the display device DD may display an image through the display surface DD-IS. The display surface DD-IS may have a rectangular shape on a plane, the rectangular shape having a long side extending in a first direction DR1 and a short side extending in a second direction DR2 crossing the first direction DR1. However, the present invention is not limited thereto, and the display surface DD-IS may have various shapes such as a circle or a polygon.

[0054] In an embodiment, the third direction DR3 may be defined as a direction substantially perpendicular to a plane defined by the first direction DR1 and the second direction DR2. The front surface (or upper surface) and the rear surface (or lower surface) of each member constituting the display device DD may be opposite to each other in the third direction DR3, and the normal direction of each of the front surface and the rear surface may be directed substantially parallel to the third direction DR3. The distance between the front surface and the rear surface of the member defined along the third direction DR3 may correspond to the thickness of the member.

[0055] In the present specification, "on a plane" may be defined as a state of viewing in the third direction DR3. That is, "on a plane" may be described based on a plane defined by the first direction DR1 and the second direction DR2. In the present specification, "on a cross section" may be defined as a state of viewing in the first direction DR1 or the second direction DR2. Meanwhile, the directions indicated by the first direction to the third directions DR1, DR2, and DR3, respectively, are relative concepts and may be changed to other directions.

[0056] In the embodiment, a display device DD provided with a flat display surface is illustrated, but the present invention is not limited thereto. The display device DD may include a curved display surface or a cubic display surface. The cubic display surface may include a plurality of display areas indicating different directions, for example, a bent display surface. The display device DD according to the embodiment may be a flexible display device DD. The flexible display device DD may be a foldable display device.

[0057] In the embodiment, a display device DD that can be applied to a tablet terminal is exemplarily illustrated. An electronic module, a camera module, a power module, etc. mounted on a mainboard can be set in a bracket / housing together with the display device DD to constitute a tablet terminal. The display device DD according to the embodiment can be applied not only to large electronic devices such as televisions or monitors, but also to small and medium-sized electronic devices such as mobile phones, car navigation systems, game consoles, or smart watches.

[0058] In the embodiments and as Figure 1 As shown in FIG. 1 , the display surface DD-IS includes an image area DD-DA on which an image is displayed and a border area DD-NDA adjacent to the image area DD-DA. The border area DD-NDA is an area on which no image is displayed. Figure 1 An icon image is illustrated as an example of the image.

[0059] In the embodiments and as Figure 1 As illustrated in , the image area DD-DA may have a substantially quadrilateral shape. The “substantially quadrilateral shape” includes not only a quadrilateral shape in a mathematical sense but also a quadrilateral shape in which no vertices are defined in its corner area but its curved boundaries are defined.

[0060] In an embodiment, the frame area DD-NDA may surround the image area DD-DA, but the present invention is not limited thereto and the shape of the frame area DD-NDA may be changed. For example, the frame area DD-NDA may be provided only on one side of the image area DD-DA.

[0061] Figure 2 is a cross-sectional view of a display device DD according to an embodiment.

[0062] In an embodiment, the display device DD may include a display module DM and a window WM disposed on the display module DM. The display module DM and the window WM may be bonded to each other by an adhesive layer PSA. According to an embodiment, the window WM may be formed in a coating manner, and the window WM may be in contact with the display module DM. In this case, the adhesive layer PSA may be omitted.

[0063] In an embodiment, the display module DM may include a display panel 100, an input sensor 200, and an anti-reflection layer 300. The display panel 100 may include a base layer 110, a driving element layer 120, a light emitting element layer 130, and an encapsulation layer 140.

[0064] In an embodiment, the driving element layer 120 is disposed on the upper surface of the base layer 110. The base layer 110 may be a flexible substrate that is bendable, foldable, or rollable. The base layer 110 may be a glass substrate, a metal substrate, or a polymer substrate. However, the present invention is not limited thereto, and the base layer 110 may be an inorganic layer, an organic layer, or a composite material layer. The base layer 110 has substantially the same shape as the display panel 100.

[0065] In an embodiment, the base layer 110 may have a multilayer structure. For example, the base layer 110 may include a first synthetic resin layer, a second synthetic resin layer, and an inorganic layer disposed between the first synthetic resin layer and the second synthetic resin layer. Each of the first synthetic resin layer and the second synthetic resin layer may include a polyimide-based resin, but is not particularly limited thereto.

[0066] In an embodiment, the driving element layer 120 may be disposed on the base layer 110. The driving element layer 120 may include a plurality of insulating layers, a plurality of semiconductor patterns, a plurality of conductive patterns, signal lines, etc. The driving element layer 120 may include a driver of a pixel.

[0067] In an embodiment, the light emitting element layer 130 may be disposed on the driving element layer 120. The light emitting element layer 130 may include a light emitting element. For example, the light emitting element may include an organic light emitting material, an inorganic light emitting material, an organic-inorganic light emitting material, a quantum dot, a quantum rod, a micro LED, or a nano LED.

[0068] In an embodiment, the encapsulation layer 140 may be disposed on the light emitting element layer 130. The encapsulation layer 140 may protect the light emitting element layer 130 (i.e., the light emitting element) from foreign matter such as moisture, oxygen, and dust particles. The encapsulation layer 140 may include at least one inorganic encapsulation layer. The encapsulation layer 140 may include a stacked structure of a first inorganic encapsulation layer / an organic encapsulation layer / a second inorganic encapsulation layer.

[0069] In an embodiment, the input sensor 200 may be directly disposed on the display panel 100. The input sensor 200 may detect the user's input, for example, in an electromagnetic induction manner and / or a capacitive manner. The display panel 100 and the input sensor 200 may be formed by a continuous process. Here, "directly disposed" may mean that a third component is not disposed between the display panel 100 and the input sensor 200. For example, a separate adhesive layer may not be disposed between the display panel 100 and the input sensor 200.

[0070] In an embodiment, the anti-reflection layer 300 reduces the reflectivity of external light incident from the top of the window WM. In an embodiment, the anti-reflection layer 300 may include a retarder and a polarizer. The retarder may be a film type or a liquid crystal coating type, and may include a λ / 2 retarder and / or a λ / 4 retarder. The polarizer may also be a film type or a liquid crystal coating type. The film type may include a stretched synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a predetermined arrangement. The retarder and the polarizer may further include a protective film. The retarder and the polarizer themselves or the protective film may be defined as the base layer of the anti-reflection layer 300.

[0071] In an embodiment, the anti-reflection layer 300 may include a color filter. The color filter has a predetermined arrangement. The arrangement of the color filter may be determined in consideration of the luminous color of the pixels included in the display panel 100. The anti-reflection layer 300 may further include a black matrix adjacent to the color filter. The anti-reflection layer 300 including the color filter may be directly disposed on the display panel 100.

[0072] In an embodiment, the window WM may include a base layer and a light shielding pattern. The base layer may include a glass substrate and / or a synthetic resin film, etc. The light shielding pattern may partially overlap the base layer. The light shielding pattern may be disposed on the rear surface of the base layer and may substantially define a border area DD-NDA (see FIG. Figure 1 The area where no light shielding pattern is provided may define an image area DD-DA of the display device DD (see Figure 1 ).

[0073] Figure 3 is a plan view of a display panel 100 according to an embodiment.

[0074] In the examples and with reference to Figure 3The display panel 100 may include a plurality of pixels PX, a scan driver SDV, a light emitting driver EDV, a plurality of signal lines, and a plurality of pads PD. The plurality of pixels PX are arranged in the display area 100-DA. The driving chip DIC installed in the non-display area 100-NDA may include a data driver. The display area 100-DA may be connected to Figure 1 The image area DD-DA corresponds to the image area DD-DA in FIG. 1 , and the non-display area 100-NDA can correspond to the image area DD-DA in FIG. 1 . Figure 1 In the present specification, the wording “a region or a portion corresponds to another region or another portion” means “the region or the portion overlaps another region or another portion” and is not necessarily limited to “two different regions or portions have the same area”. In an embodiment, the data driver may also be integrated in the display panel 100 like the scan driver SDV and the light emitting driver EDV.

[0075] In an embodiment, the plurality of signal lines may include a plurality of scan lines SL1 to SLm, a plurality of data lines DL1 to DLn, a plurality of emission lines EL1 to ELm, first and second control lines SL-C1 and SL-C2, and first and second power lines PL1 and PL2, wherein m and n are natural numbers of 2 or more.

[0076] In an embodiment, the scan lines SL1 to SLm may extend in a first direction DR1 to be electrically connected to the pixels PX and the scan driver SDV. The data lines DL1 to DLn may extend in a second direction DR2 to be electrically connected to the pixels PX and the driving chip DIC. The emission lines EL1 to ELm may extend in the first direction DR1 to be electrically connected to the pixels PX and the emission driver EDV.

[0077] In an embodiment, the first power line PL1 receives a first power voltage, and the second power line PL2 receives a second power voltage having a level lower than the first power voltage. Although not shown, a second electrode (eg, cathode) of the light emitting element is connected to the second power line PL2.

[0078] In an embodiment, the first control line SL-C1 may be connected to the scan driver SDV and may extend toward the lower end of the display panel 100. The second control line SL-C2 may be connected to the light emitting driver EDV and may extend toward the lower end of the display panel 100. The pad PD may be disposed in the non-display area 100-NDA adjacent to the lower end of the display panel 100 and may be closer to the lower end of the display panel 100 than the driving chip DIC. The pad PD may be connected to the driving chip DIC and some signal lines.

[0079] In an embodiment, the scan driver SDV may generate a plurality of scan signals, and the scan signals may be applied to the pixels PX through the scan lines SL1 to SLm. The driving chip DIC may generate a plurality of data voltages, and the data voltages may be applied to the pixels PX through the data lines DL1 to DLn. The light emitting driver EDV may generate a plurality of light emitting signals, and the light emitting signals may be applied to the pixels PX through the light emitting lines EL1 to ELm. The pixels PX may be supplied with the data voltages in response to the scan signals. The pixels PX may display an image by emitting light having a brightness corresponding to the data voltages in response to the light emitting signals.

[0080] FIG. 4A to FIG. 4C is an enlarged plan view of a display area 100 -DA according to an embodiment.

[0081] In the examples and with reference to Figure 4A The display area 100-DA may include a plurality of light emitting areas LA1, LA2, and LA3 and a non-light emitting area NLA disposed adjacent to the plurality of light emitting areas LA1, LA2, and LA3. The non-light emitting area NLA sets a boundary of the light emitting areas LA1, LA2, and LA3.

[0082] In an embodiment, the light emitting areas LA1, LA2 and LA3 may be arranged so as to correspond to Figure 3 The pixels PX in FIG. 1 correspond to each other one by one. The pixels PX include light emitting elements, and the light emitting areas LA1, LA2, and LA3 may be light emitting areas formed in the light emitting elements. Figure 5 The arrangement relationship between the light emitting areas LA1, LA2 and LA3 and the non-light emitting area NLA is described.

[0083] In an embodiment, the light-emitting areas LA1, LA2, and LA3 may include a first light-emitting area LA1 (or a first color light emission area) forming a first color light, a second light-emitting area LA2 (or a second color light emission area) forming a second color light, and a third light-emitting area LA3 (or a third color light emission area) forming a third color light. In an embodiment, the first color light may be red light, the second color light may be green light, and the third color light may be blue light.

[0084] In an embodiment, the first light emitting area LA1, the second light emitting area LA2, and the third light emitting area LA3 may have different areas, but the present invention is not limited thereto. In an embodiment, the first light emitting area LA1 may have the smallest area, and the third light emitting area LA3 may have the largest area.

[0085] In an embodiment, the first light emitting area LA1, the second light emitting area LA2 and the third light emitting area LA3 may define a unit light emitting area UA. The unit light emitting area UA is a repeated arrangement unit of light emitting areas arranged in the display area 100-DA. In an embodiment, the unit light emitting area UA may include a first unit light emitting area UA1 and a second unit light emitting area UA2.

[0086] In the embodiment and referring to the first unit light emitting area UA1 and the second unit light emitting area UA2, the first light emitting area LA1 and the second light emitting area LA2 are disposed at one side of the third light emitting area LA3 in the first direction DR1 ( Figure 4A The second light emitting area LA2 of each of the first unit light emitting area UA1 and the second unit light emitting area UA2 is disposed at one side of the first light emitting area LA1 in the first direction DR1 ( Figure 4A ).

[0087] In the embodiment, in the first unit light emitting area UA1 and the second unit light emitting area UA2, the position of the third light emitting area LA3 relative to the first light emitting area LA1 and the second light emitting area LA2 is different in the second direction DR2. With reference to the first unit light emitting area UA1, the third light emitting area LA3 is relatively disposed at the lower end of the first unit light emitting area UA1 relative to the first light emitting area LA1 and the second light emitting area LA2 in the second direction DR2. With reference to the second unit light emitting area UA2, the third light emitting area LA3 is relatively disposed at the upper end of the second unit light emitting area UA2 relative to the first light emitting area LA1 and the second light emitting area LA2 in the second direction DR2. The degree of displacement of the third light emitting area LA3 relative to the first light emitting area LA1 and the second light emitting area LA2 in the second direction DR2 may be different in the first unit light emitting area UA1 and the second unit light emitting area UA2, respectively. In the embodiment, the third light emitting area LA3 may be relatively more displaced in the second unit light emitting area UA2 than in the first unit light emitting area UA1. However, the present invention is not limited thereto, and the degree of displacement of the third light emitting area LA3 relative to the first light emitting area LA1 and the second light emitting area LA2 in the second direction DR2 may be the same in the first unit light emitting area UA1 and the second unit light emitting area UA2.

[0088] In an embodiment, the first unit light-emitting area UA1 and the second unit light-emitting area UA2 may be alternately arranged in the pixel row PXR in the first direction DR1. The first unit light-emitting area UA1 and the second unit light-emitting area UA2 are alternately arranged in the pixel column PXC along the second direction DR2. By such arrangement of the first unit light-emitting area UA1 and the second unit light-emitting area UA2, the third light-emitting area LA3 of the first unit light-emitting area UA1 and the third light-emitting area LA3 of the second unit light-emitting area UA2 are arranged in a predetermined rule. Two adjacent third light-emitting areas LA3 of the first unit light-emitting area UA1 and the second unit light-emitting area UA2 are arranged to be spaced apart from each other by a first spacing DT1 and relatively close to each other. The third light-emitting area LA3 of the first unit light-emitting area UA1 and the third light-emitting area LA3 of the second unit light-emitting area UA2 are spaced apart from each other by a first spacing DT1 to define a pair of light-emitting areas UP. The pair of light-emitting areas UP are spaced apart from each other by a second spacing DT2 in the pixel column PXC. The second spacing DT2 is greater than the first spacing DT1.

[0089] In an embodiment, a pair of light-emitting areas UP is formed due to a mask used in deposition. The light-emitting element disposed in the third light-emitting area LA3 of the first unit light-emitting area UA1 and the light-emitting element disposed in the third light-emitting area LA3 of the second unit light-emitting area UA2 include a light-emitting layer having an integral shape. That is, the light-emitting layer disposed in the third light-emitting area LA3 of the first unit light-emitting area UA1 and the light-emitting layer disposed in the third light-emitting area LA3 of the second unit light-emitting area UA2 have an integral shape and are deposited using one mask. Openings corresponding to a pair of light-emitting areas UP are defined in the corresponding mask. The area between the openings of the mask corresponds to the blocking area of ​​the mask. Since the openings corresponding to a pair of light-emitting areas UP are defined, the number of openings can be reduced, and the width of the blocking area of ​​the mask disposed between the openings in the second direction DR2 can be ensured. Since the mask of the thin film ensures the width of the blocking area of ​​the mask in the second direction DR2, a malfunction in which the mask is stretched during the deposition process can be suppressed.

[0090] In the embodiment, when comparing Figure 4A The second spacing DT2 and Figure 4B This can be seen when the third distance DT3 between the third light emitting areas LA3 is shown in FIG. Figure 4B , one type of unit light emitting area UA is set in the display area 100-DA. The third interval DT3 between the third light emitting areas LA3 of the adjacent unit light emitting areas UA in the pixel column PXC is less than Figure 4A In the second spacing DT2 used to form Figure 4B In the mask of the third light emitting area LA3, the number of openings is larger and the width of the blocking area is smaller. This is because Figure 4BOpenings respectively corresponding to the third light emitting areas LA3 are defined in the mask of the light emitting layer in the third light emitting area LA3 illustrated in FIG.

[0091] In an embodiment, Figure 4A and Figure 4B In each of the above, a pixel column in which the first and second light-emitting areas LA1 and LA2 are alternately arranged along the second direction DR2 may be referred to as a first unit pixel column PXC-1, and a pixel column in which the third light-emitting area LA3 is arranged along the second direction DR2 may be referred to as a second pixel column PXC-2.

[0092] In the examples and with reference to Figure 4C , one type of unit light emitting area UA0 is set in the display area 100-DA. The unit light emitting area UA0 includes a second light emitting area LA2 arranged to be spaced apart from each other in the first direction DR1 and a first light emitting area LA1 and a third light emitting area LA3 arranged to be spaced apart from each other in the second direction DR2. The four light emitting areas LA1, LA2 and LA3 of the unit light emitting area UA0 are arranged in a diamond form. The unit light emitting areas UA0 of the pixel row PXR are arranged along the first direction DR1. The unit light emitting areas UA0 of the adjacent pixel rows PXR may be arranged to be staggered with each other along the first direction DR1. The unit light emitting areas UA0 of the adjacent pixel columns PXC may be arranged to be staggered with each other along the second direction DR2.

[0093] Figure 5 is a cross-sectional view of a display device DD according to an embodiment. Figure 5 is with Figure 4A A cross-sectional view of the display device DD corresponding to the line II' in FIG. Figure 5 Some configurations of the display device DD are shown in FIG. Figure 2 The anti-reflection layer 300, the adhesive layer PSA and the window WM).

[0094] In an embodiment, the pixel driver PC driving the light emitting element LD may include a plurality of pixel driving elements. The pixel driver PC may include a plurality of transistors S-TFT and O-TFT and a capacitor Cst. Figure 5 A silicon transistor S-TFT and an oxide transistor O-TFT are exemplarily illustrated as examples of the transistor. Figure 5 The pixel driver PC in FIG. 1 is only an embodiment, and the configuration of the pixel driver PC is not necessarily limited thereto. The pixel driver PC may include only one type of transistor among a silicon transistor S-TFT and an oxide transistor O-TFT.

[0095] In the examples and with reference to Figure 5, the base layer 110 is illustrated as a single layer. The base layer 110 may include a synthetic resin such as polyimide. The base layer 110 may be formed by coating a synthetic resin layer on a working substrate (or a carrier substrate). After the display module DM is completed by performing the following process, the working substrate may be removed. In an embodiment, the base layer 110 may have a multilayer structure including a first synthetic resin layer, at least one inorganic layer, and a second synthetic resin layer.

[0096] In the examples and with reference to Figure 5 , the barrier layer 10br may be disposed on the base layer 110. The barrier layer 10br may prevent the introduction of foreign matter from the outside. The barrier layer 10br may include at least one inorganic layer. The barrier layer 10br may include a silicon oxide layer and a silicon nitride layer. The silicon oxide layer and the silicon nitride layer may each be provided in plural and may be alternately stacked.

[0097] In an embodiment, the barrier layer 10br may include a lower barrier layer 10br1 and an upper barrier layer 10br2. The first shielding electrode BMLa may be disposed between the lower barrier layer 10br1 and the upper barrier layer 10br2. The first shielding electrode BMLa may be disposed to correspond to the silicon transistor S-TFT. The first shielding electrode BMLa may include a metal such as molybdenum.

[0098] In an embodiment, the first shielding electrode BMLa may receive a bias voltage. The first shielding electrode BMLa may receive a first power supply voltage. The first shielding electrode BMLa may prevent the potential caused by the polarization phenomenon from affecting the silicon transistor S-TFT. The first shielding electrode BMLa may block external light from reaching the silicon transistor S-TFT. The first shielding electrode BMLa according to an embodiment may be a floating electrode in a form isolated from another electrode or line.

[0099] In an embodiment, a buffer layer 10bf may be disposed on the barrier layer 10br. The buffer layer 10bf may prevent metal atoms or impurities from diffusing from the base layer 110 to the first semiconductor pattern SC1 thereon. The buffer layer 10bf may include at least one inorganic layer. The buffer layer 10bf may include a silicon oxide layer and a silicon nitride layer.

[0100] In an embodiment, the first semiconductor pattern SC1 may be disposed on the buffer layer 10bf. The first semiconductor pattern SC1 may include a silicon semiconductor. For example, the silicon semiconductor may include amorphous silicon or polycrystalline silicon, etc. For example, the first semiconductor pattern SC1 may include low temperature polycrystalline silicon.

[0101] In an embodiment, the first semiconductor pattern SC1 may have different electrical characteristics depending on whether it is doped. The first semiconductor pattern SC1 may include a first region having high conductivity and a second region having low conductivity. The first region may be doped with an N-type dopant or a P-type dopant. The second region may be a non-doped region or a region doped at a lower concentration than the first region. The source region SE-1, the channel region AC1 (or active region), and the drain region DE1 of the silicon transistor S-TFT may be formed by the first semiconductor pattern SC1. The source region SE-1 and the drain region DE1 may extend from the channel region AC1 in opposite directions in a cross section.

[0102] In an embodiment, the first insulating layer 10 may be disposed on the buffer layer 10bf. The first insulating layer 10 may cover the first semiconductor pattern SC1. The first insulating layer 10 may be an inorganic layer. The first insulating layer 10 may be a single-layer silicon oxide layer. Not only the first insulating layer 10, but also the inorganic layer of the driving element layer 120 to be described later, may have a single-layer or multi-layer structure and may include at least one of the above materials, but the present invention is not limited thereto.

[0103] In an embodiment, a gate GT1 of a silicon transistor S-TFT is disposed on the first insulating layer 10. The gate GT1 may be a portion of a metal pattern. The gate GT1 overlaps with the channel region AC1. The gate GT1 may be a mask in a process in which the first semiconductor pattern SC1 is doped. The first electrode CE10 of the storage capacitor Cst is disposed on the first insulating layer 10. Figure 5 Different from that shown in FIG. 1 , in another embodiment, the first electrode CE10 and the gate electrode GT1 may have an integral shape.

[0104] In an embodiment, the second insulating layer 20 may be disposed on the first insulating layer 10 and may cover the gate GT1. In an embodiment, an upper electrode overlapping the gate GT1 may be further disposed on the second insulating layer 20. A second electrode CE20 overlapping the first electrode CE10 may be disposed on the second insulating layer 20. The upper electrode may have an integral shape with the second electrode CE20 on a plane.

[0105] In an embodiment, the second shielding electrode BMLb is disposed on the second insulating layer 20. The second shielding electrode BMLb may be disposed to correspond to the oxide transistor O-TFT. In an embodiment, the second shielding electrode BMLb may be omitted. According to an embodiment, the first shielding electrode BMLa may extend to the lower portion of the oxide transistor O-TFT to replace the second shielding electrode BMLb.

[0106] In an embodiment, the third insulating layer 30 may be disposed on the second insulating layer 20. The second semiconductor pattern SC2 may be disposed on the third insulating layer 30. The second semiconductor pattern SC2 may include a channel region AC2 of the oxide transistor O-TFT. The second semiconductor pattern SC2 may include a metal oxide semiconductor. The second semiconductor pattern SC2 may include a semiconductor such as indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), zinc oxide (ZnO x ) or indium oxide (In 2 O 3 )'s transparent conductive oxide (TCO).

[0107] In an embodiment, the metal oxide semiconductor may include a plurality of regions SE-2, AC2, and DE2 divided according to whether the transparent conductive oxide is reduced. The region in which the transparent conductive oxide is reduced has a higher conductivity than the region in which the transparent conductive oxide is not reduced (hereinafter, the unreduced region). The reduced region may serve as a source / drain or a signal line of a transistor. The unreduced region substantially corresponds to a semiconductor region (or channel) of the transistor. The fourth insulating layer 40 may be disposed on the third insulating layer 30. Figure 5 As shown in FIG. 1 , the fourth insulating layer 40 may cover the second semiconductor pattern SC2. In an embodiment, the fourth insulating layer 40 may overlap the gate electrode GT2 of the oxide transistor O-TFT and may be an insulating pattern exposed by the source region SE-2 and the drain region DE2 of the oxide transistor O-TFT.

[0108] In an embodiment, the gate GT2 of the oxide transistor O-TFT is disposed on the fourth insulating layer 40. The gate GT2 of the oxide transistor O-TFT may be a part of the metal pattern. The gate GT2 of the oxide transistor O-TFT overlaps the channel region AC2. The fifth insulating layer 50 may be disposed on the fourth insulating layer 40 and may cover the gate GT2. Each of the first insulating layer 10 to the fifth insulating layer 50 may be an inorganic layer.

[0109] In an embodiment, the first connection pattern CNP1 and the second connection pattern CNP2 may be disposed on the fifth insulating layer 50. The first connection pattern CNP1 and the second connection pattern CNP2 may be formed by the same process, thereby having the same material and stacking structure. The first connection pattern CNP1 may be connected to the drain region DE1 of the silicon transistor S-TFT through the first pixel contact hole PCH1 penetrating the first insulating layer to the fifth insulating layer 10, 20, 30, 40 and 50, respectively. The second connection pattern CNP2 may be connected to the source region SE-2 of the oxide transistor O-TFT through the second pixel contact hole PCH2 penetrating the fourth insulating layer 40 and the fifth insulating layer 50, respectively. The connection relationship of the first connection pattern CNP1 and the second connection pattern CNP2 relative to the silicon transistor S-TFT and the oxide transistor O-TFT is not necessarily limited thereto.

[0110] In an embodiment, the sixth insulating layer 60 may be disposed on the fifth insulating layer 50. The third connection pattern CNP3 may be disposed on the sixth insulating layer 60. The third connection pattern CNP3 may be connected to the first connection pattern CNP1 through a third pixel contact hole PCH3 penetrating the sixth insulating layer 60. The data line DL may be disposed on the sixth insulating layer 60. The seventh insulating layer 70 may be disposed on the sixth insulating layer 60 to cover the third connection pattern CNP3 and the data line DL. The third connection pattern CNP3 and the data line DL may be formed by the same process so as to have the same material and stack structure. Each of the sixth insulating layer 60 and the seventh insulating layer 70 may be an organic layer.

[0111] In an embodiment, the light emitting element LD may include an anode AE ​​(or a first electrode), a light emitting layer EL and a cathode CE (or a second electrode). The anode AE ​​of the light emitting element LD may be disposed on the seventh insulating layer 70. The anode AE ​​may be a (semi) transmissive electrode or a reflective electrode. The anode AE ​​may include a stacked structure of ITO / Ag / ITO stacked in sequence. The position of the anode AE ​​and the position of the cathode CE may be changed with each other.

[0112] In an embodiment, a pixel defining film PDL may be disposed on the seventh insulating layer 70. The pixel defining film PDL may be an organic layer. The pixel defining film PDL may have a characteristic of absorbing light. For example, the pixel defining film PDL may have a black color. The pixel defining film PDL may include a black colorant. The black colorant may include a black pigment or a black dye. The black colorant may include carbon black, a metal such as chromium, or an oxide of a metal. The pixel defining film PDL may correspond to a light shielding pattern having a light shielding property.

[0113] In an embodiment, the pixel defining film PDL may partially cover the anode AE. For example, an opening PDL-OP partially exposing the anode AE ​​may be defined in the pixel defining film PDL. The light emitting area LA1 may be defined to correspond to the opening PDL-OP. Figure 5 Graphics and Figure 4A A light emitting area LA1 corresponding to the first light emitting area LA1 in FIG. Figure 4A The cross section corresponding to the second light emitting area LA2 and the third light emitting area LA3 in FIG. Figure 5 The cross-sections in the first light emitting region LA1 are substantially the same. However, the light emitting layer EL having a material different from that of the first light emitting region LA1 may be provided in the second light emitting region LA2 and the third light emitting region LA3. Figure 4A In the pair of light-emitting areas UP in the first unit light-emitting area UA1, the pixel defining film PDL is disposed between the third light-emitting area LA3 of the first unit light-emitting area UA1 and the third light-emitting area LA3 of the second unit light-emitting area UA2. The light-emitting layer EL disposed in the third light-emitting area LA3 of the first unit light-emitting area UA1 and the third light-emitting area LA3 of the second unit light-emitting area UA2 may be disposed on the pixel defining film PDL to be disposed between the third light-emitting area LA3 of the first unit light-emitting area UA1 and the third light-emitting area LA3 of the second unit light-emitting area UA2.

[0114] In an embodiment, the hole control layer may be disposed between the anode AE ​​and the light emitting layer EL. The hole control layer may include a hole transport layer and may further include a hole injection layer. The electron control layer may be disposed between the light emitting layer EL and the cathode CE. The electron control layer may include an electron transport layer and may further include an electron injection layer.

[0115] In an embodiment, the encapsulation layer 140 may cover the light emitting element LD. The encapsulation layer 140 may include an inorganic encapsulation layer 141, an organic encapsulation layer 142, and an inorganic encapsulation layer 143 stacked in sequence, but the layers constituting the encapsulation layer 140 are not limited thereto. The inorganic encapsulation layers 141 and 143 may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer, etc. Each of the inorganic encapsulation layers 141 and 143 may have a multilayer structure. The organic encapsulation layer 142 may include an acrylic organic layer, but the present invention is not limited thereto.

[0116] In an embodiment, the input sensor 200 includes a plurality of conductive patterns. The input sensor 200 may include at least one conductive layer (or at least one conductive sensor layer) including a plurality of conductive patterns and at least one insulating layer (or at least one insulating sensor layer). In an embodiment, the input sensor 200 may include a first insulating layer 210 (or a first insulating sensor layer), a first conductive layer 220 (or a first conductive sensor layer), a second insulating layer 230 (or a second insulating sensor layer), a second conductive layer 240 (or a second conductive sensor layer), and a third insulating layer 250 (or a third insulating sensor layer). Figure 5 A plurality of conductive patterns included in each of the first conductive layer 220 and the second conductive layer 240 are briefly illustrated.

[0117] In an embodiment, the first insulating layer 210 may be directly disposed on the display panel 100. The first insulating layer 210 may be an inorganic layer including at least any one of silicon nitride, silicon oxynitride, and silicon oxide. Each of the first conductive layer 220 and the second conductive layer 240 may have a single-layer structure or a multi-layer structure stacked along the third direction DR3. Each of the first conductive layer 220 and the second conductive layer 240 may include a conductive wire defining an electrode having a mesh shape. Depending on their positions, the conductive wires of the first conductive layer 220 and the conductive wires of the second conductive layer 240 may be connected by contact holes penetrating the second insulating layer 230, or may not be connected to each other.

[0118] In an embodiment, the first conductive layer 220 and the second conductive layer 240 having a single-layer structure may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The transparent conductive layer may include an indium tin oxide (ITO), an indium zinc oxide (IZO), a zinc oxide (ZnO x ) or indium zinc tin oxide (IZTO). In addition, the transparent conductive oxide may include a conductive polymer such as PEDOT, a metal nanowire, or graphene.

[0119] In an embodiment, the first conductive layer 220 and the second conductive layer 240 having a multilayer structure may include a metal layer. For example, the metal layer may have a three-layer structure of titanium / aluminum / titanium. The conductive layer of the multilayer structure may include at least one metal layer and at least one transparent conductive layer. The second insulating layer 230 may be disposed between the first conductive layer 220 and the second conductive layer 240. In this specification, the second insulating layer 230 disposed between the first conductive layer 220 and the second conductive layer 240 may be described as an "insulating sensing layer". The third insulating layer 250 may cover the second conductive layer 240. In an embodiment of the present invention, the third insulating layer 250 may be omitted. The second insulating layer 230 and the third insulating layer 250 may include an inorganic layer or an organic layer.

[0120] Fig. 6A is a plan view of an input sensor 200 according to an embodiment. Figure 6B are plan views of some configurations of the input sensor 200 according to the embodiment. Figure 6B Some conductive patterns disposed on the same layer among a plurality of conductive patterns included in the input sensor 200 according to an embodiment are illustrated.

[0121] In the embodiments and as Fig. 6A As shown in FIG. 1 , the input sensor 200 includes a sensing area 200-DA and a non-sensing area 200-NDA disposed adjacent to the sensing area 200-DA. The sensing area 200-DA and the non-sensing area 200-NDA are respectively Figure 3 The display area 100 -DA and the non-display area 100 -NDA shown in the figure correspond to each other.

[0122] In an embodiment, the input sensor 200 includes the above-mentioned plurality of conductive patterns. The plurality of conductive patterns include a first sensing electrode SE1 (or a first sensing electrode), a second sensing electrode SE2 (or a second sensing electrode), a first signal line SL1 (or a first sensor signal line), and a second signal line SL2 (or a second sensor signal line).

[0123] In an embodiment, a first sensing electrode SE1 and a second sensing electrode SE2 that cross each other are arranged in a sensing area 200-DA. A first signal line SL1 connected to the first sensing electrode SE1 and a second signal line SL2 electrically connected to the second sensing electrode SE2 are arranged in a non-sensing area 200-NDA. Any one of the first signal line SL1 and the second signal line SL2 transmits a driving signal for sensing an external input from an external circuit to a corresponding electrode, and the other outputs a sensing signal. A change in capacitance between the first sensing electrode SE1 and the second sensing electrode SE2 is measured based on the sensing signal. In an embodiment, an input sensor with a mutual capacitance method is exemplarily illustrated, but the present invention is not limited thereto, and an input sensor with a self-capacitance method may be applied. An input sensor with a self-capacitance method may include a type of sensing electrode.

[0124] In an embodiment, the first sensing electrodes SE1 may be provided in a plurality of rows. The first sensing electrodes SE1 may include a first row sensing electrode E1-1, a second row sensing electrode E1-2, a third row sensing electrode E1-3, and a fourth row sensing electrode E1-4. Fig. 6A Different from that shown in FIG. 1 , in another embodiment, the first sensing electrode SE1 may include sensing electrodes having two rows, three rows, or five or more rows.

[0125] In an embodiment, the second sensing electrodes SE2 may be provided in a plurality of columns. The second sensing electrodes SE2 may include a first column sensing electrode E2-1, a second column sensing electrode E2-2, a third column sensing electrode E2-3, a fourth column sensing electrode E2-4, a fifth column sensing electrode E2-5, a sixth column sensing electrode E2-6, and a seventh column sensing electrode E2-7. Fig. 6A Different from that shown in FIG. 1 , in another embodiment, the second sensing electrode SE2 may include sensing electrodes having six columns or less or eight columns or more.

[0126] In an embodiment, the second sensing electrode SE2 may include a second sensing pattern SP2 and a connection pattern CP2. The second sensing pattern SP2 may have a larger area than the connection pattern CP2 and may have a rhombus shape. The connection patterns CP2 are each disposed between two adjacent second sensing patterns SP2 in the second sensing patterns SP2. The connection pattern CP2 may have a relatively shorter length than the second sensing pattern SP2.

[0127] In an embodiment, each of the first sensing electrodes SE1 may include a first sensing pattern SP1 and a bridge pattern CP1. Two adjacent first sensing patterns SP1 may be connected to each other by two bridge patterns CP1, but the number of bridge patterns CP1 connecting each of the two adjacent first sensing patterns SP1 is not limited thereto.

[0128] In an embodiment, Fig. 6A Each of the first signal line SL1 and the second signal line SL2 in the Figure 5 However, the present invention is not limited thereto, and each of the first signal line SL1 and the second signal line SL2 may be formed by the second conductive layer 240. The first signal line SL1 and the second signal line SL2 may have a double line structure including all of a line formed by the first conductive layer 220 and a line formed by the second conductive layer 240.

[0129] In the examples and with reference to Fig. 6A and Figure 6B , the first sensing pattern SP1 and the second sensing electrode SE2 may be disposed on the same layer. The bridge pattern CP1 may be disposed on a different layer from the first sensing pattern SP1 and the second sensing electrode SE2. In the input sensor 200, according to an embodiment, the bridge pattern CP1 may be included in Figure 5In the first conductive layer 220 described in the embodiment and disposed on the first insulating layer 210, the first sensing pattern SP1 and the second sensing electrode SE2 may be included in the second conductive layer 240 and disposed on the second insulating layer 230. In another embodiment, the bridge pattern CP1 may be included in the second conductive layer 240 and disposed on the second insulating layer 230, and the first sensing pattern SP1 and the second sensing electrode SE2 may be included in the first conductive layer 220 and disposed on the first insulating layer 210. Meanwhile, although not described in Figure 6B Although not shown in detail in FIG. 1 , some of the bridge patterns CP1 may be disposed on the same layer as the first sensing patterns SP1 and the second sensing electrodes SE2. Figure 8 The shape and layer structure of the bridge pattern CP1 are described in detail in .

[0130] In an embodiment, Figure 6B As shown in FIG. 1 , each of the first sensing electrode SE1 and the second sensing electrode SE2 may have a grid shape in which a plurality of opening areas are defined. For example, the plurality of opening areas may overlap with corresponding light emitting areas of the plurality of light emitting areas LA1, LA2, and LA3. The second sensing electrode SE2 crosses the first sensing electrode SE1. Figure 7 , Figure 8 The mesh shape of each of the first sensing electrode SE1 and the second sensing electrode SE2 is described in .

[0131] In the embodiment, any one of the first sensing electrode SE1 and the second sensing electrode SE2 may have an integral shape. In the embodiment, the second sensing electrode SE2 having an integral shape is exemplarily illustrated.

[0132] Figure 7 is an enlarged plan view of a portion of an input sensor according to an embodiment. Figure 8 is an enlarged plan view of a portion of an input sensor according to an embodiment. Figure 7 The enlarged view in the figure shows the Fig. 6A The portion corresponding to area AA' shown in the figure. Figure 8 The enlarged view in the figure shows the Fig. 6A The portion corresponding to area BB' shown in the figure.

[0133] In the embodiments and together with reference Fig. 6A and Figure 7 , a plurality of open areas EOP1 , EOP2 , and EOP3 may be defined in each of the first sensing patterns SP1 .

[0134] In an embodiment, the plurality of opening areas EOP1, EOP2, and EOP3 may include a first opening area EOP1 corresponding to (or overlapping) the first light emitting area LA1, a second opening area EOP2 corresponding to the second light emitting area LA2, and a third opening area EOP3 corresponding to the third light emitting area LA3. In this specification, a pixel column in which the first light emitting area LA1 and the second light emitting area LA2 are alternately arranged along the second direction DR2 may be referred to as a first unit pixel column PXC-1. A pixel column in which the third light emitting area LA3 is arranged along the second direction DR2 may be referred to as a second pixel column PXC-2.

[0135] In an embodiment, the first light emitting area LA1 may be disposed inside the first opening area EOP1, and the second light emitting area LA2 may be disposed inside the second opening area EOP2. The third light emitting area LA3 may be disposed inside the third opening area EOP3. Meanwhile, in another embodiment, two third light emitting areas LA3 may be disposed inside the third opening area EOP3.

[0136] In an embodiment, each of the first sensing patterns SP1 may include a plurality of grid lines ML defining a plurality of opening areas EOP1, EOP2, and EOP3. The plurality of grid lines ML may include a first grid line ML1, a second grid line ML2, and a third grid line ML3. The first grid line ML1 may extend in the second direction DR2. The second grid line ML2 and the third grid line ML3 may each extend in the first direction DR1. Meanwhile, the second grid line ML2 may be a line component pointing parallel to the first opening area EOP1 and the second opening area EOP2 in the second direction DR2, and the third grid line ML3 may be a line component pointing parallel to the third opening area EOP3 in the second direction DR2. Meanwhile, the first grid line ML1, the second grid line ML2, and the third grid line ML3 may have the same thickness. However, the present invention is not limited thereto, and any one of the grid lines ML may be thicker than the other grid lines ML. For example, the first grid line ML1 and the second grid line ML2 may each have a first thickness, and the third grid line ML3 may have a second thickness greater than the first thickness.

[0137] In an embodiment, the plurality of opening areas EOP1, EOP2, and EOP3 may each have a larger plane area than the overlapping light-emitting areas. For example, the plane area of ​​the first opening area EOP1 may be larger than the area of ​​the first light-emitting area LA1, the plane area of ​​the second opening area EOP2 may be larger than the area of ​​the second light-emitting area LA2, and the plane area of ​​the third opening area EOP3 may be larger than the area of ​​the third light-emitting area LA3. Therefore, the plurality of grid lines ML defining the plurality of opening areas EOP1, EOP2, and EOP3 may not reduce the light-emitting efficiency of the light-emitting areas LA1, LA2, and LA3.

[0138] In an embodiment, the arrangement and shape of the first to third grid lines ML1, ML2 and ML3 may be variously changed according to the arrangement and plane area of ​​the plurality of opening areas EOP1, EOP2 and EOP3 defined in the grid lines ML. In addition, the arrangement and plane area of ​​the plurality of opening areas EOP1, EOP2 and EOP3 may be variously changed according to the arrangement and area of ​​the corresponding light emitting areas LA1, LA2 and LA3.

[0139] In the embodiment and for the convenience of description, the first to third grid lines ML1, ML2 and ML3 are described separately, but the first to third grid lines ML1, ML2 and ML3 can be connected to each other to have an integral shape. That is, the first to third grid lines ML1, ML2 and ML3 can be formed by patterning a plurality of opening areas EOP1, EOP2 and EOP3 on the integral conductive layer. In addition, Figure 7 The open areas EOP1 , EOP2 , and EOP3 defined in the first sensing pattern SP1 and the mesh lines ML defining the open areas EOP1 , EOP2 , and EOP3 are exemplarily illustrated, but the open areas EOP1 , EOP2 , and EOP3 and the mesh lines ML having the same shape may be included in the second sensing pattern SP2 .

[0140] In the examples and with reference to FIG. 6A to FIG. 8 The input sensor 200 includes a plurality of conductive patterns, and the plurality of conductive patterns include a first sensing electrode SE1 and a second sensing electrode SE2. The first sensing electrode SE1 includes a first sensing pattern SP1 and a bridge pattern CP1. The second sensing electrode SE2 may include a second sensing pattern SP2 and a connection pattern CP2. Figure 8 Enlarged plan shapes of the 1-1th sensing pattern SP1-1, the 1-2th sensing pattern SP1-2, and the bridge pattern CP1 included in the first sensing electrode SE1 and the connection pattern CP2 included in the second sensing electrode SE2 are illustrated.

[0141] In an embodiment, in the input sensor 200, a boundary portion CTL may be defined between the first sensing pattern SP1 and the second sensing electrode SE2. The boundary portion CTL may be a portion where the mesh line ML is at least partially removed. The boundary portion CTL may be provided to insulate the first sensing pattern SP1 and the second sensing electrode SE2 from each other.

[0142] In an embodiment, each of the second sensing patterns SP2 and the connection pattern CP2 included in the second sensing electrode SE2 may include a mesh line ML and may have an integral shape. The connection pattern CP2 may be disposed between two adjacent second sensing patterns SP2 and may have an integral shape with each of the two second sensing patterns SP2. Fig. 6A Each of the plurality of second sensing patterns SP2 and the connection pattern CP2 illustrated in FIG. 5 may include the mesh line ML, and two adjacent second sensing patterns SP2 and the connection pattern CP2 among the second sensing patterns SP2 may have an integral shape.

[0143] In an embodiment, the input sensor 200 may further include a plurality of dummy patterns DMP. The plurality of dummy patterns DMP may be provided in plurality and may be disposed in the entire sensing area 200-DA. Each of the dummy patterns DMP may at least partially overlap the first sensing electrode SE1 and the second sensing electrode SE2 on a plane. Each of the dummy patterns DMP may at least partially overlap the first sensing pattern SP1, the second sensing pattern SP2, and the connection pattern CP2 on a plane. Since in the input sensor according to the embodiment, the dummy pattern DMP corresponding to the bridge pattern is provided to the entire sensing area, it is possible to prevent the limitation that only the portion in which the bridge pattern CP1 is provided has an abnormally high reflectivity, thereby preventing a malfunction that is partially bright when viewed from the outside.

[0144] In an embodiment, the bridge pattern CP1 electrically connects two adjacent first sensing patterns SP1. The bridge pattern CP1 overlaps the first contact hole CH1 on a plane, and electrically connects the two adjacent first sensing patterns SP1 through the first contact hole CH1.

[0145] In an embodiment, two adjacent first sensing patterns SP1 may be connected by two bridge patterns CP1. The bridge pattern CP1 may connect the 1-1st sensing pattern SP1-1 and the 1-2nd sensing pattern SP1-2 disposed adjacent to each other. Figure 8As illustrated in FIG. 1 , the bridge pattern CP1 may include a first sub-bridge pattern CP1-a and a second sub-bridge pattern CP1-b connecting the 1-1st sensing pattern SP1-1 and the 1-2nd sensing pattern SP1-2 disposed adjacent to each other in the first direction DR1. The first sub-bridge pattern CP1-a and the second sub-bridge pattern CP1-b may be spaced apart from each other along the second direction DR2. The first sub-bridge pattern CP1-a and the second sub-bridge pattern CP1-b may each overlap with the connection pattern CP2 of the second sensing electrode SE2. The first sub-bridge pattern CP1-a and the second sub-bridge pattern CP1-b may include first bridge patterns CP1-1a and CP1-1b and second bridge patterns CP1-2a and CP1-2b, respectively, which will be described later. Each of the first sub-bridge pattern CP1-a and the second sub-bridge pattern CP1-b may further include a third bridge pattern CP1-3, which will be described later.

[0146] In an embodiment, the bridge pattern CP1 includes first bridge patterns CP1-1a and CP1-1b overlapping the first contact hole CH1 and second bridge patterns CP1-2a and CP1-2b overlapping the second contact hole CH2. The first bridge patterns CP1-1a and CP1-1b overlap the first contact hole CH1 and the second contact hole CH2.

[0147] In an embodiment, the first bridge patterns CP1-1a and CP1-1b overlap the first contact hole CH1 and are connected to any one corresponding to the first sensing pattern SP1 through the first contact hole CH1. The first bridge patterns CP1-1a and CP1-1b partially overlap the first sensing pattern SP1. The first bridge patterns CP1-1a and CP1-1b may partially overlap the boundary portion CTL defined between the first sensing electrode SE1 and the second sensing electrode SE2. The first bridge patterns CP1-1a and CP1-1b may have a rod shape extending along the first direction DR1.

[0148] In an embodiment, the first bridge pattern CP1-1a and CP1-1b may include a 1-1th bridge pattern CP1-1a and a 1-2th bridge pattern CP1-1b. The 1-1th bridge pattern CP1-1a may be connected to the 1-1th sensing pattern SP1-1 through a first contact hole CH1, and the 1-2th bridge pattern CP1-1b may be connected to the 1-2nd sensing pattern SP1-2 through a first contact hole CH1. The 1-1th bridge pattern CP1-1a and the 1-2nd bridge pattern CP1-1b may be spaced apart from each other on a plane. The 1-1th bridge pattern CP1-1a and the 1-2nd bridge pattern CP1-1b may be spaced apart from each other on a plane, but may be electrically connected through second bridge patterns CP1-2a and CP1-2b and a third bridge pattern CP1-3 to be described later.

[0149] In an embodiment, the second bridge patterns CP1-2a and CP1-2b overlap with the second contact hole CH2 and are connected to the first bridge patterns CP1-1a and CP1-1b through the second contact hole CH2. The second bridge patterns CP1-2a and CP1-2b may include a 2-1st bridge pattern CP1-2a and a 2-2nd bridge pattern CP1-2b. The 2-1st bridge pattern CP1-2a may be connected to the 1-1st bridge pattern CP1-1a through the second contact hole CH2, and the 2-2nd bridge pattern CP1-2b may be connected to the 1-2nd bridge pattern CP1-1b through the second contact hole CH2. The second bridge patterns CP1-2a and CP1-2b may extend along the second direction DR2. The second bridge patterns CP1-2a and CP1-2b may have a grid line structure including a main portion extending along the second direction DR2 and a protruding portion protruding from the main portion along the first direction DR1.

[0150] In an embodiment, the 2-1st bridge pattern CP1-2a and the 2-2nd bridge pattern CP1-2b may be spaced apart from each other on a plane. The 2-1st bridge pattern CP1-2a and the 2-2nd bridge pattern CP1-2b may be spaced apart from each other on a plane, but may be electrically connected to each other through a third bridge pattern CP1-3 to be described later.

[0151] In an embodiment, the bridge pattern CP1 may further include a third bridge pattern CP1-3 overlapping the third contact hole CH3. The third bridge pattern CP1-3 may at least partially overlap the second bridge patterns CP1-2a and CP1-2b, and may be at least partially connected to the second bridge patterns CP1-2a and CP1-2b through the third contact hole CH3. The third bridge pattern CP1-3 may be connected to at least one of the 2-1st bridge pattern CP1-2a and the 2-2nd bridge pattern CP1-2b. In an embodiment, the third bridge pattern CP1-3 may be connected to each of the 2-1st bridge pattern CP1-2a and the 2-2nd bridge pattern CP1-2b through the third contact hole CH3. The third bridge pattern CP1-3 may have a rod shape extending along the first direction DR1.

[0152] In an embodiment, the third bridge pattern CP1-3 may overlap the second sensing electrode SE2 on a plane. The third bridge pattern CP1-3 may overlap the connection pattern CP2 included in the second sensing electrode SE2 on a plane.

[0153] Fig. 9A and Fig. 9B 2 is a plan view illustrating some configurations of an input sensor according to an embodiment. Fig. 9A and Fig. 9BEach of them respectively illustrates a conductive pattern disposed at a different layer among a plurality of conductive patterns included in an input sensor according to an embodiment.

[0154] In the embodiments and together with reference Figure 8 , Fig. 9A and Fig. 9B , the second bridge patterns CP1-2a and CP1-2b of the plurality of conductive patterns, the first sensing pattern SP1, and the second sensing electrode SE2 may be disposed on the same layer. The first bridge patterns CP1-1a and CP1-1b, the third bridge pattern CP1-3, and the dummy pattern DMP of the plurality of conductive patterns may be disposed on the same layer. For example, the first bridge patterns CP1-1a and CP1-1b, the third bridge pattern CP1-3, and the dummy pattern DMP may be included in Figure 5 2 and disposed on the first insulating layer 210, and the second bridge patterns CP1-2a and CP1-2b, the first sensing pattern SP1, and the second sensing electrode SE2 may be included in the second conductive layer 240 and disposed on the second insulating layer 230. In another embodiment, the first bridge patterns CP1-1a and CP1-1b, the third bridge pattern CP1-3, and the dummy pattern DMP may be included in the second conductive layer 240 and disposed on the second insulating layer 230, and the second bridge patterns CP1-2a and CP1-2b, the first sensing pattern SP1, and the second sensing electrode SE2 may be included in the first conductive layer 220 and disposed on the first insulating layer 210.

[0155] In the embodiments and as Fig. 9AAs shown in FIG. 1 , the second bridge patterns CP1-2a and CP1-2b may be disposed at the same layer as the second sensing electrode SE2, and may be disposed adjacent to the second sensing electrode SE2. The second bridge patterns CP1-2a and CP1-2b may be disposed adjacent to the connection pattern CP2 included in the second sensing electrode SE2. The second bridge patterns CP1-2a and CP1-2b may include mesh lines ML and connection patterns CP2, and a cutting portion SPP may be defined between the second bridge patterns CP1-2a and CP1-2b and the connection pattern CP2. The second bridge patterns CP1-2a and CP1-2b and the connection pattern CP2 may be spaced apart from each other and the cutting portion SPP may be disposed between the second bridge patterns CP1-2a and CP1-2b and the connection pattern CP2. Meanwhile, after being formed in the form of a single layer having an integral shape at the same layer, the second bridge patterns CP1-2a and CP1-2b and the connection pattern CP2 may be patterned in an operation of forming the mesh line ML by a patterning process to be spaced apart from each other and a cutting portion SPP is disposed between the second bridge patterns CP1-2a and CP1-2b and the connection pattern CP2. The cutting portion SPP may be a portion in which the mesh line ML is at least partially removed. The cutting portion SPP may be provided to insulate the second bridge patterns CP1-2a and CP1-2b and the connection pattern CP2 from each other.

[0156] In an embodiment, a boundary portion CTL may be defined between the first sensing pattern SP1 and the second sensing electrode SE2. The boundary portion CTL may be a portion where the mesh line ML is at least partially removed. The boundary portion CTL may be provided to insulate the first sensing pattern SP1 and the second sensing electrode SE2 from each other.

[0157] In an embodiment, the dummy pattern DMP may at least partially overlap the first sensing electrode SE1 and the second sensing electrode SE2 on a plane. The dummy pattern DMP may overlap any one of the first sensing pattern SP1 and the second sensing pattern SP2 on a plane. In another embodiment, the dummy pattern DMP may overlap the connection pattern CP2 on a plane. The dummy pattern DMP may include a first dummy pattern DMP1 overlapping the first sensing pattern SP1 and a second dummy pattern DMP2 overlapping the second sensing electrode SE2. Meanwhile, although not shown, the dummy pattern DMP may partially overlap the boundary portion CTL.

[0158] In an embodiment, the first bridge patterns CP1-1a and CP1-1b, the third bridge pattern CP1-3, and the dummy pattern DMP may be disposed on the same layer. The first bridge patterns CP1-1a and CP1-1b, the third bridge pattern CP1-3, and the dummy pattern DMP may each have substantially the same shape on a plane, and may be disposed to be spaced apart from each other at a constant interval. Fig. 9B As illustrated in FIG. 1 , the first bridge patterns CP1-1a and CP1-1b, the third bridge pattern CP1-3, and the dummy pattern DMP may each have substantially the same length in the first direction DR1. Meanwhile, the wording “substantially the same” in this specification includes not only a case where the shapes, lengths, etc. thereof are physically the same, but also a case where, despite the same design, there is a difference equal to an error occurring during a process.

[0159] In an embodiment, the length d1 of the first bridge patterns CP1-1a and CP1-1b may be substantially the same as the length d2 of the third bridge pattern CP1-3, and the length d1 of the first bridge patterns CP1-1a and CP1-1b may be substantially the same as the length d3 of the dummy patterns DMP1 and DMP2. In addition, the first bridge patterns CP1-1a and CP1-1b, the third bridge pattern CP1-3, and the dummy pattern DMP may each be arranged at a constant interval with other adjacent patterns in each of the first direction DR1 and the second direction DR2. In an embodiment, the first bridge patterns CP1-1a and CP1-1b, the third bridge pattern CP1-3, and the dummy pattern DMP may each be arranged at a distance from other adjacent patterns in each of the first direction DR1 and the second direction DR2 to have a constant interval.

[0160] FIG. 10A to FIG. 10C is a cross-sectional view of a portion of an input sensor according to an embodiment. Fig. 10A Graphics and Figure 8 The cross section corresponding to the line II-II' shown in the figure. Fig. 10B Graphics and Figure 8 The cross section corresponding to the line III-III' shown in the figure. Fig. 10C Graphics and Figure 8 The cross section corresponding to the line IV-IV' shown in FIG.

[0161] In the examples and with reference to Figures 8 to 10C, the first bridge patterns CP1-1a and CP1-1b and the third bridge pattern CP1-3 may be disposed on a first layer, and the second bridge patterns CP1-2a and CP1-2b, the first sensing pattern SP1, and the connection pattern CP2 may be disposed on a second layer different from the first layer. The first bridge patterns CP1-1a and CP1-1b and the third bridge pattern CP1-3 may be included in Figure 5 The first conductive layer 220 described in the embodiment of the present invention is disposed on the first insulating layer 210 , and the second bridge patterns CP1 - 2 a and CP1 - 2 b , the first sensing pattern SP1 , and the connection pattern CP2 may be included in the second conductive layer 240 and disposed on the second insulating layer 230 . FIG. 10A to FIG. 10C Each exemplarily illustrates an arrangement relationship on a cross section of a 1-1th sensing pattern SP1 of the first sensing pattern SP1, a 1-1th bridge pattern CP1-1a of the first bridge patterns CP1-1a and CP1-1b, a 2-1th bridge pattern CP1-2a of the second bridge patterns CP1-2a and CP1-2b, a third bridge pattern CP1-3, and a 2-2nd bridge pattern CP1-2b of the second bridge patterns CP1-2a and CP1-2b, but a similar description may be applied to the cross sections not shown in FIG. FIG. 10A to FIG. 10C 1-2 of the first sensing pattern SP1 and the 1-2 of the first bridge patterns CP1-1a and CP1-1b are shown in FIG.

[0162] In an embodiment, although not shown, the first conductive layer 220 and the second conductive layer 240 may each have a three-layer conductive material structure. The first conductive layer 220 and the second conductive layer 240 may each have a thick metal layer with low resistance and a transparent conductive oxide layer disposed on and below the metal layer. The transparent conductive oxide layer may have a lower reflectivity, a low conductivity, and a small thickness than the metal layer. The metal layer with low resistance may substantially correspond to the signal movement path, and the transparent conductive oxide layer with lower reflectivity may cover the metal layer to reduce the external light reflectivity. According to an embodiment, in the input sensor 200, a plurality of conductive patterns may be disposed in a small area on a plane by increasing the thickness via a three-layer structure.

[0163] In the examples and with reference to Figure 8 and Fig. 10A , the 1-1th sensing pattern SP1-1 included in the first sensing electrode SE1 may be electrically connected to the 1-1th bridge pattern CP1-1a through the first contact hole CH1. The first contact hole CH1 may penetrate the second insulating layer 230. The 1-1th sensing pattern SP1-1 disposed on the second insulating layer 230 may be electrically connected to the 1-1th bridge pattern CP1-1a through the first contact hole CH1.

[0164] In an embodiment, the 1-1th bridge pattern CP1-1a may be electrically connected to the 2-1th bridge pattern CP1-2a through the second contact hole CH2. The second contact hole CH2 may penetrate the second insulating layer 230. The 2-1th bridge pattern CP1-2a disposed on the second insulating layer 230 may be electrically connected to the 1-1th bridge pattern CP1-1a through the second contact hole CH2.

[0165] In an embodiment, the 1-1st sensing pattern SP1-1, the connection pattern CP2, and the 2-1st bridge pattern CP1-2a disposed in the same layer may be spaced apart to be insulated from each other. A boundary portion CTL may be defined between the 1-1st sensing pattern SP1-1 and the connection pattern CP2, and a cutting portion SPP may be defined between the connection pattern CP2 and the 2-1st bridge pattern CP1-2a. The 1-1st sensing pattern SP1-1 and the connection pattern CP2 may be insulated from each other by the boundary portion CTL, and the connection pattern CP2 and the 2-1st bridge pattern CP1-2a may be insulated from each other by the cutting portion SPP.

[0166] In the examples and with reference to Figure 8 and Fig. 10B , the 1-1 bridge pattern CP1-1a may be electrically connected to the 2-1 bridge pattern CP1-2a through the second contact hole CH2. The second contact hole CH2 may penetrate the second insulating layer 230. The 2-1 bridge pattern CP1-2a disposed on the second insulating layer 230 may be electrically connected to the 1-1 bridge pattern CP1-1a through the second contact hole CH2.

[0167] In an embodiment, the 2-1st bridge pattern CP1-2a may be electrically connected to the third bridge pattern CP1-3 through the third contact hole CH3. The third contact hole CH3 may penetrate the second insulating layer 230. The 2-1st bridge pattern CP1-2a disposed on the second insulating layer 230 may be electrically connected to the third bridge pattern CP1-3 through the third contact hole CH3.

[0168] In an embodiment, the connection pattern CP2 and the 2-1st bridge pattern CP1-2a disposed on the same layer may be spaced apart to be insulated from each other. A cutting portion SPP may be defined between the connection pattern CP2 and the 2-1st bridge pattern CP1-2a. The connection pattern CP2 and the 2-1st bridge pattern CP1-2a may be insulated from each other by the cutting portion SPP.

[0169] In the examples and with reference to Figure 8 and Fig. 10C, the 2-1st bridge pattern CP1-2a may be electrically connected to the third bridge pattern CP1-3 through the third contact hole CH3. The third contact hole CH3 may penetrate the second insulating layer 230. The 2-1st bridge pattern CP1-2a disposed on the second insulating layer 230 may be electrically connected to the third bridge pattern CP1-3 through the third contact hole CH3.

[0170] In an embodiment, the 2-2nd bridge pattern CP1-2b may be electrically connected to the third bridge pattern CP1-3 through the third contact hole CH3. The third contact hole CH3 may penetrate the second insulating layer 230. The 2-2nd bridge pattern CP1-2b disposed on the second insulating layer 230 may be electrically connected to the third bridge pattern CP1-3 through the third contact hole CH3.

[0171] In an embodiment, the connection pattern CP2, the 2-1st bridge pattern CP1-2a, and the 2-2nd bridge pattern CP1-2b disposed on the same layer may be spaced apart to be insulated from each other. A cutting portion SPP may be defined between the connection pattern CP2 and the 2-1st bridge pattern CP1-2a and between the connection pattern CP2 and the 2-2nd bridge pattern CP1-2b. The connection pattern CP2 and the 2-1st bridge pattern CP1-2a may be insulated from each other by the cutting portion SPP, and the connection pattern CP2 and the 2-2nd bridge pattern CP1-2b may be insulated from each other by the cutting portion SPP.

[0172] According to an embodiment, in the input sensor, the bridge pattern connecting the first sensing pattern includes a first bridge pattern connected to the first sensing pattern through a first contact hole and a second bridge pattern connected to the first bridge pattern through a second contact hole. According to an embodiment, in the input sensor, the bridge pattern may have a structure including the first bridge pattern and the second bridge pattern disposed at different layers, thereby preventing a malfunction in which the bridge pattern is viewed from the outside.

[0173] Unlike the input sensor, according to the embodiment, in the case where the bridge pattern connecting the first sensing pattern does not include the first bridge pattern and the second bridge pattern and the first sensing pattern is connected only by the first bridge pattern provided in a layer different therefrom, the first bridge pattern can be formed to be long so as to have a shape different from the plurality of dummy patterns included in the input sensor. In addition, since the bridge pattern has a shape different from the dummy pattern, it may be difficult to arrange the bridge pattern and the dummy pattern at the same interval. In this case, there may be a limitation that the first bridge pattern extending long is viewed from the outside.

[0174] According to an embodiment, in an input sensor, since a bridge pattern connecting a first sensing pattern has a shape including a first bridge pattern directly connected to the first sensing pattern and a second bridge pattern provided at a different layer from the first bridge pattern, the first bridge pattern may have the same shape as a dummy pattern, and the first bridge pattern, the third bridge pattern, and the dummy pattern may be arranged at a constant interval. Accordingly, a conductive pattern having three layers consisting of a portion where the first bridge pattern and the sensing pattern overlap each other, a portion where the dummy pattern and the sensing electrode overlap each other, and a portion where the third bridge pattern and the sensing electrode overlap each other may be provided at a constant shape and interval, thereby preventing a malfunction in which only a portion of the input sensor is viewed from the outside as bright. In addition, the visibility and reliability of a display device including the input sensor may be improved.

[0175] Fig.11 is an enlarged plan view of a portion of an input sensor according to an embodiment. Fig.11 In the figure, it is shown that Fig. 6A The portion corresponding to the area BB' shown in the figure is used as an enlarged view. Fig.11 The diagram shows a difference from Figure 8 The input sensor of the embodiment illustrated in FIG. 1 , according to another embodiment of the input sensor, and hereinafter, will be described Fig.11 The input sensor shown in the figure is Figure 8 The differences between the input sensors shown in the figure.

[0176] In the examples and with reference to Fig.11 In the input sensor, the bridge pattern CP1' electrically connects two adjacent first sensing patterns SP1. The bridge pattern CP1' overlaps the first contact hole CH1 on a plane and electrically connects the two adjacent first sensing patterns SP1 through the first contact hole CH1.

[0177] In an embodiment, the bridge pattern CP1' includes first bridge patterns CP1-1a and CP1-1b overlapping the first contact hole CH1 and second bridge patterns CP1-2a' and CP1-2b' overlapping the second contact hole CH2. The first bridge patterns CP1-1a and CP1-1b overlap the first contact hole CH1 and the second contact hole CH2. Figure 8 Different from the bridge pattern CP1 shown in FIG. 1 , in another embodiment, the bridge pattern CP1 ′ may not include the third bridge pattern CP1 - 3 .

[0178] In an embodiment, the first bridge patterns CP1-1a and CP1-1b overlap the first contact hole CH1 and are connected to any one corresponding to the first sensing pattern SP1 through the first contact hole CH1. The first bridge patterns CP1-1a and CP1-1b partially overlap the first sensing pattern SP1. The first bridge patterns CP1-1a and CP1-1b partially overlap the boundary portion CTL defined between the first sensing electrode SE1 and the second sensing electrode SE2. The first bridge patterns CP1-1a and CP1-1b may have a rod shape extending along the first direction DR1.

[0179] In an embodiment, the first bridge pattern CP1-1a and CP1-1b may include a 1-1st bridge pattern CP1-1a and a 1-2nd bridge pattern CP1-1b. The 1-1st bridge pattern CP1-1a may be connected to the 1-1st sensing pattern SP1-1 through a first contact hole CH1, and the 1-2nd bridge pattern CP1-1b may be connected to the 1-2nd sensing pattern SP1-2 through a first contact hole CH1. The 1-1st bridge pattern CP1-1a and the 1-2nd bridge pattern CP1-1b may be spaced apart from each other on a plane. The 1-1st bridge pattern CP1-1a and the 1-2nd bridge pattern CP1-1b may be spaced apart from each other on a plane, but may be electrically connected to each other through second bridge patterns CP1-2a' and CP1-2b' to be described later.

[0180] In an embodiment, the second bridge patterns CP1-2a' and CP1-2b' overlap with the second contact hole CH2 and are connected to the first bridge patterns CP1-1a and CP1-1b through the second contact hole CH2. The second bridge patterns CP1-2a' and CP1-2b' may include a 2-1st bridge pattern CP1-2a' and a 2-2nd bridge pattern CP1-2b'. The 2-1st bridge pattern CP1-2a' may be connected to the 1-1st bridge pattern CP1-1a through the second contact hole CH2, and the 2-2nd bridge pattern CP1-2b' may be connected to the 1-2nd bridge pattern CP1-1b through the second contact hole CH2.

[0181] In an embodiment, the second bridge patterns CP1-2a' and CP1-2b' may extend along the second direction DR2. The second bridge patterns CP1-2a' and CP1-2b' may have a grid line structure including a main portion extending along the second direction DR2 and a protruding portion protruding from the main portion along the first direction DR1.

[0182] In an embodiment, the second bridge patterns CP1-2a' and CP1-2b' may include a mesh line ML and a connection pattern CP2, and a cutting portion SPP may be defined between the second bridge patterns CP1-2a' and CP1-2b' and the connection pattern CP2. The second bridge patterns CP1-2a' and CP1-2b' and the connection pattern CP2 may be spaced apart from each other and the cutting portion SPP is disposed between the second bridge patterns CP1-2a' and CP1-2b' and the connection pattern CP2. Meanwhile, after being formed in the form of a single layer having an integral shape at the same layer, the second bridge patterns CP1-2a' and CP1-2b' and the connection pattern CP2 may be patterned in an operation of forming the mesh line ML by a patterning process to be spaced apart from each other and the cutting portion SPP is disposed between the second bridge patterns CP1-2a' and CP1-2b' and the connection pattern CP2. The cutting portion SPP may be a portion where the mesh line ML is at least partially removed. The cutting portion SPP may be provided to insulate the second bridge patterns CP1-2a' and CP1-2b' and the connection pattern CP2 from each other.

[0183] In an embodiment, the 2-1st bridge pattern CP1-2a' and the 2-2nd bridge pattern CP1-2b' may be connected to each other to have an integral shape. Fig.11 In the embodiment, for the convenience of description, the 2-1st bridge pattern CP1-2a' and the 2-2nd bridge pattern CP1-2b' are described separately, but the 2-1st bridge pattern CP1-2a' and the 2-2nd bridge pattern CP1-2b' may be connected to each other to have an integral shape. That is, the 2-1st bridge pattern CP1-2a' and the 2-2nd bridge pattern CP1-2b' may be formed together by patterning a cutting portion SPP for insulation from the connection pattern CP2 on the integral conductive layer.

[0184] In an embodiment, the 2-1st bridge pattern CP1-2a' and the 2-2nd bridge pattern CP1-2b' may include a first extension portion CP1-21 extending along the second direction DR2 and a second extension portion CP1-22 extending along the first direction DR1, respectively. In an embodiment, the first extension portion CP1-21 and the second extension portion CP1-22 may be spaced apart from each other on a plane and may have an integral shape when connected to each other.

[0185] According to the embodiment, a malfunction in which a conductive pattern of an input sensor included in a display device is abnormally and partially viewed from the outside may be prevented, thereby improving visibility of the input sensor including the conductive pattern and the display device including the input sensor.

[0186] In the above, it has been described with reference to the preferred embodiments of the present invention, but it will be understood by those skilled in the art that various modifications and changes may be made to the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention is not limited to the contents described in the detailed description of the specification. In addition, the embodiments or parts of the embodiments may be combined in whole or in part without departing from the scope of the present invention.

Claims

1. A display device, comprising: A display panel including a plurality of light-emitting areas; as well as an input sensor disposed on the display panel and comprising a plurality of conductive patterns, Wherein, the plurality of conductive patterns include: a first sensing electrode including a plurality of first sensing patterns provided along a first direction and a plurality of bridge patterns connecting two adjacent first sensing patterns among the plurality of first sensing patterns; a second sensing electrode spaced apart from the first sensing electrode and including a plurality of second sensing patterns provided along a second direction crossing the first direction; and a plurality of dummy patterns overlapping at least one of the first sensing electrode and the second sensing electrode on a plane, wherein each of the plurality of first sensing patterns and the plurality of second sensing patterns comprises a plurality of grid lines, a plurality of openings overlapping the plurality of light emitting regions are defined in the plurality of grid lines, and Wherein, each of the plurality of bridging patterns comprises: a first bridge pattern connected to a corresponding first sensing pattern among the plurality of first sensing patterns through a first contact hole; and The second bridge pattern is disposed at a different layer from the first bridge pattern and is connected to the first bridge pattern through a second contact hole.

2. The display device according to claim 1, wherein: The plurality of first sensing patterns include a 1-1 sensing pattern and a 1-2 sensing pattern disposed adjacent to the 1-1 sensing pattern along the first direction, The first bridge pattern includes a 1-1 bridge pattern connected to the 1-1 sensing pattern and a 1-2 bridge pattern connected to the 1-2 sensing pattern, and The 1-1th bridge pattern and the 1-2th bridge pattern are spaced apart from each other.

3. The display device according to claim 2, wherein: The second bridge pattern includes a 2-1st bridge pattern connected to the 1-1st bridge pattern and a 2-2nd bridge pattern connected to the 1-2nd bridge pattern.

4. The display device according to claim 3, wherein: The 2-1st bridge pattern and the 2-2nd bridge pattern are connected to each other to form an integrated shape.

5. The display device according to claim 3, wherein: Each of the plurality of bridge patterns further comprises: A third bridge pattern is disposed at a different layer from the second bridge pattern and is connected to at least one of the 2-1 bridge pattern and the 2-2 bridge pattern.

6. The display device according to claim 5, wherein: The third bridge pattern partially overlaps the second sensing electrode on the plane.

7. The display device according to claim 5, wherein: The third bridge pattern is connected to each of the 2-1st bridge pattern and the 2-2nd bridge pattern.

8. The display device according to claim 5, wherein: The third bridge pattern is disposed on the same layer as the first bridge pattern.

9. The display device according to claim 5, wherein: A length of the first bridge pattern in the first direction is the same as a length of the third bridge pattern in the first direction.

10. The display device according to claim 1, wherein: The second bridge pattern is disposed on the same layer as the first sensing pattern and the second sensing pattern.

11. The display device according to claim 10, wherein: The second sensing electrode further comprises: a connecting pattern disposed between two adjacent second sensing patterns among the plurality of second sensing patterns and having an integral shape with the plurality of second sensing patterns, The second bridge pattern is disposed adjacent to the connection pattern, and A cutting portion is defined between the second bridge pattern and the connection pattern.

12. The display device according to claim 1, wherein: The input sensor further includes an insulating sensing layer disposed between the first bridge pattern and the plurality of first sensing patterns, and wherein the first and second contact holes are defined in the insulating sensing layer.

13. The display device according to claim 1, wherein: A boundary portion is defined between the first sensing pattern and the second sensing electrode, and wherein the first bridge pattern partially overlaps the boundary portion.

14. The display device according to claim 1, wherein: A length of the first bridge pattern in the first direction is the same as a length of each of the plurality of dummy patterns in the first direction.

15. The display device according to claim 1, wherein: The first bridge pattern extends in the first direction, and the second bridge pattern extends in the second direction.

16. The display device according to claim 1, wherein: The plurality of first sensing patterns include a 1-1 sensing pattern and a 1-2 sensing pattern disposed adjacent to the 1-1 sensing pattern along the first direction, and The plurality of bridging patterns include: a first sub-bridge pattern, connecting the 1-1 sensing pattern and the 1-2 sensing pattern; and The second sub-bridge pattern connects the 1-1 sensing pattern and the 1-2 sensing pattern.

17. The display device according to any one of claims 1 to 16, wherein: The plurality of light emitting areas include: A first light emitting area configured to emit a first color light; a second light emitting region configured to emit a second color light different from the first color light; and a third light emitting area configured to emit a third color light different from the first color light and the second color light, wherein the first light emitting areas and the second light emitting areas are alternately arranged along the second direction, and The third light emitting area is arranged to be spaced apart from the first light emitting area and the second light emitting area along the first direction.

18. A display device comprising: A display panel including a plurality of light-emitting areas; as well as an input sensor disposed on the display panel and comprising a plurality of conductive patterns, Wherein, the plurality of conductive patterns include: a first sensing electrode including a plurality of first sensing patterns provided along a first direction and a plurality of bridge patterns connecting two adjacent first sensing patterns among the plurality of first sensing patterns; and a second sensing electrode spaced apart from the first sensing electrode and including a plurality of second sensing patterns provided along a second direction crossing the first direction, Each of the plurality of first sensing patterns and the plurality of second sensing patterns includes a plurality of grid lines, and a plurality of openings overlapping the plurality of light emitting regions are defined in the plurality of grid lines. Wherein, each of the plurality of bridging patterns comprises: a first bridge pattern connected to a corresponding first sensing pattern among the plurality of first sensing patterns through a first contact hole and extending along the first direction; and The second bridge pattern is connected to the first bridge pattern through the second contact hole and extends along the second direction.

19. The display device according to claim 18, wherein: The second bridge pattern is disposed on the same layer as the first sensing pattern and the second sensing pattern, and The first bridge pattern and the second bridge pattern are arranged in different layers.

20. A display device, comprising: A display panel including a plurality of light-emitting areas; as well as an input sensor disposed on the display panel and comprising a plurality of conductive patterns, Wherein, the plurality of conductive patterns include: a first sensing electrode including a plurality of first sensing patterns provided along a first direction and a plurality of bridge patterns connecting two adjacent first sensing patterns among the plurality of first sensing patterns; and a second sensing electrode spaced apart from the first sensing electrode and including a plurality of second sensing patterns provided along a second direction crossing the first direction, Each of the plurality of first sensing patterns and the plurality of second sensing patterns includes a plurality of grid lines, and a plurality of openings overlapping the plurality of light emitting regions are defined in the plurality of grid lines. Wherein, each of the plurality of bridging patterns comprises: a first bridge pattern connected to a corresponding first sensing pattern among the plurality of first sensing patterns through a first contact hole; and a second bridge pattern, which is at least partially disposed at the same layer as the second sensing electrode and is connected to the first bridge pattern through a second contact hole, and A cutting portion is defined between the second bridge pattern and the second sensing electrode.

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