Display device

Abstract

A display device includes: a display panel including a main area and a sub-area, where the sub-area is curved and extends from the main area; a reinforcing member disposed between the main area and the sub-area of the display panel and connected to the display panel; and a circuit component disposed on the reinforcing member.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Korean Patent Application No. 10-2023-0127871 filed on September 25, 2023 and all benefits derived therefrom, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to a display device, and more particularly, to a display device capable of reducing manufacturing costs. Background Art

[0004] An organic light emitting display device includes a display element, such as an organic light emitting diode, whose brightness is changed by electric current. Summary of the invention

[0005] An aspect of the present disclosure is to provide a display device which can reduce manufacturing costs.

[0006] Aspects of the present disclosure are not limited to the above-mentioned aspects, and additional aspects of the present disclosure (not mentioned herein) will be clearly understood by those skilled in the art from the following description of the present disclosure.

[0007] According to one embodiment of the present disclosure, a display device includes: a display panel, including a main area and a sub-area, wherein the sub-area is curved and extends from the main area; a reinforcing member, arranged between the main area and the sub-area of ​​the display panel and connected to the display panel; and a first circuit component, arranged on the reinforcing member.

[0008] In an embodiment, the reinforcement member may be directly connected to the sub-region of the display panel.

[0009] In one embodiment, the reinforcement member may be directly connected to the inner side of the sub-region of the display panel.

[0010] In an embodiment, the sub-region of the display panel may include: a bending region extending from the main region and being bent; and a packaging region extending from the bending region and the second circuit part being disposed on the packaging region.

[0011] In an embodiment, the reinforcement member may be directly connected to the encapsulation area of ​​the display panel.

[0012] In one embodiment, the reinforcement member may be directly connected to the inner side of the encapsulation area of ​​the display panel.

[0013] In an embodiment, the display device may further include a conductive adhesive member that physically and electrically connects the reinforcement member to the encapsulation region of the display panel.

[0014] In an embodiment, the display device may further include a second circuit component disposed in the sub-region of the display panel.

[0015] In an embodiment, the display device may further include an intermediate plate connecting the reinforcement member with the display panel.

[0016] In one embodiment, a first side of the middle plate may be connected to the sub-region of the display panel, and a second side of the middle plate may be connected to the reinforcement member.

[0017] In an embodiment, the sub-area of ​​the display panel may include: a bending area extending from the main area and being bent; and a packaging area extending from the bending area and connected to the middle plate, and the second circuit component is disposed on the packaging area.

[0018] In one embodiment, the first side of the intermediate plate may be connected to the packaging area of ​​the display panel.

[0019] In one embodiment, the first side of the middle plate may be connected to the outer side of the encapsulation area of ​​the display panel.

[0020] In one embodiment, the display device may further include: a first conductive adhesive member physically and electrically connecting the first side of the intermediate plate to the packaging area of ​​the display panel; and a second conductive adhesive member physically and electrically connecting the second side of the intermediate plate to the reinforcing member.

[0021] In an embodiment, one end of the reinforcement member may face the curved region of the display panel extending from the main region and being curved.

[0022] In an embodiment, the reinforcement member may include one of a flexible printed circuit board, a chip on film, and a rigid printed circuit board.

[0023] In one embodiment, the first circuit component on the reinforcement member may include a touch driver and a power supply unit.

[0024] In one embodiment, the display device may further include a display driver disposed on the display panel.

[0025] In one embodiment, the display driver may be disposed on the sub-region of the display panel.

[0026] In an embodiment, the reinforcement member may overlap the display driver in a plan view.

[0027] In the display device according to the present disclosure, the manufacturing cost can be effectively reduced.

[0028] The effects according to the embodiments of the present disclosure are not limited to the above-mentioned effects, and more various effects are included in the following description of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The above and other aspects and features of the present disclosure will become more apparent by describing in detail exemplary embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0030] Figure 1 is a plan view illustrating a display device according to an embodiment;

[0031] Figure 2 For along Figure 1 A cross-sectional view taken along line II';

[0032] Figure 3 As an example Figure 2 A view of a display panel;

[0033] Figure 4 is a plan view illustrating a display device according to another embodiment;

[0034] Figure 5 As an example circuit board from Figure 4 a plan view of the display unit removed;

[0035] Figure 6 For along Figure 4 A cross-sectional view taken along line II-II';

[0036] Figure 7 is a plan view illustrating a display device according to still another embodiment;

[0037] Figure 8 For along Figure 7 A cross-sectional view taken along line III-III';

[0038] Fig. 9 is a plan view illustrating a display device according to still another embodiment;

[0039] Fig.10 For along Fig. 9 A cross-sectional view taken along line IV-IV';

[0040] Fig.11 is a plan view illustrating a display device according to another embodiment;

[0041] Fig.12 For along Fig.11 A cross-sectional view taken along line V-V';

[0042] Fig.13 is a plan view illustrating a display device according to still another embodiment;

[0043] Fig.14 For along Fig.13 A cross-sectional view taken along line VI-VI';

[0044] Fig.15 is a plan view illustrating a display device according to still another embodiment; and

[0045] Fig.16 For along Fig.15 A cross-sectional view taken along line VII-VII'. DETAILED DESCRIPTION

[0046] The present invention will now be described more fully below with reference to the attached drawings showing preferred embodiments of the present invention. However, the present invention may be embodied in different forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art.

[0047] It will also be understood that when a layer or substrate is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers or substrates may also be present. Throughout this specification, like reference numerals refer to like components. In the drawings, the thickness of layers and regions may be exaggerated for clarity.

[0048] Although the terms "first", "second", etc. can be used to describe various elements in this article, these elements should not be limited by these terms. These terms can be used to distinguish one element from another element. Therefore, the first element discussed below can be referred to as the second element without departing from the teaching of one or more embodiments. Describing an element as a "first" element may not require or imply the presence of a second element or other elements. The terms "first", "second", etc. can be used to distinguish between elements of different categories or different sets in this article. For the sake of brevity, the terms "first", "second", etc. can respectively represent "first category (or first set)", "second category (or second set)", etc.

[0049] The features of the various embodiments of the present disclosure may be combined in part or in whole. As will be clearly understood by those skilled in the art, various interactions and operations are technically possible. The various embodiments may be practiced individually or in combination.

[0050] The terms used in this article are only used for the purpose of describing specific embodiments, and are not intended to be restrictive. As used in this article, "a", "an", "said" and "at least one" do not represent quantitative limitations, and are intended to include both singular and plural numbers, unless the context clearly indicates otherwise. For example, "an element" has the same meaning as "at least one element", unless the context clearly indicates otherwise. "At least one" is not interpreted as being limited to "one" or "one". "Or" means "and / or". As used in this article, the term "and / or" includes any and all combinations of one or more related enumerated items. It will be further understood that the terms "comprises" and / or "comprising" or "includes" and / or "including", when used in this specification, indicate that there are narrated features, regions, integers, steps, operations, elements, parts and / or groups thereof, but do not exclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, parts and / or groups thereof. Hereinafter, detailed embodiments will be described with reference to the accompanying drawings.

[0051] Figure 1 is a plan view illustrating a display device according to an embodiment, and Figure 2 For along Figure 1 A cross-sectional view taken along line II'. Figure 1 1 is a rear plan view showing the rear surface of the main area of ​​the display panel 100. As used herein, a "plan view" is a view in the thickness direction of the display device 10 (eg, the third direction DR3).

[0052] See also Figure 1 and Figure 2 , the display device 10 can be applied to portable electronic devices such as mobile phones, smart phones, tablet personal computers (PCs), mobile communication terminals, electronic notebooks, electronic books, portable multimedia players (PMPs), navigators, and ultra mobile personal computers (UMPCs). For example, the display device 10 can be applied to a display unit of a television, a laptop computer, a monitor, a billboard, or an Internet of Things (IoT) device. For another example, the display device 10 can be applied to wearable devices such as smart watches, watch phones, glasses-type displays, and head-mounted displays (HMDs).

[0053] The display device 10 may have a planar shape similar to a rectangular shape. For example, the display device 10 may have a planar shape similar to a rectangular shape having short sides in the first direction DR1 and long sides in the second direction DR2. Corners where the short sides in the first direction DR1 and the long sides in the second direction DR2 intersect may be rounded to have a predetermined curvature or formed at a right angle. The planar shape of the display device 10 may be formed to be similar to other polygonal shapes, a circular shape, or an elliptical shape, without being limited to a rectangular shape.

[0054] The display device 10 may include a display panel 100 , circuit components (eg, a display driver 200 , a touch driver 400 , or a power supply unit 500 ), a circuit board 300 , and an intermediate board 600 .

[0055] The display panel 100 may include a main area MA and a sub-area SBA.

[0056] The main area MA of the display panel 100 may include: a display area DA including pixels for displaying an image; and a non-display area NDA disposed near the display area DA. The display area DA may emit light from a plurality of light-emitting areas or a plurality of opening areas. For example, the display panel 100 may include: a pixel circuit including a switching element; a pixel defining layer defining a light-emitting area or an opening area; and a self-luminous element.

[0057] For example, the self-luminous element may include at least one of: an organic light emitting diode including an organic light emitting layer; a quantum dot light emitting diode (LED) including a quantum dot light emitting layer; an inorganic LED including an inorganic semiconductor; and a micro LED.

[0058] The non-display area NDA may surround the display area DA. The non-display area NDA may be defined as an edge area of ​​the main area MA of the display panel 100. The non-display area NDA may include a gate driver (not shown) for providing a gate signal to a gate line and a fan-out line (not shown) connecting the display driver 200 with the display area DA.

[0059] The sub-area SBA may extend from one side of the main area MA. The sub-area SBA may include a flexible material capable of bending, folding, and / or curling, etc. For example, when the sub-area SBA is bent, the sub-area SBA may overlap with the main area MA in the thickness direction (e.g., the third direction DR3). The sub-area SBA may include a pad portion connected to the circuit board 300 and the display driver 200.

[0060] The sub area SBA may include a bending area 100 a and a packaging area 100 b .

[0061] The bending region 100a may be disposed between the main region MA and the encapsulation region 100b. The bending region 100a may extend from the main region MA and be bent, and the encapsulation region 100b may extend from the bending region 100a. One side of the bending region 100a may contact the main region MA, and the other side of the bending region 100a may contact the encapsulation region 100b. The bending region 100a may have a U-shape (or a U-shaped cross section) that protrudes convexly in the opposite direction of the second direction DR2 in a bent state. The main region MA and the encapsulation region 100b may be connected to each other through the bending region 100a.

[0062] One side of the encapsulation area 100b may be in contact with the bending area 100a. When the display panel 100 is bent, the encapsulation area 100b may be disposed below the main area MA. For example, the encapsulation area 100b may be disposed below the main area MA to overlap with the main area MA in the third direction DR3. In one embodiment, the encapsulation area 100b may overlap with the non-display area NDA between the bending area 100a and a portion of the display area DA in the third direction DR3.

[0063] As described above, the display panel 100 has a curved shape in the curved region 100a, and the curved display panel 100 may have a U-shape (or a U-shaped cross section). The outer surface of the curved display panel 100 on which the screen is displayed is defined as the outer side OS of the display panel 100, and the surface opposite to the outer surface of the display panel 100 is defined as the inner side IS of the display panel 100.

[0064] The display driver 200 may output a signal and a voltage for driving the display panel 100. The display driver 200 may supply a data voltage to a data line of the display panel 100. The display driver 200 may supply a power supply voltage to a power line and supply a gate control signal to a gate driver. The display driver 200 may be formed by an integrated circuit (IC) or include an integrated circuit (IC), and may be packaged on the display panel 100 by a chip on glass (COG) method, a chip on plastic (COP) method, or an ultrasonic bonding method. For example, the display driver 200 may be disposed on the sub-area SBA (e.g., disposed on the encapsulation area 100b of the sub-area SBA), and may overlap with the main area MA in a thickness direction (e.g., a third direction DR3) in a bent state of the sub-area SBA. For another example, the display driver 200 may be packaged on a circuit board 300.

[0065] The intermediate plate 600 may be disposed between the display panel 100 and the circuit board 300. For example, the intermediate plate 600 may be disposed between the encapsulation region 100 b of the display panel 100 and the circuit board 300. The intermediate plate 600 may electrically connect the display panel 100 to the circuit board 300. For example, one side (e.g., the upper surface) of the intermediate plate 600 may be physically and electrically connected to the encapsulation region 100 b of the display panel 100, and the other side (e.g., the lower surface) of the intermediate plate 600 may be physically and electrically connected to the circuit board 300.

[0066] The middle plate 600 may be connected to the display panel 100 through the first conductive adhesive member 701. For example, the first pad portion (or first bump) of the middle plate 600 may be physically and electrically connected to a second pad portion provided in the encapsulation region 100b (e.g., the outer side OS of the encapsulation region 100b) of the display panel 100 through the first conductive adhesive member 701. For example, the first conductive adhesive member 701 may be an anisotropic conductive film (ACF).

[0067] In one embodiment, for example, the middle board 600 may be a printed circuit board (PCB) such as a flexible printed circuit board (FPCB), or a flexible film such as a chip on film (COF).

[0068] The circuit board 300 may be connected to the middle board 600 through the second conductive adhesive member 702. For example, the pad portion (or bump) of the circuit board 300 may be physically and electrically connected to the second pad portion (or second bump) of the middle board 600 through the second conductive adhesive member 702. For example, the second conductive adhesive member 702 may be an anisotropic conductive film.

[0069] In one embodiment, for example, the circuit board 300 may be a printed circuit board (PCB) such as a flexible printed circuit board (FPCB), or a flexible film such as a chip on film (COF).

[0070] In addition, the circuit board 300 may define a through hole 300a that passes through the circuit board 300 in the third direction DR3. For example, the through hole 300a of the circuit board 300 may be defined to correspond to the display driver 200. In other words, the through hole 300a of the circuit board 300 may be arranged to overlap with the display driver 200 in the third direction DR3. Figure 1 In the plan view shown in FIG. 6 , the through hole 300a may surround the display driver 200. When the thickness of the middle plate 600 is small, when the through hole 300a does not exist, the circuit board 300 and the display driver 200 may contact each other. However, in an embodiment, the through hole 300a of the circuit board 300 may prevent the circuit board 300 and the display driver 200 from contacting each other.

[0071] At least a portion of the circuit board 300 may overlap with the sub-area SBA of the display panel 100 in the third direction DR3. For example, in a state where the display panel 100 is bent, at least a portion of the circuit board 300 may overlap with the encapsulation area 100b of the sub-area SBA in the third direction DR3. In one embodiment, the circuit board 300 may overlap with the display driver 200 in the third direction DR3. In one embodiment, a portion of the circuit board 300 that overlaps with the sub-area SBA of the display panel 100 (hereinafter, referred to as the overlapping portion) may have a larger area than a portion of the circuit board 300 that does not overlap with the sub-area SBA of the display panel 100 (hereinafter, referred to as the non-overlapping portion). In other words, the area of ​​the overlapping portion may be greater than the area of ​​the non-overlapping portion. As described above, when the circuit board 300 is set close to the sub-area SBA, the area of ​​the setting area 333 may increase. For example, components such as a frame, a battery, and a camera may be set in the setting area 333.

[0072] Circuit components such as the touch driver 400 and the power supply unit 500 may be provided on the circuit board 300. For example, the touch driver 400 and the power supply unit 500 may be packaged on the circuit board 300.

[0073] The touch driver 400 may be electrically connected to the touch sensing unit of the display panel 100. The touch driver 400 may supply a touch drive signal to a plurality of touch electrodes of the touch sensing unit, and sense the amount of change in capacitance between the plurality of touch electrodes. For example, the touch drive signal may be a pulse signal having a predetermined frequency. The touch driver 400 may calculate whether an input is performed and whether coordinates are input based on the amount of change in capacitance between the plurality of touch electrodes. The touch driver 400 may be formed of or include an integrated circuit (IC).

[0074] The power supply unit 500 may supply a power supply voltage to the display driver 200 and the display panel 100. The power supply unit 500 may generate a driving voltage to supply the driving voltage to the driving voltage line, generate an initialization voltage to supply the initialization voltage to the initialization voltage line, and generate a common voltage to supply the common voltage to a common electrode common to the light emitting elements of a plurality of pixels. For example, the driving voltage may be a high potential voltage for driving the light emitting element, and the common voltage may be a low potential voltage for driving the light emitting element.

[0075] Figure 3 As an example Figure 2 FIG. 1 is a view of a display panel 100 .

[0076] See also Figure 3, the display panel 100 may include a display unit DU, a touch sensing unit TSU, and a color filter layer CFL. The display unit DU may include a substrate SUB, a transistor layer TRL, a light emitting element layer EMTL, and an encapsulation layer ENC.

[0077] The substrate SUB may be a base substrate or a base member. The substrate SUB may be a flexible substrate capable of being bent, folded and / or curled, etc. For example, the substrate SUB may include a polymer resin such as polyimide (PI), but is not limited thereto. In another example, the substrate SUB may include a glass material or a metal material.

[0078] The transistor layer TRL may be disposed on the substrate SUB. The transistor layer TRL may include a plurality of thin film transistors constituting pixel circuits of the pixels. The transistor layer TRL may further include a gate line, a data line, a power line, a gate control line, a fan-out line for connecting the display driver 200 to the data line, and a lead for connecting the display driver 200 to the pad portion. Each of the thin film transistors may include a semiconductor region, a source electrode, a drain electrode, and a gate electrode. For example, when the gate driver is formed on one side of the non-display area NDA of the display panel 100, the gate driver may include a thin film transistor.

[0079] The transistor layer TRL may be disposed in the display area DA, the non-display area NDA, and the sub-area SBA. The thin film transistors, gate lines, data lines, and power lines of each pixel of the transistor layer TRL may be disposed in the display area DA. The gate control lines and fan-out lines of the transistor layer TRL may be disposed in the non-display area NDA. The leads of the transistor layer TRL may be disposed in the sub-area SBA. The display driver 200, the first conductive adhesive member 701, and the intermediate plate 600 may be disposed on the transistor layer TRL.

[0080] The light emitting element layer EMTL may be disposed on the transistor layer TRL. The light emitting element layer EMTL may include: a plurality of light emitting elements in which a pixel electrode, a light emitting layer, and a common electrode are sequentially stacked to emit light; and a pixel defining layer for defining pixels. The plurality of light emitting elements of the light emitting element layer EMTL may be disposed in the display area DA.

[0081] For example, the light-emitting layer may be an organic light-emitting layer including an organic material. The light-emitting layer may include a hole transport layer, an organic light-emitting layer, and an electron transport layer. When the pixel electrode receives a predetermined voltage through the thin film transistor of the thin film transistor layer TRL and the common electrode receives a cathode voltage, holes and electrons may move to the organic light-emitting layer through the hole transport layer and the electron transport layer, respectively, and may be combined with each other in the organic light-emitting layer to emit light. For example, the pixel electrode may be an anode electrode, and the common electrode may be a cathode electrode, but the electrodes are not limited thereto.

[0082] For another example, the plurality of light emitting elements may include: a quantum dot light emitting diode including a quantum dot light emitting layer; an inorganic light emitting diode including an inorganic semiconductor; or a micro light emitting diode.

[0083] The encapsulation layer ENC may cover the upper surface and the side of the light emitting element layer EMTL and protect the light emitting element layer EMTL. The encapsulation layer ENC may include at least one inorganic layer and at least one organic layer to encapsulate the light emitting element layer EMTL.

[0084] The touch sensing unit TSU may be disposed on the encapsulation layer ENC. The touch sensing unit TSU may include: a plurality of touch electrodes for sensing a user's touch in a capacitive manner; and a touch line for connecting the plurality of touch electrodes to the touch driver 400. For example, the touch sensing unit TSU may sense a user's touch in a mutual capacitance manner or a self-capacitance manner.

[0085] For another example, the touch sensing unit TSU may be provided on a separate substrate provided on the display unit DU. In this case, the separate substrate for supporting the touch sensing unit TSU may be a base member for packaging the display unit DU.

[0086] A plurality of touch electrodes of the touch sensing unit TSU may be disposed in a touch sensor region overlapping the display area DA. A touch line of the touch sensing unit TSU may be disposed in a touch peripheral region overlapping the non-display area NDA.

[0087] The color filter layer CFL may be disposed on the touch sensing unit TSU. The color filter layer CFL may include a plurality of color filters corresponding to the plurality of light emitting regions, respectively. Each of the color filters may selectively transmit light of a specific wavelength and block or absorb light of other wavelengths. The color filter layer CFL may absorb a portion of light introduced from outside the display device 10 to reduce reflected light due to external light. Therefore, the color filter layer CFL may prevent color distortion caused by external light reflection.

[0088] Since the color filter layer CFL is directly disposed on the touch sensing unit TSU, the display device 10 may not require a separate substrate for the color filter layer CFL. Therefore, the thickness of the display device 10 may be relatively reduced.

[0089] Figure 4 is a plan view illustrating a display device according to another embodiment. Figure 5 As an example circuit board from Figure 4 a plan view of the display device removed, and Figure 6 For along Figure 4 A cross-sectional view taken along line II-II'.

[0090] because Figures 4 to 6 The display device 10 and Figure 1 to Figure 3 The display device 10 has a difference in the position of the circuit board 300, so the following description will be based on the difference.

[0091] like Figures 4 to 6 , the circuit board 300 may be disposed on the encapsulation area 100b of the display panel 100. In one embodiment, the circuit board 300 may contact the display panel 100 in the encapsulation area 100b. In other words, the circuit board 300 and the encapsulation area 100b of the display panel 100 may be in direct contact with each other. The circuit board 300 may be physically and electrically connected to the encapsulation area 100b of the display panel 100 (e.g., the outer side OS of the encapsulation area 100b) by the first conductive adhesive member 701. For example, the circuit board 300 may be directly connected to the display panel 100 without the aforementioned intermediate plate 600.

[0092] like Figure 4 and Figure 6 As shown in FIG. 2 , the display driver 200 may be disposed in a through hole 300 a of a circuit board 300 .

[0093] In one embodiment, Figure 4 As shown in FIG. 1 , the circuit board 300 may define at least one first groove 301 therein. For example, the first groove 301 may have a concave shape that is concave in a direction opposite to the second direction DR2 (hereinafter, referred to as the second opposite direction). The first groove 301 may improve the rigidity of the circuit board 300.

[0094] In one embodiment, Figure 5 As shown in FIG. 1 , the display panel 100 may define at least one second groove 302 therein. For example, the second groove 302 may have a concave shape that is concave in the second opposite direction. The second groove 302 may improve the rigidity of the display panel 100. The second groove 302 may be defined to correspond to the first groove 301 described above. For example, Figure 4 and Figure 5 As shown in FIG. 2 , two first grooves 301 and two second grooves 302 may overlap each other in the third direction DR3. The first groove 301 and the second groove 302 may have the same size and shape.

[0095] according to Figures 4 to 6In the display device 10 of one embodiment shown in FIG. 1 , when the circuit board 300 and the display panel 100 are attached to each other, the first groove 301 and the second groove 302 may be used as alignment marks for alignment between the circuit board 300 and the display panel 100. For example, because the display panel 100 and the circuit board 300 are attached to each other through the first conductive adhesive member 701, before such an attachment process, the first groove 301 and the second groove 302 may be used as alignment marks for alignment between the display panel 100 and the circuit board 300. When the first groove 301 and the second groove 302 are aligned, the aligned first groove 301 and the second groove 302 are aligned. Figure 4 and Figure 5 It may have a U-shape when viewed in the plan view shown in .

[0096] Figure 7 is a plan view illustrating a display device according to still another embodiment, and Figure 8 For along Figure 7 A cross-sectional view taken along line III-III'.

[0097] because Figure 7 and Figure 8 The display device 10 and Figures 4 to 6 The display device 10 has a difference in the position of the circuit board 300, so the following description will be based on the difference.

[0098] like Figure 8 As shown in FIG. 3 , the circuit board 300 may overlap with the sub-area SBA of the display panel 100 in a cross-sectional view. For example, the circuit board 300 may overlap with the package area 100b of the sub-area SBA in the third direction DR3. In one embodiment, a portion of the circuit board 300 that overlaps with the sub-area SBA (hereinafter, referred to as an overlapping portion) may have a smaller area than a portion of the circuit board 300 that does not overlap with the sub-area SBA (hereinafter, referred to as a non-overlapping portion). In other words, the area of ​​the overlapping portion may be smaller than the area of ​​the non-overlapping portion.

[0099] In one embodiment, Figure 7 As shown in FIG. 3 , the circuit board 300 may define at least one first groove 301 therein. For example, the first groove 301 may have a concave shape that is concave in the second direction DR2. The first groove 301 may improve the rigidity of the circuit board 300.

[0100] In one embodiment, Figure 7As shown in FIG. 1 , the display panel 100 may define at least one second groove 302 therein. For example, the display panel 100 may define at least one second groove 302 in the encapsulation region 100 b therein. For example, the second groove 302 may have a concave shape that is concave in a second opposite direction. In other words, the second groove 302 and the first groove 301 may have a concave shape that is concave in directions opposite to each other. The second groove 302 may improve the rigidity of the display panel 100.

[0101] according to Figure 7 and Figure 8 In the display device 10 of one embodiment shown in FIG. 1 , when the circuit board 300 and the display panel 100 are attached to each other, the first groove 301 and the second groove 302 may be used as alignment marks for alignment between the circuit board 300 and the display panel 100. For example, because the display panel 100 and the circuit board 300 are attached to each other through the first conductive adhesive member 701, before such an attachment process, the first groove 301 and the second groove 302 may be used as alignment marks for alignment between the display panel 100 and the circuit board 300. When the first groove 301 and the second groove 302 are aligned, Figure 7 In the plan view shown in FIG. 1 , the aligned first groove 301 and the second groove 302 may have an elliptical shape.

[0102] Fig. 9 is a plan view illustrating a display device according to still another embodiment, and Fig.10 For along Fig. 9 A cross-sectional view taken along line IV-IV'.

[0103] because Fig. 9 and Fig.10 The display device 10 and Figure 7 and Figure 8 The display device 10 has a difference in the position of the circuit board 300, so the following description will be based on the difference.

[0104] like Fig.10 As shown in FIG. 1 , the circuit board 300 may be attached to the encapsulation region 100 b (eg, the outer side OS of the encapsulation region 100 b ) of the display panel 100 through the first conductive adhesive member 701 .

[0105] The circuit board 300 may include a connection region 311 , a bending region 312 , and a packaging region 313 .

[0106] The connection area 311 of the circuit board 300 may be disposed on the sub-area SBA of the display panel 100. The connection area 311 of the circuit board 300 may be connected to the sub-area SBA of the display panel 100 through the first conductive adhesive member 701. For example, the connection area 311 of the circuit board 300 may be physically and electrically connected to the encapsulation area 100b (e.g., the outer side OS of the encapsulation area 100b) of the sub-area SBA through the first conductive adhesive member 701. The connection area 311 of the circuit board 300 may overlap with the encapsulation area 100b of the display panel 100 in the third direction DR3.

[0107] The bending area 312 of the circuit board 300 may be disposed between the connection area 311 and the encapsulation area 313. One side of the bending area 312 may be in contact with the connection area 311, and the other side of the bending area 312 may be in contact with the encapsulation area 313. The bending area 312 may have a U-shape (or a U-shaped cross-section) that protrudes convexly in the second direction DR2. The connection area 311 and the encapsulation area 313 may be connected to each other through the bending area 312. In one embodiment, the bending area 312 of the circuit board 300 may not overlap with the encapsulation area 100b of the display panel 100 in a plan view. In one embodiment, the bending area 100a of the display panel 100 and the bending area 312 of the circuit board 300 may protrude convexly in directions opposite to each other.

[0108] The touch driver 400 and the power supply unit 500 may be disposed on the packaging area 313 of the circuit board 300. For example, the touch driver 400 and the power supply unit 500 may be packaged on the packaging area 313 of the circuit board 300.

[0109] The package area 313 of the circuit board 300 may overlap with the sub-area SBA of the display panel 100 in the third direction DR3. For example, the package area 313 of the circuit board 300 may overlap with the package area 100b of the sub-area SBA in the third direction DR3. In addition, the package area 313 of the circuit board 300 may overlap with the display driver 200 in the third direction DR3. The display driver 200 may be disposed between the package area 313 of the circuit board 300 and the package area 100b of the display panel 100.

[0110] according to Fig. 9 and Fig.10In the display device 10 of one embodiment shown in FIG. 1 , a portion of the circuit board 300 that overlaps with the sub-area SBA of the display panel 100 (hereinafter, referred to as the overlapping portion) may have an area larger than an area of ​​a portion of the circuit board 300 that does not overlap with the sub-area SBA of the display panel 100 (hereinafter, referred to as the non-overlapping portion). In other words, the area of ​​the overlapping portion may be larger than the area of ​​the non-overlapping portion. As described above, when the circuit board 300 is disposed close to the sub-area SBA, the area of ​​the set area 333 may increase.

[0111] Fig.11 is a plan view illustrating a display device according to another embodiment, and Fig.12 For along Fig.11 A cross-sectional view taken along line V-V'.

[0112] because Fig.11 and Fig.12 The display device 10 and Fig. 9 and Fig.10 The display device 10 has a difference in that the display device 10 further includes a middle plate 600, so the following description will be based on this difference.

[0113] like Fig.11 and Fig.12 , the intermediate plate 600 may be physically and electrically connected to the encapsulation region 100b of the display panel 100 and the connection region 311 of the circuit board 300. For example, one side of the intermediate plate 600 may be attached to the encapsulation region 100b of the display panel 100 (e.g., the outer side OS of the encapsulation region 100b) by a first conductive adhesive member 701, and the other side of the intermediate plate 600 may be attached to the connection region 311 of the circuit board 300 by a second conductive adhesive member 702.

[0114] Fig.11 and Fig.12 The circuit board 300 can be connected with the above-mentioned Fig. 9 and Fig.10 The circuit board 300 is the same.

[0115] Fig.13 is a plan view illustrating a display device according to still another embodiment, and Fig.14 For along Fig.13 A cross-sectional view taken along line VI-VI'.

[0116] because Fig.13 and Fig.14 The display device 10 and Figure 1 to Figure 3 The display device 10 has a difference in that the display device 10 further includes a reinforcing member 800 , so the following description will be based on this difference.

[0117] The reinforcing member 800 may perform a buffering function for external impact, an antistatic function, and a light blocking function. To this end, according to one embodiment, the reinforcing member 800 may be disposed between the main area MA of the display panel 100 and the encapsulation area 100b. In this case, one end of the reinforcing member 800 may face the curved area 100a of the display panel 100. In addition, for example, the touch driver 400 and the power supply unit 500 may be disposed on the reinforcing member 800. In other words, the touch driver 400 and the power supply unit 500 may be encapsulated on the reinforcing member 800. To this end, in one embodiment, the reinforcing member 800 may be a printed circuit board (PCB) such as a flexible printed circuit board (FPCB), or a flexible film such as a chip on a film (COF). In addition, in one embodiment, for example, the reinforcing member 800 may be a rigid printed circuit board. In one embodiment, the reinforcing member 800 may overlap with the display driver 200 in the third direction DR3 (or in a plan view).

[0118] The middle plate 600 (e.g., one side of the middle plate 600) may be physically and electrically connected to the encapsulation region 100b (e.g., the outer side OS of the encapsulation region 100b) of the display panel 100 through the first conductive adhesive member 701. In addition, the middle plate 600 (e.g., the other side of the middle plate 600) may be physically and electrically connected to the reinforcing member 800 through the second conductive adhesive member 702. Therefore, the reinforcing member 800 may be electrically connected to the display panel 100 through the middle plate 600.

[0119] according to Fig.13 and Fig.14 In the display device 10 of one embodiment shown in FIG. 1 , since the reinforcing member 800 can perform the function of the circuit board 300 as well as the buffering function, the circuit board 300 can be omitted. Therefore, the manufacturing cost of the display device 10 can be reduced. In addition, since the middle plate 600 and the reinforcing member 800 are electrically connected to each other, ground conduction between the middle plate 600 and the reinforcing member 800 is advantageous.

[0120] Fig.15 is a plan view illustrating a display device according to still another embodiment, and Fig.16 For along Fig.15 A cross-sectional view taken along line VII-VII'.

[0121] because Fig.15 and Fig.16 The display device 10 and Fig.13 and Fig.14 The display device 10 of FIG. 1 has a difference in that the reinforcement member 800 is directly connected to the display panel 100 , so the following description will be made based on this difference.

[0122] like Fig.15 and Fig.16 As shown in FIG. 8 , the reinforcement member 800 may be physically and electrically connected to the encapsulation region 100 b (eg, the inner side IS of the encapsulation region 100 b ) of the display panel 100 through the first conductive adhesive member 701 .

[0123] Fig.15 and Fig.16 The reinforcing member 800 can be combined with the above Fig.13 and Fig.14 The reinforcing member 800 is the same.

[0124] according to Fig.15 and Fig.16 In the display device 10 of the embodiment shown in FIG. 1 , since the reinforcing member 800 can perform the function of the circuit board 300 as well as the buffering function, the circuit board 300 can be omitted. In addition, since the reinforcing member 800 is directly connected to the display panel 100, the intermediate plate 600 can be omitted. Therefore, the manufacturing cost of the display device 10 can be reduced.

[0125] A person of ordinary skill in the art to which the present disclosure belongs will be able to understand that the present disclosure can be implemented in other specific forms without changing the technical spirit or essential features of the present disclosure. Therefore, it should be understood that the above exemplary embodiments are illustrative in all aspects and not restrictive. It should be understood that the scope of the present disclosure is defined by the claims rather than the above detailed description, and all variations and modifications derived from the claims and their equivalents fall within the scope of the present disclosure.

Claims

1. A display device, comprising: A display panel comprising a main region and a sub-region, wherein the sub-region is curved and extends from the main region; a reinforcing member disposed between the main area and the sub-area of ​​the display panel and connected to the display panel; as well as The first circuit component is arranged on the reinforcing member. 2 . The display device according to claim 1 , wherein the reinforcement member is directly connected to the sub-region of the display panel. 3 . The display device according to claim 2 , wherein the reinforcement member is directly connected to an inner side of the sub-region of the display panel.

4. The display device according to claim 2, wherein the sub-area of ​​the display panel comprises: a curved region extending from the main region and being curved; as well as A packaging area extends from the bending area and a second circuit component is disposed on the packaging area. The display device according to claim 4 , wherein the reinforcement member is directly connected to the encapsulation region of the display panel. 6 . The display device of claim 5 , wherein the reinforcement member is directly connected to an inner side of the encapsulation region of the display panel. 7 . The display device of claim 6 , further comprising a conductive adhesive member physically and electrically connecting the reinforcement member to the encapsulation region of the display panel. 8 . The display device according to claim 1 , further comprising a second circuit component disposed in the sub-region of the display panel. 9 . The display device according to claim 1 , further comprising an intermediate plate connecting the reinforcement member with the display panel.

10. The display device according to claim 9, wherein the first side of the intermediate plate is connected to the sub-area of ​​the display panel, and The second side of the intermediate panel is connected to the reinforcement member.

11. The display device according to claim 10, wherein the sub-area of ​​the display panel comprises: a curved region extending from the main region and being curved; as well as A packaging area extends from the bending area and is connected to the middle board, and a second circuit component is disposed on the packaging area. 12 . The display device of claim 11 , wherein the first side of the intermediate plate is connected to the encapsulation region of the display panel. 13 . The display device of claim 12 , wherein the first side of the intermediate plate is connected to an outer side of the encapsulation area of ​​the display panel.

14. The display device according to claim 13, further comprising: a first conductive adhesive member to physically and electrically connect the first side of the intermediate plate to the encapsulation region of the display panel; as well as A second conductive adhesive member physically and electrically connects the second side of the intermediate plate to the reinforcing member. 15 . The display device according to claim 1 , wherein one end of the reinforcement member faces a curved region of the display panel that extends from the main region and is curved. 16 . The display device of claim 1 , wherein the reinforcement member comprises one of a flexible printed circuit board, a chip on film, and a rigid printed circuit board. 17 . The display device of claim 1 , wherein the first circuit part on the reinforcement member includes a touch driver and a power supply unit.

18. The display device according to claim 1, further comprising a display driver disposed on the display panel. 19 . The display device according to claim 18 , wherein the display driver is disposed on the sub-region of the display panel. 20 . The display device of claim 19 , wherein the reinforcement member overlaps the display driver in a plan view.

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