A high-temperature superconducting current lead and superconducting magnet system

Abstract

This application pertains to the field of high-temperature superconducting current leads for superconducting magnet systems, specifically disclosing a high-temperature superconducting current lead and a superconducting magnet system. Through this application, the newly added cover plate and base plate fix the high-temperature superconducting tape in the middle and form a tight fit, allowing external forces experienced during assembly, transportation, installation, cooling, and excitation to be transferred to the reinforced structure. This eliminates stress concentration and deformation on the high-temperature superconducting tape, and while maintaining both the thermal and electrical performance of the lead, eliminates the possibility of mechanical damage to the lead due to shear stress and peel stress.

Description

Technical Field

[0001] This application belongs to the field of high-temperature superconducting current leads for superconducting magnet systems, and more specifically, relates to a high-temperature superconducting current lead and a superconducting magnet system. Background Technology

[0002] In superconducting magnet systems, high-temperature superconducting current leads are responsible for current conduction between the primary and secondary components of the system. If a lead fails to quench, the magnet will be at great risk of quench failure. Therefore, highly reliable current leads are an important component of the system.

[0003] The design of high-temperature superconducting current leads needs to consider three aspects: electrical, thermal, and mechanical. Electrically, the current-carrying capacity of the lead must be greater than the magnet excitation current under the background magnetic field. Thermally, the secondary heat leakage from the lead to the system must be minimized. Mechanically, because high-temperature superconducting tapes have a multi-layered structure and the internal high-temperature superconducting material is a brittle ceramic material, transverse shear stress or interlayer peeling stress can easily cause irreversible damage, leading to a severe decrease in current-carrying capacity or even burnout. However, existing current lead structures neglect mechanical design. Summary of the Invention

[0004] To address the shortcomings of existing technologies, the purpose of this application is to provide a high-temperature superconducting current lead and superconducting magnet system, which aims to balance the thermal and electrical properties of the lead while eliminating the possibility of mechanical damage to the lead due to transverse shear stress and / or interlayer peeling stress during assembly, transportation, installation, cooling, and excitation.

[0005] The first aspect of this application relates to a high-temperature superconducting current lead, which includes: a cover plate, a base plate, connecting terminals, and a high-temperature superconducting tape; both ends of the high-temperature superconducting tape are respectively matched and connected to the connecting terminals; the cover plate and the base plate fix the high-temperature superconducting tape in the middle and form a tight fit so that it does not produce lateral displacement during the excitation process.

[0006] In some embodiments, the upper and / or lower surfaces of the high-temperature superconducting tape are provided with a buffer layer.

[0007] In some embodiments, the buffer layer is an elastic, low-temperature resistant soft material.

[0008] In some embodiments, the cross-sectional shapes of the cover plate and the base plate are complementary and match the cross-sectional shape of the high-temperature superconducting tape to completely secure it between the cover plate and the base plate.

[0009] In some embodiments, the cover plate and the bottom plate have L-shaped cross-sections, forming a complementary double L-shaped structure.

[0010] In some embodiments, the high-temperature superconducting current lead further includes a fixing element for reinforcing the multilayer structure consisting of a cover plate, a high-temperature superconducting tape, and a base plate in a direction perpendicular to the surface of the high-temperature superconducting tape.

[0011] In some embodiments, the fastener is a clamp, cable tie, or screw, and is evenly distributed along the length of the lead wire.

[0012] In some embodiments, the base plate has a groove near the high-temperature end of the lead wire, and a gap space is formed between the groove and the cover plate.

[0013] A second aspect of this application relates to a superconducting magnet system comprising high-temperature superconducting current leads according to any embodiment of this application.

[0014] In some implementations, the superconducting magnet system is used in MRI, NMR, STM, PPMS, magneto-optical systems, and quantum computing systems.

[0015] Overall, the technical solutions conceived in this application have the following beneficial effects compared with the prior art:

[0016] (1) This application provides a high-temperature superconducting current lead wire. The newly added cover plate and base plate fix the high-temperature superconducting tape in the middle and form a tight fit, so that the external force it is subjected to during assembly, transportation, installation, cooling, excitation and other processes can be transferred to the reinforced structure, thereby eliminating stress concentration and deformation on the high-temperature superconducting tape. While taking into account the thermal and electrical performance of the lead wire, it can eliminate the possibility of mechanical damage to the lead wire due to transverse shear stress and / or interlayer peeling stress.

[0017] (2) This application provides a superconducting magnet system, which strengthens the mechanical properties of the high-temperature superconducting current lead, a weak point in the system, and significantly improves the operational stability compared to the traditional superconducting magnet system. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of a high-temperature superconducting current lead structure provided in an embodiment of this application.

[0019] Figure 2 An exploded view of a meandering multi-layered structure provided for an embodiment of this application.

[0020] Figure 3 This is a cross-sectional structural and mechanical schematic diagram of the double L-shaped structure provided in the embodiments of this application.

[0021] Figure 4 This is a schematic diagram of the clamp mechanics provided for an embodiment of this application.

[0022] Figure 5 This is a schematic diagram of the base plate groove structure provided in an embodiment of this application.

[0023] Figure 6 This is a schematic diagram of the multi-segment structure of the cover plate provided in an embodiment of this application.

[0024] In all the accompanying drawings, the same reference numerals are used to denote the same elements or structures, wherein:

[0025] 1 is the cover plate, 2 is the base plate, 3 is the clamp, 4 is the copper terminal, 5 is the YBCO strip, 6 is the buffer layer, and 101, 102, and 103 are multiple segments of the cover plate. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0027] In this article, the term "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. The symbol " / " in this article indicates that the related objects are in an "or" relationship; for example, A / B means A or B.

[0028] The terms "first" and "second," etc., used in the specification and claims herein are used to distinguish different objects, not to describe a specific order of objects. For example, "first response message" and "second response message," etc., are used to distinguish different response messages, not to describe a specific order of response messages.

[0029] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0030] In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more, for example, multiple processing units means two or more processing units, multiple elements means two or more elements, etc.

[0031] The embodiments of this application are described below with reference to the accompanying drawings.

[0032] This application provides a high-temperature superconducting current lead, comprising: a cover plate, a base plate, connecting terminals, and a high-temperature superconducting tape; both ends of the high-temperature superconducting tape are respectively matched and connected to the connecting terminals; the cover plate and the base plate fix the high-temperature superconducting tape in the middle and form a tight fit, so that it does not produce lateral displacement during the excitation process.

[0033] The high-temperature superconducting tape includes, but is not limited to, YBCO (yttrium barium copper oxide), Bi-2223, and iron-based superconductors. Optionally, the high-temperature superconducting tape has protective layers on both its upper and lower surfaces.

[0034] Preferably, the upper and / or lower surfaces of the high-temperature superconducting tape are provided with a buffer layer. This design can effectively eliminate the phenomenon of local compressive stress or peel stress concentration in the high-temperature superconducting tape caused by unevenness between the cover plate and the base plate, and eliminate the possibility of local damage to the high-temperature superconducting tape during lead assembly, transportation, installation, cooling, excitation, etc.

[0035] Preferably, the buffer layer is an elastic, low-temperature resistant soft material, which includes, but is not limited to: Kapton, Teflon, Mylar, and fiberglass cloth.

[0036] Preferably, the width of the buffer layer is equal to the width of the high-temperature superconducting tape, and the length is equal to the length of the high-temperature superconducting tape located between the cover plate and the bottom plate.

[0037] Optionally, the high-temperature superconducting tape sandwiched between the buffer layers is one or more tapes connected in parallel, the number of which depends on the critical current of a single high-temperature superconducting tape and the operating current of the current lead.

[0038] Preferably, the cross-sectional shapes of the cover plate and the base plate are complementary and match the cross-sectional shape of the high-temperature superconducting tape to completely fix it between the cover plate and the base plate.

[0039] Preferably, the cover plate and the base plate have L-shaped cross-sections, forming a complementary double-L-shaped structure that can completely cover the high-temperature superconducting tape. This design isolates the high-temperature superconducting tape from the outside environment, and the double-L-shaped structure can effectively reinforce the multi-layer structure even when the thickness of the internal multi-layer structure changes. It facilitates processing while providing 360-degree all-around protection for the high-temperature superconducting tape from damage during assembly, transportation, and installation. The length and width of the L-shape can be designed according to actual needs.

[0040] Preferably, the high-temperature superconducting current lead further includes a fixing component for reinforcing the multi-layer structure consisting of a cover plate, a high-temperature superconducting tape, and a base plate in a direction perpendicular to the surface of the high-temperature superconducting tape.

[0041] The fasteners are clamps, cable ties, or screws, and are evenly distributed along the length. This design ensures that even under a strong background magnetic field, the Lorentz force on the high-temperature superconducting tape can be uniformly transferred to the reinforced structure, thereby eliminating stress concentration and deformation on the high-temperature superconducting tape, effectively preventing tape damage, and significantly improving lead strength and working capability under strong background magnetic fields.

[0042] Preferably, the fixing element is a clamp. The clamp is evenly distributed on both sides of the cover plate and the base plate, and pressure is applied using a bolt structure to uniformly reinforce the multi-layer structure of cover plate-high temperature superconducting tape-base plate. The clamp is pressurized by rotating the bolt structure through both sides of the clamp using a torque wrench. Optionally, the clamp is made of high-strength materials, including but not limited to: stainless steel, brass, and G10.

[0043] Preferably, the cover plate and the bottom plate have a meandering structure along their length, and the bending radius is not less than the minimum radius of curvature required for the high-temperature superconducting tape to operate normally. This design can effectively increase the length of the current lead within the limited space of the cryogenic container, thereby increasing the lead thermal resistance and reducing heat leakage through conduction.

[0044] Preferably, the base plate has a groove near the high-temperature end of the lead wire, forming a gap space between the groove and the cover plate. This design allows a portion of the high-temperature superconducting tape length to be stored within the groove during lead wire assembly. On one hand, this solves the installation fit problem caused by the inconsistency between the actual and designed length of the high-temperature superconducting tape during lead wire assembly, enabling the multi-layer structure of cover plate-high-temperature superconducting tape-base plate outside the groove area to form a stable and robust structure without applying additional tensile or shear stress to the high-temperature superconducting tape. On the other hand, the redundant high-temperature superconducting tape in the groove can effectively eliminate the tensile stress along the length of the high-temperature superconducting tape caused by the inconsistency in the thermal shrinkage coefficients of the cover plate, base plate, (buffer layer), and high-temperature superconducting tape during lead wire cooling.

[0045] Alternatively, the base plate can be made to have a groove by increasing the bending radius of the base plate near the high-temperature end of the lead wire.

[0046] Preferably, the length of the high-temperature superconducting tape is longer than the length of the cover plate but shorter than the length of the high-temperature superconducting tape placed on the base plate. This design allows the high-temperature superconducting tape to have a certain amount of room for movement and expansion between the cover plate and the base plate.

[0047] Preferably, the cover plate has a segmented structure along its length. This design ensures that during lead assembly, by installing the segmented cover plate starting from the low-temperature end of the lead, a stable multi-layer structure of cover plate-high-temperature superconducting tape-base plate is formed outside the groove area, while simultaneously storing redundant high-temperature superconducting tape in the groove area of ​​the base plate.

[0048] Preferably, the base plate extends into additional platforms at both ends, with threaded holes on the platforms for mating with connecting terminals.

[0049] Preferably, the connecting terminal is a square copper block with screw holes for mating with the base plate and grooves for mating with the high-temperature superconducting tape. The connection between the connecting terminal and the base plate is made using a bolt structure. Optionally, the connecting terminal may be made of oxygen-free copper.

[0050] Optionally, the connection between the high-temperature superconducting tape and the connecting terminal is made by welding with high-strength solder, including Sn63Pb37 and Sn60Pb40.

[0051] Optionally, the materials of the cover plate and the base plate include, but are not limited to, GFRP (glass fiber reinforced plastic) or CFRP (carbon fiber reinforced composite). These materials have the characteristics of low thermal conductivity and high strength, which can reduce heat leakage from the leads and improve the mechanical properties of the leads.

[0052] Example

[0053] In this embodiment, the high-temperature superconducting tape is a YBCO tape, and the connecting terminal is a copper terminal.

[0054] like Figure 1 As shown, this embodiment provides a high-temperature superconducting current lead comprising: a cover plate 1, a base plate 2, a clamp 3, copper terminals 4, and a YBCO strip 5. The left end is the high-temperature end of the lead, and the right end is the low-temperature end. The cover plate 1 and base plate 2 are made of G10 steel, possessing both high strength and low thermal conductivity. The clamp 3 is made of stainless steel, exhibiting high strength. The copper terminals 4 are made of oxygen-free copper with an RRR (Residual Metallic Conductivity) greater than 50, exhibiting low resistivity and reducing Joule heating at the low-temperature end of the lead. The YBCO strip 5 is a copper strip with a 5 μm thick protective copper layer, possessing sufficient strength while maintaining low thermal conductivity; the surface copper layer also forms a strong copper-copper weld joint with the copper terminals.

[0055] like Figure 1As shown, the copper terminal 4 is a square copper block with a groove for placing the YBCO strip 5, four positioning screw holes, and one assembly screw hole. The groove is used to form a welded joint with the YBCO strip 5, the positioning holes are used to mate with the positioning screw holes on the platforms extending from both ends of the base plate 2, and the assembly screw hole is used for mating with other conductive components during the assembly of the current lead. With the above structure, a tight and secure welded joint can be formed between the copper terminal 4 and the YBCO strip 5, and a tight bolt structure can also be formed between the copper terminal 4 and the base plate 2. This makes the lead a compact whole, significantly enhancing the lead's resistance to external forces and reducing the possibility of mechanical damage to the lead during assembly, transportation, installation, cooling, and excitation.

[0056] like Figure 1 As shown, multiple sets of clamps 3 are evenly placed along the length of the lead wire. Both the cover plate 1 and the base plate 2 have through holes on the clamps. A torque wrench is used to rotate the bolts on both sides of the clamps to apply pressure, uniformly reinforcing the internal multi-layered structure. This application employs the above structure, which effectively and evenly transfers the Lorentz force on the current lead wire to the reinforced structure even under a strong background magnetic field. This eliminates stress concentration and deformation on the YBCO tape 5, effectively preventing tape damage and significantly improving lead wire strength and working capability under strong background magnetic fields.

[0057] like Figure 2 As shown, the cover plate 1 and the base plate 2 have a serpentine structure along their length, with a minimum bending radius not less than the minimum curvature radius of the YBCO strip 5 for normal operation, which is 15 mm. This application employs the above structure, which effectively increases the length of the current lead within the limited space of the cryogenic container, thereby increasing the lead's thermal resistance and reducing heat leakage through conduction. The high-temperature superconducting current lead also includes a buffer layer 6, located on the upper and lower surfaces of the YBCO strip 5 and forming a tight fit. The buffer layer 6 is made of Kapton film, which provides good buffering.

[0058] like Figure 2 As shown, the length of the YBCO strip 5 is slightly longer than the length of the cover plate 1, but slightly shorter than the length of the base plate 2 that can accommodate the YBCO strip 5. This application employs the above structure, thus allowing the YBCO strip 5 to have a certain amount of movement and expansion space between the cover plate 1 and the base plate 2 in the recessed area near the high-temperature end of the lead.

[0059] like Figure 2As shown, the width of the buffer layer 6 is equal to the width of the YBCO strip 5, and its length is equal to the length of the YBCO strip 5 located between the cover plate 1 and the base plate 2. It is placed on both sides of the YBCO strip 5 and sandwiched between the cover plate 1 and the base plate 2. This application employs the above structure, using an elastic, low-temperature resistant soft material as the buffer strip between the cover plate 1 and the base plate 2 and the YBCO strip 5. This effectively reduces the local compressive stress or peel stress concentration of the YBCO strip 5 caused by uneven surfaces of the cover plate 1 and the base plate 2, and eliminates the possibility of local damage to the YBCO strip 5 during lead assembly, transportation, installation, cooling, and excitation.

[0060] like Figure 3 As shown, the cover plate 1 and the bottom plate 2 have L-shaped cross-sections. The double L-shaped structures complement each other and can completely fix the multi-layer structure of buffer layer 6-YBCO belt 5-buffer layer 6 inside the double L-shaped structure.

[0061] like Figure 3 As shown, the YBCO tape 5 may be subjected to external forces F1 from various directions during lead assembly, transportation, and installation. The double L-shaped structure formed by the cover plate 1 and the base plate 2 applies reaction forces F2 and F3 to the YBCO tape 5, which are equal in magnitude and opposite in direction to the external forces, thus protecting the YBCO tape 5 from mechanical damage.

[0062] This application adopts the above structure to isolate the YBCO tape 5 from the outside world, which can protect the YBCO tape 5 from mechanical damage during lead assembly, transportation, installation and other processes. Moreover, the double L-shaped structure can still effectively reinforce the multi-layer structure when the thickness of its internal multi-layer structure changes.

[0063] like Figure 4 As shown, the YBCO strip 5 may be subjected to Lorentz forces perpendicular to the strip length during excitation, which will lead to huge transverse shear stress and interlaminar peeling stress at the fixed position of the YBCO strip 5. The fixture 3 applies compressive stress perpendicular to the strip surface to the cover plate 1 and the base plate 2, thereby reinforcing the multilayer structure composed of the cover plate-high temperature superconducting strip-base plate perpendicular to the surface of the high temperature superconducting strip. This allows the Lorentz force on the YBCO strip 5 to be uniformly transferred to the reinforced structure, thus eliminating stress concentration and deformation on the YBCO strip 5.

[0064] like Figure 5As shown, the bending radius of a portion of the base plate 2 near the high-temperature end of the lead increases, resulting in a groove on the base plate 2 and a gap between it and the cover plate 1. This application employs the above structure, allowing a portion of the YBCO strip 5's length to be stored in the groove during lead assembly. This design detail solves the installation fit problem caused by the inconsistency between the actual and designed length of the YBCO strip 5 during lead assembly. It enables the multi-layer structure outside the groove area—cover plate 1-buffer layer 6-YBCO strip 5-buffer layer 6-base plate 2—to form a stable and secure fit without applying additional tensile or shear stress to the YBCO strip 5. Furthermore, the redundant YBCO strip 5 in the groove effectively eliminates the tensile stress along the length of the YBCO strip 5 caused by the inconsistent thermal shrinkage coefficients of the cover plate 1, base plate 2, YBCO strip 5, and buffer layer 6 during lead cooling.

[0065] like Figure 6 As shown, the cover plate 1 can be divided into multiple segments along its length. This application adopts the above structure, and during lead assembly, the segmented cover plates 103, 102, and 101 are installed segment by segment starting from the low-temperature end of the lead. This allows the redundant YBCO tape 5 to be gradually pushed into the groove area at the high-temperature end of the lead. This ensures stable adhesion of the multi-layer structure outside the groove area—cover plate 1-buffer layer 6-YBCO tape 5-buffer layer 6-base plate 2—while simultaneously storing the redundant YBCO tape in the groove area of ​​the base plate.

[0066] This embodiment has been applied to a 9T conductive cooling NbTi superconducting magnet system, producing the following effects: A serpentine lead structure achieves an effective lead length of 40 cm within a limited space of 20 cm height, reducing heat leakage from a single lead to 30 mW; through multi-layer reinforcement and buffering structures, as well as design details such as base plate grooves and segmented cover plates, the lead can withstand intermittent excitation for over 100 hours without failure under a 9T magnet background field and an excitation current exceeding 80 A; the shear stress or peel stress at the low-temperature end of the traditional current lead YBCO strip, which is as high as 10 MPa or more, is reduced to 0.2 MPa, while the YBCO strip may suffer structural damage under shear stress of 3.44 MPa or peel stress of 10 MPa. Clearly, this application significantly improves lead strength and working capability under strong background magnetic fields while ensuring the thermal and electrical performance of the current lead, effectively eliminating the possibility of mechanical damage to the lead during assembly, transportation, installation, cooling, and excitation.

[0067] Based on the above, this application also provides a superconducting magnet system, including the high-temperature superconducting current leads as described above.

[0068] The superconducting magnet system is applied in fields such as MRI (nuclear magnetic resonance) systems, NMR (magnetic resonance spectroscopy) systems, STM (scanning tunneling microscope) systems, PPMS (polypropion measurement system), magneto-optical systems, and quantum computing systems.

[0069] It should be understood that expressions such as “comprising” and “may include” used in this application indicate the existence of the disclosed functions, operations, or constituent elements, and do not limit one or more additional functions, operations, and constituent elements. In this application, terms such as “comprising” and / or “having” are to be interpreted as indicating a particular characteristic, number, operation, constituent element, component, or combination thereof, but not to exclude the existence or possibility of adding one or more other characteristics, numbers, operations, constituent elements, components, or combinations thereof.

[0070] Furthermore, in this application, the expression "and / or" includes any and all combinations of the associated listed words. For example, the expression "A and / or B" may include A, may include B, or may include both A and B.

[0071] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixed connection" refers to a connection where the relative positional relationship remains unchanged after connection. "Rotary connection" refers to a connection where the components can rotate relative to each other after connection. "Sliding connection" refers to a connection where the components can slide relative to each other after connection. The directional terms mentioned in the embodiments of this application, such as "top," "bottom," "inner," "outer," "left," and "right," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0072] Furthermore, the mathematical concepts mentioned in the embodiments of this application, such as symmetry, equality, parallelism, and perpendicularity, are limitations specific to the current technological level, rather than absolute and strict mathematical definitions. Slight deviations are permissible; approximations of symmetry, equality, parallelism, and perpendicularity are all acceptable. For example, "A and B are parallel" means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0 and 10 degrees. "A and B are perpendicular" means that A and B are perpendicular or approximately perpendicular, and the angle between A and B can be between 80 and 100 degrees.

[0073] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A high-temperature superconducting current lead, characterized in that, include: Cover plate, base plate, connecting terminals, and high-temperature superconducting tape; Both ends of the high-temperature superconducting tape are respectively matched and connected to the connecting terminals; The cover plate and the bottom plate fix the high-temperature superconducting tape in the middle and form a tight fit, so that it does not produce lateral displacement during the excitation process.

2. The high-temperature superconducting current lead as described in claim 1, characterized in that, The upper and / or lower surfaces of the high-temperature superconducting tape are provided with a buffer layer.

3. The high-temperature superconducting current lead as described in claim 2, characterized in that, The buffer layer is an elastic, low-temperature resistant soft material.

4. The high-temperature superconducting current lead as described in claim 1, characterized in that, The cross-sectional shapes of the cover plate and the base plate are complementary and match the cross-sectional shape of the high-temperature superconducting tape to completely fix it between the cover plate and the base plate.

5. The high-temperature superconducting current lead as described in claim 4, characterized in that, The cover plate and the bottom plate have L-shaped cross sections, forming a complementary double L-shaped structure.

6. The high-temperature superconducting current lead as described in claim 1, characterized in that, The high-temperature superconducting current lead also includes a fixing component for reinforcing the multi-layer structure consisting of a cover plate, a high-temperature superconducting tape, and a base plate in a direction perpendicular to the surface of the high-temperature superconducting tape.

7. The high-temperature superconducting current lead as described in claim 6, characterized in that, The fasteners are clamps, cable ties, or screws, and are evenly distributed along the length of the lead wire.

8. The high-temperature superconducting current lead as described in claim 1, characterized in that, The base plate has a groove near the high-temperature end of the lead wire, and a gap space is formed between the groove and the cover plate.

9. A superconducting magnet system, characterized in that, Including the high-temperature superconducting current lead as described in any one of claims 1 to 8.

10. The superconducting magnet system as described in claim 9, characterized in that, The superconducting magnet system is used in MRI, NMR, STM, PPMS, magneto-optical systems, and quantum computing systems.

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