Miniature inductor manufacturing method and inductor
Through press molding, spray painting, electroplating and precise cutting methods, the existing micro-inductor manufacturing methods are solved, and efficient and low-cost micro-inductor production is achieved, ensuring product accuracy and electrical performance.
Patent Information
- Application Number
- CN202411875097.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-19
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2044-12-19
AI Technical Summary
Existing micro-inductor manufacturing methods are difficult to reduce production costs while ensuring accuracy, and the process is complex or the molding accuracy is low.
Using a micro-inductor manufacturing method, dimensional accuracy is ensured by press-molding and flat plate molding, multiple spray painting and electroplating form reliable insulating and conductive layers, and high density integration and miniaturization is achieved through precise cutting and assembly.
It realizes efficient and low-cost production of micro-inductors, ensures the dimensional accuracy and electrical performance of the inductors, meets the needs of modern electronic products, and simplifies the production process.
Smart Images

Figure CN119694759A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of electronic component manufacturing, and in particular to a method for manufacturing a micro-inductor and an inductor. Background Art
[0002] As an important electronic component, micro-inductors are widely used in various circuit designs, especially in high-frequency filtering, signal processing and other fields. As electronic products develop towards miniaturization and lightweight, the demand for micro-inductors is growing. In order to meet this demand, many research institutions and companies are committed to developing efficient micro-inductor manufacturing methods to improve production efficiency and product quality.
[0003] In the existing technology, common methods for manufacturing micro-inductors include winding method, thin film method and powder metallurgy method. The winding method is to manufacture the inductor by winding a wire on a magnetic core. This method has a simple process, but the manufactured inductor is large in size and is not suitable for miniaturized applications. The thin film method is to deposit a metal film on a substrate, and then form an inductor structure through photolithography and etching processes. Although high-precision miniaturization can be achieved, the process is complicated and the cost is high. The powder metallurgy method is to press the powder material into shape and then sinter it, and then make an inductor through a series of processing steps. This method can achieve higher density and mechanical strength, but the molding accuracy is low and it is difficult to meet precision requirements. Therefore, the current method for manufacturing micro-inductors is difficult to reduce production costs while ensuring accuracy. Summary of the invention
[0004] The purpose of this application is to provide a method for manufacturing a micro-inductor and an inductor, so as to simplify the production process of the micro-inductor and reduce the production cost.
[0005] In the first aspect, the present application provides a method for manufacturing a micro-inductor using the following technical solution: A method for manufacturing a micro-inductor, comprising: The prefabricated powder is loaded into a flat plate mold of a first preset size for a first pressing molding to obtain a flat plate raw material; Apply the first spray paint to the six sides of the flat stock; Performing a first cutting on the upper surface of the flat plate material after the first painting, and cutting a plurality of transverse grooves of a second preset size transversely according to a first preset spacing; Performing a first electroplating on the plurality of transverse grooves cut out for the first time to obtain a plurality of electroplating grooves; The upper surface of the flat plate raw material after the first electroplating is filled with prefabricated powder and pressed for a second time, so that the prefabricated powder forms a sealing layer of a third preset size on the upper surface of the flat plate raw material to obtain a semi-finished flat plate; Spraying paint for the second time on the upper surface of the flat semi-finished product according to a third preset interval, forming a plurality of paint stripes on the upper surface of the semi-finished product; Cross-cutting the flat semi-finished product to obtain a plurality of semi-finished product blocks of a fourth preset size; The front and rear surfaces of several semi-finished blocks are spray-painted for the third time; The unpainted parts of several semi-finished blocks are electroplated for the second time to form an electroplating layer on the outer surface of the block to obtain a finished inductor.
[0006] By adopting the above technical solution, the present application can realize efficient and low-cost production of micro-inductors. First, through compression molding and flat molds, the dimensional accuracy and consistency of the inductor can be ensured. Secondly, through multiple spray painting and electroplating, reliable insulating layers and conductive layers can be formed to improve the electrical performance and reliability of the inductor. In addition, through precise cutting and assembly, high-density integration and miniaturization of inductors can be achieved to meet the needs of modern electronic products. The entire production process is simple and controllable, which can simplify the production process of micro-inductors and reduce production costs.
[0007] Preferably, the first preset size has a length of 80 mm, a width of 60 mm, and a thickness of 0.6 mm.
[0008] Preferably, the second preset size has a length of 80 mm, a width of 0.5 mm, and a depth of 0.4 mm.
[0009] Preferably, the third preset size has a length of 80 mm, a width of 60 mm, and a thickness of 0.4 mm.
[0010] Preferably, the fourth preset size has a length of 2.5 mm, a width of 2 mm, and a thickness of 1 mm.
[0011] Preferably, the first electroplating comprises: electroplating a copper layer, a nickel layer and a tin layer in sequence.
[0012] Preferably, the copper layer has a thickness of 0.005 mm, the nickel layer has a thickness of 0.003 mm, and the tin layer has a thickness of 0.01 mm.
[0013] Preferably, the first cutting and the second cutting are performed using a grinding wheel cutter.
[0014] Preferably, the first painting, the second painting and the third painting are all done with insulating paint.
[0015] In the second aspect, the present application provides a micro-inductor adopting the following technical solution: A micro-inductor, wherein the micro-inductor is manufactured by the micro-inductor manufacturing method according to the first aspect; The inductor comprises an inductor body, the outer surface of the inductor body comprises an electroplating layer and a paint layer, the electroplating layer is arranged on the left and right surfaces and both sides of the upper surface, and the paint layer is arranged on the front and rear surfaces, the lower surface and the middle part of the upper surface; An electroplating groove is penetrated from left to right inside the inductor body, and the electroplating groove and the electroplating layer form a passage.
[0016] By adopting the above technical solution, the WeChat inductor manufacturing method of the present application is simple, while ensuring precision, effectively improving production efficiency, reducing costs, and ensuring product quality.
[0017] In summary, this application includes the following beneficial technical effects: The present application can realize the efficient and low-cost production of micro-inductors. First, through compression molding and flat molds, the dimensional accuracy and consistency of the inductor can be ensured. Secondly, through multiple spray painting and electroplating, reliable insulating layers and conductive layers can be formed to improve the electrical performance and reliability of the inductor. In addition, through precise cutting and assembly, high-density integration and miniaturization of inductors can be achieved to meet the needs of modern electronic products. The entire production process is simple and controllable, which can simplify the production process of micro-inductors and reduce production costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 is a flow chart of the manufacturing method of Example 1 of the present application; Figure 2 is a schematic diagram of the overall structure of the micro-inductor of Example 1 of the present application; Figure 3 is a schematic cross-sectional structural diagram of a micro-inductor according to Example 1 of the present application; In the figure, 1. Inductor body; 2. Electroplating layer; 3. Paint layer; 4. Electroplating tank. DETAILED DESCRIPTION
[0019] The following will be combined with the attached Figure 1-3 , the technical solutions in the embodiments of the present application are clearly and completely described. The described embodiments are only possible technical implementations of the present application, not all possible implementations. Those skilled in the art can completely combine the embodiments of the present application to obtain other embodiments without creative work, and these embodiments are also within the scope of protection of the present application.
[0020] In the existing technology, common methods for manufacturing micro-inductors include winding method, thin film method and powder metallurgy method. The winding method is to manufacture the inductor by winding a wire on a magnetic core. This method has a simple process, but the manufactured inductor is large in size and is not suitable for miniaturized applications. The thin film method is to deposit a metal film on a substrate, and then form an inductor structure through photolithography and etching processes. Although high-precision miniaturization can be achieved, the process is complicated and the cost is high. The powder metallurgy method is to press the powder material into shape and then sinter it, and then make an inductor through a series of processing steps. This method can achieve higher density and mechanical strength, but the molding accuracy is low and it is difficult to meet precision requirements. Therefore, the current method for manufacturing micro-inductors is difficult to reduce production costs while ensuring accuracy.
[0021] Example 1 Since the existing micro-inductor manufacturing methods have problems such as high cost, low efficiency, and unstable product quality, Figure 1 The present application provides a method for manufacturing a micro-inductor, comprising: S1. The prefabricated powder is loaded into a flat plate mold of a first preset size for a first pressing and forming process to obtain a flat plate raw material.
[0022] Specifically, the prefabricated powder can be selected from ferrite powder or other materials with high magnetic permeability to ensure the performance of the inductor. The size of the flat mold can be adjusted according to actual needs. During the pressing process, it can be achieved by a hydraulic press or a pneumatic press to ensure the uniformity and density of the flat raw material. In the specific implementation process, the first preset size is 80 mm in length, 60 mm in width, and 0.6 mm in thickness.
[0023] S2. Spray paint on the six sides of the flat plate material for the first time.
[0024] Specifically, the main purpose of spraying paint is to form an insulating layer to prevent the inductor from short-circuiting during subsequent processing. Spraying paint can use insulating paint, such as epoxy resin paint or polyurethane paint. The method of spraying paint can use a sprayer or a dip coater to ensure that the paint layer 3 is evenly covered on the surface of the flat raw material.
[0025] S3, performing a first cutting on the upper surface of the flat plate material after the first painting, and cutting a plurality of transverse grooves of a second preset size transversely according to a first preset spacing.
[0026] Specifically, the cutting tool may be a grinding wheel cutter, and the cutting parameters need to be precisely controlled to ensure cutting quality and efficiency. In a specific implementation, the second preset size has a length of 80 mm, a width of 0.5 mm, and a depth of 0.4 mm.
[0027] S4, performing a first electroplating on the plurality of transverse grooves cut out for the first time, to obtain a plurality of electroplating grooves 4.
[0028] Specifically, the electroplating can be direct current electroplating or pulse electroplating to improve the quality and uniformity of the electroplating tank 4. In the specific implementation process, the electroplating process can be divided into multiple stages, first electroplating a copper layer with a thickness of 0.005 mm, then electroplating a nickel layer with a thickness of 0.003 mm, and finally electroplating a tin layer with a thickness of 0.01 mm.
[0029] S5. Filling the upper surface of the flat plate raw material after the first electroplating with prefabricated powder and performing a second pressing molding, so that the prefabricated powder forms a sealing layer of a third preset size on the upper surface of the flat plate raw material, and obtaining a semi-finished flat plate.
[0030] Specifically, during the pressing process, it is necessary to pay attention to controlling the pressure and temperature to ensure the compactness and stability of the sealing layer. In the specific implementation process, the third preset size is 80 mm in length, 60 mm in width, and 0.4 mm in thickness.
[0031] S6. Spray paint for a second time on the upper surface of the flat semi-finished product according to a third preset interval, forming a plurality of paint stripes on the upper surface of the semi-finished product.
[0032] Specifically, the method of the second painting is the same as the first painting, but the position and interval of the painting need to be precisely controlled to ensure the uniform distribution and integrity of the paint stripes, which is convenient for the subsequent second electroplating process.
[0033] S7, cross-cutting the flat semi-finished product to obtain a plurality of semi-finished product blocks of a fourth preset size.
[0034] Specifically, the cutting tool can also be a grinding wheel cutter, and the cutting parameters need to be precisely controlled to ensure cutting quality and efficiency. In the specific implementation process, the fourth preset size is 2.5 mm in length, 2 mm in width, and 1 mm in thickness.
[0035] S8. Spray paint for the third time on the front and rear surfaces of several semi-finished blocks.
[0036] Specifically, the method of the third painting is the same as the first painting, but the position of the painting needs to be precisely controlled to facilitate the subsequent second electroplating process.
[0037] S9. Perform a second electroplating on the unpainted parts of several semi-finished blocks to form an electroplating layer 2 on the outer surface of the blocks to obtain a finished inductor.
[0038] Specifically, the electroplating process is the same as the fourth step, but the position and area of the electroplating need to be precisely controlled to ensure the uniform distribution and integrity of the electroplating layer 2 so that a passage is formed between the electroplating layer 2 and the internal electroplating tank 4 .
[0039] The implementation principle of this embodiment is as follows: Through the above steps, efficient and low-cost production of micro-inductors can be achieved. First, through compression molding and flat molds, the dimensional accuracy and consistency of the inductor can be ensured. Secondly, through multiple spray painting and electroplating, reliable insulating layers and conductive layers can be formed to improve the electrical performance and reliability of the inductor. In addition, through precise cutting and assembly, high-density integration and miniaturization of inductors can be achieved to meet the needs of modern electronic products. The entire production process is simple and controllable, suitable for large-scale production and application, and can simplify the production process of micro-inductors and reduce production costs.
[0040] The present application also provides a micro-inductor, which is manufactured by the above-mentioned micro-inductor manufacturing method. Figure 2 and Figure 3 The inductor includes an inductor body 1, and the outer surface of the inductor body 1 includes a plating layer 2 and a paint layer 3, wherein the plating layer 2 is provided on the left and right surfaces and both sides of the upper surface, and the paint layer 3 is provided on the front and rear surfaces, the lower surface, and the middle of the upper surface. The inside of the inductor body 1 is penetrated by a plating tank 4 on the left and right sides, and the plating tank 4 and the plating layer 2 form a passage.
[0041] In the specific implementation process, the micro-inductor provided in the embodiment of the present application has a length of 2.5 mm, a width of 2 mm, and a thickness of 1 mm. The electroplating layer 2 and the electroplating tank 4 include a copper layer with a thickness of 0.005 mm, a nickel layer with a thickness of 0.003 mm, and a tin layer with a thickness of 0.01 mm. The paint layer 3 is an insulating paint, such as epoxy resin paint or polyurethane paint.
[0042] Example 2 This embodiment provides a method for manufacturing a micro-inductor, which is different from the above-mentioned embodiment in that: in step S1 and step S5, the composition of the preformed powder can be adjusted, and nano-scale conductive particles, such as carbon nanotubes or graphene, can be added to improve the electrical conductivity and thermal conductivity of the inductor. In the specific implementation process, 1% to 5% of carbon nanotubes or graphene can be added to the preformed powder to enhance the electrical conductivity and thermal conductivity of the inductor. During the filling process, it is necessary to ensure the uniform distribution of the conductive particles, which can be achieved by stirring or ultrasonic dispersion.
[0043] The implementation principle of this embodiment is: by adding nano-scale conductive particles to the prefabricated powder, the conductivity and thermal conductivity of the inductor can be significantly improved. Carbon nanotubes and graphene have excellent electrical conductivity and thermal conductivity, which can effectively reduce the resistance and temperature rise of the inductor and improve work efficiency and stability. In addition, nano-scale conductive particles can also enhance the mechanical strength and durability of the inductor, so that it can still maintain good performance in harsh environments. This structure is particularly suitable for high-power and high-temperature applications, and can effectively extend the service life and reliability of the inductor.
[0044] Example 3 This embodiment provides a method for manufacturing a micro-inductor, which is different from the above embodiment in that: in step S8, laser painting can be used instead of a traditional sprayer or dip coater. Laser painting can achieve more precise control of the painting position and thickness, and improve the quality of painting. In the specific implementation process, a laser painting machine can be used to set appropriate laser power and scanning speed to ensure the uniformity and integrity of the paint layer 3. Laser painting can be used for the first painting, the second painting, and the third painting. Especially for complex geometric shapes and small-sized parts, the advantages of laser painting are more obvious.
[0045] The implementation principle of this embodiment is: by adopting laser spraying, more accurate control of the spraying position and thickness can be achieved, and the quality of spraying can be improved. Laser spraying can avoid the problems of uneven paint layer 3 and inconsistent thickness caused by traditional sprayers or dip coaters, and ensure the reliability and stability of the insulating layer. In addition, laser spraying can also reduce material waste and environmental pollution during the spraying process, and improve production efficiency and environmental protection performance. This technology is particularly suitable for applications with high precision and high quality requirements, and can effectively improve the performance and reliability of the inductor.
[0046] Example 4 This embodiment provides a method for manufacturing a micro-inductor, which is different from the above embodiment in that: in step S9, micro-arc oxidation technology can be used to replace traditional electroplating technology to form a more uniform and dense electroplating layer 2. Micro-arc oxidation technology can generate a ceramic film on the surface of the inductor, which has excellent wear resistance and corrosion resistance. In the specific implementation process, the semi-finished inductor block can be placed in a micro-arc oxidation electrolyte, and a suitable voltage and current are set to generate a ceramic film on the surface of the inductor through micro-arc discharge. The thickness of the ceramic film can be set to 0.01mm~0.05mm to ensure the conductivity and mechanical strength of the inductor.
[0047] The implementation principle of this embodiment is: by adopting the micro-arc oxidation technology, a more uniform and dense electroplating layer 2 can be formed, thereby improving the conductivity and mechanical strength of the inductor. The ceramic film generated by the micro-arc oxidation technology has excellent wear resistance and corrosion resistance, which can effectively protect the inductor from the influence of the external environment and extend its service life. In addition, the micro-arc oxidation technology can also improve the thermal conductivity of the inductor, reduce the operating temperature, and improve the working efficiency and stability. This technology is particularly suitable for applications requiring high performance and long life, and can effectively improve the comprehensive performance and market competitiveness of the inductor.
[0048] The embodiments of this specific implementation are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. The same components are represented by the same figure marks. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.
Claims
1. A method for manufacturing a micro-inductor, characterized in that: include: The prefabricated powder is loaded into a flat plate mold of a first preset size for a first pressing molding to obtain a flat plate raw material; Apply the first spray paint to the six sides of the flat stock; Performing a first cutting on the upper surface of the flat plate material after the first painting, and cutting a plurality of transverse grooves of a second preset size transversely according to a first preset spacing; Performing a first electroplating on the plurality of transverse grooves cut out for the first time to obtain a plurality of electroplating grooves; The upper surface of the flat plate raw material after the first electroplating is filled with prefabricated powder and pressed for a second time, so that the prefabricated powder forms a sealing layer of a third preset size on the upper surface of the flat plate raw material to obtain a semi-finished flat plate; Spray painting the upper surface of the flat semi-finished product for a second time according to a third preset interval, forming a plurality of paint stripes on the upper surface of the semi-finished product; Cross-cutting the flat semi-finished product to obtain a plurality of semi-finished product blocks of a fourth preset size; The front and rear surfaces of several semi-finished blocks are spray-painted for the third time; The unpainted parts of several semi-finished blocks are electroplated for the second time to form an electroplating layer on the outer surface of the block to obtain a finished inductor.
2. A method for manufacturing a micro-inductor according to claim 1, characterized in that: The first preset size has a length of 80 mm, a width of 60 mm, and a thickness of 0.6 mm.
3. A method for manufacturing a micro-inductor according to claim 2, characterized in that: The second preset size has a length of 80 mm, a width of 0.5 mm, and a depth of 0.4 mm.
4. A method for manufacturing a micro-inductor according to claim 3, characterized in that: The third preset size has a length of 80 mm, a width of 60 mm, and a thickness of 0.4 mm.
5. A method for manufacturing a micro-inductor according to claim 4, characterized in that: The fourth preset size has a length of 2.5 mm, a width of 2 mm, and a thickness of 1 mm.
6. The method for manufacturing a micro-inductor according to claim 1, characterized in that: The first electroplating comprises: electroplating a copper layer, a nickel layer and a tin layer in sequence.
7. A method for manufacturing a micro-inductor according to claim 6, characterized in that: The copper layer has a thickness of 0.005 mm, the nickel layer has a thickness of 0.003 mm, and the tin layer has a thickness of 0.01 mm.
8. A method for manufacturing a micro-inductor according to any one of claims 1 to 7, characterized in that: The first cutting and the second cutting are performed using a grinding wheel cutting machine.
9. A method for manufacturing a micro-inductor according to any one of claims 1 to 7, characterized in that: The first spray painting, the second spray painting and the third spray painting all use insulating paint.
10. A miniature inductor, characterized in that: The inductor is manufactured by a micro-inductor manufacturing method according to any one of claims 1 to 9; The inductor comprises an inductor body (1), the outer surface of the inductor body (1) comprises an electroplating layer (2) and a paint layer (3), the electroplating layer (2) is arranged on the left and right surfaces and both sides of the upper surface, and the paint layer (3) is arranged on the front and rear surfaces, the lower surface and the middle part of the upper surface; An electroplating tank (4) runs through the inside of the inductor body (1) on the left and right sides, and the electroplating tank (4) and the electroplating layer (2) form a passage.
Citation Information
Patent Citations
Lead frame for semiconductor packaging and preparation method thereof
CN112530896A
Integrated segmented forming micro-inductor manufacturing process
CN112542305A
Inductor magnetic core forming machining method
CN114093649A