Button components and electronic devices

Abstract

This application discloses a button assembly and an electronic device. The button assembly includes: a carrier having a receiving groove; a button including a keycap and a connector, at least a portion of the keycap being located within the receiving groove, the connector being located on the side of the keycap facing the bottom of the receiving groove, and the connector connecting the middle portion of the keycap and the carrier, the keycap, connector, and the groove wall of the receiving groove enclosing a first working area and a second working area; and multiple sensor groups, with at least one sensor group located in the first working area and at least one sensor group located in the second working area. Each sensor group includes: a sensing structure connected to the keycap; and a support member supported between the sensing structure and the bottom of the receiving groove, or supported between the keycap and the bottom of the receiving groove.

Description

Technical Field

[0001] This application belongs to the technical field of electronic devices, specifically relating to a button assembly and an electronic device. Background Technology

[0002] In related technologies, electronic devices include pressure-sensitive buttons. These buttons consist of two sensor groups and two metal frames, spaced apart and positioned between the two sensor groups. The sensor groups are brittle, and the portion of the sensor group between the two metal frames has low support strength, with the connection point between the sensor group and the metal frames being a stress concentration area. When the pressure-sensitive button is triggered, external force acts directly on the sensor group. As the electronic device is used over time, cracks are prone to appear in the portion of the sensor group between the two metal frames, leading to button failure. This significantly reduces the lifespan of the pressure-sensitive button and decreases the performance of the electronic device. Summary of the Invention

[0003] This application aims to provide a button assembly and electronic device that solves one of the problems of easy failure and short service life of pressure-sensitive buttons in related technologies.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows:

[0005] In a first aspect, embodiments of this application propose a key assembly, comprising: a carrier having a receiving groove; a key, the key including a keycap and a connector, at least a portion of the keycap being located within the receiving groove, the connector being located on the side of the keycap facing the bottom of the receiving groove, and the connector connecting the middle portion of the keycap and the carrier, the keycap, the connector, and the groove wall of the receiving groove enclosing a first working area and a second working area; and a plurality of sensor groups, at least one sensor group being provided in the first working area and at least one sensor group being provided in the second working area, each sensor group including: a sensing structure connected to the keycap; and a support member supported between the sensing structure and the bottom of the receiving groove, or supported between the keycap and the bottom of the receiving groove.

[0006] Secondly, embodiments of this application provide an electronic device, including: a button assembly as described in the first aspect.

[0007] In embodiments of this application, the button assembly includes a carrier, a button, and multiple sensor groups. Each of the multiple sensor groups includes a sensing structure and a support member.

[0008] The key includes a keycap and a connector. At least a portion of the keycap is located within a receiving groove. The connector is located on the side of the keycap facing the bottom of the receiving groove. The connector connects to the middle of the keycap and also connects to a carrier. The portion of the carrier located around the connector is suspended in the air.

[0009] The support is positioned between the sensing structure and the bottom of the receiving groove, or between the keycap and the bottom of the receiving groove. It is understood that the connector and support work together to support the keycap, and that they together define the mating dimensions between the keycap and the carrier.

[0010] It is understandable that when the support is placed between the sensing structure and the bottom of the receiving groove, external force is applied to the key assembly, and the part of the keycap that is opposite to the support will deform.

[0011] Understandably, when the support is placed between the keycap and the bottom of the receiving groove, and the support is close to the connector, an external force is applied to the key assembly, and the part of the keycap located outside the support will deform.

[0012] It is understandable that when the support is placed between the keycap and the bottom of the receiving groove, and the support is located on the outer peripheral wall of the keycap, external force will be applied to the key assembly, and the part of the keycap located between the support and the connector will deform.

[0013] When an external force is applied to the button assembly, the sensor group is triggered. Specifically, when an external force is applied to the button, the keycap deforms and drives the sensor structure to deform (e.g., torsional deformation). The detection data of the sensor structure is correlated with the applied pressure to determine the pressing force of the button, and this serves as the data basis for triggering the corresponding preset function.

[0014] By rationally designing the cooperative structure of the carrier, buttons, sensor group, and support components, the keycaps and sensing structures are more easily deformed when external force is applied to the buttons. The keycaps and sensing structures can undergo greater deformation, which helps to increase the signal quantity of the sensor group, improve the sensitivity and accuracy of the sensor group in detecting pressure, and enable the corresponding preset functions of electronic devices to be triggered accurately and quickly, thereby improving the product's performance and market competitiveness.

[0015] Furthermore, the keycap, connector, and the wall of the receiving groove enclose a first working area and a second working area. At least one sensor group is located in the first working area, and at least one sensor group is located in the second working area. That is, the sensing structure is located on the side of the keycap facing the bottom of the receiving groove. In other words, the keycap protects the sensing structure. The sensing structure is not suspended in mid-air, and external forces do not directly act on it. This increases the support strength for the sensing structure, making it less prone to damage and failure, extending the lifespan of the key assembly, and improving the safety and reliability of the electronic device.

[0016] In addition, at least one sensor group is provided in the first working area and at least one sensor group is provided in the second working area, that is, at least one sensor group is provided in each working area. In this way, no matter where the button component is pressed, the keycap and the sensing structure can be effectively deformed, and the button component can be effectively triggered, which helps to improve the sensitivity and accuracy of the button component.

[0017] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0018] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0019] Figure 1 This is a partial structural diagram of the button assembly in the first state according to the first embodiment of this application;

[0020] Figure 2 This is a partial structural schematic diagram of the button assembly in the second state according to the first embodiment of this application;

[0021] Figure 3 This is a partial structural diagram of the button assembly in the third state according to the first embodiment of this application;

[0022] Figure 4 This is a partial structural diagram of the button assembly in the fourth state according to the first embodiment of this application;

[0023] Figure 5 This is a schematic diagram of the sensing structure according to an embodiment of this application;

[0024] Figure 6 This is a partial structural diagram of the button assembly in the first state according to the second embodiment of this application;

[0025] Figure 7 This is a partial structural schematic diagram of the button assembly in the second state according to the second embodiment of this application;

[0026] Figure 8 This is a partial structural diagram of the button assembly in the first state according to the third embodiment of this application;

[0027] Figure 9 This is a partial structural diagram of the button assembly in the second state according to the third embodiment of this application;

[0028] Figure 10 This is a partial structural schematic diagram of the button assembly according to the fourth embodiment of this application;

[0029] Figure 11 This is a partial structural schematic diagram of the button assembly according to the fifth embodiment of this application;

[0030] Figure 12 This is a partial structural schematic diagram of the button assembly in the first state according to the sixth embodiment of this application;

[0031] Figure 13 This is a partial structural schematic diagram of the button assembly in the second state according to the sixth embodiment of this application;

[0032] Figure 14 This is a partial structural diagram of the button assembly in the first state according to the seventh embodiment of this application;

[0033] Figure 15 This is a partial structural schematic diagram of the button assembly in the second state according to the seventh embodiment of this application;

[0034] Figure 16 This is a partial structural schematic diagram of the button assembly according to the eighth embodiment of this application;

[0035] Figure 17 This is a schematic diagram of the structure of the keycap and the first part of the sensing structure according to an embodiment of this application;

[0036] Figure 18 This is a schematic diagram of the second part of the keycap and sensing structure according to one embodiment of this application;

[0037] Figure 19 This is a schematic diagram of the third part of the keycap and sensing structure according to an embodiment of this application;

[0038] Figure 20 This is a schematic diagram of the structure of an electronic device according to the first embodiment of this application;

[0039] Figure 21 This is a schematic diagram of the structure of an electronic device according to the second embodiment of this application;

[0040] Figure 22 This is a partial structural schematic diagram of a sensing structure according to an embodiment of this application;

[0041] Figure 23 This is a schematic diagram of the sensing structure under stress according to an embodiment of this application.

[0042] Figure label:

[0043] Figures 1 to 23 The correspondence between the reference numerals and component names in the attached drawings is as follows:

[0044] 10 Key assembly, 100 Carrier, 110 Receiving slot, 112 Slot bottom of receiving slot, 114 Slot opening of receiving slot, 116 Second mounting cavity, 200 Key, 210 Keycap, 212 Middle part of keycap, 214 Outer peripheral wall of keycap, 220 Connector, 222 Connecting section, 224 Limiting section, 310 First working area, 320 Second working area, 330 First mounting cavity, 400 Sensor group, 410 Sensor structure, 412 Conductive element, 4122 Solder pad, 4124 Conductive part, 414 Pressure-sensitive part, 416 Insulating protective layer, 420 Support, 430 First flexible circuit board, 440 Elastic frame, 450 Switch, 460 Gold finger, 470 Wire, 482 First resistor, 484 Second resistor, 490 Conductor, 500 Second flexible circuit board, 60 Electronic device, 600 Frame, 700 Power button, 800 Volume button. Detailed Implementation

[0045] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0046] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0047] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0048] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0049] The following is in conjunction with the appendix Figures 1 to 23 This application describes the button assembly 10 and the electronic device 60 provided in the embodiments of this application.

[0050] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 , Figure 15 and Figure 16 As shown, a key assembly 10 according to some embodiments of this application includes: a carrier 100, the carrier 100 having a receiving groove 110; a key 200, the key 200 including a keycap 210 and a connector 220, at least a portion of the keycap 210 being located within the receiving groove 110, the connector 220 being located on the side of the keycap 210 facing the bottom 112 of the receiving groove, and the connector 220 connecting the middle portion 212 of the keycap and the carrier 100, the keycap 210, the connector 220 and the groove wall of the receiving groove 110. The system encloses a first working area 310 and a second working area 320; it includes multiple sensor groups 400, with at least one sensor group 400 located in the first working area 310 and at least one sensor group 400 located in the second working area 320. Each sensor group 400 includes: a sensing structure 410 connected to a keycap 210; and a support member 420 supported between the sensing structure 410 and the bottom 112 of the receiving groove, or supported between the keycap 210 and the bottom 112 of the receiving groove.

[0051] In embodiments of this application, the button assembly 10 includes a carrier 100, a button 200, and a plurality of sensor groups 400. Each of the plurality of sensor groups 400 includes a sensing structure 410 and a support member 420.

[0052] The key 200 includes a keycap 210 and a connector 220. At least a portion of the keycap 210 is located within a receiving groove 110. The connector 220 is located on the side of the keycap 210 facing the bottom 112 of the receiving groove. The connector 220 connects to the middle portion 212 of the keycap and also connects to a carrier 100. The portion of the carrier 100 located around the connector 220 is suspended.

[0053] The support member 420 is supported between the sensing structure 410 and the bottom 112 of the receiving groove, or the support member 420 is supported between the keycap 210 and the bottom 112 of the receiving groove. It can be understood that the connector 220 cooperates with the support member 420 to jointly support the keycap 210, and the connector 220 cooperates with the support member 420 to jointly define the mating dimensions of the keycap 210 and the carrier 100.

[0054] It is understandable that when the support 420 is supported between the sensing structure 410 and the bottom 112 of the receiving groove, an external force is applied to the key assembly 10, and the part of the keycap 210 that is opposite to the support 420 will deform.

[0055] It is understandable that when the support member 420 is supported between the keycap 210 and the bottom 112 of the receiving groove, and the support member 420 is close to the connector 220, an external force is applied to the key assembly 10, and the part of the keycap 210 located outside the support member 420 will deform.

[0056] It is understandable that when the support member 420 is supported between the keycap 210 and the bottom 112 of the receiving groove, and the support member 420 is located at the outer peripheral wall 214 of the keycap, an external force is applied to the key assembly 10, and the part of the keycap 210 located between the support member 420 and the connector 220 will deform.

[0057] When an external force is applied to the key assembly 10, the sensor group 400 is triggered. Specifically, when an external force is applied to the key 200, the keycap 210 deforms and drives the sensing structure 410 to deform (e.g., torsional deformation). The detection data of the sensing structure 410 is correlated with the pressure applied to it, so as to determine the pressing force applied to the key 200, and use this as the data basis for triggering the corresponding preset function.

[0058] By rationally configuring the cooperative structure of the carrier 100, button 200, sensor group 400, and support member 420, when an external force is applied to the button 200, the keycap 210 and the sensing structure 410 are more likely to deform. The keycap 210 and the sensing structure 410 can undergo greater deformation, which helps to increase the signal quantity of the sensing group 400, improve the sensitivity and accuracy of the sensing group 400 in detecting pressure, and enable the corresponding preset functions of the electronic device 60 to be triggered accurately and quickly, thereby improving the product's performance and market competitiveness.

[0059] Furthermore, the keycap 210, connector 220, and the groove walls of receiving groove 110 enclose a first working area 310 and a second working area 320. At least one sensor group 400 is provided in the first working area 310, and at least one sensor group 400 is provided in the second working area 320. That is, the sensing structure 410 is located on the side of the keycap 210 facing the bottom 112 of the receiving groove. In other words, the keycap 210 serves to protect the sensing structure 410. The sensing structure 410 is not suspended in mid-air, and external forces do not directly act on it. This improves the support strength for the sensing structure 410, making it less prone to damage and failure, thus extending the service life of the key assembly 10 and improving the safety and reliability of the electronic device 60.

[0060] In addition, at least one sensor group 400 is provided in the first working area 310 and at least one sensor group 400 is provided in the second working area 320, that is, at least one sensor group 400 is provided in each working area. In this way, no matter where the button assembly 10 is pressed, the keycap 210 and the sensing structure 410 can be effectively deformed, and the button assembly 10 can be effectively triggered, which helps to improve the sensitivity and accuracy of the button assembly 10.

[0061] in, Figure 2 , Figure 3 , Figure 7 , Figure 9 , Figure 13 and Figure 15 This is a schematic diagram of the single-sided press button assembly 10, with arrows indicating the direction of the external force. Figure 4 This is a schematic diagram of the sliding button assembly 10, with arrows indicating the direction of the external force.

[0062] In some embodiments, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 6 , Figure 7 , Figure 8 and Figure 9 As shown, the sensor assembly 400 also includes a flexible frame 440, through which the sensor structure 410 is connected to the keycap 210.

[0063] In this embodiment, the sensor assembly 400 also includes a flexible frame 440.

[0064] The sensing structure 410 is connected to the keycap 210 via an elastic bracket 440. The elastic bracket 440 serves as the mounting carrier 100 for the sensing structure 410, and has the function of mounting and fixing the sensing structure 410.

[0065] Furthermore, the elastic frame 440 is elastic, capable of deforming under external force, and able to recover its deformation when the external force is removed. Specifically, when an external force is applied to the key assembly 10, the sensor assembly 400 is triggered. Specifically, when an external force is applied to the key 200, the keycap 210 deforms and drives the elastic frame 440 to deform (e.g., torsional deformation). The deformation of the elastic frame 440 drives the sensing structure 410 to deform (e.g., torsional deformation). The detection data of the sensing structure 410 is correlated with the applied pressure to determine the pressing force of the key 200, and this serves as the data basis for triggering the corresponding preset function.

[0066] In some embodiments, such as Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, when the support member 420 is used to support the sensing structure 410, the elastic frame 440 is connected to the side of the keycap 210 facing the bottom 112 of the receiving groove. The elastic frame 440 and the keycap 210 enclose the first mounting cavity 330, and the sensing structure 410 is located in the first mounting cavity 330.

[0067] In this embodiment, the mating structure of the elastic frame 440, keycap 210, and sensing structure 410 is further defined.

[0068] The elastic bracket 440 is connected to the side of the keycap 210 facing the bottom 112 of the receiving groove, that is, a portion of the carrier 100 is recessed, and the elastic bracket 440 is connected to the opening of the recess. The elastic bracket 440 and the keycap 210 enclose the first mounting cavity 330. The first mounting cavity 330 serves to mount and fix the sensing structure 410. The mating dimensions of the keycap 210, the sensing structure 410, and the elastic bracket 440 can be reduced in the direction from the keycap 210 to the elastic bracket 440.

[0069] This configuration can reduce the overall size of the key assembly 10 along the direction from the keycap 210 to the elastic frame 440, which helps to reduce the internal space occupancy of the electronic device 60 and facilitates the layout of other components of the electronic device 60.

[0070] In addition, the first mounting cavity 330 can also block moisture and dirt in the environment, preventing moisture and dirt from entering the sensing structure 410, and providing structural support to ensure the performance and service life of the sensing structure 410.

[0071] In addition, this setting can increase the deformation of the keycap 210 and the sensing structure 410 when the key assembly 10 is subjected to force, which is beneficial to improving the trigger sensitivity of the key assembly 10.

[0072] In some embodiments, such as Figure 6 , Figure 7 , Figure 8 and Figure 9 As shown, when the support member 420 is used to support the keycap 210, the elastic frame 440 is connected between the sensing structure 410 and the keycap 210.

[0073] In this embodiment, the mating structure of the elastic frame 440, keycap 210, and sensing structure 410 is further defined.

[0074] The elastic frame 440 is connected between the sensing structure 410 and the keycap 210. That is, along the direction from the keycap 210 to the connector 220, the elastic frame 440 is located between the sensing structure 410 and the keycap 210. When an external force is applied to the key 200, the keycap 210 deforms and drives the elastic frame 440 to deform (e.g., torsional deformation), and the deformation of the elastic frame 440 drives the sensing structure 410 to deform (e.g., torsional deformation).

[0075] In some embodiments, such as Figure 8 , Figure 9 , Figure 11 , Figure 14 and Figure 15 As shown, when the support member 420 is used to support the keycap 210, the support member 420 is located between the sensing structure 410 and the connector 220.

[0076] In this embodiment, the positional relationship between the support member 420, the sensing structure 410, and the connector 220 is further defined.

[0077] The support member 420 is located between the sensing structure 410 and the connector 220. The connector 220 and the support member 420 cooperate to increase the effective support area of ​​the keycap 210 and ensure the effective fit size between the keycap 210 and the carrier 100.

[0078] Understandably, along the direction from the connector 220 to the support 420, the portion of the keycap 210 located outside the support 420 is suspended, and this suspended portion is relatively large. When an external force is applied to the suspended portion of the keycap 210, the keycap 210 is prone to tilting; that is, the tilting angle of the keycap 210 is relatively large. Consequently, the sensing structure 410 will also tilt accordingly. This is beneficial for increasing the signal quantity of the sensing group 400, improving the sensitivity and accuracy of the sensing group 400 in detecting pressure, enabling precise and rapid triggering of the corresponding preset functions of the electronic device 60, and ultimately enhancing the product's performance and market competitiveness.

[0079] In some embodiments, the support 420 is closer to the connector 220 than the sensing structure 410.

[0080] In this embodiment, the positional relationship between the support member 420, the sensing structure 410, and the connector 220 is further defined.

[0081] The support member 420 is closer to the connector 220 than the sensing structure 410. That is, along the direction from the support member 420 to the connector 220, the distance between the end faces of the support member 420 and the connector 220 that are disposed opposite to each other is less than the distance between the end faces of the support member 420 and the sensing structure 410 that are disposed opposite to each other.

[0082] This design, while ensuring the supporting area of ​​the connector 220 and the support 420 for the keycap 210, further increases the volume of the suspended part of the keycap 210, making the keycap 210 easier to lift, which is beneficial to improving the sensitivity and accuracy of the sensor group 400 in detecting pressure.

[0083] In some embodiments, such as Figure 6 , Figure 7 , Figure 10 , Figure 12 , Figure 13 and Figure 16 As shown, when the support member 420 is used to support the keycap 210, the sensing structure 410 is located between the connector 220 and the support member 420.

[0084] In this embodiment, the positional relationship between the support member 420, the sensing structure 410, and the connector 220 is further defined.

[0085] The sensing structure 410 is located between the connector 220 and the support 420. The connector 220 and the support 420 cooperate to increase the effective support area of ​​the keycap 210 and ensure the effective fit size between the keycap 210 and the carrier 100.

[0086] Understandably, the sensing structure 410 is located between the connector 220 and the support 420. Therefore, the portion of the keycap 210 between the connector 220 and the support 420 is suspended, and this suspended portion is relatively large. When external force is applied to the suspended portion of the keycap 210, the keycap 210 is prone to deformation. That is, the deformation of the keycap 210 is large, and the sensing structure 410 will also deform accordingly. This helps to increase the signal quantity of the sensing group 400, improves the sensitivity and accuracy of the sensing group 400 in detecting pressure, and enables precise and rapid triggering of the corresponding preset functions of the electronic device 60, thereby improving the product's performance and market competitiveness.

[0087] In some embodiments, such as Figure 6 , Figure 7 , Figure 10 , Figure 12 , Figure 13 and Figure 16 As shown, the support 420 abuts against the outer peripheral wall 214 of the keycap.

[0088] In this embodiment, the positional relationship between the support member 420 and the keycap 210 is further defined.

[0089] The support 420 abuts against the outer peripheral wall 214 of the keycap.

[0090] This design, while ensuring the supporting area of ​​the connector 220 and the support 420 for the keycap 210, further increases the volume of the suspended part of the keycap 210, making the keycap 210 more easily deformable, which is beneficial to improving the sensitivity and accuracy of the sensor group 400 in detecting pressure.

[0091] In some embodiments, such as Figure 5 As shown, the sensing structure 410 includes: a plurality of conductive elements 412, which are arranged at intervals, each conductive element 412 including a pad 4122 and a conductive portion 4124, the conductive portion 4124 being stacked on one side of the pad 4122; at least one pressure-sensitive portion 414, with a pressure-sensitive portion 414 connected between two adjacent conductive elements 412; and an insulating protective layer 416 covering the plurality of conductive elements 412 and at least one pressure-sensitive portion 414.

[0092] In this embodiment, the composition of the sensing structure 410 is further defined.

[0093] The sensing structure 410 includes a plurality of conductive elements 412, at least one pressure-sensitive part 414, and an insulating protective layer 416.

[0094] Multiple conductive elements 412 are arranged at intervals. Each conductive element 412 includes a pad 4122 and a conductive portion 4124. The conductive portion 4124 is stacked on one side of the pad 4122, and the pad 4122 is electrically connected to the conductive portion 4124.

[0095] A pressure-sensitive part 414 is connected between two adjacent conductive elements 412. An insulating protective layer 416 covers multiple conductive elements 412 and at least one pressure-sensitive part 414.

[0096] The insulating protective layer 416 serves to protect multiple conductive elements 412 and at least one pressure-sensitive element 414, and also provides insulation, thus meeting the safety requirements for the use of the button assembly 10.

[0097] Optionally, the conductive part 4124 includes a conductive paste.

[0098] In some embodiments, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Figure 9As shown, the sensing structure 410 also includes a first flexible circuit board 430, a plurality of conductive elements 412, at least one pressure-sensitive part 414 and an insulating protective layer 416 connected to the same side of the first flexible circuit board 430, and the first flexible circuit board 430 is connected to the keycap 210.

[0099] In this embodiment, the sensing structure 410 further includes a first flexible circuit board 430. A plurality of conductive elements 412, at least one pressure-sensitive part 414, and an insulating protective layer 416 are connected to the same side of the first flexible circuit board 430, and the first flexible circuit board 430 is connected to the keycap 210.

[0100] When the sensing assembly 400 includes a flexible frame, the first flexible circuit board 430 is connected to the keycap 210 via the flexible frame 440. That is, any one of the plurality of conductive elements 412, pressure-sensitive parts 414, and insulating protective layers 416 is located on the side of the first flexible circuit board 430 away from the flexible frame 440, and the flexible frame 440 is connected to the keycap 210.

[0101] The elastic frame 440 serves as a mounting carrier 100 for the first flexible circuit board 430, multiple conductive elements 412, at least one pressure-sensitive part 414, and insulating protective layer 416, and has the function of mounting and fixing the first flexible circuit board 430, multiple conductive elements 412, at least one pressure-sensitive part 414, and insulating protective layer 416.

[0102] In some embodiments, such as Figure 10 and Figure 11 As shown, pad 4122 connects to keycap 210.

[0103] In this embodiment, the mating structure of the sensing structure 410 and the keycap 210 is further defined.

[0104] The sensing structure 410 includes a plurality of conductive elements 412, at least one pressure-sensitive portion 414, and an insulating protective layer 416. Each conductive element 412 includes a pad 4122 and a conductive portion 4124, with the pad 4122 of the conductive element 412 connected to the keycap 210. This arrangement can reduce the overall size of the key assembly 10 along the direction from the keycap 210 to the connector 220, which helps to save installation space for the key assembly 10.

[0105] In some embodiments, such as Figure 16 As shown, the sensor assembly 400 also includes a switch 450, which is located on the side of the support 420 facing the keycap 210.

[0106] In this embodiment, the structure of the sensor assembly 400 is further defined. The sensor assembly 400 also includes a switch 450, which is disposed on the side of the support member 420 facing the keycap 210. That is, the support member 420 serves as a mounting carrier 100 for the switch 450, and has the function of mounting and fixing the switch 450. This arrangement enables the button assembly 10 to have a local vibration feedback function, enriching the functionality of the button assembly 10 and improving its performance.

[0107] Optionally, switch 450 includes any one or a combination of the following: piezoelectric ceramic, linear motor, electromagnetic motor, and spring.

[0108] In some embodiments, the carrier 100 is further provided with a second mounting cavity 116. Along the direction from the opening 114 of the receiving groove to the bottom of the groove, the second mounting cavity 116 is arranged at intervals on one side of the receiving groove 110. The connector 220 includes a connecting section 222 and a limiting section 224. The limiting section 224 is located in the second mounting cavity 116. One end of the connecting section 222 is connected to the keycap 210, and the other end of the connecting section 222 extends into the second mounting cavity 116 and is connected to the limiting section 224.

[0109] In this embodiment, the mating structure of the carrier 100 and the button 200 is further defined.

[0110] The carrier 100 is also provided with a second mounting cavity 116, which is arranged at intervals on one side of the receiving groove 110 along the direction from the opening 114 of the receiving groove to the bottom of the groove.

[0111] The connector 220 includes a connecting section 222 and a limiting section 224. The limiting section 224 is located within the second mounting cavity 116. One end of the connecting section 222 is connected to the keycap 210, and the other end of the connecting section 222 extends into the second mounting cavity 116 and is connected to the limiting section 224. That is, a portion of the connector 220 is located within the receiving groove 110, and the other portion of the connector 220 extends into the second mounting cavity 116.

[0112] The cavity wall of the second mounting cavity 116 has a limiting section 224, which, together with the structure of the receiving groove 110, the support member 420 and the connecting section 222, ensures the fit size between the keycap 210 and the bottom 112 of the receiving groove along the direction from the keycap 210 to the connecting member 220.

[0113] like Figure 20 and Figure 21 As shown, an electronic device 60 according to some embodiments of this application includes: a button assembly 10 as described in any of the above embodiments.

[0114] The electronic device 60 provided in this application includes the button assembly 10 of any of the above embodiments, and therefore has all the beneficial effects of the button assembly 10, which will not be described in detail here.

[0115] Optionally, the electronic device 60 may be a mobile terminal such as a mobile phone, a wearable device, a tablet computer, a laptop computer, a mobile computer, an augmented reality device (also known as an AR device), a virtual reality device (also known as a VR device), and a handheld game console, etc.

[0116] In some embodiments, such as Figure 20 and Figure 21 As shown, the electronic device 60 also includes a frame 600, a portion of which is configured as a carrier 100.

[0117] In this embodiment, the structure of the electronic device 60 is further defined, and the electronic device 60 also includes a frame 600.

[0118] A portion of the frame 600 is configured as a carrier 100, that is, a portion of the frame 600 forms a carrier 100. The frame 600 is provided with a receiving groove 110. The frame 600 also serves to install buttons 200 and multiple sensor groups 400.

[0119] Optionally, this application places the sensing structure 410 of the sensing group 400 on the button 200. By applying external force to the button 200 to press or slide the button 200, the pressure-sensitive part 414 of the sensing structure 410 is deformed, generating a change in resistance, which is then converted into an electrical signal to achieve the corresponding function.

[0120] This application, through a reasonable structural design of the button assembly 10, can increase the structural strength of the button assembly 10 while simultaneously improving its signal strength. Furthermore, it allows for software debugging to enable the button assembly 10 to perform single-click, double-click, and side-swipe detection functions. Examples include single-click for focusing, double-click for waking up or taking a picture, swipe for zooming, and hard-press for taking a picture, among others. This design allows the electronic device 60 to perform multiple functions by triggering the button assembly 10.

[0121] like Figure 22 and Figure 23 As shown, when an external force F is applied to the button assembly 10, the pressure-sensitive part 414 on the first flexible circuit board 430 of the button assembly 10 deforms. During the bending process, the first flexible circuit board 430 will be stretched or compressed, and the resistance R of the pressure-sensitive part 414 will change to R'. Due to the Poisson's ratio of the pressure-sensitive part 414, the resistance changes of R1 (i.e., the first resistance 482) and R2 (i.e., the second resistance 484) are inconsistent. Given that the deformation and resistance of the pressure-sensitive part 414 are linearly related, the pressure difference across the two ends is detected according to the Wheatstone bridge principle to determine whether the pressure-sensitive part 414 is under force and deformed, and the deformation is converted into an electrical signal to realize the corresponding function.

[0122] like Figure 1 As shown, the first flexible circuit board 430 of the sensing structure 410 is attached to the elastic frame 440. Optionally, the elastic frame 440 includes a metal frame, a plastic frame, etc., which are not listed here. The elastic frame 440 is then glued to the key 200. The connection method between the elastic frame 440 and the key 200 includes, but is not limited to, gluing, riveting, screw fastening, and welding. The portion of the keycap 210 opposite to the sensing structure 410 has a groove cut out. The elastic frame 440 and the keycap 210 enclose a first mounting cavity 330, and the sensing structure 410 is located within the first mounting cavity 330. This arrangement can increase the deformation of the keycap 210 when the key assembly 10 is subjected to force. The first resistor 482 of the sensing structure 410 is opposite to the support member 420. Optionally, the support member 420 and the carrier 100 are two relatively independent structures. Optionally, the support member 420 and the carrier 100 are integrally formed. Button 200 is connected to the mainboard of electronic device 60 via a BTB (Board to Board) connector or gold surface on the first flexible circuit board 430. The downward pressure F applied by a finger causes button 200 to bend downwards. Button 200 cooperates with support member 420 to deform elastic frame 440. The deformation of elastic frame 440 causes deformation of sensing structure 410. The change in resistance after deformation of sensing structure 410 is converted into an electrical signal to realize the function detection of button assembly 10.

[0123] Alternatively, the outer peripheral wall 214 of the keycap can be fixed to the carrier 100 with soft glue or soft double-sided tape, which is waterproof and does not hinder the deformation of the keycap 210.

[0124] like Figure 4 As shown, there are two sensor groups 400, denoted as the first sensor group and the second sensor group. The first working area 310 houses the first sensor group, and the second working area 320 houses the second sensor group. When a finger presses the keycap 210 and slides from the first sensor group to the second sensor group, the force on the first sensor group gradually decreases (i.e., the signal strength decreases). At this time, the force on the first sensor group is greater than that on the second sensor group (i.e., the signal strength of the first sensor group is greater than that of the second sensor group). When the pressure point slides to the center point of the first and second sensor groups, the forces on the first and second sensor groups are equal (i.e., the signal strength of the first sensor group is equal to that of the second sensor group). When the finger slides past the center point and approaches the second sensor group, the force on the second sensor group is greater than that on the first sensor group (i.e., the signal strength of the second sensor group is greater than that of the first sensor group).

[0125] The position detection logic is as follows: Input the signal CH1 from the first sensor group, the signal CH2 from the second sensor group, and the length L of the sliding area; output F (force value) and L1 (force position). Wherein, L1=L×(CH1 / (CH1+CH2)), F=(CH1+CH2)×K, and K is the calibration coefficient.

[0126] The magnitude of the signal (CH1+CH2) is almost unaffected by the position of the force F. When the same force is applied to any position on button 200, the difference in signal (CH1+CH2) is small, resulting in good sensitivity consistency. This logic is used to detect the user's hand displacement and realize the sliding function of electronic device 60.

[0127] Optionally, the portions of the keycap 210 located on both sides of the connector 220 have the same shape, and the mating structure of the portions of the keycap 210 located on both sides of the connector 220 is the same as that of the sensor assembly 400. This ensures that under the same pressure, the deformation of the portions of the keycap 210 located on both sides of the connector 220 and the sensor structure 410 is equal.

[0128] When the button assembly 10 generates a trigger signal, the corresponding deformation is less than or equal to 1 mm.

[0129] Optionally, the elastic frame 440 includes a steel sheet with a thickness of less than or equal to 2 mm.

[0130] Optionally, a plurality of conductive elements 412, at least one pressure-sensitive part 414, and an insulating protective layer 416 are connected to the same side of the first flexible circuit board 430, and the overall thickness of the plurality of conductive elements 412, at least one pressure-sensitive part 414, and the insulating protective layer 416 is less than or equal to 1 mm.

[0131] like Figure 6 and Figure 7As shown, the first flexible circuit board 430 of the sensing structure 410 is attached to the elastic frame 440. Optionally, the elastic frame 440 includes a metal frame, a plastic frame, etc., which are not listed here. The elastic frame 440 is then glued to the button 200. The connection method between the elastic frame 440 and the button 200 includes, but is not limited to, gluing, riveting, screw fastening, and welding. The support member 420 is supported at the outer peripheral wall 214 of the keycap. Optionally, the support member 420 and the carrier 100 are two relatively independent structures. Optionally, the support member 420 and the carrier 100 are integrally formed. The button 200 is connected to the motherboard of the electronic device 60 through the BTB (Board to Board) connector or gold surface on the first flexible circuit board 430. The pressure F applied by pressing down with a finger causes the button 200 to bend downwards. The button 200 cooperates with the support member 420 to deform the elastic frame 440. The deformation of the elastic frame 440 causes the sensing structure 410 to deform. The change in resistance of the sensing structure 410 after deformation is converted into an electrical signal to realize the function detection of the button assembly 10.

[0132] like Figure 8 and Figure 9 As shown, the support member 420 is located in the middle position, and the support member 420 is supported between the keycap 210 and the bottom 112 of the receiving groove, and the support member 420 is set close to the connector 220.

[0133] like Figure 10 and Figure 11 As shown, the elastic bracket 440 can also be omitted, and the first flexible circuit board 430 of the sensing structure 410 can be directly attached to the button 200, further saving side space and increasing the overall stacking space.

[0134] like Figures 12 to 16As shown, the first flexible circuit board 430 is removed, and the sensing structure 410 is integrated into the key 200, for example, made into a plastic pressure-sensitive key. Using LDS (Laser Direct Structuring) technology, wires 470, pads 4122, and gold fingers 460 are formed on the inner side of the keycap 210, and at least one pressure-sensitive part and an insulating protective layer 416 are printed on the pads 4122. The gold fingers 460 are interconnected with the second flexible circuit board 500 by soldering, bonding, or spring contact. The second flexible circuit board 500 is connected to the motherboard of the electronic device 60 via BTB (Board to Board) connectors or a gold-plated connector. The support member 420 is located at the outer peripheral wall 214 of the keycap, or the support member 420 is located in the middle of the keycap 210 (e.g., adjacent to the connector 220). Optionally, the support member 420 and the carrier 100 are two relatively independent structures. Optionally, the support member 420 and the carrier 100 are integrally formed. The pressure F applied by pressing down with a finger causes the button 200 to bend downwards. The button 200 cooperates with the support member 420 to deform the button 200 and cause the sensing structure 410 to deform. The change in resistance of the sensing structure 410 after deformation is converted into an electrical signal to realize the function detection of the button assembly 10.

[0135] Optionally, the conductor 490 connects to the gold finger and the second flexible circuit board 500.

[0136] The principle of LDS is to integrate ordinary plastic components and circuit boards with electrical interconnection functions, component support functions, and plastic housing support and protection functions, as well as shielding and antenna functions generated by the combination of mechanical entities and conductive patterns.

[0137] like Figure 17 , Figure 18 and Figure 19 As shown, LDS technology is used to directly fabricate pads 4122, wires 470, and gold fingers 460 on the inner side of the plastic key. Pressure-sensitive portions 414 are printed on the pads 4122 to form pressure-sensitive resistors R1 and R2, and then covered with insulating ink (i.e., an insulating protective layer 416) to achieve the pressure-sensitive function. The gold fingers 460 are interconnected with the second flexible circuit board 500 by soldering, bonding, or spring contact.

[0138] The button assembly 10 of this application, while ensuring signal strength, can effectively reduce the failure rate of the button assembly 10 during production, transportation, and assembly, and the cost of the button assembly 10 is also lower. The button assembly 10 has dual functions of pressure detection and slide detection. The slide detection function can be implemented through debugging software to achieve functions such as sliding to increase or decrease volume, sliding to take photos, sliding to switch photos, short videos, and music switching, diversifying application scenarios and improving user experience.

[0139] For example, such as Figure 20 As shown, the button assembly 10 is placed in the position of the volume buttons in related technologies and replaces the function of the volume buttons. Simultaneously, the button assembly 10 also enables a sliding function. Different switching functions can be implemented in different scenarios through software adjustments. For example, in the camera interface, one can slide to take a photo or in burst mode. In the lock screen interface, one can slide to increase or decrease the volume. Furthermore, the button assembly 10 is located on the right side of the electronic device 60, making it easy for the user to hold and slide, thus improving the user experience.

[0140] For example, such as Figure 21 As shown, the button assembly 10 is placed separately on the right side of the electronic device 60. The button assembly 10 does not replace the volume buttons 800 and power button 700 of the electronic device 60. Through software debugging, the button assembly 10 can perform multiple functions in various scenarios, such as single-click, double-click, and swipe. For example, in a photography application, single-click focuses, double-click wakes up, double-click takes a picture, swipe zooms, and hard-press takes a picture. For example, in short video or music applications, swipe switches, double-click likes, etc. For example, in a photo album application, swipe switches, etc.

[0141] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0142] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A button assembly, characterized in that, include: The carrier is provided with a receiving groove; A button, the button including a keycap and a connector, at least a portion of the keycap being located in the receiving groove, the connector being located on the side of the keycap facing the bottom of the receiving groove, and the connector connecting the middle part of the keycap and the carrier, the keycap, the connector and the groove wall of the receiving groove enclosing a first working area and a second working area; Multiple sensor groups, with at least one sensor group located in the first working area and at least one sensor group located in the second working area, wherein the sensor group includes: A sensing structure connected to the keycap; A support member, which is supported between the sensing structure and the bottom of the receiving groove, or between the keycap and the bottom of the receiving groove; The sensing assembly also includes a flexible frame, through which the sensing structure is connected to the keycap; When the support member is used to support the sensing structure, the elastic frame is connected to the side of the keycap facing the bottom of the receiving groove. The part of the keycap opposite to the sensing structure is provided with a groove. The elastic frame and the groove enclose a first mounting cavity, and the sensing structure is located in the first mounting cavity.

2. The button assembly according to claim 1, characterized in that, When the support member is used to support the keycap, the elastic frame is connected between the sensing structure and the keycap.

3. The button assembly according to claim 1, characterized in that, When the support member is used to support the keycap, the support member is located between the sensing structure and the connector.

4. The button assembly according to claim 3, characterized in that, The support member is closer to the connector than the sensing structure.

5. The button assembly according to claim 1, characterized in that, When the support member is used to support the keycap, the sensing structure is located between the connector and the support member.

6. The button assembly according to claim 5, characterized in that, The support abuts against the outer peripheral wall of the keycap.

7. The button assembly according to any one of claims 1 to 6, characterized in that, The sensing structure includes: Multiple conductive elements are arranged at intervals, each of the conductive elements includes a pad and a conductive portion, the conductive portion being stacked on one side of the pad; At least one pressure-sensitive part, with one pressure-sensitive part connected between two adjacent conductive elements; An insulating protective layer covers a plurality of the conductive elements and at least one of the pressure-sensitive parts.

8. The button assembly according to claim 7, characterized in that, The sensing structure further includes a first flexible circuit board, wherein the plurality of conductive elements, at least one pressure-sensitive part, and the insulating protective layer are connected to the same side of the first flexible circuit board, and the first flexible circuit board is connected to the keycap.

9. The button assembly according to claim 7, characterized in that, The pads are connected to the keycaps.

10. The button assembly according to any one of claims 1 to 6, characterized in that, The sensor group also includes: A switch is located on the side of the support member facing the keycap.

11. The button assembly according to any one of claims 1 to 6, characterized in that, The carrier is further provided with a second mounting cavity, which is arranged at intervals on one side of the receiving groove along the direction from the groove opening to the bottom of the groove; The connector includes a connecting section and a limiting section. The limiting section is located in the second mounting cavity. One end of the connecting section is connected to the keycap, and the other end of the connecting section extends into the second mounting cavity and is connected to the limiting section.

12. An electronic device, characterized in that, include: Frame; and The button assembly as claimed in any one of claims 1 to 11, wherein a portion of the frame is configured as the carrier.

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