Semiconductor cleaning equipment and exhaust device thereof

Abstract

The invention provides semiconductor cleaning equipment and an exhaust device thereof.The exhaust device comprises an exhaust pipeline and a pressure adjusting mechanism, and the exhaust pipeline is used for being connected with a liquid medicine collecting mechanism of the semiconductor cleaning equipment and used for exhausting air of the semiconductor cleaning equipment; the pressure adjusting mechanism comprises a damping part and a driving part, the damping part is in a plate shape and arranged in the exhaust pipeline, and the driving part is fixed to the outer side wall of the exhaust pipeline, connected with the damping part through a driving shaft and used for driving the damping part to rotate. The damping part is arranged in the exhaust pipeline, and the driving part drives the damping part to rotate, so that the exhaust area of the exhaust pipeline is changed, and the effect of adjusting the air speed and the air pressure is achieved. In addition, only the driving part of the air exhaust device is arranged outside the air exhaust pipeline, and the damping part is arranged inside the air exhaust pipeline, so that the space occupied by the air exhaust device is reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing, and in particular, to a semiconductor cleaning device and an exhaust device thereof. Background Art

[0002] In semiconductor cleaning equipment, the process chamber is used to spray liquid to clean wafers. The process chamber includes a rotating chuck, a liquid spray arm, a liquid recovery device, an exhaust system, and a box. The exhaust system includes a fan filter unit (FFU) and an exhaust duct. The fan rotates inside the structure to generate wind, which is filtered by the filter element and then blown out. The fan filter unit mainly delivers clean air with stable wind speed into the process chamber, and the exhaust duct mainly discharges the gas in the chamber in time. The two work together to affect the wind speed and pressure in the process chamber.

[0003] The cleanliness requirement of the process chamber is very high, and the exhaust system needs to control the flow field inside the chamber to prevent particles from falling on the wafer. At the same time, due to the use of related chemical liquids,

[0004] For example, sulfuric acid easily produces acid mist, which needs to be discharged in time through the exhaust system to avoid crystallization and reduce the cleaning effect. In addition, the exhaust system can maintain a slightly positive pressure in the process chamber to prevent foreign particles from flowing into the process chamber.

[0005] With the continuous development of the semiconductor industry, the related processes of wafer cleaning are becoming more and more complicated, and the requirements for exhaust systems are becoming higher and higher. It is necessary to dynamically change the air pressure inside the chamber according to different process steps. At present, the fan filter unit in the industry cannot achieve real-time automatic change of the air pressure in the chamber with the process.

[0006] Therefore, how to provide an exhaust system that occupies less space and can automatically adjust the wind pressure is a technical problem that technical personnel in this field urgently need to solve. Summary of the invention

[0007] The present application aims to solve at least one of the technical problems existing in the prior art, and proposes a semiconductor cleaning equipment and an exhaust device thereof, which can automatically adjust the wind pressure and occupy a small space.

[0008] In order to achieve the purpose of the present application, an exhaust device is provided, which is applied to semiconductor cleaning equipment and includes an exhaust pipeline and a pressure regulating mechanism, wherein:

[0009] The exhaust pipeline is used to be connected to the liquid collecting mechanism of the semiconductor cleaning equipment and is used to exhaust the semiconductor cleaning equipment;

[0010] The pressure regulating mechanism includes a damping part and a driving part. The damping part is plate-shaped and is arranged in the exhaust duct. The driving part is fixed to the outer wall of the exhaust duct and is connected to the damping part through a driving shaft, so as to drive the damping part to rotate to adjust the exhaust pressure.

[0011] In some embodiments, the driving part is a driving motor, and the pressure regulating mechanism further includes a mounting seat, and the driving motor is fixedly connected to the outer wall of the exhaust duct through the mounting seat.

[0012] In some embodiments, the driving shaft is arranged along the diameter of the exhaust duct, and the outer edge of the damping part is spaced from the inner wall of the exhaust duct.

[0013] In some embodiments, the exhaust duct is made of transparent material.

[0014] In some embodiments, the damping portion is circular, the exhaust duct is a circular tube, the center of the damping portion is located on the axis of the exhaust duct, and the diameter of the damping portion is smaller than the inner diameter of the exhaust duct.

[0015] The present application also provides a semiconductor cleaning device, comprising a chamber, a liquid medicine collecting mechanism, an air supply mechanism, a liquid medicine spraying mechanism, a controller, a chuck, and any one of the exhaust devices described above;

[0016] The chuck is arranged in the chamber and is used to carry the wafer. The air supply mechanism is located at the top of the chamber and is used to provide a downward-flowing wind field in the chamber. The liquid spraying mechanism is used to spray the cleaning liquid on the wafer to clean the surface of the wafer. The liquid collecting mechanism is arranged around the chuck and is used to collect the cleaning liquid. A drain port is provided at the bottom of the liquid collecting mechanism.

[0017] The exhaust pipeline of the exhaust device is fixed at the bottom of the liquid medicine collecting mechanism, and the inlet of the exhaust pipeline is higher than the liquid discharge port.

[0018] In some embodiments, a wind speed measuring mechanism for measuring the wind speed in the wind field is provided in the chamber.

[0019] In some embodiments, the exhaust duct is further provided with a pressure sensor located on a side of the damping portion close to the liquid medicine collecting mechanism.

[0020] In some embodiments, the orthographic projection of the upper surface of the chuck on the horizontal plane is located inside the orthographic projection of the air supply mechanism on the horizontal plane.

[0021] In some embodiments, the air supply mechanism includes a fan and a filter element, wherein the filter element is located between the fan and the chuck and is used to filter the purge gas.

[0022] This application has the following beneficial effects:

[0023] The exhaust device provided in the present application is applied to semiconductor cleaning equipment, and includes an exhaust duct and a pressure regulating mechanism, wherein the exhaust duct is used to be connected to a liquid collecting mechanism of the semiconductor cleaning equipment for exhausting the semiconductor cleaning equipment; the pressure regulating mechanism includes a damping part and a driving part, the damping part is plate-shaped and is arranged in the exhaust duct, the driving part is fixed to the outer wall of the exhaust duct, and is connected to the damping part through a driving shaft, and is used to drive the damping part to rotate.

[0024] The damping part is arranged in the exhaust duct, and the driving part drives the damping part to rotate, thereby changing the exhaust area of ​​the exhaust duct to adjust the wind pressure. In addition, only the driving part of the exhaust device is arranged outside the exhaust duct, and the damping part is arranged inside the exhaust duct, thereby reducing the space occupied by the exhaust device.

[0025] The present application also provides a semiconductor cleaning device comprising the above-mentioned exhaust device and having the above-mentioned advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of the structure of the semiconductor cleaning equipment provided in this application;

[0027] Figure 2 for Figure 1 A schematic diagram of the structure of the exhaust device;

[0028] Figure 3 for Figure 1 Schematic diagram of the internal structure of the exhaust device.

[0029] in, Figures 1 to 3 The reference numerals in the drawings are:

[0030] 1. Chamber; 2. Drug liquid spraying mechanism; 3. Air supply mechanism; 4. Chuck; 5. Drug liquid collecting mechanism; 6. Exhaust device; 7. Drain port; 8. Wind speed sensor; 61. Exhaust duct; 62. Damping part; 63. Driving motor; 64. Mounting seat; 65. Pressure sensor. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the technical solution of the present application, the semiconductor cleaning equipment and the exhaust device thereof provided by the present application are described in detail below in conjunction with the accompanying drawings.

[0032] The exhaust device 6 provided in the present application is applied to semiconductor cleaning equipment, such as Figure 1As shown, the semiconductor cleaning equipment includes a chamber 1, a chuck 4, an air supply mechanism 3, a liquid medicine spraying mechanism 2 and a liquid medicine collecting mechanism 5. The wafer is placed on the chuck 4, and the liquid medicine collecting mechanism 5 is arranged around the chuck 4, and the upper end of the liquid medicine collecting mechanism 5 is higher than the height of the upper surface of the chuck 4. The nozzle of the liquid medicine spraying mechanism 2 is located above the chuck 4, and is used to spray the cleaning liquid on the wafer. The air supply mechanism 3 is located above the chuck 4, and is used to provide a wind field with a stable and clean wind speed to the wafer. The cleaning liquid falls to the surface of the wafer under the action of the wind field to clean the surface of the wafer. The exhaust device 6 is located at the bottom of the chamber 1 and is connected to the liquid medicine collecting mechanism 5. The wind field gas entering the chamber 1 can be discharged from the chamber 1 by the exhaust device 6. The exhaust device 6 can adjust the wind pressure in the chamber 1 according to the process requirements. Appropriate wind pressure can improve the cleaning effect of the semiconductor cleaning equipment on the wafer.

[0033] The exhaust device 6 includes an exhaust pipe 61 and a pressure regulating mechanism. The exhaust pipe 61 is arranged at the bottom of the chamber 1, one end of the exhaust pipe 61 is connected to the inner side of the liquid medicine collecting mechanism 5, and the other end is connected to the outer side of the chamber 1. The wind field gas can be discharged from the chamber 1 through the exhaust pipe 61.

[0034] The pressure regulating mechanism is used to adjust the exhaust area of ​​the exhaust pipe 61, thereby controlling the exhaust pressure and flow rate. Since the wind field gas is discharged from the chamber 1 through the exhaust pipe 61, the exhaust area of ​​the exhaust pipe 61 directly affects the wind pressure of the wind field. When the wind pressure is required to be higher, the pressure regulating mechanism can reduce the exhaust area. When the wind field gas flow rate is constant, the smaller the exhaust area, the higher the wind pressure. Conversely, when the wind pressure is required to be lower, the pressure regulating mechanism can increase the exhaust area.

[0035] In addition, the air supply mechanism 3 of the semiconductor cleaning equipment can be specifically an air source such as a fan or a pressure-stabilizing tank. When the air supply mechanism is a fan, the exhaust device is mainly used to control the wind pressure; when the air supply mechanism 3 is a pressure-stabilizing tank, the exhaust device can change the wind pressure and wind speed at the same time by changing the exhaust area, and the exhaust device needs to cooperate with the pressure-stabilizing tank to control the wind speed and wind pressure.

[0036] The pressure regulating mechanism includes a damping part 62 and a driving part. The damping part 62 may be plate-shaped and arranged in the exhaust duct 61. The driving part is fixed to the outer wall of the exhaust duct 61, and the driving part is connected to the driving shaft, and the driving shaft passes through the side wall of the exhaust duct 61 and extends to the inner side of the exhaust duct 61. The damping part 62 is fixedly connected to the driving shaft and rotates around the driving shaft under the drive of the driving part. Specifically, the driving shaft may be arranged along the radial direction of the exhaust duct 61. When the damping part 62 rotates to the axis of the exhaust duct 61 vertically, the exhaust area of ​​the exhaust duct 61 is the smallest, and the wind pressure of the wind field is the smallest at this time; when the damping part 62 rotates to the axis of the exhaust duct 61 vertically, the exhaust area of ​​the exhaust duct 61 is the largest, and the wind pressure of the wind field is the largest at this time. The user can adjust the angle between the damping part 62 and the axis of the exhaust duct 61 as needed to obtain appropriate wind pressure. Of course, the position of the drive shaft can also be set according to the needs of the user, for example, along the secant line of the cross section of the exhaust duct 61, which is not limited here.

[0037] In this embodiment, the driving unit can drive the damping unit 62 to rotate around the driving shaft, change the exhaust area of ​​the exhaust duct 61, and then change the wind pressure in the semiconductor cleaning equipment. The driving unit can operate under the control of a controller or other equipment to achieve automatic adjustment of the wind pressure, avoid the safety hazards caused by manual operation, such as contact with chemical liquids, and greatly save operation time. In addition, the damping unit 62 is arranged inside the exhaust duct 61, and the driving unit is arranged outside the exhaust duct 61. The space required for the driving unit is small, so the space occupied by the exhaust device 6 can be reduced.

[0038] In some embodiments, the driving unit may be a driving motor 63. Figure 2 As shown, the exhaust duct 61 may be L-shaped, one side of the duct section may be arranged in the vertical direction, the other side of the duct section may be arranged in the horizontal direction, the damping part 62 may be arranged in the horizontal duct section, and the drive motor 63 may be arranged on the outer side wall of the horizontal duct section. Specifically, the pressure regulating mechanism also includes a mounting seat 64, the mounting seat 64 is fixedly connected to the outer side wall of the horizontal duct section, and the drive motor 63 is fixed in the mounting seat 64. The horizontal duct section has a through hole corresponding to the position of the drive motor 63, the drive shaft is arranged in the through hole, and is rotatably connected to the through hole through a sealing mechanism such as a dynamic and static ring seal. The counter shaft of the drive motor 63 can be connected to the drive shaft through a coupling, and the damping part 62 can be fixedly connected to the drive shaft through a screw. Of course, the exhaust duct 61 may also adopt other structures, and the angles of each duct section of the exhaust duct 61 with the horizontal direction may be set according to user needs. The drive motor 63 and the exhaust duct 61 may also be connected in other ways, which are not limited here.

[0039] Optionally, the driving motor 63 can be operated under the control of the control device, thereby driving the damping part to change the exhaust area. The control device can be integrated into the exhaust device, or can be a controller of the semiconductor cleaning equipment, which is not limited here.

[0040] Optionally, the exhaust duct 61 may be a round tube, and the drive shaft may be arranged along the diameter of the exhaust duct 61, specifically the diameter of the exhaust duct 61 in the horizontal direction. The damping part 62 rotates around the drive shaft driven by the drive motor 63, and the outer edge of the damping part 62 is separated from the inner wall of the exhaust duct 61, thereby ensuring that no friction occurs with the inner wall of the exhaust duct 61 during the rotation process, ensuring that the adjustment process proceeds smoothly, reducing the wear of the exhaust duct 61 and the damping part 62, and extending the service life of the two. Of course, the exhaust duct 61 may also be a square tube or a pipe fitting of other shapes, which is not limited here.

[0041] Further, the damping portion 62 may be circular, and when it is perpendicular to the axis of the exhaust duct 61, the center of the damping portion 62 is located on the axis of the exhaust duct 61. The diameter of the damping portion 62 is smaller than the inner diameter of the exhaust duct 61, so that the damping portion 62 will never rub against the inner wall of the exhaust duct 61 at any angle. Of course, the damping portion 62 may also be set to other shapes as needed, such as an ellipse, etc., which is not limited here.

[0042] Optionally, the exhaust duct 61 may be made of a transparent material. Specifically, the exhaust duct 61 may be made of a transparent PVC (Polyvinyl chloride) material. The PVC material is suitable for chambers using non-strong acid processes. Users may also select the material of the exhaust duct 61 as needed, which is not limited here. The exhaust duct 61 is made of a transparent material so that the actual rotation state of the damping part 62 inside it can be easily observed, which is convenient for debugging and subsequent maintenance.

[0043] With different rotation angles, the shielding area of ​​the damping part 62 on the exhaust pipe 61 is different. Figure 3 The solid line of the damping part 62 in the figure indicates the state before rotation, and the dotted line indicates the state after rotation. Before rotation, the damping part 62 is parallel to the axis of the exhaust duct 61, and almost does not block the exhaust duct 61. At this time, the exhaust area is the largest and the wind pressure is the smallest. If in the current state, the driving motor 63 drives the damping part 62 to rotate 90° through the driving shaft, the damping part 62 is perpendicular to the axis of the exhaust duct 61, blocking the exhaust duct 61, and the gas in the process chamber can only be discharged through the gap between the outer edge of the damping part 62 and the inner wall of the exhaust duct 61. At this time, the exhaust area is the smallest. The wind pressure is the largest.

[0044] In this embodiment, there is a certain gap between the outer edge of the damping part 62 and the inner wall of the exhaust pipe 61. Even if the damping part 62 is in a closed state, the exhaust device 6 has a certain exhaust area, which ensures that a wind field can always be formed in the process chamber, thereby ensuring the smooth progress of the cleaning process. In addition, the exhaust pipe 61 is made of a transparent material, which is convenient for observing the actual working state of the damping part 62 during debugging and subsequent maintenance.

[0045] The present application also provides a semiconductor cleaning device, including a chamber 1, a liquid medicine collecting mechanism 5, an air supply mechanism 3, a liquid medicine spraying mechanism 2, a controller (not shown in the figure), a chuck 4, and an exhaust device 6 in any of the above embodiments. The structure of other parts of the semiconductor cleaning device can refer to the prior art and will not be repeated here.

[0046] like Figure 1 As shown, the interior of the chamber 1 is a process chamber, and the chuck 4 is arranged in the chamber 1 for carrying the wafer. The air supply mechanism 3 is located at the top of the chamber 1 for providing a stable and clean wind field. The nozzle of the liquid spraying mechanism 2 is located above the chuck 4 for spraying the cleaning liquid onto the wafer. Under the action of the wind field, the cleaning liquid falls evenly on the surface of the wafer to clean the surface of the wafer. The liquid collecting mechanism is arranged around the chuck 4, and the upper end of the liquid collecting mechanism 5 is higher than the height of the upper surface of the chuck 4, which is used to collect the cleaning liquid after cleaning the wafer. The bottom of the liquid collecting mechanism 5 is provided with a drain port 7, and the collected cleaning liquid is discharged from the liquid collecting device through the drain port 7. The exhaust pipe 61 of the exhaust device 6 is fixed at the bottom of the liquid collecting mechanism 5 and is connected to the liquid collecting mechanism 5. The wind field gas entering the chamber 1 can be discharged from the chamber 1 by the exhaust device 6. The controller controls the exhaust device 6 to change the exhaust area, thereby adjusting the wind pressure. The inlet of the exhaust pipe 61 is higher than the drain port 7 , thereby preventing the cleaning liquid from entering the exhaust pipe 61 .

[0047] The air supply mechanism 3 can be specifically an air source such as a fan or a pressure-suppressing tank. When the air supply mechanism is a fan, it can provide a wind field with a stable wind speed. The speed of the fan can adjust the wind speed of the wind field, and the exhaust area of ​​the exhaust device can adjust the wind pressure of the wind field. When the air supply mechanism 3 is a pressure-suppressing tank, reducing the exhaust area of ​​the exhaust device can increase the wind pressure and reduce the wind speed; increasing the exhaust area can reduce the wind pressure and increase the wind speed. The pressure-suppressing tank increases or decreases the air supply pressure as needed, and the exhaust device cooperates with the pressure-suppressing tank to control the wind speed and wind pressure.

[0048] In this embodiment, the semiconductor cleaning equipment includes an exhaust device 6, and the controller automatically adjusts the wind pressure through the exhaust device. The damping part 62 of the exhaust device 6 is arranged in the exhaust pipe 61, which reduces the volume of the exhaust device and facilitates the arrangement of the exhaust device 6 in the semiconductor cleaning equipment.

[0049] Optionally, a wind speed measuring mechanism for measuring the wind speed in the wind field is provided in the chamber 1. Specifically, the wind speed measuring mechanism may be a wind speed sensor 8, which can measure the actual wind speed of the wind field in real time. If there is a deviation between the actual wind speed and the set wind speed, negative feedback adjustment can be performed according to the difference until the actual wind speed reaches the set wind speed. The semiconductor cleaning equipment controls the wind speed of the wind field through negative feedback adjustment, which can improve the accuracy of the control process and thus improve the cleaning effect. In addition, the measurement result of the wind speed measured at one point is often not accurate enough, so more than two wind speed sensors 8 can be set in the chamber 1 for simultaneous measurement, and the actual wind speed can be determined based on the measurement results. The specific number of wind speed sensors 8 can be set according to user needs and is not limited here.

[0050] Optionally, a pressure sensor 65 is also provided in the exhaust pipe 61. Figure 1 As shown, the pressure sensor 65 is located on the side of the damping part 62 close to the liquid collecting mechanism 5. The pressure sensor 65 can monitor whether the pressure in the exhaust pipe 61 is consistent with the set pressure. If it is inconsistent, negative feedback adjustment is performed to change the angle of the damping part 62. The pressure sensor 65 can improve the accuracy of the wind pressure control in the process chamber and improve the cleaning effect.

[0051] Optionally, the air supply mechanism 3 includes a fan and a filter element, the fan is used to transport wind field gas into the process chamber, and the filter element is located between the fan and the chuck 4, and is used to filter the wind field gas. The speed of the fan can be adjusted. Specifically, the fan speed adjustment range can be 600-1500r / min. Of course, the user can also select the fan speed adjustment range as needed, which is not limited here. The rotation of the fan generates wind, which is filtered by the filter element and blows downward toward the process chamber. In this process, the wind speed and wind pressure of the wind field in the process chamber depend on the fan speed and the airtightness of the process chamber, and the airtightness of the process chamber is mainly determined by the exhaust device 6. When the exhaust area of ​​the exhaust duct 61 is fixed, the faster the fan speed, the higher the wind speed in the process chamber.

[0052] The exhaust device 6 mainly affects the wind pressure in the chamber, and the damping part 62 is arranged in the exhaust duct 61. The driving motor 63 drives the damping part 62 to rotate through the driving shaft to change the exhaust area of ​​the exhaust duct 61. When the fan speed of the air supply mechanism 3 is fixed, the larger the angle between the damping part 62 and the axis of the exhaust duct 61, the greater the wind pressure in the process chamber.

[0053] Specifically, if you want to achieve high wind speed and high wind pressure in the process chamber, you can increase the angle between the damping part 62 and the axis of the exhaust duct 61 while increasing the fan speed of the air supply mechanism 3; if you want to achieve low wind speed and low wind pressure in the process chamber, you can reduce the angle between the damping part 62 and the axial direction of the exhaust duct 61 while reducing the fan speed of the air supply mechanism 3; if you want to achieve high wind speed and low wind pressure in the process chamber, you can increase the fan speed of the air supply mechanism 3 while reducing the angle between the damping part 62 and the axial direction of the exhaust duct 61; if you want to achieve low wind speed and high wind pressure in the process chamber, you can reduce the fan speed of the air supply mechanism 3 while increasing the angle between the damping part 62 and the axial direction of the exhaust duct 61. Of course, the above examples are only qualitative analysis, and the actual effect depends on the rate of change of the two variables, which is not limited here.

[0054] Optionally, the air supply direction of the air supply mechanism 3 is downward, and the orthographic projection of the upper surface of the chuck 4 on the horizontal plane is located inside the orthographic projection of the air supply mechanism 3 on the horizontal plane, thereby ensuring that the wind field can cover the entire area where the chuck 4 is located.

[0055] Since different links in the cleaning process have different requirements for process chamber wind speed and wind pressure, process engineers formulate a demand parameter table based on the internal database or relevant parameters of competing machines, and then convert the parameters in the demand parameter table into executable control parameters. The conversion methods are mainly fluid simulation and experimental measurement.

[0056] Fluid simulation can be simulated and analyzed by flow field simulation analysis software. Modeling is performed according to the process chamber structure, and the fan speed of the air supply mechanism 3 and the angle between the damping part 62 and the axial direction of the exhaust duct 61 in the exhaust device 6 are set as variables. The variable parameters are adjusted according to the control variable method for simulation, and finally the control parameter combination corresponding to the process requirement parameters is obtained. The advantage of this method is that it eliminates the errors caused by the inconsistency between the relevant instruments and equipment and the test state and the working state during the test; the disadvantage is that modeling requires detailed structural parameters, including the size and angle of the fan blades, etc. Otherwise, there is a large error between the simulation results and the actual results.

[0057] The test measurement is carried out through actual test measurement. According to the special test equipment, including wind speed sensor 8, pressure sensor 65, etc., according to the control variable method, the effect of different combinations of control variables is actually tested, so as to find the control parameter combination that meets the process requirements. The advantage of this method is that it is based on the actual test results and is more accurate; the disadvantage is that the test is more time-consuming, and the equipment itself will have a certain impact on the wind field environment in the process chamber.

[0058] After completing the above steps, the actual execution parameter combination is written into the machine control software. Later, as the process steps change, the system automatically executes the corresponding execution parameters to achieve automatic adjustment of the wind speed and wind pressure in the process chamber.

[0059] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present application, but the present application is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of the present application, and these modifications and improvements are also considered to be within the scope of protection of the present application.

Claims

1. An exhaust device, applied to semiconductor cleaning equipment, characterized in that: It includes exhaust pipes and pressure regulating mechanisms, wherein: The exhaust pipeline is used to be connected to the liquid collecting mechanism of the semiconductor cleaning equipment and is used to exhaust the semiconductor cleaning equipment; The pressure regulating mechanism includes a damping part and a driving part. The damping part is plate-shaped and is arranged in the exhaust duct. The driving part is fixed to the outer wall of the exhaust duct and is connected to the damping part through a driving shaft, so as to drive the damping part to rotate to adjust the exhaust pressure.

2. The exhaust device according to claim 1, characterized in that: The driving part is a driving motor, and the pressure regulating mechanism further includes a mounting seat, through which the driving motor is fixedly connected to the outer side wall of the exhaust duct.

3. The exhaust device according to claim 2, characterized in that: The driving shaft is arranged along the diameter of the exhaust duct, and the outer edge of the damping part is spaced from the inner wall of the exhaust duct.

4. The exhaust device according to claim 1, characterized in that: The exhaust pipe is made of transparent material.

5. The exhaust device according to claim 3, characterized in that: The damping part is circular, the exhaust duct is a circular tube, the center of the damping part is located on the axis of the exhaust duct, and the diameter of the damping part is smaller than the inner diameter of the exhaust duct.

6. A semiconductor cleaning device, characterized in that: It comprises a chamber, a liquid medicine collecting mechanism, an air supply mechanism, a liquid medicine spraying mechanism, a controller, a chuck and an exhaust device according to any one of claims 1 to 5; The chuck is arranged in the chamber and is used to carry the wafer. The air supply mechanism is located at the top of the chamber and is used to provide a downward-flowing wind field in the chamber. The liquid spraying mechanism is used to spray the cleaning liquid on the wafer to clean the surface of the wafer. The liquid collecting mechanism is arranged around the chuck and is used to collect the cleaning liquid. A drain port is provided at the bottom of the liquid collecting mechanism. The exhaust pipeline of the exhaust device is fixed at the bottom of the liquid medicine collecting mechanism, and the inlet of the exhaust pipeline is higher than the liquid discharge port.

7. The semiconductor cleaning equipment according to claim 6, characterized in that: The chamber is provided with a wind speed measuring mechanism for measuring the wind speed in the wind field.

8. The semiconductor cleaning equipment according to claim 7, characterized in that: The exhaust pipe is also provided with a pressure sensor located on a side of the damping part close to the liquid medicine collecting mechanism.

9. The semiconductor cleaning equipment according to claim 6, characterized in that: The orthographic projection of the upper surface of the chuck on the horizontal plane is located inside the orthographic projection of the air supply mechanism on the horizontal plane.

10. The semiconductor cleaning equipment according to claim 9, characterized in that: The air supply mechanism comprises a fan and a filter element. The filter element is located between the fan and the chuck and is used for filtering the purge gas.

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