Wafer bearing table, wafer bearing device, wafer transfer method and wafer transfer equipment

Abstract

The invention provides a wafer bearing table, a wafer bearing device, a wafer transfer method and wafer transfer equipment. The wafer bearing table comprises a bearing table main body; the holding part is arranged on the edge area of the carrying table main body and can ascend and descend relative to the carrying table main body; the supporting part comprises at least one circle of annular bulge protruding out of the surface of the carrying table main body; the sensing part is arranged in a middle area surrounded by the supporting part; the overflow part comprises an overflow hole, the overflow hole is formed in the middle area surrounded by the supporting part, and the overflow hole surrounds the sensing part; and an injection portion including a first injection port and a second injection port, the first injection port and the second injection port being located in a middle region surrounded by the support portion. According to the wafer bearing table, the wafer bearing device, the wafer transfer method and the wafer transfer equipment, the wafer cleaning effect can be improved, and the wafer scratch risk can be reduced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a wafer carrying platform, a wafer carrying device, a wafer transfer method and equipment. Background Art

[0002] The wafer processing process may include cutting, polishing, etching, grinding, cleaning and other processes. After completing the previous process, the wafer needs to be placed on a wafer loading tray by a robotic arm, and then the wafer loading tray is used to transfer the wafer to the equipment for the next process.

[0003] The wafer carrier is provided with an annular supporting protrusion, overflow hole, etc. The annular supporting protrusion contacts and supports the wafer. The water overflowing from the overflow hole can diffuse from the center to the edge of the wafer carrier. The overflow water can perform preliminary cleaning of the wafer. The overflow water will also wet the annular supporting protrusion during the diffusion process, so that the annular supporting protrusion maintains softened wettability.

[0004] However, since the overflow water diffuses from the middle to the edge of the wafer carrier, there is a height difference between the overflow water and the annular support protrusion, which makes it impossible to achieve preliminary cleaning of the wafer during the transfer to the next process. In addition, some areas on the wafer carrier, such as the middle area surrounded by the annular support protrusion, are not provided with an annular support protrusion. There is a risk of scratching the wafer during the transfer of the wafer to the equipment of the next process, for example, it can be manifested as a ring-shaped scratch in the middle area of ​​the front of the wafer. Summary of the invention

[0005] In order to solve at least one technical problem in the above-mentioned prior art, the embodiments of the present disclosure provide a wafer carrier, a wafer carrier device, a wafer transfer method and equipment.

[0006] The technical solutions provided by the embodiments of the present disclosure are as follows:

[0007] In a first aspect, an embodiment of the present disclosure provides a wafer carrier, comprising:

[0008] The main body of the platform;

[0009] A holding portion, which is disposed at an edge region of the platform body and can be raised and lowered relative to the platform body;

[0010] The supporting part includes at least one annular protrusion protruding from the surface of the carrier body;

[0011] A sensing part, arranged in a middle area surrounded by the supporting part;

[0012] an overflow portion, comprising an overflow hole, wherein the overflow hole is disposed in a middle area surrounded by the supporting portion, and the overflow hole is disposed around the sensing portion; and

[0013] The ejection portion includes a first ejection port and a second ejection port, and the first ejection port and the second ejection port are located in a middle area surrounded by the support portion.

[0014] Exemplarily, the first injection port is disposed at the center of the carrier body; there are a plurality of the second injection ports, and the plurality of the second injection ports are arranged in at least one circle and surround the first injection port.

[0015] Exemplarily, the carrier body has a mounting cavity, the sensing part includes a sensor and a mounting member, the sensor is installed in the mounting cavity through the mounting member, wherein the overflow hole is arranged on the periphery of the mounting member, and the first injection port and the second injection port are both located on the mounting member.

[0016] Exemplarily, a plurality of fastening structures are provided on the mounting member along its periphery at intervals, and the mounting member is connected to the carrier body via the fastening structures, wherein at least part of the second injection port is located between two adjacent fastening structures.

[0017] Exemplarily, the diameter of the first injection port is greater than the diameter of the second injection port.

[0018] Exemplarily, the diameter of the first jet port is 2-4 cm; the diameter of the second jet port is 0.3-0.8 cm.

[0019] Exemplarily, the supporting portion includes an inner annular protrusion and an outer annular protrusion, the inner annular protrusion and the outer annular protrusion are arranged in concentric circles, and either the inner annular protrusion or the outer annular protrusion includes a plurality of supporting protrusions arranged in a ring shape and spaced apart from each other.

[0020] In a second aspect, an embodiment of the present disclosure further provides a wafer carrying device, which includes the wafer carrying platform as described above.

[0021] In a third aspect, the embodiment of the present disclosure further provides a wafer transfer method, which transfers the wafer from the robot arm to the polishing head of the polishing equipment through the wafer carrier as described above; the method comprises the following steps:

[0022] Placing a wafer on the stage body by a robot arm, and holding the peripheral edge of the wafer by the holding portion;

[0023] Moving the wafer carrier to below the polishing head;

[0024] Lowering the holding portion to make the wafer contact the annular protrusion, spraying water through the first spray port and the second spray port, and overflowing the water through the overflow hole to preliminarily clean the wafer;

[0025] The polishing head is lowered to press down and absorb the wafer, wherein in the process of the polishing head pressing down and absorbing the wafer, water is continuously sprayed out through the first spray port and the second spray port to apply a supporting force to the wafer in the opposite direction to the pressure of the polishing head.

[0026] In a fourth aspect, an embodiment of the present disclosure further provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the wafer transfer method as described above when executing the computer program.

[0027] The beneficial effects brought by the embodiments of the present disclosure are as follows:

[0028] In the wafer carrier, wafer carrier device, wafer transfer method and equipment provided by the embodiments of the present disclosure, a holding part, a supporting part, a sensing part, an overflow part and a spraying part are provided on the carrier body of the wafer carrier. The holding part is arranged in the edge area of ​​the carrier body, and can hold the peripheral part of the wafer. The supporting part may include at least one circle of annular protrusions for contacting the wafer to support the wafer. The sensing part is located in the middle area surrounded by the supporting part, and can be used to sense whether a wafer is carried, etc. The overflow part may include an overflow hole, which is surrounded by the supporting part and is arranged to surround the sensing part. The overflow water can diffuse from the middle area to the edge to wet the supporting part. The spraying part includes a first spray port and a second spray port, and the first spray port and the second spray port are located in the area surrounded by the overflow hole. By setting the first injection port and the second injection port, when the wafer is supported above the supporting part, the first injection port and the second injection port can spray water with a certain flow rate toward the wafer, so as to work together with the overflow water to achieve preliminary cleaning of the wafer surface, thereby solving the problem of poor cleaning effect of relying solely on overflow water for preliminary cleaning of the wafer in the prior art; and, the first injection port and the second injection port are located in the middle area surrounded by the supporting part, and the sprayed water can also play a reverse supporting role for the middle area where the supporting part is not set, thereby reducing the risk of scratches when the wafer is transferred to the equipment for the next process. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A schematic diagram showing the structure of a wafer carrier provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0031] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0032] The features such as "parallel", "perpendicular", and "same" used in the embodiments of the present disclosure include the features such as "parallel", "perpendicular", and "same" in a strict sense, as well as the cases where "approximately parallel", "approximately perpendicular", "approximately the same", etc. include certain tolerances, taking into account the tolerances associated with the measurement of specific quantities (e.g., the limitations of the measurement system), and represent the acceptable deviation range for a specific value determined by ordinary technicians in the field. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of the value.

[0033] In addition, in this document, unless otherwise defined, the terms "substantially", "substantially", "approximately" and "about" are used to describe and explain small changes. When used with an event or situation, these terms can cover situations where the event or situation occurs exactly, and can also cover situations where the event or situation occurs approximately. For example, when used with a numerical value, these terms can include a range of variation of less than or equal to 10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, less than or equal to ±0.05%. The term "substantially coplanar" can refer to two surfaces being arranged along the same plane in the micrometer range, for example, arranged along the same plane within 40μm, 30μm, 20μm, 10μm or 1μm.

[0034] like Figure 1 As shown, the embodiment of the present disclosure provides a wafer carrier, comprising:

[0035] The carrier body 100;

[0036] The holding portion 200 is disposed at an edge region of the stage body 100 and can be raised and lowered relative to the stage body 100;

[0037] The supporting part 300 includes at least one annular protrusion protruding from the surface of the carrier body 100;

[0038] The sensing part 400 is disposed in the middle area surrounded by the supporting part 300;

[0039] An overflow portion, comprising an overflow hole 500, wherein the overflow hole 500 is disposed in a middle area surrounded by the supporting portion 300, and the overflow hole 500 is disposed around the sensing portion 400; and

[0040] The injection portion includes a first injection port 600 and a second injection port 700 , and the first injection port 600 and the second injection port 700 are located in a middle area surrounded by the support portion 300 .

[0041] In the above scheme, the holding part 200 is arranged at the edge area of ​​the carrier body 100, and can be used to hold the peripheral part of the wafer; the supporting part 300 can be used to contact the wafer and support the wafer; the sensing part 400 is located in the middle area surrounded by the supporting part 300, and can be used to sense whether there is a wafer and other information; the overflow hole 500 is surrounded by the supporting part 300 and is arranged around the sensing part 400, and the overflow water can diffuse from the middle area of ​​the carrier body 100 to the edge to wet the supporting part 300; the injection part includes a first injection port 600 and a second injection port 700, and the first injection port 600 and the second injection port 700 are located in the area surrounded by the supporting part 300.

[0042] In this way, when the wafer is supported above the supporting part 300, the first injection port 600 and the second injection port 700 can spray water with a certain flow rate toward the wafer, so as to work together with the overflow water to achieve preliminary cleaning of the wafer surface, thereby solving the problem in the prior art of relying solely on overflow water for preliminary cleaning of the wafer and resulting in poor cleaning effect.

[0043] Furthermore, the first injection port 600 and the second injection port 700 are located in the middle area surrounded by the supporting part 300, and the injected water can also play a reverse supporting role for the middle area where the supporting part 300 is not set, thereby reducing the risk of scratches when transferring the wafer to the equipment for the next process.

[0044] Taking the example of transferring the wafer to the polishing head of the polishing equipment through the wafer carrier, during the process of transferring the wafer to the polishing head, the polishing head will press down and absorb the wafer to complete the transfer process. When the polishing head presses down the wafer, a certain pressure will be exerted on the wafer, and in the prior art, the wafer can only be supported by the annular support part 300. In the area where the support part 300 is not provided, such as the middle area surrounded by the support part 300, the wafer is easily scratched in the middle area during this process because it is not supported.

[0045] In the embodiment of the present disclosure, when the polishing head is lowered to press down and adsorb the wafer, water can be continuously sprayed out through the first spray port 600 and the second spray port 700 to apply a supporting force to the wafer in the opposite direction of the pressure of the polishing head, so that the wafer becomes easier to be adsorbed by the polishing head, and the risk of scratching the middle area of ​​the wafer can be reduced. Therefore, the wafer support table provided in the embodiment of the present disclosure can achieve preliminary cleaning of the front side of the wafer, and can reduce the risk of scratching the wafer, thereby ultimately improving the quality of the wafer.

[0046] In some exemplary embodiments, Figure 1As shown, the supporting portion 300 may include an inner annular protrusion 310 and an outer annular protrusion 320, wherein the inner annular protrusion 310 and the outer annular protrusion 320 are arranged in concentric circles, and either the inner annular protrusion 310 or the outer annular protrusion 320 includes a plurality of supporting protrusions 300a arranged in a ring shape in sequence and spaced apart from each other.

[0047] For example, the supporting protrusion 300a can be made of a material such as polyvinyl chloride (PVC) sponge, which can reduce the risk of damage to the wafer caused by contact with the supporting protrusion 300a. Of course, it is understandable that the specific material of the supporting protrusion 300a is not limited thereto.

[0048] Furthermore, in some exemplary embodiments, Figure 1 As shown, the supporting area of ​​a single supporting protrusion 300a in the outer annular protrusion 320 may be greater than the supporting area of ​​a single supporting protrusion 300a in the inner annular protrusion 310. However, this is not limited thereto.

[0049] Furthermore, in some exemplary embodiments, Figure 1 As shown, the first injection port 600 is disposed at the center of the stage body 100 ; there are a plurality of second injection ports 700 , which are arranged in at least one circle and surround the first injection port 600 .

[0050] By adopting the above scheme, the first injection port 600 is set at the center of the carrier body 100, and multiple second injection ports 700 are arranged in at least one circle and surround the first injection port 600. In this way, the water is sprayed more evenly and the reverse support force provided to the wafer is also more uniform.

[0051] As shown in the figure, in some embodiments, a plurality of the second injection ports 700 are arranged in a circle. In other embodiments not shown, a plurality of the second injection ports 700 may also be arranged in two circles or more.

[0052] Furthermore, in some exemplary embodiments, Figure 1 As shown, the stage body 100 has a mounting cavity, and the sensing part 400 includes a sensor (not shown) and a mounting member 410, and the sensor is mounted in the mounting cavity through the mounting member 410. The overflow hole 500 is arranged at the periphery of the mounting member 410, and the first injection port 600 and the second injection port 700 are both located on the mounting member 410.

[0053] By adopting the above scheme, the first injection port 600 and the second injection port 700 are directly integrated and arranged on the mounting member 410 of the sensor. Only the mounting member 410 needs to be structurally improved, injection ports are added, and injection pipes are added accordingly. The modification cost of the mounting member 410 is low, and the space is effectively utilized, which reduces the improvement of other components in the prior art and reduces the modification cost.

[0054] Of course, it is understandable that, in other embodiments, the first injection port 600 and the second injection port 700 may also be provided on other components. For example, the first injection port 600 and the second injection port 700 may also be provided on the carrier body 100 or on the supporting protrusion 300a.

[0055] However, compared with the solution of designing the jet nozzle on other components such as the supporting protrusion 300a, if the jet nozzle is set on the supporting protrusion 300a, the modification cost of the supporting protrusion 300a is relatively high, and the material selection of the supporting protrusion 300a is limited due to the structural design of the jet nozzle, and the requirement of reducing wafer contact damage cannot be guaranteed.

[0056] Furthermore, in some exemplary embodiments, Figure 1 As shown, the mounting member 410 is provided with a plurality of fastening structures 420 arranged at intervals along its periphery, and the mounting member 410 is connected to the carrier body 100 via the fastening structures 420 , wherein at least part of the second injection port 700 is located between two adjacent fastening structures 420 .

[0057] By adopting the above solution, the existing space on the sensing part 400 can be effectively utilized while meeting the installation requirements of the sensing part 400 .

[0058] Furthermore, in some exemplary embodiments, Figure 1 As shown, the caliber of the first jet port 600 is greater than that of the second jet port 700 , and the jet speed and jet flow rate of the first jet port 600 and the second jet port 700 may be the same or different.

[0059] For example, when the first jet port 600 is located at the exact center of the carrier body 100, the first jet port 600 can spray more water to the exact center of the wafer, so that the force on the wafer is more balanced; and, considering the space utilization, the area of ​​the first jet port 600 located at the exact center of the mounting part 410 can be made as large as possible to provide more water.

[0060] In some exemplary embodiments, the diameter of the first jet port 600 is 2-4 cm, and the diameter of the second jet port 700 is 0.3-0.8 cm. For example, the diameter of the first jet port 600 is 3 cm, and the diameter of the second jet port 700 is 0.6 cm. However, this is not limited thereto.

[0061] Taking the example of transferring a wafer from a robot arm to a polishing head of a polishing device through the wafer carrier in the embodiment of the present disclosure, the working process of the wafer carrier in the embodiment of the present disclosure is as follows:

[0062] First, a wafer is placed on the stage body 100 by a robot arm, and the peripheral edge of the wafer is held by the holding portion 200. In this step, water with a certain flow rate can be sprayed from the first spray port 600 and the second spray port 700.

[0063] Then, after the wafer is placed, the wafer carrying platform is moved to below the polishing head;

[0064] Then, the holding part 200 is lowered to make the wafer contact with the annular protrusion. At the same time, water is sprayed out through the first spray port 600 and the second spray port 700, and the water overflows through the overflow hole 500 to perform preliminary cleaning on the wafer. In this step, the water sprayed from the spray port is sprayed from the middle area of ​​the carrier body 100 to clean the front side of the wafer. The easy-to-clean contaminants are discharged from the carrier body 100 through the inner and outer annular protrusions 320 together with the overflow water.

[0065] Then, the polishing head is lowered to press down and absorb the wafer. During the process of the polishing head pressing down and absorbing the wafer, water is continuously sprayed out through the first spray port 600 and the second spray port 700 to apply a supporting force to the wafer in the opposite direction to the pressure of the polishing head, so that the wafer becomes easier to be absorbed by the polishing head and the scratch on the center of the wafer can be reduced, thereby achieving effective preliminary cleaning of the front side of the wafer, reducing the risk of scratch on the center of the wafer, and ultimately improving the quality of the wafer.

[0066] It should be noted that other essential components of the wafer carrier in the embodiment of the present disclosure, such as the lifting assembly of the holding part 200, the overflow hole 500 and the water supply assembly of the injection port, etc., are all understood by ordinary technicians in the field and are not elaborated here, nor should they be regarded as limitations of the present disclosure.

[0067] In addition, the embodiment of the present disclosure further provides a wafer carrier device, which includes the wafer carrier platform provided in the embodiment of the present disclosure. Since the principle of solving the problem by the wafer carrier device is similar to the principle of solving the problem by the above-mentioned wafer carrier platform, the embodiment of the wafer carrier device provided in the embodiment of the present disclosure can refer to the embodiment of the above-mentioned wafer carrier platform provided in the embodiment of the present disclosure, and will not be repeated here.

[0068] In addition, the embodiment of the present disclosure also provides a wafer transfer method, which transfers the wafer from the robot arm to the polishing head of the polishing equipment through the wafer carrier in the embodiment of the present disclosure; the method comprises the following steps:

[0069] Step S01, placing a wafer on the stage body 100 by a robot arm, and holding the peripheral edge of the wafer by the holding part 200;

[0070] In this step, water with a certain flow rate may be sprayed from the first spray port 600 and the second spray port 700;

[0071] Step S02, moving the wafer carrier to below the polishing head;

[0072] Step S03, lowering the holding part 200 to make the wafer contact with the annular protrusion, spraying water through the first spray port 600 and the second spray port 700, and overflowing the water through the overflow hole 500, to preliminarily clean the wafer;

[0073] Step S04, lowering the polishing head so that it presses down and absorbs the wafer, wherein in the process of the polishing head pressing down on the wafer and absorbing the wafer, water is continuously sprayed through the first spray port 600 and the second spray port 700 to apply a supporting force to the wafer in the opposite direction to the pressure of the polishing head.

[0074] Obviously, the wafer transfer method provided in the embodiment of the present disclosure also has the beneficial effects brought by the wafer carrier provided in the embodiment of the present disclosure, which will not be elaborated here.

[0075] In addition, an embodiment of the present disclosure also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the wafer transfer method as described above when executing the computer program.

[0076] In addition, a computer-readable storage medium is provided in an embodiment of the present disclosure. The computer-readable storage medium stores a computer program. When the computer program is executed by a processor, the steps of the polishing method described above are implemented.

[0077] The above-mentioned computer-readable storage medium can achieve the beneficial effects brought by the above-mentioned method when the computer program stored in its memory is executed by the processor.

[0078] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory or optical memory, etc. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0079] There are a few points to note:

[0080] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0081] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or there may be intermediate elements.

[0082] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0083] The above are only specific implementations of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and the protection scope of the present disclosure shall be based on the protection scope of the claims.

Claims

1. A wafer carrier, characterized in that: include: Carrier body; A holding portion, which is disposed at an edge region of the platform body and can be raised and lowered relative to the platform body; The supporting part includes at least one annular protrusion protruding from the surface of the carrier body; A sensing part, arranged in a middle area surrounded by the supporting part; An overflow part, comprising an overflow hole, wherein the overflow hole is arranged in a middle area surrounded by the supporting part, and the overflow hole is arranged around the sensing part; and The ejection portion includes a first ejection port and a second ejection port, wherein the first ejection port and the second ejection port are located in a middle region surrounded by the support portion.

2. The wafer carrier according to claim 1, characterized in that: The first injection port is disposed at the center of the stage body; there are a plurality of the second injection ports, which are arranged in at least one circle and surround the first injection port.

3. The wafer carrier according to claim 1, characterized in that: The carrier body has a mounting cavity, the sensing part includes a sensor and a mounting member, the sensor is mounted in the mounting cavity through the mounting member, wherein the overflow hole is arranged at the periphery of the mounting member, and the first injection port and the second injection port are both located on the mounting member.

4. The wafer carrier according to claim 3, characterized in that: The mounting member is provided with a plurality of fastening structures arranged at intervals along its periphery, and the mounting member is connected to the carrier body via the fastening structures, wherein at least part of the second injection port is located between two adjacent fastening structures.

5. The wafer carrier according to claim 1, characterized in that: The diameter of the first injection port is larger than the diameter of the second injection port.

6. The wafer carrier according to claim 5, characterized in that: The diameter of the first jet port is 2-4 cm; the diameter of the second jet port is 0.3-0.8 cm.

7. The wafer carrier according to claim 1, characterized in that: The supporting portion includes an inner annular protrusion and an outer annular protrusion, the inner annular protrusion and the outer annular protrusion are arranged in concentric circles, and either the inner annular protrusion or the outer annular protrusion includes a plurality of supporting protrusions arranged in a ring shape in sequence and at intervals.

8. A wafer carrying device, characterized in that: It comprises a wafer carrier as described in any one of claims 1 to 7.

9. A wafer transfer method, characterized in that: By using the wafer carrier as claimed in claim 8, the wafer is transferred from the robot arm to the polishing head of the polishing equipment; the method comprises the following steps: Placing a wafer on the stage body by a robot arm, and holding the peripheral edge of the wafer by the holding portion; Moving the wafer carrier to below the polishing head; Lowering the holding portion to make the wafer contact the annular protrusion, spraying water through the first spray port and the second spray port, and overflowing the water through the overflow hole to preliminarily clean the wafer; The polishing head is lowered to press down and absorb the wafer, wherein in the process of the polishing head pressing down and absorbing the wafer, water is continuously sprayed out through the first spray port and the second spray port to apply a supporting force to the wafer in the opposite direction to the pressure of the polishing head.

10. An electronic device, characterized in that: The device comprises a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the wafer transfer method as claimed in claim 9 when executing the computer program.

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