Optical package structure

Abstract

An optical package structure is provided. The optical package structure includes a carrier, an optical transmitter, an optical receiver, an optical barrier, and an insulating structure. And the optical transmitter and the optical receiver are arranged above the carrier. The optical barrier is above the carrier and between the optical transmitter and the optical receiver, wherein the optical barrier defines a cavity. The cavity is filled with the insulating structure, and the elevation of the top surface of the insulating structure is lower than that of the top surface of the optical barrier relative to the surface of the carrier.

Description

Technical Field

[0001] The present disclosure generally relates to an optical package structure. Background Art

[0002] Monitoring biologically relevant information helps determine various physiological characteristics of an individual. Integrating monitoring devices (e.g., sensors) with wearable devices (e.g., a pair of glasses, earpieces, and watches) allows for the collection of relevant information in a continuous and non-invasive manner, and is therefore becoming increasingly popular. Summary of the invention

[0003] In one or more configurations, an optical packaging structure includes a carrier, an optical transmitter, an optical receiver, an optical barrier, and an insulating structure. The optical transmitter and the optical receiver are above the carrier. The optical barrier is above the carrier and between the optical transmitter and the optical receiver, wherein the optical barrier defines a cavity. The insulating structure fills the cavity, wherein the top surface of the insulating structure has a lower elevation than the top surface of the optical barrier relative to the surface of the carrier.

[0004] In one or more configurations, an optical packaging structure includes a carrier, an optical transmitter, an optical receiver, an encapsulant, and an optical blocking structure. The optical transmitter and the optical receiver are above the carrier. The encapsulant encapsulates the optical transmitter and the optical receiver. The optical blocking structure is embedded in the encapsulant and between the optical transmitter and the optical receiver. The encapsulant includes an optically transmissive structure and a metamorphic layer between the optically transmissive structure and the optical blocking structure.

[0005] In one or more configurations, an optical packaging structure includes a carrier, an optical transmitter, an optical receiver, an encapsulant, an optical barrier, and a support structure. The optical transmitter and the optical receiver are above the carrier. The encapsulant encapsulates the optical transmitter and the optical receiver. The optical barrier is above the carrier and between the optical transmitter and the optical receiver. The support structure embeds the optical barrier and is configured to increase the uniformity of the compressive strength of the upper surface of the optical packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Aspects of the present disclosure are better understood from the following detailed description when read in light of the accompanying drawings.It should be noted that various features may not be drawn to scale and that the sizes of various features may be arbitrarily increased or reduced for clarity of discussion.

[0007] Figure 1A is a top view of an optical packaging structure according to some configurations of the present disclosure.

[0008] Figure 1Bis a cross-section of an optical packaging structure according to some configurations of the present disclosure.

[0009] Figure 1C is a cross-section of an optical packaging structure according to some configurations of the present disclosure.

[0010] Figure 1D is a cross-section of a portion of an optical packaging structure according to some configurations of the present disclosure.

[0011] Figure 1E is a cross-section of a portion of an optical packaging structure according to some configurations of the present disclosure.

[0012] Figure 1F is a cross-section of a portion of an optical packaging structure according to some configurations of the present disclosure.

[0013] Figure 2A is a top view of an optical packaging structure according to some configurations of the present disclosure.

[0014] Figure 2B is a cross-section of an optical packaging structure according to some configurations of the present disclosure.

[0015] Figure 3A is a cross-section of an optical packaging structure according to some configurations of the present disclosure.

[0016] Figure 3B is a cross-section of an optical packaging structure according to some configurations of the present disclosure.

[0017] Figure 3C is a cross-section of an optical packaging structure according to some configurations of the present disclosure.

[0018] Figure 4A is a top view of an optical packaging structure according to some configurations of the present disclosure.

[0019] Figure 4B is a cross-section of an optical packaging structure according to some configurations of the present disclosure.

[0020] Figure 4C is a top view of an optical packaging structure according to some configurations of the present disclosure.

[0021] Figure 4D is a cross-section of an optical packaging structure according to some configurations of the present disclosure.

[0022] Figure 5A , Figure 5B , Figure 5C , Figure 5D , Figure 5E and Fig. 5F Various stages of an exemplary method for manufacturing an optical package structure according to some configurations of the present disclosure are described.

[0023] Common reference numbers are used throughout the drawings and detailed description to refer to the same or like elements. DETAILED DESCRIPTION

[0024] Figure 1A is a top view of an optical packaging structure 1A according to some configurations of the present disclosure. Figure 1B is a cross-section of an optical packaging structure 1A according to some configurations of the present disclosure. Figure 1C is a cross-section of an optical packaging structure 1A according to some configurations of the present disclosure. In some configurations, Figure 1B It is along Figure 1A The cross section is taken along the cross section line 1B-1B' in FIG. Figure 1C It is along Figure 1A A cross section taken along the cross section line 1C-1C'.

[0025] The optical packaging structure 1A may include a carrier 10, an optical transmitter 20, an optical receiver 30, a device 40, wires 210 and 310, an optical blocking structure, and an encapsulant 70A. The optical packaging structure 1A may have a top surface 1a (also referred to as an "upper surface") exposed to a space (e.g., air) outside the optical packaging structure 1A. In some configurations, the top surface 1a includes the top surface (also referred to as the "upper surface") of the encapsulant 70A and one or more top surfaces (also referred to as the "upper surface") of the optical blocking structure. The optical packaging structure 1A may serve as a biosensor. In some configurations, the optical packaging structure 1A may be mounted or placed in a wearable sensor device.

[0026] The carrier 10 may include, for example, a printed circuit board, such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated glass fiber-based copper foil laminate. The carrier 10 may include an interconnect structure, which may include, for example, a plurality of conductive traces and / or a plurality of conductive vias. The interconnect structure may include a redistribution layer (RDL) and / or a grounding element. In some embodiments, the carrier 10 may include an organic substrate or a lead frame. In some configurations, the carrier 10 may include a ceramic material or a metal plate. In some configurations, the carrier 10 may include a two-layer substrate, which includes a core layer and conductive materials and / or structures disposed on the upper surface (or top surface) and the lower surface (or bottom surface) of the substrate. The carrier 10 may include a semiconductor wafer or an electronic component. The electronic component may be a chip or a bare die including a semiconductor substrate, one or more integrated circuit devices, and one or more overlying interconnect structures. The integrated circuit device may include an active device such as a transistor, and / or a passive device such as a resistor, a capacitor, an inductor, or a combination thereof. The carrier 10 may include one or more conductive elements, surfaces, contacts, or pads. In some configurations, the carrier 10 includes conductive pads 110, 120, and 130. Figure 1C , the conductive pads 110, 120 and 130 are exposed by the surface 101 of the carrier 10. In some configurations, the carrier 10 includes a dielectric layer, and the surfaces of the conductive pads 110, 120 and 130 are exposed to the dielectric layer. The dielectric layer may have a surface 101. The conductive pad 110 may be connected to the ground. In some configurations, the conductive pads 110, 120 and 130 may independently include a conductive material such as a metal or a metal alloy. Examples include gold (Au), silver (Ag), aluminum (Al), copper (Cu) or an alloy thereof. The dielectric layer may include an organic material, a solder resist, PI, ABF, one or more molding raw materials, one or more pre-impregnated composite fibers (e.g., a prepreg material), borophosphosilicate glass (BPSG), silicon oxide, silicon nitride, silicon oxynitride, undoped silicate glass (USG), any combination thereof, etc.

[0027] The optical transmitter 20 (also referred to as an “optical transmitting device” or “light emitting device”) and the optical receiver 30 (also referred to as an “optical receiving device” or “light receiving device”) may be above the carrier 10. The optical transmitter 20 may be electrically connected to the carrier 10 via a wire 210. The optical receiver 30 may be electrically connected to the carrier 10 via a wire 310.

[0028] Device 40 (also referred to as an "electronic component" or "semiconductor device") may be a chip or die that includes a semiconductor substrate, one or more integrated circuit devices, and one or more overlying interconnect structures. The integrated circuit device may include active devices such as transistors, and / or passive devices such as resistors, capacitors, inductors, or a combination thereof. In some configurations, device 40 includes an optoelectronic conversion component, an electronic control component, or other types of electronic components.

[0029] The optical blocking structure may be between the optical transmitter 20 and the optical receiver 30. The optical blocking structure is configured to block one or more optical signals from being directly transmitted from the optical transmitter 20 to the optical receiver 30 without passing any target to be detected. In some configurations, the optical blocking structure has an optical transmittance (or light transmittance) of no more than about 10%, 5%, 3%, or 1% relative to the peak wavelength or wavelength range of the optical signal (light) emitted by the optical transmitter 20. In some configurations, the optical blocking structure may include an optical barrier 50 and a filling structure 60.

[0030] In some configurations, the optical barrier 50 is above the carrier 10. The optical barrier 50 is configured to reflect light. In some configurations, the optical barrier 50 includes a material configured to reflect light (e.g., a metal material). In some configurations, the optical barrier 50 is at least partially between the optical transmitter 20 and the optical receiver 30. In some configurations, the optical barrier 50 defines a cavity 50C. In some configurations, the top surface of the optical barrier 50 (e.g., top surfaces 501 and 502) is exposed to the space (e.g., air) outside the optical packaging structure 1A. In some configurations, the optical barrier 50 includes a wall structure. In some configurations, the optical barrier 50 includes a metal wall structure. The metal wall structure may include a plurality of metal walls. In some configurations, the optical barrier 50 includes a conductive material, such as a metal or a metal alloy. Examples include Au, Ag, Al, Cu, alloys thereof, or stainless steel. In some configurations, the optical barrier 50 (or the metal wall structure) is electrically connected to the conductive pad 110.

[0031] In some configurations, the optical barrier 50 includes a portion 510 (also referred to as a "first portion") and a portion 520 (also referred to as a "second portion"). In some configurations, the portion 510 is between the optical transmitter 20 and the optical receiver 30. In some configurations, the portion 520 is adjacent to one or more outer sidewalls of the enclosure 70A.

[0032] refer to Figure 1B , in some configurations, the thickness of portion 510 decreases from top surface 1a toward carrier 10. In some configurations, one or more sidewalls of portion 510 may have an irregular morphology or an irregular profile. In some configurations, the sidewall of portion 510 has a plurality of recesses and a plurality of protrusions in a top view perspective. In some configurations, the sidewall of portion 510 has a plurality of recesses and a plurality of protrusions in a cross-sectional view perspective. In some configurations, the maximum distance between the bottom of the recess and the top of the protrusion is equal to or less than about 1 μm, 0.8 μm, 0.6 μm, 0.4 μm, 0.2 μm, or 0.1 μm.

[0033] In some configurations, portion 510 includes one or more vertical portions 511 and a horizontal portion 512 above the conductive pad 110. Portions of the surface 110a (or the top surface of the upper surface) of the conductive pad 110 may be exposed by portion 510. In some configurations, the vertical portion 511 is adjacent to the encapsulant 70A. In some configurations, the horizontal portion 512 contacts the conductive pad 110. In some configurations, the vertical portion 511 separates the encapsulant 70A into two portions spaced apart from each other. In some configurations, the vertical portion 511 is connected by the horizontal portion 512. In some configurations, the vertical portion 511 includes an end portion 511a connected to the horizontal portion 512 and an end portion 511b exposed to a space (e.g., air) outside the optical packaging structure 1A. In some configurations, the thickness T1 of the horizontal portion 512 is greater than the width W1 of the end portion 511a and less than the width W2 of the end portion 511b. The thickness T1 may be from about 4 μm to about 7 μm or from about 5 μm to about 6.5 μm. In some configurations, the vertical portion 511 includes a segment connected to the horizontal portion 512 (also referred to as a "first segment" or a "lower segment") and a segment exposed to a space (e.g., air) outside the optical packaging structure 1A (also referred to as a "second segment" or an "upper segment"). The first segment (or the lower segment) may include an end portion 511a, and the second segment (or the upper segment) may include an end portion 511b. In some configurations, the thickness T3 of the second segment is greater than the thickness T2 of the first segment. The thickness T2 may be from about 1.5 μm to about 5 μm or from about 2 μm to about 4.5 μm . Thickness T3 may be from about 6 μm to about 8 μm or from about 7 μm to about 7.5 μm. In some configurations, the first segment and the second segment of the vertical portion 511 extend in different directions. For example, the first segment (or lower segment) of the vertical portion 511 may extend in a direction substantially perpendicular to the surface 101, and the second segment (or upper segment) of the vertical portion 511 may extend in a direction inclined relative to the surface 101. In some configurations, the roughness (e.g., surface roughness) of the vertical portion 511 is greater than the roughness (e.g., surface roughness) of the horizontal portion 512.

[0034] refer to Figure 1C, in some configurations, the horizontal portion 512 includes one or more surfaces 512a that contact the conductive pads 110, 120, and 130. In some configurations, the horizontal portion 512 further includes one or more surfaces 512b that do not contact the conductive pads 110, 120, and 130. The surface 512b may be a recessed portion of the surface 101 of the carrier 10. In some configurations, the roughness of the surface 512a (e.g., surface roughness) is less than the roughness of the surface 512b (e.g., surface roughness). In some configurations, the portion 520 further has one or more surfaces 520b. The surface 520b may be a recessed portion of the surface 101 of the carrier 10. In some configurations, the roughness of the surface 512a (e.g., surface roughness) is less than the roughness of the surface 520b (e.g., surface roughness). In some configurations, the surface 512a is or includes an interface between the horizontal portion 512 and the conductive pads 110, 120, and / or 130. In some configurations, surface 512b is or includes an interface between horizontal portion 512 and carrier 10. In some configurations, surface 512b is or includes an interface between horizontal portion 512 and a dielectric layer of carrier 10. In some configurations, surface 520b is or includes an interface between portion 520 and a dielectric layer of carrier 10. In some configurations, horizontal portion 512 is conformally formed on a bottom surface of a trench formed by laser cutting that exposes surfaces of conductive pads 110, 120, and 130 and a surface of a dielectric layer of carrier 10. Conductive pads 110, 120, and 130 may act as a laser stopper for forming the trench formed by laser cutting. In some configurations, the laser cutting operation causes more damage to the dielectric layer of the carrier 10 than to the conductive pads 110, 120, and 130, so the surface of the dielectric layer of the carrier 10 subjected to the laser cutting operation is less uniform (e.g., has an irregular surface morphology or has a relatively large roughness) than the surfaces of the conductive pads 110, 120, and 130 subjected to the laser cutting operation. Therefore, the roughness of the surface 512a may be less than the roughness of the surface 512b and the roughness of the surface 520b. The surface 512a, the surface 512b, and the surface 520b together form a continuous surface that contacts the carrier 10.

[0035] In some configurations, portion 520 surrounds encapsulation 70A. In some configurations, vertical portion 511 of portion 510 is directly connected to portion 520. In some configurations, optical barrier 50 including portions 510 and 520 is a single-piece element. In some configurations, portions 510 and 520 of optical barrier 50 are integrally formed into a single structure. In some configurations, top surface 501 of portion 510 and top surface 502 of portion 520 may be at substantially the same elevation. In some configurations, one or more sidewalls of portion 520 may have an irregular shape or irregular contour. In some configurations, the sidewall of portion 520 has a plurality of notches and a plurality of protrusions in a top view perspective. In some configurations, the sidewall of portion 520 has a plurality of notches and a plurality of protrusions in a cross-sectional view perspective. In some configurations, portion 520 has a substantially planar or flat sidewall exposed to a space (e.g., air) outside optical packaging structure 1A. In some configurations, the maximum distance between the bottom of the recess and the top of the protrusion is equal to or less than about 1 μm, 0.8 μm, 0.6 μm, 0.4 μm, 0.2 μm, or 0.1 μm. In some configurations, the roughness (e.g., surface roughness) of the surface 110a of the conductive pad 110 is less than the roughness (e.g., surface roughness) of the surface 520b of the portion 520.

[0036] In some configurations, a filling structure 60 is filled in the cavity 50C. The filling structure 60 is configured to absorb light. In some configurations, the filling structure 60 includes a material configured to absorb light (e.g., a resin material). The filling structure 60 may be or include an insulating structure. The filling structure 60 may be referred to as a supporting element or a supporting structure. In some configurations, the filling structure 60 is embedded in the optical barrier 50. In some configurations, the filling structure 60 is embedded in a portion 510 of the optical barrier 50. In some configurations, the filling structure 60 is surrounded by the optical barrier 50. In some configurations, the conductive pad 110 directly contacts the optical barrier 50 and is spaced apart from the filling structure 60. In some configurations, the optical barrier 50 is electrically connected to the conductive pad 110. In some configurations, the filling structure 60 is configured to increase the uniformity of the compressive strength of the top surface 1a of the optical packaging structure 1A or within the top surface 1a of the optical packaging structure 1A. In some configurations, the top surface 601 (also referred to as the “upper surface”) of the filling structure 60 has an elevation lower than the top surface (also referred to as the “upper surface”) of the optical barrier 50 relative to the surface 101 of the carrier 10 (e.g., the top surface 501 and / or 502). In some configurations, the top surface 601 of the filling structure 60 is substantially flush with or lower than the top surface (e.g., the top surface 501 and / or 502) of the optical barrier 50 relative to the surface 101 of the carrier 10. In some configurations, the elevation difference between the top surface 601 and the top surface 501 is equal to or less than about 1 μm, 0.8 μm, 0.6 μm, 0.4 μm, 0.2 μm, or 0.1 μm. In some configurations, the top surface 601 of the filling structure 60 is exposed to a space (e.g., air) outside the optical packaging structure 1A. In some configurations, the roughness (e.g., surface roughness) of the top surface 601 of the filling structure 60 is greater than the roughness (e.g., surface roughness) of the top surface (e.g., top surface 501 and / or 502) of the optical barrier 50. In some configurations, the top surface 601 of the filling structure 60 includes a plurality of recessed portions 601r and a plurality of protruding portions 601p. In some configurations, the filling structure 60 includes a profile that tapers from the top surface 601 toward the bottom surface of the insulating structure 60 from a cross-sectional view.

[0037] In some configurations, the filling structure 60 includes a lower portion 610 and an upper portion 620. In some configurations, the width of the upper portion 620 is greater than the width of the lower portion 610. In some configurations, the width of the upper portion 620 decreases toward the lower portion 610. In some configurations, the filling structure 60 may include a dielectric material (or insulating material) comprising an organic material, an inorganic material, or a combination thereof. In some configurations, the filling structure 60 may further include a conductive filler mixed with the dielectric material or dispersed in the dielectric material. In some configurations, the filling structure 60 is or includes an epoxy resin, a conductive paste (e.g., Ag paste), a liquid silicone rubber (LSR), an LSR mixed with conductive particles, an LSR mixed with carbon nanotubes, or a combination thereof. In some configurations, the filling structure 60 may include a material having a hardness (or stiffness) greater than or substantially the same as or close to the hardness of the encapsulant 70A. In some configurations, the modulus of the filling structure 60 is greater than, substantially the same as, or close to the modulus of the encapsulant 70A.

[0038] In some configurations, the encapsulant 70A encapsulates the optical transmitter 20, the optical receiver 30, the device 40, and at least one of the wires 210 and 310. In some configurations, an optical blocking structure (e.g., an optical barrier 50 and a filling structure 60) is embedded in the encapsulant 70A and between the optical transmitter 20 and the optical receiver 30. In some configurations, the encapsulant 70A includes an optical transmitting structure 70 and an opaque layer 710, and the opaque layer 71 is between the optical transmitting structure 70 and the optical blocking structure. In some configurations, the encapsulant 70A is a single-piece element. In some configurations, the optical transmitting structure 70 and the opaque layer 710 are integrally formed as a single structure. In some configurations, the encapsulant 70A defines a trench 70T, and the optical blocking structure is disposed in the trench 70T. In some configurations, the optical barrier 50 and the filling structure 60 are disposed in the trench 70T. In some configurations, the trench 70T extends from the top surface 1a (or upper surface) toward the surface 101 of the carrier 10. In some configurations, the width of the trench 70T decreases from the top surface 1a toward the surface 101 of the carrier 10. In some configurations, the trench 70T includes an upper portion 70T2 and a lower portion 70T1, and the width of the upper portion 70T2 is greater than the width of the lower portion 70T1. In some configurations, the slope of the sidewall of the upper portion 70T2 relative to the surface 101 of the carrier 10 is greater than the slope of the sidewall of the lower portion 70T1 relative to the surface 101 of the carrier 10. In some configurations, the notch portion (e.g., surface 512b) of the surface 101 of the carrier 10 and the opaque layer 710 (or metamorphic layer) collectively define the trench 70T.

[0039] In some configurations, the optical transmissive structure 70 encapsulates the optical emitter 20, the optical receiver 30, the device 40, and the wires 210 and 310. In some configurations, the top surface 701 (also referred to as the "upper surface") of the optical transmissive structure 70 is substantially aligned with the top surface (e.g., top surface 501 and / or 502) of the optical barrier 50. In some configurations, the top surface 701 of the optical transmissive structure 70 is exposed to the space (e.g., air) outside the optical packaging structure 1A. In some configurations, the surface 110a of the conductive pad 110 is not higher than the surface 101 of the carrier 10 and contacts the optical transmissive structure 70. In some configurations, the top surface 701 of the optical transmissive structure 70 is narrower than the bottom surface 702 of the optical transmissive structure 70. In some configurations, the roughness (e.g., surface roughness) of the side surface 703 of the optical transmissive structure 70 is greater than the roughness (e.g., surface roughness) of the top surface 701 of the optical transmissive structure 70. In some configurations, the roughness (e.g., surface roughness) of the top surface 601 of the filling structure 60 is greater than the roughness (e.g., surface roughness) of the top surface 701 of the optically transmissive structure 70. In some configurations, the roughness (e.g., surface roughness) of the top surface (e.g., top surface 501 and / or 502) of the optical barrier 50 may be substantially the same as, less than, or greater than the roughness (e.g., surface roughness) of the top surface 701 of the optically transmissive structure 70. In some configurations, the portion 520 of the optical barrier 50 surrounds the optically transmissive structure 70. In some configurations, the optically transmissive structure 70 has an optical transmittance (or light transmittance) greater than about 90%, 95%, 97%, or 99% relative to a peak wavelength or wavelength range of an optical signal (light) emitted by the optical emitter 20. In some configurations, the optically transmissive structure 70 is or includes epoxy, liquid silicone rubber (LSR), or a combination thereof. In some configurations, the filling structure 60 and the optically transmissive structure 70 may be formed of or include the same material.

[0040] In some configurations, the opaque layer 710 directly contacts the optical transmissive structure 70. In some configurations, the opaque layer 710 is spaced apart from the optical emitter 20 and the optical receiver 30 by the optical transmissive structure 70. In some configurations, the opaque layer 710 extends along at least a portion of the groove 70T. In some configurations, the opaque layer 710 directly contacts the optical barrier 50 (or the metal wall structure). In some configurations, the opaque layer 710 directly contacts the portions 510 and 520 of the optical barrier 50 (or the metal wall structure). The opaque layer 710 may be formed by heating a portion of the optical transmissive structure 70. When heated (e.g., by a laser cutting operation), the portion of the optical transmissive structure 70 exposed to the groove 70T may form the opaque layer 710. In some configurations, the optical transmissive structure 70 is formed of or includes a polymer layer, and a portion of the polymer layer degenerates or deteriorates when heated to transform into the opaque layer 710. The opaque layer 710 may be referred to as a degradation layer or a deterioration layer. The opaque layer 710 (or degradation layer or deterioration layer) formed by a portion of the optically transmissive structure 70 may change its color (e.g., it may become darker) after being heated. The opaque layer 710 and the optically transmissive structure 70 may have different colors. The opaque layer 710 may be a darkened portion of the optically transmissive structure 70. In some configurations, the opaque layer 710 has a lower optical transmittance (or light transmittance) than the optically transmissive structure 70. In some configurations, the opaque layer 710 has an optical transmittance (or light transmittance) of less than about 99%, 97%, 95%, 90%, 80%, or 70% relative to the peak wavelength or wavelength range of the optical signal (light) emitted by the optical emitter 20.

[0041] The top surface 501 of the optical barrier 50, the top surface 601 of the filling structure 60, and the top surface 701 of the optical transmissive structure 70 collectively form the top surface 1a of the optical packaging structure 1A. In some configurations, the top surface 1a may include an optical sensing region (e.g., the top surface 701), a conductive region (e.g., the top surface 501), and a non-conductive region (e.g., the top surface 601) that are different from each other and do not overlap each other. In some configurations, the optical packaging structure 1A does not include any protective layer disposed on or covering the top surface 1a. In some configurations, the optical packaging structure 1A does not include any optically transmissive protective layer disposed on or covering the top surface 1a.

[0042] Figure 1D is a cross-section of a portion of an optical packaging structure according to some configurations of the present disclosure. In some configurations, Figure 1D yes Figure 1A A cross section of portion 1D of the optical packaging structure 1A.

[0043] In some configurations, the portion 510 of the optical barrier 50 includes a multilayer structure (or a multilayer wall structure). In some configurations, the portion 510 includes a plurality of sheet-like microstructures. In some configurations, the portion 510 includes a plurality of sheet-like particles (or crystal grains) stacked in a direction DR1 substantially perpendicular to the surface 101 of the carrier 10. In some configurations, the portion 510 has an irregularly shaped sidewall. In some configurations, the interface between the portion 510 and the filling structure 60 includes a non-planar surface having concave portions and protruding portions. In some configurations, the interface between the portion 510 and the opaque layer 710 includes a non-planar surface having concave portions and protruding portions.

[0044] In some configurations, the opaque layer 710 includes an irregular structure. In some configurations, the interface between the optically transmissive structure 70 and the opaque layer 710 includes a non-planar surface having concave portions and protrusive portions.

[0045] In some configurations, portion 520 may have a configuration similar to Figure 1D The structure described in , and the description is omitted below.

[0046] Figure 1E is a cross-section of a portion of an optical packaging structure according to some configurations of the present disclosure. In some configurations, Figure 1E yes Figure 1A A cross section of portion 1D of the optical packaging structure 1A.

[0047] In some configurations, the optical packaging structure 1A may further include an intermediate layer 720 between the opaque layer 710 and the optical blocking structure (e.g., the optical barrier 50). In some configurations, the intermediate layer 720 is different from the opaque layer 710 and the optical barrier 50. For example, the intermediate layer 720 is or includes a layer or structure that is different from or different from the opaque layer 710 and the optical barrier 50 as observed in the SEM image. In some configurations, the intermediate layer 720 directly contacts the opaque layer 710. In some configurations, the intermediate layer 720 is directly connected to the optical transmissive structure 70 through an opening of the opaque layer 710. In some configurations, the intermediate layer 720 directly contacts the optical barrier 50 (or the metal wall structure). In some configurations, an irregular interface is formed between the intermediate layer 720 and the optical barrier 50 (or the metal wall structure). In some configurations, the intermediate layer 720 may include a material diffused from the optical transmissive structure 70 during manufacturing. The intermediate layer 720 may include the same conductive material as that of the optical barrier 50 , and have a structure (eg, a crystal structure) different from that of the optical barrier 50 .

[0048] In some configurations, portion 510 includes a plurality of protrusions and a plurality of indentations. In some configurations, the protrusions of portion 510 may extend into filling structure 60 and / or intermediate layer 720.

[0049] In some configurations, opaque layer 710 can include portions that are spaced apart from one another. In some configurations, one or more of the portions of opaque layer 710 can be spaced apart from portion 510 , and another one or more of the portions of opaque layer 710 can contact portion 510 .

[0050] In some configurations, portion 520 may have a configuration similar to Figure 1E The structure described in , and the description is omitted below.

[0051] Figure 1F is a cross-section of a portion of an optical packaging structure according to some configurations of the present disclosure. In some configurations, Figure 1F yes Figure 1A A cross section of part 1F of the structure.

[0052] In some configurations, the portion 510 (or the metal wall) includes an irregular structure extending in a direction DR2 that is tilted relative to the surface 101 of the carrier 10. In some configurations, the opaque layer 710 includes an irregular structure extending in a direction DR2 that is tilted relative to the surface 101 of the carrier 10. In some configurations, the intermediate layer 720 includes an irregular structure extending in a direction DR2 that is tilted relative to the surface 101 of the carrier 10.

[0053] According to some configurations of the present disclosure, the optical barrier is between the optical transmitter and the optical receiver, and the filling structure is embedded in the optical isolation and has a top surface that is substantially flush with or lower than the top surface of the optical barrier. Therefore, this allows the top surface of the optical blocking structure of the optical packaging structure to contact the target to be detected and be completely covered by the target to be detected, which can effectively prevent crosstalk between the optical transmitter and the optical receiver, and can improve optical efficiency.

[0054] In addition, according to some configurations of the present disclosure, the filling structure is embedded in the optical barrier and may include a material having a hardness (or stiffness) substantially the same as or close to the stiffness of the encapsulant. Therefore, the filling structure can increase the structural strength of the entire semiconductor package structure, and the filling structure can further increase the uniformity of the compressive strength of the top surface of the optical package structure or within the top surface of the optical package structure. Therefore, the user can be prevented from feeling a foreign body sensation and / or the foreign body sensation can be minimized, thereby effectively preventing or alleviating discomfort during the use of the optical package structure as a sensor. In addition, according to some configurations of the present disclosure, the filling structure filled in the groove of the encapsulant may include a material having a hardness (or stiffness) greater than or close to the hardness of the encapsulant. Therefore, when a foreign body is pressed on the top surface of the optical package structure, the force applied on the top surface can be transmitted to the encapsulant to form a lateral stress on the lateral side of the groove in which the filling structure is formed, and the filling structure having a relatively high hardness (or stiffness) can resist the lateral stress and thus prevent the top surface of the optical package from being recessed or subsided.

[0055] In addition, according to some configurations of the present disclosure, the filling structure is filled in the groove, and the vertical portion of the optical barrier is inserted between the filling structure and the optical transmission structure. Therefore, the relatively thin vertical portion of the optical barrier can be fixed and protected by the filling structure and the optical transmission structure, thereby preventing cracks and / or damage to the vertical portion of the optical barrier.

[0056] In addition, according to some configurations of the present disclosure, the optical barrier can be electrically connected to the ground through the conductive pad of the carrier. Therefore, the optical barrier can provide a reduction or prevention of the effects of optical crosstalk and EMI shielding. Therefore, the optical sensing performance can be improved, and the electronic performance can also be improved by shielding electromagnetic interference.

[0057] In addition, according to some configurations of the present disclosure, the groove for arranging the optical blocking structure includes a lower portion and an upper portion wider than the lower portion. Therefore, the material of the optical blocking structure can be more easily arranged in the groove. For example, the metal wall of the optical barrier can be more easily arranged on the inner side wall of the groove by sputtering, rather than blocking the opening of the upper portion of the groove by sputtering. In other words, step coverage can be improved. Therefore, the formed optical blocking structure (e.g., metal wall structure) can define a cavity with a relatively large opening, and the cavity with a relatively large opening can be used for a filling structure to be arranged therein. Therefore, the filling structure can be filled in the cavity, and the cavity has a relatively dense structure without voids formed therein, thereby improving the yield and quality of the optical packaging structure.

[0058] Figure 2A is a top view of an optical packaging structure 2A according to some configurations of the present disclosure. Figure 2Bis a cross-section of an optical packaging structure 2A according to some configurations of the present disclosure. In some configurations, Figure 2B It is along Figure 2A A cross section taken along the cross section line 2B-2B'. Figure 2A to 2B The structure described in is similar to Figures 1A to 1C The differences between the structures are as follows.

[0059] In some configurations, the upper portion 70T2 and the lower portion 70T1 of the trench 70T define a stepped profile. In some configurations, the filling structure 60 includes a stepped structure. In some configurations, the portion 510 has a stepped profile. In some configurations, the portion 510 (or wall structure) of the optical barrier 50 includes a stepped structure. In some configurations, the opaque layer 710 has a stepped profile.

[0060] Figure 3A is a cross-section of an optical packaging structure 3A according to some configurations of the present disclosure. Figure 3A The structure described in is similar to Figures 1A to 1C The differences between the structures are as follows.

[0061] In some configurations, the width of the portion 510 decreases toward the surface 101 of the carrier 10. In some configurations, the upper portion 70T2 and the lower portion 70T1 of the trench 70T each include a tapered profile. In some configurations, the slope of the sidewall of the upper portion 70T2 relative to the surface 101 of the carrier 10 is greater than the slope of the sidewall of the lower portion 70T1 relative to the surface 101 of the carrier 10.

[0062] In some configurations, the elevation of the top surface (e.g., top surface 501 and / or 502) of the optical barrier 50 may be higher than the elevation of the top surface 701 of the encapsulant 70A relative to the surface 101 of the carrier 10. In some configurations, the elevation difference between the top surface 501 and the top surface 701 is equal to or less than about 1 μm, 0.8 μm, 0.6 μm, 0.4 μm, 0.2 μm, or 0.1 μm. In some configurations, the elevation difference between the top surface 502 and the top surface 701 is equal to or less than about 1 μm, 0.8 μm, 0.6 μm, 0.4 μm, 0.2 μm, or 0.1 μm. In some configurations, the elevation of the top surface 601 of the filling structure 60 may be substantially the same as or lower than the elevation of the top surface 501 of the optical barrier 50 relative to the surface 101 of the carrier 10. In some configurations, the elevation of the top surface 601 of the filling structure 60 may be substantially the same as or higher than the elevation of the top surface 701 of the encapsulant 70A relative to the surface 101 of the carrier 10 .

[0063] Figure 3Bis a cross-section of an optical packaging structure 3B according to some configurations of the present disclosure. Figure 3B The structure described in is similar to Figures 1A to 1C The differences between the structures are as follows.

[0064] In some configurations, the trench 70T has substantially vertical sidewalls. In some configurations, the angle defined by the sidewalls of the trench 70T and the surface 101 of the carrier 10 is close to 90°, for example, from 85° to 95°, from 87° to 93°, or from 89° to 91°. In some configurations, the width of the portion 510 (or wall structure) of the optical barrier 50 decreases toward the surface 101 of the carrier 10. In some configurations, the portion 510 may have a substantially planar top surface 501 that covers or overlaps a portion of the top surface 701 of the optically transmissive structure 70. In some configurations, the filling structure 60 has substantially vertical sidewalls. In some configurations, the top surface 501 of the optical barrier (or optical blocking structure) covers the top surface of the opaque layer 710 (or degenerate layer).

[0065] Figure 3C is a cross-section of an optical packaging structure 3C according to some configurations of the present disclosure. Figure 3C The structure described in is similar to Figures 1A to 1C The differences between the structures are as follows.

[0066] The optical package structure 3C may be configured to bend when subjected to pressure from a user. In some configurations, the top surface 1a (or upper surface) of the optical package structure 3C is configured to be or include a curved surface when subjected to pressure from a user. The optical package structure 3C may be configured to measure an electrocardiogram (ECG) signal from a user. In some configurations, the optical package structure 3C may include an ECG detection device (e.g., an ECG sensor). In some configurations, the top surface 501 of the optical barrier 50 is configured to be connected to an ECG sensor. During the detection of the ECG signal, a portion 900 of a person (e.g., a portion of a finger or a wrist) may contact the top surface 1a and apply pressure on the top surface 1a, so that the top surface 1a may bend to form a concave surface.

[0067] In some configurations, the optical packaging structure 3C may be bent from its original shape when worn or touched by a person's (or user's) finger or wrist, and may almost return to its original shape after the device including the optical packaging structure 3C is removed by the user. In some cases where the optical packaging structure does not include a filling structure and therefore has a relatively low stiffness, the optical barrier may also bend and recover accordingly and experience cyclic stress changes, and fatigue and cracks may subsequently occur. According to some configurations of the present disclosure, a filling structure with a relatively high stiffness is filled in the groove, and a vertical portion of the optical barrier is inserted between the filling structure and the optical transmission structure. Therefore, the filling structure can provide a rigid structural support for the optical barrier and prevent the optical barrier from repeatedly bending and recovering, thereby preventing cracks and / or damage to the vertical portion of the optical barrier.

[0068] Figure 4A is a top view of an optical packaging structure 4A according to some configurations of the present disclosure. Figure 4B is a cross-section of an optical packaging structure 4A according to some configurations of the present disclosure. In some configurations, Figure 4B It is along Figure 4A A cross section taken along the cross section line 4B-4B'. Figures 4A to 4B The structure described in is similar to Figures 1A to 1C The differences between the structures are as follows.

[0069] In some configurations, the optical encapsulation structure 4A may further include support elements 60A and 60B. The support elements 60A and 60B may be referred to as filling structures or insulating structures. The support elements 60A and 60B may include one or more materials that are the same as the material of the filling structure 60 (or support structure). In some configurations, the support elements 60A and 60B are embedded in the portion 520 of the optical barrier 50. In some configurations, the top surfaces 60A1 and 60B1 (also referred to as "upper surfaces") of the support elements 60A and 60B are substantially coplanar or aligned with the top surface 701 of the encapsulant 70A.

[0070] In some configurations, the portion 520 may further include vertical portions 521 and 521' and horizontal portions 522 and 522'. In some configurations, the horizontal portions 522 and 522' further include surfaces 522b and 522b' that do not contact the conductive pad 110. The surfaces 522b and 522b' may be recessed portions of the surface 101 of the carrier 10. In some configurations, the roughness of the surface 522b is greater than the roughness of the surface 110a of the conductive pad 110. In some configurations, the roughness of the surface 522b is greater than the roughness of the interface between the horizontal portion 512 and the conductive pad 110. In some configurations, the roughness of the surface 522b' is greater than the roughness of the surface 110a of the conductive pad 110. In some configurations, the roughness of the surface 522b' is greater than the roughness of the interface between the horizontal portion 512 and the conductive pad 110. In some configurations, one or more widths of the vertical portions 521 and 521' may decrease toward the carrier 10. In some configurations, the horizontal portions 522 and 522' may each have a thickness greater than one or more thicknesses of one or more lower sections of the vertical portions 521 and 521'. In some configurations, the vertical portions 521 are connected by the horizontal portions 522 to define the cavity 50C1, and the support element 60A is disposed in the cavity 50C1. In some configurations, the support element 60A tapers toward the carrier 10. In some configurations, the vertical portions 521' are connected by the horizontal portions 521' to define the cavity 50C2, and the support element 60B is disposed in the cavity 50C2. In some configurations, the support element 60B tapers toward the carrier 10.

[0071] Figure 4C is a top view of an optical packaging structure 4C according to some configurations of the present disclosure. Figure 4D is a cross-section of an optical packaging structure 4C according to some configurations of the present disclosure. In some configurations, Figure 4D It is along Figure 4C A cross section taken along the cross section line 4D-4D'. Figures 4C to 4D The structure described in is similar to Figures 4A to 4B The differences between the structures are as follows.

[0072] In some configurations, the optical packaging structure 4A may further include support elements 60A' and 60B'. The support elements 60A' and 60B' may be referred to as filling structures or insulating structures. The support elements 60A' and 60B' may include one or more materials that are the same as the material of the filling structure 60 (or support structure). In some configurations, the top surfaces 60A1 and 60B1 of the support elements 60A' and 60B' are substantially coplanar or aligned with the top surface 701 of the encapsulant 70A. In some configurations, the side surfaces of the support elements 60A' and 60B' are exposed to the outside of the optical packaging structure 4C.

[0073] In some configurations, portion 520 may further include vertical portions 521 and 521' and horizontal portions 522 and 522'. In some configurations, vertical portion 521 is connected to horizontal portion 522 to define cavity 50C1', and support element 60A' is disposed in cavity 50C1'. In some configurations, vertical portion 521' is connected to horizontal portion 521' to define cavity 50C2', and support element 60B' is disposed in cavity 50C2'. In some configurations, side surfaces of support elements 60A' and 60B' are exposed by vertical portions 521 and 521'. In some configurations, two groups of optical transmitters 20, optical receivers 30, and devices 40 may share one support element (e.g., one vertical portion) that is surrounded by one vertical portion of an optical barrier during manufacturing. Figures 4A to 4B The support elements 60A and / or 60B described in the drawings may be singulated, and a singulation operation may be performed on the common support elements to form support elements (eg, support elements 60A' and 60B') with exposed side surfaces, such as Figures 4C to 4D As described in .

[0074] Figure 5A , Figure 5B , Figure 5C , Figure 5D , Figure 5E and Fig. 5F Various stages of an exemplary method for manufacturing an optical package structure 1A according to some configurations of the present disclosure are described.

[0075] refer to Figure 5A , a carrier 10 including one or more conductive pads (e.g., conductive pads 110) may be provided, and an optical emitter 20, an optical receiver 30, and a device 40 may be disposed on the carrier 10. The optical emitter 20 may be electrically connected to the carrier 10 by a wire 210, and the optical receiver 30 may be electrically connected to the carrier 10 by a wire 310. Next, a mold fixture 800 may be disposed around the carrier 10. In some configurations, the mold fixture 800 contacts and surrounds the carrier 10. Next, an optically transmissive material 700 may be disposed in a space defined by a surface 101 (or upper surface) of the carrier 10 and the mold fixture 800. The optically transmissive material 700 may be or include a gel. In some configurations, the optically transmissive material 700 has a relatively high fluidity. In some configurations, the gel-like optically transmissive material 700 is disposed or poured into the space, and is maintained in the space for a predetermined time until a substantially planar top surface 701 of the optically transmissive material 700 is formed, and then a curing operation may be performed on the optically transmissive material 700. In some configurations, no planarization operation (eg, a grinding operation or a polishing operation) is performed on the optically transmissive material 700 .

[0076] refer to Figure 5BAfter the optically transmissive material 700 is cured to form the optically transmissive structure 70, a heat-resistant sacrificial layer 810 may be disposed to cover the entire top surface 701 of the optically transmissive structure 70. The heat-resistant sacrificial layer 810 may be or include a heat-resistant tape.

[0077] refer to Figure 5C , the groove structure 70H may be formed within the optical transmissive structure 70. In some configurations, the groove structure 70H includes grooves 70H1 and 70T. In some configurations, the groove 70H1 may be formed in a peripheral area of ​​the optical transmissive structure 70. In some configurations, the groove 70H1 surrounds the optical transmissive structure 70. In some configurations, the inner sidewall of the mold fixture 800 may be exposed to the groove 70H1. The groove 70H1 may have a bottom surface 70Hb extending into a portion of the carrier 10. The bottom surface 70Hb may be recessed from the surface 101. In some configurations, the groove 70T is between the optical transmitter 20 and the optical receiver 30. In some configurations, the groove 70T includes a lower portion 70T1 and an upper portion 70T2 having a width greater than the width of the lower portion 70T1. In some configurations, the conductive pad 110 is exposed to the groove 70T. In some configurations, an opening may be formed in the heat-resistant sacrificial layer 810 that is substantially aligned with a top end of the upper portion 70T2 of the trench 70T.

[0078] In some configurations, the groove structure 70H may be formed by a laser cutting operation (also referred to as "laser grooving"). In some configurations, the grooves 70H1 and 70T are formed by the same laser cutting operation. After the groove structure 70H is formed, the opaque layer 710 may be formed by the heat from the laser cutting operation. In some configurations, the heat from the laser cutting operation is absorbed by the portion of the optically transmissive structure 70 exposed to the grooves 70H1 and 70T, and the opaque layer 710 is formed along the inner sidewalls of the grooves 70H1 and 70T. In some configurations, the groove 70T may be formed by one or more steps of the laser cutting operation. For example, a first laser cutting operation may be performed to form a substantially straight groove having substantially vertical sidewalls, and a second laser cutting operation may be performed to widen the upper portion of the straight groove to form the lower portion 70T1 and the upper portion 70T2 of the groove 70T. The lower portion 70T1 may be formed by a first laser cutting operation, and the upper portion 70T2 may be formed by a second laser cutting operation. The conductive pad 110 may act as a laser stop for forming the trench 70T. In some configurations, a portion of the carrier 10 (e.g., a dielectric layer of the carrier 10) may be removed by a laser cutting operation to form a trench 70H1 that partially extends into the carrier 10. In some other configurations, the trench structure 70H may be formed by one or more mechanical cutting operations. In some configurations, the opening of the heat-resistant sacrificial layer 810 and the trench 70T of the trench structure 70H are formed by the same removal operation. In some configurations, the opening of the heat-resistant sacrificial layer 810 and the trench 70T of the trench structure 70H are formed by the same laser cutting operation. In some configurations, the opening of the heat-resistant sacrificial layer 810 and the trench 70T of the trench structure 70H are formed by the same mechanical cutting operation.

[0079] According to some configurations of the present disclosure, the heat-resistant sacrificial layer 810 is formed by a removal operation that forms the trench 70T, so that the opening of the heat-resistant sacrificial layer 810 is substantially aligned with the top end of the trench 70T and substantially covers the remaining top surface 701 of the optically transmissive structure 70. Therefore, any residue formed by the removal operation (e.g., residue from a laser cutting operation or a mechanical cutting operation) is formed on the heat-resistant sacrificial layer 810, rather than directly contacting or covering the top surface 701 of the optically transmissive structure 70. Therefore, the top surface 701 of the optically transmissive structure 70 can be prevented from being covered by an undesirable optical blocking material.

[0080] refer to Figure 5D, the optical barrier 50 (or metal wall structure) may be formed in the trench 70H1 and on the inner sidewalls of the trench 70T. In some configurations, the optical barrier 50 may be formed by sputtering or spraying. In some configurations, although the optical barrier 50 is formed by sputtering in the direction DR3 substantially perpendicular to the surface 101 of the carrier 10, the formed portion 510 of the optical barrier 50 (e.g., the vertical portion 511 of the portion 510) has a decreasing width in the direction DR3. In some configurations, the upper section of the vertical portion 511 is formed on the sidewall of the upper portion 70T2 of the trench 70T and thus has a relatively large thickness. In some configurations, the lower section of the vertical portion 511 is formed on the sidewall of the lower portion 70T1 of the trench 70T and thus has a relatively small thickness.

[0081] According to some configurations of the present disclosure, when the optical barrier 50 is formed by sputtering or spraying, the heat-resistant sacrificial layer 810 covers the top surface 701 of the optical transmissive structure 70. Therefore, the heat-resistant sacrificial layer 810 can prevent the sputtered material or the coating material from directly forming or covering the top surface 701, and any sputtered material or coating material formed outside the groove structure 70H can be removed as well as the heat-resistant sacrificial layer 810. Therefore, the top surface 701 of the optical transmissive structure 70 can be prevented from being covered by an undesirable optical blocking material or optical isolation material.

[0082] refer to Figure 5E , the mold fixture 800 and the heat-resistant sacrificial layer 810 may be removed. In some configurations, a planarization operation (eg, a grinding operation or a polishing operation) is not performed on the optical barrier 50 .

[0083] refer to Fig. 5F , the filling structure 60 can be formed in the cavity 50C within the portion 510 of the optical barrier 50. In some configurations, the filling structure 60 can be formed by spraying, dispensing, printing or other applicable techniques. In some configurations, no planarization operation (e.g., grinding operation or polishing operation) is performed on the filling structure 60. Thus, the optical packaging structure 1A is formed.

[0084] According to some configurations of the present disclosure, the optically transmissive material has a relatively high fluidity, and thus a substantially planar surface of the optically transmissive structure can be formed without any planarization operation (eg, grinding or polishing).

[0085] In addition, according to some configurations of the present disclosure, the groove formed by the laser cutting operation may have a substantially uniform planar surface, and thus the metal wall of the optical barrier formed by sputtering on the substantially uniform surface may have a relatively dense structure and thus a substantially planar top surface. Therefore, the optical barrier and the optical transmission structure may jointly form a substantially planar top surface of the optical packaging structure. Therefore, this allows the planar top surface of the optical packaging structure to contact the target to be detected and be completely covered by the target to be detected, which can effectively prevent crosstalk between the optical transmitter and the optical receiver, and can improve optical efficiency.

[0086] Unless otherwise specified, spatial descriptions such as "above", "below", "up", "left", "right", "lower", "top", "bottom", "vertical", "horizontal", "side", "above", "below", "upper", "above", "below", etc. are indicated relative to the orientation shown in the figure. It should be understood that the spatial descriptions used herein are for illustrative purposes only, and that embodiments of the structures described herein may be spatially configured in any orientation or manner, provided that the advantages of the embodiments of the present disclosure are not deviated by such configurations.

[0087] As used herein, the terms "approximately," "substantially," "generally," "about," and "about" are used to describe and explain minor variations. When used in conjunction with an event or circumstance, these terms may refer to instances where the event or circumstance occurred exactly as well as instances where the event or circumstance occurred very approximately. For example, when used in conjunction with a numerical value, these terms may refer to a range of variation of less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if a first numerical value is within a range of variation of less than or equal to ±10% of a second numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%, then the first numerical value may be considered to be "substantially" the same as or equal to the second numerical value. For example, "substantially" vertical can refer to an angular variation range of less than or equal to ±10° relative to 90°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.

[0088] If the displacement between the two surfaces is no more than 5 μm, no more than 2 μm, no more than 1 μm, or no more than 0.5 μm, then the two surfaces can be considered to be coplanar or substantially coplanar. If the displacement between the highest point and the lowest point of a surface is no more than 5 μm, no more than 2 μm, no more than 1 μm, or no more than 0.5 μm, then the surface can be considered to be substantially flat.

[0089] As used herein, the singular forms "a," "an," and "the" may include plural or plural referents unless the context clearly indicates otherwise.

[0090] As used herein, the terms "conductive," "electrically conductive," and "conductivity" refer to the ability to carry an electric current. Conductive materials are materials that present little or no resistance to the flow of electric current. One unit of measurement for conductivity is Siemens per meter (S / m). Typically, a conductive material is one that has a conductivity greater than about 10 4 S / m, for example at least 10 5 S / m or at least 10 6 S / m of a material. The conductivity of a material sometimes varies with temperature. Unless otherwise specified, the conductivity of a material is measured at room temperature.

[0091] In addition, amounts, ratios and other numerical values ​​are sometimes presented herein in a range format. It should be understood that such a range format is used for the sake of convenience and brevity, and should be flexibly construed to include not only the values ​​explicitly specified as the limits of the range, but also all individual values ​​or sub-ranges encompassed within the range, as if each value and sub-range were explicitly specified.

[0092] Although the present disclosure has been described and illustrated with reference to the specific embodiments of the present disclosure, these descriptions and illustrations are not restrictive. It should be understood by those skilled in the art that various changes may be made and equivalents may be replaced without departing from the true spirit and scope of the present disclosure as defined by the appended claims. The illustrations may not necessarily be drawn to scale. Due to manufacturing processes and tolerances, there may be differences between the process reproduction in the present disclosure and the actual equipment. There may be other embodiments that are not specifically described in the present disclosure. The description and drawings should be regarded as illustrative rather than restrictive. Modifications may be made to make specific situations, materials, material compositions, methods or processes suitable for the goals, spirit and scope of the present disclosure. All such modifications are deemed to be included within the scope of the appended claims. Although the disclosed method has been described herein with reference to specific operations performed in a specific order, it should be understood that these operations may be combined, subdivided or reordered to form equivalent methods without departing from the teachings of the present disclosure. Therefore, unless specifically indicated herein, the order and grouping of operations are not limitations of the present disclosure.

Claims

1. An optical packaging structure, comprising: Carrier; an optical transmitter and an optical receiver above the carrier; an optical barrier over the carrier and between the optical transmitter and the optical receiver, wherein the optical barrier defines a cavity; and an insulating structure filled in the cavity, Wherein, relative to the surface of the carrier, the elevation of the top surface of the insulating structure is lower than the elevation of the top surface of the optical barrier. 2 . The optical packaging structure according to claim 1 , wherein the top surface of the insulating structure is exposed to a space outside the optical packaging structure.

3. The optical packaging structure according to claim 1 further comprises an optically transmissive structure encapsulating the optical transmitter, the optical receiver and the optical barrier, wherein a top surface of the optically transmissive structure is substantially aligned with the top surface of the optical barrier, and the top surface of the optically transmissive structure is narrower than a bottom surface of the optically transmissive structure. The optical package structure of claim 3 , wherein the top surface of the optical barrier is configured to be connected to an ECG sensor.

5. The optical packaging structure according to claim 1, further comprising an optical transmissive structure encapsulating at least one of the optical transmitter and the optical receiver, wherein the roughness of the top surface of the insulating structure is greater than the roughness of the top surface of the optical transmissive structure. 6 . The optical packaging structure according to claim 5 , wherein a roughness of a side surface of the optically transmissive structure is greater than the roughness of the top surface of the optically transmissive structure. 7 . The optical package structure of claim 1 , wherein the carrier comprises a gasket directly contacting the optical barrier and spaced apart from the insulating structure. The optical package structure according to claim 7 , wherein the optical barrier is electrically connected to the pad.

9. The optical packaging structure according to claim 7, further comprising an optically transmissive structure encapsulating the optical transmitter, the optical receiver and the optical barrier, wherein the gasket has a top surface that is not higher than the surface of the carrier and contacts the optically transmissive structure. 10 . The optical package structure according to claim 1 , wherein the insulating structure comprises a profile that tapers from the top surface toward a bottom surface of the insulating structure from a cross-sectional view.

11. An optical packaging structure, comprising: Carrier; an optical transmitter and an optical receiver above the carrier; an enclosure encapsulating the optical transmitter and the optical receiver; and an optical blocking structure embedded in the encapsulant and between the optical transmitter and the optical receiver, The encapsulant includes an optically transmissive structure and a metamorphic layer between the optically transmissive structure and the optically blocking structure. 12 . The optical packaging structure according to claim 11 , wherein the degenerate layer directly contacts the optically transmissive structure. 13 . The optical packaging structure according to claim 11 , further comprising an intermediate layer between the deteriorated layer and the optical blocking structure, wherein the intermediate layer is different from the deteriorated layer. 14 . The optical packaging structure according to claim 13 , wherein the intermediate layer is directly connected to the optically transmissive structure through the opening of the altered layer. 15 . The optical package structure of claim 11 , wherein the encapsulant defines a groove, the optical blocking structure is disposed in the groove, and the degenerate layer extends along at least a portion of the groove. 16 . The optical package structure according to claim 15 , wherein an upper surface of the carrier has a notch portion, and the notch portion and the altered layer collectively define the groove of the encapsulant. 17 . The optical packaging structure according to claim 15 , wherein a top surface of the optical blocking structure covers a top surface of the deteriorated layer.

18. An optical packaging structure, comprising: Carrier; an optical transmitter and an optical receiver above the carrier; an enclosure encapsulating the optical transmitter and the optical receiver; an optical barrier above the carrier and between the optical transmitter and the optical receiver; and A support structure is embedded in the optical barrier and is configured to increase the uniformity of the compressive strength of the upper surface of the optical packaging structure. The optical packaging structure according to claim 18 , wherein the stiffness of the support structure is greater than the stiffness of the encapsulant.

20. The optical package structure of claim 18, wherein the optical barrier is configured to reflect light and the support structure is configured to absorb the light.

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