Transparent display panel and display device

Abstract

The embodiment of the invention provides a transparent display panel and a display device. Relates to the technical field of display and is used for solving the technical problem of relative deviation of transmittance of a transparent display panel to ambient light. The transparent display panel comprises a substrate and pixels arranged on the substrate. The pixel comprises a light-emitting area and a light-transmitting area. The light emitting region includes a packaged light emitting device. The packaged light emitting device includes a plurality of light emitting chips and an external pad. The light-emitting chip comprises an anode electrode and a cathode electrode. The external pads include a single-pole pad and a common-pole pad. The total number of the unipolar pads and the copolar pads is less than the total number of the anode electrodes and the cathode electrodes. One of the anode electrode and the cathode electrode of the light-emitting chip is electrically connected with the common-pole bonding pad, and the other one of the anode electrode and the cathode electrode of the light-emitting chip is electrically connected with the corresponding single-pole bonding pad.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a transparent display panel and a display device. Background Art

[0002] With the development of display technology, transparent display technology can bring novel experiences and usage scenarios to users. The transparent display panel has a display function and can be used to present image information to the user. At the same time, the transparent display panel has a perspective effect, that is, ambient light can enter the transparent display panel from one side of the transparent display panel, and then pass through the transparent display panel and exit from the other side of the transparent display panel, so that the user can observe the image displayed on the transparent display panel, and also observe the scene behind the transparent display panel. Transparent display panels can be applied to scenes such as car window glass and shopping mall windows. However, the current transparent display panel has a relative deviation in the transmittance of ambient light, which makes the transparency of the transparent display panel poor, so that the scene behind the transparent display panel observed by the user is unclear. Summary of the invention

[0003] In view of the above problems, the embodiments of the present application provide a transparent display panel and a display device, which can help reduce the area of ​​the light-emitting region and relatively increase the area of ​​the light-transmitting region to improve the transmittance of ambient light of the transparent display panel.

[0004] In order to achieve the above objectives, the present application provides the following technical solutions:

[0005] A first aspect of an embodiment of the present application provides a transparent display panel, which includes a substrate and a plurality of pixels. The pixels are arranged on the substrate. The pixels include a light-emitting area and a light-transmitting area. The light-emitting area includes a packaged light-emitting device. The packaged light-emitting device includes a plurality of light-emitting chips and an external pad. The light-emitting chip includes an anode electrode and a cathode electrode. The external pad includes a unipolar pad and a common-pole pad. The total number of the unipolar pad and the common-pole pad is less than the total number of the anode electrode and the cathode electrode. One of the anode electrode and the cathode electrode of the light-emitting chip is electrically connected to the common-pole pad, and the other is electrically connected to the corresponding unipolar pad.

[0006] The transparent display panel of the embodiment of the present application includes a substrate and pixels arranged on the substrate. Each pixel includes a light-emitting area and a light-transmitting area. The light-emitting area includes a packaged light-emitting device. The packaged light-emitting device includes a plurality of light-emitting chips and an external pad. The light-emitting chip is electrically connected to the external pad. The light-emitting chip includes an anode electrode and a cathode electrode. The external pad includes a unipolar pad and a common-pole pad. The total number of unipolar pads and common-pole pads is less than the total number of anode electrodes and cathode electrodes. One of the anode electrode and the cathode electrode of the light-emitting chip is electrically connected to the common-pole pad, and the other is electrically connected to the corresponding unipolar pad. The packaged light-emitting device can be welded to an external circuit through the external pad. Compared with the way that the anode electrode and the cathode electrode of each light-emitting chip are independently connected to the external circuit, when the packaged light-emitting device is electrically connected to the external circuit, the number of connection points formed between the packaged light-emitting device and the external circuit will be relatively reduced, and the wiring area between the packaged light-emitting device and the external circuit can also be reduced, so that the connection area between the packaged light-emitting device and the external circuit can be relatively small, which is conducive to reducing the area of ​​the light-emitting area and relatively increasing the area of ​​the light-transmitting area to improve the transmittance of the ambient light of the transparent display panel. Therefore, the transparency of the transparent display panel of the embodiment of the present application is relatively higher, and the scene behind the transparent display panel can be observed relatively more clearly, which improves the user experience.

[0007] In a possible implementation, the number of monopolar pads is greater than or equal to the number of light-emitting chips.

[0008] In a possible implementation, the cathode electrode of the light emitting chip is electrically connected to the common electrode pad, and the anode electrode is electrically connected to the corresponding unipolar pad. The packaged light emitting device is formed into a common cathode structure.

[0009] In a possible implementation, the light-emitting area further includes a control circuit, which is electrically connected to the packaged light-emitting device, and is used to control the packaged light-emitting device to emit light.

[0010] In a possible implementation, the control circuit includes transistors, and along the thickness direction of the transparent display panel, the transistors are located on the backlight side of the packaged light-emitting device, and the unipolar pads are electrically connected to the corresponding transistors.

[0011] The light-emitting side of the light-emitting chip is the light-emitting side of the packaged light-emitting device, and the non-light-emitting side of the light-emitting chip is the backlight side of the packaged light-emitting device. Since the transistor is located on the backlight side of the packaged light-emitting device, the transistor itself and the wiring between the packaged light-emitting device and the transistor will not occupy the light-transmitting area, thereby reducing the possibility of the light-transmitting area being relatively reduced due to the transistor itself and the wiring between the packaged light-emitting device and the transistor occupying the light-transmitting area.

[0012] In a possible implementation, the transistor is an oxide thin film transistor or a low temperature polysilicon thin film transistor.

[0013] Oxide thin film transistors or low-temperature polysilicon thin film transistors have high mobility and high current, so that the light-emitting chip can achieve a higher brightness, which is conducive to the transparent display panel to achieve a relatively high contrast.

[0014] In a possible implementation, the light-emitting area further includes a common electrode line, the common electrode pad is electrically connected to the common electrode line, and along the thickness direction of the transparent display panel, the common electrode line is located on the backlight side of the packaged light-emitting device.

[0015] The common electrode pad is electrically connected to the common electrode line. The transistor and the common electrode line are used to supply power to the light-emitting chip so that the light-emitting chip can emit light. The common electrode line is used to provide a common voltage. Along the thickness direction of the transparent display panel, the common electrode line is located on the backlight side of the packaged light-emitting device, so that the common electrode line does not occupy the light-transmitting area, thereby reducing the possibility of the light-transmitting area being relatively reduced due to the common electrode line encroaching on the light-transmitting area.

[0016] In a possible implementation, the light-emitting area further includes a pixel electrode, each unipolar pad is electrically connected to the transistor via the pixel electrode, and the pixel electrode is located on the backlight side of the packaged light-emitting device along the thickness direction of the transparent display panel.

[0017] Along the thickness direction of the transparent display panel, the pixel electrode is located on the backlight side of the packaged light-emitting device, so that the pixel electrode does not occupy the light-transmitting area, thereby reducing the possibility of the light-transmitting area being relatively reduced due to the pixel electrode occupying the light-transmitting area.

[0018] In a possible implementation, the packaged light emitting device includes three light emitting chips, and the external pads include three unipolar pads and one common-pole pad.

[0019] In a possible implementation, the packaged light emitting device further includes a substrate, and the three light emitting chips are arranged side by side on the substrate. The arrangement of the light emitting chips is relatively simple, which is conducive to reducing the processing difficulty and cost.

[0020] In a possible implementation, the three light-emitting chips are respectively a red light-emitting chip, a green light-emitting chip, and a blue light-emitting chip.

[0021] In a possible implementation, the light-emitting chip is a Micro-LED chip.

[0022] Micro-LED chips themselves have the characteristics of high brightness and long life. The luminous efficiency of Micro-LED chips can increase with the increase of brightness. The light-emitting chip adopts the method of Micro-LED chips. On the one hand, it is conducive to extending the service life of the transparent display panel. At the same time, the transparent display panel can achieve a higher display brightness to improve the contrast of the transparent display panel; on the other hand, due to the high brightness and long life of Micro-LED chips, the size of Micro-LED chips can be relatively reduced if the life of Micro-LED chips allows, which is conducive to reducing the size of the packaged light-emitting device, thereby further relatively reducing the size of the light-emitting area and increasing the size of the light-transmitting area.

[0023] In a possible implementation, the packaged light-emitting device further includes a substrate and a transparent package body, the light-emitting chip and the transparent package body are both arranged on the substrate, and the transparent package body covers the light-emitting chip.

[0024] The transparent encapsulation body can be combined with the substrate. The transparent encapsulation body and the substrate can protect the light-emitting chip, prolong the path for water vapor to enter the light-emitting chip, and help reduce the possibility of damage to the light-emitting chip and prolong the service life of the light-emitting chip.

[0025] In a possible implementation manner, the packaged light-emitting device further includes a substrate, and the external solder pad is disposed on the substrate.

[0026] In a possible implementation, the substrate is rectangular, and the unipolar pads and the common-pole pads are respectively disposed at the four vertex corners of the substrate.

[0027] A second aspect of an embodiment of the present application provides a display device, which includes a transparent display panel as described in the above embodiment. The transparent display panel includes a substrate and a plurality of pixels. The pixels are arranged on the substrate. The pixels include a light-emitting area and a light-transmitting area. The light-emitting area includes a packaged light-emitting device. The packaged light-emitting device includes a plurality of light-emitting chips and an external pad. The light-emitting chip includes an anode electrode and a cathode electrode. The external pad includes a unipolar pad and a common-pole pad. The total number of unipolar pads and common-pole pads is less than the total number of anode electrodes and cathode electrodes. One of the anode electrode and the cathode electrode of the light-emitting chip is electrically connected to the common-pole pad, and the other is electrically connected to the corresponding unipolar pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0029] Figure 1 A schematic diagram of a partial structure of a transparent display panel according to an embodiment of the present application;

[0030] Figure 2 A schematic diagram of a partial structure of a transparent display panel according to an embodiment of the present application;

[0031] Figure 3 This is a schematic structural diagram of a packaged light-emitting device according to an embodiment of the present application;

[0032] Figure 4 FIG. 1 is a schematic diagram of a partial cross-sectional structure of a transparent display panel according to an embodiment of the present application.

[0033] Description of reference numerals:

[0034] 10. Transparent display panel;

[0035] 20. substrate;

[0036] 30. Encapsulate light-emitting devices;

[0037] 31. Substrate;

[0038] 32. light emitting chip; 321. anode electrode; 322. cathode electrode;

[0039] 33. Transparent packaging body;

[0040] 34, external pad; 341, unipolar pad; 342, common pad;

[0041] 40. Transistor;

[0042] 41. Source;

[0043] 42. Drain;

[0044] 43. Active layer;

[0045] 44. Gate;

[0046] 45. Gate insulating layer;

[0047] 46. ​​Interlayer insulation layer;

[0048] 50. Common electrode line;

[0049] 60. pixel electrode;

[0050] P, pixel; CG, light emitting area; TG, light transmitting area;

[0051] X, thickness direction. DETAILED DESCRIPTION

[0052] In the current transparent display panel technology, the transparent display panel includes a plurality of pixels. The pixel includes a light-emitting area and a light-transmitting area. The light-transmitting area is used to transmit ambient light so that the user can observe the scene behind the transparent display panel. The light-emitting area is provided with a light-emitting chip. When the light-emitting chip emits light, the transparent display panel can display an image. The intensity of the external ambient light varies. When the external ambient light is strong and bright, the light-emitting chip needs to have a higher brightness to ensure that the transparent display panel has a higher contrast to achieve a better display effect. The light-emitting chip has an anode electrode and a cathode electrode. The anode electrode and the cathode electrode of each light-emitting chip are electrically connected to the control circuit independently, for example, the anode electrode and the cathode electrode are electrically connected to the control circuit independently by welding, resulting in a large number of connection points between all the light-emitting chips in a pixel and the control circuit, and a relatively large connection area, which in turn leads to a relatively large area of ​​the light-emitting area. However, due to the relatively large area of ​​the light-emitting area, the area of ​​the light-transmitting area is relatively small, so the transmittance of the transparent display panel to the ambient light is relatively biased, so that the transparency of the transparent display panel is poor, so that the scene behind the transparent display panel observed by the user is unclear.

[0053] In response to the above technical problems, the present application provides an improved technical solution, in which a packaged light-emitting device is provided in the light-emitting area of ​​a pixel. The packaged light-emitting device includes a plurality of light-emitting chips. In the packaged light-emitting device, one electrode of each light-emitting chip is electrically connected to a common-pole pad, and the other electrode is electrically connected to the corresponding unipolar pad. The common-pole pad and the unipolar pad are each electrically connected to an external circuit (e.g., a control circuit). Since the total number of common-pole pads and unipolar pads is less than the total number of anode electrodes and cathode electrodes of all light-emitting chips, the connection area between the packaged light-emitting device and the external circuit is relatively small, which can help reduce the area of ​​the light-emitting area and relatively increase the area of ​​the light-transmitting area, so as to improve the transmittance of ambient light of the transparent display panel, and then the scene behind the transparent display panel can be observed relatively more clearly through the transparent display panel.

[0054] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be further described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0055] Figure 1 The partial structure of the transparent display panel 10 according to an embodiment of the present application is schematically shown. Figure 2The partial structure of the transparent display panel 10 according to an embodiment of the present application is schematically shown. Figure 3 The structure of a packaged light emitting device 30 according to an embodiment of the present application is schematically shown. Figure 4 The partial cross-sectional structure of the transparent display panel 10 according to an embodiment of the present application is schematically shown. Figures 1 to 4 The technical solution of the embodiment of the present application is described.

[0056] refer to Figure 1 and Figure 2 As shown, in the embodiment of the present application, the transparent display panel 10 includes a substrate 20 and a plurality of pixels P. The substrate 20 may be a transparent insulating substrate. For example, the substrate 20 may be a rigid substrate, for example, the substrate 20 may be a glass substrate. For example, the substrate 20 may be a flexible substrate. For example, the material of the substrate 20 may be polyimide (PI). The plurality of pixels P are disposed on the substrate 20. For example, the plurality of pixels P may be disposed in an array distributed on the substrate 20. For example, each pixel P may include a plurality of sub-pixels. For example, each pixel P may include three sub-pixels.

[0057] In the embodiment of the present application, the pixel P includes a light-emitting region CG and a light-transmitting region TG. The light-emitting region CG includes a packaged light-emitting device 30. Since the light-emitting region CG is provided with the packaged light-emitting device 30, the light-emitting region CG has a certain shielding effect on the ambient light, so that the ambient light is not easy to pass through the light-emitting region CG.

[0058] In the embodiment of the present application, the light-transmitting region TG may be adjacent to the luminous region CG. For example, the light-transmitting region TG may be located on one side of the luminous region CG. The light-transmitting region TG has good transmittance and can relatively easily transmit ambient light. The light-transmitting region TG may only include a light-transmitting insulating layer to facilitate the transmission of ambient light. The larger the area of ​​the light-transmitting region TG is, the greater the transmittance of ambient light of the transparent display panel 10 is, and the clearer the scene observed through the transparent display panel 10 is.

[0059] See also Figure 3 and Figure 4 As shown, in the embodiment of the present application, the packaged light-emitting device 30 of the light-emitting region CG includes a light-emitting chip 32 and an external pad 34. The light-emitting chip 32 includes an anode electrode 321 and a cathode electrode 322. In some examples, one pixel P may include one packaged light-emitting device 30. Each light-emitting chip 32 in one packaged light-emitting device 30 may be formed as a sub-pixel.

[0060] The packaged light emitting device 30 is electrically connected to an external circuit through an external solder pad 34. The external solder pad 34 is exposed to facilitate soldering to an external circuit. The external solder pad 34 includes a unipolar solder pad 341 and a common-pole solder pad 342. The unipolar solder pad 341 and the common-pole solder pad 342 are insulated from each other. The unipolar solder pad 341 refers to a solder pad for electrically connecting to an electrode of the corresponding light emitting chip 32. One of the anode electrode 321 and the cathode electrode 322 of the light emitting chip 32 is electrically connected to the common-pole solder pad 342, and the other is electrically connected to the corresponding unipolar solder pad 341.

[0061] See also Figure 3 As shown, each light emitting chip 32 includes an anode electrode 321 and a cathode electrode 322. The total number of anode electrodes 321 and cathode electrodes 322 of all light emitting chips 32 is twice the total number of light emitting chips 32. The total number of unipolar pads 341 and common polarity pads 342 is less than the total number of anode electrodes 321 and cathode electrodes 322 of all light emitting chips 32. Therefore, when the packaged light emitting device 30 is electrically connected to an external circuit, the number of connection points formed between the packaged light emitting device 30 and the external circuit will be relatively reduced, thereby relatively reducing the connection area between the packaged light emitting device 30 and the external circuit.

[0062] For example, one packaged light emitting device 30 may include three light emitting chips 32. The total number of anode electrodes 321 and cathode electrodes 322 of the three light emitting chips 32 is six. In one packaged light emitting device 30, the number of external pads 34 is four.

[0063] Exemplarily, the anode electrode 321 of the light emitting chip 32 is electrically connected to the common electrode pad 342 , and the cathode electrode 322 is electrically connected to the corresponding unipolar pad 341 , so that the packaged light emitting device 30 is formed into a common anode structure.

[0064] Exemplarily, the cathode electrode 322 of the light emitting chip 32 is electrically connected to the common electrode pad 342 , and the anode electrode 321 is electrically connected to the corresponding unipolar pad 341 , so that the packaged light emitting device 30 is formed into a common cathode structure.

[0065] In some achievable embodiments, the packaged light emitting device 30 includes a circuit layer. The light emitting chip 32 is electrically connected to the corresponding unipolar pad 341 and the common electrode pad 342 through the circuit layer. In some examples, the circuit layer may include a wiring. The anode electrode 321 and the cathode electrode 322 of the light emitting chip 32 may be electrically connected to the corresponding unipolar pad 341 or the common electrode pad 342 through the corresponding wiring.

[0066] The transparent display panel 10 of the embodiment of the present application includes a substrate 20 and a pixel P disposed on the substrate 20. Each pixel P includes a light-emitting region CG and a light-transmitting region TG. The light-emitting region CG includes a packaged light-emitting device 30. The packaged light-emitting device 30 includes a plurality of light-emitting chips 32 and an external pad 34 for electrically connecting to an external circuit. The light-emitting chip 32 is electrically connected to the external pad 34. The light-emitting chip 32 includes an anode electrode 321 and a cathode electrode 322. The external pad 34 includes a unipolar pad 341 and a common electrode pad 342. The total number of the external pads 34 is less than the total number of the anode electrodes 321 and the cathode electrodes 322 of all the light-emitting chips 32. One of the anode electrode 321 and the cathode electrode 322 of the light-emitting chip 32 is electrically connected to the common electrode pad 342, and the other is electrically connected to the corresponding unipolar pad 341. The packaged light-emitting device 30 can be soldered to an external circuit through the external pad 34. Compared with the way that the anode electrode 321 and the cathode electrode 322 of each light-emitting chip 32 are independently connected to the external circuit, when the packaged light-emitting device 30 is electrically connected to the external circuit, the number of connection points formed between the packaged light-emitting device 30 and the external circuit will be relatively reduced, and the wiring area between the packaged light-emitting device 30 and the external circuit can also be reduced, so that the connection area between the packaged light-emitting device 30 and the external circuit can be relatively small, which is conducive to reducing the area of ​​the light-emitting area CG and relatively increasing the area of ​​the light-transmitting area TG, so as to improve the transmittance of the ambient light of the transparent display panel 10. Therefore, the transparency of the transparent display panel 10 of the embodiment of the present application is relatively higher, and the scene behind the transparent display panel 10 can be relatively more clearly observed, which improves the user experience.

[0067] In some achievable embodiments, the number of monopolar pads 341 may be greater than or equal to the number of light emitting chips 32. In some examples, the number of monopolar pads 341 is equal to the number of light emitting chips 32, that is, the number of monopolar pads 341 may be the same as the number of light emitting chips 32.

[0068] In some achievable embodiments, the packaged light emitting device 30 may further include a substrate 31 . The substrate 31 may be a transparent substrate. A plurality of light emitting chips 32 may be disposed on the substrate 31 . An external solder pad 34 may be disposed on the substrate 31 .

[0069] In some achievable ways, the packaged light-emitting device 30 may further include a transparent package 33. The transparent package 33 and the light-emitting chip 32 are both disposed on the substrate 31. The transparent package 33 covers the light-emitting chip 32. The transparent package 33 may be combined with the substrate 31. The transparent package 33 and the substrate 31 may protect the light-emitting chip 32, extend the path for water vapor to enter the light-emitting chip 32, and help reduce the possibility of damage to the light-emitting chip 32, thereby extending the service life of the light-emitting chip 32.

[0070] In some possible implementations, see Figure 3 As shown, the packaged light emitting device 30 may include three light emitting chips 32. The external pads 34 may include three unipolar pads 341 and one common pad 342. One of the anode electrodes 321 and the cathode electrodes 322 of the three light emitting chips 32 is electrically connected to the common pad 342, and the other is electrically connected to the corresponding unipolar pad 341. Each light emitting chip 32 may serve as a sub-pixel.

[0071] In some examples, the light emitting chip 32 in the packaged light emitting device 30 can be used to emit white light, so that the transparent display panel 10 can be used to achieve black and white display.

[0072] In some examples, the three light emitting chips 32 in the packaged light emitting device 30 may be a red light emitting chip, a green light emitting chip, and a blue light emitting chip, respectively, so that the transparent display panel 10 may be used to achieve color display.

[0073] In some examples, the light-emitting chip 32 in the packaged light-emitting device 30 can be a Micro-LED chip. The Micro-LED chip itself has the characteristics of high brightness and long life. The luminous efficiency of the Micro-LED chip can increase with the increase of brightness. The light-emitting chip 32 adopts the Micro-LED chip. On the one hand, it is beneficial to extend the service life of the transparent display panel 10, and the transparent display panel 10 can achieve a higher display brightness to improve the contrast of the transparent display panel 10; on the other hand, since the Micro-LED chip has high brightness and long life, the size of the Micro-LED chip can be relatively reduced if the life of the Micro-LED chip allows, which is conducive to reducing the size of the packaged light-emitting device 30, so that the size of the light-emitting area CG can be further relatively reduced, and the size of the light-transmitting area TG can be increased.

[0074] In some examples, the packaged light-emitting device 30 of the embodiment of the present application can be processed and manufactured using MIP (micro LED in package) packaging technology.

[0075] In some examples, three light emitting chips 32 are arranged side by side on the substrate 31. The three light emitting chips 32 are arranged at intervals along a direction. The arrangement of the light emitting chips 32 is relatively simple, which is conducive to reducing the difficulty of processing and reducing the processing cost.

[0076] In some achievable ways, the substrate 31 may be rectangular. The four vertex corners of the substrate 31 are respectively provided with a single-pole pad 341 and a common-pole pad 342. There is a gap between the light-emitting chip 32 and the edge of the substrate 31. The single-pole pad 341 and the common-pole pad 342 are insulated. In some examples, the substrate 31 may be square.

[0077] In some achievable embodiments, the light-emitting region CG may further include a control circuit. The packaged light-emitting device 30 is electrically connected to the control circuit. The control circuit is used to control the packaged light-emitting device 30 to emit light. Since the light-emitting region CG is provided with the packaged light-emitting device 30 and the control circuit, the light-emitting region CG has a certain shielding effect on the ambient light, so that the ambient light is not easy to pass through the light-emitting region CG.

[0078] See also Figure 4 As shown, the control circuit includes a transistor 40 (Thin Film Transitor, TFT). The unipolar pad 341 of the packaged light-emitting device 30 is electrically connected to the corresponding transistor 40. In some examples, the transistor 40 may be an oxide thin film transistor. Exemplarily, the oxide thin film transistor may be, but is not limited to, an indium gallium zinc thin film transistor or a gallium indium thin film transistor. In some examples, the transistor 40 may be a low temperature polysilicon thin film transistor (Low Temperature Poly-silicon Thin Film Transistor, LTPS TFT).

[0079] In the embodiment of the present application, the oxide thin film transistor or the low-temperature polysilicon thin film transistor has high mobility and high current, so that the light-emitting chip 32 can achieve a higher brightness, which is beneficial for the transparent display panel 10 to achieve a relatively high contrast.

[0080] Along the thickness direction X of the transparent display panel 10, the transistor 40 is located on the backlight side of the packaged light-emitting device 30. The side of the light-emitting chip 32 from which light is emitted is the light-emitting side of the packaged light-emitting device 30, and the side of the light-emitting chip 32 from which light is not emitted is the backlight side of the packaged light-emitting device 30. Since the transistor 40 is located on the backlight side of the packaged light-emitting device 30, the transistor 40 itself and the wiring between the packaged light-emitting device 30 and the transistor 40 will not occupy the light-transmitting area TG, thereby reducing the possibility that the light-transmitting area TG is relatively reduced due to the transistor 40 itself and the wiring between the packaged light-emitting device 30 and the transistor 40 occupying the light-transmitting area TG.

[0081] For some examples, see Figure 4As shown, the transistor 40 includes a source 41, a drain 42, an active layer 43, a gate 44 and a gate insulator 45 (GI). The source 41 and the drain 42 are electrically connected to the active layer 43, respectively. The gate insulating layer 45 is arranged between the gate 44 and the active layer 43. Exemplarily, the material of the gate insulating layer 45 can be one or more of silicon nitride (SiNx), silicon oxide (SiOx) and silicon oxynitride (SiOxNy). Exemplarily, the transistor 40 also includes an interlayer insulating layer 46. The interlayer insulating layer 46 is arranged between the active layer 43 and the source 41 and between the active layer 43 and the drain 42. Exemplarily, the material of the interlayer insulating layer 46 can be one or more of silicon nitride (SiNx), silicon oxide (SiOx) and silicon oxynitride (SiOxNy).

[0082] In some examples, the transparent display panel 10 includes scan signal lines, data signal lines, voltage signal lines, etc. The unipolar pad 341 in the external pad 34 can be used to achieve electrical connection with the scan signal lines, data signal lines, and voltage signal lines.

[0083] For some examples, see Figure 4 As shown, the transparent display panel 10 further includes a common electrode line 50. The common electrode pad 342 is electrically connected to the common electrode line 50. The transistor 40 and the common electrode line 50 are used to supply power to the light emitting chip 32 so that the light emitting chip 32 can emit light. The common electrode line 50 is used to provide a common voltage.

[0084] Exemplarily, along the thickness direction X of the transparent display panel 10, the common electrode line 50 is located on the backlight side of the encapsulated light-emitting device 30, so that the common electrode line 50 does not occupy the light-transmitting area TG, thereby reducing the possibility of the light-transmitting area TG being relatively reduced due to the common electrode line 50 occupying the light-transmitting area TG.

[0085] For some examples, see Figure 4 As shown, the light emitting region CG further includes a pixel electrode 60. Each unipolar pad 341 is electrically connected to the transistor 40 through the pixel electrode 60. The unipolar pad 341 can be connected to one of the source 41 and the drain 42 in the transistor 40 through the corresponding pixel electrode 60.

[0086] Exemplarily, along the thickness direction X of the transparent display panel 10, the pixel electrode 60 is located on the backlight side of the encapsulated light-emitting device 30, so that the pixel electrode 60 does not occupy the light-transmitting area TG, thereby reducing the possibility of the light-transmitting area TG being relatively reduced due to the pixel electrode 60 occupying the light-transmitting area TG.

[0087] The present application also provides a display device, including the transparent display panel 10 of the above embodiment. The display device may include a spliced ​​display screen, an electronic reader, a mobile phone, a computer, a tablet computer, a television, or a car display, etc., which have a display function.

[0088] The various embodiments or implementation methods in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referenced to each other.

[0089] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0090] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A transparent display panel, characterized in that: include: A substrate and a plurality of pixels, wherein the pixels are arranged on the substrate, and the pixels include a light-emitting area and a light-transmitting area; The light emitting area includes a packaged light emitting device, and the packaged light emitting device includes: A plurality of light-emitting chips, each of which comprises an anode electrode and a cathode electrode; The external pads include a unipolar pad and a common-pole pad, wherein the total number of the unipolar pads and the common-pole pads is less than the total number of the anode electrodes and the cathode electrodes, and one of the anode electrode and the cathode electrode of the light-emitting chip is electrically connected to the common-pole pad, and the other is electrically connected to the corresponding unipolar pad.

2. The transparent display panel according to claim 1, characterized in that: The number of the monopolar pads is greater than or equal to the number of the light-emitting chips; Preferably, the cathode electrode of the light-emitting chip is electrically connected to the common electrode pad, and the anode electrode is electrically connected to the corresponding unipolar pad.

3. The transparent display panel according to claim 1, characterized in that: The light-emitting area further comprises a control circuit, the control circuit is electrically connected to the packaged light-emitting device, and the control circuit is used to control the packaged light-emitting device to emit light; Preferably, the control circuit comprises transistors, and along the thickness direction of the transparent display panel, the transistors are located on the backlight side of the packaged light-emitting device, and the unipolar pads are electrically connected to the corresponding transistors.

4. The transparent display panel according to claim 3, characterized in that: The transistor is an oxide thin film transistor or a low temperature polysilicon thin film transistor.

5. The transparent display panel according to claim 3, characterized in that: The light emitting area further comprises a common electrode line, the common electrode pad is electrically connected to the common electrode line, and along the thickness direction of the transparent display panel, the common electrode line is located at the backlight side of the packaged light emitting device; Alternatively, the light-emitting area further includes a pixel electrode, each of the unipolar pads is electrically connected to the transistor via the pixel electrode, and along the thickness direction of the transparent display panel, the pixel electrode is located on the backlight side of the packaged light-emitting device.

6. The transparent display panel according to any one of claims 1 to 5, characterized in that: The packaged light emitting device comprises three light emitting chips, and the external pads comprise three unipolar pads and one common-pole pad; Preferably, the packaged light-emitting device further comprises a substrate, and the three light-emitting chips are arranged side by side on the substrate.

7. The transparent display panel according to claim 6, characterized in that: The three light-emitting chips are respectively a red light-emitting chip, a green light-emitting chip and a blue light-emitting chip; Preferably, the light-emitting chip is a Micro-LED chip.

8. The transparent display panel according to any one of claims 1 to 5, characterized in that: The packaged light emitting device further comprises a substrate and a transparent package body. The light emitting chip and the transparent package body are both arranged on the substrate, and the transparent package body covers the light emitting chip.

9. The transparent display panel according to any one of claims 1 to 5, characterized in that: The packaged light emitting device further comprises a substrate, and the external pad is arranged on the substrate; Preferably, the substrate is rectangular, and the unipolar pad and the common-pole pad are respectively arranged at the four vertex corners of the substrate.

10. A display device, characterized in that: Comprising the transparent display panel as claimed in any one of claims 1 to 9.

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