Heat dissipation structure of high-speed connector
By designing the upper and lower radiator and drawer stop structure on the shield cover of the high-speed connector, the problem of difficulty in effectively dissipating heat in traditional heat dissipation structures is solved, and efficient heat conduction and stable equipment performance are achieved.
Patent Information
- Application Number
- CN202311234386.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-24
- Publication Date
- 2025-03-25
AI Technical Summary
The traditional high-speed connector heat dissipation structure is difficult to effectively dissipate heat during use, resulting in heat accumulation and affecting the stability and performance of the equipment.
A high-speed connector heat dissipation structure is designed, including a shield cover and a heat dissipation structure arranged in the shield cover. The heat dissipation structure includes two upper and lower radiators, which are fixed to the shield cover by elastic firmware, and an isolation cover and a stop plate are provided inside the shield cover to form a drawer-type moving stop structure to improve heat dissipation efficiency.
By setting a radiator on the top and inside of the shield cover and using the elastic sheet and stop plate structure, efficient heat dissipation of the optical module is achieved, the heat dissipation function at the lower net port is improved, and the stability and performance of the equipment are enhanced.
Smart Images
Figure CN119695564A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of electronic devices, and in particular to providing a high-speed connector and a high-speed connector heat dissipation structure. Background Art
[0002] The Gigabit Interface Connector (GBIC) is a hot-swappable input / output device that plugs into a Gigabit Ethernet port / slot and is responsible for connecting the port to the fiber-optic network. GBICs can be used and interchanged on a variety of Cisco products and can be mixed with 1000BaseSX, 1000BaseLX / LH, or 1000BaseZX interfaces that comply with IEEE 802.3z on a port-by-port basis. Furthermore, Cisco is offering a 1000BaseLX / LH interface that fully complies with the IEEE 802.3z 1000BaseLX standard, but with a transmission distance of up to 10 kilometers on single-mode fiber, which is 5 kilometers farther than the ordinary 1000BaseLX interface. In short, as new features are continuously developed, it will be easier to upgrade these modules to the latest interface technology, allowing customers to maximize their investment.
[0003] These traditional plug-in designs have been successful in the past, but they tend to fall short of the industry's ongoing miniaturization goals. It is desirable to miniaturize transceivers to increase port density associated with network connections such as distribution boxes, cable patch panels, wiring closets, and computer input / output (I / O). Traditional plug-in module configurations are unable to meet these parameter requirements. It is also desirable to increase port density and optimize the connection interface of SFP modules.
[0004] The new standard has been announced and is referred to as the hot-pluggable (SFP) standard. SFP is the abbreviation of SMALL FORM PLUGGABLE, which can be simply understood as an upgraded version of GBIC. The SFP module is half the size of the GBIC module, and more than twice the number of ports can be configured on the same panel. The other functions of the SFP module are basically the same as those of GBIC. Some switch manufacturers call the SFP module a miniaturized GBIC (MINI-GBIC). The SFP module is half the size of the GBIC module, and more than twice the number of ports can be configured on the same panel. The other functions of the SFP module are basically the same as those of GBIC. However, the heat dissipation structure of the high-speed connector generates heat during use.
[0005] Therefore, it is necessary to improve the existing high-speed connector heat dissipation structure to solve the above problems. Summary of the invention
[0006] In order to solve the above technical problems, the main purpose of the present invention is to provide a high-speed connector heat dissipation structure.
[0007] In order to achieve the above object, the technical solution applied by the present invention is:
[0008] The invention discloses a high-speed connector heat dissipation structure, comprising a shielding cover and a heat dissipation structure arranged on the shielding cover, the heat dissipation structure comprising a radiator, wherein: the shielding cover forms a cavity, the cavity has an opening for inserting an optical module, and the cavity is provided with a cover window; the radiator is fixed to the shielding cover by an elastic fastener, and comprises a substrate, a protrusion and a heat sink, the heat sink covers one side of the substrate, the protrusion is opposite to the heat sink on the other side of the substrate, and the cover window is adapted in the cavity for the inserted optical module to abut against.
[0009] In this embodiment, preferably: the isolation cover includes a front plate, an upper partition is vertically connected to the upper edge of the front plate, and a lower partition is connected to the lower edge of the front plate parallel to the upper partition, wherein: the upper partition is stamped to form an elastic sheet, and the free end of the elastic sheet is inclined forward and downward; the lower partition has a convex portion, the convex portion is centered behind the lower window and parallel to the plane of the lower partition and forms a limiting spacing, and the rear edge of the lower partition is indented forward to form a groove, and convex pieces are stamped on both sides of the groove.
[0010] In this embodiment, preferably, the isolation cover is provided with a stop plate, which is formed by stamping and includes a slide rail adapted to the limiting spacing, a guide groove adapted to the protruding piece, and a baffle extending downward in the groove to limit the depth of the optical module.
[0011] In this embodiment, preferably: the cover body includes two sides, and buckles are respectively provided on both sides of the cover body; the elastic fixing device includes a clamping member, and the clamping member includes two opposite elastic plates and two opposite clamping plates; the heat sink includes an upper heat sink, and the substrate of the upper heat sink is on the cover body so that the protrusion of the upper heat sink contacts the upper surface of an optical module in the upper cavity through the top window, and the two opposite clamping plates are respectively provided with card grooves for the buckles to adapt, and the two opposite elastic plates are pressed on the upper heat sink substrate to elastically position the upper heat sink on the cover body.
[0012] In this embodiment, preferably: the elastic fastener includes an elastic sheet of an upper partition, the heat sink includes a lower heat sink, the lower heat sink is placed between the upper partition and the lower partition, and the substrate of the lower heat sink is on the lower partition so that its protrusion passes through the lower window in the lower cavity for contact with the top of another optical module, and the elastic sheet of the upper partition is elastically pressed on the heat sink of the lower heat sink to position the lower heat sink in the isolation cover.
[0013] In this embodiment, preferably: the high-speed connector includes a terminal module and an optical component; the bottom cover is shorter than the cover body but equal to the isolation cover length, the bottom cover plate is arranged in the front half below the cover body, the isolation cover is arranged in the front half of the cavity relative to the bottom cover plate, and the rear cover plate is combined with the rear side of the cover body so that the rear half of the cover body forms an open space for the terminal module to be arranged.
[0014] In the present embodiment, preferably: the optical component includes a light guide and a positioning seat, the light guide includes a light guiding section and a light receiving section perpendicular to the light guiding section, the positioning seat is outside the shielding cover and is flush with the lower edge of the rear cover plate and is arranged against the rear cover plate; the light receiving section extends forward with a positioning foot adapted to the rear cover plate, and the free end of the light receiving section has a light receiving surface, the free end of the light receiving section is inserted into the positioning seat, and the light receiving surface is exposed to the bottom surface of the positioning seat; the light guiding section is in the gap between adjacent upper heat sinks, and the light end face of the light guiding section is flush with the front edge of the shielding cover.
[0015] In this embodiment, preferably: the opening edge of the open space of the shielding cover is arranged with grounding springs, and the grounding springs include radial contacts extending from the bottom cover plate and lateral contacts formed by the lower side of the auxiliary plate adhered to the outer side of the cover body and the rear cover plate.
[0016] Compared with the prior art, the present invention has the following beneficial effects:
[0017] First, an upper radiator is arranged on the top of the shielding cover to dissipate heat from the network port, and a lower radiator is arranged inside the shielding cover to dissipate heat from the lower network port, and an elastic sheet is arranged on the top of the lower radiator. When the optical module is inserted into the shielding cover through the cavity, the elastic sheet holds the top surface of the lower radiator, so that the bottom surface of the lower radiator is in close contact with the top surface of the lower optical module, so that heat is transferred from the optical module to the radiator, thereby improving the heat dissipation function at the lower network port;
[0018] Secondly, a stop plate is provided on the isolation cover inside the shielding cover, and the stop plate cooperates with the lower partition of the isolation cover to form a movable stop structure similar to a drawer, which takes into account the SMT upper board function of the connector and enables the lower network port to have a sub-stop function for inserting the optical module. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The preferred implementation modes will be described below in a clear and understandable manner with reference to the accompanying drawings to further illustrate the above-mentioned characteristics, technical features, advantages and implementation methods of the present invention.
[0020] Figure 1 It is a schematic diagram of the structure of this embodiment.
[0021] Figure 2 It is a schematic diagram of the structure of this embodiment from another perspective (adapted with an optical module).
[0022] Figure 3 It is a structural schematic diagram showing some internal components of this embodiment.
[0023] Figure 4 2 is an exploded schematic diagram of this embodiment.
[0024] Figure 5 Schematic diagram of the exploded view of the shielding cover of this embodiment.
[0025] Figure 6It is an exploded schematic diagram of the isolation cover and the lower radiator of this embodiment.
[0026] Figure 7 It is a structural schematic diagram of the radiator from another perspective of this embodiment.
[0027] Figure 8 It is an enlarged structural schematic diagram of the stop plate of this embodiment.
[0028] Fig. 9 yes Figure 1 Schematic diagram of the structure enlarged at point A in the middle.
[0029] Description of Figure Numbers:
[0030] Shielding cover 1, partition 11, bottom cover plate 12, cover body 13, top window 131, buckle 132, rear cover plate 14, grounding spring 15, optical component 2, light guide 21, light guide section 211, light receiving section 212, positioning seat 22, cross arm 23, terminal module 3, optical module 4, upper heat sink 5, upper substrate 51, upper heat sink 52, lower heat sink 6, lower substrate 61, lower protrusion 62, lower heat sink 63, isolation cover 7, upper partition 71, elastic sheet 711, lower partition 72, front plate 73, lower window 731, protrusion 732, groove 733, protrusion 734, stop plate 74, slide rail 741, baffle 742, guide groove 743, clamping member 8, elastic plate 81, clamping plate 82, slot 821, middle plate 83. DETAILED DESCRIPTION
[0031] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.
[0032] It should be understood that when used in this specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or collections.
[0033] In order to simplify the drawings, only the parts related to the present invention are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, in order to simplify the drawings and facilitate understanding, in some figures, only one of the parts with the same structure or function is schematically drawn or marked. In this article, "one" not only means "only one", but also means "more than one".
[0034] It should be further understood that the term “and / or” used in the specification and appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.
[0035] In the embodiments shown in the drawings, the indications of directions (such as up, down, left, right, front and back) used to explain the structure and movement of the various components of the present invention are not absolute but relative. These descriptions are appropriate when these components are in the positions shown in the drawings. If the descriptions of the positions of these components change, the indications of these directions also change accordingly.
[0036] In addition, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.
[0037] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the specific implementation methods of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings and other implementation methods can be obtained based on these drawings without creative work.
[0038] In one embodiment, the reference specification Figures 1 to 9 , a high-speed connector heat dissipation structure provided in the figure includes a shielding cover 1, an optical component 2, a terminal module 3, four optical modules 4, two upper radiators 5 and two lower radiators 6. The front end of the shielding cover 1 is provided with an opening, and a partition 11 is provided inside. The partition 11 divides the internal space of the shielding cover 1 into cavities arranged on the left and right (i.e., a left cavity and a right cavity), and the tops of the left cavity and the right cavity are respectively provided with top windows 131. The optical component 2 includes two groups (four) of light guides 21, which are bent structures and arranged side by side at the tail end and top of the outer side of the shielding cover 1. The terminal module 3 is arranged in the open space inside (the rear half) of the shielding cover 1. The four optical modules 4 are divided into two groups on the left and right, respectively inserted in the left cavity and the right cavity, and the two optical modules 4 in each group are arranged at intervals up and down. The two upper radiators 5 are arranged on the top of the shielding cover 1, and the two upper radiators 5 can contact the two optical modules 4 in the upper row through the top window 131. Two lower heat sinks 6 are disposed inside the shielding case 1 and are respectively located between the upper and lower rows of optical modules 4 . The lower heat sinks 6 are respectively in contact with the corresponding optical modules 4 through elastic sheet components.
[0039] In this embodiment (such as Figure 1 , Figure 3 and Figure 4), an upper radiator 5 is arranged on the top of the shielding cover 1 to dissipate heat for the upper network port, a lower radiator 6 is arranged inside the shielding cover 1 to dissipate heat for the lower network port, and an elastic sheet assembly is arranged on the top of the lower radiator 6. When the optical module 4 is inserted into the inside of the shielding cover 1 through the cavity, the elastic sheet assembly supports the top surface of the lower radiator 6, so that the bottom surface of the lower radiator 6 is in close contact with the top surface of the lower optical module 4, so that heat is conducted from the optical module 4 to the lower radiator 6, thereby improving the heat dissipation function at the lower network port.
[0040] Specifically, refer to the attached manual Figure 1 , Figure 2 , Figure 5 and Fig. 9 , the shielding cover 1 includes a bottom cover plate 12, a cover body 13 and a rear cover plate 14, and the bottom cover plate 12, the cover body 13 and the rear cover plate 14 are arranged to form the shielding cover 1. In the example, the open space opening for the terminal module 3 in the rear half of the shielding cover 1 (i.e., the matching surface position of the terminal module 3 and the PCB board) is densely covered with grounding springs (not marked), wherein: the grounding springs include radial contact pins (not marked) extending from the rear side edge of the bottom cover plate 12 and N lateral contact pins 91 formed on the lower side of the auxiliary board 9 adhered to the outer side of the cover body 13 and the rear cover plate 14, and these radial contact pins and lateral contact pins 91 are actually in contact with the PCB board around the terminal module 3. This improves the anti-EMI capability of the high-speed connector (which requires higher).
[0041] Reference Manual Attached Figure 1 , Figure 3 and Figure 4 The optical assembly 2 includes four light guides 21, two positioning seats 22 and two cross arms 23. The four light guides 21 are arranged side by side at the tail end and the top of the outer side of the shielding cover 1. The light guide 21 includes a light guide section 211 and a light receiving section 212 connected in sequence. The light guide section 211 is arranged horizontally, and the light receiving section 212 is arranged vertically. The two ends of each positioning seat 22 are respectively fixedly connected to the bottom of a light receiving section 212, and the two ends of each cross arm 23 are respectively fixedly connected to one end of a light guide section 211 away from the light receiving section 212. Two upper heat sinks 5 are respectively arranged on the cover body 13, and each upper heat sink 5 is respectively provided with two light guide sections 211, and the light receiving section 212 is close to the outer side of the rear cover plate 14.
[0042] Reference Manual Attached Figures 3 to 5 The upper heat sink 5 includes an upper substrate 51, an upper protrusion (not shown) disposed at the bottom of the upper substrate 51, and a plurality of upper heat sinks 52 disposed at intervals at the top of the upper substrate 51. The upper protrusion is disposed at the middle position of the bottom of the upper substrate 51. The end of the upper protrusion is arranged as an inclined structure, which can facilitate the insertion of the optical module 4. The plurality of upper heat sinks 52 extend along the length direction of the upper substrate 51. Four light guide segments 211 are buried between the plurality of upper heat sinks 52 at intervals.
[0043] The upper heat sink 5 is mounted on the top of the shielding cover 1 through a clamping member 8, and the clamping member 8 includes two elastic plates 81, two clamping plates 82, and an intermediate plate 83. The two clamping plates 82 are arranged in parallel, and the two elastic plates 81 are respectively connected to the two ends of the top of the two clamping plates 82, and the two ends of the intermediate plate 83 are respectively connected to the middle positions of the two elastic plates 81. A plurality of card slots 821 are respectively arranged on the two clamping plates 82, and a plurality of buckles 132 are respectively arranged on both sides of the cover body 13. The clamping member 8 presses the upper heat sink 5 onto the cover body 13, and the buckles 132 are adapted to be clamped with the card slots 821, so that the upper heat sink 5 is installed on the cover body 13.
[0044] Reference Manual Attached Figure 6 , Figure 7 The lower heat sink 6 includes a lower substrate 61, a lower protrusion 62 arranged at the bottom of the lower substrate 61, and a plurality of lower heat sinks 63 spaced apart at the top of the lower substrate 61. The lower protrusion 62 is arranged at the middle position of the bottom of the lower substrate 61. The end of the lower protrusion 62 is arranged as a slope structure to facilitate the insertion of the optical module 4. The plurality of lower heat sinks 63 extend along the length direction of the lower substrate 61.
[0045] Reference Manual Attached Figures 6 to 8 , the shielding cover 1 is also provided with two isolation covers 7 arranged side by side, the two isolation covers 7 are arranged in the middle position of the shielding cover 1, and the two isolation covers 7 are arranged crosswise with the partition 11 to divide the opening of the shielding cover 11 into four cavities, each of which is used for inserting an optical module 4. The isolation cover 7 includes an upper partition 71, a lower partition 72 and a front plate 73, the two ends of the front plate 73 are fixedly connected to the upper partition 71 and the lower partition 72 respectively, and the upper partition 71 is arranged parallel to the lower partition 72, and the lower heat sink 6 is arranged between the upper partition 71 and the lower partition 72. The elastic sheet assembly includes a plurality of elastic sheets 711, and the plurality of elastic sheets 711 are arranged at intervals on the upper partition 71. When the optical module 4 is inserted into the shielding cover 1 through the cavity, the elastic sheet 711 supports the top surface of the lower heat sink 6, so that the bottom surface of the lower heat sink 6 is in close contact with the top surface of the optical module 4 of the lower layer.
[0046] The lower partition 72 is provided with a lower window 731, a convex portion 732, a groove portion 733 and two protrusions 734. The lower window 731 is arranged at the middle position of the lower partition 72, the groove portion 733 is arranged at one end of the lower partition 72 away from the front plate 73, the convex portion 732 is arranged between the lower window 731 and the groove portion 733, and the two protrusions 734 are respectively arranged on both sides of the convex portion 732.
[0047] Each isolation cover 7 is also provided with a stop plate 74, on which a slide rail 741, a baffle 742 and two guide grooves 743 are provided. The slide rail 741 is provided at the middle position of one end of the stop plate 74, and the baffle 742 is provided at the other end of the stop plate 74, and the baffle 742 extends downward, and the two guide grooves 743 are respectively provided on both sides of the slide rail 741. The stop plate 74 is installed on the lower partition plate 72, so that the slide rail 741 is adapted to be inserted into the convex portion 732. The two convex pieces 734 are adapted to be arranged in the corresponding guide grooves 743, and can reciprocate along the length direction of the guide grooves 743, and the baffle 742 is located at the groove portion 733. When the optical module 4 of the lower row is inserted into the inner preset distance of the shielding cover 1 through the cavity, the end of the optical module 4 of the lower row pushes the baffle 742, thereby driving the stop plate 74 to move in the direction away from the front plate 73. By setting a stop plate 74 on the isolation cover 7 inside the shielding cover 1, the stop plate 74 cooperates with the lower partition plate 72 of the isolation cover 7 to form a movable stop structure similar to a drawer, taking into account the connector SMT upper board function and making the lower network port have a sub-stop insertion optical module function.
[0048] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.
[0049] It should be noted that the above embodiments can be freely combined as needed. The above are only preferred embodiments of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention.
Claims
1. A high-speed connector heat dissipation structure, comprising a shielding cover and a heat dissipation structure disposed on the shielding cover, the heat dissipation structure comprising a radiator, characterized in that: The shielding cover forms a cavity, the cavity has an opening for the optical module to be placed, and the cavity is provided with a cover window; the heat sink is fixed to the shielding cover by an elastic fastener, and includes a substrate, a protrusion and a heat sink, the heat sink is spread over one side of the substrate, the protrusion is opposite to the heat sink on the other side of the substrate, and the cover window is adapted in the cavity for the placed optical module to be supported.
2. The high-speed connector heat dissipation structure according to claim 1, characterized in that: The shielding cover includes a cover body, a bottom cover plate, a rear cover plate and an isolation cover arranged on the cover body. The isolation cover is located between the cover body and the bottom cover plate and divides the cavity into an upper cavity and a lower cavity with equivalent opening sizes. The isolation cover has an upper partition and a lower partition. The cover window includes a top window and a lower window. The top window is located in the cover body and communicates with the upper cavity; the lower window is located in the lower partition and communicates with the lower cavity.
3. The high-speed connector heat dissipation structure according to claim 2, characterized in that: The isolation cover includes a front plate, an upper partition plate is vertically connected to the upper edge of the front plate, and a lower partition plate is connected to the lower edge of the front plate in parallel with the upper partition plate, wherein: the upper partition plate is stamped to form an elastic sheet, and the free end of the elastic sheet is inclined toward the front and downward; the lower partition plate has a convex portion, which is centered behind the lower window and parallel to the plane of the lower partition plate and forms a limiting spacing, and a groove portion is indented forward at the rear edge of the lower partition plate, and convex pieces are stamped on both sides of the groove portion.
4. The high-speed connector heat dissipation structure according to claim 3, characterized in that: The isolation cover is equipped with a stop plate, which is formed by stamping and includes a slide rail adapted to the limiting spacing, a guide groove adapted to the convex piece, and a baffle extending downward in the groove to limit the depth of the optical module.
5. The high-speed connector heat dissipation structure according to claim 4, characterized in that: The cover body includes two sides, and buckles are respectively provided on both sides of the cover body; the elastic fixing includes a clamping piece, and the clamping piece includes two opposite elastic plates and two opposite clamping plates; the heat sink includes an upper heat sink, and the substrate of the upper heat sink is on the cover body so that the protrusion of the upper heat sink contacts the upper surface of an optical module in the upper cavity through the top window, and the two opposite clamping plates are respectively provided with card grooves for the buckles to adapt, and the two opposite elastic plates are pressed on the upper heat sink substrate to elastically position the upper heat sink on the cover body.
6. The high-speed connector heat dissipation structure according to claim 5, characterized in that: The elastic fastener includes an elastic sheet of an upper partition, and the heat sink includes a lower heat sink. The lower heat sink is placed between the upper partition and the lower partition, and the substrate of the lower heat sink is on the lower partition so that the protrusion of the lower heat sink is in contact with the top of another optical module through the lower window in the lower cavity. The elastic sheet of the upper partition is elastically pressed on the heat sink of the lower heat sink to position the lower heat sink in the isolation cover.
7. The high-speed connector heat dissipation structure according to claim 6, characterized in that: The high-speed connector includes a terminal module and an optical component; the bottom cover is shorter than the cover body but equal to the length of the isolation cover, the bottom cover plate is arranged at the front half below the cover body, the isolation cover is arranged at the front half of the cavity relative to the bottom cover plate, and the rear cover plate is combined with the rear side of the cover body so that the rear half of the cover body forms an open space for the terminal module to be arranged.
8. The high-speed connector heat dissipation structure according to claim 7, characterized in that: The optical component includes a light guide and a positioning seat. The light guide includes a light guiding section and a light receiving section perpendicular to the light guiding section. The positioning seat is outside the shielding cover and is flush with the lower edge of the rear cover plate and is arranged against the rear cover plate. The light receiving section extends forward with a positioning foot adapted to the rear cover plate, and the free end of the light receiving section has a light receiving surface. The free end of the light receiving section is inserted into the positioning seat, and the light receiving surface is exposed to the bottom surface of the positioning seat. The light guiding section is in the gap between adjacent upper heat sinks, and the light end face of the light guiding section is flush with the front edge of the shielding cover.
9. The high-speed connector heat dissipation structure according to claim 8, characterized in that: The opening edge of the open space of the shielding cover is arranged with grounding springs, which include radial contact pins extending from the bottom cover plate and lateral contact pins formed by the lower side of the auxiliary plate adhered to the outer side of the cover body and the rear cover plate.