A power device protection circuit and device protection board

By integrating a digital temperature sensor, voltage regulator, digital potentiometer, operational amplifier, and microcontroller, the constant current, constant voltage, and temperature compensation issues of the GaN power supply bias protection circuit are solved, achieving circuit stability and reliability, making it suitable for high-performance applications of GaN devices.

CN119695795BActive Publication Date: 2025-09-23STATE GRID HEILONGJIANG ELECTRIC POWER CO LTD QITAIHE POWER SUPPLY CO +1
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Patent Information

Application Number
CN202411649682.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-11-19
Publication Date
2025-09-23
Estimated Expiration
2044-11-19

AI Technical Summary

Technical Problem

Existing GaN power supply bias protection circuits cannot achieve constant current and constant voltage, resulting in poor stability. The temperature compensation circuit design is complex, which increases costs and maintenance difficulties, limiting the widespread application of GaN devices in high-performance application scenarios.

Method used

An integrated digital temperature sensor, voltage regulator, digital potentiometer, operational amplifier, and microcontroller are used to achieve accurate temperature compensation, stable voltage and current output, flexible resistance control, and reliable switch timing control.

Benefits of technology

It significantly improves the performance, stability and reliability of the circuit, simplifies the design and debugging process, and is suitable for GaN device protection in various scenarios.

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Abstract

The present application provides a power device protection circuit and device protection board. The power device protection circuit includes: a basic protection circuit, including resistors R1, R2, R3, R4, R5, R6, R7, R8, R9, capacitors C1, C2, field-effect transistors Q1, a first transistor Q2, and a second transistor Q3; a digital temperature sensor U1, the voltage regulator U2, a digital potentiometer U3, an operational amplifier U4, and a microcontroller U5. The power device protection circuit provided in this application can achieve high-precision timing control and temperature compensation, improving the protection of gallium nitride power devices.
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Description

Technical Field

[0001] The present application relates to the field of circuit protection, and in particular to a power device protection circuit and a device protection board. Background Art

[0002] With the continuous advancement of semiconductor technology, gallium nitride (GaN) has become a key material for the development of microelectronic and optoelectronic devices due to its excellent electrical properties. In particular, GaN-based microwave power amplifiers have stringent requirements for power supply timing, stability, and temperature adaptability. However, existing GaN power supply bias protection circuits often have shortcomings. For example, they cannot achieve constant current and voltage, resulting in poor stability. In addition, the temperature compensation circuit design is complex, increasing costs and maintenance difficulties. These issues limit the widespread use of GaN devices in certain high-performance applications.

[0003] Therefore, the present application provides a power device protection circuit and a device protection board to solve one of the above technical problems. Summary of the Invention

[0004] The purpose of this application is to provide a power device protection circuit and device protection board that can solve at least one of the above-mentioned technical problems. The specific solution is as follows:

[0005] According to a specific embodiment of the present application, in a first aspect, the present application provides a power device protection circuit, comprising:

[0006] The basic protection circuit includes a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a resistor R8, a resistor R9, a capacitor C1, a capacitor C2, a field effect transistor Q1, a first transistor Q2, and a second transistor Q3; a digital temperature sensor U1, wherein the power pin VCC of the digital temperature sensor U1 is connected to the power supply terminal V+, the ground pin GND1 of the digital temperature sensor U1 is grounded, the data pin SCL of the digital temperature sensor U1 is connected to the I2C interface A4 of the microcontroller U5, and the data pin SDA of the digital temperature sensor U1 is connected to the I2C interface A5 of the microcontroller U5; the voltage regulator U2, the voltage regulator U 2 is connected to the second voltage output terminal VGG through a fuse, the output pin OUT of the voltage regulator U2 is connected to the power supply terminal V+, the adjustment pin ADJ of the voltage regulator U2 is connected to the ground GND through the resistor R1, the resistor R2, and the capacitor C1 of the voltage divider network, and through the resistor R9, and the other end of the resistor R2 is connected to the negative voltage terminal V-; the digital potentiometer U3, the power pin VCC of the digital potentiometer U3 is connected to the power supply terminal V+, the ground pin GND2 of the digital potentiometer U3 is grounded, and the data pins CLK, DATA, and LOAD of the digital potentiometer U3 are respectively connected to the SPI interfaces D10, D11, and D13 of the microcontroller U5. The sliding end W0 of the digital potentiometer U3 is connected to the non-inverting input pin In+ of the operational amplifier U4; the operational amplifier U4, the positive power supply pin Vcc of the operational amplifier U4 is connected to the power supply terminal V+, the negative power supply pin GND3 of the operational amplifier U4 is grounded, and the output pin Out of the operational amplifier U4 is connected to one end of the fourth resistor R4 and the sixth resistor R6; wherein, the gate of the field effect transistor Q1 is connected to the GPIO pin D8 of the microcontroller U5, the first transistor Q2 and the second transistor Q3 are connected through the base, and the PWM output pin D9 of the microcontroller U5 is connected to the base of the first transistor Q2 and the base of the second transistor Q3 through the resistor R10. 3; the emitter E of the first transistor Q2 is connected to the drain of the field effect transistor Q1 through the resistor R4, and the collector C of the first transistor Q2 is grounded through the resistor R5; the emitter E of the second transistor Q3 is connected to the drain of the field effect transistor Q1 through the resistor R6, and is connected to the first voltage output terminal VDD, the collector C of the second transistor Q3 is connected to one end of the first capacitor C1, and is connected to the second voltage output terminal VGG and one end of the resistor R8; the source of the field effect transistor Q1 is connected to the power supply terminal V+, and is connected to one end of the resistor R3 and the capacitor C2, and the gate of the field effect transistor Q1 is also connected to the other end of the resistor R3 and the capacitor C2, respectively.

[0007] In one embodiment, the basic protection circuit includes a switching timing circuit; the switching timing circuit is composed of the field effect tube Q1, the resistor R1, the resistor R2, the resistor R3, the resistor R9 and the capacitor C1; wherein, the gate of the field effect tube is connected to one end of the resistor R1; the source of the field effect tube is connected to the power supply end; the drain of the field effect tube is connected to the constant voltage and constant current circuit; one end of the resistor R1 is connected to one end of the resistor R3; the other end of the resistor R1 is connected to one end of the resistor R2; the other end of the resistor R2 is connected to the negative voltage end; the other end of the resistor R3 is connected to the power supply end; one end of the capacitor C1 is connected to one end of the resistor R2; the other end of the capacitor C1 is connected to the ground; wherein, the connection node between the resistor R2 and the resistor R1 is a preset node, and when the voltage of the preset node meets the preset condition, the field effect tube is turned on.

[0008] In one embodiment, the basic protection circuit includes a constant voltage and constant current circuit; the constant voltage and constant current circuit is composed of the first transistor Q2, the second transistor Q3, the resistor R4, the resistor R5 and the resistor R6; wherein the base of the first transistor Q2 is connected to the base of the second transistor Q3 and the collector of the first transistor Q2 respectively; the emitter of the first transistor Q2 is connected to one end of the resistor R4, and the other end of the resistor R4 is connected to the drain of the field effect transistor Q1; the first The collector of the transistor Q2 is connected to one end of the resistor R5, and the other end of the resistor R5 is grounded; the emitter of the second transistor Q3 is connected to one end of the resistor R6, and the other end of the resistor R6 is connected to the drain of the field effect transistor Q1, and the emitter of the second transistor Q3 is connected to the first voltage output terminal VDD; the collector of the second transistor Q3 is connected to one end of the first capacitor C1 via the resistor R7, and the collector of the second transistor Q3 is connected to the second voltage output terminal VGG via the resistor R7.

[0009] In one embodiment, the basic protection circuit includes a temperature compensation circuit; the temperature compensation circuit includes the first transistor Q2 and the second transistor Q3; wherein the base of the first transistor Q2 is respectively connected to the base of the second transistor Q3 and the collector of the first transistor Q2; the emitter of the first transistor Q2 is connected to the drain of the field effect transistor Q1; the collector of the first transistor Q2 is grounded; the emitter of the second transistor Q3 is connected to the drain of the field effect transistor Q1, and the emitter of the second transistor Q3 is connected to the first voltage output terminal VDD; the collector of the second transistor Q3 is connected to one end of the first capacitor C1 via the resistor R7, and the collector of the second transistor Q3 is connected to the second voltage output terminal VGG via the resistor R7.

[0010] In one embodiment, one end of the resistor R7 is connected to the collector of the second transistor, the other end of the resistor R7 is connected to one end of the capacitor C1, and the other end of the resistor R7 is connected to the second voltage output terminal VGG; one end of the resistor R8 is connected to the other end of the resistor R7 and connected to the second voltage output terminal VGG; the resistor R9, one end of the resistor R9 is connected to the other end of the capacitor C1, and the other end of the resistor R9 is connected to the other end of the resistor R8, and the branch composed of the resistor R9 and the capacitor C1 is connected in parallel with the resistor R8.

[0011] According to a specific embodiment of the present application, in a second aspect, the present application provides a device protection board configured with the power device protection circuit described in any one of the first aspects.

[0012] Compared with the prior art, the above-mentioned scheme of the embodiment of the present application has at least the following beneficial effects: the power device protection circuit provided by the present application achieves precise temperature compensation, stable voltage and current output, flexible resistance control, and reliable switch timing control by integrating a digital temperature sensor, a voltage regulator, a digital potentiometer, an operational amplifier, and a microcontroller, significantly improving the performance, stability, and reliability of the circuit while simplifying the design and debugging process, and is suitable for gallium nitride device protection in various scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A power device protection circuit diagram in related art is shown.

[0014] Figure 2 The power device protection circuit diagram in this application is shown.

[0015] Figure 3a A top schematic diagram of a device protection board in the related art is shown.

[0016] Figure 3b The bottom layer schematic diagram of the device protection board in the related art is shown.

[0017] Figure 4a Shown is a top schematic diagram of the device protection board in this application.

[0018] Figure 4b The bottom schematic diagram of the device protection board in this application is shown. DETAILED DESCRIPTION

[0019] To make the objectives, technical solutions, and advantages of this application more clear, this application will be further described in detail below with reference to the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.

[0020] The terms used in the examples of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms "a," "the," and "the" used in the examples of this application and the appended claims are also intended to include plural forms, and unless the context clearly indicates otherwise, "a plurality" generally includes at least two.

[0021] It should be understood that the term "and / or" as used herein is merely a description of the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, or B exists alone. Furthermore, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0022] It should be understood that although the terms first, second, third, etc. may be used to describe in the embodiments of the present application, these descriptions should not be limited to these terms. These terms are only used to distinguish the descriptions. For example, without departing from the scope of the embodiments of the present application, the first may also be referred to as the second, and similarly, the second may also be referred to as the first.

[0023] As used herein, the words "if" and "if" may be interpreted as "at the time of" or "when" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined" or "if (stated condition or event) is detected" may be interpreted as "when it is determined" or "in response to the determination" or "when detecting (stated condition or event)" or "in response to detecting (stated condition or event)," depending on the context.

[0024] It should also be noted that the terms "include," "comprises," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a product or device comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such product or device. In the absence of further limitations, an element defined by the phrase "comprises a..." does not exclude the presence of other identical elements in the product or device comprising the element.

[0025] It should be noted in particular that any symbols and / or numbers in the specification that are not marked in the accompanying drawings are not drawing marks.

[0026] With the continuous advancement of semiconductor technology, gallium nitride (GaN) has become a key material for the development of microelectronic and optoelectronic devices due to its excellent electrical properties. In particular, GaN-based microwave power amplifiers have stringent requirements for power supply timing, stability, and temperature adaptability. However, existing GaN power supply bias protection circuits have several shortcomings, such as the inability to achieve constant current and voltage, resulting in poor stability. Furthermore, the complex design of temperature compensation circuits increases costs and maintenance difficulties. These issues have limited the widespread use of GaN devices in certain high-performance applications.

[0027] In the related art, a protection circuit for gallium nitride power devices is provided.

[0028] Figure 1 A power device protection circuit diagram in related art is shown.

[0029] In related technologies, such as Figure 1 As shown in the figure, the protection circuit includes a power input section, a power management section, a switch timing circuit, a temperature monitoring section, an I2C communication interface, a protection and status monitoring section, and a general-purpose input / output section. The power input section provides the main power and ground. The power management section uses a power converter to convert the main power into VDD and VGG outputs, which supply the operating voltage and gate drive voltage of the GaN power device, respectively. The switch timing circuit receives an external clock signal and generates control signals to control the switching timing of the GaN power device. The temperature monitoring section monitors the circuit temperature using a thermistor and provides temperature feedback. The I2C communication interface is used to transmit data and clock signals. The protection and status monitoring section outputs power-on and normal status signals and provides an interrupt output. The general-purpose input / output section is used to read the status of external devices and control them.

[0030] However, while the protection circuits in related technologies offer all the basic functions, they suffer from several deficiencies in power management, timing control, and protection. For example, the lack of a precise temperature compensation mechanism leads to unstable circuit performance under varying temperatures; imprecise voltage and current control prevents the load from operating at stable voltage and current; inaccurate switching timing control affects the circuit's response speed and reliability; inflexible resistance adjustment makes it difficult to adapt to different application scenarios; and a lack of effective filtering and current stabilization measures leads to large fluctuations in the power supply voltage, impacting the circuit's stability and reliability. The improved circuit addresses these issues by integrating a digital temperature sensor, voltage regulator, digital potentiometer, operational amplifier, and microcontroller, significantly improving the circuit's performance, stability, and reliability.

[0031] In view of this, the present application provides a power device protection circuit capable of efficiently protecting gallium nitride power devices.

[0032] The optional embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0033] The embodiment provided in this application is an embodiment of a power device protection circuit.

[0034] The following combination Figure 2 The embodiments of the present application are described in detail.

[0035] Figure 2 The flow chart of the power device protection circuit of the present application is shown as follows: Figure 2 As shown, the non-integrated components in the power device protection circuit include resistor R1, resistor R2, resistor R3, resistor R4, resistor R5, resistor R6, resistor R7, resistor R8, resistor R9, resistor R10, fuse F1, capacitor C1, capacitor C2, field effect transistor Q1, first transistor Q2 and second transistor Q3, and the integrated components include digital temperature sensor U1, voltage regulator U2, digital potentiometer U3, operational amplifier U4, and microcontroller U5.

[0036] In this application, the power pin VCC of the digital temperature sensor U1 is connected to the power supply terminal V+, the ground pin GND1 of the digital temperature sensor U1 is grounded, the data pin SCL of the digital temperature sensor U1 is connected to the I2C interface A4 of the microcontroller U5, and the data pin SDA of the digital temperature sensor U1 is connected to the I2C interface A5 of the microcontroller U5.

[0037] In the present application, the input pin IN of the voltage regulator U2 is connected to the second voltage output terminal VGG through a fuse, the output pin OUT of the voltage regulator U2 is connected to the power supply terminal V+, the adjustment pin ADJ of the voltage regulator U2 is connected to the ground GND through the resistor R1, resistor R2, capacitor C1 of the voltage divider resistor network, and through the resistor R9, and the other end of the resistor R2 is connected to the negative voltage terminal V-.

[0038] In this application, the power pin VCC of the digital potentiometer U3 is connected to the power supply terminal V+, the ground pin GND2 of the digital potentiometer U3 is grounded, the data pins CLK, DATA, and LOAD of the digital potentiometer U3 are respectively connected to the SPI interfaces D10, D11, and D13 of the microcontroller U5, and the sliding end W0 of the digital potentiometer U3 is connected to the non-inverting input pin In+ of the operational amplifier U4.

[0039] In this application, the positive power pin Vcc of the operational amplifier U4 is connected to the power supply terminal V+, the negative power pin GND3 of the operational amplifier U4 is grounded, and the output pin Out of the operational amplifier U4 is connected to one end of the fourth resistor R4 and the sixth resistor R6.

[0040] The gate of field-effect transistor Q1 is connected to GPIO pin D8 of microcontroller U5. The first transistor Q2 and the second transistor Q3 are connected via their bases. A PWM output pin D9 of microcontroller U5 is connected to the bases of the first transistor Q2 and the second transistor Q3 via resistor R10. The emitter E of the first transistor Q2 is connected to the drain of field-effect transistor Q1 via resistor R4, and the collector C of the first transistor Q2 is grounded via resistor R5. The emitter E of the second transistor Q3 is connected to the drain of field-effect transistor Q1 via resistor R6 and to the first voltage output terminal VDD. The collector C of the second transistor Q3 is connected to one end of the first capacitor C1, the second voltage output terminal VGG, and one end of resistor R8.

[0041] In the present application, the source of the field effect transistor Q1 is connected to the power supply terminal V+, and is connected to one end of the resistor R3 and the capacitor C2, and the gate of the field effect transistor Q1 is also connected to the other end of the resistor R3 and the capacitor C2 respectively.

[0042] In the present application, the basic protection circuit is composed of non-integrated components including resistors R1, R2, R3, R4, R5, R6, R7, R8, R9, capacitors C1, C2, field-effect transistors Q1, first transistors Q2, and second transistors Q3. Furthermore, based on the combination of components, the basic protection circuit may include, for example, a switching timing circuit, a constant voltage and constant current circuit, and a temperature compensation circuit.

[0043] In an embodiment of the present application, the basic protection circuit includes a switch timing circuit. The switch timing circuit is composed of a field effect transistor Q1, a resistor R1, a resistor R2, a resistor R3, a resistor R9 and a capacitor C1. Among them, the gate of the field effect transistor is connected to one end of the resistor R1. The source of the field effect transistor is connected to the power supply end. The drain of the field effect transistor is connected to the constant voltage and constant current circuit. One end of the resistor R1 is connected to one end of the resistor R3. The other end of the resistor R1 is connected to one end of the resistor R2. The other end of the resistor R2 is connected to the negative voltage end. The other end of the resistor R3 is connected to the power supply end. One end of the capacitor C1 is connected to one end of the resistor R2. The other end of the capacitor C1 is connected to the ground. Among them, the connection node between the resistor R2 and the resistor R1 is a preset node. When the voltage of the preset node meets the preset condition, the field effect transistor is turned on.

[0044] In an embodiment of the present application, the basic protection circuit includes a constant voltage and constant current circuit. The constant voltage and constant current circuit is composed of a first transistor Q2, a second transistor Q3, a resistor R4, a resistor R5, and a resistor R6. The base of the first transistor Q2 is connected to the base of the second transistor Q3 and the collector of the first transistor Q2, respectively. The emitter of the first transistor Q2 is connected to one end of the resistor R4, and the other end of the resistor R4 is connected to the drain of the field effect transistor Q1. The collector of the first transistor Q2 is connected to one end of the resistor R5, and the other end of the resistor R5 is grounded. The emitter of the second transistor Q3 is connected to one end of the resistor R6, and the other end of the resistor R6 is connected to the drain of the field effect transistor Q1. The emitter of the second transistor Q3 is connected to the first voltage output terminal VDD. The collector of the second transistor Q3 is connected to one end of the first capacitor C1 via a resistor R7, and the collector of the second transistor Q3 is connected to the second voltage output terminal VGG via a resistor R7.

[0045] In an embodiment of the present application, the basic protection circuit includes a temperature compensation circuit. The temperature compensation circuit includes a first transistor Q2 and a second transistor Q3. The base of the first transistor Q2 is connected to the base of the second transistor Q3 and the collector of the first transistor Q2, respectively. The emitter of the first transistor Q2 is connected to the drain of the field effect transistor Q1. The collector of the first transistor Q2 is grounded. The emitter of the second transistor Q3 is connected to the drain of the field effect transistor Q1, and the emitter of the second transistor Q3 is connected to the first voltage output terminal VDD. The collector of the second transistor Q3 is connected to one end of the first capacitor C1 via a resistor R7, and the collector of the second transistor Q3 is connected to the second voltage output terminal VGG via a resistor R7.

[0046] In the embodiment of the present application, one end of the resistor R7 is connected to the collector of the second transistor, the other end of the resistor R7 is connected to one end of the capacitor C1, and the other end of the resistor R7 is connected to the second voltage output terminal VGG.

[0047] In the present application, one end of the resistor R8 is connected to the other end of the resistor R7 and is also connected to the second voltage output end VGG.

[0048] In this application, resistor R9, one end of resistor R9 is connected to the other end of capacitor C1, and the other end of resistor R9 is connected to the other end of resistor R8. The branch formed by resistor R9 and capacitor C1 is connected in parallel with resistor R8. This design is because considering the overvoltage problem of the external microcontroller U5 directly connected to the protection circuit provided in the related art, the other end of resistor R8 is adjusted from one end of capacitor C1 to the other end, and an additional wire is extended from one end of capacitor C1 to the other end of R8, so that resistor R8 is connected in parallel with capacitor C1. At the same time, the new resistor R9 is connected in series between capacitor C1 and ground to achieve single-channel current stabilization, thereby ensuring that its constant current and constant voltage function is not affected.

[0049] In addition, it should be noted that the pins that need to complete specific functions are all in Figure 2 The respective connection modes are shown in FIG. Figure 2 The pins shown in the connection method all adopt a conventional connection method, or are unconnected and unused pins, and are not described in detail in this application.

[0050] In some embodiments, the power device protection circuit monitors the ambient temperature in real time via a digital temperature sensor U1 and transmits the temperature data to a microcontroller U5. The microcontroller U5 adjusts the resistance of the digital potentiometer U3 based on the temperature data, thereby achieving temperature compensation. The voltage regulator U2 stabilizes the input 12V voltage to 5V, providing a stable power supply for the entire circuit. The gate of the field-effect transistor Q1 is controlled by the GPIO pin D8 of the microcontroller U5 to achieve precise switching timing control. The operational amplifier U4 ensures the stability of the output voltage and current through a feedback network. Resistor R8 is connected in parallel with capacitor C1, and resistor R9 is connected in series between capacitor C1 and ground to achieve single-channel current stabilization, ensuring that the load operates at stable voltage and current.

[0051] In some embodiments, the power device protection circuit uses a digital temperature sensor U1 to monitor the ambient temperature and transmits the temperature data to the microcontroller U5 through the I2C interface of the microcontroller U5. The microcontroller U5 adjusts the resistance value of the digital potentiometer U3 according to the temperature data to achieve temperature compensation. The voltage regulator U2 is connected to the second voltage output terminal VGG through a fuse, stabilizing the input 12V voltage to 5V, providing a stable power supply for the circuit. The gate of the field effect transistor Q1 is controlled by the GPIO pin D8 of the microcontroller U5 to achieve precise switching timing control. The first transistor Q2 and the second transistor Q3 are connected through the base to form a constant voltage and constant current circuit to ensure the stability of the output voltage and current. Resistor R8 is connected in parallel with capacitor C1, and resistor R9 is connected in series between capacitor C1 and ground to achieve single-channel current stabilization, ensuring that the load operates under stable voltage and current.

[0052] In some embodiments, the power device protection circuit monitors the ambient temperature through a digital temperature sensor U1 and transmits the temperature data to the microcontroller U5. The microcontroller U5 adjusts the resistance value of the digital potentiometer U3 according to the temperature data to achieve temperature compensation. The voltage regulator U2 stabilizes the input 12V voltage to 5V through the voltage divider resistor network R1 and R2, providing a stable power supply for the circuit. The gate of the field effect transistor Q1 is controlled by the GPIO pin D8 of the microcontroller U5 to achieve precise switching timing control. The first transistor Q2 and the second transistor Q3 are connected through the base to form a temperature compensation circuit to ensure the stable performance of the circuit under different temperature conditions. Resistor R8 is connected in parallel with capacitor C1, and resistor R9 is connected in series between capacitor C1 and ground to achieve single-channel current stabilization, ensuring that the load operates under stable voltage and current.

[0053] In some embodiments, the power device protection circuit monitors the ambient temperature through a digital temperature sensor U1 and transmits the temperature data to the microcontroller U5. The microcontroller U5 adjusts the resistance value of the digital potentiometer U3 according to the temperature data to achieve temperature compensation. The voltage regulator U2 is connected to the second voltage output terminal VGG through a fuse, stabilizing the input 12V voltage to 5V, providing a stable power supply for the circuit. The gate of the field effect transistor Q1 is controlled by the GPIO pin D8 of the microcontroller U5 to achieve precise switching timing control. The operational amplifier U4 ensures the stability of the output voltage and current through a feedback network. Resistor R8 is connected in parallel with capacitor C1, and resistor R9 is connected in series between capacitor C1 and ground to achieve single-channel current stabilization, ensuring that the load operates under stable voltage and current. In addition, the circuit also includes an electrolytic capacitor C2 connected between the power supply terminal V+ and ground for filtering and reducing fluctuations in the power supply voltage.

[0054] In some embodiments, the power device protection circuit monitors the ambient temperature through a digital temperature sensor U1 and transmits the temperature data to a microcontroller U5. The microcontroller U5 adjusts the resistance value of the digital potentiometer U3 based on the temperature data to achieve temperature compensation. The voltage regulator U2 stabilizes the input 12V voltage to 5V through the voltage divider resistor network R1 and R2, providing a stable power supply for the circuit. The gate of the field-effect transistor Q1 is controlled by the GPIO pin D8 of the microcontroller U5 to achieve precise switching timing control. The first transistor Q2 and the second transistor Q3 are connected through the base to form a constant voltage and constant current circuit to ensure the stability of the output voltage and current. Resistor R8 is connected in parallel with capacitor C1, and resistor R9 is connected in series between capacitor C1 and ground to achieve single-channel current stabilization, ensuring that the load operates at stable voltage and current. In addition, the circuit also includes an electrolytic capacitor C2 connected between the power supply terminal V+ and ground for filtering and reducing fluctuations in the power supply voltage.

[0055] The above embodiments of this application demonstrate different application methods of the improved power device protection circuit. By integrating a digital temperature sensor, a voltage regulator, a digital potentiometer, an operational amplifier and a microcontroller, accurate temperature compensation, stable voltage and current output, flexible resistance control and reliable switch timing control are achieved, significantly improving the performance, stability and reliability of the circuit.

[0056] In the related art, a device protection board is also deployed corresponding to the protection circuit provided in the related art.

[0057] Figure 3a A top schematic diagram of a device protection board in the related art is shown.

[0058] Figure 3b The bottom layer schematic diagram of the device protection board in the related art is shown.

[0059] In this application, taking into account the problems in the related technology regarding the production process, such as high cost of board modification and the inability to return the manufactured boards and having to be scrapped, a device protection board is provided accordingly, which is equipped with the power device protection circuit described in any of the above embodiments.

[0060] For example, the device protection board provided in the present application is correspondingly configured with non-integrated components such as resistor R1, resistor R2, resistor R3, resistor R4, resistor R5, resistor R6, resistor R7, resistor R8, resistor R9, resistor R10, fuse F1, capacitor C1, capacitor C2, field effect transistor Q1, first transistor Q2 and second transistor Q3, as well as integrated components such as digital temperature sensor U1, voltage regulator U2, digital potentiometer U3, the operational amplifier U4, and microcontroller U5.

[0061] Figure 4a Shown is a top schematic diagram of the device protection board in this application.

[0062] Figure 4b The bottom schematic diagram of the device protection board in this application is shown.

[0063] For example, Figure 4a and 4b As shown, this application provides a device protection board layout suitable for the power device protection circuit of this application, based on the reference of some components of the original circuit, with minimal layout changes. On this basis, during the production process, only a simple board expansion and assembly is required to complete the design update of the board. In addition, the manufactured boards can be reused by returning them, thereby improving the protection effect of gallium nitride power devices while minimizing the production modification costs for the production plant, which is more in line with production needs.

[0064] Although operations are described in a particular order in the drawings, this should not be understood as requiring that the operations be performed in the particular order shown or in serial order, or that all shown operations be performed to obtain the desired results. In certain circumstances, multitasking and parallel processing may be advantageous.

[0065] Any steps, operations or procedures described herein may be performed or implemented using one or more hardware or software modules, either alone or in combination with other devices. In one embodiment, the software modules are implemented using a computer program product comprising a computer-readable medium containing computer program code, which can be executed by a computer processor to perform any or all of the steps, operations or procedures described.

[0066] The foregoing description of the implementation of the present application has been provided for purposes of illustration and description. The foregoing description is not intended to be exhaustive or to limit the present application to the precise form disclosed, and various variations and modifications are possible in accordance with the above teachings or may result from the practice of the present application. These embodiments have been selected and described in order to illustrate the principles of the present application and its practical application, so as to enable those skilled in the art to utilize the present application in various embodiments and modifications as appropriate for the particular use contemplated.

[0067] It is further understood that, unless otherwise specified, “connection” includes a direct connection where there are no other components between the two elements, and also includes an indirect connection where there are other elements between the two elements.

[0068] It should be further understood that although operations are described in a particular order in the drawings in the embodiments of the present application, this should not be construed as requiring that these operations be performed in the particular order shown or in a serial order, or that all of the illustrated operations be performed to obtain the desired results. In certain circumstances, multitasking and parallel processing may be advantageous.

[0069] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the invention disclosed herein. This application is intended to encompass any variations, uses, or adaptations of the present application that follow the general principles of the present application and include common knowledge or customary techniques in the field of the present application that are not disclosed herein. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the scope of claims below.

[0070] It should be understood that the present application is not limited to the precise structures described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the scope of the appended claims.

[0071] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A power device protection circuit, characterized in that: include: A basic protection circuit includes resistors R1, R2, R3, R4, R5, R6, R7, R8, R9, capacitors C1, C2, a field effect transistor Q1, a first transistor Q2, and a second transistor Q3; A digital temperature sensor U1, wherein a power pin VCC of the digital temperature sensor U1 is connected to a power supply terminal V+, a ground pin GND1 of the digital temperature sensor U1 is grounded, a data pin SCL of the digital temperature sensor U1 is connected to an I2C interface A5 of a microcontroller U5, and a data pin SDA of the digital temperature sensor U1 is connected to an I2C interface A4 of the microcontroller U5; A voltage regulator U2, wherein an input pin IN of the voltage regulator U2 is connected to a first voltage output terminal VDD through a fuse, an output pin OUT of the voltage regulator U2 is connected to the power supply terminal V+, an adjustment pin ADJ of the voltage regulator U2 is connected to ground GND through a resistor R1, a resistor R2, and a capacitor C1 of a voltage divider resistor network, and through a resistor R9, and the other end of the resistor R2 is connected to a negative voltage terminal V-; A digital potentiometer U3, wherein a power pin VCC of the digital potentiometer U3 is connected to a power supply terminal V+, a ground pin GND2 of the digital potentiometer U3 is grounded, data pins LOAD, DATA, and CLK of the digital potentiometer U3 are respectively connected to SPI interfaces D10, D11, and D13 of the microcontroller U5, and a sliding terminal W0 of the digital potentiometer U3 is connected to a non-inverting input pin In+ of an operational amplifier U4; The operational amplifier U4, wherein the positive power supply pin Vcc of the operational amplifier U4 is connected to the power supply terminal V+, the negative power supply pin GND3 of the operational amplifier U4 is grounded, and the output pin Out of the operational amplifier U4 is connected to one end of the resistor R4 and the resistor R6; The gate of the field effect transistor Q1 is connected to the GPIO pin D8 of the microcontroller U5, the first transistor Q2 and the second transistor Q3 are connected through their bases, and the PWM output pin D9 of the microcontroller U5 is connected to the bases of the first transistor Q2 and the second transistor Q3 through a resistor R10; the emitter E of the first transistor Q2 is connected to the drain of the field effect transistor Q1 through a resistor R4, and the collector C of the first transistor Q2 is grounded through a resistor R5; the emitter E of the second transistor Q3 is connected to the drain of the field effect transistor Q1 through the resistor R6, and is connected to the first voltage output terminal VDD, and the collector C of the second transistor Q3 is connected to one end of the capacitor C1 through a resistor R7, and is connected to the second voltage output terminal VGG and one end of the resistor R8; The source of the field effect transistor Q1 is connected to the power supply terminal V+, and is connected to one end of the resistor R3 and the capacitor C2. The gate of the field effect transistor Q1 is also connected to the other end of the resistor R3 and the capacitor C2 respectively.

2. The power device protection circuit according to claim 1, wherein: The basic protection circuit includes a switch timing circuit; The switching timing circuit is composed of the field effect transistor Q1, the resistor R1, the resistor R2, the resistor R3, the resistor R9 and the capacitor C1; wherein, the gate of the field effect transistor Q1 is connected to one end of the resistor R1; the source of the field effect transistor Q1 is connected to the power supply terminal V+; the drain of the field effect transistor Q1 is connected to the constant voltage and constant current circuit; one end of the resistor R1 is connected to the other end of the resistor R3; the other end of the resistor R1 is connected to one end of the resistor R2; the other end of the resistor R2 is connected to the negative voltage terminal V-; one end of the resistor R3 is connected to the power supply terminal V+; one end of the capacitor C1 is connected to one end of the resistor R2; the other end of the capacitor C1 is connected to the ground through the resistor R9; wherein, the connection node between the resistor R2 and the resistor R1 is a preset node, and when the voltage of the preset node meets the preset condition, the field effect transistor is turned on.

3. The power device protection circuit according to claim 1, wherein: The basic protection circuit includes a constant voltage and constant current circuit; The constant voltage and constant current circuit comprises a first transistor Q2, a second transistor Q3, a resistor R4, a resistor R5, and a resistor R6; wherein the base of the first transistor Q2 is connected to the base of the second transistor Q3 and the collector of the first transistor Q2, respectively; the emitter of the first transistor Q2 is connected to the other end of the resistor R4, one end of which is connected to the drain of the field effect transistor Q1; the collector of the first transistor Q2 is connected to one end of the resistor R5, the other end of which is grounded; the emitter of the second transistor Q3 is connected to the other end of the resistor R6, one end of which is connected to the drain of the field effect transistor Q1, and the emitter of the second transistor Q3 is connected to the first voltage output terminal VDD; the collector of the second transistor Q3 is connected to one end of the capacitor C1 via the resistor R7, and the collector of the second transistor Q3 is connected to the second voltage output terminal VGG via the resistor R7.

4. The power device protection circuit according to claim 1, wherein: The basic protection circuit includes a temperature compensation circuit; The temperature compensation circuit includes a first transistor Q2 and a second transistor Q3; wherein the base of the first transistor Q2 is connected to the base of the second transistor Q3 and the collector of the first transistor Q2 respectively; the emitter of the first transistor Q2 is connected to the drain of the field effect transistor Q1; the collector of the first transistor Q2 is grounded; the emitter of the second transistor Q3 is connected to the drain of the field effect transistor Q1, and the emitter of the second transistor Q3 is connected to the first voltage output terminal VDD; the collector of the second transistor Q3 is connected to one end of the capacitor C1 via the resistor R7, and the collector of the second transistor Q3 is connected to the second voltage output terminal VGG via the resistor R7.

5. The power device protection circuit according to claim 1, wherein: One end of the resistor R7 is connected to the collector of the second transistor, the other end of the resistor R7 is connected to one end of the capacitor C1, and the other end of the resistor R7 is connected to the second voltage output terminal VGG; One end of the resistor R8 is connected to the other end of the resistor R7 and is also connected to the second voltage output end VGG; The resistor R9, one end of the resistor R9 is connected to the other end of the capacitor C1, and the other end of the resistor R9 is connected to the other end of the resistor R8, and the branch formed by the resistor R9 and the capacitor C1 is connected in parallel with the resistor R8.

6. A device protection plate, characterized in that: A power device protection circuit according to any one of claims 1 to 5 is provided.

Citation Information

Patent Citations

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    CN107565913A

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