Power supply chip, chip and electronic equipment

Abstract

The invention provides a power supply chip, a chip and electronic equipment, and belongs to the field of electronic equipment. The power supply chip comprises a first voltage input pin, a second voltage input pin, a first pin, a second pin, a power supply output pin, a first power supply circuit and a second power supply circuit. Wherein the first power supply circuit and the second power supply circuit are different power supply circuits. The input end of the first power supply circuit is coupled with the first voltage input pin, and the output end of the first power supply circuit is coupled with the power supply output pin. The input end of the second power supply circuit is coupled with the second voltage input pin, the output end of the second power supply circuit is coupled with the first pin, and the second pin is coupled with the power supply output pin. The first pin and the second pin are used for being connected with the two ends of an external inductor respectively. According to the embodiment of the invention, the power supply mode of the power supply chip can be selected more flexibly to meet the requirements of different electronic products, and richer selectable solutions are provided for the design and implementation of the electronic equipment.

Description

Technical Field

[0001] The present application relates to the field of electronic equipment, and in particular to a power supply chip, a chip and an electronic equipment. Background Art

[0002] Different electronic products (e.g., mobile phones, personal computers, tablets, and IoT devices) have different requirements in terms of power consumption, performance, size, etc. This requires the chips in electronic products to have higher versatility and flexibility to meet the needs of different electronic products; for example, to adapt to the needs of extreme ultra-thin size (e.g., foldable phones), extreme battery life (e.g., candy-bar phones), and adapter device reuse (e.g., personal computers and tablets). Summary of the invention

[0003] The embodiments of the present application provide a power supply chip, a chip and an electronic device, which are used to meet the needs of different electronic devices and provide a wealth of optional solutions for the design and implementation of electronic devices.

[0004] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions: In a first aspect, a power supply chip is provided. The power supply chip includes a first voltage input pin, a second voltage input pin, a first pin, a second pin, a power supply output pin, a first power supply circuit, and a second power supply circuit. The first power supply circuit and the second power supply circuit are different power supply circuits. The input end of the first power supply circuit is coupled to the first voltage input pin, and the output end of the first power supply circuit is coupled to the power supply output pin. The input end of the second power supply circuit is coupled to the second voltage input pin, the output end of the second power supply circuit is coupled to the first pin, and the second pin is coupled to the power supply output pin. The first pin and the second pin are used to respectively connect the two ends of an external inductor.

[0005] In the implementation manner of the present application, the power supply chip can supply power to the load connected to the power supply output pin through the first power supply circuit or the second power supply circuit. Thus, the power supply mode of the power supply chip can be flexibly selected to meet the needs of different electronic products, providing a rich selection of optional solutions for the design and implementation of electronic equipment.

[0006] In some possible implementations, the power supply chip further includes a switch circuit and a third voltage input pin, the input end of the switch circuit is coupled to the third voltage input pin, and the output end of the switch circuit is coupled to the power supply output pin. In the implementation of the present application, the power supply chip can further supply power to a load connected to the power supply output pin through the switch circuit. That is, the implementation of the present application can more flexibly select the power supply mode of the power supply chip to meet the design requirements of different electronic products, and provide a richer range of optional solutions for the design and implementation of electronic equipment.

[0007] In some possible implementations, the second voltage input pin and the first voltage input pin are the same pin of the power supply chip, and the third voltage input pin and the second voltage input pin are different pins of the power supply chip, thereby reducing the number of package pins of the power supply chip and reducing the packaging difficulty.

[0008] In order to control the operation of the first power supply circuit, the second power supply circuit and the switch circuit. In some possible implementations, the power supply chip further includes a controller and a register, and the register is configured with a state value. The controller is configured to: in response to the state value being a first state value, control the first power supply circuit to operate. In response to the state value being a second state value, control the second power supply circuit to operate. In response to the state value being a third state value, control the switch circuit to turn on.

[0009] Further, in order to increase the versatility and flexibility of the power supply chip. In some possible embodiments, the power supply chip also includes a power supply selection pin, and the controller is coupled to the power supply selection pin. The controller is also configured to: in response to the state value being a fourth state value, control the working state of the first power supply circuit, the second power supply circuit and the switch circuit according to the potential of the power supply selection pin. In some examples, the controller is configured to: when the potential of the power supply selection pin is a high potential, control the first power supply circuit to work. When the potential of the power supply selection pin is a low potential, control the second power supply circuit to work. When the potential of the power supply selection pin is floating, control the switch circuit to turn on.

[0010] In some possible implementations, the register is an electronic fuse (eFuse) register.

[0011] In some possible implementations, when the first pin and the second pin are respectively connected to two ends of the external inductor, the second power supply circuit and the external inductor form a buck DC-DC converter (BUCK) circuit. The BUCK circuit can convert the input voltage into an output voltage with low power consumption and high efficiency, thereby meeting the high energy efficiency requirements of electronic equipment.

[0012] In some possible implementations, the first power supply circuit is a low dropout regulator (LDO) circuit. The low dropout regulator circuit does not need to be used with an external inductor, so the first pin SW1 and the second pin SW2 of the power supply chip do not need to be connected to an external inductor, which helps to reduce the layout area of ​​the circuit board, thereby meeting the requirements of thinness of electronic equipment.

[0013] In some possible implementations, a diode is further included, wherein the anode of the diode is coupled to the first power supply pin, and the cathode of the diode is coupled to the input end of the first power supply circuit. Alternatively, the anode of the diode is coupled to the output end of the first power supply circuit, and the cathode of the diode is coupled to the power supply output pin. By providing a diode, current can be prevented from flowing back to the input end of the first power supply circuit through the parasitic diode in the first power supply circuit (i.e., the LDO circuit).

[0014] In a second aspect, a chip is provided. The chip includes a first voltage input pin, a second voltage input pin, a first pin, a second pin, a first power supply circuit, a second power supply circuit and an on-chip load. The first power supply circuit and the second power supply circuit are different power supply circuits. The input end of the first power supply circuit is coupled to the first voltage input pin, and the output end of the first power supply circuit is coupled to the on-chip power supply end of the chip. The input end of the second power supply circuit is coupled to the second voltage input pin, the output end of the second power supply circuit is coupled to the first pin, the second pin is coupled to the on-chip power supply end, and the on-chip power supply end is coupled to the on-chip load. The first pin and the second pin are used to respectively connect the two ends of an external inductor.

[0015] In some possible implementations, the chip further includes a switch circuit and a third voltage input pin, the input end of the switch circuit is coupled to the third voltage input pin, and the output end of the switch circuit is coupled to an internal power supply end.

[0016] In a third aspect, an electronic device is provided, comprising a power management chip, a load, and the power supply chip of any one of the first aspects, wherein the power supply chip is coupled to the power management chip and the load respectively.

[0017] In a fourth aspect, an electronic device is provided, which includes a power management chip and the chip in the second aspect, wherein the chip is coupled to the power management chip.

[0018] It should be understood that the technical effects in the second to fourth aspects can refer to the technical effects of the first aspect and any embodiment thereof, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application; Figure 2 A schematic diagram of the structure of a power supply chip provided in an embodiment of the present application; Figure 3 A schematic diagram of the structure of another power supply chip provided in an embodiment of the present application; Figure 4 A schematic diagram of possible locations of diodes in a power supply chip provided in an embodiment of the present application; Figure 5A schematic diagram of an application structure of a power supply chip provided in an embodiment of the present application in an electronic device; Figure 6 A schematic diagram of the structure of a chip provided in an embodiment of the present application; Figure 7 A schematic diagram of an application structure of the chip provided in an embodiment of the present application in a first electronic device; Figure 8 A schematic diagram of another application structure of the chip provided in an embodiment of the present application in a first electronic device; Fig. 9 A schematic diagram of an application structure of the chip provided in an embodiment of the present application in a second electronic device; Fig.10 A schematic diagram of another application structure of the chip provided in an embodiment of the present application in a second electronic device; Fig.11 A schematic diagram of an application structure of the chip provided in an embodiment of the present application in a third electronic device; Fig.12 A schematic diagram of another application structure of the chip provided in an embodiment of the present application in a third electronic device.

[0020] Figure numerals: 100, electronic device; 110, processor chip; 120, internal memory; 130, power management module; 140, mobile communication module; 150, wireless communication module; 160, interface circuit; 161, SD card interface circuit; 162, USB interface circuit; 163, SIM card interface circuit; 210, display module; 220, audio module; 230, sensor module; 240, antenna; 250, motor; 260, camera; 270, button; 280, battery; 300, chip; 310, power supply chip; 311, first power supply circuit; 312, second power supply circuit; 313, switch circuit; 314, controller; 315, register; 320, on-chip load; 410, power management chip; 420, load. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0022] The terms "first", "second", etc. involved in the embodiments of the present application are only used to distinguish features of the same type and cannot be understood as indicating relative importance, quantity, order, etc.

[0023] The terms "exemplary" or "for example" and the like in the embodiments of the present application are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of the terms "exemplary" or "for example" is intended to present the related concepts in a specific way.

[0024] The terms "coupling" and "connection" involved in the embodiments of the present application should be understood in a broad sense. For example, they may refer to a direct physical connection, or an indirect connection achieved through electronic devices, such as a connection achieved through resistors, inductors, capacitors or other electronic devices.

[0025] The embodiment of the present application provides an electronic device, which can be mobile or fixed. The electronic device can be deployed on land (for example, indoors or outdoors, handheld or vehicle-mounted, etc.), on the water (for example, ships, etc.), or in the air (for example, airplanes, balloons, and satellites, etc.). The electronic device can be called user equipment (UE), access terminal, terminal unit, subscriber unit, terminal station, mobile station (MS), mobile station, terminal agent or terminal device, etc. For example, the electronic device can be a mobile phone, a tablet computer, a laptop computer, a smart bracelet, a smart screen, a smart watch, a headset, a smart speaker, a virtual reality (VR) device, an augmented reality (AR) device, a terminal in industrial control, a terminal in self driving, a terminal in remote medical, a terminal in smart grid, a terminal in transportation safety, a terminal in smart city, a terminal in smart home, etc. The embodiments of the present application do not limit the specific type and structure of the electronic device. A possible structure of the electronic device is described below.

[0026] Figure 1The schematic diagram of the structure of an electronic device is shown. The electronic device 100 includes a processor chip 110, an internal memory 120, a power management module 130, a mobile communication module 140, a wireless communication module 150, an interface circuit 160, a display module 210, an audio module 220, a sensor module 230, an antenna 240, a motor 250, a camera 260, a button 270, and a battery 280. Among them, the sensor module 230 may include a pressure sensor, a gyroscope sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a distance sensor, a proximity light sensor, a fingerprint sensor, a temperature sensor, a touch sensor, an ambient light sensor, and a bone conduction sensor.

[0027] It is to be understood that the interface connection relationship between the modules illustrated in the embodiment of the present application is only a schematic illustration and does not constitute a specific limitation on the electronic device 100. In other embodiments of the present application, the electronic device 100 may include more or fewer components than shown in the figure, or combine some components, or split some components, or arrange the components differently. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0028] The processor chip 110 may include one or more processing units, for example, the processing unit may be a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), a system on chip (SoC), a central processing unit (CPU), an application processor (AP), a network processor (NP), a digital signal processor (DSP), a microcontroller unit (MCU), a programmable logic device (PLD), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, a baseband processor, and a neural-network processing unit (NPU), etc.

[0029] The wireless communication function of the electronic device 100 can be implemented by the antenna 240, the mobile communication module 140, the wireless communication module 150, the modem, and the baseband processor. The antenna 240 is used to transmit and receive electromagnetic wave signals. Each antenna 240 in the electronic device 100 can be used to cover a single or multiple communication frequency bands. Different antennas 240 can also be reused to improve the utilization of the antenna 240.

[0030] The mobile communication module 140 can provide solutions for wireless communications including 2G / 3G / 4G / 5G, etc., applied to the electronic device 100. The wireless communication module 150 can provide solutions for wireless communications including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), infrared technology (IR), etc., applied to the electronic device 100.

[0031] The internal memory 120 may be used to store computer executable program codes, which include computer instructions. The processor chip 110 executes various functional applications and data processing of the electronic device 100 by running the computer instructions stored in the internal memory 120. In addition, the internal memory 120 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, a universal flash storage (UFS), etc.

[0032] The memory involved in the embodiments of the present application may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memories. Among them, the non-volatile memory may be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or a flash memory. The volatile memory may be a random access memory (RAM), which is used as an external cache. By way of example but not limitation, many forms of RAM are available, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), and direct RAM bus RAM (DR RAM). It should be noted that the memory of the systems and methods described herein is intended to include, but is not limited to, these and any other suitable types of memory.

[0033] In some embodiments, the interface circuit 160 includes a secure digital (SD) card interface circuit 161 , a universal serial bus (USB) interface circuit 162 , a subscriber identification module (SIM) card interface circuit 163 , and the like.

[0034] The SD card interface circuit 161 can be used to connect an external memory card, such as a micro SanDisk (MicroSD) card, to expand the storage capacity of the electronic device 100. The external memory card communicates with the processor through the external memory interface to implement a data storage function, such as storing music, video and other files in the external memory card.

[0035] The USB interface circuit 162 can be used to connect external devices to achieve functions including data transmission and charging. For example, the mobile phone can be connected to a computer or other device through the USB interface circuit 162 to achieve fast transmission of data such as files, photos, and videos. This transmission method is usually more stable and reliable than wireless transmission. For example, the mobile phone can be connected to a charger or a computer through the USB interface circuit 162, thereby providing a stable current for the mobile phone to achieve fast charging.

[0036] The SIM card interface circuit 163 is used to connect a SIM card. The SIM card can be connected to or disconnected from the electronic device 100 by inserting the SIM card interface circuit 163 or pulling the SIM card interface circuit 163 out. The electronic device 100 can support 1 or N SIM card interface circuits 163, where N is a positive integer greater than 1. The SIM card interface circuit 163 can support a Nano SIM card, a Micro SIM card, a SIM card, and the like.

[0037] The electronic device 100 can implement audio functions through the audio module and the processor chip 110, such as music playing and recording. The audio module 220 is used to convert digital audio information into analog audio signal output, and is also used to convert analog audio input into digital audio signals. In some embodiments, the audio module can be arranged in the processor chip 110, or some functional modules of the audio module can be arranged in the processor chip 110.

[0038] The key 270 includes a power key, a volume key, etc. The key 270 may be a mechanical key 270 or a touch key 270. The electronic device 100 may receive input from the key 270 and generate key signal input related to user settings and function control of the electronic device 100. The motor 250 may generate a vibration prompt. The motor 250 may be used for incoming call vibration prompts or for touch vibration feedback.

[0039] The electronic device 100 can realize the shooting function through the ISP, the camera 260, the video codec, the GPU, the display module 210, and the processor chip 110. The ISP is used to process the data fed back by the camera 260. In some embodiments, the ISP can be set in the camera 260. The camera 260 is used to capture a static image or a video. In some embodiments, the electronic device 100 may include 1 or N cameras 260, where N is a positive integer greater than 1.

[0040] The electronic device 100 can realize the display function through the GPU, the display module 210 and the processor chip 110. The GPU is a microprocessor for image processing, which connects the display module 210 and the processor chip 110. The GPU is used to perform mathematical and geometric calculations and for graphics rendering, and it executes computer instructions to generate or change display information.

[0041] The battery 280 is coupled to the power management module 130; wherein the power management module 130 may include a power management integrated circuit (PMIC). In some scenarios, the battery 280 may power loads such as the processor chip 110, the internal memory 120, the display module 210, the audio module 220, and the sensor module 230 through the power management module 130. In some scenarios, the power management module 130 may receive charging input from a charger to charge the battery 280. The charger may be a wireless charger, such as a wireless charging base, other electronic devices 100 with reverse wireless charging function, etc. The power management module 130 may receive wireless charging input through the wireless charging coil of the electronic device 100.

[0042] Different electronic devices have different requirements in terms of power consumption, performance, size, etc. This requires that each component in the electronic device, such as the chip, has higher versatility and flexibility to meet the needs of different electronic devices; for example, the need to adapt to the extreme ultra-thin size (such as folding mobile phones), the need to adapt to the extreme battery life (such as candy-bar mobile phones), and the need to reuse adapters (such as personal computers and tablets).

[0043] The present application provides a power supply chip that can meet the needs of different electronic devices and provide a rich selection of solutions for the design and implementation of electronic devices. Figure 2 As shown, the power supply chip 310 includes a first voltage input pin Vin1, a second voltage input pin Vin2, a first pin SW1, a second pin SW2, a power supply output pin Vout, a first power supply circuit 311 and a second power supply circuit 312. The first power supply circuit 311 and the second power supply circuit 312 are different power supply circuits. The input end of the first power supply circuit 311 is coupled to the first voltage input pin Vin1, and the output end of the first power supply circuit 311 is coupled to the power supply output pin Vout. The input end of the second power supply circuit 312 is coupled to the second voltage input pin Vin2, the output end of the second power supply circuit 312 is coupled to the first pin SW1, and the second pin SW2 is coupled to the power supply output pin Vout.

[0044] In some embodiments, the first power supply circuit 311 is an LDO circuit, which can achieve linear regulation of the output voltage, and the output voltage has low noise and small ripple, but there is a certain current loss, especially when the difference between the input voltage and the output voltage is large, the conversion efficiency is low.

[0045] The first pin SW1 and the second pin SW2 are used to connect the two ends of the external inductor respectively. When the first pin SW1 and the second pin SW2 are connected to the two ends of the external inductor respectively, the second power supply circuit 312 and the external inductor form a BUCK circuit. The BUCK circuit can convert the input voltage into an output voltage with low power consumption and high efficiency. The embodiment of the present application realizes the decoupling of the BUCK circuit. When the BUCK circuit is not used, the first pin SW1 and the second pin SW2 of the power supply chip 310 do not need to be connected to the external inductor, which helps to reduce the layout area of ​​the circuit board.

[0046] like Figure 3 As shown, in some embodiments, the power supply chip 310 further includes a switch circuit 313 and a third voltage input pin Vin3, the input end of the switch circuit 313 is coupled to the third voltage input pin Vin3, and the output end of the switch circuit 313 is coupled to the power supply output pin Vout. In some examples, the second voltage input pin Vin2 and the first voltage input pin Vin1 are the same pin of the power supply chip 310, and the third voltage input pin Vin3 and the second voltage input pin Vin2 are different pins of the power supply chip 310. Although Figure 3 Although not shown in the figure, those skilled in the art should understand that in other examples, the first voltage input pin Vin1, the second voltage input pin Vin2 and the third voltage input pin Vin3 may also be different pins of the power supply chip 310 respectively.

[0047] For different electronic devices 100, the power supply chip 310 provided in the embodiment of the present application can flexibly choose to use the first power supply circuit 311, the second power supply circuit 312 or the switching circuit 313 to power the load 420 connected to the power supply output pin Vout in the electronic device 100, thereby meeting the needs of different electronic devices 100 and providing a wealth of optional solutions for the design and implementation of the electronic device 100.

[0048] Please continue to refer to Figure 3In some implementations, the power supply chip 310 further includes a controller 314 and a register 315, and the register 315 is configured with a state value. The controller 314 can be coupled to the register 315, the first power supply circuit 311, the second power supply circuit 312, and the switch circuit 313, respectively, as shown in Table 1 below, and the controller 314 can control the operation of the first power supply circuit 311, the second power supply circuit 312, and the switch circuit 313 according to the state value configured in the register 315.

[0049] Table 1

[0050] In some implementations, register 315 may be a 2-bit electronic fuse register. In some examples, the first state value is "00", the second state value is "01", and the third state value is "10".

[0051] In some implementations, the state value of the register 315 can be configured by direct fuses before the power supply chip 310 leaves the factory, thereby fixing the power supply mode of the power supply chip 310 .

[0052] In order to make the power supply mode of the power supply chip 310 more flexible, in some embodiments, the power supply chip 310 further includes a power supply selection pin Sel, and the controller 314 is coupled to the power supply selection pin Sel. As shown in Table 2 below, when the state value configured by the register 315 is the fourth state value, the controller 314 can control the working state of the first power supply circuit 311, the second power supply circuit 312, and the switch circuit 313 according to the potential of the power supply selection pin Sel; in some examples, the fourth state value is "11".

[0053] Table 2

[0054] It should be understood that the pin suspension (also referred to as floating) described in the embodiments of the present application means that the pin is not connected to any external circuit or electronic component.

[0055] In some implementations, the power supply chip 310 further includes a diode D. Figure 4 As shown, the anode of the diode D is coupled to the first power supply pin Vin1, and the cathode of the diode D is coupled to the input terminal of the first power supply circuit 311. Alternatively, the anode of the diode D is coupled to the output terminal of the first power supply circuit 311, and the cathode of the diode D is coupled to the power supply output pin Vout. This prevents the current from flowing back through the parasitic diode in the first power supply circuit 311 (ie, the LDO circuit).

[0056] like Figure 5As shown, an electronic device 100 is also provided in the embodiment of the present application. The electronic device 100 includes a power management chip 410, a load 420 and Figure 2-Figure 4 Any power supply chip 310 is coupled to the power management chip 410 and the load 420 respectively.

[0057] like Figure 6 As shown, the embodiment of the present application also provides a chip. The chip 300 includes a first voltage input pin Vin1, a second voltage input pin Vin2, a third voltage input pin Vin3, a first pin SW1, a second pin SW2, a first power supply circuit 311, a second power supply circuit 312, a switch circuit 313, a controller 314, a register 315, a diode D and an on-chip load 320. Among them, the first power supply circuit 311 and the second power supply circuit 312 are different power supply circuits. The input end of the first power supply circuit 311 is coupled to the first voltage input pin Vin1, and the output end of the first power supply circuit 311 is coupled to the on-chip power supply terminal Vp of the chip 300. The input end of the second power supply circuit 312 is coupled to the second voltage input pin Vin2, the output end of the second power supply circuit 312 is coupled to the first pin SW1, the second pin SW2 is coupled to the on-chip power supply terminal Vp, and the on-chip power supply terminal Vp is coupled to the on-chip load 320. The input end of the switch circuit 313 is coupled to the third voltage input pin Vin3, and the output end of the switch circuit 313 is coupled to the on-chip power supply terminal Vp. The first pin SW1 and the second pin SW2 are used to connect the two ends of the external inductor respectively. The controller 314 is coupled to the register 315, the first power supply circuit 311, the second power supply circuit 312 and the switch circuit 313 respectively. The anode of the diode D is coupled to the first power supply pin Vin1, and the cathode of the diode D is coupled to the input end of the first power supply circuit 311.

[0058] Another electronic device 100 is provided in the embodiment of the present application. The electronic device 100 includes a power management chip 410 and Figure 6 As shown in the chip 300 , the chip 300 is coupled to a power management chip 410 .

[0059] like Figure 7 and Figure 8As shown, in some scenarios, the electronic device 100 (for example, a foldable mobile phone) needs to be ultra-thin, the thickness of the chip 300 and peripheral devices is less than 0.7 mm, and the power management chip 410 has no excess power to provide to the chip 300. At this time, the first voltage input pin Vin1 of the chip 300 is coupled to the first voltage output pin Vsys of the power management chip 410, the second voltage input pin Vin2 of the chip 300 is suspended, and the first pin SW1 and the second pin SW2 of the chip 300 are suspended. In this scenario, avoid using a large external inductor to ensure that the thickness of the electronic device 100 is small and meet the design requirements.

[0060] In such Figure 7 In some examples shown, the state value of the register 315 in the chip 300 is configured as a first state value (eg, "00"); or Figure 8 In some other examples shown, the state value of the register 315 in the chip 300 is configured as a fourth state value (for example, "11"), and the power supply selection pin Sel of the chip 300 is connected to the high level VDD through the pull-up resistor R1. At this time, the controller 314 controls the first power supply circuit 311 to work; that is, the first power supply circuit 311 is in the on mode (onmode), and controls the second power supply circuit 312 not to work; that is, the second power supply circuit 312 is in the off mode (off mode), and controls the switch circuit 313 to be disconnected.

[0061] As described above, the first power supply circuit 311 is an LDO circuit. In some embodiments, the controller 314 can dynamically adjust the on-resistance of the voltage regulator in the LDO circuit according to the output voltage of the LDO circuit, thereby stabilizing the output voltage of the LDO circuit. For example, when the output voltage increases, the controller 314 controls the on-resistance of the voltage regulator to increase, so that the on-voltage drop on the voltage regulator increases, thereby reducing the output voltage of the LDO circuit.

[0062] like Fig. 9 and Fig.10 As shown, in some scenarios, the electronic device 100 (for example, a candy-bar phone) needs to have high energy efficiency requirements, and the power management chip 410 has no excess power to provide to the chip 300. At this time, the first voltage input pin Vin1 of the chip 300 is coupled to the first voltage output pin Vsys of the power management chip 410, the second voltage input pin Vin2 of the chip 300 is suspended, and the first pin SW1 and the second pin SW2 of the chip 300 are respectively connected to the two ends of the external inductor L. In this scenario, a low-power, high-efficiency BUCK circuit is used to meet the high energy efficiency requirements.

[0063] In such Fig. 9In some examples shown, the state value of the register 315 in the chip 300 is configured as a second state value (eg, "01"); or Fig.10 In some other examples shown, the state value of the register 315 in the chip 300 is configured as a fourth state value (e.g., "11"), and the power supply selection pin Sel of the chip 300 is grounded to GND through the pull-down resistor R2. At this time, the controller 314 controls the second power supply circuit 312 to work; that is, the second power supply circuit 312 is in the on mode, and controls the first power supply circuit 311 not to work; that is, the first power supply circuit 311 is in the off mode, and controls the switch circuit 313 to be disconnected.

[0064] As described above, the second power supply circuit 312 and the external inductor L form a BUCK circuit. In some embodiments, the controller 314 can output pulse width modulation (PWM) signals with different duty cycles. When the duty cycle of the PWM signal is not zero, the second power supply circuit 312 works. The larger the duty cycle of the PWM signal, the larger the output voltage of the BUCK circuit. The controller 314 can dynamically adjust the duty cycle of the PWM signal according to the output voltage of the BUCK circuit, thereby stabilizing the output voltage of the BUCK circuit. Fig.11 and Fig.12 As shown, in some scenarios, the power management chip 410 in the electronic device 100 (for example, a tablet or a personal computer, etc.) has excess high-efficiency power to provide to the chip 300. At this time, the third voltage input pin Vin3 of the chip 300 is coupled to the second voltage output pin Vpwr of the power management chip 410, the first voltage input pin Vin1 of the chip 300 is suspended, and the first pin SW1 and the second pin SW2 of the chip 300 are suspended. In this scenario, the power provided by the power management chip 410 is not converted, and there is no power conversion loss. It can meet the requirements of high energy efficiency competitiveness, and can save circuit peripheral devices (for example, external inductors), thereby achieving the comprehensive competitiveness improvement of optimal power efficiency and cost.

[0065] In such Fig.11 In some examples shown, the state value of the register 315 in the chip 300 is configured as a third state value (eg, "10"); or Fig.12In some other examples shown, the state value of the register 315 in the chip 300 is configured as a fourth state value (e.g., "11"), and the power supply selection pin Sel of the chip 300 is suspended. At this time, the controller 314 controls the first power supply circuit 311 to work; that is, the first power supply circuit 311 is in an off mode, and controls the second power supply circuit 312 not to work; that is, the second power supply circuit 312 is in an off mode, and controls the switch circuit 313 to be turned on.

[0066] In the embodiments of the present application, a power supply chip, a chip and an electronic device are provided. For different electronic devices 100, the embodiments of the present application can flexibly select to use the first power supply circuit 311, the second power supply circuit 312 or the switch circuit 313 to power the load 420 (or the on-chip load 320 in the chip 300) connected to the power supply output pin Vout in the electronic device 100, providing a rich selection of optional solutions for the design and implementation of various electronic devices 100.

[0067] In the several embodiments provided in the present application, it should be understood that the disclosed power supply chip, chip and electronic device can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the modules is only a logical function division. There may be other division methods in actual implementation, such as multiple modules or components can be combined or integrated into another device, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or modules, which can be electrical, mechanical or other forms.

[0068] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical modules, that is, they may be located in one device or distributed on multiple devices. Some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment.

[0069] In addition, each functional module in each embodiment of the present application may be integrated into one device, or each module may exist physically separately, or two or more modules may be integrated into one device.

[0070] In the above embodiments, all or part of the embodiments may be implemented by software, hardware, firmware or any combination thereof. When implemented by software programs, all or part of the embodiments may be implemented in the form of computer program products.

[0071] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A power supply chip, characterized in that: The power supply chip comprises a first voltage input pin, a second voltage input pin, a first pin, a second pin, a power supply output pin, a first power supply circuit and a second power supply circuit; wherein the first power supply circuit and the second power supply circuit are different power supply circuits; The input end of the first power supply circuit is coupled to the first voltage input pin, and the output end of the first power supply circuit is coupled to the power supply output pin; The input end of the second power supply circuit is coupled to the second voltage input pin, the output end of the second power supply circuit is coupled to the first pin, and the second pin is coupled to the power supply output pin; The first pin and the second pin are used to connect two ends of an external inductor respectively.

2. The power supply chip according to claim 1, characterized in that: The power supply chip further includes a switch circuit and a third voltage input pin, wherein the input end of the switch circuit is coupled to the third voltage input pin, and the output end of the switch circuit is coupled to the power supply output pin.

3. The power supply chip according to claim 2, characterized in that: The second voltage input pin and the first voltage input pin are the same pin of the power supply chip; The third voltage input pin and the second voltage input pin are different pins of the power supply chip.

4. The power supply chip according to claim 2 or 3, characterized in that: The power supply chip also includes a controller and a register, wherein the register is configured with a status value; The controller is configured to: In response to the state value being a first state value, controlling the first power supply circuit to operate; In response to the state value being a second state value, controlling the second power supply circuit to operate; In response to the state value being a third state value, the switch circuit is controlled to be turned on.

5. The power supply chip according to claim 4, characterized in that: The power supply chip further includes a power supply selection pin, the controller is coupled to the power supply selection pin, and the controller is further configured as follows: In response to the state value being a fourth state value, the operating states of the first power supply circuit, the second power supply circuit, and the switch circuit are controlled according to the potential of the power supply selection pin.

6. The power supply chip according to claim 5, characterized in that: The controller is configured to: When the potential of the power supply selection pin is high, controlling the first power supply circuit to operate; When the potential of the power supply selection pin is low, controlling the second power supply circuit to operate; When the potential of the power supply selection pin is suspended, the switch circuit is controlled to be turned on.

7. The power supply chip according to claim 4, characterized in that: The register is an electronic fuse register.

8. The power supply chip according to claim 1, characterized in that: When the first pin and the second pin are respectively connected to two ends of an external inductor, the second power supply circuit and the external inductor form a BUCK circuit.

9. The power supply chip according to claim 1, characterized in that: The first power supply circuit is a low voltage difference linear voltage regulator circuit.

10. The power supply chip according to claim 1, characterized in that: further comprising a diode, wherein an anode of the diode is coupled to the first power supply pin, and a cathode of the diode is coupled to an input terminal of the first power supply circuit; or, An anode of the diode is coupled to an output end of the first power supply circuit, and a cathode of the diode is coupled to the power supply output pin.

11. A chip, characterized in that: The chip comprises a first voltage input pin, a second voltage input pin, a first pin, a second pin, a first power supply circuit, a second power supply circuit and an on-chip load; wherein the first power supply circuit and the second power supply circuit are different power supply circuits; The input end of the first power supply circuit is coupled to the first voltage input pin, and the output end of the first power supply circuit is coupled to the on-chip power supply end of the chip; The input end of the second power supply circuit is coupled to the second voltage input pin, the output end of the second power supply circuit is coupled to the first pin, the second pin is coupled to the on-chip power supply end, and the on-chip power supply end is coupled to the on-chip load; The first pin and the second pin are used to connect two ends of an external inductor respectively.

12. The chip according to claim 11, characterized in that: The chip further includes a switch circuit and a third voltage input pin, wherein the input end of the switch circuit is coupled to the third voltage input pin, and the output end of the switch circuit is coupled to the on-chip power supply end.

13. An electronic device, characterized in that: It comprises a power management chip, a load and the power supply chip according to any one of claims 1 to 10, wherein the power supply chip is coupled to the power management chip and the load respectively.

14. An electronic device, characterized in that: It comprises a power management chip and the chip as claimed in claim 11 or 12, wherein the chip is coupled to the power management chip.

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