Bridge structure and electric energy converter

Abstract

The embodiment of the invention provides a bridge structure and an electric energy converter. The bridge structure comprises a first circuit board, a second circuit board, a plurality of transmission boards and a plurality of devices, the first circuit board and the second circuit board are oppositely arranged; the plurality of transmission plates are positioned between the first circuit board and the second circuit board and are electrically connected with the first circuit board and the second circuit board respectively; a hollow area for air flow to pass through is formed among the first circuit board, the second circuit board and the plurality of transmission plates; the plurality of devices comprise first-class devices and second-class devices, the heating value of the first-class devices is greater than or equal to a first threshold value, and the heating value of the second-class devices is smaller than the first threshold value; the first type of devices are distributed in the hollow area; and the second type of devices are distributed in the hollow area and / or other areas of the bridge structure, so that the bridge structure is simple in process, improved in safety, improved in reliability and improved in heat dissipation efficiency.

Description

Technical Field

[0001] The present disclosure relates to the field of power electronics technology, and in particular to a bridge structure and an electric energy converter. Background Art

[0002] In a structure where two printed circuit boards (PCBs) are stacked on each other (referred to as a board-on-board structure), the related technology often uses multiple metal pillars (e.g., copper pillars) to fix and support the two PCBs. However, the metal pillars can only play a supporting role, and other connection methods (e.g., flat cables and / or flying wires) are required to electrically connect the two PCBs, resulting in complex processes and other problems; further, the use of flat cables and / or flying wires can lead to poor safety, poor signal consistency, poor reliability and other problems. Summary of the invention

[0003] The embodiments of the present disclosure provide a bridge structure and an electric energy converter.

[0004] In a first aspect, an embodiment of the present disclosure provides a first circuit board, a second circuit board, a plurality of transmission boards, and a plurality of devices; the first circuit board and the second circuit board are placed opposite to each other; the plurality of transmission boards are located between the first circuit board and the second circuit board, and are electrically connected to the first circuit board and the second circuit board respectively; a hollow area for airflow to pass through is formed between the first circuit board, the second circuit board, and the plurality of transmission boards;

[0005] The multiple devices include a first type of devices and a second type of devices, the heat generated by the first type of devices is greater than or equal to a first threshold, and the heat generated by the second type of devices is less than the first threshold; the first type of devices are distributed in the hollow area; the second type of devices are distributed in the hollow area and / or the remaining area of ​​the bridge structure.

[0006] In some embodiments, within the hollow area, the first type of components and the second type of components are distributed on the upper surface of the first circuit board and / or the lower surface of the second circuit board.

[0007] In some embodiments, the bridge structure further includes a fan, and wind from the fan blows toward the hollow area;

[0008] When the first type of device includes multiple first sub-devices, the distance between the first sub-device and the fan is positively correlated with the heat generated by the first sub-device, and / or the distance between the first sub-device and the fan is positively correlated with the volume of the first sub-device.

[0009] In some embodiments, a plurality of air ducts for air flow are provided between the plurality of first sub-components; and wind from the fan is diverted along the plurality of air ducts to outer walls of the plurality of first sub-components.

[0010] In some embodiments, when only the first type of components are distributed in the hollow area, the volume of the hollow area has a positive correlation with the sum of the volumes of the plurality of first sub-components.

[0011] In some embodiments, the second circuit board includes a connection area and a non-connection area, and the projection of the connection area covers the area where the plurality of transmission boards contact the second circuit board; when the second type of device includes a plurality of second sub-devices, on the second circuit board:

[0012] The second sub-components having a weight greater than or equal to a second threshold are distributed in the connection area, and the second sub-components having a weight less than the second threshold are distributed in the non-connection area.

[0013] In some embodiments, the lengths of the plurality of transmission plates along the wind direction are positively correlated with the number of the second sub-components distributed in the connection area.

[0014] In some embodiments, the plurality of devices further include connector-type devices, and the connector-type devices are distributed in areas where the plurality of transmission boards contact the first circuit board and / or the second circuit board.

[0015] In some embodiments, the connector type device includes a first type of connector and a second type of connector;

[0016] The plurality of transmission boards are electrically connected to the first circuit board via the first type of connectors, and the plurality of transmission boards are electrically connected to the second circuit board via the second type of connectors.

[0017] In some embodiments, when the volume of the second sub-component is greater than or equal to a third threshold, the second sub-component is distributed in the hollow area and / or on the second circuit board.

[0018] In some embodiments, the distance between the first sub-component having a volume greater than or equal to the third threshold and the fan is greater than the distance between the first sub-component having a volume less than the third threshold and the fan.

[0019] In some embodiments, the plurality of devices further include a transmission device, the transmission device is electrically connected to the remaining devices in the bridge structure, and / or the transmission device is electrically connected to a device outside the bridge structure;

[0020] When the transmission components are electrically connected to components outside the bridge structure, the transmission components are distributed on the multiple transmission boards.

[0021] In some embodiments, the transmission components are located between the height of the corresponding transmission plate and the height of the components outside the bridge structure to meet a preset range.

[0022] In some embodiments, the bridge structure further includes a signal line, and the plurality of transmission boards utilize the signal line to transmit signals.

[0023] In a second aspect, an embodiment of the present disclosure provides an electric energy converter, the electric energy converter comprising a bridge structure as described in any one of the first aspects;

[0024] The power converter is used at least to convert direct current power into alternating current power, or to convert alternating current power into direct current power.

[0025] The disclosed embodiment provides a bridge structure and an electric energy converter, wherein the bridge structure includes a first circuit board, a second circuit board, a plurality of transmission plates and a plurality of devices; the first circuit board and the second circuit board are placed opposite to each other; the plurality of transmission plates are located between the first circuit board and the second circuit board, and are electrically connected to the first circuit board and the second circuit board respectively; a hollow area for airflow to pass through is formed between the first circuit board, the second circuit board and the plurality of transmission plates; the plurality of devices include first-type devices and second-type devices, the heat generation of the first-type devices is greater than or equal to a first threshold value, and the heat generation of the second-type devices is less than the first threshold value; the first-type devices are distributed in the hollow area; the second-type devices are distributed in the hollow area and / or the rest of the bridge structure. In this way, the first circuit board and the second circuit board can be supported and electrically connected by the plurality of transmission plates, so that the process is simple, the safety is improved, and the reliability is improved; in addition, the first-type devices with a larger heat generation can be arranged in the hollow area to improve the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of a three-dimensional structure of a semiconductor structure;

[0027] Figure 2 A three-dimensional structure diagram of a bridge structure provided in an embodiment of the present disclosure Figure 1 ;

[0028] Figure 3 A three-dimensional structure diagram of a bridge structure provided in an embodiment of the present disclosure Figure 2 ;

[0029] Figure 4 A three-dimensional structure diagram of a bridge structure provided in an embodiment of the present disclosure Figure 3 ;

[0030] Figure 5 A schematic diagram of the structure of a bridge structure provided in an embodiment of the present disclosure;

[0031] Figure 6 A schematic diagram of the three-dimensional structure of a plug-in device provided in an embodiment of the present disclosure;

[0032] Figure 7 A schematic diagram of the composition structure of an electric energy converter provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. It is understood that the specific embodiments described herein are only used to explain the relevant applications, rather than to limit the present disclosure. It should also be noted that, for the convenience of description, only the parts related to the relevant applications are shown in the drawings.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present disclosure belongs. The terms used herein are only for the purpose of describing the embodiments of the present disclosure and are not intended to limit the present disclosure.

[0035] In the following description, reference is made to “some embodiments”, which describe a subset of all possible embodiments, but it will be understood that “some embodiments” may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.

[0036] It should be pointed out that the terms "first\second\third" involved in the embodiments of the present disclosure are merely used to distinguish similar objects and do not represent a specific ordering of the objects. It can be understood that "first\second\third" can be interchanged in a specific order or sequence where permitted, so that the embodiments of the present disclosure described here can be implemented in an order other than that illustrated or described here.

[0037] In the related art, two PCB boards placed opposite to each other are often supported by multiple metal columns. Figure 1 , which provides a schematic diagram of the three-dimensional structure of a semiconductor structure. Figure 1 As shown, the semiconductor structure 10 includes a first circuit board 11, a second circuit board 12, and a plurality of metal pillars 13 ( Figure 1 Only one reference numeral 13) and a plurality of wiring terminals 14 ( Figure 1Only one reference numeral 14 is shown in the figure); the first circuit board 11 and the second circuit board 12 are placed opposite to each other along a first direction, and the first direction is perpendicular to the plane where the first circuit board 11 and / or the second circuit board 12 are located; a plurality of metal pillars 13 are located between the first circuit board 11 and the second circuit board 12; a plurality of wiring terminals 14 are respectively located on the first circuit board 11 and the second circuit board 12.

[0038] For example, Figure 1 The circuit board 12 includes four metal pillars 13, which are located around the second circuit board 12, but the number and position of the metal pillars 13 are not specifically limited. Specifically, the metal pillars 13 can be copper pillars, which are not specifically limited.

[0039] For example, Figure 1 The wiring terminal 14 includes four wiring terminals 14, two of which are located on the first circuit board 11, and two of which are located on the second circuit board 12, but the number and position of the wiring terminals 14 are not specifically limited. In addition, the wiring terminals 14 located on the first circuit board 11 and the wiring terminals 14 located on the second circuit board 12 are connected by wiring to electrically connect the first circuit board 11 and the second circuit board 12.

[0040] It should be noted that Figure 1 The wiring terminal 14 is used as an example, but the first circuit board 11 and the second circuit board 12 can also be electrically connected through flying wires, which is not specifically limited.

[0041] It should also be noted that although Figure 1 Although not shown in the figure, components may also be arranged on the first circuit board 11 and the second circuit board 12 according to actual needs.

[0042] In summary, along the first direction, the upper PCB board (i.e., the second circuit board 12) is fixed to the lower PCB board (i.e., the first circuit board 11) by the metal column 13, and the metal column 13 can only play a supporting role, and cannot play an electrical connection role. In the related art, it is necessary to use other connection methods (for example, flat cables and / or flying wires) to electrically connect the two PCB boards, which leads to problems such as complex processes; further, the use of flat cables and / or flying wires will lead to problems such as failure to meet safety regulations, poor safety, poor signal consistency, interference with other devices, and poor reliability.

[0043] Based on this, the embodiment of the present disclosure provides a bridge structure, which includes a first circuit board, a second circuit board, a plurality of transmission plates and a plurality of devices; the first circuit board and the second circuit board are placed opposite to each other; the plurality of transmission plates are located between the first circuit board and the second circuit board, and are electrically connected to the first circuit board and the second circuit board respectively; a hollow area for airflow to pass through is formed between the first circuit board, the second circuit board and the plurality of transmission plates; the plurality of devices include a first type of device and a second type of device, the heat generation of the first type of device is greater than or equal to a first threshold value, and the heat generation of the second type of device is less than the first threshold value; the first type of device is distributed in the hollow area; the second type of device is distributed in the hollow area and / or the rest of the bridge structure. In this way, the first circuit board and the second circuit board can be supported and electrically connected by the plurality of transmission plates, so that the process is simple, the safety is improved, and the reliability is improved; in addition, the first type of device with a larger heat generation can be arranged in the hollow area to improve the heat dissipation efficiency.

[0044] The embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.

[0045] In one embodiment of the present disclosure, see Figure 2 , which shows a three-dimensional structure diagram of a bridge structure provided by an embodiment of the present disclosure Figure 1 .like Figure 2 As shown, the bridge structure 20 includes a first circuit board 21, a second circuit board 22, and a plurality of transmission boards 23 ( Figure 2 Only one reference numeral 23 is shown in the figure) and a plurality of devices 24 (reference numerals are not shown in the figure); a first circuit board 21 and a second circuit board 22 are placed opposite to each other; a plurality of transmission boards 23 are located between the first circuit board 21 and the second circuit board 22, and are electrically connected to the first circuit board 21 and the second circuit board 22, respectively; a hollow area 25 for airflow to pass through is formed between the first circuit board 21, the second circuit board 22 and the plurality of transmission boards 23;

[0046] The plurality of devices 24 include a first type of device 241 and a second type of device 242 ( Figure 2 Only one label 241, 242 is shown in the figure, the heat generated by the first type of device 241 is greater than or equal to the first threshold, and the heat generated by the second type of device 242 is less than the first threshold; the first type of device 241 is distributed in the hollow area 25; the second type of device 242 is distributed in the hollow area 25 and / or the remaining area of ​​the bridge structure 20.

[0047] like Figure 2As shown, the first circuit board 21 and the second circuit board 22 are placed opposite to each other along a first direction, and the first direction is perpendicular to the plane where the first circuit board 21 and / or the second circuit board 22 are located, that is, along the first direction, the second circuit board 22 is located above the first circuit board 21. On the surface of the first circuit board 21 or the second circuit board 22, two directions intersecting with each other (for example, perpendicular to each other) are defined, namely, the second direction and the third direction.

[0048] It should be noted that the first circuit board 21, the second circuit board 22 and the plurality of transmission boards 23 are all PCB boards, and the transmission board 23 can also be called a bridge board. In this embodiment, the sizes of the first circuit board 21, the second circuit board 22 and the plurality of transmission boards 23, and the positions where the plurality of transmission boards 23 are electrically connected to the first circuit board 21 and the second circuit board 22 are not specifically limited. For example, Figure 2 In the description, it is assumed that the size of the second circuit board 22 is smaller than that of the first circuit board 21, and the two transmission boards 23 are electrically connected at the edge position of the second circuit board 22 along the third direction.

[0049] It should also be noted that if the bridge structure 20 includes two transmission plates 23, a hollow area 25 can be formed between the first circuit board 21, the second circuit board 22 and the two transmission plates 23; if the bridge structure 20 includes three transmission plates 23, two hollow areas 25 can be formed between the first circuit board 21, the second circuit board 22 and the three transmission plates 23. This embodiment does not specifically limit the number of transmission plates 23. Exemplarily, the specific implementation of the embodiment of the present disclosure is described in detail by taking the bridge structure 20 including two transmission plates 23 and one hollow area 25 as an example.

[0050] It should also be noted that the devices 24 can be distributed on the first circuit board 21, and / or the second circuit board 22, and / or the plurality of transmission boards 23, and are electrically connected to the corresponding circuit boards respectively. Figure 2 In the embodiment, the devices 24 of different shapes can represent different devices, and the type of the device is not specifically limited in this embodiment. In addition, compared with the related art, the type and quantity of the devices are not changed, but based on the bridge structure 20 disclosed in the present invention, the devices 24 are re-arranged according to the device properties; that is, the devices 24 on the transmission plate 23 are Figure 1 The components on the first circuit board 11 and / or the second circuit board 12. Here, the component attributes are at least one or more of the following: heat generation, weight, volume, component type, and connection type.

[0051] In this embodiment, the first threshold value can be set according to actual needs, so that the device 24 with a larger heat generation (i.e., the first type device 241) is placed in the hollow area 25, and the device 24 with a smaller heat generation (i.e., the second type device 242) is placed in the hollow area 25 and / or the remaining area of ​​the bridge structure 20. The value of the first threshold value is not specifically limited. In other words, the first type device 241 with a larger heat generation needs to be placed in the hollow area 25 to improve the heat dissipation efficiency; and the second type device 242 with a smaller heat generation can be placed in the hollow area 25 and / or the remaining area of ​​the bridge structure 20 according to actual needs. For example, the specific implementation of the embodiment of the present disclosure is described in detail by taking the second type device 242 placed in the remaining area of ​​the bridge structure 20 (e.g., on the second circuit board 22) as an example. In addition, the first type device 241 with a larger heat generation may include capacitors, inductors, switching devices, etc.

[0052] In summary, see Figure 1 In the related art, no area for airflow to pass through can be formed between the dispersedly arranged plurality of metal pillars 13 and the first circuit board 11 and the second circuit board 12, and the metal pillars 13 cannot play an electrical connection role.

[0053] In contrast, see Figure 2 , the first circuit board 21 and the second circuit board 22 can be supported and electrically connected by multiple transmission boards 23, reducing the problems of not meeting safety regulations, poor signal consistency, interference with other devices caused by wiring and / or flying wires in the related technology, so that the process is simple, the safety is improved, and the reliability is improved; secondly, with the help of the board surface of the multiple transmission boards 23, a hollow area 25 for air flow to pass through is formed between the first circuit board 21, the second circuit board 22 and the multiple transmission boards 23, and an air duct is constructed, and the first type of device 241 with a larger heat generation is arranged in the hollow area 25 to improve the heat dissipation efficiency; in addition, compared with the related technology, the bridge structure 20 increases the board surface of the multiple transmission boards 23, and can also improve the power density.

[0054] In some embodiments, Figure 3 As shown, in the hollow area 25 , the first type of components 241 and the second type of components 242 are distributed on the upper surface of the first circuit board 21 and / or the lower surface of the second circuit board 22 .

[0055] It should be noted that, in this embodiment, the components distributed on the upper surface of the circuit board means distributed on the circuit board, and the components are electrically connected to the circuit board.

[0056] It should also be noted that the first circuit board 21 and the second circuit board 22 are placed opposite to each other along the first direction. Specifically, the upper surface of the first circuit board 21 and the lower surface of the second circuit board 22 are placed opposite to each other.

[0057] It should also be noted that if the second type of components 242 are distributed in the hollow area 25, the second type of components 242 may be distributed on the upper surface of the first circuit board 21 and / or the lower surface of the second circuit board 22. Figure 3 As shown, illustratively, only the first type of device 241 is distributed in the hollow area 25 and in the hollow area 25, the first type of device 241 is distributed on the lower surface of the second circuit board 22, and the first type of device 241 can be hung upside down on the lower surface of the second circuit board 22 by a hook (as shown in the dotted box), or the first type of device 241 can be placed on the lower surface of the second circuit board 22 in the hollow area 25 by other methods, which is not specifically limited. Exemplarily, the specific implementation of the embodiment of the present disclosure is described in detail by taking the first type of device 241 distributed in the hollow area 25 and located on the first circuit board 21 as an example.

[0058] In some embodiments, Figure 2 As shown, the bridge structure 20 may further include a fan 26 (not shown in the figure), and wind from the fan 26 blows toward the hollow area 25;

[0059] When the first type device 241 includes multiple first sub-devices, the distance between the first sub-device and the fan 26 has a positive correlation with the heat generation of the first sub-device, and / or the distance between the first sub-device and the fan 26 has a positive correlation with the volume of the first sub-device.

[0060] Specifically, the wind from the fan 26 blows toward the hollow area 25 along the second direction, that is, the wind direction is the second direction.

[0061] Here, the distance between the first sub-component with a larger heat generation and the fan 26 is greater than the distance between the first sub-component with a smaller heat generation and the fan 26, so that the wind blown by the fan 26 to the first sub-component farther away from the fan 26 will not be overheated and will not affect the heat dissipation efficiency; the distance between the first sub-component with a larger volume and the fan 26 is greater than the distance between the first sub-component with a smaller volume and the fan 26, so that the first sub-component with a larger volume will not block the passage of wind in the hollow area 25 and will not affect the heat dissipation efficiency.

[0062] It should be noted that, when the cross-sectional areas of the first sub-components are equal, the volume of the first sub-component is positively correlated with the height of the first sub-component, that is, the distance between the first sub-component and the fan 26 is positively correlated with the height of the first sub-component, and a shorter first sub-component is closer to the fan 26 than a relatively taller first sub-component.

[0063] It should also be noted that the bridge structure 20 may include one fan 26 or multiple fans 26, and the wind from the fan 26 may blow toward the first type of device 241 in the hollow area 25 and / or the blank area without device obstruction, without specific limitation. Here, the fan 26 may be a turbulent fan, but without specific limitation. A turbulent fan is a technology that uses resistance and disturbance to improve gas transportation efficiency and energy saving. Its main principle is to change the gas flow field properties so that the gas maintains a high speed during transportation and recovers energy as much as possible after the gas is sent out by the fan. The working principle of a turbulent fan is to install various forms of disturbance structures such as baffles, honeycomb fillers or spiral bodies inside the fan, which can prevent gas flow and change the flow field characteristics, thereby improving work efficiency.

[0064] Furthermore, in some embodiments, Figure 2 As shown, there are multiple air ducts for air flow between the multiple first sub-components; the wind from the fan 26 is diverted along the multiple air ducts to the outer walls of the multiple first sub-components.

[0065] like Figure 2 As shown, arrows are used to indicate air ducts for air flow to pass through. When the wind from the fan 26 is diverted along multiple air ducts to the outer walls of multiple first sub-components, the heat of the first type of components 241 can be taken away, thereby improving the heat dissipation efficiency.

[0066] In some embodiments, when only the first type devices 241 are distributed in the hollow region 25 , the volume of the hollow region 25 has a positive correlation with the sum of the volumes of the plurality of first sub-devices.

[0067] That is to say, when the sum of the volumes of all the first sub-components included in the first type device 241 is small, the volume of the hollow area 25 can be reduced by adjusting the positions at which the multiple transmission plates 23 are electrically connected to the first circuit board 21 and the second circuit board 22; when the sum of the volumes of all the first sub-components included in the first type device 241 is large, the volume of the hollow area 25 can be increased.

[0068] based on Figure 2 The bridge structure 20 shown in FIG. Figure 4 As shown, by adjusting the positions at which the plurality of transmission plates 23 are electrically connected to the first circuit board 21 and the second circuit board 22, the two transmission plates 23 are brought closer to each other along the third direction, so that the volume of the hollow area 25 is reduced.

[0069] In some embodiments, when the first type devices 241 and the second type devices 242 are distributed in the hollow area 25 , the volume of the hollow area 25 is positively correlated with the sum of the volumes of the first type devices 241 and the second type devices 242 .

[0070] In the case where the second-type device 242 includes multiple second sub-devices, when the sum of the volumes of all first sub-devices included in the first-type device 241 and all second sub-devices included in the second-type device 242 is small, the volume of the hollow area 25 can be reduced; when the sum of the volumes of all first sub-devices included in the first-type device 241 and all second sub-devices included in the second-type device 242 is large, the volume of the hollow area 25 can be increased.

[0071] It should be noted that the first circuit board 21 is located at the lower part of the bridge structure 20 and has good load-bearing capacity. When the first type of device 241 is heavy, placing it on the first circuit board 21 can improve the stability of the bridge structure 20.

[0072] In addition, for the convenience of illustration, Figures 2 to 4 The first circuit board 21, the second circuit board 22 and the plurality of transmission boards 23 are adaptively filled. Please understand this in conjunction with the text description.

[0073] In some embodiments, see Figure 5 , which shows a schematic diagram of the structure of a bridge structure provided by an embodiment of the present disclosure, specifically a top view along a first direction. Figure 5 As shown, the second circuit board 22 may include a connection area 221 and a non-connection area 222 (the reference numerals are not shown in the figure), and the projection of the connection area 221 covers the area where the plurality of transmission boards 23 contact the second circuit board 22; when the second type of device 242 includes a plurality of second sub-devices, on the second circuit board 22:

[0074] The second sub-components with a weight greater than or equal to the second threshold are distributed in the connection area 221 , and the second sub-components with a weight less than the second threshold are distributed in the non-connection area 222 .

[0075] In this embodiment, the second threshold can be set according to actual needs to place the second sub-component with heavier weight in the connection area 221 and the second sub-component with lighter weight in the non-connection area 222, and the value of the second threshold is not specifically limited.

[0076] It should be noted that the size of the connection area 221 is larger than the size of the area where the plurality of transmission plates 23 contact the second circuit board 22, and the difference between the sizes of the two areas can be set according to actual needs, for example, according to the number and volume of the placed second sub-devices, etc. That is to say, the size of the connection area 221 can be set according to actual needs. Figure 5 The size of the connection area 221 in the figure is only an example. In addition, on the second circuit board 22, except for the connection area 221, the remaining area is a non-connection area 222.

[0077] It should also be noted that because the projection of the connection area 221 covers the area where multiple transmission plates 23 contact the second circuit board 22, the load-bearing capacity of the connection area 221 is better than that of the non-connection area 222. Therefore, the second sub-component with lower heat generation and heavier weight is placed in the connection area 221 of the second circuit board 22, and the second sub-component with lower heat generation and lighter weight is placed in the non-connection area 222 of the second circuit board 22, such as the middle area of ​​the second circuit board 22, thereby improving the stability of the bridge structure 20.

[0078] Furthermore, the layout of the entire bridge structure 20 and the positional relationship of the fan 26 can be optimized so that the transmission plate 23 has a longer dimension along the wind direction, so that the connection area 221 of the second circuit board 22 can support more second sub-components with a weight greater than or equal to the second threshold.

[0079] In some embodiments, the length of the plurality of transmission plates 23 along the wind direction has a positive correlation with the number of second sub-components distributed in the connection area 221 .

[0080] That is, when the number of second sub-devices to be placed in the connection area 221 is large, the length of the transmission plate 23 along the wind direction can be increased; when the number of second sub-devices to be placed in the connection area 221 is small, the length of the transmission plate 23 along the wind direction can also be small. For example, Figure 5 The length of the transmission plate 23 along the wind direction is greater than Figure 2 The length of the transmission plate 23 along the wind direction.

[0081] It should be noted that when the quantity requirement of the second sub-components in the connection area 221 and the stability requirement of the bridge structure 20 are met, the lengths of multiple transmission plates 23 along the wind direction can be adjusted synchronously, or only part of the transmission plates 23 can be adjusted, and there is no specific limitation on this.

[0082] In some embodiments, Figure 2 As shown, the plurality of devices 24 further include connector-type devices 243 (labels not shown in the figure), and the connector-type devices 243 are distributed in the area where the plurality of transmission boards 23 contact the first circuit board 21 and / or the second circuit board 22 .

[0083] For example, Figure 2 Only the plug-in type components 243 around one of the transmission boards 23 are shown in the figure, but each transmission board 23 has the plug-in type components 243 around it.

[0084] It should be noted that the projections of the areas where the multiple transmission boards 23 contact the second circuit board 22 and the areas where the multiple transmission boards 23 contact the first circuit board 21 along the first direction overlap, and because the projection of the connection area 221 of the second circuit board 22 covers the areas where the multiple transmission boards 23 contact the second circuit board 22, when the heavier second sub-component is placed in the connection area 221, the weight of the second sub-component can make the connection between the plug-in component 243 and the first circuit board 21, the second circuit board 22 and the multiple transmission boards 23 more firmly. In other words, the plug-in component 243 can not only fix each PCB board, but also improve the stability of the bridge structure 20.

[0085] Furthermore, in some embodiments, Figure 2 As shown, the connector type device 243 includes a first type connector 2431 and a second type connector 2432;

[0086] The plurality of transmission boards 23 are electrically connected to the first circuit board 21 via the first type connector 2431 , and the plurality of transmission boards 23 are electrically connected to the second circuit board 22 via the second type connector 2432 .

[0087] It should be noted that the first type connectors 2431 are distributed in the area where the plurality of transmission boards 23 contact the first circuit board 21, and the second type connectors 2432 are distributed in the area where the plurality of transmission boards 23 contact the second circuit board 22. Through the first type connectors 2431 and the second type connectors 2432, the entire bridge structure 20 can be electrically connected.

[0088] Here, the first type connector 2431 and the second type connector 2432 have the same structure.

[0089] See also Figure 6 , which shows a three-dimensional structural diagram of a plug-in device provided by an embodiment of the present disclosure. Figure 6 As shown, the pin terminals of the connector device 243 are distributed at 90 degrees, and the two parts of the terminals are respectively inserted into the transmission board 23 and the first circuit board 21 or the second circuit board 22. The PCB board into which the two parts of the terminals are inserted can be selected according to actual needs. For example, the longer part of the terminal can be inserted into the first circuit board 21 or the second circuit board 22, and the shorter part of the terminal can be inserted into the transmission board 23, so as to play a role in strength support and improve the stability of the bridge structure 20.

[0090] In some embodiments, the first type connector 2431 can be welded to the first circuit board 21 and the corresponding transmission board 23 using a welding process. In this way, the first circuit board 21 located at the bottom adopts a welding process, making it safer and more secure, thereby Figure 1 By using the relevant technologies in the field, the failure points caused by contact are reduced by half, and the reliability of the bridge structure is improved by 20%.

[0091] In other embodiments, the first type connector 2431 can be welded on the first circuit board 21 and the corresponding transmission board 23 by welding process, and the second type connector 2432 can be welded on the second circuit board 22 and the corresponding transmission board 23, so that Figure 1 With the related technologies in the invention, there are almost no failure points caused by contact, which further improves the reliability of the bridge structure 20.

[0092] In some embodiments, when the volume of the second sub-component is greater than or equal to the third threshold, the second sub-component is distributed in the hollow area 25 and / or on the second circuit board 22 .

[0093] In this embodiment, the third threshold value may be set according to actual needs to place the second sub-component with a larger volume in the hollow area 25 and / or on the second circuit board 22, and the value of the third threshold value is not specifically limited.

[0094] Specifically, in one possibility, when the volume of the second sub-component is greater than or equal to the third threshold, the second sub-component may be distributed on the second circuit board 22 .

[0095] It should be noted that, by placing the second sub-component with a volume greater than or equal to the third threshold on the second circuit board 22, the area of ​​the first circuit board 21 constituting the hollow area 25 can be preferentially enlarged to increase the volume of the hollow area 25 when the area of ​​the first circuit board 21 is the same, so that more first sub-components can be placed in the hollow area 25. In other words, placing the second sub-component with a smaller heat generation (i.e., heat generation less than the first threshold) and a larger volume (i.e., a volume greater than or equal to the third threshold) on the second circuit board 22 can not affect the use of the hollow area 25, so that the overall heat dissipation efficiency is improved.

[0096] In another possibility, when the volume of the second sub-component is greater than or equal to the third threshold, the second sub-component may be distributed in the hollow area 25 .

[0097] It should be noted that when the number of first sub-components that need to dissipate heat is small and there is extra space in the hollow area 25, a second sub-component with a larger volume (i.e., a volume greater than or equal to the third threshold) can be placed in the hollow area 25 to make the layout of the bridge structure 20 more compact.

[0098] In another possibility, when the volume of the second sub-component is greater than or equal to the third threshold, the second sub-component may be distributed in the hollow area 25 and on the second circuit board 22 , which is not specifically limited.

[0099] It should be noted that the second sub-component with a smaller volume (i.e., a volume smaller than the third threshold) is preferentially placed on the second circuit board 22 and the remaining area of ​​the first circuit board 21 except the hollow area 25, but can also be placed in the hollow area 25 according to actual needs, and there is no specific limitation on this.

[0100] The distance between the first sub-component and the fan 26 has a positive correlation with the volume of the first sub-component. Specifically, in some embodiments, the distance between the first sub-component whose volume is greater than or equal to the third threshold and the fan 26 is greater than the distance between the first sub-component whose volume is less than the third threshold and the fan 26.

[0101] That is, the first sub-component with a smaller volume is closer to the fan 26 than the first sub-component with a larger volume.

[0102] In some embodiments, Figure 2 As shown, the multiple devices 24 may further include a transmission device 244 (only one reference numeral 244 is shown in the figure), the transmission device 244 is electrically connected to the remaining devices in the bridge structure 20, and / or the transmission device 244 is electrically connected to the devices outside the bridge structure 20;

[0103] When the transmission components 244 are electrically connected to components outside the bridge structure 20 , the transmission components 244 are distributed on a plurality of transmission boards 23 .

[0104] It should be noted that there is no specific limitation on the type of the transmission device 244 , and it can be set according to actual needs. Exemplarily, the transmission device 244 is a network port terminal, which needs to be electrically connected to a device outside the bridge structure 20 .

[0105] In the related art, transmission components are generally placed on the lower circuit board (first circuit board 11), and the connection points of the external components that need to be electrically connected are higher, so switching processing is required. In this embodiment, when the transmission component 244 needs to be electrically connected to the components outside the bridge structure 20, it is placed on the transmission board 23 arranged along the first direction, and the height of the transmission component 244 can be adjusted according to the height of the components outside the bridge structure 20, so that switching processing is not required.

[0106] Furthermore, in some embodiments, the transmission components 244 are located between the height of the corresponding transmission plate 23 and the height of the components outside the bridge structure 20 to meet a preset range.

[0107] That is to say, the required height of the transmission device 244 for external wiring can be adapted by adjusting the height of the transmission device 244 on the transmission board 23 .

[0108] It should be noted that the preset range can be 0, that is, the height of the transmission device 244 located on the corresponding transmission plate 23 is consistent with the height of the device outside the bridge structure 20. It can also be set according to actual needs. As long as the transmission device 244 and the device outside the bridge structure 20 can be directly electrically connected, there is no specific limitation on this.

[0109] In some embodiments, the bridge structure 20 may further include signal lines, and the plurality of transmission boards 23 transmit signals using the signal lines.

[0110] It should be noted that the signal line can be processed accordingly so that the relevant signal can be isolated, shielded, current-carrying, etc. Exemplarily, a shielding layer is wrapped around the outside of the signal line to shield the transmitted signal.

[0111] In some embodiments, the bridge structure 20 may further include a plurality of metal columns, and the plurality of metal columns are located between the first circuit board 21 and the second circuit board 22 .

[0112] It should be noted that when the board surface area of ​​the first circuit board 21 and the second circuit board 22 is relatively large, and multiple transmission boards 23 are electrically connected at the edge position of the second circuit board 22 along the third direction, a metal column can be placed in the middle area of ​​the second circuit board 22 to further increase the strength and stability of the bridge structure 20, and the number and position of the metal column are not specifically limited. Specifically, the metal column can be a copper column, but this is not specifically limited either.

[0113] In summary, the present disclosure provides a bridge structure 20, compared to Figure 1 The semiconductor structure 10 and the bridge structure 20 shown can construct an air duct, increase the board surface (i.e., the board surface of multiple transmission boards 23), improve the power density, and reduce the problems of not meeting safety regulations, poor signal consistency, and interference with other devices caused by flying wires. The specific description is as follows:

[0114] (1) In the plate-on-plate structure, a bridge plate (i.e., transmission plate 23) is used for signal connection and support, and copper columns can be further used for auxiliary support, replacing Figure 1 The copper column support and cable connection solutions in the related technology optimize the process design and PCB board design, and have a strong sense of craftsmanship.

[0115] (2) From the process point of view, the PCB board (i.e., the transmission board 23) in the present disclosure is used instead of Figure 1The cable arrangement in the related art can reduce the preparation process of the cable arrangement and improve reliability; and can flexibly adapt the number of connecting wires in the bridge structure 20; in addition, since the first type of connector 2431 can be welded to the lower first circuit board 21 and the corresponding transmission board 23 using a welding process, the failure points caused by contact are reduced by half.

[0116] (3) From the perspective of the line, the transmission board 23 is used as a connector to ensure the consistency of the line batch; and the relevant signals can be isolated, shielded, and current-carrying.

[0117] (4) From the perspective of PCB board design, adding a bridge board to the bridge structure 20 is equivalent to increasing the area of ​​the PCB board, thereby reducing the area of ​​other boards (i.e., the first circuit board 21 and the second circuit board 22), which is beneficial to reducing the size of the chassis using the bridge structure 20 and facilitating design.

[0118] (5) The hollow area 25 can be constructed by the bridge plate.

[0119] In another embodiment of the present disclosure, see Figure 7 , which shows a schematic diagram of the structure of an electric energy converter provided by an embodiment of the present disclosure. Figure 7 As shown, the electric energy converter 30 includes the aforementioned bridge structure 20;

[0120] The power converter 30 is at least used to convert DC power into AC power, or to convert AC power into DC power.

[0121] It should be noted that the power converter 30 may include an inverter, a converter and a rectifier. Among them, the inverter can convert DC power into AC power; the rectifier can convert AC power into DC power; the converter can convert fixed-frequency AC power into adjustable-frequency AC power, and can also convert DC power into AC power.

[0122] The electric energy converter 30 , because it includes the aforementioned bridge structure 20 , has at least the same advantages as the bridge structure 20 , which can simplify the process, improve safety, improve reliability, and improve heat dissipation efficiency.

[0123] Details not disclosed in the embodiments of the present disclosure may be understood by referring to the description of the aforementioned embodiments.

[0124] The above description is only a preferred embodiment of the present disclosure and is not intended to limit the protection scope of the present disclosure.

[0125] It should be noted that in the present disclosure, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0126] The serial numbers of the above-mentioned embodiments of the present disclosure are only for description and do not represent the advantages or disadvantages of the embodiments.

[0127] The methods disclosed in several method embodiments provided in the present disclosure can be arbitrarily combined without conflict to obtain new method embodiments.

[0128] The features disclosed in several product embodiments provided in the present disclosure can be arbitrarily combined without conflict to obtain new product embodiments.

[0129] The features disclosed in several method or device embodiments provided in the present disclosure may be arbitrarily combined without conflict to obtain new method embodiments or device embodiments.

[0130] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A bridge structure, characterized in that: The bridge structure includes a first circuit board, a second circuit board, a plurality of transmission boards and a plurality of devices; the first circuit board and the second circuit board are placed opposite to each other; the plurality of transmission boards are located between the first circuit board and the second circuit board, and are electrically connected to the first circuit board and the second circuit board respectively; a hollow area for airflow to pass through is formed between the first circuit board, the second circuit board and the plurality of transmission boards; The multiple devices include a first type of devices and a second type of devices, the heat generated by the first type of devices is greater than or equal to a first threshold, and the heat generated by the second type of devices is less than the first threshold; the first type of devices are distributed in the hollow area; the second type of devices are distributed in the hollow area and / or the remaining area of ​​the bridge structure.

2. The bridge structure according to claim 1, characterized in that: In the hollow area, the first type of components and the second type of components are distributed on the upper surface of the first circuit board and / or the lower surface of the second circuit board.

3. The bridge structure according to claim 1, characterized in that: The bridge structure also includes a fan, and wind from the fan blows toward the hollow area; When the first type of device includes multiple first sub-devices, the distance between the first sub-device and the fan is positively correlated with the heat generated by the first sub-device, and / or the distance between the first sub-device and the fan is positively correlated with the volume of the first sub-device.

4. The bridge structure according to claim 3, characterized in that: A plurality of air ducts for air flow are provided between the plurality of first sub-components; wind from the fan is diverted along the plurality of air ducts to the outer walls of the plurality of first sub-components.

5. The bridge structure according to claim 3, characterized in that: In the case where only the first-type components are distributed in the hollow region, the volume of the hollow region has a positive correlation with the sum of the volumes of the plurality of first sub-components.

6. The bridge structure according to claim 3, characterized in that: The second circuit board includes a connection area and a non-connection area, and the projection of the connection area covers the area where the plurality of transmission boards contact the second circuit board; in the case where the second type of device includes a plurality of second sub-devices, on the second circuit board: The second sub-components having a weight greater than or equal to a second threshold are distributed in the connection area, and the second sub-components having a weight less than the second threshold are distributed in the non-connection area.

7. The bridge structure according to claim 6, characterized in that: The lengths of the plurality of transmission plates along the wind direction are positively correlated with the number of the second sub-components distributed in the connection area.

8. The bridge structure according to claim 6, characterized in that: The plurality of devices further include connector-type devices, and the connector-type devices are distributed in areas where the plurality of transmission boards contact the first circuit board and / or the second circuit board.

9. The bridge structure according to claim 8, characterized in that: The connector type devices include a first type of connector and a second type of connector; The plurality of transmission boards are electrically connected to the first circuit board via the first type of connectors, and the plurality of transmission boards are electrically connected to the second circuit board via the second type of connectors.

10. The bridge structure according to claim 6, characterized in that: When the volume of the second sub-component is greater than or equal to a third threshold, the second sub-component is distributed in the hollow area and / or on the second circuit board.

11. The bridge structure according to claim 10, characterized in that: The distance between the first sub-component having a volume greater than or equal to the third threshold and the fan is greater than the distance between the first sub-component having a volume less than the third threshold and the fan.

12. The bridge structure according to claim 1, characterized in that: The plurality of devices further include transmission devices, the transmission devices are electrically connected to the remaining devices in the bridge structure, and / or the transmission devices are electrically connected to devices outside the bridge structure; When the transmission components are electrically connected to components outside the bridge structure, the transmission components are distributed on the multiple transmission boards.

13. The bridge structure according to claim 12, characterized in that: The transmission components are located between the height of the corresponding transmission plate and the height of the components outside the bridge structure to meet a preset range.

14. The bridge structure according to claim 1, characterized in that: The bridge structure also includes a signal line, and the plurality of transmission boards transmit signals using the signal line.

15. An electric energy converter, characterized in that: The electric energy converter comprises a bridge structure as claimed in any one of claims 1 to 14; The power converter is at least used to convert direct current power into alternating current power, or to convert alternating current power into direct current power.

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