Infrared detector tube shell assembly lead interconnection structure and manufacturing method thereof

Abstract

The invention discloses an infrared detector tube shell assembly lead interconnection structure and a manufacturing method thereof. The structure comprises a plurality of pins, a through hole type electrode plate, a TEC, an assembly shell and a lead wire, the module is characterized in that the TEC is fixedly connected with the upper mounting surface of the module shell through the TEC lower mounting surface; the electrode plate lower mounting surface of the through hole type electrode plate is fixedly connected with the TEC upper mounting surface; a plurality of pins correspondingly penetrate through the through hole type electrode plate through a plurality of through holes; a gold electrode plating layer is arranged on the periphery of the penetrating position of each pin on the through hole type electrode plate; and the relative positions of each group of gold electrode plating layers and the pins are the same and are interconnected through lead wires. According to the multi-row pin assembly structure, the area of the electrode plates is increased in the assembly structure, and the pins are covered and penetrate through the electrode plates, so that the reliability of a lead interconnection result of the multi-row pin assembly structure can be effectively improved.

Description

Technical Field

[0001] The present invention relates to an infrared detector tube shell assembly packaging technology, specifically to a new assembly method for a through-hole electrode plate with a multi-row pin design, which improves the consistency of the multi-row pin lead structure, and particularly to an infrared detector tube shell assembly lead interconnection structure and a manufacturing method thereof. Background Art

[0002] Infrared detector components are widely used in the field of aerospace infrared. The packaging of the detector is a key link to ensure the final electrical, optical, thermal and mechanical properties of the detector. The packaging structure of the infrared detector component mainly includes an integrated tube shell seat with pins, a lead substrate, a chip, an aperture, a filter, a window and other components. The packaging process is the mounting of the lead substrate and the tube shell seat, mounting the chip on the lead substrate, and then wire bonding the lead substrate and the pins, and then mounting the aperture, filter and other components, and finally the sealing and welding of the window and the tube shell seat to complete the packaging process of the entire infrared detector.

[0003] The wire bonding between the lead substrate and the pins plays an important role in establishing the electrical connection between the chip and the outside world and ensuring the smooth input / output between the chip and the outside world. It is the key to the entire back-end packaging process. In recent years, with the increasing density and speed of chip input / output, the single-row pin design in the base of the infrared detector component tube shell can no longer meet the demand, and it is often necessary to design a double-row pin to meet the chip input / output requirements.

[0004] The lead substrate in the infrared detector component is a rectangular structure mounted in the center of the tube socket, and there is generally a spacing of about 1mm to the pins of the tube shell. There are two main problems after the lead bonding of the component with double-row pins. The first problem is the poor consistency of the lead morphology after the substrate and the pins are bonded: due to the inconsistent distances between the front and rear rows of pins and the lead substrate, the lead length is inconsistent after bonding, and because of the dense number of pins, it is difficult to avoid misaligned assembly with the lead substrate PAD, resulting in interference between the front and rear rows of leads after interconnection. The second problem is the difference in the tensile strength value of the lead after interconnection: due to the limitations of the packaging structure of the infrared detector component, it is often limited by the installation of the aperture, and there is a requirement for consistency in the arc height of the lead. In the case of consistent arc height, due to the inconsistency of the lead length, the tensile strength uniformity of the lead is poor during the tensile test. In summary, there is an urgent need for a method for interconnecting through-hole electrode leads of infrared detector components. Summary of the invention

[0005] The purpose of the present invention is to provide a lead interconnection structure of an infrared detector tube shell assembly, which mainly solves the technical problems existing in the above-mentioned prior art. In the present invention, by increasing the area of ​​the electrode plate in the assembly structure, covering and passing through the pins, the reliability of the lead interconnection results of the multi-row pin assembly structure can be effectively improved.

[0006] In order to achieve the above-mentioned object of the invention, the technical solution of the present invention is:

[0007] A lead interconnection structure of an infrared detector tube shell component, characterized in that it includes a plurality of pins, a through-hole electrode plate, a TEC, a component housing, and lead wires; characterized in that the TEC is connected and fixed to the upper mounting surface of the component housing via the lower mounting surface of the TEC; the lower mounting surface of the electrode plate of the through-hole electrode plate is connected and fixed to the upper mounting surface of the TEC; the through-hole electrode plate passes a plurality of pins through a plurality of through holes; a gold electrode coating is arranged on the through-hole electrode plate around the position where each pin passes out; each group of gold electrode coatings has the same relative position as the pin and are interconnected via lead wires.

[0008] The infrared detector tube shell assembly lead interconnection structure is characterized in that the lower mounting surface and the upper mounting surface of the TEC are fixed by gluing, silver paste welding or screwing.

[0009] The infrared detector tube shell assembly lead interconnection structure is characterized in that the lower mounting surface of the electrode plate and the upper mounting surface of the TEC are fixed by gluing.

[0010] The infrared detector tube shell assembly lead interconnection structure is characterized in that the pins are made of composite materials, have a gold-plated surface, are cylindrical in shape, and are insulated and fixed by sintering glass beads.

[0011] The infrared detector tube shell assembly lead interconnection structure is characterized in that: the through-hole electrode plate is made of a material with good thermal conductivity, the surface electrode is gold-plated, and the shape is rectangular; the multiple through holes on the through-hole electrode plate are prepared by drilling at equal intervals, and the gold electrode plating is attached to the through-hole gaps and arranged.

[0012] The infrared detector tube shell assembly lead interconnection structure is characterized in that the material of the through-hole electrode plate is ceramic or gemstone.

[0013] The infrared detector tube shell assembly lead interconnection structure is characterized in that the TEC is rectangular in shape and has a single-stage or multi-stage structure.

[0014] The infrared detector tube shell component lead interconnection structure is characterized in that the component shell material is Kovar, the surface is gold-plated, and it is an integrated tube shell with glass bead sintered pins.

[0015] The infrared detector tube shell assembly lead interconnection structure is characterized in that the lead wire material is gold, silicon aluminum or platinum.

[0016] A method for manufacturing the above-mentioned infrared detector tube shell assembly lead interconnection structure is characterized in that it comprises the following steps:

[0017] A. TEC is connected and fixed through the lower mounting surface of TEC and the upper mounting surface of the component housing;

[0018] B. After the pins are passed through the corresponding through holes of the through-hole electrode plate, the lower mounting surface of the through-hole electrode plate is connected and fixed to the upper mounting surface of the TEC;

[0019] C. Each pin and the corresponding gold electrode coating are interconnected using wires through a wire bonding machine.

[0020] The advantages of the present invention are:

[0021] 1. The present invention has reliable structure and convenient operation.

[0022] 2. The present invention can effectively improve the consistency of lead wires when interconnecting the leads of a multi-row pin assembly structure.

[0023] 3. The present invention greatly shortens the length of the lead wire and effectively improves the reliability of the lead wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the installation of the interconnection structure of the lead wires of the infrared detector tube shell assembly of the present invention;

[0025] Figure 2 It is a schematic diagram of the structure of the through-hole electrode plate in the present invention. DETAILED DESCRIPTION

[0026] The specific implementation of this patent is further described in detail below in conjunction with the accompanying drawings.

[0027] See also Figure 1 , 2 The present invention discloses a lead interconnection structure of an infrared detector tube shell component. As shown in the figure: it includes a plurality of pins 1, a through-hole electrode plate 2, a TEC 3, a component housing 4, and a lead wire 5. The TEC 3 is connected and fixed with the upper mounting surface 4-1 of the component housing 4 through the lower mounting surface 3-1 of the TEC; the lower mounting surface 2-1 of the through-hole electrode plate 2 is connected and fixed with the upper mounting surface 3-2 of the TEC; the through-hole electrode plate 2 passes through a plurality of pins 1 through a plurality of through holes 2-3; a gold electrode coating 2-2 is arranged on the through-hole electrode plate 2 around the position where each pin 1 passes through; each group of gold electrode coatings 2-2 has the same relative position as the pin 1 and is interconnected through the lead wire 5.

[0028] In the present invention, the TEC lower mounting surface 3 - 1 and the upper mounting surface 4 - 1 are fixed by adhesive bonding, silver paste welding or screwing.

[0029] In the present invention, the electrode plate lower mounting surface 2-1 and the TEC upper mounting surface 3-2 are fixed by gluing.

[0030] In the present invention, the pin 1 is a composite material with a gold-plated surface and a cylindrical shape, and is insulated and fixed by sintering glass beads.

[0031] In the present invention, the through-hole electrode plate 2 is made of a material with good thermal conductivity (such as ceramics or gemstones), the surface electrode is gold-plated, and the shape is rectangular; the plurality of through holes 2-3 on the through-hole electrode plate 2 are prepared by drilling holes at equal intervals, and the gold electrode plating 2-2 is attached to the through holes 2-3 and arranged in gaps.

[0032] In the present invention, the TEC 3 is rectangular in shape and has a single-stage or multi-stage structure.

[0033] In the present invention, the component housing 4 is made of Kovar, with a gold-plated surface, and is an integrated tube shell with glass bead sintered pins.

[0034] In the present invention, the lead wire 5 is made of gold, silicon aluminum or platinum.

[0035] The present invention also discloses a method for manufacturing the above-mentioned infrared detector tube shell assembly lead interconnection structure, which comprises the following steps:

[0036] A. The TEC 3 is connected and fixed to the upper mounting surface 4-1 of the component housing 4 via the lower mounting surface 3-1 of the TEC;

[0037] B. After the pins 1 are passed through the through holes 2-3 of the through-hole electrode plate 2, the electrode plate lower mounting surface 2-1 of the through-hole electrode plate 2 is connected and fixed to the TEC upper mounting surface 3-2;

[0038] C. Each pin 1 and the corresponding gold electrode plating layer 2 - 2 are interconnected using a wire 5 through a wire bonding machine.

[0039] Example

[0040] The interconnection structure of the infrared detector shell assembly leads in this example is as follows Figure 1 As shown, an infrared short-wave detector is encapsulated in the tube shell, wherein the detector has an operating temperature of 60K. The specific implementation method of the present invention is as follows:

[0041] The pin 1 is made of composite material, with gold-plated surface, cylindrical shape, and is fixed by glass bead sintering insulation. The pin 1 has a diameter of 2.4 mm and a height of 5 mm. The double-layer design is arranged on both sides of the component housing 4.

[0042] The through-hole electrode plate 2 is made of ceramic, gemstone and other materials with good thermal conductivity, and the surface electrode is gold-plated and square in shape. The through-hole electrode plate 2 is 30 mm long, 20 mm wide and 1 mm thick. The through holes 2-3 are prepared by drilling holes at equal intervals, and the diameter of the through holes 2-3 is 2.5 mm. The through holes 2-13 and the pins 1 have a gap of 0.1-0.2 mm, and the gold electrode plating 2-2 is arranged one by one with the through holes 2-3.

[0043] The TEC 3 is a single-stage refrigeration device with a square shape, a length of 25 mm, a width of 15 mm, and a thickness of 7 mm. The surfaces of the TEC lower mounting surface 3-1 and the TEC upper mounting surface 3-2 are smooth.

[0044] The component housing 4 is made of kovar with a gold-plated surface. The component housing 4 is 45 mm long, 30 mm wide and 18 mm thick. It is fixed to the pins by sintering with glass beads.

[0045] The lead wire 5 is made of gold, silicon aluminum or the like and has a linear structure.

[0046] The steps for making this example are as follows:

[0047] A. The TEC lower mounting surface 3 - 1 of the TEC 3 and the upper mounting surface 4 - 1 of the component housing 4 are mounted by gluing, screwing, welding or the like.

[0048] B. After the pins 1 are passed through the corresponding through holes 2-3 of the through-hole electrode plate 2, the electrode plate lower mounting surface 2-1 of the through-hole electrode plate 2 and the TEC upper mounting surface 3-2 are fixed by gluing, welding or the like.

[0049] C. Pin 1 and gold electrode coating 2-2 are interconnected by wire bonding machine using 25-micron gold wire. The arc height of lead wire 5 is 1 mm and the arc length is 2 mm.

[0050] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. An infrared detector tube shell assembly lead interconnection structure, characterized in that: It comprises a plurality of pins (1), a through-hole electrode plate (2), a TEC (3), a component housing (4), and a lead wire (5); the characteristics are as follows: the TEC (3) is connected and fixed to the upper mounting surface (4-1) of the component housing (4) via the lower mounting surface (3-1) of the TEC; the lower mounting surface (2-1) of the through-hole electrode plate (2) is connected and fixed to the upper mounting surface (3-2) of the TEC; the through-hole electrode plate (2) passes through a plurality of pins (1) correspondingly via a plurality of through holes (2-3); a gold electrode coating (2-2) is arranged on the through-hole electrode plate (2) around the position where each pin (1) passes through; each group of gold electrode coatings (2-2) has the same relative position to the pin (1) and is interconnected via the lead wire (5).

2. The lead interconnection structure of the infrared detector housing assembly according to claim 1, characterized in that: The TEC lower mounting surface (3-1) and the upper mounting surface (4-1) are fixed by adhesive bonding, silver paste welding or screwing.

3. The lead interconnection structure of the infrared detector housing assembly according to claim 1, characterized in that: The electrode plate lower mounting surface (2-1) and the TEC upper mounting surface (3-2) are fixed by gluing.

4. The infrared detector housing assembly lead interconnection structure according to claim 1, 2 or 3, characterized in that: The pin (1) is a composite material with a gold-plated surface and a cylindrical shape, and is insulated and fixed by sintering glass beads.

5. The infrared detector housing assembly lead interconnection structure according to claim 1, 2 or 3, characterized in that: The through-hole electrode plate (2) is made of a material with good thermal conductivity, and the surface electrode is gold-plated and has a rectangular shape; the plurality of through holes (2-3) on the through-hole electrode plate (2) are prepared by drilling holes at equal intervals, and the gold electrode plating (2-2) is attached to the through holes (2-3) and arranged in intervals.

6. The infrared detector housing assembly lead interconnection structure according to claim 5, characterized in that: The material of the through-hole electrode plate (2) is ceramic or gemstone.

7. The infrared detector housing assembly lead interconnection structure according to claim 1, 2 or 3, characterized in that: The TEC (3) is rectangular in shape and has a single-stage or multi-stage structure.

8. The infrared detector housing assembly lead interconnection structure according to claim 1, 2 or 3, characterized in that: The component housing (4) is made of Kovar material, has a gold-plated surface, and is an integrated tube housing with glass bead sintered pins.

9. The infrared detector housing assembly lead interconnection structure according to claim 1, 2 or 3, characterized in that: The material of the lead wire (5) is gold, silicon aluminum or platinum.

10. A method for manufacturing the lead interconnection structure of the infrared detector housing assembly according to claim 1, characterized in that: It includes the following steps: A. The TEC (3) is connected and fixed to the upper mounting surface (4-1) of the component housing (4) via the TEC lower mounting surface (3-1); B. After the through holes (2-3) of the through-hole electrode plate (2) are passed through the corresponding pins (1), the electrode plate lower mounting surface (2-1) of the through-hole electrode plate (2) is connected and fixed to the TEC upper mounting surface (3-2); C. Each pin (1) and the corresponding gold electrode coating (2-2) are interconnected through a wire bonding machine using wires (5).

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