LED chip packaging structure and LED chip packaging method

Abstract

The present invention discloses an LED chip packaging structure and a packaging method for an LED chip, and specifically relates to the field of LED chip packaging technology, including a chip packaging shell, a positioning slot column, a support frame, and a force-equalizing packaging mechanism; wherein the force-equalizing packaging mechanism includes a reduction motor, a linkage screw, a sleeve block, and a connecting shaft; the force-equalizing packaging mechanism also includes a linkage sleeve shaft, a support shaft, a hinge block, a guide sleeve block, a rotating shaft, and a torque sensor; and also includes a synchronous and uniform packaging mechanism. The present invention has the advantages of realizing uniform force for packaging operations through the force-equalizing packaging mechanism, avoiding cracks at the edge position during later use, greatly extending the service life of the LED chip, and having a better packaging effect, thereby solving the problem that inclined cracks at the edge position will occur during later use, affecting the service life of the LED chip, and having a poor packaging effect.

Description

Technical Field

[0001] The present invention relates to the technical field of LED chip packaging, and more specifically, to an LED chip packaging structure and a LED chip packaging method. Background Art

[0002] The main purpose of LED chip packaging structure is to protect the chip. The packaging structure provides the necessary mechanical protection for the LED chip to prevent it from being exposed to the air for a long time or being mechanically damaged and failing. This helps to improve the reliability and stability of the LED chip and extend its service life.

[0003] In the existing public documents, the patent announcement number CN117525245A discloses an LED chip packaging structure. This technology is through the second lens layer is set on the side of the circuit board away from the substrate, and is located in the bracket, the first lens layer and the second lens layer are both provided with grooves, and the grooves are filled with quantum dot materials; the filter layer, the filter layer is set on the side of the second lens layer away from the circuit board, and is located in the bracket; the packaging glue layer, the gap in the bracket cup is filled with packaging glue to form a packaging glue layer. This application has the effect of alleviating the problem of excessive blue light components in the relevant LED chip packaging structure. However, this technology still has the following problems.

[0004] During the LED chip packaging process, the edge position needs to be packaged, and the edge position is widely distributed, which leads to uneven packaging fixation and uneven force at the edge position when the package is fixed. This will cause inclined cracks at the edge position during later use, affecting the service life of the LED chip and resulting in poor packaging effect. Therefore, an LED chip packaging structure and an LED chip packaging method are needed. Summary of the invention

[0005] In order to overcome the above-mentioned defects of the prior art, the present invention provides the following technical solutions: an LED chip packaging structure, comprising a chip packaging shell, a positioning slot column and a support frame, wherein the positioning slot column is fixed to one side of the chip packaging shell, the support frame is located on one side of the positioning slot column, the support frame and the chip packaging shell are fixedly connected, and a force-balancing packaging mechanism is provided on one side of the inner wall of the support frame; the force-balancing packaging mechanism comprises a reduction motor fixedly arranged on one side of the inner wall of the support frame, a linkage screw is fixedly installed on the output end of the reduction motor, and a sleeve block is threadedly connected to the outer wall of the linkage screw. A connecting shaft is fixedly installed on one side of the inner wall of the sleeve block; the force balancing and packaging mechanism also includes a linkage sleeve shaft, a support shaft, a hinge block, a guide sleeve block, a rotating shaft and a torque sensor; the linkage sleeve shaft is rotatably connected to the outer wall of the connecting shaft, the support shaft is rotatably installed on the inner wall of the linkage sleeve shaft and away from the connecting shaft, the hinge block is fixed on one end of the support shaft, and the guide sleeve block is fixedly arranged on one side of the hinge block; the rotating shaft is fixedly installed on the bottom end of the linkage screw, and the torque sensor is fixedly connected to the bottom end of the rotating shaft; the outer wall of the guide sleeve block is provided with a synchronous and uniform packaging mechanism.

[0006] Preferably, the sleeve block is slidably connected to the support frame, and the reduction motor is used to drive the linkage screw to rotate; the outer wall of the sleeve block and the inner wall of the support frame are both smooth surfaces. A support block is provided on one side of the torque sensor, and the support frame and the torque sensor are fixedly connected to the support block. A controller is provided on the other side of the positioning slot column, and the chip packaging shell is fixedly connected to the controller. An LED chip is installed on one side of the inner wall of the chip packaging shell, and a packaging inner shell is provided on one side of the LED chip.

[0007] When the technical solution is in use, the reduction motor drives the linkage screw to rotate, the rotating shaft rotates on the sensing end of the torque sensor, the linkage screw drives the sleeve block to move downward under the action of the thread transmission force, the connecting shaft drives the top end of the linkage sleeve shaft to move downward, and the support shaft drives the hinge block to move forward. The hinge block drives the guide sleeve block to move forward, and the guide sleeve block realizes uniform force movement according to the specified torque force.

[0008] Preferably, the synchronous and uniform packaging mechanism includes a plurality of pull rods fixedly arranged on the outer wall of the guide sleeve block; a pull block is fixedly connected to one side of each of the pull rods, and a sleeve ring is fixedly installed on one end of the pull block, and a plurality of pull rods are slidably connected to the inner wall of the sleeve ring, and a plurality of limit screws are rotatably connected to one side of the sleeve ring, and the limit screws are threadedly connected to the pull rods; a plurality of limit rings are provided on the other side of the sleeve ring, and the limit rings are fixedly connected to the pull rods, and the limit rings are used to support the sleeve rings, and a positioning cylinder is slidably connected to the outer wall of the pull rod away from the position of the limit ring, and the positioning cylinder is fixedly connected to the chip packaging shell; a pull cover is fixedly installed on one end of the pull rod, and a sealing sleeve gasket is provided between the pull cover and the chip packaging shell, and the sealing sleeve gasket is slidably connected to the pull rod; a detection component is provided on the outer wall of the pull cover, and the guide sleeve block is slidably connected to the positioning slot column. The plurality of pull rods are arranged in a circular ring with equal spacing, the sealing sleeve is made of rubber material, the vertical cross-sectional area of ​​the limiting ring is larger than the vertical cross-sectional area of ​​the limiting screw ring, and the pull rod is made of carbon fiber material.

[0009] When the technical solution is in use, the guide sleeve block slides forward along the positioning slot column, multiple pull strips drive multiple pull blocks to move forward respectively, the sleeve ring drives multiple limit screw rings to move forward, and the pull rod causes the limit ring to move forward, so that the sleeve ring can make multiple pull rods synchronously subjected to force and move evenly, the pull cover drives the sealing sleeve gasket to move forward and squeeze, and at the same time, the pull cover drives the package inner shell forward, and the package inner shell seals and fixes the LED chip on one side of the inner wall of the chip package outer shell.

[0010] Preferably, the detection component includes a sensing block fixedly arranged on the outer wall of the pull cover; an edge distance sensor is provided on one side of the sensing block, a socket support block is fixedly connected to the outer wall of the edge distance sensor, and the socket support block is fixedly connected to the chip packaging shell, and both sides of the socket support block are fixedly installed with limit support rings; a guide rod is slidably connected to the inner wall of the guide sleeve block, and the guide rod is fixedly connected to the positioning slot column, a sliding ring is fixedly installed on one side of the guide sleeve block, and the outer wall of the sliding ring is fixedly connected to the sensing support block; a main distance sensor is provided on one side of the sensing support block, and the main distance sensor is fixedly connected to the positioning slot column.

[0011] When the technical solution is used, when the pull cover moves forward, it will drive the sensing block to move forward, and the sleeve support block can firmly support the edge distance sensor, so that the edge distance sensor can realize distance sensing of the sensing block. The guide sleeve block drives the sliding collar to move forward, and the sliding collar drives the sensing support block to move forward. When the displacement distance value sensed by the main distance sensor is the same as the distance set by the controller, and the displacement distance sensed by the edge distance sensor is the same as the distance set by the controller, the pull cover can be sealed to the specified position.

[0012] A method for packaging an LED chip, the method comprising the following steps:

[0013] Step 1: uniform force adjustment package, the reduction motor drives the linkage screw to rotate, the hinge block drives the guide sleeve block to move forward, and the guide sleeve block realizes uniform force movement according to the specified torque force;

[0014] Step 2: synchronous and uniform packaging, the guide sleeve block slides forward along the positioning slot column, and the pull cover is synchronously and uniformly force-packed;

[0015] Step 3: Positioning detection: the forward movement of the cover will drive the sensing block to move forward until the displacement distance value sensed by the main distance sensor is the same as the distance set by the controller, and the displacement distance sensed by the edge distance sensor is the same as the distance set by the controller.

[0016] Technical effects and advantages of the present invention:

[0017] The present invention uses a uniform force to adjust the packaging mechanism. The reduction motor drives the linkage screw to rotate, the rotating shaft rotates on the sensing end of the torque sensor, the linkage screw drives the sleeve block to move downward under the action of the thread transmission force, the connecting shaft drives the top end of the linkage sleeve shaft to move downward, and the top end of the linkage sleeve shaft drives the support shaft to move forward, the hinge block drives the guide sleeve block to move forward, the guide sleeve block realizes uniform force movement according to the specified torque force, realizes uniform force for packaging operation, avoids cracking at the edge position during later use, greatly prolongs the service life of the LED chip, and has a better packaging effect;

[0018] The present invention utilizes a synchronous and uniform packaging mechanism, wherein the guide sleeve block slides forward along the positioning slot column, the guide sleeve block drives multiple pull bars to move forward, the sleeve ring drives multiple limit screw rings to move forward, the limit screw ring drives the pull rod to move forward, the sleeve ring can make multiple pull rods synchronously force-bearing and uniformly move, the sealing sleeve gasket moves forward to extrude and seal at the end of the chip packaging shell, the packaging inner shell makes the LED chip sealed and fixed on one side of the inner wall of the chip packaging shell, the pull cover can be synchronously force-bearing and packaged uniformly, avoids cracking at the edge position, greatly prolongs the service life of the LED chip, and has a better packaging effect;

[0019] The present invention adopts a detection component, and the forward movement of the pull cover will drive the sensing block to move forward, and the sensing block approaches the edge distance sensor. The sleeve support block supports two limit support rings, and the sleeve support block can firmly support the edge distance sensor. The edge distance sensor can realize distance sensing for the sensing block. The displacement distance value sensed by the main distance sensor is the same as the distance set by the controller. At the same time, the displacement distance sensed by the edge distance sensor is the same as the distance set by the controller. The guide sleeve block can be evenly stressed to the designated packaging position according to the designated position, and the packaging is more uniform.

[0020] According to the mutual influence of the above multiple effects, firstly, the guide sleeve is moved evenly according to the specified torque force, and the packaging operation is performed with even force. Secondly, the pull cover can be packaged with even force synchronously to avoid cracks at the edge. Finally, the displacement distance value sensed by the main distance sensor is the same as the distance set by the controller, and the displacement distance sensed by the edge distance sensor is the same as the distance set by the controller. In summary, the packaging operation can be performed with even force, and cracks at the edge can be avoided during later use, which greatly extends the service life of the LED chip and achieves a better packaging effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the LED chip packaging structure of the present invention.

[0022] Figure 2 It is a schematic diagram of a partial structure of the connection between the chip packaging shell and the support frame of the present invention.

[0023] Figure 3 For the present invention Figure 1 Enlarged structural diagram at A in the middle.

[0024] Figure 4 It is a bottom view structural schematic diagram of the LED chip packaging structure of the present invention.

[0025] Figure 5 It is a schematic diagram of the vertical cross-section structure of the LED chip packaging structure of the present invention.

[0026] Figure 6 It is a schematic diagram of the partial structure of the connection between the pull rod and the pull block of the present invention.

[0027] Figure 7 It is a schematic diagram of a partial structure of the connection between the chip packaging shell and the socket support block of the present invention.

[0028] Figure 8 It is a schematic diagram of the partial structure of the connection between the guide rod and the positioning slot column of the present invention.

[0029] The accompanying drawings are marked as follows: 1. chip packaging shell; 2. positioning slot column; 3. support frame; 4. linkage screw; 5. reduction motor; 6. sleeve block; 7. connecting shaft; 8. linkage sleeve shaft; 9. support shaft; 10. hinge block; 11. guide sleeve block; 12. rotating shaft; 13. torque sensor; 14. support block; 15. controller; 16. LED chip; 17. packaging inner shell; 18. pull rod; 19. pull block; 20. sleeve ring; 21. pull rod; 22. limit screw ring; 23. limit ring; 24. positioning cylinder; 25. pull cover; 26. sealing sleeve; 27. sensing block; 28. edge distance sensor; 29. ​​sleeve support block; 30. limit support ring; 31. guide rod; 32. sliding sleeve ring; 33. sensing support block; 34. main distance sensor. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] As attached Figure 1 - Attachment Figure 8 An LED chip packaging structure is shown, and the LED chip packaging structure is provided with a uniform force adjustment packaging mechanism, a synchronous uniform packaging mechanism, and a detection component. The settings of each mechanism and component can achieve uniform force for packaging operation, avoid cracks at the edge position during later use, greatly extend the service life of the LED chip, and achieve better packaging effect. The specific structural settings of each mechanism and component are as follows.

[0032] In this embodiment, as shown in the attached Figure 1 - Attachment Figure 4 As shown, the positioning slot column 2 is fixed on one side of the chip packaging shell 1, the support frame 3 is located on one side of the positioning slot column 2, and a force-balancing packaging mechanism is provided on one side of the inner wall of the support frame 3; the force-balancing packaging mechanism includes a reduction motor 5 fixedly arranged on one side of the inner wall of the support frame 3, a linkage screw 4 is fixedly installed on the output end of the reduction motor 5, the outer wall of the linkage screw 4 is threadedly connected with a sleeve block 6, and a connecting shaft 7 is fixedly installed on one side of the inner wall of the sleeve block 6; the force-balancing packaging mechanism also includes a linkage sleeve shaft 8, a support shaft 9, a hinge block 10, a guide sleeve block 11, a rotating shaft 12 and a torque sensor 13.

[0033] The linkage sleeve 8 is rotatably connected to the outer wall of the connecting shaft 7, the support shaft 9 is rotatably installed on the inner wall of the linkage sleeve 8 and away from the connecting shaft 7, the hinge block 10 is fixed to one end of the support shaft 9, and the guide sleeve 11 is fixedly arranged on one side of the hinge block 10; the rotating shaft 12 is fixedly installed at the bottom end of the linkage screw 4, and the torque sensor 13 is fixedly connected to the bottom end of the rotating shaft 12; the outer wall of the guide sleeve 11 is provided with a synchronous and uniform packaging mechanism.

[0034] In this embodiment, as shown in the attached Figure 1 - Attachment Figure 5As shown, a support block 14 is provided on one side of the torque sensor 13, and the support frame 3 and the torque sensor 13 are fixedly connected to the support block 14, so that the support frame 3 supports the support block 14, and the support block 14 supports the torque sensor 13, thereby increasing the stability of the torque sensor 13. A controller 15 is provided on the other side of the positioning slot column 2, and the chip packaging shell 1 is fixedly connected to the controller 15, so that when the displacement distance value sensed by the main distance sensor 34 is the same as the distance set by the controller 15, and the displacement distance sensed by the edge distance sensor 28 is the same as the distance set by the controller 15, the pull cover 25 can be packaged synchronously and uniformly. An LED chip 16 is installed on one side of the inner wall of the chip packaging shell 1, and a packaging inner shell 17 is provided on one side of the LED chip 16, and the LED chip 16 is sealed and fixed on one side of the inner wall of the chip packaging shell 1 through the packaging inner shell 17.

[0035] In this embodiment, as shown in the attached Figure 3 - Attachment Figure 6 As shown, the synchronous uniform packaging mechanism includes a plurality of pull bars 18 fixedly arranged on the outer wall of the guide sleeve block 11; a pull block 19 is fixedly connected to one side of each pull bar 18, a sleeve ring 20 is fixedly installed at one end of the pull block 19, a plurality of pull rods 21 are slidably connected to the inner wall of the sleeve ring 20, a plurality of limit screw rings 22 are rotatably connected to one side of the sleeve ring 20, and the limit screw rings 22 are threadedly connected to the pull rods 21; a plurality of limit rings 23 are arranged on the other side of the sleeve ring 20, and the limit rings 23 are threadedly connected to the pull rods 21 The pull rod 21 is fixedly connected with the chip package shell 1, the limit ring 23 is used to support the sleeve ring 20, the outer wall of the pull rod 21 is slidably connected with a positioning cylinder 24 away from the limit ring 23, and the positioning cylinder 24 is fixedly connected with the chip package shell 1; a pull cover 25 is fixedly installed at one end of the pull rod 21, and a sealing sleeve 26 is provided between the pull cover 25 and the chip package shell 1, and the sealing sleeve 26 is slidably connected with the pull rod 21; the outer wall of the pull cover 25 is provided with a detection component, and the guide sleeve 11 is slidably connected with the positioning groove column 2. A plurality of pull strips 18 are arranged in a circular ring with equal spacing, and the sealing sleeve 26 is made of rubber material. The vertical cross-sectional area of ​​the limit ring 23 is larger than the vertical cross-sectional area of ​​the limit screw ring 22, and the pull rod 21 is made of carbon fiber material.

[0036] In this embodiment, as shown in the attached Figure 7 - Attachment Figure 8As shown, the detection component includes a sensing block 27 fixedly arranged on the outer wall of the pull cover 25; an edge distance sensor 28 is provided on one side of the sensing block 27, and a sleeve support block 29 is fixedly connected to the outer wall of the edge distance sensor 28, and the sleeve support block 29 is fixedly connected to the chip packaging shell 1, and both sides of the sleeve support block 29 are fixedly installed with limit support rings 30; a guide rod 31 is slidably connected to the inner wall of the guide sleeve block 11, and the guide rod 31 is fixedly connected to the positioning groove column 2, a sliding ring 32 is fixedly installed on one side of the guide sleeve block 11, and a sensing support block 33 is fixedly connected to the outer wall of the sliding ring 32; a main distance sensor 34 is provided on one side of the sensing support block 33, and the main distance sensor 34 is fixedly connected to the positioning groove column 2.

[0037] The working principle of the LED chip packaging structure of the present invention is as follows:

[0038] Step 1, when the force is evenly adjusted to encapsulate, the specified encapsulation force is set on the controller 15, so that the reduction motor 5 drives the linkage screw 4 to rotate, the linkage screw 4 drives the rotating shaft 12 to rotate, the rotating shaft 12 rotates on the sensing end of the torque sensor 13, and the support frame 3 supports the support block 14, the support block 14 supports the torque sensor 13, thereby increasing the stability of the torque sensor 13, and the linkage screw 4 drives the sleeve block 6 to move downward under the action of the thread transmission force, the sleeve block 6 drives the connecting shaft 7 to move downward, the connecting shaft 7 drives the top end of the linkage sleeve shaft 8 to move downward, and the top end of the linkage sleeve shaft 8 drives the support shaft 9 to move forward, and the support shaft 9 drives the hinge block 10 to move forward.

[0039] At the same time, the hinge block 10 drives the guide sleeve block 11 to move forward, and the guide sleeve block 11 realizes uniform movement according to the specified torque force.

[0040] Step 2, during synchronous and uniform packaging, the guide sleeve block 11 slides forward along the positioning groove column 2, the guide sleeve block 11 drives multiple pull strips 18 to move forward, the multiple pull strips 18 respectively drive multiple pull blocks 19 to move forward, the pull block 19 drives the sleeve ring 20 to move forward, the sleeve ring 20 drives multiple limit screw rings 22 to move forward, the limit screw ring 22 drives the pull rod 21 to move forward, the pull rod 21 makes the limit ring 23 move forward, so that the sleeve ring 20 can make the multiple pull rods 21 synchronously force and move evenly, and the pull rod 21 moves forward along the inner wall of the positioning tube 24, the pull rod 21 drives the pull cover 25 to move forward, the pull cover 25 drives the sealing sleeve gasket 26 to move forward and extrude, and the sealing sleeve gasket 26 moves forward and extrude and seals at the end of the chip packaging shell 1.

[0041] At the same time, the pull cover 25 drives the package inner shell 17 to move forward, and the package inner shell 17 seals and fixes the LED chip 16 on one side of the inner wall of the chip package outer shell 1, and the pull cover 25 can be packaged synchronously and evenly.

[0042] Step 3: During positioning detection, when the pull cover 25 moves forward, the sensing block 27 moves forward, and the sensing block 27 approaches the edge distance sensor 28. The chip package shell 1 supports the sleeve support block 29, and the sleeve support block 29 supports two limit support rings 30. At the same time, the sleeve support block 29 can firmly support the edge distance sensor 28, thereby increasing the stability of the edge distance sensor 28. In this way, the edge distance sensor 28 can realize distance sensing of the sensing block 27.

[0043] The sliding collar 32 is driven forward by the guide sleeve 11, and the sliding collar 32 moves forward along the outer wall of the guide rod 31, and the sliding collar 32 drives the sensing support block 33 to move forward, and the sensing support block 33 approaches the position of the main distance sensor 34. When the displacement distance value sensed by the main distance sensor 34 is the same as the distance set by the controller 15, and the displacement distance sensed by the edge distance sensor 28 is the same as the distance set by the controller 15, the pull cover 25 can be packaged at the specified position, and the guide sleeve 11 can be evenly stressed to the specified packaging position according to the specified position.

[0044] The contents not described in detail in the specification belong to the prior art known to those skilled in the art, and the model parameters of each electrical appliance are not specifically limited, and conventional equipment can be used. In this technical solution, the electrical control components not mentioned are not shown in the figure because they belong to the prior art and will not be described here.

[0045] The contents not described in detail in the specification belong to the prior art known to those skilled in the art, and the model parameters of each electrical appliance are not specifically limited, and conventional equipment can be used. In this technical solution, the electrical control components not mentioned are not shown in the figure because they belong to the prior art and will not be described here.

[0046] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An LED chip packaging structure, comprising a chip packaging shell, a positioning slot column and a support frame, wherein the positioning slot column is fixed to one side of the chip packaging shell, the support frame is located on one side of the positioning slot column, and the support frame is fixedly connected to the chip packaging shell, characterized in that: A force equalizing and adjusting packaging mechanism is provided on one side of the inner wall of the support frame; The force-equalizing packaging mechanism comprises a reduction motor fixedly arranged on one side of the inner wall of the support frame, a linkage screw is fixedly installed on the output end of the reduction motor, a sleeve block is threadedly connected to the outer wall of the linkage screw, and a connecting shaft is fixedly installed on one side of the inner wall of the sleeve block; the force-equalizing packaging mechanism also comprises a linkage sleeve shaft, a support shaft, an articulated block, a guide sleeve block, a rotating shaft and a torque sensor; the linkage sleeve shaft is rotatably connected to the outer wall of the connecting shaft, the support shaft is rotatably installed on the inner wall of the linkage sleeve shaft and away from the connecting shaft, the articulated block is fixed on one end of the support shaft, and the guide sleeve block is fixed on one side of the articulated block; the rotating shaft is fixedly installed on the bottom end of the linkage screw, and the torque sensor is fixedly connected to the bottom end of the rotating shaft; the outer wall of the guide sleeve block is provided with a synchronous and uniform packaging Mechanism, the synchronous and uniform packaging mechanism includes a plurality of pull rods fixedly arranged on the outer wall of the guide sleeve block; one side of each pull rod is fixedly connected to the pull block, and a sleeve ring is fixedly installed on one end of the pull block, and a plurality of pull rods are slidably connected to the inner wall of the sleeve ring, and a plurality of limit screw rings are rotatably connected to one side of the sleeve ring, and the limit screw rings and the pull rods are threadedly connected; a plurality of limit rings are provided on the other side of the sleeve ring, and the limit rings are fixedly connected to the pull rods, and the limit rings are used to support the sleeve rings, and a positioning cylinder is slidably connected to the outer wall of the pull rod and away from the position of the limit ring, and the positioning cylinder is fixedly connected to the chip packaging shell; a pull cover is fixedly installed on one end of the pull rod, and a sealing sleeve gasket is provided between the pull cover and the chip packaging shell, and the sealing sleeve gasket is slidably connected to the pull rod.

2. The LED chip packaging structure according to claim 1, characterized in that: The sleeve block is slidably connected to the support frame, and the reduction motor is used to drive the linkage screw to rotate; The outer wall of the sleeve block and the inner wall of the support frame are both smooth surfaces.

3. The LED chip packaging structure according to claim 1, characterized in that: A support block is provided on one side of the torque sensor, and the support frame and the torque sensor are fixedly connected to the support block.

4. The LED chip packaging structure according to claim 1, characterized in that: A controller is provided on the other side of the positioning slot column, and the chip packaging shell is fixedly connected to the controller.

5. The LED chip packaging structure according to claim 1, characterized in that: An LED chip is installed on one side of the inner wall of the chip packaging shell, and a packaging inner shell is provided on one side of the LED chip.

6. The LED chip packaging structure according to claim 1, characterized in that: The outer wall of the pull cover is provided with a detection component, and the guide sleeve block is slidably connected with the positioning slot column.

7. The LED chip packaging structure according to claim 1, characterized in that: The plurality of pull strips are arranged in a circular ring with equal spacing, and the sealing sleeve is made of rubber material.

8. The LED chip packaging structure according to claim 1, characterized in that: The vertical cross-sectional area of ​​the limiting ring is greater than the vertical cross-sectional area of ​​the limiting screw ring, and the pull rod is made of carbon fiber material.

9. The LED chip packaging structure according to claim 6, characterized in that: The detection assembly includes a sensing block fixedly arranged on the outer wall of the sliding cover; An edge distance sensor is provided on one side of the sensing block, a sleeve support block is fixedly connected to the outer wall of the edge distance sensor, and the sleeve support block is fixedly connected to the chip packaging shell, and limit support rings are fixedly installed on both sides of the sleeve support block; The inner wall of the guide sleeve block is slidably connected with a guide rod, and the guide rod is fixedly connected to the positioning slot column. A sliding ring is fixedly installed on one side of the guide sleeve block, and the outer wall of the sliding ring is fixedly connected with an induction support block. A main distance sensor is provided on one side of the induction support block, and the main distance sensor is fixedly connected to the positioning slot column.

10. A method for packaging an LED chip, using the LED chip packaging structure of claim 9, characterized in that: The method comprises the following steps: Step 1: uniform force adjustment package, the reduction motor drives the linkage screw to rotate, the hinge block drives the guide sleeve block to move forward, and the guide sleeve block realizes uniform force movement according to the specified torque force; Step 2: synchronous and uniform packaging, the guide sleeve block slides forward along the positioning slot column, and the pull cover is synchronously and uniformly force-packed; Step 3: Positioning detection: the forward movement of the cover will drive the sensing block to move forward until the displacement distance value sensed by the main distance sensor is the same as the distance set by the controller, and the displacement distance sensed by the edge distance sensor is the same as the distance set by the controller.

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