Display device and manufacturing method thereof

By designing complex insulation layer and electrode structures in the display device, the problem of high resistance and low integration of large display panels is solved, and the effect of reducing resistance and improving integration is achieved.

CN119698181APending Publication Date: 2025-03-25SAMSUNG DISPLAY CO LTD
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Patent Information

Application Number
CN202411254610.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-09-22
Filing Date
2024-09-09
Publication Date
2025-03-25

AI Technical Summary

Technical Problem

The electrode resistance of large display panels is large, resulting in a decrease in integration, making it difficult to maintain high integration while reducing the resistance.

Method used

By designing the first and second auxiliary insulating layers, pixel-defined films and electrodes in the display device, an electrical connection between the second electrode and the first auxiliary electrode is formed by using the opening and angle design structure, and the resistance is reduced.

Benefits of technology

The resistance of the electrode is effectively reduced, the efficiency of the display device is improved, while maintaining a high pixel integration degree.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a display device and a manufacturing method thereof. A display device according to one embodiment of the present invention comprises: a first auxiliary insulating layer in which an opening is defined; a second auxiliary insulating layer disposed on the first auxiliary insulating layer; a pixel defining film disposed on the second auxiliary insulating layer and defining a pixel opening portion; at least one part of the first auxiliary electrode is arranged in the opening part; a second auxiliary electrode, at least a portion of which is disposed within the opening, and which includes a second-1 portion disposed on the first auxiliary electrode, and a second-2 portion including a first surface having a first angle with respect to an upper surface of the first auxiliary electrode, the second surface including a second angle with respect to an upper surface of the second auxiliary electrode; the first auxiliary electrode is arranged on the substrate and is separated from the upper surface of the first auxiliary electrode; at least one part of the first electrode is arranged in the pixel opening part; and a second electrode disposed on the first electrode and electrically connected to the first auxiliary electrode.
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Description

Technical Field

[0001] The present invention relates to a display device and a method for manufacturing the display device, and to a display device with improved efficiency by improving the resistance of an electrode and a method for manufacturing the display device. Background Art

[0002] A variety of display devices are being developed for multimedia devices such as televisions, portable phones, tablet computers, computers, game consoles, etc. In order to improve the resolution of the display device, research is being conducted on methods of reducing the size of pixels and increasing the degree of integration. Display devices including large display panels have a large area, and thus have a problem of relatively large electrode resistance compared to small and medium-sized display panels. If the surface area of ​​the opening formed is increased in order to reduce the resistance of the electrode, the degree of integration is reduced. Therefore, it is necessary to find the optimal point between the improvement of the electrode resistance and the reduction of the degree of integration. Summary of the invention

[0003] An object of the present invention is to provide a display device and a method for manufacturing the display device capable of reducing electrode resistance.

[0004] A display device according to an embodiment of the present invention includes: a first auxiliary insulating layer, which defines an opening; a second auxiliary insulating layer, which is arranged on the first auxiliary insulating layer; a pixel defining film, which is arranged on the second auxiliary insulating layer and defines a pixel opening; a first auxiliary electrode, at least a portion of which is arranged in the opening; a second auxiliary electrode, at least a portion of which is arranged in the opening and includes a 2-1 portion and a 2-2 portion, wherein the 2-1 portion is arranged on the first auxiliary electrode, and the 2-2 portion includes a first surface having a first angle with an upper surface of the first auxiliary electrode and is separated from the upper surface of the first auxiliary electrode; a first electrode, at least a portion of which is arranged in the pixel opening; and a second electrode, which is arranged on the first electrode and electrically connected to the first auxiliary electrode.

[0005] The 2-2 portion may be arranged in the opening.

[0006] A portion of the second auxiliary insulating layer may be disposed on the second auxiliary electrode.

[0007] The first angle may be an acute angle.

[0008] The 2-1 portion may be directly disposed on the first auxiliary electrode.

[0009] The second auxiliary electrode may further include a 2-3 portion including a second surface having a second angle with the upper surface of the first auxiliary electrode and spaced apart from the upper surface of the first auxiliary electrode.

[0010] The second angle may be an acute angle.

[0011] In a plane, the pixel opening portion may not overlap with the opening portion.

[0012] A display device according to an embodiment of the present invention includes: a base layer; a circuit element layer arranged on the base layer; and a display element layer arranged on the circuit element layer, including a pixel defining film and a light-emitting element, wherein the circuit element layer includes: a first auxiliary insulating layer defining an opening; a second auxiliary insulating layer arranged on the first auxiliary insulating layer; a first auxiliary electrode, at least a portion of which is arranged in the opening; and a second auxiliary electrode, at least a portion of which is arranged in the opening and includes a 2-1 portion and a 2-2 portion, wherein the 2-1 portion is arranged on the first auxiliary electrode, the 2-2 portion includes a first surface having a first angle with an upper surface of the first auxiliary electrode and is separated from the upper surface of the first auxiliary electrode, the pixel defining film is arranged on the second auxiliary insulating layer, and a pixel opening portion is defined in the pixel defining film, and the light-emitting element includes: a first electrode, at least a portion of which is arranged in the pixel opening portion; a second electrode, which is arranged on the first electrode and electrically connected to the first auxiliary electrode; and an intermediate layer, which is arranged between the first electrode and the second electrode, and at least a portion of which is arranged in the pixel opening portion.

[0013] A manufacturing method of a display device according to an embodiment of the present invention includes the following steps: forming a first auxiliary insulating layer on a first auxiliary electrode; forming a preliminary opening portion on the first auxiliary insulating layer that overlaps with the first auxiliary electrode on a plane; forming a second auxiliary electrode, the second auxiliary electrode being arranged in the preliminary opening portion and including a 2-1 portion and a 2-2 portion, the 2-1 portion being arranged on the first auxiliary electrode, the 2-2 portion including a first surface having a first angle with an upper surface of the first auxiliary electrode and being separated from the upper surface of the first auxiliary electrode; forming a second auxiliary insulating layer on the first auxiliary insulating layer and the second auxiliary electrode; arranging a mask including a first hole that overlaps with the preliminary opening portion on a plane on the second auxiliary insulating layer; etching a portion of the first auxiliary insulating layer and a portion of the second auxiliary insulating layer that overlap with the first hole on a plane respectively to form an opening portion that exposes the 2-2 portion and a portion of the first auxiliary electrode; forming a first electrode that does not overlap with the opening portion and an intermediate layer arranged on the first electrode; and forming a second electrode that is arranged on the intermediate layer and electrically connected to the first auxiliary electrode.

[0014] According to an embodiment of the present invention, the second electrode included in the display device is electrically connected to the first auxiliary electrode exposed by the opening, thereby reducing the resistance of the electrode and improving the efficiency of the display device, and since the size of the opening is small enough, the pixel integration will not be significantly reduced.

[0015] In addition, since the opening portion can be easily formed through an etching process using a mask including a hole, the process difficulty of the manufacturing method of the display device can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a perspective view of a display device according to an embodiment of the present invention.

[0017] Figure 2 is an exploded perspective view of a display device according to an embodiment of the present invention.

[0018] Figure 3 is a cross-sectional view of a display device according to an embodiment of the present invention.

[0019] Figure 4 is a plan view of a display panel according to an embodiment of the present invention.

[0020] Figure 5 is a plan view of an enlarged active area of ​​a display panel according to an embodiment of the present invention.

[0021] Figure 6 A display device according to an embodiment of the present invention is provided along Figure 5 The cross-sectional view is taken along line II'.

[0022] Figure 7 and Figure 8 A display device according to an embodiment of the present invention is provided along Figure 5 The cross-sectional view is taken along line II-II'.

[0023] Fig. 9 is a flow chart of a method for manufacturing a display device according to an embodiment of the present invention.

[0024] Fig.10 is a cross-sectional view showing a part of a method for manufacturing a display device according to an embodiment of the present invention.

[0025] Fig.11 is a cross-sectional view showing a part of a method for manufacturing a display device according to an embodiment of the present invention.

[0026] Fig.12 is a cross-sectional view showing a part of a method for manufacturing a display device according to an embodiment of the present invention.

[0027] Fig.13 is a cross-sectional view showing a part of a method for manufacturing a display device according to an embodiment of the present invention.

[0028] Fig.14 is a cross-sectional view showing a part of a method for manufacturing a display device according to an embodiment of the present invention.

[0029] Fig.15 is a cross-sectional view showing a part of a method for manufacturing a display device according to an embodiment of the present invention.

[0030] Fig.16 is a cross-sectional view showing a part of a method for manufacturing a display device according to an embodiment of the present invention.

[0031] Fig.17 is a cross-sectional view showing a part of a method for manufacturing a display device according to an embodiment of the present invention.

[0032] Fig.18 is a cross-sectional view showing a part of a method for manufacturing a display device according to an embodiment of the present invention.

[0033] Fig.19 is a cross-sectional view showing a part of a method for manufacturing a display device according to an embodiment of the present invention.

[0034] Description of Reference Numerals DETAILED DESCRIPTION

[0035] In this specification, when a certain constituent element (or region, layer, part, etc.) is mentioned to be "on", "connected to" or "combined to" another constituent element (or region, layer, part, etc.), it means that the certain constituent element (or region, layer, part, etc.) can be directly arranged on / connected to / combined with another constituent element (or region, layer, part, etc.), or a third constituent element (or region, layer, part, etc.) may be arranged between them.

[0036] Meanwhile, in the present application, "directly arranged" may mean that there is no additional layer, film, region, plate, etc. between one part of a layer, film, region, plate, etc. For example, "directly arranged" may mean that two layers or two parts are arranged without using an additional part such as an adhesive part.

[0037] The same reference numerals represent the same components. In addition, in the drawings, the thickness, ratio and size of the components are exaggerated to effectively illustrate the technical content. "And / or" includes all combinations that can define more than one related component.

[0038] The terms "first", "second" and the like can be used to describe a variety of constituent elements, but the constituent elements should not be limited to the terms. The terms are only used to distinguish one constituent element from another constituent element. For example, without departing from the scope of the present invention, the first constituent element can be named as the second constituent element, and similarly, the second constituent element can also be named as the first constituent element. Unless different meanings are clearly indicated in the context, the expression of the singular also includes the expression of the plural number.

[0039] In addition, terms such as "below", "on the lower side", "above", "on the upper side" and the like are used to describe the relationship between components shown in the drawings. The terms are relative concepts and are described based on the directions shown in the drawings.

[0040] It should be understood that terms such as “including” or “having” are used to specify the existence of features, numbers, steps, operations, constituent elements, parts or combinations thereof recorded in the specification, rather than excluding the existence or additional possibilities of one or more other features or numbers, steps, operations, constituent elements, parts or combinations thereof in advance.

[0041] Unless otherwise defined, all terms (including technical terms and scientific terms) used in this specification have the same meanings as those commonly understood by those skilled in the art in the technical field to which the present invention belongs. In addition, terms such as those defined in commonly used dictionaries should be interpreted as having the same meanings as those in the context of the relevant technology, and herein, unless expressly defined, should not be interpreted as having overly ideal or overly formal meanings.

[0042] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0043] Figure 1 is a three-dimensional diagram of a display device according to an embodiment of the present invention, Figure 2 is an exploded perspective view of a display device according to an embodiment of the present invention.

[0044] Reference Figure 1 and Figure 2, the display device DD may be a device that is activated according to an electrical signal. The display device DD according to the present invention may be a large display device such as a television, a monitor, and the like. These display devices are presented only as examples, and the display device DD may obviously be implemented in other forms without departing from the concept of the present invention. The display device DD has a rectangular shape having long sides in a first direction DR1 and short sides in a second direction DR2 intersecting the first direction DR1. However, the shape of the display device DD is not limited thereto, and a display device DD of various shapes may be provided. The display device DD may display an image IM toward a third direction DR3 on a display surface IS that is parallel to the first direction DR1 and the second direction DR2, respectively. The display surface IS that displays the image IM may correspond to the front surface (front surface) of the display device DD.

[0045] In this embodiment, the front surface (or upper surface) and the back surface (or lower surface) of each component are defined based on the direction of displaying the image IM. The front surface and the back surface may be opposite to each other in the third direction DR3, and the normal direction of the front surface and the back surface may be parallel to the third direction DR3.

[0046] The distance between the front surface and the back surface in the third direction DR3 may correspond to the thickness of the display device DD in the third direction DR3. In addition, the directions indicated by the first direction DR1 to the third direction DR3 are relative concepts and may be converted into other directions.

[0047] The display device DD can sense external input applied from the outside. The external input may include various forms of input provided from the outside of the display device DD. The display device DD according to an embodiment of the present invention can sense external input of the user applied from the outside. The external input of the user may be any one of various forms of external input such as a part of the user's body, light, heat, sight or pressure, or a combination thereof. In addition, the display device DD may also sense the external input of the user applied to the side or back of the display device DD according to the structure of the display device DD, and is not limited to a certain embodiment. As an example of the present invention, the external input may also include input by means of an input device (for example, a stylus, an active pen, a touch pen, an electronic pen, etc.).

[0048] The display surface IS of the display device DD can be divided into a display area DA and a non-display area NDA. The display area DA can be an area where an image IM is displayed. The user recognizes the image IM through the display area DA. In this embodiment, the display area DA is shown as a quadrilateral with rounded vertices. However, this is an exemplary case, and the display area DA can have a variety of shapes and is not limited to a certain embodiment.

[0049] The non-display area NDA is adjacent to the display area DA. The non-display area NDA may have a predetermined color. The non-display area NDA may surround the display area DA. Accordingly, the shape of the display area DA may be substantially defined by the non-display area NDA. However, this is an exemplary case, and the non-display area NDA may be arranged adjacent to only one side of the display area DA, or may also be omitted. The display device DD according to an embodiment of the present invention may include various embodiments, and is not limited to a certain embodiment.

[0050] like Figure 2 As shown, the display device DD may include a display module DM and a window WM arranged on the display module DM. The display module DM may include a display panel DP and an input sensing layer ISP.

[0051] The display panel DP according to an embodiment of the present invention may be a light-emitting display panel. As an example, the display panel DP may be an organic light-emitting display panel. The light-emitting layer EML ( Figure 6 ) may include organic light-emitting substances.

[0052] The display panel DP may output an image IM, and the output image IM may be displayed through the display surface IS.

[0053] The input sensing layer ISP may be arranged on the display panel DP to sense external input. The input sensing layer ISP may be directly arranged on the display panel DP. According to an embodiment of the present invention, the input sensing layer ISP may be formed on the display panel DP by a continuous process. That is, in the case where the input sensing layer ISP is directly arranged on the display panel DP, an internal adhesive film (not shown) is not arranged between the input sensing layer ISP and the display panel DP. However, an internal adhesive film may be arranged between the input sensing layer ISP and the display panel DP. In this case, the input sensing layer ISP may not be manufactured by a continuous process with the display panel DP, and it may be manufactured by a process independent of the process of manufacturing the display panel DP, and then fixed to the upper surface of the display panel DP by an internal adhesive film.

[0054] The window WM may be formed of a transparent material capable of emitting the image IM, such as glass, sapphire, plastic, etc. Although the window WM is shown as a single layer, it is not limited thereto and may include a plurality of layers.

[0055] In addition, although not shown, the non-display area NDA of the display device DD described above can be substantially set as an area printed with a substance including a predetermined color in an area of ​​the window WM. As an example of the present invention, the window WM may include a light-blocking pattern for defining the non-display area NDA. The light-blocking pattern is a colored organic film, which can be formed by coating, for example.

[0056] The window WM may be combined with the display module DM through an adhesive film. As an example of the present invention, the adhesive film may include an optically clear adhesive film (OCA). However, the adhesive film is not limited thereto, and may include a general adhesive or bonding agent. For example, the adhesive film may include an optically clear adhesive resin (OCR) or a pressure sensitive adhesive film (PSA).

[0057] An anti-reflection layer may also be arranged between the window WM and the display module DM. The anti-reflection layer reduces the reflectivity of external light incident from the upper side of the window WM. The anti-reflection layer according to an embodiment of the present invention may include a phase retarder and a polarizer. The phase retarder may be a film type or a liquid crystal coating type, and may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer may also be a film type or a liquid crystal coating type. The film type may include a stretched synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a predetermined arrangement. The phase retarder and the polarizer may be implemented by a polarizing film.

[0058] As an example of the present invention, the anti-reflection layer may further include a color filter. Figure 4 ) determines the arrangement of the color filters. In this case, the anti-reflection layer may further include a light-blocking pattern arranged between the color filters.

[0059] The display module DM may display an image IM according to an electrical signal, and may send / receive information for an external input. The display module DM may be defined as an active area AA and a peripheral area NAA. The active area AA may be defined as an area where the image IM is emitted from the display panel DP (i.e., an area where the image IM is displayed). In addition, the active area AA may also be defined as an area where the input sensing layer ISP senses an external input applied from the outside. According to an embodiment, the active area AA of the display module DM may correspond to (or overlap) at least a portion of the display area DA.

[0060] The peripheral area NAA is adjacent to the active area AA. The peripheral area NAA may be an area where the image IM is not substantially displayed. For example, the peripheral area NAA may surround the active area AA. However, this is an exemplary case, and the peripheral area NAA may be defined as a variety of shapes and is not limited to a certain embodiment. According to one embodiment, the peripheral area NAA of the display module DM may correspond to (or overlap) at least a portion of the non-display area NDA.

[0061] The display module DM may further include a main circuit board MCB, a flexible circuit film D-FCB, and a driving chip DIC. The main circuit board MCB may be connected to the flexible circuit film D-FCB and electrically connected to the display panel DP. The flexible circuit film D-FCB is connected to the display panel DP and electrically connects the display panel DP and the main circuit board MCB. The main circuit board MCB may include a plurality of driving elements. The plurality of driving elements may include a circuit portion for driving the display panel DP. A driving chip DIC may be mounted on the flexible circuit film D-FCB.

[0062] As an example of the present invention, the flexible circuit film D-FCB may include a first flexible circuit film D-FCB1, a second flexible circuit film D-FCB2, and a third flexible circuit film D-FCB3. As an example of the present invention, the driving chip DIC may include a first driving chip DIC1, a second driving chip DIC2, and a third driving chip DIC3. The first to third flexible circuit films D-FCB1 to D-FCB3 may be arranged to be spaced apart in the first direction DR1, and may be connected to the display panel DP to electrically connect the display panel DP and the main circuit board MCB. The first driving chip DIC1 may be mounted on the first flexible circuit film D-FCB1. The second driving chip DIC2 may be mounted on the second flexible circuit film D-FCB2. The third driving chip DIC3 may be mounted on the third flexible circuit film D-FCB3. However, the embodiments of the present invention are not limited thereto. For example, the display panel DP may also be electrically connected to the main circuit board MCB through one flexible circuit film, and only one driving chip may be mounted on one flexible circuit film. In addition, the display panel DP may be electrically connected to the main circuit board MCB via four or more flexible circuit films, and the driving chips may be mounted on the flexible circuit films respectively.

[0063] Figure 2 , the first to third driver chips DIC1 to DIC3 are respectively mounted on the first to third flexible circuit films D-FCB1 to D-FCB3, but the present invention is not limited thereto. For example, the first to third driver chips DIC1 to DIC3 may be directly mounted on the display panel DP. In this case, the portion of the display panel DP on which the first to third driver chips DIC1 to DIC3 are mounted may be bent and arranged behind the display module DM. Alternatively, the first to third driver chips DIC1 to DIC3 may also be directly mounted on the main circuit board MCB.

[0064] The input sensing layer ISP may be electrically connected to the main circuit board MCB through the flexible circuit film D-FCB. However, the embodiments of the present invention are not limited thereto. That is, the display module DM may additionally include a separate flexible circuit film for electrically connecting the input sensing layer ISP to the main circuit board MCB.

[0065] The display device DD also includes a housing EDC that accommodates the display module DM. The housing EDC can be combined with the window WM to define the appearance of the display device DD. The housing EDC absorbs impacts applied from the outside and prevents foreign matter / water from penetrating into the display module DM, thereby protecting the structure accommodated in the housing EDC. In addition, as an example of the present invention, the housing EDC can be set to a form combined with multiple storage components.

[0066] According to one embodiment, the display device DD may also include an electronic module including various functional modules for operating the display module DM, a power supply module (e.g., a battery) for supplying power required for the overall operation of the display device DD, a bracket for dividing the internal space of the display device DD by combining with the display module DM and / or the outer casing EDC, etc.

[0067] Figure 3 is a cross-sectional view of a display device according to an embodiment of the present invention. Figure 3 In the figure, in order to illustrate the stacking relationship of the functional panels and / or functional units constituting the display device DD, the display device DD is simply shown.

[0068] The display device DD according to an embodiment may include a display module DM, a light control layer LCL and a window WM. The display module DM may include a display panel DP and an input sensing layer ISP. In an embodiment of the present invention, the input sensing layer ISP may be omitted.

[0069] The display panel DP generates an image. The display panel DP includes a plurality of pixels PX ( Figure 4 ). The display panel DP according to an embodiment may be a light-emitting display panel including a light-emitting element as a display element, but is not particularly limited thereto. For example, the display panel DP may be an organic light-emitting display panel. The light-emitting layer of the organic light-emitting display panel may include an organic light-emitting substance. Hereinafter, the display panel DP is described as an organic light-emitting display panel.

[0070] The input sensing layer ISP is disposed on the display panel DP. The input sensing layer ISP acquires coordinate information of an external input (eg, a touch event). The input sensing layer ISP may sense the external input in a capacitive manner.

[0071] The light control layer LCL may be disposed on the input sensing layer ISP. The light control layer LCL may control the path of light generated at the display panel DP. In addition, the light control layer LCL may reduce the reflectivity of natural light (or sunlight) incident from the upper side of the window WM.

[0072] The window WM may be arranged on the light control layer LCL. The window WM and the light control layer LCL may be combined by a window adhesive layer ADL. The window adhesive layer ADL may be a pressure sensitive adhesive film (PSA: Pressure Sensitive Adhesive film) or an optically clear adhesive (OCA: Optically Clear Adhesive).

[0073] Figure 4 is a plan view of a display panel according to an embodiment of the present invention.

[0074] Reference Figure 4 , the display panel DP may include a base layer BS divided into an active area AA and a peripheral area NAA. The display panel DP may include pixels PX arranged in the active area AA and signal lines SGL electrically connected to the pixels PX. The display panel DP may include a driving circuit GDC and a pad part PLD arranged in the peripheral area NAA.

[0075] The pixels PX may be arranged along the first direction DR1 and the second direction DR2. The pixels PX may include a plurality of pixel rows extending along the first direction DR1 and arranged along the second direction DR2 and a plurality of pixel columns extending along the second direction DR2 and arranged along the first direction DR1.

[0076] The signal lines SGL may include gate lines GL, data lines DL, power lines PL, and control signal lines CSL. Each of the gate lines GL may be connected to a corresponding pixel in the pixels PX, and each of the data lines DL may be connected to a corresponding pixel in the pixels PX. The power lines PL may be electrically connected to the pixels PX. The control signal lines CSL may be connected to the drive circuit GDC and provide a control signal to the drive circuit GDC.

[0077] The driving circuit GDC may include a gate driving circuit. The gate driving circuit may generate a gate signal and sequentially output the generated gate signal to the gate line GL. The gate driving circuit may also output another control signal to the pixel driving circuit.

[0078] The pad part PLD may include a pixel pad D-PD and an input pad I-PD.

[0079] The pixel pad D-PD can be used to connect the flexible circuit film D-FCB ( Figure 2) is connected to the pad of the display panel DP. Each of the pixel pads D-PD can be connected to a corresponding signal line in the signal line SGL. The pixel pad D-PD can be connected to the corresponding pixel PX through the signal line SGL. In addition, one of the pixel pads D-PD can be connected to the driving circuit GDC.

[0080] The input pad I-PD can be used to make the flexible circuit film D-FCB ( Figure 2 ) is connected to the input sensing layer ISP ( Figure 3 ) pad. Although Figure 4 The case where the input pad I-PD is arranged on the display panel DP is shown, but it is not limited thereto, and the input pad I-PD may be arranged on the input sensing layer ISP and may be connected to a circuit board independent of the pixel pad D-PD.

[0081] Figure 5 is a plan view of an enlarged active area of ​​a display panel according to an embodiment of the present invention. Figure 5 An arrangement relationship of the opening area OA, the first pixel area PXA-B, the second pixel area PXA-R, and the third pixel area PXA-G in a direction of observing the front surface of the display device DD is shown.

[0082] Reference Figure 5 , the opening area OA can be set to be multiple and not overlap with the first pixel area PXA-B to the third pixel area PXA-G in the plane. In the plane, the multiple opening areas OA can be arranged crosswise with the multiple third pixel areas PXA-G along the first direction DR1. In the plane, the multiple opening areas OA can be arranged crosswise with the multiple second pixel areas PXA-R along the second direction DR2. The arrangement described above is exemplary. Different from the illustration, the multiple opening areas OA can be arranged between the first pixel area PXA-B and the second pixel area PXA-R in the first direction DR1. The opening area OA may include first opening areas OA1 ( Figure 7 ) and the second opening area OA2 ( Figure 8 ), the first opening area OA1 ( Figure 7 ) may have a smaller area on a plane than the second opening area OA2 ( Figure 8 The smaller the area of ​​the opening area OA on the plane, the closer the pixel regions PXA-B, PXA-R, and PXA-G can be arranged to each other, thereby improving the integration degree.

[0083] On a plane, the first pixel region PXA-B and the second pixel region PXA-R may be arranged crosswise along the first direction DR1. The third pixel region PXA-G may be arranged in a pixel row different from the first pixel region PXA-B and the second pixel region PXA-R, and the third pixel region PXA-G may be arranged in the same pixel row along the first direction DR1. The first pixel region PXA-B and the second pixel region PXA-R may be arranged crosswise along the first direction DR1. The arrangement of the first pixel region PXA-B to the third pixel region PXA-G is not limited thereto.

[0084] On a plane, the non-light emitting area NPXA does not overlap with the opening area OA and the first to third pixel areas PXA-B to PXA-G. Figure 5 In the embodiment, the remaining area except the opening area OA and the first to third pixel areas PXA-B to PXA-G may be the non-luminous area NPXA. On a plane, the opening area OA and the first to third pixel areas PXA-B to PXA-G may be surrounded by the non-luminous area NPXA.

[0085] On a plane, the first electrode AE ​​may overlap the opening area OA and the first to third pixel areas PXA-B to PXA-G, respectively. On a plane, a portion of the first electrode AE ​​may overlap the non-emission area NPXA.

[0086] Figure 6 A display device according to an embodiment of the present invention is provided along Figure 5 The cross-sectional view is taken along line II'. Figure 5 The II' line shown shows the situation of cutting off the third pixel region PXA-G, but this is an example, and the description of the third pixel region PXA-G can also be applied to the first pixel region PXA-B and the second pixel region PXA-R.

[0087] Reference Figure 6 , the display panel DP may include a base layer BS, a circuit element layer DP-CL, a display element layer DP-OLED and an encapsulation layer TFE.

[0088] The base layer BS may include a synthetic resin film. In addition, the base layer BS may include a glass substrate, a metal substrate, an organic / inorganic composite material substrate, etc. For example, the base layer BS may be a silicon substrate including silicon. The base layer BS may be a silicon wafer.

[0089] A buffer layer BFL composed of at least one inorganic layer is arranged on the upper surface of the base layer BS. The buffer layer BFL improves the bonding force between the base layer BS and the semiconductor pattern. The buffer layer BFL may include a silicon oxide layer and a silicon nitride layer. The silicon oxide layer and the silicon nitride layer may be alternately stacked.

[0090] The display panel DP may include a plurality of insulating layers and semiconductor patterns, conductive patterns, signal lines, etc. The insulating layers, semiconductor layers, and conductive layers are formed by coating, deposition, etc. Then, the insulating layers, semiconductor layers, and conductive layers may be selectively patterned by photolithography and etching. In this way, semiconductor patterns, conductive patterns, signal lines, etc. included in the circuit element layer DP-CL and the display element layer DP-OLED are formed.

[0091] A semiconductor pattern is arranged on the buffer layer BFL. The semiconductor pattern may include polycrystalline silicon. However, not limited thereto, the semiconductor pattern may also include amorphous silicon or metal oxide. The semiconductor pattern may be arranged in a specific rule across multiple light-emitting regions. The semiconductor pattern has different electrical properties depending on whether it is doped or not. The semiconductor pattern may include a first region with a large doping concentration and a second region with a small doping concentration. The first region may be doped with an N-type dopant or a P-type dopant. A P-type transistor includes a first region doped with a P-type dopant.

[0092] The conductivity of the first region is greater than that of the second region, and substantially functions as an electrode or a signal line. The second region substantially corresponds to an active region (or channel) of a transistor. In other words, a portion of the semiconductor pattern may be an active region of a transistor, another portion may be a source or drain of the transistor, and another portion may be a conductive region.

[0093] like Figure 6 As shown, the source S1 , the active area A1 , and the drain D1 of the transistor T1 are formed by a semiconductor pattern. Figure 6 A portion of a signal transmission line SCL formed of a semiconductor pattern is shown. Although not separately shown, the signal transmission line SCL may be connected to the drain D1 of the transistor T1 in plane.

[0094] A first insulating layer 10 to a second auxiliary insulating layer 60 are arranged on the buffer layer BFL. The first insulating layer 10 to the second auxiliary insulating layer 60 may be an inorganic layer or an organic layer. A gate G1 is arranged on the first insulating layer 10. An upper electrode UE may be arranged on the second insulating layer 20. A first connection electrode CNE1 may be arranged on the fourth insulating layer 40. The first connection electrode CNE1 may be connected to the signal transmission line SCL through a contact hole CNT-1 that penetrates the first insulating layer 10 to the fourth insulating layer 40. A first auxiliary insulating layer 50 and a second auxiliary insulating layer 60 may be arranged on the fourth insulating layer 40. According to an embodiment, the first auxiliary insulating layer 50 and the second auxiliary insulating layer 60 may be organic layers. A detailed description of the first auxiliary insulating layer 50 and the second auxiliary insulating layer 60 will be described in detail in the description of Figure 7 It will be described later in the description of .

[0095] A second connection electrode CNE2 may be disposed on the first auxiliary insulating layer 50 . The second connection electrode CNE2 may be connected to the first connection electrode CNE1 through a contact hole CNT- 2 penetrating the first auxiliary insulating layer 50 .

[0096] A display element layer DP-OLED may be disposed on the circuit element layer DP-CL. According to the present embodiment, the display element layer DP-OLED may include a light emitting element OLED, a pixel defining layer PDL, and a cover layer CPL.

[0097] The light emitting element OLED is arranged on the second auxiliary insulating layer 60. According to the present embodiment, the light emitting element OLED includes a first electrode AE ​​and a second electrode CE. The light emitting element OLED may further include an intermediate layer ML arranged between the first electrode AE ​​and the second electrode CE. The intermediate layer ML may include a hole control layer HCL, a light emitting layer EML, and an electron control layer ECL. On a plane, a portion of the intermediate layer ML may overlap with the pixel opening OP-P. The intermediate layer ML may include an intermediate layer ML arranged on the first auxiliary electrode SD1 ( Figure 7 ) on the first contact portion TP1 ( Figure 7 ). Regarding the first contact portion TP1 ( Figure 7 ) will be described later.

[0098] The first electrode AE ​​may be arranged on the second auxiliary insulating layer 60. The first electrode AE ​​is connected to the second connection electrode CNE2 through the contact hole CNT-3 penetrating the second auxiliary insulating layer 60. The pixel defining film PDL is arranged on the second auxiliary insulating layer 60. A pixel opening OP-P is defined in the pixel defining film PDL. The pixel opening OP-P exposes at least a portion of the first electrode AE. At least a portion of the first electrode AE ​​is arranged in the pixel opening OP-P.

[0099] In one embodiment, the pixel defining layer PDL may include a light absorbing substance, a black coloring agent, a black dye, a black pigment, a metal such as carbon black, chromium, or an oxide thereof.

[0100] The hole control layer HCL may be disposed on the first electrode AE. The hole control layer HCL may be disposed in the third pixel region PXA-G and the non-light emitting region NPXA. The hole control layer HCL may include a hole transport layer and may further include a hole injection layer.

[0101] The light emitting layer EML may be disposed between the first electrode AE ​​and the second electrode CE. The light emitting layer EML may be disposed on the hole control layer HCL. The light emitting layer EML may be disposed together in the third pixel region PXA-G and the non-light emitting region NPXA.

[0102] The electron control layer ECL may be disposed on the light emitting layer EML. The electron control layer ECL may include an electron transport layer and may further include an electron injection layer.

[0103] The second electrode CE is arranged on the first electrode AE. The second electrode CE may be arranged on the electronic control layer ECL. The electronic control layer ECL and the second electrode CE may be arranged together in the third pixel region PXA-G and the non-luminous region NPXA. The second electrode CE is electrically connected to the first auxiliary electrode SD1 ( Figure 7 The second electrode CE may include the first auxiliary electrode SD1 ( Figure 7 ) directly contacts the second contact portion TP2 ( Figure 7 Regarding the second contact portion TP2 ( Figure 7 ) will be described in detail later.

[0104] The cover layer CPL is disposed on the second electrode CE. The cover layer CPL may be commonly disposed in the third pixel region PXA-G and the non-emission region NPXA.

[0105] According to an embodiment, the cover layer CPL may include an inorganic substance and may be formed by a sputtering deposition process.

[0106] The cover layer CPL covers the second electrode CE to protect the second electrode CE and the light emitting layer EML from external moisture penetration or contamination. In addition, by adjusting the refractive index and thickness of the cover layer CPL, the light totally reflected at the interface between the second electrode CE and the cover layer CPL can be reduced.

[0107] The encapsulation layer TFE may be arranged on the display element layer DP-OLED. The encapsulation layer TFE may seal the display element layer DP-OLED. The encapsulation layer TFE may be one layer or a layer stacked with multiple layers. The encapsulation layer TFE includes at least one organic film.

[0108] According to an embodiment, the encapsulation layer TFE may include a first inorganic layer IOL1, an organic layer OL, and a second inorganic layer IOL2. The first inorganic layer IOL1 may be disposed on the cover layer CPL. The organic layer OL may be disposed on the first inorganic layer IOL1. The second inorganic layer IOL2 is disposed on the organic layer OL and may cover the organic layer OL.

[0109] The first inorganic layer IOL1 and the second inorganic layer IOL2 may protect the display element layer DP-OLED from moisture / oxygen, and the organic layer OL may protect the display element layer DP-OLED from foreign substances such as dust particles.

[0110] Figure 7 and Figure 8 A display device according to an embodiment of the present invention is provided along Figure 5 The cross-sectional view is taken along line II-II'. Figure 7 1 is a diagram showing a case where a first opening area OA1 is defined. Figure 8 2 is a diagram showing a case where a second opening area OA2 is defined. Figure 6 The configuration described in is described below without repeating the description.

[0111] Reference Figure 7 The circuit element layer DP-CL includes a first auxiliary insulating layer 50, a second auxiliary insulating layer 60, a first auxiliary electrode SD1, and a second auxiliary electrode SD2. The first auxiliary electrode SD1 may be disposed on the fourth insulating layer 40. The first auxiliary electrode SD1 may be directly disposed on the fourth insulating layer 40. The first auxiliary electrode SD1 is a conductor. The first auxiliary electrode SD1 may include a first connection electrode CNE1 ( Figure 6 ) of the same material. The first auxiliary electrode SD1 includes an upper surface U-SD1 parallel to the first direction DR1. A first contact portion TP1 and a second contact portion TP2 may be arranged on the upper surface U-SD1 of the first auxiliary electrode SD1. The first contact portion TP1 and the second contact portion TP2 may be directly arranged on the upper surface U-SD1 of the first auxiliary electrode SD1. If the second contact portion TP2 is directly arranged on the upper surface U-SD1 of the first auxiliary electrode SD1, the second electrode CE is electrically connected to the first auxiliary electrode SD1. If the second contact portion TP2 included in the second electrode CE is directly arranged on the first auxiliary electrode SD1, since the electrons moving through the second electrode CE pass through the first auxiliary electrode SD1, the cross-sectional area of ​​the channel is increased and the resistance can be reduced.

[0112] The first auxiliary insulating layer 50 may be disposed on the first auxiliary electrode SD1. The first auxiliary insulating layer 50 may be directly disposed on the first auxiliary electrode SD1. In a plane, the first auxiliary insulating layer 50 may overlap a portion of the first auxiliary electrode SD1. An opening portion OP is defined in the first auxiliary insulating layer 50. In a plane, the opening portion OP may overlap the first opening area OA1. In a plane, the opening portion OP may overlap the pixel opening portion OP-P ( Figure 6 ) do not overlap. The diameter of the opening OP on a plane may be greater than 10 micrometers and less than 15 micrometers. For example, the diameter of the opening OP on a plane may be 10 micrometers. The opening OP may be a structure that provides a space so that the second electrode CE can be electrically connected to the first auxiliary electrode SD1. At least a portion of the first auxiliary electrode SD1 is arranged in the opening OP. At least a portion of the first auxiliary electrode SD1 is exposed through the opening OP.

[0113] The second auxiliary electrode SD2 includes a 2-1 portion SD2-1 disposed on the first auxiliary electrode SD1 and a 2-2 portion SD2-2 separated from the upper surface U-SD1 of the first auxiliary electrode SD1. The second auxiliary electrode SD2 may further include a 2-3 portion SD2-3 separated from the upper surface U-SD1 of the first auxiliary electrode SD1. The 2-2 portion SD2-2 may be a portion extending and protruding from one side of the 2-1 portion SD2-1. The 2-3 portion SD2-3 may be a portion extending and protruding from the other side of the 2-1 portion SD2-1. At least a portion of the second auxiliary electrode SD2 is disposed in the opening OP. The second auxiliary electrode SD2 may include a second connection electrode CNE2 ( Figure 6 The area of ​​the second auxiliary electrode SD2 on the plane may be smaller than the area of ​​the first auxiliary electrode SD1 on the plane.

[0114] The 2-1 portion SD2-1 may be directly disposed on the first auxiliary electrode SD1. The 2-1 portion SD2-1 may electrically connect the first auxiliary electrode SD1 and the second auxiliary electrode SD2.

[0115] The 2-2 portion SD2-2 includes a first surface SDS1 having a first angle AG1 with the upper surface U-SD1 of the first auxiliary electrode SD1. The first angle AG1 may be an acute angle. In the case where the first angle AG1 is not an acute angle but an obtuse angle, the difficulty of the manufacturing process may increase. The 2-2 portion SD2-2 may be arranged in the opening portion OP. A portion of the 2-2 portion SD2-2 may be exposed by the opening portion OP. The second contact portion TP2 may be arranged between the first contact portion TP1 and the first surface SDS1. On a plane, the second contact portion TP2 may overlap with the 2-2 portion SD2-2. On a plane, the first contact portion TP1 may not overlap with the 2-2 portion SD2-2.

[0116] The second auxiliary insulating layer 60 is arranged on the first auxiliary insulating layer 50. The second auxiliary insulating layer 60 may be directly arranged on the first auxiliary insulating layer 50. In a plane, the second auxiliary insulating layer 60 may overlap with the opening portion OP. The opening portion OP may penetrate the second auxiliary insulating layer 60 and the pixel definition film PDL. The opening portion OP may provide a space in which a portion of each of the intermediate layer ML and the second electrode CE can be directly arranged on the first auxiliary electrode SD1. A portion of the second auxiliary insulating layer 60 may be arranged on the second auxiliary electrode SD2. In a plane, the second auxiliary insulating layer 60 may not overlap with the first contact portion TP1 and the second contact portion TP2, respectively.

[0117] Reference Figure 8 In a plane, the second opening area OA2 overlaps with the second auxiliary electrode SD2. Figure 8 The second opening area OA2 shown is Figure 7 The difference between the first opening area OA1 shown is that: Figure 8 The second opening area OA2 shown has a difference in that the opening portion OP overlaps the entire second auxiliary electrode SD2 in plane rather than overlapping a portion of the second auxiliary electrode SD2 .

[0118] In one embodiment, the second auxiliary electrode SD2 may further include a 2-3 portion SD2-3. A portion of the 2-3 portion SD2-3 may be exposed by the opening portion OP. The 2-3 portion SD2-3 may include a second surface SDS2 having a second angle AG2 with the upper surface U-SD1 of the first auxiliary electrode SD1. The second angle AG2 may be an acute angle. The first angle AG1 and the second angle AG2 may be substantially the same. In the case where the second angle AG2 is not an acute angle but an obtuse angle, the difficulty of the manufacturing process may increase. The opening portion OP may expose the second surface SDS2. The second contact portion TP2 may be arranged between the first contact portion TP1 and the second surface SDS2.

[0119] The second opening area OA2 may have a larger area than the first opening area OA1 ( Figure 7 ) has a wider area on the plane. Since the opening portion OP of the second opening area OA2 can expose the 2-3 portion SD2-3, the second contact portion TP2 can be arranged not only between the 2-1 portion SD2-1 and the first contact portion TP1, but also additionally between the first contact portion TP1 and the second surface SDS2. If the second contact portion TP2 is additionally arranged between the first contact portion TP1 and the second surface SDS2, the area in contact with the first auxiliary electrode SD1 increases, so that the resistance of the second electrode CE can be further reduced.

[0120] Next, the manufacturing method of the display device of the present invention is described. Figures 1 to 8 Detailed description of the structure described in .

[0121] Fig. 9 is a flow chart of a method for manufacturing a display device according to an embodiment of the present invention. Figures 10 to 17 is a cross-sectional view showing a part of a method for manufacturing a display device according to an embodiment of the present invention.

[0122] Reference Fig. 9 The manufacturing method of the display device according to the present invention comprises the following steps: forming a first auxiliary insulating layer on a first auxiliary electrode (S110); forming a preliminary opening portion overlapping the first auxiliary electrode on a plane in the first auxiliary insulating layer (S120); forming a second auxiliary electrode, the second auxiliary electrode being arranged in the preliminary opening portion and comprising a 2-1 portion and a 2-2 portion, the 2-1 portion being arranged on the first auxiliary electrode, the 2-2 portion comprising a first surface having a first angle with an upper surface of the first auxiliary electrode and being separated from the upper surface of the first auxiliary electrode (S130); forming a first auxiliary insulating layer on the first auxiliary insulating layer and the second auxiliary electrode on the first auxiliary electrode; forming a second auxiliary electrode on the first auxiliary electrode; forming a second auxiliary electrode on the first auxiliary electrode; forming a second auxiliary electrode on the first auxiliary electrode; forming a second auxiliary electrode on the first auxiliary electrode; forming a second auxiliary electrode on the first auxiliary electrode; forming a second auxiliary electrode on the first auxiliary electrode; forming a second auxiliary electrode on the first auxiliary electrode; forming a second auxiliary electrode on the first auxiliary electrode A second auxiliary insulating layer is formed on the second auxiliary electrode (S140); a mask including a first hole overlapping with the prepared opening portion on a plane is arranged on the second auxiliary insulating layer (S150); a portion of the first auxiliary insulating layer and a portion of the second auxiliary insulating layer overlapping with the first hole on a plane are respectively etched to form an opening portion exposing the 2-2 portion and a portion of the first auxiliary electrode (S160); a first electrode that does not overlap with the opening portion and an intermediate layer arranged on the first electrode are formed (S170); and a second electrode arranged on the intermediate layer and electrically connected to the first auxiliary electrode is formed (S180).

[0123] Also refer to Fig. 9 and Fig.10According to an embodiment of the present invention, the method for manufacturing a display device includes the following steps: forming a first auxiliary insulating layer 50 on the first auxiliary electrode SD1 (S110). The first auxiliary electrode SD1 may be formed on the fourth insulating layer 40 ( Figure 6 ) and on the fourth insulating layer 40 ( Figure 6 ) may be arranged with a third insulating layer 30 ( Figure 6 )、the second insulating layer 20( Figure 6 )、the first insulating layer 10( Figure 6 )、Buffer layer BFL( Figure 6 ) and the base layer BS ( Figure 6 ), but they are omitted for illustration. The first auxiliary insulating layer 50 may be formed to cover the upper surface and side surfaces of the first auxiliary electrode SD1.

[0124] Also refer to Fig. 9 and Fig.11 , a method for manufacturing a display device according to an embodiment includes the following steps: forming a preliminary opening portion POP overlapping with the first auxiliary electrode SD1 on a plane in the first auxiliary insulating layer 50 (S120). The preliminary opening portion POP may be formed by etching a portion of the first auxiliary insulating layer 50. The preliminary opening portion POP may be formed by dry etching a portion of the first auxiliary insulating layer 50. The preliminary opening portion POP may completely penetrate the first auxiliary insulating layer 50. A portion of the first auxiliary electrode SD1 may be exposed through the preliminary opening portion POP.

[0125] Also refer to Fig. 9 and Fig.12According to an embodiment, a method for manufacturing a display device includes the following steps: forming a second auxiliary electrode SD2, the second auxiliary electrode SD2 is arranged in the preliminary opening portion POP, and includes a 2-1 portion SD2-1 and a 2-2 portion SD2-2, the 2-1 portion SD2-1 is arranged on the first auxiliary electrode SD1, the 2-2 portion SD2-2 includes a first surface SDS1 having a first angle AG1 with an upper surface U-SD1 of the first auxiliary electrode SD1 and is separated from the upper surface U-SD1 of the first auxiliary electrode SD1 (S130). The first angle AG1 may be an acute angle. In the case where the first angle AG1 is an obtuse angle, the process difficulty may increase. The step of forming the second auxiliary electrode SD2 (S130) may include the following steps: forming a 2-3 portion including a second surface SDS2 having a second angle AG2 with the upper surface U-SD1 of the first auxiliary electrode SD1 and being separated from the upper surface U-SD1 of the first auxiliary electrode SD1. The second angle AG2 may be an acute angle. In the case where the second angle AG2 is an obtuse angle, the process difficulty may increase. The first angle AG1 and the second angle AG2 may be substantially the same as each other. The 2-2 portion SD2-2 and the 2-3 portion SD2-3 may be directly disposed on the first auxiliary insulating layer 50. The 2-1 portion SD2-1 may be directly disposed on the first auxiliary electrode SD1. The 2-1 portion SD2-1 may be directly disposed on a portion of the first auxiliary electrode SD1 exposed by the preliminary opening portion POP.

[0126] Also refer to Fig. 9 and Fig.13 , a method for manufacturing a display device according to an embodiment includes the following steps: forming a second auxiliary insulating layer 60 on the first auxiliary insulating layer 50 and the second auxiliary electrode SD2 (S140). The second auxiliary insulating layer 60 may be directly disposed on the first auxiliary insulating layer 50 and the second auxiliary electrode SD2. The second auxiliary insulating layer 60 may cover the first auxiliary insulating layer 50 and the second auxiliary electrode SD2. In a region where the second auxiliary insulating layer 60 overlaps with the 2-1 portion SD2-1 on a plane, a portion of the second auxiliary insulating layer 60 may be formed in a recessed manner.

[0127] Also refer to Fig. 9 , Fig.14 and Fig.15, a method for manufacturing a display device according to an embodiment includes the following steps: arranging a mask MK including a first hole HL1 overlapping with a preliminary opening portion POP on a plane on a second auxiliary insulating layer 60 (S150); and etching a portion of the first auxiliary insulating layer 50 and a portion of the second auxiliary insulating layer 60 overlapping with the first hole HL1 on a plane to form an opening portion OP exposing a portion of the 2-2 portion SD2-2 and the first auxiliary electrode SD1 (S160). The mask MK may be arranged to be separated from the second auxiliary insulating layer 60 in a third direction DR3. On a plane, the first hole HL1 may not overlap with the 2-1 portion SD2-1, so that the second auxiliary insulating layer 60 arranged on the 2-1 portion SD2-1 is not etched. If the first hole HL1 does not overlap with the 2-1 portion SD2-1 on a plane, the area of ​​the second auxiliary insulating layer 60 to be etched is reduced, thereby improving the efficiency of the etching process. The mask MK may also include a second hole HL2 overlapping with the preliminary opening portion POP on a plane. Unlike the illustration, the second hole HL2 does not exist, and the first hole HL1 may overlap the 2-1 portion SD2-1, at least a portion of the first auxiliary insulating layer 50, and the 2-3 portion SD2-3, respectively, on a plane. If the first hole HL1 overlaps the 2-1 portion SD2-1, at least a portion of the first auxiliary insulating layer 50, and the 2-3 portion SD2-3, respectively, on a plane, the opening portion OP is formed wider, thereby Figure 7 As shown in the figure, the second surface SDS2 is not exposed and a part of the second electrode CE is not arranged between the upper surface U-SD1 and the second surface SDS2. Figure 8 ) The area in contact with the first auxiliary electrode SD1 is widened, thereby being able to more effectively reduce resistance. The etching in the process of respectively etching a portion of the first auxiliary insulating layer 50 and a portion of the second auxiliary insulating layer 60 overlapping the first hole HL1 on a plane may be dry etching.

[0128] Also refer to Fig. 9 and Fig.16 The manufacturing method of the display device of one embodiment includes the following steps: forming a first electrode AE ​​( Figure 6 ) and arranged on the first electrode AE ​​( Figure 6) on the second auxiliary insulating layer 60 (S170). The first electrode AE ​​may be arranged on the second auxiliary insulating layer 60. The step S170 of forming the intermediate layer ML may include spraying a constituent material of the intermediate layer ML in a direction opposite to the third direction DR3. For example, the constituent material of the intermediate layer ML may include a well-known organic electroluminescent material. A portion of the intermediate layer ML directly arranged on the first auxiliary electrode SD1 does not overlap with the 2-2 portion SD2-2 on a plane. The intermediate layer ML may be arranged on the second auxiliary insulating layer 60, the 2-2 portion SD2-2, the 2-3 portion SD2-3, and the first auxiliary electrode SD1. Unlike the illustration, the second auxiliary insulating layer 60 may not be arranged on the second auxiliary electrode SD2, in which case the intermediate layer ML may be directly arranged on the second auxiliary electrode SD2.

[0129] Also refer to Fig. 9 and Fig.17, a manufacturing method of a display device according to an embodiment includes the following steps: forming a second electrode CE disposed on the middle layer ML and electrically connected to the first auxiliary electrode SD1 (S180). The step S180 of forming the second electrode CE may include the following steps: forming a second contact portion TP2 disposed directly on the first auxiliary electrode SD1 by spraying a constituent material of the second electrode CE in a direction forming a predetermined angle with the third direction DR3. The constituent material of the second electrode CE may include at least one of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, Yb, and compounds containing them (e.g., AgYb, AgMg and MgAg compounds according to the content, etc.) or mixtures (e.g., mixtures of Ag and Mg), and substances having a multilayer structure such as LiF / Ga, LiF / Al. Since the first surface SDS1 is separated from the upper surface U-SD1 of the first auxiliary electrode SD1 and forms a first angle AG1, the constituent material of the second electrode CE can be sprayed in a direction having a predetermined angle opposite to the third direction DR3, so that the second contact portion TP2 can be directly arranged on the first auxiliary electrode SD1. The angle at which the constituent material of the second electrode CE is sprayed can form a predetermined angle with the angle at which the constituent material of the intermediate layer ML is sprayed, so that a portion of the second electrode CE can be directly arranged on the first auxiliary electrode SD1. Compared with the existing method of providing an intermediate layer as a common layer and then using a laser drill to form an opening portion so that a portion of the second electrode contacts the auxiliary electrode, the manufacturing method of the display device of one embodiment has a relatively small size of the formed opening portion, which is conducive to improving the integration. The second electrode CE may include a second contact portion TP2 directly arranged on the first auxiliary electrode SD1. The second electrode CE may be electrically connected to the first auxiliary electrode SD1 through the second contact portion TP2. The second auxiliary electrode SD2 may be directly arranged on the first auxiliary electrode SD1 and electrically connected to the first auxiliary electrode SD1. Since the second electrode CE may be electrically connected to the first auxiliary electrode SD1 and the second auxiliary electrode SD2 through the second contact portion TP2 , resistance may be effectively reduced by increasing a cross-sectional area of ​​a channel through which electrons move.

[0130] Also refer to Fig.18 and Fig.19In one embodiment, the manufacturing method of the display device may further include the following steps: before the step of forming the opening portion, a portion of the first auxiliary insulating layer 50 and a portion of the second auxiliary insulating layer 60 that overlap with the first auxiliary electrode SD1 on the plane and do not overlap with the second auxiliary electrode SD2 on the plane are respectively etched to form a sub-opening portion SOP. In order to form the sub-opening portion SOP, a first mask MK1 including a 1-1 hole HL1-1 and a 1-2 hole HL1-2 may be arranged on the second auxiliary insulating layer 60. Each of the 1-1 hole HL1-1 and the 1-2 hole HL1-2 may not overlap with the second auxiliary electrode SD2 on the plane. The etching in the process of forming the sub-opening portion SOP may be dry etching. The sub-opening portion SOP may include a first sub-opening portion SOP1 and a second sub-opening portion SOP2. The first sub-opening portion SOP1 may not expose the 2-1 portion SD2-1. The second sub-opening portion SOP2 may not expose the 2-3 portion SD2-3. Opening portion OP ( Fig.16 ) may be greater than the depth of the sub-opening SOP. The sub-opening SOP may not completely penetrate the first auxiliary insulating layer 50. The sub-opening SOP is formed to improve the difficulty of the process of forming the opening OP. If the sub-opening SOP is formed before forming the opening OP, the time and energy consumption required for etching to form the opening OP are improved, and a portion of the first auxiliary insulating layer 50 formed between the 2-2 portion SD2-2 and the first auxiliary electrode SD1 and a portion of the first auxiliary insulating layer 50 formed between the 2-3 portion SD2-3 and the first auxiliary electrode SD1 can be effectively etched. If a portion of the first auxiliary insulating layer 50 formed between the 2-2 portion SD2-2 and the first auxiliary electrode SD1 and a portion of the first auxiliary insulating layer 50 formed between the 2-3 portion SD2-3 and the first auxiliary electrode SD1 are effectively etched, the formation of the second electrode CE ( Fig.17 ) can be easily arranged in a space directly on the first auxiliary electrode SD1.

[0131] The above description is made with reference to the preferred embodiments of the present invention, but a person who is a mature technician in the technical field to which the present invention belongs or a person who has general knowledge in the technical field to which the present invention belongs can understand that various modifications and changes can be made to the present invention without departing from the concept and technical field of the present invention recorded in the claims. Therefore, the technical scope of the present invention is not limited to the contents recorded in the detailed description of the specification, but should only be determined by the claims.

Claims

1. A display device, comprising: A first auxiliary insulating layer is defined with an opening; a second auxiliary insulating layer, arranged on the first auxiliary insulating layer; A pixel defining film, arranged on the second auxiliary insulating layer and defining a pixel opening; A first auxiliary electrode, at least a portion of which is arranged in the opening; a second auxiliary electrode, at least a portion of which is arranged in the opening, and includes a 2-1 portion and a 2-2 portion, wherein the 2-1 portion is arranged on the first auxiliary electrode, and the 2-2 portion includes a first surface having a first angle with an upper surface of the first auxiliary electrode and is separated from the upper surface of the first auxiliary electrode; A first electrode, at least a portion of which is arranged in the pixel opening; as well as The second electrode is arranged on the first electrode and electrically connected to the first auxiliary electrode.

2. The display device according to claim 1, wherein: The 2-2 portion is arranged in the opening.

3. The display device according to claim 1, wherein: A portion of the second auxiliary insulating layer is disposed on the second auxiliary electrode.

4. The display device according to claim 1, wherein: The first angle is an acute angle.

5. The display device according to claim 1, wherein: The 2-1 portion is directly arranged on the first auxiliary electrode.

6. The display device according to claim 1, wherein: The second auxiliary electrode further includes a 2-3 portion including a second surface having a second angle with the upper surface of the first auxiliary electrode and spaced apart from the upper surface of the first auxiliary electrode.

7. The display device according to claim 6, wherein: The second angle is an acute angle.

8. The display device according to claim 1, wherein: In a plane, the pixel opening portion does not overlap with the opening portion.

9. A display device, comprising: Base layer; A circuit element layer is arranged on the base layer; as well as The display element layer is arranged on the circuit element layer, and includes a pixel defining film and a light emitting element. Wherein, the circuit element layer comprises: A first auxiliary insulating layer is defined with an opening; a second auxiliary insulating layer, arranged on the first auxiliary insulating layer; A first auxiliary electrode, at least a portion of which is arranged in the opening; and a second auxiliary electrode, at least a portion of which is arranged in the opening, and includes a 2-1 portion and a 2-2 portion, wherein the 2-1 portion is arranged on the first auxiliary electrode, and the 2-2 portion includes a first surface having a first angle with an upper surface of the first auxiliary electrode and is separated from the upper surface of the first auxiliary electrode, The pixel defining film is arranged on the second auxiliary insulating layer, and a pixel opening is defined in the pixel defining film. The light emitting element comprises: A first electrode, at least a portion of which is arranged in the pixel opening; a second electrode disposed on the first electrode and electrically connected to the first auxiliary electrode; and The intermediate layer is arranged between the first electrode and the second electrode, and at least a portion of the intermediate layer is arranged in the pixel opening.

10. A method for manufacturing a display device, comprising the following steps: forming a first auxiliary insulating layer on the first auxiliary electrode; forming a preliminary opening portion in the first auxiliary insulating layer so as to overlap with the first auxiliary electrode in a plane; forming a second auxiliary electrode, the second auxiliary electrode being arranged in the preliminary opening and comprising a 2-1 portion and a 2-2 portion, the 2-1 portion being arranged on the first auxiliary electrode, the 2-2 portion comprising a first surface having a first angle with an upper surface of the first auxiliary electrode and being spaced apart from the upper surface of the first auxiliary electrode; forming a second auxiliary insulating layer on the first auxiliary insulating layer and the second auxiliary electrode; disposing a mask including a first hole overlapping the preliminary opening portion in a plane on the second auxiliary insulating layer; respectively etching a portion of the first auxiliary insulating layer and a portion of the second auxiliary insulating layer which overlap with the first hole in a plane to form an opening portion exposing the 2-2 portion and a portion of the first auxiliary electrode; forming a first electrode that does not overlap the opening and an intermediate layer disposed on the first electrode; as well as A second electrode is formed which is disposed on the intermediate layer and is electrically connected to the first auxiliary electrode.