Organic light emitting display device and method for manufacturing the same

Abstract

An organic light emitting display device and a method for manufacturing the organic light emitting display device are discussed. The organic light emitting display device includes: a lower substrate having a plurality of sub-pixels; an anode disposed on the lower substrate; a bank disposed to overlap an end portion of the anode and configured to define a light emitting region; an organic light emitting layer disposed on the anode and the bank; a cathode disposed on the organic light emitting layer; the upper substrate and the lower substrate are oppositely arranged; a black matrix disposed on one surface of the upper substrate and protruding toward the lower substrate and defining an opening region corresponding to the light emitting region; a color filter disposed on one surface of the upper substrate to correspond to the opening region; and a reflective layer disposed on a side surface of the black matrix.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority of Korean Patent Application No. 10-2023-0127316 filed in the Korean Intellectual Property Office on September 22, 2023, the entire contents of which are hereby expressly incorporated into this application by reference. Technical Field

[0003] The present disclosure relates to an organic light emitting display device, and more particularly, to an organic light emitting display device including a reflective layer and a black matrix and a method of manufacturing the same. Background Art

[0004] Unlike a liquid crystal display (LCD) device having a backlight, an organic light emitting display (OLED) device does not require a separate light source. Therefore, the advantages of the organic light emitting display device are that the organic light emitting display device can be made light and thin, can be easily processed, and because the organic light emitting display device can be operated by a low voltage, the power consumption is low.

[0005] Among them, the organic light-emitting display device can have an autonomous light-emitting element, and the layer of the organic light-emitting display device can be configured by a thin organic film. An additional advantage of the organic light-emitting display device is that the organic light-emitting display device can have excellent flexibility and elasticity compared to other display devices, and can therefore be implemented as a flexible display device.

[0006] Generally, an organic light-emitting display device refers to a display device using an organic light-emitting element that injects electrons from a cathode and holes from an anode into a light-emitting layer, where the light-emitting layer emits light when excitons generated by coupling the injected electrons and holes fall from an excited state to a ground state.

[0007] Meanwhile, organic light-emitting display devices that employ microcavities to improve the light-emitting efficiency of organic light-emitting display devices are being continuously studied. A microcavity means that light is repeatedly reflected between two layers spaced apart by an optical path length, so that light having a specific wavelength is amplified by constructive interference. In the case of a top-emission type organic light-emitting display device, a microcavity is applied in such a manner that light emitted from an organic light-emitting layer is repeatedly reflected between an anode including a reflective layer and a cathode configured by a semi-transmissive layer.

[0008] In addition, in the case of a bottom emission type organic light-emitting display device, even if the intensity of the microcavity in the bottom emission type organic light-emitting display device is lower than that in the top emission type organic light-emitting display device, the microcavity can be applied in a process in which light emitted from an organic light-emitting layer is reflected by a cathode.

[0009] As described above, in an organic light-emitting display device to which a microcavity is applied, the front brightness is increased. Therefore, the luminous efficiency of the organic light-emitting display device can be improved, the power consumption can be reduced, and the life span can also be improved. However, the lateral brightness can be reduced to the extent that the front brightness is increased by applying the microcavity to the organic light-emitting display device, and the reduction in the lateral brightness can eventually lead to the problem of reduced viewing angle. Summary of the invention

[0010] An object to be achieved by the present disclosure is to provide an organic light emitting display device including an undercut region between a black matrix and a lower substrate to improve light emitting efficiency and suppress degradation of lateral brightness, thereby solving the problem of reduced viewing angle.

[0011] Another object to be achieved by the present disclosure is to provide an organic light-emitting display device, in which the thickness of the reflective layer arranged on the side surface of the black matrix decreases as the distance from the lower substrate decreases, so that the interference of the reflective layer in the opening area can be suppressed and a wider opening area can be ensured.

[0012] Still another object to be achieved by the present disclosure is to provide a method for manufacturing an organic light emitting display device, the method being provided to form an undercut region.

[0013] The technical problems to be solved by the present disclosure are not limited to the above-mentioned technical problems, and other technical problems that are not mentioned above but can be clearly understood by those skilled in the art according to the following description can also be solved by the present disclosure.

[0014] According to one aspect of the present disclosure, an organic light-emitting display device includes: a lower substrate, which includes a plurality of sub-pixels; an anode, which is disposed on the lower substrate; a dam, which is disposed to overlap with an end of the anode and is configured to define a light-emitting area; an organic light-emitting layer, which is disposed on the anode and the dam; a cathode, which is disposed on the organic light-emitting layer; an upper substrate, which is disposed opposite to the lower substrate; a black matrix, which is disposed on one surface of the upper substrate and protrudes toward the lower substrate and is configured to define an opening area corresponding to the light-emitting area; a color filter, which is disposed on one surface of the upper substrate to correspond to the opening area; and a reflective layer, which is disposed on a side surface of the black matrix, wherein the black matrix includes an undercut area, through which a portion of the bottom surface of the black matrix adjacent to the upper substrate is exposed.

[0015] A method for manufacturing an organic light-emitting display device according to another aspect of the present disclosure includes: preparing a mother substrate and forming a black matrix on the mother substrate; etching the mother substrate on which the black matrix is ​​formed by wet etching, and forming an upper substrate having a protruding portion by isotropically etching the mother substrate; depositing a metal layer including a light-reflective metal material on the upper substrate and the black matrix; applying a photoresist to surround the protruding portion of the upper substrate and at least a portion of the black matrix, and curing the photoresist; removing the metal layer deposited on the upper substrate corresponding to the opening area by dry etching to form a reflective layer arranged on at least a portion of the top surface and side surfaces of the black matrix; applying the photoresist between the black matrices and curing the photoresist to form a color filter.

[0016] Additional details of example implementations are included in the detailed description and accompanying drawings.

[0017] According to one or more aspects of the present disclosure, an undercut region is formed on the bottom surface of a black matrix of an organic light-emitting display device, which can minimize the area of ​​the opening region lost from the originally intended opening region. Therefore, the decrease in the aperture ratio can be suppressed, the aperture ratio can be increased, and the transmittance and brightness can be increased. In addition, the degradation of the external reflection visibility generated when the external light is reflected by the reflective layer provided in the opening region can be suppressed.

[0018] According to one or more aspects of the present disclosure, a viewing angle may be increased by solving a limitation in an organic light emitting display device in which brightness decreases as the viewing angle changes toward a side surface.

[0019] According to one or more aspects of the present disclosure, it is possible to minimize or solve the problem that a screen having the same color in an organic light emitting display device is visually recognized as different color coordinates according to angles.

[0020] The effects according to the present disclosure are not limited to the above-mentioned effects, and the present disclosure includes more various effects.

[0021] Furthermore, other effects not mentioned above will be obviously understood by those of ordinary skill in the art through the following description.

[0022] The above-mentioned objects to be achieved by the present disclosure, means for achieving the objects, and effects of the present disclosure do not specify essential features of the claims, and therefore, the scope of the claims is not limited to the disclosure of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The above and other aspects, features and other advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which:

[0024] Figure 1is a schematic top plan view for explaining an organic light emitting display device according to an embodiment of the present disclosure;

[0025] Figure 2 is along Figure 1 A schematic cross-sectional view taken along line II' of ;

[0026] Figure 3 is a schematic cross-sectional view for explaining an organic light emitting display device according to another embodiment of the present disclosure.

[0027] Figure 4 is a schematic cross-sectional view for explaining an organic light emitting display device according to still another embodiment of the present disclosure.

[0028] Figure 5 is a schematic cross-sectional view for explaining an organic light emitting display device according to a comparative example; and

[0029] 6A to 6F is a cross-sectional view for explaining an example of a method of manufacturing an organic light emitting display device according to various aspects of the present disclosure. DETAILED DESCRIPTION

[0030] The advantages and features of the present disclosure and methods for achieving these advantages and features will become clear by reference to the following example embodiments described in detail in conjunction with the accompanying drawings. However, the present disclosure is not limited to the example embodiments disclosed herein, but will be implemented in various forms. The example embodiments are provided only as examples so that those skilled in the art can fully understand the disclosure of the present disclosure and the scope of the present disclosure.

[0031] The shapes, sizes, ratios, angles, numbers, etc. of the example embodiments for describing the present disclosure shown in the accompanying drawings are merely examples, and the present disclosure is not limited thereto. Throughout the specification, the same reference numerals generally represent the same elements. In addition, in the following description of the present disclosure, a detailed description of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of the present disclosure. Terms such as "comprising", "having" and "consisting of..." used in this article are generally intended to allow the addition of other components, unless these terms are used together with the term "only". Unless otherwise expressly stated, any reference to the singular may include the plural.

[0032] Even if not explicitly stated, the components are interpreted as including the ordinary error range.

[0033] When terms such as "on", "over", "below", and "adjacent" are used to describe the positional relationship between two parts, one or more parts may be located between the two parts unless these terms are used together with the terms "immediately" or "directly".

[0034] When an element or a layer is referred to as being “on” another element or layer, the other layer or element may be directly on the other element or interposed therebetween.

[0035] Although the terms "first", "second", etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components and may not limit the order and sequence. Therefore, in the technical concept of the present disclosure, the first component mentioned below may be the second component.

[0036] Throughout the specification, like reference numerals generally refer to like elements.

[0037] For ease of description, the size and thickness of each component shown in the drawings are shown, but the present disclosure is not limited to the size and thickness of the components shown. In addition, the term "can" fully encompasses all meanings of the term "may".

[0038] The features of the various embodiments of the present disclosure may be partially or entirely dependent on or combined with each other, and may be technically related and operated with each other in various ways, and the embodiments may be performed independently of each other or in association with each other.

[0039] Hereinafter, an organic light emitting display device according to an exemplary embodiment of the present disclosure will be described in detail with reference to the accompanying drawings. All components of each display device according to all embodiments of the present disclosure are operably coupled and configured.

[0040] Figure 1 is a schematic top plan view for explaining an organic light emitting display device according to an embodiment of the present disclosure. Figure 2 is along Figure 1 A cross-sectional view taken along line II'.

[0041] Reference Figure 1 and Figure 2 The organic light-emitting display device 100 according to an embodiment of the present disclosure includes a lower substrate 110, a thin film transistor 120, an organic light-emitting element 130, a bonding layer 140, a black matrix 150, a reflective layer 160, a color filter layer CF (CF_R, CF_G and CF_B) and an upper substrate 170.

[0042] The organic light-emitting display device 100 according to an embodiment of the present disclosure may be configured as a top-emission organic light-emitting display device. For example, the organic light-emitting display device 100 may emit light toward the upper substrate 170. The top-emission organic light-emitting display device is configured so that the light emitted from the organic light-emitting element 130 propagates to the upper substrate 170 disposed opposite to the lower substrate 110 on which the organic light-emitting element 130 is formed. In the top-emission organic light-emitting display device, the cathode 133 may be configured as a transparent electrode or a semi-transmissive electrode to allow the light emitted from the organic light-emitting element 130 to propagate to the upper substrate 170. In addition, the cathode 133 may be formed to be very thin to improve transparency. A specific description thereof will be described below.

[0043] Reference Figure 1 , the lower substrate 110 includes a display area DA and a non-display area NDA. The display area DA is an area in which a plurality of pixels are arranged to basically display an image. A display element for displaying an image and various driving elements for operating the display element may be arranged in the display area DA.

[0044] The organic light-emitting display device 100 of the present disclosure can be folded or bent. To this end, an opening or concave pattern corresponding to the folding or bending area can be formed on the lower substrate 110. Specifically, the lower substrate 110 includes an inner surface arranged to face the organic light-emitting element 130 and an outer surface opposite to the inner surface. In this case, the opening or concave pattern can be a groove portion formed inward from the outer surface, so that the organic light-emitting display device can be folded or bent. The opening or concave pattern can have a structure in which the opening portion (or concave portion) and the blocking portion (or convex portion) are continuously and alternately arranged. Therefore, the opening or concave pattern can give the lower substrate 110 flexibility.

[0045] The display area DA may include a plurality of pixels. The plurality of pixels may be arranged in a matrix shape, and the plurality of pixels may each include a plurality of sub-pixels SP. Each of the sub-pixels SP is an element for displaying one color. The sub-pixel SP may be defined as an area where a plurality of gate lines arranged in a first direction and a plurality of data lines arranged in a second direction different from the first direction intersect each other. In this case, the first direction may be Figure 1 The horizontal direction (e.g., the X-axis direction) in the first direction, and the second direction may be Figure 1The vertical direction (e.g., Y-axis direction) in FIG. 2 . However, the present disclosure is not limited thereto. Each sub-pixel SP includes a light-emitting area EA from which light is emitted and a non-light-emitting area NEA from which light is not emitted. In the present specification, only the light-emitting area from which light is emitted is defined as the sub-pixel SP. A plurality of pixels may each include a first sub-pixel SP1, a second sub-pixel SP2, and a third sub-pixel SP3. The first sub-pixel SP1 may be a red pixel, the second sub-pixel SP2 may be a green pixel, and the third sub-pixel SP3 may be a blue pixel. However, the present disclosure is not limited thereto. The sub-pixel SP1, the sub-pixel SP2, and the sub-pixel SP3 each have a light-emitting area EA_R, a light-emitting area EA_G, and a light-emitting area EA_B. Specifically, the first sub-pixel SP1 may have a red light-emitting area EA_R, the second sub-pixel SP2 may have a green light-emitting area EA_G, and the third sub-pixel SP3 may have a blue light-emitting area EA_B. However, the present disclosure is not limited thereto.

[0046] The sub-pixels SP may each include an organic light emitting element 130 and a driving element. In this case, the driving element may include a switching transistor, a driving transistor, etc. The driving element may be electrically connected to a signal line such as a gate line and a data line connected to a gate driver and a data driver disposed in the non-display area NDA.

[0047] The non-display area NDA may be disposed in a peripheral area of ​​the lower substrate 110. The non-display area NDA may be an area where no image is displayed. The non-display area NDA may be disposed to surround the display area DA. Various constituent elements for operating a plurality of sub-pixels SP disposed in the display area DA may be disposed in the non-display area NDA. For example, a driver IC, a driver circuit, a signal line, a flexible film, and the like configured to supply signals for operating the plurality of sub-pixels SP may be disposed. In this case, the driver IC may include a gate driver, a data driver, and the like. The driver IC and the driver circuit may be disposed by a gate-in-panel (GIP) method, a chip-on-film (COF) method, a tape automated bonding (TAB) method, a tape carrier package (TCP) method, a chip-on-glass (COG) method, and the like.

[0048] Reference Figure 2 The lower substrate 110 is used to support and protect several components of the organic light-emitting display device 100. The lower substrate 110 may be made of glass or a flexible plastic material. In the case where the lower substrate 110 is made of a plastic material, the lower substrate 110 may be made of, for example, polyimide (PI). However, the present disclosure is not limited thereto.

[0049] A thin film transistor 120 including a gate electrode, an active layer, a source electrode, and a drain electrode is formed on a lower substrate 110. Specifically, a gate electrode is formed on the lower substrate 110, and a gate insulating layer 111 for insulating the gate electrode and the active layer is formed on the gate electrode and the lower substrate 110. The gate insulating layer 111 may be configured as a single layer made of silicon nitride (SiNx) or silicon oxide (SiOx) as an inorganic material. Alternatively, the gate insulating layer 111 may be configured as a multilayer made of silicon nitride (SiNx) or silicon oxide (SiOx).

[0050] An active layer is formed on the gate insulating layer 111, an etching stopper layer 112 is formed on the active layer, and a source electrode and a drain electrode are formed on the active layer and the etching stopper layer 112. The source electrode and the drain electrode are electrically connected to the active layer while being adjacent to the active layer, and are formed in a partial area of ​​the etching stopper layer 112. In this specification, for the sake of convenience of description, among various thin film transistors that may be included in the organic light-emitting display device 100, only the thin film driving transistor 120 is shown. In addition, in this specification, the thin film transistor 120 is described as having an inverse staggered structure. However, the present disclosure is not limited thereto. A thin film transistor having a coplanar structure may be used.

[0051] An overcoat layer 113 is formed on the thin film transistor 120. The overcoat layer 113 may be made of an insulating material such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide-based resin, a polyimide-based resin, an unsaturated polyester-based resin, a polyphenylene resin, a polyphenylene sulfide-based resin, benzocyclobutene, and a photoresist. However, the present disclosure is not limited thereto.

[0052] The organic light emitting element 130 and the bank 114 are formed on the outer coating layer 113. In this case, the organic light emitting element 130 is disposed in each of the sub-pixel SP1, the sub-pixel SP2, and the sub-pixel SP3, and includes an anode 131, an organic light emitting layer 132, and a cathode 133. Specifically, the anode 131 configured to supply holes to the organic light emitting layer 132 may be formed on the outer coating layer 113, and the bank 114 may be disposed around the anode 131. In this case, the bank 114 may be formed in a shape covering the edge of the anode 131. Therefore, the bank 114 may define the light emitting area EA_R, the light emitting area EA_G, and the light emitting area EA_B. The organic light emitting layer 132 may be formed on the anode 131, and the cathode 133 configured to supply electrons to the organic light emitting layer 132 may be formed on the organic light emitting layer 132.

[0053] Figure 2The anode 131 is shown to be configured as a single layer. However, the anode 131 may include a reflective layer and a transparent conductive layer on the reflective layer. The reflective layer of the anode 131 may be formed on the outer coating 113 and electrically connected to the thin film transistor 120 through a contact hole formed in the outer coating 113. The reflective layer of the anode 131 may be made of a metal material having excellent light reflectivity. For example, the reflective layer of the anode 131 may be made of a metal material such as an alloy (Ag alloy). The transparent conductive layer of the anode 131 may be made of a transparent conductive oxide (TCO) having a high work function. For example, the transparent conductive layer of the anode 131 may be made of materials such as indium tin oxide (ITO) and indium zinc oxide (IZO).

[0054] The cathode 133 may be configured as a permeable or semi-permeable conductive layer. For example, the cathode 133 may transmit a portion or all of the light emitted from the organic light-emitting layer 132 and allow the light to propagate to the outside. In the case where the cathode 133 transmits a portion of the light emitted from the organic light-emitting layer 132, another portion of the light may be reflected in a direction toward the anode 131. The cathode 133 may be made of a metal material having a low work function. In addition, the cathode 133 may be formed to have a very small thickness to ensure light transmittance. For example, the cathode 133 may be made of a metal material such as silver (Ag), titanium (Ti), aluminum (Al), molybdenum (Mo), an alloy of silver (Ag) and magnesium (Mg), and the metal material may be formed to be very thin and have a thickness less than 100 nm. However, the present disclosure is not limited thereto.

[0055] Because the anode 131 includes a reflective layer and the cathode has light semi-transmittance, a microcavity effect may occur in the organic light emitting element 130. The microcavity means that light is repeatedly reflected between two layers spaced apart by an optical path length, and light having a specific wavelength is amplified, achieving constructive interference while corresponding to the optical path length. Figure 2 As shown, in the case where the organic light emitting display device 100 is a top emission type organic light emitting display device, a portion of light emitted from the organic light emitting layer 132 travels toward the cathode 133 , and another portion of the light travels toward the anode 131 .

[0056] In this case, the light having propagated toward the anode 131 is reflected by the anode 131, and the light propagates along a path changed to be directed toward the cathode 133. As described above, a portion of the light having propagated toward the cathode 133 passes through the cathode 133 and is released to the outside, and another portion of the light is reflected by the cathode 133 and propagates along a path changed to be directed toward the anode 131. Therefore, the light is repeatedly reflected between the anode 131 and the cathode 133, and light having a specific wavelength may be amplified by constructive interference based on the distance between the anode 131 and the cathode 133 (i.e., the distance between the portion of the reflected light of the anode 131 and the portion of the reflected light of the cathode 133).

[0057] For example, since the wavelength of red visible light is about 620nm, the resonance distance in the first sub-pixel SP1 corresponding to the wavelength needs to be a multiple of about 310nm. Therefore, the thickness of the organic light-emitting layer 132 corresponding to the distance between the anode 131 and the cathode 133 in the first sub-pixel region SP1 can be set to a multiple of about 310nm. In addition, since the wavelength of green visible light is about 530nm, the resonance distance in the second sub-pixel SP2 corresponding to the wavelength needs to be a multiple of about 265nm. Therefore, the thickness of the organic light-emitting layer 132 in the second sub-pixel SP2 can be set to a multiple of about 265nm. In addition, since the wavelength of blue visible light is about 460nm, the resonance distance in the third sub-pixel SP3 corresponding to the wavelength needs to be a multiple of about 230nm. Therefore, the thickness of the organic light-emitting layer 132 in the third sub-pixel SP3 can be set to a multiple of about 230nm.

[0058] For example, in the case where light emitted from the organic light-emitting layer 132 is reflected by the top surface of the reflective layer of the anode 131 and the bottom surface of the cathode 133, the sum of the thickness of the organic light-emitting layer 132 and the thickness of the transparent conductive layer in the first sub-pixel SP1 can be set to a multiple of approximately 310 nm, the sum of the thickness of the organic light-emitting layer 132 and the thickness of the transparent conductive layer in the second sub-pixel SP2 can be set to a multiple of approximately 265 nm, and the sum of the thickness of the organic light-emitting layer 132 and the thickness of the transparent conductive layer in the third sub-pixel region SP3 can be set to a multiple of approximately 230 nm.

[0059] In the case where the resonance distance associated with the light having a specific wavelength is defined as described above, in the emitted light beam, the light having the corresponding wavelength is extracted to the outside in a state where the amplitude of the light increases by constructive interference as the light is repeatedly reflected between the anode 131 and the cathode 133, and the light having a wavelength other than the corresponding wavelength is extracted to the outside in a state where the amplitude of the light decreases by destructive interference as the light is repeatedly reflected between the anode 131 and the cathode 133. Therefore, the light emission efficiency associated with the light having a specific wavelength corresponding to the resonance distance can be improved by realizing a microcavity.

[0060] In order to realize the microcavity as described above, the distance from the reflective layer of the anode 131 to the cathode 133 is determined by applying the resonance distance set for each of the sub-pixel SP1, the sub-pixel SP2, and the sub-pixel SP3. By adjusting the thickness of the organic light emitting layer 132 for each of the sub-pixel SP1, the sub-pixel SP2, and the sub-pixel SP3, the resonance distance set differently for each of the sub-pixel SP1, the sub-pixel SP2, and the sub-pixel SP3 can be defined. Alternatively, the resonance distance set differently for each of the sub-pixel SP1, the sub-pixel SP2, and the sub-pixel SP3 can be defined by adjusting the thickness of the transparent conductive layer on the reflective layer of the anode 131 for each of the sub-pixel SP1, the sub-pixel SP2, and the sub-pixel SP3. Alternatively, the resonance distance set for each of the sub-pixel SP1, the sub-pixel SP2, and the sub-pixel SP3 can be defined by adding a cap layer on the cathode 133 for each of the sub-pixel SP1, the sub-pixel SP2, and the sub-pixel SP3 and adjusting the thickness of the cap layer.

[0061] Therefore, in the organic light-emitting display device 100 according to an embodiment of the present disclosure, the distance from the reflective layer of the anode 131 to the cathode 133 in the red light-emitting region EA_R, the distance from the reflective layer of the anode 131 to the cathode 133 in the green light-emitting region EA_G, and the distance from the reflective layer of the anode 131 to the cathode 133 in the blue light-emitting region EA_B may be different from each other. In particular, the distance relationship may be configured such that the distance from the reflective layer of the anode 131 to the cathode 133 in the red light-emitting region EA_R may be the longest, the distance from the reflective layer of the anode 131 to the cathode 133 in the green light-emitting region EA_G may be the second longest, and the distance from the reflective layer of the anode 131 to the cathode 133 in the blue light-emitting region EA_B may be the shortest.

[0062] The upper substrate 170 is disposed opposite to the lower substrate 110. The upper substrate 170 may be used to protect and support several other components of the organic light-emitting display device 100 including the color filter CF and the black matrix 150. The upper substrate 170 may be made of glass. In the case where the upper substrate 170 is made of glass, the transmittance of light emitted from the organic light-emitting layer 132 may be increased.

[0063] The upper substrate 170 may include a protruding portion 171 protruding toward the lower substrate 110 and formed to overlap with the black matrix 150. Specifically, the black matrix 150 is formed on the upper substrate 170 and is disposed to protrude toward the lower substrate 110, and defines an opening area OA corresponding to the emission area EA_R, the emission area EA_G, and the emission area EA_B, respectively. In addition, the black matrix 150 includes an undercut area UA, through which a portion of the bottom surface 150b of the black matrix 150 adjacent to the upper substrate 170 is exposed. In this case, the black matrix 150 is disposed on the protruding portion 171, and the protruding portion 171 has a structure in which a top surface 171a where the protruding portion 171 and the black matrix 150 are adjacent to each other or a bottom surface 171b as a rear surface of the protruding portion 171 has a width smaller than a width of a bottom surface 150a of the black matrix 150, so that an undercut area UA is formed through which a portion of the bottom surface 150b of the black matrix 150 adjacent to the upper substrate 170 is exposed. Figure 5 As described, in the case where the undercut region is not formed between the black matrix and the upper substrate, during the process of forming the reflective layer on the black matrix, the end of the reflective layer enters a part of the initially expected opening region, which causes the problem that the opening region is narrower than the initially expected region. Specifically, in the case where the composition including the metal material is applied to the black matrix and cured to form the reflective layer, the composition can flow downward along the side surface of the black matrix and be arranged on the top surface of the upper substrate corresponding to the opening region. In addition, even in the case of forming the reflective layer by depositing the metal material, the metal material can even be deposited on the top surface of the upper substrate adjacent to the black matrix. When the end of the reflective layer enters a part of the initially expected opening region, the area of ​​the opening region is reduced, which may reduce the display performance and cause the external light to be reflected by the reflective layer arranged in the opening region in the user's field of view, and the problem of visibility deterioration associated with external reflection. Therefore, an undercut region UA ​​is formed between the black matrix 150 and the upper substrate 170, which can suppress the reduction of the opening region OA by suppressing the reflective layer 160 from entering the initially expected opening region OA during the process of forming the reflective layer 160 on the black matrix 150.

[0064] The protruding portion 171 of the upper substrate 170 may include a top surface 171a configured to abut against the bottom surface 150b of the black matrix 150, a bottom surface 171b as a rear surface of the protruding portion 171, and a side surface 171c configured to connect the top surface 171a and the bottom surface 171b. The width of the top surface 171a or the bottom surface 171b of the protruding portion 171 may be smaller than the width of the bottom surface 150b of the black matrix 150. For example, the side surface 171c of the protruding portion 171 is disposed inward of the side surface 150c of the black matrix 150, so that the undercut area UA may be formed between the upper substrate 170 and the black matrix 150 spaced apart from each other by the protruding portion 171.

[0065] The protruding portion 171 of the upper substrate 170 and the black matrix 150 may each have a tapered shape having a width increasing toward the upper substrate 170. In this case, a decrease in brightness according to a viewing angle in the organic light emitting display device 100 may be further suppressed, which may further increase the viewing angle.

[0066] The height of the protruding portion 171 of the upper substrate 170 may be greater than the maximum thickness of the reflective layer 160, and may be, for example, 0.1 μm to 1 μm or 0.5 μm to 1 μm. Figure 3 As shown in , the thickness of the reflective layer 260 disposed on the side surface 150c of the black matrix 150 may decrease as the distance from the bottom surface 150b of the black matrix 150 adjacent to the upper substrate 170 decreases. In this case, the maximum thickness of the reflective layer 160 means the thickness of the thickest part when one reflective layer 160 has different thicknesses.

[0067] The photoresist PR that can be used in the process of forming the reflective layer 160 on the black matrix 150 can more stably cover the bottom surface 150b of the black matrix 150 in the undercut area UA. Therefore, only the metal layer 160' deposited on the upper substrate 170 to form the reflective layer 160 is stably etched, which can suppress damage to the reflective layer 160 deposited on the top surface 150a or the bottom surface 150b of the black matrix 150.

[0068] The black matrix 150 may be made of an organic material. The black matrix 150 may include a base resin and a black material. The base resin may be one selected from a cardo-based resin, an epoxy-based resin, an acrylate-based resin, a siloxane-based resin, and a polyimide. However, the present disclosure is not limited thereto. The black material may be a black pigment selected from a carbon-based pigment, a metal oxide-based pigment, and an organic pigment. For example, a carbon-based pigment may be carbon black. For example, a metal oxide-based pigment may be titanium black (TiNxOy), a Cu-Mn-Fe-based black pigment, and the like. However, the present disclosure is not limited thereto. For example, an organic pigment may be selected from lactam black, perylene black, and aniline black. However, the present disclosure is not limited thereto. In addition, an RGB black pigment including a red pigment, a blue pigment, and a green pigment may be used as a black material.

[0069] The color filter CF_R, the color filter CF_G, and the color filter CF_B are arranged to correspond to the opening area OA, respectively. The undercut area UA formed between the black matrix 150 and the upper substrate 170 may be filled with the color filter CF_R, the color filter CF_G, and the color filter F_B. In addition, the color filters CF_R, the color filter CF_G, and the color filter CF_B, which are respectively arranged in the sub-pixels SP1, the sub-pixel SP2, and the sub-pixel SP3 adjacent to each other, may overlap each other at least partially on the top surface 150a of the black matrix 150 adjacent to the lower substrate 110. The color filter CF_R, the color filter CF_G, and the color filter CF_B may include a first color filter, such as a red color filter CF_R corresponding to the first sub-pixel SP1, a second color filter, such as a green color filter CF_G corresponding to the second sub-pixel SP2, and a third color filter, such as a blue color filter CF_B corresponding to the third sub-pixel SP3. The color filters CF_R, CF_G, and CF_B may each be disposed such that only one type of color filter corresponds to one of the plurality of opening areas OA. In the case where the color filters CF_R, CF_G, and CF_B are disposed as described above, color reproducibility may be improved.

[0070] The color filter CF_R, the color filter CF_G and the color filter CF_B may each independently include a transparent base resin and a chromogenic material. For example, the transparent base resin may be one selected from polyacrylate, polymethyl methacrylate, polyimide, polyvinyl alcohol, polyethylene, polypropylene, polystyrene and polyethylene terephthalate. However, the present disclosure is not limited thereto. A chromogenic material means a material that absorbs light having a specific wavelength band and transmits light having the remaining wavelength bands. For example, the red color filter CF_R includes a red chromogenic material that transmits light having a red wavelength band and absorbs light having green and blue wavelength bands. For example, the red chromogenic material may be a perylene-based compound or a diketopyrrolopyrrole-based compound. In addition, the green chromogenic material may be a phthalocyanine-based compound. In addition, the blue chromogenic material may be a copper phthalocyanine-based compound or an anthraquinone-based compound. However, the chromogenic material is not limited thereto. Any material that transmits light having red, blue and green wavelength bands may be used without restriction.

[0071] The reflective layer 160 is arranged on the side surface 150c connecting the top surface 150a and the bottom surface 150b of the black matrix 150. In addition, the reflective layer 160 can even be arranged on the top surface 150a of the black matrix 150. Among the light beams L1, L2, L3 and L4 emitted from the organic light emitting layer 132, the light beams L1 and L4 propagating toward the light emitting area EA pass through the upper substrate 170 and are released to the outside. However, the light beams L2 and L3 propagating toward the area other than the light emitting area EA are absorbed by other components such as the color filter CF_R, the color filter CF_G and the color filter CF_B or the black matrix 150, and sometimes cannot be released to the outside. Therefore, the reflective layer 160 can be arranged on the side surface of the black matrix 150, so that the reflective layer 160 can reflect or scatter the light beams L2 and L3 propagating toward the area other than the light emitting area EA, and change the path of the light to the upper substrate 170. For example, light that has been lost due to absorption by other components can be additionally released to the outside by means of the reflective layer 160. Therefore, in the prior art, light is released to an area beyond the viewing angle range so that the viewing angle is ensured. In addition, the amount of light released to the light emitting area EA is increased, so that the color reproduction range is improved.

[0072] The reflective layer 160 may include a light-reflective metal material. In this case, the light-reflective metal material may include one or more metal materials selected from gold (Au), platinum (Pt), silver (Ag), copper (Cu), nickel (Ni), titanium (Ti), magnesium (Mg), aluminum (Al), rhodium (Rh) and alloys thereof, which are relatively stable metal materials having an average light reflectivity of 50% or more in all wavelength band regions. The light-reflective metal material may be aluminum (Al) or silver (Ag), which is a metal having the highest light reflectivity associated with light in a wavelength region corresponding to visible light. However, the present disclosure is not limited thereto. In the case where the reflective layer 160 includes a light-reflective metal material, the efficiency of reflecting or scattering the light beams L2 and L3 propagating toward an area other than the light-emitting area EA may be improved. Therefore, the color reproduction range may be further improved.

[0073] The reflective layer 160 may be a single layer. As described below, the reflective layer 160 may be formed as a single layer on the surface of the black matrix 150 through a deposition process. In the case where the reflective layer 160 is formed as a single layer, the organic light-emitting display device 100 including the reflective layer 160 may be further thinned, and the manufacturing process may be simplified.

[0074] The maximum thickness of the reflective layer 160 may be 1 μm or less, for example, 0.01 μm to 1 μm or 0.1 μm to 0.5 μm. When the thickness of the reflective layer 160 is adjusted to the above range, the light reflection efficiency may be further improved. In this case, the maximum thickness of the reflective layer 160 has the same meaning as described above.

[0075] The lower substrate 110 on which the insulating layer 111, the thin film transistor 120, the outer coating 113, the embankment 114 and the organic light-emitting element 130 are stacked can be bonded to the upper substrate 170 on which the black matrix 150, the reflective layer 160 and the color filter CF_R, the color filter CF_G and the color filter CF_B are stacked by means of the bonding layer 140. In this case, the upper substrate 170 and the lower substrate 110 can be bonded so that the opening area OA defined on the upper substrate 170 by the black matrix 150 corresponds to the light-emitting area EA_R, the light-emitting area EA_G and the light-emitting area EA_B defined on the lower substrate 110 by the embankment 114. In addition, the upper substrate 170 and the lower substrate 110 can be bonded so that the color filter CF_R, the color filter CF_G and the color filter CF_B on the upper substrate 170 face the cathode 133 on the lower substrate 110. For example, the bonding layer 140 may be disposed between the color filters CF_R, CF_G, and CF_B and the cathode 133. The bonding layer 140 may be configured as a single layer or multiple layers as needed. However, the present disclosure is not limited thereto.

[0076] As described above, the organic light-emitting display device 100 according to an embodiment of the present disclosure includes an upper substrate 170 including a protruding portion 171, and a black matrix 150 disposed on the protruding portion 171 and having a surface on which a reflective layer 160 is formed. Therefore, the path of light can be changed by reflecting or scattering the light beams L2 and L3 propagating toward an area other than the light-emitting area EA, so that the light propagates toward the upper substrate 170 in the light-emitting area EA. In addition, as described above, the path of the light that has been lost is changed to be toward the light-emitting area EA, so that the amount of light emitted from the light-emitting area EA is increased, and the color reproduction range is improved. At the same time, the organic light-emitting display device 100 according to an embodiment of the present disclosure includes an undercut area UA between the black matrix 150 and the upper substrate 170, and a portion of the bottom surface 150b of the black matrix 150 is exposed through the undercut area UA. In the case where the undercut area UA is formed below the black matrix 150, during the process of forming the reflective layer 160 on the black matrix 150, the aperture ratio can be improved and the reduction in the aperture area when the reflective layer 160 is disposed on the upper substrate 170 on which the black matrix 150 is not disposed can be suppressed. In addition, the problem of deterioration of reflective visibility from the outside can be solved by the reflective layer disposed in the aperture area.

[0077] Figure 3 is a schematic cross-sectional view for explaining an organic light emitting display device 200 according to another embodiment of the present disclosure.

[0078] Reference Figure 3 In the organic light-emitting display device 200 according to another embodiment of the present disclosure, the thickness of the reflective layer 260 disposed on the side surface 150c of the black matrix 150 may decrease as the distance from the bottom surface 150b of the black matrix 150 adjacent to the upper substrate 170 decreases. In addition, the end of the bottom surface 150b of the black matrix 150 may coincide with the end of the reflective layer 260 on the side adjacent to the bottom surface 150b of the black matrix 150. Therefore, the reduction of the opening area OA caused by the interference with the opening area OA of the reflective layer 260 may be suppressed, and a wider opening area OA may be ensured. In addition, the reflective layer 260 is formed not to overlap with the opening area OA, so that a wider opening area OA may be ensured, which may further improve the transmittance and the brightness.

[0079] When referring to Figure 3 When describing the organic light emitting display device 200 according to an embodiment of the present disclosure, Figure 1 and Figure 2 The description of all components of the organic light-emitting display device 100 according to the embodiment can be similarly applied to the description of all components that are not described. Therefore, the description of all components that are not described will be omitted. Figure 1 and Figure 2Description of components that are the same as components of the organic light emitting display device 100 according to an embodiment of the present disclosure.

[0080] Figure 4 is a schematic cross-sectional view for explaining an organic light emitting display device 300 according to still another embodiment of the present disclosure.

[0081] like Figure 2 and Figure 3 As shown, in the organic light-emitting display device 100 or the organic light-emitting display device 200 according to an embodiment of the present disclosure, the reflective layer 160 or the reflective layer 260 may be disposed on the entire top surface 150a of the black matrix 150 at one side adjacent to the lower substrate 110. Figure 4 As shown, the reflective layer 360 may be disposed on a portion of the top surface 150a of the black matrix 150 to expose at least a portion of the top surface 150a of the black matrix 150 adjacent to the lower substrate 110. Therefore, light emitted from the organic light emitting layer 132 and propagating toward the top surface 150a of the black matrix 150 is absorbed by the exposed top surface 150a of the black matrix 150. Therefore, color mixing that may occur when light emitted from the organic light emitting layer 132 is reflected again by another adjacent sub-pixel may be suppressed.

[0082] When referring to Figure 4 When describing the organic light emitting display device 300 according to an embodiment of the present disclosure, Figure 1 and Figure 2 The description of all components of the organic light-emitting display device 100 according to the embodiment can be similarly applied to the description of all components that are not described. Therefore, the description of all components that are not described will be omitted. Figure 1 and Figure 2 Description of components that are the same as components of the organic light emitting display device 100 according to an embodiment of the present disclosure.

[0083] Figure 5 is a schematic cross-sectional view for explaining an organic light emitting display device according to a comparative example.

[0084] Reference Figure 5In the organic light-emitting display device according to the comparative example, the color filter layer CF_R', the color filter layer CF_G' and the color filter layer CF_B' are disposed on the upper substrate 70, the black matrix 150 is disposed on the color filter layer CF_R', the color filter layer CF_G' and the color filter layer CF_B', and a reflective layer 60 having a shape surrounding the black matrix 150 is disposed. For example, in the organic light-emitting display device according to the comparative example, no undercut region is formed between the black matrix 150 and the upper substrate 70. In this case, as described above, there is the following problem: during the process of forming the reflective layer 60 on the black matrix 150, as the end of the reflective layer 60 enters a part of the initially intended opening area OA, the opening area OA is narrower than the initially intended area. In addition, there is the following problem: when external light is reflected by the reflective layer 60 disposed in the opening area OA, the external reflection visibility is reduced.

[0085] Therefore, as mentioned above Figures 1 to 4 As described above, in the organic light-emitting display device 100, the organic light-emitting display device 200, or the organic light-emitting display device 300 according to various embodiments of the present disclosure, the undercut area UA is formed between the black matrix 150 and the upper substrate 170, which can suppress the reduction of the opening area OA by suppressing the reflection layer 160, the reflection layer 260, or the reflection layer 360 from entering the originally intended opening area OA during the process of forming the reflection layer 160, the reflection layer 260, or the reflection layer 360 on the black matrix 150. Therefore, external light is reflected by the reflection layer 60 disposed in the opening area OA, which can suppress the degradation of the external reflection visibility.

[0086] 6A to 6F It is a cross-sectional view of an example of a method for manufacturing a black matrix 150, a reflective layer 160, a color filter CF, and an upper substrate 170, which are components of an organic light-emitting display device 100 for illustrating various aspects of the present disclosure, and the black matrix 150, the reflective layer 160, and the color filter CF are on the upper substrate 170.

[0087] Reference Fig. 6A First, a mother substrate 170' made of glass is prepared, and a black matrix 150 is formed on the mother substrate 170'. For example, the black matrix 150 may be patterned by a photoresist process.

[0088] Reference Figure 6B, the mother substrate 170' on which the black matrix 150 is formed is etched by wet etching. Therefore, the upper substrate 170 having the protruding portion 171 is formed by isotropically etching the mother substrate 170', the mother substrate 170' including the top surface of the mother substrate 170' exposed due to the absence of the black matrix 150 and a portion of the contact surface between the black matrix 150 and the mother substrate 170'. Therefore, an undercut area UA is formed between the black matrix 150 and the upper substrate 170, and a portion of the black matrix 150 is exposed through the undercut area UA.

[0089] Reference Figure 6C , a metal layer 160' including a light-reflective metal material is deposited on the upper substrate 170 and the black matrix 150. Therefore, the metal layer 160' is deposited on the top surface 150a and the side surface 150c of the black matrix 150. In addition, an opening area OA is defined between adjacent black matrices 150, and the metal layer 160' is deposited even on the upper substrate 170 corresponding to the opening area OA. For example, the metal layer 160' may not be deposited on the bottom surface 150b of the black matrix 150, the side surface 171c of the protruding portion 171, and the top surface of the upper substrate 170 in the undercut area UA. At the same time, Figure 6C It is shown that the metal layer 160' is not disposed on the top surface of the upper substrate 170 in the undercut area UA. However, the present disclosure is not limited thereto. At least a portion of the metal layer 160' may extend to be disposed on the top surface of the upper substrate 170 in the undercut area UA. In this case, the deposition may be performed by a chemical vapor deposition (CVD) process, a plasma enhanced chemical vapor deposition (PECVD) process, or the like. However, the present disclosure is not limited thereto.

[0090] Reference Fig.6D , a photoresist is applied to surround the protruding portion 171 of the upper substrate 170 and the black matrix 150 , and the photoresist is cured by using a high temperature plate, a furnace, or a UV curing tool. However, the present disclosure is not limited thereto.

[0091] Reference Fig. 6E , the metal layer 160' deposited on the upper substrate 170 corresponding to the opening area OA is removed by dry etching. Therefore, the metal layer 160' deposited on the black matrix 150 is protected from etching by the photoresist and is maintained without being removed. At the same time, the metal layer 160' deposited on the upper substrate 170 and not protected by the photoresist is removed. Therefore, the reflective layer 160 provided on the top surface 150a and the side surface 150c of the black matrix 150 is formed.

[0092] The photoresist is then removed by using a tool such as an RF or microwave plasma resist stripper. However, the present disclosure is not limited thereto.

[0093] The reflective layer 160 may be formed on the side surface 150 c and the top surface 150 a of the black matrix 150 through the above-described process.

[0094] Reference Fig. 6F , a photoresist for forming the color filter CF_R, the color filter CF_G, and the color filter CF_B is applied between the black matrices 150 and cured. In this case, one type of color filter CF_R, color filter CF_G, or color filter CF_B is formed between two adjacent black matrices 150, which suppresses color mixing between different color filters.

[0095] Example implementations of the present disclosure may also be described as follows:

[0096] According to one aspect of the present disclosure, an organic light-emitting display device is provided. The organic light-emitting display device includes: a lower substrate, the lower substrate includes a plurality of sub-pixels; an anode, the anode is arranged on the lower substrate; a bank, the bank is arranged to overlap with the end of the anode and is configured to define a light-emitting area; an organic light-emitting layer, the organic light-emitting layer is arranged on the anode and the bank; a cathode, the cathode is arranged on the organic light-emitting layer; an upper substrate, the upper substrate is arranged opposite to the lower substrate; a black matrix, the black matrix is ​​arranged on one surface of the upper substrate and protrudes toward the lower substrate and is configured to define an opening area corresponding to the light-emitting area; a color filter, the color filter is arranged on one surface of the upper substrate to correspond to the opening area; and a reflective layer, the reflective layer is arranged on the side surface of the black matrix, wherein the black matrix includes an undercut area, through which a portion of the bottom surface of the black matrix adjacent to the upper substrate is exposed.

[0097] The upper substrate may include a protruding portion protruding toward the lower substrate, and the black matrix may be disposed on the protruding portion.

[0098] The protrusion may include: a top surface adjacent to the bottom surface of the black matrix; a bottom surface opposite to the top surface of the protrusion; and a side surface configured to connect the top surface of the protrusion and the bottom surface of the protrusion, and a width of the top surface or the bottom surface of the protrusion may be smaller than a width of the bottom surface of the black matrix.

[0099] A side surface of the protrusion portion may be disposed inward of a side surface of the black matrix, and an undercut region may be formed between the upper substrate and the black matrix spaced apart from each other by the protrusion portion.

[0100] The protrusion portion and the black matrix each may have a tapered shape having a width increasing toward the upper substrate.

[0101] The height of the protruding portion may be greater than the maximum thickness of the reflective layer.

[0102] The thickness of the reflective layer becomes thinner as the distance from the bottom surface of the black matrix adjacent to the upper substrate decreases.

[0103] An end portion of the bottom surface of the black matrix may coincide with or correspond to an end portion of the reflective layer on a side adjacent to the bottom surface of the black matrix.

[0104] The reflective layer may not overlap with the opening area.

[0105] The reflective layer may include a light reflective metallic material.

[0106] The light reflective metal material may include aluminum or silver.

[0107] The reflective layer may be a single layer.

[0108] The reflective layer may also be disposed on a portion of the top surface of the black matrix to expose at least a portion of the top surface of the black matrix adjacent to the lower substrate.

[0109] The undercut areas may be filled with color filters.

[0110] The color filters respectively disposed in adjacent sub-pixels may at least partially overlap each other on a top surface of the black matrix adjacent to the lower substrate.

[0111] The upper substrate may be made of glass.

[0112] According to another aspect of the present disclosure, a method for manufacturing an organic light-emitting display device is provided, the method comprising: preparing a mother substrate and forming a black matrix on the mother substrate; etching the mother substrate on which the black matrix is ​​formed by wet etching, and forming an upper substrate having a protruding portion by isotropically etching the mother substrate; depositing a metal layer including a light-reflective metal material on the upper substrate and the black matrix; applying a photoresist to surround the protruding portion of the upper substrate and at least a portion of the black matrix, and curing the photoresist; removing the metal layer deposited on the upper substrate corresponding to the opening area by dry etching to form a reflective layer arranged on at least a portion of the top surface and side surfaces of the black matrix; applying the photoresist between the black matrices and curing the photoresist to form a color filter.

[0113] Although the example embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and can be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the example embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above-mentioned example embodiments are illustrative in all aspects and do not limit the present disclosure. All technical concepts within the equivalent scope of the present disclosure should be interpreted as falling within the scope of the present disclosure.

Claims

1. An organic light emitting display device, comprising: A lower substrate, the lower substrate comprising a plurality of sub-pixels; an anode, the anode being disposed on the lower substrate; a bank portion disposed to overlap with an end portion of the anode and configured to define a light emitting region; an organic light-emitting layer, the organic light-emitting layer being disposed on the anode and the bank; a cathode, the cathode being disposed on the organic light-emitting layer; an upper substrate, the upper substrate being arranged opposite to the lower substrate; a black matrix disposed on one surface of the upper substrate and protruding toward the lower substrate, the black matrix being configured to define an opening area corresponding to the light emitting area; a color filter disposed on the one surface of the upper substrate to correspond to the opening area; as well as a reflective layer, the reflective layer being arranged on a side surface of the black matrix, The black matrix includes an undercut region, through which a portion of a bottom surface of the black matrix adjacent to the upper substrate is exposed.

2. The organic light emitting display device according to claim 1, wherein: The upper substrate includes a protruding portion protruding toward the lower substrate, and the black matrix is ​​disposed on the protruding portion.

3. The organic light emitting display device according to claim 2, wherein: The protruding parts include: a top surface, the top surface being adjacent to the bottom surface of the black matrix; a bottom surface opposite the top surface of the protruding portion; and a side surface configured to connect the top surface of the protruding portion and the bottom surface of the protruding portion, and Wherein, a width of the top surface or the bottom surface of the protruding portion is smaller than a width of the bottom surface of the black matrix.

4. The organic light emitting display device according to claim 3, wherein: The side surface of the protruding portion is disposed inwardly of the side surface of the black matrix, and the undercut region is formed between the upper substrate and the black matrix which are spaced apart from each other by the protruding portion.

5. The organic light emitting display device according to claim 2, wherein: Each of the protrusion portion and the black matrix has a tapered shape having a width that increases toward the upper substrate.

6. The organic light emitting display device according to claim 2, wherein: The height of the protruding portion is greater than the maximum thickness of the reflective layer.

7. The organic light emitting display device according to claim 1, wherein: The thickness of the reflective layer becomes thinner as the distance from the bottom surface of the black matrix adjacent to the upper substrate decreases.

8. The organic light emitting display device according to claim 7, wherein: An end of the bottom surface of the black matrix coincides with or corresponds to an end of the reflective layer on a side adjacent to the bottom surface of the black matrix.

9. The organic light emitting display device according to claim 8, wherein: The reflective layer does not overlap with the opening area.

10. The organic light emitting display device according to claim 1, wherein: The reflective layer includes a light reflective metal material.

11. The organic light emitting display device according to claim 10, wherein: The light reflective metal material includes aluminum or silver.

12. The organic light emitting display device according to claim 10, wherein: The reflective layer is a single layer.

13. The organic light emitting display device according to claim 1, wherein: The reflective layer is also disposed on a portion of a top surface of the black matrix to expose at least a portion of the top surface of the black matrix adjacent to the lower substrate.

14. The organic light emitting display device according to claim 1, wherein: The undercut area is filled with the color filter.

15. The organic light emitting display device according to claim 1, wherein: The color filters respectively disposed in adjacent sub-pixels at least partially overlap each other on a top surface of the black matrix adjacent to the lower substrate.

16. The organic light emitting display device according to claim 1, wherein: The upper substrate is made of glass.

17. The organic light emitting display device according to claim 1, wherein: The anode includes a reflective layer, and a distance from the reflective layer of the anode to the cathode is determined based on a resonance distance set for each sub-pixel.

18. A method for manufacturing an organic light emitting display device, the method comprising: preparing a mother substrate, and forming a black matrix on the mother substrate; etching the mother substrate on which the black matrix is ​​formed by wet etching, and forming an upper substrate having a protruding portion by isotropically etching the mother substrate; depositing a metal layer including a light-reflective metal material on the upper substrate and the black matrix; applying a photoresist to surround the protruding portion of the upper substrate and at least a portion of the black matrix, and curing the photoresist; removing the metal layer deposited on the upper substrate corresponding to the opening area by dry etching to form a reflective layer disposed on at least a portion of the top surface and side surfaces of the black matrix; as well as The photoresist is applied between the black matrices and cured to form a color filter.

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