Display module and display device

Abstract

The invention discloses a display module and a display device, and belongs to the technical field of display panels. The display module comprises: a display panel; the heat dissipation film is located on the backlight side of the display panel; the fingerprint module is located on the side, away from the display panel, of the heat dissipation film; the heat dissipation film comprises a buffer layer, a soaking layer and an anti-stamping layer, the soaking layer is located on the side, away from the display panel, of the buffer layer, the anti-stamping layer is located on at least one of the two opposite sides of the buffer layer, and the two opposite sides of the buffer layer comprise the side, away from the soaking layer, of the buffer layer and the side, close to the soaking layer, of the buffer layer; the elastic modulus of the anti-stamping layer is larger than that of the buffer layer, and the buffer layer, the soaking layer and the anti-stamping layer are uniform dielectric layers enabling ultrasonic waves to be transmitted along a straight line. According to the invention, the identification accuracy of the fingerprint module can be ensured, the problem of die marks is solved, the cost is reduced, and the thickness of the display module is reduced.

Description

Technical Field

[0001] The present application belongs to the technical field of display panels, and in particular, relates to a display module and a display device. Background Art

[0002] The heat dissipation film in the display module is generally an SCF (Super Clean Foam) composite film, and the foam in the SCF composite film has many irregular small holes, so it is necessary to groove the SCF film layer to place the fingerprint module in the groove to prevent the ultrasonic wave of the fingerprint module from being refracted multiple times in the foam and affecting the recognition accuracy of the fingerprint module. However, the step difference caused by the grooves in the SCF film layer is easy to cause mold printing problems, and the grooves increase the die-cutting process and increase the cost. In addition, the foam is thick, which leads to a thicker display module. Summary of the invention

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a display module and a display device, which can solve the mold printing problem while ensuring the recognition accuracy of the fingerprint module, and reduce the cost and thickness of the display module.

[0004] In a first aspect, the present application provides a display module, comprising:

[0005] Display panel;

[0006] A heat dissipation film, located on the backlight side of the display panel;

[0007] An ultrasonic fingerprint module is located on a side of the heat dissipation film away from the display panel;

[0008] Among them, the heat dissipation film includes a buffer layer, a heat spreader layer and an anti-mold printing layer, the heat spreader layer is located on the side of the buffer layer away from the display panel, and the anti-mold printing layer is located on at least one of the two opposite sides of the buffer layer, and the two opposite sides of the buffer layer include the side of the buffer layer away from the heat spreader layer and the side of the buffer layer close to the heat spreader layer; the elastic modulus of the anti-mold printing layer is greater than the elastic modulus of the buffer layer, and the buffer layer is a uniform dielectric layer that allows ultrasonic waves to propagate in a straight line.

[0009] According to the display module of the present application, the buffer layer, the heat-spreading layer and the anti-mold-printing layer in the heat dissipation film are all set to be a uniform dielectric layer that allows ultrasonic waves to propagate in a straight line. The fingerprint module is located on the side of the heat dissipation film away from the display panel. The uniform dielectric layer is conducive to the transmission of ultrasonic waves, thereby ensuring the recognition accuracy of the fingerprint module. There is no need to groove the heat dissipation film, and an anti-mold-printing layer is set on at least one of the two opposite sides of the buffer layer to solve the mold-printing problem caused by the grooves of the heat dissipation film, reduce the die-cutting process, and reduce the cost. In addition, the thickness of the uniform dielectric layer is thinned, thereby reducing the thickness of the display module.

[0010] According to one embodiment of the present application, the buffer layer includes a silica gel layer.

[0011] The buffer layer is set as a silicone layer, the thickness of the buffer layer is reduced, and then the thickness of the display module is reduced. The internal medium of the silicone layer is uniform, which is conducive to the transmission of ultrasonic waves and ensures the recognition accuracy of the fingerprint module. In addition, the silicone layer itself has adhesion properties, so that the buffer layer can be directly attached to the surface of the display panel or the anti-mold printing layer without setting an adhesion layer, further reducing the thickness of the display module.

[0012] According to an embodiment of the present application, a groove is provided on the side of the heat dissipation film away from the display panel, and the ultrasonic fingerprint module is located in the groove. A groove is provided in the heat dissipation film, and the ultrasonic fingerprint module is arranged in the groove, so as to further reduce the thickness of the display module.

[0013] According to an embodiment of the present application, the anti-mold printing layer is located on a side of the buffer layer away from the heat-dissipating layer, and the groove penetrates the heat-dissipating layer and extends into the buffer layer.

[0014] According to one embodiment of the present application, the heat-dissipating layer includes a metal layer.

[0015] According to one embodiment of the present application, the display module further includes a driving circuit board;

[0016] The driving circuit board is connected to the display panel and the ultrasonic fingerprint module respectively.

[0017] By integrating the fingerprint FPC corresponding to the fingerprint module into the main FPC corresponding to the display panel, a driving circuit board is formed, thereby reducing the space occupied by the driving circuit board.

[0018] According to an embodiment of the present application, the driving circuit board integrates a display driving module and a touch driving module, and the display driving module and the touch driving module share at least one component.

[0019] The display driving module and the touch driving module integrated in the driving circuit board share at least one component, which reduces the number of components used, saves space, and reduces costs.

[0020] According to an embodiment of the present application, the driving circuit board is located on a side of the heat dissipation film away from the display panel, and the driving circuit board is located on at least one side of the peripheral side of the ultrasonic fingerprint module.

[0021] According to one embodiment of the present application, the display module further includes a shielding layer;

[0022] The shielding layer is located on a side of the driving circuit board away from the heat dissipation film.

[0023] According to one embodiment of the present application, the driving circuit board is provided with a fingerprint connector, and the driving circuit board is connected to the ultrasonic fingerprint module through the fingerprint connector.

[0024] According to one embodiment of the present application, the fingerprint connector is a board-to-board connector.

[0025] The fingerprint module is connected to the driver circuit board through a board-to-board connector, making the connection between the fingerprint module and the driver circuit board more stable and solving the problems of fingerprint FPC warping and poor insertion.

[0026] According to one embodiment of the present application, the ultrasonic fingerprint module includes a fingerprint sensing layer, a piezoelectric layer, an electrode layer and an insulating layer which are sequentially located on a side of the heat dissipation film away from the display panel;

[0027] The driving circuit board is connected to the fingerprint sensing layer.

[0028] According to one embodiment of the present application, the driving circuit board is provided with a terminal connector.

[0029] According to one embodiment of the present application, the terminal connector is a board-to-board connector.

[0030] In a second aspect, the present application provides a display device, which includes the above-mentioned display module.

[0031] According to the display device of the present application, the buffer layer in the heat dissipation film is set as a uniform dielectric layer that allows ultrasonic waves to propagate in a straight line. The fingerprint module is located on the side of the heat dissipation film away from the display panel. The uniform dielectric layer is conducive to the transmission of ultrasonic waves, thereby ensuring the recognition accuracy of the fingerprint module. There is no need to groove the heat dissipation film, and an anti-mold printing layer is provided on at least one of the two opposite sides of the buffer layer to solve the mold printing problem caused by the grooves of the heat dissipation film, reduce the die-cutting process, and reduce the cost. In addition, the thickness of the uniform dielectric layer is thinned, thereby reducing the thickness of the display module.

[0032] According to one embodiment of the present application, the display device further includes a terminal module;

[0033] The terminal module is connected to the display module.

[0034] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0036] Figure 1It is one of the structural schematic diagrams of the display module provided in the embodiment of the present application;

[0037] Figure 2 It is one of the structural schematic diagrams of the display module provided in the embodiment of the present application;

[0038] Figure 3 It is one of the structural schematic diagrams of the display module provided in the embodiment of the present application;

[0039] Figure 4 It is a schematic diagram of ultrasonic transmission in foam in the related art;

[0040] Figure 5 is a schematic diagram of ultrasonic transmission in a buffer layer of a display module provided in an embodiment of the present application;

[0041] Figure 6 This is one of the structural schematic diagrams of the fingerprint module and the driving circuit board in the display module provided in the embodiment of the present application;

[0042] Figure 7 This is the second structural schematic diagram of the fingerprint module and the driving circuit board in the display module provided in the embodiment of the present application;

[0043] Figure 8 This is the third structural schematic diagram of the fingerprint module and the driving circuit board in the display module provided in the embodiment of the present application;

[0044] Fig. 9 It is a structural schematic diagram of the fingerprint module in the display module provided in an embodiment of the present application. DETAILED DESCRIPTION

[0045] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0046] The display module and the display device provided in the embodiments of the present application are described below with reference to the accompanying drawings.

[0047] Figure 1 A schematic diagram of the structure of a display module provided in an embodiment of the present application.

[0048] like Figure 1 As shown, the display module includes a display panel 10, a heat dissipation film 20 and an ultrasonic fingerprint module 30. Among them, the display module performs an unlocking operation based on ultrasonic fingerprint, that is, the image of the fingerprint is obtained by ultrasonic technology for unlocking operation. Compared with optical fingerprint (optical fingerprint uses the reflection of light to detect the fingerprint circuit for unlocking operation), ultrasonic fingerprint has the advantages of fast recognition speed, high recognition accuracy and high security.

[0049] The display panel 1 can be an OLED (Organic Light-Emitting Diode) display panel, or other types of display panels, which are not specifically limited here. The heat dissipation film 20 is located on the backlight side of the display panel 10, that is, the heat dissipation film 20 is located on the back of the display panel 10. The heat dissipation film 20 includes a buffer layer 21, which is used to buffer the stress acting on the display panel 10. The buffer layer 21 is a uniform dielectric layer that allows ultrasonic waves to propagate in a straight line, that is, the internal medium of the buffer layer 21 is uniform. The fingerprint module 30 is located on the side of the heat dissipation film 20 away from the display panel 10, that is, the fingerprint module 30 can be attached to the surface of the heat dissipation film 20 away from the display panel 10.

[0050] The heat dissipation film 20 further includes a heat-dissipating layer 22, which is located on the side of the buffer layer 21 close to the fingerprint module 30, that is, the ultrasonic fingerprint module 30 is attached to the side of the heat-dissipating layer 22 away from the buffer layer 21. The heat-dissipating layer 22 is used to uniformly dissipate the heat generated when the display panel 10 is working. The heat-dissipating layer 22 is a uniform medium layer that allows ultrasonic waves to propagate in a straight line, that is, the internal medium of the heat-dissipating layer 22 is uniform.

[0051] The heat dissipation film 20 further includes an anti-mold printing layer 23, which is located on at least one of the two opposite sides of the buffer layer 21. The two opposite sides of the buffer layer 21 include a side of the buffer layer 21 away from the heat-dissipating layer 22 and a side of the buffer layer 21 close to the heat-dissipating layer 22. Figure 1 As shown, the anti-mold printing layer 23 can be located between the buffer layer 21 and the heat-dissipating layer 22; Figure 2 As shown, the anti-mold printing layer 23 may be located between the buffer layer 21 and the display panel 10; Figure 3 As shown, the anti-mold printing layer 23 can be located between the buffer layer 21 and the heat-diffusion layer 22 and between the buffer layer 21 and the display panel 10. The elastic modulus of the anti-mold printing layer 23 is greater than the elastic modulus of the buffer layer 21 to prevent the occurrence of mold printing problems. The anti-mold printing layer 23 is a uniform dielectric layer that allows ultrasonic waves to propagate in a straight line, that is, the internal medium of the anti-mold printing layer 23 is uniform. The ultrasonic fingerprint module 30 is located on the side of the heat dissipation film 20 away from the display panel 10, that is, the ultrasonic fingerprint module 30 is located on the side of the heat-diffusion layer 22 away from the buffer layer 21. Among them, the buffer layer 21, the heat-diffusion layer 22 and the anti-mold printing layer 23 are respectively uniform dielectric layers that allow ultrasonic waves to propagate in a straight line, that is, the internal medium of the buffer layer 21, the heat-diffusion layer 22 and the anti-mold printing layer 23 is uniform, which is conducive to the transmission of ultrasonic waves, so that when the ultrasonic fingerprint module 30 is located on the side of the heat dissipation film 20 away from the display panel 10, the recognition accuracy of the ultrasonic fingerprint module 30 can be guaranteed.

[0052] The heat dissipation film in the related art is a SCF composite film, and the buffer layer in the SCF composite film is foam. The foam is produced by a foaming process, so that there are many small semi-closed and semi-open holes of different sizes inside the foam, such as Figure 4 As shown, this microstructure will have multi-directional refraction and reflection during the ultrasonic transmission process, which seriously affects the utilization rate of ultrasonic waves, and then affects the recognition accuracy of the ultrasonic fingerprint module. In order to ensure the recognition accuracy of the ultrasonic fingerprint module, a groove is made in the SCF composite film to hollow out the foam, and the ultrasonic fingerprint module is attached to the groove to prevent the foam from affecting the transmission of ultrasonic waves. However, the step difference caused by the groove of the SCF composite film causes the attachment of the ultrasonic fingerprint module to cause mold printing problems, affecting the display effect. Moreover, the size of the groove depends on the size of the ultrasonic fingerprint module. The larger the size of the ultrasonic fingerprint module, the larger the groove, resulting in more serious mold printing problems. Moreover, the groove of the SCF composite film increases the die-cutting process and increases the cost. In addition, due to the numerous pores in the foam, the thickness of the foam is large, which in turn causes the thickness of the display module to be large, which is not conducive to the transmission of ultrasonic waves.

[0053] In the embodiment of the present application, the buffer layer 21 in the heat dissipation film 20 is a uniform dielectric layer, so that the dielectric inside the buffer layer 21 is uniform, that is, there are no numerous pores inside the buffer layer 21. Figure 5 As shown. Moreover, the heat-dissipating layer 22 and the anti-mold-printing layer 23 are also uniform dielectric layers. The buffer layer 21, the heat-dissipating layer 22 and the anti-mold-printing layer 23 with uniform dielectrics serve as transmission media for ultrasonic waves, which can reduce the refraction and reflection of ultrasonic waves, improve the utilization rate of ultrasonic waves, and ensure the recognition accuracy of the fingerprint module. The ultrasonic fingerprint module 30 is directly attached to the side of the heat dissipation film 20 away from the display panel 10. There is no need to groove the heat dissipation film 20, and the anti-mold-printing layer 23 is provided in the heat dissipation film 20, which fundamentally solves the mold-printing problem caused by the grooves, improves the display effect, and reduces the die-cutting process and reduces the cost. In addition, there are no pores in the buffer layer 21, so that the thickness of the buffer layer 21 is thinned, thereby reducing the overall thickness of the display module.

[0054] In some embodiments, the buffer layer 21 includes a silica gel layer.

[0055] During the manufacturing process, the silicone layer can be transformed from liquid to gel by hydrolysis reaction, and then dried to evaporate the water to obtain silicone that can be coated. After the silicone is coated on the backlight side of the display panel 10, it is degassed to discharge the gas in the silicone, and finally a silicone layer is formed. Since the gas in the silicone layer is discharged, the thickness of the silicone layer is reduced, and the internal medium of the silicone layer is uniform, which is conducive to the transmission of ultrasonic waves and ensures the recognition accuracy of the ultrasonic fingerprint module 30.

[0056] The SCF composite film in the related art also includes an adhesive layer, so that the foam is arranged on the back of the display panel 10 through the adhesive layer, and the setting of the adhesive layer increases the thickness of the SCF composite film. However, the buffer layer 21 in the embodiment of the present application includes a silicone layer, and the silicone layer itself has an adhesive property, so that the buffer layer 21 can be directly arranged on the back of the display panel 10 or the surface of the anti-mold printing layer without the need to set an adhesive layer, thereby further reducing the thickness of the display module.

[0057] In some embodiments, Figure 2 As shown, a groove 24 is provided on the side of the heat dissipation film 20 away from the display panel 10, and the ultrasonic fingerprint module 30 is located in the groove 24. The opening of the groove 24 faces the side of the heat dissipation film 20 away from the display panel 10, and the bottom of the groove 24 is located in the heat dissipation film 20, that is, the groove 24 does not penetrate the heat dissipation film 20.

[0058] The groove 24 does not penetrate the heat dissipation film 20, so that the bottom of the groove 24 has a buffer layer 21 and / or an anti-mold printing layer 24 to solve the mold printing problem. In addition, the ultrasonic fingerprint module 30 is arranged in the groove 24 to further reduce the thickness of the display module.

[0059] In some embodiments, the anti-mold printing layer 23 is located on a side of the buffer layer 21 away from the heat-dissipating layer 22 , and the groove 24 penetrates the heat-dissipating layer 22 and extends into the buffer layer 21 .

[0060] The anti-mold printing layer 23 can be located on one side of the buffer layer 21, and the ultrasonic fingerprint module 30 is located in the groove 24, further reducing the thickness of the display module, and the bottom of the groove 24 has the anti-mold printing layer 23, which effectively solves the mold printing problem.

[0061] In some embodiments, the heat-saturating layer 22 may include a metal layer, and the material of the metal layer may include copper foil or aluminum alloy.

[0062] In some embodiments, the material of the anti-mold printing layer 23 may include PI (Polyimide) or PET (Polyethylene terephthalate), etc.

[0063] It should be noted that the area of ​​the heat dissipation film 20 is larger than the area of ​​the ultrasonic fingerprint module 30, and the orthographic projection of the ultrasonic fingerprint module 30 on the display panel 10 is located within the orthographic projection of the heat dissipation film 20 on the display panel 10. In some embodiments, the heat dissipation film 20 completely covers the surface of the backlight side of the display panel 10.

[0064] In some embodiments, the display module may further include an adhesive layer, and the adhesive layer is located between the heat dissipation film 20 and the ultrasonic fingerprint module 30, that is, the ultrasonic fingerprint module 30 is attached to the heat dissipation film 20 through the adhesive layer. The material of the adhesive layer may include SPA (Pressure sensitive adhesive) and the like.

[0065] In some embodiments, Figures 6 to 8 As shown, the display module further includes a driving circuit board 40, and the driving circuit board 40 is connected to the display panel 10 and the ultrasonic fingerprint module 30 respectively, that is, the driving circuit board 40 can drive the display panel 10 and the ultrasonic fingerprint module 30 respectively. Among them, the driving circuit board 40 can be an FPC (Flexible Printed Circuit, flexible circuit board).

[0066] In the related art, the display panel is provided with a main FPC, and the fingerprint module is provided with a fingerprint FPC, that is, the main FPC and the fingerprint FPC are designed separately, which occupies a large space, and the connection between the main FPC and the fingerprint FPC is prone to cause the fingerprint FPC to warp and poor plugging. However, the embodiment of the present application integrates the fingerprint FPC into the main FPC to form a driving circuit board 40, which reduces the space occupied by the driving circuit board 40 and solves the problem of fingerprint FPC warping and poor plugging.

[0067] In some embodiments, the driver circuit board 40 integrates a display driver module and a touch driver module, and the display driver module and the touch driver module share at least one component.

[0068] like Figure 6 and Figure 8 As shown, the driving circuit board 40 may have a device area 41, and the display driving module and the touch driving module may be located in the device area 41. Figure 7 As shown, the driving circuit board 40 may also have a plurality of device areas 41 , and the display driving module and the touch driving module may be located in different device areas 41 .

[0069] The number and position of the device area 41 can be set according to the actual needs of the terminal module. For example, the device area 41 needs to avoid the installation position of some devices (such as batteries, etc.) in the terminal module, that is, the number and position of the device area 41 in the driver circuit board 40 can be determined according to the free position in the terminal module, so that the device area 41 in the driver circuit board 40 corresponds to the free position in the terminal module.

[0070] The display driver module is used to drive the display, and the touch driver module is used to drive the touch. The display driver module includes multiple components (such as capacitors, resistors, and diodes, etc.), and the touch driver module includes multiple components (such as capacitors, resistors, and diodes, etc.). The display driver module and the touch driver module share at least one component (such as capacitors and diodes in the power supply, etc.).

[0071] The components in the display driving module and the touch driving module are located in the device area 41 of the driving circuit board 40. The positions of the components in the display driving module and the touch driving module in the device area 41 of the driving circuit board 40 can be set according to actual needs.

[0072] In the related art, the main FPC and the fingerprint FPC are designed separately, and the components used are more and the cost is higher. However, in the embodiment of the present application, the fingerprint FPC is integrated into the main FPC to form a driving circuit board 40. The driving circuit board 40 integrates a display driving module and a touch driving module. Some components in the display driving module and the touch driving module can be shared, which reduces the components used, reduces the cost, and saves space.

[0073] In some embodiments, the driving circuit board 40 is located on a side of the heat dissipation film 20 away from the display panel 10, and the driving circuit board 40 is located on at least one side of the fingerprint module 30. Figure 6 and Figure 7 As shown, the driving circuit board 40 can be arranged around the ultrasonic fingerprint module 30, such as Figure 8 As shown, the driving circuit board 40 can also be located on two adjacent sides of the ultrasonic fingerprint module 30. The positions of the driving circuit board 40 and the ultrasonic fingerprint module 30 can be set according to actual needs and are not specifically limited here.

[0074] In some embodiments, the display module further includes a shielding layer, which is located on a side of the driving circuit board 40 away from the heat dissipation film 20. The shielding layer is used to shield the interference between the components in the driving circuit board 40 and the terminal module.

[0075] The coverage of the shielding layer can be set according to actual needs. In some embodiments, the shielding layer covers the device area 41 of the driving circuit board 40.

[0076] In the related art, the main FPC and the fingerprint FPC are designed separately, and a shielding cover needs to be set in the fingerprint FPC, and a shielding layer also needs to be set at the main FPC to shield the interference between the components and the terminal module. However, in the embodiment of the present application, the main FPC and the fingerprint FPC are integrated into a driving circuit board 40, the shielding cover in the fingerprint FPC is removed, and the interference between the components and the terminal module is shielded by the shielding layer, which saves space and reduces costs.

[0077] In some embodiments, Figures 6 to 8As shown, the driving circuit board 40 is provided with a fingerprint connector 42, and the driving circuit board 40 is connected to the ultrasonic fingerprint module 30 through the fingerprint connector 42. The fingerprint connector 42 may be a board-to-board (BTB) connector.

[0078] In the related art, the fingerprint FPC corresponding to the fingerprint module is connected to the main FPC corresponding to the display panel through a ZIF (Zero Insertion Force) connector. Due to the limitations of the entire machine, there is a risk of the fingerprint FPC warping and poor connection when plugging the fingerprint FPC through the ZIF connector.

[0079] The embodiment of the present application integrates the fingerprint FPC and the main FPC into a driving circuit board 40, and the ultrasonic fingerprint module 30 is connected to the driving circuit board 40 through a board-to-board connector, so that the connection between the ultrasonic fingerprint module 30 and the driving circuit board 40 is more stable, solving the problems of fingerprint FPC warping and poor insertion, and can save wiring space, reduce costs, and improve the yield and utilization of the display module.

[0080] The position of the fingerprint connector 42 on the driver circuit board 40 can be set according to actual needs. In some embodiments, the position of the fingerprint connector 42 on the driver circuit board 40 can be determined according to the position of the ultrasonic fingerprint module 30. Figures 6 to 8 As shown, the fingerprint connector 42 can be arranged at the edge of the driving circuit board 40 close to the ultrasonic fingerprint module 30 to facilitate the connection between the fingerprint connector 42 and the ultrasonic fingerprint module 30. The fingerprint connector 42 can be located at any position around the ultrasonic fingerprint module 30 to ensure the connection between the fingerprint connector 42 and the ultrasonic fingerprint module 30.

[0081] In some embodiments, the position of the fingerprint connector 42 on the driving circuit board 40 can be determined according to the position of the ultrasonic fingerprint module 30 and the position of the device area 41 on the driving circuit board 40. Figure 8 As shown, the fingerprint connector 42 can be set at the edge of the driving circuit board 40 close to the ultrasonic fingerprint module 30, and the fingerprint connector 42 and the device area 41 can be located on the same side of the ultrasonic fingerprint module 30 to facilitate the fingerprint connector 42 to be connected to the ultrasonic fingerprint module 30 and the components in the device area 41 respectively, and the device area 41 and the fingerprint connector 42 are close to each other on the driving circuit board 40, which can reduce the space occupied by the driving circuit board 40.

[0082] In some embodiments, Fig. 9As shown, the ultrasonic fingerprint module 30 includes a fingerprint sensing layer 31, a piezoelectric layer 32, an electrode layer 33 and an insulating layer 34 which are sequentially located on the side of the heat dissipation film 20 away from the display panel 10, that is, the fingerprint sensing layer 31 is located on the side of the heat dissipation film 20 away from the display panel 10, the piezoelectric layer 32 is located on the side of the fingerprint sensing layer 31 away from the heat dissipation film 20, the electrode layer 33 is located on the side of the piezoelectric layer 32 away from the fingerprint sensing layer 31, and the insulating layer 34 is located on the side of the electrode layer 33 away from the piezoelectric layer 32.

[0083] Among them, the fingerprint sensing layer 31 is connected to the driving circuit board 40. The fingerprint sensing layer 31 includes a plurality of fingerprint sensing units. The thickness of the fingerprint sensing layer 31 may be 0.09 mm. The material of the piezoelectric layer 32 may be polyvinylidene fluoride (PVDF), and the thickness of the piezoelectric layer 32 may be less than or equal to 10 μm. The material of the electrode layer 33 may be a metal material, such as silver Ag, etc., and the thickness of the electrode layer 33 may be between 15 and 25 μm. The material of the insulating layer 34 may be insulating ink, etc., and the thickness of the insulating layer 34 may be between 15 and 30 μm. In addition, an adhesive (such as PC adhesive) may be provided between the fingerprint sensing layer 31 and the piezoelectric layer 32, and the thickness of the adhesive may be between 0.1 and 0.9 μm.

[0084] In the embodiment of the present application, the fingerprint sensing layer 31 in the ultrasonic fingerprint module 30 is directly connected to the driving circuit board 40 through a board-to-board connector, thereby improving the stability of the connection between the ultrasonic fingerprint module 30 and the driving circuit board 40, saving space and cost.

[0085] In some embodiments, Figures 6 to 8 As shown, the driving circuit board 40 is provided with a terminal connector 43, and the terminal connector 43 is used to connect the driving circuit board 40 with the terminal module.

[0086] The number of terminal connectors 43 may be one or more. The number of terminal connectors 43 may be determined according to the number of target terminals in the terminal module for connecting to the driver circuit board 40, that is, the number of terminal connectors 43 is the same as the number of target terminals in the terminal module for connecting to the driver circuit board 40. If the terminal module includes at least one target terminal, the driver circuit board 40 is provided with at least one terminal connector 43 to ensure that at least one target terminal in the terminal module is connected to at least one terminal connector 43 in a one-to-one correspondence.

[0087] The position of the terminal connector 43 can be determined according to the position of the target terminal in the terminal module corresponding to the terminal connector 43, that is, the position of the terminal connector 43 corresponds to the position of the target terminal in the terminal module corresponding to the terminal connector 43. The position of at least one terminal connector 43 corresponds to the position of at least one target terminal in a one-to-one manner to ensure that at least one terminal connector 43 can be connected to at least one target terminal in a one-to-one manner.

[0088] The terminal connector 43 can be arranged horizontally or vertically. The arrangement direction of the terminal connector 43 can be determined according to the arrangement direction of the target terminal corresponding to the terminal connector 43 in the terminal module, that is, the arrangement direction of the terminal connector 43 is consistent with the arrangement direction of the target terminal corresponding to the terminal connector 43 in the terminal module. If the target terminal corresponding to the terminal connector 43 is arranged horizontally, the terminal connector 43 is arranged horizontally; if the target terminal corresponding to the terminal connector 43 is arranged vertically, the terminal connector 43 is arranged vertically, so as to ensure that the terminal connector 43 and the corresponding target terminal can be adapted and connected.

[0089] In some embodiments, the terminal connector 43 may be a board-to-board connector, that is, the driver circuit board 40 is connected to the terminal module in a board-to-board manner, so that the connection between the terminal module and the driver circuit board 40 is more stable and saves wiring space.

[0090] In some embodiments, the shape of the driving circuit board 40 and its position around the ultrasonic fingerprint module 30 can be comprehensively determined according to the positions of the device area 41, the fingerprint connector 42 and the terminal connector 43. Figure 6 and Figure 7 As shown, when the device area 41, the fingerprint connector 42 and the terminal connector 43 are located on different sides of the ultrasonic fingerprint module 30, the driving circuit board 40 can be arranged around the ultrasonic fingerprint module 30. Figure 8 As shown, when the device area 41, the fingerprint connector 42 and the terminal connector 43 are located on two adjacent sides of the ultrasonic fingerprint module 30, the driving circuit board 40 can be located only on two adjacent sides of the ultrasonic fingerprint module 30. In the case of meeting the requirements of the terminal module, the device area 41, the fingerprint connector 42 and the terminal connector 43 are centrally arranged to reduce the space occupied by the driving circuit board 40.

[0091] In some embodiments, the display panel 10 may include a substrate, a thin film transistor layer, a cathode layer, a light emitting layer, and an anode layer. The thin film transistor layer is located on one side of the substrate, the cathode layer is located on the side of the thin film transistor layer away from the substrate, the light emitting layer is located on the side of the cathode layer away from the thin film transistor layer, and the anode layer is located on the side of the light emitting layer away from the cathode layer. The display panel 10 may also include other film layers, which are not specifically limited here.

[0092] In some embodiments, Figures 1 to 3 As shown, the display module may further include a polarizer 11, an optical adhesive layer 12 and a cover plate 13. The polarizer 11 is located on the side of the display panel 10 away from the heat dissipation film 20, that is, the polarizer 11 is located on the light-emitting side of the display panel 10. The optical adhesive layer 12 is located on the side of the polarizer 11 away from the display panel 10, and the cover plate 13 is located on the side of the optical adhesive layer 12 away from the polarizer 11, that is, the cover plate 13 is adhered to the polarizer 11 through the optical adhesive layer 12. The material of the cover plate 13 can be glass, etc. The display module may also include other film layers, which are not specifically limited here.

[0093] According to the display module provided by the embodiment of the present application, the buffer layer, the heat-spreading layer and the anti-mold-printing layer in the heat dissipation film are all set as a uniform dielectric layer that allows ultrasonic waves to propagate in a straight line. The fingerprint module is located on the side of the heat dissipation film away from the display panel. The uniform dielectric layer is conducive to the transmission of ultrasonic waves, ensuring the recognition accuracy of the fingerprint module. There is no need to groove the heat dissipation film, and the anti-mold-printing layer is set on at least one of the two opposite sides of the buffer layer to solve the mold-printing problem caused by the groove of the heat dissipation film, and reduce the die-cutting process and reduce costs. In addition, the thickness of the uniform dielectric layer is thinned, thereby reducing the thickness of the display module. In addition, the fingerprint FPC is integrated into the main FPC to form a driving circuit board, reducing the space occupied by the driving circuit board, and the fingerprint module is connected to the driving circuit board through a board-to-board connector, so that the connection between the fingerprint module and the driving circuit board is more stable, solving the problems of fingerprint FPC warping and poor plugging, and improving the yield and utilization of the display module.

[0094] Accordingly, an embodiment of the present application further provides a display device, comprising the display module in the above embodiment. Figure 1 As shown, the display module includes:

[0095] Display panel 10;

[0096] The heat dissipation film 20 is located on the backlight side of the display panel 10

[0097] The ultrasonic fingerprint module 30 is located on a side of the heat dissipation film 20 away from the display panel 10;

[0098] Among them, the heat dissipation film includes a buffer layer, a heat spreader layer and an anti-mold printing layer, the heat spreader layer is located on the side of the buffer layer away from the display panel, and the anti-mold printing layer is located on at least one of the two opposite sides of the buffer layer, and the two opposite sides of the buffer layer include the side of the buffer layer away from the heat spreader layer and the side of the buffer layer close to the heat spreader layer; the elastic modulus of the anti-mold printing layer is greater than the elastic modulus of the buffer layer, and the buffer layer, the heat spreader layer and the anti-mold printing layer are respectively uniform dielectric layers that allow ultrasonic waves to propagate in a straight line.

[0099] According to the display device provided in the embodiment of the present application, the buffer layer, the heat-spreading layer and the anti-mold-printing layer in the heat dissipation film are all set to be a uniform dielectric layer that allows ultrasonic waves to propagate in a straight line. The fingerprint module is located on the side of the heat dissipation film away from the display panel. The uniform dielectric layer is conducive to the transmission of ultrasonic waves, thereby ensuring the recognition accuracy of the fingerprint module. There is no need to groove the heat dissipation film, and an anti-mold-printing layer is provided on at least one of the two opposite sides of the buffer layer to solve the mold-printing problem caused by the grooves in the heat dissipation film, reduce the die-cutting process, and reduce the cost. In addition, the thickness of the uniform dielectric layer is thinned, thereby reducing the thickness of the display module.

[0100] In some embodiments, the buffer layer 21 includes a silicone layer. The thickness of the silicone layer is relatively thin, and the internal medium of the silicone layer is uniform, which is conducive to the transmission of ultrasonic waves and ensures the recognition accuracy of the ultrasonic fingerprint module 30. In addition, the silicone layer itself has adhesion properties, so that the buffer layer 21 can be directly attached to the surface of the display panel 10 or the anti-mold printing layer without the need to set an adhesion layer, further reducing the thickness of the display module.

[0101] In some embodiments, a groove 24 is provided on the side of the heat dissipation film 20 away from the display panel 10, and the ultrasonic fingerprint module 30 is located in the groove 24. A groove is provided in the heat dissipation film, and the ultrasonic fingerprint module is arranged in the groove, so as to further reduce the thickness of the display module.

[0102] In some embodiments, the anti-mold printing layer 23 is located on a side of the buffer layer 21 away from the heat-dissipating layer 22 , and the groove 24 penetrates the heat-dissipating layer 22 and extends into the buffer layer 21 .

[0103] In some embodiments, the heat dissipation film 20 further includes a heat-spreading layer 22; the heat-spreading layer 22 is located on a side of the buffer layer 21 close to the ultrasonic fingerprint module 30. The heat-spreading layer 22 is used to uniformly dissipate the heat generated by the display panel 10 when it is working.

[0104] In some embodiments, the heat-dissipating layer 22 includes a metal layer, and the material of the metal layer can be copper foil or aluminum alloy.

[0105] In some embodiments, the display module further includes a driving circuit board 40; the driving circuit board 40 is connected to the display panel 10 and the ultrasonic fingerprint module 30 respectively.

[0106] In some embodiments, the driver circuit board 40 integrates a display driver module and a touch driver module, and the display driver module and the touch driver module share at least one component. The driver circuit board 40 integrates a display driver module for driving display and a touch driver module for driving touch, and some components in the display driver module and the touch driver module can be shared, which reduces costs and reduces the space occupied by the driver circuit board 40.

[0107] In some embodiments, the driving circuit board 40 is located on a side of the heat dissipation film 20 away from the display panel 10 , and the driving circuit board 40 is located on at least one side of the ultrasonic fingerprint module 30 .

[0108] In some embodiments, the display module further includes a shielding layer, which is located on the side of the driving circuit board 40 away from the heat dissipation film 20. The main FPC and the fingerprint FPC are integrated into the driving circuit board 40, the shielding cover in the fingerprint FPC is removed, and the interference between the components and the terminal module is shielded by the shielding layer, which saves space and reduces costs.

[0109] In some embodiments, the driving circuit board 40 is provided with a fingerprint connector 42 , and the driving circuit board 40 is connected to the ultrasonic fingerprint module 30 via the fingerprint connector 42 .

[0110] In some embodiments, the fingerprint connector 42 is a board-to-board connector. In this embodiment, the fingerprint FPC and the main FPC are integrated into a driving circuit board 40, and the ultrasonic fingerprint module 30 is connected to the driving circuit board 40 through the board-to-board connector, so that the connection between the ultrasonic fingerprint module 30 and the driving circuit board 40 is more stable, solving the problem of fingerprint FPC warping and poor plugging, and improving the yield and utilization of the display module.

[0111] In some embodiments, the ultrasonic fingerprint module 30 includes a fingerprint sensing layer 31, a piezoelectric layer 32, an electrode layer 33 and an insulating layer 34, which are sequentially located on the side of the heat dissipation film 20 away from the display panel 10; the driving circuit board 40 is connected to the fingerprint sensing layer 31. In this embodiment, the fingerprint sensing layer 31 in the fingerprint module 20 is directly connected to the driving circuit board 40 through a board-to-board connector, which is stable, saves space and saves costs.

[0112] In some embodiments, the driving circuit board 40 is provided with a terminal connector 43 .

[0113] In some embodiments, the terminal connector 43 is a board-to-board connector.

[0114] In some embodiments, the display device further includes a terminal module, which is connected to the display module, that is, the terminal module is connected to the display module through the terminal connector 43 of the driver circuit board 40 in the display module. The driver circuit board 40 is connected to the terminal module in a board-to-board manner, which makes the connection more stable and saves wiring space.

[0115] The display device provided in the embodiment of the present application can be applied to any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, etc.

[0116] The terms "first", "second", etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of the same type, and the number of objects is not limited. For example, the first object can be one or more.

[0117] In the description of the present application, “plurality” means two or more.

[0118] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0119] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A display module, characterized in that: include: Display panel; A heat dissipation film, located on the backlight side of the display panel; An ultrasonic fingerprint module is located on a side of the heat dissipation film away from the display panel; Among them, the heat dissipation film includes a buffer layer, a heat spreader layer and an anti-mold printing layer, the heat spreader layer is located on the side of the buffer layer away from the display panel, and the anti-mold printing layer is located on at least one of the two opposite sides of the buffer layer, and the two opposite sides of the buffer layer include the side of the buffer layer away from the heat spreader layer and the side of the buffer layer close to the heat spreader layer; the elastic modulus of the anti-mold printing layer is greater than the elastic modulus of the buffer layer, and the buffer layer, the heat spreader layer and the anti-mold printing layer are respectively uniform dielectric layers that allow ultrasonic waves to propagate in a straight line.

2. The display module according to claim 1, characterized in that: The buffer layer includes a silica gel layer.

3. The display module according to claim 1, characterized in that: A groove is provided on a side of the heat dissipation film facing away from the display panel, and the ultrasonic fingerprint module is located in the groove.

4. The display module according to claim 3, characterized in that: The anti-mold printing layer is located on a side of the buffer layer away from the heat-dissipating layer, and the groove penetrates the heat-dissipating layer and extends into the buffer layer.

5. The display module according to claim 1, characterized in that: The heat-dissipating layer includes a metal layer.

6. The display module according to claim 1, characterized in that: The display module also includes a driving circuit board; The driving circuit board is connected to the display panel and the ultrasonic fingerprint module respectively.

7. The display module according to claim 6, characterized in that: The driving circuit board integrates a display driving module and a touch driving module, and the display driving module and the touch driving module share at least one component.

8. The display module according to claim 6, characterized in that: The driving circuit board is located on a side of the heat dissipation film away from the display panel, and the driving circuit board is located on at least one side of the periphery of the ultrasonic fingerprint module.

9. The display module according to claim 8, characterized in that: The display module also includes a shielding layer; The shielding layer is located on a side of the driving circuit board away from the heat dissipation film.

10. The display module according to claim 6, characterized in that: The driving circuit board is provided with a fingerprint connector, and the driving circuit board is connected to the ultrasonic fingerprint module through the fingerprint connector.

11. The display module according to claim 10, characterized in that: The fingerprint connector is a board-to-board connector.

12. The display module according to claim 6, characterized in that: The ultrasonic fingerprint module comprises a fingerprint sensing layer, a piezoelectric layer, an electrode layer and an insulating layer which are sequentially located on a side of the heat dissipation film away from the display panel; The driving circuit board is connected to the fingerprint sensing layer.

13. The display module according to claim 6, characterized in that: The driving circuit board is provided with a terminal connector.

14. A display device, characterized in that: A display module comprising any one of claims 1 to 13.

15. The display device according to claim 14, characterized in that: The display device also includes a terminal module; The terminal module is connected to the display module.

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