Method of manufacturing display device

Abstract

The method of manufacturing a display device includes: forming a light emitting element layer on a mother substrate; forming a via portion in the dummy region of the preliminary package substrate to form at least one bridge connecting the cell region of the preliminary package substrate and the dummy region adjacent to the cell region; bonding the mother substrate and the preliminary packaging substrate; applying a sealing member through the through-hole portion, the sealing member extending from an upper surface of the mother substrate to a side surface of the preliminary package substrate exposed by the through-hole portion; and cutting the at least one bridge and separating the dummy region of the preliminary package substrate.

Description

Technical Field

[0001] The present disclosure relates to a method of manufacturing a display device with improved process reliability. Background Art

[0002] Due to the increasing development of information technology, the importance of display devices as communication media has been emphasized. In addition, users of display devices such as liquid crystal display (LCD) devices, organic light emitting display (OLED) devices, plasma display panel (PDP) devices, or quantum dot display devices have been increasing and becoming more and more popular.

[0003] A head mounted display (HMD) includes a display device. An HMD is a device worn like glasses or a helmet, which includes a screen for the eyes. An HMD is used in virtual reality (VR) or augmented reality (AR), and content is projected at a distance close to the user's eyes. The HMD uses a lens to provide an image generated by the display device to the user's eyes. The HMD may include a high-resolution micro organic light emitting diode (OLED). The high-resolution micro OLED may be an organic light emitting diode on silicon (OLEDoS) formed using a semiconductor process based on a silicon wafer.

[0004] It should be understood that this background technology section is intended, in part, to provide a useful background for understanding the technology. However, this background technology section may also include ideas, concepts or understandings that were not part of the understanding of a person skilled in the relevant art before the corresponding effective filing date of the subject matter disclosed herein. Summary of the invention

[0005] Various embodiments provide a method of manufacturing a display device that prevents defects caused by fine glass fragments generated during physical processing of a package substrate.

[0006] According to an embodiment of the present disclosure, a method for manufacturing a display device includes: forming a light-emitting element layer on a mother substrate; forming a through-hole portion in a dummy area of ​​a preliminary encapsulation substrate to form at least one bridge connecting a unit area of ​​the preliminary encapsulation substrate and a dummy area adjacent to the unit area; joining the mother substrate and the preliminary encapsulation substrate; applying a sealing member through the through-hole portion, the sealing member extending from an upper surface of the mother substrate to a side surface of the preliminary encapsulation substrate exposed by the through-hole portion; and cutting at least one bridge and separating the dummy area of ​​the preliminary encapsulation substrate.

[0007] In an embodiment, the cutting of the at least one bridge may include applying an impact to an outer side surface of the preliminary package substrate.

[0008] In an embodiment, applying the impact to the outer side surface of the preliminary package substrate may include applying the impact in a second direction perpendicular to a first direction in which the at least one bridge extends.

[0009] In an embodiment, the width of the central portion of at least one bridge may be smaller than the width of each end of the at least one bridge.

[0010] In an embodiment, a thickness of the at least one bridge may be less than a thickness of the preliminary package substrate.

[0011] In an embodiment, the forming of the through hole portion in the dummy region may include processing a side surface of the preliminary package substrate to have a chamfered shape. The side surface of the preliminary package substrate may overlap the cell region and be exposed by the through hole portion.

[0012] In an embodiment, the method may further include strengthening the preliminary package substrate by an ion exchange process between the forming of the through hole portion in the dummy region and the cutting of the at least one bridge.

[0013] According to another embodiment of the present disclosure, a method for manufacturing a display device includes: forming a light emitting element layer on a mother substrate; forming a through hole portion in a dummy area of ​​a preliminary packaging substrate to form at least one bridge connecting a unit area of ​​the preliminary packaging substrate and a dummy area adjacent to the unit area; forming a polarization layer on the preliminary packaging substrate; joining the mother substrate and the preliminary packaging substrate; cutting at least one bridge and separating the dummy area of ​​the preliminary packaging substrate.

[0014] In an embodiment, the forming of the polarization layer may include: forming a preliminary polarization layer overlapping the cell region and the dummy region on the preliminary encapsulation substrate; and cutting the preliminary polarization layer and forming the polarization layer overlapping the cell region.

[0015] In an embodiment, the cutting of the preliminary polarization layer may include irradiating a laser to the preliminary polarization layer, and the irradiation of the laser may overlap with both ends of the at least one bridge.

[0016] In an embodiment, the cutting of the preliminary polarization layer may include simultaneously cutting the preliminary polarization layer and the at least one bridge piece using a laser.

[0017] In an embodiment, the cutting of the preliminary polarization layer may be performed before the cutting of the at least one bridge member. The cutting of the at least one bridge member may include applying an impact to an outer side surface of the preliminary encapsulation substrate.

[0018] In an embodiment, the width of the central portion of at least one bridge may be smaller than the width of each end of the at least one bridge.

[0019] In an embodiment, the forming of the via portion in the dummy region may include processing a side surface of the preliminary package substrate to have a chamfered shape, and the side surface of the preliminary package substrate may overlap the cell region and be exposed by the via portion.

[0020] In an embodiment, the method may further include strengthening the preliminary package substrate by an ion exchange process between the forming of the through hole portion in the dummy region and the cutting of the at least one bridge.

[0021] According to an embodiment of the present disclosure, a method for manufacturing a display device may include: processing a preliminary packaging substrate including a unit area and a dummy area adjacent to the unit area; forming at least one bridge connecting the unit area and the dummy area; joining a mother substrate and the preliminary packaging substrate; and cutting at least one bridge and separating the dummy area of ​​the preliminary packaging substrate.

[0022] For example, the method of manufacturing a display device includes cutting at least one bridge member and separating the dummy region of the preliminary encapsulation substrate. Therefore, without using a physical processing method using a diamond wheel or a dicing saw, the dummy region of the preliminary encapsulation substrate can be separated from the mother substrate. Therefore, problems caused by fine-sized fragments of the preliminary encapsulation substrate remaining on the encapsulation substrate that may be generated during the physical processing method can be prevented. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Additional understanding according to embodiments of the present disclosure will become more apparent by describing in detail elements of embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0024] Figure 1 is a schematic plan view showing a display device according to an embodiment of the present disclosure;

[0025] Figure 2 yes Figure 1 A schematic enlarged plan view of region A;

[0026] Figure 3 It is along Figure 2 A schematic cross-sectional view taken along line II-II';

[0027] Figure 4 It is along Figure 1 A schematic cross-sectional view taken along line II' of ;

[0028] Figure 5 is a schematic flow chart of a method for manufacturing a display device according to an embodiment of the present disclosure;

[0029] Figures 6 to 20 It is shown Figure 5 A schematic diagram of a method for manufacturing a display device;

[0030] Fig.21 is a schematic flowchart of a method for manufacturing a display device according to another embodiment of the present disclosure; and

[0031] Figures 22 to 32 It is shown Fig.21 Schematic diagram of a method for manufacturing a display device. DETAILED DESCRIPTION

[0032] In the following description, for the purpose of explanation, many specific details are set forth in order to provide a thorough understanding of various embodiments or implementations of the present disclosure. As used herein, "embodiment" and "implementation" are interchangeable words, which are non-limiting examples of the devices or methods disclosed herein. However, it is apparent that various embodiments may be practiced without these specific details or with one or more equivalent arrangements. Here, various embodiments do not have to be exclusive and do not limit the present disclosure. For example, the specific shape, configuration, and characteristics of an embodiment may be used or implemented in another embodiment.

[0033] Unless otherwise specified, the illustrated embodiments should be understood to provide features of the present disclosure. Therefore, unless otherwise specified, the features, components, modules, layers, films, panels, regions and / or aspects, etc. (hereinafter individually or collectively referred to as "elements") of the various embodiments may be combined, separated, interchanged and / or rearranged in other ways without departing from the scope of the present invention.

[0034] The use of cross hatching and / or shading in the drawings is generally provided to clarify the boundaries between adjacent elements. Therefore, unless otherwise stated, the presence or absence of cross hatching or shading does not convey or indicate any preference or requirement for a specific material, material properties, size, ratio, commonality between the elements shown, and / or any other characteristics, attributes, properties, etc. of the elements. In addition, in the drawings, the size and relative size of the elements may be exaggerated for the purpose of clarity and / or description. When the embodiment can be implemented differently, a specific process sequence can be performed differently from the described sequence. For example, two processes described in succession can be performed substantially simultaneously, or in an order opposite to the described sequence. In addition, the same reference numerals represent the same elements.

[0035] When an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, the element may be directly on, directly connected to, or directly coupled to the other element or layer, or there may be intervening elements or layers. However, when an element or layer is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers. For this purpose, the term "connected" may refer to a physical connection, an electrical connection, and / or a fluid connection with or without intervening elements.

[0036] Although the terms "first", "second", etc. may be used to describe various elements in this article, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Therefore, without departing from the teachings of the present disclosure, the first element discussed below may be referred to as the second element.

[0037] Spatially relative terms, such as "under," "beneath," "under," "lower," "above," "upper," "above," "higher," and "side" (e.g., as in "sidewall"), etc., may be used herein for descriptive purposes and thereby describe the relationship of one element to another element (or elements) as shown in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientations depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, an element described as "under" or "below" other elements or features would subsequently be oriented "above" the other elements or features. Thus, the term "under" may include both above and below orientations. Furthermore, the device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and therefore, the spatially relative descriptors used herein should be interpreted accordingly.

[0038] The terms used herein are used to describe the purpose of specific embodiments, rather than to limit them. As used herein, unless the context clearly indicates otherwise, "one / a kind of", "one / person" and "the (or described)" are intended to also include plural forms. In addition, when used in this specification, the terms "comprise", "include", "contain" and / or "have" illustrate the existence of stated features, integral bodies, steps, operations, elements, components and / or their groups, but do not exclude the existence or addition of one or more other features, integral bodies, steps, operations, elements, components and / or their groups.

[0039] Various embodiments are described herein with reference to cross-sectional views and / or exploded views that are schematic illustrations of embodiments and / or intermediate structures. Thus, variations in the shapes of the illustrations due to, for example, manufacturing techniques and / or tolerances are anticipated. Thus, the embodiments described herein need not be construed as limited to the specific shapes of the regions shown, but rather include deviations in shape due to, for example, manufacturing. Thus, the regions shown in the accompanying drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and therefore are not necessarily intended to be limiting.

[0040] As is customary in the art, some embodiments are described and illustrated in the accompanying drawings according to functional blocks, units and / or modules. It will be appreciated by those skilled in the art that these blocks, units and / or modules are physically implemented by electronic (or optical) circuits (such as, logic circuits, discrete components, microprocessors, hard-wired circuits, storage elements and wiring connections, etc.), which can be formed using semiconductor-type manufacturing techniques or other manufacturing techniques. In the case where blocks, units and / or modules are implemented by microprocessors or other similar hardware, they can be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and can be optionally driven by firmware and / or software. It is also conceivable that each block, unit and / or module can be implemented by dedicated hardware, or by a combination of dedicated hardware that performs some functions and a processor that performs other functions (e.g., one or more programmed microprocessors and associated circuits). In addition, each block, unit and / or module of some embodiments can be physically separated into two or more interactive and discrete blocks, units and / or modules without departing from the scope of this disclosure. Furthermore, the blocks, units and / or modules of some embodiments may be physically combined into more complex blocks, units and / or modules without departing from the scope of the present disclosure.

[0041] The terms "about" or "approximately" as used herein include the stated value and are within an acceptable range of deviation for the particular value determined by one of ordinary skill in the art, taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0042] For the purpose of the present disclosure, the phrase "at least one of A and B" may be interpreted as only A, only B, or any combination of A and B. In addition, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z.

[0043] Unless otherwise defined or implied herein, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which the present disclosure belongs. It will also be understood that, unless explicitly defined as such in the text, terms (such as those defined in general dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and the present disclosure, and should not be interpreted in an idealized or overly formalized sense.

[0044] Figure 1 is a schematic plan view showing a display device according to an embodiment of the present disclosure.

[0045] In the present specification, a plane may be defined by a first direction DR1 and a second direction DR2 intersecting (e.g., crossing) the first direction DR1. For example, the first direction DR1 and the second direction DR2 may be perpendicular to each other. A direction orthogonal to the plane may be a third direction DR3. For example, the third direction DR3 may be a thickness direction of the display device DD. For example, the third direction DR3 may be perpendicular to each of the first direction DR1 and the second direction DR2.

[0046] Reference Figure 1 , the display device DD according to an embodiment of the present disclosure may include a display area DA and a non-display area NDA.

[0047] An image may be displayed in the display area DA. The display area DA may have a rectangular planar shape. However, the planar shape of the display area DA is not limited thereto, and the display area DA may have various planar shapes such as a circular shape, an elliptical shape, or a polygonal shape.

[0048] The image may not be displayed in the non-display area NDA. The non-display area NDA may be adjacent to the display area DA (e.g., positioned around the display area DA). For example, the non-display area NDA may completely surround the display area DA. A driver for displaying an image in the display area DA may be provided in the non-display area NDA.

[0049] Pixels PX for generating an image may be disposed in the display area DA. The pixels PX may emit light, and the light emitted from the pixels PX may be combined to generate an image. For example, the pixels PX may be disposed in a matrix form along the first direction DR1 and the second direction DR2.

[0050] Signal lines such as gate lines and data lines may be provided in the display area DA. Each of the pixels PX may be electrically connected to the signal lines. Each of the pixels PX may receive a gate signal, a data signal, etc. from the signal lines. Thus, an image may be displayed in the display area DA in the third direction DR3.

[0051] The display device DD according to the embodiment of the present disclosure may be various display devices that display images. For example, the display device may be an organic light-emitting display device, a liquid crystal display device, an organic light-emitting diode on silicon (OLEDoS) display device, a liquid crystal on silicon (LCoS) display device, or a light-emitting diode on silicon (LEDoS) display device, etc.

[0052] In an embodiment, the display device DD may be an organic light emitting diode on silicon (OLEDoS) display device. In the case where the display device DD is OLEDoS, the display device DD may be configured with a head mounted display (HMD). The HMD may be a glasses-type monitor device for virtual reality or augmented reality. The HMD may be worn in the form of glasses, a helmet, etc. In the HMD, a focus may be formed at a close distance in front of the user's eyes. However, the embodiments of the present disclosure are not limited thereto, and the display device DD may be configured with various displays.

[0053] Figure 2 yes Figure 1 Schematic enlarged plan view of area A.

[0054] Reference Figure 2 , each of the pixels PX may include a first light emitting area EA1, a second light emitting area EA2, and a third light emitting area EA3 that emit light. Figure 2 In the embodiment of the present invention, each of the pixels PX may include three light emitting areas EA1, EA2, and EA3. However, the present disclosure is not limited thereto, and each of the pixels PX may include four or more light emitting areas.

[0055] For example, each of the first light-emitting area EA1, the second light-emitting area EA2, and the third light-emitting area EA3 may have a triangular plane shape, a square plane shape, a circular plane shape, a track-shaped plane shape, an elliptical plane shape, etc. In an embodiment, each of the first light-emitting area EA1, the second light-emitting area EA2, and the third light-emitting area EA3 may have a rectangular plane shape. However, the present disclosure is not limited thereto, and each of the first light-emitting area EA1, the second light-emitting area EA2, and the third light-emitting area EA3 may have various plane shapes. For example, one of the first light-emitting area EA1, the second light-emitting area EA2, and the third light-emitting area EA3 may have a different size and / or shape from one or more of the first light-emitting area EA1, the second light-emitting area EA2, and the third light-emitting area EA3. In other embodiments, the first light-emitting area EA1, the second light-emitting area EA2, and the third light-emitting area EA3 may have the same size and / or the same shape.

[0056] Each of the first light emitting area EA1, the second light emitting area EA2, and the third light emitting area EA3 may include a light emitting element LD that emits a first light. For example, the first light may be white light. However, the present disclosure is not limited thereto, and the light emitting element LD included (or disposed) in the first light emitting area EA1 may emit red light, the light emitting element LD included in the second light emitting area EA2 may emit green light, and the light emitting element LD included in the third light emitting area EA3 may emit blue light.

[0057] The first light emitting area EA1 may emit the second light. The first light emitting area EA1 may convert the first light emitted from the light emitting element LD into the second light and emit the second light. For example, the second light may be red light, but the present disclosure is not limited thereto.

[0058] The second light emitting area EA2 may emit a third light. The second light emitting area EA2 may convert the first light emitted from the light emitting element LD into a third light and emit the third light. For example, the third light may be green light, but the present disclosure is not limited thereto.

[0059] The third light emitting area EA3 may emit fourth light. The third light emitting area EA3 may convert the first light emitted from the light emitting element LD into fourth light and emit the fourth light. For example, the fourth light may be blue light, but the present disclosure is not limited thereto.

[0060] The first light emitting area EA1, the second light emitting area EA2, and the third light emitting area EA3 may be arranged in the first direction DR1. For example, the first light emitting area EA1, the second light emitting area EA2, and the third light emitting area EA3 may be arranged in the order of the first light emitting area EA1, the second light emitting area EA2, and the third light emitting area EA3 in the first direction DR1. For example, the second light emitting area EA2 may be arranged between the first light emitting area EA1 and the third light emitting area EA3 in the first direction DR1. The first light emitting area EA1, the second light emitting area EA2, and the third light emitting area EA3 may be arranged in the second direction DR2. However, the present disclosure is not limited thereto.

[0061] The first light emitting area EA1, the second light emitting area EA2, and the third light emitting area EA3 may be defined by a light blocking portion (or black matrix) BM. The light blocking portion BM may be adjacent to (e.g., surround) each of the first light emitting area EA1, the second light emitting area EA2, and the third light emitting area EA3. For example, the light blocking portion BM may be disposed between adjacent light emitting areas in the first light emitting area EA1, the second light emitting area EA2, and the third light emitting area EA3. For example, in a plan view, the light blocking portion BM may have a grid shape, a mesh shape, a lattice shape, etc.

[0062] Figure 3 It is along Figure 2Schematic cross-sectional view taken along line II-II'.

[0063] Reference Figure 1 and Figure 3 , the display device DD according to an embodiment of the present disclosure may include a substrate SUB, a display layer DP, an encapsulation substrate ENC, and a polarization layer POL.

[0064] The substrate SUB may include a base substrate BS and a pixel circuit portion PXC. In an embodiment, the substrate SUB may be a semiconductor circuit board. The substrate SUB may include a silicon wafer.

[0065] The base substrate BS may define a groove GRV. The pixel circuit parts PXC may be respectively accommodated in (eg, disposed in) the groove GRV. Each of the pixel circuit parts PXC may include at least one transistor. Each of the pixel circuit parts PXC may also include at least one capacitor.

[0066] The display layer DP may be disposed on the substrate SUB. The display layer DP may include a light emitting element layer LDL, an encapsulation layer TFE, a color filter layer CFL, a lens layer LL, and a filling layer (eg, an overcoat layer) OL.

[0067] The light emitting element layer LDL may be disposed on the substrate SUB. The light emitting element layer LDL may include a light emitting element LD and an insulating layer IL. Each of the light emitting elements LD may include a pixel electrode PE, a light emitting layer EML, and a common electrode CE.

[0068] The insulating layer IL may be disposed on the substrate SUB. The insulating layer IL may define an opening exposing the pixel circuit portion PXC. The insulating layer IL may include an inorganic insulating material and / or an organic insulating material. Examples of the inorganic insulating material that may be used as the insulating layer IL may include silicon oxide (SiO x ), Silicon Nitride (SiN x ), silicon oxynitride (SiO x N y ) etc. These may be used alone or in combination with each other. Examples of organic insulating materials that may be used as the insulating layer IL may include photoresists, polyacrylic resins, polyimide resins, polyamide resins, siloxane resins, acrylic resins, epoxy resins, etc. These may be used alone or in combination with each other.

[0069] The pixel electrode PE may be disposed on the pixel circuit portion PXC in each of the first light emitting region EA1, the second light emitting region EA2, and the third light emitting region EA3. For example, the pixel electrode PE may be disposed in an opening defined by the insulating layer IL. The pixel electrode PE may be electrically connected to the pixel circuit portion PXC. Therefore, the pixel electrode PE may receive a voltage from the pixel circuit portion PXC. The pixel electrode PE may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. Examples of materials that may be used as the pixel electrode PE may include silver (Ag), an alloy including silver, molybdenum (Mo), an alloy including molybdenum, aluminum (Al), an alloy including aluminum, aluminum nitride (AlN), tungsten (W), tungsten nitride (WN), copper (Cu), nickel (Ni), chromium (Cr), chromium nitride (CrN), titanium (Ti), tantalum (Ta), platinum (Pt), scandium (Sc), indium tin oxide (ITO), indium zinc oxide (IZO), etc. These may be used alone or in combination with each other. For example, the pixel electrode PE may be used as an anode electrode.

[0070] The light-emitting layer EML may be disposed on the pixel electrode PE and the insulating layer IL. For example, the light-emitting layer EML may be disposed on the pixel electrode PE and the insulating layer IL in the first light-emitting area EA1, the second light-emitting area EA2, and the third light-emitting area EA3. The light-emitting layer EML may extend along the first light-emitting area EA1, the second light-emitting area EA2, and the third light-emitting area EA3. However, the present disclosure is not limited thereto, and the light-emitting layer EML may be independently disposed in each of the first light-emitting area EA1, the second light-emitting area EA2, and the third light-emitting area EA3. The light-emitting layer EML may include an organic material that emits light of a color (e.g., a preset or selectable color). In an embodiment, the light-emitting layer EML may include an organic light-emitting material that emits white light.

[0071] The common electrode CE may be disposed on the light emitting layer EML. The common electrode CE may extend along the first light emitting area EA1, the second light emitting area EA2, and the third light emitting area EA3. The common electrode CE may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in combination with each other. For example, the common electrode CE may be used as a cathode electrode.

[0072] Therefore, the light emitting element LD including the pixel electrode PE, the light emitting layer EML, and the common electrode CE may be disposed on the substrate SUB.

[0073] The encapsulation layer TFE may be disposed on the light emitting element layer LDL. The encapsulation layer TFE may prevent impurities, moisture, etc. from penetrating into the light emitting element layer LDL from the outside. The encapsulation layer TFE may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. The inorganic encapsulation layer and the organic encapsulation layer may be alternately stacked on each other. For example, the inorganic encapsulation layer may include silicon oxide (SiO x ), Silicon Nitride (SiN x ), silicon oxynitride (SiO x N y ) etc. These may be used alone or in combination with each other. For example, the organic encapsulation layer may include a cured polymer such as polyacrylate.

[0074] The color filter layer CFL may be disposed on the encapsulation layer TFE. The color filter layer CFL may include a light blocking portion BM, a first color filter CF1, a second color filter CF2, and a third color filter CF3.

[0075] The light blocking portion BM may be disposed on the encapsulation layer TFE. The light blocking portion BM may separate the first light emitting area EA1, the second light emitting area EA2, and the third light emitting area EA3. For example, the light blocking portion BM may define an opening that separates the first light emitting area EA1, the second light emitting area EA2, and the third light emitting area EA3. Therefore, the light blocking portion BM may not overlap with the first light emitting area EA1, the second light emitting area EA2, and the third light emitting area EA3. The light blocking portion BM may include an inorganic material and / or an organic material having a black color. For example, the light blocking portion BM may include a black pigment, a black dye, carbon black, etc. These may be used alone or in combination with each other.

[0076] The first, second, and third color filters CF1, CF2, and CF3 may be respectively disposed within the openings defined by the light blocking portion BM.

[0077] The first color filter CF1 may be disposed on the encapsulation layer TFE in the first light emitting area EA1. The first color filter CF1 may transmit the second light among the first light emitted from the light emitting element layer LDL, and may absorb or block the third light and the fourth light. For example, the first color filter CF1 may transmit red light and may absorb or block green light and blue light. However, the present disclosure is not limited thereto.

[0078] The second color filter CF2 may be disposed on the encapsulation layer TFE in the second light emitting area EA2. The second color filter CF2 may transmit the third light among the first light emitted from the light emitting element layer LDL, and may absorb or block the second light and the fourth light. For example, the second color filter CF2 may transmit green light and may absorb or block red light and blue light. However, the present disclosure is not limited thereto.

[0079] The third color filter CF3 may be disposed on the encapsulation layer TFE in the third light emitting area EA3. The third color filter CF3 may transmit the fourth light among the first light emitted from the light emitting element layer LDL, and may absorb or block the second light and the third light. For example, the third color filter CF3 may transmit blue light and may absorb or block red light and green light. However, the present disclosure is not limited thereto.

[0080] The lens layer LL may be disposed on the color filter layer CFL. The lens layer LL may include a microlens ML. The microlens ML may be disposed on the first color filter CF1, the second color filter CF2, and the third color filter CF3, respectively. The microlens ML may have a refractive index (e.g., a predetermined or selectable refractive index). The microlens ML may improve light extraction efficiency. For example, the microlens ML may guide light emitted from the first color filter CF1, the second color filter CF2, and the third color filter CF3 in a third direction DR3.

[0081] The filling layer OL may be disposed on the lens layer LL. The filling layer OL may flatten the upper surface of the color filter layer CFL and the upper surface of the lens layer LL. The filling layer OL may include an inorganic insulating material and / or an organic insulating material. Examples of the inorganic insulating material that may be used as the filling layer OL may include silicon oxide (SiO x ), Silicon Nitride (SiN x ), silicon oxynitride (SiO x N y ) etc. These may be used alone or in combination with each other. Examples of organic insulating materials that may be used as the filling layer OL may include acrylic polymers, imide polymers, amide polymers, fluorine-based polymers, aryl ether-based polymers, vinyl alcohol-based polymers, etc. These may be used alone or in combination with each other.

[0082] The encapsulation substrate ENC may be disposed on the filling layer OL. The encapsulation substrate ENC may cover and protect the display layer DP. The encapsulation substrate ENC may be attached to a surface (e.g., an upper surface) of the display layer DP by an adhesive member. The encapsulation substrate ENC may include a transparent material. For example, the encapsulation substrate ENC may include glass or plastic. However, the present disclosure is not limited thereto, and an encapsulation film or layer may be formed on the display layer DP.

[0083] The polarizing layer POL may be disposed on the encapsulation substrate ENC. The polarizing layer POL may reduce external light reflection of the display device DD. When the external light reflection is reduced, the visibility of the display device DD may be improved. In other embodiments, the polarizing layer POL may be omitted.

[0084] Figure 4 It is along Figure 1 Schematic cross-sectional view taken along line II'.

[0085] Reference Figure 1 and Figure 4 , the display device DD according to an embodiment of the present disclosure may include a substrate SUB, a display layer DP, an encapsulation substrate ENC, a first sealing member SL1 , a polarizing layer POL, and a pad portion PP.

[0086] The first sealing member SL1 may be disposed on the substrate SUB in the non-display area NDA. The first sealing member SL1 may cover the side surface of the display layer DP. The first sealing member SL1 may include an inorganic material. For example, the first sealing member SL1 may be glass frit. The glass frit may include a main material in a powder form, such as glass (e.g., glass raw material), silicon oxide, etc. The first sealing member SL1 may be a slurry including silicon oxide, a laser or infrared absorber, an organic binder, and a filler for reducing a thermal expansion coefficient, etc. When laser is irradiated to the first sealing member SL1, the first sealing member SL1 may be melted and solidified.

[0087] The encapsulation substrate ENC may be disposed on the display layer DP and the first sealing member SL1. The encapsulation substrate ENC may overlap the display area DA and the non-display area NDA. For example, the encapsulation substrate ENC may completely overlap the display area DA and partially overlap the non-display area NDA.

[0088] The polarizing layer POL may be disposed on the encapsulation substrate ENC. The polarizing layer POL may overlap (e.g., completely overlap) the encapsulation substrate ENC. The polarizing layer POL may overlap the display area DA and the non-display area NDA. For example, the polarizing layer POL may completely overlap the display area DA and partially overlap the non-display area NDA.

[0089] The pad portion PP may be disposed in the non-display area NDA located on one side of the display area DA. For example, the pad portion PP may be disposed in the non-display area NDA located on the lower side of the substrate SUB. The pad portion PP may be electrically connected to a printed circuit board, etc. The pad portion PP may be spaced apart from the display layer DP.

[0090] Figure 5 is a schematic flowchart of a method for manufacturing a display device according to an embodiment of the present disclosure. Figures 6 to 20 It is shown Figure 5 Schematic diagram of a method for manufacturing a display device.

[0091] Reference Figure 5According to an embodiment of the present disclosure, the method MM for manufacturing a display device may include: forming a light emitting element layer on a mother substrate (S100); forming a through hole portion in a dummy area to form a bridge connecting a unit area and a dummy area (for example, processing a preliminary encapsulation substrate, and forming a through hole portion in the dummy area to form a bridge connecting the unit area and the dummy area) (S200); strengthening the preliminary encapsulation substrate (S300); bonding the mother substrate with the preliminary encapsulation substrate (S400); applying (for example, coating) a sealing member through the through hole portion, the sealing member extending from the upper surface of the mother substrate to the side surface of the preliminary encapsulation substrate exposed by the through hole portion (S500); cutting the bridge and separating the dummy area of ​​the preliminary encapsulation substrate (S600); and cutting the mother substrate (S700). For example, the method MM of manufacturing a display device may include forming a light-emitting element layer on a mother substrate (S100); forming a bridge connecting a cell region and a dummy region (S200); reinforcing a preliminary encapsulation substrate (S300); bonding a mother substrate and a preliminary encapsulation substrate (S400); applying a sealing member through a through-hole portion (S500); separating a dummy region of the preliminary encapsulation substrate (S600); and cutting of the mother substrate (S700). The formation of a bridge connecting a cell region and a dummy region (S200) may include processing the preliminary encapsulation substrate and forming a through-hole portion in the dummy region (S200). In the process of applying the sealing member through the through-hole portion (S500), the sealing member may extend from the upper surface of the mother substrate to the side surface of the preliminary encapsulation substrate exposed by the through-hole portion. Separating the dummy region of the preliminary encapsulation substrate (S600) may include cutting of the bridge.

[0092] Reference Figure 6 and Figure 7 , a light emitting element layer LDL may be formed on the mother substrate MSUB (for example, referring to Figure 3 )(S100).

[0093] The mother substrate MSUB may be formed of a silicon wafer. The mother substrate MSUB may include a substrate (eg, Figure 3 For example, the mother substrate MSUB may be cut, and the substrate may be formed. The pixel circuit part PXC may be formed in the mother substrate MSUB.

[0094] The display layer DP, the first sealing member SL1, and the pad portion PP may be formed on the mother substrate MSUB.

[0095] A display layer DP may be formed in each display area DA on the mother substrate MSUB. Each of the display layers DP may include a light emitting element layer (eg, Figure 3 A packaging layer (eg, Figure 3encapsulation layer TFE), color filter layer (e.g., Figure 3 Color filter layer CFL), lens layer (eg, Figure 3 lens layer LL) and a filling layer (e.g., Figure 3 Filling layer OL).

[0096] A first sealing member SL1 may be formed on the mother substrate MSUB in the non-display area NDA. The first sealing member SL1 may cover a side surface of the display layer DP.

[0097] The pad portion PP may be formed on the mother substrate MSUB in the non-display area NDA. For example, the non-display area NDA may be adjacent to (eg, surround) the display area DA.

[0098] exist Figure 6 In the embodiment, nine display layers DP and nine pad portions PP may be formed on the mother substrate MSUB, but the present disclosure is not limited thereto. For example, less than nine display layers DP and less than nine pad portions PP may be formed on the mother substrate MSUB. For another example, more than nine display layers DP and more than nine pad portions PP may be formed on the mother substrate MSUB.

[0099] Reference Figures 8 to 11 , the preliminary package substrate MENC may be processed, and a through hole portion TH may be formed in the dummy area DUM. Thus, a bridge BRD connecting the cell area CA and the dummy area DUM may be formed (S200).

[0100] The preliminary encapsulation substrate MENC may include a transparent material. For example, the preliminary encapsulation substrate MENC may include glass or plastic (or synthetic resin). The preliminary encapsulation substrate MENC may have a rectangular planar shape. However, the planar shape of the preliminary encapsulation substrate MENC is not limited thereto, and the preliminary encapsulation substrate MENC may have various planar shapes, such as a circular planar shape, an elliptical planar shape, or a polygonal planar shape, etc.

[0101] The preliminary package substrate MENC may include a cell area CA and a dummy area DUM. Figure 7 ) and the preliminary encapsulation substrate MENC are bonded to each other, the cell area CA may overlap with the display area DA and the non-display area NDA. For example, the mother substrate MSUB and the preliminary encapsulation substrate MENC may be bonded to each other, and the cell area CA may completely overlap with the display area DA and may partially overlap with the non-display area NDA. The dummy area DUM may be adjacent to (e.g., surrounding) the cell area CA. In the case where the bridge BRD is cut ( Figure 5After the cutting (S600) of the bridge BRD, the dummy area DUM of the preliminary encapsulation substrate MENC can be separated from the mother substrate MSUB. A detailed description of the cutting (S600) of the bridge BRD is provided later. For example, after the cutting (S600) of the bridge BRD, the unit area CA of the preliminary encapsulation substrate MENC can be located on the mother substrate MSUB. For example, after the cutting (S600) of the bridge BRD, only the unit area CA of the preliminary encapsulation substrate MENC can be located (or can remain on) the mother substrate MSUB.

[0102] The preliminary package substrate MENC may be processed, and a through hole portion TH may be formed in the dummy area DUM to form a bridge BRD connecting the cell area CA and the dummy area DUM. For example, the through hole portion TH may be adjacent to (e.g., surrounding) the cell area CA, excluding the area where the bridge BRD is located. For example, the through hole portion TH may surround the cell area CA, and may not be formed in the area where the bridge BRD is located.

[0103] In an embodiment, the preliminary packaging substrate MENC may be processed using laser LAS. For example, the preliminary packaging substrate MENC may be processed using laser induced deep etching (LIDE) technology. However, the present disclosure is not limited thereto, and various physical processing methods may be used to process the preliminary packaging substrate MENC.

[0104] The bridge BRD may connect the cell area CA and the dummy area DUM. The bridge BRD may be positioned adjacent to the through hole portion TH. Figure 8 In the embodiment, four bridges BRD may be formed in each unit area CA, but the present disclosure is not limited thereto.

[0105] In an embodiment, the bridge BRD may extend in the second direction DR2. However, the present disclosure is not limited thereto. In another embodiment, the bridge BRD may extend in the first direction DR1. In yet another embodiment, the bridge BRD may extend in both the first direction DR1 and the second direction DR2.

[0106] Fig. 9 yes Figure 8 Schematic enlarged plan view of region B. In an embodiment, as Fig. 9 As shown in , the width W1 of the central portion of the bridge BRD may be smaller than the width W2 of each end of the bridge BRD. Therefore, the bridge BRD may be cut with a relatively small impact in the cutting (S600) of the bridge BRD. The detailed description of the cutting (S600) of the bridge BRD is described later. For example, the width of the bridge BRD may be in the range of about 30 microns to about 100 microns.

[0107] In an embodiment, Fig.10 As shown in FIG, the thickness of the bridge BRD may be less than the thickness of the preliminary encapsulation substrate MENC. Fig.14 ) of application (e.g., coating) Figure 5 In S500), the second sealing member SL2 may extend to the upper portion of the side surface of the preliminary package substrate MENC adjacent to the through hole portion TH. Fig.14 Describe it in detail.

[0108] In an embodiment, Fig.11 As shown in , the formation (S200) of the through hole portion TH in the dummy area DUM may include: processing the side surface of the preliminary encapsulation substrate MENC overlapping with the unit area CA and exposed by the through hole portion TH to have a chamfered shape. For example, except for the area where the bridge BRD is located, the side surface of the preliminary encapsulation substrate MENC exposed by the through hole portion TH may have a chamfered shape. Therefore, stress concentration on the side surface of the preliminary encapsulation substrate MENC exposed by the through hole portion TH can be prevented. For example, the resistance of the side surface of the preliminary encapsulation substrate MENC exposed by the through hole portion TH to impact can be increased.

[0109] The laser LAS can be irradiated to the upper surface of the preliminary encapsulation substrate MENC, and the depth of the laser LAS can be adjusted. Therefore, a chamfered shape can be formed on the side surface of the preliminary encapsulation substrate MENC. For example, as the upper surface of the preliminary encapsulation substrate MENC approaches the through-hole portion TH, the depth of the laser LAS irradiated to the upper surface of the preliminary encapsulation substrate MENC can increase. Therefore, the side surface of the preliminary encapsulation substrate MENC adjacent to the through-hole portion TH can have a chamfered shape. In other embodiments, the laser LAS can also be irradiated to the lower surface of the preliminary encapsulation substrate MENC. As the lower surface of the preliminary encapsulation substrate MENC approaches the through-hole portion TH, the depth of the laser LAS irradiated to the lower surface of the preliminary encapsulation substrate MENC can increase.

[0110] In an embodiment, between the formation of the through hole portion TH in the dummy region DUM (S200) and the cutting of the bridge BRD (S600), the preliminary package substrate MENC ( Figure 5 S300). For example, an ion exchange process may be used to strengthen the preliminary encapsulation substrate MENC. The ion exchange process may be performed by treating the preliminary encapsulation substrate MENC with a material including alkali metal ions. For example, the material including alkali metal ions may include potassium nitrate (KNO 3 ), sodium nitrate (NaNO 3) etc. In the method MM for manufacturing a display device according to an embodiment of the present disclosure, since the bridge piece BRD is cut to separate the dummy area DUM of the preliminary encapsulation substrate MENC from the mother substrate MSUB, a strengthening process can be performed in the preliminary encapsulation substrate MENC. For example, the dummy area DUM of the preliminary encapsulation substrate MENC can be separated from the mother substrate MSUB without using a physical processing method (such as using a diamond wheel or a dicing saw). Therefore, a strengthening process can be performed in the preliminary encapsulation substrate MENC. Therefore, in contrast to the encapsulation substrate (for example, Fig. 20 Compared with the case where a strengthening process is performed on each of the package substrates ENC), the strengthening process can be relatively simplified.

[0111] Reference Fig.12 and Fig.13 , the mother substrate MSUB and the preliminary encapsulation substrate MENC may be bonded to each other ( S400 ).

[0112] The mother substrate MSUB and the preliminary encapsulation substrate MENC may be bonded to each other, and the unit area CA of the preliminary encapsulation substrate MENC may overlap with the display area DA and the non-display area NDA. For example, the unit area CA of the preliminary encapsulation substrate MENC may completely overlap with the display area DA and partially overlap with the non-display area NDA. In a plan view, the through hole portion TH may be adjacent to (e.g., surrounding) the display area DA. For example, the unit area CA of the preliminary encapsulation substrate MENC may overlap (e.g., completely overlap) the display layer DP and the first sealing member SL1. In a plan view, the bridge BRD may be spaced apart from the display layer DP. In a plan view, the bridge BRD may be spaced apart from the pad portion PP.

[0113] Reference Fig.14 , can be obtained by passing through the through hole portion TH (for example, referring to Fig.12 ) The second sealing member SL2 is applied (S500). For example, a droplet SL2' for forming the second sealing member SL2 may be dropped on the preliminary encapsulation substrate MENC and pass through the through hole portion TH. Thus, the second sealing member SL2 may be formed. The second sealing member SL2 may extend from the upper surface of the mother substrate MSUB to the side surface of the preliminary encapsulation substrate MENC exposed by the through hole portion TH.

[0114] The second sealing member SL2 may be applied to the mother substrate MSUB through the through hole portion TH. In the case where the second sealing member SL2 is applied to the mother substrate MSUB through the through hole portion TH, the second sealing member SL2 may extend from the upper surface of the mother substrate MSUB to the side surface of the preliminary encapsulation substrate MENC exposed by the through hole portion TH. Therefore, the second sealing member SL2 may cover the side surface of the first sealing member SL1. The second sealing member SL2 may have a triangular cross-sectional shape, but the present disclosure is not limited thereto.

[0115] In an embodiment, the thickness of the bridge BRD may be smaller than the thickness of the preliminary encapsulation substrate MENC. The second sealing member SL2 may extend to an upper portion of a side surface of the preliminary encapsulation substrate MENC exposed by the through hole portion TH.

[0116] Therefore, the second sealing member SL2 may support the preliminary encapsulation substrate MENC in the cell area CA. In the case where the second sealing member SL2 supports the preliminary encapsulation substrate MENC in the cell area CA, the bridge BRD ( Figure 5 In S600 of FIG. 1 , the misalignment of the preliminary encapsulation substrate MENC in the cell area CA is prevented. A detailed description of the cutting ( S600 ) of the bridge BRD is provided later.

[0117] In other embodiments, applying the second sealing member SL2 through the through hole portion TH (S500) may be omitted. Figure 5 After S400 ), cutting of the bridge BRD may be continuously performed ( S600 ).

[0118] Reference Figures 15 to 17 , the bridge BRD is cut, and the dummy area DUM of the preliminary package substrate MENC may be separated from the mother substrate MSUB ( S600 ).

[0119] In an embodiment, an impact IMP may be applied to the outer side surface of the preliminary encapsulation substrate MENC, and the bridge BRD may be cut. However, the present disclosure is not limited thereto, and the bridge BRD may be cut by irradiating laser to both ends of the bridge BRD.

[0120] Fig.16 yes Fig.15 Schematic enlarged plan view of region C. In an embodiment, the impact IMP may be applied in a direction perpendicular to the direction in which the bridge BRD extends. Fig.16As shown in FIG. 1 , when the bridge BRD extends in the second direction DR2 , the impact IMP may be applied in the first direction DR1 . However, the present disclosure is not limited thereto. In another embodiment, the impact IMP may be applied in an oblique direction between the second direction DR2 and the first direction DR1 in which the bridge BRD extends.

[0121] In the case where the impact IMP is applied to the outer side surface of the preliminary encapsulation substrate MENC, stress may be concentrated in the portion where the width of the bridge BRD is the smallest. Therefore, the bridge BRD may be cut at the portion where the width of the bridge BRD is the smallest.

[0122] After the cutting (S600) of the bridge BRD, the dummy area DUM of the preliminary encapsulation substrate MENC may be separated from the mother substrate MSUB. For example, after the cutting (S600) of the bridge BRD, the unit area CA of the preliminary encapsulation substrate MENC may be located on the mother substrate MSUB. For example, only the unit area CA of the preliminary encapsulation substrate MENC may be located (or may remain) on the mother substrate MSUB. Therefore, the encapsulation substrate ENC may be formed on the display layer DP and the first sealing member SL1.

[0123] In the method MM of manufacturing a display device according to an embodiment of the present disclosure, an impact IMP may be applied to the preliminary encapsulation substrate MENC, and the dummy area DUM of the preliminary encapsulation substrate MENC may be separated from the mother substrate MSUB. Therefore, a physical processing method using a diamond wheel or a dicing saw may not be used. Therefore, the problem of fine-sized fragments of the preliminary encapsulation substrate MENC remaining on the encapsulation substrate ENC that may be generated during the physical processing method may be suppressed.

[0124] Reference Figures 18 to 20 , the mother substrate MSUB can be cut (S700).

[0125] The mother substrate MSUB may be cut to form a substrate SUB. The cutting of the mother substrate MSUB may be performed by irradiating the laser LAS to the mother substrate MSUB (S700). For example, the mother substrate MSUB may be cut along the side adjacent to the display layer DP and the pad portion PP and the other side adjacent to the display layer DP and the pad portion PP, respectively. Therefore, the display layer DP may be disposed in the display area DA on the substrate SUB, and the pad portion PP may be disposed in the non-display area NDA on the substrate SUB.

[0126] A polarization layer (eg, Figure 3 The polarization layer POL may be overlapped with the encapsulation substrate ENC (eg, completely overlapped). In other embodiments, the polarization layer may be omitted.

[0127] Thus, a display device including the substrate SUB, the display layer DP, the pad portion PP, and the encapsulation substrate ENC may be formed.

[0128] Fig.21 is a schematic flowchart of a method for manufacturing a display device according to another embodiment of the present disclosure. Figures 22 to 32 It is shown Fig.21 Schematic diagram of a method for manufacturing a display device.

[0129] Reference Fig.21 According to another embodiment of the present disclosure, a method MM' for manufacturing a display device may include: forming a light emitting element layer on a mother substrate (S100'); forming a through hole portion in a dummy area to form a bridge connecting a unit area and a dummy area (for example, processing a preliminary encapsulation substrate, and forming a through hole portion in the dummy area to form a bridge connecting the unit area and the dummy area) (S200'); strengthening the preliminary encapsulation substrate (S300'); bonding a mother substrate to a preliminary encapsulation substrate (S400'); forming a polarization layer on the preliminary encapsulation substrate (S500'); cutting the bridge and separating the dummy area of ​​the preliminary encapsulation substrate (S600'); and cutting the mother substrate (S700'). For example, the method MM' of manufacturing a display device may include: forming a light-emitting element layer on a mother substrate (S100'); forming a bridge connecting a cell region and a dummy region (S200'); reinforcing a preliminary encapsulation substrate (S300'); bonding a mother substrate and a preliminary encapsulation substrate (S400'); forming a polarization layer on a preliminary encapsulation substrate (S500'); separating a dummy region of the preliminary encapsulation substrate (S600'); and cutting of the mother substrate (S700'). The formation of a bridge connecting a cell region and a dummy region (S200') may include processing the preliminary encapsulation substrate and forming a through-hole portion in the dummy region. The separation of the dummy region of the preliminary encapsulation substrate (S600') may include cutting of the bridge.

[0130] The formation of the light emitting element layer on the mother substrate (S100′) can be similar to the Figure 6 and Figure 7 The described forming of the light emitting element layer on the mother substrate (S100) is substantially the same.

[0131] The processing of the preliminary packaging substrate and the formation of the through hole portion in the dummy region to form a bridge connecting the cell region and the dummy region (S200′) may be similar to that described in reference to Figures 8 to 11 The described processing of the preliminary package substrate and the formation of the through hole portion in the dummy region to form a bridge connecting the cell region and the dummy region ( S200 ) are substantially the same.

[0132] The strengthening of the preliminary packaging substrate (S300') can be combined with the strengthening of the preliminary packaging substrate ( Figure 5S300) is basically the same.

[0133] The bonding of the mother substrate and the preliminary package substrate (S400′) can be similar to the Fig.12 and Fig.13 The described bonding of the mother substrate and the preliminary package substrate ( S400 ) is substantially the same.

[0134] The cutting of the mother substrate (S700') can be similar to the reference Figures 18 to 20 The cutting of the mother substrate (S700) is substantially the same. Therefore, in the following, references to Figures 6 to 20 A detailed description of the method MM for manufacturing a display device.

[0135] Reference Fig. 22 and Fig.23 , the mother substrate MSUB and the preliminary encapsulation substrate MENC may be bonded to each other ( S400 ′).

[0136] In the case where the mother substrate MSUB and the preliminary encapsulation substrate MENC are bonded to each other, the unit area CA of the preliminary encapsulation substrate MENC may overlap with the display area DA and the non-display area NDA. For example, the mother substrate MSUB and the preliminary encapsulation substrate MENC may be bonded to each other, and the unit area CA of the preliminary encapsulation substrate MENC may completely overlap with the display area DA and partially overlap with the non-display area NDA. In a plan view, the through hole portion TH may be adjacent to (e.g., surrounding) the display area DA. For example, the unit area CA of the preliminary encapsulation substrate MENC may overlap (e.g., completely overlap) the display layer DP and the first sealing member SL1. In a plan view, the bridge BRD may be spaced apart from the display layer DP. In a plan view, the bridge BRD may be spaced apart from the pad portion PP. For example, in a plan view, the bridge BRD may be spaced apart from the display layer DP and the pad portion PP.

[0137] Reference Figure 24 to Figure 27 , a polarization layer POL may be formed on the preliminary encapsulation substrate MENC (S500'). The formation of the polarization layer POL on the preliminary encapsulation substrate MENC (S500') may include: forming a preliminary polarization layer PPOL overlapping the cell area CA and the dummy area DUM on the preliminary encapsulation substrate MENC (S510'); and cutting the preliminary polarization layer PPOL and forming a polarization layer POL overlapping the cell area CA (S520').

[0138] like Fig.25 As shown in FIG. 5 , a preliminary polarization layer PPOL overlapping the cell area CA and the dummy area DUM may be formed on the preliminary encapsulation substrate MENC ( S510 ′). Therefore, the preliminary polarization layer PPOL may overlap the bridge BRD.

[0139] like Fig.26 and Fig. 27 As shown in , the preliminary polarization layer PPOL may be cut, and the polarization layer POL overlapping the unit area CA may be formed (S520'). In an embodiment, the laser LAS may be irradiated on the end of the bridge BRD, and the preliminary polarization layer PPOL may be cut. For example, the irradiation of the laser LAS may overlap with both ends of the bridge BRD.

[0140] The polarization layer POL may be formed before cutting the mother substrate MSUB. Therefore, the polarization layer POL may be formed on the preliminary packaging substrate MENC. For example, the polarization layer POL and the preliminary packaging substrate MENC may be integrated with each other to form a part. For example, with the packaging substrate (e.g., Fig.32 Compared with the case where the polarization layer POL is formed on each of the encapsulation substrates ENC), the formation of the polarization layer POL can be relatively simplified.

[0141] In an embodiment, Fig.26 As shown in FIG. , the bridge BRD may not be cut by the laser LAS, and the preliminary polarization layer PPOL (eg, referring to Fig.25 ) can be cut by laser LAS. For example, laser LAS can be irradiated to the preliminary polarization layer PPOL, and the depth of the laser LAS can be adjusted. Therefore, the preliminary polarization layer PPOL can be cut without cutting the bridge BRD. For example, the cutting (S520') of the preliminary polarization layer PPOL and the cutting (S600') of the bridge BRD can be performed separately. For example, the cutting (S520') of the preliminary polarization layer PPOL can be performed before the cutting (S600') of the bridge BRD.

[0142] In another embodiment, if Fig. 27 As shown in FIG. , the bridge BRD can be cut by laser LAS (e.g., see Fig.26 ) and a preliminary polarization layer PPOL (eg, see Fig.25 ) each. For example, in the case where the laser LAS is irradiated to both ends of the bridge BRD, the bridge BRD and the preliminary polarization layer PPOL can be cut by the irradiation of the laser LAS. For example, the cutting of the preliminary polarization layer PPOL (S520') and the cutting of the bridge BRD (S600') can be performed simultaneously. Therefore, it is possible to cut the bridge BRD and the preliminary polarization layer PPOL without applying an impact (for example, Fig.28 Cutting the bridge piece BRD without the impact of IMP).

[0143] In other embodiments, the forming of the polarization layer POL on the preliminary encapsulation substrate MENC ( S500 ′) may be performed before bonding the mother substrate MSUB and the preliminary encapsulation substrate MENC ( S400 ′).

[0144] Before bonding the mother substrate MSUB and the preliminary encapsulation substrate MENC, the presence of foreign matter between the preliminary encapsulation substrate MENC and the polarization layer POL may be checked.

[0145] Reference Fig.28 and Fig.29 , the bridge BRD may be cut, and the dummy area DUM of the preliminary package substrate MENC may be separated from the mother substrate MSUB ( S600 ′).

[0146] An impact IMP may be applied to the outer surface of the preliminary packaging substrate MENC, and the bridge BRD may be cut. Fig. 27 As shown in , the bridge BRD can be cut by irradiating laser to both ends of the bridge BRD.

[0147] In an embodiment, the impact IMP may be applied in a direction perpendicular to the direction in which the bridge BRD extends. In another embodiment, the impact IMP may be applied in a diagonal direction between the direction in which the bridge BRD extends and the direction perpendicular to the direction in which the bridge BRD extends.

[0148] In the case where the impact IMP is applied to the outer side surface of the preliminary encapsulation substrate MENC, stress may be concentrated in the portion where the width of the bridge BRD is the smallest. Therefore, the bridge BRD may be cut at the portion where the width of the bridge BRD is the smallest.

[0149] After cutting the bridge BRD, the dummy area DUM of the preliminary encapsulation substrate MENC can be separated from the mother substrate MSUB. For example, after cutting the bridge BRD, the unit area CA of the preliminary encapsulation substrate MENC can be located on the mother substrate MSUB. For example, only the unit area CA of the preliminary encapsulation substrate MENC can be located (or can remain on) the mother substrate MSUB.

[0150] Reference Figure 30 to Figure 32 , the mother substrate MSUB can be cut (S700').

[0151] The mother substrate MSUB may be cut to form a substrate SUB. The laser LAS may be irradiated to the mother substrate MSUB, and the cutting of the mother substrate MSUB may be performed by irradiating the laser LAS (S700'). For example, the mother substrate MSUB may be cut along the sides adjacent to the display layer DP and the pad portion PP and the other sides adjacent to the display layer DP and the pad portion PP, respectively. For example, the laser LAS may be irradiated to the upper side, the left side, and the right side of the display layer DP and the lower side of the pad portion PP. Therefore, the display layer DP may be set in the display area DA on the substrate SUB, and the pad portion PP may be set in the non-display area NDA on the substrate SUB.

[0152] Thus, the display device DD including the substrate SUB, the display layer DP, the pad portion PP, the encapsulation substrate ENC, and the polarization layer POL may be formed.

[0153] The present disclosure may be applied to various display devices. For example, the present disclosure may be applied to various display devices, such as display devices for vehicles, ships, airplanes, portable communication devices, display devices for display or information transmission, and medical display devices.

[0154] The above description is an example of the technical features of the present disclosure, and those skilled in the art to which the present disclosure belongs will be able to make various modifications and changes.Therefore, the above disclosed embodiments can be implemented separately or in combination with each other.

[0155] Therefore, the embodiments disclosed in the present disclosure are not intended to limit the technical spirit of the present disclosure, but to describe the technical spirit of the present disclosure, and the scope of the technical spirit of the present disclosure is not limited by these embodiments. The protection scope of the present disclosure should be interpreted by the attached claims, and should be interpreted as all technical spirits within the equivalent scope are included in the scope of the present disclosure.

Claims

1. A method for manufacturing a display device, wherein: The method comprises: forming a light emitting element layer on a mother substrate; forming a through hole portion in a dummy region of a preliminary package substrate to form at least one bridge connecting a cell region of the preliminary package substrate and the dummy region adjacent to the cell region; bonding the mother substrate to the preliminary packaging substrate; applying a sealing member through the through-hole portion, the sealing member extending from the upper surface of the mother substrate to a side surface of the preliminary package substrate exposed by the through-hole portion; and The at least one bridge is cut and the dummy region of the preliminary package substrate is separated.

2. The method according to claim 1, wherein: The cutting of the at least one bridge includes applying an impact to an outer side surface of the preliminary package substrate.

3. The method according to claim 2, wherein: The applying the impact to the outer side surface of the preliminary package substrate includes applying the impact in a second direction perpendicular to a first direction in which the at least one bridge extends.

4. The method according to claim 1, wherein: The width of a central portion of the at least one bridge is smaller than a width of each end of the at least one bridge.

5. The method according to claim 1, wherein: The at least one bridge has a thickness smaller than a thickness of the preliminary encapsulation substrate.

6. The method according to claim 1, wherein: The forming of the through hole portion in the dummy region includes processing the side surface of the preliminary package substrate to have a chamfered shape, and The side surface of the preliminary package substrate overlaps the cell region and the side surface of the preliminary package substrate is partially exposed by the through hole.

7. The method according to claim 1, wherein: The method further comprises: The preliminary package substrate is strengthened by an ion exchange process between the forming of the via portion in the dummy region and the cutting of the at least one bridge.

8. A method for manufacturing a display device, wherein: The method comprises: forming a light emitting element layer on a mother substrate; forming a through hole portion in a dummy region of a preliminary package substrate to form at least one bridge connecting a cell region of the preliminary package substrate and the dummy region adjacent to the cell region; forming a polarizing layer on the preliminary packaging substrate; bonding the mother substrate to the preliminary packaging substrate; and The at least one bridge is cut and the dummy region of the preliminary package substrate is separated.

9. The method according to claim 8, wherein: The forming of the polarizing layer comprises: forming a preliminary polarization layer on the preliminary packaging substrate to overlap the cell region and the dummy region; and The preliminary polarization layer is cut to form the polarization layer overlapping the unit area.

10. The method according to claim 9, wherein: The cutting of the preliminary polarization layer includes irradiating laser to the preliminary polarization layer, and The irradiation of the laser overlaps both ends of the at least one bridge member.

11. The method according to claim 10, wherein: The cutting of the preliminary polarizing layer includes simultaneously cutting the preliminary polarizing layer and the at least one bridge member using the laser.

12. The method according to claim 9, wherein: said cutting of said preliminary polarizing layer is performed before said cutting of said at least one bridge, and The cutting of the at least one bridge member includes applying an impact to an outer side surface of the preliminary package substrate.

13. The method according to claim 8, wherein: The width of a central portion of the at least one bridge is smaller than a width of each end of the at least one bridge.

14. The method according to claim 8, wherein: The forming of the through hole portion in the dummy region includes processing a side surface of the preliminary package substrate to have a chamfered shape, and The side surface of the preliminary package substrate overlaps the cell region and the side surface of the preliminary package substrate is partially exposed by the through hole.

15. The method according to claim 8, wherein: The method further comprises: The preliminary package substrate is strengthened by an ion exchange process between the forming of the via portion in the dummy region and the cutting of the at least one bridge.

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