Method and device for setting parameters of centralized glue supply pump based on multi-dimensional factors

Abstract

The invention discloses a method for setting parameters of a centralized glue supply pump based on multi-dimensional factors, which comprises the following steps of: determining the movement speed of a glue gun nozzle of a spraying robot and the movement speed of a workpiece carrier according to the number of target workpieces, the length of a to-be-sealed position of each workpiece and workbench information; the distance between a glue gun nozzle of the spraying robot and the position, needing to be sealed, of the workpiece is determined; determining the initial power of the glue pump according to the moving speed and the working distance of the gun nozzle of the glue gun, the size of the gun nozzle and the size of the transmission pipeline; performing test spraying on the to-be-sealed position according to the initial power of each stage of rubber pump; obtaining an initial spraying image of the colloid after the test spraying is completed; and adjusting the power of the glue pump according to the initial spraying image and the image of the target glue shape. The power of the glue pump is automatically adjusted according to multi-dimensional factors, accurate adjustment is achieved, energy consumption is reduced to the maximum extent, the production efficiency is improved, and the automation degree is improved.

Description

Technical Field

[0001] The present invention relates to the field of computer control technology, and in particular to a method and device for setting parameters of a centralized glue supply pump based on multi-dimensional factors. Background Art

[0002] In industrial production, glue spraying is needed in many places, such as integrated circuits, semiconductor packaging, printed circuit boards, color LCD screens, electronic components, electronic parts, automotive parts, etc. Glue spraying equipment is a new automation equipment in modern industry, which can spray glue on products of different sizes and shapes. The performance of glue spraying equipment mainly includes adjustable spraying shape, adjustable glue amount, adjustable glue supply and reabsorption amount, and can spray glue of different viscosities.

[0003] The glue spraying system is a multi-stage glue spraying equipment. Each stage of the equipment is connected by pipes. When the glue spraying equipment is working, it is necessary to set the power parameters of the glue spraying pump. Usually, technicians set it based on experience. The power of the pump is sufficient to transport the glue to the next stage pump. If the setting is too large, it will lead to waste of resources. If the setting is too small, it will not meet the production requirements. Summary of the invention

[0004] In order to solve the above problems existing in the prior art, the present invention provides a method, device, electronic device and storage medium for setting parameters of a centralized glue supply pump based on multi-dimensional factors. The technical problem to be solved by the present invention is achieved through the following technical solutions:

[0005] A first aspect of an embodiment of the present invention provides a method for setting parameters of a centralized glue supply pump based on multi-dimensional factors, comprising the following steps:

[0006] Determine the moving speed of the glue gun nozzle of the spraying robot and the moving speed of the workpiece carrier according to the number of target workpieces, the length of the position to be sealed of the workpiece and the workbench information; wherein the spraying robot is arranged on the workbench, and the workbench information includes: the number of workbenches, the size of the workbench and the distance between two adjacent workbenches;

[0007] Determining a working distance between a nozzle of a glue gun of the spraying robot and a position to be sealed on a workpiece according to a target colloid shape;

[0008] Determining the colloid flow rate of the glue gun nozzle according to the movement speed of the glue gun nozzle, the working distance and the size of the glue gun nozzle;

[0009] Determine the initial power of the glue pump according to the colloid flow rate and the size of the transmission pipeline;

[0010] Performing test spraying on the position to be sealed according to the initial power of the glue pump;

[0011] Acquire the initial spraying image of the colloid after the test spraying is completed;

[0012] The power of the glue pump is adjusted according to the initial spraying image and the image of the target colloid shape.

[0013] In one embodiment of the present invention, the glue pump includes: a primary glue pump, a secondary glue pump and a tertiary glue pump; the initial power of the glue pump is determined according to the colloid flow rate and the size of the transmission pipeline, including:

[0014] Determine the initial power of the primary glue pump according to the colloid flow rate and the diameter and length of the primary transmission pipeline;

[0015] Determining the initial power of the secondary glue pump according to the colloid flow rate and the diameter and length of the secondary transmission pipeline;

[0016] The initial power of the three-stage glue pump is determined according to the colloid flow rate and the diameter and length of the three-stage transmission pipeline.

[0017] In one embodiment of the present invention, the method further comprises:

[0018] Determine whether the initial power of each stage of the glue pump is less than the reference power of each stage;

[0019] If it is less than, increase the initial power of each stage of glue pump.

[0020] In one embodiment of the present invention, adjusting the power of the glue pump according to the initial spraying image and the image of the target colloid shape includes:

[0021] Comparing the initial spraying image with the image of the target colloid shape;

[0022] When the size of the initial spraying image is larger than the size of the target colloid shape image, the power of the three-stage glue pump is reduced, and the reduced power of the three-stage glue pump is greater than or equal to the three-stage reference power;

[0023] When the size of the initial spraying image is smaller than the size of the target colloid shape image, increasing the power of the tertiary glue pump;

[0024] When the initial spraying image is the same as the image of the target colloid shape, the power of the three-stage glue pump is reduced multiple times within the energy-saving threshold range, and test spraying is performed with the power after each reduction until the size of the current spraying image is smaller than the size of the target colloid shape image, and the power of the previous test spraying is used as the adjusted power.

[0025] A second aspect of an embodiment of the present invention provides a device for setting parameters of a centralized glue supply pump based on multi-dimensional factors, comprising:

[0026] A first determination module is used to determine the movement speed of the glue gun nozzle of the spraying robot and the movement speed of the workpiece carrier according to the number of target workpieces, the length of the position to be sealed of the workpiece and the workbench information; wherein the spraying robot is arranged on the workbench, and the workbench information includes: the number of workbenches, the size of the workbench and the distance between two adjacent workbenches;

[0027] A second determination module is used to determine the working distance between the glue gun nozzle of the spraying robot and the position to be sealed of the workpiece according to the target colloid shape;

[0028] A third determination module is used to determine the colloid flow rate of the glue gun nozzle according to the movement speed of the glue gun nozzle, the working distance and the size of the glue gun nozzle;

[0029] A fourth determination module, used to determine the initial power of the glue pump according to the colloid flow rate and the size of the transmission pipeline;

[0030] A test module, used for performing test spraying on the position to be sealed according to the initial power of the glue pump;

[0031] An acquisition module, used for acquiring an initial spraying image of the colloid after the test spraying is completed;

[0032] The regulating module is used to regulate the power of the glue pump according to the initial spraying image and the image of the target colloid shape.

[0033] In one embodiment of the present invention, the glue pump includes: a primary glue pump, a secondary glue pump and a tertiary glue pump; the initial power of the glue pump is determined according to the colloid flow rate and the size of the transmission pipeline, including:

[0034] Determine the initial power of the primary glue pump according to the colloid flow rate and the diameter and length of the primary transmission pipeline;

[0035] Determining the initial power of the secondary glue pump according to the colloid flow rate and the diameter and length of the secondary transmission pipeline;

[0036] The initial power of the three-stage glue pump is determined according to the colloid flow rate and the diameter and length of the three-stage transmission pipeline.

[0037] In one embodiment of the present invention, it also includes:

[0038] A judgment module, used to judge whether the initial power of each stage of the glue pump is less than the reference power of each stage;

[0039] If it is less than, increase the initial power of each stage of glue pump.

[0040] In one embodiment of the present invention, adjusting the power of the glue pump according to the initial spraying image and the image of the target colloid shape includes:

[0041] Comparing the initial spraying image with the image of the target colloid shape;

[0042] When the size of the initial spraying image is larger than the size of the target colloid shape image, the power of the three-stage glue pump is reduced, and the reduced power of the three-stage glue pump is greater than or equal to the three-stage reference power;

[0043] When the size of the initial spraying image is smaller than the size of the target colloid shape image, increasing the power of the tertiary glue pump;

[0044] When the initial spraying image is the same as the image of the target colloid shape, the power of the three-stage glue pump is reduced multiple times within the energy-saving threshold range, and test spraying is performed with the power after each reduction until the size of the current spraying image is smaller than the size of the target colloid shape image, and the power of the previous test spraying is used as the adjusted power.

[0045] A third aspect of an embodiment of the present invention provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the program, a method for setting parameters of a centralized glue supply pump based on multi-dimensional factors provided by the first aspect of an embodiment of the present invention is implemented.

[0046] A fourth aspect of an embodiment of the present invention provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, a method for setting parameters of a centralized glue supply pump based on multi-dimensional factors provided by the first aspect of an embodiment of the present invention is implemented.

[0047] Beneficial effects of the present invention:

[0048] The present invention can determine the moving speed of the glue gun nozzle and the moving speed of the workpiece carrier according to the target number of workpieces and the workbench information, thereby maximizing production efficiency, and automatically adjusting the power of the glue pump according to multi-dimensional factors, thereby achieving precise adjustment, minimizing energy consumption, improving production efficiency, and enhancing the degree of automation.

[0049] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description, claims, and drawings.

[0050] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0052] Figure 1 A flow chart of a method for setting parameters of a centralized glue supply pump based on multi-dimensional factors provided by an embodiment of the present invention;

[0053] Figure 2 A schematic block diagram of a device for setting parameters of a centralized glue supply pump based on multi-dimensional factors provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0054] The present invention is further described in detail below with reference to specific embodiments, but the embodiments of the present invention are not limited thereto.

[0055] The glue supply system of the present invention can realize 24-hour uninterrupted glue supply, meeting the needs of mass production line. Provide the production line with stable flow and pressure material supply, ensuring that the manual station and the robot station can output stably (flow and pressure). A pressure regulator is set at the outlet to ensure the pressure and flow stability of the output fluid. The system supplies glue through large-volume packaging, and the state of the glue material is more stable, reducing quality defects caused by changes in material properties. Insulation measures are installed on the system pipeline to further maintain the stability of the material. According to the actual situation of the workshop layout, the system can realize long-distance glue supply through the form of secondary pressurization. All 300Gal RAMs are concentrated in one area, which can realize the centralized storage and loading and unloading management of materials. The degree of personnel and vehicle diversion in the internal passage of the workshop is improved, making the internal management of the workshop more orderly and the personnel safer. The system is driven by a pneumatic motor. Due to its characteristics, the pneumatic motor determines that it has a large noise when working. Concentrating all 300Gal RAMs in a relatively closed area can reduce the noise pollution of the entire workshop and protect the hearing of workers. The glue supply system can be configured according to different spraying processes. The system is flexible and can be used with multiple brands of products. Through different processes and equipment configurations, the system realizes the application of full-process glue spraying of automobile OEMs, such as: body sealant, anti-stone impact glue, structural glue, silent glue, windshield glue, etc. The system improves the semi-automatic degree of the equipment through the organic combination of mechanics and electrical. The system is installed with: barrel in place sensor detection lock to ensure that the material is installed in place on the equipment to avoid damage to the system due to the material not being in place. Liquid level sensor, used to monitor the liquid level in the barrel in real time, and switch the equipment between empty / full barrels through the pneumatic device according to the liquid level status. Pump frequency sensor, used to monitor the working pump frequency of the pneumatic pump, to achieve overclocking protection of the pump body itself, and cut off the power air source. Pressure sensor, used to monitor the system pressure.

[0056] like Figure 1 As shown, a first aspect of an embodiment of the present invention provides a method for setting parameters of a centralized glue supply pump based on multi-dimensional factors, comprising the following steps:

[0057] Step 11, determining the movement speed of the glue gun nozzle of the spraying robot and the movement speed of the workpiece carrier according to the target number of workpieces, the length of the position to be sealed of the workpiece and the workbench information.

[0058] The spraying robot is arranged on a workbench, and the workbench information includes: the number of workbenches, the size of the workbench and the distance between two adjacent workbenches.

[0059] Step 12, determining a working distance between a glue gun nozzle of a spraying robot and a position to be sealed of a workpiece according to a target colloid shape.

[0060] Step 13, determining the colloid flow rate of the glue gun nozzle according to the movement speed of the glue gun nozzle, the working distance and the size of the glue gun nozzle.

[0061] Step 14, determining the initial power of the glue pump according to the glue flow rate and the size of the transmission pipeline.

[0062] Step 15, test spraying is performed on the position to be sealed according to the initial power of the glue pump.

[0063] Step 16, obtaining an initial spraying image of the colloid after the test spraying is completed.

[0064] Step 17, adjusting the power of the glue pump according to the initial spraying image and the image of the target colloid shape.

[0065] In this embodiment, the movement speed of the glue gun nozzle and the movement speed of the workpiece carrier can be determined according to the target number of workpieces and the workbench information to meet the production target requirements, thereby maximizing production efficiency. The power of the glue pump can be automatically adjusted according to multi-dimensional factors, achieving large and precise adjustment of the glue pump power, minimizing energy consumption, improving production efficiency, and enhancing the degree of automation.

[0066] A second aspect of an embodiment of the present invention provides a method for setting parameters of a centralized glue supply pump based on multi-dimensional factors, which is applied to a control terminal or a server, and includes the following steps:

[0067] Step 21, determining the movement speed of the glue gun nozzle of the spraying robot and the movement speed of the workpiece carrier according to the target number of workpieces, the length of the position to be sealed of the workpiece and the workbench information.

[0068] The spraying robot is arranged on a workbench, and the workbench information includes: the number of workbenches, the size of the workbench and the distance between two adjacent workbenches.

[0069] In this embodiment, the glue supply system includes a three-stage glue supply subsystem, which is powered by a first-stage glue supply pump, a second-stage glue supply pump and a third-stage glue supply pump. Since the pneumatic pump produces a relatively high noise level of >85dB when working, there is a risk of noise injury to the workers, so the first-stage glue supply pump is centrally placed in a separate material room (in the same workshop), the second-stage glue supply pump is for pressurization, and the third-stage glue supply pump is set close to the spray robot.

[0070] The spraying is a stop-and-go type. The spraying robot does not move. The workpiece is set on the workbench. After the workbench moves to a certain position, the spraying robot sprays, and the conveyor line stops moving during spraying. According to the production capacity requirements, the target number of workpieces that need to be sprayed on each workbench per hour is determined. The spraying robot is set on the workbench. When the spraying robot is working, the glue gun nozzle moves to spray glue. The position to be sealed of the workpiece is also the position of the workpiece that needs to be sprayed. A workpiece can have at least one position to be sealed. According to the length of glue spraying required for each position to be sealed corresponding to each workbench (that is, the length that the glue gun nozzle needs to move), and the number of positions to be sealed that need to be completed per workbench per hour, the speed at which the glue gun nozzle of the spraying robot on this workbench needs to move can be obtained. At the same time, according to the target number of workpieces that need to be sprayed on each workbench per hour, the length of a workbench, the distance between two adjacent workbenches, and the number of workbenches, the moving speed of the workpiece carrier can be determined. The speed at which the glue gun nozzle of the spraying robot needs to move and the moving speed of the workpiece carrier need to meet the target number of workpieces that need to be completed per workbench per hour.

[0071] In a feasible implementation, the workpiece carrier can move at a faster speed when glue spraying is not required.

[0072] For example, after the model of the workpiece is input in the control terminal, the length of the position to be sealed of the workpiece can be obtained.

[0073] Step 22, determining the working distance between the glue gun nozzle of the spraying robot and the position to be sealed of the workpiece according to the target colloid shape.

[0074] In this step, the smaller the distance between the nozzle of the glue gun and the position to be sealed, the wider the shape of the colloid formed by the glue spraying and the thicker the thickness.

[0075] In a feasible implementation, a correspondence between the size of the colloid shape and the working distance can be formed based on historical data analysis, and the correspondence can be obtained and the working distance can be determined before production. For example, the correspondence can be that the size range of the colloid shape can correspond to a working distance or a range of working distances.

[0076] Step 23, determining the colloid flow rate of the glue gun nozzle according to the movement speed of the glue gun nozzle, the working distance and the size of the glue gun nozzle.

[0077] In this step, the required target flow rate can be determined according to the movement speed of the glue gun nozzle and the working distance, and the colloid flow rate can be determined according to the target flow rate and the diameter of the glue gun nozzle.

[0078] Step 24, determining the initial power of the glue pump according to the glue flow rate and the size of the transmission pipeline.

[0079] In this step, the main purpose of the glue supply system is to supply the material to the demand point (secondary glue pump inlet and spray robot) at a certain flow rate and pressure. The pressure needs to be set according to the installation status on site, the length of the pipeline and other conditions. The pressure loss of the system is calculated according to the length of the transmission pipeline, and the supply pressure of the glue pump is initially set according to the required colloid flow rate, that is, the initial power.

[0080] Specifically, under the production requirement of meeting the target number of workpieces, in step 23, if the working distance and the size of the glue gun nozzle are determined, the size of the transmission pipeline is determined, the faster the glue gun nozzle moves, the greater the colloid flow rate is required, and the greater the power is required.

[0081] If the movement speed of the glue gun nozzle and the size of the glue gun nozzle are determined, and the size of the transmission pipeline is determined, the greater the working distance, the greater the colloid flow rate required, and the greater the power required.

[0082] If the moving speed and working distance of the glue gun nozzle are determined, and the size of the transmission pipeline is determined, the smaller the size of the glue gun nozzle is, the greater the colloid flow rate is required, and the greater the power is required.

[0083] If the glue gun nozzle moving speed, working distance and glue gun nozzle size are determined, the colloid flow rate is determined, the longer the transmission pipeline, the greater the power required.

[0084] Here, the glue pump includes: a primary glue pump, a secondary glue pump and a tertiary glue pump, and the transmission pipeline includes: a primary transmission pipeline, a secondary transmission pipeline and a tertiary transmission pipeline. The specific steps of step 24 include: step 241-step 243:

[0085] Step 241, determine the initial power of the first-stage glue pump according to the colloid flow rate and the diameter and length of the first-stage transmission pipeline. The initial power of each stage glue pump must at least meet the minimum flow and pressure requirements of the next stage glue pump. The first-stage transmission pipeline connects the first-stage glue pump and the second-stage glue pump, the second-stage transmission pipeline connects the second-stage glue pump and the third-stage glue pump, and the third-stage transmission pipeline connects the third-stage glue pump and the glue gun of the spray robot.

[0086] Step 242, determining the initial power of the secondary glue pump according to the colloid flow rate and the diameter and length of the secondary transmission pipeline.

[0087] Step 243, determining the initial power of the tertiary glue pump according to the colloid flow rate and the diameter and length of the tertiary transmission pipeline.

[0088] In a feasible implementation, the corresponding relationship between the pressure loss and the flow rate and the corresponding relationship with the initial power can be preset, and the required initial power can be determined according to the corresponding relationship.

[0089] Step 25, test spraying is performed on the position to be sealed according to the initial power of each stage of the glue pump.

[0090] Step 26, determining whether the initial power of each stage of the glue pump is less than the reference power of each stage.

[0091] If it is less than, increase the initial power of each stage of glue pump.

[0092] In this step, after starting the test spraying, if the initial power is less than the reference power, the corresponding first-level glue pump will issue an alarm, and the corresponding initial power is too low, and the initial power needs to be increased. If no alarm is issued, the initial power can be used for test spraying.

[0093] Step 27, starting the test spraying, after the test spraying is completed, obtaining the initial spraying image of the colloid after the test spraying is completed.

[0094] Step 28, adjusting the power of the glue pump according to the initial spraying image and the image of the target colloid shape.

[0095] Specifically, the specific steps of step 28 include step 281-step 284:

[0096] Step 281 , comparing the initial spraying image with the image of the target colloid shape.

[0097] Step 282 , when the size of the initial spraying image is larger than the size of the target colloid shape image, the power of the three-stage glue pump is reduced, and the reduced power of the three-stage glue pump is greater than or equal to the three-stage reference power.

[0098] In this step, the colloid shape image in the initial spraying image is compared with the image of the target colloid shape. When it is larger than the target colloid shape, or the part larger than the target colloid shape exceeds the first error threshold, the power of the three-stage glue pump needs to be reduced. However, it is necessary to ensure that the reduced power is not less than the three-stage reference power.

[0099] Step 283 , when the size of the initial spraying image is smaller than the size of the target colloid shape image, increase the power of the tertiary glue pump.

[0100] In this step, the colloid shape image in the initial spraying image is compared with the image of the target colloid shape. When the colloid shape is smaller than the target colloid shape, or the portion smaller than the target colloid shape exceeds the second error threshold, the power of the three-stage glue pump needs to be increased.

[0101] Step 284, when the initial spraying image is the same as the image of the target colloid shape, the power of the three-stage glue pump is reduced multiple times within the energy-saving threshold range, and test spraying is performed with the power after each reduction until the size of the current spraying image is smaller than the size of the target colloid shape image, or the part smaller than the target colloid shape exceeds the second error threshold, and the power of the previous test spraying is used as the adjusted power.

[0102] In this step, lower power can be used as much as possible while meeting the standard glue shape to reduce energy consumption.

[0103] Specifically, when the glue shape in the initial spraying image is the same as the image of the target glue shape, the power of the three-stage glue pump can be lowered within a small range to produce products that meet the target glue shape at the lowest power. Here, after the power is lowered within a small range, another trial spraying is performed. After the current spraying is completed, the current spraying image is obtained, and the current spraying image is compared with the image of the target glue shape again. If the two are the same, the power is further lowered by a small margin, and another trial spraying and image comparison are performed until the glue shape in the current spraying image is smaller than the target glue shape. At this time, it means that the power is the lowest when the glue of the previous trial spraying can meet the target glue shape, and the previous power is used as the final working power for formal production.

[0104] Step 29, production is carried out with the power adjusted by the three-stage glue pump.

[0105] like Figure 2 As shown, the third aspect of the embodiment of the present invention provides a device for setting parameters of a centralized glue supply pump based on multi-dimensional factors, including:

[0106] The first determination module 31 is used to determine the movement speed of the glue gun nozzle of the spraying robot and the movement speed of the workpiece carrier according to the number of target workpieces, the length of the position to be sealed of the workpiece and the workbench information; wherein the spraying robot is set on the workbench, and the workbench information includes: the number of workbenches, the size of the workbench and the distance between two adjacent workbenches;

[0107] A second determination module 32 is used to determine the working distance between the glue gun nozzle of the spray robot and the position to be sealed of the workpiece according to the target colloid shape;

[0108] A third determination module 33, for determining the colloid flow rate of the glue gun nozzle according to the movement speed of the glue gun nozzle, the working distance and the size of the glue gun nozzle;

[0109] The fourth determination module 34 is used to determine the initial power of the glue pump according to the glue flow rate and the size of the transmission pipeline;

[0110] A test module 35 is used to perform test spraying on the position to be sealed according to the initial power of the glue pump;

[0111] An acquisition module 36 is used to acquire an initial spraying image of the colloid after the test spraying is completed;

[0112] The adjustment module 37 is used to adjust the power of the glue pump according to the initial spraying image and the image of the target colloid shape.

[0113] In one embodiment of the present invention, the glue pump includes: a primary glue pump, a secondary glue pump and a tertiary glue pump; according to the flow rate of the colloid and the size of the transmission pipeline, the initial power of the glue pump is determined, including:

[0114] Determine the initial power of the first-stage glue pump according to the colloid flow rate and the diameter and length of the first-stage transmission pipeline;

[0115] Determine the initial power of the secondary glue pump according to the colloid flow rate and the diameter and length of the secondary transmission pipeline;

[0116] Determine the initial power of the three-stage glue pump according to the colloid flow rate and the diameter and length of the three-stage transmission pipeline.

[0117] In one embodiment of the present invention, it also includes:

[0118] A judgment module, used to judge whether the initial power of each stage of the glue pump is less than the reference power of each stage;

[0119] If it is less than, increase the initial power of each stage of glue pump.

[0120] In one embodiment of the present invention, adjusting the power of the glue pump according to the initial spraying image and the image of the target colloid shape includes:

[0121] comparing the initial spraying image with the image of the target colloid shape;

[0122] When the size of the initial spraying image is larger than the size of the target colloid shape image, the power of the three-stage glue pump is reduced, and the power of the three-stage glue pump after the reduction is greater than or equal to the three-stage reference power;

[0123] When the size of the initial spraying image is smaller than the size of the target colloid shape image, the power of the three-stage glue pump is increased;

[0124] When the initial spraying image is the same as the image of the target colloid shape, the power of the three-stage glue pump is reduced multiple times within the energy-saving threshold range, and test spraying is performed with the power after each reduction until the size of the current spraying image is smaller than the size of the target colloid shape image, and the power of the previous test spraying is used as the adjusted power.

[0125] A fourth aspect of an embodiment of the present invention provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the program, a method for setting parameters of a centralized glue supply pump based on multi-dimensional factors provided in the above-mentioned embodiment of the present invention is implemented.

[0126] A fifth aspect of an embodiment of the present invention further provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the steps of a method for setting parameters of a centralized glue supply pump based on multi-dimensional factors provided in the above-mentioned embodiment of the present invention are implemented.

[0127] The memory may include a random access memory (RAM) or a non-volatile memory (NVM), such as at least one disk memory. Optionally, the memory may also be at least one storage device located away from the aforementioned processor.

[0128] The above-mentioned processor can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware systems.

[0129] The method provided in the embodiment of the present invention can be applied to electronic devices. Specifically, the electronic device can be: a desktop computer, a portable computer, an intelligent mobile terminal, a server, etc. This is not limited here, and any electronic device that can implement the present invention belongs to the protection scope of the present invention.

[0130] As for the device / electronic device embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0131] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0132] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0133] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0134] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A method for setting parameters of a centralized glue supply pump based on multi-dimensional factors, characterized in that: The following steps are involved: Determine the moving speed of the glue gun nozzle of the spraying robot and the moving speed of the workpiece carrier according to the number of target workpieces, the length of the position to be sealed of the workpiece and the workbench information; wherein the spraying robot is arranged on the workbench, and the workbench information includes: the number of workbenches, the size of the workbench and the distance between two adjacent workbenches; Determining a working distance between a nozzle of a glue gun of the spraying robot and a position to be sealed on a workpiece according to a target colloid shape; Determining the colloid flow rate of the glue gun nozzle according to the movement speed of the glue gun nozzle, the working distance and the size of the glue gun nozzle; Determine the initial power of the glue pump according to the colloid flow rate and the size of the transmission pipeline; Performing test spraying on the position to be sealed according to the initial power of the glue pump; Acquire the initial spraying image of the colloid after the test spraying is completed; The power of the glue pump is adjusted according to the initial spraying image and the image of the target colloid shape.

2. The method according to claim 1, characterized in that The glue pump includes: a primary glue pump, a secondary glue pump and a tertiary glue pump; the initial power of the glue pump is determined according to the flow rate of the colloid and the size of the transmission pipeline, including: Determine the initial power of the primary glue pump according to the colloid flow rate and the diameter and length of the primary transmission pipeline; Determining the initial power of the secondary glue pump according to the colloid flow rate and the diameter and length of the secondary transmission pipeline; The initial power of the three-stage glue pump is determined according to the colloid flow rate and the diameter and length of the three-stage transmission pipeline.

3. The method according to claim 2, characterized in that The method further comprises: Determine whether the initial power of each stage of the glue pump is less than the reference power of each stage; If it is less than, increase the initial power of each stage of glue pump.

4. The method according to claim 3, characterized in that The step of adjusting the power of the glue pump according to the initial spraying image and the image of the target colloid shape comprises: Comparing the initial spraying image with the image of the target colloid shape; When the size of the initial spraying image is larger than the size of the target colloid shape image, the power of the three-stage glue pump is reduced, and the reduced power of the three-stage glue pump is greater than or equal to the three-stage reference power; When the size of the initial spraying image is smaller than the size of the target colloid shape image, increasing the power of the tertiary glue pump; When the initial spraying image is the same as the image of the target colloid shape, the power of the three-stage glue pump is reduced multiple times within the energy-saving threshold range, and test spraying is performed with the power after each reduction until the size of the current spraying image is smaller than the size of the target colloid shape image, and the power of the previous test spraying is used as the adjusted power.

5. A device for setting parameters of a centralized glue supply pump based on multi-dimensional factors, characterized in that: include: A first determination module is used to determine the movement speed of the glue gun nozzle of the spraying robot and the movement speed of the workpiece carrier according to the number of target workpieces, the length of the position to be sealed of the workpiece and the workbench information; wherein the spraying robot is arranged on the workbench, and the workbench information includes: the number of workbenches, the size of the workbench and the distance between two adjacent workbenches; A second determination module is used to determine the working distance between the glue gun nozzle of the spraying robot and the position to be sealed of the workpiece according to the target colloid shape; A third determination module is used to determine the colloid flow rate of the glue gun nozzle according to the movement speed of the glue gun nozzle, the working distance and the size of the glue gun nozzle; A fourth determination module, used to determine the initial power of the glue pump according to the colloid flow rate and the size of the transmission pipeline; A test module, used for performing test spraying on the position to be sealed according to the initial power of the glue pump; An acquisition module, used for acquiring an initial spraying image of the colloid after the test spraying is completed; The regulating module is used to regulate the power of the glue pump according to the initial spraying image and the image of the target colloid shape.

6. The device according to claim 5, characterized in that The glue pump includes: a primary glue pump, a secondary glue pump and a tertiary glue pump; the initial power of the glue pump is determined according to the flow rate of the colloid and the size of the transmission pipeline, including: Determine the initial power of the primary glue pump according to the colloid flow rate and the diameter and length of the primary transmission pipeline; Determining the initial power of the secondary glue pump according to the colloid flow rate and the diameter and length of the secondary transmission pipeline; The initial power of the three-stage glue pump is determined according to the colloid flow rate and the diameter and length of the three-stage transmission pipeline.

7. The device according to claim 6, characterized in that Also includes: A judgment module, used to judge whether the initial power of each stage of the glue pump is less than the reference power of each stage; If it is less than, increase the initial power of each stage of glue pump.

8. The device according to claim 5, characterized in that The step of adjusting the power of the glue pump according to the initial spraying image and the image of the target colloid shape comprises: Comparing the initial spraying image with the image of the target colloid shape; When the size of the initial spraying image is larger than the size of the target colloid shape image, the power of the three-stage glue pump is reduced, and the reduced power of the three-stage glue pump is greater than or equal to the three-stage reference power; When the size of the initial spraying image is smaller than the size of the target colloid shape image, increasing the power of the tertiary glue pump; When the initial spraying image is the same as the image of the target colloid shape, the power of the three-stage glue pump is reduced multiple times within the energy-saving threshold range, and test spraying is performed with the power after each reduction until the size of the current spraying image is smaller than the size of the target colloid shape image, and the power of the previous test spraying is used as the adjusted power.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the program, the method for setting parameters of a centralized glue supply pump based on multi-dimensional factors as described in any one of claims 1 to 4 is implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method for setting parameters of a centralized glue supply pump based on multi-dimensional factors described in any one of claims 1 to 4 is implemented.

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