Automatic silicon wafer sorting machine
By designing an automatic silicon wafer sorting machine with gears and linkage components, the intermittent automatic sorting of silicon wafers is realized by using motor drive and intermittent dialing blocks, which solves the problem of increased energy consumption caused by multiple sets of power sources in the prior art, reduces processing costs and improves sorting efficiency.
Patent Information
- Application Number
- CN202411677585.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-22
- Publication Date
- 2025-03-28
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
When sorting silicon wafers, existing silicon wafer sorters need to rely on multiple sets of power sources to achieve independent discharge of silicon wafers, resulting in an increase in energy consumption of the entire device and thus increase processing costs.
An automatic silicon wafer sorting machine is designed. The drive shaft is driven by the motor, and the transmission function of gears and linkage components is used to enable the belt shaft and linkage shaft to rotate at different speeds. The intermittent pivoting promotes the transmission of the silicon wafer, realizing intermittent automatic sorting of the silicon wafer.
By using a single power source to achieve intermittent transmission of silicon wafers, the energy consumption of the device is reduced, processing costs are reduced, and the efficiency of silicon wafer sorting is improved.
Smart Images

Figure CN119702462A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of silicon wafer processing, and in particular to an automatic silicon wafer sorting machine. Background Art
[0002] Silicon wafers are important materials for making integrated circuits. Various semiconductor devices can be made by photolithography, ion implantation and other methods. The sheet structure of silicon single material is relatively thin, and there are mainly two structures: round and square. There are single crystals and polycrystalline. Single crystals are crystalline materials with a fixed crystal orientation. They are generally used as substrates for semiconductor integrated circuits and are also used to make solar cells. Polycrystalline is a crystalline material without a uniform fixed crystal orientation. It is generally used for solar photovoltaic power generation or as raw materials for pulling single crystal silicon. Although photovoltaic silicon wafers were mostly square before, the emergence of rectangular silicon wafers has many advantages.
[0003] The existing silicon wafer sorting machine still has the following problems when in use: When sorting the existing silicon wafers, the unloading of the silicon wafers needs to rely on multiple sets of power sources for their autonomous unloading, which leads to an increase in the energy consumption of the entire device and ultimately increases the overall processing cost.
[0004] Therefore, it is necessary to invent an automatic silicon wafer sorting machine to solve the above problems. Summary of the invention
[0005] The purpose of the present invention is to provide an automatic silicon wafer sorting machine to solve the problem raised in the above background technology that the existing silicon wafers need to rely on multiple sets of power sources to unload the silicon wafers autonomously during sorting, which increases the energy consumption of the entire device and ultimately increases the overall processing cost.
[0006] In order to achieve the above object, the present invention provides the following technical solution: an automatic silicon wafer sorting machine, comprising: frame; Legs, the legs are fixedly connected to the four corners of the bottom of the frame; An external frame, the external frame is fixedly connected to a top wall on one side of the frame; A detection machine, the detection machine is fixedly mounted on the top of the frame; A motor, a drive shaft, a belt shaft and a conveyor belt, wherein the motor is fixedly connected to the side wall of the frame, and the output shaft of the motor is drivingly connected to the drive shaft, the drive shaft and the belt shaft are meshed with gears, and the conveyor belt is drivingly connected between the two belt shafts; A linkage assembly, the linkage assembly includes a turntable, a short rod, a linkage plate and a linkage shaft, the turntable is fixedly sleeved on the outer wall of the driving shaft, and the outer wall of the turntable is fixedly connected with the short rod, and the short rod matches the inside of the notch set inside the linkage plate; the linkage shaft is inserted into the inner ring of the linkage plate, and the outer wall of the linkage shaft is fixedly connected with a shift block.
[0007] In some possible embodiments, the gears are fixedly mounted on the outer walls of the drive shaft and the belt shaft close to the drive shaft, and the two sets of gears are meshed and connected.
[0008] In some possible embodiments, the present invention further includes: a position limiting installation component, wherein the position limiting installation component includes a side plate 1, a side plate 2, a notch 1 arranged inside the external frame, an end plate 1, an end plate 2, and a spring; The side panel one and the side panel two are movably mounted inside the notch one, and the end of the side panel one is fixedly connected to the end panel one, and the end of the side panel two is fixedly connected to the end panel two, and the end panel one and the end panel two are movably connected via the spring.
[0009] In some possible embodiments, an adjustment component is further included, wherein the adjustment component includes a screw rod, a polished rod, a disc, and a bottom plate; The screw is threadedly connected to the inside of the side plate one, the polished rod is movably inserted into the inside of the side plate two, and the lower ends of the screw and the polished rod are fixedly connected to the disc, and the lower ends of the screw and the polished rod are slidably connected to the preset groove inside the bottom plate.
[0010] In some possible embodiments, the upper and lower ends of the side panels 1 and 2 are fixedly connected with square limit blocks, and the limit blocks move inside the limit grooves preset inside the external frame, and the limit grooves are connected to the notch 1.
[0011] In some possible embodiments, a movable groove with three open sides is opened inside the end plate 2, and the inner wall of the movable groove is in contact with the inner wall of the end plate 1 and is slidably connected, and the inner wall of the movable groove is fixedly connected to a connecting block, which is arranged at the opening of one side of the movable groove.
[0012] In some possible embodiments, the two ends of the spring are respectively fixedly connected to the connecting block and the inner wall of one side of the notch 2 opened inside the end plate 1.
[0013] In some possible embodiments, there are two turntables, the outer ring diameters of the two turntables are different, and the two turntables are coaxially installed, and the outer wall of the turntable with a larger outer ring diameter is fixedly connected with a short rod, and the outer wall of the turntable with a larger outer ring diameter is in contact with the outer wall of the linkage plate.
[0014] In some possible embodiments, the notches are arranged inside the special-shaped linkage plate, and the notches are arranged in four groups in number, and the four groups of notches are distributed in a ring shape at equal angles.
[0015] In some possible embodiments, the outer ring of the shift block is arc-shaped, and the rod body connecting the shift block and the linkage shaft has toughness. The shift blocks are arranged in four groups, and the four groups of shift blocks are distributed in a ring shape at equal angles.
[0016] In the above technical solution, the technical effects and advantages provided by the present invention are: The present invention drives the rotation of the driving shaft by starting the motor. Under the transmission action of the gears and the linkage assembly, the belt shaft and the linkage shaft have the same direction of rotation and different rotation speeds. In this way, the intermittently rotating shifting block intermittently shifts the shifting block to rotate, so that the friction between the shifting block and the silicon wafer to be transmitted at the bottom during the rotation of the shifting block promotes the transmission of the silicon wafer at the bottom of the limit installation assembly, so that the silicon wafer is intermittently transmitted, which is convenient for the detection machine to perform detection and sorting operations. In this way, only one power source is needed to automatically sort the silicon wafers intermittently, making the use of the device more energy-efficient; the handle at the upper end of the torsion screw drives the screw to realize the lifting movement, and then drives the lifting movement of the bottom plate movably connected to the lower end of the screw, so as to facilitate the adjustment of the distance between the bottom plate and the two side plates and the lower end of the two end plates, so that the distance just matches the subsequent separation of a silicon wafer, which is convenient for the subsequent separation and processing of silicon wafers of different thicknesses. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.
[0018] Figure 1 A three-dimensional diagram of the overall structure of an automatic silicon wafer sorting machine according to an embodiment of the present invention; Figure 2 An exploded view of the overall structure of the automatic silicon wafer sorting machine according to an embodiment of the present invention; Figure 3 An exploded view of the connection structure of the limit installation assembly according to an embodiment of the present invention; Figure 4 It is an exploded view from the first perspective of the connection structure of the frame and linkage components of an embodiment of the present invention; Figure 5 An exploded view of the connection structure of the frame and linkage components of an embodiment of the present invention from a second perspective; Figure 6 It is a three-dimensional diagram of the connection structure between the end plate 2 (partially cut away) and the end plate 1 according to an embodiment of the present invention; Figure 7A three-dimensional diagram of the overall structure of the linkage assembly according to an embodiment of the present invention; Figure 8 It is an exploded view of the connection structure between the base plate and the screw rod according to an embodiment of the present invention.
[0019] Description of reference numerals: 1. Frame; 2. Legs; 3. Testing machine; 4. Motor; 5. Drive shaft; 6. Belt shaft; 7. Conveyor belt; 8. External frame; 9. Limit installation assembly; 901. Side panel one; 902. Side panel two; 903. Notch one; 904. Limit slot; 905. Limit block; 906. End panel one; 907. End panel two; 908. Movable slot; 909. Notch two; 910. Spring; 911. Connecting block; 10. Adjustment assembly; 101. Screw; 102. Bare rod; 103. Disc; 104. Bottom plate; 105. Channel; 106. Notch three; 11. Linkage assembly; 111. Turntable; 112. Short rod; 113. Linkage plate; 114. Notch; 115. Linkage shaft; 12. Gear; 13. Shift block. DETAILED DESCRIPTION
[0020] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.
[0021] The present invention provides Figure 1-8 The silicon wafer automatic sorting machine shown includes a frame 1, legs 2 are fixedly connected at the four corners of the bottom of the frame 1, a detection machine 3 is fixedly installed on the top of the frame 1, a motor 4 is fixedly connected to the side wall of the frame 1, and the output shaft of the motor 4 is connected to the drive shaft 5, and the drive shaft 5 is meshed with the belt shaft 6 through a gear 12, a conveyor belt 7 is connected between the two belt shafts 6, and an external frame 8 is fixedly connected to the top wall of one side of the frame 1, and also includes: The limit installation component 9, the outer frame 8 is provided with a notch 903 inside, and the notch 903 is movably installed with a side plate 901 and a side plate 902 inside, and the end of the side plate 901 is fixedly connected with an end plate 906, and the end of the side plate 902 is fixedly connected with an end plate 907, and the end plate 906 and the end plate 907 are movably connected through a spring 910, so as to ensure that the silicon wafers to be sorted can be neatly installed and wait for sorting; The adjusting component 10 has a screw rod 101 connected to the inner thread of the side plate 1 901, and a polished rod 102 is movably inserted into the inner part of the side plate 2 902, and the lower ends of the screw rod 101 and the polished rod 102 are fixedly connected to a disc 103, and the lower ends of the screw rod 101 and the polished rod 102 are slidably connected to a preset groove 105 inside the bottom plate 104, and the spacing between the bottom plate 104 and the lower ends of the two side plates is adjusted, so that silicon wafers of different thicknesses can pass through the bottom plate 104 and the lower ends of the two side plates and be transmitted to the conveyor belt 7, thereby realizing the transmission of silicon wafers of different specifications; The linkage assembly 11, the outer wall of the driving shaft 5 is fixedly sleeved with a turntable 111, and the outer wall of the turntable 111 is fixedly connected with a short rod 112, and the short rod 112 matches the inside of the notch 114 set inside the linkage plate 113, the inner circle of the linkage plate 113 is plugged with a linkage shaft 115, and the outer wall of the linkage shaft 115 is fixedly connected with a shift block 13, and the shift block 13 passes through a preset notch 106 inside the bottom plate 104. Through the rotation of the shift block 13, the friction between the shift block 13 and the silicon wafer to be transmitted at the bottom during the rotation process promotes the transmission of the silicon wafer at the bottom in the limiting installation assembly 9.
[0022] The outer walls of the drive shaft 5 and the belt shaft 6 close to the drive shaft 5 are fixedly mounted with gears 12, and the two sets of gears 12 are meshed and connected, so that during the rotation of the drive shaft 5, the belt shaft 6 and the drive shaft 5 rotate in different directions, and at the same time, the linkage shaft 115 has the same direction as the drive shaft 5 under the transmission action of the linkage assembly 11.
[0023] The upper and lower ends of side panel 1 901 and side panel 2 902 are fixedly connected with square limit blocks 905, and the limit blocks 905 move inside the limit grooves 904 preset inside the external frame 8, and the limit grooves 904 are connected with notch 1 903 to ensure the stability of the movement of side panel 1 901 and side panel 2 902.
[0024] An active groove 908 with three open sides is provided inside the end plate 907, and the inner wall of the active groove 908 is in contact with the inner wall of the end plate 906 and is slidably connected, and the inner wall of the active groove 908 is fixedly connected with a connecting block 911, and the connecting block 911 is arranged at the beginning of one side of the active groove 908, so that when the side plate 901 and the side plate 902 move, the end plate 906 and the end plate 907 fixedly connected to the ends of the side plate 901 and the side plate 902 are synchronously driven to move, so that the gap between the side plate and the end plate can be opposite to the three sides of the silicon wafer to be sorted, ensuring that the subsequent side plates and end plates can be aligned and limited for silicon wafers of different sizes, which is convenient for the subsequent autonomous unloading of silicon wafers.
[0025] The two ends of the spring 910 are fixedly connected to the connecting block 911 and the inner wall of the notch 2 909 opened inside the end plate 1 906. Under the elastic force of the spring 910, the end plate and the side plate can fit with the three side walls of the silicon wafer, which is convenient for the unloading of the silicon wafer.
[0026] There are two turntables 111 , and the outer diameters of the two turntables 111 are different. The two turntables 111 are coaxially installed, and the outer wall of the turntable 111 with a larger outer diameter is fixedly connected with a short rod 112 , and the outer wall of the turntable 111 with a larger outer diameter fits the outer wall of the linkage plate 113 .
[0027] The notches 114 are arranged inside the special-shaped linkage plate 113. There are four groups of notches 114, which are distributed in a ring shape at equal angles. The turntable 111 rotates to drive the short rod 112 to rotate. At this time, the linkage plate 113 does not rotate. When the short rod 112 is engaged with the notch 114 on the linkage plate 113, the short rod 112 continuously rotates with the turntable 111, thereby causing the linkage plate 113 to rotate, thereby achieving the effect of intermittently rotating the linkage plate 113.
[0028] The outer ring of the shift block 13 is arc-shaped, and the rod body connecting the shift block 13 and the linkage shaft 115 is tough. There are four groups of shift blocks 13, and the four groups of shift blocks 13 are distributed in a ring at equal angles. Through the rotation of the shift block 13, the friction between the shift block 13 and the silicon wafer to be transported at the bottom during the rotation process is used to promote the transmission of the silicon wafer at the bottom in the limiting installation assembly 9.
[0029] Working principle: When using the automatic silicon wafer sorting machine, first adjust the distance between the bottom plate 104 and the two side plates and the lower ends of the two end plates according to the thickness of the silicon wafers to be sorted, twist the handle at the upper end of the screw 101, and the screw 101 is threadedly connected to the side plate 901. In the process of twisting the screw 101, the screw 101 can be driven to achieve lifting movement, and the disc 103 fixedly connected to the lower end of the screw 101 moves inside the groove 105 preset inside the bottom plate 104. In this way, the bottom plate 104 movably connected to the lower end is driven to move up and down during the lifting and lowering process of the screw 101, so that the distance between the bottom plate 104 and the two side plates and the lower ends of the two end plates can be adjusted conveniently, so that the distance is just matched with the subsequent of a silicon wafer; By starting the motor 4, the drive shaft 5 connected to the output shaft of the motor 4 is driven to rotate. Under the transmission action of the gear 12, the drive shaft 5 and the adjacent belt shaft 6 rotate synchronously in different directions. At the same time, during the rotation of the drive shaft 5, the turntable 111 fixedly connected to the outer wall of the drive shaft 5 rotates, driving the short rod 112 fixedly connected to the side wall of the turntable 111 to rotate. At this time, the linkage plate 113 does not rotate. When the short rod 112 is engaged with the notch 114 on the linkage plate 113, the short rod 112 rotates continuously with the turntable 111, thereby causing the linkage plate 113 to rotate, so as to intermittently make the linkage The plate 113 rotates. At this time, the linkage shaft 115 inserted in the inner circle of the linkage plate 113 rotates synchronously. At this time, the direction of the linkage shaft 115 is opposite to that of the drive shaft 5, and the linkage shaft 115 and the belt shaft 6 have the same direction, so that the intermittently rotating shift block 13 intermittently shifts the shift block 13 to rotate, so that the friction between the shift block 13 and the silicon wafer to be transmitted at the bottom during the rotation process promotes the transmission of the silicon wafer at the bottom of the limit installation assembly 9, and the silicon wafer passes through the gap between the bottom plate 104 and the two side plates and the lower end of the two end plates, so that the silicon wafer is intermittently transmitted, which is convenient for the detection machine 3 to perform detection and sorting operations.
[0030] The above description is only by way of illustration of certain exemplary embodiments of the present invention. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.
Claims
1. A silicon wafer automatic sorting machine, characterized in that: include: frame; Legs, the legs are fixedly connected to the four corners of the bottom of the frame; An external frame, the external frame is fixedly connected to a top wall on one side of the frame; A detection machine, the detection machine is fixedly mounted on the top of the frame; A motor, a drive shaft, a belt shaft and a conveyor belt, wherein the motor is fixedly connected to the side wall of the frame, and the output shaft of the motor is drivingly connected to the drive shaft, the drive shaft and the belt shaft are meshed with gears, and the conveyor belt is drivingly connected between the two belt shafts; A linkage assembly, the linkage assembly includes a turntable, a short rod, a linkage plate and a linkage shaft, the turntable is fixedly sleeved on the outer wall of the driving shaft, and the outer wall of the turntable is fixedly connected with the short rod, and the short rod matches the inside of the notch set inside the linkage plate; the linkage shaft is inserted into the inner ring of the linkage plate, and the outer wall of the linkage shaft is fixedly connected with a shift block.
2. The automatic silicon wafer sorting machine according to claim 1, characterized in that: The gears are fixedly sleeved on the outer walls of the driving shaft and the belt shaft close to the driving shaft, and the two sets of gears are meshed and connected.
3. The automatic silicon wafer sorting machine according to claim 1, characterized in that: Also includes: A position limiting installation assembly, the position limiting installation assembly comprising a side plate 1, a side plate 2, a notch 1 arranged inside the external frame, an end plate 1, an end plate 2 and a spring; The side panel one and the side panel two are movably mounted inside the notch one, and the end of the side panel one is fixedly connected to the end panel one, and the end of the side panel two is fixedly connected to the end panel two, and the end panel one and the end panel two are movably connected via the spring.
4. The automatic silicon wafer sorting machine according to claim 3, characterized in that: Also included is an adjustment assembly, which includes a screw rod, a polished rod, a disc and a bottom plate; The screw is threadedly connected to the inside of the side plate one, the polished rod is movably inserted into the inside of the side plate two, and the lower ends of the screw and the polished rod are fixedly connected to the disc, and the lower ends of the screw and the polished rod are slidably connected to the preset groove inside the bottom plate.
5. The automatic silicon wafer sorting machine according to claim 4, characterized in that: The upper and lower ends of the side panels 1 and 2 are fixedly connected with square limit blocks, and the limit blocks move inside the limit grooves preset inside the external frame, and the limit grooves are connected with the notch 1.
6. The automatic silicon wafer sorting machine according to claim 3, characterized in that: The interior of the second end plate is provided with a movable groove with three open sides, and the inner wall of the movable groove is in contact with the inner wall of the first end plate and is slidably connected, and the inner wall of the movable groove is fixedly connected with a connecting block, which is arranged at the beginning of one side of the movable groove.
7. The automatic silicon wafer sorting machine according to claim 2, characterized in that: The two ends of the spring are respectively fixedly connected to the connecting block and the inner wall of one side of the notch 2 opened inside the end plate 1.
8. The automatic silicon wafer sorting machine according to any one of claims 1 to 7, characterized in that: There are two turntables, the outer diameters of the two turntables are different, and the two turntables are coaxially installed. The outer wall of the turntable with the larger outer diameter is fixedly connected with a short rod, and the outer wall of the turntable with the larger outer diameter fits with the outer wall of the linkage plate.
9. The automatic silicon wafer sorting machine according to any one of claims 1 to 7, characterized in that: The notches are arranged inside the special-shaped linkage plate, and there are four groups of notches in number, and the four groups of notches are distributed in a ring shape at equal angles.
10. The automatic silicon wafer sorting machine according to any one of claims 1 to 7, characterized in that: The outer ring of the shift block is arc-shaped, and the rod body connecting the shift block and the linkage shaft has toughness. The shift blocks are arranged in four groups in number, and the four groups of shift blocks are distributed in a ring shape at equal angles.
Citation Information
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