Ultrafine solder powder preparation device

By designing a solder powder preparation device including an ultrasonic atomizer, an electric push rod and a drip frame, the problems of uneven and spilling of tin liquid caused by manual pouring are solved, and efficient and uniform tin liquid atomization powder is achieved, and the quality and production efficiency of solder powder are improved.

CN119703098APending Publication Date: 2025-03-28曾誉尹
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Patent Information

Application Number
CN202411850029.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-16
Publication Date
2025-03-28

AI Technical Summary

Technical Problem

When preparing tin powder by ultrasonic wave, manual pouring is used to cause uneven and spilling of tin liquid, reducing powder making efficiency and quality.

Method used

An ultrafine solder powder preparation device is designed including a base frame, a preparation box, an ultrasonic atomizer, an electric push rod, a sliding frame, a feed piece and a vibrating member. The feeding member and sliding frame are driven by the electric push rod, and the tin liquid flow is accelerated by the vibrating member, and the tin liquid is uniformly dripped on the atomized disc tool head through the dripping frame, realizing automatic watering.

Benefits of technology

It improves the efficiency and quality of tin liquid atomization powder making, reduces the unevenness and waste of manual operation, and ensures that the prepared solder powder is more refined.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the technical field of solder powder preparation, in particular to a superfine solder powder preparation device which comprises a base frame serving as a bearing carrier of the whole preparation device. The preparation box body is fixedly arranged on the base frame, an opening is formed in the front side of the preparation box body, and box side plates are arranged on the left side, the right side and the rear side of the preparation box body; and the ultrasonic nebulizer is mounted at the top of the preparation box body, and the ultrasonic nebulizer is used for atomizing the molten tin liquid to prepare the tin soldering powder. Hot melting metal tin liquid used for preparing soldering tin powder is put in the feeding port, the vibrating frame is continuously vibrated in cooperation with the vibrating motor, the hot melting metal tin liquid rapidly flows into the material dripping frame from the material conveying pipe, and finally the metal tin liquid is dripped into the atomizing disc tool head through the material dripping frame for powder preparation. Therefore, manual pouring is replaced by automatic dripping of the metal tin liquid, the tin liquid atomization powder making efficiency is improved, and finer soldering tin powder is prepared.
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Description

Technical Field

[0001] The invention relates to the technical field of solder powder preparation, and in particular to a device for preparing ultrafine solder powder. Background Art

[0002] Solder powder is also called welding powder or tin powder. Solder powder is a silvery-white metal powder with excellent ductility and plasticity. It is widely used in the welding and connection of electronic components. It also has excellent electrical conductivity and thermal conductivity. As an important type of industrial raw material, its application in electronics, metallurgy, energy, aerospace and other fields is expanding. With the gradual improvement of modern industry's performance requirements for solder powder particle size, purity, morphology, etc., although traditional solder powder preparation methods such as water atomization, gas atomization and centrifugal atomization have entered the large-scale industrial production stage, the process method directly determines the characteristics of the powder, and the solder powder prepared by traditional processes can no longer meet the requirements for the use of high-performance solder powder in certain fields.

[0003] At present, ultrasonic atomization is a new type of powder making method developed in recent years. Ultrasonic waves are used to atomize molten metal into powder. The principle is to use the vibration energy of ultrasonic waves to make the solid and liquid mix quickly. The anti-shear effect of ultrasonic waves can break the aggregation of lumps and particles, thereby forming fine solid particles. Since ultrasonic preparation of solder powder is usually carried out in a metal box, and the powder is made by an ultrasonic atomizer installed in the box, during the preparation, the melted tin liquid is poured on the ultrasonic atomizer by manpower, so that the tin liquid forms a thin liquid layer on the surface of the tool head. The thin liquid layer excites surface tension waves under the action of ultrasonic vibration. When the droplet amplitude of the thin layer of tin liquid exceeds the amplitude of the tool head, it will fly out and be atomized into fine tin powder particles. However, when this kind of manual tin liquid pouring is used, the thickness of the poured tin liquid is affected by manual operation. When the pouring is uneven, it will directly affect the efficiency and quality of the tin liquid atomization powder making, and part of the poured tin liquid will drip from the tool head of the ultrasonic atomizer to the bottom of the box, which will cause trouble in subsequent cleaning after solidification. Summary of the invention

[0004] (1) Technical issues to be resolved In order to overcome the shortcomings of the prior art of preparing tin powder by ultrasonic atomization, which causes unevenness and spillage of tin liquid when artificial pouring is used, thereby reducing the efficiency and quality of tin liquid atomization powder preparation, the technical problem to be solved by the present invention is to provide a uniform dripping type ultrafine solder powder preparation device.

[0005] (2) Technical solution In order to solve the above technical problems, the present invention provides such an ultrafine solder powder preparation device, comprising: a base frame, serving as a load-bearing carrier of the entire preparation device; a preparation box, fixedly arranged on the base frame, the front side of the preparation box is an opening, and the left side, right side and rear side of the preparation box are all box side panels; an ultrasonic atomizer, installed on the top of the preparation box, the ultrasonic atomizer is used to atomize the molten tin liquid to prepare solder powder; the ultrasonic atomizer includes a vibrator, a connecting rod and an atomizing disc tool head, the vibrator is fixedly installed on the top of the preparation box, the connecting rod passes through the top of the preparation box and is connected to the vibrator, the atomizing disc tool head is fixedly arranged at the lower end of the connecting rod, and the atomizing disc The tool head is used for preparing solder powder, and the vibrator drives the atomizing disc tool head to perform ultrasonic vibration through a connecting rod, so that the tin liquid poured on the atomizing disc tool head is prepared into solder powder; the electric push rod is fixedly installed on the top of the preparation box; the sliding frame is arranged at the front opening of the preparation box; the feeding piece passes through and is fixedly installed on the sliding frame, and the top of the feeding piece is connected to the telescopic rod of the electric push rod. The feeding piece is used to conveniently pour the tin liquid onto the atomizing disc tool head, saving the operation of repeatedly pouring the tin liquid manually; the vibrating piece is fixedly installed on the feeding piece, the vibrating piece passes through the sliding frame and is connected to each other, and the vibrating piece is used to vibrate the feeding piece to speed up the feeding rate of the molten tin liquid.

[0006] In one of the embodiments, the feeding member includes: a guide frame, which is slidably installed on the top side of the preparation box; a feed pipe, which is obliquely penetrated and fixedly installed on the sliding frame, the feed pipe is connected to the guide frame as a whole, and the feed pipe is connected to the telescopic rod of the electric push rod, and the guide frame is used to cooperate with the electric push rod and horizontally guide the feed pipe; a feed port, which is connected to the opening at the upper end of the feed pipe; a drip frame, which is connected to the opening at the lower end of the feed pipe, and no less than two drip ports are provided at the bottom of the drip frame, and the drip frame is used to adapt to the atomizing disc tool head and drip the injected tin liquid onto the atomizing disc tool head for powdering.

[0007] In one embodiment, the drip frame is a fan-shaped frame structure as a whole, and a plurality of dripping ports for dripping tin liquid are evenly opened on the bottom side of the drip frame. The connecting rod is located at the center point of the drip frame and does not contact each other. The plurality of dripping ports on the bottom side of the drip frame are vertically aligned with the atomizing disc tool head. The tin liquid flowing out of the dripping ports can evenly drip onto the upper surface of the atomizing disc tool head, so that the tin liquid can form a uniform tin liquid layer on the upper surface of the atomizing disc tool head.

[0008] In one embodiment, the vibrating member includes: a vibration frame, which is fixedly mounted on the inclined tube wall of the feed pipe, and the vibration frame and the feed pipe are passed through the interior of the sliding frame together; a vibration motor, which is arranged on the top of the vibration frame, and the vibration motor is used to drive the vibration frame to vibrate, thereby vibrating the feed pipe with the vibrating vibration frame, so that the injected hot molten tin liquid flows down quickly in the feed pipe.

[0009] In one embodiment, a cleaning scraper is provided in the frame of the preparation box, the blade of the cleaning scraper is tilted upward and fixedly installed on the front side of the preparation box, the blade height of the cleaning scraper is horizontally aligned with the lower side of the drip frame, and the cleaning scraper is used to scrape and clean the solidified tin liquid at the drip port on the bottom side of the drip frame.

[0010] In one embodiment, a scraping assembly is provided in the middle part of the frame of the preparation box, and the scraping assembly includes: L-shaped pull strips, which are arranged as two symmetrical strips on the left and right and are fixedly installed on the inner side of the sliding frame; a first connecting strip, which is provided with two strips and are symmetrically and rotationally installed on the front top of the frame of the preparation box, and the lower end of the first connecting strip is rotatably connected to the end of the L-shaped pull strip; a second connecting strip, which is provided with two strips and are symmetrically and rotationally installed on the lower ends of the first connecting strips, and the connecting axes of the first connecting strip and the second connecting strip are both rotatably connected to the rear end of the L-shaped pull strip; a scraping frame plate, which is slidably arranged on the inner side of the frame of the preparation box, the scraping frame plate is in contact with the inner side wall of the preparation box and is used to scrape solder powder, and the scraping frame plate is rotatably connected to the lower ends of the two second connecting strips.

[0011] In one embodiment, the L-shaped pull strip is composed of a fixed strip and a slide groove frame, wherein the fixed strip is symmetrically fixedly installed on the inner side of the sliding frame, the slide groove frame is vertically fixed to the corresponding fixed strip, and the connecting axis between the first connecting strip and the second connecting strip is located in the slide groove frame.

[0012] In one of the embodiments, a rejection assembly is provided at the bottom of the frame of the preparation box, and the rejection assembly includes: a bottom plate, a sliding opening is provided on the front side of the base frame, and the bottom plate is slidably installed inside the base frame through the sliding opening; a connecting plate, which is vertically and fixedly connected to the bottom plate located at the outer part of the base frame, and the top of the connecting plate is fixedly installed on the front side of the sliding frame, and when the connecting plate is driven by the sliding frame to move in a direction away from the preparation box, the connecting plate will drive the bottom plate to be pulled out of the base frame; a rejection knife block, which is fixedly installed at the bottom of the front side of the frame of the preparation box, and the blade of the rejection knife block is inclined downward toward the inside of the preparation box, and the blade of the rejection knife block is in contact with the upper side of the bottom plate.

[0013] In one of the embodiments, the cleaning scraper and the rejecting knife block are both detachably mounted on the frame of the preparation box. According to the usage of the cleaning scraper and the rejecting knife block, the cleaning scraper and the rejecting knife block can be disassembled, cleaned or replaced at any time, so that the cleaning scraper can effectively clean the solidified tin liquid at the dripping port of the dripping frame, and the rejecting knife block can scrape and recover the tin liquid dropped on the bottom plate.

[0014] (3) Beneficial effects 1. By placing hot-melt metal tin liquid for preparing solder powder at the feed inlet, the vibration frame is continuously vibrated by the vibration motor, so that the hot-melt metal tin liquid quickly flows from the feed pipe into the drip frame, and finally the metal tin liquid is dripped onto the atomizing disc tool head through the drip frame for powder making, thereby realizing the automatic dripping of metal tin liquid instead of manual pouring, improving the efficiency of tin liquid atomization powder making and preparing finer solder powder.

[0015] 2. When the feed piece is moved by the electric push rod, the cleaning scraper is used to scrape the bottom side of the drip frame on the feed piece, so as to clean and scrape off the solidified tin liquid after dripping on the drip frame, prevent the solidified tin liquid from clogging the dripping port of the drip frame, and achieve long-term uniform dripping of tin liquid on the drip frame, so as to keep the prepared solder powder refined.

[0016] 3. When the feed part and the sliding frame are driven by the electric push rod to move together, the sliding frame drives the L-shaped pull bar to slide horizontally, and the L-shaped pull bar cooperates with the first connecting bar and the second connecting bar, so that the horizontally sliding sliding frame can synchronously drive the scraping frame plate to rise and fall vertically, thereby scraping off the solder powder adsorbed on the inner wall of the preparation box, so as to collect the solder powder manually.

[0017] 4. The horizontally moving sliding frame is used to synchronously drive the connecting plate to move, and then the moving connecting plate drives the bottom plate to move relative to the rejecting knife block, and the rejecting knife block is used to remove the dripping tin liquid on the bottom plate, so as to automatically clean the solidified tin liquid blocks on the bottom plate, thereby saving the cost of subsequent manual cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and other objects, features and advantages of the embodiments of the present invention will become more easily understood through the following detailed description with reference to the accompanying drawings, in which several embodiments of the present invention will be described by way of example and not limitation.

[0019] Figure 1 It is a structural schematic diagram of the present invention.

[0020] Figure 2 This is a schematic diagram of the structure of the box and ultrasonic atomizer prepared in the present invention.

[0021] Figure 3 It is a side structural schematic diagram of the ultrasonic atomizer and the feeding member and other components of the present invention.

[0022] Figure 4 It is a schematic diagram of the structure of the feeding member and the vibrating member of the present invention.

[0023] Figure 5 A connection diagram of the box, the cleaning scraper and the feed member is prepared for the present invention.

[0024] Figure 6 It is a side view structural schematic diagram of the sliding frame, the rejecting component and the scraping component of the present invention.

[0025] Figure 7 It is a detailed structural schematic diagram of the scraping component of the present invention.

[0026] Figure 8 It is a detailed structural schematic diagram of the sliding frame and the scraping component of the present invention.

[0027] Fig. 9 The present invention is a schematic diagram of the structure of the box body, the sliding frame and the rejection component.

[0028] The marks in the accompanying drawings are: 1-base frame, 2-preparation box, 3-ultrasonic atomizer, 31-vibrator, 32-connecting rod, 33-atomizing disc tool head, 4-electric push rod, 5-sliding frame, 6-feeding piece, 61-guide frame, 62-feeding pipe, 63-feeding port, 64-drip frame, 7-vibrating piece, 71-vibrating frame, 72-vibrating motor, 8-cleaning scraper, 9-scraping assembly, 91-L-shaped pull strip, 911-fixed strip, 912-slide frame, 92-first connecting strip, 93-second connecting strip, 94-scraping frame plate, 10-rejecting assembly, 101-bottom plate, 102-connecting plate, 103-rejecting knife block. DETAILED DESCRIPTION

[0029] The preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art.

[0030] It should be noted that the terms "front", "back", "left" and "right" are used in the following ways: Figure 1For the purpose of basic viewing, the term "including" and its variations used in this document represent open inclusion, i.e., "including but not limited to". Unless otherwise stated, the term "or" means "and / or". The term "based on" means "based at least in part on". The terms "an example embodiment" and "an embodiment" mean "at least one example embodiment". The term "another embodiment" means "at least one additional embodiment". The terms "first", "second", etc. may refer to different or the same objects.

[0031] Example 1: A device for preparing ultrafine solder powder, referring to Figure 1 and Figure 2 As shown, it includes: a base frame 1, which serves as a load-bearing carrier of the entire preparation device; a preparation box 2, which is fixedly arranged on the base frame 1, the front side of the preparation box 2 is an opening, and the left side, right side and rear side of the preparation box 2 are all box side panels; an ultrasonic atomizer 3, which is installed on the top of the preparation box 2, and the ultrasonic atomizer 3 is used to atomize the molten tin liquid to prepare solder powder; the ultrasonic atomizer 3 includes a vibrator 31, a connecting rod 32 and an atomizing disc tool head 33, the vibrator 31 is fixedly installed on the top of the preparation box 2 by bolts, the connecting rod 32 passes through the top of the preparation box 2 and is connected to the vibrator 31, the atomizing disc tool head 33 is fixedly arranged at the lower end of the connecting rod 32, the atomizing disc tool head 33 is used for the preparation of solder powder, and the vibrator 31 drives the atomizing disc tool head 33 to perform ultrasonic vibration through the connecting rod 32, so that the atomizing disc tool head 33 is poured into The tin liquid is prepared into solder powder; an electric push rod 4 is fixedly installed on the top of the preparation box 2; a sliding frame 5 is arranged at the front opening of the preparation box 2; a feeding piece 6 is passed through and fixedly installed on the sliding frame 5, and the top of the feeding piece 6 is connected to the telescopic rod of the electric push rod 4, and the feeding piece 6 is used to conveniently pour the tin liquid onto the atomizing disc tool head 33, saving the operation of manually pouring the tin liquid repeatedly; a vibrating piece 7 is fixedly installed on the feeding piece 6, and the vibrating piece 7 passes through the sliding frame 5 and is connected to each other, and the vibrating piece 7 is used to vibrate the feeding piece 6 to accelerate the feeding rate of the molten tin liquid, and the tin liquid is injected into the top of the feeding piece 6, and the auxiliary vibration of the vibrating piece 7 on the feeding piece 6 is cooperated, so that the feeding piece 6 introduces the injected tin liquid into the atomizing disc tool head 33, and the preparation of the solder powder is synchronously completed by using the ultrasonic atomizer 3, thereby improving the efficiency and quality of the tin liquid atomization powder making.

[0032] Reference Figure 1-Figure 3As shown, the feed member 6 includes: a guide frame 61, which is slidably installed on the top side of the preparation box 2; a feed pipe 62, which is obliquely penetrated and fixedly installed on the sliding frame 5, the feed pipe 62 is connected to the guide frame 61 as a whole, and the feed pipe 62 is connected to the telescopic rod of the electric push rod 4, and the guide frame 61 is used to cooperate with the electric push rod 4 and horizontally guide the feed pipe 62; a feed port 63, which is connected to the opening at the upper end of the feed pipe 62; a drip frame 64, which is connected to the opening at the lower end of the feed pipe 62, and the bottom of the drip frame 64 is provided with no less than two drip ports, and the drip frame 64 is used to adapt to the atomizing disc tool head 33, and drip the injected tin liquid onto the atomizing disc tool head 33 for powdering, and by pouring the melted tin liquid into the feed port 63, the poured tin liquid will slide along the inclined feed pipe 62 The molten tin liquid is then dripped into the drip frame 64, and finally the molten tin liquid is dripped onto the atomizing disc tool head 33 through the drip frame 64, and the tin liquid is prepared into solder powder through the atomizing disc tool head 33, and the prepared solder powder will be scattered on the inner wall of the preparation box 2, so that the solder powder can be collected manually later. The drip frame 64 is a fan-shaped frame structure as a whole, and a plurality of dripping ports for dripping tin liquid are evenly opened on the bottom side of the drip frame 64, and the connecting rod 32 is located at the center point of the drip frame 64 and does not contact each other. The plurality of dripping ports on the bottom side of the drip frame 64 are vertically aligned with the atomizing disc tool head 33, and the tin liquid flowing out of the dripping ports can be evenly dripped onto the upper surface of the atomizing disc tool head 33, so that the tin liquid can form a uniform tin liquid layer on the upper surface of the atomizing disc tool head 33, and the tin liquid is atomized into finer solder powder by the ultrasonic atomizer 3.

[0033] Reference Figure 1 , Figure 3 and Figure 4 As shown, the vibrating member 7 includes: a vibration frame 71, which is fixedly arranged on the inclined tube wall of the feed pipe 62, and the vibration frame 71 and the feed pipe 62 are jointly passed through the interior of the sliding frame 5; a vibration motor 72, which is arranged on the top of the vibration frame 71, and the vibration motor 72 is used to drive the vibration frame 71 to vibrate, so as to vibrate the feed pipe 62 with the vibrating vibration frame 71, so that the injected hot melt tin liquid can flow down quickly in the feed pipe 62, so as to prevent the hot melt tin liquid from solidifying prematurely in the feed pipe 62.

[0034] When preparing solder powder, first turn on the ultrasonic atomizer 3. At this time, the activated vibrator 31 transmits the ultrasonic vibration to the atomizing disc tool head 33 through the connecting rod 32, so that the atomizing disc tool head 33 vibrates ultrasonically. At this time, the hot-melted metal tin liquid is poured from the feed port 63. The poured metal tin liquid will flow into the feed pipe 62 from the feed port 63, and will continue to flow downward along the inclined feed pipe 62 to the drip frame 64. At this time, the vibration motor 72 is enabled, and the vibration motor 72 will drive the vibration frame 71 to vibrate together. The vibrated vibration frame 71 will drive the feed pipe 62 to vibrate synchronously. At this time, the continuously vibrating feed pipe 62 vibrates the metal tin liquid inside it, thereby accelerating the flow of the metal tin liquid in the feed pipe 62 to prevent the metal tin liquid from flowing too slowly in the feed pipe 62 and solidifying. When the fast-flowing metal tin liquid When flowing into the dripping frame 64 from the feeding pipe 62 and filling the entire dripping frame 64, the metallic tin liquid will evenly drip from the multiple dripping ports on the bottom side of the dripping frame 64 to the upper side of the atomizing disc tool head 33. The metallic tin liquid dripping onto the atomizing disc tool head 33 will form a tin liquid layer, and under the action of the ultrasonically vibrating atomizing disc tool head 33, the tin liquid will vibrate and be atomized into small particles of tin powder. The prepared atomized tin powder will be scattered on the inner wall of the preparation box 2, so that the user can directly scrape and collect the tin powder later. In this way, it is only necessary to pour the metallic tin liquid from the feeding piece 6 and then evenly drip the tin liquid onto the atomizing disc tool head 33 through the dripping frame 64 to complete the fine preparation of the tin powder, saving the tedious operation of manually pouring the tin liquid onto the ultrasonic atomizer 3 for preparation each time, and improving the efficiency and quality of preparing solder powder.

[0035] Example 2: Based on Example 1, refer to Figure 2 and Figure 5 As shown, a cleaning scraper 8 is arranged in the frame of the preparation box 2, the blade of the cleaning scraper 8 is tilted upward and fixedly installed on the front side of the preparation box 2, the blade height of the cleaning scraper 8 is horizontally aligned with the lower side of the drip frame 64, and the cleaning scraper 8 is used to scrape and clean the solidified tin liquid at the drip port on the bottom side of the drip frame 64, so as to prevent the dripping tin liquid from solidifying at the drip port after the drip frame 64 is used for a long time and causing blockage.

[0036] Reference Figure 1 , Figure 6 and Figure 7As shown, it also includes a scraping assembly 9, which includes: L-shaped pull strips 91, which are set as two symmetrical left and right and are fixedly installed on the inner side of the sliding frame 5 by bolts; a first connecting strip 92, which is provided with two and is symmetrically rotated and installed on the front top of the frame of the preparation box 2, and the lower end of the first connecting strip 92 is rotatably connected to the end of the L-shaped pull strip 91; a second connecting strip 93, which is provided with two and is symmetrically rotated and installed on the lower end of the first connecting strip 92, and the connecting shafts of the first connecting strip 92 and the second connecting strip 93 are both rotatably connected to the rear end of the L-shaped pull strip 91; a scraping frame plate 94, which is slidably arranged on the inner side of the frame of the preparation box 2, and the scraping frame plate 94 is connected to the preparation box 2. The inner wall of the preparation box 2 is in contact with the preparation box 2 and is used to scrape off the solder powder. The scraping frame plate 94 is rotatably connected to the lower ends of the two second connecting strips 93. When the feed piece 6 is driven by the electric push rod 4 to slide from the inside to the outside of the preparation box 2, the preparation box 2 will synchronously drive the L-shaped pull strip 91 to move, so that the L-shaped pull strip 91 simultaneously acts on the connecting axis of the first connecting strip 92 and the second connecting strip 93, so that the first connecting strip 92 rotates downward around its upper vertex and rotates and squeezes on the upper vertex of the second connecting strip 93, so that the second connecting strip 93 pushes the scraping frame plate 94 downward, so that the sliding scraping frame plate 94 scrapes off the solder powder adsorbed on the inner wall of the preparation box 2.

[0037] Reference Figure 6-Figure 8 As shown, the L-shaped pull strip 91 is composed of a fixed strip 911 and a slide groove frame 912, wherein the fixed strip 911 is symmetrically fixedly installed on the inner side of the sliding frame 5 by bolts, and the slide groove frame 912 is vertically fixed to the corresponding fixed strip 911, and the connecting axis of the first connecting strip 92 and the second connecting strip 93 is located in the slide groove frame 912, and the sliding frame 5 drives the fixed strip 911 and the slide groove frame 912 to slide, and the slide groove frame 912 squeezes the connecting axis of the first connecting strip 92 and the second connecting strip 93, so that the second connecting strip 93 rotates around the connecting axis at its upper end, and cooperates with the first connecting strip 92 to rotate downward, so that the second connecting strip 93 rotates and extends downward, and at this time, the connecting axis at the lower end of the second connecting strip 93 that moves downward squeezes the scraping frame plate 94, thereby driving the scraping frame plate 94 to move downward and scrape off the solder powder retained or adsorbed on the inner wall of the preparation box 2.

[0038] When a round of solder powder is prepared, the electric push rod 4 is activated. The electric push rod 4 will extend and retract outward through the telescopic rod thereon and push the feed pipe 62. The pushed feed pipe 62 will move in the direction away from the preparation box 2 under the guidance of the guide frame 61. At this time, the moving feed pipe 62 will also drive the vibrating member 7 and the sliding frame 5 to move together. When the feed pipe 62 moving in the direction away from the preparation box 2 drives the dripping frame 64 to contact the cleaning scraper 8, the cleaning scraper 8 will fit the bottom side of the dripping frame 64 and scrape the dripping port, thereby cleaning the tin liquid block solidified at the dripping port. The solidified tin liquid block after cleaning can be recycled again, reducing unnecessary waste of metal tin liquid, and when the entire feed piece 6 drives the sliding frame 5 to move in the direction away from the preparation box 2, the moving sliding frame 5 will pull the two L-shaped pull strips 91 on its inner side, and the pulled L-shaped pull strips 91 will gradually move from The preparation box 2 moves from the inside to the outside, at this time, the L-shaped pull bar 91 will be squeezed on the connecting axis of the first connecting bar 92 and the second connecting bar 93 through the slide frame 912 thereon. After the lower end connecting axis of the first connecting bar 92 is pulled, the first connecting bar 92 will rotate downward around the rotating axis at its upper end. After the rotation, the lower end connecting axis of the first connecting bar 92 will adapt to the slide frame 912 and continue to slide down inside it. At this time, the first connecting bar 92 will squeeze the connecting axis of the second connecting bar 93 to move downward, and the squeezed second connecting bar 93 will rotate and extend downward around the connecting axis at its upper end, thereby squeezing and pushing the scraping frame plate 94 to slide vertically downward in the preparation box 2, so that the scraping frame plate 94 is used to scrape off the solder powder retained or adsorbed on the inner wall of the preparation box 2, so that the user can directly collect the solder powder, thereby further improving the preparation efficiency of the solder powder by saving manual scraping work.

[0039] Example 3: Based on Example 2, refer to Figure 1 , Figure 5 , Figure 6 and Fig. 9As shown, it also includes a rejection component 10, which includes: a bottom plate 101, a sliding opening is provided on the front side of the base frame 1, and the bottom plate 101 is slidably installed inside the base frame 1 through the sliding opening; a connecting plate 102, which is vertically and fixedly connected to the bottom plate 101 located on the outer side of the base frame 1, and the top of the connecting plate 102 is fixedly installed on the front side of the sliding frame 5 by bolts, and when the connecting plate 102 is driven by the sliding frame 5 to move in a direction away from the preparation box 2, the connecting plate 102 will drive the bottom plate 101 to be pulled out of the base frame 1; a rejection knife block 103, which is fixedly installed at the bottom of the front side of the frame of the preparation box 2, and the blade of the rejection knife block 103 is facing the inside of the preparation box 2 and tilted downward, and the blade of the rejection knife block 103 is aligned with the upper side of the bottom plate 101. When the bottom plate 101 moves relative to the rejecting knife block 103, the rejecting knife block 103 will remove and clean the tin liquid that has fallen on the bottom plate 101 and solidified, so as to subsequently recycle the solidified tin liquid after cleaning. The cleaning scraper 8 and the rejecting knife block 103 are both detachably mounted on the frame of the preparation box 2. According to the use of the cleaning scraper 8 and the rejecting knife block 103, the cleaning scraper 8 and the rejecting knife block 103 can be disassembled, cleaned or replaced at any time, so that the cleaning scraper 8 can effectively clean the solidified tin liquid at the dripping port of the dripping frame 64, ensuring that the dripping frame 64 smoothly drips the tin liquid for preparation, and the rejecting knife block 103 can scrape and recycle the tin liquid that has fallen on the bottom plate 101, saving the workload of manually scraping the solidified tin liquid that needs to be scraped off later.

[0040] When the electric push rod 4 drives the feeding member 6 and the sliding frame 5 to move together in the direction away from the preparation box 2, the moving sliding frame 5 will be pressed on the upper end of the connecting plate 102, and the connected plate 102 after being pressed will drive the bottom plate 101 to move in the direction away from the preparation box 2, so that the connecting plate 102 is continuously pulled out from the base frame 1. Since the rejecting knife block 103 is always fixed in the preparation box 2, the bottom plate 101 will move relative to the rejecting knife block 103 when being pulled out. The scraper block 103 moves, and at this time the scraper block 103 will contact and scrape the upper surface of the base plate 101, thereby scraping off the tin liquid clots that have fallen on the base plate 101, and as the base plate 101 is completely pulled out of the base frame 1, all the tin liquid clots that have fallen on the base plate 101 are scraped off, saving the trouble of manually cleaning the tin liquid clots later. The scraped tin liquid clots can be collected, and after the collected tin liquid clots are hot-melted again, they can be recycled and used to prepare solder powder.

[0041] The embodiments of the present invention have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or technical improvements in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A device for preparing ultrafine solder powder, comprising: A base frame (1) serving as a load-bearing carrier for the entire preparation device; A preparation box (2) is fixedly mounted on the base frame (1); the front side of the preparation box (2) is an opening, and the left side, right side and rear side of the preparation box (2) are all box side panels; an ultrasonic atomizer (3) is mounted on the top of the preparation box (2); the ultrasonic atomizer (3) is used to atomize molten tin liquid to prepare solder powder; the ultrasonic atomizer (3) comprises a vibrator (31), a connecting rod (32) and an atomizing disc tool head (33); the vibrator (31) is fixedly mounted on the top of the preparation box (2); the connecting rod (32) passes through the top of the preparation box (2) and is connected to the vibrator (31); the atomizing disc tool head (33) is fixedly mounted on the connecting rod (3 2) lower end, the atomizing disc tool head (33) is used for preparing solder powder; the electric push rod (4) is fixedly mounted on the top of the preparation box (2); the sliding frame (5) is arranged at the front opening of the preparation box (2); it is characterized in that the feed piece (6) passes through and is fixedly mounted on the sliding frame (5), the top of the feed piece (6) is connected to the telescopic rod of the electric push rod (4), and the feed piece (6) is used to conveniently pour the tin liquid onto the atomizing disc tool head (33); the vibrating piece (7) is fixedly mounted on the feed piece (6), the vibrating piece (7) passes through the sliding frame (5), and the vibrating piece (7) is used to vibrate the feed piece (6) to accelerate the feeding rate of the molten tin liquid.

2. The device for preparing ultrafine solder powder according to claim 1, characterized in that: The feed member (6) comprises: a guide frame (61) slidably mounted on the top side of the preparation box (2); a feed pipe (62) obliquely penetrated and fixedly mounted on the sliding frame (5), the feed pipe (62) and the guide frame (61) being connected to form a whole, and the feed pipe (62) being connected to the telescopic rod of the electric push rod (4), the guide frame (61) being used to cooperate with the electric push rod (4) and to guide the feed pipe (62) horizontally; a feed port (63) connected to the opening at the upper end of the feed pipe (62); and a drip frame (64) connected to the opening at the lower end of the feed pipe (62), the drip frame (64) having at least two drip ports at the bottom, and the drip frame (64) being used to adapt to the atomizing disc tool head (33).

3. The device for preparing ultrafine solder powder according to claim 2, characterized in that: The drip frame (64) is a fan-shaped frame structure as a whole. A plurality of drip openings for dripping tin liquid are evenly arranged on the bottom side of the drip frame (64). The connecting rod (32) is located at the center point of the drip frame (64) and does not contact each other. The plurality of drip openings on the bottom side of the drip frame (64) are vertically aligned with the atomizing disc tool head (33).

4. The device for preparing ultrafine solder powder according to claim 3, characterized in that: The vibrating member (7) comprises: a vibrating frame (71) fixedly arranged on the inclined tube wall of the feeding tube (62), and the vibrating frame (71) and the feeding tube (62) jointly penetrate the sliding frame (5); a vibrating motor (72) arranged on the top of the vibrating frame (71), and the vibrating motor (72) is used to drive the vibrating frame (71) to vibrate, thereby vibrating the feeding tube (62) with the vibrating vibrating frame (71), so that the injected hot molten tin liquid flows down quickly in the feeding tube (62).

5. The device for preparing ultrafine solder powder according to claim 4, characterized in that: A cleaning scraper (8) is arranged in the frame of the preparation box (2); the blade of the cleaning scraper (8) is tilted upward and fixedly mounted on the front side of the preparation box (2); the blade height of the cleaning scraper (8) is horizontally aligned with the lower side of the drip frame (64); and the cleaning scraper (8) is used to scrape off solidified tin liquid at the dripping port on the bottom side of the dripping frame (64).

6. The device for preparing ultrafine solder powder according to claim 5, characterized in that: A scraping assembly (9) is arranged in the middle of the frame of the preparation box (2), and the scraping assembly (9) comprises: an L-shaped pull bar (91), which is arranged as two symmetrical left and right pull bars and is respectively fixedly mounted on the inner side of the sliding frame (5); a first connecting bar (92), which is arranged as two and is respectively symmetrically rotatably mounted on the top of the front side of the frame of the preparation box (2), and the lower end of the first connecting bar (92) is rotatably connected to the end of the L-shaped pull bar (91); and a second connecting bar (93), which is arranged as two and is respectively symmetrically mounted on the inner side of the sliding frame (5). The first connecting strip (92) and the second connecting strip (93) are symmetrically rotatably mounted on the lower end of the first connecting strip (92), and the connecting shafts of the first connecting strip (92) and the second connecting strip (93) are both rotatably connected to the rear end of the L-shaped pull strip (91); a scraping frame plate (94) is slidably arranged on the inner side of the frame of the preparation box (2), and the scraping frame plate (94) is used to scrape off the solder powder adsorbed on the inner wall of the preparation box (2) after preparation, and the scraping frame plate (94) is rotatably connected to the lower end of the second connecting strip (93).

7. The device for preparing ultrafine solder powder according to claim 6, characterized in that: The L-shaped pull bar (91) is composed of a fixed bar (911) and a slide groove frame (912), wherein the fixed bar (911) is symmetrically fixedly installed on the inner side of the sliding frame (5), and the slide groove frame (912) is vertically fixedly connected to the corresponding fixed bar (911), and the connecting axis of the first connecting bar (92) and the second connecting bar (93) is located in the slide groove frame (912), and the sliding frame (5) drives the fixed bar (911) and the slide groove frame (912) to slide, and the slide groove frame (912) is pressed on the connecting axis of the first connecting bar (92) and the second connecting bar (93), so that the second connecting bar (93) rotates downward around the connecting axis at its upper end and extends, thereby driving the scraping frame plate (94) to move downward and scrape off the solder powder.

8. The device for preparing ultrafine solder powder according to claim 7, characterized in that: A rejecting assembly (10) is arranged at the bottom of the frame of the preparation box (2), and the rejecting assembly (10) comprises: a bottom plate (101), a sliding opening is arranged on the front side of the base frame (1), and the bottom plate (101) is slidably mounted inside the base frame (1) through the sliding opening; a connecting plate (102) is vertically and fixedly connected to the bottom plate (101), and the top of the connecting plate (102) is fixedly mounted on the front side of the sliding frame (5), and the sliding frame (5) drives the connecting plate (102) to move away from the preparation box (2). When the preparation box (2) moves in the direction of the connection plate (102), the bottom plate (101) will be driven to be drawn out from the base frame (1); a removal knife block (103) is fixedly mounted on the front bottom of the frame of the preparation box (2), the blade of the removal knife block (103) is facing the inside of the preparation box (2) and tilted downward, and the blade of the removal knife block (103) is in contact with the upper side of the bottom plate (101), and the removal knife block (103) is used to scrape off the solidified tin liquid blocks that fall onto the bottom plate (101).

9. The device for preparing ultrafine solder powder according to claim 8, characterized in that: The cleaning scraper (8) and the rejecting knife block (103) are both detachably mounted on the frame of the preparation box (2); the cleaning scraper (8) and the rejecting knife block (103) can be disassembled, cleaned or replaced at any time according to the usage of the cleaning scraper (8) and the rejecting knife block (103).