Automatic equipment for optimizing end sealing quality of MLCC ceramic capacitor

By designing an automated device for MLCC ceramic capacitors, the problem of low end capping quality caused by rough end-end capping is solved, and efficient optimization of end-end capping of ceramic capacitors is achieved, which significantly improves the quality and stability of the product.

CN119703432AActive Publication Date: 2025-03-28SUZHOU AICHUANG CLOUD TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202510079682.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-18
Publication Date
2025-03-28
Estimated Expiration
2045-01-18

AI Technical Summary

Technical Problem

The end surface of the preliminarily processed ceramic chip is relatively rough, which affects the welding performance of the metal layer, resulting in defects such as hollows, cracks, and offsets after the end capping, which reduces the end capping quality.

Method used

Design an automated equipment with optimized end capping quality of MLCC ceramic capacitors, including processing tables, clamps, pickup mechanisms and cutting components. By surface modification of the ends of the ceramic chip, metal impurities and dust are removed to ensure flatness and welding performance.

Benefits of technology

Through the use of automation equipment, the end capping quality of MLCC ceramic capacitors is significantly improved, the occurrence of defects such as hollows, cracks, and offsets is reduced, and the efficient production of ceramic capacitors is ensured.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses automatic equipment for optimizing the end sealing quality of an MLCC ceramic capacitor, and relates to the field of ceramic capacitor end sealing treatment, the automatic equipment comprises an equipment box body, a conveying area and a processing area are arranged in the equipment box body, a conveying frame is arranged at the bottom end of the conveying area, and a tray is arranged at the top of the conveying frame; the machining table is arranged in the center of the interior of the machining area, a control box is arranged at the top of the machining table, two sets of symmetrically-distributed clamping blocks are arranged above the control box, and a control mechanism is arranged in the control box; the guide frame is arranged in the equipment box body, a third electric push rod is arranged on the guide frame, and a picking mechanism is arranged at the bottom of the third electric push rod; and the cutting assemblies are symmetrically arranged in the machining area, and each cutting assembly comprises a guide rail and a laser tool bit. According to the automatic equipment for optimizing the end sealing quality of the MLCC ceramic capacitor, surface modification can be carried out on the end parts of a plurality of ceramic chips at the same time, so that the flatness and the welding performance of the ceramic chips are ensured, and the end sealing quality of the MLCC ceramic capacitor is improved.
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Description

Technical Field

[0001] The present invention relates to the technical field of ceramic capacitor end-capping processing, and in particular to automated equipment for optimizing the end-capping quality of MLCC ceramic capacitors. Background Art

[0002] MLCC is composed of multiple layers of ceramic dielectric diaphragms, which are stacked together in a staggered manner and sintered at high temperature to form a ceramic chip, and a metal layer is sealed at both ends of the chip as an electrode. MLCC products are small in size and high in precision, which is convenient for efficient assembly by automatic placement machines and is suitable for many electronic devices such as communications, computers, household appliances, and instruments.

[0003] During the process of sealing the two ends of the MLCC ceramic capacitor, the surface of the ceramic chip end is relatively rough after the initial processing, and there are problems such as metal impurities, dust or scratches. During the sealing, the insufficient flatness of the ceramic chip end affects the welding performance of the metal layer, which will cause the MLCC ceramic capacitor to have defects such as voids, cracks, and offsets after sealing, reducing the sealing quality of the MLCC ceramic capacitor and causing quality problems such as ceramic damage or exposed electrodes in subsequent process products. Summary of the invention

[0004] Technical problem to be solved: The surface of the ceramic chip end after preliminary processing is relatively rough, which affects the welding performance of the metal layer, resulting in defects such as voids, cracks, and offsets in the MLCC ceramic capacitor after sealing, reducing the sealing quality of the MLCC ceramic capacitor.

[0005] In view of the deficiencies in the prior art, the present invention provides an automated device for optimizing the sealing quality of MLCC ceramic capacitors, thereby solving the technical problems mentioned in the background technology.

[0006] Technical solution:

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0008] An automated device for optimizing the sealing quality of MLCC ceramic capacitors, comprising: an equipment box, wherein a conveying area and a processing area are arranged inside the equipment box, wherein the conveying area is located in front of the processing area, and a conveying frame is arranged at the bottom of the conveying area, a tray is arranged on the top of the conveying frame, ceramic chips distributed in a rectangular array are supported on the tray, and a limit baffle is arranged above the conveying frame and near the left end;

[0009] A processing table is arranged at the inner center of the processing area, a control box is arranged on the top of the processing table, two groups of clamping blocks symmetrically distributed front and back are arranged above the control box, each of the clamping blocks is rotatably connected to the control box, a control mechanism for pushing the clamping blocks to rotate 180° is arranged inside the control box, the control mechanism includes a control frame, a connecting plate and an adjusting plate, the control frame is slidably arranged inside the control box, the connecting plate is fixedly connected to the clamping blocks, and the two ends of the adjusting plate are respectively rotatably connected to the control frame and the connecting plate;

[0010] A guide frame is arranged inside the equipment box, and a third electric push rod is slidably connected to the guide frame. A picking mechanism is installed at the bottom of the third electric push rod, which is used to move the entire group of ceramic chips on the tray to the inner side of the clamping block for fixing. The picking mechanism includes a vacuum suction plate, and two groups of suction pipes symmetrically distributed front and back are arranged at the bottom of the vacuum suction plate. Each of the suction pipes corresponds to the clamping block respectively, and a suction cup is arranged at the bottom of the suction pipe, and a movable head rotatably connected to the vacuum suction plate is arranged at the top of the suction pipe;

[0011] The cutting assembly is symmetrically arranged inside the processing area. The cutting assembly includes guide rails and laser cutter heads symmetrically arranged on the front and rear sides of the control box. A slide seat is slidably connected to the guide rails, and the laser cutter head is installed on the slide seat.

[0012] In one possible implementation, a partition is provided between the conveying area and the processing area, and there is space for the picking mechanism to move between the top of the partition and the inner top wall of the equipment case, the front inner wall of the equipment case is a hollow structure, and a control system is provided inside it, a display screen is installed on the front side of the equipment case and near the top, a number of evenly distributed control buttons are provided at the bottom of the display screen, and heat dissipation holes are provided on the side walls of the equipment case and on the left and right sides of the processing area.

[0013] In a possible implementation, a conveyor belt is installed on the inner side of the conveyor frame and near the top, a first motor for driving the conveyor belt is installed on the left front side of the conveyor frame, the tray is placed on the upper surface of the conveyor belt, a rectangular array of storage slots are arranged on the top of the tray, each of the ceramic chips is arranged inside the storage slot, movable feet are arranged at both ends of the limit baffle, the movable feet are rotatably connected to the inner wall of the equipment box, and a control motor for driving the movable feet to rotate 90° is installed in the front inner wall of the equipment box.

[0014] In one possible implementation, a chip removal box is installed on the inner bottom wall of the equipment box and below the processing table, and chip feed openings are provided at the top of the chip removal box and on the front and rear sides of the processing table. A protective cover is provided on the top of the chip removal box and outside the chip feed opening, and the top end of the protective cover is located between the laser cutter head and the slide.

[0015] In a possible implementation, a support plate is installed on the top of the control box, the clamping blocks are symmetrically arranged in an array above the support plate, a control shaft rotatably connected to the support plate is provided at the bottom center of the clamping block, the end of the connecting plate is fixedly connected to the bottom of the control shaft, the control frame is slidably arranged inside the control box, the top of the control frame is provided with control grooves symmetrically distributed in the front and back, the inner side of the control groove is provided with connecting holes distributed in an array, the adjustment plate is arranged in an array on the inner side of the control groove, one end of the adjustment plate is rotatably connected to the connecting hole through a rotating shaft, the other end of the adjustment plate is rotatably connected to the connecting plate through a rotating shaft, and a first electric push rod for pushing the control frame to slide is installed on the left side of the control box.

[0016] In a possible implementation, the top of the clamp block is a bilaterally symmetrical opening structure, anti-slip pads are provided on the left and right side walls of the clamp block, and spring clips are installed on the side walls of the clamp block near the bottom end.

[0017] In a possible implementation, a positioning plate symmetrically distributed front to back is provided above the control box and between the front and rear groups of clamping blocks, a limit frame is provided at both left and right ends of the positioning plate, the bottom of the limit frame is integrally formed with the upper surface of the control box, a first spring is installed between the limit frame and the positioning plate, the opposite side of the bottom of the positioning plate is in the shape of an inclined surface, an accommodating groove penetrating up and down is provided on the control frame and near the center, a wedge-shaped push block is provided on the inner side of the accommodating groove, the wedge-shaped push block penetrates the support plate, and the top of the wedge-shaped push block contacts the inclined surface of the bottom of the positioning plate, and a second electric push rod for pushing the wedge-shaped push block to move up and down is installed at the bottom of the control box and on the inner side of the accommodating groove.

[0018] In a possible implementation, the guide frame is fixedly connected to the inner top wall of the equipment case, the top of the third electric push rod is provided with a guide block slidably connected to the guide frame, the top of the guide frame is provided with a rotatable first screw rod, the first screw rod passes through the guide block and is threadedly connected to the guide block, the top of the guide frame is provided with a second motor that drives the first screw rod to rotate, the push rod end of the third electric push rod is fixedly connected to the top of the vacuum suction plate, a vacuum generator is installed at the top of the equipment case and near the left end, and a connecting pipe is provided between the vacuum generator and the vacuum suction plate for connection.

[0019] In a possible implementation, the movable head is rotatably connected to the bottom of the vacuum suction plate, and a sealing ring is arranged between the movable head and the vacuum suction plate, the outer wall of the movable head is provided with triangular edges symmetrically distributed front and back, a locking seat is installed at the bottom of the vacuum suction plate and near the center, a left-right symmetrical high-definition camera is arranged at the bottom of the locking seat, the inner side of the locking seat is slidably connected with a locking plate symmetrically distributed front and back, a plurality of triangular grooves corresponding to the triangular edges are arranged on the locking plate, the interior of the locking seat is provided with locking grooves distributed in an array, the inner side of the locking groove is slidably connected with a sliding shaft symmetrical front and back, the ends of the front and rear two groups of sliding shafts are respectively fixedly connected to the locking plates on the front and rear sides, and a second spring is arranged inside the locking groove and between the sliding shafts on the front and rear sides.

[0020] In one possible implementation, a laser generator is installed on the inner top wall of the equipment box near the right end, and the laser generator is connected to the two groups of laser cutter heads through a line. A rotatable second screw rod is provided on the guide rail, and the second screw rod passes through the slide seat and is threadedly connected to the slide seat. A third motor for driving the second screw rod to rotate is installed on the left side of the guide rail.

[0021] Beneficial effects:

[0022] In this solution, by providing a processing table, a clamping block, a picking mechanism and a cutting assembly, the end of the ceramic chip can be surface modified to remove rough materials such as metal impurities and dust that exist in the ceramic chip after preliminary processing, so as to ensure the flatness and welding performance of the ceramic chip, thereby improving the end sealing quality of the MLCC ceramic capacitor.

[0023] In this solution, by providing two groups of symmetrically distributed clamps and picking mechanisms at the front and rear, and cooperating with two groups of laser cutter heads, two groups of ceramic chips on the tray can be picked up at the same time for surface treatment. In addition, through the cooperation of the control frame, the connecting plate and the adjustment plate, multiple ceramic chips can be turned at the same time to ensure that the ceramic chips have a high surface treatment efficiency, so that the equipment has a high end-capping optimization efficiency for MLCC ceramic capacitors.

[0024] In this solution, by providing a positioning plate and a wedge-shaped push block, when the wedge-shaped push block moves upward, the positioning plate can align the ceramic chip on the clamping block, and the movable head can be locked and fixed by the cooperation of the locking seat, the locking plate and the triangular edge, ensuring that the picking mechanism has high stability when picking up the ceramic chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings.

[0026] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0027] Figure 2 It is a schematic diagram of the internal structure of the equipment box of the present invention;

[0028] Figure 3 This is one of the schematic diagrams of the conveyor structure of the present invention;

[0029] Figure 4 This is the second schematic diagram of the conveyor structure of the present invention;

[0030] Figure 5 It is a side view of the main structure of the present invention;

[0031] Figure 6 It is a structural schematic diagram of the processing area of ​​the present invention;

[0032] Figure 7 It is a schematic diagram of the processing table structure of the present invention;

[0033] Figure 8 It is a schematic diagram of the structure of the control box of the present invention;

[0034] Fig. 9 It is a schematic diagram of the control frame structure of the present invention;

[0035] Fig.10 It is a schematic diagram of the clamping block structure of the present invention;

[0036] Fig.11 It is a schematic diagram of the alignment mechanism of the present invention;

[0037] Fig.12 It is a schematic diagram of the guide frame structure of the present invention;

[0038] Fig.13 It is a schematic diagram of the structure of the vacuum suction plate of the present invention;

[0039] Fig.14 It is a schematic diagram of the locking seat structure of the present invention;

[0040] Fig.15 It is a schematic diagram of the cutting assembly of the present invention.

[0041] Legend: 1. Equipment box; 11. Conveying area; 12. Processing area; 13. Partition; 14. Display screen; 15. Control button; 16. Heat dissipation hole; 2. Conveying rack; 21. Conveying belt; 211. First motor; 22. Tray; 221. Storage slot; 23. Ceramic chip; 24. Limit baffle; 241. Movable foot; 242. Control motor; 3. Processing table; 31. Chip box; 32. Chip inlet; 33. Protective cover; 4. Control box; 41. Support plate; 42. Clamp block; 421. Anti-skid pad; 422. Spring clip; 43. Control rack; 431. Control slot; 432. Connecting hole; 44. First electric push rod; 45. Control shaft; 451. Connecting plate; 46. Adjustment Section plate; 47, accommodating groove; 5, positioning plate; 51, limiting frame; 52, first spring; 53, wedge-shaped push block; 54, second electric push rod; 6, guide frame; 61, third electric push rod; 611, guide block; 62, vacuum suction plate; 621, vacuum generator; 622, connecting pipe; 63, suction pipe; 631, suction cup; 64, movable head; 641, triangular edge; 65, first screw rod; 651, second motor; 7, locking seat; 71, high-definition camera; 72, locking plate; 721, triangular groove; 73, locking groove; 74, sliding shaft; 75, second spring; 8, guide rail; 81, sliding seat; 82, laser cutter head; 83, laser generator; 84, second screw rod; 85, third motor. DETAILED DESCRIPTION

[0042] The preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention can be implemented in various forms, so the present invention is not limited to the embodiments described below. In addition, in order to more clearly describe the present invention, components that are not connected with the invention will be omitted from the drawings.

[0043] The technical solution in the embodiment of the present application is to solve the problems of the above-mentioned background technology, and the overall idea is as follows:

[0044] Embodiment 1:

[0045] This embodiment introduces the specific structure of an automated device for optimizing the sealing quality of MLCC ceramic capacitors.

[0046] like Figure 1-Figure 15 As shown, it comprises: an equipment box 1, a conveying area 11 and a processing area 12 are arranged inside the equipment box 1, the conveying area 11 is located in front of the processing area 12, and a conveying frame 2 is arranged at the bottom end of the conveying area 11, a tray 22 is arranged on the top of the conveying frame 2, and ceramic chips 23 distributed in a rectangular array are supported on the tray 22, and a limit baffle 24 is arranged above the conveying frame 2 and near the left end;

[0047] The processing table 3 is arranged at the inner center of the processing area 12. A control box 4 is arranged on the top of the processing table 3. Two groups of clamping blocks 42 are arranged above the control box 4 and are symmetrically distributed front and back. Each clamping block 42 is rotatably connected to the control box 4. A control mechanism for pushing the clamping block 42 to rotate 180° is arranged inside the control box 4. The control mechanism includes a control frame 43, a connecting plate 451 and an adjusting plate 46. The control frame 43 is slidably arranged inside the control box 4. The connecting plate 451 is fixedly connected to the clamping block 42. The two ends of the adjusting plate 46 are respectively rotatably connected to the control frame 43 and the connecting plate 451.

[0048] The guide frame 6 is arranged inside the equipment box 1, and a third electric push rod 61 is slidably connected to the guide frame 6. A picking mechanism is installed at the bottom of the third electric push rod 61, which is used to move the entire group of ceramic chips 23 on the tray 22 to the inner side of the clamping block 42 for fixing. The picking mechanism includes a vacuum suction plate 62, and two groups of suction pipes 63 symmetrically distributed front and back are arranged at the bottom of the vacuum suction plate 62. Each suction pipe 63 corresponds to the clamping block 42 respectively. A suction cup 631 is arranged at the bottom of the suction pipe 63, and a movable head 64 rotatably connected to the vacuum suction plate 62 is arranged at the top of the suction pipe 63;

[0049] The cutting assembly is symmetrically arranged inside the processing area 12. The cutting assembly includes a guide rail 8 and a laser cutter head 82 symmetrically arranged on the front and rear sides of the control box 4. A slide seat 81 is slidably connected to the guide rail 8, and the laser cutter head 82 is installed on the slide seat 81.

[0050] When producing MLCC ceramic capacitors, the conveyor rack 2 is connected to the production line of MLCC ceramic capacitors, and the ceramic chips 23 in the tray 22 can be conveyed to the inside of the conveying area 11, and the limit baffle 24 is used to limit the left end of the conveying area 11 to ensure that the ceramic chips 23 are aligned with the leftmost suction pipe 63, so that the picking mechanism can move the ceramic chips 23 to the clamping block 42;

[0051] After the limit baffle 24 blocks and limits the tray 22, the third electric push rod 61 slides along the guide frame 6 and drives the picking mechanism to move forward and backward. Through the cooperation of the vacuum suction plate 62, the suction tube 63 and the suction cup 631, the two groups of ceramic chips 23 can be moved from the tray 22 to the clamping block 42 for fixation. After that, the cutting assembly is moved along the guide rail 8, and the laser cutter head 82 can be used to laser cut one side of the ceramic chip 23, so as to perform surface modification on the end of the ceramic chip 23 to remove metal impurities, dust and other rough substances on the surface of the original component to ensure its flatness and welding performance, thereby improving the end sealing quality of the MLCC ceramic capacitor.

[0052] After the end of the ceramic chip 23 close to the guide rail 8 is surface treated, the control frame 43 is pushed to slide inside the control box 4, and the transmission is carried out through the connecting plate 451 and the adjustment plate 46, pushing the clamp 42 to rotate 180°, so that the two groups of ceramic chips 23 are steered and adjusted at the same time, which is convenient for processing the end of the ceramic chip 23 on the other side, thereby improving the flatness of the two ends of the ceramic chip 23 and avoiding defects such as voids, cracks, and protruding particles when the MLCC ceramic capacitor is sealed.

[0053] like Figure 2 As shown, a partition 13 is arranged between the conveying area 11 and the processing area 12, and there is a space for the picking mechanism to move between the top of the partition 13 and the inner top wall of the equipment box 1. The partition 13 can avoid interfering with the movement of the picking mechanism while installing the front cutting component.

[0054] The front inner wall of the equipment case 1 is a hollow structure, and a control system is arranged inside it, which can be used to control the equipment as a whole. A display screen 14 is installed on the front side of the equipment case 1 and near the top. At the same time, a high-definition camera 71 is also installed at the bottom of the vacuum suction plate 62. The display screen 14 can display the picture taken by the high-definition camera 71 in real time, so as to observe the position and surface condition of the ceramic chip 23 during the processing. A number of evenly distributed control buttons 15 are arranged at the bottom of the display screen 14 to facilitate the setting of the equipment. Heat dissipation holes 16 are provided on the side walls of the equipment case 1 and on the left and right sides of the processing area 12 to dissipate heat from the processing area 12.

[0055] like Figure 2-Figure 4 As shown, a conveyor belt 21 is installed on the inner side of the conveyor frame 2 and near the top, a first motor 211 for driving the conveyor belt 21 is installed on the left front side of the conveyor frame 2, a tray 22 is placed on the upper surface of the conveyor belt 21, a rectangular array of storage grooves 221 are arranged on the top of the tray 22, and each ceramic chip 23 is respectively arranged inside the storage groove 221, and the conveyor belt 21 is connected to the production line of MLCC ceramic capacitors. When the first motor 211 is running, it can drive the conveyor belt 21 to move and continuously transport the tray 22 to the inside of the equipment box 1, so as to optimize the ceramic chips 23 stored on the tray 22 as a whole group.

[0056] Both ends of the limit baffle 24 are provided with movable feet 241, which are rotatably connected to the inner wall of the equipment box 1. A control motor 242 for driving the movable foot 241 to rotate 90° is installed in the front inner wall of the equipment box 1. When the motor 242 drives the movable foot 241 to rotate, the direction of the limit baffle 24 can be controlled. When the limit baffle 24 is facing to the right, the tray 22 on the conveyor belt 21 can be limited and blocked to ensure that the ceramic chip 23 and the straw 63 are located on the same center line. When the limit baffle 24 is facing upward, the tray 22 can be allowed to move to the left, which is convenient for the conveyor belt 21 to transport the ceramic chips 23 in the tray 22 to the next production line.

[0057] In addition, in order to improve the overall control effect of the equipment and improve the efficiency of the picking mechanism in sucking the ceramic chip 23, a pressure sensor can be installed on the limit baffle 24. When the tray 22 contacts the limit baffle 24, the pressure sensor can feed back the signal to the control system to facilitate the control of the picking mechanism to suck the ceramic chip 23 on the tray 22.

[0058] like Figure 5-Figure 7 As shown, a chip removal box 31 is installed on the inner bottom wall of the equipment box 1 and below the processing table 3. Chip feed ports 32 are provided at the top of the chip removal box 31 and on the front and rear sides of the processing table 3. The chips generated during the processing of the ceramic chip 23 can fall into the interior of the chip removal box 31 through the chip feed port 32, so as to collect and process the waste chips. A protective cover 33 is provided on the top of the chip removal box 31 and on the outside of the chip feed port 32, and the top of the protective cover 33 is located between the laser cutter head 82 and the slide 81. The protective cover 33 can block and guide the chips generated during the processing, so as to prevent the chips from splashing outward and facilitate the chips to fall into the chip removal box 31 for collection.

[0059] like Figure 8-Figure 10 As shown, a support plate 41 is installed on the top of the control box 4, and clamping blocks 42 are symmetrically arranged in an array above the support plate 41. A control shaft 45 rotatably connected to the support plate 41 is provided at the bottom center of the clamping block 42, and the end of the connecting plate 451 is fixedly connected to the bottom of the control shaft 45. The control frame 43 is slidably arranged inside the control box 4, and the top of the control frame 43 is provided with control grooves 431 symmetrically distributed in the front and back, and the inner side of the control groove 431 is provided with connecting holes 432 distributed in an array. The adjusting plate 46 is arranged on the inner side of the control groove 431 in an array, and one end of the adjusting plate 46 is rotatably connected to the connecting hole 432 through a rotating shaft, and the other end of the adjusting plate 46 is rotatably connected to the connecting plate 451 through a rotating shaft. A first electric push rod 44 for pushing the control frame 43 to slide is installed on the left side of the control box 4.

[0060] It should be noted that in order to facilitate the connection plate 451 to drive the clamping block 42 to rotate, the width of the control groove 431 is greater than the rotation diameter of the connection plate 451, thereby preventing the connection plate 451 from contacting the inner wall of the control groove 431 during rotation.

[0061] When the first electric push rod 44 is running, it can push the control frame 43 to slide to the right inside the control box 4. During the sliding process, the control frame 43 can drive the end of the adjustment plate 46 to move to the right through the connecting hole 432. At the same time, the rotating shaft of the adjustment plate 46 and the connecting hole 432 rotate with each other, and the adjustment plate 46 and the connecting plate 451 directly rotate with each other. The transmission through the adjustment plate 46 and the connecting plate 451 can drive the clamping block 42 to rotate around the control shaft 45, and then drive the ceramic chip 23 to transmit. When the control frame 43 moves to the maximum distance, the clamping block 42 can be rotated 180°, so that the two ends of the ceramic chip 23 are converted, which is convenient for processing the end face of the ceramic chip 23, thereby optimizing the sealing quality of the MLCC ceramic capacitor.

[0062] In addition, during the steering process, in order to ensure the stability of the ceramic chip 23, the suction cup 631 is always in close contact with the upper surface of the ceramic chip 23, and the top of the suction tube 63 is rotated on the vacuum suction plate 62 through the movable head 64, so that the suction cup 631 and the clamping block 42 cooperate with each other to clamp and control the ceramic chip 23 during the steering process to prevent the ceramic chip 23 from loosening.

[0063] Furthermore, the top of the clamp block 42 is a left-right symmetrical opening structure. When the clamp block 42 clamps the ceramic chip 23, the end of the ceramic chip 23 is located on the outside of the processing table 3, ensuring that other structures will not be affected when the laser cutter head 82 performs end surface processing on the ceramic chip 23. Anti-slip pads 421 are provided on the left and right side walls of the clamp block 42, and spring clips 422 are installed on the side walls of the clamp block 42 and near the bottom. The anti-slip pads 421 and the spring clips 422 cooperate with each other to improve the fixing effect of the clamp block 42 on the ceramic chip 23, thereby improving the stability of the ceramic chip 23.

[0064] like Figure 2 , Figure 12-13As shown, the guide frame 6 is fixedly connected to the inner top wall of the equipment box 1, and a guide block 611 slidably connected to the guide frame 6 is provided on the top of the third electric push rod 61. A rotatable first screw rod 65 is installed on the top of the guide frame 6. The first screw rod 65 passes through the guide block 611 and is threadedly connected to the guide block 611. A second motor 651 that drives the first screw rod 65 to rotate is installed on the top of the guide frame 6. The push rod end of the third electric push rod 61 is fixedly connected to the top of the vacuum suction plate 62. A vacuum generator 621 is installed on the top of the equipment box 1 and near the left end. A connecting pipe 622 is provided between the vacuum generator 621 and the vacuum suction plate 62 for connection. When the vacuum generator 621 is running, vacuum suction can be generated at the bottom of the front and rear groups of suction pipes 63 through the connecting pipe 622 and the vacuum suction plate 62, and the front and rear groups of suction pipes 63 can be independently controlled.

[0065] When the second motor 651 drives the first screw rod 65 to rotate, it can drive the guide block 611 to slide forward and backward along the guide frame 6, and drive the third electric push rod 61 and the picking mechanism to move. When the picking mechanism moves forward to the top of the ceramic chip 23, the third electric push rod 61 drives the vacuum suction plate 62 to move downward, so that the suction cup 631 at the bottom of the suction tube 63 contacts the upper surface of the ceramic chip 23. At this time, the vacuum generator 621 is operated to enable the suction cup 631 to vacuum absorb the ceramic chip 23. After that, the third electric push rod 61 drives the vacuum suction plate 62 to move upward, and the third electric push rod 61 moves backward along the guide frame 6 to the top of the control box 4, so that the third electric push rod 61 pushes the vacuum suction plate 62 to move downward, and the ceramic chips 23 at the bottom of each suction cup 631 can be placed in the clamping block 42, so as to facilitate the end processing of two groups of ceramic chips 23 at the same time.

[0066] The movable head 64 is rotatably connected to the bottom of the vacuum suction plate 62, and a sealing ring is provided between the movable head 64 and the vacuum suction plate 62, so that a good sealing effect is achieved between the top of the suction tube 63, the movable head 64 and the vacuum suction plate 62. When the control frame 43 moves and drives the clamping block 42 to rotate through the connecting plate 451 and the adjusting plate 46, the suction cup 631 maintains close contact with the upper surface of the ceramic chip 23. During the rotation, the top of the suction tube 63 rotates on the vacuum suction plate 62 through the movable head 64. The suction cup 631 and the clamping block 42 cooperate with each other to ensure that the ceramic chip 23 has sufficient stability when turning.

[0067] like Figure 2 and Fig.15As shown, a laser generator 83 is installed on the inner top wall of the equipment box 1 and near the right end. The laser generator 83 is connected to the two groups of laser cutter heads 82 through a line. A rotatable second screw rod 84 is provided on the guide rail 8. The second screw rod 84 passes through the slide seat 81 and is threadedly connected to the slide seat 81. A third motor 85 for driving the second screw rod 84 to rotate is installed on the left side of the guide rail 8. When the laser generator 83 is running, the laser cutter head 82 can perform laser cutting on the surface of the ceramic chip 23. At this time, the third motor 85 is operated to drive the second screw rod 84 to rotate, so that the slide seat 81 slides along the guide rail 8, which can drive the laser cutter head 82 to move, and during the movement, the ends of multiple ceramic chips 23 are surface treated.

[0068] Working principle: When the device is used, first, the conveyor belt 21 is connected to the production line of MLCC ceramic capacitors, and the tray 22 is continuously transported to the conveying area 11 through the conveyor belt 21. When the left end of the tray 22 is in contact with the limit baffle 24 and aligned, the second motor 651 is driven to drive the first screw 65 to rotate, and the guide block 611 is driven to move along the guide frame 6, so that the third electric push rod 61 drives the vacuum suction plate 62 to move forward. At this time, the bottom of the vacuum suction plate 62 can be viewed through the high-definition camera 71. The vacuum suction plate 62 is filmed to control the position of the vacuum suction plate 62, so that the vacuum suction plate 62 drives the suction pipe 63 to the top of the ceramic chip 23. Then, the third electric push rod 61 is operated to drive the vacuum suction plate 62 to move downward, so that the suction cup 631 at the bottom of the suction pipe 63 is in close contact with the upper surface of the ceramic chip 23. Then, the vacuum generator 621 is operated to generate vacuum suction at the bottom of the suction pipe 63 through the connecting pipe 622 and the vacuum suction plate 62, so as to suck the ceramic chip 23, so as to control the movement of the ceramic chip 23.

[0069] Further, the third electric push rod 61 is controlled to drive the vacuum suction plate 62 to move backward, so that the vacuum suction plate 62 moves to the top of the control box 4, and the third electric push rod 61 is operated to drive the vacuum suction plate 62 to move downward, and the ceramic chip 23 at the bottom of the suction cup 631 is placed in the corresponding clamping block 42, and then the third motor 85 is operated to drive the second screw rod 84 to rotate, so that the slide seat 81 drives the laser cutter head 82 to slide to the left, and the end of the ceramic chip 23 can be surface treated by the laser cutter head 82;

[0070] When the laser cutter head 82 moves to the leftmost end, the first electric push rod 44 pushes the control frame 43 to slide, and transmits the information through the connecting plate 451 and the adjustment plate 46, driving the clamp 42 to rotate around the control shaft 45, and driving the ceramic chip 23 to rotate. When the control frame 43 slides to the maximum distance, the two groups of ceramic chips 23 rotate 180° at the same time, so that the unprocessed end of the ceramic chip 23 faces the guide rail 8. After that, the control slide 81 drives the laser cutter head 82 to slide to the right, and the other end of the ceramic chip 23 can be surface treated to remove surface defects of the ceramic chip 23, thereby optimizing the sealing quality of the ceramic chip 23 MLCC ceramic capacitor.

[0071] Embodiment 2:

[0072] This embodiment is an improvement based on the first embodiment:

[0073] like Figure 6-Figure 11 As shown, in order to improve the alignment effect of the ceramic chip 23 on the same side and facilitate the regulation of the end portion to be cut of the ceramic chip 23, a positioning plate 5 symmetrically distributed front and back is arranged above the control box 4 and between the front and rear groups of clamping blocks 42, and a limit frame 51 is arranged at both ends of the left and right ends of the positioning plate 5, and the bottom of the limit frame 51 is integrally formed with the upper surface of the control box 4, and a first spring 52 is installed between the limit frame 51 and the positioning plate 5, and the opposite side of the bottom of the positioning plate 5 is in the shape of an inclined surface, and a receiving groove 47 penetrating up and down is opened on the control frame 43 and near the center, and a wedge-shaped push block 53 is arranged on the inner side of the receiving groove 47, and the wedge-shaped push block 53 penetrates the support plate 41, and the top of the wedge-shaped push block 53 contacts the inclined surface of the bottom of the positioning plate 5, and a second electric push rod 54 for pushing the wedge-shaped push block 53 to move up and down is installed at the bottom of the control box 4 and on the inner side of the receiving groove 47.

[0074] When the wedge-shaped push block 53 is located inside the control box 4, the elastic action of the first spring 52 causes the opposite surfaces of the two sets of positioning plates 5 to contact. At this time, the top of the wedge-shaped push block 53 contacts the bottom inclined surface of the positioning plate 5. When the second electric push rod 54 operates to drive the wedge-shaped push block 53 to move upward, the wedge-shaped push block 53 pushes the positioning plate 5 to move to both sides, so that the positioning plate 5 aligns the ceramic chip 23 on the clamping block 42.

[0075] In addition, in order to prevent the wedge-shaped push block 53 from affecting the left and right sliding of the control frame 43 , the length difference between the accommodating groove 47 and the wedge-shaped push block 53 is greater than the maximum sliding distance of the control frame 43 .

[0076] like Figure 13-14As shown, since the top of the suction tube 63 is rotatably connected to the vacuum suction plate 62 through the movable head 64, in order to prevent the movable head 64 from moving randomly and causing the ceramic chip 23 to rotate, a triangular edge 641 symmetrically distributed front and back is arranged on the outer wall of the movable head 64, and a locking seat 7 is installed at the bottom of the vacuum suction plate 62 and near the center. A left-right symmetrical high-definition camera 71 is arranged at the bottom of the locking seat 7 to facilitate positioning when picking up the ceramic chip 23. A front-to-back symmetrical locking plate 72 is slidably connected to the inner side of the locking seat 7. A number of triangular grooves 721 corresponding to the triangular edge 641 are arranged on the locking plate 72. An array of locking grooves 73 are arranged inside the locking seat 7. A front-to-back symmetrical sliding shaft 74 is slidably connected to the inner side of the locking groove 73. The ends of the front and rear two groups of sliding shafts 74 are fixedly connected to the locking plates 72 on the front and rear sides respectively, and a second spring 75 is arranged inside the locking groove 73 and between the sliding shafts 74 on the front and rear sides.

[0077] When the locking plate 72 is in the locked state, the locking plate 72 is in the locked state, and the locking plate 72 is in the locked state, so that the locking plate 72 is locked and the locking plate 72 is locked.

[0078] Finally, it should be noted that: Obviously, the above embodiments are only examples for clearly explaining the present invention, and are not intended to limit the implementation methods. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from this are still within the scope of protection of the present invention.

Claims

1. An automated device for optimizing the sealing quality of MLCC ceramic capacitors, characterized in that: include: An equipment box (1), wherein a conveying area (11) and a processing area (12) are arranged inside the equipment box (1), wherein the conveying area (11) is located in front of the processing area (12), and a conveying frame (2) is arranged at the bottom end of the conveying area (11), a tray (22) is arranged on the top of the conveying frame (2), and ceramic chips (23) distributed in a rectangular array are supported on the tray (22), and a limit baffle (24) is arranged above and near the left end of the conveying frame (2); A processing table (3) is arranged at the inner center of a processing area (12); a control box (4) is arranged on the top of the processing table (3); two groups of clamping blocks (42) are arranged above the control box (4) and are symmetrically distributed front and back; each of the clamping blocks (42) is rotatably connected to the control box (4); a control mechanism for pushing the clamping blocks (42) to rotate 180° is arranged inside the control box (4); the control mechanism comprises a control frame (43), a connecting plate (451) and an adjusting plate (46); the control frame (43) is slidably arranged inside the control box (4); the connecting plate (451) is fixedly connected to the clamping blocks (42); and the two ends of the adjusting plate (46) are rotatably connected to the control frame (43) and the connecting plate (451); A guide frame (6) is arranged inside the equipment box (1), and a third electric push rod (61) is slidably connected to the guide frame (6). A picking mechanism is installed at the bottom of the third electric push rod (61) for moving the entire group of ceramic chips (23) on the tray (22) to the inner side of the clamping block (42) for fixing. The picking mechanism includes a vacuum suction plate (62), and two groups of suction pipes (63) symmetrically distributed front and back are arranged at the bottom of the vacuum suction plate (62). Each of the suction pipes (63) corresponds to the clamping block (42) respectively. A suction cup (631) is arranged at the bottom of the suction pipe (63), and a movable head (64) rotatably connected to the vacuum suction plate (62) is arranged at the top of the suction pipe (63); A cutting assembly is symmetrically arranged inside a processing area (12), and comprises a guide rail (8) and a laser cutter head (82) symmetrically arranged on the front and rear sides of a control box (4); a slide seat (81) is slidably connected to the guide rail (8), and the laser cutter head (82) is mounted on the slide seat (81).

2. The automated equipment for optimizing the sealing quality of MLCC ceramic capacitors according to claim 1, characterized in that: A partition (13) is provided between the conveying area (11) and the processing area (12), and a space for the picking mechanism to move is provided between the upper part of the partition (13) and the inner top wall of the equipment case (1). The front inner wall of the equipment case (1) is a hollow structure, and a control system is provided inside the hollow structure. A display screen (14) is installed on the front side of the equipment case (1) and near the top. A plurality of evenly distributed control buttons (15) are provided at the bottom of the display screen (14). Heat dissipation holes (16) are provided on the side walls of the equipment case (1) and on both the left and right sides of the processing area (12).

3. The automated equipment for optimizing the sealing quality of MLCC ceramic capacitors according to claim 1, characterized in that: A conveyor belt (21) is installed on the inner side of the conveyor frame (2) and near the top end, and a first motor (211) for driving the conveyor belt (21) is installed on the left front side of the conveyor frame (2). The tray (22) is placed on the upper surface of the conveyor belt (21), and a rectangular array of storage grooves (221) is arranged on the top of the tray (22). Each of the ceramic chips (23) is arranged inside the storage groove (221), and movable feet (241) are arranged at both ends of the limit baffle (24). The movable feet (241) are rotatably connected to the inner wall of the equipment box (1), and a control motor (242) for driving the movable feet (241) to rotate 90 degrees is installed in the front inner wall of the equipment box (1).

4. The automated equipment for optimizing the sealing quality of MLCC ceramic capacitors according to claim 1, characterized in that: A chip removal box (31) is installed on the inner bottom wall of the equipment box (1) and below the processing table (3); a chip feed opening (32) is provided at the top of the chip removal box (31) and on both the front and rear sides of the processing table (3); a protective cover (33) is provided at the top of the chip removal box (31) and on the outside of the chip feed opening (32); and the top end of the protective cover (33) is located between the laser cutter head (82) and the slide seat (81).

5. The automated equipment for optimizing the sealing quality of MLCC ceramic capacitors according to claim 1, characterized in that: A support plate (41) is installed on the top of the control box (4), the clamping block (42) is arranged symmetrically front and back on the top of the support plate (41) in an array shape, a control shaft (45) rotatably connected to the support plate (41) is provided at the bottom center of the clamping block (42), the end of the connecting plate (451) is fixedly connected to the bottom of the control shaft (45), the control frame (43) is slidably arranged inside the control box (4), the top of the control frame (43) is provided with control grooves (431) symmetrically distributed front and back, the inner side of the control groove (431) is provided with connecting holes (432) distributed in an array, the adjusting plate (46) is arranged in an array shape on the inner side of the control groove (431), one end of the adjusting plate (46) is rotatably connected to the connecting hole (432) through a rotating shaft, and the other end of the adjusting plate (46) is rotatably connected to the connecting plate (451) through a rotating shaft, and a first electric push rod (44) for pushing the control frame (43) to slide is installed on the left side of the control box (4).

6. The automated equipment for optimizing the sealing quality of MLCC ceramic capacitors according to claim 5, characterized in that: The top of the clamp block (42) is a bilaterally symmetrical opening structure, and anti-slip pads (421) are arranged on the left and right side walls of the clamp block (42). A spring clip (422) is installed on the side wall of the clamp block (42) near the bottom end.

7. The automated equipment for optimizing the sealing quality of MLCC ceramic capacitors according to claim 1, characterized in that: A positioning plate (5) symmetrically distributed frontward and rearward is arranged above the control box (4) and between the front and rear groups of clamping blocks (42). Limiting frames (51) are arranged at both left and right ends of the positioning plate (5). The bottom of the limiting frame (51) is integrally formed with the upper surface of the control box (4). A first spring (52) is installed between the limiting frame (51) and the positioning plate (5). The opposite side of the bottom of the positioning plate (5) is in the shape of an inclined surface. A receiving groove (47) penetrating up and down is provided on the control frame (43) and near the center. A wedge-shaped push block (53) is provided on the inner side of the receiving groove (47). The wedge-shaped push block (53) penetrates the supporting plate (41), and the top of the wedge-shaped push block (53) contacts the inclined surface of the bottom of the positioning plate (5). A second electric push rod (54) for pushing the wedge-shaped push block (53) to move up and down is installed at the bottom of the control box (4) and on the inner side of the receiving groove (47).

8. The automated equipment for optimizing the sealing quality of MLCC ceramic capacitors according to claim 1, characterized in that: The guide frame (6) is fixedly connected to the inner top wall of the equipment box (1); a guide block (611) slidably connected to the guide frame (6) is arranged at the top of the third electric push rod (61); a rotatable first screw rod (65) is installed at the top of the guide frame (6); the first screw rod (65) passes through the guide block (611) and is threadedly connected to the guide block (611); a second motor (651) for driving the first screw rod (65) to rotate is installed at the top of the guide frame (6); the push rod end of the third electric push rod (61) is fixedly connected to the top of the vacuum suction plate (62); a vacuum generator (621) is installed at the top of the equipment box (1) and near the left end; a connecting pipe (622) is provided between the vacuum generator (621) and the vacuum suction plate (62) for connection.

9. The automated equipment for optimizing the sealing quality of MLCC ceramic capacitors according to claim 8, characterized in that: The movable head (64) is rotatably connected to the bottom of the vacuum suction plate (62), and a sealing ring is arranged between the movable head (64) and the vacuum suction plate (62). The outer wall of the movable head (64) is provided with triangular edges (641) symmetrically distributed front and back. A locking seat (7) is installed at the bottom of the vacuum suction plate (62) and near the center. The bottom of the locking seat (7) is provided with a left-right symmetrical high-definition camera (71). The inner side of the locking seat (7) is slidably connected with a front-right symmetrical locking plate (72). ), the locking plate (72) is provided with a plurality of triangular grooves (721) corresponding to the triangular edges (641), the locking seat (7) is provided with array-distributed locking grooves (73) inside, the inner side of the locking groove (73) is slidably connected with a front-to-rear symmetrical sliding shaft (74), the ends of the front and rear two groups of sliding shafts (74) are respectively fixedly connected to the locking plates (72) on the front and rear sides, and a second spring (75) is provided inside the locking groove (73) and between the sliding shafts (74) on the front and rear sides.

10. The automated equipment for optimizing the sealing quality of MLCC ceramic capacitors according to claim 1, characterized in that: A laser generator (83) is installed on the inner top wall of the equipment box (1) near the right end. The laser generator (83) is connected to the two groups of laser cutter heads (82) through a line. A rotatable second screw rod (84) is provided on the guide rail (8). The second screw rod (84) passes through the slide seat (81) and is threadedly connected to the slide seat (81). A third motor (85) for driving the second screw rod (84) to rotate is installed on the left side of the guide rail (8).

Citation Information

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