Laser cutting equipment for automatic deviation correction of concave-convex surface of wafer

Abstract

According to the laser cutting equipment capable of automatically rectifying the deviation aiming at the concave-convex surface of the wafer, the upper computer controls the movable driving module to drive the cutting unit frame to drive the laser irradiated by the laser generating unit to pass through the object to be cut according to the cutting track; thickness and inclination of all parts of a cutting track and distance between the laser generating unit and each part of the cutting track can be obtained through the range finder, so that when laser slides over all the parts of the cutting track, objective lens distance between the lens groups can be driven through the lens driving module, laser focal length is adjusted, and cutting precision is improved. Laser can stably, completely and intensively fall on all parts of a cutting track, so that to-be-cut objects with uneven surfaces, different thicknesses of all parts and different inclined parts on the surfaces are stably cut; the invention belongs to the technical field of automatic equipment.

Description

Technical Field

[0001] The present invention belongs to the technical field of automation equipment, and in particular relates to a laser cutting device capable of automatically correcting unevenness on a wafer surface. Background Art

[0002] With the rapid rise of industries such as artificial intelligence, intelligent manufacturing, automotive electronics, the Internet of Things, and 5G communications, integrated circuits, as the core hardware of these industries, have also become the core of my country's information technology development. Therefore, the integrated circuit industry has been developing rapidly, and the market scale and technical level are constantly improving. As a type of integrated circuit, chip manufacturing has also become one of the rapidly developing industries.

[0003] Wafer cutting is an important part of the chip manufacturing process, and its technical accuracy and efficiency directly affect the performance and cost of the chip. Compared with mechanical cutting, laser cutting is to irradiate the surface of the wafer with a focused laser beam. The laser energy is absorbed by the wafer material and converted into heat energy, causing the local area to melt or evaporate rapidly, thus forming a cutting channel. This process is fast and precise, and can achieve micron-level cutting accuracy. In addition, since laser cutting is non-contact, it avoids the impact of mechanical stress on the wafer and reduces the generation of cracks and fragments. Therefore, this feature makes laser cutting particularly suitable for processing fragile or ultra-thin wafers. In recent years, with the continuous advancement of laser technology, optical technology, precision machinery technology, etc., the accuracy, speed and stability of wafer cutting equipment have been significantly improved.

[0004] Since traditional wafer cutting is to adsorb the wafer to be cut on a vacuum platform, after manually or actually calibrating the cutting path, the platform is moved along the cutting path or the cutting laser head above is used for cutting. At this time, the height of the laser head is fixed and it only moves parallel to the axis of the cutting path. However, this cutting mode faces two problems: 1. The levelness of the vacuum platform depends on the accuracy of the platform design and assembly, and it cannot be guaranteed to be completely level; 2. In fact, the surface of the wafer is not completely flat, and there may be uneven thickness at different positions on a cutting path. Since the principle of laser cutting is to cut by focusing the laser on the wafer surface, the above two problems will result in the laser focus not necessarily falling completely on the wafer surface during actual cutting, resulting in unstable quality of the cutting path. Summary of the invention

[0005] The purpose of the present invention is to provide a laser cutting device that can automatically correct the unevenness of a wafer surface, so as to solve the technical defects described in the background technology.

[0006] The purpose of the present invention is to provide a laser cutting device which can automatically correct the unevenness of the wafer surface, so as to solve the technical defects of the background technology.

[0007] A laser cutting device for automatically correcting the unevenness of a wafer surface comprises: A cutting platform, which is used to place objects to be cut; A mobile driving module, the mobile driving module drives a cutting machine frame, the cutting machine frame is equipped with a rangefinder and a laser generating unit, the rangefinder is perpendicular to the cutting platform, the laser generating unit is parallel to the rangefinder, so that the laser emitted by the laser generating unit irradiates the object to be cut placed on the cutting platform, and the laser generating unit is parallel to the rangefinder and has a constant distance; The lens group is located between the laser generating unit and the cutting platform. The lens group is provided with a lens driving module. The lens driving module includes a rack and a gear. The rack is fixedly arranged. An array of electromagnets with S poles and N poles arranged in a staggered manner is arranged on the rack. The gear bearing is fixed on the objective lens of the lens group. The gear is meshed with the rack. An array of magnets with S poles and N poles arranged in a staggered manner is arranged on the outer periphery of the gear. By energizing the electromagnets with S poles or N poles respectively, the electromagnets adsorb the magnets on the gears to drive the gears to move on the racks and fix the gears at a certain position on the racks, so that the lens driving module can be used to drive the objective lens distance between the lens groups according to the distance between the rangefinder and the object to be cut, thereby adjusting the laser focal length.

[0008] Based on the above technical solution, the present invention further achieves the following beneficial effects: 1. When the laser slides over the cutting part of the object to be cut, the distance between it and the object to be cut is monitored in advance by the rangefinder, and then the lens driving module is used to drive the objective lens distance between the lens groups, thereby adjusting the laser focal length so that the laser can fall on the cutting part stably, completely and concentratedly, thereby stably cutting the object to be cut with uneven surface, different thickness of each part, and different inclined parts on the surface; 2. Since the array on the rack has several electromagnets with staggered S and N poles, and the outer peripheral array of the gear has several magnets with staggered S and N poles, it is possible to energize the electromagnets with S or N poles respectively. At this time, the suction force of the electromagnet near the gear attracts the magnets near its periphery to drive the gear to move on the rack to a certain position of the rack. When the gear moves, the gear drives the objective lens to move, so as to adjust the distance between multiple objective lenses and the distance between the objective lens and the laser generating unit, thereby adjusting the focal length of the laser; 3. Since the electromagnets on the rack are arranged with S poles and N poles staggered, and the magnets on the periphery of the gear are also arranged with S poles and N poles staggered, the gear can be driven to move on the rack by the principle of repulsion of like magnetic fields of magnets; 4. Since the gear is driven to move on the rack by adsorbing the magnet on the periphery of the gear through the electromagnet, when the gear moves to a certain position of the rack, the magnet can be adsorbed by the electromagnet, thereby fixing the gear to a certain position of the rack, that is, fixing the position of the material objective lens.

[0009] In order to further optimize the above technical solution, it can be optionally combined with one or more of the following implementation methods without conflict.

[0010] In some embodiments, the laser cutting device for automatically correcting the unevenness of the wafer surface further includes: A control system, wherein the control system comprises a host computer and an analog quantity acquisition card, wherein the host computer is signal-connected to the analog quantity acquisition card and a mobile drive module, wherein the analog quantity acquisition card is electrically signal-connected to the rangefinder and the lens drive module respectively, wherein the host computer controls the mobile drive module to drive the cutting machine frame to drive the laser irradiated by the laser generating unit to pass through the object to be cut along a cutting track, and the rangefinder passes over the cutting track in advance, so that the analog quantity acquisition card obtains the distance between the cutting machine frame and a certain part of the cutting track through the rangefinder in advance, so as to calculate the distance between the laser generating unit and the part, the thickness of the part and the inclination of the object to be cut, so that when the laser reaches the part, the time when the laser irradiated by the laser generating unit reaches the part after the rangefinder passes through a certain part of the cutting track is calculated through the distance between the laser generating unit and the rangefinder and the moving speed of the mobile drive module to drive the cutting machine frame, and thereafter, the analog quantity acquisition card controls the lens drive module to drive the objective lens distance between the lens groups, and adjusts the laser focal length; Based on the above technical solution, the present invention further achieves the following beneficial effects: Because before the upper computer controls the mobile drive module to drive the cutting machine frame to drive the laser generating unit to irradiate the laser to pass through the object to be cut along the cutting track, the thickness and inclination of all parts of the cutting track and the distance between the laser generating unit and each part of the cutting track can be obtained through the rangefinder. Therefore, when the laser slides through all parts of the cutting track, the objective lens distance between the lens groups can be driven by the lens drive module, and the laser focal length can be adjusted so that the laser can fall stably, completely and concentratedly on all parts of the cutting track, thereby stably cutting the object to be cut with an uneven surface, different thicknesses in different parts, and different inclinations on the surface.

[0011] In some embodiments, the electromagnet is electrically connected to the analog quantity acquisition card, and the analog quantity acquisition card is used to separately and independently energize the electromagnet located near the gear; Based on the above technical solution, the present invention further achieves the following beneficial effects: 1. Since the analog quantity acquisition card is used to energize the electromagnets located near the gears separately and independently, it is possible to more stably and accurately push the gears to a certain position of the rack through the attraction or repulsion of the magnetic field of the electromagnets near the gears, and stably fix the gears on the racks; 2. By cutting off the power to the electromagnets other than those near the gear, it is possible to avoid interference of the electromagnets other than those near the gear with the electromagnets near the gear, thereby driving the gear to move more stably.

[0012] In some embodiments, the lens assembly is provided with a plurality of objective lenses, each objective lens is fixed with a gear meshing with a rack on a bearing, and the lens driving module further includes a lens positioning unit, which is used to obtain the position of each gear on the rack; Based on the technical solution, the present invention further achieves the following beneficial effects: 1. Since each electromagnet can be energized independently through the analog acquisition card, and each objective lens is fixed with a gear meshing with the rack, each gear on the rack can be driven to move independently, that is, each objective lens can be driven to move independently; 2. Since all gears move on the same rack, it is not necessary to set up multiple motors to independently drive each objective lens to move, thereby reducing the size of the device and the manufacturing cost of the device; 3. When driving each objective lens to move independently, the lens positioning unit is combined to position each objective lens and control the operation of each electromagnet, so as to accurately adjust the distance between multiple objective lenses and the distance between the objective lens and the laser generating unit; 4. Compared with the traditional motor-driven gear rotation, since the motor drives the gear rotation in a step-by-step manner, the present invention controls the gear rotation by giving specific electrical energy to the electromagnet and utilizing the magnetic field generated by the electromagnet. Since the current range can be infinite and the current can be adjusted infinitely precisely, the present invention can drive the gear rotation more accurately for the motor.

[0013] In some embodiments, each electromagnet is provided with a filter, and the frequency band of electric energy output by each filter is different from the frequency band of electric energy output by all other filters, so that each electromagnet can only receive electric energy of the corresponding frequency band, and the analog quantity acquisition card is connected to all filters in parallel with electrical signals, so that the analog quantity acquisition card can combine and output the electric energy of different frequency bands transmitted to each electromagnet; Based on the above technical solution, the present invention further achieves the following beneficial effects: There is no need to independently set up a cable for each electromagnet to connect to the analog quantity acquisition card. Instead, all electromagnets can be connected to the analog quantity acquisition card in parallel through a single set of cables. Each electromagnet can also be independently controlled, thereby reducing the difficulty of wiring, reducing the difficulty of line control logic, and reducing the amount of wire used.

[0014] In some embodiments, the rack is equipped with a frequency divider connected to the electrical signal of each electromagnet, the frequency divider outputs different frequency bands of electrical energy given to each electromagnet, and the frequency divider is connected to the electrical signal of the analog quantity acquisition card, so that the analog quantity acquisition card can combine the different frequency bands of electrical energy delivered to each electromagnet and output them to the frequency divider; Based on the above technical solution, the present invention further achieves the following beneficial effects: By connecting the electrical signal of each electromagnet through a frequency divider, the analog quantity acquisition card does not need to be connected to each electromagnet separately and independently with cables. Instead, each electromagnet can be independently controlled by connecting it to the analog quantity acquisition card through a single set of cables, thereby reducing the difficulty of wiring, reducing the difficulty of line control logic, and reducing the amount of wire used.

[0015] In some embodiments, the lens assembly is provided with a slide rail, the slide rail is fixedly arranged, and the objective lens is provided with a slider which slides on the slide rail; Based on the above technical solution, the gear can move linearly on the rack more stably, and the objective lenses can also move linearly stably. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the specific implementation of the present invention, the following is a brief description of the drawings and reference numerals required to be used in describing the specific implementation.

[0017] Figure 1 It is a schematic structural diagram of the cutting machine assembly frame of the present invention; Figure 2 is a circuit block diagram of the control system of the present invention; Figure 3 is a schematic diagram of the position of the rack described in Examples 2 and 3; Figure 4 is a schematic diagram of the position of the electromagnet described in Example 2; Figure 5 Schematic diagram of the position of the electromagnet described in Example 3.

[0018] Reference numerals: 1. Cutting platform; 12. Object to be cut; 13. Cutting track; 2. Mobile drive module; 21. Cutting machine frame; 22. Rangefinder; 23. Laser generating unit; 3. Lens group; 31. Objective lens; 41. Rack; 411. Electromagnet; 412. Filter; 413. Divider; 42. Gear; 421. Magnet; 43. Slide rail; 44. Slider; 5. Host computer; 51. Analog acquisition card. DETAILED DESCRIPTION

[0019] In order to make the objectives, technical solutions and advantages of the present invention more clear, this specific implementation method further describes the present invention in detail with reference to the accompanying drawings.

[0020] like Figures 1 to 5 As shown, this specific embodiment provides a laser cutting device for automatically correcting the unevenness of the wafer surface, which includes a cutting platform 1, a mobile drive module 2 and a control system.

[0021] The cutting platform 1 is used to place the object 12 to be cut.

[0022] A mobile driving module 2 drives a cutting machine frame 21, the cutting machine frame 21 is equipped with a rangefinder 22 and a laser generating unit 23, the rangefinder 22 is perpendicular to the cutting platform 1, the laser generating unit 23 is parallel to the rangefinder 22, so that the laser emitted by the laser generating unit 23 irradiates the object to be cut 12 placed on the cutting platform 1, the laser generating unit 23 is parallel to the rangefinder 22 and there is a constant distance between them, a lens group 3 is provided between the laser generating unit 23 and the cutting platform 1, the lens group 3 is provided with a lens driving module, and the lens driving module is used to drive the distance of the objective lens 31 between the lens groups 3.

[0023] The control system includes a host computer 5 and an analog quantity acquisition card 51. The host computer 5 is connected to the analog quantity acquisition card 51 and the mobile drive module 2 by signal. The analog quantity acquisition card 51 is respectively connected to the rangefinder 22 and the lens drive module by electrical signal. The host computer 5 controls the mobile drive module 2 to drive the cutting machine frame 21 to drive the laser generating unit 23 to irradiate the laser before passing through the object 12 to be cut along the cutting track 13. The rangefinder 22 passes over the cutting track 13 in advance, so that the analog quantity acquisition card 51 obtains the distance between the cutting machine frame 21 and a certain part of the cutting track 13 through the rangefinder 22 in advance. The distance between the positions is used to calculate the distance between the laser generating unit 23 and the position, the thickness of the position and the inclination of the object 12 to be cut. Therefore, when the laser reaches the position, the time for the laser irradiated by the laser generating unit 23 to reach the position after the rangefinder 22 passes through a certain position of the cutting track 13 is calculated through the distance between the laser generating unit 23 and the rangefinder 22 and the moving speed of the cutting machine frame 21 driven by the mobile driving module 2. After that, the analog quantity acquisition card 51 controls the lens driving module to drive the distance between the objective lens 31 of the lens group 3 to adjust the laser focal length.

[0024] Before the upper computer 5 controls the mobile driving module 2 to drive the cutting machine frame 21 to drive the laser generating unit 23 to irradiate the laser to pass through the object 12 to be cut along the cutting track 13, the thickness and inclination of all parts of the cutting track 13 and the distance between the laser generating unit 23 and each part of the cutting track 13 can be obtained through the rangefinder 22. Therefore, when the laser slides through all parts of the cutting track 13, the distance of the objective lens 31 between the lens groups 3 can be driven by the lens driving module to adjust the laser focal length so that the laser can stably, completely and concentratedly fall on all parts of the cutting track 13, thereby stably cutting the object 12 to be cut with an uneven surface, different thicknesses in different parts, and different inclinations on the surface.

[0025] In some embodiments, the lens driving module is a motor, which is used as a power source to drive the screw of the screw module to rotate to achieve the distance between the objective lens 31 of the lens group 3.

[0026] In some embodiments, the lens driving module includes a rack 41 and a gear 42. The rack 41 is fixedly arranged. An array of several electromagnets 411 with staggered S and N poles is arranged on the rack 41. The electromagnet 411 is electrically connected to the analog quantity acquisition card 51. The bearing of the gear 42 is fixed on the objective lens 31 of the lens group 3. The gear 42 is meshed with the rack 41. The outer peripheral array of the gear 42 has several magnets 421 with staggered S and N poles. The analog quantity acquisition card 51 is used to independently energize the electromagnet 411 located near the gear 42, so that the electromagnet 411 near the gear 42 absorbs the magnets 421 near its periphery, thereby driving the gear 42 to move on the rack 41 and fixing the gear 42 at a certain position of the rack 41.

[0027] The analog quantity acquisition card 51 is used to independently energize the electromagnet 411 located near the gear 42, and control the electromagnet 411 far away from the gear 42 to be de-energized, so that the suction force of the electromagnet 411 near the gear 42 adsorbs the magnet 421 near its periphery, so as to drive the gear 42 to move on the rack 41 to a certain position of the rack 41. When the gear 42 moves, the gear 42 leads the objective lens 31 to move, so as to adjust the distance between multiple objective lenses 31 and the distance between the objective lens 31 and the laser generating unit 23, thereby adjusting the laser focal length.

[0028] The electromagnet 411 on the rack 41 is arranged with S and N poles staggered, and the magnet 421 on the periphery of the gear 42 is also arranged with S and N poles staggered. Therefore, the gear 42 can be driven to move on the rack 41 by the principle of repulsion of like magnetic fields of the magnet 421.

[0029] The gear 42 is driven to move on the rack 41 by attracting the magnet 421 on the periphery of the gear 42 through the electromagnet 411. When the gear 42 moves to a certain position of the rack 41, the electromagnet 411 can attract the magnet 421 to fix the gear 42 to a certain position of the rack 41, that is, to fix the position of the material objective lens 31.

[0030] In some embodiments, the lens group 3 is provided with a plurality of objective lenses 31 , each objective lens 31 is fixed with a gear 42 meshing with a rack 41 , and the lens driving module further includes a lens positioning unit for obtaining the position of each gear 42 on the rack 41 .

[0031] Each electromagnet 411 is independently energized through the analog quantity acquisition card 51. At the same time, each objective lens 31 is fixed with a gear 42 meshing with the rack 41, so that each gear 42 on the rack 41 is independently driven to move, that is, each objective lens 31 is independently driven to move. All gears 42 move on the same rack 41, that is, each objective lens 31 can be independently driven to move without setting up multiple motors, thereby reducing the size of the device and the manufacturing cost of the device.

[0032] When each objective lens 31 is driven to move independently, the lens positioning unit is combined to position each objective lens 31 and control the operation of each electromagnet 411, thereby achieving precise adjustment of the distance between multiple objective lenses 31 and the distance between the objective lens 31 and the laser generating unit 23.

[0033] In some embodiments, each electromagnet 411 is provided with a filter 412, and the frequency band of electric energy output by each filter 412 is different from the frequency band of electric energy output by all other filters 412, so that each electromagnet 411 can only receive electric energy of the corresponding frequency band, and the analog quantity acquisition card 51 is connected to all filters 412 in parallel with electrical signals, so that the analog quantity acquisition card 51 can combine and output the electric energy of different frequency bands transmitted to each electromagnet 411.

[0034] There is no need to independently set up a cable for each electromagnet 411 to connect to the analog quantity acquisition card 51. Instead, all the electromagnets 411 can be connected in parallel to the analog quantity acquisition card 51 through a single set of cables. Each electromagnet 411 can also be independently controlled, thereby reducing the difficulty of wiring, reducing the difficulty of line control logic, and reducing the amount of wire used.

[0035] In some embodiments, the rack 41 is equipped with a divider 413 connected to the electrical signal of each electromagnet 411. The frequency bands of the electrical energy output by the divider 413 to each electromagnet 411 are different from each other. The divider 413 is connected to the electrical signal of the analog quantity acquisition card 51 so that the analog quantity acquisition card 51 can combine the different frequency bands of electrical energy transmitted to each electromagnet 411 and output them to the divider 413.

[0036] The divider 413 is connected to the electrical signal of each electromagnet 411, so that the analog quantity acquisition card 51 does not need to be connected to each electromagnet 411 separately and independently with cables. Instead, each electromagnet 411 can be independently controlled by connecting to the analog quantity acquisition card 51 through a single set of cables, thereby reducing the difficulty of wiring, reducing the difficulty of line control logic, and reducing the amount of wire used.

[0037] In some embodiments, the lens group 3 is provided with a slide rail 43, which is fixed, and the objective lens 31 is installed with a slider 44 that slides on the slide rail 43, so that the gear 42 can move more stably in a straight line on the rack 41, and the objective lenses 31 can also move stably in a straight line.

[0038] In order to further illustrate the laser cutting equipment for automatically correcting the unevenness of the wafer surface described in this specific embodiment, the following embodiments are listed to introduce the laser cutting equipment. Example

[0039] like Figure 1 and 2 As shown, this embodiment provides a laser cutting device for automatically correcting the unevenness of a wafer surface, which includes a cutting platform 1, a mobile drive module 2 and a control system.

[0040] The cutting platform 1 is used to place the object 12 to be cut.

[0041] A mobile driving module 2 drives a cutting machine frame 21, the cutting machine frame 21 is equipped with a rangefinder 22 and a laser generating unit 23, the rangefinder 22 is perpendicular to the cutting platform 1, the laser generating unit 23 is parallel to the rangefinder 22, so that the laser emitted by the laser generating unit 23 irradiates the object to be cut 12 placed on the cutting platform 1, the laser generating unit 23 is parallel to the rangefinder 22 and there is a constant distance between them, a lens group 3 is provided between the laser generating unit 23 and the cutting platform 1, the lens group 3 is provided with a lens driving module, and the lens driving module is used to drive the distance of the objective lens 31 between the lens groups 3.

[0042] The lens driving module is a motor. When the motor is used as a power source, the objective lens 31 in the lens group 3 is fixed with a slider 44 and a nut. The motor is connected to a lead screw, which is threadedly connected to the nut. The slider 44 slides on the slide rail 43, which is fixedly connected. When the motor drives the lead screw to rotate, the lead screw can drive the objective lens 31 to move.

[0043] The control system includes a host computer 5 and an analog quantity acquisition card 51. The host computer 5 is connected to the analog quantity acquisition card 51 and the mobile drive module 2 by signals. The analog quantity acquisition card 51 is respectively connected to the rangefinder 22 and the lens drive module by electrical signals. The host computer 5 controls the mobile drive module 2 to drive the cutting machine frame 21 to drive the laser generating unit 23 to irradiate the laser before passing through the object 12 to be cut along the cutting track 13. The rangefinder 22 passes over the cutting track 13 in advance, so that the analog quantity acquisition card 51 obtains the distance between the cutting machine frame 21 and a certain part of the cutting track 13 through the rangefinder 22 in advance, so as to calculate the distance between the laser generating unit 23 and the cutting track 13. 23 and the part, the thickness of the part and the inclination of the object 12 to be cut, so that when the laser reaches the part, the time for the laser irradiated by the laser generating unit 23 to reach the part after the rangefinder 22 passes through a certain part of the cutting track 13 is calculated through the distance between the laser generating unit 23 and the rangefinder 22 and the moving speed of the cutting machine assembly frame 21 driven by the mobile driving module 2. After that, the analog quantity acquisition card 51 controls the lens driving module to drive the objective lens 31 between the lens groups 3 to move, thereby adjusting the distance between the objective lenses 31 and the distance between the objective lens 31 and the laser generating unit 23, and adjusting the laser focal length. Example

[0044] like Figure 1 and 3 As shown, this embodiment provides a laser cutting device for automatically correcting the unevenness of a wafer surface, which includes: A cutting platform 1, the cutting platform 1 is used to place an object 12 to be cut; A mobile driving module 2 is driven by the mobile driving module 2 to drive a cutting machine frame 21, and a rangefinder 22 and a laser generating unit 23 are installed on the cutting machine frame 21. The rangefinder 22 is perpendicular to the cutting platform 1, and the laser generating unit 23 is parallel to the rangefinder 22, so that the laser emitted by the laser generating unit 23 irradiates the object to be cut 12 placed on the cutting platform 1, and the laser generating unit 23 is parallel to the rangefinder 22 and has a constant distance; The lens group 3 is located between the laser generating unit 23 and the cutting platform 1. The lens group 3 is provided with a lens driving module. The lens driving module includes a rack 41 and a gear 42. The rack 41 is fixedly arranged. A plurality of electromagnets 411 with S poles and N poles arranged in a staggered manner are arrayed on the rack 41. The gear 42 is fixed on the objective lens 31 of the lens group 3. The gear 42 is meshed with the rack 41. A plurality of magnets 421 with S poles and N poles arranged in a staggered manner are arrayed on the periphery of the gear 42. By respectively energizing the electromagnet 411 with the S pole or N pole, the electromagnet 411 is attracted to the magnet 421 on the gear 42 to drive the gear 42 to move on the rack 41 and fix the gear 42 to a certain position of the rack 41, so that the distance between the objective lens 31 between the lens group 3 can be driven by the lens driving module according to the distance between the rangefinder 22 and the object to be cut 12, thereby adjusting the laser focal length.

[0045] When the laser slides over the cutting part of the object 12 to be cut, the distance between the laser and the object 12 to be cut is monitored in advance by the rangefinder 22, and then the lens driving module is used to drive the distance of the objective lens 31 between the lens group 3, thereby adjusting the laser focal length so that the laser can fall on the cutting part stably, completely and intensively, thereby stably cutting the object 12 to be cut with uneven surface, different thicknesses at different parts, and different inclined parts on the surface; further, since the rack 41 is arrayed with a plurality of electromagnets 411 with staggered S and N poles, at the same time, The peripheral array of the gear 42 has a plurality of magnets 421 with staggered S and N poles. Therefore, the electromagnet 411 with the S or N pole can be energized respectively. At this time, the suction force of the electromagnet 411 near the gear 42 adsorbs the magnets 421 near its periphery to drive the gear 42 to move on the rack 41 to a certain position of the rack 41. When the gear 42 moves, the gear 42 moves with the objective lens 31, thereby adjusting the distance between the multiple objective lenses 31 and the distance between the objective lens 31 and the laser generating unit 23, thereby adjusting the focal length of the laser.

[0046] The electromagnet 411 on the rack 41 is arranged with S poles and N poles staggered, and the magnet 421 on the periphery of the gear 42 is also arranged with S poles and N poles staggered. Therefore, the gear 42 can be driven to move on the rack 41 by the principle of repulsion of like magnetic fields of the magnet 421. When adjusting the focal length, the electromagnet 411 attracts the magnet 421 on the periphery of the gear 42 to drive the rack 41 to move. When the gear 42 moves to a certain position of the rack 41, the electromagnet 411 can attract the magnet 421 to fix the gear 42 to a certain position of the rack 41, that is, to fix the position of the material objective lens 31. Example

[0047] like Figures 1 to 4 As shown, this embodiment provides a laser cutting device for automatically correcting the unevenness of a wafer surface, which includes a cutting platform 1, a mobile drive module 2 and a control system.

[0048] The cutting platform 1 is used to place the object 12 to be cut.

[0049] A mobile driving module 2 drives a cutting machine frame 21, the cutting machine frame 21 is equipped with a rangefinder 22 and a laser generating unit 23, the rangefinder 22 is perpendicular to the cutting platform 1, the laser generating unit 23 is parallel to the rangefinder 22, so that the laser emitted by the laser generating unit 23 irradiates the object to be cut 12 placed on the cutting platform 1, the laser generating unit 23 is parallel to the rangefinder 22 and there is a constant distance between them, a lens group 3 is provided between the laser generating unit 23 and the cutting platform 1, the lens group 3 is provided with a lens driving module, and the lens driving module is used to drive the distance of the objective lens 31 between the lens groups 3.

[0050] The control system includes a host computer 5 and an analog quantity acquisition card 51. The host computer 5 is connected to the analog quantity acquisition card 51 and the mobile drive module 2 by signals. The analog quantity acquisition card 51 is respectively connected to the rangefinder 22 and the lens drive module by electrical signals. The host computer 5 controls the mobile drive module 2 to drive the cutting machine frame 21 to drive the laser generating unit 23 to irradiate the laser before passing through the object 12 to be cut along the cutting track 13. The rangefinder 22 passes over the cutting track 13 in advance, so that the analog quantity acquisition card 51 obtains the distance between the cutting machine frame 21 and a certain part of the cutting track 13 through the rangefinder 22 in advance, so as to calculate the distance between the laser generating unit 23 and the cutting track 13. 23 and the part, the thickness of the part and the inclination of the object 12 to be cut, so that when the laser reaches the part, the time for the laser irradiated by the laser generating unit 23 to reach the part after the rangefinder 22 passes through a certain part of the cutting track 13 is calculated through the distance between the laser generating unit 23 and the rangefinder 22 and the moving speed of the cutting machine assembly frame 21 driven by the mobile driving module 2. After that, the analog quantity acquisition card 51 controls the lens driving module to drive the objective lens 31 between the lens groups 3 to move, thereby adjusting the distance between the objective lenses 31 and the distance between the objective lens 31 and the laser generating unit 23, and adjusting the laser focal length.

[0051] The lens driving module includes a rack 41 and a slide rail 43. The rack 41 is fixedly arranged, and an array of several electromagnets 411 with staggered S and N poles is arranged on the rack 41, and the electromagnets 411 are electrically connected to the analog quantity acquisition card 51. The bearing on the objective lens 31 is connected to a gear 42, which is meshed with the rack 41. The outer peripheral array of the gear 42 has several magnets 421 with staggered S and N poles. The analog quantity acquisition card 51 is used to independently energize the electromagnet 411 located near the gear 42, so that the electromagnet 411 near the gear 42 absorbs the magnets 421 near its periphery, thereby driving the gear 42 to move on the rack 41 and fixing the gear 42 to a certain position of the rack 41. The slide rail 43 is fixedly arranged, and the objective lens 31 is equipped with a slider 44 sliding on the slide rail 43, so that the gear 42 can move more stably on the rack 41 in a straight line, and the objective lens 31 can also move stably in a straight line.

[0052] When the lens group 3 is provided with a plurality of objective lenses 31, each objective lens 31 is fixed with a gear 42 meshing with a rack 41 and a slider 44 sliding on a slide rail 43, and the lens driving module further includes a lens positioning unit, which is used to obtain the position of each gear 42 located on the rack 41. The lens positioning unit can obtain the distance of its lens through the infrared rangefinder 22 to achieve positioning of the objective lens 31.

[0053] Each electromagnet 411 is provided with a filter 412, and the frequency band of electric energy output by each filter 412 is different from the frequency band of electric energy output by all other filters 412, so that each electromagnet 411 can only receive electric energy of the corresponding frequency band, and the analog quantity acquisition card 51 is connected to all filters 412 in parallel with electrical signals, so that the analog quantity acquisition card 51 can combine and output the electric energy of different frequency bands transmitted to each electromagnet 411. Example

[0054] like Figures 1 to 3 ,as well as Figure 5 As shown, this embodiment provides a laser cutting device for automatically correcting the unevenness of a wafer surface, which includes a cutting platform 1, a mobile drive module 2 and a control system.

[0055] The cutting platform 1 is used to place the object 12 to be cut.

[0056] A mobile driving module 2 drives a cutting machine frame 21, the cutting machine frame 21 is equipped with a rangefinder 22 and a laser generating unit 23, the rangefinder 22 is perpendicular to the cutting platform 1, the laser generating unit 23 is parallel to the rangefinder 22, so that the laser emitted by the laser generating unit 23 irradiates the object to be cut 12 placed on the cutting platform 1, the laser generating unit 23 is parallel to the rangefinder 22 and there is a constant distance between them, a lens group 3 is provided between the laser generating unit 23 and the cutting platform 1, the lens group 3 is provided with a lens driving module, and the lens driving module is used to drive the distance of the objective lens 31 between the lens groups 3.

[0057] The control system includes a host computer 5 and an analog quantity acquisition card 51. The host computer 5 is connected to the analog quantity acquisition card 51 and the mobile drive module 2 by signals. The analog quantity acquisition card 51 is respectively connected to the rangefinder 22 and the lens drive module by electrical signals. The host computer 5 controls the mobile drive module 2 to drive the cutting machine frame 21 to drive the laser generating unit 23 to irradiate the laser before passing through the object 12 to be cut along the cutting track 13. The rangefinder 22 passes over the cutting track 13 in advance, so that the analog quantity acquisition card 51 obtains the distance between the cutting machine frame 21 and a certain part of the cutting track 13 through the rangefinder 22 in advance, so as to calculate the distance between the laser generating unit 23 and the cutting track 13. 23 and the part, the thickness of the part and the inclination of the object 12 to be cut, so that when the laser reaches the part, the time for the laser irradiated by the laser generating unit 23 to reach the part after the rangefinder 22 passes through a certain part of the cutting track 13 is calculated through the distance between the laser generating unit 23 and the rangefinder 22 and the moving speed of the cutting machine assembly frame 21 driven by the mobile driving module 2. After that, the analog quantity acquisition card 51 controls the lens driving module to drive the objective lens 31 between the lens groups 3 to move, thereby adjusting the distance between the objective lenses 31 and the distance between the objective lens 31 and the laser generating unit 23, and adjusting the laser focal length.

[0058] The lens driving module includes a rack 41 and a slide rail 43. The rack 41 is fixedly arranged, and an array of several electromagnets 411 with staggered S and N poles is arranged on the rack 41, and the electromagnets 411 are electrically connected to the analog quantity acquisition card 51. The bearing on the objective lens 31 is connected to a gear 42, which is meshed with the rack 41. The outer peripheral array of the gear 42 has several magnets 421 with staggered S and N poles. The analog quantity acquisition card 51 is used to independently energize the electromagnet 411 located near the gear 42, so that the electromagnet 411 near the gear 42 absorbs the magnets 421 near its periphery, thereby driving the gear 42 to move on the rack 41 and fixing the gear 42 to a certain position of the rack 41. The slide rail 43 is fixedly arranged, and the objective lens 31 is equipped with a slider 44 sliding on the slide rail 43, so that the gear 42 can move more stably on the rack 41 in a straight line, and the objective lens 31 can also move stably in a straight line.

[0059] When the lens group 3 is provided with a plurality of objective lenses 31, each objective lens 31 is fixed with a gear 42 meshing with a rack 41 and a slider 44 sliding on a slide rail 43, and the lens driving module further includes a lens positioning unit, which is used to obtain the position of each gear 42 located on the rack 41. The lens positioning unit can obtain the distance of its lens through the infrared rangefinder 22 to achieve positioning of the objective lens 31.

[0060] The rack 41 is equipped with a divider 413 which is electrically connected to each electromagnet 411 . The frequency bands of the electrical energy outputted by the divider 413 to each electromagnet 411 are different from each other. The divider 413 is electrically connected to the analog quantity acquisition card 51 so that the analog quantity acquisition card 51 can combine the electrical energy of different frequency bands transmitted to each electromagnet 411 and output them to the divider 413 .

Claims

1. A laser cutting device for automatically correcting the unevenness of a wafer surface, characterized in that: include: A cutting platform (1), wherein the cutting platform (1) is used to place an object to be cut (12); A mobile drive module (2), wherein the mobile drive module (2) drives a cutting machine frame (21), wherein the cutting machine frame (21) is equipped with a rangefinder (22) and a laser generating unit (23), wherein the rangefinder (22) is perpendicular to the cutting platform (1), and the laser generating unit (23) is parallel to the rangefinder (22), so that the laser emitted by the laser generating unit (23) irradiates the object to be cut (12) placed on the cutting platform (1), and the laser generating unit (23) is parallel to the rangefinder (22) and at a constant distance; A lens group (3), the lens group (3) being located between the laser generating unit (23) and the cutting platform (1), the lens group (3) being provided with a lens driving module, the lens driving module comprising a rack (41) and a gear (42), the rack (41) being fixedly arranged, a plurality of electromagnets (411) with S poles and N poles arranged in a staggered manner being arranged on the rack (41), the gear (42) being fixedly bearing on the objective lens (31) of the lens group (3), the gear (42) being meshed with the rack (41), and a plurality of S poles being arranged on the periphery of the gear (42) being arranged on the periphery of the gear (42) The magnet (421) with staggered N poles is energized by the electromagnet (411) which is respectively provided with the S pole or the N pole, so that the electromagnet (411) attracts the magnet (421) on the gear (42), thereby driving the gear (42) to move on the rack (41) and fixing the gear (42) to a certain position of the rack (41), so that the distance between the objective lens (31) between the lens group (3) can be driven by the lens driving module according to the distance between the rangefinder (22) and the object to be cut (12), thereby adjusting the laser focal length.

2. The laser cutting device for automatically correcting the unevenness of the wafer surface according to claim 1 is characterized in that: Also includes: A control system, the control system comprising a host computer (5) and an analog quantity acquisition card (51), the host computer (5) being connected to the analog quantity acquisition card (51) and a mobile drive module (2) by signal, the analog quantity acquisition card (51) being connected to the rangefinder (22) and the lens drive module by electrical signal respectively, the host computer (5) controlling the mobile drive module (2) to drive the cutting machine assembly frame (21) to drive the laser irradiated by the laser generating unit (23) to pass through the object to be cut (12) along a cutting track (13), the rangefinder (22) passing over the cutting track (13) in advance, so that the analog quantity acquisition card (51) can obtain the cutting machine assembly frame (21) through the rangefinder (22) in advance. The distance between the laser generating unit (23) and a certain part of the cutting track (13) is calculated to calculate the distance between the laser generating unit (23) and the part, the thickness of the part and the inclination of the object (12) to be cut. When the laser reaches the part, the time when the laser irradiated by the laser generating unit (23) reaches the part after the rangefinder (22) passes through a certain part of the cutting track (13) is calculated by the distance between the laser generating unit (23) and the rangefinder (22) and the moving speed of the driving module to drive the cutting machine assembly frame (21). Thereafter, the analog quantity acquisition card (51) controls the lens driving module to drive the distance between the objective lens (31) and the lens group (3) to adjust the laser focal length.

3. The laser cutting device for automatically correcting the unevenness of the wafer surface according to claim 2, characterized in that: The electromagnet (411) is electrically connected to the analog quantity acquisition card (51), and the analog quantity acquisition card (51) is used to independently energize the electromagnet (411) located near the gear (42).

4. The laser cutting device for automatically correcting the unevenness of the wafer surface according to claim 3 is characterized by: The lens group (3) is provided with a plurality of objective lenses (31), each of the objective lenses (31) is fixed with a gear (42) meshing with the rack (41) on a bearing, and the lens driving module further comprises a lens positioning unit, which is used to obtain the position of each gear (42) on the rack (41).

5. The laser cutting device for automatically correcting the unevenness of the wafer surface according to claim 4, characterized in that: Each of the electromagnets (411) is provided with a filter (412), and the frequency band of electric energy output by each of the filters (412) is different from the frequency bands of electric energy output by all the other filters (412), so that each of the electromagnets (411) can only receive electric energy of a corresponding frequency band, and the analog quantity acquisition card (51) is connected to all of the filters (412) in parallel by electrical signals, so that the analog quantity acquisition card (51) can combine and output the electric energy of different frequency bands transmitted to each of the electromagnets (411).

6. The laser cutting device for automatically correcting the unevenness of the wafer surface according to claim 4, characterized in that: The rack (41) is provided with a frequency divider (413) connected to the electrical signal of each electromagnet (411); the frequency divider (413) outputs different frequency bands of electrical energy to each electromagnet (411); the frequency divider (413) is connected to the electrical signal of the analog quantity acquisition card (51) so that the analog quantity acquisition card (51) can combine the electrical energy of different frequency bands supplied to each electromagnet (411) and output them to the frequency divider (413).

7. The laser cutting device for automatically correcting the unevenness of the wafer surface according to claim 4, characterized in that: The lens group (3) is provided with a slide rail (43), the slide rail (43) is fixedly arranged, and the objective lens (31) is provided with a slider (44) which slides on the slide rail (43).

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