Fixed blanking equipment for high-precision circuit board

Abstract

The invention relates to the field of circuit board processing, and provides high-precision circuit board fixed blanking equipment which comprises a bottom die and a movable die which are matched with each other. The roller frame is mounted on one side of the bottom die; the leveling device is mounted on one side of the roller frame, and a plate is rolled and leveled by the leveling device and then falls onto the roller frame; the supporting plates are mounted on the two sides of the roller frame; the telescopic frame is mounted on the supporting plate and suspended above the roller frame; the suction cup frame is mounted on the telescopic frame; the fixing pins are mounted on the periphery of the bottom die; the puncture nail is arranged on the fixing pin; and the inlet hole is formed in the movable mold corresponding to the position of the puncture nail in a matched manner. The flattening device is arranged to grind and flatten a deformed raw material plate and then feed the deformed raw material plate to the blanking bottom die, so that it can be ensured that the raw material plate does not tilt or deform in the blanking process, and the blanked shape plate does not have flaws.

Description

Technical Field

[0001] The invention relates to the field of circuit board processing, and in particular to a fixed punching device for high-precision circuit boards. Background Art

[0002] TV backlight circuit boards usually use aluminum substrates as the carrier of the circuit board. Figure 1 As shown, in order to facilitate the slitting of the shape plate, a separation groove is pre-cut on the raw material plate around the edge of the shape plate by a cutting device during the processing of the backlight source circuit board. However, since there is still necessary processing to be completed later, the shape plate and the raw material plate need to be connected to the raw material plate by a connecting part. At this time, the shape plate and the raw material plate are still processed as a whole inseparable sheet material, and the raw material plate needs to be clamped and fixed during the processing to assist the processing.

[0003] A common processing method is to apply clamping and fixing measures on the side of the raw material plate. Such clamping method usually causes a certain amount of deformation of the raw material plate. Since a separation groove is opened between the raw material plate and the shape plate at this time, the shape plate is only connected to the raw material plate through the connecting part. The deformation caused when clamping the raw material plate will cause part of the shape plate to deform accordingly, causing the part where the shape plate and the raw material plate are connected to be slightly warped. Since the circuit board uses an aluminum substrate as a carrier, the deformation caused in this way usually does not recover by itself, which makes it easy for the cutting equipment to cut the warped part of the shape plate during the final cutting of the connecting part, resulting in cutting defects on the edge of the shape plate. Summary of the invention

[0004] The present invention aims to solve the technical problems existing in the above-mentioned prior art. To this end, the present invention provides a fixed punching device for high-precision circuit boards.

[0005] To achieve the above-mentioned purpose, the present invention provides a fixed punching device for high-precision circuit boards, comprising: a bottom mold and a movable mold that match each other; the bottom mold is symmetrically provided with mold openings, and the movable mold is provided with a mold convex portion that matches the mold opening; a positioning column is arranged around the bottom mold; a positioning hole is opened on the movable mold that matches the position of the positioning column; a roller frame is installed on one side of the bottom mold; a leveling device is installed on one side of the roller frame, and the sheet material falls onto the roller frame after being rolled and leveled by the leveling device; a support plate is installed on both sides of the roller frame; a telescopic frame is installed on the support plate and suspended above the roller frame; a suction cup frame is installed Installed on the telescopic frame; fixed pins are installed around the bottom mold; puncture nails are arranged on the fixed pins; entry holes are opened on the movable mold corresponding to the positions of the puncture nails; the leveling device includes: a frame surrounded by a blocking component, the frame is installed on one side of the roller frame; a plurality of upper rollers are provided, which are rotatably installed on the upper part of the frame; a plurality of lower rollers are provided, which are rotatably installed on the lower part of the frame; a slit is left between the upper roller and the lower roller to allow the sheet to pass through; a pulley group is connected to the plurality of lower rollers; a protective cover is installed on the side wall of the frame; a first motor is installed on the protective cover to drive the lower roller to rotate.

[0006] As a further improvement of the solution, the bottom of the die opening is provided with an open oblique opening.

[0007] As a further improvement of the solution, it also includes: a correction angle plate installed around the movable mold; a receiving opening opened on the bottom mold matching the position of the correction angle plate; and the bottom edge of the correction angle plate is an inclined edge.

[0008] As a further improvement of the solution, the hole radius of the entry hole allowing the puncture pin to enter is not less than the sum of the radius of the puncture pin and the thickness of the sheet material.

[0009] As a further improvement of the solution, it also includes: a spring, which is sleeved on the puncture nail; and a ring, which is slidably arranged on the puncture nail and connected to one end of the spring.

[0010] As a further improvement of the solution, a downwardly recessed receiving groove is provided on the bottom mold at a position connected to the fixing pin, and a part of the spring is placed in the receiving groove.

[0011] As a further improvement of the scheme, the telescopic frame includes: guide plates symmetrically fixedly installed on both sides of the connecting plate; the guide plates are connected to the support plates; a slide groove is opened on the guide plate; a sliding plate is slidably arranged in the slide groove; a rack is fixedly installed on the sliding plate; a second motor is installed on the connecting plate close to the side of the bottom mold; a gear is drive-mounted on the second motor and meshes with the rack.

[0012] As a further improvement of the solution, it also includes: a bearing, which is arranged in the slide groove of the guide plate, and the part of the sliding plate in the slide groove is in rolling contact with the bearing.

[0013] As a further improvement of the solution, the suction cup frame includes: a fixed frame, which is installed on the sliding plates on both sides; a movable frame, which can be lifted and lowered on the fixed frame through a telescopic push rod; and a suction nozzle, which is evenly installed on the movable frame.

[0014] As a further improvement of the solution, it also includes: a bottom cover plate, which is arranged at the bottom of the bottom mold, and a concave collecting groove is opened on the bottom cover plate.

[0015] The present invention brings the following effects: 1. The present invention provides a leveling device to roll and level the deformed raw material plate and then feed it to the punching bottom die, so as to ensure that the raw material plate does not warp or deform during the punching process, and the punched shape plate will not have defects; at the same time, the piercing nails provided on the bottom die can pierce the edge of the raw material plate during the pressing process of the dynamic die, so as to firmly fix it on the bottom die to prevent the raw material plate from deviating.

[0016] 2. The oblique opening at the bottom of the die opening of the present invention can prevent the debris generated by punching from getting stuck in the die opening; the provided correction angle plate can align the raw material plate to the correct angle before punching during the downward movement of the movable die.

[0017] 3. The spring and the collar provided on the puncture pin of the present invention can automatically push the raw material plate out from the puncture pin after the movable mold is lifted, so as to prevent the raw material plate from being stuck on the puncture pin; the bearing provided on the guide plate can make the sliding plate slide more smoothly, so that the sliding plate will not be easily stuck in the groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Schematic diagram of evenly arranged shape plates on the raw material plate.

[0019] Figure 2 It is a complete schematic diagram of the present invention.

[0020] Figure 3 For the present invention Figure 1 The schematic diagram omits the support plate, telescopic frame, suction cup frame and bottom cover plate.

[0021] Figure 4 This is a disassembly schematic diagram of the leveling device of the present invention.

[0022] Figure 5 It is a schematic diagram of the bottom mold, the movable mold and the bottom cover plate of the present invention.

[0023] Figure 6 For the present invention Figure 5 An enlarged schematic diagram of part A.

[0024] Figure 7 It is a specific schematic diagram of the movable mold of the present invention.

[0025] Figure 8 It is a schematic diagram of the telescopic frame and the suction cup frame of the present invention.

[0026] Fig. 9 It is a specific schematic diagram of the telescopic frame of the present invention.

[0027] Fig.10 It is a specific schematic diagram of the suction cup frame of the present invention.

[0028] The corresponding relationship between the reference numerals and the names of the components in the accompanying drawings is as follows: 500-raw material plate, 501-shaped plate, 502-separation groove, 503-connecting part, 1-bottom mold, 2-movable mold, 101-die opening, 102-die convex part, 103-oblique opening, 201-correction angle plate, 202-accommodation opening, 203-inclined edge, 301-positioning column, 302-positioning hole, 3-roller frame, 4-leveling device, 401-enclosing component, 402-upper roller, 403-lower roller, 404-pulley group, 405 -protective cover, 406-first motor, 5-support plate, 6-telescopic frame, 7-suction cup frame, 8-bottom cover plate, 801-collecting groove, 9-fixing pin, 901-piercing nail, 902-accommodating groove, 903-spring, 904-ring, 905-entry hole, 601-connecting plate, 602-guide plate, 603-slide groove, 6021-bearing, 604-sliding plate, 605-rack, 606-second motor, 607-gear, 701-fixed frame, 702-movable frame, 703-telescopic push rod, 704-suction nozzle. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It will be appreciated that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some but not all structures related to the present application are shown in the drawings. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the art without making creative work are within the scope of protection of the present application.

[0030] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0031] The present invention specifically discloses a fixed punching device for high-precision circuit boards, such as Figure 2-Figure 10 As shown, it includes: a bottom die 1 and a movable die 2 that match each other. When in use, the bottom die 1 and the movable die 2 need to be installed on the blanking equipment respectively, the bottom die 1 is fixed, and the movable die 2 is installed on the movable end of the blanking equipment; the bottom die 1 is symmetrically provided with die openings 101 at intervals, and the movable die 2 is provided with a die convex portion 102 that matches the die opening 101. The raw material plate 500 to be blanked is placed on the bottom die 1, and the blanking equipment makes the movable die 2 move downward, and the die convex portion 102 cuts the connecting portion 503 between the raw material plate 500 and the shape plate 501, and the cut connecting portion 503 falls downward through the die opening 101, according to Figure 3 As shown, the bottom of the die 101 is provided with an open oblique opening 103, and the oblique opening 103 has a larger accommodation space than the die 101, so that the cut connecting portion 503 continues to enter the die 101 without getting stuck in the die 101. Figure 5 and Figure 7 As shown, positioning columns 301 are fixedly installed around the bottom mold 1, and positioning holes 302 are opened on the movable mold 2 that match the positions of the positioning columns 301. Before the movable mold 2 and the bottom mold 1 contact each other, the positioning columns 301 will first penetrate into the positioning holes 302, so as to prevent the positions of the movable mold 2 and the bottom mold 1 from deviating.

[0032] according to Figure 3 As shown, a roller frame 3 is fixedly installed on the left side of the bottom mold 1, and a leveling device 4 is fixedly installed on the left side of the roller frame 3. The deformed and bent raw material plate 500 is rolled and leveled by the leveling device 4 and then falls onto the roller frame 3. Figure 2 As shown, support plates 5 are fixedly installed on both sides of the roller frame 3, and the support plates 5 on both sides are commonly connected with a telescopic frame 6, and the telescopic frame 6 is suspended above the roller frame 3, and a suction cup frame 7 is installed on the telescopic frame 6. After the leveled raw material plate 500 is sucked up by the suction cup frame 7, the suction cup frame 7 is pushed to the top of the bottom mold 1 by the telescopic frame 6, so that the leveled raw material plate 500 is placed on the bottom mold 1.

[0033] according to Figure 5 and Figure 6As shown, the fixing pin 9 is installed around the bottom mold 1, and a puncture pin 901 is fixedly installed on the fixing pin 9. An entry hole 905 is opened on the movable mold 2 corresponding to the position of the puncture pin 901. When the raw material plate 500 is placed on the bottom mold 1, the tip of the puncture pin 901 is against the bottom of the raw material plate 500, and as the movable mold 2 moves downward and presses on the raw material plate 500, the puncture pin 901 will penetrate the raw material plate 500, so that the raw material plate 500 is firmly fixed on the bottom mold 1, and finally the blanking is completed. Among them, the hole radius of the entry hole 905 allowing the puncture pin 901 to enter is not less than the sum of the radius of the puncture pin 901 plus the thickness of the sheet material. The purpose of this is that when the puncture pin 901 penetrates the raw material plate 500, the sheet material at the break of the raw material plate 500 will expand outward. Therefore, if the entry hole 905 does not have enough accommodation space, the expanded sheet material will press against the movable mold 2, thereby making it impossible for the movable mold 2 to effectively cut the connecting portion 503 on the raw material plate 500.

[0034] The position of the puncture pin 901 can also be set on the movable mold 2, but when the puncture pin 901 is set on the movable mold 2, the edge of the movable mold 2 will block the view, making it difficult for workers to notice the puncture pin 901, and it is easy for workers to scratch their arms when taking waste materials. If it is set on the bottom mold 1, the position of the puncture pin 901 can be clearly sensed, so it is preferred to set the puncture pin 901 on the bottom mold 1.

[0035] according to Figure 6 As shown, a spring 903 is sleeved on the puncture pin 901, a ring 904 is connected to the spring 903, and the ring 904 is slidably set on the puncture pin 901. After the puncture pin 901 passes through the raw material plate 500, the ring 904 rests on the raw material plate 500, and as the raw material plate 500 is pressed down by the passive mold 2, the spring 903 is compressed. When the raw material plate 500 is punched out, as the movable mold 2 is lifted, the spring 903 resets and pushes the ring 904 upward, and pushes the raw material plate 500 out, so as to prevent the raw material plate 500 from being stuck on the puncture pin 901. Among them, a downwardly recessed receiving groove 902 is provided at the position connected to the fixing pin 9 on the bottom mold 1, and a part of the spring 903 is placed in the receiving groove 902, and the ring 904 can also be placed in the receiving groove 902 after being pressed down. In this way, after the raw material plate 500 is pressed down, the spring 903 and the ring 904 will not press against the raw material plate 500, thereby causing the raw material plate 500 to be unable to fit on the surface of the bottom mold 1.

[0036] according to Figure 4As shown, the leveling device 4 includes: a frame surrounded by a fence component 401, specifically a frame formed by two long plates arranged up and down and fixedly installed side plates on the sides of both sides, the frame is fixedly installed on one side of the roller frame 3, a plurality of upper rollers 402 are rotatably connected to the upper part of the frame, and a plurality of lower rollers 403 are rotatably connected to the lower part of the frame, and a slit is left between the upper rollers 402 and the lower rollers 403 to allow the sheet to pass through. When in use, the raw material plate 500 to be punched only needs to be rolled and rolled between the upper rollers 402 and the lower rollers 403 to press the deformed raw material plate 500 into a straight state. The ends of the plurality of lower rollers 403 are connected in series through a pulley group 404 to keep rotating in the same direction, and protective covers 405 are fixedly installed on the side walls of both sides of the frame, and a first motor 406 is fixedly installed on the protective cover 405 on one side, so that the lower rollers 403 are driven to rotate by the first motor 406. After being rolled by the leveling device 4 , the raw material plate 500 no longer has the problem of local bending and deformation, and cutting defects can be avoided in the cut shape plate 501 during the punching process.

[0037] according to Figure 7 As shown, correction angle plates 201 are fixedly installed around the movable mold 2, and a receiving opening 202 is provided on the bottom mold 1 that matches the position of the correction angle plates 201. After the raw material plate 500 is sent to the bottom mold 1 through the suction cup frame 7, if there is a slight deviation in the placement angle, the correction angle plates 201 will first align and contact with the four corners of the raw material plate 500 during the downward movement of the movable mold 2, and correct the raw material plate 500 with a deviation in position during the contact process. Among them, the bottom edge of the correction angle plate 201 is an inclined edge 203, and the inclined plate is larger than the inner straight edge of the correction angle plate 201, so that the correction angle plate 201 will not directly hit the edge of the raw material plate 500 during the downward movement.

[0038] according to Figure 8 and Fig. 9As shown, the telescopic frame 6 includes: guide plates 602 are symmetrically fixedly installed on both sides of the connecting plate 601, the guide plates 602 are fixedly connected to the support plates 5, so that the guide plates 602 are mounted above the roller frame 3, a slide groove 603 is opened on the guide plate 602, and a sliding plate 604 is slidably arranged on the guide plate 602 through the slide groove 603, a rack 605 is fixedly installed on the sliding plate 604, and a second motor 606 is fixedly installed on the connecting plate 601, the second motor 606 is close to the side of the bottom mold 1, and a gear 607 is installed on the output end of the second motor 606, and the gear 607 is meshed with the rack 605. As the second motor 606 drives the rack 605 to move, the sliding plate 604 slides out of the slide groove 603, and the suction cup frame 7 is fixed on the sliding plates 604 on both sides and moves accordingly. In order to make the sliding plate 604 slide more smoothly on the guide plate 602, a bearing 6021 is provided in the slide groove 603 of the guide plate 602. When the sliding plate 604 slides in the slide groove 603, it will roll in contact with the bearing 6021, thereby ensuring that the sliding plate 604 can slide more smoothly in the slide groove 603 and will not get stuck in the slide groove 603.

[0039] according to Figure 8 and Fig.10 As shown, the suction cup frame 7 includes: a fixed frame 701 installed on the sliding plates 604 on both sides, a movable frame 702 is installed on the fixed frame 701 so as to be liftable by a telescopic push rod 703, suction nozzles 704 are evenly installed on the sliding movable frame 702, the raw material plate 500 on the roller frame 3 moves the suction nozzle 704 downward by the telescopic push rod 703, the raw material plate 500 is sucked and then lifted, and then the raw material plate 500 is pushed to the bottom mold 1 by using the telescopic frame 6.

[0040] according to Figure 2 As shown, a bottom cover plate 8 is detachably installed at the bottom of the bottom mold 1, and a recessed collecting groove 801 is opened on the bottom cover plate 8. The collecting groove 801 corresponds to the bottom of the die opening 101. The connecting part 503 cut off from the raw material plate 500 falls into the collecting groove 801 below through the die opening 101, thereby completing the centralized collection of these waste materials.

[0041] The above-mentioned embodiments only express the preferred implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person skilled in the art, several modifications, improvements and substitutions can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the attached claims.

Claims

1. A fixed punching device for high-precision circuit boards, comprising: A base mold (1) and a movable mold (2) that match each other; the base mold (1) is provided with mold openings (101) symmetrically spaced apart, and the movable mold (2) is provided with a mold protrusion (102) that matches the mold opening (101); a positioning column (301) is arranged around the base mold (1); a positioning hole (302) is opened on the movable mold (2) that matches the position of the positioning column (301); it is characterized in that it also includes: a roller frame (3) installed on one side of the base mold (1); a leveling device (4) installed on one side of the roller frame (3), and the sheet material falls onto the roller frame (3) after being rolled and leveled by the leveling device (4); a support plate (5) installed on both sides of the roller frame (3); a telescopic frame (6) installed on the support plate (5) and suspended above the roller frame (3); a suction cup frame (7) installed on the telescopic frame (6); a fixing pin ( 9), mounted around the bottom mold (1); a piercing nail (901), arranged on the fixing pin (9); an entry hole (905), opened on the movable mold (2) corresponding to the position of the piercing nail (901); the leveling device (4) comprises: a frame surrounded by a blocking component (401), the frame being mounted on one side of the roller frame (3); a plurality of upper rollers (402), rotatably mounted on the upper part of the frame; a plurality of lower rollers (403), rotatably mounted on the lower part of the frame; a slit for allowing the sheet to pass between the upper rollers (402) and the lower rollers (403); a pulley group (404), connected to the plurality of lower rollers (403); a protective cover (405), mounted on the side wall of the frame; and a first motor (406), mounted on the protective cover (405) to drive the lower rollers (403) to rotate.

2. The fixed punching equipment for high-precision circuit boards according to claim 1 is characterized in that: The bottom of the die opening (101) is provided with an open oblique opening (103).

3. The fixed punching equipment for high-precision circuit boards according to claim 2 is characterized in that: Also includes: The correction angle plate (201) is installed around the movable mold (2); the receiving opening (202) is opened on the bottom mold (1) and matches the position of the correction angle plate (201); the bottom edge of the correction angle plate (201) is an inclined edge (203).

4. The fixed punching equipment for high-precision circuit boards according to claim 3 is characterized in that: The hole radius of the entry hole (905) allowing the puncture pin (901) to enter is not less than the sum of the radius of the puncture pin (901) and the thickness of the sheet material.

5. The fixed punching device for high-precision circuit boards according to claim 4 is characterized in that: Also includes: The spring (903) is sleeved on the puncture nail (901); the ring (904) is slidably disposed on the puncture nail (901) and connected to one end of the spring (903).

6. The fixed punching device for high-precision circuit boards according to claim 5, characterized in that: A downwardly recessed receiving groove (902) is provided at a position on the bottom mold (1) connected to the fixing pin (9), and a portion of the spring (903) is disposed in the receiving groove (902).

7. The fixed punching device for high-precision circuit boards according to any one of claims 1 to 6, characterized in that: The telescopic frame (6) comprises: guide plates (602) symmetrically fixedly mounted on both sides of the connecting plate (601); the guide plates (602) are connected to the supporting plate (5); a slide groove (603) is formed on the guide plate (602); a sliding plate (604) is slidably arranged in the slide groove (603); a rack (605) is fixedly mounted on the sliding plate (604); a second motor (606) is mounted on the connecting plate (601) on a side close to the bottom mold (1); and a gear (607) is drive-mounted on the second motor (606) and meshes with the rack (605).

8. The fixed punching equipment for high-precision circuit boards according to claim 7 is characterized in that: Also includes: The bearing (6021) is disposed in the slide groove (603) of the guide plate (602), and the portion of the sliding plate (604) in the slide groove (603) is in rolling contact with the bearing (6021).

9. The fixed punching device for high-precision circuit boards according to claim 8, characterized in that: The suction cup frame (7) comprises: a fixed frame (701) mounted on the sliding plates (604) on both sides; a movable frame (702) mounted on the fixed frame (701) in a liftable manner via a telescopic push rod (703); and suction nozzles (704) evenly mounted on the movable frame (702).

10. The fixed punching device for high-precision circuit boards according to claim 9, characterized in that: Also includes: A bottom cover plate (8) is arranged at the bottom of the bottom mold (1), and a recessed collecting groove (801) is formed on the bottom cover plate (8).

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