A kind of building compression-resistant extruded composite board and preparation method thereof

Abstract

The present application relates to the field of building materials, and more specifically, to a compression-resistant extruded composite board for construction and a preparation method thereof. The board comprises an extruded layer, two connecting layers, and two surface layers, wherein the extruded layer is located between the two connecting layers and is connected to the surface layers on both sides by the connecting layers. The extruded layer is made of the following raw materials in percentage by weight: 70-90% polystyrene, 1-5% foaming agent, 1-3% nucleating agent, 5-20% modifier, and the remainder being processing aids; the modifier is obtained by mixing alkenyl-containing polysiloxane, (methacryloyloxymethyl) triethoxysilane, epoxy-modified resin, reactive diluent, initiator, and filler powder in a weight ratio of 1: (0.1-0.3): (0.3-1.5): (1-3): (0.01-0.04): (1-3); and the connecting layer is made of an adhesive containing the modifier. Through the above technical solution, the obtained extruded composite board has better compression resistance and structural stability, and reduces the possibility of layer structure falling off in a high humidity environment.

Description

Technical Field

[0001] The present application relates to the field of building materials, and more specifically, to a building compression-resistant extruded composite board and a preparation method thereof. Background Art

[0002] Extruded polystyrene (Extruded Styrene) is a common building material, widely used in various applications, including wall coverings, floors, and countertops. Its lightweight, thermally insulating, and soundproofing properties make it a crucial component of the construction industry. However, as people's expectations for living environments continue to rise, existing Extruded Styrene (Extruded Styrene) panels are increasingly facing challenges in practical applications, particularly in high-humidity and load-bearing environments.

[0003] To address these challenges, existing technologies have employed a variety of methods to improve the performance of extruded boards. For example, different types of additives are added to enhance mechanical properties and durability; special adhesives are used to strengthen the bond between layers; and multi-layer composite structures are employed to enhance overall stability and compressive strength.

[0004] While these approaches have alleviated some of these issues to a certain extent, significant shortcomings remain. Existing extruded panels are particularly susceptible to interlayer delamination, bending, and even damage when subjected to prolonged pressure in high-humidity environments, severely impacting their service life and safety. Therefore, there is an urgent need to develop a new type of extruded composite panel that can maintain excellent performance under high-humidity and load-bearing conditions to meet market demand and technological advancements. Summary of the Invention

[0005] The purpose of the present application is to overcome the above technical problems and provide a construction compression-resistant extruded composite board and a preparation method. In the first aspect, a construction compression-resistant extruded composite board comprises an extruded layer, two connecting layers and two surface layers, wherein the extruded layer is located between the two connecting layers, and both sides of the extruded layer are connected to the surface layers through the connecting layers. The extruded layer is made of the following raw materials in the following weight percentages:

[0006] Polystyrene 70-90%

[0007] Foaming agent 1-5%

[0008] Nucleating agent 1-3%

[0009] Modifier 5-20%

[0010] The balance is processing aids;

[0011] The modifier is prepared by mixing alkenyl-containing polysiloxane, methacryloyloxymethyl)triethoxysilane, epoxy modified resin, reactive diluent, initiator, and filler powder in a weight ratio of 1: (0.1-0.3): (0.3-1.5): (1-3): (0.01-0.04): (1-3);

[0012] The connecting layer is made of an adhesive containing a modifier.

[0013] By adopting the above technical solution, the compressive strength and interlayer connection stability of the extruded composite board can be significantly improved. Specifically:

[0014] Modifier: Composed of alkenyl-containing polysiloxane, methacryloyloxymethyl (methacryloyloxymethyl) triethoxysilane, epoxy-modified resin, reactive diluent, initiator, and filler powder, this modifier not only enhances the dispersion of the filler but also improves the overall performance of the composite board. These ingredients work synergistically to impart improved mechanical properties and water resistance to the extruded layer.

[0015] Tie layer: The tie layer contains a binder with a modifier, which provides stronger adhesion to the extruded layer, effectively preventing the layer structure from falling off in high-humidity environments. This further improves the durability and practicality of the composite board.

[0016] In summary, this technical solution effectively solves the problem of layer structure shedding and bending that is prone to occur in existing extruded boards during long-term use, especially in high humidity and load-bearing environments.

[0017] The compounding of alkenyl-containing polysiloxane, methacryloyloxymethyl)triethoxysilane, epoxy-modified resin, and reactive diluent can further promote the dispersion of the filler, so that the formed modifier has better comprehensive performance. After curing, the modifier is used in the extrusion layer to further enhance the compressive strength of the composite board and further enhance the stability of the connecting layer.

[0018] By adopting the above technical solution, the dispersion of the filler can be further improved, so that the resulting modifier has better overall performance. After curing, the modifier is used in the extruded layer to further enhance the compressive strength of the composite board and further improve the stability between the connecting layers.

[0019] Since the connecting layer is made of an adhesive containing a modifier, it is easier to adhere to the extruded layer, thereby further improving the connection stability of the composite board structure.

[0020] By adopting this technical solution, the bonding layer, made from a binder containing a modifier, significantly enhances the adhesion between the bonding layer and the extruded layer, further improving the connection stability of the composite panel's various layers. This not only effectively prevents interlayer delamination that can occur during long-term use, but also enhances the composite panel's overall compression resistance and water resistance, thereby improving its practicality and durability in high-humidity environments and under load-bearing conditions.

[0021] In addition, alkenyl-containing polysiloxane, methacryloyloxymethyl)triethoxysilane, and epoxy-modified resin all play a waterproof role, further improving its waterproof properties, and the filling powder can also enhance the compressive strength of the connecting layer, thereby obtaining an extruded composite board with better layer structure stability and compression resistance, and reducing damage and delamination in long-term pressure and humid environments, thereby improving its practicality.

[0022] By employing this technical solution, the alkenyl-containing polysiloxane, methacryloxymethyl (methacryloyloxymethyl) triethoxysilane, and epoxy-modified resin all contribute to waterproofing, further enhancing the composite panel's waterproof performance. Furthermore, the filler powder enhances the compressive strength of the connecting layer, giving the extruded composite panel excellent structural stability and compression resistance. This reduces the risk of damage and delamination from prolonged exposure to pressure and humidity, significantly improving the product's practicality and durability.

[0023] Preferably, the filling powder in the modifier of the extruded layer is PI powder and / or PEEK powder.

[0024] By adopting the above technical solution, the filler powder used in the modifier of the extruded layer is PI powder and / or PEEK powder. These high-performance polymer materials possess excellent mechanical properties and thermal stability. As fillers, they provide a supporting skeleton. Combined with olefinic polysiloxane, epoxy-modified resin, reactive diluent, and initiator, they further enhance the composite board's compression resistance. This improvement can significantly improve product durability and service life, particularly in load-bearing environments such as flooring, partitions, and countertops, reducing damage and delamination caused by prolonged pressure.

[0025] PI powder and PEEK powder are both high-performance polymer materials with excellent mechanical properties and thermal stability. As filling powders, they can play the role of supporting the skeleton and, in combination with alkenyl-containing polysiloxanes, epoxy-modified resins, active diluents, and initiators, further improve the compression resistance of the composite board.

[0026] By employing this technical solution, PI powder and PEEK powder, as high-performance polymer materials with excellent mechanical properties and thermal stability, serve as a supporting framework in the extruded layer. These filler powders synergize with alkenyl-containing polysiloxane, epoxy-modified resin, reactive diluent, and initiator to further enhance the composite board's compression resistance.

[0027] Preferably, the connecting layer is formed by curing an adhesive, and the adhesive is composed of the following raw materials in the following weight percentages:

[0028] Epoxy resin 55-70%

[0029] Curing agent 3-8%

[0030] Modifier 3-15%

[0031] The balance is epoxy resin diluent;

[0032] The modifier is prepared by mixing alkenyl-containing polysiloxane, methacryloyloxymethyl)triethoxysilane, epoxy modified resin, active diluent, initiator and filler powder in a weight ratio of 1: (0.1-0.3): (0.3-1.5): (1-3): (0.01-0.04): (1-3).

[0033] By adopting the above technical solution, a specific ratio of epoxy resin, curing agent, modifier, and epoxy resin diluent is added to the adhesive of the connecting layer, making the connecting layer not only have good water resistance and adhesion, but also significantly enhance the overall structural stability of the composite board. Specifically, the synergistic effect of alkenyl-containing polysiloxane, (methacryloyloxymethyl) triethoxysilane, and epoxy-modified resin improves the overall performance of the adhesive, especially maintaining good stability and durability in high-humidity environments. At the same time, the addition of filler powder further enhances the compressive strength of the connecting layer, thereby effectively preventing bending and delamination after long-term pressure, and improving the practicality and lifespan of the composite board.

[0034] Preferably, when a modifier is added, its comprehensive performance is further enhanced.

[0035] The filling powder in the modifier of the adhesive material consists of nitrile rubber powder, PI powder and PEEK powder in a weight ratio of 3: (0.5-1): (0.1-0.5).

[0036] By adopting the above technical solution, the connection layer of the composite board not only has high adhesion and waterproof properties, but also further enhances its compressive strength and stability. Specifically:

[0037] Enhanced compressive strength: The combination of NBR powder, PI powder, and PEEK powder significantly improves the mechanical properties of the connecting layer, especially its compressive strength. These high-performance polymer materials possess excellent mechanical properties and thermal stability, enabling them to maintain good structural integrity in long-term compressive environments.

[0038] Improve interlayer stability: The alkenyl-containing polysiloxane, methacryloxymethyltriethoxysilane, epoxy-modified resin and other ingredients in the modifier can effectively promote the dispersion of fillers, making the adhesion between the connecting layer and the extruded layer stronger, thereby reducing the layer structure shedding phenomenon caused by long-term use.

[0039] Improved waterproof performance: The various components in the modifier, such as alkenyl-containing polysiloxane, methacryloxymethyltriethoxysilane, and epoxy-modified resin, all have good waterproof properties, further improving the overall waterproof performance of the composite board. It is particularly suitable for applications in high-humidity environments and avoids damage caused by moisture penetration.

[0040] Preferably, the particle size of the filling powder is 1-20 μm.

[0041] By adopting the above technical solution, the particle size of the filler powder is controlled within the range of 1-20μm, which can effectively improve the uniformity and density of the internal structure of the composite board. Specifically, the smaller particle size helps the filler powder to be better dispersed in the modifier, thereby enhancing the overall mechanical properties of the composite material, especially the compressive strength and durability. At the same time, the fine particles can also increase the surface area, improve the compatibility and interfacial bonding with other components, and further enhance the interlayer connection stability and waterproof performance of the composite board. These improvements enable the composite board to exhibit better performance under long-term pressure and humid environments, reducing the risk of layer structure shedding and damage.

[0042] Preferably, the alkenyl-containing polysiloxane is vinyl-terminated dimethyl polysiloxane and / or polymethylsiloxane silsesquioxane crosslinked polymer.

[0043] By employing the aforementioned technical solution, vinyl-terminated dimethylpolysiloxane and / or polymethylsiloxane silsesquioxane crosslinked polymers as alkenyl-containing polysiloxanes can significantly improve the heat resistance and mechanical properties of the modifier, thereby further enhancing the overall stability of the composite board. These high-performance polysiloxane materials not only enhance the compression resistance of the extruded layer but also strengthen the adhesion between the tie layer and the surface layer, resulting in improved moisture resistance and durability of the composite board in high-humidity and high-pressure environments.

[0044] Preferably, the epoxy-modified resin is epoxy acrylate resin and / or novolac epoxy-modified vinyl ester resin.

[0045] By adopting the above technical solution, epoxy acrylate resin and / or novolac epoxy modified vinyl ester resin as epoxy modified resin can significantly improve the overall mechanical properties and chemical corrosion resistance of the composite board. Specifically:

[0046] Improve mechanical properties: Epoxy acrylate resin and phenolic epoxy modified vinyl ester resin both have high strength and toughness, which can effectively enhance the compressive and impact resistance of the extruded layer, thereby improving the mechanical properties of the entire composite board.

[0047] Improved interfacial bonding: These resins can better integrate with other components during the curing process, forming a tighter molecular network structure, thereby enhancing the bonding between the tie layer and the extruded layer, and further improving the interlayer stability of the composite board.

[0048] In summary, the selection of epoxy acrylate resin and / or phenolic epoxy modified vinyl ester resin as epoxy modified resin can significantly improve the comprehensive performance of building compression-resistant extruded composite panels, making them more suitable for various harsh use environments.

[0049] Preferably, the processing aid is one or more of an antioxidant, a lubricant, a colorant, and a foam stabilizer.

[0050] By adopting the above technical solutions, the processing of composite boards is more stable. Antioxidants can effectively prevent the material from oxidative degradation at high temperatures and extend the service life of the product. Lubricants help improve melt fluidity, reduce equipment wear and improve production efficiency. Colorants can adjust the product color as needed to meet different decorative requirements. Foam stabilizers ensure uniform pore distribution during the foaming process and improve the physical and mechanical properties of the product.

[0051] Preferably, the foam stabilizer is one or more of triphenyl phosphite, sorbitol, and pentaerythritol.

[0052] By adopting the above technical solution, using one or more of triphenyl phosphite, sorbitol, and pentaerythritol as foam stabilizers, the foaming process of the extruded layer can be effectively improved, making it more uniform and stable. This not only increases the overall density and mechanical properties of the composite board, but also enhances its durability and compression resistance, thereby reducing the risk of damage under long-term pressure and humid environments.

[0053] In a second aspect, a method for preparing a compression-resistant extruded composite board for construction comprises the following steps:

[0054] Modifier: heat-curing, drying, and crushing the modifier to obtain a solid modifier;

[0055] Weigh polystyrene, a foaming agent, a nucleating agent, a solid modifier, and a processing aid according to weight percentage, mix them evenly, and perform melt extrusion and foaming to obtain an extruded layer;

[0056] The adhesive is coated on both sides of the extruded layer to form a glue layer, and the surface layer is attached to the surfaces of the glue layers on both sides. The pressure is maintained and the glue layer is solidified to obtain a building compression-resistant extruded composite board.

[0057] By adopting the above technical solution, the preparation method ensures the effective introduction and uniform distribution of the modifier. Specifically, the treatment of the modifier: the modifier is heated, solidified, dried, and crushed to obtain a solid modifier. This process ensures the stability and activity of the modifier, allowing it to better perform in the subsequent mixing process.

[0058] Raw Material Mixing and Melt Extrusion: Weigh polystyrene, foaming agent, nucleating agent, solid modifier, and processing aid, calculated by weight percentage, and mix them evenly. Melt extrusion and foaming are then performed to produce the extruded layer. This step ensures thorough mixing of the components, enhancing the mechanical and physical properties of the extruded layer, particularly its compressive strength and durability.

[0059] Application of the adhesive: The adhesive is applied to both sides of the extruded layer to form a glue layer. A surface layer is then attached to the glue layer on both sides. Pressure is maintained and the glue layer is allowed to cure, ultimately resulting in a compression-resistant extruded composite panel. The adhesive contains a modifier, which further strengthens the bond between the connecting layer and the extruded layer, improving the overall stability and waterproof performance of the composite panel.

[0060] In summary, this preparation method effectively improves the layer structure stability, compression resistance and waterproof performance of building compression-resistant extruded composite panels. It is particularly suitable for high-humidity environments and occasions with high load-bearing requirements. It reduces problems such as damage and delamination after long-term use, and significantly improves the practicality and life of the product.

[0061] In summary, this application includes at least one of the following beneficial technical effects:

[0062] 1. By adding a specific proportion of modifiers to the extruded layer, especially alkenyl-containing polysiloxane, methacryloxymethyltriethoxysilane, epoxy-modified resin and other ingredients, the compressive strength and waterproof performance of the composite board are significantly enhanced, effectively reducing the bending and damage caused by long-term pressure in high-humidity environments;

[0063] 2. The connecting layer is made of an adhesive containing a modifier, which improves the adhesion between the connecting layer and the extruded layer and the surface layer, further enhancing the overall stability and anti-delamination ability of the composite board, and is especially suitable for applications with high load-bearing requirements; 3. The selection and ratio optimization of filler powder (such as PI powder and PEEK powder) not only increases the mechanical properties and thermal stability of the composite board, but also further enhances its compression resistance and wear resistance, thereby extending the service life of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0064] Figure 1 This is a cross-sectional view of a compression-resistant extruded composite board for construction according to the present application; DETAILED DESCRIPTION

[0065] The present application is further described in detail below with reference to the embodiments.

[0066] The epoxy resin diluent is 1,4-butanediol diglycidyl ether;

[0067] The active diluent is epoxidized soybean oil;

[0068] The number average molecular weight of polystyrene is 100,000-200,000;

[0069] The foaming agent is foaming agent H;

[0070] The nucleating agent is composed of nano-silica and benzoate in a weight ratio of 1:1;

[0071] The CAS number of vinyl-terminated dimethylpolysiloxane is 68083-19-2;

[0072] Methylsiloxane silsesquioxane crosspolymer KSP101, white powder;

[0073] The epoxy acrylate resin was allnex EBECRYL 605 / 20;

[0074] The phenolic epoxy-modified vinyl ester resin was model 977S from Jiangsu Zhipai Chemical Co., Ltd.;

[0075] Epoxy resin Zhenzhengfeng MF-3301;

[0076] Curing agent epoxy resin anhydride curing agent methyltetrahydrophthalic anhydride MTHPA.

[0077] Preparation example of modifier

[0078] Preparation Example 1

[0079] A modifier is prepared by the following method:

[0080] According to parts by weight, polysiloxane, (methacryloyloxymethyl)triethoxysilane, epoxy modified resin, active diluent, initiator, and filler powder are weighed and uniformly mixed in a weight ratio of 1:0.3:0.3:1:0.01:3 to obtain a modifier.

[0081] The filler powder is PI powder. The filler powder in the modifier of the adhesive is nitrile rubber powder, and the particle size of the filler powder is 5μm.

[0082] Preparation Example 2

[0083] Preparation Example 2 differs from Preparation Example 1 in that polysiloxane, (methacryloyloxymethyl)triethoxysilane, epoxy-modified resin, reactive diluent, initiator, and filler powder are weighed and uniformly mixed in a weight ratio of 1:0.2:1:2:0.03:2.

[0084] Preparation Example 3

[0085] Preparation Example 3 is different from Preparation Example 1 in that polysiloxane, (methacryloyloxymethyl)triethoxysilane, epoxy modified resin, reactive diluent, initiator, and filler powder are weighed and mixed uniformly in a weight ratio of 1:0.1:1.5:3:0.04:1.

[0086] Preparation Example 4

[0087] The difference between Preparation Example 4 and Preparation Example 2 is that the alkenyl polysiloxane is a polymethylsiloxane silsesquioxane cross-linked polymer.

[0088] Preparation Example 5

[0089] The difference between Preparation Example 5 and Preparation Example 4 is that the alkenyl-containing polysiloxane is composed of vinyl-terminated dimethyl polysiloxane and polymethylsiloxane silsesquioxane crosslinked polymer in a weight ratio of 1:1.

[0090] Preparation Example 6

[0091] The difference between Preparation Example 6 and Preparation Example 5 is that the epoxy-modified resin is a phenolic epoxy-modified vinyl ester resin.

[0092] Preparation Example 7

[0093] Preparation Example 7 is different from Preparation Example 5 in that the epoxy-modified resin is composed of epoxy acrylate resin and novolac epoxy-modified vinyl ester resin in a weight ratio of 1:2.

[0094] Preparation Example 8

[0095] The difference between Preparation Example 8 and Preparation Example 2 is that the filling powder is PEEK powder.

[0096] Preparation Example 9

[0097] The difference between Preparation Example 9 and Preparation Example 2 is that the filling powder is nitrile rubber powder.

[0098] Preparation Example 10

[0099] Preparation Example 10 differs from Preparation Example 7 in that the filling powder consists of PI powder and PEEK powder in a weight ratio of 3:1.

[0100] Preparation Example 11

[0101] Preparation Example 11 is different from Preparation Example 7 in that the filling powder is composed of nitrile rubber powder, PI powder, and PEEK powder in a weight ratio of 3:0.6:0.4.

[0102] Adhesive Preparation Example

[0103] Preparation Example 12

[0104] An adhesive is prepared by the following method:

[0105] According to weight percentage, 55% of epoxy resin, 3% of curing agent, 27% of epoxy resin diluent, and 15% of the modifier obtained in Preparation Example 1 were weighed and mixed evenly to obtain an adhesive.

[0106] The foam stabilizer is triphenyl phosphite.

[0107] Preparation Example 13

[0108] Preparation Example 13 differs from Preparation Example 11 in that the adhesive is prepared by the following method:

[0109] According to weight percentage, 63% of epoxy resin, 5% of curing agent, 21% of epoxy resin diluent, and 11% of the modifier obtained in Preparation Example 2 were weighed and mixed evenly to obtain an adhesive.

[0110] Preparation Example 14

[0111] Preparation Example 14 differs from Preparation Example 12 in that the adhesive is prepared by the following method:

[0112] According to weight percentage, 70% of epoxy resin, 8% of curing agent, 11% of epoxy resin diluent, and 11% of the modifier obtained in Preparation Example 3 were weighed and mixed evenly to obtain an adhesive.

[0113] Preparation Examples 15-22

[0114] Preparation Examples 15-22 differ from Preparation Example 13 in that the sources of the modifiers are different, as shown in Table 1.

[0115] Table 1 Sources of modifiers for preparing 12-22

[0116] Preparation Example Source of modifier Preparation Example 12 Preparation Example 1 Preparation Example 13 Preparation Example 2 Preparation Example 14 Preparation Example 3 Preparation Example 15 Preparation Example 4 Preparation Example 16 Preparation Example 5 Preparation Example 17 Preparation Example 6 Preparation Example 18 Preparation Example 7 Preparation Example 19 Preparation Example 8 Preparation Example 20 Preparation Example 9 Preparation Example 21 Preparation Example 10 Preparation Example 22 Preparation Example 11

[0117] Preparation Comparative Example

[0118] Preparation Comparative Example 1

[0119] The difference between Preparation Comparative Example 1 and Preparation Example 12 is that the modifier is replaced by epoxy resin in equal amount.

[0120] Example

[0121] Example 1

[0122] A building compression-resistant extruded composite panel includes an extruded layer, two connecting layers and two surface layers. The extruded layer is located between the two connecting layers, and both sides of the extruded layer are connected to the surface layers through the connecting layers. The thickness of the extruded layer is 20-100 mm, preferably 50 mm in this embodiment, the thickness of the connecting layer is 0.1-1 mm, preferably 0.2 mm in this embodiment, and the surface layer is a PET layer with a thickness of 1-30 mm, preferably 2 mm in this embodiment.

[0123] The building compression-resistant extruded composite board is prepared by the following method:

[0124] Modifier: The modifier obtained in Preparation Example 1 was heated to 70°C and cured for 20 minutes. The product was then dried in an oven at 50°C for 2 hours, crushed in a grinder, and sieved through 500 mesh to obtain a solid modifier.

[0125] According to the weight percentage of the extruded layer, 64% polystyrene, 5% foaming agent, 3% nucleating agent, 20% solid modifier and 8% processing aid are weighed and mixed evenly, and melt extruded and foamed to obtain an extruded layer; the processing aid is composed of an antioxidant, a colorant and a foam stabilizer in a weight ratio of 1:2:5; the foam stabilizer is polyacrylamide, the antioxidant is antioxidant 1010, and the colorant is phthalocyanine blue.

[0126] The adhesive of Preparation Example 12 is coated on both sides of the extruded layer to form a glue layer, and a surface layer is attached to the surface of the glue layer on both sides, and the pressure is maintained and the glue layer is cured to obtain a building compression-resistant extruded composite board. Figure 1 It is the cross-sectional structure of technical composite panel.

[0127] Example 2

[0128] The difference between Example 2 and Example 1 is that the amount of raw materials used in the extrusion layer is different, as follows:

[0129] According to the weight percentage of the extruded layer, 80% polystyrene, 3% foaming agent, 2% nucleating agent, 11% solid modifier, and 4% processing aid are prepared, wherein the solid modifier is obtained by the method of Example 1 of the modifier obtained in Preparation Example 2.

[0130] Example 3

[0131] The difference between Example 3 and Example 1 is that the amount of raw materials used in the extrusion layer is different, as follows:

[0132] According to the weight percentage of the extruded layer, 90% polystyrene, 1% foaming agent, 1% nucleating agent, 5% solid modifier, and 3% processing aid are prepared, wherein the solid modifier is obtained by the method of Example 1 of the modifier obtained in Preparation Example 3.

[0133] Examples 4-7

[0134] The difference between Examples 4-7 and Example 2 is that the sources of the modifiers used in the extruded layer are different, as shown in Table 2.

[0135] Table 2 Sources of modifiers used in the extruded layers of Examples 1-7

[0136] Example Sources of modifiers used in extruded layers Example 1 Preparation Example 1 Example 2 Preparation Example 2 Example 3 Preparation Example 3 Example 4 Preparation Example 4 Example 5 Preparation Example 5 Example 6 Preparation Example 6 Example 7 Preparation Example 7 Example 8 Preparation Example 8 Example 9 Preparation Example 10

[0137] Examples 10-19

[0138] The difference between Examples 10-19 and Example 9 is that the sources of the adhesive are different, as shown in Table 3;

[0139] Table 3 The sources of the adhesives in Examples 10-19 are different

[0140] Example Source of adhesive Example 10 Preparation Example 13 Example 11 Preparation Example 14 Example 12 Preparation Example 15 Example 13 Preparation Example 16 Example 14 Preparation Example 17 Example 15 Preparation Example 18 Example 16 Preparation Example 19 Example 17 Preparation Example 20 Example 18 Preparation Example 21 Example 19 Preparation Example 22

[0141] Comparative Example

[0142] Comparative Example 1

[0143] The difference between Comparative Example 1 and Example 1 is that the solid modifier in the extrusion layer is replaced by filler powder.

[0144] Comparative Example 2

[0145] The difference between Comparative Example 2 and Example 1 is that the modifier in the adhesive is replaced with epoxy resin.

[0146] Comparative Example 3

[0147] The difference between Comparative Example 3 and Example 1 is that, based on Comparative Example 2, the solid modifier in the extrusion layer is replaced with filler powder.

[0148] Comparative Example 4

[0149] The difference between Comparative Example 4 and Example 1 is that the alkenyl-containing polysiloxane in the extruded layer is replaced by an epoxy-modified resin in equal amounts.

[0150] Comparative Example 5

[0151] The difference between Comparative Example 5 and Example 1 is that the epoxy-modified resin in the glue layer is replaced by an equal amount of alkenyl-containing polysiloxane.

[0152] Performance testing

[0153] The architectural compression-resistant extruded composite panels obtained in Examples 1-19 and Comparative Examples 1-5 were cut into test samples of corresponding sizes and then used in the following experimental tests, as shown in Table 4.

[0154] Test Method / Test Method Test 1: The test samples obtained in Examples 1-19 and Comparative Examples 1-5 were tested with their dimensions according to GB / T 2792-1998. The connection between the extruded layer and a connecting layer was scratched 1 mm, and then the peeling force was tested.

[0155] Test 2: The test samples obtained from Examples 1-19 and Comparative Examples 1-5 were placed in a double 85 test box and subjected to a double 85 test for 7 days. The samples were taken out and air-dried, and then the peel force was tested in the same manner as in Test 1. The peel force reduction rate was calculated as the peel force of Test 1 minus the peel force of Test 2 minus the peel force of Test 1, and the result was multiplied by 100%.

[0156] Test 3: The test samples obtained in Examples 1-19 and Comparative Examples 1-5 were subjected to compression tests with dimensions according to GB / T 10801.2-2018.

[0157] The above experimental data are shown in Table 4.

[0158] Table 4 Experimental data of Examples 1-19 and Comparative Examples 1-5

[0159]

[0160]

[0161] Combining Example 1 and Comparative Examples 1-5 and Table 4, it can be seen that the peel force and compressive strength of Comparative Examples 1-5 are smaller than those of Example 1, while the peel force reduction rate is greater than that of Example 1, indicating that the modifier prepared by using polysiloxane, (methacryloyloxymethyl) triethoxysilane, epoxy modified resin, reactive diluent, initiator, and filler powder is applied to the adhesive and the plastic layer, which can further improve the compression resistance of the building extruded composite board.

[0162] Combining Example 7 with Example 9 and Table 4, it can be seen that the compressive strength of Example 7 is smaller than that of Example 9, while the peel force reduction rate is greater than that of Example 9, indicating that the compounding of PI powder and PEEK powder plays a synergistic role and further improves its compression performance.

[0163] From Example 10 and Table 3, it can be seen that the peeling force and compressive strength of Example 7 are both smaller than those of Example 10, indicating that the compounding of nitrile rubber powder, PI powder and PEEK powder further enhances the comprehensive performance.

[0164] Combining Example 7, Example 5, Example 19 and Table 4, it can be seen that the peel force and compressive strength of Example 5 are lower than those of Example 7 and Example 19, and the peel force reduction rate is higher than that of Example 7 and Example 19, indicating that the epoxy acrylate resin and the phenolic epoxy modified vinyl ester resin are compounded to play a synergistic role, which can enhance adhesion and compressive strength and avoid the possibility of falling off in a high humidity environment.

[0165] This specific embodiment is merely an explanation of the present application and is not a limitation of the present application. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed, but as long as they are within the scope of the claims of the present application, they are protected by the patent law.

Claims

1. A building compression-resistant extruded composite board, characterized in that: The extruded layer comprises an extruded layer, two connecting layers and two surface layers, wherein the extruded layer is located between the two connecting layers, and both sides of the extruded layer are connected to the surface layers through the connecting layers. The extruded layer is made of the following raw materials in the following weight percentages: Polystyrene 70-90% Foaming agent 1-5% Nucleating agent 1-3% Modifier 5-20% The balance is processing aids; The modifier is prepared by mixing alkenyl-containing polysiloxane, methacryloxymethyltriethoxysilane, epoxy modified resin, reactive diluent, initiator, and filler powder in a weight ratio of 1: (0.1-0.3): (0.3-1.5): (1-3): (0.01-0.04): (1-3); the connecting layer is prepared by an adhesive containing the modifier; The connecting layer is formed by curing an adhesive, and the adhesive is composed of the following raw materials in the following weight percentages: Epoxy resin 55-70% Curing agent 3-8% Modifier 3-15% The balance is epoxy resin diluent; The modifier in the adhesive is obtained by mixing alkenyl-containing polysiloxane, methacryloxymethyltriethoxysilane, epoxy modified resin, reactive diluent, initiator, and filler powder in a weight ratio of 1: (0.1-0.3): (0.3-1.5): (1-3): (0.01-0.04): (1-3); The filler powder in the modifier in the extruded layer is PI powder and PEEK powder; the alkenyl-containing polysiloxane is vinyl-terminated dimethyl polysiloxane and / or polymethylsiloxane silsesquioxane crosslinked polymer.

2. The compression-resistant extruded composite board for construction according to claim 1, characterized in that: The filling powder in the modifier of the adhesive material is composed of nitrile rubber powder, PI powder and PEEK powder in a weight ratio of 3: (0.5-1): (0.1-0.5).

3. The compression-resistant extruded composite board for construction according to claim 1, characterized in that: The particle size of the filling powder is 1-20 μm.

4. The compression-resistant extruded composite board for construction according to claim 1, characterized in that: The epoxy modified resin is epoxy acrylate resin and / or novolac epoxy modified vinyl ester resin.

5. The compression-resistant extruded composite board for construction according to claim 1, characterized in that: The processing aid is one or more of an antioxidant, a lubricant, a colorant, and a foam stabilizer.

6. The compression-resistant extruded composite board for construction according to claim 5, characterized in that: The foam stabilizer is composed of one or more of triphenyl phosphite, sorbitol and pentaerythritol.

7. A method for preparing a compression-resistant extruded composite board for construction according to any one of claims 1 to 6, characterized in that: The following steps are involved: Modifier: heat-curing, drying, and crushing the modifier to obtain a solid modifier; Weigh polystyrene, a foaming agent, a nucleating agent, a solid modifier, and a processing aid according to weight percentage, mix them evenly, and perform melt extrusion and foaming to obtain an extruded layer; The adhesive is coated on both sides of the extruded layer to form a connecting layer, and the surface layer is attached to the surfaces of the connecting layers on both sides. The pressure is maintained and the connecting layer is solidified to obtain a building compression-resistant extruded composite board.

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