Cutting device and method suitable for substrate glass
By setting arc guide rails and breaking power devices in the glass substrate cutting device to determine the position of the arc center and breaking center, the production demand problem that the prior art cannot meet the requirements of large-size glass and high-quality, achieving efficient and accurate glass cutting, improving product quality and cutting efficiency.
Patent Information
- Application Number
- CN202411929018.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-03-28
AI Technical Summary
The existing glass substrate cutting technology cannot meet the production needs of large-size glass and high-quality requirements, resulting in short service life, high cost and insufficient production capacity of cutting mechanisms.
By setting arc guide rails and breaking power devices in the cutting device, the positions of the arc center and breaking center are determined, and the relationship between the cutter head scribe center and breaking center is controlled, so as to achieve efficient and precise cutting of the substrate glass.
It effectively reduces adverse effects caused by cutting, such as pulling and edge rubbing, improves product quality and cutting efficiency, and is suitable for substrate glass of various sizes.
Smart Images
Figure CN119707269A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of flat glass substrate manufacturing, and in particular to a cutting device and method suitable for substrate glass. Background Art
[0002] Glass cutting is an important part of the LCD manufacturing industry. As the requirements of customers and users continue to increase, cost pressure is increasing. The current hourly production capacity is no longer enough to meet current production and market needs. The production line needs to continuously increase production capacity to cope with market changes.
[0003] Since the original design of the glass substrate line is based on the original small size and slow beat design, but with the development of the substrate glass industry to large size, customers have higher and higher requirements for glass quality. Under the faster and faster beat, the same material and design method can no longer meet the existing industry use. The original cutting mechanism on site can no longer meet the existing method, the service life is relatively short, and the cost is relatively high.
[0004] It can be seen that the existing technology can no longer solve the practical problems encountered in current production. Summary of the invention
[0005] The object of the present invention is to provide a cutting device and method suitable for substrate glass to overcome the problems existing in the prior art. The present invention can adjust the position after breaking by selecting different arc guide rails to determine different arc centers, that is, the positions of breaking centers, and controlling the distances between different breaking centers; at the same time, the cutting center and the breaking center of the blade are made inconsistent, which can effectively reduce the adverse effects caused by cutting; in addition, the present invention can achieve different effects through different breaking centers and can be used in different industries.
[0006] In order to achieve the above object, the technical solution adopted by the present invention is as follows: A cutting device suitable for substrate glass comprises a frame, a slide device is installed on one side of the frame, the slide device comprises an arc guide rail, the arc guide rail is installed on one side of the frame, a plurality of moving blocks are slidably connected to the arc guide rail, the rear parts of the plurality of moving blocks are connected to an adsorption device through a mounting plate, the adsorption device comprises an adsorption device body, a suction cup is installed on the top of the adsorption device body, a breaking power device is installed between the mounting plate and the frame; a mounting base is fixed on the top of the frame, a cutting board mounting seat is installed on the top of the mounting base, and a cutting board strip is installed on the cutting board mounting seat; a cutter head column is fixed on the other side of the frame, the cutter head column is connected to a cutter head device through a connecting piece, the cutter head device comprises a cutter head device body, a cutting cutter head is installed on the bottom of the cutter head device body, and the cutter head device body is connected to the cutter head column through a connecting piece; Further, the radius of the arc-shaped guide rail is 500-800 mm; Furthermore, the hardness of the cutting board strip is 50-70 HRC.
[0007] A cutting method applicable to substrate glass, based on the above-mentioned cutting device applicable to substrate glass, comprises the following steps: Step 1: Install the arc guide rail of the target radius on one side of the rack, and then install the substrate glass on the anvil strip; Step 2: Breaking off the power device drives the adsorption device to move circumferentially to the bottom of the substrate glass through the arc guide rail, and the suction cup of the adsorption device adsorbs the bottom of the substrate glass; Step 3: After the cutting head of the cutting head device scribes the top surface of the substrate glass according to the center of the cutting head, it stays at the edge of the anvil strip. At this time, the distance between the suction cup and the cutting head is L1, and the distance between the cutting head and the center of the cutting head is L3; Step 4: Determine the breaking center through the marking center of the cutter head, and the breaking center is consistent with the arc center of the arc guide rail; Step 5: The breaking power device drives the adsorption device to move circumferentially through the arc guide rail, and the circumferential movement of the adsorption device generates a pulling force on the substrate glass to break the substrate glass; Furthermore, in step 2, the suction cup adsorption pressure is -0.045~-0.085 Mpa; Furthermore, in step 2, the suction length of the suction cup is L2; Furthermore, L1 and L2 satisfy: 3L2≥L1≥1.5L2; Further, L3 in step 3 is 1-3 mm; Furthermore, the breaking center is determined by the cutter head scoring center in step 4 as follows: the breaking center is the bottom of the substrate glass just below the cutter head scoring center on the top surface of the substrate glass; Furthermore, in the step five, the substrate glass is broken at a breaking angle of 2° to 15°.
[0008] The above technical solution has the following advantages or beneficial effects: The present invention provides a cutting device suitable for substrate glass. By setting an arc guide rail, the center of the arc can be determined; by setting a breaking power device, an adsorption device can be driven to move circumferentially on the arc guide rail, so that the substrate glass can be fixed and broken in a guiding direction; by setting a cutter head device, the cutting center of the cutter head can be determined, so that the positions of the breaking center / arc center and the cutter head cutting center are inconsistent, thereby preventing the adverse effects of cutting on the substrate glass and improving product quality.
[0009] Furthermore, by selecting different arc guide rail radii, the position of the arc center can be changed, that is, the position of the breaking center can be changed to adapt to substrate glasses of various sizes.
[0010] Furthermore, by controlling the hardness of the cutting board strips, the cutting board strips can have a buffering function, and will not deform when the board is broken, thereby preventing the cutting board strips from affecting the breaking result.
[0011] The present invention provides a cutting method suitable for substrate glass, in which a cutter head device is used to perform scoring according to the cutter head scoring center, an adsorption device is used to realize fixation before breaking, and a breaking power device drives the adsorption device to break. The position after breaking is adjusted by determining the center of the arc, that is, the position of the breaking center, and controlling the distances between different breaking centers. At the same time, the cutter head scoring center and the breaking center are made inconsistent, which can prevent obvious pulling and edge rubbing, effectively reduce adverse effects caused by cutting, and is beneficial to improving the quality of broken products.
[0012] Furthermore, by controlling the adsorption pressure of the suction cup, the entire breaking process can be accurately controlled to reduce adverse effects on the substrate glass and improve product quality.
[0013] Furthermore, by flexibly controlling the sizes of L1, L2 and L3, different forms of adsorption can be achieved to achieve different effects, thereby enhancing the flexibility of the device.
[0014] Furthermore, the existing devices often use a method in which the breaking center is consistent with the cutting center of the blade. The present method can prevent obvious pulling and rubbing of the edges by setting the breaking center inconsistent with the cutting center of the blade, thereby effectively reducing the adverse effects caused by cutting.
[0015] Furthermore, by setting the breaking angle, the breaking can be achieved more accurately, and the adverse effects of the breaking on the substrate glass can be prevented, thereby improving the quality of the product. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a structural schematic diagram of a cutting device suitable for substrate glass of the present invention; Figure 2 A schematic diagram of the suction length L2 and the distance L1 between the suction cup and the cutting blade head of a cutting device suitable for substrate glass of the present invention; Figure 3 A schematic diagram of the breaking center position of a cutting device suitable for substrate glass according to the present invention; Figure 4 A schematic flow chart of a cutting method applicable to substrate glass according to the present invention; In the figure, 1-frame; 11-mounting base; 12-cutter head column; 2-mounting plate; 3-breaking power device; 4-adsorption device; 5-arc guide rail; 51-moving block; 6-anvil strip; 61-anvil mounting seat; 7-cutting head. DETAILED DESCRIPTION
[0017] The present invention is further described in detail below in conjunction with specific embodiments, which are intended to explain the present invention rather than to limit it. In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention. It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.
[0018] Embodiment 1: like Figure 1 As shown, the present invention provides a cutting device suitable for substrate glass, including a frame 1, a mounting base 11, a mounting plate 2, a cutter head column 12, a breaking power device 3, an adsorption device 4, a slide device, an anvil mounting seat 61, an anvil strip 6, a cutter head device and a cutting cutter head 7; the adsorption device 4 includes an adsorption device body and a suction cup; the slide device includes an arc guide rail 5 and a moving block 51; the cutter head device includes a cutter head device body and a cutting cutter head 7; A slide device is installed on one side of the frame 1, and the slide device includes an arc-shaped guide rail 5, which is installed on one side of the frame 1. The arc-shaped guide rail 5 is slidably connected to two moving blocks 51, and the rear parts of the two moving blocks 51 are connected to an adsorption device 4 through a mounting plate 2. The adsorption device 4 includes an adsorption device body, and a suction cup is installed on the top of the adsorption device body. A breaking power device 3 is installed between the mounting plate 2 and the frame 1; a mounting base 11 is fixed on the top of the frame 1, and a cutting board mounting seat 61 is installed on the top of the mounting base 11, and a cutting board strip 6 is installed on the cutting board mounting seat 61; a cutter head column 12 is fixed on the other side of the frame 1, and the cutter head column 12 is connected to the cutter head device body through a connecting pipe, and a cutting cutter head 7 is installed at the bottom of the cutter head device body; Preferably, the radius of the arc-shaped guide rail 5 is 500 mm; Preferably, the hardness of the cutting board strip 6 is 50 HRC.
[0019] Embodiment 2: like Figure 1 As shown, the present invention provides a cutting device suitable for substrate glass, including a frame 1, a mounting base 11, a mounting plate 2, a cutter head column 12, a breaking power device 3, an adsorption device 4, a slide device, an anvil mounting seat 61, an anvil strip 6, a cutter head device and a cutting cutter head 7; the adsorption device 4 includes an adsorption device body and a suction cup; the slide device includes an arc guide rail 5 and a moving block 51; the cutter head device includes a cutter head device body and a cutting cutter head 7; A slide device is installed on one side of the frame 1, and the slide device includes an arc-shaped guide rail 5, which is installed on one side of the frame 1. The arc-shaped guide rail 5 is slidably connected to three moving blocks 51, and the rear parts of the three moving blocks 51 are connected to an adsorption device 4 through a mounting plate 2. The adsorption device 4 includes an adsorption device body, and a suction cup is installed on the top of the adsorption device body. A breaking power device 3 is installed between the mounting plate 2 and the frame 1; a mounting base 11 is fixed on the top of the frame 1, and a cutting board mounting seat 61 is installed on the top of the mounting base 11, and a cutting board strip 6 is installed on the cutting board mounting seat 61; a cutter head column 12 is fixed on the other side of the frame 1, and the cutter head column 12 is connected to the cutter head device body through a connecting plate, and a cutting cutter head 7 is installed at the bottom of the cutter head device body; Preferably, the radius of the arc-shaped guide rail 5 is 700 mm; Preferably, the hardness of the cutting board strip 6 is 60 HRC.
[0020] Embodiment 3: like Figure 1As shown, the present invention provides a cutting device suitable for substrate glass, including a frame 1, a mounting base 11, a mounting plate 2, a cutter head column 12, a breaking power device 3, an adsorption device 4, a slide device, an anvil mounting seat 61, an anvil strip 6, a cutter head device and a cutting cutter head 7; the adsorption device 4 includes an adsorption device body and a suction cup; the slide device includes an arc guide rail 5 and a moving block 51; the cutter head device includes a cutter head device body and a cutting cutter head 7; A slide device is installed on one side of the frame 1, and the slide device includes an arc guide rail 5, which is installed on one side of the frame 1. The arc guide rail 5 is slidably connected to four moving blocks 51, and the rear parts of the four moving blocks 51 are connected to an adsorption device 4 through a mounting plate 2. The adsorption device 4 includes an adsorption device body, and a suction cup is installed on the top of the adsorption device body. A breaking power device 3 is installed between the mounting plate 2 and the frame 1; a mounting base 11 is fixed on the top of the frame 1, and a cutting board mounting seat 61 is installed on the top of the mounting base 11, and a cutting board strip 6 is installed on the cutting board mounting seat 61; a cutter head column 12 is fixed on the other side of the frame 1, and the cutter head column 12 is connected to the cutter head device body through a connecting pipe, and a cutting cutter head 7 is installed at the bottom of the cutter head device body; Preferably, the radius of the arc-shaped guide rail 5 is 800 mm; Preferably, the hardness of the anvil strip 6 is 70 HRC.
[0021] Embodiment 4: like Figure 2 , Figure 3 and Figure 4 As shown, the present invention provides a cutting method applicable to substrate glass, based on the above-mentioned cutting device applicable to substrate glass, comprising the following steps: Step 1: install an arc-shaped guide rail 5 with a radius of 500 mm on one side of the frame 1, and then install the substrate glass on the anvil strip 6; Step 2: The breaking power device 3 drives the adsorption device 4 to move circumferentially to the bottom of the substrate glass through the arc guide rail 5. The suction cup of the adsorption device 4 adsorbs the bottom of the substrate glass at a pressure of -0.045 MPa. The adsorption length of the suction cup is L2, and L2=40 mm. Step 3: After the cutting head 7 of the cutting head device scribes the top surface of the substrate glass according to the center of the cutting head scribe line, it stays at the edge of the anvil strip 6. At this time, the distance between the suction cup and the cutting head 7 is L1, L1=60 mm, and the distance between the cutting head 7 and the center of the cutting head scribe line is L3=1 mm. Preferably, L1 and L2 satisfy: 3L2≥L1≥1.5L2; Step 4: determine the breaking center by the cutter head scoring center. The breaking center is the bottom of the substrate glass just below the cutter head scoring center on the top surface of the substrate glass. The breaking center is consistent with the arc center of the arc guide rail 5, with an error of ≤1 mm. Step 5: The breaking power device 3 drives the adsorption device 4 to move circumferentially through the arc guide rail 5. The circumferential movement of the adsorption device 4 generates a pulling force on the substrate glass, and the substrate glass is broken at an angle of 2°.
[0022] Embodiment 5: As 2, Figure 3 and Figure 4 As shown, the present invention provides a cutting method applicable to substrate glass, based on the above-mentioned cutting device applicable to substrate glass, comprising the following steps: Step 1: Install an arc guide rail 5 with a radius of 600 mm on one side of the frame 1, and then install the substrate glass on the anvil strip 6; Step 2: The breaking power device 3 drives the adsorption device 4 to move circumferentially to the bottom of the substrate glass through the arc guide rail 5. The suction cup of the adsorption device 4 adsorbs the bottom of the substrate glass at a pressure of -0.080 MPa. The adsorption length of the suction cup is L2, and L2=50 mm. Step 3: After the cutting head 7 of the cutting head device scribes the top surface of the substrate glass according to the center of the cutting head scribe line, it stays at the edge of the anvil strip 6. At this time, the distance between the suction cup and the cutting head 7 is L1, L1=80 mm, and the distance between the cutting head 7 and the center of the cutting head scribe line is L3, L3=2 mm. Preferably, L1 and L2 satisfy: 3L2≥L1≥1.5L2; Step 4: determine the breaking center by the cutter head scoring center. The breaking center is the bottom of the substrate glass just below the cutter head scoring center on the top surface of the substrate glass. The breaking center is consistent with the arc center of the arc guide rail 5, with an error of ≤1 mm. Step 5: The breaking power device 3 drives the adsorption device 4 to move circumferentially through the arc guide rail 5. The circumferential movement of the adsorption device 4 generates a pulling force on the substrate glass, and the substrate glass is broken at an angle of 11°.
[0023] Embodiment 6: like Figure 2 , Figure 3 and Figure 4 As shown, the present invention provides a cutting method applicable to substrate glass, based on the above-mentioned cutting device applicable to substrate glass, comprising the following steps: Step 1: Install an arc guide rail 5 with a radius of 800 mm on one side of the frame 1, and then install the substrate glass on the anvil strip 6; Step 2: The breaking power device 3 drives the adsorption device 4 to move circumferentially to the bottom of the substrate glass through the arc guide rail 5. The suction cup of the adsorption device 4 adsorbs the bottom of the substrate glass at a pressure of -0.085 MPa. The adsorption length of the suction cup is L2, and L2=60 mm. Step 3: After the cutting head 7 of the cutting head device scribes the top surface of the substrate glass according to the center of the cutting head scribe line, it stays at the edge of the anvil strip 6. At this time, the distance between the suction cup and the cutting head 7 is L1, L1=90 mm, and the distance between the cutting head 7 and the center of the cutting head scribe line is L3, L3=3 mm. Preferably, L1 and L2 satisfy: 3L2≥L1≥1.5L2; Step 4: determine the breaking center through the cutter head scoring center. The breaking center is the bottom of the substrate glass just below the cutter head scoring center on the top surface of the substrate glass. The breaking center is consistent with the arc center of the arc guide rail 5, with an error of ≤1 m. Step 5: The breaking power device 3 drives the adsorption device 4 to move circumferentially through the arc guide rail 5. The circumferential movement of the adsorption device 4 generates a pulling force on the substrate glass, and the substrate glass is broken at an angle of 15°.
[0024] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A cutting device suitable for substrate glass, characterized in that: The invention comprises a frame (1), a slide device is installed on one side of the frame (1), the slide device comprises an arc-shaped guide rail (5), the arc-shaped guide rail (5) is installed on one side of the frame (1), the arc-shaped guide rail (5) is slidably connected to a plurality of moving blocks (51), the rear parts of the plurality of moving blocks (51) are connected to an adsorption device (4) through a mounting plate (2), the adsorption device (4) comprises an adsorption device body, a suction cup is installed on the top of the adsorption device body, and a breaking power device is installed between the mounting plate (2) and the frame (1). The frame (1) is provided with a mounting base (11) fixed on the top, a cutting board mounting base (61) is mounted on the top of the mounting base (11), and a cutting board strip (6) is mounted on the cutting board mounting base (61); a cutter head column (12) is fixed on the other side of the frame (1), the cutter head column (12) is connected to a cutter head device via a connecting piece, the cutter head device comprises a cutter head device body, a cutting cutter head (7) is mounted on the bottom of the cutter head device body, and the cutter head device body is connected to the cutter head column (12) via a connecting piece.
2. The cutting device for substrate glass according to claim 1, characterized in that: The radius of the arc-shaped guide rail (5) is 500-800 mm.
3. The cutting device for substrate glass according to claim 1, characterized in that: The hardness of the anvil strip (6) is 50-70 HRC.
4. A cutting method for substrate glass, based on a cutting device for substrate glass according to any one of claims 1 to 3, characterized in that: The following steps are involved: S1, installing an arc-shaped guide rail (5) of a target radius on one side of a frame (1), and then installing the substrate glass on an anvil strip (6); S2, the breaking power device (3) drives the adsorption device (4) to move circumferentially to the bottom of the substrate glass through the arc-shaped guide rail (5), and the suction cup of the adsorption device (4) adsorbs the bottom of the substrate glass; S3, after the cutting head (7) of the cutting head device scribes the top surface of the substrate glass according to the center of the cutting head scribe line, it stays at the edge of the anvil strip (6), at which time the distance between the suction cup and the cutting head (7) is L1, and the distance between the cutting head (7) and the center of the cutting head scribe line is L3; S4, determining the breaking center by the marking center of the cutter head, the breaking center being consistent with the arc center of the arc guide rail (5); S5, the breaking power device (3) drives the adsorption device (4) to move circumferentially via the arc-shaped guide rail (5), and the circumferential movement of the adsorption device (4) generates a pulling force on the substrate glass, thereby breaking the substrate glass.
5. The cutting method for substrate glass according to claim 4, characterized in that: The suction pressure of the suction cup in S2 is -0.045~-0.085 Mpa.
6. A cutting method for substrate glass according to claim 4, characterized in that: The suction length of the suction cup in S2 is L2.
7. A cutting method for substrate glass according to claim 6, characterized in that: The L1 and L2 satisfy: 3L2≥L1≥1.5L2.
8. The cutting method for substrate glass according to claim 4, characterized in that: The L3 in the S3 is 1-3 mm.
9. A cutting method for substrate glass according to claim 4, characterized in that: Specifically, the breaking center is determined by the cutter head scoring center in S4: the breaking center is the bottom of the substrate glass just below the cutter head scoring center on the top surface of the substrate glass.
10. A cutting method for substrate glass according to claim 4, characterized in that: In the S5, the substrate glass is broken at an angle of 2° to 15°.