Coated glass, laminated glass and method for producing coated glass

Abstract

The application provides a coated glass, a laminated glass and a preparation method of the coated glass. The coated glass comprises a first substrate and a coating structure. The coating structure is arranged on the first substrate. The coating structure comprises at least two functional stacks and at least one intermediate layer. The at least two functional stacks are sequentially arranged on the first substrate, and each functional stack comprises a first dielectric layer, a metal layer and a second dielectric layer which are sequentially arranged. The metal layer is arranged between the first dielectric layer and the second dielectric layer. The at least one intermediate layer is arranged between adjacent two functional stacks. The at least one intermediate layer comprises a ceramic ZnSnO3 layer. The refractive index n of the ceramic ZnSnO3 layer is 1.95-2.05. The extinction coefficient k of the ceramic ZnSnO3 layer is 2.0*10 ‑3 -7.0*10 ‑3 The coated glass provided by the application has higher mechanical performance and sufficient hardness to resist various scratches in a deep processing process.

Description

Technical Field

[0001] This application relates to the field of glass technology, and in particular to a method for preparing coated glass, laminated glass, and coated glass. Background Technology

[0002] Low-emissivity (Low-E) glass is popular among customers due to its energy-saving, heat-insulating, and sun-shading properties. Its main applications are energy-saving glass for glass curtain walls and automotive windshields. Low-emissivity glass achieves these properties through a low-emissivity coating structure; however, the mechanical properties of the coating layer are currently poor, making it easily scratched by hard objects, resulting in a low yield rate during further processing. Summary of the Invention

[0003] The purpose of this application is to provide a method for preparing coated glass, laminated glass, and coated glass, wherein the coated glass has higher mechanical properties and sufficient hardness to resist various scratches during deep processing.

[0004] This application provides a coated glass, the coated glass comprising:

[0005] First substrate; and

[0006] A coating structure is disposed on a first substrate. The coating structure includes at least two functional layers and at least one intermediate layer. The at least two functional layers are sequentially stacked on the first substrate in a direction away from the first substrate. Each functional layer includes a first dielectric layer, a metal layer, and a second dielectric layer sequentially stacked. The metal layer is disposed between the first dielectric layer and the second dielectric layer. An intermediate layer is disposed between two adjacent functional layers. At least one intermediate layer includes a ceramic ZnSnO3 layer, wherein the refractive index n of the ceramic ZnSnO3 layer is 1.95 to 2.05, and the extinction coefficient k of the ceramic ZnSnO3 layer is 2.0*10. -3 ~7.0*10 -3 .

[0007] This application provides a coated glass that uses a ceramic ZnSnO3 layer as the intermediate layer of the coating structure. On one hand, the ceramic ZnSnO3 layer possesses the excellent thermal ductility of metal oxides, enabling it to serve as an intermediate layer in the coating structure to connect the metal layer and non-metal materials. This prevents the coating structure from cracking during heat treatment due to significant differences in the thermal expansion coefficients of the metal and non-metal layers. On the other hand, compared to other materials, it has a refractive index n value of 1.95–2.05 and an extinction coefficient k value of 2.0*10. -3 ~7.0*10 -3The ceramic ZnSnO3 layer has high density, which can improve the film hardness of the ceramic ZnSnO3 layer, thereby improving the film hardness of the coating structure. When the ceramic ZnSnO3 layer is used as an intermediate layer, it can improve the overall hardness of the coating structure. On the one hand, it solves the problem of poor mechanical properties of the film in the existing coating structure, and on the other hand, it makes the coated glass have higher mechanical properties, thus having sufficient hardness to resist various scratches during deep processing.

[0008] In one possible implementation, the coating structure further includes an adhesion layer and a protective layer, the adhesion layer being disposed on the surface of the first substrate, and at least two functional stacks being disposed on the side of the adhesion layer opposite to the first substrate.

[0009] In one possible implementation, the adhesion layer includes at least one of SiAlZrNx layer, ZrOx layer, NbOx layer, SiNx layer, ZnSnOx layer, SiZrNx layer and ceramic ZnSnO3 layer.

[0010] In one possible implementation, the coating structure further includes a protective layer disposed on the side of at least two functional layers opposite to the adhesion layer, and at least one of the adhesion layer and the protective layer includes a ceramic ZnSnO3 layer.

[0011] In one possible implementation, along the direction away from the first substrate, the protective layer includes an inner protective layer and an outer protective layer. The inner protective layer is disposed on the side of at least two functional stacks away from the adhesion layer, and the outer protective layer is disposed on the side of the inner protective layer away from the at least two functional stacks. The inner protective layer includes a ceramic ZnSnO3 layer.

[0012] In one possible implementation, the inner protective layer includes a first protective layer and a second protective layer. The first protective layer is disposed on the side of at least two functional layers away from the adhesion layer, and the second protective layer is disposed between the first protective layer and the outer protective layer. The second protective layer is a ceramic ZnSnO3 layer.

[0013] In one possible implementation, the material of the first protective layer is selected from oxides of at least one element selected from Zn, Mg, Sn, Ti, Nb, and Zr.

[0014] In one possible implementation, the outer protective layer includes at least one of the following: SiAlZrNx layer, SiZrNx layer, ZrOx layer, SiNx layer, SiZrOx layer, and SiAlZrOx layer.

[0015] In one possible implementation, the first dielectric layer includes at least one of an AZO layer, a Ti alloy layer, an NbOx layer, a TiOx layer, a NiCr layer, a NiCrOx layer, a ZnAlOx layer, a ZnOx layer, and a SnOx layer, and the second dielectric layer includes at least one of an AZO layer, a Ti alloy layer, a NbOx layer, a TiOx layer, a NiCr layer, a NiCrOx layer, a ZnAlOx layer, a ZnOx layer, and a SnOx layer.

[0016] In one possible implementation, the material of the metal layer includes any one of Ag, Au, Cu, and Al, or a metal alloy thereof.

[0017] In one possible implementation, there are two functional stacks, including a first functional stack and a second functional stack, and one intermediate layer, which is a first intermediate layer. The coating structure also includes a protective layer, which includes a first protective layer, a second protective layer and an outer protective layer. The coating structure includes an adhesion layer, a first functional stack, a first intermediate layer, a second functional stack, a first protective layer, a second protective layer and an outer protective layer stacked sequentially. The first intermediate layer includes a ceramic ZnSnO3 layer.

[0018] In one possible implementation, there are three functional stacks, including a first functional stack, a second functional stack, and a third functional stack. There are two intermediate layers, including a first intermediate layer and a second intermediate layer. The coating structure also includes a protective layer, including a first protective layer, a second protective layer, and an outer protective layer. The coating structure includes an adhesion layer, a first functional stack, a first intermediate layer, a second functional stack, a second intermediate layer, a third functional stack, a first protective layer, a second protective layer, and an outer protective layer stacked sequentially. Both the first intermediate layer and the second intermediate layer include a ceramic ZnSnO3 layer.

[0019] In one possible implementation, the pencil hardness of the ceramic ZnSnO3 layer is ≥5H, and the pencil hardness of the coated glass after heat treatment is ≥7H.

[0020] This application also provides a laminated glass, including a second substrate, an adhesive layer, and a coated glass as described above, wherein the adhesive layer is bonded between the second substrate and the coated structure of the coated glass.

[0021] This application also provides a method for preparing coated glass, comprising:

[0022] Provide a first substrate;

[0023] A coating structure is fabricated on a first substrate. The coating structure includes at least two functional layers and at least one intermediate layer. The at least two functional layers are sequentially stacked on the first substrate. Along a direction away from the first substrate, each functional layer includes a first dielectric layer, a metal layer, and a second dielectric layer sequentially stacked. The metal layer is disposed between the first dielectric layer and the second dielectric layer. An intermediate layer is disposed between two adjacent functional layers. At least one intermediate layer includes a ceramic ZnSnO3 layer, wherein the refractive index n of the ceramic ZnSnO3 layer is 1.95–2.05, and the extinction coefficient k of the ceramic ZnSnO3 layer is 2.0 × 10⁻⁶. -3 ~7.0*10 -3 .

[0024] In one possible implementation, the step of preparing the coating structure on the first substrate includes the step of preparing a ceramic ZnSnO3 layer: the target is configured as a ZTO target, and a high-power pulsed magnetron sputtering power supply is used as the target power supply to perform magnetron sputtering on the ZTO target to obtain a ceramic ZnSnO3 layer.

[0025] In one possible implementation, the sputtering rate of magnetron sputtering is 2.1 nm*m / (min*kW) to 2.8 nm*m / (min*kW).

[0026] In one possible implementation, the peak power density for magnetron sputtering is 14.47 W / cm². 2 ~58.43W / cm 2 The duty cycle is 5%–18%, and the pulse width is 30μs–60μs.

[0027] In one possible implementation, the Zn:Sn mass ratio in the ZTO target is 40:60 to 60:40. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 A schematic diagram of the cross-sectional structure of the laminated glass provided in the embodiments of this application;

[0030] Figure 2 for Figure 1 A schematic cross-sectional view of the coated glass in the first embodiment of the laminated glass shown.

[0031] Figure 3 for Figure 1A schematic cross-sectional view of the coated glass in the second embodiment of the laminated glass shown.

[0032] Figure 4 for Figure 1 A schematic cross-sectional view of the coated glass in the third embodiment of the laminated glass shown;

[0033] Figure 5 This is a schematic diagram of the preparation process of the coated glass provided in the embodiments of this application. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0035] For ease of understanding, the terminology used in the embodiments of this application will be explained first.

[0036] And / or: This is simply a way of describing the relationship between related objects. It indicates that there can be three kinds of relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0037] The value of x in the chemical formula: If it is clearly defined, the defined range shall prevail. If it is not clearly defined, it can be determined according to the stoichiometric, substoichiometric, or superstoichiometric deposition methods used in the magnetron sputtering process.

[0038] Heat treatment: High-temperature heat treatment at least 500°C, such as the weight-bending process or pressing bending process used in the production of automotive glass.

[0039] Please see Figure 1 , Figure 1 This is a schematic diagram of the cross-sectional structure of the laminated glass 1000 provided in an embodiment of this application.

[0040] This application provides a laminated glass 1000, which can be applied to vehicles, doors and windows, glass curtain walls, etc. For example, when the laminated glass 1000 is applied to a vehicle, it can be a windshield, rear windshield, sunroof, side window, etc.

[0041] Specifically, the laminated glass 1000 includes a coated glass 100, an adhesive layer 300, and a second substrate 500. The adhesive layer 300 is bonded between the coated glass 100 and the second substrate 500. In this embodiment, the coated glass 100 has a pencil hardness ≥7H after heat treatment, meaning that the pencil hardness of the coating surface of the coated glass 100 after heat treatment is ≥7H in a pencil hardness test. The coated glass 100 includes a first substrate 110 and a coating structure 130, which is disposed on at least one side of the first substrate 110 along the thickness direction. In the following embodiments, the example of the coating structure 130 being disposed on one side of the first substrate 110 along the thickness direction is used for explanation. The adhesive layer 300 is bonded between the coating structure 130 of the coated glass 100 and the second substrate 500 to achieve bonding of the adhesive layer 300 between the coated glass 100 and the second substrate 500.

[0042] For example, both the first substrate 110 and the second substrate 500 can be transparent glass or ultra-clear glass (white glass). The coating structure 130 is a low-emissivity (Low-E) film layer to enable the coated glass 100 to have properties such as heat insulation and sun shading. The adhesive layer 300 can be used to improve the structural strength of the laminated glass 1000, enabling it to meet safety standards and regulatory requirements in more scenarios. For example, the material of the adhesive layer 300 can be polyvinyl butyral (PVB), ethylene vinyl acetate (EVA), thermoplastic polyurethane elastomer (TPU), or ionomer polymer film (SGP), etc. For example, the adhesive layer 300 includes at least one film layer. For instance, the adhesive layer 300 can have one, two, three, or four layers, etc., and the number of layers in this embodiment is not limited.

[0043] See Figure 2 , Figure 2 for Figure 1 The cross-sectional structure diagram of the coated glass 100 in the first embodiment of the laminated glass 1000 shown is shown.

[0044] In this embodiment, the coating structure 130 includes an adhesion layer 10, at least two functional stacks 30, at least one intermediate layer 50, and a protective layer 70. The adhesion layer 10 is disposed on the surface of the first substrate 110. The at least two functional stacks 30 are sequentially stacked on the first substrate 110 and disposed on the side of the adhesion layer 10 away from the first substrate 110. An intermediate layer 50 is disposed between two adjacent functional stacks 30. The protective layer 70 is disposed on the side of the at least two functional stacks 30 away from the adhesion layer 10. The coating structure 130 has a low-emissivity effect, thereby enabling the coated glass 100 to have heat insulation and sun-shading properties.

[0045] In the coating structure 130 of the coated glass 100 of the first embodiment, three functional stacks 30 and two intermediate layers 50 are illustrated. The three functional stacks 30 include a first functional stack 31, a second functional stack 32, and a third functional stack 33, and the two intermediate layers 50 include a first intermediate layer 51 and a second intermediate layer 52. Specifically, the coating structure 130 includes an adhesion layer 10, a first functional stack 31, a first intermediate layer 51, a second functional stack 32, a second intermediate layer 52, a third functional stack 33, and a protective layer 70, which are stacked sequentially. It is understood that the number of functional stacks 30 can be two, three, four, etc., and this embodiment does not limit the number of functional stacks 30. Similarly, the number of intermediate layers 50 can be one, two, three, etc., and this embodiment does not limit the number of intermediate layers 50.

[0046] Specifically, the adhesion layer 10 is used to enhance the adhesion of the coated structure 130 to the first substrate 110. Exemplarily, the adhesion layer 10 includes at least one of a SiAlZrNx layer, a ZrOx layer, a NbOx layer, a SiNx layer, a ZnSnOx layer, and a SiZrNx layer. It is understood that the x values ​​in the chemical formulas of the materials selected for the adhesion layer 10 can be the same or different. Exemplarily, 1 ≤ x ≤ 3. Exemplarily, the thickness of the adhesion layer 10 is 10 nm to 40 nm. For example, the thickness of the adhesion layer 10 can be 10 nm, 15 nm, 20 nm, 25 nm, 30 nm, 35 nm, 40 nm, etc.

[0047] Along the direction away from the first substrate 110, each functional stack 30 includes a first dielectric layer 301, a metal layer 303, and a second dielectric layer 305 stacked sequentially, with the metal layer 303 disposed between the first dielectric layer 301 and the second dielectric layer 305. For example, in the coating structure 130 of the first embodiment, the first functional stack 31, the second functional stack 32, and the third functional stack 33 each include a first dielectric layer 301, a metal layer 303, and a second dielectric layer 305. In each functional stack 30, the first dielectric layer 301 faces the first substrate 110, the metal layer 303 is disposed on the side of the first dielectric layer 301 away from the first substrate 110, and the second dielectric layer 305 is disposed on the side of the metal layer 303 away from the first dielectric layer 301.

[0048] In each functional stack 30, the first dielectric layer 301 and the second dielectric layer 305 can be used to protect the metal layer 303 from damage by alkali metal ions, oxygen, etc. The first dielectric layer 301 can also serve as a seed layer for crystallization of the metal layer 303 to improve the deposition density of the metal layer 303.

[0049] For example, the first dielectric layer 301 includes at least one selected from AZO layer, Ti alloy layer, NbOx layer, TiOx layer, NiCr layer, NiCrOx layer, ZnAlOx layer, ZnOx layer, and SnOx layer. It is understood that the x value in the chemical formula of each material selected for the first dielectric layer 301 can be the same or different. For example, 1 ≤ x ≤ 3. For example, the thickness of the first dielectric layer 301 is 5 nm to 30 nm. For instance, the thickness of the first dielectric layer 301 can be 5 nm, 10 nm, 15 nm, 20 nm, 25 nm, 30 nm, etc. For example, the material of the metal layer 303 includes any one of Ag, Au, Cu, and Al, or a metal alloy. For instance, the material of the metal layer 303 can be Ag, AgCu alloy, AgIn alloy, etc. For example, the thickness of the metal layer 303 is 5 nm to 20 nm. For example, the thickness of the metal layer 303 can be 5 nm, 10 nm, 15 nm, 20 nm, etc. Exemplarily, the second dielectric layer 305 includes at least one selected from AZO layer, Ti alloy layer, NbOx layer, TiOx layer, NiCr layer, NiCrOx layer, ZnAlOx layer, ZnOx layer, and SnOx layer. It is understood that the x value in the chemical formula of each material selected in the second dielectric layer 305 can be the same or different. Exemplarily, 1 ≤ x ≤ 3. Exemplarily, the thickness of the second dielectric layer 305 is 5 nm to 30 nm. For example, the thickness of the second dielectric layer 305 can be 5 nm, 10 nm, 15 nm, 20 nm, 25 nm, 30 nm, etc.

[0050] In this embodiment, at least one intermediate layer 50 includes a ceramic ZnSnO3 layer, which is disposed between two adjacent functional layers 30 to achieve the intermediate layer 50 being disposed between two adjacent functional layers 30. The refractive index n of the ceramic ZnSnO3 layer is 1.95–2.05, and the extinction coefficient k of the ceramic ZnSnO3 layer is 2.0 × 10⁻⁶. -3 ~7.0*10 -3 For example, the refractive index n value of the ceramic ZnSnO3 layer can be 1.95, 1.96, 1.97, 1.98, 1.99, 2.00, 2.01, 2.02, 2.03, 2.04, 2.05, etc. For example, the extinction coefficient k value of the ceramic ZnSnO3 layer can be 2.0*10⁻⁶. -3 3.0*10 -3 4.0*10 -3 5.0*10 -3 6.0*10 -3 7.0*10 -3In this embodiment of the application, the pencil hardness of the ceramic ZnSnO3 layer is ≥5H, that is, the pencil hardness of the film surface of the ceramic ZnSnO3 layer under the pencil hardness test is ≥5H.

[0051] For example, the thickness of the intermediate layer 50 is 30nm to 75nm. For instance, the thickness of the intermediate layer 50 can be 30nm, 35nm, 40nm, 45nm, 50nm, 55nm, 60nm, 65nm, 70nm, 75nm, etc. In the first embodiment, both the first intermediate layer 51 and the second intermediate layer 52 are ceramic ZnSnO3 layers, with the thickness of the first intermediate layer 51 being 30nm to 75nm and the thickness of the second intermediate layer 52 being 30nm to 75nm.

[0052] A protective layer 70 is disposed on the outermost functional stack 30 of at least two functional stacks 30, away from the first substrate 110. The protective layer 70 provides protection for the coated structure 130, preventing corrosion and mechanical damage. The protective layer 70 comprises at least one film layer. For example, the protective layer 70 may have one, two, three, or four layers; the embodiments of this application do not limit the number of film layers in the protective layer 70.

[0053] In the first embodiment, the protective layer 70 includes an inner protective layer 71 and an outer protective layer 73. The inner protective layer 71 is disposed on the side of at least two functional stacks 30 opposite to the first substrate 110, and the outer protective layer 73 is disposed on the side of the inner protective layer 71 opposite to the at least two functional stacks 30. The inner protective layer 71 includes at least one film layer. In the first embodiment, the inner protective layer 71 is illustrated with two film layers. Specifically, the protective layer 70 in the first embodiment has three layers: the inner protective layer 71 includes a first protective layer 711 and a second protective layer 712, in which case the protective layer 70 includes the first protective layer 711, the second protective layer 712, and the outer protective layer 73 stacked sequentially. It is understood that in other embodiments, the protective layer 70 may also have two layers, and the inner protective layer 71 may also have one film layer, namely the first protective layer 711, in which case the protective layer 70 includes the first protective layer 711 and the outer protective layer 73 stacked sequentially.

[0054] For example, the material of the first protective layer 711 is selected from oxides of at least one element selected from Zn, Mg, Sn, Ti, Nb, and Zr. For example, the material of the first protective layer 711 is TiOx, where 1 ≤ x ≤ 3. For example, the thickness of the first protective layer 711 is 0–25 nm. For example, the thickness of the first protective layer 711 can be 0 nm, 5 nm, 10 nm, 15 nm, 20 nm, 25 nm, etc. For example, the second protective layer 712 can be a ZnSnOx layer, where 1 ≤ x ≤ 3. For example, the thickness of the second protective layer 712 is 0–25 nm. For example, the thickness of the second protective layer 712 can be 0 nm, 5 nm, 10 nm, 15 nm, 20 nm, 25 nm, etc. For example, the outer protective layer 73 can be at least one selected from SiAlZrNx layer, SiZrNx layer, ZrOx layer, SiNx layer, SiZrOx layer, and SiAlZrOx layer. It is understood that the x-values ​​in the chemical formulas of the materials selected in the outer protective layer 73 can be the same or different. For example, 1 ≤ x ≤ 3. For example, the thickness of the outer protective layer 73 is 5–70 nm. For instance, the thickness of the outer protective layer 73 can be 5 nm, 10 nm, 20 nm, 30 nm, 40 nm, 50 nm, 60 nm, 70 nm, etc. It should be noted that the x-values ​​in the chemical formulas of the materials selected in the outer protective layer 73, the second protective layer 712, the first protective layer 711, the second dielectric layer 305, the first dielectric layer 301, and the adhesion layer 10 can be the same or different, and this application does not impose any restrictions on this.

[0055] To address the issue of poor mechanical properties of the coated film, a hard material, SiC, can be used as the outermost protective layer to prevent damage during processing. Alternatively, hard transparent ceramic materials ZrO2 or Nb2O5 can be selected as the bottom dielectric layer, with hard Si3N4 or ZrO2 layers as the outermost protective layer, to achieve processing resistance. However, these protective layer materials only increase the hardness of the innermost or outermost layer of the coated structure, without improving the overall hardness of the structure, and are insufficient to fully guarantee its processing resistance.

[0056] To address the aforementioned issues, this application provides a coated glass 100 that uses a ceramic ZnSnO3 layer as the intermediate layer 50 of the coating structure 130. On one hand, the ceramic ZnSnO3 layer possesses the excellent thermal ductility of metal oxides, enabling it to serve as the intermediate layer 50 in the coating structure 130 to connect the metal layer 303 and non-metallic materials such as the non-metallic protective layer SiNx. This prevents the coating structure 130 from cracking during heat treatment due to a significant difference in the thermal expansion coefficients of the metal layer 303 and the non-metallic layer. On the other hand, compared to other materials, it has a refractive index n of 1.95–2.05 and an extinction coefficient k of 2.0 × 10⁻⁶. -3 ~7.0*10 -3 The ceramic ZnSnO3 layer has high density, which can improve the film hardness of the ceramic ZnSnO3 layer, thereby improving the film hardness of the coating structure 130. When the ceramic ZnSnO3 layer is used as an intermediate layer, it can improve the overall hardness of the coating structure 130. On the one hand, it solves the problem of poor mechanical properties of the film in the existing coating structure, and on the other hand, it makes the coated glass 100 have higher mechanical properties, thus having sufficient hardness to resist various scratches during deep processing.

[0057] See Figure 3 , Figure 3 for Figure 1 The cross-sectional structure diagram of the coated glass 100 in the laminated glass 1000 shown in the second embodiment.

[0058] In the coating structure 130 of the coated glass 100 of the second embodiment, there are two functional stacks 30 and one intermediate layer 50. The two functional stacks 30 include a first functional stack 31 and a second functional stack 32, and the intermediate layer 50 is the first intermediate layer 51. Specifically, the coating structure 130 includes an adhesion layer 10, a first functional stack 31, a first intermediate layer 51, a second functional stack 32, and a protective layer 70, which are stacked sequentially. Both the first functional stack 31 and the second functional stack 32 include a first dielectric layer 301, a metal layer 303, and a second dielectric layer 305.

[0059] In the second embodiment, the coating structure 130 includes a first intermediate layer 51, which is a ceramic ZnSnO3 layer, and a protective layer 70, which includes a first protective layer 711, a second protective layer 712, and an outer protective layer 73. The adhesion layer 10, the first functional stack 31, and the second functional stack 32 can all be selected with reference to the first embodiment.

[0060] See Figure 4 , Figure 4 for Figure 1 The cross-sectional structure diagram of the coated glass 100 in the third embodiment of the laminated glass 1000 shown is illustrated.

[0061] In the coating structure 130 of the coated glass 100 of the third embodiment, there are four functional stacks 30 and three intermediate layers 50. The four functional stacks 30 include a first functional stack 31, a second functional stack 32, a third functional stack 33, and a fourth functional stack 34. The three intermediate layers 50 include a first intermediate layer 51, a second intermediate layer 52, and a third intermediate layer 53. In this case, the coating structure 130 specifically includes an adhesion layer 10, a first functional stack 31, a first intermediate layer 51, a second functional stack 32, a second intermediate layer 52, a third functional stack 33, a third intermediate layer 53, a fourth functional stack 34, and a protective layer 70, all stacked sequentially. The first functional stack 31, the second functional stack 32, the third functional stack 33, and the fourth functional stack 34 each include a first dielectric layer 301, a metal layer 303, and a second dielectric layer 305.

[0062] In the coating structure 130 of the third embodiment, the first intermediate layer 51, the second intermediate layer 52, and the third intermediate layer 53 are all ceramic ZnSnO3 layers, and the protective layer 70 includes a first protective layer 711, a second protective layer 712, and an outer protective layer 73. The adhesion layer 10, the first functional stack 31, the second functional stack 32, the third functional stack 33, and the fourth functional stack 34 can all be selected with reference to the first embodiment.

[0063] See also Figures 2 to 4 In some embodiments of the coated glass 100, at least one of the adhesion layer 10 and the protective layer 70 includes a ceramic ZnSnO3 layer to further improve the film hardness of the coating structure 130. For example, in the coating structure 130 of the first and second embodiments, the adhesion layer 10 includes a ceramic ZnSnO3 layer, or the protective layer 70 includes a ceramic ZnSnO3 layer, or both the adhesion layer 10 and the protective layer 70 include ceramic ZnSnO3 layers.

[0064] Taking the coating structure 130 in the first, second, and third embodiments as examples, the protective layer 70 includes an inner protective layer 71 and an outer protective layer 73. In this case, the inner protective layer 71 of the protective layer 70 includes a ceramic ZnSnO3 layer to avoid film defects when the ceramic ZnSnO3 layer is used as the outer protective layer 73, thereby giving the coating structure 130 superior film hardness. Exemplarily, in some specific embodiments, the second protective layer 712 in the inner protective layer 71 is a ceramic ZnSnO3 layer.

[0065] See also Figure 5 , Figure 5 This is a schematic diagram illustrating the fabrication process of the coated glass 100 provided in this application embodiment. The coated glass 100 can be the coated glass 100 described in the first or second embodiment above.

[0066] This application embodiment also provides a method for preparing the above-mentioned coated glass 100, including:

[0067] S1. Provide a first substrate 110.

[0068] S2. A coating structure 130 is fabricated on the first substrate 110. The coating structure 130 includes at least two functional stacks 30 and at least one intermediate layer 50. The at least two functional stacks 30 are sequentially stacked on the first substrate 110. Along the direction away from the first substrate 110, each functional stack 30 includes a first dielectric layer 301, a metal layer 303, and a second dielectric layer 305 sequentially stacked. The metal layer 303 is disposed between the first dielectric layer 301 and the second dielectric layer 305. An intermediate layer 50 is provided between two adjacent functional stacks 30. At least one intermediate layer 50 includes a ceramic ZnSnO3 layer, wherein the refractive index n of the ceramic ZnSnO3 layer is 1.95 to 2.05, and the extinction coefficient k of the ceramic ZnSnO3 layer is 2.0*10. -3 ~7.0*10 -3 .

[0069] In this embodiment, step S2 includes the preparation of a ceramic ZnSnO3 layer: the target is configured as a ZTO (zinc tin oxide) target, and a high-power pulsed magnetron sputtering (HiPIMS) power supply is used as the target power source to perform magnetron sputtering on the ZTO target to obtain the ceramic ZnSnO3 layer. For example, the Zn:Sn mass ratio in the ZTO target is 40:60 to 60:40. For instance, the Zn:Sn mass ratio in the ZTO target can be 40:60, 50:50, 52:48, 60:40, etc. For example, the sputtering rate of the magnetron sputtering is 2.1 nm*m / (min*kW) to 2.8 nm*m / (min*kW), that is, the ceramic ZnSnO3 layer is obtained by sputtering at a sputtering rate of 2.1 nm*m / (min*kW) to 2.8 nm*m / (min*kW).

[0070] In some specific embodiments, the target material is configured as a ceramic ZTO target, and a HiPIMS power supply is used as the target power source. One to five dual rotating cathodes are employed, and magnetron sputtering is performed in a mixture of argon and oxygen at a pressure of 1.0 × 10⁻³ mbar to 6.0 × 10⁻³ mbar to deposit a ceramic ZnSnO₃ layer. The peak power density for magnetron sputtering is 14.47 W / cm². 2 ~58.43W / cm 2The duty cycle is 5%–18%, and the pulse width is 30–60 μs. For example, the peak power for magnetron sputtering is 130 kW–525 kW, the voltage is 650 V–1000 V, and the current is 200 A–525 A. Wherein, peak power density = peak power / sputtering target area.

[0071] Traditional magnetron sputtering techniques typically sputter targets in an atomic state, resulting in low ionization rates. The high-power pulsed magnetron sputtering (HiPIMS) used in this application, as an emerging ionization magnetron sputtering technology, reduces the duty cycle to supply the target with MW-level instantaneous high power (approximately 1000 times that of ordinary magnetron sputtering) within a short pulse (10µs–500µs). This increases the plasma density by 2–3 orders of magnitude compared to traditional magnetron sputtering, with some target ionization rates even exceeding 70%. This results in a dense ZnSnO3 ceramic layer with a smooth surface and strong film-substrate adhesion. In this application, the ZnSnO3 ceramic layer is a dense ZnSnO3 film obtained using a ZTO target and a small amount of O2 sputtering. The increased density of the ZTO target material improves the hardness of the ZnSnO3 ceramic layer, thereby enhancing the hardness of the coated structure 130.

[0072] The following section describes the preparation process and performance of the ceramic ZnSnO3 layer using experimental data. Referring to Tables 1 and 2, the conventional ZnSnO3 layer in Tables 1 and 2 represents the film deposited using ZnSn (zinc-tin alloy) as the target material and MF (medium-frequency magnetron sputtering) as the target power source. The ordinary ZnSnO3 layer represents the film deposited using ZTO (zinc-tin oxide) as the target material and MF (medium-frequency magnetron sputtering) as the target power source. The ceramic ZnSnO3 layer represents the film deposited using ZTO (zinc-tin oxide) as the target material and HiPIMS (high-power pulsed magnetron sputtering) as the target power source. In Table 1, the area of ​​the sputtering target is approximately 8800 cm². 2 ~8900cm 2 The peak power density of the ZnSnO3 ceramic layer prepared by magnetron sputtering is approximately 14.47 W / cm³. 2 ~58.43W / cm 2 .

[0073] Table 1 Comparison of power supply process parameters for traditional ZnSnO3 layer, ordinary ZnSnO3 layer and ceramic ZnSnO3 layer.

[0074]

[0075]

[0076] Table 2 Comparison of sputtering rates for traditional ZnSnO3 layers, ordinary ZnSnO3 layers, and ceramic ZnSnO3 layers

[0077]

[0078] As shown in Tables 1 and 2, using ZnSn as the target material and an MF (medium-frequency magnetron sputtering) power supply as the target power source, the sputtering rate for preparing conventional ZnSnO3 layers is relatively low, approximately 0.5 nm*m / (min*kW) to 1.3 nm*m / (min*kW). The sputtering rate for preparing ordinary ZnSnO3 layers is 15.4% to 53.8% higher than that for conventional ZnSnO3 layers. The sputtering rate for preparing ceramic ZnSnO3 layers is 5% to 40% higher than that for ordinary ZnSnO3 layers, and 61.5% to 115.4% higher than that for conventional ZnSnO3 layers.

[0079] Generally, the sputtering rate of a material deposited using a HiPIMS power supply is slightly lower than that deposited using an MF power supply. However, this study found the opposite to occur when sputtering ZTO material using a HiPIMS power supply. This is because ZTO has poor conductivity and is difficult to ionize, making it challenging to completely ionize the ZTO target using an MF power supply. This often results in voltage instability, target sparking, and severe arcing alarms during sputtering. In this embodiment, using ZTO (zinc tin oxide) as the target and a HiPIMS (high-power pulsed magnetron sputtering) power supply, the sputtering rate for preparing ceramic ZnSnO3 layers was significantly improved. This increased sputtering rate is beneficial for the application of ceramic ZnSnO3 layers and can greatly reduce the costs associated with cavity design, cathode, power supply, and molecular pumps required for such applications.

[0080] Furthermore, Tables 1 and 2 show that the refractive index (n) ranges of the traditional ZnSnO3 layer and the ordinary ZnSnO3 layer are quite similar, while the refractive index (n) of the ceramic ZnSnO3 layer is slightly lower than that of both the traditional and ordinary ZnSnO3 layers. Simultaneously, the extinction coefficient (k) of the ceramic ZnSnO3 layer is slightly higher than that of both the traditional and ordinary ZnSnO3 layers. This is because the higher sputtering energy of the HiPIMS power supply results in a denser ceramic ZnSnO3 layer, leading to the disruption of a small number of bond energies within the ceramic ZnSnO3 layer.

[0081] The following experiments were conducted to measure the film strength of the aforementioned traditional ZnSnO3 layer, ordinary ZnSnO3 layer, and ceramic ZnSnO3 layer. Since the pencil hardness of each of these materials is >9H, making direct comparison difficult, a glass substrate was used. A metal soft layer was deposited on the surface of the glass substrate, and then the aforementioned material layers were deposited on the metal soft layer as protective layers to test the protective strength of the protective layers on the metal soft layer. The results are shown in Table 3. In Table 3, the SiZrNx layer was deposited using an MF (mid-frequency magnetron sputtering) power supply as the target power source. The substrate used was ordinary white glass with a thickness of 2.1 mm, and the metal soft layer was an Ag monolayer with a thickness of 13.04 nm, as an example.

[0082] Table 3. Material Hardness Tests for SiZrNx Layers, Traditional ZnSnO3 Layers, Ordinary ZnSnO3 Layers, and Ceramic ZnSnO3 Layers

[0083]

[0084]

[0085] As shown in Table 3, in Experimental Group 1, the metal soft layer was a 13.04 nm Ag monolayer deposited on a 2.1 mm thick ordinary white glass surface, with a measured pencil hardness of 4B. Comparing the pencil hardness test results of each protective layer material, the surface hardness ranking is: ceramic ZnSnO3 layer > ordinary ZnSnO3 layer > SiZrNx layer > traditional ZnSnO3 layer. The experimental results show that the pencil hardness of the ceramic ZnSnO3 layer is ≥5H, significantly higher than other protective layer materials, making it more suitable as the intermediate layer of the coating structure 130.

[0086] The following section provides a detailed explanation of the application of ceramic ZnSnO3 layers to the coating structure 130, using comparative examples and specific illustrations.

[0087] Comparative Examples 1-3:

[0088] Comparative Examples 1-3 provide a coated glass comprising a first substrate / adhesion layer / first functional stack / first intermediate layer / second functional stack / second intermediate layer / third functional stack / first protective layer / second protective layer / outer protective layer, which are sequentially stacked. The first functional stack, second functional stack, and third functional stack each include a first dielectric layer, a metal layer, and a second dielectric layer.

[0089] Examples 1-5:

[0090] Examples 1-5 provide a coated glass 100, which is a specific example of the coated glass 100 of the first embodiment. It includes a first substrate 110, an adhesion layer 10, a first functional stack 31, a first intermediate layer 51, a second functional stack 32, a second intermediate layer 52, a third functional stack 33, a first protective layer 711, a second protective layer 712, and an outer protective layer 73, all stacked sequentially. The first functional stack 31, the second functional stack 32, and the third functional stack 33 each include a first dielectric layer 301, a metal layer 303, and a second dielectric layer 305.

[0091] The coated glass from Comparative Examples 1-3 and the coated glass from Examples 1-5 were used to measure the pencil hardness of the coated glass before and after heat treatment at 550℃~720℃, and the test results of alcohol wiping are shown in Tables 4 and 5, respectively. In Tables 4 and 5, the conventional ZnSnO3 layer is denoted as ZnSnO3(MF), the ordinary ZnSnO3 layer is denoted as ZTO(MF), and the ceramic ZnSnO3 layer is denoted as ZTO(HiPIMS).

[0092] Table 4 shows the structure and test results of the coated glass in Comparative Examples 1-3 and Example 1.

[0093]

[0094]

[0095] Table 5. Structure and test results of the coated glass in Examples 2-5

[0096]

[0097]

[0098]

[0099] As shown in Tables 4 and 5, the coating structure of Comparative Example 1 uses MF power supply to deposit ZnSnO3, resulting in ZnSnO3(MF) as the adhesion layer, first intermediate layer, second intermediate layer, and second protective layer. The pencil hardness test results for the coating structure of Comparative Example 1 before and after heat treatment are 3H and 4H, respectively. The coating structure of Comparative Example 2 uses MF power supply to deposit ZTO, resulting in ZTO(MF) as the adhesion layer, first intermediate layer, second intermediate layer, and second protective layer. The pencil hardness test results for the coating structure of Comparative Example 2 before and after heat treatment are 7H and 6H, respectively. The coating structure of Comparative Example 3 uses MF power supply to deposit Si3N4, resulting in Si3N4 as the adhesion layer, first intermediate layer, second intermediate layer, and second protective layer. The pencil hardness test results for the coating structure of Comparative Example 3 before and after heat treatment are 6H and 3H, respectively. It is evident that the coating hardness of the coating structures of Comparative Examples 1-3 is relatively low before and after heat treatment. Among them, the coating structure of Comparative Example 3 showed a significant decrease in film hardness after heat treatment, indicating that the coating structure of Comparative Example 3 cannot meet the requirements of the weight-bending process or pressing bending process in the production of automotive glass.

[0100] By comparing Examples 1-5 and Comparative Examples 1-3, the coating structure 130 in the coated glass 100 of Examples 2-5 exhibits high pencil hardness before and after heat treatment, meeting the requirements for weight-bending or pressing-bending processes in the production of automotive glass. Furthermore, the sheet resistance R of the coating structure 130 in Examples 1-5 is reduced after high-temperature heat treatment, and the requirements for alcohol wiping are met before and after high-temperature heat treatment, indicating that the film system design of the coating structure 130 in Examples 1-5 is reasonable.

[0101] Comparing Examples 1-5 with Comparative Example 1, it can be seen that, compared to the coating structure of Comparative Example 1, in Example 5, the ZTO (HiPIMS) (i.e., ceramic ZnSnO3 layer) obtained by using a ZTO target deposited by HiPIMS power supply as the first intermediate layer 51 and the second intermediate layer 52 resulted in a coating structure 130 with pencil hardness tests of 9H / 8H before and after heat treatment, indicating an improvement in the overall film hardness of the coating structure 130. In Example 4, the ceramic ZnSnO3 layer was used as the adhesion layer 10, the first intermediate layer 51, and the second intermediate layer 52, resulting in a coating structure 130 with pencil hardness tests of 9H / 8H before and after heat treatment, indicating an improvement in the overall film hardness of the coating structure 130. In Example 3, the ceramic ZnSnO3 layer was used as the first intermediate layer 51, the second intermediate layer 52, and the second protective layer 712 in the inner protective layer 71, resulting in a coating structure 130 with pencil hardness tests of 9H / 9H before and after heat treatment, indicating an improvement in the overall film hardness of the coating structure 130. In Example 2, a ceramic ZnSnO3 layer was used as the second protective layer 712 in the adhesion layer 10, the first intermediate layer 51, the second intermediate layer 52, and the inner protective layer 71. The resulting coating structure 130 had a pencil hardness >9H before and after heat treatment, and the overall film hardness of the coating structure 130 was improved.

[0102] Experimental results show that the instantaneous high power supplied to the ZTO target by the HiPIMS power supply in this embodiment not only promotes the ionization of the ZTO target to increase the sputtering rate, but also produces a ZTO (HiPIMS) thin film (i.e., a ceramic ZnSnO3 layer) with a dense structure and smooth surface. Using this as an intermediate layer in the coating structure 130 enhances the overall hardness of the coating structure 130, thus providing sufficient hardness to withstand various scratch challenges during deep processing. Furthermore, comparing Examples 2-3 and Example 5 reveals that using a ceramic ZnSnO3 layer in at least one of the adhesion layer 10 and the protective layer 70 in the coating structure 130 further improves the overall hardness of the coating structure 130.

[0103] Furthermore, comparing Examples 1 and 2, the difference between the coating structure of Example 1 and Example 2 lies in that the outer protective layer 73 in Example 1 is a ceramic ZnSnO3 layer. The pencil hardness test results of the coating structure of Example 1 before and after heat treatment are 6H and 7H, respectively, which are slightly lower than the pencil hardness test results of the coating structure of Example 2 before and after heat treatment. This is because the instantaneous high power supplied to the ZTO target by the HiPIMS power supply may cause a small number of defects inside the coating layer. When the ceramic ZnSnO3 layer is used as the outermost protective layer 73, it may react with O2 and water molecules in the air, affecting the performance of the coating layer. Therefore, in some preferred embodiments, the ceramic ZnSnO3 film layer is not set in the outer protective layer 73.

[0104] Comparative Example 4:

[0105] Comparative Example 4 provides a coated glass comprising a first substrate / adhesion layer / first functional layer / first intermediate layer / second functional layer / first protective layer / second protective layer / outer protective layer, which are sequentially stacked. The first functional layer and the second functional layer each include a first dielectric layer, a metal layer, and a second dielectric layer.

[0106] Examples 6-8:

[0107] Examples 6-8 provide a coated glass 100, which is a specific example of the coated glass 100 of the second embodiment, including a first substrate 110, an adhesion layer 10, a first functional stack 31, a first intermediate layer 51, a second functional stack 32, a first protective layer 711, a second protective layer 712, and an outer protective layer 73, which are stacked sequentially. The first functional stack 31 and the second functional stack 32 each include a first dielectric layer 301, a metal layer 303, and a second dielectric layer 305.

[0108] The coated glass from Comparative Example 4 and the coated glass from Examples 6-8 were used to measure the pencil hardness of the coated glass before and after heat treatment at 550℃ to 720℃, and the test results of alcohol wiping are shown in Table 6. In Table 6, the conventional ZnSnO3 layer is denoted as ZnSnO3(MF), the ordinary ZnSnO3 layer is denoted as ZTO(MF), and the ceramic ZnSnO3 layer is denoted as ZTO(HiPIMS).

[0109] Table 6 shows the structure and test results of the coated glass in Comparative Example 4 and Examples 6-8.

[0110]

[0111]

[0112] As shown in Table 6, the coating structure of the coated glass in Comparative Example 4 uses an MF power supply to deposit ZnSnO3. The resulting ZnSnO3(MF) serves as the adhesion layer, the first intermediate layer, and the second protective layer. The pencil hardness test results of the coating structure in Comparative Example 4 before and after heat treatment are 4H and 5H, respectively, indicating a relatively low film hardness. In contrast, Examples 6-8 use a HiPIMS power supply to provide instantaneous high power to the ZTO target, which not only promotes the ionization of the ZTO target to increase the sputtering rate, but also produces a ZTO(HiPIMS) (i.e., a ceramic ZnSnO3 layer) with advantages such as a dense structure and a smooth surface. Specifically, Example 6 uses a ceramic ZnSnO3 layer as the adhesion layer 10, the first intermediate layer 51, and the second protective layer 712; Example 7 uses a ceramic ZnSnO3 layer as the adhesion layer 10 and the first intermediate layer 51; and Example 8 uses a ceramic ZnSnO3 layer as the first intermediate layer 51 and the second protective layer 712. The resulting coating structures 130 all exhibit high film hardness.

[0113] Experimental results show that using a ceramic ZnSnO3 layer as the first intermediate layer 51 can improve the overall hardness of the coating structure 130. Using it as the adhesion layer 10 and / or the second protective layer 712 can further improve the overall hardness of the coating structure 130, thus enabling the coating structure 130 to possess sufficient hardness to withstand various scratch challenges during deep processing. Specifically, when the ceramic ZnSnO3 layer is used simultaneously as the adhesion layer 10, the first intermediate layer 51, and the second protective layer 712, as in Example 6, the pencil hardness test results before and after heat treatment for the coating structure 130 are >9H and >9H respectively, indicating that the coating structure 130 possesses sufficient hardness to withstand various scratch challenges during deep processing.

[0114] Comparative Example 5:

[0115] Comparative Example 5 provides a coated glass comprising a first substrate / adhesion layer / first functional stack / first intermediate layer / second functional stack / second intermediate layer / third functional stack / third intermediate layer / fourth functional stack / first protective layer / second protective layer / outer protective layer, which are sequentially stacked. The first functional stack, second functional stack, third functional stack, and fourth functional stack each include a first dielectric layer, a metal layer, and a second dielectric layer.

[0116] Examples 9-11:

[0117] Examples 9-11 provide a coated glass 100, which is a specific example of the coated glass 100 of the third embodiment. It includes a first substrate 110, an adhesion layer 10, a first functional stack 31, a first intermediate layer 51, a second functional stack 32, a second intermediate layer 52, a third functional stack 33, a third intermediate layer 53, a fourth functional stack 34, a first protective layer 711, a second protective layer 712, and an outer protective layer 73, all stacked sequentially. The first functional stack 31, the second functional stack 32, the third functional stack 33, and the fourth functional stack 34 each include a first dielectric layer 301, a metal layer 303, and a second dielectric layer 305.

[0118] The coated glass from Comparative Example 5 and the coated glass from Examples 9-11 were used to measure the pencil hardness of the coated glass before and after heat treatment at 550℃ to 720℃, and the test results of alcohol wiping are shown in Table 7. In Table 7, the conventional ZnSnO3 layer is denoted as ZnSnO3(MF), the ordinary ZnSnO3 layer is denoted as ZTO(MF), and the ceramic ZnSnO3 layer is denoted as ZTO(HiPIMS).

[0119] Table 7 shows the structure and test results of the coated glass in Comparative Example 5 and Examples 9-11.

[0120]

[0121]

[0122]

[0123] As shown in Table 7, the coating structure of the coated glass in Comparative Example 5 uses an MF power supply to deposit ZnSnO3. The resulting ZnSnO3(MF) serves as the adhesion layer, the first intermediate layer, the second intermediate layer, the third intermediate layer, and the second protective layer. The pencil hardness test results of the coating structure in Comparative Example 5 before and after heat treatment are 2H / HB, respectively. In contrast, Examples 9-11 use a HiPIMS power supply to provide instantaneous high power to the ZTO target, which not only promotes the ionization of the ZTO target to increase the sputtering rate, but also produces a ZTO(HiPIMS) (i.e., ceramic ZnSnO3 layer) with the advantages of a dense structure and a smooth surface. In Example 9, a ceramic ZnSnO3 layer is used as the adhesion layer 10, the first intermediate layer 51, the second intermediate layer 52, the third intermediate layer 53, and the second protective layer 712. In Example 10, a ceramic ZnSnO3 layer is used as the first intermediate layer 51, the second intermediate layer 52, and the third intermediate layer 53. In Example 11, a ceramic ZnSnO3 layer is used as the first intermediate layer 51, the second intermediate layer 52, the third intermediate layer 53, and the second protective layer 712. The resulting coating structures 130 all have high film hardness.

[0124] Experimental results show that using a ceramic ZnSnO3 layer as the first intermediate layer 51 can improve the overall hardness of the coating structure 130. Using it as the adhesion layer 10 and / or the second protective layer 712 can further improve the overall hardness of the coating structure 130, thus enabling the coating structure 130 to possess sufficient hardness to withstand various scratch challenges during deep processing. Specifically, when the ceramic ZnSnO3 layer is used simultaneously as the adhesion layer 10, the first intermediate layer 51, the second intermediate layer 52, the third intermediate layer 53, and the second protective layer 712, as in Example 9, the pencil hardness test results before and after heat treatment are >9H and >9H respectively, indicating that the coating structure 130 possesses sufficient hardness to withstand various scratch challenges during deep processing.

[0125] The following analysis, with reference to Table 8, examines the process parameters and performance after heat treatment of the coating structures of Comparative Examples 1-3 and Examples 1-2.

[0126] Table 8. Process parameters and performance after heat treatment of the coating structures of Comparative Examples 1-3 and Examples 1-2

[0127]

[0128]

[0129] In the coating structures 130 of Examples 3-5, the films obtained by magnetron sputtering are the same as those in Comparative Examples 1-3 and Examples 1-2, and can be referred to the data in Table 8, which will not be listed here again. As can be seen from Table 8, in the coating structures 130 of Examples 1 and 2, ZnSnO3 (ZTO) films (i.e. ceramic ZnSnO3 films) obtained by HiPIMS power supply sputtering ZTO target deposition were used. The sputtering rate of the ceramic ZnSnO3 film was increased by 61.5% to 115.4%. The increase in sputtering rate is beneficial to the application of ceramic ZnSnO3 film materials. The cavity, cathode, power supply, and molecular pump required for the application of ceramic ZnSnO3 film materials are reduced, thus reducing costs.

[0130] The process parameters and performance after heat treatment of the coating structures of Comparative Example 4 and Example 6 are analyzed below with reference to Table 9.

[0131] Table 9 shows the process parameters and performance after heat treatment of the coating structures in Comparative Example 4 and Example 6.

[0132]

[0133] In the coating structures 130 of Examples 7-8, the films obtained by magnetron sputtering are the same as those in Comparative Example 4 and Example 6, as shown in Table 9, and will not be listed here again. As can be seen from Table 9, in the coating structure 130 of Example 6, a ZnSnO3 (ZTO) film (i.e., a ceramic ZnSnO3 film) was obtained by sputtering a ZTO target with a HiPIMS power supply. The sputtering rate of the ceramic ZnSnO3 film was increased by 61.5% to 115.4%. This increased sputtering rate is beneficial for the application of the ceramic ZnSnO3 film material. The required cavity, cathode, power supply, and molecular pump for the application of the ceramic ZnSnO3 film material are reduced, thus lowering costs.

[0134] The process parameters and performance after heat treatment of the coating structures of Comparative Example 5 and Example 9 are analyzed below with reference to Table 10.

[0135] Table 10 shows the process parameters and performance after heat treatment of the coating structures in Comparative Example 5 and Example 9.

[0136]

[0137] In the coating structures 130 of Examples 10-11, the films obtained by magnetron sputtering are the same as those in Comparative Example 5 and Example 9, as shown in Table 10, and will not be listed here again. As can be seen from Table 10, in the coating structure 130 of Example 9, a ZnSnO3 (ZTO) film (i.e., a ceramic ZnSnO3 film) was obtained by sputtering a ZTO target with a HiPIMS power supply. The sputtering rate of the ceramic ZnSnO3 film was increased by 61.5% to 115.4%. This increased sputtering rate is beneficial for the application of the ceramic ZnSnO3 film material. The required cavity, cathode, power supply, and molecular pump for the application of the ceramic ZnSnO3 film material are reduced, thus lowering costs.

[0138] As can be seen from Tables 8-10, compared with the comparative example which uses MF power supply for magnetron sputtering of the film, the embodiments of this application use HiPIMS power supply to replace the traditional MF power supply, and use ZTO as the target material, which improves the sputtering rate of the film. This reduces the number of cathodes required for sputtering ZTO target material using HiPIMS power supply. One cathode corresponds to one chamber position, one power supply, and several molecular pumps, thus saving more costs.

[0139] The aforementioned experimental results show that, in this embodiment of the application, ZnSnO3 (ZTO) (i.e., ceramic ZnSnO3 film) is obtained by sputtering ZTO target with HiPIMS power supply, increasing the sputtering rate of the ceramic ZnSnO3 film by 61.5–115.4%. Furthermore, replacing traditional ZnSnO3 films and ordinary ZnSnO3 films with ceramic ZnSnO3 films in the coating structure 130 improves the overall hardness of the coating structure 130, giving the coated glass 100 higher mechanical properties and thus sufficient hardness to resist various scratches during deep processing.

[0140] The above-disclosed embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art will understand that all or part of the processes for implementing the above embodiments and equivalent variations made in accordance with the claims of this application are still within the scope of this application.

Claims

1. A coated glass, characterized in that, The coated glass comprises: a first substrate; and The coating structure is arranged on the first substrate, and comprises at least two functional stacks and at least one intermediate layer, the at least two functional stacks are sequentially arranged on the first substrate, and each of the functional stacks comprises a first dielectric layer, a metal layer and a second dielectric layer which are sequentially arranged, the metal layer is arranged between the first dielectric layer and the second dielectric layer, the intermediate layer is arranged between adjacent two functional stacks, and at least one of the intermediate layers comprises a ceramic ZnSnO3 layer, wherein the refractive index n of the ceramic ZnSnO3 layer is 1.95-2.05, and the extinction coefficient k of the ceramic ZnSnO3 layer is 2.0*10 -3 -7.0*10 -3 .

2. The coated glass according to claim 1, wherein, The coated structure further comprises an adhesion layer, the adhesion layer is arranged on the surface of the first substrate, and the at least two functional stacks are arranged on the side of the adhesion layer away from the first substrate.

3. The coated glass according to claim 2, wherein, The adhesion layer comprises at least one of a SiAlZrNx layer, a ZrOx layer, a NbOx layer, a SiNx layer, a ZnSnOx layer, a SiZrNx layer, and the ceramic ZnSnO3 layer.

4. The coated glass according to claim 2, wherein, The coated structure further comprises a protective layer, the protective layer is arranged on the side of the at least two functional stacks away from the adhesion layer, and at least one of the adhesion layer and the protective layer comprises the ceramic ZnSnO3 layer.

5. The coated glass according to claim 4, wherein, In the direction away from the first substrate, the protective layer comprises an inner protective layer and an outer protective layer, the inner protective layer is arranged on the side of the at least two functional stacks away from the adhesion layer, and the outer protective layer is arranged on the side of the inner protective layer away from the at least two functional stacks, and the inner protective layer comprises the ceramic ZnSnO3 layer.

6. The coated glass according to claim 5, wherein, The inner protective layer comprises a first protective layer and a second protective layer, the first protective layer is arranged on the side of the at least two functional stacks away from the adhesion layer, and the second protective layer is arranged between the first protective layer and the outer protective layer, wherein the second protective layer is the ceramic ZnSnO3 layer.

7. The coated glass according to claim 6, wherein, The material of the first protective layer is selected from the oxides of at least one element of Zn, Mg, Sn, Ti, Nb, and Zr.

8. The coated glass according to claim 5, wherein, The outer protective layer comprises at least one of a SiAlZrNx layer, a SiZrNx layer, a ZrOx layer, a SiNx layer, a SiZrOx layer, and a SiAlZrOx layer.

9. The coated glass according to any one of claims 1 to 8, wherein, The first medium layer comprises at least one of an AZO layer, a Ti alloy layer, a NbOx layer, a TiOx layer, a NiCr layer, a NiCrOx layer, a ZnAlOx layer, a ZnOx layer, and a SnOx layer, and the second medium layer comprises at least one of an AZO layer, a Ti alloy layer, a NbOx layer, a TiOx layer, a NiCr layer, a NiCrOx layer, a ZnAlOx layer, a ZnOx layer, and a SnOx layer.

10. The coated glass according to any one of claims 1 to 8, wherein, The material of the metal layer comprises any one of Ag, Au, Cu, and Al or a metal alloy.

11. The coated glass according to any one of claims 1 to 8, wherein, The coated structure comprises two functional stacks, one intermediate layer, and a protective layer, the two functional stacks comprise a first functional stack and a second functional stack, the intermediate layer is a first intermediate layer, the protective layer comprises a first protective layer, a second protective layer, and an outer protective layer, the coated structure comprises the adhesion layer, the first functional stack, the first intermediate layer, the second functional stack, the first protective layer, the second protective layer, and the outer protective layer arranged in sequence, and the first intermediate layer comprises the ceramic ZnSnO3 layer.

12. The coated glass according to any one of claims 1 to 8, wherein, The functional laminates have three, including a first functional laminate, a second functional laminate and a third functional laminate, the intermediate layers have two, including a first intermediate layer and a second intermediate layer, the coated structure further comprises a protective layer, the protective layer includes a first protective layer, a second protective layer and an outer protective layer, the coated structure comprises an adhesion layer, the first functional laminate, the first intermediate layer, the second functional laminate, the second intermediate layer, the third functional laminate, the first protective layer, the second protective layer and the outer protective layer in turn, the first intermediate layer and the second intermediate layer both comprise the ceramic ZnSnO3 layer.

13. The coated glass according to any one of claims 1 to 8, wherein, The pencil hardness of the ceramic ZnSnO3 layer is ≥5H, and the pencil hardness of the coated glass after heat treatment is ≥7H.

14. A laminated glass characterized by The coated glass comprises a second substrate, a bonding layer and the coated glass according to any one of claims 1 to 13, and the bonding layer is bonded between the second substrate and the coated structure of the coated glass.

15. A method of manufacturing a coated glass, characterized in that, The coated glass comprises: A first substrate is provided; Preparation of a film structure on the first substrate, the film structure comprising at least two functional stacks and at least one intermediate layer, the at least two functional stacks being sequentially stacked on the first substrate, each of the functional stacks comprising a first dielectric layer, a metal layer and a second dielectric layer sequentially stacked, the metal layer being disposed between the first dielectric layer and the second dielectric layer, the at least one intermediate layer being disposed between adjacent two of the functional stacks, the at least one intermediate layer comprising a ceramic ZnSnO3 layer, wherein the refractive index n of the ceramic ZnSnO3 layer is 1.95-2.05, and the extinction coefficient k of the ceramic ZnSnO3 layer is 2.0*10 -3 -7.0*10 -3 .

16. The method of claim 15, wherein the glass sheet is heated to a temperature of from 500°C to 600°C. The step of preparing a coated structure on the first substrate comprises the step of preparing the ceramic ZnSnO3 layer: the target material is configured as a ZTO target material, a high-power pulsed magnetron sputtering power supply is used as the target material power supply, and the ZTO target material is subjected to magnetron sputtering to obtain the ceramic ZnSnO3 layer.

17. The method of claim 16, wherein the glass sheet is heated to a temperature of from about 500°C to about 600°C. The sputtering rate of the magnetron sputtering is 2.1 nm*m / (min*kW) to 2.8 nm*m / (min*kW).

18. The method of claim 16, wherein the glass sheet is heated to a temperature of from about 500°C to about 600°C. The peak power density of the magnetron sputtering is 14.47 W / cm 2 ~ 58.43 W / cm 2 , the duty cycle is 5%~18%, and the pulse width is 30 us~60 us.

19. The method of claim 16, wherein the glass sheet is heated to a temperature of from about 500°C to about 600°C. The mass ratio of Zn:Sn in the ZTO target material is 40:60 to 60:40.

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