Low-oil-permeability single-component heat-conducting gel and preparation method thereof
By using a precuring system of single-ended vinyl silicone oil and side hydrogen-containing silicone oil in a single-component thermal gel, a branched structure is formed, and the oil seepage problem caused by low crosslinking density in the prior art is solved, and the effects of high extrusion rate and low oil seepage are achieved.
Patent Information
- Application Number
- CN202510002998.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-02
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2045-01-02
AI Technical Summary
The existing single-component thermal gel has low cross-link density after precuring, resulting in some polymers not participating in the reaction and are still in a free state, which is prone to separation of oil seepage and oil powder, affecting the reliability of heat dissipation.
Single-ended vinyl silicone oil and side hydrogen-containing silicone oil are used as pre-curing systems. Through the appropriate silicon-hydrogen ratio design and control of viscosity, a branched structure with side hydrogen-containing silicone oil as the main chain and single-ended vinyl silicone oil is distributed on both sides of the main chain to improve extrusion and avoid oil leakage.
The characteristics of high extrusion rate and low permeability oil are achieved, which enhances the extrusion property and use stability of the thermally conductive gel and reduces the risk of oil seepage.
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Abstract
Description
Technical Field
[0001] The invention relates to the technical field of polymer materials, in particular to a thermally conductive gel, and in particular to a low-permeability oil single-component thermally conductive gel and a preparation method thereof. Background Art
[0002] With the development of the electronics industry, especially the rapid rise of industries such as 5G communications and new energy vehicles, thermal management materials have ushered in unprecedented opportunities. The power of electronic components is getting higher and higher, thermal management is becoming more and more important, and the requirements for thermal management materials are getting higher and higher. As a new type of thermal interface material, silicone thermal conductive gel has attracted much attention in the industry because it has the advantages of both thermal conductive gaskets and thermal conductive silicone grease.
[0003] Single-component thermal conductive gel can replace thermal conductive silicone grease due to its advantages such as convenient construction, dispensing construction, and non-powdering. It is widely used in communication equipment such as base stations, 3C terminals, and automotive electronic control. However, existing single-component thermal conductive gels usually adopt two technical solutions. One is the pre-curing reaction of double-ended vinyl silicone oil and double-ended hydrogen silicone oil to form a system in which long-chain and short-chain polymers coexist; the other is the pre-curing reaction of double-ended vinyl silicone oil and side hydrogen silicone oil to form a system in which a cross-linked network and short-chain polymers coexist. In order to ensure good extrudability after pre-curing, the cross-linking density of these two technical solutions is designed to be very low (silicon hydrogen group to vinyl molar ratio <1). However, we found that low cross-linking density will inevitably lead to some polymers such as vinyl silicone oil not participating in the reaction and still being in a free state. Some single-component thermal conductive gels on the market are only made of non-reactive methyl silicone oil mixed with powder, without any pre-curing reaction. Long-term use is prone to oil seepage and oil-powder separation, affecting the heat dissipation reliability.
[0004] Chinese patent application CN118994918A discloses a one-component thermally conductive gel and a preparation method thereof, which uses vinyl silicone oil and side hydrogen silicone oil as base polymers, and modified boron nitride and liquid metal as thermally conductive fillers to produce a one-component thermally conductive gel with excellent thermal conductivity, high extrudability and low oil permeability. However, boron nitride is usually difficult to add and has a high oil absorption value. Its low oil permeability is more derived from the high oil absorption value of boron nitride powder, which has little to do with the base polymer, and the risk of oil permeation still exists after long-term use.
[0005] Chinese patent application CN119119733A discloses a high thermal conductivity and high temperature resistant organic silicon thermal conductive gel and its preparation method, which uses dimethyl silicone oil, dispersant, modified aluminum oxide and modified zinc oxide as raw materials. The modified aluminum oxide and modified zinc oxide after surface treatment can better combine with dimethyl silicone oil, thereby achieving the effect of reducing viscosity. At the same time, the organic silicon thermal conductive gel will not powder in a high temperature environment. However, its polymer system is non-reactive dimethyl silicone oil, which inevitably has a greater risk of oil leakage. Summary of the invention
[0006] Based on this, the present invention aims to provide a single-ended vinyl silicone oil, a single-component thermal conductive gel composition and a preparation method thereof to address the deficiencies in the prior art. The single-component thermal conductive gel has the characteristics of high extrusion rate and low oil permeability due to the design of a polymer system including the single-ended vinyl silicone oil.
[0007] The first aspect of the present invention provides a single-component thermally conductive gel, which is prepared from raw materials including the following components in parts by weight:
[0008] Single-ended vinyl silicone oil: 100 parts,
[0009] Side hydrogen silicone oil: 20-60 parts,
[0010] Modified thermal conductive powder: 2400-3100 parts,
[0011] Inhibitor: 0.01-0.2 parts,
[0012] Platinum catalyst: 2ppm-10ppm;
[0013] The single-end vinyl silicone oil is a polydimethylsiloxane in which one end of each molecule is a Si-Vi group and the other end is a methyl group, and the viscosity is 10mPa·s to 200mPa·s, and Vi is a vinyl group;
[0014] The side hydrogen-containing silicone oil is a polydimethylsiloxane having at least 3 SiH groups on each molecular chain, a hydrogen content of 0.05wt% to 0.3wt%, and a viscosity of 50 to 500mPa·s;
[0015] The modified thermally conductive powder is prepared by modifying common thermally conductive powder by compounding long-chain alkyl silane and vinyl silane.
[0016] In some embodiments, the single-terminated vinyl silicone oil,
[0017] Preferably, the viscosity of the single-ended vinyl silicone oil is 30 mPa·s to 200 mPa·s, more preferably 50 mPa·s to 100 mPa·s.
[0018] In some of the embodiments, the side hydrogen-containing silicone oil has a hydrogen content of 0.1wt% to 0.2wt%, a viscosity of 100mPa·s to 300mPa·s, preferably a viscosity of 150mPa·s to 300mPa·s, and more preferably a viscosity of 150mPa·s to 200mPa·s.
[0019] In some embodiments, the molar ratio of the silicon hydrogen groups in the side hydrogen-containing silicone oil to the vinyl groups in the single-terminal vinyl silicone oil is 1.5:1 to 3.0:1, preferably 2 to 3.0:1.
[0020] In some embodiments, when the single-end vinyl silicone oil in the one-component thermally conductive gel is 100 parts, the side hydrogen-containing silicone oil is 20-50 parts, more preferably 20-30 parts.
[0021] In some embodiments, when the single-component thermally conductive gel contains 100 parts of single-ended vinyl silicone oil, the modified thermally conductive powder contains 2400-2600 parts.
[0022] In some embodiments, when the single-end vinyl silicone oil in the one-component thermally conductive gel is 100 parts, the inhibitor is preferably 0.1-0.2 parts, and / or the platinum catalyst is: 3ppm-8ppm.
[0023] In some embodiments, the long-chain alkylsilane used for modification in the modified thermally conductive powder is trimethoxysilane containing an alkyl group with 8 to 16 carbon atoms; and the thermally conductive powder is one or a combination of aluminum oxide, zinc oxide, magnesium oxide, aluminum nitride and boron nitride.
[0024] In some of the embodiments, the preparation method of the modified thermally conductive powder is as follows: 100 parts by weight of thermally conductive powder are put into a stirring kettle, and 0.1-1.0 parts by weight of long-chain alkyl silane is atomized and sprayed into the stirring kettle under stirring, and the temperature is raised to 70°C-90°C and reacted for 1h to 3h to obtain the modified thermally conductive powder.
[0025] In some preferred embodiments, the weight proportion of the long-chain alkyl silane is 0.1-0.5, more preferably 0.1-0.3, and even more preferably 0.15-0.3.
[0026] In some preferred embodiments, the long-chain alkyl silane is trimethoxysilane containing an alkyl group of 8 to 16 carbon atoms, preferably trimethoxysilane containing an alkyl group of 10 to 14 carbon atoms, and most preferably dodecyltrimethoxysilane.
[0027] In some embodiments, the platinum catalyst is one or a combination of chloroplatinic acid, chloroplatinic acid-isopropanol complex, and Custer's catalyst.
[0028] In some embodiments, the inhibitor is one of 1-ethynyl-1-cyclohexanol, tetramethyltetravinylcyclotetrasiloxane, 2-methyl-3-butynyl-2-ol, 3-methyl-1-hexynyl-3-ol, 3,5-dimethyl-1-hexynyl-3-ol, 3-methyl-1-dodecyn-3-ol, or a combination thereof.
[0029] The second aspect of the present invention is to provide a method for preparing any of the above-mentioned thermally conductive gels, the preparation method comprising the following steps:
[0030] (S1) adding the side hydrogenated silicone oil, the single-end vinyl silicone oil and the inhibitor into a blender, stirring and mixing them evenly, and then adding the modified thermal conductive powder in batches, stirring and mixing them evenly after adding them;
[0031] (S2) putting the catalyst into a planetary mixer, stirring and mixing evenly, and evacuating the mixture to remove bubbles;
[0032] (S3) heating and pre-curing the mixture obtained in step (S2) to obtain the pre-cured single-component thermally conductive gel.
[0033] The invention prepares a single-component thermally conductive gel, and adopts side hydrogenated silicone oil and single-terminal vinyl silicone oil as the precuring system of the single-component thermally conductive gel to obtain the thermally conductive gel with high extrusion rate and low oil permeability.
[0034] Compared with the existing single-component thermal conductive gel, the single-component thermal conductive gel of the present invention has the following advantages: using specific side hydrogen-containing silicone oil and single-end vinyl silicone oil as the pre-curing reaction matrix, after pre-curing, a branched structure is formed with the side hydrogen-containing silicone oil as the main chain and the single-end vinyl silicone oil distributed on both sides of the main chain, and the branched structure is similar to a loose fishbone structure, which is completely different from the structure of the traditional single-component thermal conductive gel technical solution after pre-curing. By designing and controlling the viscosity of the side hydrogen-containing silicone oil and the single-end vinyl silicone oil through a suitable silicon-hydrogen ratio (silicon hydrogen group to vinyl molar ratio), the branched structure not only has high extrudability, but also the single-end vinyl silicone oil fully participates in the reaction, which avoids the free and oil seepage of the vinyl silicone oil to the greatest extent, and has the characteristics of high extrudability and low oil seepage. DETAILED DESCRIPTION
[0035] The technical scheme of the present invention is further illustrated by specific examples below. Those skilled in the art should understand that the examples are only to help understand the present invention and should not be regarded as specific limitations of the present invention.
[0036] Unless otherwise defined, all technical and scientific terms used in the present invention have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.
[0037] The terms "including" and "having" and any variations thereof of the present invention are intended to cover non-exclusive inclusions. For example, a process, method, device, product or equipment comprising a series of steps is not limited to the listed steps or modules, but may optionally include steps not listed, or may optionally include other steps inherent to these processes, methods, products or equipment.
[0038] In the present invention, the term "multiple" refers to two or more than two. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent the following three situations: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects are in an "or" relationship.
[0039] The single-terminated vinyl silicone oil in the single-component thermally conductive gel of the present invention has the following structure:
[0040]
[0041] The single-ended vinyl silicone oil is a polydimethylsiloxane in which one end of each molecule is a Si-Vi group and the other end is a methyl group, and the viscosity thereof is selected between 10 mPa·s and 200 mPa·s.
[0042] The side hydrogenated silicone oil in the one-component thermally conductive gel of the present invention has the structure:
[0043]
[0044] The hydrogen content of the side hydrogen-containing silicone oil is controlled to be 0.05wt% to 0.3wt%, and the viscosity is controlled to be 50mPa·s to 300mPa·s.
[0045] The following are specific embodiments.
[0046] The viscosity in the following examples refers to the viscosity at 25° C. unless otherwise specified; the “parts” mentioned refer to parts by weight unless otherwise specified.
[0047] The preparation of the thermally conductive gel described in the following examples can be carried out according to the following method.
[0048] The method for preparing the single-component thermally conductive gel comprises the following steps:
[0049] (1) according to the specific amount, the single-end vinyl silicone oil, the side hydrogen silicone oil and the inhibitor are added into a planetary mixer, stirred for 5 min-6 min to mix evenly, and the modified thermal conductive powder is added in three batches, and stirred for 30 min-35 min after adding until the mixture is evenly mixed;
[0050] (2) putting the catalyst into a planetary mixer, stirring and mixing for 20-25 minutes, and evacuating the mixture to remove bubbles;
[0051] (3) After packaging, heat at about 70° C. (65-75° C.) for 3 h to 3.5 h to obtain a pre-cured single-component thermally conductive gel.
[0052] Example 1
[0053] The raw material composition of the single-component thermally conductive gel composition described in this embodiment is as follows:
[0054]
[0055] The molar ratio of the silyl hydrogen groups in the side hydrogen-containing silicone oil to the vinyl groups in the single-terminal vinyl silicone oil is 2.97.
[0056] The preparation of the modified thermally conductive powder comprises the following steps:
[0057] 100 parts of thermally conductive powder (aluminum oxide) were added into a stirring kettle, and 0.2 parts of long-chain alkyl silane (dodecyltrimethoxysilane) were atomized and sprayed into the stirring kettle under stirring, and the temperature was raised to about 80°C and reacted for about 2 hours to obtain a modified thermally conductive powder. In the following examples, the preparation method of the modified thermally conductive powder is the same as this.
[0058] The amount of the modified thermally conductive powder used is 20 times the total amount of the single-end vinyl silicone oil and the side hydrogen silicone oil, and the following embodiments are the same.
[0059] Example 2
[0060] The raw material composition of the single-component thermally conductive gel composition described in this embodiment is as follows:
[0061]
[0062] The molar ratio of the silyl hydrogen groups in the side hydrogen-containing silicone oil to the vinyl groups in the single-terminal vinyl silicone oil is 1.82.
[0063] Example 3
[0064] The raw material composition of the single-component thermally conductive gel composition described in this embodiment is as follows:
[0065]
[0066] The molar ratio of the silyl hydrogen groups in the side hydrogen-containing silicone oil to the vinyl groups in the single-terminal vinyl silicone oil is 2.03.
[0067] Example 4
[0068] The raw material composition of the single-component thermally conductive gel composition described in this embodiment is as follows:
[0069]
[0070] The molar ratio of the silyl hydrogen groups in the side hydrogen-containing silicone oil to the vinyl groups in the single-terminal vinyl silicone oil is 2.43.
[0071] Example 5
[0072] The raw material composition of the single-component thermally conductive gel composition described in this embodiment is as follows:
[0073]
[0074] The molar ratio of the silyl hydrogen groups in the side hydrogen-containing silicone oil to the vinyl groups in the single-terminal vinyl silicone oil is 2.03.
[0075] Comparative Example 1
[0076] The single-component thermally conductive gel composition of this comparative example adopts the commonly used composition of existing thermally conductive gels, that is, a simple chain extension method, and forms a structure in which long-chain and short-chain polymers coexist after pre-curing. Among them, the amount of thermally conductive powder used is 20 times that of the oil phase.
[0077] The specific composition of its raw materials is as follows:
[0078]
[0079]
[0080] The molar ratio of the silyl hydrogen groups in the hydrogen-terminated silicone oil to the vinyl groups in the vinyl-terminated silicone oil is 0.41.
[0081] The specific preparation method comprises the following steps:
[0082] (1) Add the vinyl-terminated silicone oil, hydrogen-terminated silicone oil and inhibitor into a planetary mixer, stir for 5 minutes to mix evenly, add the modified thermal conductive powder in three batches, and stir for 30 minutes after adding until the mixture is evenly mixed;
[0083] (2) putting the catalyst into a planetary mixer, stirring and mixing for 20 minutes, and evacuating the mixture to remove bubbles;
[0084] (3) After packaging, heat at 70° C. for 3 h to obtain a pre-cured single-component thermal conductive gel.
[0085] Comparative Example 2
[0086] The single-component thermally conductive gel composition of this comparative example adopts another commonly used composition of thermally conductive gels, and is pre-cured by terminal vinyl groups and side hydrogen-containing silicon groups to form a structure in which a cross-linked network and short-chain polymers coexist.
[0087] The specific composition of its raw materials is as follows:
[0088]
[0089]
[0090] The molar ratio of the silyl hydrogen group in the side hydrogen-containing silicone oil to the vinyl group in the terminal vinyl silicone oil is 0.27.
[0091] The specific preparation method comprises the following steps:
[0092] (1) Add the vinyl-terminated silicone oil, hydrogen-containing silicone oil and inhibitor into a planetary mixer, stir for 5 minutes to mix evenly, add the modified thermal conductive powder in three batches, and stir for 30 minutes after adding until the mixture is evenly mixed;
[0093] (2) putting the catalyst into a planetary mixer, stirring and mixing for 20 minutes, and evacuating the mixture to remove bubbles;
[0094] (3) After packaging, heat at 70° C. for 3 h to obtain a pre-cured single-component thermal conductive gel.
[0095] Comparative Example 3
[0096] The raw material composition of the single-component thermal conductive gel composition of this comparative example is as follows:
[0097]
[0098]
[0099] The molar ratio of the silyl hydrogen group in the side hydrogen-containing silicone oil to the vinyl group in the terminal vinyl silicone oil is 0.20.
[0100] Comparative Example 4
[0101] The raw material composition of the single-component thermally conductive gel composition described in this embodiment is as follows:
[0102]
[0103] The molar ratio of the silyl hydrogen groups in the side hydrogen-containing silicone oil to the vinyl groups in the terminal vinyl silicone oil is 1.22.
[0104] Comparative Example 5
[0105] The raw material composition of the single-component thermally conductive gel composition described in this embodiment is as follows:
[0106]
[0107]
[0108] The molar ratio of the silyl hydrogen group in the side hydrogen-containing silicone oil to the vinyl group in the terminal vinyl silicone oil is 4.05.
[0109] Comparative Example 6
[0110] The raw material composition of the single-component thermally conductive gel composition described in this embodiment is as follows:
[0111]
[0112] The molar ratio of the silane hydrogen group in the side hydrogen-containing silicone oil to the vinyl group in the terminal vinyl silicone oil is 2.03; the preparation method of the single-component thermal conductive gel comprises the following steps:
[0113] (1) according to the specific amount, the single-end vinyl silicone oil, the side hydrogen silicone oil and the inhibitor were added into a planetary mixer, stirred for 5 minutes to mix evenly, and the modified thermal conductive powder was added in three batches, and stirred for 30 minutes after adding until the mixture was evenly mixed;
[0114] (2) putting the catalyst into a planetary mixer, stirring and mixing for 20 minutes, and evacuating the mixture to remove bubbles;
[0115] (3) After packaging, heat at 70° C. for 3 h to obtain a pre-cured single-component thermal conductive gel.
[0116] The thermally conductive gel compositions of the above embodiments and comparative examples were tested respectively:
[0117] 1. Thermal conductivity: measured in accordance with ASTM D 5470-01 Characterization test for thermal conductivity of thin thermally conductive solid electrical insulating materials;
[0118] 2. Extrusion rate determination method: 30cc syringe filled with rubber, set the air pressure to 0.6MPa, and record the extrusion volume (mass) in 1min;
[0119] 3. Oil seepage determination method: Take 10g of single-component thermal conductive gel, place it on filter paper, make a circular gel sample with a diameter of 3cm, and calculate the oil seepage area after baking at 120℃ for 7 days (oil seepage area = maximum area of oil seepage edge - circular gel sample area).
[0120] The test results are as follows:
[0121]
[0122]
[0123] It can be seen from the table above that the thermal conductivity of Examples 1-5 is about 6.0 W / mK, the extrusion rate exceeds 30 g / min, and the oil penetration area is less than 1.5 cm 2 Due to the use of a specific single-end vinyl and side hydrogen-containing silicone oil technical solution, the silicon-hydrogen ratio (silicon-hydrogen to vinyl molar ratio) is designed to be between 1.5 and 3.0. After pre-curing, a branched structure that is neither a long-chain linear nor a three-dimensional network is formed, which can have both a high extrusion rate and a low oil yield.
[0124] Comparative Example 1 is different from Examples 1-5 in that it is a pure chain extension system of vinyl-terminated silicone oil and hydrogen-terminated silicone oil. The extrudability is only 21.3 g / min, and the oil penetration area is as high as 6.87 cm 2, oil leakage is serious; Comparative Examples 2 and 3 are both cured cross-linked systems with double-terminal vinyl and side hydrogen-containing silicone oils. Although the silicon-hydrogen ratio has been designed to be much less than 1, the extrusion performance is far inferior to that of Examples 1-5, and the oil leakage area exceeds 4cm 2 The above are far less than Examples 1-5; Comparative Example 4 is different from Example 3 in that its silicon-hydrogen ratio is designed to be 1.22, and the branched chain links are very dense. Although the oil penetration area is smaller, the extrusion is too low to meet the high extrusion requirements. Comparative Example 5 is different from Example 3 in that its silicon-hydrogen ratio is designed to be 4.05, and the branched chain links are too loose. Although its extrusion rate is high, the oil penetration is relatively poor, reaching 2.17 cm 2 ; Comparative Example 6 is different from Example 3 in that a single-ended vinyl silicone oil with a viscosity of 300 mPa.s is used. Although the silicon-hydrogen ratio is designed to be consistent, the molecular weight is too large, resulting in excessively long branched chains and an extrusion rate of only 7.69 g / min, which cannot take into account both high extrusion and low oil permeability requirements.
[0125] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0126] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.
Claims
1. A single-component thermally conductive gel, characterized in that: The composition is prepared from the following raw materials by weight: Single-ended vinyl silicone oil: 100 parts, Side hydrogen silicone oil: 20-60 parts, Modified thermal conductive powder: 2400-3100 parts, Inhibitor: 0.01-0.2 parts, Platinum catalyst: 2ppm-10ppm; The structure of the single-ended vinyl silicone oil is: Its viscosity is 10mPa·s~200mPa·s; The structure of the side hydrogen-containing silicone oil is Its hydrogen content is 0.05wt% to 0.3wt% and its viscosity is 50 to 500mPa·s; The modified thermally conductive powder is made from ordinary thermally conductive powder modified by long-chain alkyl silane.
2. The single-component thermally conductive gel according to claim 1, characterized in that: The single-end vinyl silicone oil has a viscosity of 30 mPa·s to 200 mPa·s, preferably a viscosity of 50 mPa·s to 100 mPa·s.
3. The single-component thermally conductive gel according to claim 1, characterized in that: The hydrogen content of the side hydrogen-containing silicone oil is 0.1wt% to 0.2wt%, and the viscosity is 50mPa·s to 300mPa·s, more preferably 150mPa·s to 300mPa·s.
4. The single-component thermally conductive gel according to any one of claims 1 to 3, characterized in that: The molar ratio of the silyl hydrogen groups in the side hydrogen-containing silicone oil to the vinyl groups in the single-terminal vinyl silicone oil is 1.5:1 to 3.0:1, preferably 2:1 to 3.0:
1.
5. The single-component thermally conductive gel according to any one of claims 1 to 3, characterized in that: The long-chain alkylsilane used for modification in the modified thermally conductive powder is trimethoxysilane containing an alkyl group with 8 to 16 carbon atoms; and / or The thermally conductive powder is one or a combination of aluminum oxide, zinc oxide, magnesium oxide, aluminum nitride and boron nitride.
6. The single-component thermally conductive gel according to claim 5, characterized in that: The preparation method of the modified thermally conductive powder comprises: adding 100 parts by weight of thermally conductive powder into a stirring kettle, atomizing and spraying 0.1-1.0 parts by weight of long-chain alkyl silane into the stirring kettle under stirring, heating to 70° C.-90° C. and reacting for 1 h to 3 h to obtain the modified thermally conductive powder.
7. The single-component thermally conductive gel according to claim 5, characterized in that: The weight portion of the long-chain alkyl silane is 0.1-0.5, more preferably 0.1-0.3, and even more preferably 0.15-0.3; and / or The long-chain alkylsilane is trimethoxysilane containing an alkyl group of 8 to 16 carbon atoms, preferably trimethoxysilane containing an alkyl group of 10 to 14 carbon atoms, and most preferably dodecyltrimethoxysilane.
8. The single-component thermally conductive gel according to any one of claims 1 to 3, characterized in that: When the single-end vinyl silicone oil in the one-component thermally conductive gel is 100 parts, the side hydrogen-containing silicone oil is 20-50 parts, more preferably 20-30 parts; and / or Modified thermal conductive powder: 2400-2600 parts; and / or 0.1-0.2 parts of inhibitor; and / or The platinum catalyst is 3ppm-8ppm.
9. The single-component thermally conductive gel according to any one of claims 1 to 3, characterized in that: The platinum catalyst is one or a combination of chloroplatinic acid, chloroplatinic acid-isopropanol complex, and Custer catalyst; and / or the inhibitor is one or a combination of 1-ethynyl-1-cyclohexanol, tetramethyltetravinylcyclotetrasiloxane, 2-methyl-3-butynyl-2-ol, 3-methyl-1-hexynyl-3-ol, 3,5-dimethyl-1-hexynyl-3-ol, and 3-methyl-1-dodecynyl-3-ol.
10. A method for preparing the thermally conductive gel according to any one of claims 1 to 9, characterized in that: The preparation method comprises the following steps: (S1) adding the side hydrogenated silicone oil, the single-end vinyl silicone oil and the inhibitor into a blender, stirring and mixing them evenly, and then adding the modified thermal conductive powder in batches, stirring and mixing them evenly after adding them; (S2) putting the catalyst into a stirrer, stirring and mixing evenly, and vacuuming to remove bubbles to obtain a mixture; (S3) heating and pre-curing the mixture obtained in step (S2) to obtain the pre-cured single-component thermally conductive gel.
Citation Information
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