Silicon-based cooling liquid with high compatibility as well as preparation method and application of silicon-based cooling liquid

Abstract

The invention belongs to the technical field of cooling liquid, and discloses silicon-based cooling liquid with high compatibility as well as a preparation method and application of the silicon-based cooling liquid. The silicon-based cooling liquid is prepared from the following components in parts by mass: 55 to 65 parts of low-viscosity polydimethylsiloxane, 30 to 40 parts of modified polydimethylsiloxane, 2 to 3.5 parts of a de-foaming agent, 1 to 2 parts of an acid eliminating agent and 0.2 to 0.8 part of an ignition point improving agent. The silicon-based cooling liquid obtained by the invention not only improves the safety and efficiency of a system, but also improves the material compatibility and environmental friendliness, and effectively solves various problems in the application of the existing cooling liquid in the fields of new energy and data centers.

Description

Technical Field

[0001] The present invention relates to the technical field of cooling liquids, and in particular to a silicon-based cooling liquid with high compatibility, and a preparation method and application thereof. Background Art

[0002] With the rapid development of new energy and data center industries, power density continues to increase, and the demand for heat dissipation technology is becoming increasingly urgent. Heat dissipation technology will develop in the direction of higher efficiency and lower energy consumption. At the same time, with the improvement of environmental awareness, heat dissipation technology pays more and more attention to environmental performance and reduces the impact on the environment. While improving the heat dissipation effect, safety will become an important development direction of heat dissipation technology. At present, heat dissipation technologies mainly include air cooling and cold plate technology. However, under the background of increasing power density, the heat dissipation effects of these two technologies can no longer meet actual needs.

[0003] In recent years, immersion liquid cooling technology has gradually become a research hotspot. This technology has higher heat dissipation efficiency and lower energy consumption, and is considered to be a green and efficient cooling technology. As an efficient heat dissipation method, especially in the field of high-performance computing and data centers, immersion liquid cooling technology achieves heat dissipation by completely immersing electronic equipment in coolant. At present, there are two main types of immersion coolants on the market: fluorinated liquids and olefin compounds. Fluorinated liquid is a cooling medium based on immersion liquid cooling technology. Its advantages include: 1) High thermal conductivity: Fluorinated liquid usually has high thermal conductivity and can quickly absorb and transfer heat, so the heat dissipation efficiency is very high; 2) Low viscosity: Fluorinated liquid has low viscosity and good fluidity, which makes it easier to circulate and distribute in the immersion cooling system; 3) Chemical stability: Fluorinated liquid has stable chemical properties and is not easy to react with other substances. Therefore, it has low corrosiveness to electronic components and can extend the life of the equipment; 4) No moisture: Fluorinated liquid does not contain moisture, avoiding conductivity and corrosion problems caused by moisture, and is suitable for highly sensitive electronic equipment; 5) Suitable for high power density: Fluorinated liquid can effectively cope with the heat generated by high power density equipment, and is suitable for applications such as high-performance computing and servers. However, its disadvantages cannot be ignored, especially in terms of cost, environmental protection and safety: 1) High volatility: Fluorinated liquid has high volatility and easily evaporates into the air, which may cause environmental pollution and personnel health risks; 2) High cost: The production and recycling costs of fluorinated liquid are high, which increases the overall cost of the cooling system; 3) Environmental issues: Fluorinated liquid has a certain impact on the environment, and its emission and treatment need to strictly comply with environmental protection regulations, otherwise it may cause environmental pollution; 4) Compatibility issues: Although fluorinated liquid has good chemical stability, it is not compatible with all materials and may damage certain types of sealing materials or coatings.

[0004] Olefin compound coolant is a type used in immersion liquid cooling systems, often composed of linear or branched olefins, such as polyalphaolefin (PAO). This type of coolant has good chemical stability, high thermal conductivity, strong electrical insulation, low viscosity, and low volatility. However, there are indeed many disadvantages, such as low flash ignition point: increased risk of fire and explosion, requiring additional safety measures, such as the use of explosion-proof electrical equipment, strict control of ignition sources, and installation of proper ventilation systems; poor material compatibility: olefin compound coolant may be corrosive or soluble to certain materials (such as rubber, plastic, etc.); poor reliability: after long-term use, the coolant will absorb heat or impurities, resulting in performance degradation.

[0005] Therefore, it is of great significance to study a highly compatible silicon-based coolant and its preparation method so that it can meet market demand and provide more efficient, environmentally friendly and safe heat dissipation solutions for new energy and data center scenarios. Summary of the invention

[0006] The present invention provides a silicon-based coolant with high compatibility and a preparation method and application thereof, the purpose of which is to solve the problems of low ignition point, poor thermal conductivity, poor material compatibility, poor volatility and difficulty in biodegradation existing in the prior art.

[0007] In order to achieve the above object, the present invention adopts the following technical solution:

[0008] The present invention provides a silicon-based coolant with high compatibility, comprising the following components in parts by mass:

[0009] 55-65 parts of low-viscosity polydimethylsiloxane, 30-40 parts of modified polydimethylsiloxane, 2-3.5 parts of defoaming agent, 1-2 parts of anti-acid agent, 0.2-0.8 parts of ignition point enhancer.

[0010] Preferably, the kinematic viscosity of the low-viscosity polydimethylsiloxane is ≤200 cSt.

[0011] Preferably, the modified polydimethylsiloxane is phenyl polydimethylsiloxane or hydroxy polydimethylsiloxane.

[0012] Preferably, the defoaming agent is polydimethylsiloxane or hydroxyl-terminated branched polydimethylsiloxane;

[0013] The viscosity of the polydimethylsiloxane is 50 to 1000 cSt.

[0014] Preferably, the acid relieving agent is one or more of sodium hydroxide, potassium hydroxide, calcium hydroxide and aluminum hydroxide.

[0015] Preferably, the ignition point enhancer is cerium oxide, cerium nitrate, zirconium octoate or an oil-soluble cesium compound, and the oil-soluble cesium compound is Ce(acac)4.

[0016] The present invention also provides a method for preparing the silicon-based coolant with high compatibility, comprising the following steps:

[0017] Low-viscosity polydimethylsiloxane, modified polydimethylsiloxane, a defoamer, an acid-removing agent, an ignition point enhancer, a desiccant and an adsorbent are mixed and heated to obtain a silicon-based coolant.

[0018] Preferably, the desiccant is one or more of molecular sieve, activated carbon and alumina;

[0019] The adsorbent is white clay or diatomaceous earth;

[0020] The mass ratio of the low-viscosity polydimethylsiloxane, the desiccant and the adsorbent is 88-92:5-7:2-5.

[0021] Preferably, the mixing time is 1 to 3 hours, the heating temperature is 110 to 150° C., and the heating time is 1 to 2 hours.

[0022] The present invention also provides application of the silicon-based coolant with high compatibility in the fields of new energy and data centers.

[0023] It can be seen from the above technical solutions that, compared with the prior art, the present invention has the following beneficial effects:

[0024] The present invention prepares a silicon-based coolant with excellent properties by accurately proportioning and mixing at least two siloxane organic substances, and heating and stirring for at least 2 hours. The prepared silicon-based coolant has its inherent non-volatility at room temperature, ensuring the stability of the coolant during storage and use. The silicon-based coolant takes environmental factors into consideration, making it easier to biodegrade and reducing potential impact on the environment.

[0025] The silicon-based coolant of the present invention not only improves the safety and efficiency of the system, but also improves material compatibility and environmental friendliness, and effectively solves various problems in the application of existing coolants in the fields of new energy and data centers. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0027] Figure 1 A schematic diagram of an oil cooler used for the silicon-based coolant obtained in the present invention;

[0028] Figure 2 for Figure 1 Schematic diagram of the internal structure of the oil cooler. DETAILED DESCRIPTION

[0029] The present invention provides a silicon-based coolant with high compatibility, comprising the following components in parts by mass:

[0030] 55-65 parts of low-viscosity polydimethylsiloxane, 30-40 parts of modified polydimethylsiloxane, 2-3.5 parts of defoaming agent, 1-2 parts of anti-acid agent, 0.2-0.8 parts of ignition point enhancer.

[0031] In the present invention, the mass fraction of the low-viscosity polydimethylsiloxane is preferably 56 to 63 parts, more preferably 57 to 62 parts, and more preferably 58 to 60 parts. The mass fraction of the modified polydimethylsiloxane is preferably 32 to 38 parts, more preferably 34 to 37 parts, and more preferably 35 to 36 parts. The mass fraction of the defoaming agent is preferably 2.2 to 3.3 parts, more preferably 2.4 to 3 parts, and more preferably 2.6 to 2.8 parts. The mass fraction of the anti-acid agent is preferably 1.2 to 1.8 parts, more preferably 1.4 to 1.7 parts, and more preferably 1.5 to 1.6 parts. The mass fraction of the ignition point enhancer is preferably 0.3 to 0.7 parts, more preferably 0.4 to 0.6 parts, and more preferably 0.5 parts.

[0032] In the present invention, the kinematic viscosity of the low-viscosity polydimethylsiloxane is preferably ≤200 cSt, more preferably 10 to 120 cSt, and more preferably 20 to 50 cSt; the low-viscosity polydimethylsiloxane is continuously synthesized using a cation exchange resin as a catalyst.

[0033] In the present invention, the modified polydimethylsiloxane is preferably phenyl polydimethylsiloxane or hydroxy polydimethylsiloxane; the kinematic viscosity of the modified polydimethylsiloxane is preferably 30 to 500 cSt, more preferably 40 to 400 cSt, and more preferably 70 to 200 cSt.

[0034] In the present invention, the phenyl polydimethylsiloxane can improve the heat resistance and hydrophobicity of the coolant; the hydroxyl-terminated modification in the hydroxyl polydimethylsiloxane can improve the fluidity and heat resistance of the coolant by introducing a hydroxyl (-OH) group at the end of the polymer chain, and at the same time can improve the resistance to chemicals (such as solvents, acids, and alkalis).

[0035] In the present invention, the kinematic viscosity of the modified polydimethylsiloxane is greater than the kinematic viscosity of the low-viscosity polydimethylsiloxane.

[0036] In the present invention, the defoamer has a linear or branched structure, preferably polydimethylsiloxane or hydroxyl-terminated branched polydimethylsiloxane;

[0037] The viscosity of the polydimethylsiloxane is preferably 50 to 1000 cSt, more preferably 200 to 800 cSt, and even more preferably 400 to 600 cSt.

[0038] In the present invention, the acid-removing agent is a chemical substance that can neutralize acidic substances, preferably one or more of sodium hydroxide, potassium hydroxide, calcium hydroxide and aluminum hydroxide.

[0039] In the present invention, the ignition point enhancer is preferably a cerium compound or an oil-soluble cesium compound. The cerium compound preferably includes one or more of cerium oxide, cerium nitrate and zirconium octanoate. The oil-soluble cesium compound is preferably Ce(acac)4, which can increase the ignition point of the fuel, thereby improving the safety of storage and use of silicon-based coolants.

[0040] The present invention also provides a method for preparing the silicon-based coolant with high compatibility, comprising the following steps:

[0041] Low-viscosity polydimethylsiloxane, modified polydimethylsiloxane, a defoamer, an acid-removing agent, an ignition point enhancer, a desiccant and an adsorbent are mixed and heated to obtain a silicon-based coolant.

[0042] In the present invention, the desiccant is preferably one or more of molecular sieve, activated carbon and alumina, which has high hygroscopicity and is used to remove moisture from oil products;

[0043] The adsorbent is preferably white clay or diatomaceous earth, which is used to adsorb impurities in the coolant;

[0044] The mass ratio of the low-viscosity polydimethylsiloxane, the desiccant and the adsorbent is preferably 88-92:5-7:2-5, more preferably 89-91:5-7:3-4, and more preferably 90:6:4.

[0045] In the present invention, the mixing time is preferably 1 to 3 hours, more preferably 1.5 to 2.5 hours, more preferably 2 hours, the heating temperature is preferably 110 to 150°C, more preferably 120 to 140°C, more preferably 125 to 130°C, and the heating time is preferably 1 to 2 hours, more preferably 1.5 hours.

[0046] In the present invention, the addition of the defoaming agent, deacidifying agent, ignition point enhancer, adsorbent and desiccant further improves the ignition point and thermal conductivity of the coolant, making it more suitable for high temperature and high pressure working environment.

[0047] In the present invention, the purpose of filtering after heating is to remove the adsorbent and the desiccant; the filtration is preferably carried out by filtering with a filter, and the mesh size of the filter is preferably ≥100μm, more preferably ≥150μm, and more preferably ≥200μm.

[0048] The present invention also provides application of the silicon-based coolant with high compatibility in the fields of new energy and data centers.

[0049] In the present invention, the application also includes applying the highly compatible silicon-based coolant to an oil cooler with four-sided air extraction.

[0050] The technical solutions provided by the present invention are described in detail below in conjunction with the embodiments, but they should not be construed as limiting the protection scope of the present invention.

[0051] Example 1

[0052] In this embodiment, the raw materials for preparation include the following components in parts by weight:

[0053] 65 parts of low viscosity polydimethylsiloxane with a kinematic viscosity of 20 cSt, 30 parts of phenyl polydimethylsiloxane with a kinematic viscosity of 30 cSt, 2.5 parts of polydimethylsiloxane, 1.5 parts of sodium hydroxide, 0.5 parts of cerium oxide, 4.3 parts of activated carbon, and 2.9 parts of diatomaceous earth;

[0054] The preparation method is:

[0055] Low viscosity polydimethylsiloxane, phenyl polydimethylsiloxane, polydimethylsiloxane, sodium hydroxide, cerium oxide, activated carbon and diatomaceous earth were mixed for 2 hours and heated at 120° C. for 2 hours to obtain a mixed solution. The obtained mixed solution was sieved with a sieve with a pore size of 120 μm to obtain a silicon-based coolant.

[0056] Example 2

[0057] In this embodiment, the raw materials for preparation include the following components in parts by weight:

[0058] 65 parts of low viscosity polydimethylsiloxane with a kinematic viscosity of 10 cSt, 30 parts of hydroxy polydimethylsiloxane with a kinematic viscosity of 30 cSt, 3 parts of polydimethylsiloxane, 1.2 parts of calcium hydroxide, 0.7 parts of cerium oxide, 4.3 parts of activated carbon, and 2.9 parts of diatomaceous earth;

[0059] The preparation method is:

[0060] Low viscosity polydimethylsiloxane, hydroxy polydimethylsiloxane, polydimethylsiloxane, calcium hydroxide, cerium oxide, activated carbon and diatomaceous earth were mixed for 2 hours and heated at 120°C for 2 hours to obtain a mixed solution. The obtained mixed solution was sieved with a sieve with a pore size of 120 μm to obtain a silicon-based coolant.

[0061] Example 3

[0062] In this embodiment, the raw materials for preparation include the following components in parts by weight:

[0063] 65 parts of low viscosity polydimethylsiloxane with a kinematic viscosity of 10 cSt, 30 parts of phenyl polydimethylsiloxane with a kinematic viscosity of 30 cSt, 2.5 parts of polydimethylsiloxane, 1.5 parts of sodium hydroxide, 0.5 parts of cerium oxide, 4.3 parts of activated carbon, and 2.9 parts of diatomaceous earth;

[0064] The preparation method is:

[0065] Low viscosity polydimethylsiloxane, phenyl polydimethylsiloxane, polydimethylsiloxane, sodium hydroxide, cerium oxide, activated carbon and diatomaceous earth were mixed for 2 hours and heated at 120° C. for 2 hours to obtain a mixed solution. The obtained mixed solution was sieved with a sieve with a pore size of 120 μm to obtain a silicon-based coolant.

[0066] Example 4

[0067] In this embodiment, the raw materials for preparation include the following components in parts by weight:

[0068] 65 parts of low viscosity polydimethylsiloxane with a kinematic viscosity of 20 cSt, 30 parts of phenyl polydimethylsiloxane with a kinematic viscosity of 50 cSt, 2.5 parts of polydimethylsiloxane, 1.5 parts of sodium hydroxide, 0.5 parts of cerium oxide, 4.3 parts of activated carbon, and 2.9 parts of diatomaceous earth;

[0069] The preparation method is:

[0070] Low viscosity polydimethylsiloxane, phenyl polydimethylsiloxane, polydimethylsiloxane, sodium hydroxide, cerium oxide, activated carbon and diatomaceous earth were mixed for 2 hours and heated at 120° C. for 2 hours to obtain a mixed solution. The obtained mixed solution was sieved with a sieve with a pore size of 120 μm to obtain a silicon-based coolant.

[0071] Example 5

[0072] In this embodiment, the raw materials for preparation include the following components in parts by weight:

[0073] 65 parts of low viscosity polydimethylsiloxane with a kinematic viscosity of 30 cSt, 30 parts of phenyl polydimethylsiloxane with a kinematic viscosity of 50 cSt, 2.5 parts of polydimethylsiloxane, 1.5 parts of potassium hydroxide, 0.5 parts of cerium oxide, 4.3 parts of activated carbon, and 2.9 parts of white clay;

[0074] The preparation method is:

[0075] Low viscosity polydimethylsiloxane, phenyl polydimethylsiloxane, polydimethylsiloxane, potassium hydroxide, cerium oxide, activated carbon and white clay were mixed for 2 hours and heated at 120°C for 2 hours to obtain a mixed solution. The obtained mixed solution was sieved with a sieve with a pore size of 120 μm to obtain a silicon-based coolant.

[0076] Example 6

[0077] In this embodiment, the raw materials for preparation include the following components in parts by weight:

[0078] 65 parts of low viscosity polydimethylsiloxane with a kinematic viscosity of 50 cSt, 30 parts of phenyl polydimethylsiloxane with a kinematic viscosity of 70 cSt, 2.5 parts of polydimethylsiloxane, 1.5 parts of sodium hydroxide, 0.5 parts of cerium oxide, 4.3 parts of activated carbon, and 2.9 parts of diatomaceous earth;

[0079] The preparation method is:

[0080] Low viscosity polydimethylsiloxane, phenyl polydimethylsiloxane, polydimethylsiloxane, sodium hydroxide, cerium oxide, activated carbon and diatomaceous earth were mixed for 2 hours and heated at 120° C. for 2 hours to obtain a mixed solution. The obtained mixed solution was sieved with a sieve with a pore size of 120 μm to obtain a silicon-based coolant.

[0081] Example 7

[0082] In this embodiment, the raw materials for preparation include the following components in parts by weight:

[0083] 55 parts of low viscosity polydimethylsiloxane with a kinematic viscosity of 20 cSt, 35 parts of phenyl polydimethylsiloxane with a kinematic viscosity of 30 cSt, 2.5 parts of polydimethylsiloxane, 1.5 parts of sodium hydroxide, 0.5 parts of cerium oxide, 3.7 parts of activated carbon, and 2.45 parts of diatomaceous earth;

[0084] The preparation method is:

[0085] Low viscosity polydimethylsiloxane, phenyl polydimethylsiloxane, polydimethylsiloxane, sodium hydroxide, cerium oxide, activated carbon and diatomaceous earth were mixed for 2 hours and heated at 120° C. for 2 hours to obtain a mixed solution. The obtained mixed solution was sieved with a sieve with a pore size of 120 μm to obtain a silicon-based coolant.

[0086] Example 8

[0087] In this embodiment, the raw materials for preparation include the following components in parts by weight:

[0088] 55 parts of low viscosity polydimethylsiloxane with a kinematic viscosity of 20 cSt, 35 parts of hydroxy polydimethylsiloxane with a kinematic viscosity of 50 cSt, 2.5 parts of polydimethylsiloxane, 1.5 parts of sodium hydroxide, 0.5 parts of cerium oxide, 3.7 parts of activated carbon, and 2.45 parts of diatomaceous earth;

[0089] The preparation method is:

[0090] Low viscosity polydimethylsiloxane, hydroxy polydimethylsiloxane, polydimethylsiloxane, sodium hydroxide, cerium oxide, activated carbon and diatomaceous earth were mixed for 2 hours and heated at 120° C. for 2 hours to obtain a mixed solution. The obtained mixed solution was sieved with a sieve with a pore size of 120 μm to obtain a silicon-based coolant.

[0091] Example 9

[0092] In this embodiment, the raw materials for preparation include the following components in parts by weight:

[0093] 55 parts of low viscosity polydimethylsiloxane with a kinematic viscosity of 10 cSt, 35 parts of phenyl polydimethylsiloxane with a kinematic viscosity of 40 cSt, 2.5 parts of polydimethylsiloxane, 1.5 parts of sodium hydroxide, 0.5 parts of cerium oxide, 3.7 parts of activated carbon, and 2.45 parts of diatomaceous earth;

[0094] The preparation method is:

[0095] Low viscosity polydimethylsiloxane, phenyl polydimethylsiloxane, polydimethylsiloxane, sodium hydroxide, cerium oxide, activated carbon and diatomaceous earth were mixed for 2 hours and heated at 120° C. for 2 hours to obtain a mixed solution. The obtained mixed solution was sieved with a sieve with a pore size of 120 μm to obtain a silicon-based coolant.

[0096] Example 10

[0097] In this embodiment, the raw materials for preparation include the following components in parts by weight:

[0098] 55 parts of low viscosity polydimethylsiloxane with a kinematic viscosity of 10 cSt, 35 parts of phenyl polydimethylsiloxane with a kinematic viscosity of 30 cSt, 2.5 parts of polydimethylsiloxane, 1.5 parts of sodium hydroxide, 0.5 parts of cerium oxide, 3.7 parts of activated carbon, and 2.45 parts of diatomaceous earth;

[0099] The preparation method is:

[0100] Low viscosity polydimethylsiloxane, phenyl polydimethylsiloxane, polydimethylsiloxane, sodium hydroxide, cerium oxide, activated carbon and diatomaceous earth were mixed for 2 hours and heated at 120° C. for 2 hours to obtain a mixed solution. The obtained mixed solution was sieved with a sieve with a pore size of 120 μm to obtain a silicon-based coolant.

[0101] Embodiment 11

[0102] In this embodiment, the raw materials for preparation include the following components in parts by weight:

[0103] 55 parts of low viscosity polydimethylsiloxane with a kinematic viscosity of 30 cSt, 35 parts of phenyl polydimethylsiloxane with a kinematic viscosity of 50 cSt, 2.5 parts of polydimethylsiloxane, 1.5 parts of sodium hydroxide, 0.5 parts of cerium oxide, 3.7 parts of activated carbon, and 2.45 parts of diatomaceous earth;

[0104] The preparation method is:

[0105] Low viscosity polydimethylsiloxane, phenyl polydimethylsiloxane, polydimethylsiloxane, sodium hydroxide, cerium oxide, activated carbon and diatomaceous earth were mixed for 2 hours and heated at 120° C. for 2 hours to obtain a mixed solution. The obtained mixed solution was sieved with a sieve with a pore size of 120 μm to obtain a silicon-based coolant.

[0106] Example 12

[0107] In this embodiment, the raw materials for preparation include the following components in parts by weight:

[0108] 55 parts of low viscosity polydimethylsiloxane with a kinematic viscosity of 50 cSt, 35 parts of hydroxy polydimethylsiloxane with a kinematic viscosity of 70 cSt, 2.5 parts of polydimethylsiloxane, 1.5 parts of sodium hydroxide, 0.5 parts of cerium oxide, 3.7 parts of activated carbon, and 2.45 parts of diatomaceous earth;

[0109] The preparation method is:

[0110] Low viscosity polydimethylsiloxane, hydroxy polydimethylsiloxane, polydimethylsiloxane, sodium hydroxide, cerium oxide, activated carbon and diatomaceous earth are mixed for 2 hours and then heated at 120°C for 2 hours to obtain a mixed solution. The obtained mixed solution is sieved with a sieve with a pore size of 120 μm to remove the activated carbon and diatomaceous earth to obtain a silicon-based coolant.

[0111] Performance testing:

[0112] The flash point and ignition point of the silicon-based coolants obtained in Examples 1 to 12 were tested respectively, and the test results are shown in Table 1.

[0113] Table 1 Flash point and ignition point test results of silicon-based coolants obtained in Examples 1 to 12

[0114]

[0115] As can be seen from Table 1, the greater the viscosity, the greater the flash point and fire point of the silicon-based coolant. When the viscosity is as low as 10 cSt, the flash point can still be controlled above 250°C and the fire point can be controlled above 475°C, which is sufficient to meet the application needs of most scenarios.

[0116] The compatibility test was performed on the silicon-based coolant obtained in Example 1. The compatibility test was performed by placing the materials shown in Table 2 in the silicon-based coolant obtained in Example 1, respectively, and letting it stand at 80°C for 14 days. By comparing the changes in mass and volume before and after standing, it was determined whether there was a risk. The test results are shown in Table 2.

[0117] Table 2 Compatibility test results of silicon-based coolant obtained in Example 1

[0118]

[0119]

[0120] As shown in Table 2, the silicon-based coolant obtained in the present invention, except for having a certain impact on soft PVC, can be applied to the components described in Table 2, that is, it has extremely strong compatibility.

[0121] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A silicon-based coolant with high compatibility, characterized in that: The composition includes the following components in parts by weight: 55-65 parts of low-viscosity polydimethylsiloxane, 30-40 parts of modified polydimethylsiloxane, 2-3.5 parts of defoaming agent, 1-2 parts of anti-acid agent, 0.2-0.8 parts of ignition point enhancer.

2. A silicon-based coolant with high compatibility according to claim 1, characterized in that: The kinematic viscosity of the low-viscosity polydimethylsiloxane is ≤200 cSt.

3. A silicon-based coolant with high compatibility according to claim 1, characterized in that: The modified polydimethylsiloxane is phenyl polydimethylsiloxane or hydroxy polydimethylsiloxane.

4. The silicon-based coolant with high compatibility according to claim 1, characterized in that: The defoaming agent is polydimethylsiloxane or hydroxyl-terminated branched polydimethylsiloxane; The viscosity of the polydimethylsiloxane is 50 to 1000 cSt.

5. The silicon-based coolant with high compatibility according to claim 1, characterized in that: The acid relieving agent is one or more of sodium hydroxide, potassium hydroxide, calcium hydroxide and aluminum hydroxide.

6. The silicon-based coolant with high compatibility according to claim 1, characterized in that: The ignition point enhancer is cerium oxide, cerium nitrate, zirconium octanoate or an oil-soluble cesium compound, and the oil-soluble cesium compound is Ce(acac)4.

7. A method for preparing a highly compatible silicon-based coolant according to any one of claims 1 to 6, characterized in that: The steps include: The low-viscosity polydimethylsiloxane, modified polydimethylsiloxane, a defoamer, an acid-removing agent, a flash point enhancer, a desiccant and an adsorbent are mixed and heated to obtain a silicon-based coolant.

8. The method for preparing a silicon-based coolant with high compatibility according to claim 7, characterized in that: The desiccant is one or more of molecular sieve, activated carbon and alumina; The adsorbent is white clay or diatomaceous earth; The mass ratio of the low-viscosity polydimethylsiloxane, the desiccant and the adsorbent is 88-92:5-7:2-5.

9. The method for preparing a silicon-based coolant with high compatibility according to claim 7, characterized in that: The mixing time is 1 to 3 hours, the heating temperature is 110 to 150° C., and the heating time is 1 to 2 hours.

10. Application of the highly compatible silicon-based coolant according to any one of claims 1 to 6 in the fields of new energy and data centers.

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