Chip testing jig and chip testing method using same

Abstract

The invention relates to the fields of manufacturing and testing of chip component production equipment in the electronic core industry, manufacturing and testing of special equipment for semiconductor devices and the like, in particular to a chip testing jig and a chip testing method applying the same. The chip testing jig comprises a base, the middle part of the upper surface of the base is provided with a pressing groove, and the middle part of the pressing groove is provided with a chip groove; the covering piece comprises a covering body, and a through screw hole is formed in the middle of the covering body; the pressing sheet is arranged below the covering body; the press-fit height adjusting part comprises a stud part, the outer side of the stud part is provided with threads matched with the through screw hole, and the stud part is screwed into the through screw hole; in the covering state, the pressing piece is arranged above the chip groove in a pressing mode. The front end of a screw of the stud piece abuts against the back face of the pressing piece, and along with the change of the screwing-in depth of the stud piece, the front end of the screw pushes the pressing piece to move up and down. The chip testing jig can adapt to chips to be tested with different thicknesses, and the use scene of the same chip testing jig is expanded.

Description

Technical Field

[0001] The present invention relates to the fields of chip component production equipment manufacturing and testing, semiconductor device special equipment manufacturing and testing in the core electronics industry, and in particular to a chip testing jig and a chip testing method using the same. Background Art

[0002] The chip test jig is a standard test device that tests the electrical performance and electrical connections of the chip to check for manufacturing defects and component failures. It is a static connector between the IC and the PCB. It makes chip replacement testing more convenient without having to constantly solder and remove the chip. In this way, the chip and PCB will not be damaged, thereby achieving fast and efficient testing.

[0003] In the process of realizing the present invention, the applicant found that the thickness of different types of chips and different batches of chips of the same type in the scientific research / trial production stage are different. During the test process, the probe often has a virtual connection due to insufficient pressure, and the chip is broken due to excessive pressure. In addition, for piezoelectric MEMS chips, external force causes the substrate to deform, and the deformation is transmitted to the piezoelectric MEMS to generate stress, which causes the piezoelectric MEMS device to be abnormal or fail. Therefore, the working conditions of the chip under different pressure environments are worth studying.

[0004] In addition, the temperature control of mm-scale microchips is often achieved through a temperature chamber, but the process is slow and difficult to accurately control, and it is even more difficult to measure and control the chip temperature in real time. In particular, different temperature change rates will generate corresponding pyroelectric signals for piezoelectric MEMS devices. In order to meet the test of chip functions under different temperature change rates, it is necessary to measure and control the chip temperature in real time. The size of MEMS electronic cigarette chips is small, generally between 1.8 and 6 mm in length and width, and the diameter of the chip pores is generally between 0.2 and 0.5 mm. The sealing connection of the test airway is one of the difficulties in the test. It is often placed on the PCB measurement board through reflow soldering, and then the airway is glued to build the measurement airway. The process is complicated, the test efficiency is low, the PCB board is expensive and cannot be reused, and the glue bonding sealing effect is uncertain. Therefore, it is cost-saving and necessary to make a reusable measuring fixture that can seal the pores of tiny chips well and only needs to replace the chip to be tested. Summary of the invention

[0005] 1. Technical issues to be solved

[0006] The present invention is expected to at least partially solve one of the above technical problems.

[0007] 2. Technical Solution

[0008] The first aspect of the present invention provides a chip testing jig. The chip testing jig comprises: a base, a pressing groove is provided in the middle of the upper surface of which, and a chip slot is provided in the middle of the pressing groove; a cover, comprising: a cover body, a through screw hole is provided in the middle thereof; a pressing sheet is provided below the cover body; a pressing height adjustment member comprises: a stud member, a thread matching the through screw hole is provided on the outer side thereof, and the stud member is screwed into the through screw hole; wherein, in the cover state, the cover body is pressed on the upper surface of the base, and the pressing sheet at least partially extends into the pressing groove and is pressed above the chip slot; the front end of the screw of the stud member is pressed against the back of the pressing sheet, and as the screwing depth of the stud member changes, the front end of the screw pushes the pressing sheet to move up and down.

[0009] The second aspect of the present invention provides a chip testing method. The chip testing method uses the above-mentioned chip testing jig, including: step A, retracting the stud member to a preset safe position; step B, opening the cover member from the base and placing the chip to be tested into the chip slot; step C, gradually screwing the stud member forward until the pressing piece presses the chip to be tested; step D, starting to test the chip to be tested.

[0010] 3. Beneficial Effects

[0011] (1) In the present invention, as the screw-in depth of the stud member changes, the front end of the screw pushes the pressing plate to move up and down, thereby effectively adjusting the distance between the front end of the pressing plate and the bottom of the chip slot.

[0012] The present invention can adapt to chips to be tested of different thicknesses, prevent the chips to be tested from being crushed, expand the use scenarios of the same chip testing jig, and reduce user costs.

[0013] (2) In the present invention, a pressure sensor is provided between the front end of the screw of the screw member and the pressing piece, and the cable of the pressure sensor is led out from the side of the pressing piece and connected to a corresponding testing instrument.

[0014] In actual scenarios, it is necessary to pay attention to the following: ① Screw the stud forward step by step and observe the value output by the pressure sensor to prevent the chip under test from being crushed due to excessive pressure caused by screwing in too quickly. ② Test after the pressure sensor output reaches the preset pressure value to prevent incorrect test results due to virtual connection.

[0015] Those skilled in the art should understand that, due to the pressure sensor, the chip testing jig of the present invention can also test the signal response of the chip to be tested under different pressure environments.

[0016] (3) In the present invention, N threaded holes are arranged on the periphery of the connection part, and N ≥ 2. N countersunk holes corresponding to the threaded holes are arranged on the cover body, and through-holes are arranged in the countersunk holes. The cover part also includes: N floating bolts, for each floating bolt, its screw rod passes through the through-hole of the cover body and is screwed to the threaded hole of the pressing piece; a spring is arranged between its screw head and the surface of the cover body. The spring is arranged in the countersunk head of the countersunk hole to prevent interference from the external environment. The spring and the floating bolt pull the pressing piece tightly against the front end of the screw rod.

[0017] (4) In the present invention, a pressing groove corresponding to the cross-sectional shape of the stud is formed in the middle of the surface of the pressing sheet near the stud; the front end of the screw of the stud extends into the pressing groove. The pressing groove enables the front end of the stud to be stably and reliably inserted into the pressing groove, and leaves enough space for the subsequent temperature adjustment element groove and temperature measurement element groove.

[0018] (5) In the present invention, a stop column is provided on the upper surface of the covering body; wherein, when the pressing plate has not reached the pressing limit position, the handle is turned to rotate freely, and the pressing plate moves up and down with the front end of the screw; when the pressing plate reaches the pressing limit, the stop column blocks the further tightening of the handle to prevent the chip to be tested from being crushed.

[0019] (6) In the present invention, a temperature regulating element and a temperature measuring element are added to the chip testing jig, so that the signal response of the chip to be tested at different temperatures can be tested, thereby expanding the scope of chip testing.

[0020] Furthermore, by arranging the test probe, test gas path, etc. at the lower part of the chip slot of the base, and arranging the temperature regulating element, temperature measuring element, etc. on the cover, the base space can be utilized more reasonably, which is more conducive to the layout of cables, gas paths, and heat transfer paths. The performance of the MEMS electronic cigarette chip can be monitored in real time in response to the temperature changes of the temperature regulating element, the mechanical pressure of the screw, the air pressure changes of the test airway, and other factors, thereby realizing multifunctional synchronous testing of temperature, shell pressure, chip pore air pressure, and output signal, and improving the accuracy and reliability of the test results.

[0021] (7) In the present invention, a temperature regulating element groove and a temperature measuring element groove are provided at the bottom of the pressing groove. A pressing piece lead groove is provided on the side of the two element grooves; and a cover part lead hole is provided on the cover body. The cables of the temperature regulating element and / or the temperature measuring element are led out from the pressing piece lead groove and the cover part lead groove to the side of the cover part body. The cables of the temperature regulating element and the temperature measuring element are led out from the cover part body instead of the pressing piece, which can avoid the influence of the up and down movement of the pressing piece body on the related functions and also avoid the damage of the cables.

[0022] (8) In the present invention, in order to improve the heat transfer efficiency, thermal conductive silicone grease is filled at the positions where the temperature regulating element and the temperature measuring element contact the bottom of the corresponding groove.

[0023] (9) In the present invention, the temperature regulating element groove and the temperature measuring element groove are respectively encapsulated with the temperature regulating element and the temperature measuring element and then filled with encapsulating glue, and the bottom surface of the pressing groove is flat.

[0024] The present invention can produce the following beneficial effects through the above arrangement: first, it can ensure that the temperature regulating element and the temperature measuring element will not be damaged when the stud member is pressed down; second, it can reasonably utilize the space to prevent the temperature regulating element and the temperature measuring element from interfering with the test probe, airway, etc.

[0025] (10) In the present invention, the inverted trumpet-shaped chip slot airway is conducive to avoiding interference between the test airway and the test probe, and can improve the mechanical strength of the base itself. The inverted trumpet-shaped overall test airway is conducive to quickly and accurately transmitting air pressure, improving the accuracy and reliability of testing under different air pressure conditions.

[0026] (11) In the present invention, the base includes: an outer portion, an inlay groove formed inside thereof; an inner portion, which is detachably inlaid in the inlay groove, wherein the probe, the chip slot airway, etc. are arranged in the inner portion. Since the positions of the electrical contacts of different chips to be tested are different, the inner portion is arranged to be detachable, so that when testing different types of chips, only the inner portion can be replaced, and the probe of the inner portion can be electrically connected to the corresponding part on the circuit board, thereby greatly expanding the test scenarios of the chip test jig and reducing the cost.

[0027] (12) In summary, the present invention provides a chip testing jig that is adaptable to various chips of different thicknesses, different sizes, and different electrical contact positions, which can improve the convenience, accuracy, and safety of testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1A and Figure 1B They are respectively a stereoscopic view and a front view of a chip testing jig in an open state according to an embodiment of the present invention.

[0029] Figure 2A and Figure 2B They are Figure 1A The chip test jig is shown in a three-dimensional view and a front view in a closed state.

[0030] Figure 3A and Figure 3B They are Figure 1A The three-dimensional view and front view of the base, circuit board and gas path connector in the chip test fixture are shown.

[0031] Figure 4A and Figure 4B They are Figure 1AThe three-dimensional view and the front view of the cover part and the pressing height adjustment part in the chip testing jig are shown.

[0032] Figure 5A and Figure 5B for Figure 1A The three-dimensional view and front view of the pressing plate in the chip testing jig are shown. DETAILED DESCRIPTION

[0033] The object of the present invention is to provide a chip testing jig which is adaptable to various chips with different thicknesses, different sizes and different electrical contact positions, so as to improve the accuracy and safety of the test.

[0034] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific implementation methods and with reference to the accompanying drawings.

[0035] Figure 1A and Figure 1B They are respectively a stereoscopic view and a front view of a chip testing jig in an open state according to an embodiment of the present invention. Figure 2A and Figure 2B They are Figure 1A The chip test jig is shown in a three-dimensional view and a front view in a closed state. Figure 3A and Figure 3B They are Figure 1A The three-dimensional view and front view of the base, circuit board and gas path connector in the chip test fixture are shown. Figure 4A and Figure 4B They are Figure 1A The three-dimensional view and the front view of the cover part and the pressing height adjustment part in the chip testing jig are shown. Figure 5A and Figure 5B for Figure 1A The three-dimensional view and front view of the pressing plate in the chip testing jig are shown.

[0036] It should be noted that, in order to more clearly illustrate the internal structure, the key parts of each figure are drawn in perspective, and the perspective parts are represented by dotted lines. Please refer to the figures, the chip test jig of this embodiment includes:

[0037] The base 100 has a pressing groove 101 in the middle of its upper surface, and a chip groove 102 in the middle of the pressing groove;

[0038] The cover member 200 comprises: a cover body 210, the middle of which is provided with a through screw hole; a pressing piece 220, which is provided below the cover body;

[0039] The press-fit height adjustment member 300 comprises: a stud member 310, the outer side of which is provided with a thread matching the through screw hole, and the stud member is screwed into the through screw hole; a handle 320 is turned and fixed to the top end of the stud member;

[0040] The circuit board 400 is fixed to the lower surface of the base and is provided with connection terminals 410;

[0041] The gas circuit connector 500 is fixed below the circuit board.

[0042] When testing the chip to be tested, the chip to be tested is placed in the chip slot 102, and the chip test jig is placed in a covering state as a whole, that is, the covering body 210 is pressed on the upper surface of the base 100, and the pressing piece 220 at least partially extends into the pressing slot 101 and is pressed above the chip to be tested in the chip slot 102. After the test is completed, the chip test jig is placed in an open state as a whole, that is, the covering body 210 is separated from the upper surface of the base 100, the pressing piece 220 is detached from the pressing slot 101, the pressing slot 101 and the chip slot 102 are opened, and the chip to be tested is taken out.

[0043] The following is a detailed description of each component of the chip testing jig of this embodiment.

[0044] In this embodiment, the chip to be tested is a MEMS piezoelectric electronic cigarette chip, and the response of the MEMS piezoelectric electronic cigarette chip under different air pressure environments and temperature environments needs to be tested. Therefore, a test airway and a temperature control element of the chip to be tested need to be set in the chip test jig.

[0045] In this case, in this embodiment, the test probe, test gas path, etc. are arranged at the lower part of the chip slot of the base, and the temperature control element, temperature measuring element, etc. are arranged on the cover part, which can make more reasonable use of the base space, is more conducive to the layout of cables, gas paths, and heat transfer paths, and monitor the performance of the MEMS electronic cigarette chip in real time in response to factors such as the temperature change of the temperature control element, the mechanical pressure of the screw member, and the air pressure change of the test airway, thereby realizing multifunctional synchronous testing of temperature, shell pressure, chip pore air pressure and output signal, and improving the accuracy and reliability of the test results.

[0046] As shown in the figure, M probe holes are set at the preset position at the bottom of the chip slot, M≥1. Among them, M probes 103 are set inside the base, the front end of which extends upward through the corresponding probe holes, and the rear end is connected to the pad on the circuit board. A connecting terminal 410 is set on the circuit board, which is electrically connected to the rear end of the M probes. The position of the probe 103 corresponds to the position of the electrical contact on the chip to be tested. When the chip to be tested is tested, the probe 103 is pressed against the corresponding contact on the chip to be tested, and the electrical signal will be transmitted to the corresponding test equipment through the connecting terminal 410.

[0047] It should be noted that the base 100 and the connection terminals 410 are respectively fixed to the middle and periphery of the upper surface of the circuit board 400. Such a configuration is more conducive to the stability of the chip test jig and also facilitates the signal connection between the chip test jig and the test equipment.

[0048] Please continue to refer to the attached drawings, a chip slot air passage 121 in the shape of an inverted trumpet is provided at a preset position at the bottom of the chip slot. The chip slot air passage 121 extends downward to the circuit board 400. The inverted trumpet-shaped chip slot air passage 121 is conducive to avoiding interference between the test air passage and the test probe, and can improve the mechanical strength of the base itself.

[0049] A circuit board air hole 401 is provided at a corresponding position of the circuit board below the chip slot air channel 121; and a connector air channel 501 is provided inside the air path connector below the circuit board air hole. Among them, the chip slot air channel 121, the circuit board air hole 401, and the connector air channel 501 together constitute the test air channel. The peripheral air path terminal 600 is connected to the air path connector, and its front end is connected to the test air channel, and the test air channel as a whole is in the shape of an inverted trumpet. Among them, the overall test air channel in the shape of an inverted trumpet is conducive to quickly and accurately transmitting air pressure to the chip test slot, thereby improving the accuracy and reliability of testing under different air pressure conditions.

[0050] It should be noted that the above is only a preferred embodiment of the present invention, and the air circuit terminal is located at the bottom of the chip test jig. In some other embodiments of the present invention, the air circuit terminal may also be located on the side of the chip test jig. In this case, the test airway may only include a chip slot airway, which first extends downward and then laterally to the side of the base. This variant can also implement the present invention, but such an airway design has rigid air circuit bends, and is not as fast and accurate as the present embodiment in terms of air pressure transmission speed and accuracy.

[0051] It should be noted that, in this embodiment, the depths of the chip slot and the pressing slot are specially set, specifically:

[0052] ①Chip slot depth

[0053] The chip slot depth is slightly smaller than the designed chip thickness to be tested, so that the press sheet can transfer pressure to the chip to be tested. In addition, the chip slot thickness cannot be too shallow to prevent the chip to be tested from slipping out of the chip slot. Specifically: 0.1mm≤H1-H2≤1mm, where H1 is the thickness of the chip to be tested and H2 is the depth of the chip slot.

[0054] ② Pressing groove depth

[0055] The depth of the pressing groove is slightly smaller than the thickness of the pressing part, that is, when the pressing sheet is pressed down, a part of the pressing part is always outside the pressing groove. Specifically: 0.5mm≤H3-H4≤1.5mm, where H3 is the thickness of the pressing sheet and H4 is the thickness of the pressing groove.

[0056] It should be emphasized that, in this embodiment, the base 100 includes: an outer portion, in which an inlay groove is formed; an inner portion, which is detachably inlaid in the inlay groove, wherein the probe, the chip slot airway, etc. are arranged in the inner portion. Since the positions of the electrical contacts of different chips to be tested are different, the inner portion is arranged to be detachable, so that when testing different types of chips, only the inner portion can be replaced, and the probe of the inner portion can be electrically connected to the corresponding part on the circuit board, thereby greatly expanding the test scenarios of the chip test jig and reducing the cost.

[0057] As mentioned above, the cover member 200 includes: a cover body 210, a central portion of which is provided with a through screw hole; and a pressing piece 220, which is provided below the cover body.

[0058] In order to realize the combination with the cover, the base 100 is pivotally connected to the first end of the cover body 210 through the pivot 110 on one side. The second end of the cover body is provided with a hook-shaped buckle 211 extending downward; the side of the base is provided with a buckle groove corresponding to the hook-shaped buckle; wherein, in the closed state, the hook-shaped buckle 211 is buckled into the buckle groove to lock the cover body 210 and the base 100, as shown in FIG2; in the open state, the hook-shaped buckle 211 is disengaged from the buckle groove, and the cover body rotates around the pivot and is unscrewed from the top of the base, as shown in FIG1.

[0059] Furthermore, the pressing sheet 220 includes: a connecting portion 221 and a pressing portion 222. The connecting portion 221 is in the shape of a larger square sheet, and the pressing portion 222 is in the shape of a smaller square sheet. The cross-sectional shape of the pressing portion 222 corresponds to the cross-sectional shape of the pressing groove. In the closed state, the pressing portion extends into the pressing groove and is pressed above the chip groove.

[0060] In this embodiment, the cross-sectional shape of the connecting portion 221 is larger than the cross-sectional shape of the stud member. A pressing groove 223 corresponding to the cross-sectional shape of the stud member is formed in the middle of the surface of the pressing sheet close to the stud member; the front end of the screw of the stud member extends into the pressing groove 223. Among them, the depth H5 of the pressing groove 223 satisfies: 1.5mm≤H5≤3.0mm. Such a depth can enable the front end of the stud member to be stably and reliably inserted into the pressing groove, and leave enough space for the subsequent temperature regulating element groove and temperature measuring element groove.

[0061] Those skilled in the art should understand that the shapes of the above connecting portion and the pressing portion are only for illustration, and the present invention is not limited thereto. In other embodiments of the present invention, the two may also be in other shapes, for example, the connecting portion may also be circular, and the pressing portion may also be in a disc shape corresponding to the pressing groove, and these variations may also implement the present invention and are also within the protection scope of the present invention.

[0062] Please continue to refer to the attached drawings. A temperature regulating element groove 224 and a temperature measuring element groove 225 are provided at the bottom of the pressing groove 223. The temperature regulating element and the temperature measuring element are respectively arranged in the temperature regulating element groove 224 and the temperature measuring element groove 225. In the present invention, the temperature regulating element and the temperature measuring element are added to the chip testing jig, so that the signal response of the chip to be tested at different temperatures can be tested, thereby expanding the scope of chip testing.

[0063] Please refer to the attached drawings. The sides of the two element slots are provided with lead slots for the pressing piece; the cover body is provided with lead holes 212 for the cover. The cables of the temperature regulating element and / or the temperature measuring element are led out from the lead slots for the pressing piece and the lead slots for the cover to the sides of the cover body. The cables of the temperature regulating element and the temperature measuring element are led out from the cover body instead of the pressing piece, which can avoid the influence of the up and down movement of the pressing piece body on the related functions and also avoid the damage of the cables.

[0064] In this embodiment, the temperature regulating element can be a heating element or a cooling element. If it is a heating element, it can be a metal wire heating plate or a ceramic heating plate. If it is a cooling element, it can be a Peltier element. The temperature measuring element can be a thermal resistor temperature sensor or a thermocouple temperature sensor.

[0065] When Peltier elements are used, the peripheral power amplifier, data acquisition system, PID servo system, and heat sink control are used to achieve fine temperature adjustment and control of the chip.

[0066] In this embodiment, the temperature measuring element is arranged in the pressing sheet. In other embodiments of the present invention, multiple temperature measuring elements can be added to the base, for example, a temperature measuring element is installed close to each of the four corners of the chip to be tested, which can be used to study the temperature gradient related issues of the chip to be tested. Furthermore, any corner of the bottom plate of the chip to be tested can be replaced with a temperature regulating element to study the influence of different heating directions on the chip to be tested. Furthermore, a temperature regulating element can be set next to any probe in the base to study the influence of the heating pin on the chip.

[0067] In addition, the depth of the temperature regulating element groove and the temperature measuring element groove is slightly greater than the height of the temperature regulating element and the temperature measuring element, specifically: ①0.1mm≤H6-H7≤0.5mm, H6 and H7 are the thickness of the temperature regulating element groove and the temperature regulating element respectively; ②0.1mm≤H8-H9≤0.5mm, H8 and H9 are the thickness of the temperature measuring element groove and the temperature measuring element respectively.

[0068] In order to improve the heat transfer efficiency, thermal conductive silicone grease is filled at the position where the temperature regulating element and the temperature measuring element contact the bottom of the corresponding groove. In addition, the temperature regulating element groove and the temperature measuring element groove are respectively encapsulated with the temperature regulating element and the temperature measuring element, and then filled with encapsulation glue, and the bottom surface of the pressing groove 223 is flat. Through the above measures, this embodiment can produce the following beneficial effects: first, it can ensure that the temperature regulating element and the temperature measuring element will not be damaged when the stud is pressed down; second, the space can be reasonably utilized to prevent the temperature regulating element and the temperature measuring element from interfering with the test probe, airway, etc.

[0069] Furthermore, N threaded holes are arranged on the periphery of the connection part, N≥2. N countersunk holes 213 corresponding to the threaded holes are arranged on the cover body, and through-holes 214 are arranged in the countersunk holes 213. The cover part also includes: N floating bolts, for each floating bolt 231, its screw rod passes through the through-hole of the cover body and is screwed to the threaded hole 233 of the pressing sheet; a spring 232 is arranged between its screw head and the surface of the cover body. The spring 232 is arranged in the countersunk head of the countersunk hole to prevent interference from the external environment.

[0070] Furthermore, a connection groove is provided on the surface of the covering body facing the pressing sheet, and the shape of the connection groove matches the shape of the connection part 221. Wherein:

[0071] ① When the spring is in an unstressed state, a portion of the connecting portion 221 and / or the pressing portion 222 may be in the connecting portion groove.

[0072] ② When the stud is screwed into the through-screw hole, the front end of the screw pushes the pressing piece to extend downward, and the spring is in a compressed state. It pulls back the pressing piece through N floating bolts, and sticks the back of the pressing piece to the front end of the screw.

[0073] In this embodiment, the pressing height adjustment member 300 includes: a stud member 310, the outer side of which is provided with a thread matching the through screw hole, and the stud member is screwed into the through screw hole; and a handle 320 is turned and fixed to the rear end of the stud member.

[0074] In this embodiment, the front end of the screw of the stud member 310 is pressed against the pressing groove 223. As the screwing depth of the stud member changes, the front end of the screw pushes the pressing piece 220 to move up and down. At the same time, the spring 232 and the floating bolt 231 pull the pressing piece tightly against the front end of the screw, so as to effectively adjust the distance between the front end of the pressing piece and the bottom of the chip slot. Through the above settings, the chip test jig of this embodiment can adapt to chips of different thicknesses to be tested, expand the use scenarios, and reduce user costs.

[0075] Furthermore, a pressure sensor is provided between the front end of the screw of the screw member and the pressing piece, and the cable of the pressure sensor is led out from the side of the pressing piece and connected to a corresponding testing instrument. In this embodiment, the pressure sensor is a piezoelectric ceramic plate type pressure sensor.

[0076] In actual scenarios, it is necessary to pay attention to the following: ① Screw the stud forward step by step and observe the value output by the pressure sensor to prevent the chip under test from being crushed due to excessive pressure caused by screwing in too quickly. ② Test after the pressure sensor output reaches the preset pressure value to prevent incorrect test results due to virtual connection.

[0077] Those skilled in the art should understand that, due to the pressure sensor, the chip testing jig of this embodiment can also test the signal response of the chip to be tested under different pressure environments.

[0078] In addition, a stop column 241 is provided on the upper surface of the covering body; wherein, when the pressing piece has not reached the pressing limit position, the handle is turned to rotate freely, and the pressing piece moves up and down with the front end of the screw; when the pressing piece reaches the downward pressing limit, the stop column prevents the handle from being further tightened to prevent the chip to be tested from being crushed.

[0079] It should be additionally explained that, in the present embodiment, the stud member 310 and the pressing sheet 220 are made of metal materials, and the base 100 and the covering body 210 are made of synthetic resin materials.

[0080] Those skilled in the art should understand that the material of the laminate directly determines the heating efficiency, so the use of good thermal conductors such as copper can further improve the range and accuracy of the controllable temperature. The base material directly determines the heat dissipation efficiency, and easy-to-process materials should be selected for micro-airway manufacturing. For example, for high-temperature storage experiments, materials such as polytetrafluoroethylene, polypropylene, or even ceramics can be used. For rapid temperature adjustment experiments, materials such as aluminum, copper, silver, platinum, or brass can be used.

[0081] Those skilled in the art should understand that the above are only preferred embodiments of the present invention, and the present invention is not limited thereto. In other embodiments of the present invention, various improvements can be made to the chip test jig according to actual scene requirements, for example:

[0082] ① Without setting the pressing groove, the front end of the screw of the stud is bonded and fixed to the connecting part;

[0083] ② No countersunk hole is provided, and the spring is directly exposed on the surface of the cover body;

[0084] ③ The cables of the temperature regulating element and the temperature measuring element are directly led out from the side of the pressing piece, and no longer from the cover body;

[0085] ④ The temperature measuring element is set on the base, and its temperature measuring probe presses against the chip to be measured from bottom to top, instead of setting the temperature measuring element in the pressing piece.

[0086] ⑤ In addition to the specific types of the above-mentioned temperature regulating elements, temperature measuring elements, and pressure sensors, those skilled in the art may also select other types of products that can achieve corresponding functions as needed;

[0087] ⑥ This embodiment is designed for piezoelectric MEMS electronic cigarette chips, and can test the chip response in different air pressure environments, different temperature environments, and different pressure environments. However, for other types of chips, if the corresponding test environment is not required, the corresponding components or designs can be omitted. For example, if the air pressure environment is not required, the airway design can be cancelled; if the temperature environment is not required, the temperature control components, temperature measuring components and other related designs can be cancelled.

[0088] ⑦ Instead of using a one-side pivot connection and a buckle fixation method on the other side, the base and the cover body use a double-sided buckle method to achieve closing.

[0089] ⑧ In order to realize the test of the pressure-equalizing electronic cigarette chip, a vent hole can be set at the corresponding position of the cover.

[0090] Although the effect is slightly inferior to that of the present embodiment, the above various variations can also implement the present invention and are also within the protection scope of the present invention.

[0091] Based on the above chip testing jig, the present invention also provides a chip testing method using the same. The chip testing method of this embodiment includes:

[0092] Step A, retracting the stud to a safe position;

[0093] Step B, opening the cover from the base, and placing the chip to be tested into the chip slot;

[0094] Step C, gradually screwing the stud forward until the pressing piece presses the chip to be tested tightly;

[0095] Step D, start testing the chip to be tested.

[0096] The following is a detailed description of each step of the chip testing method of this embodiment.

[0097] In step A, the stud member is returned to the uppermost position, thereby leaving enough space for the chip to be tested.

[0098] When a pressure sensor is provided between the front end of the screw of the stud member and the pressing plate in the chip testing jig, in step B, the value of the pressure sensor is observed while the stud member is screwed in. When the pressure sensor outputs a preset pressure value, it means that the pressing plate has pressed the chip to be tested, and the stud member cannot be screwed in further to avoid crushing the chip to be tested.

[0099] When the chip testing jig includes: a temperature adjustment element and a temperature measuring element, in step D, the temperature of the chip to be tested is adjusted to a preset temperature by the temperature adjustment element, and the characteristics of the chip to be tested at the preset temperature are tested.

[0100] At this point, the various embodiments of the present invention have been introduced. According to the above description, those skilled in the art should have a clear understanding of the present invention.

[0101] It should be noted that, unless explicitly indicated to the contrary, the numerical parameters in the specification and claims of the present invention may be approximate values ​​and may be changed according to the content of the present invention. Specifically, all the numbers indicating the content of the composition, reaction conditions, etc. recorded in the specification and claims should be understood to be modified by the term "about" in all cases, and the meaning of the expression is to include a change of ±10% from a specific number in some embodiments.

[0102] The ordinal numbers used in the specification and claims, such as "first", "second", "third", "primary", "secondary", as well as Arabic numerals, letters, etc., to modify the corresponding elements (or steps), are intended only to make a component (or step) with a certain name clearly distinguishable from another component (or step) with the same name, and do not mean that the element (or step) has any ordinal number, nor do they represent the order of one element (or step) and another element (or step). At the same time, unless the steps are specifically described or must occur in sequence, the order of the above steps is not limited to the above list, and can be changed or rearranged according to the required design.

[0103] It should also be noted that the directional terms mentioned in the embodiments, such as "center", "lateral", "longitudinal", "top", "bottom", "up", "down", "front", "back", "left", "right", "inside", "outside", etc., indicate positions or positional relationships based only on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. Moreover, throughout the drawings, the same elements are represented by the same or similar reference numerals. Moreover, the shapes and sizes of the components in the drawings do not reflect the actual size and proportion, but only illustrate the contents of the embodiments of the present invention.

[0104] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0105] Those skilled in the art should understand that in the claims and description of the present invention, the word "comprising" does not exclude the existence of elements (or steps) not listed in the claims. The word "a" or "an" preceding an element (or step) does not exclude the existence of multiple such elements (or steps).

[0106] For certain implementations, if they are not the key content of the present invention and are well known to ordinary technicians in the relevant technical field, they are not described in detail in the drawings or text of the specification due to space limitations. In this case, reference can be made to relevant existing technologies for understanding.

[0107] Furthermore, the above embodiments are provided merely to enable the present invention to satisfy legal requirements, and the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

[0108] Similarly, it should be understood that in order to simplify the present invention, in the above description of the exemplary embodiments of the present invention, the various features of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. However, the method of the invention should not be interpreted as reflecting the following intention: the claimed invention requires more features than the features explicitly stated in each claim. More specifically, as reflected in the claims, each inventive aspect lies in less than all the features of the previous single embodiment. Moreover, the embodiments can be mixed and matched with each other or with other embodiments based on design and reliability considerations, that is, the technical features in different embodiments can be freely combined to form more embodiments. Therefore, the claims following the specific embodiment are hereby explicitly incorporated into the specific embodiment, wherein each claim itself serves as a separate embodiment of the present invention.

[0109] The above specific embodiments provide a detailed description of the objectives, technical means and beneficial effects of the present invention. It should be understood that the purpose of the detailed description is to enable those skilled in the art to understand the present invention more clearly, and it is not used to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip testing jig, characterized in that: include: The base has a pressing groove in the middle of its upper surface, and a chip groove in the middle of the pressing groove; The cover member comprises: a cover body, the middle of which is provided with a through screw hole; and a pressing sheet, which is provided below the cover body; The press-fit height adjustment member comprises: a stud member, the outer side of which is provided with a thread matching the through screw hole, and the stud member is screwed into the through screw hole; Among them, in the covering state, the covering body is pressed on the upper surface of the base, and the pressing piece at least partially extends into the pressing groove and is pressed above the chip groove; the front end of the screw of the stud member is pressed against the back side of the pressing piece, and as the screw-in depth of the stud member changes, the front end of the screw pushes the pressing piece to move up and down.

2. The chip testing jig according to claim 1, characterized in that: The periphery of the pressing sheet is provided with N threaded holes, N ≥ 2; The cover body is provided with N through light holes corresponding to the threaded holes; It also includes: N floating bolts, for each floating bolt, its screw rod passes through the through light hole of the covering body and is screwed to the threaded hole of the pressing sheet; a spring is arranged between the screw head and the surface of the covering body.

3. The chip testing jig according to claim 2, characterized in that: The pressing sheet comprises: a connecting portion and a pressing portion, wherein: The cross-sectional shape of the connecting portion is larger than the cross-sectional shape of the stud member; The cross-sectional shape of the pressing portion corresponds to the cross-sectional shape of the pressing groove. When the covering member is in the covering state, the pressing portion extends into the pressing groove and is pressed above the chip groove. A connection groove is provided on the surface of the covering body facing the pressing sheet, and the shape of the connection groove matches the shape of the connection part; Among them, when the spring is in an unstressed state, the connecting part and / or the pressing part is in the connecting part groove; when the stud member is screwed into the through screw hole, the front end of the screw pushes the pressing piece to extend downward, and the spring is in a compressed state, and it pulls back the pressing piece through N floating bolts, and sticks the back of the pressing piece to the front end of the screw.

4. The chip testing jig according to claim 3, characterized in that: A pressure sensor is provided between the front end of the screw of the screw member and the pressing sheet; And / or, a pressing groove corresponding to the cross-sectional shape of the stud is formed in the middle of the surface of the pressing sheet close to the stud; the front end of the screw of the stud extends into the pressing groove; And / or, a countersunk hole is provided on the cover assembly, and the through light hole is provided below the countersunk hole; the floating bolt passes through the countersunk hole, passes through the light hole and is screwed to the threaded hole on the pressing plate, and the spring is located in the countersunk hole.

5. The chip testing jig according to claim 4, characterized in that: satisfy: 0.1mm≤H1-H2≤1mm, where H1 is the thickness of the chip to be tested and H2 is the depth of the chip slot and / or, 0.5 mm ≤ H3-H4 ≤ 1.5 mm, wherein H3 is the thickness of the pressing portion, and H4 is the thickness of the pressing groove; And / or, 1.5 mm ≤ H5 ≤ 3.0 mm, wherein H5 is the depth of the pressing groove.

6. The chip testing jig according to claim 4, characterized in that: Also includes: A temperature regulating element, which is arranged in the pressing sheet or in the base; And / or, a temperature measuring element, which is arranged in the pressing sheet or in the base.

7. The chip testing jig according to claim 6, characterized in that: A temperature regulating element groove is provided at the bottom of the pressing groove; the temperature regulating element is arranged in the temperature regulating element groove; And / or, a temperature measuring element groove is provided at the bottom of the pressing groove; and the temperature measuring element is arranged in the temperature measuring element groove.

8. The chip testing jig according to claim 7, characterized in that: The bottom surface of the pressing groove is flat; And / or, the temperature regulating element is filled with thermal conductive silicone grease in the temperature regulating element groove, and the temperature measuring element is encapsulated in the temperature measuring element groove and then filled up; And / or, the temperature measuring element is filled with thermal conductive silicone grease in the temperature measuring element groove, and the temperature regulating element is encapsulated in the temperature regulating element groove and then filled up; and / or, 0.1 mm ≤ H6-H7 ≤ 0.5 mm, H6 and H7 are the thickness of the temperature regulating element groove and the temperature regulating element, respectively; and / or, 0.1 mm ≤ H8-H9 ≤ 0.5 mm, where H8 and H9 are the thickness of the temperature measuring element groove and the temperature measuring element, respectively; And / or, the pressing piece portion on the side of the temperature regulating element slot and / or the temperature measuring element slot is provided with a pressing piece lead groove; the covering body is provided with a covering piece lead hole; the cables of the temperature regulating element and / or the temperature measuring element are led out from the pressing piece lead groove and the covering piece lead groove to the side of the covering piece body; And / or, the temperature regulating element is: a heating element or a cooling element; the heating element is one of the following: a metal wire heating plate, a ceramic heating plate; the cooling element is a Peltier element; And / or, the temperature measuring element is one of the following: a thermal resistance temperature sensor, a thermocouple temperature sensor.

9. The chip testing jig according to claim 1, characterized in that: Also includes: A circuit board is fixed to the lower surface of the base; A chip slot airway is provided inside the base below the preset position at the bottom of the chip slot; The chip slot air channel extends downward to the circuit board; or first extends downward and then laterally to the side of the base.

10. The chip testing jig according to claim 9, characterized in that: The chip slot airway is in the shape of an inverted trumpet; And / or, a gasket groove is arranged on the outer side of the top of the chip slot air channel; an elastic gasket is arranged in the gasket groove, between the air pressure sensing hole of the chip to be tested and the chip slot air channel.

11. The chip testing jig according to claim 9, characterized in that: The chip slot airway extends downward to the circuit board; A circuit board air hole is provided at a corresponding position of the circuit board below the chip slot air channel; The chip testing jig further comprises: an air path connector, fixed below the circuit board, and having a connector airway disposed inside the air path corresponding to the air hole of the circuit board; The chip slot airway, the circuit board air hole, and the connector airway together constitute a test airway, and the test airway is in an inverted trumpet shape as a whole.

12. The chip testing jig according to claim 9, characterized in that: M probe holes are arranged at a preset position at the bottom of the chip slot, M≥1; wherein the M probes are arranged inside the base, the front ends of which extend upward through the corresponding probe holes, and the rear ends of which are connected to the pads on the circuit board; The base comprises: an outer portion, an inlay groove is formed inside the outer portion; an inner portion, which is detachably inlaid in the inlay groove; wherein the probe and the chip slot airway are arranged in the inner portion.

13. The chip testing jig according to claim 1, characterized in that: In the open state, the cover body is separated from the upper surface of the base, and the pressing piece is detached from the pressing groove; And / or, the pressing height adjustment member further comprises: a handle is twisted and fixed to the top end of the stud member; And / or, a stop column is provided on the upper surface of the cover body; wherein, when the pressing piece has not reached the downward pressure limit position, the stud piece rotates freely, and the pressing piece moves up and down with the front end of the screw rod; when the pressing piece reaches the downward pressure limit, the stop column prevents the stud piece from being further tightened; And / or, the first end of the cover body is pivotally connected to the base via a pivot; the second end of the cover body is provided with a hook-shaped buckle extending downward; the side of the base is provided with a buckle groove corresponding to the hook-shaped buckle; wherein, in the closed state, the hook-shaped buckle is buckled into the buckle groove to lock the cover and the base; in the open state, the hook-shaped buckle is disengaged from the buckle groove, and the cover body rotates around the pivot and is unscrewed from the top of the base; And / or, the stud member and the pressing sheet are made of metal material, and the base and the covering body are made of synthetic resin material.

14. A chip testing method, characterized in that: A chip testing jig according to any one of claims 1 to 13, comprising: Step A, retracting the stud member to a preset safe position; Step B, opening the cover from the base, and placing the chip to be tested into the chip slot; Step C, gradually screwing the stud forward until the pressing piece presses the chip to be tested tightly; Step D, start testing the chip to be tested.

15. The chip testing method according to claim 14, characterized in that: The chip testing jig is the chip testing jig according to claim 4, and in the step C, the stud member is screwed forward step by step until the pressure sensor outputs a preset pressure value; And / or, the chip testing jig is the chip testing jig according to claim 6, and in the step D, the temperature of the chip to be tested is adjusted to a preset temperature by the temperature adjustment element, and the characteristics of the chip to be tested at the preset temperature are tested.

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