Push rod type chip testing device

Abstract

A push rod type chip testing device disclosed by the present invention comprises a main body and a box cover, one end of the top of the main body is connected with the box cover through a rotating shaft, the top of the main body is provided with a testing groove, the box cover is provided with a pressure assembly, the pressure assembly penetrates through the box cover in the vertical direction, and the pressure assembly is arranged in the testing groove. The two ends of the pressure assembly are slidably connected with the box cover, and a push rod assembly is arranged on the box cover and used for enabling the pressure assembly to slide up and down in the box cover. According to the push rod type chip testing device provided by the invention, the pressure assembly and the box cover are separately arranged, and after the box cover is buckled on the main body, the push rod assembly drives the pressure assembly to move in the vertical direction, so that a chip is rapidly pressed, and meanwhile, the pressing force of the pressure assembly on the chip is uniform; and the phenomenon of chip offset caused by overlarge pressing force on one side is avoided.

Description

Technical Field

[0001] The invention belongs to the technical field of chip testing, and in particular relates to a push rod type chip testing device. Background Art

[0002] In chip testing, especially RF chip testing, the contact between the RF pad and the test system needs to be lossless and reliable to ensure the stability and consistency of signal transmission.

[0003] In the prior art, for example, CN214703722U discloses a test device for radio frequency chips with a protective structure, which is connected to the tester by rotating one end of a rotating plate, and the chip is pressed by the rotating plate. This pressing method will first contact the test chip at the end close to the shaft, which is likely to cause the chip to warp or deviate on one side, making the entire test state uncontrollable and unable to meet the requirements of test stability and consistency. Summary of the invention

[0004] The purpose of the present invention is to provide a push rod type chip testing device to solve the problem in the prior art that when the chip is pressed, one side of the chip will be warped and offset.

[0005] To this end, the present invention provides a push rod type chip testing device, including a main body and a box cover, wherein one end of the top of the main body is connected to the box cover via a rotating shaft, a test slot is arranged on the top of the main body, a pressure assembly is arranged on the box cover, the pressure assembly penetrates the box cover in a vertical direction, both ends of the pressure assembly are slidably connected to the box cover, a push rod assembly is arranged on the box cover, and the push rod assembly is used to make the pressure assembly slide up and down in the box cover.

[0006] Preferably, vertical first slide grooves are provided on both sides of the box cover, and first sliders are provided on both sides of the pressure assembly, and the first sliders are slidably connected in the first slide grooves.

[0007] Preferably, a stopper is provided in the box cover, and the pressure assembly is connected to the stopper via a spring.

[0008] Preferably, second sliding grooves in the horizontal direction are provided on both sides of the box cover.

[0009] Preferably, the push rod assembly includes a second slider, a push rod and a third slider, the push rod is rotatably connected to the box cover, the second slider is in the second slide groove, the second slider is slidably connected to the second slide groove, the push rod is provided with a third slide groove, the second slider is fixedly connected to the third slider, the third slider is in the third slide groove, and the third slider is slidably connected to the third slide groove.

[0010] Preferably, a groove is provided at the bottom of the second sliding block.

[0011] Preferably, a radio frequency component is provided in the test slot.

[0012] Preferably, a radio frequency interface is provided on the outer side wall of the main body.

[0013] Preferably, the radio frequency interface and the radio frequency component are connected via a cable in the inner cavity of the main body. Preferably, the inner cavity of the main body is filled with absorbing material.

[0014] Beneficial effects: 1. The present invention provides a push rod type chip testing device in which the pressure assembly and the box cover are separately arranged. When the box cover is buckled on the main body, the push rod assembly drives the pressure assembly to move in the vertical direction, which will achieve rapid pressing of the chip and ensure that the pressing force of the pressure assembly on the chip is uniform, and there will be no phenomenon of chip deviation caused by excessive pressing force on one side.

[0015] 2. In the present invention, the inner cavity of the main body is filled with absorbing materials to reduce signal crosstalk inside the main body and improve the accuracy of chip testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 The figure is a schematic structural diagram of a push rod type chip testing device in the present invention.

[0018] Figure 2 The figure is a schematic diagram of the internal structure of a push rod type chip testing device in the present invention.

[0019] Figure 3 The exploded view of the box cover of a push rod type chip testing device in the present invention.

[0020] Figure 4 The present invention is a front view of a box cover of a push rod type chip testing device in a compressed state.

[0021] Figure 5 The figure is a schematic diagram of the internal structure of a box cover in a compressed state of a push rod type chip testing device in the present invention.

[0022] Figure 6 The present invention is a front view of a box cover of a push rod type chip testing device in a relaxed state.

[0023] Figure 7 The figure is a schematic diagram of the internal structure of a box cover of a push rod type chip testing device in a relaxed state in the present invention.

[0024] In the figure, 1-main body, 11-RF interface, 12-absorbing material, 2-box cover, 21-first slide groove, 22-stopper, 23-spring, 24-second slide groove, 3-test groove, 4-pressure assembly, 41-first slider, 5-push rod assembly, 51-second slider, 52-push rod, 53-third slider, 54-third slide groove, 55-groove, 6-RF assembly. DETAILED DESCRIPTION

[0025] The content of the present invention can be more easily understood by selecting the following detailed description of the preferred implementation method of the present invention and the embodiments included. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those of ordinary skill in the art to which the present invention belongs. When there is a conflict, the definition in this specification shall prevail.

[0026] Embodiment 1: like Figure 1 As shown, a push rod type chip testing device is provided in this embodiment, including a main body 1 and a box cover 2, wherein one end of the top of the main body 1 is connected to the box cover 2 via a rotating shaft, a test slot 3 is arranged on the top of the main body 1, a pressure assembly 4 is arranged on the box cover 2, the pressure assembly 4 vertically penetrates the box cover 2, both ends of the pressure assembly 4 are slidably connected to the box cover 2, a push rod assembly 5 is arranged on the box cover 2, and the push rod assembly 5 is used to make the pressure assembly 4 slide up and down in the box cover 2.

[0027] like Figure 2-3 As shown, vertical first slide grooves 21 are provided on both sides of the box cover 2, and first sliders 41 are provided on both sides of the pressure assembly 4. The first sliders 41 are slidably connected in the first slide grooves 21. Stoppers 22 are provided in the box cover 2, and the pressure assembly 4 is connected to the stoppers 22 through springs 23. The first sliders 41 on both sides of the pressure assembly 4 slide in the first slide grooves 21, so that the pressure assembly 4 can only move in the vertical direction. The spring 23 makes the pressure assembly 4 be lifted up when there is no external force. When the box cover 2 is buckled, due to the existence of the spring 23, the pressure assembly 4 does not directly contact the chip, but there is a gap. When subjected to external force, the pressure assembly 4 presses the chip as a whole, and there will be no situation where the chip is offset due to the large pressing force on one side. like Figure 4-7As shown, the second slide grooves 24 in the horizontal direction are arranged on both sides of the box cover 2. The push rod assembly 5 includes a second slider 51, a push rod 52 and a third slider 53. The push rod 52 is rotatably connected with the box cover 2. The second slider 51 is in the second slide groove 24. The second slider 51 is slidably connected with the second slide groove 24. The push rod 52 is provided with a third slide groove 54. The second slider 51 is fixedly connected with the third slider 53. The third slider 53 is in the third slide groove 54. The third slider 53 is slidably connected with the third slide groove 54. A groove 55 is arranged at the bottom of the second slider 51. When the push rod 52 is pushed to rotate, the third slider 53 slides in the third slide groove 54 and drives the second slider 51 to slide in the second slide groove 24. Since the first slider 41 is lifted up together with the pressure assembly 4 due to the action of the spring 23, the first slider 41 is close to the bottom surface of the second slider 51. When the first slider 41 is in the groove 55, the pressure assembly 4 rises, and when the first slider 41 is outside the groove 55, the pressure assembly 4 falls. In this embodiment, in order to better enable the first slider 41 to slide in the groove 55, one side of the groove 55 is an inclined surface as a transition. The push rod 52 is connected to the box cover 2 by a damping shaft, and the rotation resistance of the shaft is greater than the elastic force of the spring 23, so that the push rod 52 can keep the compression spring 23 to press the pressure assembly 4.

[0028] The test slot 3 is provided with a radio frequency component 6. The outer wall of the main body 1 is provided with a radio frequency interface 11. The radio frequency interface 11 is connected to the single-port radio frequency component 6 through a cable in the inner cavity of the main body 1. The inner cavity of the main body 1 is filled with an absorbing material 12. The inner cavity of the main body 1 is filled with an absorbing material 12 to reduce signal crosstalk inside the main body 1 and improve the accuracy of chip testing.

[0029] The pressure assembly 4 in this embodiment can be an integrated structure, which compresses the chip by rigid force, or a split structure, which is connected by a spring 23 in the middle, and compresses the chip by flexible force. The pressure assembly 4 is used to compress the chip, and it only needs to realize the compression of the chip by controlling the upward and downward movement of the assembly 5 with the push rod 52, and its specific form is not specifically limited by the present invention.

[0030] Working principle: place the chip in the test slot 3, and snap the box cover 2 onto the main body 1. At this time, the first slider 41 is in the groove 55. The pressure assembly 4 is lifted up due to the elastic force of the spring 23, and there is a gap between the pressure assembly 4 and the chip. Then push the push rod 52, which drives the second slider 51 to move horizontally, so that the first slider 41 is outside the groove 55. The first slider 41 is driven by the pressure of the second slider 51 to drive the pressure assembly 4 to move downward, thereby pressing the two ends of the chip synchronously, ensuring that the force on the chip is uniform and preventing the chip from deflecting.

[0031] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A push rod chip testing device, characterized in that: It includes a main body and a box cover, wherein one end of the top of the main body is connected to the box cover via a rotating shaft, a test slot is provided on the top of the main body, a pressure assembly is provided on the box cover, the pressure assembly passes through the box cover in a vertical direction, both ends of the pressure assembly are slidably connected to the box cover, a push rod assembly is provided on the box cover, and the push rod assembly is used to make the pressure assembly slide up and down in the box cover.

2. A push rod chip testing device according to claim 1, characterized in that: Vertical first slide grooves are arranged on both sides of the box cover, and first sliders are arranged on both sides of the pressure assembly. The first sliders are slidably connected in the first slide grooves.

3. A push rod chip testing device according to claim 2, characterized in that: A stopper is arranged inside the box cover, and the pressure assembly is connected to the stopper through a spring.

4. A push rod chip testing device according to claim 3, characterized in that: Second sliding grooves in the horizontal direction are arranged on both sides of the box cover.

5. A push rod chip testing device according to claim 4, characterized in that: The push rod assembly includes a second slider, a push rod and a third slider, the push rod is rotatably connected to the box cover, the second slider is in the second slide groove, the second slider is slidably connected to the second slide groove, the push rod is provided with a third slide groove, the second slider is fixedly connected to the third slider, the third slider is in the third slide groove, and the third slider is slidably connected to the third slide groove.

6. The push rod chip testing device according to claim 5, characterized in that: A groove is arranged at the bottom of the second sliding block.

7. The push rod chip testing device according to claim 1, characterized in that: A radio frequency component is arranged in the test slot.

8. The push rod chip testing device according to claim 7, characterized in that: The outer side wall of the main body is provided with a radio frequency interface.

9. The push rod chip testing device according to claim 8, characterized in that: The radio frequency interface is connected to the radio frequency component via a cable in the inner cavity of the main body.

10. The push rod chip testing device according to claim 9, characterized in that: The inner cavity of the main body is filled with wave absorbing material.

Images