Optical device test circuit and test method

Abstract

The invention relates to the technical field of optical device testing, and discloses an optical device testing circuit and method, and the circuit comprises an MCU control unit, impedance testing equipment, and a housing conduction testing unit. The shell conduction test unit comprises a relay, the MCU control unit is connected with the relay, and when the MCU control unit controls the relay to be disconnected, the relay is not communicated with the electrode, and the relay and the MCU control unit form a loop; when the MCU control unit controls the relay to be closed, the relay is communicated with the electrode; the impedance test equipment is connected with the MCU control unit, the impedance test equipment is connected with all pins of the optical device, and the impedance test equipment is also connected with an electrode through an outgoing line; the optical device is detachably placed on the test structure, and when the optical device is placed on the test structure, the optical device is conducted with the test structure. When the insulation condition of the pin and the shell of the optical device is tested, the test result can be ensured to be effective.

Description

Technical Field

[0001] The present invention relates to the technical field of optical device testing, and in particular to an optical device testing circuit and a testing method. Background Art

[0002] After the production of optical devices, the electrical performance between each pin needs to be tested before and after each process operation, especially the resistance value between each pin and the housing of the optical device needs to be strictly controlled to ensure that the product does not affect other performance during high and low temperature aging tests. The market demand is to ensure insulation between the pins of the optical device and its housing, that is, the resistance between the pins and the housing is high, generally reaching the mega level. However, during the test, if the test end connected to the housing has poor contact or is directly disconnected, the impedance test result of any pin and housing is infinite, but such a test is meaningless and cannot rule out the problem that the pins and housing of the optical device are not insulated, and then flow into the market. When used, the housing of the optical device will leak electricity, which will affect the optical device chip and even the optical device equipment. Therefore, there will be great risks in the traditional testing process. At present, many test schemes do not control the parameter values ​​of the housing, resulting in many products flowing to the client, and then slowly appearing various problems as the use time increases. Therefore, this potential risk problem needs to be detected and eliminated before production. Summary of the invention

[0003] The purpose of the present invention is to ensure that the test result is effective when testing the insulation condition between the pin of an optical device and its housing, and to provide an optical device test circuit and a test method.

[0004] In order to achieve the above-mentioned object of the invention, the embodiment of the present invention provides the following technical solutions:

[0005] An optical device test circuit is connected to an optical device test structure through electrodes; the test circuit comprises: an MCU control unit, an impedance test device, and a housing conduction test unit;

[0006] The housing conduction test unit includes a relay, and the MCU control unit is connected to the relay. When the MCU control unit controls the relay to be disconnected, the relay is not connected to the electrode, and the relay and the MCU control unit form a loop; when the MCU control unit controls the relay to be closed, the relay is connected to the electrode;

[0007] The impedance test device is connected to the MCU control unit, the impedance test device is connected to all pins of the optical device, and the impedance test device is also connected to the electrode through a lead wire;

[0008] The optical device is detachably placed on the test structure, and when placed on the test structure, the optical device is connected to the test structure.

[0009] A method for testing an optical device comprises the following steps:

[0010] Step S1, the electrode SW1, the housing of the optical device and the electrode SW2 are in contact through the optical device test structure; the MCU control unit outputs a high level to the relay and outputs a voltage V1 through the DAC port. If the voltage V2 detected by the ADC port is equal to the pre-stored voltage value V2`, step S2 is executed, otherwise, abnormal processing is performed;

[0011] Step S2: The MCU control unit outputs a low level to the relay and notifies the impedance test equipment to perform a functional test on the optical device. When all functional tests are completed, step S3 is executed;

[0012] Step S3: The MCU control unit outputs a high level 1 to the relay and outputs a voltage V1 through the DAC port. If the voltage V2 detected through the ADC port is equal to the pre-stored voltage value V2`, it means that the functional test result of step S2 is valid; otherwise, an exception is handled and returns to step S1.

[0013] Compared with the prior art, the present invention has the following beneficial effects: before testing whether the pins of the optical device and its housing meet the performance requirements (i.e., the pins and the housing are guaranteed to be insulated), the present invention first tests whether the housing of the optical device is normally connected to the test circuit, thereby avoiding the situation where the test results of the pins and the housing are normal when the housing of the optical device is not connected to the test circuit, thereby improving the accuracy of the test results. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0015] Figure 1 It is a schematic diagram of the test structure of the present invention;

[0016] Figure 2 Schematic diagram of the test circuit of the present invention.

[0017] Main component symbols

[0018] Base 1, test fixture 2, insulating guide rod 3, first conductive metal block 4, second conductive metal block 5, optical device 6, flexible circuit board 7. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. The components of the embodiments of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents the selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present invention.

[0020] It should be noted that similar numbers and letters represent similar items in the following figures, so once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. At the same time, in the description of the present invention, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance, or implying any such actual relationship or order between these entities or operations. In addition, the terms "connected", "connected", "connected", etc. can be directly connected between elements, or indirectly connected via other elements.

[0021] The present invention is achieved through the following technical solutions: Figure 1 As shown, an optical device test structure includes a base 1, a test fixture 2, an insulating guide rod 3, a first conductive metal block 4, and a second conductive metal block 5. The test fixture 2, the insulating guide rod 3, the first conductive metal block 4, and the second conductive metal block 5 are all placed on the base 1 made of insulating material. The test fixture 2 is operated to make the insulating guide rod 3 push the first conductive metal block 4 to move toward the second conductive metal block 5 fixedly arranged relative to the base 1, and the optical device 6 to be tested can be detachably placed on the second conductive metal block 5, and the first conductive metal block 4 is connected to the optical device test circuit through the electrode SW1, and the second conductive metal block 5 is connected to the optical device test circuit through the electrode SW2. When the optical device 6 is placed on the second conductive metal block 5, the first conductive metal block 4 is pushed to move toward the second conductive metal block 5 until it contacts. Since the outer shell of the optical device 6 is made of metal material, the first conductive metal block 4, the outer shell of the optical device 6, and the second conductive metal block 5 are conductive after contact, that is, the electrode SW1 and the electrode SW2 are conductive.

[0022] like Figure 2As shown, the optical device test circuit connected to the test structure includes an MCU control unit, an impedance test device, and a shell conduction test unit. The MCU control unit has a DAC port, an ADC port, a GPIO port, and an IIC communication interface; the shell conduction test unit includes a relay RLY1 and a transistor Q1. The ADC port of the MCU control unit is connected to the base of the transistor Q1, and the collector of the transistor Q1 is connected to the control end of the relay RLY1; the DAC port of the MCU control unit is connected to the contact 6 of the relay RLY1, the ADC port of the MCU control unit is connected to the contact 3 of the relay RLY1, the contact 7 of the relay RLY1 is connected to the contact 2, the contact 5 of the relay RLY1 is connected to the electrode SW1, and the electrode SW1 is connected to the first conductive metal block 4; the contact 4 of the relay RLY1 is connected to the electrode SW2, and the electrode SW2 is connected to the second conductive metal block 5. The optical device 6 also has a flexible circuit board 7 with several pins.

[0023] The impedance test device includes a lead wire com, and the impedance test device is connected to a flexible circuit board 7 having a plurality of pins. Assuming that the flexible circuit board 7 has 10 pins, namely, NO.1, NO.2, ..., NO.10, all of them are connected to the impedance test device; the lead wire com of the impedance test device is connected to the electrode SW2. In this solution, when the first conductive metal block 4, the housing of the optical device 6, and the second conductive metal block 5 are turned on, the flexible circuit board 7 can be connected to the electrodes SW1 and SW2 through the lead wire com, that is, the pin No.i, the impedance test device, the lead wire com, the electrode SW1, and the housing cover can be connected into a line.

[0024] Functional testing of optical devices includes determining the impedance between each pin of the optical device and between each pin and the housing. For ease of understanding, Ri-j is used to represent the impedance between the i-th pin NO.i and the j-th pin NO.j, i=1,2,...,10, j=1,2,...,10, i≠j; Ri-c is used to represent the impedance between the i-th pin NO.i and the housing cover of the optical device. If the pins and housing of the produced optical device are completely insulated, the test of the optical device has passed. Otherwise, it needs to be returned to the factory or scrapped and cannot be sold or circulated. Therefore, when Ri-c is infinite (usually above the mega level), it means that the test has passed.

[0025] However, if the electrode SW2 fails to be effectively connected to the shell cover, Ri-c is also infinite. Even if there is a problem that the pin NO.i is short-circuited with the shell cover (i.e., the pin NO.i is not insulated from the shell cover), Ri-c is always infinite because the electrode SW2 is not effectively connected to the shell cover. Then the final test result is still passed, which makes the test meaningless. Therefore, the focus of the present invention is to first test the connection status of the shell cover and the electrode SW2 through the lead wire com of the impedance test equipment. When the connection between the electrode SW2 and the shell cover is effective, the next step of testing Ri-j and Ri-c is performed.

[0026] For further information, see Figure 2 The optical device test circuit also includes a resistor R1, a resistor R2, a resistor R3, a resistor R4, a capacitor C1, and a diode D1. One end of the resistor R1 is connected to the DAC port of the MCU control unit, and the other end of the resistor R1 is connected to the contact 6 of the relay RLY1; one end of the resistor R2 is connected to the contact 5 of the relay RLY1, and the other end of the resistor R2 is connected to the electrode SW1; one end of the resistor R3 is respectively connected to the ADC port of the MCU control unit and the contact 3 of the relay RLY1, and the other end of the resistor R3 is grounded; one end of the resistor R4 is connected to the GPIO port of the MCU control unit, the other end of the resistor R4 is connected to the base of the transistor Q1, the emitter of the transistor Q1 is grounded, and the collector of the transistor Q1 is connected to the control end of the relay RLY1; the diode D1 is connected in parallel with the relay RLY1; one end of the capacitor C1 is respectively connected to the ADC port of the MCU control unit and the contact 3 of the relay RLY1, and the other end of the capacitor C1 is grounded.

[0027] When the MCU control unit outputs a low level of 0 through the GPIO port, the relay RLY1 does not act (i.e., disconnected), contact 6 is connected to contact 7, contact 3 is connected to contact 2, contacts 6, 7, 2, 3 and the MCU control unit form a loop, and the contact resistance of the contacts of the relay RLY1 can be ignored; when the MCU control unit outputs a voltage V1 through the DAC port, the voltage V2 detected by the ADC port is:

[0028] V2=V1*R3 / (R1+R3);

[0029] The MCU control unit determines whether the voltage received by its ADC port is equal to V2. For example, when the voltage V1=2V, the resistance R1=10KΩ, and the resistance R3=10KΩ, then V2 should be equal to 1V under normal circumstances; but if V2=0V, it means that the conduction between contact 6 and contact 7, contact 3 and contact 2 of relay RLY1 is abnormal; if V2>1V, it means that the line is short-circuited. In short, when the GPIO port outputs a low level of 0, after V1 outputs a certain voltage value, V2 must satisfy V2=V1*R3 / (R1+R3), otherwise it means that the test circuit detection is abnormal, either the contact conduction of relay RLY1 is abnormal, or the circuit is short-circuited. It is necessary to eliminate the abnormality, and the next step of testing can be carried out when V2=1V.

[0030] When the MCU control unit outputs a high level 1 through the GPIO port, the relay RLY1 is activated, the contact 6 is connected to the contact 5, the contact 3 is connected to the contact 4, and the contact 5 is connected to the electrode SW1 through the resistor R2, and the contact 4 is connected to the electrode SW2. If the electrode SW1 is not connected to the electrode SW2 at this time, that is, the first conductive metal block 4 is not in contact with the outer shell cover of the optical device 6, the MCU control unit outputs the voltage V1 through the DAC port at this time, and detects V2=0V through the ADC port. If the electrode SW1 is normally connected to the electrode SW2 at this time, that is, the first conductive metal block 4, the outer shell cover of the optical device 6 and the second conductive metal block 5 are turned on, the voltage V2 should be:

[0031] V2=V1*R3 / (R1+R2+R3+RSW);

[0032] Among them, RSW is the contact resistance of electrode SW1 and electrode SW2. After the MCU control unit outputs voltage V1=2V, if it is known that R1=10KΩ, R2=10KΩ, R3=10KΩ, and RSW=10Ω, then when V2 is equal to 0.67V, it means that electrode SW1 is normally connected to electrode SW2. Since resistors R1, R2, and R3 are all fixed values, when RSW changes, voltage V2 will also change accordingly, but as long as V2 is equal to 0V, it means that electrode SW1 is not connected to electrode SW2; when V2<0.67V, it means that the on-resistance of RSW is too large; when V2>0.67V, it means that the on-resistance of RSW is too small.

[0033] Under non-ideal conditions, the contact resistance RSW of electrode SW1 and electrode SW2 will change due to line length or long-term wear, so the DAC port is used to output an adjustable voltage V1 to adapt to changes in actual applications. At the same time, the resistance values ​​of resistors R1, R2, and R3 can also be adjusted to increase the loop test current and improve the test accuracy. Before each test, only one inspection is required to pre-store the voltage value V2 under normal connection into the MCU control unit. In each subsequent test, the real-time test voltage V2 can be compared with the pre-stored voltage value.

[0034] Based on the above optical device test structure and optical device test circuit, this solution proposes an optical device test method, including the following method:

[0035] Step S0: The MCU control unit outputs a low level to the relay and outputs a voltage V1 through the DAC port. If the voltage V2 detected by the ADC port is equal to the pre-stored voltage value V02, step S1 is executed, otherwise exception processing is performed.

[0036] Before testing the optical device, the optical device test circuit can be pre-tested. The MCU control unit outputs a low level 0 through the GPIO port, the transistor Q1 is turned off, and the relay RLY1 does not operate. The MCU control unit outputs voltage V1 through the DAC port, and then detects voltage V2 through the ADC port. If voltage V2 is equal to the pre-stored voltage value V02, it means that the pre-test of the optical device test circuit has passed, and step S1 is executed; otherwise, the operator is prompted to handle the abnormality. The pre-stored voltage value V02 is:

[0037] V02=V1*R3 / (R1+R3);

[0038] Wherein, R1 is the resistance value of the resistor R1, R3 is the resistance value of the resistor R3, and V1 is the voltage value output by the DAC port of the MCU control unit.

[0039] Step S1: The first conductive metal block, the housing of the optical device and the second conductive metal block are brought into contact through the optical device test structure; the MCU control unit outputs a high level to the relay and outputs a voltage V1 through the DAC port. If the voltage V2 detected through the ADC port is equal to the pre-stored voltage value V2`, step S2 is executed, otherwise exception processing is performed.

[0040] Before testing the impedance between the pins of the optical device and between the pins and the shell, it is necessary to first determine whether the shell cover of the optical device is normally connected to the test circuit. Place the optical device 6 on the second conductive metal block 5, activate the test fixture 2, and move the first conductive metal block 4 to the second conductive metal block 5 until it is in contact. The MCU controller outputs a high level 1 through the GPIO port, the transistor Q1 is turned on, the relay RLY1 is activated, the contact 6 is connected to the contact 5, and the contact 3 is connected to the contact 4. The MCU controller outputs the voltage V1 through the DAC port and detects the voltage V2 through the ADC port. If the voltage V2 is equal to the pre-stored voltage value V2', it means that the electrode SW1, the shell cover of the optical device and the electrode SW2 are normally connected, that is, the shell cover of the optical device is normally connected to the test circuit; otherwise, it is not connected, and the abnormality is eliminated. It may be that the contact between the first conductive metal block 4, the shell cover of the optical device, and the second conductive metal block 5 is not good, it may also be that the electrode SW1 and the first conductive metal block 4 are not clamped well, it may also be that the electrode SW2 and the second conductive metal block 5 are not clamped well, and there are many other reasons. In short, only when the voltage V2 detected by the ADC port is equal to the pre-stored voltage value V2' can the housing cover of the optical device be normally connected to the test circuit, and then step S2 is executed.

[0041] The pre-stored voltage value V2' is:

[0042] V2`=V1*R3 / (R1+R2+R3+RSW);

[0043] Wherein, RSW is the contact resistance between the electrode SW1 and the electrode SW2, R1 is the resistance value of the resistor R1, R2 is the resistance value of the resistor R2, R3 is the resistance value of the resistor R3, and V1 is the voltage value output by the DAC port of the MCU control unit.

[0044] Since electrodes SW1 and SW2 will wear out during long-term use, the contact resistance RSW will change. The acceptable range of change of RSW due to wear is set as [RSW min ,RSW max ], where RSW min Indicates the minimum contact resistance, RSW max Indicates the maximum contact resistance. Since R1, R2, R3, and V1 are fixed values, the contact resistance is within the range [RSW min ,RSW max ], the corresponding change range of the pre-stored voltage value V2` is [V2` min ,V2` max ], where V2` min Indicates the minimum value of the pre-stored voltage value V2`, V2` maxIndicates the maximum value of the pre-stored voltage value V2`, that is:

[0045] V2` min =V1*R3 / (R1+R2+R3+RSW min );

[0046] V2` max =V1*R3 / (R1+R2+R3+RSW max );

[0047] Therefore, in an ideal case, if the voltage V2 detected by the ADC port is equal to the pre-stored voltage value V2', step S2 is executed; in an undesirable case, if the voltage V2 detected by the ADC port is within the pre-stored voltage range [V2' min ,V2` max ], then execute step S2.

[0048] If V2≠V2`, or V2 is not in [V2` min ,V2` max ], it means that the electrode SW1, the housing cover of the optical device and the electrode SW2 are not connected normally, that is to say, the housing cover of the optical device is not normally connected to the test circuit, so abnormal processing is required.

[0049] Step S2: The MCU control unit outputs a low level to the relay and notifies the impedance testing equipment to perform a functional test on the optical device. When all functional tests are completed, step S3 is executed.

[0050] In step S1, when V2 is equal to the pre-stored voltage value V2` or in [V2` min ,V2` max ], it means that electrode SW1, the cover of the optical device 6 and electrode SW2 are connected and conductive. Then, the MCU control unit outputs a low level 0 through the GPIO port, the relay RLY1 is disconnected, contact 6 is connected to contact 7, contact 3 is connected to contact 2; electrode SW1 is disconnected from the DAC port, and electrode SW2 is disconnected from the ADC port. The lead-out line com of the impedance test equipment is only connected to electrode SW2, and electrode SW1 is floating.

[0051] The MCU control unit notifies the impedance test equipment through the IIC communication interface to start various functional tests, including Ri-c and Ri-j. Since the electrode SW2 is already connected to the outer shell cover of the optical device 6, and the lead wire com is also connected to the electrode SW2, the pin No.i, the lead wire com, the electrode SW2, and the outer shell cover are connected into a line. At this time, if the impedance test equipment measures that Ri-c is infinite, it means that the pin No.i inside the optical device 6 is insulated from the outer shell cover, that is, the test passes; if the measured Ri-c is not infinite, it means that there are impurities or connections between the pin No.i inside the optical device 6 and the outer shell cover, that is, the optical device product test fails. For example, if the measured Ri-c is equal to 0, it means that the pin No.i inside the optical device 6 is short-circuited with the outer shell cover.

[0052] However, because during the test, if the electrode SW2 is not connected to the shell cover, then Ri-c is also infinite, so after executing step S2, step S3 must be executed for further verification to prove that in step S2, Ri-c is infinite not because the electrode SW2 is not connected to the shell cover, but because the pin No.i is insulated from the shell cover.

[0053] In addition, the impedance between pin No.i and pin No.j measured by the impedance test equipment is also valid, but because the functions of each pin are different, the impedance results are not consistent.

[0054] When all functional tests are completed, the impedance test device disconnects all pins of the optical device 6 and notifies the MCU control unit through the IIC communication interface that the test has been completed.

[0055] Step S3: The MCU control unit outputs a high level 1 to the relay and outputs a voltage V1 through the DAC port. If the voltage V2 detected through the ADC port is equal to the pre-stored voltage value V2`, it means that the functional test result of step S2 is valid, and step S4 is executed; otherwise, exception processing is performed and returns to step S1.

[0056] In order to ensure that all functional test results in step S2 are valid, the MCU control unit outputs a high level 1 through the GPIO port, the relay RLY1 is activated again, contact 6 is connected to contact 5, the DAC port is connected to electrode SW1, contact 3 is connected to contact 4, and the ADC port is connected to electrode SW2. The MCU control unit outputs voltage V1 through the DAC port, and the ADC port determines if the voltage V2 is equal to the pre-stored voltage value V2`, or the voltage V2 is within [V2` min ,V2` max], it means that Ri-c in step S2 is infinite because pin No.i is insulated from the shell cover, that is, electrode SW1, shell cover and electrode SW2 are normally connected, and then step S4 is executed; otherwise, all functional test results of step S2 are invalid, because Ri-c in step S2 is infinite because electrode SW2 is not connected to the shell cover, and the impedance test result between pin No.i and the shell cover is meaningless at this time, so the operator should be prompted to handle the abnormality and then return to step S1 or step S0.

[0057] Step S4: Replace the next optical component and return to step S1.

[0058] When all functional test results are valid, the MCU control unit outputs a low level 0 through the GPIO port, the relay RLY1 is disconnected, the sliding test fixture 2 moves the first conductive metal block 4 away from the second conductive metal block 5, and the optical device 6 is removed from the second conductive metal block 5. The next optical device is replaced to continue testing, and the process returns to step S1 or step S0.

[0059] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. An optical device test circuit, characterized in that: The connection is achieved through electrodes and an optical device test structure; the test circuit includes: an MCU control unit, an impedance test device, and a housing conduction test unit; The housing conduction test unit includes a relay, and the MCU control unit is connected to the relay. When the MCU control unit controls the relay to be disconnected, the relay is not connected to the electrode, and the relay and the MCU control unit form a loop; when the MCU control unit controls the relay to be closed, the relay is connected to the electrode; The impedance test device is connected to the MCU control unit, the impedance test device is connected to all pins of the optical device, and the impedance test device is also connected to the electrode through a lead wire; The optical device is detachably placed on the test structure, and when placed on the test structure, the optical device is connected to the test structure.

2. The optical device test circuit according to claim 1, characterized in that: The DAC port of the MCU control unit is connected to the contact 6 of the relay, the ADC port of the MCU control unit is connected to the contact 3, the contact 7 of the relay is connected to the contact 2, the contact 5 of the relay is connected to the electrode SW1, and the contact 4 of the relay is connected to the electrode SW2; the GPIO port of the MCU control unit is connected to the control end of the relay; When the MCU control unit sends a low level to the control end of the relay through the GPIO port, the relay is disconnected, that is, contact 6 of the relay is connected to contact 7, and contact 3 is connected to contact 2; When the MCU control unit sends a high level to the control end of the relay through the GPIO port, the relay is closed, that is, contact 6 of the relay is connected to contact 5, and contact 3 is connected to contact 4.

3. The optical device test circuit according to claim 2, characterized in that: The test structure includes a test fixture, an insulating guide rod, a first conductive metal block, and a second conductive metal block; the optical device is detachably placed on the second conductive metal block, and when the test fixture is activated, the insulating guide rod pushes the first conductive metal block to move toward the second conductive metal block until the first conductive metal block contacts the optical device, and the first conductive metal block, the housing of the optical device, and the second conductive metal block are connected.

4. The optical device test circuit according to claim 3, characterized in that: The electrodes include an electrode SW1 and an electrode SW2; the second conductive metal block is connected to a contact 4 of the relay via the electrode SW1, and the first conductive metal block is connected to a contact 5 of the relay via the electrode SW2.

5. The optical device test circuit according to claim 4, characterized in that: The impedance testing device is connected to the electrode SW2 via a lead wire.

6. The optical device test circuit according to claim 4, characterized in that: The test circuit also includes resistors R1, R2, and R3; one end of the resistor R1 is connected to the DAC port of the MCU control unit, and the other end of the resistor R1 is connected to the contact 6 of the relay; one end of the resistor R2 is connected to the contact 5 of the relay, and the other end of the resistor R2 is connected to the electrode SW1; one end of the resistor R3 is respectively connected to the ADC port of the MCU control unit and the contact 3 of the relay, and the other end of the resistor R3 is grounded.

7. A method for testing an optical device, implemented based on the test circuit according to any one of claims 1 to 6, characterized in that: The following steps are involved: Step S1: The first conductive metal block, the housing of the optical device and the second conductive metal block are brought into contact through the optical device test structure; the MCU control unit outputs a high level to the relay and outputs a voltage V1 through the DAC port. If the voltage V2 detected through the ADC port is equal to the pre-stored voltage value V2`, step S2 is executed, otherwise, exception processing is performed; Step S2: The MCU control unit outputs a low level to the relay and notifies the impedance test equipment to perform a functional test on the optical device. When all functional tests are completed, step S3 is executed; Step S3: The MCU control unit outputs a high level 1 to the relay and outputs a voltage V1 through the DAC port. If the voltage V2 detected through the ADC port is equal to the pre-stored voltage value V2`, it means that the functional test result of step S2 is valid; Otherwise, perform exception handling and return to step S1.

8. The optical device testing method according to claim 7, characterized in that: The step S1 specifically includes the following steps: The optical device is placed on the second conductive metal block, and the test fixture is activated to move the first conductive metal block toward the second conductive metal block until they are in contact. The MCU controller outputs a high level through the GPIO port, and the relay RLY1 is activated, and the contact 6 is connected to the contact 5, and the contact 3 is connected to the contact 4. The MCU controller outputs a voltage V1 through the DAC port, and detects the voltage V2 through the ADC port. If the voltage V2 is equal to the pre-stored voltage value V2`, it means that the electrode SW1, the housing cover of the optical device, and the electrode SW2 are normally connected; otherwise, they are not connected, and the abnormality is eliminated until the voltage V2 detected by the ADC port is equal to the pre-stored voltage value V2`, and step S2 is executed; The pre-stored voltage value V2' is: V2`=V1*R3 / (R1+R2+R3+RSW); Wherein, RSW is the contact resistance between the electrode SW1 and the electrode SW2, R1 is the resistance value of the resistor R1, R2 is the resistance value of the resistor R2, R3 is the resistance value of the resistor R3, and V1 is the voltage value output by the DAC port of the MCU control unit.

9. The optical device testing method according to claim 8, characterized in that: The step S2 specifically includes the following steps: The MCU control unit outputs a low level 0 through the GPIO port, the relay RLY1 is disconnected, the contact 6 is connected to the contact 7, and the contact 3 is connected to the contact 2; the lead wire com of the impedance test equipment is connected to the electrode SW2; The MCU control unit notifies the impedance test equipment to start various functional tests, including Ri-c and Ri-j; Ri-j represents the impedance between the i-th pin NO.i and the j-th pin NO.j of the optical device, i=1,2,...,10, j=1,2,...,10, i≠j; Ri-c represents the impedance between the i-th pin NO.i and the housing cover of the optical device; If the impedance test equipment measures that Ri-c is infinite, the test passes; if the measured Ri-c is not infinite, the test fails; When all functional tests are completed, the impedance test equipment disconnects all pins of the optical device and notifies the MCU control unit that the test has been completed.

10. The optical device testing method according to claim 9, characterized in that: The step S3 specifically comprises the following steps: The MCU control unit then outputs a high level through the GPIO port, the relay RLY1 operates again, the contact 6 is connected to the contact 5, the DAC port is connected to the electrode SW1, the contact 3 is connected to the contact 4, and the ADC port is connected to the electrode SW2; The MCU control unit outputs voltage V1 through the DAC port, and the ADC port determines that if the voltage V2 is equal to the pre-stored voltage value V2`, it means that the functional test result of step S2 is valid; otherwise, all functional test results of step S2 are invalid and return to step S1.

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