Light adjusting device

Abstract

The invention discloses a light adjusting device. The light adjusting device comprises a bearing assembly, a multi-axis moving platform, a clamping assembly and a light beam analyzer, the bearing assembly is used for bearing a chip module, the chip module comprises a substrate and an optical chip arranged on the substrate, the optical chip is provided with a plurality of receiving and transmitting waveguide modules, and each receiving and transmitting waveguide module is used for receiving and transmitting an optical signal. The multi-axis moving platform comprises a mounting part and is used for adjusting the position and posture of the mounting part. The clamping assembly is arranged on the mounting part, the clamping assembly comprises a driving part and two clamping jaws arranged on the driving part, and the driving part is used for controlling the two clamping jaws to synchronously move in the same direction or back to back, so that the two clamping jaws clamp or release the micro-reflector, the micro-reflector is provided with a plurality of reflecting surfaces, and one reflecting surface is arranged opposite to one receiving and transmitting waveguide module. And the light beam analyzer is used for receiving the light beams emitted by the optical chip and reflected by the micro reflecting mirror. According to the invention, the stress change during light modulation of the micro-mirror can be reduced, so that the light modulation is more stable, and the modulation precision is improved.

Description

Technical Field

[0001] The present application relates to the technical field of automation equipment, and in particular to a light modulation device. Background Art

[0002] LiDAR is a radar system that emits laser beams to detect the position, speed and other characteristic quantities of a target. Its working principle is to transmit a detection signal (laser beam) to the target, and then compare the received signal reflected from the target (target echo) with the transmitted signal. After appropriate processing, relevant information about the target can be obtained, such as target distance, direction, altitude, speed, attitude, and even shape parameters.

[0003] In the related art, the optical transceiver module of some laser radars includes an optical chip and a micro-reflector. The optical chip includes multiple transceiver waveguide modules. Each transceiver waveguide module is used to realize the emission of detection light and the reception of echo light. The transceiver waveguide modules are staggered in a direction perpendicular to the normal of the optical chip. The micro-reflector and the optical chip are arranged relative to each other along the direction of the optical signal emitted by the transceiver waveguide module; the micro-reflector has multiple reflective surfaces, and each reflective surface is arranged relative to a transceiver waveguide module. In the process of optical adjustment of the micro-reflector and the optical chip, the related art adopts a conventional spring clamp structure to clamp and release the micro-reflector, but the spring clamp usually only releases pressure on one side at the moment of releasing the micro-reflector, which will cause a slight displacement of the position of the micro-reflector, thereby affecting the debugging result. Summary of the invention

[0004] The embodiment of the present application provides a light adjustment device, which can reduce the stress change of a micro-reflector during light adjustment, making the light adjustment more stable, thereby improving the adjustment accuracy.

[0005] The present application provides a light modulation device, which includes:

[0006] A carrier assembly, used for carrying a chip module, wherein the chip module comprises a substrate and an optical chip arranged on the substrate, wherein the optical chip has a plurality of transceiver waveguide modules, and each of the transceiver waveguide modules is used for transmitting and receiving an optical signal;

[0007] A multi-axis mobile platform, comprising a mounting portion, wherein the multi-axis mobile platform is used to adjust the position and posture of the mounting portion;

[0008] a clamping assembly, arranged at the mounting portion, the clamping assembly comprising a driving portion and two clamping claws arranged at the driving portion, the driving portion being used to control the two clamping claws to move synchronously toward or away from each other, so that the two clamping claws clamp or release a micro-reflector, the micro-reflector having a plurality of reflecting surfaces, one of the reflecting surfaces being arranged opposite to a transceiver waveguide module to reflect the detection light emitted through the transceiver waveguide module; and

[0009] The light beam analyzer is arranged above the supporting component and is used for receiving the light beam emitted by the optical chip and reflected by the micro-reflector.

[0010] In some embodiments, the multi-axis mobile platform is a six-axis mobile platform, and the mounting portion is an execution end of the six-axis mobile platform.

[0011] In some embodiments, the clamping jaw includes a connecting portion and a clamping portion;

[0012] The connecting portion is connected to the driving portion, the clamping portion is connected to the connecting portion, the clamping portions of the two clamping jaws are arranged opposite to each other, and the two clamping portions are used to cooperate together to clamp or release the micro-reflector.

[0013] In some embodiments, one of the two clamping parts is a first clamping part, and the other is a second clamping part, the first clamping part has a first side wall arranged toward the second clamping part, and the clamping part of the second clamping part has a second side wall arranged toward the first clamping part;

[0014] A positioning groove is provided on the bottom surface of the first clamping portion, and the positioning groove has a third side wall facing the second clamping portion and a fourth side wall disposed away from the driving portion;

[0015] The two clamping parts position and clamp the micro reflector via the third side wall, the fourth side wall and the second side wall.

[0016] In some embodiments, a first groove communicating with the positioning groove is further provided at the bottom of the first clamping portion, and the first groove is communicated with the positioning groove at the third side and the fourth side, respectively.

[0017] In some embodiments, the clamping jaw further includes a reinforcing rib disposed on a bottom surface of the clamping portion.

[0018] In some embodiments, along the thickness direction of the clamping portion, the ratio of the thickness of the reinforcing rib to the thickness of the clamping portion is 1 / 6 to 1 / 2.

[0019] In some embodiments, the bottom surface of the clamping portion is recessed to form at least one air-avoiding groove, and the air-avoiding groove is not connected to the positioning groove.

[0020] In some embodiments, the supporting component includes a base and an adsorption platform, the adsorption platform is fixed above the base, and the adsorption platform is connected to a vacuum generating device, and the adsorption platform is used to support and vacuum adsorb the surface of the substrate away from the optical chip.

[0021] In some embodiments, the supporting assembly further includes a first movable module, the first movable module is connected to the base, and the first movable module is used to drive the base to move.

[0022] In some of the embodiments, the optical modulation device further comprises a bracket and a second movable module, the second movable module is slidably mounted on the bracket, and the optical beam profiler is mounted on the second movable module and is located above the optical chip.

[0023] In some embodiments, the light modulation device further includes a camera, which is installed on the second movable module, and is used to obtain relative position information between the micro-reflector and the optical chip.

[0024] In the process of clamping or releasing the micro-reflector in the optical adjustment device of the embodiment of the present application, the driving part of the clamping assembly is used to control the two clamping claws to move synchronously toward or away from each other. Therefore, when the relative position of the micro-reflector and the optical chip is determined for fixation, at the moment of releasing the micro-reflector, the two clamping claws release the micro-reflector at the same time, reducing the force difference on the two sides relative to each other when releasing the micro-reflector, reducing the occurrence of micro-displacement of the position of the micro-reflector, that is, reducing the stress change of the micro-reflector during optical adjustment, making the optical adjustment more stable and improving the adjustment accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0026] Figure 1 A schematic diagram of the three-dimensional structure of a light modulation device according to an embodiment of the present application;

[0027] Figure 2 for Figure 1 A partial enlarged view of the middle A;

[0028] Figure 3 A schematic diagram of a supporting component of the light modulation device of the present application;

[0029] Figure 4 This is a schematic diagram of the structure of the clamping assembly of the light modulation device of the present application;

[0030] Figure 5 This is a schematic diagram of the exploded structure of the clamping assembly of the light modulation device of the present application;

[0031] Figure 6 A schematic diagram of the structure of the clamping claw of the clamping assembly of the light modulating device of the present application;

[0032] Figure 7 A schematic structural diagram of another embodiment of a clamping jaw of a clamping assembly of a light modulating device of the present application;

[0033] Figure 8 It is a partial structural schematic diagram of the light modulation device of the present application.

[0034] Description of Figure Numbers:

[0035] 100, optical modulation device; 10, bearing assembly; 11, base; 12, adsorption stage; 13, first movable module; 20, multi-axis movable platform; 21, mounting portion; 30, clamping assembly; 31, driving portion; 311, driving end; 32, clamping claw; 321, connecting portion; 322, clamping portion; 322a, first clamping portion; 322b, second clamping portion; 3221, reinforcing rib; 3222, air avoidance groove; 3223, first side wall; 3224, positioning groove; 3225, first groove; 3226, second side wall; 3227, third side wall; 3228, fourth side wall; 40, beam analyzer; 50, bracket; 60, second movable module; 70, camera; 300, micro-mirror; 200, chip module; 201, substrate; 202, optical chip.

[0036] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0037] In order to make the objectives, technical solutions and advantages of the present application clearer, the following part will further describe the embodiments of the present application in detail in conjunction with the accompanying drawings.

[0038] When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Instead, they are only examples of devices and methods consistent with some aspects of the present application as detailed in the attached claims.

[0039] In the description of the present application, it should be understood that the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances. In addition, in the description of the present application, unless otherwise specified, "multiple" refers to two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the objects associated before and after are in an "or" relationship.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0041] The micro-reflector and optical chip of the laser radar transceiver module need to be fine-tuned in attitude and position during coupling installation to debug the optical axis. In the related art, a conventional spring clamp structure is used to clamp and release the micro-reflector, but the spring clamp usually only releases pressure on one side at the moment of releasing the micro-reflector, which will cause a slight displacement of the position of the micro-reflector, thereby affecting the debugging result.

[0042] To solve the above problems, please refer to Figures 1 to 3The present application proposes a light modulation device 100, which is used to perform light modulation on an optical chip module 200 and a micro-reflector 300. The optical chip module 200 includes a substrate 201 and an optical chip 202 disposed on the substrate 201; the optical chip 202 has a plurality of transceiver waveguide modules, each of which is used to realize the transmission and reception of an optical signal, and each transceiver waveguide module is staggered along a direction perpendicular to the normal of the optical chip 202, so that the plurality of transceiver waveguide modules can realize the transmission and reception of multi-channel optical signals. The micro-reflector 300 is used to be installed on the substrate 201 after light modulation with the optical chip 201, and includes a plurality of reflective surfaces, each of which is used to be arranged opposite to a transceiver waveguide module to reflect the detection light emitted through the transceiver waveguide module. In an embodiment of the present application, the light modulation device 100 includes a bearing assembly 10, a multi-axis moving platform 20, a clamping assembly 30 and a beam analyzer 40. Among them, the bearing assembly 10 is a bearing base of the optical chip module 200, that is, it is used to bear the optical chip module 200. The multi-axis mobile platform 20 includes a mounting portion 21, and the multi-axis mobile platform 20 is used to adjust the position and posture of the mounting portion 21. The clamping assembly 30 is arranged on the above-mentioned mounting portion 21, and the clamping assembly 30 includes a driving portion 31 and two clamping claws 32 arranged on the driving portion 31; the driving portion 31 is used to control the two clamping claws 32 to move synchronously toward or away from each other, so that the two clamping claws clamp or release the above-mentioned micro-reflector 300. The above-mentioned multi-axis mobile platform 20 can adjust the position and posture of the clamping assembly 30 and the micro-reflector 300 by adjusting the position and posture of the mounting portion 21, so as to realize the optical adjustment of the micro-reflector 300 and the optical chip 201. The beam analyzer 40 is disposed above the above-mentioned carrier assembly 10, and is used to receive the light beam emitted by the optical chip 201 and reflected by the micro-reflector 300, so as to judge the optical alignment of the micro-reflector 300 and the optical chip module 200 by the quality of the light beam received by the beam analyzer 40. Next, the specific structures of the above-mentioned carrier assembly 10, the multi-axis moving platform 20, the clamping assembly 30 and the beam analyzer 40 are described in turn.

[0043] For the carrier assembly 10, please refer to Figure 3In this embodiment, the bearing assembly 10 includes a base 11 and a carrier 12. The base 11 is provided with an air suction channel, one end of which extends to the top of the base 11 to form an air suction hole, and the other end of the air suction channel is connected to a vacuum generating device. The carrier 12 is fixed to the top of the base 11 and covers the above-mentioned air suction hole. The carrier 12 is provided with a connecting hole connecting the air suction hole and the upper surface of the carrier 12. When the vacuum generating device is working, it evacuates the air suction channel, thereby causing the air suction hole and the carrier 12 to be in a negative pressure state, so that the optical chip module 200 can be adsorbed. Among them, the above-mentioned carrier 12 can use a microporous adsorption ceramic carrier, which has a large number of micropores and is distributed throughout the entire carrier, so that it can have a uniform adsorption effect everywhere, and can adapt to the adsorption area of ​​substrates 201 of various specifications and sizes smaller than it.

[0044] In some embodiments, the carrier assembly 10 further includes a first movable module 13, which is connected to the base 11, and is used to drive the base 11 to move. Specifically, the first movable module 13 may include a sliding block and a slide rail, the slide rail is placed on a supporting surface such as the ground, and the base 11 is installed on the slider; in this way, the position of the slider on the slide rail can be adjusted to synchronously drive the base 11 and the adsorption carrier 12 to move, so that after the optical chip module 200 and the micro-reflector 300 are completely fixed, the two can be moved to a position away from the clamping assembly 30 for access. As for the method of driving the slider to move relative to the slide rail, it can be driven manually, or it can be driven by a power mechanism such as a motor or a cylinder, or it can be driven by a power mechanism such as a motor in combination with a transmission mechanism such as a screw slider, which is not specifically limited here.

[0045] For multi-axis mobile platform 20, see Figure 1 The multi-axis mobile platform 20 has a multi-axis degree of freedom, so that its execution end can realize a structure of movement in multiple dimensions. The multi-axis mobile platform 20 includes a mounting portion 21, which is the execution end of the multi-axis mobile platform 20; the multi-axis mobile platform 20 is used to adjust the position and posture of the mounting portion 21, and then the clamping assembly 30 provided on the mounting portion 21 and the position and posture of the micro-reflector 300 clamped by the clamping assembly 30 can be adjusted, so that the reflection surface of the micro-reflector 300 is aligned with the optical path of the transceiver waveguide module of the optical chip 202 in the optical chip module 200. Specifically, the multi-axis mobile platform 20 can adjust the position of the micro-reflector 300 in the horizontal direction or the vertical direction by translating the position of the mounting portion 21 in the horizontal direction or the vertical direction, and the multi-axis mobile platform 20 can also adjust the posture of the micro-reflector 300 by rotating the mounting portion 21 to adjust its posture.

[0046] Optionally, the multi-axis mobile platform 20 is a six-axis mobile platform, and the mounting portion 21 is the execution end of the six-axis mobile platform. It is understandable that in order to achieve adjustment in multiple angles and directions, the multi-axis mobile platform 20 is a six-axis mobile platform, that is, it includes a linear slide in three directions and a rotating table in three directions. In this way, the six-axis mobile platform includes an X-axis slide, a Y-axis slide, a Z-axis slide, a U-axis rotating table, a V-axis rotating table and a W-axis rotating table. The above-mentioned slides or rotating tables are connected in series in a preset order, and the mounting portion 21 is arranged at the downstream slide or rotating table, so that the movement of each slide or rotating table can drive the movement of the mounting portion 21. In this way, the position and posture of the execution end (mounting portion 21) can be changed by controlling the movement of each slide or rotating table, thereby realizing the change of the position and posture of the clamping assembly 30.

[0047] For the above-mentioned clamping assembly 30, please refer to Figure 4 , while combining Figure 1 , the clamping assembly 30 is arranged on the mounting portion 21, and includes a driving portion 31 and a pair of clamping jaws 32. Among them, the driving portion 31 is installed on the mounting portion 21, and is a power element in the clamping assembly 30, which is used to control the two clamping jaws 32 to move synchronously toward or away from each other, so that the two clamping jaws 32 clamp or release the micro-reflector 300. In one embodiment, the driving portion 31 has a driving end 311, and the driving end 311 is provided with a slide groove and two sliders, and the two sliders are slidably arranged in the slide groove. A clamping jaw 32 is detachably connected to a slider, for example, threaded holes can be provided on the clamping jaw 32 and the slider, and the threaded holes are connected by screw threads to fix the clamping jaw 32 on the slider, so that the connection between the slider and the clamping jaw 32 is stable, and the subsequent maintenance and replacement of the clamping jaw 32 is convenient. Of course, the clamping jaw 32 and the slider can also be connected by means of snaps or the like. The driving part 31 is used to drive the two sliders to approach each other so as to drive the two clamping jaws 32 to move toward each other synchronously to clamp the micro-reflector 300, or to drive the two sliders to move away from each other so as to drive the two clamping jaws 32 to move backward synchronously to release the micro-reflector 300. In some embodiments, the driving end 311 may include a motor and a synchronous belt mechanism to drive the two sliders; of course, in other embodiments, the driving end 311 may also include a transmission structure such as a motor, a screw rod, and a nut to drive the two sliders, thereby driving the sliders to slide in the slide groove. The specific selection can be made by those skilled in the art according to the specific situation, and the present application does not limit this, as long as it can be achieved.

[0048] In this embodiment, the driving end 311 is provided with two parallel slide grooves, and each slider is installed in a corresponding slide groove; the driving part 31 is used to drive the two sliders to move toward or away from each other along the direction in which the slide grooves extend, so that the two clamping claws clamp or release the reflector 300. On the one hand, this arrangement can help avoid interference caused by the sliding of the two sliders. On the other hand, since the driving end 311 itself has a large cross-section, the two sliders are arranged in two slide grooves, which is conducive to utilizing the area of ​​the end surface of the driving end 311, thereby reducing the size of the driving part in the direction in which the slide grooves extend. Of course, correspondingly, the shape of the pair of clamping claws 32 also needs to be adaptively adjusted.

[0049] Reference Figure 1 and Figure 4 Optionally, the clamping jaw 32 includes a connecting portion 321 and a clamping portion 322. The connecting portion 321 is connected to the driving portion 31, and the clamping portion 322 is connected to the connecting portion 321. The clamping portions 322 of the two clamping jaws 32 are arranged relatively to each other along the direction in which the above-mentioned slide groove extends, and the two clamping portions 322 are used to cooperate together to clamp or release the micro-reflector 300. Among them, the material of the connecting portion 321 and the clamping portion 322 can be a metal material or a hard material, such as SUS304 stainless steel. The connecting portion 321 and the clamping portion 322 are set to a metal material or a hard material, which can further improve the connection strength between the connecting portion 321 and the clamping portion 322 and improve the clamping stability. Of course, the connecting portion 321 and the clamping portion 322 can also be integrally formed by injection molding or the like to improve the structural strength of the clamping jaw 32. It should be noted that, in order to further improve the stability of clamping, the clamping portions 322 of the two clamping jaws 32 have the same shape, and the centers of the relative surfaces of the clamping portions 322 of the two clamping jaws 32 are arranged opposite to each other, so that when clamping the micro-reflector 300, the relative force positions of the two surfaces of the micro-reflector 300 are the same, and the force is balanced, so as to further improve the stability of clamping. In this embodiment, the clamping portion 322 can be arranged in a long strip block shape, and the ends of the two clamping portions 322 away from the connecting portion 321 are used to abut the micro-reflector 300, so that the clamping position is away from the driving portion 31, and the connecting portion 321 can avoid the beam analyzer 40, thereby reducing the situation where the beam analyzer 40 is blocked by the driving portion 31 when acquiring the beam. It should be noted that, as described above, since the two connecting portions 321 are located on different driving straight lines of the driving portion 31, the clamping portions 322 of the two clamping jaws 32 can be adjusted to be located on the same driving straight line by changing the shape of one of the connecting portions 321, so as to ensure that the two clamping portions 322 are balanced in force when clamping the two sides of the micro-reflector 300. Of course, in other embodiments, the two connecting portions 321 can also be completely located on the same driving straight line of the driving portion 31. In this case, the shapes of the two clamping jaws 32 are mirrored, which is conducive to simplifying the design of the pair of clamping jaws 32.

[0050] Combined with reference Figures 5 to 7For the convenience of description, the present application defines one of the two clamping portions 322 as a first clamping portion 322a, and the other as a second clamping portion 322b. Figure 5 The clamping portion 322 on the right side is defined as a first clamping portion 322a. Figure 5 The clamping portion 322 on the left side is defined as a second clamping portion 322b. The first clamping portion 322a has a first side wall 3223 disposed toward the second clamping portion 322b, and the second clamping portion 322b has a second side wall 3226 disposed toward the first clamping portion 322a. A positioning groove 3224 is disposed on the bottom surface of the first clamping portion 322a, and the positioning groove 3224 has a third side wall 3227 facing the second clamping portion 322b and a fourth side wall 3228 disposed away from the driving portion 31. The two clamping portions 322 are positioned and clamped to clamp the micro-reflector 300 via the third side wall 3227, the fourth side wall 3228 and the second side wall 3226.

[0051] In this way, the three sides of the micro-reflector 300 are abutted against each other by the third side wall 3227, the fourth side wall 3228 and the second side wall 3226 to position the micro-reflector 300 against the wall, so as to ensure that the initial position of the clamped micro-reflector 300 is consistent each time, so as to reduce the influence of the clamping error on the debugging accuracy. It should be noted that the micro-reflector 300 is arranged in an approximately rectangular block shape as a whole, and the side away from each reflection surface has a first side surface, and it also has a second side surface and a third side surface that are relatively arranged between the first side surface and each reflection surface, and the second side surface and the third side surface are parallel to the direction of the detection light emission. Therefore, the third side wall 3227, the second side wall 3226 and the fourth side wall 3228 can be arranged in a plane, so as to further abut the stability of the second side surface, the third side surface and the first side surface of the clamped micro-reflector 300. In addition, the positioning groove 3224 is only provided on the first clamping portion 322a, and no positioning groove 3224 is provided on the second clamping portion 322b. This not only facilitates processing, but also eliminates the need to provide two fourth side walls 3228, thereby avoiding the disadvantage of the position of the micro-reflector 300 changing due to the misalignment of the two fourth side walls 3228.

[0052] Combined with reference Figure 7Furthermore, a first groove 3225 connected to the positioning groove 3224 is further provided at the bottom of the first clamping portion 322a, and the first groove 3225 is connected to the positioning groove 3224 at the third side wall 3227 and the fourth side wall 3228 respectively. Since the first groove 3225 is processed by milling, there will be a rounded corner inscribed relative to the third side wall 3227 and the fourth side wall 3228 between the third side wall 3227 and the fourth side wall 3228, instead of the two being connected at a right angle, and the rounded corner will interfere with the corners of the micro-reflector, which not only affects the clamping of the micro-reflector, but may even damage the micro-reflector. The provision of the first groove 3225 removes the above-mentioned rounded corner structure as a whole. When the micro-reflector is clamped in the two clamping portions, the right-angle structure formed by the above-mentioned first side surface and the second side surface will be accommodated in the first groove 3225, thereby overcoming the above-mentioned shortcomings.

[0053] Optionally, in conjunction with reference Figure 6 and Figure 7 , the clamping jaw 32 also includes a reinforcing rib 3221 arranged on the bottom surface of the clamping portion 322. Among them, by convexly providing the reinforcing rib 3221 on the bottom surface of the clamping portion 322, the strength of the clamping portion 322 can be improved, thereby improving the strength of the clamping jaw 32, and to a certain extent, avoiding the deformation of the clamping jaw 32 when the clamping micro-reflector 300 is subjected to force, thereby improving the stability and reliability of the clamping jaw 32. In this embodiment, the reinforcing rib 3221 can be arranged in a long strip shape and extend along the length direction of the clamping portion 322, so as to increase the contact area between the reinforcing rib 3221 and the clamping portion 322, so as to further improve the strength of the clamping portion 322. Of course, in other embodiments, the reinforcing rib 3221 can also be arranged in multiple sections at intervals. In addition, the end of the reinforcing rib 3221 away from the connecting portion 321 can form an avoidance slope, so that the reinforcing rib 3221 can avoid the chip module 200 on the carrier assembly 10 when clamping, thereby improving the stability of clamping. In order to further improve the strength of the clamping portion 322, a reinforcing rib 3221 may also be provided on the top surface of the clamping portion 322, and the reinforcing rib 3221 corresponds to the reinforcing rib 3221 on the ground, so as to further improve the stability and reliability of the clamping jaw 32. The specific shape and arrangement of the top reinforcing rib 3221 may be selected by those skilled in the art as required, and will not be elaborated here.

[0054] Furthermore, along the thickness direction of the clamping portion 322, the ratio of the thickness of the reinforcing rib 3221 to the thickness of the clamping portion 322 is 1 / 6 to 1 / 2. When the ratio of the thickness of the reinforcing rib 3221 to the thickness of the clamping portion 322 is less than 1 / 6, the thickness of the reinforcing rib 3221 will be much smaller than the thickness of the clamping portion 322, so that the reinforcing rib 3221 cannot effectively improve the strength of the clamping portion 322, affecting the stability and reliability of the clamping jaw 32. When the ratio of the thickness of the reinforcing rib 3221 to the thickness of the clamping portion 322 is greater than 1 / 2, the thickness of the reinforcing rib 3221 will be too large, occupying more material, resulting in excessively high costs. At the same time, when the clamping portion 322 clamps the micro-reflector 300, there is a possibility that the reinforcing rib 3221 will collide with the chip module 200 on the bearing component 10. Therefore, the ratio of the thickness of the reinforcing rib 3221 to the thickness of the clamping portion 322 can be 1 / 3, 1 / 4, 1 / 5, etc., so as to ensure that the reinforcing rib 3221 improves the strength of the clamping portion 322 while reducing the possibility of the reinforcing rib 3221 colliding with the chip module 200 on the supporting component 10 during clamping.

[0055] Combined with reference Figure 6 and Figure 7 Optionally, the bottom surface of the clamping portion 322 is recessed to form at least one avoidance groove 3222, and the avoidance groove 3222 is not connected to the positioning groove 3224. Specifically, the avoidance groove 3222 is located on the side of the positioning groove 3224 away from the other clamping portion 322, so that the avoidance groove 3222 can avoid other hardware components on the substrate 201 other than the optical chip 202 and the micro-reflector 300, such as a transimpedance amplifier (TIA). Correspondingly, one end of the above-mentioned reinforcing rib 3221 is close to the side of the avoidance groove 3222 toward the connecting portion 321, and the other end extends toward the connecting portion 321; in this way, when performing light adjustment, the reinforcing rib 3221 may not be located at all or only the above-mentioned avoidance slope is located above the substrate 201, thereby avoiding interference with the components on the substrate 201. In this embodiment, the bottom surface of the clamping portion 322 is recessed to form a single avoidance groove 3222, and the avoidance groove 3222 can extend from the end of the clamping portion 322 away from the connecting portion 321 toward the connecting portion 321, and the avoidance groove 3222 extends to the side wall of the clamping portion 322, so that it can not only play an avoidance role, but also facilitate processing. The groove depth of the avoidance groove 3222 can be 0.1mm to 0.2mm, so as to control the volume ratio of the avoidance groove 3222 to the clamping portion 322, thereby reducing the possibility that the avoidance groove 3222 affects the strength of the clamping portion 322. Of course, in other embodiments, the avoidance groove 3222 can also be formed into a corresponding shape or a corresponding number according to the avoidance requirements, which can be specifically set by those skilled in the art according to specific needs and will not be elaborated here.

[0056] For the above beam profiler 40, please refer to Figure 1 , the beam analyzer 40 is arranged above the supporting component 10, and is used to receive the light beam emitted by the optical chip 202 and reflected by the micro-reflector 300. It should be noted that the supporting component 10, the multi-axis mobile platform 20 and the beam analyzer 40 can be fixedly installed on the same mounting base, so as to facilitate the overall movement of the light modulation device 100. Of course, the supporting component 10, the multi-axis mobile platform 20 and the beam analyzer 40 can also be separately arranged to facilitate independent adjustment of their respective positions and improve the flexibility of the setting. The beam analyzer 40 determines whether the light modulation meets the requirements by monitoring the optical axis pointing and beam quality (such as optical power and spot size, etc.) of each channel. Its working principle is similar to that of the existing beam analyzer 40 and will not be elaborated here.

[0057] The optical adjustment device 100 of the present application carries the chip module 200 through the carrying component 10, and the multi-axis mobile platform 20 adjusts the position and posture of the mounting portion 21 to synchronously drive the clamping component 30 to clamp the micro-reflector 300 to change its position and posture. In this way, the light beam emitted by the optical chip 202 of the chip module 200 and reflected by the micro-reflector 300 received by the beam analyzer 40 can be calculated to determine whether the required optical parameters are met. When the optical parameters are not met, the position and posture of the mounting portion 21 are adjusted again by the multi-axis mobile platform 20 to synchronously drive the clamping component 30 to clamp the micro-reflector 300 to change its position and posture, so as to adjust it to meet the required optical parameters. When the optical parameters are met, the position and posture of the micro-mirror 300 are recorded, and the multi-axis mobile platform 20 is driven to adjust the mounting portion 21 to drive the clamping assembly 30 and the micro-mirror 300 to leave the chip module 200; then, glue is dispensed at the position of the micro-mirror 300 on the substrate 201 of the chip module 200 manually or with glue dispensing equipment; thereafter, the multi-axis mobile platform 20 is driven again to adjust the mounting portion 21 to drive the clamping assembly 30 and the micro-mirror 300 to reach the above-recorded position and posture, and at the same time, it is re-judged whether the light beam received by the light beam analyzer 40, which is emitted by the optical chip 202 of the chip module 200 and reflected by the micro-mirror 300, meets the required optical parameters. If the optical parameters are met, UV light is used for curing, otherwise, debugging is continued until the optical parameters are met before curing.

[0058] Reference Figure 8Optionally, the optical modulation device 100 further includes a bracket 50 and a second movable module 60, the second movable module 60 is slidably mounted on the bracket 50, and the beam analyzer 40 is mounted on the second movable module 60 and is located above the optical chip module 200. The bracket 50 can be made of a hard material such as metal, so as to improve the stability of the support of the bracket 50. In this embodiment, the bracket 50 is arranged in a gantry manner, and the overall design is relatively simple, which is easy to process, and can be stably placed on a supporting surface such as the ground. Of course, in other embodiments, the bracket 50 can also be set to a corresponding shape according to the specific placement environment requirements.

[0059] The second movable module 60 can be slidably mounted on the bracket 50. Specifically, a slide rail can be set on the bracket 50, and the second movable module 60 includes a driving member and a slider, and the slider is connected to the beam analyzer 40. The driving member drives the slider to move back and forth along the slide rail, thereby driving the beam analyzer 40 to move, and then the position of the beam analyzer 40 can be adjusted to be arranged opposite to the optical chip 202 of the chip module 200, so as to accurately receive the light beam emitted by the optical chip 202 and reflected by the micro-reflector 300. It can be understood that the driving member can be driven by a motor or a cylinder to drive the slider to move. In other embodiments, the second movable module 60 can also be driven by a gear rack or a lead screw to realize that the second movable module 60 can be slidably mounted on the bracket 50. The specific setting can be made by those skilled in the art according to the specific situation, which will not be elaborated here.

[0060] Furthermore, the light adjustment device 100 also includes a camera 70, which is installed on the second movable module 60, and the camera 70 is used to obtain the relative position information between the micro-mirror 300 and the chip. Among them, since the beam analyzer 40 is located above the optical chip 202, in order to avoid blocking the beam analyzer 40, the camera 70 can be located on the side of the chip module 200. In one embodiment, the camera 70 is a telecentric lens camera, and the relative position information between the micro-mirror 300 and the chip is obtained by the camera 70, so that the distance between the micro-mirror 300 and the substrate 201 can be monitored to avoid interference between the two during light adjustment to ensure the debugging accuracy. The camera 70 is installed on the second movable module 60, so the position of the camera 70 can also be adjusted by adjusting the position of the second movable module 60, so that the camera 70 can be adjusted according to the position of the chip module 200 or the micro-mirror 300 to improve the monitoring accuracy. Of course, in other embodiments of the present application, a third mobile module independently arranged relative to the second mobile module 60 may be further provided, the structure of the third mobile module is similar to that of the second mobile module 60, and the camera 70 is installed on the third mobile module; in this way, the movement of the camera can be controlled by the third mobile module.

[0061] In summary, the optical modulation device 100 of the embodiment of the present application includes a bearing assembly 10, a multi-axis mobile platform 20, a clamping assembly 30 and a beam analyzer 40. In the process of clamping or releasing the micro-reflector 300 of the optical modulation device 100, the driving part 31 of the clamping assembly 30 is used to control the two clamping claws 32 to move synchronously toward or away from each other, so that when the relative positions of the micro-reflector 300 and the optical chip 202 are determined for fixation, at the moment of releasing the micro-reflector 300, the two clamping claws 32 release the micro-reflector 300 at the same time, reducing the force difference on the two sides when releasing the micro-reflector 300, reducing the occurrence of micro-displacement of the position of the micro-reflector 300, that is, reducing the stress change of the micro-reflector 300 during optical modulation, making the optical modulation more stable, and improving the debugging accuracy.

[0062] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of this application, it should be understood that if the terms "upper", "lower", "left", "right", etc. indicate an orientation or position relationship based on the orientation or position relationship shown in the drawings, it is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0063] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A light modulation device, characterized in that: include: A carrier assembly, used for carrying a chip module, wherein the chip module comprises a substrate and an optical chip arranged on the substrate, wherein the optical chip has a plurality of transceiver waveguide modules, and each of the transceiver waveguide modules is used for transmitting and receiving an optical signal; A multi-axis mobile platform, comprising a mounting portion, wherein the multi-axis mobile platform is used to adjust the position and posture of the mounting portion; a clamping assembly, arranged at the mounting portion, the clamping assembly comprising a driving portion and two clamping claws arranged at the driving portion, the driving portion being used to control the two clamping claws to move synchronously toward or away from each other, so that the two clamping claws clamp or release a micro-reflector, the micro-reflector having a plurality of reflecting surfaces, one of the reflecting surfaces being arranged opposite to one of the transceiver waveguide modules to reflect the detection light emitted through the transceiver waveguide module; and The light beam analyzer is arranged above the supporting component and is used for receiving the light beam emitted by the optical chip and reflected by the micro-reflector.

2. The light modulation device according to claim 1, characterized in that: The multi-axis mobile platform is a six-axis mobile platform, and the mounting portion is an execution end of the six-axis mobile platform.

3. The light modulation device according to claim 1, characterized in that: The clamping jaw comprises a connecting portion and a clamping portion; The connecting portion is connected to the driving portion, the clamping portion is connected to the connecting portion, the clamping portions of the two clamping jaws are arranged opposite to each other, and the two clamping portions are used to cooperate together to clamp or release the micro-reflector.

4. The light modulation device according to claim 3, characterized in that: One of the two clamping parts is a first clamping part, and the other is a second clamping part, the first clamping part has a first side wall arranged toward the second clamping part, and the second clamping part has a second side wall arranged toward the first clamping part; A positioning groove is provided on the bottom surface of the first clamping portion, and the positioning groove has a third side wall facing the second clamping portion and a fourth side wall disposed away from the driving portion; The two clamping parts position and clamp the micro reflector via the third side wall, the fourth side wall and the second side wall.

5. The light modulation device according to claim 4, characterized in that: A first groove communicating with the positioning groove is further provided at the bottom of the first clamping portion, and the first groove is communicated with the positioning groove at the third side surface and the fourth side surface respectively.

6. The light modulation device according to claim 3, characterized in that: The clamping jaw further includes a reinforcing rib arranged on the bottom surface of the clamping portion.

7. The light modulation device according to claim 6, characterized in that: Along the thickness direction of the clamping portion, the ratio of the thickness of the reinforcing rib to the thickness of the clamping portion is 1 / 6 to 1 / 2.

8. The light modulation device according to claim 4, characterized in that: The bottom surface of the clamping portion is concavely formed to form at least one air-avoiding groove, and the air-avoiding groove is not connected to the positioning groove.

9. The light modulation device according to any one of claims 1 to 8, characterized in that: The supporting component includes a base and an adsorption platform, wherein the adsorption platform is fixed above the base and connected to a vacuum generating device, and the adsorption platform is used for supporting and vacuum-adsorbing the surface of the substrate away from the optical chip.

10. The light modulation device according to claim 9, characterized in that: The bearing assembly further includes a first movable module, the first movable module is connected to the base, and the first movable module is used to drive the base to move.

11. The light modulation device according to any one of claims 1 to 8, characterized in that: The optical modulation device further comprises a bracket and a second movable module, wherein the second movable module is slidably mounted on the bracket, and the optical beam profiler is mounted on the second movable module and is located above the optical chip.

12. The light modulation device according to claim 11, characterized in that: The light modulation device further includes a camera, which is installed on the second movable module and is used to obtain relative position information between the micro-reflector and the optical chip.

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