Manufacturing method of three-dimensional developing glass display panel
By combining grating principle and lithography technology, high-precision and high-efficiency dynamic stereo development effect on glass display panels is achieved, solving the problems of high cost, low efficiency and insufficient accuracy of traditional methods, and achieving a variety of stereo development effects and good optical performance.
Patent Information
- Application Number
- CN202510181351.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-19
- Publication Date
- 2025-03-28
AI Technical Summary
Traditional glass display panels are planar structures, lacking three-dimensional sense and visual effects. The existing three-dimensional development technology is cost-effective, low efficiency and insufficient accuracy.
Using grating principles and photolithography technology, grating patterns are designed and dynamic stereo development effects are achieved on glass panels through photomasks, photoresist, exposure, development and acid etching.
It achieves a dynamic three-dimensional development effect with high precision and high efficiency, overcomes the problems of high cost, low efficiency and insufficient accuracy of traditional mechanical engraving or laser engraving methods, and enhances the optical performance and mechanical strength of glass panels.
Smart Images
Figure CN119717302A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of glass processing, and in particular relates to a method for manufacturing a three-dimensional developing glass display panel. Background Art
[0002] The stereoscopic glass display panel is a new type of display device that uses special optical technology to achieve stereoscopic image display. It coats a film with stereoscopic development function on the glass panel and uses a grating or lens array to accurately control the light, so that viewers can see images with depth and three-dimensionality without wearing special glasses. This technology not only improves the realism of visual effects, but also broadens the scope of display applications and is widely used in advertising media, electronic games, virtual reality and other fields. The stereoscopic glass display panel has the advantages of high definition, low power consumption, and thin and light design, and is one of the important directions for the development of future display technology.
[0003] However, conventional glass display panels are usually flat structures, lacking three-dimensional sense and visual effects. Existing three-dimensional development technologies mostly use mechanical engraving or laser engraving, but these methods have problems such as high cost, low efficiency, and insufficient precision.
[0004] Therefore, a new manufacturing method is needed to achieve a high-precision and high-efficiency dynamic three-dimensional development effect on a glass display panel. Summary of the invention
[0005] The purpose of the present invention is to provide a method for manufacturing a three-dimensional developing glass display panel in order to solve the above-mentioned problem.
[0006] The technical solution adopted by the present invention is as follows: a method for manufacturing a three-dimensional developing glass display panel, comprising the following steps:
[0007] S1: Designing grating patterns: Using computer-aided design (CAD) software, designing the desired grating patterns, the grating patterns include periodically arranged microstructures such as lines, dots or other geometric shapes.
[0008] S2: Convert the designed grating pattern into a photomask file.
[0009] S3: Preparing a photomask: Using photolithography technology, a photomask is prepared on a transparent substrate, and the photomask has light-transmitting and light-impermeable areas corresponding to the designed grating pattern.
[0010] S4: coating photoresist: coating a layer of photoresist evenly on the surface of the glass panel, and the thickness of the photoresist is determined according to the required etching depth.
[0011] S5: Exposure: Align the photomask to the glass panel and use ultraviolet light for exposure. During the exposure process, the light-transmitting area on the photomask allows ultraviolet light to pass through, causing the photoresist to undergo a photochemical reaction and form a latent image.
[0012] S6: Development: Place the exposed glass panel into a developer to remove the photoresist in the unexposed area to expose the glass surface.
[0013] S7: Acid etching: The developed glass panel is placed in an acid etching solution, which etches the exposed glass surface to form a microstructure corresponding to the grating pattern. The etching time and acid concentration are controlled to obtain the desired etching depth and surface roughness.
[0014] S8: Cleaning and post-processing: Take the etched glass panel out of the acid etching solution and clean it with deionized water to remove the residual acid and photoresist. Perform post-processing on the glass panel, such as polishing, cleaning, drying, etc., to enhance its optical properties and mechanical strength.
[0015] In a preferred embodiment, in step S1, the period of the grating is usually set in the range of 10 to 100 microns, and the specific value depends on the target display effect and optical performance requirements. The width and spacing ratio of the lines or dot matrix needs to be controlled between 1:1 and 1:5 to ensure the diffraction efficiency of the grating. The depth design of the microstructure needs to be combined with the feasibility of the subsequent etching process, and 0.5 to 10 microns is generally recommended. During the design process, a high-resolution image file needs to be exported with a resolution of not less than 2400 DPI to ensure the clarity and accuracy of the pattern edge.
[0016] In a preferred embodiment, in step S2, the file format is usually GDSII or DXF to ensure compatibility with the lithography machine. The pattern edge needs to be corrected for optical proximity effect, and the compensation value is set to 0.1 to 0.5 microns to reduce the diffraction error during exposure. When the file is color-separated, it is necessary to distinguish between the light-transmitting area and the light-shielding area. The light-shielding area material is selected from chromium or iron oxide, and the light-transmitting area keeps the substrate transparent. The data accuracy must reach the nanometer level to avoid pattern distortion.
[0017] In a preferred embodiment, in the step S3, the photomask substrate is made of high-purity quartz or borosilicate glass with a thickness of 1 to 3 mm. A chromium layer with a thickness of 80 to 120 nanometers is deposited on the substrate by magnetron sputtering as a light-shielding material. After applying the photoresist, a laser direct writing or electron beam lithography machine is used for pattern transfer, and the exposure wavelength is 365 nanometers or 248 nanometers. The developer uses a tetramethylammonium hydroxide solution with a concentration of 2.38% and a development time of 30 to 60 seconds. When etching the chromium layer, a ferric chloride solution or dry plasma etching is used, and finally defects are detected by an optical microscope or a scanning electron microscope to ensure that the line width error is less than ±5%.
[0018] In a preferred embodiment, in step S4, the thickness of the adhesive layer is controlled by the spin coating speed, the rotation speed is set to 1000 to 5000 rpm, the time is 30 to 60 seconds, and the final thickness is 1 to 10 microns. Before applying the glue, the glass panel needs to be plasma cleaned with a power of 100 to 300 watts and a time of 2 to 5 minutes to improve adhesion. After applying the glue, a pre-baking treatment is required at a temperature of 90 to 120 degrees Celsius for 5 to 30 minutes to remove the solvent and solidify the adhesive layer.
[0019] In a preferred embodiment, in step S5, the exposure wavelength is selected to be 365 nanometers or 405 nanometers, the light intensity is 10 to 50 milliwatts per square centimeter, and the exposure time is set to 10 to 300 seconds according to the sensitivity of the photoresist. During the exposure process, the ambient temperature needs to be maintained at 20 to 25 degrees Celsius and the humidity is less than 50% to avoid moisture absorption and deformation of the adhesive layer. A contact or proximity exposure mode is adopted, and the distance between the mask and the glass panel is 10 to 50 microns to balance the resolution and the mask life.
[0020] In a preferred embodiment, in step S6, a 0.4% to 1% sodium hydroxide solution is used for the positive photoresist, and a special organic solvent such as propylene glycol methyl ether acetate is used for the negative photoresist. The development time is usually 30 to 180 seconds, and the unexposed area is removed by immersion or spraying. After development, it is necessary to rinse with deionized water immediately, the water temperature is 20 to 25 degrees Celsius, and the rinsing time is 30 to 60 seconds. The end point of development can be judged by observing the edge clarity of the glue layer under a microscope, and the residual glue scraps need to be purged and removed with a nitrogen gun.
[0021] In a preferred embodiment, in step S7, the etching solution is a mixed solution of hydrofluoric acid and nitric acid, the concentration of hydrofluoric acid is 5% to 20%, and the concentration of nitric acid is 5% to 10%. The etching temperature is controlled at 20 to 40 degrees Celsius, the time is 1 to 30 minutes, and the etching rate is about 0.1 to 1 micron / minute. The etching uniformity is improved by magnetic stirring or ultrasonic assistance, and the stirring speed is 100 to 500 rpm. The etching depth is monitored in real time by a laser interferometer, and the surface roughness must be less than 50 nanometers, which can be optimized by adjusting the acid concentration and temperature.
[0022] In a preferred embodiment, in step S8, the etched glass panel is subjected to three ultrasonic cleanings with deionized water, each for 5 to 10 minutes at a frequency of 40 kHz. The residual acid solution is neutralized with 0.1% ammonia water and then dehydrated with anhydrous ethanol. Polishing adopts a chemical mechanical polishing process, and the polishing liquid is a silica or cerium oxide suspension with a particle size of 0.1 to 1 micron and a pressure of 0.1 to 0.5 MPa. Drying is carried out in a clean oven at a temperature of 60 to 100 degrees Celsius for 10 to 30 minutes. Finally, the transmittance is detected by a spectrophotometer to ensure that it reaches more than 90%, and the surface strength is verified by a Mohs hardness test.
[0023] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:
[0024] In the present invention, by combining the grating principle and the photolithography technology, a high-precision and high-efficiency dynamic three-dimensional development effect is achieved, overcoming the problems of high cost, low efficiency, and insufficient precision of traditional mechanical engraving or laser engraving methods. By designing different grating patterns, a variety of three-dimensional development effects can be achieved to meet different application requirements. In addition, the post-processing process can enhance the optical properties and mechanical strength of the glass panel, making it more suitable for practical applications. Therefore, the production method has the beneficial effects of high precision, high efficiency, a variety of three-dimensional development effects, good optical properties and mechanical strength, and a wide range of applications, and has broad market prospects in the fields of architecture, decoration, advertising, and electronic products. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 It is a schematic diagram of the process principle of the present invention. DETAILED DESCRIPTION
[0026] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.
[0027] Reference Figure 1 ,
[0028] A method for manufacturing a three-dimensional developing glass display panel comprises the following steps:
[0029] S1: Designing grating patterns: Using computer-aided design (CAD) software, designing the desired grating patterns, the grating patterns include periodically arranged microstructures such as lines, dots or other geometric shapes.
[0030] S2: Convert the designed grating pattern into a photomask file.
[0031] S3: Preparing a photomask: Using photolithography technology, a photomask is prepared on a transparent substrate, and the photomask has light-transmitting and light-impermeable areas corresponding to the designed grating pattern.
[0032] S4: coating photoresist: coating a layer of photoresist evenly on the surface of the glass panel, and the thickness of the photoresist is determined according to the required etching depth.
[0033] S5: Exposure: Align the photomask to the glass panel and use ultraviolet light for exposure. During the exposure process, the light-transmitting area on the photomask allows ultraviolet light to pass through, causing the photoresist to undergo a photochemical reaction and form a latent image.
[0034] S6: Development: Place the exposed glass panel into a developer to remove the photoresist in the unexposed area to expose the glass surface.
[0035] S7: Acid etching: The developed glass panel is placed in an acid etching solution, which etches the exposed glass surface to form a microstructure corresponding to the grating pattern. The etching time and acid concentration are controlled to obtain the desired etching depth and surface roughness.
[0036] S8: Cleaning and post-processing: Take the etched glass panel out of the acid etching solution and clean it with deionized water to remove the residual acid and photoresist. Perform post-processing on the glass panel, such as polishing, cleaning, drying, etc., to enhance its optical properties and mechanical strength.
[0037] In step S1, the period of the grating is usually set in the range of 10 to 100 microns, and the specific value depends on the target display effect and optical performance requirements. The width and spacing ratio of the lines or dots needs to be controlled between 1:1 and 1:5 to ensure the diffraction efficiency of the grating. The depth design of the microstructure needs to be combined with the feasibility of the subsequent etching process, and 0.5 to 10 microns is generally recommended. High-resolution image files need to be exported during the design process, with a resolution of not less than 2400DPI to ensure the clarity and accuracy of the pattern edges.
[0038] In step S2, the file format is usually GDSII or DXF to ensure compatibility with the lithography machine. The pattern edge needs to be corrected for optical proximity effect, and the compensation value is set to 0.1 to 0.5 microns to reduce the diffraction error during exposure. When the file is color-separated, it is necessary to distinguish between the light-transmitting area and the light-shielding area. The light-shielding area material is selected as chromium or iron oxide, and the light-transmitting area keeps the substrate transparent. The data accuracy must reach the nanometer level to avoid pattern distortion.
[0039] In step S3, the photomask substrate is made of high-purity quartz or borosilicate glass with a thickness of 1 to 3 mm. A chromium layer with a thickness of 80 to 120 nanometers is deposited on the substrate by magnetron sputtering as a light-shielding material. After applying the photoresist, a laser direct writing or electron beam lithography machine is used for pattern transfer, and the exposure wavelength is 365 nanometers or 248 nanometers. The developer uses a tetramethylammonium hydroxide solution with a concentration of 2.38% and a development time of 30 to 60 seconds. When etching the chromium layer, a ferric chloride solution or dry plasma etching is used, and finally defects are detected by an optical microscope or a scanning electron microscope to ensure that the line width error is less than ±5%.
[0040] In step S4, the thickness of the adhesive layer is controlled by the spin coating speed, the speed is set to 1000 to 5000 rpm, the time is 30 to 60 seconds, and the final thickness is 1 to 10 microns. Before applying the glue, the glass panel needs to be plasma cleaned with a power of 100 to 300 watts for 2 to 5 minutes to improve adhesion. After applying the glue, a pre-baking treatment is required at a temperature of 90 to 120 degrees Celsius for 5 to 30 minutes to remove the solvent and solidify the adhesive layer.
[0041] In step S5, the exposure wavelength is selected to be 365 nanometers or 405 nanometers, the light intensity is 10 to 50 milliwatts per square centimeter, and the exposure time is set to 10 to 300 seconds according to the sensitivity of the photoresist. During the exposure process, the ambient temperature must be maintained at 20 to 25 degrees Celsius and the humidity must be lower than 50% to prevent the adhesive layer from absorbing moisture and deforming. A contact or proximity exposure mode is used, and the distance between the mask and the glass panel is 10 to 50 microns to balance the resolution and the mask life.
[0042] In step S6, a 0.4% to 1% sodium hydroxide solution is used for positive photoresist, and a special organic solvent such as propylene glycol methyl ether acetate is used for negative photoresist. The development time is usually 30 to 180 seconds, and the unexposed area is removed by immersion or spraying. After development, it is necessary to rinse with deionized water immediately, the water temperature is 20 to 25 degrees Celsius, and the rinsing time is 30 to 60 seconds. The end point of development can be judged by observing the edge clarity of the glue layer under a microscope, and the residual glue scraps need to be purged and removed with a nitrogen gun.
[0043] In step S7, the etching solution is a mixed solution of hydrofluoric acid and nitric acid, with a hydrofluoric acid concentration of 5% to 20% and a nitric acid concentration of 5% to 10%. The etching temperature is controlled at 20 to 40 degrees Celsius, the time is 1 to 30 minutes, and the etching rate is about 0.1 to 1 micron / minute. The etching uniformity is improved by magnetic stirring or ultrasonic assistance, and the stirring speed is 100 to 500 rpm. The etching depth is monitored in real time by a laser interferometer, and the surface roughness must be less than 50 nanometers, which can be optimized by adjusting the acid concentration and temperature.
[0044] In step S8, the etched glass panel is ultrasonically cleaned with deionized water three times, each time for 5 to 10 minutes at a frequency of 40 kHz. The residual acid is neutralized with 0.1% ammonia water and then dehydrated with anhydrous ethanol. Polishing adopts a chemical mechanical polishing process, and the polishing liquid is a silica or cerium oxide suspension with a particle size of 0.1 to 1 micron and a pressure of 0.1 to 0.5 MPa. Drying is carried out in a clean oven at a temperature of 60 to 100 degrees Celsius for 10 to 30 minutes. Finally, the transmittance is detected by a spectrophotometer to ensure that it reaches more than 90%, and the surface strength is verified by a Mohs hardness test.
[0045] Embodiment 1:
[0046] 1. Design grating pattern: Use CAD software to design a periodic line pattern with a line width of 15 microns and a spacing of 30 microns.
[0047] 2. Prepare a photomask: Prepare a photomask having the above-mentioned line pattern on a transparent substrate.
[0048] 3. Apply photoresist: Apply a layer of photoresist with a thickness of 5 microns on the surface of the glass panel.
[0049] 4. Exposure: Align the photomask to the glass panel and expose with UV light for 10 seconds.
[0050] 5. Development: Place the exposed glass panel in the developer to remove the photoresist in the unexposed area.
[0051] 6. Acid etching: Place the developed glass panel into the glass etching solution that has been prepared and matured in advance, and etch for 5 minutes to form a line structure with a depth of 3 microns.
[0052] 7. Cleaning and post-processing: The glass panel is cleaned with deionized water, and then polished, cleaned and dried to obtain a three-dimensional developing glass display panel.
[0053] Embodiment 2:
[0054] 1. Design grating pattern: Use CAD software to design a dot pattern with a dot diameter of 10 microns and a dot pitch of 25 microns.
[0055] 2. Prepare a photomask: prepare a photomask having the above-mentioned dot matrix pattern on a transparent substrate.
[0056] 3. Coating photoresist: Coat a layer of photoresist with a thickness of 5 microns on the surface of the glass panel.
[0057] 4. Exposure: Align the photomask to the glass panel and expose with UV light for 8 seconds.
[0058] 5. Development: Place the exposed glass panel in the developer to remove the photoresist in the unexposed area.
[0059] 6. Acid etching: Place the developed glass panel into the glass etching solution prepared and matured in advance, etch for 3 minutes to form a dot matrix structure with a depth of 2 microns.
[0060] 7. Cleaning and post-processing: The glass panel is cleaned with deionized water, and then polished, cleaned and dried to obtain a three-dimensional developing glass display panel.
[0061] From the above, it can be known that in the present invention, by combining the grating principle and photolithography technology, a high-precision, high-efficiency dynamic three-dimensional development effect is achieved, overcoming the problems of high cost, low efficiency, and insufficient precision of traditional mechanical engraving or laser engraving methods. By designing different grating patterns, a variety of three-dimensional development effects can be achieved to meet different application requirements. In addition, the post-processing process can enhance the optical properties and mechanical strength of the glass panel, making it more suitable for practical applications. Therefore, the production method has the beneficial effects of high precision, high efficiency, a variety of three-dimensional development effects, good optical properties and mechanical strength, and a wide range of applications, and has broad market prospects in the fields of architecture, decoration, advertising, and electronic products.
[0062] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprises" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.
[0063] The above description enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A method for manufacturing a three-dimensional developing glass display panel, characterized in that: The steps include: S1: Design grating pattern: Use computer-aided design software to design the required grating pattern, which includes periodically arranged microstructures such as lines, dots or other geometric shapes; S2: Convert the designed grating pattern into a photomask file; S3: preparing a photomask: using photolithography technology to prepare a photomask on a transparent substrate, the photomask having light-transmitting and light-impermeable areas corresponding to the designed grating pattern; S4: coating photoresist: coating a layer of photoresist evenly on the surface of the glass panel, the thickness of the photoresist being determined according to the required etching depth; S5: Exposure: Align the photomask to the glass panel and use ultraviolet light for exposure; During the exposure process, the light-transmitting areas on the photomask allow ultraviolet light to pass through, causing the photoresist to undergo a photochemical reaction and form a latent image; S6: Development: placing the exposed glass panel into a developer to remove the photoresist in the unexposed area to expose the glass surface; S7: Acid etching: placing the developed glass panel into an acid etching solution, and the acid etching solution etches the exposed glass surface to form a microstructure corresponding to the grating pattern; controlling the etching time and the acid concentration to obtain the desired etching depth and surface roughness; S8: Cleaning and post-processing: Take the etched glass panel out of the acid etching solution, clean it with deionized water to remove the residual acid and photoresist; perform post-processing on the glass panel, such as polishing, cleaning, and drying, to enhance its optical properties and mechanical strength.
2. The method for manufacturing a three-dimensional developing glass display panel according to claim 1, characterized in that: In step S1, the period of the grating is usually set in the range of 10 to 100 microns, and the specific value depends on the target display effect and optical performance requirements; the width and spacing ratio of the lines or dots needs to be controlled between 1:1 and 1:5 to ensure the diffraction efficiency of the grating; the depth design of the microstructure needs to be combined with the feasibility of the subsequent etching process, and is generally recommended to be 0.5 to 10 microns; during the design process, a high-resolution image file needs to be exported with a resolution of not less than 2400 DPI to ensure the clarity and accuracy of the pattern edge.
3. The method for manufacturing a three-dimensional developing glass display panel according to claim 1, characterized in that: In step S2, the file format is usually GDSII or DXF to ensure compatibility with the lithography machine; the pattern edge needs to be corrected for optical proximity effect, and the compensation value is set to 0.1 to 0.5 microns to reduce the diffraction error during exposure; when the file is color-separated, it is necessary to distinguish between the light-transmitting area and the light-shielding area, and the material of the light-shielding area is chromium or iron oxide.
4. The method for manufacturing a three-dimensional developing glass display panel according to claim 1, characterized in that: In the step S3, the photomask substrate is made of high-purity quartz or borosilicate glass with a thickness of 1 to 3 mm; a chromium layer with a thickness of 80 to 120 nanometers is deposited on the substrate as a light-shielding material by magnetron sputtering; after coating the photoresist, a laser direct writing or electron beam lithography machine is used for pattern transfer, and the exposure wavelength is 365 nanometers or 248 nanometers; a tetramethylammonium hydroxide solution is used as a developer with a concentration of 2.38% and a development time of 30 to 60 seconds; when etching the chromium layer, a ferric chloride solution or dry plasma etching is used, and finally defects are detected by an optical microscope or a scanning electron microscope to ensure that the line width error is less than ±5%.
5. The method for manufacturing a three-dimensional developing glass display panel according to claim 1, characterized in that: In the step S4, the thickness of the glue layer is controlled by the spin coating speed, the rotation speed is set to 1000 to 5000 rpm, the time is 30 to 60 seconds, and the final thickness is 1 to 10 microns; before applying the glue, the glass panel needs to be plasma cleaned with a power of 100 to 300 watts and a time of 2 to 5 minutes to improve adhesion; after applying the glue, a pre-baking treatment is required with a temperature of 90 to 120 degrees Celsius and a time of 5 to 30 minutes to remove the solvent and solidify the glue layer.
6. The method for manufacturing a three-dimensional developing glass display panel according to claim 1, characterized in that: In the step S5, the exposure wavelength is selected to be 365 nanometers or 405 nanometers, the light intensity is 10 to 50 milliwatts per square centimeter, and the exposure time is set to 10 to 300 seconds according to the sensitivity of the photoresist; during the exposure process, the ambient temperature needs to be maintained at 20 to 25 degrees Celsius and the humidity is lower than 50% to prevent the adhesive layer from absorbing moisture and deforming; a contact or proximity exposure mode is adopted, and the distance between the mask and the glass panel is 10 to 50 microns.
7. The method for manufacturing a three-dimensional developing glass display panel according to claim 1, characterized in that: In step S6, a 0.4% to 1% sodium hydroxide solution is used for the positive photoresist, and a special organic solvent such as propylene glycol methyl ether acetate is used for the negative photoresist; the developing time is usually 30 to 180 seconds, and the unexposed area is removed by immersion or spraying; after development, it is necessary to rinse with deionized water immediately, the water temperature is 20 to 25 degrees Celsius, and the rinsing time is 30 to 60 seconds; the end point of development can be judged by observing the edge clarity of the glue layer under a microscope, and the residual glue debris needs to be blown away with a nitrogen gun.
8. The method for manufacturing a three-dimensional developing glass display panel according to claim 1, wherein: In step S7, the etching solution is a mixed solution of hydrofluoric acid and nitric acid, the concentration of hydrofluoric acid is 5% to 20%, and the concentration of nitric acid is 5% to 10%; the etching temperature is controlled at 20 to 40 degrees Celsius, the time is 1 to 30 minutes, and the etching rate is about 0.1 to 1 micron / minute; the etching uniformity is improved by magnetic stirring or ultrasonic assistance, and the stirring speed is 100 to 500 rpm; the etching depth is monitored in real time by a laser interferometer, and the surface roughness must be less than 50 nanometers.
9. The method for manufacturing a three-dimensional developing glass display panel according to claim 1, characterized in that: In the step S8, the etched glass panel needs to be ultrasonically cleaned with deionized water three times, each time for 5 to 10 minutes, with a frequency of 40 kHz; the residual acid solution is neutralized with 0.1% ammonia water, and then dehydrated with anhydrous ethanol; polishing adopts a chemical mechanical polishing process, and the polishing liquid is a silica or cerium oxide suspension with a particle size of 0.1 to 1 micron and a pressure of 0.1 to 0.5 MPa; drying is carried out in a clean oven at a temperature of 60 to 100 degrees Celsius and a time of 10 to 30 minutes; finally, the transmittance is detected by a spectrophotometer to ensure that it reaches more than 90%, and the surface strength is verified by a Mohs hardness test.