Exposure method and exposure system of direct writing imaging exposure equipment

Abstract

The present invention discloses an exposure method and exposure system for a direct-write imaging exposure device. The method includes: obtaining the actual positions of at least two first marking points on a first surface; determining the first surface's displacement based on the deviation between the actual position of each first marking point and the theoretical position of each first marking point, and performing exposure of the first surface using preset exposure conditions when the first surface is not displaced; after the first surface is exposed, obtaining the actual positions of at least two second marking points on a second surface; determining the second surface's displacement based on the deviation between the actual position of each second marking point and the theoretical position of each second marking point; and when the second surface is not displaced, determining the displacement of a plate to be exposed based on the deviation between the actual position of each first marking point and the actual position of each second marking point, and performing exposure of the second surface using preset exposure conditions when the plate to be exposed is not displaced. Utilizing the above method, the alignment accuracy and exposure yield of the plate to be exposed are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of exposure of direct-write imaging exposure equipment, and in particular to an exposure method and an exposure system of direct-write imaging exposure equipment. Background Art

[0002] In electronics manufacturing, laser direct imaging (LDI) equipment exposes the substrate to be exposed. It uses lasers to precisely transfer the design pattern onto the substrate, laying the foundation for subsequent processes. This process requires extremely high precision, which directly affects the performance and reliability of the circuit board.

[0003] In double-sided exposure, alignment accuracy is a key indicator affecting exposure quality. This method determines board misalignment by comparing the actual measured values ​​of the mark points on one side with the theoretical values. However, this method only considers the misalignment of one side. This can lead to situations where the alignment accuracy requirements for both the front and back sides are within the deviation range, but one side has positive misalignment while the other two have negative misalignment. This creates a large distance between the actual position points on the two sides, resulting in reduced alignment accuracy. Ultimately, the exposure yield of the exposed board is very low, wasting the exposed board and reducing production capacity. Summary of the Invention

[0004] The present invention provides an exposure method and an exposure system for a direct-write imaging exposure device, which can confirm the deviation of the first side and the second side of a plate to be exposed, thereby determining the deviation of the plate to be exposed, and then expose the second side when the plate to be exposed is not deflected, thereby improving the alignment accuracy and exposure yield of the plate to be exposed, saving plates and reducing costs.

[0005] In a first aspect, the present invention provides an exposure method for a direct-write imaging exposure device, wherein a plate to be exposed in the exposure device includes a first surface and a second surface facing away from each other in a thickness direction, and the first surface and the second surface are respectively provided with first and second marking points aligned with each other, comprising:

[0006] Obtaining actual positions of at least two first marking points on the first surface;

[0007] Determining the deviation of the first surface according to the deviation between the actual position of each first marking point and the theoretical position of each first marking point, and performing exposure of the first surface using a preset exposure condition when the first surface is not deflected;

[0008] After the exposure of the first surface is completed, obtaining actual positions of at least two second marking points on the second surface;

[0009] Determining the position deviation of the second surface according to the deviation between the actual position of each second marking point and the theoretical position of each second marking point;

[0010] When the second side is not deflected, the deflection of the plate to be exposed is determined based on the deviation between the actual position of each first marking point and the actual position of each second marking point, so that the second side can be exposed using the preset exposure conditions when the plate to be exposed is not deflected.

[0011] Optionally, determining the position deviation of the plate to be exposed based on the deviation between the actual position of each first marking point and the actual position of each second marking point includes:

[0012] Determining deformation of the first surface and the second surface according to the actual position of each first marking point and the actual position of each second marking point;

[0013] When the deformation of the first surface and the second surface meets a preset deformation condition, determining the position offset of the first surface and the second surface according to the actual position of each first marking point and the actual position of each second marking point;

[0014] When there is no positional offset between the first surface and the second surface, it is determined that the plate to be exposed is not deviated.

[0015] Optionally, the preset deformation condition includes the first surface and the second surface deforming in the same proportion;

[0016] Determining deformation of the first surface and the second surface according to the actual position of each first marking point and the actual position of each second marking point includes:

[0017] Determining a first expansion / contraction value between the first surfaces and a second expansion / contraction value between the second surfaces according to actual positions of the first marking points and actual positions of the second marking points;

[0018] determining a first difference between the first expansion and contraction value and the second expansion and contraction value according to the first expansion and contraction value and the second expansion and contraction value;

[0019] When the first difference is within a first preset difference threshold range, it is determined that the first surface and the second surface are deformed in the same proportion.

[0020] Optionally, determining a first expansion / contraction value between the first surfaces and a second expansion / contraction value between the second surfaces according to the actual positions of the first marking points and the actual positions of the second marking points includes:

[0021] Determining a first distance between the actual positions of the first marking points according to the actual positions of the first marking points to determine a first expansion / contraction value of the first surface;

[0022] According to the actual positions of the second marking points, a second distance between the actual positions of the second marking points is determined to determine the second expansion and contraction value of the second surface.

[0023] Optionally, the actual position of the first marking point includes a first transverse coordinate position in a first direction and a first longitudinal coordinate position in a second direction, and the actual position of the second marking point includes a second transverse coordinate position in the first direction and a second longitudinal coordinate position in the second direction, and the first direction and the second direction are perpendicular;

[0024] Determining a position offset between the first surface and the second surface according to an actual position of each first marking point and an actual position of each second marking point includes:

[0025] Determining, based on the actual positions of the first marking points and the actual positions of the second marking points, a second difference between a first transverse coordinate position of the actual position of the first marking points and a second transverse coordinate position of the actual position of the second marking points, a third difference between a first longitudinal coordinate position of the actual position of the first marking points and a second longitudinal coordinate position of the actual position of the second marking points, and a third distance between the actual positions of the first marking points and the actual positions of the second marking points;

[0026] When the second difference is within the second preset difference threshold range, the third difference is within the third preset difference threshold range, and the third distance is within the third preset distance threshold range, it is determined that no positional offset occurs between the first surface and the second surface.

[0027] Optionally, before determining the displacement of the first surface based on the deviation between the actual position of the first marking point and the theoretical position of the first marking point, and exposing the first surface using the preset exposure conditions when the first surface is not displaced, the method further includes:

[0028] Make sure the first side is not deformed.

[0029] Optionally, determining that the first surface is not deformed includes:

[0030] Collecting the actual positions of at least three third marking points on the first side of another plate to be exposed in the same batch;

[0031] Determining a fourth distance between the actual positions of the first marking points based on the actual positions of the first marking points, and determining a fifth distance between the actual positions of the third marking points based on the actual positions of the third marking points;

[0032] A fourth difference between the fourth distance and the fifth distance is determined based on the fourth distance and the fifth distance. When the fourth difference is within a fourth preset difference threshold range, it is determined that the first surface of the plate to be exposed is not deformed.

[0033] Optionally, the deviation includes a jog deviation and a spacing deviation; the actual position of the first marking point includes a first transverse coordinate position in a first direction and a first longitudinal coordinate position in a second direction, the first direction and the second direction being perpendicular;

[0034] Determining the position deviation of the first surface according to the deviation between the actual position of each first marking point and the theoretical position of each first marking point includes:

[0035] Determine, based on the actual position of each first marking point and the theoretical position of each first marking point, a fitted theoretical position of each first marking point formed by fitting the actual position of each first marking point and the theoretical position of each first marking point; the fitted theoretical position of the first marking point includes a first fitted transverse coordinate position in the first direction and a first fitted longitudinal coordinate position in the second direction;

[0036] Determine, based on the actual position of each first marking point and the fitted theoretical position of each first marking point, a fifth difference between the first lateral position coordinate of the actual position of each first marking point and the first fitted lateral coordinate position of the fitted theoretical position of each first marking point, a sixth difference between the first longitudinal position coordinate of the actual position of each first marking point and the first fitted longitudinal coordinate position of the fitted theoretical position of each first marking point, and a sixth distance between the actual position of each first marking point and the fitted theoretical position of each first marking point;

[0037] When the fifth difference is within a fifth preset difference threshold range, the sixth difference is within a sixth preset difference threshold range, and the sixth distance is within a sixth preset distance threshold range, determining that no inching deviation occurs on the first surface;

[0038] Determining a seventh distance between the fitted theoretical positions of the first marking points based on the fitted theoretical positions of the first marking points, and determining an eighth distance between the actual positions of the first marking points based on the actual positions of the first marking points;

[0039] A seventh difference between the seventh distance and the eighth distance is determined. When the seventh difference is within a seventh preset difference threshold range, it is determined that no spacing deviation occurs on the first surface, thereby determining that the first surface is not deviated.

[0040] Optionally, the deviation includes a jog deviation and a spacing deviation; the actual position of the second marking point includes a second transverse coordinate position in the first direction and a second longitudinal coordinate position in the second direction, the first direction and the second direction being perpendicular;

[0041] Determine the position deviation of the second surface according to the deviation between the actual position of each second marking point and the theoretical position of each second marking point, including:

[0042] Determine, based on the actual position of each second marking point and the theoretical position of each second marking point, a fitted theoretical position of each second marking point formed by fitting the actual position of each second marking point and the theoretical position of each second marking point; the fitted theoretical position of the second marking point includes a second fitted transverse coordinate position in the first direction and a second fitted longitudinal coordinate position in the second direction;

[0043] Determine, based on the actual position of each second marking point and the fitted theoretical position of each second marking point, an eighth difference between the second lateral position coordinate of the actual position of each second marking point and the second fitted lateral coordinate position of the fitted theoretical position of each second marking point, a ninth difference between the second longitudinal position coordinate of the actual position of each second marking point and the second fitted longitudinal coordinate position of the fitted theoretical position of each second marking point, and a ninth distance between the actual position of each second marking point and the fitted theoretical position of each second marking point;

[0044] When the eighth difference value is within an eighth preset difference threshold range, the ninth difference value is within a ninth preset difference threshold range, and the ninth distance is within a ninth preset distance threshold range, determining that no inching deviation occurs on the second surface;

[0045] Determine a tenth distance between the fitted theoretical positions of the second marking points based on the fitted theoretical positions of the second marking points, and determine an eleventh distance between the actual positions of the second marking points based on the actual positions of the second marking points;

[0046] A tenth difference between the tenth distance and the eleventh distance is determined. When the tenth difference is within a tenth preset difference threshold range, it is determined that no spacing deviation occurs on the second surface, thereby determining that the second surface is not deviated.

[0047] In a second aspect, the present invention provides an exposure system for a direct-write imaging exposure device, comprising an image acquisition module, an exposure module, and a control module; the control module is used to execute the exposure method of the direct-write imaging exposure device.

[0048] The technical solution of the present invention obtains the actual positions of at least two first marking points on the first surface; determines the offset of the first surface based on the deviation between the actual position of each first marking point and the theoretical position of each first marking point, and performs exposure of the first surface using preset exposure conditions when the first surface is not offset; after the exposure of the first surface is completed, obtains the actual positions of at least two second marking points on the second surface; determines the offset of the second surface based on the deviation between the actual position of each second marking point and the theoretical position of each second marking point; when the second surface is not offset, determines the offset of the plate to be exposed based on the deviation between the actual position of each first marking point and the actual position of each second marking point, so as to perform exposure of the second surface using preset exposure conditions when the plate to be exposed is not offset. Utilizing the above method, by confirming the offset of the first and second surfaces of the plate to be exposed, thereby determining the offset of the first and second surfaces of the plate to be exposed, and then exposing the second surface when the plate to be exposed is not offset, the alignment accuracy and exposure yield of the plate to be exposed are improved, plate materials are saved, and costs are reduced.

[0049] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0051] Figure 1 A flowchart of an exposure method of a direct-write imaging exposure device provided in Embodiment 1 of the present invention;

[0052] Figure 2 A flow chart of an exposure method of a direct-write imaging exposure device provided in Embodiment 2 of the present invention;

[0053] Figure 3 A flowchart of an exposure method for a direct-write imaging exposure device provided in Embodiment 3 of the present invention;

[0054] Figure 4 This is a structural diagram of an electronic device provided in Example 5 of the present invention. DETAILED DESCRIPTION

[0055] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0056] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0057] Example 1

[0058] Figure 1This is a flow chart of an exposure method for a direct-write imaging exposure device provided in a first embodiment of the present invention. This embodiment is applicable to confirming the misalignment between the first and second surfaces of a sheet to be exposed to improve the alignment accuracy of the sheet to be exposed. The method can be performed by an exposure system of the direct-write imaging exposure device. The sheet to be exposed in the direct-write imaging exposure device includes a first surface and a second surface that face away from each other in the thickness direction. The first and second surfaces are each provided with a first marking point and a second marking point that are aligned with each other. Typically, when setting the first marking points on the first surface, at least two first marking points are provided to ensure accuracy. When there are two first marking points, the two first marking points are located at the center of the exposure device and at any corner of the exposure device, respectively. When there are three first marking points, the three first marking points are located at any three corners of the sheet to be exposed. Similarly, when there are two second marking points on the second surface, the two second marking points are located at the center of the exposure device and at any corner of the exposure device, respectively. When there are three second marking points on the second surface, the three second marking points are located at any three corners of the exposure device, respectively, and each first marking point is aligned with a second marking point. In addition, the substrate to be exposed by the direct-write imaging exposure device may include various semiconductor and non-semiconductor exposure materials requiring exposure operations, such as PCBs, wafers, flexible circuit boards (FPCs), and flat panel displays (FPDs). For simplicity of explanation, this application will subsequently describe the substrate to be exposed by the direct-write imaging exposure device as a PCB. When setting the first and second marking points, a laser process can be used to punch holes at preset edge positions to form through-holes, with the locations at both ends of the through-holes serving as the first and second marking points. Alternatively, a laser marking device can be used to mark the first surface of the PCB before placing it on the board to form the first marking points. The PCB board can then be placed on the board and the first surface aligned. After alignment, marking can be performed on the second surface to form the second marking points. The specific shape can be determined based on actual conditions and is not limited here. Common shapes of the first and second marking points include graphics or graphic combinations. Graphics include, but are not limited to, circles, triangles, rectangles, or crosses. Graphic combinations include combinations formed by graphics. Combinations include, but are not limited to, a herringbone combination, a four-petal plum blossom combination, or a pentagonal combination. When identifying and locating the first marker point and the second marker point, in addition to obtaining the actual position of their center point, the actual graphic parameters of the remaining position points except the center point can also be obtained. Specifically, if the first marker point and the second marker point are solid circles, the specific position (such as the center of the circle) and radius value of each first marker point and the second marker point can be obtained after positioning.In this embodiment, a cross has twelve vertices, eight sides, and one center point; a rectangle has four vertices, four sides, and one center point; a circle has a center point and a radius; a combination of circles in a Chinese-shaped triangle includes, in addition to the radius and center position of the three circles, the distance between the centers of the three circles; a combination of crosses in a four-petal plum blossom shape includes, in addition to the actual graphic parameters of the cross, the distance between the center points of the five crosses and the distance between the vertices of the five crosses. The specific parameters can be determined according to actual conditions and are not limited here. For example. Figure 1 As shown, the method includes:

[0059] S110: Acquire actual positions of at least two first marking points on a first surface.

[0060] Specifically, after the first marker is determined, the actual positions of at least two first markers on the first surface, captured by an image acquisition module or other device, are acquired. If there are two first markers, the actual positions of the two first markers are acquired; if there are three first markers, the actual positions of the three first markers are acquired; if there are four first markers, the actual positions of the four first markers are acquired. The actual position of the first marker may be an actual coordinate position including a horizontal coordinate and a vertical coordinate.

[0061] S120. Determine the displacement of the first surface according to the deviation between the actual position of each first marking point and the theoretical position of each first marking point, and execute the exposure procedure of the first surface using the preset exposure conditions when the first surface is not displaced.

[0062] Specifically, after collecting the actual positions of at least two first marking points on the first side, since each first marking point has a corresponding initial theoretical position and an actual position of the first marking point after marking, the deviation of the first marking point's actual position and the theoretical position can be used to determine the first side's displacement. In this embodiment, if the actual position of the first marking point is determined to be within a preset deviation range of the theoretical position of the first marking point, it can be determined that the first side has not been displaced. The preset deviation range can be determined based on actual conditions and is not limited here. In addition, marking point displacement is often caused by positional deviation or deformation of the exposed sheet. Therefore, the JEPE value calculation method can be used to fit the actual position and theoretical position of the first marking point to form a new fitted theoretical position of the first marking point. Based on the deviation between the fitted theoretical position and the actual position of the first marking point, if the deviation is within the preset deviation range, it can be determined that the first side has not been displaced. The JE value can be used to determine the placement information of the PCB board, and the PE value can be used to determine the deformation information of the PCB board. At the same time, the above two methods can also be used to simultaneously determine the deviation of the first surface. When both conditions are met, it can be determined that the first surface has not been deflected. This is not limited here. When it is determined that the first surface has not been deflected, it indicates that the first surface meets the exposure requirements, and then the exposure program is run to instruct the exposure module to use the preset exposure conditions to expose the first surface. The preset exposure conditions can be actually determined according to the actual exposure requirements and are not limited here. For example, according to the deviation, after the exposure pattern is transformed, the deformed exposure pattern is transferred to the PCB board to be exposed. The exposure pattern transformation methods include scaling, mirroring, local deformation, rotation or inversion.

[0063] S130 . After the exposure of the first surface is completed, obtain the actual positions of at least two second marking points on the second surface.

[0064] Specifically, after exposing the first side, the PCB is flipped over to expose the second side. Before exposing the second side, it is necessary to determine the offset of the second side and the relative displacement between the theoretical position of the PCB to be exposed and the second side. At this point, the actual positions of at least two second marking points on the second side, captured by an image acquisition module or other device, can be obtained. If there are three second marking points, the actual positions of the three second marking points are obtained. If there are four second marking points, the actual positions of the four second marking points are obtained. The number of second marking points is the same as that of the first marking points, and the actual positions of the second marking points can also be actual coordinate positions including horizontal and vertical coordinates.

[0065] S140 , determining the position deviation of the second surface according to the deviation between the actual position of each second marking point and the theoretical position of each second marking point.

[0066] Specifically, after collecting the actual positions of at least three second marking points on the second surface, since each second marking point has a corresponding initial theoretical position and the actual position of the second marking point after marking is completed, the deviation between the actual position of each second marking point and the theoretical position of each second marking point is used to determine the displacement of the second surface of the PCB board. In this embodiment, when it is determined that the actual position of the second marking point is within the preset deviation range of the theoretical position of the second marking point, it can be determined that the first surface has not been displaced, wherein the preset deviation range can be determined according to the actual situation and is not limited here. In addition, similar to the first surface, the JEPE value calculation method can also be used to determine the displacement of the second surface. At the same time, the above two methods can also be used to simultaneously determine the displacement of the second surface. When both conditions are met, it can be determined that the second surface has not been displaced.

[0067] S150. When the second side is not deflected, the deflection of the plate to be exposed is determined based on the deviation between the actual position of each first marking point and the actual position of each second marking point, so as to perform exposure of the second side using the preset exposure conditions when the plate to be exposed is not deflected.

[0068] Specifically, when determining that the second surface has not been offset, it is also necessary to determine the relative deviation between the first surface and the second surface. In this embodiment, the deformation and positional offset of the first surface and the second surface can be determined based on the deviation between the actual position of each first marking point and the actual position of each corresponding second marking point. When the deformation of the first surface and the second surface meets the preset deformation condition and the first surface and the second surface have not been offset, indicating that the PCB board has not been offset, the second surface can be exposed using the preset exposure conditions to ensure that the exposure pattern is accurately transferred to the PCB board and improve the exposure accuracy of the PCB board. The preset exposure conditions for exposing the second surface here can be the same as or different from the preset exposure conditions for exposing the first surface. When different, this includes that the preset pattern for exposing the second surface is different from that of the first surface, and that the exposure pattern transformation method for the second surface is different from that of the first surface.

[0069] The technical solution of the embodiment of the present invention is as follows: obtaining the actual positions of at least two first marking points on the first surface; determining the deviation of the first surface according to the deviation between the actual position of each first marking point and the theoretical position of each first marking point, and performing exposure of the first surface using preset exposure conditions when the first surface is not deflected; after the exposure of the first surface is completed, obtaining the actual positions of at least two second marking points on the second surface; determining the deviation of the second surface according to the deviation between the actual position of each second marking point and the theoretical position of each second marking point; when the second surface is not deflected, determining the deviation of the exposure device according to the deviation between the actual position of each first marking point and the actual position of each second marking point, so as to perform exposure of the second surface using preset exposure conditions when the exposure device is not deflected. By using the above method, the deviation of the first surface and the second surface of the plate to be exposed are determined respectively, and the relative offset between the first surface and the second surface is confirmed, thereby determining the deviation of the plate to be exposed. Compared with the existing method of only confirming the deviation of the first surface and the second surface, which still leads to low alignment accuracy when the first surface and the second surface are both within the preset deviation range, the present application improves the alignment accuracy and exposure yield of the plate to be exposed by confirming the relative offset between the first surface and the second surface, and when the first surface or the second surface is deviated, the plate is withdrawn, the plate to be exposed is re-placed, and then re-inspected and exposed, thereby saving plates and reducing costs.

[0070] Example 2

[0071] Figure 2 This is a flow chart of an exposure method for a direct-write imaging exposure device provided in the second embodiment of the present invention. The specific implementation method of determining the deviation of the plate to be exposed based on the deviation between the actual position of each first marking point and the actual position of each second marking point in this embodiment and the above-mentioned embodiment S150 is as follows:

[0072] Determining deformation of the first surface and the second surface according to the actual position of each first marking point and the actual position of each second marking point;

[0073] When the deformation of the first surface and the second surface meets a preset deformation condition, determining the position offset of the first surface and the second surface according to the actual position of each first marking point and the actual position of each second marking point;

[0074] When there is no positional offset between the first surface and the second surface, it is determined that the plate to be exposed is not deviated.

[0075] For details not yet provided in this embodiment, please refer to the above embodiments and will not be described again here.

[0076] like Figure 2 As shown, the method includes:

[0077] S210: Acquire actual positions of at least two first marking points on a first surface.

[0078] The actual position of the first marking point includes a first horizontal coordinate position in a first direction and a first vertical coordinate position in a second direction, and the first direction and the second direction are perpendicular.

[0079] S220: Determine the displacement of the first surface according to the deviation between the actual position of each first marking point and the theoretical position of each first marking point, and perform exposure of the first surface using a preset exposure condition when the first surface is not displaced.

[0080] S230: After the exposure of the first surface is completed, obtain the actual positions of at least two second marking points on the second surface.

[0081] The actual position of the second marking point includes a second horizontal coordinate position in the first direction and a second vertical coordinate position in the second direction.

[0082] S240: Determine the position deviation of the second surface according to the deviation between the actual position of each second marking point and the theoretical position of each second marking point.

[0083] S250: When the second surface is not deflected, determine the deformation of the first surface and the second surface according to the actual position of each first marking point and the actual position of each second marking point.

[0084] Among them, this step can be further refined as follows: according to the actual position of each first marking point and the actual position of each second marking point, determine the first expansion and contraction value between the first surfaces and the second expansion and contraction value of the second surface; according to the first expansion and contraction value and the second expansion and contraction value, determine the first difference between the first expansion and contraction value and the second expansion and contraction value; when the first difference is within the first preset difference threshold range, determine that the first surface and the second surface are deformed in the same proportion.

[0085] The expansion / shrinkage value refers to the dimensional change of the PCB during the lamination process due to the influence of material properties and process parameters. Under normal circumstances, when the first and second sides of the PCB undergo the same exposure process, the expansion / shrinkage values ​​of the first and second sides are the same, that is, the first and second sides deform in the same proportion.

[0086] Specifically, when confirming the misalignment of the PCB board, to ensure exposure accuracy and improve exposure yield, it is also necessary to confirm the offset between the first and second surfaces. This offset includes confirmation of deformation and positional offset. The deformation of the first and second surfaces is first confirmed. In this embodiment, a first distance between the actual positions of each first marking point on the first surface is determined. Once this first distance is determined, this first distance represents the first expansion / contraction value of the first surface. After the first expansion / contraction value is determined, a second distance between the actual positions of each second marking point aligned with the first marking point is calculated. This second distance represents the second expansion / contraction value of the second surface. After determining the first and second expansion / contraction values, a difference calculation is performed between the first and second expansion / contraction values. Specifically, the first distance is subtracted from the second distance to obtain a first difference. A determination is then made as to whether the first difference is within a first preset difference threshold. If the first difference is within the first preset difference threshold, it indicates that the deformation of the first and second surfaces is the same, meaning that the first and second surfaces have undergone the same proportional deformation, which can be either proportional expansion or contraction, or both surfaces have zero deformation. Because the first and second surfaces of the PCB are exposed using the same exposure process, the deformation of the first and second surfaces should normally be the same. When there are three first marking points and three second marking points, the first difference needs to be determined three times. After the deformation of the actual positions of the two first marking points and the actual positions of the two aligned second marking points is determined, the deformation between the actual positions of the remaining two first marking points on the first side of the PCB board and the actual positions of the remaining second marking points on the second side needs to be determined. When it is determined after three calculations that the first difference is within the first preset difference threshold range, it indicates that the first side and the second side have deformed in the same proportion and have reached the preset deformation condition. At this time, the position offset of the first side and the second side is confirmed. When it is determined that the first difference is not within the first preset difference threshold range, if the first difference is greater than the upper limit of the first preset difference threshold range, it indicates that the difference in expansion and contraction between the first side and the second side is too large, and the deformation of the first side and the second side is different, then the confirmation of the exposure of the second side of the PCB board is stopped and the board removal process is carried out.

[0087] S260: When the deformation of the first surface and the second surface meets a preset deformation condition, determine the position offset of the first surface and the second surface according to the actual position of each first marking point and the actual position of each second marking point.

[0088] Among them, this step can be further refined as follows: according to the actual position of each first marking point and the actual position of each second marking point, determine the second difference between the first horizontal coordinate position of the actual position of each first marking point and the second horizontal coordinate position of the actual position of each second marking point, the third difference between the first longitudinal coordinate position of the actual position of each first marking point and the second longitudinal coordinate position of the actual position of each second marking point, and the third distance between the actual position of each first marking point and the actual position of each second marking point; when the second difference is within the second preset difference threshold range, the third difference is within the third preset difference threshold range, and the third distance is within the third preset distance threshold range, it is determined that there is no position offset between the first surface and the second surface.

[0089] Specifically, after the deformation of the first and second surfaces is determined, the position offset needs to be determined. That is, when confirming the position offset of the first and second surfaces, the first horizontal coordinate position of the actual position of each first marking point and the actual position of the second marking point can be subtracted from the second horizontal coordinate position of the actual position of each second marking point aligned with it to obtain a second difference. It is also necessary to subtract the first vertical coordinate position of the actual position of each first marking point from the second vertical coordinate position of the actual position of each second marking point aligned with it to obtain a third difference. After calculating the second and third differences, for accurate determination, a third distance is further calculated between the actual position of each first marking point and the actual position of each second marking point aligned with it. After calculating the third distance, it is determined whether the second difference is within the second preset difference threshold range, whether the third difference is within the third preset difference threshold range, and whether the third distance is within the third preset distance threshold range. If it is determined that the second difference is within the second preset difference threshold range, the third difference is within the third preset difference threshold range, and the third distance is within the third preset distance threshold range, it indicates that the actual positions of the first marking points on the first side and the actual positions of the second marking points on the second side are aligned, there is no positional offset between the first and second sides, and the PCB board is not offset. If it is determined that the second difference is outside the second preset difference threshold range, or the third difference is outside the third preset difference threshold range, or the third distance is outside the third preset distance threshold range, it indicates that the actual positions of the first marking points on the first side and the actual positions of the second marking points on the second side are not aligned, there is a positional offset between the first and second sides, and the second side will not be exposed, and the board removal process will be executed.

[0090] Similarly, when there are three first and second marking points, the second difference, third difference, and third distance must be determined three times. Only when it is determined that all three second differences, three third differences, and three third distances meet the corresponding preset conditions is it determined that there is no positional offset between the first and second surfaces. If at least one of the second difference, third difference, or third distance does not meet the corresponding preset condition, it indicates that there is a positional offset between the first and second surfaces, and the second surface is not exposed.

[0091] S270: When there is no positional offset between the first surface and the second surface, determine that the plate to be exposed is not offset, and perform exposure of the second surface using a preset exposure condition when the plate to be exposed is not offset.

[0092] Specifically, if it is determined that there is no positional offset between the first and second surfaces, indicating that the PCB board is not offset, the second surface can be exposed using an exposure process under preset exposure conditions. The preset exposure conditions for the second surface can be the same as or different from those for the first surface, depending on actual circumstances and are not limited herein.

[0093] The technical solution of the embodiment of the present invention is as follows: when the second surface is not deflected, the deformation of the first surface and the second surface is determined according to the actual position of each first marking point and the actual position of each second marking point; when the deformation of the first surface and the second surface meets the preset deformation condition, the position offset of the first surface and the second surface is determined according to the actual position of each first marking point and the actual position of each second marking point; when the first surface and the second surface are not deflected, it is determined that the PCB board is not deflected, so that the second surface is exposed using the preset exposure conditions when the PCB board is not deflected. Using the above method, the deformation of the first surface and the second surface is determined according to the expansion and shrinkage value, and the position offset of the first surface and the second surface is determined according to the actual position of each first marking point and the actual position of each second marking point. The second surface is exposed only when it is determined that the first surface and the second surface are deformed in the same proportion and no position offset occurs. Compared with the JEPE value which uses the fitted theoretical position coordinates to calculate the deformation, this embodiment uses the expansion and shrinkage value to directly compare the coordinate information of the actual marking points of the first surface and the second surface before exposing the second surface, so the data acquisition is more accurate, and the deformation of the plate on the second surface is directly determined by the expansion and shrinkage value. Therefore, the position offset and deformation amount of the second surface are clearer, and the exposure pattern conversion when the second surface is exposed is more accurate, thereby improving the alignment accuracy of the plate to be exposed and improving production efficiency. It can timely discover potential problems during the exposure process and prompt the staff to make corresponding processing operations to avoid bringing error terms into the exposure process, resulting in unqualified plates to be exposed. In addition, the expansion and contraction values ​​can be used to determine whether the first surface and the second surface deform in the same proportion. In this way, the deviation thresholds of the first surface and the second surface can be increased in actual production, thereby greatly reducing the defective rate of the plate to be exposed, allowing more plate to be exposed to be used, saving plate materials, and improving the exposure yield of the plate to be exposed.

[0094] Example 3

[0095] Figure 3 This is a flow chart of an exposure method for a direct-write imaging exposure device provided in a third embodiment of the present invention. This embodiment adds the following steps to S120 in the above embodiment, which determines the deviation of the first surface based on the deviation between the actual position of the first marking point and the theoretical position of the first marking point, and performs exposure of the first surface using preset exposure conditions when the first surface is not deviated:

[0096] Make sure the first side is not deformed.

[0097] Furthermore, the specific implementation method of S120, determining the position deviation of the first surface according to the deviation between the actual position of the first marking point and the theoretical position of the first marking point, is refined as follows:

[0098] Determine, based on the actual position of each first marking point and the theoretical position of each first marking point, a fitted theoretical position of each first marking point formed by fitting the actual position of each first marking point and the theoretical position of each first marking point; the fitted theoretical position of the first marking point includes a first fitted transverse coordinate position in the first direction and a first fitted longitudinal coordinate position in the second direction;

[0099] Determine, based on the actual position of each first marking point and the fitted theoretical position of each first marking point, a fifth difference between the first lateral position coordinate of the actual position of each first marking point and the first fitted lateral coordinate position of the fitted theoretical position of each first marking point, a sixth difference between the first longitudinal position coordinate of the actual position of each first marking point and the first fitted longitudinal coordinate position of the fitted theoretical position of each first marking point, and a sixth distance between the actual position of each first marking point and the fitted theoretical position of each first marking point;

[0100] When the fifth difference is within a fifth preset difference threshold range, the sixth difference is within a sixth preset difference threshold range, and the sixth distance is within a sixth preset distance threshold range, determining that no inching deviation occurs on the first surface;

[0101] Determining a seventh distance between the fitted theoretical positions of the first marking points based on the fitted theoretical positions of the first marking points, and determining an eighth distance between the actual positions of the first marking points based on the actual positions of the first marking points;

[0102] A seventh difference between the seventh distance and the eighth distance is determined. When the seventh difference is within a seventh preset difference threshold range, it is determined that no spacing deviation occurs on the first surface, thereby determining that the first surface is not deviated.

[0103] Furthermore, the specific implementation method of S140, determining the position deviation of the second surface according to the deviation between the actual position of each second marking point and the theoretical position of each second marking point, is refined as follows:

[0104] Determine, based on the actual position of each second marking point and the theoretical position of each second marking point, a fitted theoretical position of each second marking point formed by fitting the actual position of each second marking point and the theoretical position of each second marking point; the fitted theoretical position of the second marking point includes a second fitted transverse coordinate position in the first direction and a second fitted longitudinal coordinate position in the second direction;

[0105] Determine, based on the actual position of each second marking point and the fitted theoretical position of each second marking point, an eighth difference between the second lateral position coordinate of the actual position of each second marking point and the second fitted lateral coordinate position of the fitted theoretical position of each second marking point, a ninth difference between the second longitudinal position coordinate of the actual position of each second marking point and the second fitted longitudinal coordinate position of the fitted theoretical position of each second marking point, and a ninth distance between the actual position of each second marking point and the fitted theoretical position of each second marking point;

[0106] When the eighth difference value is within an eighth preset difference threshold range, the ninth difference value is within a ninth preset difference threshold range, and the ninth distance is within a ninth preset distance threshold range, determining that no inching deviation occurs on the second surface;

[0107] Determine a tenth distance between the fitted theoretical positions of the second marking points based on the fitted theoretical positions of the second marking points, and determine an eleventh distance between the actual positions of the second marking points based on the actual positions of the second marking points;

[0108] A tenth difference between the tenth distance and the eleventh distance is determined. When the tenth difference is within a tenth preset difference threshold range, it is determined that no spacing deviation occurs on the second surface, thereby determining that the second surface is not deviated.

[0109] For details not yet provided in this embodiment, please refer to the above embodiments and will not be described again here.

[0110] like Figure 3 As shown, the method includes:

[0111] S310: Determine that the first surface is not deformed.

[0112] Among them, this step can be further refined as follows: collecting the actual positions of at least three third marking points on the first side of another plate to be exposed in the same batch; determining the fourth distance between the actual positions of each first marking point based on the actual position of each first marking point, and determining the fifth distance between the actual positions of each third marking point based on the actual position of each third marking point; determining the fourth difference between the fourth distance and the fifth distance based on the fourth distance and the fifth distance, and when the fourth difference is within the fourth preset difference threshold range, determining that the first side of the plate to be exposed has not been deformed.

[0113] Specifically, before exposing the first surface, the deformation of the first surface needs to be determined. In this embodiment, because PCBs are not exposed individually but rather in batches using the same exposure process, the deformation of multiple PCBs in the same batch should be the same after undergoing the same process. Therefore, the deformation of the first surface can be determined using the remaining PCBs in the same batch. Specifically, another PCB from the same batch is taken and the actual positions of the third marking points on the first surface of that PCB are collected. The number of first and third marking points is the same, for example, three. The three first and third marking points are located in the same position on the first surface of different PCBs. After collecting the actual positions of the three third marking points, three fifth distances are calculated between the actual positions of the three third marking points. Furthermore, three fourth distances are calculated between the actual positions of the three first marking points. Each fourth distance represents the expansion or contraction value of the first surface of the PCB, and each fifth distance represents the expansion or contraction value of the first surface of another PCB. After calculating the fourth distance and the fifth distance, each fourth distance is subtracted from each fifth distance to obtain three fourth difference values. It is then determined whether each fourth difference value is within a fourth preset difference threshold range. When all three fourth difference values ​​are within the fourth preset difference threshold range, it indicates that the expansion and contraction of the first surfaces of the two PCB boards are the same, which means that the first surfaces of the PCB boards have not undergone unpredictable deformation, and the first surfaces can be subsequently exposed. When one of the three fourth difference values ​​is not within the fourth preset difference threshold range, it indicates that the expansion and contraction of the first surfaces of the two PCB boards are different, which means that the first surfaces of the PCB boards have undergone deformation, and the first surfaces cannot be subsequently exposed. By collecting the fourth difference values ​​and comparing them with boards from the same batch, it is possible to determine whether the PCB boards have undergone unpredictable deformation. If deformation occurs, the boards can be directly withdrawn without exposing the first surfaces, which can save board processing time and improve exposure efficiency.

[0114] S311. Obtain actual positions of at least two first marking points on the first surface.

[0115] The actual position of the first marking point includes a first horizontal coordinate position in a first direction and a first vertical coordinate position in a second direction, and the first direction and the second direction are perpendicular.

[0116] S312: Determine, based on the actual position of each first marking point and the theoretical position of each first marking point, a fitted theoretical position of each first marking point formed by fitting the actual position of each first marking point and the theoretical position of each first marking point.

[0117] The fitted theoretical position of the first marking point includes a first fitted transverse coordinate position in the first direction and a first fitted longitudinal coordinate position in the second direction.

[0118] Specifically, when determining the misalignment of the first surface, the JEPE value can be used for calculation. That is, the actual position of each first marking point and the theoretical position of each first marking point are used to fit the actual position of each first marking point with the theoretical position of each first marking point. Factors that may be considered during the fitting include, but are not limited to, the inspection results of the previous process, the PCB material, the photoresist material, and experience with previous exposure of similar PCBs. After fitting, a new fitted theoretical position of the first marking point is formed. When there are three first marking points, there are also three fitted theoretical positions of the first marking point. The fitted theoretical position of the first marking point includes a first fitted horizontal coordinate position in the first direction and a first fitted vertical coordinate position in the second direction.

[0119] S313. Based on the actual position of each first marking point and the fitted theoretical position of each first marking point, determine the fifth difference between the first horizontal position coordinate of the actual position of each first marking point and the first fitted horizontal coordinate position of the fitted theoretical position of each first marking point, the sixth difference between the first vertical position coordinate of the actual position of each first marking point and the first fitted longitudinal coordinate position of the fitted theoretical position of each first marking point, and the sixth distance between the actual position of each first marking point and the fitted theoretical position of each first marking point.

[0120] S314: When the fifth difference is within the fifth preset difference threshold range, the sixth difference is within the sixth preset difference threshold range, and the sixth distance is within the sixth preset distance threshold range, determine that no inching deviation occurs on the first surface.

[0121] Specifically, after determining the fitting theoretical position of each first marking point, it is necessary to determine the jog deviation (JE) of the first surface. That is, using the actual position of each first marking point and the fitted theoretical position of each first marking point, a fifth difference between the first horizontal position coordinate of the actual position of each first marking point and the first fitted horizontal coordinate position of the fitted theoretical position of each first marking point, a sixth difference between the first vertical position coordinate of the actual position of each first marking point and the first fitted vertical coordinate position of the fitted theoretical position of each first marking point, and a sixth distance between the actual position of each first marking point and the fitted theoretical position of each first marking point are calculated. When the number of first marking points is three, the calculated fifth difference, sixth difference, and sixth distance are also three. After determining the fifth difference, sixth difference, and sixth distance, it is determined whether each fifth difference is within a fifth preset difference threshold range, whether each sixth difference is within a sixth preset difference threshold range, and whether each sixth distance is within a sixth preset distance threshold range. When each fifth difference is within the fifth preset difference threshold range, each sixth difference is within the sixth preset difference threshold range, and each sixth distance is within the sixth preset distance threshold range, it indicates that the inching deviation of the first surface of the PCB board is within a normal deviation range, and it can be determined that no inching deviation occurs on the first surface. When at least one of the fifth difference values ​​is outside the fifth preset difference threshold range, or at least one of the sixth difference values ​​is within the sixth preset difference threshold range, or at least one of the sixth distances is outside the sixth preset distance threshold range, it indicates that the jog deviation of the first surface is outside the normal deviation range, that is, the deviation is too large, and it is determined that a jog error exists on the first surface, and the exposure process for the first surface is stopped.

[0122] S315. Determine a seventh distance between the fitted theoretical positions of the first marking points based on the fitted theoretical positions of the first marking points, and determine an eighth distance between the actual positions of the first marking points based on the actual positions of the first marking points.

[0123] S316: Determine a seventh difference between the seventh distance and the eighth distance. When the seventh difference is within a seventh preset difference threshold range, determine that no spacing deviation occurs on the first surface, thereby determining that the first surface is not deviated.

[0124] Specifically, when it is determined that there is no inching deviation on the first surface, it is also necessary to determine whether there is a pitch error (PE) on the first surface. That is, based on the calculated fitted theoretical positions of each first marking point, a seventh distance between the fitted theoretical positions of each first marking point can be determined. Based on the collected actual positions of each first marking point, an eighth distance between the actual positions of each first marking point can be determined. After determining the seventh and eighth distances, the seventh and eighth distances are subtracted to obtain a seventh difference. It is then determined whether the seventh difference is within a seventh preset difference threshold. If the seventh difference is determined to be within the seventh preset difference threshold, it indicates that the pitch deviation on the first surface is within a normal deviation range, and it can be determined that there is no pitch deviation on the first surface. If the seventh difference is determined to be outside the seventh preset difference threshold, then there is a pitch deviation on the first surface, and the first surface is deflected. Therefore, only when it is determined that there is no inching deviation or pitch deviation on the first surface can it be determined that there is no deflection on the first surface. If it is determined that there is either inching deviation or pitch deviation on the first surface, it indicates that there is deflection on the first surface, and exposure of the first surface is terminated.

[0125] S317: After the exposure of the first surface is completed, obtain the actual positions of at least two second marking points on the second surface.

[0126] S318. Determine, based on the actual position of each second marking point and the theoretical position of each second marking point, a fitted theoretical position of each second marking point formed by fitting the actual position of each second marking point and the theoretical position of each second marking point.

[0127] The fitted theoretical position of the second marking point includes a second fitted transverse coordinate position in the first direction and a second fitted longitudinal coordinate position in the second direction.

[0128] Specifically, when determining the misalignment of the second surface, the JEPE value can also be used for calculation. That is, the actual position of each second marking point and the theoretical position of each second marking point are used to fit the actual position of each second marking point with the theoretical position of each second marking point. Factors considered during the fitting include, but are not limited to, the inspection results of the previous process, the PCB board material, the photoresist material, and the experience of previously exposing similar PCB boards. After fitting, a new fitted theoretical position of the second marking point is formed. When there are three second marking points, there are also three fitted theoretical positions of the second marking points. The fitted theoretical positions of the second marking points include a second fitted horizontal coordinate position in the first direction and a second fitted vertical coordinate position in the second direction.

[0129] S319. Based on the actual position of each second marking point and the fitted theoretical position of each second marking point, determine the eighth difference between the second horizontal position coordinate of the actual position of each second marking point and the second fitted horizontal coordinate position of the fitted theoretical position of each second marking point, the ninth difference between the second vertical position coordinate of the actual position of each second marking point and the second fitted vertical coordinate position of the fitted theoretical position of each second marking point, and the ninth distance between the actual position of each second marking point and the fitted theoretical position of each second marking point.

[0130] S320: When the eighth difference is within the eighth preset difference threshold range, the ninth difference is within the ninth preset difference threshold range, and the ninth distance is within the ninth preset distance threshold range, determine that no inching deviation occurs on the second surface.

[0131] Specifically, after determining the fitting theoretical position of each second marking point, it is necessary to determine the jog deviation (JE) of the second surface. That is, using the actual position of each second marking point and the fitted theoretical position of each second marking point, an eighth difference between the second horizontal position coordinate of the actual position of each second marking point and the second fitted horizontal coordinate position of the fitted theoretical position of each second marking point, a ninth difference between the second vertical position coordinate of the actual position of each second marking point and the second fitted vertical coordinate position of the fitted theoretical position of each second marking point, and a ninth distance between the actual position of each second marking point and the fitted theoretical position of each second marking point are calculated. When the number of second marking points is three, the calculated eighth difference, ninth difference, and ninth distance are also three. After determining the eighth difference, ninth difference, and ninth distance, it is determined whether each eighth difference is within an eighth preset difference threshold range, whether each ninth difference is within a ninth preset difference threshold range, and whether each ninth distance is within a ninth preset distance threshold range. When each eighth difference is within the eighth preset difference threshold range, each ninth difference is within the ninth preset difference threshold range, and each ninth distance is within the ninth preset distance threshold range, it indicates that the inching deviation of the second surface of the PCB board is within a normal deviation range, and it can be determined that no inching deviation occurs on the second surface. When at least one of the eighth difference values ​​is outside the eighth preset difference threshold range, or at least one of the ninth difference values ​​is within the ninth preset difference threshold range, or at least one of the ninth distances is outside the ninth preset distance threshold range, it indicates that the jog deviation of the second surface is outside the normal deviation range, that is, the deviation is too large, and it is determined that a jog error exists on the second surface, and the exposure process for the second surface is stopped.

[0132] S321. Determine a tenth distance between the fitted theoretical positions of the second marking points based on the fitted theoretical positions of the second marking points, and determine an eleventh distance between the actual positions of the second marking points based on the actual positions of the second marking points.

[0133] S322: Determine a tenth difference between the tenth distance and the eleventh distance. When the tenth difference is within a tenth preset difference threshold range, determine that no spacing deviation occurs on the second surface, thereby determining that the second surface is not deviated.

[0134] Specifically, when it is determined that there is no inching deviation on the second surface, it is also necessary to determine whether there is a pitch error (PE) on the second surface. That is, based on the calculated fitted theoretical positions of each second marking point, the tenth distance between the fitted theoretical positions of each second marking point can be determined. Similarly, based on the collected actual positions of each second marking point, the eleventh distance between the actual positions of each second marking point can be determined. After determining the tenth and eleventh distances, the tenth and eleventh distances are subtracted to obtain a tenth difference value, and it is determined whether the tenth difference value is within a tenth preset difference threshold range. If the tenth difference value is determined to be within the tenth preset difference threshold range, it indicates that the pitch deviation of the second surface is within a normal deviation range, and it can be considered that there is no pitch deviation on the second surface. If the tenth difference value is determined to be outside the tenth preset difference threshold range, then there is a pitch deviation on the second surface, and the second surface is deviated. In other words, only when it is determined that there is no inching deviation or pitch deviation on the second surface can it be determined that there is no deviated second surface. If it is determined that there is inching deviation or pitch deviation on the second surface, it indicates that there is deviated second surface, and exposure of the second surface is stopped at this time.

[0135] S323. When the second side is not deflected, the deflection of the plate to be exposed is determined based on the deviation between the actual position of each first marking point and the actual position of each second marking point, so as to perform exposure of the second side using the preset exposure conditions when the plate to be exposed is not deflected.

[0136] The technical solution of the embodiment of the present invention quickly realizes the offset of the first surface and the second surface by fitting the coordinate positions, and before exposing the first surface, it is determined that the first surface has not undergone unpredictable deformation, thereby improving the exposure alignment accuracy of the plate to be exposed and saving plate and production costs.

[0137] Example 4

[0138] Based on the same inventive concept, the present invention provides an exposure system for a direct-write imaging exposure device, comprising an image acquisition module, an exposure module, and a control module; the image acquisition module is used to acquire the actual positions of a first marking point and a second marking point, the exposure module is used to expose the first side and the second side of the exposure device, and the control module is used to execute the exposure method of the above-mentioned direct-write imaging exposure device.

[0139] The above system can execute the exposure methods of the direct-write imaging exposure apparatus provided in all the aforementioned embodiments of the present invention, and has the corresponding functional modules and beneficial effects for executing the aforementioned methods. For technical details not fully described in this embodiment, please refer to the methods provided in all the aforementioned embodiments of the present invention.

[0140] Example 5

[0141] Figure 4 A schematic structural diagram of an electronic device 10 provided for embodiment five of the present invention. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device may also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0142] like Figure 4 As shown, the electronic device 10 includes at least one processor 11 and a memory, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc., which is communicatively connected to the at least one processor 11. The memory stores a computer program that can be executed by the at least one processor. The processor 11 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or the computer program loaded from the storage unit 18 into the random access memory (RAM) 13. Various programs and data required for the operation of the electronic device 10 can also be stored in the RAM 13. The processor 11, ROM 12, and RAM 13 are connected to each other via a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0143] Multiple components in the electronic device 10 are connected to the I / O interface 15, including an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a magnetic disk, an optical disk, etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.

[0144] The processor 11 can be any general-purpose and / or specialized processing component with processing and computing capabilities. Some examples of the processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various specialized artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any other suitable processor, controller, microcontroller, etc. The processor 11 executes the various methods and processes described above, such as the exposure method of the direct-write imaging exposure device.

[0145] In some embodiments, the exposure method of the direct-write imaging exposure device can be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or installed on electronic device 10 via ROM 12 and / or communication unit 19. When the computer program is loaded into RAM 13 and executed by processor 11, one or more steps of the backside alignment method described above can be performed. Alternatively, in other embodiments, processor 11 can be configured to execute the exposure method of the direct-write imaging exposure device through any other appropriate means (e.g., via firmware).

[0146] Various embodiments of the systems and techniques described herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), system-on-chip systems (SOCs), programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include being implemented in one or more computer programs that are executable and / or interpreted on a programmable system that includes at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0147] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when the computer program is executed by the processor, the functions / operations specified in the flowcharts and / or block diagrams are implemented. The computer program may be executed entirely on the machine, partially on the machine, as a stand-alone software package, partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0148] In the context of the present invention, computer-readable storage media can be tangible media that can contain or store a computer program for use with an instruction execution system, device or equipment or used in combination with an instruction execution system, device or equipment. Computer-readable storage media can include but are not limited to electronic, magnetic, optical, electromagnetic, infrared or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, computer-readable storage media can be machine-readable signal media. More specific examples of machine-readable storage media can include electrical connections based on one or more lines, portable computer disks, hard disks, random access memories (RAM), read-only memories (ROM), erasable programmable read-only memories (EPROM or flash memory), optical fibers, portable compact disk read-only memories (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0149] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0150] The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0151] A computing system may include clients and servers. The clients and servers are typically remote from each other and typically interact via a communication network. This client-server relationship arises through computer programs running on the respective computers, creating a client-server relationship. The server may be a cloud server, also known as a cloud computing server or cloud host. This server is a hosting product within the cloud computing service ecosystem that addresses the management difficulties and limited scalability of traditional physical hosting and VPS services.

[0152] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved. This is not limited herein.

[0153] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. An exposure method of a direct writing imaging exposure device, characterized in that: The plate to be exposed of the exposure device includes a first surface and a second surface which are opposite to each other in the thickness direction, and the first surface and the second surface are respectively provided with a first marking point and a second marking point which are aligned with each other, including: Acquire actual positions of at least two first marking points on the first surface; Determining a deviation of the first surface according to a deviation between an actual position of each of the first marking points and a theoretical position of each of the first marking points, and performing exposure of the first surface using a preset exposure condition when the first surface is not deflected; After the exposure of the first surface is completed, obtaining actual positions of at least two second marking points on the second surface; determining a position deviation of the second surface according to a deviation between an actual position of each second marking point and a theoretical position of each second marking point; When the second side is not deviated, the deviation of the plate to be exposed is determined based on the deviation between the actual position of each first marking point and the actual position of each second marking point, and the exposure of the second side is performed using the preset exposure conditions when the plate to be exposed is not deviated.

2. The exposure method according to claim 1, wherein Determining the position deviation of the plate to be exposed according to the deviation between the actual position of each of the first marking points and the actual position of each of the second marking points includes: determining deformation conditions of the first surface and the second surface according to actual positions of the first marking points and actual positions of the second marking points; When the deformation of the first surface and the second surface meets a preset deformation condition, determining the position offset of the first surface and the second surface according to the actual position of each of the first marking points and the actual position of each of the second marking points; When there is no positional offset between the first surface and the second surface, it is determined that the plate to be exposed is not deflected.

3. The exposure method according to claim 2, wherein: The preset deformation condition includes the first surface and the second surface deforming in the same proportion; Determining deformation of the first surface and the second surface according to the actual position of each of the first marking points and the actual position of each of the second marking points includes: determining a first expansion / contraction value of the first surface according to the actual position of each of the first marking points; determining a second expansion / contraction value of the second surface according to the actual position of each of the second marking points; determining a first difference between the first expansion value and the second expansion value according to the first expansion value and the second expansion value; When the first difference is within a first preset difference threshold range, it is determined that the first surface and the second surface are deformed in the same proportion.

4. The exposure method according to claim 3, wherein: Determining a first expansion / contraction value between the first surfaces and a second expansion / contraction value between the second surfaces according to actual positions of the first marking points and actual positions of the second marking points includes: determining a first distance between the actual positions of the first marking points according to the actual positions of the first marking points, so as to determine a first expansion / contraction value of the first surface; According to the actual positions of the second marking points, a second distance between the actual positions of the second marking points is determined to determine a second expansion and contraction value of the second surface.

5. The exposure method according to claim 2, wherein: The actual position of the first marking point includes a first horizontal coordinate position in a first direction and a first vertical coordinate position in a second direction, and the actual position of the second marking point includes a second horizontal coordinate position in the first direction and a second vertical coordinate position in the second direction, wherein the first direction and the second direction are perpendicular; Determining a position offset between the first surface and the second surface according to an actual position of each of the first marking points and an actual position of each of the second marking points includes: determining, based on the actual positions of the first marking points and the actual positions of the second marking points, a second difference between the first horizontal coordinate position of the actual position of the first marking points and the second horizontal coordinate position of the actual position of the second marking points, a third difference between the first longitudinal coordinate position of the actual position of the first marking points and the second longitudinal coordinate position of the actual position of the second marking points, and a third distance between the actual positions of the first marking points and the actual positions of the second marking points; When the second difference is within a second preset difference threshold range, the third difference is within a third preset difference threshold range, and the third distance is within a third preset distance threshold range, it is determined that no position offset occurs between the first surface and the second surface.

6. The exposure method according to claim 1, wherein Determining the deviation of the first surface according to the deviation between the actual position of the first marking point and the theoretical position of the first marking point, and before exposing the first surface using a preset exposure condition when the first surface is not deflected, the method further includes: It is determined that the first surface is not deformed.

7. The exposure method according to claim 6, wherein: Determining that the first surface is not deformed includes: Obtaining the actual positions of at least two third marking points on the first side of another plate to be exposed in the same batch; determining a fourth distance between the actual positions of the first marking points based on the actual positions of the first marking points, and determining a fifth distance between the actual positions of the third marking points based on the actual positions of the third marking points; A fourth difference between the fourth distance and the fifth distance is determined based on the fourth distance and the fifth distance. When the fourth difference is within a fourth preset difference threshold range, it is determined that the first surface of the to-be-exposed plate is not deformed.

8. The exposure method according to claim 1, wherein The deviation includes a point deviation and a spacing deviation; the actual position of the first marking point includes a first horizontal coordinate position in a first direction and a first vertical coordinate position in a second direction, the first direction and the second direction being perpendicular; Determining the deviation of the first surface according to the deviation between the actual position of each of the first marking points and the theoretical position of each of the first marking points includes: Determine, based on the actual position of each of the first marking points and the theoretical position of each of the first marking points, a fitted theoretical position of each of the first marking points formed by fitting the actual position of each of the first marking points and the theoretical position of each of the first marking points; the fitted theoretical position of the first marking point includes a first fitted horizontal coordinate position in the first direction and a first fitted vertical coordinate position in the second direction; Determine, based on the actual position of each of the first marking points and the fitted theoretical position of each of the first marking points, a fifth difference between the first lateral position coordinate of the actual position of each of the first marking points and the first fitted lateral coordinate position of the fitted theoretical position of each of the first marking points, a sixth difference between the first longitudinal position coordinate of the actual position of each of the first marking points and the first fitted longitudinal coordinate position of the fitted theoretical position of each of the first marking points, and a sixth distance between the actual position of each of the first marking points and the fitted theoretical position of each of the first marking points; When the fifth difference is within a fifth preset difference threshold range, the sixth difference is within a sixth preset difference threshold range, and the sixth distance is within a sixth preset distance threshold range, determining that the first surface does not have the inching deviation; determining a seventh distance between the fitted theoretical positions of the first marking points based on the fitted theoretical positions of the first marking points, and determining an eighth distance between the actual positions of the first marking points based on the actual positions of the first marking points; A seventh difference between the seventh distance and the eighth distance is determined. When the seventh difference is within a seventh preset difference threshold range, it is determined that the first surface does not have the spacing deviation, so as to determine that the first surface is not deviated.

9. The exposure method according to claim 1, wherein The deviation includes a jog deviation and a spacing deviation; the actual position of the second marking point includes a second transverse coordinate position in a first direction and a second longitudinal coordinate position in a second direction, the first direction and the second direction being perpendicular; Determining the deviation of the second surface according to the deviation between the actual position of each second marking point and the theoretical position of each second marking point includes: Determine, based on the actual position of each second marking point and the theoretical position of each second marking point, a fitted theoretical position of each second marking point formed by fitting the actual position of each second marking point and the theoretical position of each second marking point; the fitted theoretical position of the second marking point includes a second fitted transverse coordinate position in the first direction and a second fitted longitudinal coordinate position in the second direction; Determine, based on the actual position of each second marking point and the fitted theoretical position of each second marking point, an eighth difference between the second lateral position coordinate of the actual position of each second marking point and the second fitted lateral coordinate position of the fitted theoretical position of each second marking point, a ninth difference between the second longitudinal position coordinate of the actual position of each second marking point and the second fitted longitudinal coordinate position of the fitted theoretical position of each second marking point, and a ninth distance between the actual position of each second marking point and the fitted theoretical position of each second marking point; When the eighth difference is within an eighth preset difference threshold range, the ninth difference is within a ninth preset difference threshold range, and the ninth distance is within a ninth preset distance threshold range, determining that the second surface does not have the inching deviation; Determining a tenth distance between the fitted theoretical positions of the second marking points based on the fitted theoretical positions of the second marking points, and determining an eleventh distance between the actual positions of the second marking points based on the actual positions of the second marking points; A tenth difference between the tenth distance and the eleventh distance is determined. When the tenth difference is within a tenth preset difference threshold range, it is determined that the second surface does not have the spacing deviation, so as to determine that the second surface is not deviated.

10. An exposure system of a direct writing imaging exposure device, characterized in that: It comprises an image acquisition module, an exposure module and a control module; the control module is used to execute the exposure method of the direct writing imaging exposure device according to any one of claims 1 to 9.

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