A high-precision chip temperature control system

Abstract

The present invention discloses a high-precision temperature control system for a chip, which includes a main cooling circuit, an auxiliary peak-shaving cooling circuit, and an auxiliary valley-filling heating circuit. The main cooling circuit is connected to the heat exchange pipeline of the heat-generating chip, and the auxiliary peak-shaving cooling circuit and the auxiliary valley-filling heating circuit are connected to the main cooling circuit through a first gear pump and a second gear pump respectively. The first gear pump and the second gear pump are respectively connected to the control board signal. The main cooling circuit is connected to the output end and the reflux end of the main cooling circuit liquid storage tank, the input end of the auxiliary peak-shaving cooling circuit is connected to the peak-shaving cooling liquid storage tank, the output end of the auxiliary peak-shaving cooling circuit is connected to the first gear pump, the input end of the auxiliary valley-filling heating circuit is connected to the valley-filling heating liquid storage tank, the output end of the auxiliary valley-filling heating circuit is connected to the second gear pump, the peak-shaving cooling liquid storage tank is connected to a refrigeration system, and the valley-filling heating liquid storage tank is connected to a heating system.

Description

Technical Field

[0001] The present invention relates to the technical field of chip production and manufacturing, and in particular to a high-precision chip temperature control system. Background Art

[0002] In the electronics industry, chips have strict temperature requirements for normal operation. Currently, chip cooling technology is a key component in ensuring stable chip operation, and it has undergone a significant evolution. Early simple cooling methods have gradually evolved into the widely used air cooling and liquid cooling technologies of today. These technologies can, to a certain extent, meet the cooling requirements of chips under normal operating conditions, with their primary goal being to control chip temperatures within a specified range.

[0003] At the patent level, there are already many patented technologies related to chip cooling. These technologies have innovated from different perspectives in terms of heat dissipation structure, heat dissipation materials, and heat dissipation principles, improving heat dissipation efficiency and stability to a certain extent. However, these patented technologies mainly focus on optimizing heat dissipation effects under stable power conditions.

[0004] Currently, chip cooling faces critical challenges. On the one hand, the adjustable range and speed of current cooling methods are relatively low, making it difficult to effectively adjust the cooling intensity in a timely manner when the chip power changes. On the other hand, the heat dissipation equipment has a relatively large thermal capacity. This characteristic, due to thermal inertia, makes it difficult to cope with sudden changes in chip power consumption. Consequently, when the chip power suddenly increases or decreases, the chip temperature changes dramatically, adversely affecting chip performance. Existing cooling technologies lack effective solutions to this problem. While improvements have been explored, most rely solely on fan or pump speed regulation. This has limited adjustment ranges and significant shortcomings in temperature control accuracy, making it impossible to meet the high-precision temperature control requirements of chips. Therefore, a new chip temperature control device is urgently needed to address this issue. Summary of the Invention

[0005] The purpose of the present invention is to overcome the defects of the prior art and provide a high-precision chip temperature control system to solve the problems raised in the above background technology.

[0006] A high-precision temperature control system for a chip comprises a control board and a heating chip, wherein the control board is connected to the heating core signal, and the heating chip feeds back the chip power consumption value and the chip temperature value to the control board. The system is characterized in that it also comprises a main cooling circuit, an auxiliary peak-shaving cooling circuit, and an auxiliary valley-filling heating circuit. The main cooling circuit is connected to the heat exchange pipeline of the heating chip, and two branches, an auxiliary peak-shaving cooling circuit and an auxiliary valley-filling heating circuit, are provided between the main cooling circuit and the heat exchange pipeline of the heating chip. The auxiliary peak-shaving cooling circuit and the auxiliary valley-filling heating circuit are connected to the main cooling circuit through a first gear pump and a second gear pump, respectively. The first gear pump and the second gear pump are respectively connected to the control board signal. The main cooling circuit is connected to the output end and the return end of the main cooling circuit liquid storage tank, the input end of the auxiliary peak-shaving cooling circuit is connected to the peak-shaving cooling liquid storage tank, the output end of the auxiliary peak-shaving cooling circuit is connected to the first gear pump, the input end of the auxiliary valley-filling heating circuit is connected to the valley-filling heating liquid storage tank, and the output end of the auxiliary valley-filling heating circuit is connected to the second gear pump. The peak-shaving cooling liquid storage tank is connected to a refrigeration system, and the valley-filling heating liquid storage tank is connected to a heating system.

[0007] Furthermore, a heat exchanger is provided on the return end of the main cooling circuit near the main cooling circuit liquid storage tank, and a fan is provided on the heat exchanger, and the fan is connected to the control board signal.

[0008] Furthermore, a main circuit pump is provided on the output end of the main cooling circuit close to the main cooling circuit liquid storage tank, and the main circuit pump is connected to the control board signal.

[0009] Furthermore, a solenoid valve is provided in the main cooling circuit near the main circuit pump end.

[0010] Furthermore, the control panel includes a real-time data acquisition and processing module, a historical data analysis and prediction module, a PID controller module, a feedforward compensation module, a comprehensive control decision module, a physical parameter compensation module, a flow comprehensive adjustment module, a flow fine-tuning module, and a final flow adjustment instruction generation module;

[0011] The real-time data acquisition and processing module is connected to the heating chip, and its output is connected to the historical data analysis and prediction module and the PID controller module. The real-time data acquisition and processing module inputs the real-time power consumption P(t) and temperature T(t) data from the heating chip and outputs the pre-processed power consumption and temperature data stream;

[0012] The historical data analysis and prediction module is connected to the real-time data acquisition and processing module and outputs to the feedforward compensation module. The historical data analysis and prediction module inputs the data received from the real-time data acquisition and processing module and outputs the power consumption prediction value. ;

[0013] The PID controller module interacts with the real-time data acquisition and processing module to obtain the current temperature information and input the target temperature set point T setpoint and current temperature T(t), outputs the flow regulation amount Q based on the error calculation PID and pass the results to the comprehensive control decision module;

[0014] The feedforward compensation module receives the forecast data from the historical data analysis and forecast module and inputs the future power consumption change trend And send the result to the comprehensive control decision module to output the feedforward adjustment value Q feedforward ;

[0015] The integrated control decision module receives the adjustment quantity Q from the PID controller module PID And the feedforward adjustment quantity Q of the information of the feedforward compensation module feedforward , the output is connected to the physical parameter compensation module, and the output comprehensive flow regulation instruction Q final ;

[0016] The physical parameter compensation module receives the instruction of the comprehensive control decision module and inputs the comprehensive flow adjustment instruction Q final , fine-tuning is performed based on actual physical conditions, and then passed to the flow comprehensive regulation module, which outputs the final flow regulation instruction after physical parameter adjustment;

[0017] The flow comprehensive regulation module receives instructions from the physical parameter compensation module, inputs the final flow regulation instruction, directly controls the operation of the two gear pumps, and outputs a drive signal to the first gear pump and the second gear pump;

[0018] The flow fine-tuning module is inserted after the physical parameter compensation module or directly connected before the flow comprehensive adjustment module, and is used to make fine adjustments to the flow when necessary;

[0019] The final flow regulation instruction generation module serves as an information aggregation point, receives status reports from all modules, and issues a final flow regulation instruction.

[0020] Furthermore, the feedforward compensation module outputs the feedforward adjustment value Q feedforward The calculation formula is:

[0021] ;

[0022] where k f is the feedforward gain coefficient, is the predicted future power consumption value, and P(t) is the current actual power consumption value.

[0023] Furthermore, the PID controller module outputs a flow regulation value Q based on the error calculation.PID The calculation formula is:

[0024] ;

[0025] Where: e(t) = T setpoint -T(t) is the error signal, K p , K i , K d are the proportional, integral and differential coefficients respectively,

[0026] Q PID (t) is the flow adjustment calculated by the PID controller, which represents the coolant or heating fluid flow rate that needs to be adjusted at time t to correct the deviation between the current temperature and the target temperature.

[0027] Furthermore, the comprehensive control decision module outputs the comprehensive flow regulation instruction Q final The calculation formula is:

[0028]

[0029] Among them, α is the weight factor of PID adjustment amount, and β is the weight factor of feedforward compensation amount.

[0030] Beneficial effects of the present invention:

[0031] 1. High-precision temperature control

[0032] Real-time monitoring of the chip temperature sensor, combined with analysis of the chip's power output, allows for precise response to sudden changes in chip power consumption. Whether power consumption suddenly increases or decreases, the additional cooling and heating circuits quickly respond, releasing coolant at the appropriate temperature and flow rate to maintain a constant chip temperature. This effectively avoids chip performance degradation caused by rapid temperature fluctuations and achieves highly precise temperature control.

[0033] 2. Improve chip performance stability

[0034] By precisely controlling chip temperature, the chip consistently operates at peak performance. This eliminates performance issues like computational errors and reduced processing speeds caused by overheating or overcooling, which are often the result of traditional cooling methods' inability to cope with sudden power consumption fluctuations. This significantly improves chip performance stability and reliability.

[0035] 3. Optimize the adaptability of the cooling system

[0036] Unlike traditional cooling technologies, this invention incorporates specialized cooling circuits in addition to conventional cooling fluid paths, enabling the cooling system to better adapt to the complex and changing operating conditions of the chip. This not only effectively dissipates heat when power consumption is stable, but also remains capable of handling sudden power fluctuations, enhancing the overall cooling system's adaptability to diverse operating conditions.

[0037] 4. Extend chip service life

[0038] A stable temperature environment reduces material fatigue and damage to the chip caused by temperature stress. It avoids accelerated chip aging at high temperatures and potential physical property changes at low temperatures, thereby extending the chip's service life and reducing the risk of chip failure due to temperature issues. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 This is a connection diagram of the system of the present invention;

[0040] Figure 2 This is the control logic diagram of the control board of the present invention.

[0041] In the figure: 1. Main cooling circuit reservoir, 2. Main cooling circuit, 3. Main circuit pump, 4. Valley-filling heating reservoir, 5. Peak-shaving cooling reservoir, 6. Heating system, 7. Refrigeration system, 8. Auxiliary peak-shaving cooling circuit, 9. Auxiliary valley-filling heating circuit, 10. First gear pump, 11. Second gear pump, 12. Heating chip, 13. Control board, 14. Fan, 15. Heat exchanger. DETAILED DESCRIPTION

[0042] The present invention proposes a high-precision chip temperature control system. This precise chip temperature control system is premised on the chip's ability to output specific parameters. For example, certain Intel CPU chips can output real-time power consumption and real-time chip temperature. These two key parameters are input into the temperature control system of the present invention as control signals. This input method, based on the chip's own real-time parameters, lays a solid foundation for achieving precise temperature control. Throughout the temperature control process, the chip's temperature sensor plays an indispensable role. It continuously monitors the chip temperature in real time and feeds this accurate temperature information back to the temperature control device, thereby providing a precise basis for the device's control actions and ensuring the timeliness and accuracy of temperature control.

[0043] The present invention uses liquid cooling technology with pump and fan speed control. This liquid cooling method provides a strong guarantee for efficient heat dissipation, while the pump and fan speed control functions further enhance the flexibility and adaptability of the cooling system.

[0044] On this basis, the present device has a unique liquid circuit design. In addition to setting up a conventional cooling liquid circuit for basic heat dissipation functions, a heating liquid circuit and a refrigeration liquid circuit with peak shaving and valley filling functions are additionally added. These two special liquid circuits are the key innovations of the present invention. They are specifically used to deal with the complex and difficult problem of sudden changes in chip power consumption during operation. In order to achieve faster and more effective temperature control, the heating liquid circuit and the refrigeration liquid circuit are arranged as close as possible to the inlet area of ​​the chip cooling liquid circuit. Such a layout can effectively reduce the heat capacity and reduce the delay in the heat transfer process, so that it can respond more quickly to changes in chip temperature and achieve the goal of fast and constant chip temperature. Moreover, the heating liquid circuit and the refrigeration liquid circuit pipelines are driven by a first gear pump 10 and a second gear pump 11 with a precise flow metering function. This gear pump can accurately control the flow of the coolant, providing reliable hardware support for the subsequent precise adjustment of the cooling or heating power according to the changes in chip power consumption.

[0045] In a specific embodiment, Figure 1 As shown, a high-precision temperature control system for a chip includes a control board 13 and a heating chip 12. The control board 13 is connected to the heating chip 12 by signal. The heating chip 12 feeds back the chip power consumption value and the chip temperature value to the control board 13. It also includes a main cooling circuit 2, an auxiliary peak-shaving cooling circuit 8, and an auxiliary valley-filling heating circuit 9. The main cooling circuit 2 is connected to the heat exchange pipeline of the heating chip 12. Two branches, an auxiliary peak-shaving cooling circuit 8 and an auxiliary valley-filling heating circuit 9, are provided between the main cooling circuit 2 and the heat exchange pipeline of the heating chip 12. The auxiliary peak-shaving cooling circuit 8 and the auxiliary valley-filling heating circuit 9 are connected to the main cooling circuit 2 through a first gear pump 10 and a second gear pump 11 respectively. The first gear pump 10 and the second gear pump 11 are respectively connected to the control board 13 by signal. The main cooling circuit 2 is connected to the output end and the return end of the main cooling circuit liquid storage tank 1. A heat exchanger 15 is provided on the main cooling circuit 2 near the return end of the main cooling circuit liquid storage tank 1. A fan 14 is provided on the heat exchanger 15, and the fan 14 is connected to the control board 13 by signal. The main cooling circuit 2 is provided with a main circuit pump 3 at the output end near the main cooling circuit liquid storage tank 1, and the main circuit pump 3 is connected to the control board 13 by signal. The main cooling circuit 2 is provided with a solenoid valve near the end of the main circuit pump 3. The input end of the auxiliary peak shaving cooling circuit 8 is connected to the peak shaving cooling liquid storage tank 5, the output end of the auxiliary peak shaving cooling circuit 8 is connected to the first gear pump 10, the input end of the auxiliary valley filling heating circuit 9 is connected to the valley filling heating liquid storage tank 4, the output end of the auxiliary valley filling heating circuit 9 is connected to the second gear pump 11, the peak shaving cooling liquid storage tank 5 is connected to the refrigeration system 7, and the valley filling heating liquid storage tank 4 is connected to the heating system 6.

[0046] The chip's conventional cooling fluid circuit plays a fundamental and crucial role in the entire cooling system. When the chip is operating at a constant power consumption, the conventional cooling fluid circuit effectively removes the heat generated by the chip by continuously and steadily circulating the coolant. By properly adjusting the speed of the main circuit pump 3 and fan 14, the chip temperature can be precisely controlled within the appropriate operating temperature range. For example, the chip temperature can be stabilized within a highly precise set value range of 70°C ± 0.2°C, ensuring stable performance and reliable operation of the chip at a constant power consumption.

[0047] When the chip power consumption suddenly increases, the additional peak-shaving cooling liquid circuit begins to play a key role. The operating mechanism of this cooling liquid circuit is very sophisticated. It can accurately release coolant at a lower temperature through its equipped first gear pump 10 based on the specific value of the chip power consumption increase. In this process, the flow rate of the released coolant is strictly and accurately calculated to ensure that the cooling power generated by this part of the coolant during evaporation or heat exchange on the chip surface is exactly equal to the increase in chip power consumption. Through this precise matching method, the additional heat generated by the sudden increase in power consumption can be effectively offset, thereby ensuring that the chip temperature remains constant and avoiding the adverse effects of the sudden temperature change caused by the sudden increase in power consumption on chip performance.

[0048] When chip power consumption suddenly decreases, the additional valley-fill heating liquid circuit begins to operate. Based on the specific circumstances of the chip's power reduction, it uses the second gear pump 11 to accurately release a higher-temperature coolant. The released heating liquid flow rate is also carefully calculated to ensure that the heating power generated by this heating liquid during heat exchange with the chip is exactly equal to the reduction in chip power consumption. This way, even if chip power consumption suddenly decreases, the chip temperature is not affected and remains stable, further protecting chip performance from temperature fluctuations and ensuring stable and reliable chip operation under complex and variable power consumption conditions.

[0049] The specific implementation is through the coordination between the modules configured on the control board 13, specifically:

[0050] like Figure 2 As shown, the control panel 13 includes a real-time data acquisition and processing module, a historical data analysis and prediction module, a PID controller module, a feedforward compensation module, a comprehensive control decision module, a physical parameter compensation module, a flow comprehensive adjustment module, a flow fine-tuning module, and a final flow adjustment instruction generation module;

[0051] The real-time data acquisition and processing module is connected to the heating chip 12, and its output is connected to the historical data analysis and prediction module and the PID controller module. The real-time data acquisition and processing module inputs the real-time power consumption P(t) and temperature T(t) data from the heating chip 12 and outputs the pre-processed power consumption and temperature data stream;

[0052] The historical data analysis and prediction module is connected to the real-time data acquisition and processing module and outputs to the feedforward compensation module. The historical data analysis and prediction module inputs the data received from the real-time data acquisition and processing module and outputs the power consumption prediction value. .

[0053] The historical data analysis and prediction module is a key component in the chip's high-precision temperature control system. It uses time series analysis or machine learning algorithms to predict future power consumption trends based on stored historical power consumption and temperature data. This module aims to predict potential power consumption fluctuations in the chip in advance, providing the necessary information for the feedforward compensation module. This allows the system to respond to power consumption changes before they occur, improving the accuracy and timeliness of temperature control.

[0054] The working principle of the historical data analysis and prediction module is:

[0055] The module receives pre-processed power consumption and temperature data from the real-time data acquisition and processing module and stores it in the internal database for subsequent analysis. The received data is further cleaned to remove outliers, fill in missing data points, and convert the data into a form suitable for analysis. Through time domain and frequency domain analysis, statistical feature calculation and other methods, key features that can reflect the system behavior pattern are extracted, such as periodic changes, trend components, seasonal factors, etc. According to the application scenario and technical requirements, select a suitable time series prediction model or machine learning algorithm (such as ARIMA, LSTM neural network, etc.). Use historical data to train the selected model and optimize the model parameters to obtain the best prediction performance. Use the trained model to predict the power consumption changes in the future period and generate power consumption prediction values. The prediction timeframe can be set based on actual needs, ranging from a short window (e.g., minutes to hours) to a longer window (e.g., days or longer). The predicted power consumption trend is sent to the feedforward compensation module, which serves as the basis for adjusting the coolant or heating fluid flow rate. A closed-loop control system is also established to regularly evaluate the accuracy of the prediction results. Model updates or retraining are performed based on actual operating conditions to ensure the continued effectiveness of the predictions.

[0056] For example, in a specific embodiment, the system needs to predict the power consumption trend within the next 10 minutes. The historical data analysis and prediction module performs the following steps:

[0057] 1. Data reception: The historical data analysis and prediction module receives the latest power consumption and temperature data from the real-time data acquisition and processing module.

[0058] 2. Data processing: Perform preprocessing steps such as cleaning, filling missing values, and smoothing noise on the newly received data.

[0059] 3. Feature extraction: Calculate the time series characteristics of the current data, such as mean, variance, autocorrelation coefficient, etc., while taking into account past periodicity and trend information.

[0060] 4. Model application: Apply a pre-trained time series prediction model (such as ARIMA or LSTM) to predict the power consumption trend over the next 10 minutes based on current features and historical data.

[0061] 5. Output prediction results: Output the predicted power consumption trend Sent to the feedforward compensation module so that it can prepare corresponding flow regulation measures in advance.

[0062] The historical data analysis and prediction module can provide reliable prediction information for the feedforward compensation module, providing strong support for the efficient operation of the entire chip high-precision temperature control system.

[0063] The PID controller module interacts with the real-time data acquisition and processing module to obtain the current temperature information and input the target temperature set point T setpoint and current temperature T(t), outputs the flow regulation amount Q based on the error calculation PID The PID controller module is one of the core control components in the chip's high-precision temperature control system, responsible for calculating the required flow adjustment amount Q based on the error between the current temperature and the target temperature. PID The module maintains the chip temperature near the set point by precisely adjusting the flow of cooling or heating liquid to achieve stable and efficient temperature control.

[0064] The working principle of the PID controller module is as follows: The PID controller module obtains the real-time measurement value of the current temperature T(t) from the real-time data acquisition and processing module, and reads the target temperature set point T setpoint , calculate the current temperature T(t) and the target temperature T setpoint The error between e(t) = T setpoint -T(t). Apply PID control algorithm to calculate the flow regulation amount Q that needs to be adjusted PID (t), the formula is as follows:

[0065] ;

[0066] Where: e(t) = T setpoint -T(t) is the error signal, K p , K i , K d are the proportional, integral and differential coefficients respectively,

[0067] Q PID (t) is the flow adjustment value calculated by the PID controller, which represents the flow rate of the coolant or heating liquid that needs to be adjusted at time t to correct the deviation between the current temperature and the target temperature. The three parameters K of the PID controller are optimized through experimental debugging and automatic parameter adjustment algorithm. p , K i , K d , in order to achieve the best control performance. The calculated flow adjustment amount Q PID (t) is sent to the integrated control decision module as part of its basis for formulating the final flow regulation instructions.

[0068] For example, in a specific embodiment, the system needs to maintain the chip temperature within the range of 70°C ± 0.2°C. The PID controller module performs the following steps:

[0069] 1. Receiving temperature information: The PID controller module receives the latest temperature data T(t) from the real-time data acquisition and processing module, and reads the target temperature T set by the user. setpoint =70℃.

[0070] 2. Error calculation: Calculate the error between the current temperature and the target temperature: e(t) = 70°C - T(t).

[0071] 3. PID control algorithm application: Apply the PID control algorithm to calculate the flow adjustment amount Q that needs to be adjusted based on the error e(t) PID (t).

[0072] 4. Parameter tuning: If the control effect is not ideal, you can adjust the PID parameter K p , K i , K d , to obtain better control performance.

[0073] 5. Output adjustment amount: Subtract the calculated flow adjustment amount Q PID (t) is sent to the integrated control decision module so that it can formulate the final flow regulation instruction based on the information of feedforward compensation.

[0074] The feedforward compensation module receives the forecast data from the historical data analysis and forecast module and inputs the future power consumption change trend And send the result to the comprehensive control decision module to output the feedforward adjustment value Q feedforward ;

[0075] The feedforward compensation module is an important component of the chip's high-precision temperature control system. It is designed to calculate and output the required flow adjustment amount Q in advance based on the future power consumption change trend provided by the historical data analysis and prediction module. feedforward The module enables faster and more precise temperature control by pre-adjusting the flow of coolant or heating fluid to offset expected power consumption fluctuations:

[0076] Feedforward compensation module workflow:

[0077] The feedforward compensation module receives the future power consumption change trend from the historical data analysis and prediction module The current actual power consumption P(t) is provided by the real-time data acquisition and processing module. This data forms the basis for the feedforward compensation module's calculations. If the forecast indicates that power consumption will increase in the future (for example, due to increased load or running higher-performance applications), the feedforward compensation module will need to prepare additional cooling capacity. Conversely, if the forecast indicates that power consumption will decrease, the coolant flow rate will need to be reduced or a heater will be introduced to maintain a stable temperature.

[0078] Set the feedforward gain coefficient k f , set the feedforward gain coefficient k f This is a key step that determines the system's response strength to the predicted power consumption changes. f The following aspects need to be considered:

[0079] System response characteristics: Understand the dynamic response characteristics of the system, including the time delay from when the flow rate is adjusted to actually affect the chip temperature. This can be determined experimentally and is usually known during the design phase.

[0080] Experimental data: The data obtained through experiments can be used to evaluate different k f For example, in a laboratory environment, various power consumption changes are simulated and the corresponding temperature response curves are recorded to optimize k f .

[0081] Stability considerations: Ensure k f The selection should not cause the system to overreact, that is, avoid excessive compensation that causes temperature fluctuations outside the allowable range. At the same time, sufficient response speed should be ensured to offset the temperature impact caused by power consumption changes in a timely manner.

[0082] Safety: Considering the safety and reliability of the system in extreme cases, k fIt should be within a reasonable range, neither overly conservative nor overly radical.

[0083] Then according to the set k f And the received power consumption change trend, apply the formula to calculate the feedforward adjustment amount Q feedforward :

[0084]

[0085] in:

[0086] where k f is the feedforward gain coefficient, is the predicted future power consumption value, and P(t) is the current actual power consumption value.

[0087] The calculated feedforward adjustment quantity Q feedforward Sent to the comprehensive control decision module as part of the basis for formulating the final flow regulation instructions.

[0088] For example, in a specific embodiment, the system needs to prepare for the power consumption change trend within the next 10 minutes in advance. The feedforward compensation module performs the following steps:

[0089] 1. Receive prediction data: The feedforward compensation module receives the latest power consumption prediction value , and the current actual power consumption (P(t).

[0090] 2. Power consumption trend analysis: Analyze the power consumption trend over the next 10 minutes to determine whether power consumption will increase or decrease, and estimate the impact of these changes on temperature.

[0091] 3. Set the feedforward gain coefficient k f :Based on the system response characteristics and previous experimental data, set an appropriate k f .

[0092] 4. Calculation of feedforward regulation: Apply the formula to calculate the feedforward regulation Q feedforward (t), in order to prepare corresponding flow regulation measures.

[0093] 5. Output regulation: The calculated feedforward regulation Q feedforward (t) is sent to the integrated control decision module so that it can combine the information of the PID controller to formulate the final flow regulation instruction.

[0094] The integrated control decision module receives the adjustment quantity Q from the PID controller module PID And the feedforward adjustment quantity Q of the information of the feedforward compensation module feedforward , the output is connected to the physical parameter compensation module, and the output comprehensive flow regulation instruction Q finalThe integrated control decision module is one of the core components of the chip's high-precision temperature control system. It is responsible for integrating the adjustment amount from the PID controller module and the information from the feedforward compensation module (i.e., the feedforward adjustment amount), and calculating the final flow control instruction Q based on this information. final By combining the advantages of real-time feedback control and predictive control, this module can achieve more accurate and timely adjustment of the cooling or heating liquid flow, thereby ensuring the stability and efficiency of the chip temperature.

[0095] The working principle of the comprehensive control decision module is:

[0096] The integrated control decision module receives the flow regulation value Q calculated based on the current temperature error from the PID controller module. PID (t), and at the same time receives the feedforward adjustment value Q calculated based on the future power consumption change trend prediction from the feedforward compensation module feedforward (t). Weight factors α and β are set based on the system's response characteristics and experimental data. α represents the weight of the PID control variable, and β represents the weight of the feedforward compensation variable. These two factors determine the relative importance of the two control methods in the final flow control command.

[0097] Apply the formula to calculate the comprehensive flow regulation index Q final (t), the formula is as follows:

[0098]

[0099] Among them, α is the weight factor of PID adjustment amount, and β is the weight factor of feedforward compensation amount.

[0100] The calculated comprehensive flow regulation instruction Q final (t) is sent to the physical parameter compensation module as the basis for the next fine-tuning.

[0101] For example, in a specific embodiment, the system needs to maintain the chip temperature within the range of 70°C ± 0.2°C and to cope with the power consumption change trend in the next 10 minutes. The comprehensive control decision module performs the following steps:

[0102] 1. Receive adjustment information: The integrated control decision module receives the latest flow adjustment value Q from the PID controller module PID (t), and the feedforward adjustment value Q provided by the feedforward compensation module feedforward (t).

[0103] 2. Weight factor setting: Based on the system response characteristics and previous experimental data, set the weight factors α and β.

[0104] 3. Calculation of comprehensive flow regulation instruction: Apply the formula to calculate the comprehensive flow regulation instruction Q final (t) to prepare corresponding flow regulation measures.

[0105] 4. Output regulation: The calculated comprehensive flow regulation instruction Q final (t) is sent to the physical parameter compensation module so that it can formulate the final flow regulation instructions based on the actual situation.

[0106] The integrated control decision module provides reliable flow regulation information to the physical parameter compensation module, providing strong support for the efficient operation of the entire chip's high-precision temperature control system. Furthermore, it works in conjunction with the PID controller module and the feedforward compensation module to form a fast-response, high-precision temperature control system.

[0107] The physical parameter compensation module receives the instruction of the comprehensive control decision module and inputs the comprehensive flow adjustment instruction Q final , fine-tuning is performed based on actual physical conditions, and then passed to the flow comprehensive regulation module, which outputs the final flow regulation instruction after physical parameter adjustment;

[0108] The physical parameter compensation module receives the instruction of the comprehensive control decision module and inputs the comprehensive flow adjustment instruction Q final , fine-tuned based on actual physical conditions, and then passed to the flow comprehensive regulation module, which outputs the final flow regulation instruction after physical parameter adjustment. The specific details are as follows:

[0109] The physical parameter compensation module first receives the comprehensive flow regulation instruction Q from the comprehensive control decision module final , parses the flow regulation information in the instruction and prepares to make further adjustments based on actual physical conditions. Actual physical conditions include:

[0110] Pressure drop compensation: The built-in pressure sensor is used to monitor the pressure changes during the flow of the coolant or heating liquid in real time, and the speeds of the first gear pump 10 and the second gear pump 11 are dynamically adjusted according to the monitored pressure drop to ensure that the required flow rate is maintained unchanged.

[0111] Pumping Efficiency Optimization: Utilizes a pre-stored database of pumping efficiency curves to select the most appropriate pump speed set point. Based on the pumping efficiency under the current operating conditions, the pump speed is optimized to minimize energy loss and maximize flow accuracy.

[0112] Flow Path Resistance Assessment: Calculates actual flow deviations caused by factors such as pipe diameter and number of elbows based on historical data and experiments. Based on the calculated results, appropriate flow compensation is applied to offset the impact of these factors.

[0113] Temperature Dependency Correction: Accounts for the effect of temperature on liquid viscosity. As the temperature increases or decreases, the viscosity of the liquid changes, which affects the flow rate. Based on real-time temperature data, the flow setpoint is automatically adjusted to ensure the expected flow rate is achieved at different temperatures.

[0114] Compensation for system aging effects: This takes into account the aging effects that may occur over time, such as decreased pump performance or increased deposits on pipe walls. Regularly check and adjust system parameters to ensure long-term stable operation.

[0115] Combined with the monitoring and analysis of all the above physical conditions, the final flow control instruction after compensation is calculated. The final flow control instruction after physical parameter adjustment is sent to the flow comprehensive control module. It is directly connected to the flow comprehensive control module via a signal line.

[0116] The flow comprehensive regulation module receives instructions from the physical parameter compensation module, inputs the final flow regulation instruction, directly controls the operation of the two gear pumps, and outputs driving signals to the first gear pump 10 and the second gear pump 11;

[0117] The flow comprehensive regulation module is one of the key executive components in the chip high-precision temperature control system, responsible for receiving the final flow regulation instruction Q from the physical parameter compensation module. final , and directly controls the operation of the first gear pump 10 and the second gear pump 11 according to this instruction. By precisely adjusting the speed of the two gear pumps, the flow integrated regulation module can ensure that the coolant or heating liquid flows through the heat-generating chip 12 at the required flow rate and pressure, thereby achieving efficient and stable control of the chip temperature. Input: Final flow regulation instruction Q final , calculated by the physical parameter compensation module, contains the flow regulation information after compensation for actual physical conditions.

[0118] Output: Drive signal to the first gear pump 10 and the second gear pump 11, used to control the speed of the two gear pumps to achieve accurate output of the required flow rate.

[0119] Working principle of comprehensive flow regulation module:

[0120] The flow comprehensive regulation module receives the final flow regulation instruction Q from the physical parameter compensation module final , the directive has taken into account the influence of actual physical conditions such as pressure drop, pumping efficiency, flow path resistance, temperature dependence and system aging effects.

[0121] Parse the received final flow regulation instruction Q final (t), determine the target flow rate Q that each gear pump needs to achieve target,1 (t) or Q target,2 (t).

[0122] According to the target flow Q target,1 (t) or Q target,2 (t), combined with the pre-stored pumping efficiency curve database, the flow demand is converted into the corresponding gear pump speed setting value N target,1 (t) or (N target,2 This step takes into account the differences in pumping efficiency under different working conditions and optimizes the speed to minimize energy loss and maximize flow accuracy.

[0123] Send a drive signal to the first gear pump 10 or the second gear pump 11 to set its speed to N respectively. target,1 (t) or N target,2 (t) Ensure that the cooling liquid or heating liquid flows to the heating chip 12 according to the predetermined flow rate and pressure.

[0124] The integrated flow control module not only accurately executes the flow control instructions provided by the physical parameter compensation module, but also dynamically responds to changes in system status, ensuring the efficient operation of the entire chip's high-precision temperature control system. Furthermore, it works closely with the physical parameter compensation module to form a fast-response, high-precision temperature control system.

[0125] The flow fine-tuning module is inserted after the physical parameter compensation module or directly connected before the flow comprehensive adjustment module, and is used to make fine adjustments to the flow when necessary;

[0126] The flow rate fine-tuning module is one of the fine-tuning components in the chip's high-precision temperature control system. Its primary function is to make subtle adjustments to the flow of the coolant or heating fluid when necessary. This module is inserted after the physical parameter compensation module or directly before the integrated flow control module to ensure that flow control instructions are executed with the utmost precision based on actual needs. By introducing a flow rate fine-tuning mechanism, the system's temperature control accuracy can be further improved to meet the stringent requirements of chip temperature control.

[0127] Working principle of flow fine-tuning module:

[0128] The flow fine-tuning module first receives the final flow adjustment instruction Q from the physical parameter compensation module. final (t), analyze the target flow rate Q that each gear pump needs to achieve target,1 (t) and Q target,2 (t).

[0129] Implement a closed-loop control system and use the built-in flow sensor to monitor the actual flow Q in real time actual,1 (t) and Q actual,2 (t), and the target flow Q target,1 (t) and Q target,2(t) to identify any possible flow deviation ΔQ(t).

[0130] According to the detected flow deviation ΔQ(t), the proportional integral derivative PID control algorithm or other appropriate adjustment algorithm is applied to calculate the required fine-tuning amount ΔQ adjust (t). This step is to minimize flow deviation and ensure that the coolant or heating fluid flows strictly according to the set value.

[0131] The original final flow regulation instruction Q final (t) and the calculated fine-tuning amount ΔQ adjust (t) Combine and generate a new flow regulation instruction Q adjusted (t):

[0132] Q adjusted (t) = Q final (t) +ΔQ adjust (t)

[0133] The updated flow regulation instruction (Q adjusted (t) is sent to the flow comprehensive regulation module to drive the first gear pump (10) and the second gear pump (11) to perform more precise operations.

[0134] For example, in a specific embodiment, the system needs to maintain the chip temperature within the range of 70°C ± 0.2°C and to cope with the power consumption change trend in the next 10 minutes, the flow fine-tuning module performs the following steps:

[0135] 1. Receive and analyze instructions: The flow fine-tuning module receives the final flow adjustment instruction Q from the physical parameter compensation module. final (t), parse out the target flow Q target,1 (t) and Q target,2 (t).

[0136] 2. Real-time monitoring of flow deviation: Implement a closed-loop control system to monitor the actual flow rate Q in real time actual,1 (t) and Q actual,2 (t), and the target flow Q target,1 (t) and Q target,2 (t) and identify the flow deviation ΔQ(t).

[0137] 3. Calculate the fine-tuning amount: Calculate the required fine-tuning amount ΔQ based on the detected flow deviation ΔQ(t) adjust (t).

[0138] 4. Update the flow control instruction: Combine the original final flow control instruction Q final (t) and the calculated fine-tuning amount ΔQ adjust(t), generate a new flow regulation instruction Q adjusted (t).

[0139] 5. Send the updated command: Send the updated flow adjustment command Q adjusted (t) is sent to the flow comprehensive regulation module to drive the first gear pump 10 and the second gear pump 11 to operate more accurately.

[0140] The flow fine-tuning module not only accurately corrects the flow control instructions provided by the physical parameter compensation module but also dynamically responds to changes in system status, ensuring the efficient operation of the entire chip's high-precision temperature control system. Furthermore, it works closely with the physical parameter compensation module and the integrated flow control module to form a fast-response, high-precision temperature control system.

[0141] The final flow control instruction generation module serves as an information aggregation point, receives status reports from all modules, and issues the final flow control instruction. The final flow control instruction generation module is the information aggregation point and decision-making core in the chip high-precision temperature control system. It is responsible for receiving status reports from the real-time data acquisition and processing module, historical data analysis and prediction module, PID controller module, feedforward compensation module, comprehensive control decision module, and physical parameter compensation module, and integrates the final flow control instruction Q based on this information. final This module ensures the coordinated operation of the entire temperature control system and realizes the precise control of the flow of the cooling liquid or the heating liquid to maintain the temperature of the heating chip 12 within the set range.

[0142] Input status reports from various control and monitoring modules, including but not limited to:

[0143] The real-time data acquisition and processing module provides the current power consumption (P(t)) and temperature (T(t).

[0144] Future power consumption change trends provided by the historical data analysis and prediction module .

[0145] The error-based flow regulation Q calculated by the PID controller module PID (t).

[0146] The feedforward adjustment value Q output by the feedforward compensation module feedforward (t).

[0147] The comprehensive flow regulation instruction Q calculated by the comprehensive control decision module final,compensated (t).

[0148] Flow regulation instruction Q after adjustment by the physical parameter compensation module final,physical (t).

[0149] The final flow regulation instruction is output, which is used to directly control the operation of the first gear pump 10 and the second gear pump 11 after all module information is integrated.

[0150] The working principle of the final flow regulation instruction generation module:

[0151] The final flow regulation instruction generation module receives the latest status reports from each relevant module to obtain key information about the current system status and expected changes. The received information is summarized and analyzed to evaluate the consistency and relationship between data from different sources, such as checking whether the real-time temperature meets the predicted value, confirming the coordination between modules, etc. Based on the summarized information, decide how to adjust the flow of coolant or heating liquid. Taking into account the response characteristics, stability requirements and safety considerations of the system, determine the most appropriate flow regulation strategy. Convert the above decisions into specific flow regulation instructions to ensure that they reflect the changes in real-time temperature and power consumption, as well as future power consumption trends and the influence of actual physical conditions. Send the final flow regulation instruction to the comprehensive flow regulation module, which directly controls the operation of the first gear pump 10 and the second gear pump 11.

[0152] The final flow control command generation module not only accurately integrates information from different modules but also dynamically responds to changes in system status, ensuring efficient operation of the entire chip's high-precision temperature control system. Furthermore, as an information aggregation point, it ensures coordination and consistency among the subsystems, forming a fast-response, high-precision temperature control system.

[0153] This invention utilizes real-time monitoring of chip temperature sensors, combined with analysis of chip power output, to precisely address sudden changes in chip power consumption. Whether power consumption suddenly increases or decreases, the additional cooling and heating circuits quickly respond by releasing coolant at the appropriate temperature and flow rate to maintain a constant chip temperature. This effectively prevents chip performance degradation caused by rapid temperature fluctuations and achieves highly precise temperature control. Precise chip temperature control ensures the chip consistently operates at optimal performance. This eliminates performance issues such as computational errors and reduced processing speeds caused by overheating or overcooling, which are often the shortcomings of traditional cooling methods in addressing sudden power fluctuations. This significantly improves chip performance stability and reliability. Unlike traditional cooling technologies, this invention incorporates specialized cooling circuits in addition to conventional cooling circuits, enabling the cooling system to better adapt to the complex and changing operating conditions of the chip. This not only effectively dissipates heat when power consumption is stable, but also remains robust in scenarios with sudden power fluctuations, enhancing the overall cooling system's adaptability to diverse operating conditions. This stable temperature environment reduces material fatigue and damage to the chip caused by thermal stress. It avoids the accelerated aging of the chip at high temperatures and the possible changes in physical properties at low temperatures, thereby extending the service life of the chip and reducing the risk of chip failure due to temperature problems.

Claims

1. A high-precision chip temperature control system, comprising a control board (13) and a heating chip (12), wherein the control board (13) is connected to the heating chip (12) by signal, and the heating chip (12) feeds back the chip power consumption value and the chip temperature value to the control board (13), characterized in that: The system further comprises a main cooling circuit (2), an auxiliary peak-cutting cooling circuit (8), and an auxiliary valley-filling heating circuit (9), wherein the main cooling circuit (2) is connected to a heat exchange pipeline of a heating chip (12), and two branches, namely an auxiliary peak-cutting cooling circuit (8) and an auxiliary valley-filling heating circuit (9), are provided between the main cooling circuit (2) and the heat exchange pipeline of the heating chip (12). The auxiliary peak-cutting cooling circuit (8) and the auxiliary valley-filling heating circuit (9) are connected to the main cooling circuit (2) via a first gear pump (10) and a second gear pump (11), respectively. The first gear pump (10) and the second gear pump (11) are connected to the control circuit (12) respectively. The board (13) is connected to the signal of the main cooling circuit (2), the main cooling circuit (2) is connected to the output end and the return end of the main cooling circuit liquid storage tank (1), the input end of the auxiliary peak-cutting cooling circuit (8) is connected to the peak-cutting cooling liquid storage tank (5), the output end of the auxiliary peak-cutting cooling circuit (8) is connected to the first gear pump (10), the input end of the auxiliary valley-filling heating circuit (9) is connected to the valley-filling heating liquid storage tank (4), the output end of the auxiliary valley-filling heating circuit (9) is connected to the second gear pump (11), the peak-cutting cooling liquid storage tank (5) is connected to the refrigeration system (7), and the valley-filling heating liquid storage tank (4) is connected to the heating system (6); The control panel (13) includes a real-time data acquisition and processing module, a historical data analysis and prediction module, a PID controller module, a feedforward compensation module, and a comprehensive control decision module; The real-time data acquisition and processing module inputs the real-time power consumption P(t) and temperature T(t) data from the heating chip (12), and outputs the pre-processed power consumption and temperature data stream; The historical data analysis and prediction module inputs the data received from the real-time data acquisition and processing module and outputs the power consumption prediction value ; The PID controller module inputs the target temperature set point T setpoint and current temperature T(t), outputs the flow regulation amount Q based on the error calculation PID and pass the results to the comprehensive control decision module; The feedforward compensation module inputs the power consumption prediction value , output feedforward regulation Q feedforward ; The comprehensive control decision module receives the flow adjustment value Q PID and the feedforward regulation Q feedforward , output comprehensive flow regulation instruction Q final , thereby controlling the operation of the first gear pump (10) and the second gear pump (11).

2. A high-precision chip temperature control system according to claim 1, characterized in that: A heat exchanger (15) is provided on the return end of the main cooling circuit (2) near the main cooling circuit liquid storage tank (1), and a fan (14) is provided on the heat exchanger (15). The fan (14) is connected to the control panel (13) via a signal.

3. The high-precision chip temperature control system according to claim 1, characterized in that: A main circuit pump (3) is provided at the output end of the main cooling circuit (2) close to the main cooling circuit liquid storage tank (1), and the main circuit pump (3) is connected to the control panel (13) via a signal.

4. The high-precision chip temperature control system according to claim 1, characterized in that: The main cooling circuit (2) is provided with a solenoid valve near the end of the main circuit pump (3).

5. The high-precision chip temperature control system according to claim 1, characterized in that: The control panel (13) further comprises a physical parameter compensation module, a flow comprehensive adjustment module, a flow fine-tuning module, and a final flow adjustment instruction generation module; The physical parameter compensation module receives the instruction of the comprehensive control decision module and inputs the comprehensive flow adjustment instruction Q final , fine-tuning is performed based on actual physical conditions, and then passed to the flow comprehensive regulation module, which outputs the final flow regulation instruction after physical parameter adjustment; The flow comprehensive regulation module receives instructions from the physical parameter compensation module, inputs the final flow regulation instruction, directly controls the operation of the two gear pumps, and outputs driving signals to the first gear pump (10) and the second gear pump (11); The flow fine-tuning module is inserted after the physical parameter compensation module or directly connected before the flow comprehensive adjustment module, and is used to make fine adjustments to the flow; The final flow regulation instruction generation module serves as an information aggregation point, receives status reports from all modules, and issues a final flow regulation instruction.

6. The high-precision chip temperature control system according to claim 1, characterized in that: The feedforward compensation module outputs the feedforward adjustment value Q feedforward The calculation formula is: ； where k f is the feedforward gain coefficient, is the power consumption prediction value, and P(t) is the current actual power consumption value.

7. The high-precision chip temperature control system according to claim 1, characterized in that: The PID controller module outputs the flow regulation quantity Q based on the error calculation PID The calculation formula is: ； Where: e(t) = T setpoint -T(t) is the error signal, K p , K i , K d are the proportional, integral and differential coefficients respectively, Q PID (t) is the flow adjustment calculated by the PID controller, which represents the coolant or heating fluid flow rate that needs to be adjusted at time t to correct the deviation between the current temperature and the target temperature.

8. The high-precision chip temperature control system according to claim 5, characterized in that: The comprehensive control decision module outputs the comprehensive flow regulation instruction Q final The calculation formula is: ； Among them, α is the weight factor of PID adjustment amount, and β is the weight factor of feedforward compensation amount.

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