Intelligent Bonding Silver Wire Method and System with Intelligent Regulation of Power Supply Power

Abstract

The present invention relates to the technical field of power management, and discloses an intelligent bonding silver wire method for intelligent regulation of power supply power. The method includes: querying the bonding process of the intelligent bonding silver wire, setting the power supply power of the intelligent bonding silver wire, and collecting the bonding data of the intelligent bonding silver wire; identifying the classification data items of the bonding data and extracting the key bonding parameters of the bonding data; identifying the action relationship between the power supply power and the bonding quality, and setting a power tracking system for the power supply power; analyzing the parameter change law of the power supply power and identifying the constraint conditions of the power supply power; setting the power distribution mode and abnormal warning threshold of the power supply power, and based on the abnormal warning threshold and the power distribution mode, setting an adaptive adjustment mechanism for the power supply power; combining the power tracking system, the adaptive adjustment mechanism and the power distribution mode, and performing intelligent regulation on the power supply power to obtain an intelligent regulation result. The present invention can realize intelligent regulation of the power supply power of the bonding silver wire and improve the bonding quality.

Description

Technical Field

[0001] The present invention relates to the technical field of power management, and particularly to an intelligent bonding silver wire method and system for intelligent regulation of power supply power. Background Art

[0002] The intelligent bonding silver wire for intelligent regulation of power supply power refers to a bonding silver wire that can dynamically adjust its electrical conductivity according to the load demand and operating state of the power supply system to adapt to different load demands, improve energy utilization efficiency and the overall performance of the system. With the rapid development of microelectronics technology and the increasing demand for intelligent manufacturing, the requirements for bonding silver wire and its process have gradually increased. To improve the production efficiency and quality control of bonding silver wire, the management of power supply power has become a key factor.

[0003] In the prior art, the power supply power control of bonding silver wire mainly adopts fixed parameter settings and cannot be dynamically adjusted according to the actual load demand, which affects the control accuracy of the power supply power of bonding silver wire and results in poor quality of bonding silver wire. Summary of the Invention

[0004] To solve the above problems, the present invention provides an intelligent bonding silver wire method and system for intelligent regulation of power supply power, which can realize intelligent regulation of the power supply power of bonding silver wire and improve the bonding quality.

[0005] In the first aspect, the present invention provides an intelligent bonding silver wire method for intelligent regulation of power supply power, including:

[0006] Obtain the intelligent bonding silver wire to be regulated, query the bonding process of the intelligent bonding silver wire, set the power supply power of the intelligent bonding silver wire according to the bonding process, and collect the bonding data of the intelligent bonding silver wire;

[0007] Identify the classification data items of the bonding data, analyze the mutual dependence degree between the power supply power and the classification data items, and extract the key bonding parameters of the bonding data according to the mutual dependence degree;

[0008] Based on the key bonding parameters, analyze the bonding quality of the intelligent bonding silver wire, identify the action relationship between the power supply power and the bonding quality, and set the power tracking system of the power supply power according to the action relationship;

[0009] According to the power tracking system, collect the real-time parameters of the power supply power, analyze the parameter change law of the power supply power based on the real-time parameters, and identify the constraint conditions of the power supply power according to the parameter change law;

[0010] Based on the above constraints, set the power distribution mode of the power supply power. According to the power distribution mode, set the abnormal warning threshold of the power supply power. Based on the abnormal warning threshold and the power distribution mode, set the adaptive adjustment mechanism of the power supply power;

[0011] Combined with the power tracking system, the adaptive adjustment mechanism and the power distribution mode, intelligently regulate the power supply power to obtain an intelligent regulation result.

[0012] In a possible implementation manner of the first aspect, setting the power supply power of the intelligent bonding silver wire according to the bonding process includes:

[0013] Identify the process type of the bonding process;

[0014] Based on the process type, identify the bonding object corresponding to the intelligent bonding silver wire;

[0015] Analyze the first material property and the second material property of the intelligent bonding silver wire and the bonding object;

[0016] According to the first material property and the second material property, analyze the energy requirements corresponding to the process type;

[0017] Based on the energy requirements, identify the bonding environmental conditions of the intelligent bonding silver wire and the bonding object;

[0018] Combined with the energy requirements, the material properties and the bonding environmental conditions, set the power supply power of the intelligent bonding silver wire.

[0019] In a possible implementation manner of the first aspect, analyzing the bonding quality of the intelligent bonding silver wire based on the key bonding parameters includes:

[0020] Based on the key bonding parameters, identify the bonding interface of the intelligent bonding silver wire;

[0021] Analyze the material properties and surface states of the bonding interface;

[0022] According to the material properties and the surface states, identify the bonding influencing factors of the intelligent bonding silver wire;

[0023] Based on the intelligent bonding silver wire, extract the bonding points of the bonding interface;

[0024] According to the bonding influencing factors, analyze the stability degree of the bonding points;

[0025] Combined with the material properties, the surface states and the stability degree, analyze the bonding quality of the intelligent bonding silver wire.

[0026] In a possible implementation of the first aspect, the power tracking system for setting the power of the power supply according to the action relationship includes:

[0027] Identifying the bonding quality corresponding to the power of the power supply according to the action relationship;

[0028] Setting a quality standard for the bonding quality, and setting a power floating threshold for the power of the power supply according to the quality standard;

[0029] Configuring a power monitoring device for the power of the power supply, and collecting real-time power parameters of the power of the power supply based on the power monitoring device;

[0030] Setting a tracking trigger condition for the real-time power parameters according to the power floating threshold;

[0031] Combining the power floating threshold, the power monitoring device and the tracking trigger condition to set the power tracking system for the power of the power supply.

[0032] In a possible implementation of the first aspect, the analysis of the parameter change law of the power of the power supply based on the real-time parameters includes:

[0033] Extracting historical data of the power of the power supply, and extracting power change data of the historical data;

[0034] Identifying time series data of the power change data;

[0035] Analyzing the historical change trend of the power of the power supply based on the time series data;

[0036] Analyzing the change conditions of the power of the power supply according to the power change data;

[0037] Extracting the characteristic performance of the power of the power supply under the historical change trend;

[0038] Based on the change conditions and the characteristic performance, constructing a trend change model of the power of the power supply;

[0039] Analyzing the parameter change law of the power of the power supply according to the trend change model.

[0040] In a possible implementation of the first aspect, the identification of the constraint conditions of the power of the power supply according to the parameter change law includes:

[0041] Identifying the influencing factors of the parameter change law;

[0042] Analyzing the factor types of the influencing factors;

[0043] Calculate the proportion of the influence of the factor type on the power supply power using the following formula:

[0044] ;

[0045] Among them, represents the proportion of the influence of the factor type on the power supply power, represents the total number of evaluations corresponding to the factor type, represents the index of the number of evaluation times, represents the evaluation score of the i-th factor type on the power supply power, represents the weight coefficient of the represents the total number of factor types, represents the index number of the factor type, represents the adjustment coefficient of the i-th factor type on the power supply power;

[0046] Extract the key factor types of the influencing factors according to the proportion of influence;

[0047] Identify the bonding area corresponding to the power supply power and analyze the properties of the bonding material in the bonding area;

[0048] Identify the output threshold of the power supply power according to the properties of the bonding material;

[0049] Extract the bonding operation equipment in the bonding area and extract the maximum power output range of the bonding operation equipment;

[0050] Combine the key factor types, the output threshold, and the maximum power output range to identify the constraint conditions of the power supply power.

[0051] In a possible implementation manner of the first aspect, setting the power distribution mode of the power supply power based on the constraint conditions includes:

[0052] Identify the power transmission path of the power supply power;

[0053] Determine the bonding material and bonding area corresponding to the power supply power according to the power transmission path;

[0054] Identify the bonding stage of the bonding material and analyze the stage power requirement of the bonding material based on the bonding stage;

[0055] Extract the material bonding points in the bonding area and identify the bonding point positions of the material bonding points;

[0056] Identify the material properties of the bonding material, and analyze the regional power demand of the bonding material according to the material properties and the bonding point position;

[0057] Analyze the bonding effect of the bonding material based on the constraint conditions;

[0058] Set the power distribution mode of the power supply according to the bonding effect, the stage power demand and the regional power demand;

[0059] In a possible implementation manner of the first aspect, the setting of the abnormal warning threshold of the power supply according to the power distribution mode includes:

[0060] Identify the bonding stage and the bonding object corresponding to the power supply according to the power distribution mode;

[0061] Analyze the stage power demand of the bonding stage, and analyze the material properties of the bonding object;

[0062] Set the segmented power standard of the power supply based on the stage power demand and the material properties;

[0063] Define the stage abnormal condition of the power supply according to the segmented power standard;

[0064] Set the abnormal warning threshold of the power supply based on the segmented power standard and the stage abnormal condition.

[0065] In a possible implementation manner of the first aspect, the setting of the adaptive adjustment mechanism of the power supply based on the abnormal warning threshold and the power distribution mode includes:

[0066] Set the abnormal feedback mechanism of the power supply based on the abnormal warning threshold;

[0067] Locate the abnormal area of the power supply according to the abnormal feedback mechanism;

[0068] Analyze the required power of the abnormal area based on the power distribution mode;

[0069] Use the following formula to identify the reasonable degree of operation of the required power in the abnormal area:

[0070] ;

[0071] where M represents the reasonable degree of operation of the required power in the abnormal area, represents the adjustment coefficient of the required power in the abnormal area, represents the difference value between the required power and the actual power in the abnormal area at a specific time t, Represents the corrected value of the demand power in the abnormal area at a specific time t. Represents the error tolerance of the demand power in the abnormal area at a specific time t.

[0072] Set the mode switching condition of the power distribution mode according to the reasonable degree of operation.

[0073] Based on the mode switching condition and the demand power, set the adaptive adjustment mechanism of the power supply power.

[0074] In a second aspect, the intelligent bonding silver wire system for intelligent regulation of power supply power provided by the present invention is characterized in that the system includes:

[0075] A data acquisition module, configured to obtain the intelligent bonding silver wire to be regulated, query the bonding process of the intelligent bonding silver wire, set the power supply power of the intelligent bonding silver wire according to the bonding process, and collect the bonding data of the intelligent bonding silver wire.

[0076] A key parameter extraction module, configured to identify the classified data items of the bonding data, analyze the mutual dependence degree between the power supply power and the classified data items, and extract the key bonding parameters of the bonding data according to the mutual dependence degree.

[0077] A power tracking module, configured to analyze the bonding quality of the intelligent bonding silver wire based on the key bonding parameters, identify the action relationship between the power supply power and the bonding quality, and set the power tracking system of the power supply power according to the action relationship.

[0078] A rule analysis module, configured to collect the real-time parameters of the power supply power according to the power tracking system, analyze the parameter change rule of the power supply power based on the real-time parameters, and identify the constraint conditions of the power supply power according to the parameter change rule.

[0079] A power distribution module, configured to set the power distribution mode of the power supply power based on the constraint conditions, set the abnormal warning threshold of the power supply power according to the power distribution mode, and set the adaptive adjustment mechanism of the power supply power based on the abnormal warning threshold and the power distribution mode.

[0080] An intelligent regulation module, configured to intelligently regulate the power supply power by combining the power tracking system, the adaptive adjustment mechanism and the power distribution mode to obtain an intelligent regulation result.

[0081] Compared with the prior art, the technical principle and beneficial effects of the above solution are as follows:

[0082] In the embodiments of the present invention, by querying the bonding process of the intelligent bonding silver wire, setting the power of the intelligent bonding silver wire according to the bonding process, and collecting the bonding data of the intelligent bonding silver wire, the key parameters affecting the power demand in the bonding process can be determined, and the relationship between the power and the bonding data can be determined to realize the intelligent control of the bonding silver wire equipment; further, by analyzing the interdependence between the power and the classified data items, and extracting the key bonding parameters of the bonding data according to the interdependence, the bonding process can be better monitored and controlled to ensure the quality of the bonded products; secondly, by identifying the relationship between the power and the bonding quality, and setting up a power tracking system for the power according to the relationship, the optimal power setting can be determined, the bonding process can be optimized, and by precisely controlling the power, the fluctuations in the bonding process can be reduced, and the consistency of the bonding process can be improved; thirdly, by analyzing the parameter change law of the power, and identifying the constraint conditions of the power according to the parameter change law, the regulation strategy of the power can be continuously learned and optimized, more scientific and data-driven decisions can be made, the intelligent level of the bonding process can be improved, and the power can be automatically adjusted according to the constraint conditions to ensure that the power is maintained within the range that can produce high-quality bonding; in addition, by setting the power distribution mode of the power based on the constraint conditions, sufficient energy can be ensured for the bonding area, thermal damage to the material can be avoided during the bonding process, the production efficiency can be improved, and based on the abnormal warning threshold and the power distribution mode, an adaptive adjustment mechanism for the power can be set, and the power can be flexibly adjusted according to different production conditions and material characteristics to realize the intelligent regulation of the power; finally, by combining the power tracking system, the adaptive adjustment mechanism and the power distribution mode, the intelligent regulation of the power is carried out to obtain an intelligent regulation result, which helps to maintain the stability of the bonding process, reduce fluctuations and defects, thereby improving the bonding quality. At the same time, through precise power distribution, unnecessary energy waste can be avoided, energy-saving production can be realized, and the intelligent regulation system can quickly adapt to different production requirements, enhancing the flexibility and adaptability of the bonding process. Therefore, the intelligent bonding silver wire method for intelligent regulation of the power of the bonding silver wire proposed by the present invention can realize the intelligent regulation of the power of the bonding silver wire and improve the bonding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0083] The accompanying drawings herein are incorporated into the specification and form a part of the specification, showing embodiments consistent with the present invention and used together with the specification to explain the principles of the present invention.

[0084] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0085] Figure 1 Schematic flowchart of an intelligent bonding silver wire method for intelligent power regulation of a power supply provided by an embodiment of the present invention;

[0086] Figure 2 Schematic module diagram of an intelligent bonding silver wire system for intelligent power regulation of a power supply provided by an embodiment of the present invention. Detailed implementation manners

[0087] It should be understood that the specific implementation manners described herein are only used to explain the present invention and are not used to limit the present invention.

[0088] The embodiment of the present invention provides an intelligent bonding silver wire method for intelligent power regulation of a power supply. The execution subject of the intelligent bonding silver wire method for intelligent power regulation of the power supply includes, but is not limited to, at least one of electronic devices such as a server, a terminal, etc. that can be configured to execute the method provided by the embodiment of the present invention. In other words, the intelligent bonding silver wire method for intelligent power regulation of the power supply can be executed by software or hardware installed on a terminal device or a server device, and the software can be a blockchain platform. The server includes, but is not limited to: a single server, a server cluster, a cloud server, or a cloud server cluster, etc. The server can be an independent server or a cloud server that provides basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, Content Delivery Network (CDN), and big data and artificial intelligence platforms.

[0089] Refer to Figure 1 As shown, it is a schematic flowchart of an intelligent bonding silver wire method for intelligent power regulation of a power supply provided by an embodiment of the present invention. Among them, Figure 1 The intelligent bonding silver wire method for intelligent power regulation described in

[0090] S1. Obtain the intelligent bonding silver wire to be regulated, query the bonding process of the intelligent bonding silver wire, set the power supply power of the intelligent bonding silver wire according to the bonding process, and collect the bonding data of the intelligent bonding silver wire.

[0091] In an embodiment of the present invention, by obtaining the intelligent bonding silver wire to be regulated and querying the bonding process of the intelligent bonding silver wire, key parameters affecting the power supply power demand in the bonding process can be determined, providing data support for the intelligent regulation of the power supply power of the subsequent intelligent bonding silver wire. The intelligent bonding silver wire refers to the silver wire monitored and adjusted by an intelligent control system during the bonding process. The bonding process refers to a technical process of using a silver wire as a connection material to connect the electrodes of a chip to a lead frame or a substrate.

[0092] Optionally, the query of the bonding process of the intelligent bonding silver wire can be obtained through a process experiment.

[0093] Furthermore, in an embodiment of the present invention, by setting the power supply power of the intelligent bonding silver wire according to the bonding process and collecting the bonding data of the intelligent bonding silver wire, the relationship between the power supply power and the bonding data can be determined to achieve intelligent control of the bonding silver wire equipment. The power supply power refers to the electrical energy power supplied to the bonding equipment during the bonding of the silver wire. The bonding data refers to various parameter and performance index data collected during the bonding process, such as bonding strength, resistance of the bonding point, tension of the bonding wire, etc.

[0094] Optionally, the collection of the bonding data of the intelligent bonding silver wire can be obtained through sensors built in the bonding silver wire equipment.

[0095] As an embodiment of the present invention, setting the power supply power of the intelligent bonding silver wire according to the bonding process includes: identifying the process type of the bonding process; based on the process type, identifying the bonding object corresponding to the intelligent bonding silver wire; analyzing the first material properties and the second material properties of the intelligent bonding silver wire and the bonding object; according to the first material properties and the second material properties, analyzing the energy demand corresponding to the process type; based on the energy demand, identifying the bonding environmental conditions of the intelligent bonding silver wire and the bonding object; and combining the energy demand, the material properties, and the bonding environmental conditions to set the power supply power of the intelligent bonding silver wire.

[0096] Among them, the energy demand refers to the total amount of energy required to complete the bonding process, such as ultrasonic energy, thermal energy, etc. The bonding object refers to two components that the bonding silver wire needs to connect, such as a chip and a substrate, a chip and a lead frame, etc. The first material properties refer to the physical and chemical properties of the bonding silver wire itself, such as melting point, conductivity, hardness, ductility, etc. The second material properties refer to the material properties of the bonding object, including thermal expansion coefficient, thermal conductivity, conductivity, surface state, etc. The bonding environmental conditions refer to the environmental conditions during the bonding process, such as temperature, humidity, cleanliness, pressure, etc.

[0097] Optionally, the analysis of the first material property and the second material property of the intelligent bonding silver wire and the bonding object can be determined through laboratory experiments. Based on the energy requirement, the identification of the bonding environmental conditions of the intelligent bonding silver wire and the bonding object can be achieved by using environmental monitoring equipment, such as a thermometer.

[0098] S2. Identify the classification data items of the bonding data, analyze the interdependence degree between the power supply power and the classification data items, and extract the key bonding parameters of the bonding data according to the interdependence degree.

[0099] In the embodiment of the present invention, by identifying the classification data items of the bonding data, the composition parameter types of the bonding data can be clarified to obtain key characteristic parameters. The classification data items refer to the specific data types obtained by classifying the data collected during the bonding process according to their attributes and functions, such as material property data, environmental condition data, equipment status data, etc.

[0100] Optionally, the identification of the classification data items of the bonding data can be implemented by using a support vector machine.

[0101] Furthermore, in the embodiment of the present invention, by analyzing the interdependence degree between the power supply power and the classification data items, the optimal bonding parameters can be determined to achieve more precise control of the power supply power. The interdependence degree refers to the relationship density between the power supply power and the classification data items.

[0102] Optionally, the analysis of the interdependence degree between the power supply power and the classification data items can be implemented by using a mutual information formula.

[0103] In the embodiment of the present invention, by extracting the key bonding parameters of the bonding data according to the interdependence degree, the bonding process can be better monitored and controlled to ensure the quality of the bonded product. The key bonding parameters refer to the variables or attributes that have a significant impact on the bonding result in the bonding data, such as power supply power, material properties, bonding speed, etc.

[0104] Optionally, the extraction of the key bonding parameters of the bonding data according to the interdependence degree can be implemented by using a machine learning algorithm, such as a decision tree algorithm.

[0105] S3. Based on the key bonding parameters, analyze the bonding quality of the intelligent bonding silver wire, identify the action relationship between the power supply power and the bonding quality, and set a power tracking system for the power supply power according to the action relationship.

[0106] In the embodiments of the present invention, by analyzing the bonding quality of the intelligent bonding silver wire based on the key bonding parameters, the optimal power supply power setting can be determined to achieve high-quality bonding. The bonding quality refers to the connection quality formed between two or more materials or components during the bonding process.

[0107] As an embodiment of the present invention, the analyzing of the bonding quality of the intelligent bonding silver wire based on the key bonding parameters includes: identifying the bonding interface of the intelligent bonding silver wire based on the key bonding parameters; analyzing the material properties and surface states of the bonding interface; identifying the bonding influencing factors of the intelligent bonding silver wire according to the material properties and the surface states; extracting the bonding points of the bonding interface based on the intelligent bonding silver wire; analyzing the stability degree of the bonding points according to the bonding influencing factors; and analyzing the bonding quality of the intelligent bonding silver wire by combining the material properties, the surface states and the stability degree.

[0108] Among them, the bonding interface refers to the contact area between the silver wire and the material to be bonded (such as a semiconductor chip or a substrate), the material properties refer to the general term of the inherent properties of the silver wire and the relevant properties of the material to be bonded, the surface state refers to the cleanliness, roughness, oxide layer condition, etc. of the bonding interface, the bonding influencing factors refer to the variables or conditions that affect the bonding process and the final bonding quality, such as the contact area between the bonding materials, environmental pollutants, the shape of the bonding points, etc., the bonding points refer to the physical connection points formed between the silver wire and the material to be bonded, and the stability degree refers to the ability of the bonding points to maintain their integrity and performance under various environments and working conditions.

[0109] Optionally, the analysis of the surface state of the bonding interface can be realized by using a surface profiler, the extraction of the bonding points of the bonding interface can be obtained through a microscope, and the analysis of the stability degree of the bonding points according to the bonding influencing factors can be realized by using thermal cycle tests, mechanical stress tests and chemical stability tests.

[0110] Furthermore, in the embodiments of the present invention, by identifying the interaction relationship between the power supply power and the bonding quality, the bonding process can be optimized to achieve the intelligent control of the power supply power. The interaction relationship refers to the mutual influence and causal connection between the power supply power and the bonding quality.

[0111] Optionally, the analysis of the interaction relationship between the power supply power and the bonding quality can be determined by a regression analysis method.

[0112] In an embodiment of the present invention, by setting up a power tracking system for the power supply according to the above-mentioned functional relationship, the power supply power can be accurately controlled, fluctuations during the bonding process can be reduced, and the consistency of the bonding process can be improved. The power tracking system refers to a system for monitoring and tracking the power supply power during the bonding process.

[0113] As an embodiment of the present invention, the power tracking system for setting the power supply power according to the above-mentioned functional relationship includes: identifying the bonding quality corresponding to the power supply power according to the functional relationship; setting a quality standard for the bonding quality, and setting a power floating threshold for the power supply power according to the quality standard; configuring a power monitoring device for the power supply power, and collecting real-time power parameters of the power supply power based on the power monitoring device; setting a tracking trigger condition for the real-time power parameters according to the power floating threshold; and setting up the power tracking system for the power supply power in combination with the power floating threshold, the power monitoring device, and the tracking trigger condition.

[0114] Among them, the quality standard refers to predefined performance indicators that the bonding quality should achieve, such as mechanical strength, electrical performance, thermal stability, etc. The power floating threshold refers to the allowable fluctuation range of the power supply power during the bonding process. The power monitoring device refers to a device or system for real-time measuring and recording the power supply power. The real-time power parameters refer to the power supply power data collected in real time during the bonding process. The tracking trigger condition refers to a specific condition under which the system automatically takes action when the real-time parameters of the power supply power reach or exceed the preset power floating threshold.

[0115] Optionally, the setting of the quality standard for the bonding quality can be determined according to the quality requirements of the bonding silver wire, and the configuration of the power monitoring device for the power supply power can be realized by using a power sensor, such as a thermocouple.

[0116] S4. According to the power tracking system, collect the real-time parameters of the power supply power, analyze the parameter change law of the power supply power based on the real-time parameters, and identify the constraint conditions of the power supply power according to the parameter change law.

[0117] In an embodiment of the present invention, by collecting the real-time parameters of the power supply power according to the power tracking system, the power supply power during the bonding process can be adjusted immediately to cope with any changes during the process. The real-time parameters refer to the power supply power parameters collected in real time during the bonding process.

[0118] Optionally, the collection of the real-time parameters of the power supply power according to the power tracking system can be realized by using a power meter.

[0119] Furthermore, in the embodiments of the present invention, by analyzing the parameter change law of the power supply power based on the real-time parameters, the regulation strategy of the power supply power can be continuously learned and optimized according to the real-time data and historical data, so as to make more scientific and data-driven decisions and improve the intelligent level of the bonding process. The parameter change law refers to the mode and trend of the power supply power changing with time or other factors during the bonding process.

[0120] As an embodiment of the present invention, the analyzing the parameter change law of the power supply power based on the real-time parameters includes: extracting the historical data of the power supply power and extracting the power change data of the historical data; identifying the time series data of the power change data; analyzing the historical change trend of the power supply power based on the time series data; analyzing the change conditions of the power supply power according to the power change data; extracting the characteristic performance of the power supply power under the historical change trend; constructing a trend change model of the power supply power based on the change conditions and the characteristic performance; and analyzing the parameter change law of the power supply power according to the trend change model.

[0121] Among them, the historical data refers to the power supply power data collected during past bonding processes, the power change data refers to the values extracted from the historical data representing the change of the power supply power during the bonding process, the time series data refers to the power change data arranged in chronological order, the historical change trend refers to the overall trend of the power supply power changing with time, such as rising, falling or periodic fluctuations, the change conditions refer to the specific conditions or factors affecting the change of the power supply power, such as material characteristics, environmental conditions, equipment status, etc., the characteristic performance refers to the specific characteristics shown by the power supply power, such as power peaks, valleys, stable intervals, etc., and the trend change model refers to a mathematical model describing and predicting the change trend of the power supply power.

[0122] Optionally, the identification of the time series data of the power change data can be obtained through time series analysis, the analysis of the change conditions of the power supply power according to the power change data can be realized by using experimental design software, such as DOE software, and the construction of the trend change model of the power supply power based on the change conditions and the characteristic performance can be obtained through a deep learning model.

[0123] In the embodiments of the present invention, by identifying the constraint conditions of the power supply power according to the parameter change law, the power supply power can be automatically adjusted according to the constraint conditions to ensure that the power supply power is maintained within the range capable of generating high-quality bonding. The constraint conditions refer to the factors restricting or controlling the change of the power supply power, such as material characteristics, environmental temperature, equipment specifications, etc.

[0124] As an embodiment of the present invention, identifying the constraint conditions of the power supply power according to the parameter change rule includes: identifying the influencing factors of the parameter change rule; analyzing the factor types of the influencing factors; calculating the contribution ratio of each factor type to the power supply power; extracting the key factor types of the influencing factors according to the contribution ratio; identifying the bonding area corresponding to the power supply power and analyzing the bonding material properties of the bonding area; identifying the output threshold of the power supply power according to the bonding material properties; extracting the bonding operation device of the bonding area and extracting the maximum power output range of the bonding process operation device; combining the key factor types, the output threshold and the maximum power output range to identify the constraint conditions of the power supply power.

[0125] Among them, the influencing factor refers to various reasons that cause the change of the power supply power, the factor type refers to the classification of the influencing factors, such as physical, environmental or equipment factors, the contribution ratio refers to the contribution ratio of each factor to the change of the power supply power, the key factor type refers to the factor type that significantly affects the power supply power, the bonding area refers to the area where the silver wire contacts the substrate and forms a bond, the bonding material property refers to the material characteristics that affect the bonding process and the power supply power requirements, the output threshold refers to the minimum and maximum values of the power supply power, the bonding operation device refers to the device that performs the bonding operation, such as a bonding machine, and the maximum power output range refers to the maximum power supply power range that the bonding operation device can provide.

[0126] Optionally, the analysis of the bonding material properties of the bonding area can be realized by using a material data sheet, and the identification of the bonding area corresponding to the power supply power can be determined by a thermal imager, such as a thermal imaging camera.

[0127] In an optional embodiment of the present invention, the following formula is used to calculate the contribution ratio of the factor type to the power supply power:

[0128] ;

[0129] Among them, represents the contribution ratio of the factor type to the power supply power, represents the total number of evaluations corresponding to the factor type, represents the index of the number of evaluations, represents the action score of the i-th factor type on the power supply power, represents the weight coefficient of the i-th factor type, represents the total number of factor types, represents the index number of the factor type, represents the regulation coefficient of the i-th factor type on the power supply power.

[0130] S5. Based on the above constraints, set the power distribution mode of the power supply power. According to the power distribution mode, set the abnormal warning threshold of the power supply power. Based on the abnormal warning threshold and the power distribution mode, set the adaptive adjustment mechanism of the power supply power.

[0131] In the embodiment of the present invention, by setting the power distribution mode of the power supply power based on the above constraints, it can ensure that the bonding area obtains sufficient energy, avoid thermal damage to the material during the bonding process, and improve production efficiency. The power distribution mode refers to the strategy of reasonably distributing the power supply power to different stages or different regions during the bonding process according to the specific requirements of the bonding task and the capabilities of the bonding equipment during the process of bonding silver wires.

[0132] As an embodiment of the present invention, setting the power distribution mode of the power supply power based on the above constraints includes: identifying the power transmission path of the power supply power; determining the bonding material and the bonding area corresponding to the power supply power according to the power transmission path; identifying the bonding stage of the bonding material, and analyzing the stage power requirement of the bonding material based on the bonding stage; extracting the material bonding point of the bonding area and identifying the bonding point position of the material bonding point; identifying the material characteristics of the bonding material, and analyzing the regional power requirement of the bonding material according to the material characteristics and the bonding point position; analyzing the bonding effect of the bonding material based on the above constraints; setting the power distribution mode of the power supply power according to the bonding effect, the stage power requirement and the regional power requirement.

[0133] Among them, the power transmission path refers to the path for the power supply power to be transmitted from the power supply system to the bonding tool or the heating element through wires, switches, control units, etc. The bonding stage refers to different stages during the bonding process, such as the preheating stage, the melting stage, the cooling stage, etc. The stage power requirement refers to the power supply power level required for a specific stage of bonding silver wires. The material bonding point refers to the point where the silver wire contacts the substrate and starts to bond. The bonding point position refers to the specific position of the bonding material in the bonding area. The regional power requirement refers to the power required for the bonding points at different positions in the bonding area. The bonding effect refers to the quality and performance after bonding, such as mechanical strength, electrical performance and thermal stability.

[0134] Optionally, the identification of the power transmission path of the power supply power can be determined by the technical specifications of the bonding equipment. The identification of the bonding point position of the material bonding point can be achieved by using a microscopic device. Based on the material properties and the bonding point position, the analysis of the regional power demand of the bonding material can be realized by using simulation tests. Based on the constraint conditions, the analysis of the bonding effect of the bonding material can be obtained through physical and electrical tests after bonding.

[0135] Furthermore, in the embodiment of the present invention, by setting an abnormal warning threshold for the power supply power according to the power distribution mode, it is possible to prevent the power supply power from exceeding the safe operating range of the device, ensuring that the power supply power is maintained within the range capable of producing high-quality bonding. The abnormal warning threshold refers to the upper or lower limit value of the power supply power preset to ensure the safety of the bonding process and the product quality.

[0136] As an embodiment of the present invention, setting the abnormal warning threshold for the power supply power according to the power distribution mode includes: identifying the bonding stage and the bonding object corresponding to the power supply power according to the power distribution mode; analyzing the stage power demand of the bonding stage and the material properties of the bonding object; setting the segmented power standard of the power supply power based on the stage power demand and the material properties; defining the stage abnormal conditions of the power supply power according to the segmented power standard; and setting the abnormal warning threshold for the power supply power based on the segmented power standard and the stage abnormal conditions.

[0137] Among them, the bonding stage refers to different stages in the bonding process, such as the preheating stage. The bonding object refers to the component or material to be bonded, such as silver wire and substrate. The material properties refer to the material properties of the bonding object, including physical and thermodynamic properties, etc. The segmented power standard refers to the recommended power levels for different stages set according to the bonding stage and the material properties. The stage abnormal conditions refer to the conditions under which the power supply power deviates from the normal level.

[0138] Optionally, based on the stage power demand and the material properties, the setting of the segmented power standard of the power supply power can be realized by using statistical analysis. According to the segmented power standard, the definition of the stage abnormal conditions of the power supply power can be determined by using a fault analysis model.

[0139] In the embodiment of the present invention, by setting an adaptive adjustment mechanism for the power supply power based on the abnormal warning threshold and the power distribution mode, the power supply power can be flexibly adjusted according to different production conditions and material properties to achieve intelligent control of the power supply power. The adaptive adjustment mechanism refers to a system or method that can automatically adjust the power output of the power supply according to real-time feedback and preset conditions.

[0140] As an embodiment of the present invention, the adaptive adjustment mechanism for setting the power supply power based on the abnormal warning threshold and the power distribution mode includes: setting an abnormal feedback mechanism for the power supply power based on the abnormal warning threshold; positioning the abnormal area of the power supply power according to the abnormal feedback mechanism; analyzing the required power of the abnormal area based on the power distribution mode; identifying the reasonable degree of operation of the required power in the abnormal area; setting the mode switching condition of the power distribution mode according to the reasonable degree of operation; and setting the adaptive adjustment mechanism for the power supply power based on the mode switching condition and the required power.

[0141] Among them, the abnormal feedback mechanism refers to the mechanism for responding to and processing abnormal situations of the power supply power. The abnormal area refers to the bonding area where the power supply power does not conform to the normal mode or expected behavior. The required power refers to the target power required to maintain the normal operation of the bonding process. The reasonable degree of operation refers to the degree to which the power supply power can meet the expected standards or requirements after adjustment. The mode switching condition refers to the specific condition for triggering the switch from one working mode to another working mode.

[0142] Optionally, the setting of the abnormal feedback mechanism for the power supply power based on the abnormal warning threshold can be implemented by using a defect tracking tool.

[0143] In an alternative embodiment of the present invention, the following formula is used to identify the reasonable degree of operation of the required power in the abnormal area:

[0144] ;

[0145] Among them, M represents the reasonable degree of operation of the required power in the abnormal area, represents the adjustment coefficient of the required power in the abnormal area, represents the difference value between the required power and the actual power in the abnormal area at a specific time t, represents the correction value of the required power in the abnormal area at a specific time t, represents the error tolerance of the required power in the abnormal area at a specific time t.

[0146] S6. Combining the power tracking system, the adaptive adjustment mechanism and the power distribution mode, intelligently regulate the power supply power to obtain an intelligent regulation result.

[0147] In the embodiments of the present invention, by combining the power tracking system, the adaptive adjustment mechanism and the power distribution mode, the power of the power supply is intelligently regulated to obtain an intelligent regulation result, which helps to maintain the stability of the bonding process, reduce fluctuations and defects, thereby improving the bonding quality. At the same time, through precise power distribution, unnecessary energy waste can be avoided, and energy-saving production can be achieved. In addition, the intelligent regulation system can quickly adapt to different production requirements, enhancing the flexibility and adaptability of the bonding silver wire bonding process. The intelligent regulation result refers to the result achieved after real-time monitoring and automatic adjustment of the power supply power during the bonding silver wire process by using the power tracking system, the adaptive adjustment mechanism and the power distribution mode.

[0148] It can be seen that in the embodiments of the present invention, by querying the bonding process of the intelligent bonding silver wire, setting the power of the intelligent bonding silver wire according to the bonding process, and collecting the bonding data of the intelligent bonding silver wire, the key parameters affecting the power demand in the bonding process can be determined, and the relationship between the power and the bonding data can be determined to achieve intelligent control of the bonding silver wire equipment; further, in the embodiments of the present invention, by analyzing the interdependence between the power and the classification data items, and extracting the key bonding parameters of the bonding data according to the interdependence, the bonding process can be better monitored and controlled to ensure the quality of the bonded products; secondly, in the embodiments of the present invention, by identifying the relationship between the power and the bonding quality, and setting up a power tracking system for the power according to the relationship, the optimal power setting can be determined, the bonding process can be optimized, and by precisely controlling the power, the fluctuations in the bonding process can be reduced, and the consistency of the bonding process can be improved; thirdly, in the embodiments of the present invention, by analyzing the parameter change law of the power, and identifying the constraint conditions of the power according to the parameter change law, the regulation strategy of the power can be continuously learned and optimized, more scientific and data-driven decisions can be made, the intelligent level of the bonding process can be improved, and the power can be automatically adjusted according to the constraint conditions to ensure that the power is maintained within the range capable of generating high-quality bonding; in addition, in the embodiments of the present invention, by setting the power distribution mode of the power based on the constraint conditions, sufficient energy can be ensured for the bonding area, thermal damage to the material can be avoided during the bonding process, the production efficiency can be improved, and based on the abnormal warning threshold and the power distribution mode, an adaptive adjustment mechanism for the power can be set, and the power can be flexibly adjusted according to different production conditions and material characteristics to achieve intelligent regulation of the power; finally, in the embodiments of the present invention, by combining the power tracking system, the adaptive adjustment mechanism and the power distribution mode, intelligent regulation of the power is carried out to obtain an intelligent regulation result, which helps to maintain the stability of the bonding process, reduce fluctuations and defects, thereby improving the bonding quality. At the same time, through precise power distribution, unnecessary energy waste can be avoided, energy-saving production can be achieved, and the intelligent regulation system can quickly adapt to different production requirements, enhancing the flexibility and adaptability of the bonding process. Therefore, the intelligent bonding silver wire method for intelligent regulation of the power of the present invention can achieve intelligent regulation of the power of the bonding silver wire and improve the bonding quality.

[0149] As Figure 2 shown, it is a system function module diagram of the intelligent bonding silver wire for intelligent regulation of the power of the present invention.

[0150] The intelligent bonding silver wire system 200 for intelligent regulation of power supply power according to the present invention can be installed in an electronic device. According to the functions achieved, the intelligent bonding silver wire system for intelligent regulation of power supply power may include a data acquisition module 201, a key parameter extraction module 202, a power tracking module 203, a rule analysis module 204, a power distribution module 205, and an intelligent regulation module 206. The modules in the present invention may also be referred to as units, which refer to a series of computer program segments that can be executed by an electronic device processor and can complete fixed functions, and are stored in the memory of the electronic device.

[0151] In the embodiments of the present invention, the functions of each module / unit are as follows:

[0152] The data acquisition module 201 is configured to obtain the intelligent bonding silver wire to be regulated, query the bonding process of the intelligent bonding silver wire, set the power supply power of the intelligent bonding silver wire according to the bonding process, and collect the bonding data of the intelligent bonding silver wire;

[0153] The key parameter extraction module 202 is configured to identify the classification data items of the bonding data, analyze the mutual dependence degree between the power supply power and the classification data items, and extract the key bonding parameters of the bonding data according to the mutual dependence degree;

[0154] The power tracking module 203 is configured to analyze the bonding quality of the intelligent bonding silver wire based on the key bonding parameters, identify the action relationship between the power supply power and the bonding quality, and set the power tracking system of the power supply power according to the action relationship;

[0155] The rule analysis module 204 is configured to collect the real-time parameters of the power supply power according to the power tracking system, analyze the parameter change rule of the power supply power based on the real-time parameters, and identify the constraint conditions of the power supply power according to the parameter change rule;

[0156] The power distribution module 205 is configured to set the power distribution mode of the power supply power based on the constraint conditions, set the abnormal warning threshold of the power supply power according to the power distribution mode, and set the adaptive adjustment mechanism of the power supply power based on the abnormal warning threshold and the power distribution mode;

[0157] The intelligent regulation module 206 is configured to perform intelligent regulation on the power supply power by combining the power tracking system, the adaptive adjustment mechanism and the power distribution mode to obtain an intelligent regulation result.

[0158] Specifically, each module in the intelligent bonding silver wire system 200 for intelligent regulation of power supply power in the embodiments of the present invention adopts the same as the above Figure 1It uses the same technical means as the intelligent bonding silver wire method for intelligent power regulation described in [reference], and can produce the same technical effects, which will not be elaborated here.

[0159] In addition, in each embodiment of the present invention, each functional module can be integrated in a processing unit, or each unit can exist physically alone, or two or more units can be integrated in one unit. The above integrated unit can be implemented in the form of hardware, or in the form of a combination of hardware and software functional modules.

[0160] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms.

[0161] Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be regarded as limiting the claimed invention.

[0162] It should be noted that in this text, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising one..." does not exclude the existence of additional identical elements in the process, method, article or device comprising the element.

[0163] The above are only specific embodiments of the present invention, enabling those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to these embodiments shown herein, but rather to the broadest scope consistent with the principles and novel features invented herein.

Claims

1. An intelligent bonding silver wire method for intelligent regulation of power supply power, characterized in that, The method includes: Obtain the intelligent bonding silver wire to be regulated, query the bonding process of the intelligent bonding silver wire, set the power of the intelligent bonding silver wire according to the bonding process, and collect the bonding data of the intelligent bonding silver wire; Identify the classification data items of the bonding data, analyze the degree of mutual dependence between the power and the classification data items, and extract the key bonding parameters of the bonding data according to the degree of mutual dependence; Based on the key bonding parameters, analyze the bonding quality of the intelligent bonding silver wire, identify the relationship between the power and the bonding quality, and set up a power tracking system for the power according to the relationship; According to the power tracking system, collect the real-time parameters of the power, analyze the parameter change law of the power based on the real-time parameters, and identify the constraint conditions of the power according to the parameter change law; Based on the constraint conditions, set the power distribution mode of the power, set the abnormal warning threshold of the power according to the power distribution mode, and set up an adaptive adjustment mechanism for the power based on the abnormal warning threshold and the power distribution mode; Combining the power tracking system, the adaptive adjustment mechanism and the power distribution mode, intelligently regulate the power to obtain an intelligent regulation result.

2. The method according to claim 1, wherein The setting of the power of the intelligent bonding silver wire according to the bonding process includes: Identify the process type of the bonding process; Based on the process type, identify the bonding object corresponding to the intelligent bonding silver wire; Analyze the first material property and the second material property of the intelligent bonding silver wire and the bonding object; According to the first material property and the second material property, analyze the energy requirement corresponding to the process type; Based on the energy requirement, identify the bonding environmental conditions of the intelligent bonding silver wire and the bonding object; Combining the energy requirement, the material property and the bonding environmental conditions, set the power of the intelligent bonding silver wire.

3. The method according to claim 1, wherein The analysis of the bonding quality of the intelligent bonding silver wire based on the key bonding parameters includes: Based on the key bonding parameters, identify the bonding interface of the intelligent bonding silver wire; Analyze the material property and the surface state of the bonding interface; According to the material property and the surface state, identify the bonding influencing factors of the intelligent bonding silver wire; Based on the intelligent bonding silver wire, extract the bonding points of the bonding interface; According to the bonding influencing factors, analyze the stability degree of the bonding points; Combining the material property, the surface state and the stability degree, analyze the bonding quality of the intelligent bonding silver wire.

4. The method according to claim 1, characterized in that The setting of the power tracking system of the power according to the relationship includes: According to the relationship, identify the bonding quality corresponding to the power; Set the quality standard of the bonding quality, and set the power floating threshold of the power according to the quality standard; Configure the power monitoring device of the power, and collect the real-time power parameters of the power based on the power monitoring device; Set the tracking trigger condition of the real-time power parameter according to the power floating threshold; Combine the power floating threshold, the power monitoring device and the tracking trigger condition to set the power tracking system of the power supply; 5. The method according to claim 1, characterized in that, Analyze the parameter change law of the power supply power based on the real-time parameter, including: Extract the historical data of the power supply power and extract the power change data of the historical data; Identify the time series data of the power change data; Analyze the historical change trend of the power supply power based on the time series data; Analyze the change condition of the power supply power according to the power change data; Extract the characteristic performance of the power supply power under the historical change trend; Construct a trend change model of the power supply power based on the change condition and the characteristic performance; Analyze the parameter change law of the power supply power according to the trend change model; 6. The method according to claim 1, characterized in that, Identify the constraint condition of the power supply power according to the parameter change law, including: Identify the influencing factors of the parameter change law; Analyze the factor type of the influencing factors; Use the following formula to calculate the proportion of the effect of the factor type on the power supply power: ； Among them, represents the proportion of the effect of the factor type on the power supply power, represents the total number of evaluations corresponding to the factor type, represents the evaluation times index of the factor type, represents the effect score of the factor type on the power supply power in the i-th evaluation, represents the weight coefficient of the factor type in the represents the total number of factor types, represents the index number of the factor type, represents the regulation coefficient of the power supply power by the j-th factor type; Extract the key factor type of the influencing factors according to the proportion of the effect; Identify the bonding area corresponding to the power supply power and analyze the bonding material properties of the bonding area; Identify the output threshold of the power supply power according to the bonding material properties; Extract the bonding operation device of the bonding area and extract the maximum power output range of the bonding operation device; Combine the key factor type, the output threshold and the maximum power output range to identify the constraint condition of the power supply power; 7. The method according to claim 1, characterized in that, Set the power distribution mode of the power supply power based on the constraint condition, including: Identify the power transmission path of the power supply power; Determine the bonding material and bonding area corresponding to the power supply power according to the power transmission path; Identify the bonding stage of the bonding material, and analyze the stage power requirement of the bonding material based on the bonding stage; Extract the material bonding point of the bonding area and identify the bonding point position of the material bonding point; Identify the material characteristics of the bonding material, and analyze the regional power requirement of the bonding material according to the material characteristics and the bonding point position; Analyze the bonding effect of the bonding material based on the constraint condition; Set the power distribution mode of the power supply power according to the bonding effect, the stage power requirement and the regional power requirement; 8. The method according to claim 1, wherein Set the abnormal warning threshold of the power supply power according to the power distribution mode, including: Identify the bonding stage and bonding object corresponding to the power supply power according to the power distribution mode; Analyze the stage power requirement of the bonding stage and analyze the material properties of the bonding object; Set the segmented power standard of the power supply power based on the stage power requirement and the material properties; Define the stage abnormal condition of the power supply power according to the segmented power standard; Set the abnormal warning threshold of the power supply power based on the segmented power standard and the stage abnormal condition; 9. The method according to claim 1, characterized in that Based on the abnormal warning threshold and the power distribution mode, set an adaptive adjustment mechanism for the power supply power, including: Based on the abnormal warning threshold, set an abnormal feedback mechanism for the power supply power; According to the abnormal feedback mechanism, locate the abnormal area of the power supply power; Based on the power distribution mode, analyze the required power of the abnormal area; Use the following formula to identify the reasonable degree of operation of the required power in the abnormal area: ； Among them, M represents the reasonable degree of operation of the demand power in the abnormal area, represents the adjustment coefficient of the demand power in the abnormal area, represents the difference value between the demand power and the actual power in the abnormal area at a specific time t, represents the correction value of the demand power in the abnormal area at a specific time t, represents the error tolerance of the demand power in the abnormal area at a specific time t; According to the reasonable degree of operation, set the mode switching condition of the power distribution mode; Based on the mode switching condition and the required power, set the adaptive adjustment mechanism for the power supply power.

10. The intelligent wire bonding silver wire system with intelligent regulation of power supply power is characterized in that, The system includes: A data acquisition module, configured to obtain the intelligent bonding silver wire to be regulated, query the bonding process of the intelligent bonding silver wire, set the power supply power of the intelligent bonding silver wire according to the bonding process, and collect the bonding data of the intelligent bonding silver wire; A key parameter extraction module, configured to identify the classified data items of the bonding data, analyze the interdependence between the power supply power and the classified data items, and extract the key bonding parameters of the bonding data according to the interdependence; A power tracking module, configured to analyze the bonding quality of the intelligent bonding silver wire based on the key bonding parameters, identify the interaction relationship between the power supply power and the bonding quality, and set a power tracking system for the power supply power according to the interaction relationship; A rule analysis module, configured to collect the real-time parameters of the power supply power according to the power tracking system, analyze the parameter change rule of the power supply power based on the real-time parameters, and identify the constraint conditions of the power supply power according to the parameter change rule; A power distribution module, configured to set the power distribution mode of the power supply power based on the constraint conditions, set the abnormal warning threshold of the power supply power according to the power distribution mode, and set the adaptive adjustment mechanism for the power supply power based on the abnormal warning threshold and the power distribution mode; An intelligent regulation module, configured to perform intelligent regulation on the power supply power by combining the power tracking system, the adaptive adjustment mechanism and the power distribution mode to obtain an intelligent regulation result.

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