Liquid Cooling Heat Dissipation Device and Server

Abstract

The present application discloses a liquid-cooling heat dissipation device and a server, relating to the technical field of server heat dissipation, and comprising a main heat exchange flow channel; a processor heat exchange mechanism is communicated with the main heat exchange flow channel through a quick-connector assembly; when only the processor needs to be replaced, the processor heat exchange mechanism can be separately disassembled and installed by disconnecting the quick-connector assembly; the memory heat exchange mechanism comprises a fixed shaft, a quick-locking assembly and a plurality of memory heat exchange sub-boards, the memory heat exchange sub-boards are arranged on the fixed shaft in a penetrating manner, and the quick-locking assembly is used for abutting the memory heat exchange sub-boards against the main heat exchange flow channel so as to enable the memory heat exchange sub-boards to exchange heat with the main heat exchange flow channel; when the memory needs to be replaced, only the quick-locking assembly needs to be opened, and the memory heat exchange sub-boards are rotated around the fixed shaft, then the memory can be taken out and a new memory can be replaced, without removing the memory heat exchange sub-boards for disassembly and assembly. The present application supports independent disassembly and maintenance of the processor and the memory, greatly improving the flexibility, convenience and safety of production, testing and operation and maintenance.

Description

Technical Field

[0001] The present application relates to the technical field of server heat dissipation, and in particular to a liquid cooling device and a server. Background Art

[0002] With the economic development of society, especially with the development of artificial intelligence technology, higher demands are placed on the computing power of IT equipment such as servers. At the same time, higher requirements are also placed on the deployment density of IT equipment such as servers. This makes liquid cooling technology the best choice to meet the high-density and high-power consumption heat dissipation needs of servers.

[0003] However, in the related art, since the arrangement design of processors and memory in servers is becoming more and more compact, the liquid cooling device for dissipating heat from the servers has the problem of difficulty in installation, operation and maintenance. Summary of the invention

[0004] The present application provides a liquid cooling device and a server to at least solve the problems of difficult installation and operation and maintenance in the related art.

[0005] The present application provides a liquid cooling device, comprising:

[0006] Main heat exchange flow channel;

[0007] A processor heat exchange mechanism, used for cooling the processor, the processor heat exchange mechanism is detachably connected to the main heat exchange flow channel through a quick connector assembly, so that the processor heat exchange mechanism is connected to the main heat exchange flow channel;

[0008] The memory heat exchange mechanism includes a fixed shaft, a quick locking assembly and multiple memory heat exchange sub-plates. The memory heat exchange sub-plates are inserted into the fixed shaft so that the memory heat exchange sub-plates can rotate around the fixed shaft and slide axially along the fixed shaft. The memory heat exchange sub-plates are used to clamp corresponding memory. The quick locking assembly is used to fix the multiple memory heat exchange sub-plates and abut against the main heat exchange flow channel so that the memory heat exchange sub-plates can exchange heat with the main heat exchange flow channel.

[0009] The present application also provides a server, comprising the above-mentioned liquid cooling device.

[0010] With the liquid cooling heat dissipation device of the present application, since the quick connector assembly is used to detachably connect the processor heat exchange mechanism and the main heat exchange flow path, when only the processor or the processor heat exchange mechanism needs to be replaced, the quick connection and disconnection of the processor heat exchange mechanism and the main heat exchange flow path can be achieved through the quick connector assembly, and then the processor heat exchange mechanism can be detached and installed separately without detaching the memory heat exchange mechanism and the memory together; the memory heat exchange sub-board is penetrated through the fixed shaft and fixed by the quick locking assembly and abuts against the main heat exchange flow path, and the memory heat exchange sub-board clamps the corresponding memory. Therefore, when the memory needs to be replaced, only the quick locking assembly needs to be opened, and the memory heat exchange sub-board corresponding to the memory is rotated around the fixed shaft, and then the memory can be taken out and a new memory can be replaced without removing the memory heat exchange sub-board for disassembly and assembly; the memory heat exchange sub-board is penetrated through the fixed shaft, so the memory heat exchange sub-board can move freely along the axial direction of the fixed shaft. During actual assembly, the memory heat exchange sub-board can adaptively and precisely adjust its own position according to the position of the memory to ensure the best fit with the memory. The present application supports the independent disassembly and assembly maintenance of the processor and the memory, greatly improving the flexibility, maintainability, convenience and safety of production, testing and operation and maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0012] Figure 1 Schematic structural diagram of a server provided by an embodiment of the present application;

[0013] Figure 2 For Figure 1 Schematic structural diagram of the liquid cooling heat dissipation device of the server shown;

[0014] Figure 3 For Figure 2 Schematic structural diagram of the liquid cooling heat dissipation device shown;

[0015] Figure 4 For Figure 2 Schematic partial exploded structural diagram of the liquid cooling heat dissipation device of the server shown;

[0016] Figure 5 For Figure 3 Schematic structural diagram of the main heat exchange flow path of the liquid cooling heat dissipation device shown;

[0017] Figure 6 For Figure 5 Schematic structural diagram of another view angle of the main heat exchange flow path shown;

[0018] Figure 7 is Figure 5 a partially exploded structural schematic diagram of the main heat exchange channel shown;

[0019] Figure 8 is Figure 7 an enlarged structural schematic diagram of the main heat exchange channel shown;

[0020] Figure 9 is Figure 5 a cross-sectional view of the main heat exchange channel shown;

[0021] Figure 10 is Figure 3 a structural schematic diagram of the memory heat exchange sub-board of the liquid cooling heat dissipation device shown;

[0022] Figure 11 is Figure 10 one of the partially exploded structural schematic diagrams of the memory heat exchange sub-board shown;

[0023] Figure 12 is Figure 10 another of the partially exploded structural schematic diagrams of the memory heat exchange sub-board shown;

[0024] Figure 13 is Figure 10 a structural schematic diagram of the main cold plate of the memory heat exchange sub-board shown;

[0025] Figure 14 is Figure 10 a structural schematic diagram of another perspective of the memory heat exchange sub-board shown;

[0026] Figure 15 is Figure 10 a cross-sectional view of the memory heat exchange sub-board shown;

[0027] Figure 16 is Figure 3 a structural schematic diagram of the memory heat exchange mechanism of the liquid cooling heat dissipation device shown;

[0028] Figure 17 is Figure 16 a structural schematic diagram of the memory heat exchange mechanism during assembly shown;

[0029] Figure 18 is Figure 16 a structural schematic diagram of the memory heat exchange mechanism after assembly shown;

[0030] Figure 19 is Figure 18 a structural schematic diagram of the quick locking component of the memory heat exchange mechanism shown;

[0031] Figure 20 is Figure 18 a structural schematic diagram of another perspective of the memory heat exchange mechanism after assembly shown;

[0032] Figure 21 is Figure 3 a partial exploded structural schematic diagram of the liquid leakage detection mechanism of the liquid cooling heat dissipation device shown;

[0033] Figure 22 is Figure 21 a partial enlarged structural schematic diagram of the liquid leakage detection mechanism shown;

[0034] Figure 23 is Figure 3 a structural schematic diagram when the liquid cooling heat dissipation device is assembled.

[0035] Among them, the above-mentioned drawings include the following reference numerals:

[0036] 100 - Liquid cooling heat dissipation device; 10 - Main heat exchange flow channel; 11 - Main heat exchange sub - flow channel; 111 - First main heat exchange sub - flow channel; 112 - Second main heat exchange sub - flow channel; 113 - Third main heat exchange sub - flow channel; 114 - Liquid distribution port; 115 - Liquid collection port; 116 - Sub - flow channel joint; 12 - Connecting pipeline; 121 - First branch connecting pipeline; 122 - Second branch connecting pipeline; 13 - Cover plate; 131 - Flow channel cavity; 132 - Rib structure; 133 - Heat conduction groove; 134 - Heat exchange pad; 14 - Bottom plate; 141 - Shovel tooth structure; 15 - Inlet; 16 - Outlet; 17 - Second positioning hole; 18 - Second non - loosening screw; 19 - Fixed seat; 20 - Processor heat exchange mechanism; 21 - Quick - connector assembly; 211 - Liquid inlet quick - connector; 212 - Liquid outlet quick - connector; 22 - Fastening screw hole; 23 - Processor heat exchange connecting pipeline; 24 - Processor liquid inlet pipeline; 25 - Processor liquid outlet pipeline; 30 - Memory heat exchange mechanism; 31 - Fixed shaft; 32 - Quick - locking assembly; 321 - Pressure rod bracket; 322 - Pressure rod; 323 - Lock; 3231 - Locking pin; 3232 - Guide slope; 324 - Locking piece; 3241 - Stop piece; 3242 - Pushing piece; 325 - Limit screw; 326 - Pressure rod sleeve; 327 - Elastic piece; 328 - Protrusion structure; 33 - Memory heat exchange sub - plate; 331 - Main cold plate; 3311 - Substrate; 3312 - Reinforcement frame; 3313 - Limit groove; 3314 - Heat pipe groove; 3315 - Heat pipe; 3316 - Guide pin; 332 - Sub - cold plate; 3321 - Heat conduction pad groove; 3322 - Guide hole; 333 - Heat conduction pad; 334 - Locking switch assembly; 3341 - Cam wrench; 3342 - Cam rotating shaft; 3343 - Pressing slider; 3344 - Guide shaft; 3345 - Cam part; 3346 - Handle part; 3347 - Compression spring; 3348 - Guide groove; 3349 - Guide block; 335 - Anti - scratch film; 336 - Through - hole; 40 - Leakage detection mechanism; 41 - First diversion groove; 42 - Detection wire groove; 43 - Leakage detection wire; 44 - Second diversion groove; 50 - Liquid supply and return joint assembly; 51 - Liquid inlet pipeline; 52 - Liquid return pipeline; 80 - Cold plate support; 81 - First positioning pin; 82 - First non - loosening screw; 83 - Second positioning pin; 84 - Support screw hole; 200 - Server; 201 - Motherboard; 202 - Processor; 203 - Memory; 204 - First positioning hole; 205 - Motherboard screw hole; 206 - Liquid supply and return quick - connector; 207 - Stud. Detailed implementation mode

[0037] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present application.

[0038] It should be noted that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application. The terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements. The terms "parallel", "perpendicular", and "equal" include the described situations and situations similar to the described situations, and the range of the similar situations is within the acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurement being discussed and the errors associated with the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, where the acceptable deviation range of approximate parallel can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicular and approximate perpendicular, where the acceptable deviation range of approximate perpendicular can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range of approximate equality can be, for example, that the difference between the two equal ones is less than or equal to 5% of any one of them. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0039] In order to enable those skilled in the art of this technology to better understand the solution of the present application, the present application will be further described in detail below in conjunction with the drawings and specific embodiments.

[0040] Such as Figure 1 、 Figure 2 and Figure 3As shown, the liquid cooling device 100 provided in the embodiment of the present application is used in a server 200. The server 200 includes a motherboard 201, a processor 202, a memory 203 and a liquid cooling device 100. The processor 202 and the memory 203 are arranged on the motherboard 201. The liquid cooling device 100 is used to perform liquid cooling on the processor 202 and the memory 203.

[0041] In some possible implementations, the processor 202 includes a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit).

[0042] In some possible implementations, the server 200 is a dual-way general-purpose server.

[0043] The liquid cooling device 100 includes a main heat exchange channel 10, a processor heat exchange mechanism 20 and a memory heat exchange mechanism 30. The main heat exchange channel 10 is used to communicate with the coolant flow path. The processor heat exchange mechanism 20 is in communication with the main heat exchange channel 10. The processor heat exchange mechanism 20 is disposed on the processor 202, and is used to cool down the processor 202. The memory heat exchange mechanism 30 is in heat exchange contact with the main heat exchange channel 10. The memory heat exchange mechanism 30 is sandwiched with the memory 203, and is used to cool down the memory 203.

[0044] In some possible implementations, the processor heat exchange mechanism 20 is detachably connected to the main heat exchange channel 10 via a quick connector assembly 21 , so that the processor heat exchange mechanism 20 is in communication with the main heat exchange channel 10 .

[0045] Please also see Figure 5 In some possible implementations, the memory heat exchange mechanism 30 includes a fixed shaft 31, a quick locking assembly 32, and a plurality of memory heat exchange sub-plates 33. The memory heat exchange sub-plates 33 are inserted into the fixed shaft 31 so that the memory heat exchange sub-plates 33 rotate around the fixed shaft 31 and slide axially along the fixed shaft 31. The memory heat exchange sub-plates 33 are used to be clamped in the corresponding memory 203, and the quick locking assembly 32 is used to fix the plurality of memory heat exchange sub-plates 33 and abut against the main heat exchange flow channel 10 so that the memory heat exchange sub-plates 33 and the main heat exchange flow channel 10 can exchange heat.

[0046] Specifically, the quick locking assembly 32 applies pressure to the memory heat exchange sub-plate 33 so that the memory heat exchange sub-plate 33 is pressed against the main heat exchange channel 10 , thereby enabling the memory heat exchange sub-plate 33 to exchange heat with the main heat exchange channel 10 .

[0047] In some possible implementations, multiple memories 203 are arranged in sequence on the main board 201. The axial direction of the fixed shaft 31 is parallel to the arrangement direction of the multiple memories 203. The quick locking assembly 32 is arranged on one side of the memory 203, and along the arrangement direction of the multiple memories 203, presses the multiple memory heat exchange sub - plates 33 rotatably arranged on the fixed shaft 31 against the corresponding memories 203.

[0048] Since the quick - connector assembly 21 is used to connect the processor heat exchange mechanism 20 to the main heat exchange flow channel 10, when only the processor 202 or the processor heat exchange mechanism 20 needs to be replaced, the quick - connector assembly 21 can be used to quickly connect and disconnect the processor heat exchange mechanism 20 from the main heat exchange flow channel 10, and then the processor heat exchange mechanism 20 can be disassembled and installed separately, without the need to disassemble the memory heat exchange mechanism 30 and the memory 203 together.

[0049] The memory heat exchange sub - plate 33 is inserted through the fixed shaft 31, fixed by the quick locking assembly 32, and abuts against the main heat exchange flow channel 10. The memory heat exchange sub - plate 33 clamps the corresponding memory 203. Therefore, when the memory 203 needs to be replaced, only a simple operation is required to open the quick locking assembly 32, and rotate the memory heat exchange sub - plate 33 corresponding to the memory 203 around the fixed shaft 31, then the memory 203 can be taken out and a new memory 203 can be replaced, without the need to remove the memory heat exchange sub - plate 33 for disassembly and assembly, greatly simplifying the replacement process of the memory 203; the memory heat exchange sub - plate 33 is inserted through the fixed shaft 31, so the memory heat exchange sub - plate 33 can move freely on the fixed shaft 31. During actual assembly, it can adaptively and precisely adjust its own position according to the position of the memory 203 to ensure the best contact and heat exchange efficiency between the memory heat exchange sub - plate 33 and the memory 203, achieving the best adaptation, improving the structural compatibility and reliability of the memory heat exchange sub - plate 33, and improving the heat dissipation effect.

[0050] In the scenario where only the memory heat exchange mechanism 30 needs to be replaced, that is, when the memory 203 uses air cooling, there is no need to disassemble the processor heat exchange mechanism 20, disconnect the quick - connector assembly 21, and disassemble related components such as the main heat exchange flow channel 10 and the memory heat exchange mechanism 30. Only by connecting two supply and return liquid pipelines to the cabinet manifold through the quick - connector assembly 21 can the coolant be conducted, and the time for replacing the processor heat exchange mechanism 20 and applying thermal grease can be saved.

[0051] Since the liquid cooling heat dissipation device 100 of the present application supports the independent disassembly and maintenance of the processor 202 and the memory 203, the operation and maintenance personnel can replace and maintain the components more quickly, reduce the unnecessary disassembly and assembly times of the required heat dissipation electronic components, greatly improve the flexibility, maintainability, convenience and safety of production, testing and operation and maintenance, reduce the downtime, improve the availability and maintenance efficiency of the server 200, improve the structural compatibility and reliability of the memory heat exchange mechanism 30, can meet various operation and maintenance scenarios of the data center, is beneficial to reducing the failure rate of liquid cooling components and electronic components, and reducing the development and operation and maintenance costs.

[0052] At the same time, the application of the quick connector assembly 21 and the quick locking assembly 32 realizes tool-free installation, reduces the risk of misoperation during disassembly and assembly, and enhances the safety and reliability of the system.

[0053] In some possible implementation manners, the quick connector assembly 21 includes an inlet liquid quick connector 211 and an outlet liquid quick connector 212. The inlet liquid quick connector 211 connects one side of the main heat exchange flow path 10 with the processor heat exchange mechanism 20, and the outlet liquid quick connector 212 connects the other side of the main heat exchange flow path 10 with the processor heat exchange mechanism 20.

[0054] The designs of the inlet liquid quick connector 211 and the outlet liquid quick connector 212 ensure that the coolant can circulate efficiently between the main heat exchange flow path 10 and the processor heat exchange mechanism 20, take away the heat generated by the processor 202, and achieve efficient heat dissipation. The designs of the inlet liquid quick connector 211 and the outlet liquid quick connector 212 provide flexible system configuration options, allowing users to adjust the flow path and direction of the coolant according to specific requirements to adapt to different heat dissipation requirements.

[0055] The quick connector assembly 21 allows users to easily connect and disconnect the liquid pipelines of the processor heat exchange mechanism 20, simplifies the installation and disassembly process of the system, and improves the convenience and efficiency of operation. Quick connectors usually have good sealing performance, can effectively reduce the risk of liquid leakage, and ensure the safety and reliability of the system.

[0056] Please also refer to Figure 4 In some possible implementation manners, the liquid cooling heat dissipation device 100 includes a plurality of processor heat exchange mechanisms 20, and adjacent processor heat exchange mechanisms 20 are connected through a processor heat exchange connection pipeline 23.

[0057] The multiple processor heat exchange mechanisms 20 are connected through the processor heat exchange connection pipeline 23, and the coolant can circulate among the processor heat exchange mechanisms 20 to ensure a uniform temperature distribution within the system and avoid local overheating. The series design of the multiple processor heat exchange mechanisms 20 can optimize the flow path of the coolant, improve the heat exchange efficiency, and ensure that each processor 202 can obtain sufficient cooling effect. The modular design of the multiple processor heat exchange mechanisms 20 and the processor heat exchange connection pipeline 23 facilitates the expansion and upgrade of the system, supports application scenarios of different scales and complexities, and reduces the manufacturing and maintenance costs.

[0058] In some possible implementation manners, the liquid cooling heat dissipation device 100 includes two processor heat exchange mechanisms 20. The liquid inlet quick connector 211 is connected to one of the processor heat exchange mechanisms 20 through the processor liquid inlet pipeline 24. The two processor heat exchange mechanisms 20 are connected through the processor heat exchange connection pipeline 23. The other processor heat exchange mechanism 20 is connected to the liquid outlet quick connector 212 through the processor liquid outlet pipeline 25, so as to connect the two processor heat exchange mechanisms 20 to the main heat exchange flow path 10.

[0059] The cooling liquid on one side in the main heat exchange flow path 10 is divided into two branches through the liquid inlet quick connector 211. The first branch enters from the main heat exchange flow path 10 into the liquid inlet quick connector 211, then enters the first processor heat exchange mechanism 20 through the processor liquid inlet pipeline 24, then enters the second processor heat exchange mechanism 20 through the processor heat exchange connection pipeline 23, and finally flows into the liquid outlet quick connector 212 through the processor liquid outlet pipeline 25 and flows to the other side of the main heat exchange flow path 10. The second branch sequentially passes through three groups of first main heat exchange sub-flow paths 111, second main heat exchange sub-flow paths 112, and third main heat exchange sub-flow paths 113, absorbs the heat conducted by the memory heat exchange mechanism 30, and after converging with the first branch, returns to the liquid supply and return quick connector 206 through the return pipeline 52 to form a complete liquid loop within the server 200.

[0060] In some possible implementation manners, the main heat exchange flow path 10 includes multiple main heat exchange sub-flow paths 11, and the multiple main heat exchange sub-flow paths 11 are sequentially connected through the connection pipeline 12.

[0061] In some possible implementation manners, the main heat exchange flow path 10 includes a first main heat exchange sub-flow path 111, a second main heat exchange sub-flow path 112, and a third main heat exchange sub-flow path 113. The connection pipeline 12 includes a first branch connection pipeline 121 and a second branch connection pipeline 122. The first main heat exchange sub-flow path 111 is connected to the second main heat exchange sub-flow path 112 through the first branch connection pipeline 121, and the second main heat exchange sub-flow path 112 is connected to the third main heat exchange sub-flow path 113 through the second branch connection pipeline 122.

[0062] By dividing the main heat exchange channel 10 into multiple sub-channels, segmented heat dissipation can be achieved. Each sub-channel can focus on the heat management of a specific area or component, thereby improving the overall heat dissipation efficiency.

[0063] In some possible implementation manners, the first main heat exchange sub-channel 111 and the third main heat exchange sub-channel 113 are located in the same row and are oppositely arranged with respect to the second main heat exchange sub-channel 112.

[0064] In some possible implementation manners, the first main heat exchange sub-channel 111 and the third main heat exchange sub-channel 113 are located at the rear side of the processor 202 and the memory 203, and the second main heat exchange sub-channel 112 is located at the front side of the processor 202 and the memory 203. The first main heat exchange sub-channel 111 is connected to the processor heat exchange mechanism 20 through the quick connector assembly 21, and the third main heat exchange sub-channel 113 is connected to the processor heat exchange mechanism 20 through the quick connector assembly 21, so as to divert the fluid of the main heat exchange channel 10 to the processor heat exchange mechanism 20.

[0065] Please also refer to Figure 6 In some possible implementation manners, a liquid distribution port 114 is provided on the first main heat exchange sub-channel 111, and a liquid collection port 115 is provided on the third main heat exchange sub-channel 113. The inlet quick connector 211 is communicated with the liquid distribution port 114, and the outlet quick connector 212 is communicated with the liquid collection port 115.

[0066] When the inlet quick connector 211 and the outlet quick connector 212 are in a connected state, the first branch enters the inlet quick connector 211 from the liquid distribution port 114 on the side wall of the first main heat exchange sub-channel 111. The cooling liquid successively enters the two processor heat exchange mechanisms 20 through the processor inlet pipeline 24 and the processor heat exchange connection pipeline 23, continuously taking away the heat generated during the operation of the processor 202 chip to ensure that the temperature of the processor 202 chip is always within the normal range. Subsequently, the coolant passes through the processor outlet pipeline 25 and the outlet quick connector 212 in sequence and reaches the liquid collection port 115 on the third main heat exchange sub-channel 113.

[0067] The second branch passes through the flow channel in the first main heat exchange sub-channel 111 at the rear side, and after changing the flow direction of the coolant through the first branch connection pipeline 121, it reaches the second main heat exchange sub-channel 112 near the front side of the chassis. After the coolant absorbs the heat transferred from the memory heat exchange sub-board 33 in the second main heat exchange sub-channel 112 at the front side and flows out, it then reaches the third main heat exchange sub-channel 113 at the rear side through the second branch connection pipeline 122. Subsequently, it flows along the flow channel in the third main heat exchange sub-channel 113 at the rear side and converges with the coolant of the first branch at the liquid collection port 115.

[0068] In some possible implementations, sub-channel connectors 116 are respectively provided at one end of the first main heat exchange sub-channel 111 facing away from the third main heat exchange sub-channel 113 and at both ends of the second main heat exchange sub-channel 112. The sub-channel connector 116 of the first main heat exchange sub-channel 111 is connected to the sub-channel connector 116 on one side of the second main heat exchange sub-channel 112 through a first branch connection pipe 121. The sub-channel connector 116 on the other side of the second main heat exchange sub-channel 112 is connected to the sub-channel connector 116 of the third main heat exchange sub-channel 113 through a second branch connection pipe 122.

[0069] Please also refer to Figure 7 、 Figure 8 and Figure 9 . In some possible implementations, the main heat exchange sub-channel 11 includes a cover plate 13 and a bottom plate 14. A flow channel cavity 131 is provided in the cover plate 13, and the bottom plate 14 covers the flow channel cavity 131. The processor heat exchange mechanism 20 communicates with the flow channel cavity 131, and the memory heat exchange sub-board 33 abuts against the cover plate 13.

[0070] The combination of the cover plate 13 and the bottom plate 14 provides a closed and stable structure, ensuring the integrity and sealing of the flow channel cavity 131, preventing coolant leakage, and improving the reliability of the system. At the same time, the design of the flow channel cavity 131 can optimize the fluid path according to specific heat dissipation requirements, ensuring that the coolant maximally contacts the heat source during the flow process and improving the heat exchange efficiency.

[0071] The design of the flow channel cavity 131 allows the coolant to flow inside the cover plate 13 and directly communicate with the processor heat exchange mechanism 20, realizing efficient heat exchange, being able to quickly take away the heat generated by the processor 202, and improving the heat dissipation efficiency. Due to the direct communication design between the processor heat exchange mechanism 20 and the flow channel cavity 131, the processor heat exchange mechanism 20 can be conveniently disassembled and replaced during maintenance without affecting the installation of the memory heat exchange sub-board 33, improving the maintainability of the system.

[0072] The memory heat exchange sub-board 33 directly abuts against the cover plate 13, enabling the memory heat exchange sub-board 33 to more flexibly exchange heat with the coolant in the flow channel cavity 131, reducing the thermal resistance in the heat transfer path, and enabling the heat generated by the memory 203 to be more quickly transferred to the coolant.

[0073] In some possible implementations, rib structures 132 are provided in the flow channel cavity 131. The rib structures 132 protrude in the flow channel cavity 131 and are arranged along the extension direction of the flow channel cavity 131.

[0074] The rib structure 132 increases the surface area inside the flow channel cavity 131, thereby expanding the contact area between the coolant and the flow channel wall, improving the heat exchange efficiency, and enabling heat to be transferred from the heat source to the coolant more quickly. The rib structure 132 can guide the flow path of the coolant inside the flow channel cavity 131, ensuring that the fluid is evenly distributed throughout the flow channel and avoiding the occurrence of flow dead zones or local overheating phenomena.

[0075] At the same time, the rib structure 132 can disturb the flow of the coolant and promote the formation of turbulence. Compared with laminar flow, the fluid in the turbulent state has higher heat transfer ability, thereby improving the convective heat transfer between the flow channel cavity 131 and the coolant and being able to carry away heat more effectively.

[0076] The rib structure 132 not only helps to improve the heat exchange efficiency but also can enhance the structural strength of the flow channel cavity 131, acting as a reinforcing rib, improving the liquid pressure resistance ability of the flow channel cavity 131, and preventing deformation or rupture under high-pressure conditions.

[0077] The shape and spacing of the rib structure 132 can be designed and adjusted according to specific heat dissipation requirements to achieve the best thermal management effect.

[0078] In some possible implementation manners, a shovel tooth structure 141 is provided on the bottom plate 14, and the shovel tooth structure 141 is arranged in the flow channel cavity 131 along the extension direction of the flow channel cavity 131. The shovel tooth structure 141 is distributed directly below the contact area between the flow channel cavity 131 and the memory heat exchange sub-board 33.

[0079] The shovel tooth structure 141 increases the surface area inside the flow channel cavity 131, thereby expanding the contact area between the coolant and the flow channel wall, improving the heat exchange efficiency, and enabling heat to be transferred from the heat source to the coolant more quickly. The shovel tooth structure 141 can guide the flow path of the coolant inside the flow channel cavity 131, ensuring that the fluid is evenly distributed throughout the flow channel and avoiding the occurrence of flow dead zones or local overheating phenomena.

[0080] At the same time, the shovel tooth structure 141 can disturb the flow of the coolant and promote the formation of turbulence. Compared with laminar flow, the fluid in the turbulent state has higher heat transfer ability and can carry away heat more effectively.

[0081] The shovel tooth structure 141 not only helps to improve the heat exchange efficiency but also can enhance the structural strength of the flow channel cavity 131, improve its pressure resistance ability, and prevent deformation or rupture under high-pressure conditions.

[0082] The shape, length, height, and spacing of the shovel tooth structure 141 can be designed and adjusted according to specific heat dissipation requirements to achieve the best thermal management effect.

[0083] In some possible implementations, the rib structure 132 is located in the middle of the flow channel cavity 131 to divide the flow channel cavity 131 into two parts. A plurality of shovel tooth structures 141 are respectively located in the flow channel cavities 131 on both sides. The tooth tips of the shovel tooth structures 141 are integrally formed with the cover plate 13 by welding to further divide the flow channel cavity 131 and form a plurality of microchannels.

[0084] In some possible implementations, the first main heat exchange sub-channel 111 is provided with an inlet 15. The third main heat exchange sub-channel 113 is provided with an outlet 16. The inlet 15 and the outlet 16 are respectively located in the middle of the first main heat exchange sub-channel 111 and the third main heat exchange sub-channel 113. The rib structure 132 divides a baffle structure in the flow channel cavities 131 of the first main heat exchange sub-channel 111 and the third main heat exchange sub-channel 113.

[0085] After the coolant enters the first main heat exchange sub-channel 111 from the inlet 15, a part of the liquid enters the liquid inlet quick connector 211 through the liquid separation port 114 to form a first branch. The other part flows along the flow channel cavity 131 of the first main heat exchange sub-channel 111 to form a second branch. After flowing in the first main heat exchange sub-channel 111 in the direction of the third main heat exchange sub-channel 113, it undergoes a baffle and then flows in the direction away from the third main heat exchange sub-channel 113. Then it enters the first branch connection pipeline 121 through the sub-channel joint 116. After passing through the second main heat exchange sub-channel 112, it reaches the third main heat exchange sub-channel 113 at the rear through the second branch connection pipeline 122. Subsequently, it flows in the direction of the first main heat exchange sub-channel 111 along the flow channel in the rear third main heat exchange sub-channel 113, undergoes a baffle, and converges with the coolant of the first branch at the liquid collection port 115, and then flows out of the main heat exchange flow channel 10 through the outlet 16.

[0086] In some possible implementations, the fixed shaft 31 is provided on the cover plate 13, and the axial direction of the fixed shaft 31 is the same as the extending direction of the flow channel cavity 131 in the cover plate 13, so as to sequentially arrange a plurality of memory heat exchange sub-boards 33 along the extending direction of the flow channel cavity 131.

[0087] Please also refer to Figure 10 In some possible implementations, a plurality of memory heat exchange sub-boards 33 are divided into two groups along the length direction of the memory 203. The two groups of memory heat exchange sub-boards 33 are arranged oppositely, and along the length direction of the memory 203, each group of memory heat exchange sub-boards 33 respectively clamps one end of the corresponding memory 203. The memory heat exchange sub-boards 33 at both ends are axisymmetric structures with each other, combined into a set of memory heat exchange sub-boards 33 to jointly dissipate heat for a memory 203.

[0088] By dividing the memory heat exchange sub-board 33 into two groups and sandwiching one end of the memory 203 along the length direction of the memory 203, the length of the memory heat exchange sub-board 33 is reduced. Since the ability to resist stress bending and deformation is improved after the length of the memory heat exchange sub-board 33 is reduced, the stiffness of each memory heat exchange sub-board 33 can be effectively increased, the risk of deformation of the memory heat exchange sub-board 33 during the process of fitting with and inserting / removing the memory 203 is reduced, the stability of the overall structure is improved, which helps to maintain good contact between the memory heat exchange sub-board 33 and the memory 203 during the installation and disassembly processes, and ensures the heat dissipation performance. At the same time, the disconnected area between the two memory heat exchange sub-boards 33 can also effectively prevent the chips protruding from the center of the memory 203 from being damaged by extrusion during insertion / removal.

[0089] The memory heat exchange sub-board 33 is connected to the main heat exchange flow channel 10 through the fixed shaft 31, so the memory heat exchange sub-board 33 can move freely on the fixed shaft 31. During actual assembly, the memory heat exchange sub-board 33 can adapt to and precisely adjust its own position according to the position of the memory 203, which can effectively solve the influence of the fitting tolerance of related components in the server 200 on the poor fitting between the memory heat exchange sub-board 33 and the memory 203, and ensure the best adaptation with the memory 203.

[0090] Please also refer to Figure 11 , Figure 12 , Figure 13 and Figure 14 , in some possible implementation manners, the memory heat exchange sub-board 33 includes a main cold plate 331, a secondary cold plate 332, a heat conducting pad 333 and a locking switch assembly 334. Along the thickness direction of the memory 203, the main cold plate 331 is located on one side of the memory 203. The secondary cold plate 332 is movably arranged on the main cold plate 331 and is located on the other side of the memory 203. The heat conducting pad 333 is arranged on the sides of the main cold plate 331 and the secondary cold plate 332 facing the memory 203. The main cold plate 331 and the secondary cold plate 332 are penetrated through the fixed shaft 31. The locking switch assembly 334 is arranged on the main cold plate 331, and the locking switch assembly 334 is used to drive the secondary cold plate 332 to move towards the main cold plate 331 to press the heat conducting pad 333 on the main cold plate 331 and the secondary cold plate 332 onto the memory 203.

[0091] The heat conducting pad 333 is arranged on the sides of the main cold plate 331 and the secondary cold plate 332 facing the memory 203, ensuring good thermal contact between the memory heat exchange sub-board 33 and the memory 203, improving the heat conduction efficiency, and being able to transfer the heat generated by the memory 203 to the memory heat exchange sub-board 33 for heat dissipation more effectively.

[0092] The secondary cold plate 332 is movably arranged on the main cold plate 331 and is adjusted through the locking switch assembly 334, allowing adjustment according to the actual thickness of the memory 203 during installation to ensure close contact between the memory heat exchange sub-board 33 and the memory 203.

[0093] The locking switch assembly 334 can drive the secondary cold plate 332 to move towards the primary cold plate 331 to achieve quick locking, simplify the installation and disassembly process of the memory heat exchange sub-board 33, reduce the operation time, and improve the operation and maintenance efficiency. Through the adjustment of the locking switch assembly 334, an appropriate pressing force can be provided to avoid applying excessive mechanical stress to the memory 203, thereby reducing the risk of damage to the memory 203. The locking switch assembly 334 improves the overall reliability of the system and ensures that the memory heat exchange sub-board 33 can maintain good thermal contact with the memory 203 under various operating conditions.

[0094] The memory heat exchange sub-board 33 can improve the structural compatibility, reliability, and operation flexibility of the memory cold plate, and solve problems such as difficult insertion and removal of the current memory 203, poor contact of the heat dissipation surface, and cumbersome steps for replacing the memory 203. The memory heat exchange sub-board 33 is designed to be split at both ends, that is, two groups of memory heat exchange sub-boards 33 with a length approximately half of the length of the memory 203 are combined to achieve the heat dissipation of each memory 203. Each group of memory heat exchange sub-boards 33 is designed with a locking switch assembly 334 for quick locking, which not only provides an adjustable spring force to ensure good fitting between the thermal conductive pad 333 and the memory 203 and the required pressing force, but also can achieve manual quick locking and unlocking of the memory heat exchange sub-board 33 and the memory 203, while reducing the failure rate of the memory 203 and further improving its service life.

[0095] In some possible implementation manners, the primary cold plate 331 includes a base plate 3311 and a reinforcement frame 3312. The base plate 3311 is penetrated through the fixed shaft 31, the reinforcement frame 3312 is disposed on the base plate 3311, the secondary cold plate 332 is movably disposed on the reinforcement frame 3312, and the locking switch assembly 334 is disposed on the reinforcement frame 3312.

[0096] In some possible implementation manners, the reinforcement frame 3312 is designed at the top end of the base plate 3311. On the one hand, it is used to strengthen the rigidity of the base plate 3311 to prevent deformation caused by extrusion with the memory 203 during use; on the other hand, the reinforcement frame 3312 can provide mounting holes for the locking switch assembly 334 and will not interfere with the memory 203 during the operation process.

[0097] The introduction of the reinforcement frame 3312 improves the overall rigidity and strength of the primary cold plate 331, reduces the possible deformation of the memory heat exchange sub-board 33 during installation and use, ensures the stable contact between the memory heat exchange sub-board 33 and the memory 203, and improves the heat dissipation efficiency. The reinforcement frame 3312 helps to evenly distribute the pressure applied to the locking switch assembly 334 during the locking process, avoid generating excessive local stress on the memory 203, and reduce the risk of damage to the memory 203.

[0098] In some possible implementations, a limiting groove 3313 is provided on the substrate 3311, and the limiting groove 3313 is used to accommodate the heat-conducting pad 333.

[0099] The limiting groove 3313 provides a definite installation position for the heat-conducting pad 333, ensuring the precise positioning of the heat-conducting pad 333 between the main cold plate 331 and the memory 203, helping to maintain the effective contact area of the heat-conducting pad 333, and improving the heat conduction efficiency. The limiting groove 3313 can also effectively prevent the heat-conducting pad 333 from moving or sliding during installation and use, ensuring that the heat-conducting pad 333 is always in the best position and avoiding the decrease in heat dissipation performance caused by position deviation.

[0100] By providing a fixed position for the heat-conducting pad 333 through the limiting groove 3313, the installation process is simplified, the possibility of installation errors is reduced, and the operation efficiency is improved. At the same time, the limiting groove 3313 can also protect the edge of the heat-conducting pad 333 to a certain extent, reduce the damage caused by mechanical stress or friction, and thus extend the service life of the heat-conducting pad 333.

[0101] In some possible implementations, a heat pipe groove 3314 is provided on one side of the substrate 3311 away from the limiting groove 3313, and the heat pipe groove 3314 is used to embed the heat pipe 3315.

[0102] The heat pipe 3315 is an efficient heat conduction device that can transfer heat quickly. By embedding the heat pipe 3315 in the substrate 3311, heat can be transferred from the memory 203 area to other parts more quickly, improving the heat dissipation efficiency of the main cold plate 331.

[0103] The design of the heat pipe groove 3314 allows the heat pipe 3315 to be tightly embedded in the substrate 3311, ensuring that heat is evenly distributed along the length direction of the heat pipe 3315, helping to avoid local overheating and improving the temperature uniformity of the memory 203. Embedding the heat pipe 3315 into the substrate 3311 through the heat pipe groove 3314 makes the main cold plate 331 more compact and does not significantly increase the volume of the memory heat exchange sub-board 33. The heat pipe groove 3314 ensures the tight contact between the heat pipe 3315 and the substrate 3311, reduces the thermal resistance in the heat transfer path, and improves the heat conduction efficiency.

[0104] In some possible implementations, a heat-conducting pad groove 3321 is provided on the side of the secondary cold plate 332 facing the memory 203, and the heat-conducting pad groove 3321 is used to accommodate the heat-conducting pad 333.

[0105] The heat-conducting pad groove 3321 provides a definite installation position for the heat-conducting pad 333, ensuring the precise positioning of the heat-conducting pad 333 between the secondary cold plate 332 and the memory 203, which helps to maintain the effective contact area of the heat-conducting pad 333 and improve the heat conduction efficiency. The heat-conducting pad groove 3321 can also effectively prevent the heat-conducting pad 333 from moving or sliding during installation and use, ensuring that the heat-conducting pad 333 is always in the optimal position and avoiding the decrease in heat dissipation performance caused by position deviation.

[0106] Providing a fixed position for the heat-conducting pad 333 through the heat-conducting pad groove 3321 simplifies the installation process, reduces the possibility of installation errors, and improves the operation efficiency. At the same time, the heat-conducting pad groove 3321 can also protect the edge of the heat-conducting pad 333 to a certain extent, reducing the damage caused by mechanical stress or friction, thereby prolonging the service life of the heat-conducting pad 333.

[0107] The hardness of the heat-conducting pads 333 on the main cold plate 331 and the secondary cold plate 332 is the same. Therefore, the acting forces exerted by the locking switch assembly 334 on the main cold plate 331 and the secondary cold plate 332 are the same. So the clamping forces received on the two sides of the memory 203 are also consistent, avoiding the inclination of the memory 203 to one side caused by different contact methods or dimensional deviations on both sides of the memory 203 in the previous solutions, and avoiding the stress damage to the gold fingers of the memory 203 and the memory slot, which is beneficial to reducing the failure rate of the memory 203 and further improving its service life.

[0108] In some possible implementation manners, one of the main cold plate 331 and the secondary cold plate 332 is provided with a guide pin 3316, and the other is provided with a guide hole 3322 opposite to the guide pin 3316.

[0109] The design of the guide pin 3316 and the guide hole 3322 ensures that the main cold plate 331 and the secondary cold plate 332 can be accurately aligned during installation, which helps to ensure good contact between the memory heat exchange sub-board 33 and the memory 203 and improve the heat conduction efficiency.

[0110] The guide pin 3316 and the guide hole 3322 provide a simple and effective alignment mechanism, making the installation process more intuitive and convenient, reducing the possibility of installation errors, and improving the operation efficiency. During use, the guide pin 3316 and the guide hole 3322 can effectively prevent the relative misalignment of the main cold plate 331 and the secondary cold plate 332, ensuring that the memory heat exchange sub-board 33 maintains a stable structure during operation.

[0111] In some possible implementation manners, through holes 336 are provided on the substrate 3311 and the secondary cold plate 332. The through holes 336 are used for passing through the fixed shaft 31. The through holes 336 and the fixed shaft 31 cooperate to form a hinge structure, enabling the substrate 3311 and the secondary cold plate 332 to rotate on the fixed shaft 31.

[0112] In some possible implementations, there is no heat pipe slot on the auxiliary cold plate 332, so its thickness can be appropriately reduced to meet the requirement of the spacing of the memory 203.

[0113] Please refer to Figure 15 as well. In some possible implementations, the locking switch assembly 334 includes a cam wrench 3341, a cam rotating shaft 3342, a pressing slider 3343, and a guiding shaft 3344. The cam wrench 3341 is rotatably arranged on the reinforcement frame 3312 through the cam rotating shaft 3342. The guiding shaft 3344 is arranged on the reinforcement frame 3312. The auxiliary cold plate 332 is inserted through the guiding shaft 3344, and the pressing slider 3343 is arranged on the auxiliary cold plate 332 and faces the cam wrench 3341. The cam wrench 3341 is used to push the pressing slider 3343 to move along the axial direction of the guiding shaft 3344, so that the auxiliary cold plate 332 moves towards the main cold plate 331.

[0114] When installing the memory heat exchange sub-board 33 onto the memory 203, the main cold plate 331 and the auxiliary cold plate 332 rotate together around the fixed shaft 31 to both sides of the memory 203 until they contact the main heat exchange sub-channel 11. At this time, the quick locking assembly 32 is placed and locked down. Finally, the cam wrench 3341 is turned from the vertical position to the horizontal position to complete the locking. During this process, the cam of the cam wrench 3341 turns from the small diameter to the large diameter, pushing the pressing slider 3343 to translate along the guiding shaft 3344. During the above process, the pressing slider 3343 will drive the auxiliary cold plate 332 to translate. The thermal conductive pads 333 on the main cold plate 331 and the auxiliary cold plate 332 will first come into contact with the memory 203. As the main cold plate 331 and the auxiliary cold plate 332 continue to translate and clamp the memory 203 under the cam thrust, the thermal conductive pads 333 can be further compressed, ensuring that the required pre-tightening force is met between the thermal conductive pads 333 and the memory 203, reducing the contact thermal resistance, and achieving the best heat dissipation effect.

[0115] For the memory heat exchange sub-board 33 to be closely attached to and unlocked from the memory 203, only the cam wrench 3341 needs to be turned. The operation is quick and reliable, effectively reducing the failure rate and operation time of electronic component replacement. The use of the cam wrench 3341 makes the locking and unlocking processes simple and intuitive. The operator can quickly complete the installation and disassembly of the memory heat exchange sub-board 33 and the memory 203, improving the operation efficiency.

[0116] Through the rotation of the cam rotating shaft 3342, the cam wrench 3341 can precisely control the movement of the pressing slider 3343, allowing an accurate pressing force to be applied to the auxiliary cold plate 332, ensuring good thermal contact between the memory heat exchange sub-board 33 and the memory 203.

[0117] The guide shaft 3344 provides a stable sliding path to prevent the auxiliary cold plate 332 from deflecting or tilting during movement, thereby ensuring the stability of the memory heat exchange sub-plate 33. Through the cam mechanism, the clamping slider 3343 can move smoothly along the axial direction of the guide shaft 3344, ensuring that the force applied to the auxiliary cold plate 332 is uniform, reducing local stress concentration and reducing the risk of damage to the memory 203.

[0118] In some possible implementations, the cam wrench 3341 has a cam portion 3345 and a handle portion 3346 . The cam portion 3345 is rotatably disposed on the cam shaft 3342 and abuts against the clamping slider 3343 . The handle portion 3346 is connected to the cam portion 3345 .

[0119] The cam portion 3345 can convert rotational motion into linear motion by abutting against the clamping slider 3343, thereby accurately controlling the clamping force applied to the auxiliary cold plate 332, helping to ensure good thermal contact between the memory heat exchange sub-plate 33 and the memory 203, and improving heat dissipation efficiency.

[0120] The handle 3346 provides an interface that is easy to grasp and operate, so that the user can easily rotate the cam wrench 3341, thereby improving the efficiency of installation and removal and reducing the operation time. By adjusting the rotation angle of the handle 3346, the user can easily adjust the size of the clamping force, allowing for flexible adjustment according to specific installation requirements to ensure the best clamping effect.

[0121] In some possible implementations, the mating surfaces of the cam portion 3345 and the clamping slider 3343 are arc surfaces, which can ensure smooth sliding during the mating process.

[0122] In some possible implementations, the locking switch assembly 334 also includes a compression spring 3347, which is sleeved on the guide shaft 3344 and located on the side of the clamping slider 3343 away from the cam wrench 3341, and one side of the compression spring 3347 is connected to the reinforcement frame 3312, and the other side is connected to the clamping slider 3343.

[0123] The compression spring 3347 provides a buffer mechanism that can absorb and alleviate mechanical shock and vibration that may occur during installation and use, helping to protect the memory heat exchange sub-board 33 and memory 203 and extend their service life.

[0124] The difference between the major diameter and the minor diameter of the cam portion 3345 is the horizontal displacement of the secondary cold plate 332. Based on this, parameters such as the compression amount of the thermal pad 333 can be further calculated, which is convenient for design and selection. When maintenance or unlocking of the memory heat exchange sub-board 33 is required, the cam wrench 3341 is turned from the horizontal position to the vertical position, that is, the locking switch device is opened. During the process, the cam portion 3345 rotates from the major diameter to the minor diameter. During the spring-back process of the compression spring 3347, the pressing slider 3343 is pushed to translate in the loosening direction. At this time, the thermal pads 333 of the primary cold plate 331 and the secondary cold plate 332 and the memory 203 change from the compressed state to the non-contact state. Therefore, after unlocking the quick locking assembly 32, opening the memory slot switch can smoothly remove the memory 203 from the main board 201, realizing tool-free and quick replacement.

[0125] In some possible implementation manners, one of the pressing slider 3343 and the guide shaft 3344 is provided with a guide groove 3348, and the other is provided with a guide block 3349 relative to the guide groove 3348.

[0126] The cooperation of the guide groove 3348 and the guide block 3349 can ensure that the primary cold plate 331 and the secondary cold plate 332 do not tilt during translation, thereby improving the accuracy of fitting with the memory 203.

[0127] The combination of the guide groove 3348 and the guide block 3349 ensures the precise linear movement of the pressing slider 3343 along the guide shaft 3344, which helps to avoid the offset or tilt of the pressing slider 3343 during movement, ensuring that the applied pressing force is uniform and stable. The design of the guide groove 3348 and the guide block 3349 provides a clear movement path, reducing the friction and wear between the pressing slider 3343 and other components, thereby extending the service life of the components. The precise guiding mechanism improves the reliability of the locking and unlocking operations, ensuring that the expected pressing effect can be achieved for each operation and enhancing the overall reliability of the system.

[0128] In some possible implementation manners, the memory heat exchange sub-board 33 further includes an anti-scratch film 335, and the anti-scratch film 335 is attached to the thermal pad 333, the primary cold plate 331 and the secondary cold plate 332.

[0129] The anti-scratch film 335 can effectively protect the surfaces of the thermal pad 333, the primary cold plate 331 and the secondary cold plate 332, reduce the friction during installation, and prevent scratches, wear or other physical damages during installation, operation and maintenance, thereby extending the service life of the components, maintaining the integrity and thermal conductivity of the thermal pad 333, and ensuring that heat can be efficiently transferred from the memory 203 to the memory heat exchange sub-board 33.

[0130] The anti-scratch film 335 can also prevent dust, grease and other contaminants from adhering to the thermal pad 333 and the surfaces of the main cold plate 331 and the auxiliary cold plate 332, keeping the components clean and improving the heat dissipation efficiency. The presence of the anti-scratch film 335 makes the cleaning and maintenance process simpler, and the user can easily wipe off the dirt on the film without worrying about damaging the thermal pad 333 or the surfaces of the main cold plate 331 and the auxiliary cold plate 332.

[0131] In some possible implementations, a heat conducting groove 133 is provided on the cover plate 13 , a heat exchanging pad 134 is provided in the heat conducting groove 133 , and the internal memory heat exchanging sub-plate 33 abuts against the heat exchanging pad 134 .

[0132] The design of the heat conduction groove 133 can reduce the thermal resistance of the heat of the memory 203 being transferred to the main heat exchange sub-channel 11 through the memory heat exchange sub-plate 33. On the one hand, it can reduce the wall thickness of the heat conduction area of the main heat exchange sub-channel 11 here and reduce its thermal resistance. On the other hand, it can better fix the position of the heat exchange pad 134 to prevent it from moving, wrinkling or falling off after being compressed, thereby increasing its service life.

[0133] The heat exchange pad 134 can effectively fill the gap between the memory heat exchange sub-plate 33 and the cover plate 13 in the heat conduction area, ensure close contact between the two, reduce contact thermal resistance, improve heat conduction efficiency, and transfer the heat generated by the memory 203 to the cover plate 13 more quickly for heat dissipation.

[0134] The combined design of the heat conducting groove 133 and the heat exchange pad 134 reduces the thermal resistance in the heat transfer path, ensuring that heat can be efficiently transferred from the memory heat exchange sub-board 33 to the cover plate 13 .

[0135] The heat conducting groove 133 provides a clear location to place the heat exchange pad 134, which simplifies the installation process, ensures the correct positioning of the heat exchange pad 134, and improves operating efficiency.

[0136] The heat exchange pad 134 has a certain flexibility and can compensate for possible unevenness on the surfaces of the memory heat exchange sub-plate 33 and the cover plate 13, thereby increasing the contact area and heat conduction efficiency.

[0137] Please also see Figure 16 , Figure 17 , Figure 18 , Figure 19 and Figure 20, in some possible implementation manners, the quick locking assembly 32 includes a lever bracket 321, a lever 322, a lock 323, and a lock piece 324. The lock 323 is disposed on the main heat exchange flow path 10. One end of the lever 322 is rotatably disposed on the lever bracket 321. A lock piece 324 is provided at the other end of the lever 322. The lock 323 cooperates with the lock piece 324 to lock the lever 322 and make the lever 322 abut against the side of the memory heat exchange sub-board 33 away from the main heat exchange flow path 10, so that the memory heat exchange sub-board 33 abuts against the main heat exchange flow path 10.

[0138] The quick locking assembly 32 is used to apply a certain clamping force to the memory heat exchange sub-board 33, further improving the heat conduction efficiency between the memory heat exchange sub-board 33 and the main heat exchange sub-flow path 11 and reducing its contact thermal resistance.

[0139] The design of the quick locking assembly 32 allows the user to quickly lock or release the memory heat exchange sub-board 33 through a simple operation of the lever 322, greatly simplifying the installation and disassembly process and improving the operation efficiency.

[0140] The cooperation between the lock 323 and the lock piece 324 provides a stable mechanical connection, ensuring that the lever 322 can firmly hold the memory heat exchange sub-board 33 against the main heat exchange flow path 10 and preventing loosening or displacement during use. The design of the lever 322 makes the force applied to the memory heat exchange sub-board 33 uniform, ensuring good contact between the memory heat exchange sub-board 33 and the main heat exchange flow path 10 and improving the heat conduction efficiency.

[0141] In some possible implementation manners, the lever bracket 321 and the lock 323 are respectively disposed on the main heat exchange flow path 10 and are located on both sides of a plurality of sequentially arranged memories 203. When the lock 323 cooperates with the lock piece 324, the extending direction of the lever 322 is the same as the direction in which the plurality of memories 203 are sequentially arranged, so as to simultaneously press a plurality of memory heat exchange sub-boards 33 against the corresponding memories 203.

[0142] In some possible implementation manners, the quick locking assembly 32 further includes a limit screw 325. The limit screw 325 is disposed on the lever bracket 321. A lever sleeve 326 is provided at one end of the lever 322, and the lever sleeve 326 is sleeved on the limit screw 325.

[0143] The limit screw 325 provides a clear limiting function, ensuring that the lever 322 remains in a predetermined position during operation, which helps to ensure a stable connection between the memory heat exchange sub-board 33 and the main heat exchange flow path 10. By restricting the movement range of the lever 322, the limit screw 325 can prevent excessive force application, thereby avoiding damage to the memory heat exchange sub-board 33 and other components.

[0144] The pressure rod sleeve 326 is passed through the limiting screw 325 to provide additional support and guidance, thereby enhancing the stability of the pressure rod 322 and reducing possible shaking or deviation during operation.

[0145] In some possible implementations, a spring sheet 327 is provided on one side of the pressure rod 322 facing the memory heat exchange sub-plate 33 , and a protrusion structure 328 is provided on the spring sheet 327 opposite to the memory heat exchange sub-plate 33 .

[0146] The spring piece 327 has a certain elasticity and can provide additional cushioning and support when the pressure rod 322 applies force, adapt to slight dimensional changes caused by thermal expansion or other factors, and ensure stable contact between the memory heat exchange sub-plate 33 and the main heat exchange channel 10. The spring piece 327 and the protruding structure 328 help to improve the heat conduction efficiency and enhance the heat dissipation effect.

[0147] The protruding structure 328 can concentrate the force on a specific area, ensuring that the pressure applied to the memory heat exchange sub-plate 33 is uniform, reducing local stress concentration and lowering the risk of component damage.

[0148] The height of the protruding structure 328 on the corresponding spring sheet 327 can be designed according to the required compression amount of the heat exchange pad 134. When the pressure rod 322 is lowered and locked, the protruding structure 328 on the spring sheet 327 will squeeze the memory heat exchange sub-plate 33, so that the spring sheet 327 will produce elastic deformation and generate a certain elastic force acting on the memory heat exchange sub-plate 33. The force is transmitted through the memory heat exchange sub-plate 33 and compresses the heat exchange pad 134 in the heat conduction groove 133 to meet its buckling force requirements.

[0149] In some possible implementations, the lock buckle 323 includes a locking pin 3231 and a guide slope 3232. The locking piece 324 is provided with a blocking piece 3241 and a paddle 3242. The locking pin 3231 and the blocking piece 3241 are limited and matched, and the paddle 3242 is connected to the blocking piece 3241. When the pressure rod 322 is pressed until the locking pin 3231 and the blocking piece 3241 are limited, locking can be achieved. When the paddle 3242 is toggled to disengage the locking pin 3231 from the blocking piece 3241, unlocking can be achieved, and tool-free installation is achieved, thereby improving operation efficiency.

[0150] The limiting cooperation between the locking pin 3231 and the blocking piece 3241 provides a stable locking mechanism, ensuring that the pressure rod 322 will not loosen when in the locked position, thereby maintaining a stable connection between the memory heat exchange sub-plate 33 and the main heat exchange flow channel 10. The guide bevel 3232 helps to guide the locking piece 324 into the correct position, reducing the need for precise alignment during operation, making the locking and unlocking process smoother and more intuitive. The presence of the guide bevel 3232 also reduces the direct friction between the locking piece 324 and the locking pin 3231, reducing wear and extending the service life of the component. The design of the paddle 3242 allows the user to quickly release the locking mechanism with a simple action, simplifying the disassembly process and improving operational efficiency.

[0151] In this solution, by unlocking the quick locking assembly 32 and the locking switch assembly 334, the memory heat exchange sub-plate 33 can be rotated and lifted along the fixed axis 31, so that the memory slot switch is completely exposed, and there is no device blocking the upper area, which is convenient for the operator to directly unlock the memory slot switch. This effectively solves the difficulty of the existing solution in which the memory slot switch needs to be unlocked through the gap between adjacent memory cold plates using tools, greatly improving the operating efficiency and safety.

[0152] Please also see Figure 21 and Figure 22 In some possible implementations, the liquid cooling device 100 further includes a liquid leakage detection mechanism 40, and the liquid leakage detection mechanism 40 includes a processor liquid leakage detection component and a memory liquid leakage detection component.

[0153] The liquid leakage detection mechanism 40 can quickly detect any leakage in the liquid cooling system, and promptly sound an alarm or take automatic protective measures to prevent damage caused by liquid leakage. The processor 202 and the memory 203 are key components in the computer system. The liquid leakage detection mechanism 40 specifically monitors these areas, which helps to protect these key components from liquid damage and extend their service life. By quickly detecting and responding to the leakage problem, the system can repair the problem before it expands, reduce unexpected downtime caused by liquid leakage, and improve the availability of the system. The liquid leakage detection mechanism 40 can be integrated with the system's automated management and monitoring system to achieve real-time monitoring and automated response to the liquid cooling system and improve management efficiency. In order to meet the flexibility requirements, the processor leakage detection component and the memory leakage detection component are independently designed, and each has an independent signal interface connected to the mainboard 201.

[0154] In some possible implementations, the processor leakage detection component includes a processor heat exchange mechanism detection component, a processor heat exchange mechanism and connecting pipeline connection detection component, and a processor heat exchange mechanism connecting pipeline detection component.

[0155] The processor liquid leakage detection component is located at the welded joints of the processor heat exchange mechanism, the connection points between the processor heat exchange mechanism and the connecting pipelines, and below the connecting pipelines of the processor heat exchange mechanism and the maintenance joint connecting pipelines. The leakage detection line can be fixed to metal parts such as the cold plate and joints by winding along the outer diameter of the metal parts, using acetic acid tape, waterproof tape or buckles. The fixation of the leakage detection line to the connecting pipeline can be achieved by heat shrinking the leakage detection line and the connecting pipeline inside the heat shrinkable sleeve.

[0156] By setting multiple detection components at key positions, the system can comprehensively monitor the processor heat exchange mechanism, connecting pipelines and their connection points to ensure that any potential liquid leakage problems can be detected in time. Comprehensive liquid leakage detection improves the overall reliability of the liquid cooling system, ensures safe operation under various operating conditions, and reduces the risk of failures caused by liquid leakage.

[0157] In some possible implementation manners, the liquid cooling heat dissipation device 100 further includes a cold plate bracket 80. The memory liquid leakage detection component includes a first diversion groove 41, a detection wire groove 42 and a leakage detection line 43. The main heat exchange flow channel 10 is arranged on the cold plate bracket 80. A detection wire groove 42 and a plurality of first diversion grooves 41 are arranged on one side of the cold plate bracket 80 facing the main heat exchange flow channel 10. The plurality of first diversion grooves 41 are arranged at intervals. The detection wire groove 42 communicates with the plurality of first diversion grooves 41, and the leakage detection line 43 is arranged in the detection wire groove 42. The first diversion groove 41 is used to collect and divert the leaked liquid in the main heat exchange flow channel 10 to prevent the leaked liquid in the main heat exchange flow channel 10 from spreading to the main board 201 and damaging the circuit. The detection wire groove 42 is used to place and protect the leakage detection line 43 on the one hand to prevent it from being damaged by pulling and friction, and on the other hand to receive the leaked liquid diverted by the first diversion groove 41. Once liquid leakage is detected, the electrical signal of the leakage detection line 43 changes accordingly and triggers an alarm. After receiving the alarm signal, the server management module immediately issues an instruction to turn off the server power supply to avoid losses to equipment and data.

[0158] If the memory liquid leakage detection component follows the laying scheme of the processor liquid leakage detection component, it is necessary to fix the liquid leakage detection line and the main heat exchange sub-channel 11 with tape to detect the leaked liquid. However, in actual use, due to the different structures of the memory heat exchange sub-board 33 and the need to frequently operate on the memory 203, it is difficult to fix the liquid leakage detection line flat and firmly on the memory heat exchange sub-board 33 in the above way. It is easy for the liquid leakage detection line to be loose or displaced and interfere with the switch of the memory slot during the opening and closing process, resulting in damage to the liquid leakage detection line due to wear and pulling, and inability to lock due to interference with the memory slot switch, causing faults such as the memory 203 not being properly installed. If the number of fixing tapes is increased, it will absorb and isolate a part of the leaked liquid, affecting the accuracy of the liquid leakage detection system. Therefore, in this solution, the memory liquid leakage detection component takes into account both the convenience of installation and operation and maintenance and the accuracy of the detection function.

[0159] The setting of multiple first diversion grooves 41 can effectively guide any potential leaked liquid into the specific detection wire groove 42, ensuring that the leaked liquid can be quickly collected and detected, and reducing the diffusion of liquid in the system. By setting multiple spaced first diversion grooves 41 and detection wire grooves 42 on the cold plate bracket 80, the system can cover a larger area, ensuring that leaked liquid at any position can be detected, and improving the overall detection coverage rate. The connected design of the detection wire groove 42 and multiple first diversion grooves 41 enables the liquid leakage detection line 43 to quickly detect the liquid in any first diversion groove 41, providing a timely liquid leakage alarm to prevent the liquid from damaging the system. It can achieve efficient and reliable liquid leakage detection in a limited space, is not easy to interfere with the memory 203, is firmly fixed and has good contact, is not easy to be damaged during installation and operation and maintenance, reduces the difficulty of production and operation and maintenance operations, effectively improves the detection accuracy rate and installation and operation and maintenance efficiency, and saves the server downtime.

[0160] In some possible implementation manners, a fixing seat 19 is provided on the main heat exchange channel 10, and the fixing seat 19 is used to connect with the quick connector assembly 21.

[0161] A connecting head is provided on the fixing seat 19. One of the connecting head and the quick connector assembly 21 is a female connector, and the other is a male connector. When the two are docked with each other, the connection of the quick connector assembly 21 can be realized.

[0162] In some possible implementation manners, a second diversion groove 44 penetrating the main heat exchange channel 10 is provided on the main heat exchange channel 10 below the quick connector assembly 21, and the second diversion groove 44 is communicated with the detection wire groove 42.

[0163] The setting of the second diversion groove 44 can effectively guide any liquid leakage from the quick-connect fitting assembly 21, enabling it to quickly flow into the detection wire groove 42, thereby improving the efficiency of liquid leakage detection. By connecting the second diversion groove 44 with the detection wire groove 42, the system can cover a larger detection area, not only limited to the memory 203 area but also including the area near the quick-connect fitting assembly 21, ensuring comprehensive monitoring. Since the second diversion groove 44 directly penetrates the main heat exchange flow channel 10, any liquid leakage can be quickly guided to the liquid leakage detection line 43 in the detection wire groove 42. Therefore, when liquid leakage occurs in the quick-connect fitting assembly 21, the leaked liquid will drip onto the surface of the main heat exchange flow channel 10 under the action of gravity. When the liquid accumulates to a certain volume, it will flow along the second diversion groove 44 to the detection wire groove 42. Once the liquid leakage detection line 43 arranged in the detection wire groove 42 is wetted, an alarm will be triggered immediately, thus achieving a quick response and reducing the potential damage of the liquid to the system. This design makes the liquid leakage detection system more integrated and simplified, reducing the need for additional sensors or complex wiring, and lowering the system complexity and cost.

[0164] In some possible implementation manners, the width of the second diversion groove 44 covers the range where liquid leakage may occur in the quick-connect fitting assembly 21, that is, the width of the second diversion groove 44 is greater than the gap between the female connector and the male connector, so as to more comprehensively detect the liquid leakage condition of the quick-connect fitting assembly 21.

[0165] In some possible implementation manners, the inlet 15 is adjacently arranged with one of the fixed seats 19, the outlet 16 is adjacently arranged with the other fixed seat 19, and the length of the second diversion groove 44 covers the inlet 15 and one of the fixed seats 19, or the outlet 16 and the fixed seat 19, so as to simultaneously detect the liquid leakage condition at the inlet 15 and the fixed seat 19, or the outlet 16 and the fixed seat 19.

[0166] The liquid leakage detection mechanism 40 of this application effectively solves the problem of liquid leakage detection at the connection of the quick connector in the quick connector assembly 21 within a limited space. For movable components such as quick connectors, they need to be connected during operation and disconnected during maintenance. The accuracy of liquid leakage detection and service life are crucial. If the liquid leakage detection line is directly laid along the connection direction of the quick connector and fixed together with it, it is necessary to require a wiring terminal in the middle of the liquid leakage detection line to enable connection and disconnection. Therefore, in actual use, before unlocking and disconnecting the quick connector, it is necessary to first disconnect the wiring terminal of the liquid leakage detection line here, and after the quick connector is connected and locked, it is necessary to reconnect the wiring terminal of the liquid leakage detection line here. The above operation steps will inevitably increase the operation difficulty and time, and if not careful, it will also cause the liquid leakage detection line to be damaged by external force pulling. At the same time, the shape of the quick connector is often a continuous curved surface axially. Problems such as the liquid leakage detection line being difficult to fit well with the quick connector and fixed, and unable to cover all areas of liquid droplet leakage will also lead to low detection accuracy. The liquid leakage detection mechanism 40 of this solution not only avoids the complex liquid leakage detection line loop winding on the internal heat exchange sub-board 33, solves the interference problem that is prone to occur in practical applications, but also effectively improves the detection accuracy and installation, operation and maintenance efficiency, saves the server downtime.

[0167] In some possible implementation manners, the cold plate bracket 80 is provided with a first positioning pin 81 and a first non-loosening screw 82. The first positioning pin 81 corresponds to the first positioning hole 204 on the main board 201, and the first non-loosening screw 82 corresponds to the main board screw hole 205 on the main board.

[0168] The first positioning pin 81 corresponds to the positioning hole 204 on the main board, ensuring that the cold plate bracket 80 can be accurately positioned on the main board 201, which helps to ensure the correct alignment of the cold plate bracket 80 with the processor 202 or other components, thereby optimizing the heat conduction efficiency. The design of the first positioning pin 81 and the first non-loosening screw 82 makes the installation process simpler and more intuitive, reduces the possibility of installation errors, improves the operation efficiency, facilitates the maintenance and replacement of the cold plate bracket 80 and related components. Users can easily remove and reinstall these components, reducing the maintenance cost. Users can easily fix the cold plate bracket 80 in place without complex adjustment. The design of the first non-loosening screw 82 ensures that the screw will not fall off during installation and maintenance, reduces the risk of losing the screw, and at the same time ensures that the cold plate bracket 80 remains stable during use, preventing loosening caused by vibration or movement.

[0169] In some possible implementation manners, the main heat exchange flow path 10 is provided with a second positioning hole 17 and a second non-loosening screw 18. The cold plate bracket 80 is provided with a second positioning pin 83 and a bracket screw hole 84. The second positioning pin 83 corresponds to the second positioning hole 17, and the second non-loosening screw 18 corresponds to the bracket screw hole 84.

[0170] The second positioning pin 83 corresponds to the second positioning hole 17, ensuring the precise alignment of the cold plate bracket 80 and the main heat exchange flow path 10, which helps optimize the liquid flow path and heat conduction efficiency, ensuring the efficient operation of the system.

[0171] The design of the second positioning pin 83 and the second non-loosening screw 18 makes the installation process simpler and more intuitive. Users can easily fix the main heat exchange flow path 10 to the cold plate bracket 80 without complex adjustments, reducing the possibility of installation errors, facilitating the maintenance and replacement of the main heat exchange flow path 10 and related components. Users can easily remove and reinstall these components, reducing maintenance costs. The design of the second non-loosening screw 18 ensures that the screw will not fall off during installation and maintenance, reducing the risk of losing the screw and the screwdriver slipping, while ensuring that the main heat exchange flow path 10 remains stable during use, preventing loosening caused by vibration or movement.

[0172] In some possible implementation manners, the liquid cooling heat dissipation device 100 further includes a supply and return liquid joint assembly 50. The supply and return liquid joint assembly 50 is communicated with the main heat exchange flow path 10, and the supply and return liquid joint assembly 50 is mainly used for the on-off of the cooling liquid flow path in the server 200.

[0173] The introduction of the supply and return liquid joint assembly 50 allows the coolant to circulate in the main heat exchange flow path 10, taking away the heat generated by electronic components such as the processor 202 and the memory 203, thereby realizing efficient heat management and heat dissipation. The supply and return liquid joint assembly 50 can be integrated with an external cooling system (such as a chiller or a radiator) to provide a flexible heat dissipation solution, adapting to different application requirements and environmental conditions. Through continuous liquid circulation, the liquid cooling heat dissipation device 100 can maintain a stable temperature in the system, prevent overheating, and improve the performance and reliability of electronic devices.

[0174] In some possible implementation manners, the supply and return liquid joint assembly 50 is fixed at the leftmost side of the rear window of the server 200. After being connected to the water distribution device at the cabinet end through the supply and return liquid quick connector 206, the coolant circuit is conducted, separating the water and electricity from the power module on the right side of the server 200 to the greatest extent.

[0175] In some possible implementation manners, the supply and return liquid joint assembly 50 includes a liquid inlet pipeline 51 and a liquid return pipeline 52. The liquid inlet pipeline 51 is communicated with one side of the main heat exchange flow path 10, and the liquid return pipeline 52 is communicated with the other side of the main heat exchange flow path 10.

[0176] The coolant enters the liquid cooling device 100 of the server 200 through the liquid supply and return quick connector 206, and reaches the first main heat exchange sub-channel 111 through the liquid inlet pipeline 51. The coolant flowing out of the third main heat exchange sub-channel 113 is returned to the liquid supply and return quick connector 206 through the liquid return pipeline 52, thereby completing the entire circulation process of the coolant in the server 200.

[0177] By connecting the liquid inlet pipe 51 and the liquid return pipe 52 to the two sides of the main heat exchange channel 10, a complete circulation path is formed to ensure that the coolant can effectively flow through the entire main heat exchange channel 10, remove the heat generated by the equipment, and achieve efficient heat exchange. This design allows flexible configuration of the flow direction and flow rate of the coolant to adapt to different heat dissipation requirements and system configurations, providing greater design and application flexibility.

[0178] In some possible implementations, the processor heat exchange mechanism 20 is provided with a fastening screw hole 22 , and the fastening screw hole 22 corresponds to the stud 207 of the chip socket on the mainboard 201 .

[0179] The corresponding design of the fastening screw hole 22 and the stud 207 ensures that the processor heat exchange mechanism 20 can be firmly fixed on the motherboard 201 to prevent loosening or displacement during use, ensures good contact between the processor heat exchange mechanism 20 and the processor 202, helps to optimize the heat conduction efficiency, and quickly transfers the heat generated by the processor 202 to the processor heat exchange mechanism 20 for heat dissipation.

[0180] The corresponding design of the fastening screw hole 22 and the stud 207 also makes the installation process of the processor heat exchange mechanism 20 simpler and more intuitive, reduces the possibility of installation errors, and improves operating efficiency. The design of the fastening screw hole 22 facilitates the maintenance and replacement of the processor 202 or the processor heat exchange mechanism 20, and the user can easily remove and reinstall the components, reducing maintenance costs.

[0181] By means of the rationally distributed fastening screw holes 22 , the pressure applied to the processor heat exchange mechanism 20 can be effectively dispersed, stress concentration can be reduced, and the risk of component damage can be lowered.

[0182] Please also see Figure 23During installation, the first step is to install the cold plate bracket 80, align all the first positioning pins 81 on the cold plate bracket 80 and put them into the first positioning holes 204 on the main board 201. At this time, the first captive screw 82 can also be aligned with the main board screw hole 205, and the first captive screw 82 is fastened in place. The second step is to lift the pressure rod 322 and rotate all the memory heat exchange sub-plates 33 around the fixed axis 31 to the maximum elevation position. At this time, the pressure rod 322 is lowered and locked. Then all the memory heat exchange sub-plates 33 are rotated in the opposite direction around the fixed axis 31 and lean on the pressure rod 322. The pressure rod 322 plays a role in blocking and limiting the memory heat exchange sub-plate 33, limiting its further falling. The third step is to align the second positioning hole 17 on the main heat exchange channel 10 with the second positioning pin 83 on the cold plate bracket 80, and lower the main heat exchange channel 10 and the memory heat exchange sub-plate 33 together. At this time, the second captive screw 18 on the main heat exchange flow channel 10 is also aligned with the bracket screw hole 84 on the cold plate bracket 80, and the second captive screw 18 is fastened in place. Then, the liquid supply and return joint assembly 50 is fixed to the rear window of the chassis by screw fastening. The fourth step is to install the memory heat exchange sub-board 33, insert the memory 203, and lift the pressure rod 322, rotate all the memory heat exchange sub-boards 33 around the fixed axis 31 to the position covering the memory 203 particles, then lower and lock the pressure rod 322, and finally turn the locking switch assembly 334 to press the memory 203. The fifth step is to install the processor heat exchange mechanism 20, align the fastening screw hole 22 of the processor heat exchange mechanism 20 with the stud 207 of the chip socket on the motherboard 201, and slowly lower it horizontally, and tighten all the fastening screw holes 22 according to the required torque. Then fix the processor heat exchange connection pipeline 23, and connect the liquid inlet quick connector 211 and the liquid outlet quick connector 212. The sixth step is to install the leakage detection line signal interface. The installation of the entire liquid cooling system can be completed by connecting the leakage detection line signal interfaces of the processor heat exchange mechanism 20 and the memory heat exchange sub-board 33 to the main board 201 according to the bit numbers.

[0183] The liquid cooling device 100 provided in the embodiment of the present application includes a main heat exchange channel 10, a processor heat exchange mechanism 20 and a memory heat exchange mechanism 30. The processor heat exchange mechanism 20 is arranged on the processor 202, and the processor heat exchange mechanism 20 is connected to the main heat exchange channel 10 through a quick connector assembly 21. The memory heat exchange mechanism 30 includes a fixed shaft 31, a quick locking assembly 32 and a plurality of memory heat exchange sub-plates 33. The memory heat exchange sub-plates 33 are passed through the fixed shaft 31 and clamped with corresponding memory 203. The quick locking assembly 32 is used to fix the memory heat exchange sub-plates 33 and abut against the main heat exchange channel 10, so that the memory heat exchange sub-plates 33 and the main heat exchange channel 10 can exchange heat.

[0184] Since the processor heat exchange mechanism 20 is connected to the main heat exchange flow path 10 by means of the quick connector assembly 21, when only the processor 202 or the processor heat exchange mechanism 20 needs to be replaced, the quick connection and disconnection between the processor heat exchange mechanism 20 and the main heat exchange flow path 10 can be achieved through the quick connector assembly 21, and then the processor heat exchange mechanism 20 can be disassembled and installed separately without disassembling the memory heat exchange mechanism 30 and the memory 203 together.

[0185] The memory heat exchange sub-board 33 is inserted through the fixed shaft 31 and fixed by the quick locking assembly 32 and abuts against the main heat exchange flow path 10. The memory heat exchange sub-board 33 clamps the corresponding memory 203. Therefore, when the memory 203 needs to be replaced, only a simple operation is required to open the quick locking assembly 32 and rotate the memory heat exchange sub-board 33 corresponding to the memory 203 around the fixed shaft 31, then the memory 203 can be taken out and a new memory 203 can be replaced without removing the memory heat exchange sub-board 33 for disassembly and assembly, which greatly simplifies the replacement process of the memory 203; the memory heat exchange sub-board 33 is inserted through the fixed shaft 31, so the memory heat exchange sub-board 33 can move freely on the fixed shaft 31. During actual assembly, the memory heat exchange sub-board 33 can be self-adapted according to the position of the memory 203 and accurately adjust its own position to ensure the best contact and heat exchange efficiency between the memory heat exchange sub-board 33 and the memory 203, achieving the best adaptation and improving the heat dissipation effect.

[0186] Since the liquid cooling heat dissipation device 100 of the present application supports the independent disassembly and maintenance of the processor 202 and the memory 203, the operation and maintenance personnel can replace and maintain the components more quickly, greatly improving the flexibility, maintainability, convenience and safety of production, testing and operation and maintenance, reducing the downtime, and improving the availability and maintenance efficiency of the server 200.

[0187] In addition, the embodiment of the present application further provides a server 200, including a main board 201, a processor 202, a memory 203 and the above-mentioned liquid cooling heat dissipation device 100. The processor 202 and the memory 203 are arranged on the main board 201, and the liquid cooling heat dissipation device 100 is used for dissipating heat from the processor 202 and the memory 203.

[0188] In view of the fact that the server 200 in this embodiment includes the liquid cooling heat dissipation device 100 described in any of the above embodiments, therefore, the server 200 includes the structure and beneficial effects of the liquid cooling heat dissipation device 100, which will not be elaborated in detail in this embodiment.

[0189] The above has introduced in detail a liquid cooling heat dissipation device and a server provided by the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principle of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A liquid cooling and heat dissipation device, characterized in that, include: Main heat exchange flow channel; A processor heat exchange mechanism, used for dissipating heat from the processor, the processor heat exchange mechanism being detachably connected to the main heat exchange flow channel via a quick connector assembly so that the processor heat exchange mechanism is in communication with the main heat exchange flow channel; The memory heat exchange mechanism includes a fixed shaft, a quick locking assembly and a plurality of memory heat exchange sub-plates. The memory heat exchange sub-plate is inserted into the fixed shaft so that the memory heat exchange sub-plate can rotate around the fixed shaft and slide axially along the fixed shaft. The memory heat exchange sub-plate is used to clamp the corresponding memory. The quick locking assembly includes a pressure rod bracket, a pressure rod, a lock buckle and a locking plate. The lock buckle is arranged on the main heat exchange flow channel. One end of the pressure rod is rotatably arranged on the pressure rod bracket. The other end of the pressure rod is provided with the locking plate. The lock buckle cooperates with the locking plate to lock the pressure rod. The quick locking assembly is used to fix and abut the plurality of memory heat exchange sub-plates on the main heat exchange flow channel so that the memory heat exchange sub-plates can exchange heat with the main heat exchange flow channel.

2. The liquid cooling heat dissipation device according to claim 1, wherein The main heat exchange flow channel includes a plurality of main heat exchange sub-flow channels, and the plurality of main heat exchange sub-flow channels are connected in sequence through connecting pipelines.

3. The liquid cooling heat dissipation device according to claim 2, characterized in that The main heat exchange channel includes a first main heat exchange sub-channel, a second main heat exchange sub-channel and a third main heat exchange sub-channel, and the connecting pipeline includes a first branch connecting pipeline and a second branch connecting pipeline. The first main heat exchange sub-channel is connected to the second main heat exchange sub-channel through the first branch connecting pipeline, and the second main heat exchange sub-channel is connected to the third main heat exchange sub-channel through the second branch connecting pipeline.

4. The liquid cooling heat dissipation device according to claim 3, wherein, The first main heat exchange sub-channel is provided with a liquid separation port, the third main heat exchange sub-channel is provided with a liquid collection port, the quick connector assembly includes a liquid inlet quick connector and a liquid outlet quick connector, the liquid inlet quick connector is connected to the liquid separation port, and the liquid outlet quick connector is connected to the liquid collection port.

5. The liquid cooling and heat dissipation device according to claim 3, wherein The liquid cooling device also includes a liquid supply and return joint assembly, and the liquid supply and return joint assembly is connected to the main heat exchange flow channel.

6. The liquid cooling and heat dissipation device according to claim 5, characterized in that, The liquid supply and return joint assembly includes a liquid inlet pipeline and a liquid return pipeline. The liquid inlet pipeline is communicated with the first main heat exchange sub-channel, and the liquid return pipeline is communicated with the third main heat exchange sub-channel.

7. The liquid cooling and heat dissipation device according to claim 2, wherein, The main heat exchange sub-channel includes a cover plate and a bottom plate, the cover plate is provided with a channel cavity, the bottom plate covers the channel cavity, the processor heat exchange mechanism is connected with the channel cavity, and the memory heat exchange sub-plate abuts against the cover plate.

8. The liquid cooling and heat dissipation device according to claim 7, wherein A rib structure is provided in the flow channel cavity, and the rib structure is arranged along the extension direction of the flow channel cavity.

9. The liquid cooling and heat dissipation device according to claim 7, characterized in that, The bottom plate is provided with a shovel tooth structure, and the shovel tooth structure is arranged in the flow channel cavity along the extension direction of the flow channel cavity.

10. The liquid cooling and heat dissipation device according to claim 7, characterized in that, The cover plate is provided with a heat conduction groove, a heat exchange pad is provided in the heat conduction groove, and the memory heat exchange sub-plate abuts against the heat exchange pad.

11. The liquid cooling and heat dissipation device according to any one of claims 1-10, characterized in that, The quick connector assembly includes a liquid inlet quick connector and a liquid outlet quick connector. The liquid inlet quick connector connects one side of the main heat exchange channel with the processor heat exchange mechanism, and the liquid outlet quick connector connects the other side of the main heat exchange channel with the processor heat exchange mechanism.

12. The liquid cooling and heat dissipation device according to claim 11, wherein The liquid cooling and heat dissipation device includes a plurality of the processor heat exchange mechanisms, and adjacent processor heat exchange mechanisms are communicated through a processor heat exchange connection pipeline.

13. The liquid cooling and heat dissipation device according to claim 12, characterized in that, The liquid cooling and heat dissipation device includes two of the processor heat exchange mechanisms. The liquid inlet quick connector is communicated with one of the processor heat exchange mechanisms through a processor liquid inlet pipeline. The two processor heat exchange mechanisms are communicated through the processor heat exchange connection pipeline. The other processor heat exchange mechanism is communicated with the liquid outlet quick connector through a processor liquid outlet pipeline.

14. The liquid cooling and heat dissipation device according to claim 1, wherein, A plurality of the memory heat exchange sub-boards are divided into two groups along the length direction of the memory. The two groups of memory heat exchange sub-boards are arranged oppositely, and along the length direction of the memory, each group of memory heat exchange sub-boards clamps one end of the corresponding memory respectively.

15. The liquid cooling heat dissipation device according to claim 1, characterized in that, The memory heat exchange sub-board includes a main cold plate, a sub-cold plate, a heat conducting pad and a locking switch assembly. Along the thickness direction of the memory, the main cold plate is located on one side of the memory, the sub-cold plate is movably arranged on the main cold plate and located on the other side of the memory. The heat conducting pad is arranged on the sides of the main cold plate and the sub-cold plate facing the memory. The main cold plate and the sub-cold plate are penetrated by a fixed shaft. The locking switch assembly is arranged on the main cold plate. The locking switch assembly is used to drive the sub-cold plate to move towards the main cold plate so as to press the heat conducting pads on the main cold plate and the sub-cold plate onto the memory.

16. The liquid cooling and heat dissipation device according to claim 15, wherein, The locking switch assembly includes a cam wrench, a cam rotating shaft, a pressing slider and a guiding shaft. The cam wrench is rotatably arranged on the main cold plate through the cam rotating shaft. The guiding shaft is arranged on the main cold plate. The sub-cold plate is penetrated by the guiding shaft. The pressing slider is arranged on the sub-cold plate and faces the cam wrench. The cam wrench is used to push the pressing slider to move axially along the guiding shaft so as to make the sub-cold plate move towards the main cold plate.

17. The liquid cooling and heat dissipation device according to claim 16, characterized in that, The locking switch assembly further includes a compression spring. The compression spring is sleeved on the guiding shaft and located on the side of the pressing slider away from the cam wrench. One side of the compression spring is connected to the main cold plate, and the other side is connected to the pressing slider.

18. The liquid cooling heat dissipation device according to claim 15, characterized in that, The memory heat exchange sub-board further includes an anti-scratch film. The anti-scratch film is attached to the heat conducting pad, the main cold plate and the sub-cold plate.

19. The liquid cooling and heat dissipation device according to claim 1, wherein When the pressure rod is locked, the pressure rod abuts against the side of the memory heat exchange sub-board away from the main heat exchange channel so that the memory heat exchange sub-board abuts against the main heat exchange channel.

20. The liquid cooling heat dissipation device according to claim 19, wherein A spring piece is arranged on the side of the pressure rod facing the memory heat exchange sub-board, and a convex structure is arranged on the spring piece opposite to the memory heat exchange sub-board.

21. The liquid cooling and heat dissipation device according to claim 1, wherein The liquid cooling and heat dissipation device further includes a liquid leakage detection mechanism. The liquid leakage detection mechanism includes a processor liquid leakage detection component and a memory liquid leakage detection component.

22. The liquid cooling and heat dissipation device according to claim 21, wherein The liquid cooling and heat dissipation device further includes a cold plate bracket. The memory liquid leakage detection component includes a first diversion groove, a detection wire groove, and a liquid leakage detection wire. The main heat exchange flow channel is arranged on the cold plate bracket. The detection wire groove and a plurality of the first diversion grooves are arranged on one side of the cold plate bracket facing the main heat exchange flow channel. The plurality of first diversion grooves are arranged at intervals. The detection wire groove communicates with the plurality of first diversion grooves. The liquid leakage detection wire is arranged in the detection wire groove.

23. The liquid cooling and heat dissipation device according to claim 22, wherein, A fixing seat is arranged on the main heat exchange flow channel. The fixing seat is used for connecting with the quick connector assembly.

24. The liquid cooling and heat dissipation device according to claim 23, wherein, A second diversion groove penetrating through the main heat exchange flow channel is arranged on the main heat exchange flow channel below the quick connector assembly. The second diversion groove communicates with the detection wire groove.

25. A server, characterized in that, It includes the liquid cooling and heat dissipation device according to any one of claims 1-24.

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