An active-cooled computer mainframe equipped with a solid-state drive

Abstract

The present application provides an actively cooled computer mainframe equipped with a solid-state drive, belonging to the field of computer mainframes, including a chassis and a base at the bottom thereof. A motherboard assembly is provided at the center inside the chassis, and a heat dissipation assembly is provided between the chassis and the motherboard assembly. In the present invention, by providing a heat conduction tube, a transmission tube, a fan blade, a servo motor and a heat dissipation block, the heat conduction tube, the transmission tube, the fan blade and the heat dissipation block all have a high heat conduction coefficient, can quickly absorb the heat generated by the solid-state drive, and at the same time make the heat transfer direction controllable. The outer surface and the inner surface of the heat conduction tube can both contact the air, thereby ensuring a good heat exchange area. The air flow in the heat conduction tube is controllable and concentrated, having a stable heat dissipation effect. The opening part on the side wall of the heat conduction tube fits the flow guide cover, ensuring that the air flow blown out of the heat conduction tube is concentrated and flows towards the flow guide cover, and at the same time limiting the noise propagation direction. The noise can reduce the energy of the sound wave after being blocked by the flow guide cover, thereby achieving the effect of noise reduction.

Description

Technical Field

[0001] This application relates to the technical field of computer hosts, and particularly to an actively cooled computer host equipped with a solid-state drive. Background Art

[0002] A computer host is one of the basic units of a computer. The computer host provides a structured environment to accommodate and connect all other computing resources and devices. Usually, a motherboard, a central processing unit, a memory, a graphics card, etc. are installed in the computer host. With the development of technology, the evolution of the host has changed from traditional desktop computers to today's compact PCs, and the selection types and configurations are rich and diverse;

[0003] Due to its compact design and space limitations, the heat dissipation problem of compact PCs is often prominent. Especially for high-speed solid-state drives, a solution is given in a prior art actively cooled computer host with a solid-state drive, the publication number of which is CN118819262B. Heat is dissipated from the solid-state drive in an abnormal state through a cooling fan to prevent damage to the solid-state drive caused by continuous high heat;

[0004] However, when this device is in use, the cooling fan dissipates heat from the solid-state drive mounting plate and the solid-state drive through air flow. The surface areas of the solid-state drive and the solid-state drive mounting plate are small, and the area for heat exchange with air is small, resulting in problems such as difficulty in controlling noise and temperature;

[0005] Therefore, an actively cooled computer host equipped with a solid-state drive is proposed. Summary of the Invention

[0006] In view of this, the purpose of this application is to provide an actively cooled computer host equipped with a solid-state drive to quickly dissipate the heat generated by the solid-state drive into the ambient air.

[0007] To solve the above technical problems, this application provides the following technical solutions:

[0008] An actively cooled computer host equipped with a solid-state drive, including a chassis and a base at the bottom thereof. A motherboard assembly is disposed at the center inside the chassis, and a heat dissipation assembly is disposed between the chassis and the motherboard assembly;

[0009] The chassis includes: a middle frame, side covers, and a perforated plate. The side covers are disposed at one side opening of the middle frame, and the perforated plate is disposed at the other side opening of the middle frame;

[0010] The motherboard assembly includes: a mounting plate, heat pipes, a solid-state drive, and a cooling fan. The heat pipes are attached to one side surface of the mounting plate, the solid-state drive is snap-connected to the other side surface of the mounting plate, and the cooling fan is disposed at the end corner position of the mounting plate;

[0011] The heat dissipation component includes: a heat conduction tube, a grille plate, a transmission tube, fan blades, a servo motor, an extrusion member, a heat conduction block and a heat dissipation block. The heat conduction tube is disposed in contact with the inner sidewall of the middle frame. Two of the grille plates are respectively disposed on both sides inside the cavity of the heat conduction tube. The transmission tube is rotatably disposed through the grille plate. The fan blades are sleeved at both ends of the transmission tube. The servo motor is disposed inside the heat conduction tube. The servo motor is in a transmission relationship with the transmission tube. The extrusion member is disposed outside the transmission tube. The heat conduction block is disposed between the two grille plates. The heat dissipation block is disposed outside the heat conduction tube. The heat dissipation block is in contact with the outside of the solid-state drive.

[0012] Preferably, the middle frame is disposed at the middle position of the sidewall of the side cover. A heat dissipation channel is provided between the outer sidewall of the middle frame and the side cover. An air outlet matching the heat dissipation fan is provided on the middle frame.

[0013] Preferably, the mounting plate is disposed at the central position of the middle frame. Grooves are provided at the end corners of the mounting plate. A flow guide cover is provided in the end corner grooves of the mounting plate. The flow guide cover includes two air outlets with a 90-degree included angle. An air inlet is provided on the side of the flow guide cover facing the porous plate. The heat dissipation fan is disposed in the flow guide cover.

[0014] The heat conduction tube is disposed in contact with the flow guide cover. The sidewall opening of the heat conduction tube is communicated with the inner cavity of the flow guide cover.

[0015] Preferably, heat dissipation fins are provided in the air outlets of the flow guide cover. The sidewall opening of the heat conduction tube is disposed opposite to the heat dissipation fins. The end of the heat pipe is in contact with the outer sidewall of the heat dissipation fins.

[0016] Preferably, the heat conduction tube is a hollow cuboid structure. The heat conduction tube includes openings at both ends. The grille plate is provided with openings. The diameter of the openings of the grille plate is smaller than the diameter of the heat conduction block.

[0017] Preferably, the transmission tube is a hollow circular tube structure. The transmission tube is rotatably connected to the grille plate through a bearing. Circular holes are provided on the outer sidewall of the transmission tube.

[0018] Preferably, the extrusion member is a spiral structure. The diameter of the extrusion member is one-half of the inner cavity diameter of the heat conduction tube. Air vents are provided on the outer sidewall of the extrusion member.

[0019] Preferably, the heat conduction block is a spherical structure.

[0020] Preferably, a heat conduction pad is attached to the inner sidewall of the heat conduction tube. The sidewall of the heat conduction pad is attached to the sidewall of the grille plate.

[0021] Preferably, the heat conduction pad is a tubular structure. The thickness of the heat conduction pad is one-half of the diameter of the heat conduction block.

[0022] Compared with the prior art, the present application has at least the following beneficial effects:

[0023] In the present invention, by providing a heat conduction tube, a transmission tube, a fan blade, a servo motor and a heat dissipation block, the heat conduction tube, the transmission tube, the fan blade and the heat dissipation block all have a high heat conduction coefficient, which can quickly absorb the heat generated by the solid-state drive, and at the same time make the heat transfer direction controllable. The outer surface and the inner surface of the heat conduction tube can both contact the air, so as to ensure a good heat exchange area. The air flow in the heat conduction tube is controllable and concentrated, with a stable heat dissipation effect. The opening part of the side wall of the heat conduction tube fits the flow guide cover, ensuring that the air flow blown out of the heat conduction tube is concentrated towards the flow guide cover, and at the same time limiting the noise propagation direction. After being blocked by the flow guide cover, the noise can reduce the energy of the sound wave, thus achieving the effect of noise reduction.

[0024] In the present invention, by providing a heat conduction tube, a heat conduction block, an extrusion member and a grille plate, a channel for the air flow to pass through is provided between two adjacent heat conduction blocks. At the same time, the heat conduction block has a good heat exchange area with the air. The moving space of the heat conduction block is limited by the heat conduction tube, making the heat transfer direction controllable. When the heat conduction block is extruded by the extrusion member, the heat conduction block generates displacement, and the flowing heat conduction block can contact the air more fully. At the same time, the channel for the air flow is further increased to ensure the air flow velocity in the heat conduction tube and strengthen the heat dissipation effect.

[0025] In the present invention, by providing a heat conduction tube and a heat conduction pad, the heat conduction pad is soft in texture and has a high heat conduction coefficient, which can achieve good heat exchange between the heat conduction tube, the heat conduction pad and the heat conduction block. The heat conduction pad can absorb sound waves, reduce the reflection of sound waves, disperse and weaken the propagation of sound waves, thereby suppressing the loudness of noise.

[0026] In the present invention, by providing a heat conduction block, the heat conduction block has a high heat conduction coefficient and can quickly absorb the heat dissipated by the solid-state drive. The spherical heat conduction block has a low rolling resistance and can conduct the heat to the air through displacement. The moving space of the heat conduction block is limited by the heat conduction tube, making the heat transfer direction controllable, so as to reduce the influence of heat on other electronic components on the main board assembly. And the heat conduction blocks are closely arranged, and the gaps between two adjacent heat conduction blocks are densely distributed. Therefore, when the noise passes through the heat conduction blocks, it is continuously reflected, and the energy carried by the sound wave is continuously weakened, achieving the effect of suppressing noise. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a schematic diagram of the overall structure in the present application;

[0028] Figure 2 is a schematic diagram of the porous plate structure in the present application;

[0029] Figure 3 is a schematic diagram of the mounting plate structure in the present application;

[0030] Figure 4 Schematic diagram of the heat conduction tube structure in this application;

[0031] Figure 5 Schematic diagram of the cross-sectional structure of the heat conduction tube in this application;

[0032] Figure 6 Schematic diagram of the extrusion part structure in this application;

[0033] Figure 7 Schematic diagram of the heat conduction pad structure in this application;

[0034] Figure 8 Schematic diagram of the flow guide cover structure in this application;

[0035] [Reference numerals]

[0036] 1, Chassis; 101, Middle frame; 102, Side cover; 103, Perforated plate; 2, Base; 3, Mounting plate; 301, Heat pipe; 302, Solid state drive; 303, Cooling fan; 304, Flow guide cover; 3041, Heat sink; 4, Heat conduction tube; 401, Grille plate; 402, Transmission tube; 403, Fan blade; 404, Servo motor; 405, Extrusion part; 406, Heat conduction block; 407, Heat dissipation block; 408, Heat conduction pad. Detailed implementation manners

[0037] The following describes in detail the active heat dissipation computer mainframe with a solid state drive provided by the present invention in combination with the accompanying drawings and specific embodiments. At the same time, it should be noted here that in order to make the embodiments more detailed, the following embodiments are the best and preferred embodiments. For some well-known technologies, those skilled in the art can also adopt other alternative methods for implementation; and the accompanying drawings are only for more specific description of the embodiments, and are not intended to specifically limit the present invention.

[0038] As Figure 1 、 Figure 2 、 Figure 3 and Figure 4 shown, an active heat dissipation computer mainframe with a solid state drive provided by an embodiment of the present application includes a chassis 1 and a base 2 at the bottom thereof. A motherboard assembly is provided at the center inside the chassis 1, and a heat dissipation assembly is provided between the chassis 1 and the motherboard assembly;

[0039] The chassis 1 includes: a middle frame 101, a side cover 102 and a perforated plate 103. The side cover 102 is provided at one side opening of the middle frame 101, and the perforated plate 103 is provided at the other side opening of the middle frame 101;

[0040] The main board assembly includes: a mounting board 3, a heat pipe 301, a solid-state drive 302, and a cooling fan 303. The heat pipe 301 is attached to one side of the surface of the mounting board 3, the solid-state drive 302 is snap-connected to the other side of the surface of the mounting board 3, and the cooling fan 303 is arranged at the corner position of the mounting board 3;

[0041] The heat dissipation assembly includes: a heat conduction pipe 4, a grille plate 401, a transmission pipe 402, a fan blade 403, a servo motor 404, a pressing member 405, a heat conduction block 406, and a heat dissipation block 407. The heat conduction pipe 4 is attached to the inner side wall of the middle frame 101. Two grille plates 401 are respectively arranged on both sides of the inner cavity of the heat conduction pipe 4. The transmission pipe 402 is rotatably arranged through the grille plate 401. The fan blades 403 are sleeved at both ends of the transmission pipe 402. The servo motor 404 is arranged inside the heat conduction pipe 4. The servo motor 404 is in a transmission relationship with the transmission pipe 402. The pressing member 405 is arranged outside the transmission pipe 402. The heat conduction block 406 is arranged between the two grille plates 401. The heat dissipation block 407 is arranged outside the heat conduction pipe 4. The heat dissipation block 407 is attached to the outside of the solid-state drive 302;

[0042] The servo motor 404 is provided with a matching power supply and a controller. During actual use, the heat generated by the solid-state drive 302 is conducted to the heat dissipation block 407 with a high thermal conductivity coefficient. The part of the heat dissipation block 407 attached to the heat conduction pipe 4 can quickly absorb heat. At the same time, the part of the heat dissipation block 407 attached to the surface of the solid-state drive 302 is provided with heat dissipation grooves to increase the surface area and improve the heat exchange area between the heat dissipation block 407 and the air.

[0043] The heat is conducted from the heat dissipation block 407 to the heat conduction block 406 with the same high thermal conductivity coefficient. The servo motor 404 drives the transmission pipe 402 to rotate, and the two fan blades 403 on both sides of the transmission pipe 402 rotate. During the rotation of the fan blades 403, the air is squeezed, so that the external air enters the inside of the heat conduction pipe 4 through the perforated plate 103. The impurities in the air are intercepted by the grille plate 401 to reduce the problem that the impurities adhere to the surface of the heat conduction pipe 4 and hinder heat dissipation. The flowing air exchanges heat with the heat conduction pipe 4 to achieve the heat dissipation effect;

[0044] Both the outer surface and the inner surface of the heat conduction pipe 4 can be in contact with the air, so as to ensure a good heat exchange area. At the same time, the heat conduction pipe 4 has a high thermal conductivity coefficient, can quickly absorb the heat generated by the solid-state drive 302, and quickly dissipate the heat to the external environment of the chassis 1;

[0045] During the rotation of the transmission pipe 402, the pressing member 405 is driven to rotate reciprocally. The pressing member 405 has an inclined surface, so it can squeeze the air, accelerate the flow of the air flow in the heat conduction pipe 4, achieve the effect of improving the air pressure and the air volume, and further strengthen the heat dissipation effect;

[0046] Meanwhile, a heat conducting block 406 with a high heat conduction coefficient is also arranged inside the heat pipe 4. The heat conducting block 406 can quickly absorb the heat on the heat pipe 4. The heat conducting block 406 is filled in the inner cavity of the heat pipe 4, so as to ensure that the heat conducting blocks 406 can be mutually attached. The two mutually attached heat conducting blocks 406 can quickly exchange the heat carried by each other. When there is air flow inside the heat pipe 4, a channel for the air flow to pass through is arranged between two adjacent heat conducting blocks 406, so that the heat of the heat conducting block 406 can be dissipated to the outside through the air flow;

[0047] Meanwhile, the moving space of the heat conducting block 406 is limited by the heat pipe 4, so that the heat transfer direction can be controlled to reduce the influence of heat on other electronic components on the main board assembly. When the heat conducting block 406 is extruded by the extruding part 405, the heat conducting block 406 generates displacement. The flowing heat conducting block 406 can be more fully contacted with the air, and meanwhile, the channel for the air flow is further increased to ensure the air flow velocity inside the heat pipe 4;

[0048] Meanwhile, the heat conducting blocks 406 are closely arranged, and the gaps between two adjacent heat conducting blocks 406 are densely distributed. Therefore, when the noise passes through the heat conducting blocks 406, it is continuously reflected, and the energy carried by the sound wave is continuously weakened, achieving the effect of noise suppression;

[0049] Meanwhile, both the transmission pipe 402 and the extruding part 405 have a high heat conduction coefficient, and they can also be used for heat transfer. Meanwhile, the part where they are in contact with the air has a good heat exchange area, so that the heat dissipation requirement can be met.

[0050] In this embodiment, as Figures 3 to 8 shown, the middle frame 101 is arranged at the middle position of the side wall of the side cover 102. A heat dissipation channel is arranged between the outer side wall of the middle frame 101 and the side cover 102. An air outlet matching with the heat dissipation fan 303 is arranged on the middle frame 101;

[0051] The middle frame 101 is arranged between the side cover 102 and the porous plate 103. The middle frame 101 is shielded by the side cover 102 and the porous plate 103, so it is not easily affected by external impacts and has a high safety factor;

[0052] Meanwhile, the middle frame 101 is made of metal material, which has good mechanical strength and is not easily deformed when being impacted. The heat dissipation channel between the middle frame 101 and the side cover 102 can be used to limit the air flow direction, so as to be conducive to taking away the accumulated heat on the middle frame 101 and achieving the heat dissipation effect;

[0053] The heat dissipation fan 303 arranged on the middle frame 101 is used to dissipate the heat accumulated on the heat pipe 301 to the ambient air. Meanwhile, the opening of the heat pipe 4 is arranged on the air outlet path of the heat dissipation fan 303, and the air blown out by the heat dissipation fan 303 can be effectively used to achieve the effect of dissipating the heat of the heat pipe 4;

[0054] The airflow blown out from the heat pipe 4 can be integrated into the airflow discharged by the cooling fan 303. The airflow is controllable and concentrated, improving the user experience.

[0055] The mounting plate 3 is arranged at the central position of the middle frame 101. Grooves are arranged at the end corners of the mounting plate 3. A flow guide cover 304 is arranged in the end corner grooves of the mounting plate 3. The flow guide cover 304 includes two air outlets with a 90-degree included angle. An air inlet is arranged on the side of the flow guide cover 304 facing the porous plate 103. The cooling fan 303 is arranged in the flow guide cover 304;

[0056] The heat pipe 4 is arranged in contact with the flow guide cover 304. The side wall opening of the heat pipe 4 is communicated with the inner cavity of the flow guide cover 304;

[0057] The flow guide cover 304 can collect the airflow discharged by the cooling fan 303, making the airflow flow concentrated. At the same time, two air outlets are arranged, which can match two independently working heat pipes 301, achieving the purpose of increasing the heat dissipation area and improving the heat dissipation effect;

[0058] At the same time, the two air outlets of the flow guide cover 304 are orthogonally distributed, and the two airflows do not intersect, thus preventing the situation of airflow interference with each other and improving the user experience;

[0059] The cooling fan 303 is arranged inside the flow guide cover 304. The flow guide cover 304 shields the cooling fan 303, improving the safety factor. At the same time, it ensures the stable and safe operation of the cooling fan 303. At the same time, the flow guide cover 304 can block the noise generated during the operation of the cooling fan 303 from spreading to the outside, achieving a noise reduction effect.

[0060] The side wall opening part of the heat pipe 4 is attached to the flow guide cover 304, ensuring that the airflow blown out from the heat pipe 4 flows concentratedly towards the flow guide cover 304. At the same time, the noise propagation direction is limited. Through the blocking of the flow guide cover 304, the energy of the sound wave can be reduced, thus achieving a noise reduction effect.

[0061] Heat dissipation fins 3041 are arranged in the air outlets of the flow guide cover 304. The side wall opening of the heat pipe 4 is arranged facing the heat dissipation fins 3041. The end of the heat pipe 301 is attached to the outer side wall of the heat dissipation fins 3041;

[0062] The heat dissipation fins 3041 increase the heat exchange area between the flow guide cover 304 and the air, helping to improve the heat dissipation effect of the heat pipe 4 and the flow guide cover 304. At the same time, by arranging the end of the heat pipe 301 in contact with the heat dissipation fins 3041, the heat pipe 301 can be quickly cooled. When the heat pipe 301 is attached to the CPU and GPU, it can bring a heat dissipation effect to the CPU and GPU;

[0063] Meanwhile, the heat sink 3041 further increases the resistance and path of the noise sound wave propagation, which can effectively reduce the energy of the noise sound wave and achieve the effect of noise reduction.

[0064] The heat conduction tube 4 is a hollow cuboid structure. The heat conduction tube 4 includes openings at both ends. The grille plate 401 is provided with hollow-outs, and the diameter of the hollow-out holes of the grille plate 401 is smaller than the diameter of the heat conduction block 406.

[0065] The openings at both ends of the heat conduction tube 4 are for air circulation. At the same time, the fan blade 403 is arranged in the inner cavity of the heat conduction tube 4. The noise is weakened through the inner wall of the heat conduction tube 4 to reduce the noise problem. The grille plate 401 is arranged on the air flow path. The grille plate 401 can filter impurities in the air flow, absorb the energy of the noise, and limit the position of the heat conduction block 406, and support the stable rotation of the transmission tube 402 at the same time.

[0066] The transmission tube 402 is a hollow circular tube structure. The transmission tube 402 is rotatably connected to the grille plate 401 through a bearing, and circular holes are provided on the outer side wall of the transmission tube 402.

[0067] The inner cavity of the transmission tube 402 can allow air to flow. When the fan blade 403 works, an air flow is generated in the inner cavity of the heat conduction tube 4. The air flow enters the inside of the transmission tube 402 through the circular holes outside the transmission tube 402, so as to ensure that the air flow inside the heat conduction tube 4 remains stable, and thus ensure the heat dissipation effect of the heat conduction tube 4.

[0068] The extrusion part 405 is a spiral structure. The diameter of the extrusion part 405 is one-half of the inner diameter of the heat conduction tube 4, and ventilation holes are provided on the outer side wall of the extrusion part 405.

[0069] The extrusion part 405 can effectively drive the displacement of the heat conduction block 406, so that the heat conduction block 406 fully exchanges heat with the air. The heat conduction block 406 filled inside the heat conduction tube 4 has a large surface area, so good heat conduction and heat dissipation effects can be achieved.

[0070] The extrusion part 405 drives the heat conduction block 406 to flow inside the heat conduction tube 4. At the same time, the through holes of the extrusion part 405 itself can allow air to flow, providing a path for air flow and making the air flow and mix well, improving the heat dissipation effect.

[0071] The heat conduction block 406 is a spherical structure.

[0072] In the case of the same volume, compared with other structures, the spherical structure has a large surface area and a small rolling resistance. Due to its large surface area, the heat conduction block 406 has a good heat exchange area with the air.

[0073] The contact surface between two adjacent heat conduction blocks 406 is a point contact, so the influence on the air flow can be controlled. At the same time, the surface of the heat conduction block 406 is smooth and has a small rolling resistance, so it can move smoothly and move well in the cooling air flow to achieve the cooling effect.

[0074] A heat conduction pad 408 is attached to the inner side wall of the heat conduction tube 4, and the side wall of the heat conduction pad 408 is attached to the side wall of the grille plate 401;

[0075] The heat conduction pad 408 is soft in texture and has a high heat conduction coefficient. Because the heat conduction pad 408 has elasticity, the heat conduction pad 408 can wrap the heat conduction block 406 to ensure a good heat exchange area and meet the need for rapid heat conduction;

[0076] At the same time, the heat conduction pad 408 can absorb sound waves, reduce the reflection of sound waves, disperse and weaken the propagation of sound waves, and the soft-textured heat conduction pad 408 attenuates the sound waves when they propagate inside it, thereby reducing the loudness of the noise;

[0077] At the same time, the heat conduction pad 408 can reduce vibration. The heat conduction pad 408 can isolate the vibration generated by the collision between the heat conduction blocks 406 or the collision between the heat conduction block 406 and the heat conduction tube 4, thereby reducing noise.

[0078] The heat conduction pad 408 is a tubular structure, and the thickness of the heat conduction pad 408 is half of the diameter of the heat conduction block 406;

[0079] The cross-section of the heat conduction pad 408 is square, which can fit the inner wall of the heat conduction tube 4, achieve good protection of the inner wall of the heat conduction tube 4, reduce noise and vibration problems, and at the same time meet the need for heat conduction. Its thickness is only half of the diameter of the heat conduction block 406, so that the heat conduction block 406 can move smoothly relative to the heat conduction pad 408.

[0080] In the technical solution provided by the present invention, during actual use, the heat generated by the solid-state drive 302 is conducted to the heat conduction block 406. The drive tube 402 is driven to rotate by the servo motor 404, and the two fan blades 403 on both sides of the drive tube 402 rotate. During the rotation of the fan blades 403, the air is squeezed, so that the external air enters the inside of the heat conduction tube 4 through the porous plate 103, and the impurities in the air are intercepted by the grille plate 401;

[0081] Both the outer surface and the inner surface of the heat conduction tube 4 can contact the air for heat dissipation. The heat conduction block 406 can quickly absorb the heat on the heat conduction tube 4. When there is an air flow in the heat conduction tube 4, a channel for the air flow to flow through is provided between two adjacent heat conduction blocks 406, so that the heat of the heat conduction block 406 can be dissipated to the outside through the air flow;

[0082] When the heat-conducting block 406 is squeezed by the squeezing member 405, the heat-conducting block 406 generates displacement, and the flowing heat-conducting block 406 can be in more sufficient contact with the air. At the same time, the channel for air flow is further increased to ensure the air flow velocity in the heat-conducting tube 4.

[0083] At the same time, both the transmission tube 402 and the squeezing member 405 have a high heat conduction coefficient, and they can also be used to transfer heat. At the same time, the part in contact with the air has a good heat exchange area, so the heat dissipation requirement can be met.

[0084] The present invention covers any substitutions, modifications, equivalent methods and solutions made on the essence and scope of the present invention. In order to enable the public to have a thorough understanding of the present invention, specific details are described in detail in the following preferred embodiments of the present invention. However, those skilled in the art can fully understand the present invention without the description of these details. In addition, well-known methods, processes, procedures, components and circuits are not described in detail to avoid unnecessary confusion to the essence of the present invention.

[0085] Those of ordinary skill in the art can understand that all or part of the steps in implementing the above-described embodiment methods can be completed by instructing relevant hardware through a program, and this program can be stored in a computer-readable storage medium, such as: ROM / RAM, magnetic disk, optical disk, etc.

[0086] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. An active heat dissipation computer host equipped with a solid state hard disk, comprising a chassis (1) and a base (2) at the bottom thereof, characterized in that: A mainboard assembly is arranged at the inner center of the chassis (1), and a heat dissipation assembly is arranged between the chassis (1) and the mainboard assembly; The chassis (1) comprises: a middle frame (101), a side cover (102) and a porous plate (103), wherein the side cover (102) is arranged at an opening on one side of the middle frame (101), and the porous plate (103) is arranged at an opening on the other side of the middle frame (101); The motherboard assembly comprises: a mounting plate (3), a heat pipe (301), a solid state hard disk (302) and a cooling fan (303), wherein the heat pipe (301) is attached to one side of the surface of the mounting plate (3), the solid state hard disk (302) is clamped to the other side of the surface of the mounting plate (3), and the cooling fan (303) is arranged at an end angle position of the mounting plate (3); The heat dissipation assembly comprises: a heat conducting pipe (4), a grid plate (401), a transmission pipe (402), a fan blade (403), a servo motor (404), an extrusion piece (405), a heat conducting block (406) and a heat dissipation block (407); the heat conducting pipe (4) having a high thermal conductivity is arranged in contact with the inner wall of the middle frame (101); the two grid plates (401) are respectively arranged on both sides of the inner cavity of the heat conducting pipe (4); the transmission pipe (402) is rotatably passed through the grid plate (401) ) is arranged, the two fan blades (403) are respectively sleeved on the two ends of the transmission tube (402), the servo motor (404) is arranged inside the heat conduction tube (4), the servo motor (404) and the transmission tube (402) establish a transmission relationship, the servo motor (404) drives the transmission tube (402) to rotate, and the transmission tube (402) drives the two fan blades (403) on both sides to rotate, and the extrusion member (405) including the inclined surface is arranged outside the transmission tube (402) The transmission tube (402) drives the extrusion piece (405) to reciprocate during rotation. The heat-conducting block (406) with a high thermal conductivity is arranged between the two grid plates (401). Two adjacent heat-conducting blocks (406) are attached to each other. The activity space of the heat-conducting block (406) is limited by the heat-conducting tube (4), so that the heat transfer direction is controllable to reduce the influence of heat on other electronic components on the mainboard assembly. The heat-conducting block (406) is controlled by the extrusion piece ( When the heat conducting block (406) is squeezed by the heat conducting pipe (405), the heat conducting block (406) is displaced, and the flowing heat conducting block (406) can fully contact with the air, and at the same time, the air flow channel is further increased to ensure the air flow rate in the heat conducting pipe (4). The heat dissipation block (407) with a high thermal conductivity is arranged on the outside of the heat conducting pipe (4), and the heat dissipation block (407) is attached to the outside of the solid state drive (302). The heat dissipation block (407) is used to conduct heat to the heat conducting block (406).

2. The active heat dissipation computer host equipped with a solid state drive according to claim 1, characterized in that: The middle frame (101) is arranged in the middle position of the side wall of the side cover (102), a heat dissipation channel is arranged between the outer wall of the middle frame (101) and the side cover (102), and an air outlet matching the heat dissipation fan (303) is arranged on the middle frame (101).

3. The active heat dissipation computer host equipped with a solid state drive according to claim 1, characterized in that: The mounting plate (3) is arranged at the center position of the middle frame (101); a groove is arranged at the end corner position of the mounting plate (3); a guide cover (304) is arranged in the end corner groove of the mounting plate (3); the guide cover (304) comprises two air outlets with an included angle of 90 degrees; an air inlet is arranged on a side of the guide cover (304) facing the porous plate (103); and the cooling fan (303) is arranged in the guide cover (304); The heat conducting pipe (4) is arranged in close contact with the air guide cover (304), and the side wall opening of the heat conducting pipe (4) is in communication with the inner cavity of the air guide cover (304).

4. The active heat dissipation computer host equipped with a solid state hard disk according to claim 3, characterized in that: A heat sink (3041) is arranged in the air outlet of the air guide cover (304), the side wall opening of the heat pipe (4) is arranged opposite to the heat sink (3041), and the end of the heat pipe (301) is attached to the outer side wall of the heat sink (3041).

5. The active heat dissipation computer host equipped with a solid state drive according to claim 1, characterized in that: The heat conducting pipe (4) is a hollow rectangular parallelepiped structure, the heat conducting pipe (4) comprises openings at both ends, the grid plate (401) is hollowed out, and the diameter of the hollow hole of the grid plate (401) is smaller than the diameter of the heat conducting block (406).

6. The active heat dissipation computer host equipped with a solid state drive according to claim 1, characterized in that: The transmission tube (402) is a hollow circular tube structure. The transmission tube (402) is rotatably connected to the grid plate (401) via a bearing. The outer side wall of the transmission tube (402) is provided with a circular hole.

7. The active heat dissipation computer host equipped with a solid state drive according to claim 1, characterized in that: The extruded piece (405) is a spiral structure, the diameter of the extruded piece (405) is half the diameter of the inner cavity of the heat conducting pipe (4), and the outer side wall of the extruded piece (405) is provided with a vent hole.

8. The active heat dissipation computer host equipped with a solid state hard disk according to claim 1, characterized in that: The heat conducting block (406) is a spherical structure.

9. The active heat dissipation computer host equipped with a solid state drive according to claim 1, characterized in that: The inner side wall of the heat-conducting pipe (4) is fitted with a heat-conducting pad (408), and the side wall of the heat-conducting pad (408) is fitted with the side wall of the grid plate (401).

10. The active heat dissipation computer host equipped with a solid state hard disk according to claim 9, characterized in that: The thermal conductive pad (408) is a tubular structure, and the thickness of the thermal conductive pad (408) is half of the diameter of the thermal conductive block (406).

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