Fault detection method and device, electronic equipment and storage medium
By implementing the fault detection method in electronic equipment, using the processing module and the control module to detect and visually present the fault results, the problems of complex and low efficiency of fault detection in the prior art are solved, and the efficiency and intuitiveness of fault detection are improved.
Patent Information
- Application Number
- CN202510220287.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-27
- Publication Date
- 2025-03-28
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The prior art is difficult to detect fault problems in electronic equipment quickly and intuitively, resulting in complex product development and increased production detection difficulty, affecting production efficiency and increasing customer complaints.
A fault detection method is provided, by implementing a command detection component in an electronic device, determining the detection result, and generating display information to visually present the detection result. The method includes a processing module and a control module for performing functions of detecting and displaying information generation.
Improve the efficiency and intuitiveness of fault detection, allowing users to directly know the fault points, thereby providing development, production and customers with solutions to their own problems, reducing waste of manpower and material resources and saving time costs.
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Figure CN119718807A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of computer technology, and in particular to a fault detection method, device, electronic device, and computer-readable storage medium. Background Art
[0002] At present, computer products bring a good experience, convenience, intelligence, etc. to our lives. However, with the upgrading of the black technology of computer products, the accompanying technical and production testing difficulties or various types of failure problems encountered by customers during use are increasing. These failure problems indirectly increase the complexity of product development, product development cycle, production testing procedures and difficulty, further affecting product production efficiency and the increase in customer complaints caused by failure problems.
[0003] Fault problems that occur during development, production, and customer use need to be solved through R&D analysis, board failure reporting, and after-sales repair, which brings unnecessary troubles, indirectly wastes human and material resources, and affects the work and life of users. Therefore, it is necessary to provide a fault detection method that can quickly detect and intuitively present faults. Summary of the invention
[0004] The present disclosure provides a fault detection method, device, electronic device and storage medium to at least solve the above technical problems existing in the prior art.
[0005] In a first aspect, an embodiment of the present disclosure provides a fault detection method, which is applied to an electronic device, wherein the electronic device includes: at least one component, and the method includes: Detect at least one component according to a first instruction and determine a detection result; the first instruction is used to instruct to detect at least one component; According to the detection result, display information is generated, and the display information is sent to a display component, the display component is used to present the display information, and the display information is used to reflect the detection result.
[0006] In a second aspect, an embodiment of the present disclosure provides a fault detection device, the device is applied to an electronic device, the electronic device includes: at least one component, the device includes: A processing module, configured to detect at least one component according to a first instruction and determine a detection result; wherein the first instruction is used to instruct the detection of at least one component; The control module is used to generate display information according to the detection result, and send the display information to the display component, wherein the display component is used to present the display information, and the display information is used to reflect the detection result.
[0007] In a third aspect, an embodiment of the present disclosure provides an electronic device, including: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the fault detection method.
[0008] In a fourth aspect, an embodiment of the present disclosure provides a non-transitory computer-readable storage medium storing computer instructions, wherein the computer instructions are used to enable a computer to execute the fault detection method.
[0009] The disclosed embodiments provide a fault detection method, device, electronic device, and storage medium, which are applied to an electronic device, wherein the electronic device includes: at least one component, and the method includes: detecting at least one component according to a first instruction and determining a detection result; the first instruction is used to instruct the detection of at least one component; generating display information according to the detection result, sending the display information to a display component, the display component is used to present the display information, and the display information is used to reflect the detection result. In this way, after the component is detected, the detection result is intuitively presented through the display component, thereby improving the efficiency of fault detection, and the user can directly know the fault point, thereby providing a solution for non-professionals such as customers to solve the problem by themselves.
[0010] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 A flowchart of a fault detection method provided by an embodiment of the present disclosure; Figure 2 A schematic diagram of the structure of a LGA package CPU installation fault detection device provided in an application embodiment of the present disclosure; Figure 3 A schematic diagram of the structure of a display component provided for an application embodiment of the present disclosure; Figure 4 A schematic diagram of the structure of a fault detection device provided in an embodiment of the present disclosure; Figure 5 A schematic diagram of the structure of an electronic device provided in an embodiment of the present disclosure. DETAILED DESCRIPTION
[0012] In order to make the purpose, features, and advantages of the present disclosure more obvious and easy to understand, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.
[0013] Before further describing the embodiments of the present disclosure in detail, the related technologies involved in the embodiments of the present disclosure are described.
[0014] Land Grid Array (LGA) is an integrated circuit packaging technology that is widely used in the packaging of computer processors, chipsets and other high-performance integrated circuits. What is different from other packaging technologies is that it requires a mounting bracket to allow the central processing unit (CPU) to be correctly pressed on the elastic tentacles exposed by the socket. The principle is the same as the ball grid array (BGA) packaging, the difference is that BGA is soldered, while LGA can be unlocked at any time to replace the chip.
[0015] With the continuous upgrading of electronic equipment, the number of faults encountered in the production and testing of electronic equipment or in customer use is also increasing. These faults indirectly increase the complexity and difficulty of product development, product development cycle, production and testing process and difficulty, further affecting product production efficiency and the increase in customer complaints caused by faults. In related technologies, the following solutions can be used for different faults: For the failure of the computer not booting up, you can check the whole machine environment, reinstall the CPU, check whether the hardware design and the mainboard power supply are normal, check whether the mainboard is burned out, measure the signal, etc. For alarm failures, the length of the buzzer alarm sound can be used to distinguish the fault problem and make corresponding treatment; For downtime failures, you can observe the downtime location, capture the startup through the serial port, and reproduce and analyze the system logs. For production failures, since the production side is full of operators, when a failure occurs, they usually report the motherboard directly for repair; When a fault occurs during customer use, ordinary consumers cannot solve the problem unless they send the product to after-sales service.
[0016] Regardless of whether the above problems occur in the development stage, the production stage or the customer use stage, the process of detecting and solving the faults is very complicated.
[0017] In actual applications, due to the LGA packaging form, there is a risk of poor contact between the CPU pins and the pogo pins of the Socket after the CPU is manually installed. In serious cases, the machine will not boot up directly, and in mild cases, the machine will often shut down or restart abnormally during use. The above solutions to problems such as machine failure to boot up, downtime, and production do not intuitively reflect the specific reasons, and can only allow R&D to investigate and analyze, and report board failures, such as non-motherboard failures, environmental or component compatibility failures, which indirectly wastes manpower and material resources. As for solutions to problems such as alarms and failures during customer use, due to the narrow scope of the failure problems and large limitations, the solutions are only applicable to product manufacturers and have no practical significance for consumers.
[0018] Based on this, the embodiment of the present disclosure provides a fault detection method applied to an electronic device, the electronic device includes: at least one component, the method includes: detecting at least one component according to a first instruction, and determining the detection result; the first instruction is used to instruct the detection of at least one component; according to the detection result, generating display information, sending the display information to a display component, the display component is used to present the display information, and the display information is used to reflect the detection result. In this way, after the component is detected, the detection result is intuitively presented through the display component, the fault detection efficiency is improved, and the user can directly know the fault point, thereby providing non-professionals such as customers with a solution to the problem by themselves.
[0019] Figure 1 A flowchart of a fault detection method provided by an embodiment of the present disclosure; Figure 1 As shown, the fault detection method is applied to an electronic device, the electronic device includes: at least one component, and the method includes: Step 101: detect at least one component according to a first instruction and determine a detection result; the first instruction is used to instruct to detect at least one component; Step 102: Generate display information according to the detection result, and send the display information to a display component, wherein the display component is used to present the display information, and the display information is used to reflect the detection result.
[0020] In some embodiments, the fault detection method is applicable to any device that needs to detect multiple components and present the detection results, and there is no limitation on the type of electronic device.
[0021] For example, the electronic device may be a user equipment (UE), a computer, a mobile terminal, etc.
[0022] In some embodiments, the first instruction is also used to indicate a component power-on timing; The step of detecting at least one component according to the first instruction and determining a detection result includes: During the startup of the electronic device, powering on the at least one component according to the power-on sequence of the components; During the power-on process of each of the components, a component presence detection is performed on each of the components.
[0023] Here, the component power-on sequence represents the time sequence in which various components in an electronic device or a computer system are powered on and start working.
[0024] Component in-place detection represents the process of detecting and confirming whether a component has been correctly installed or connected to the specified position or interface.
[0025] Here, during the startup of the electronic device, according to the power-on timing of the components, the at least one component is powered on, and during the power-on process in sequence, each component is detected in place to obtain a detection result. If each component is installed or connected to a specified position or interface, the detection result may be fault-free. If there is a component that is not installed or connected to a specified position or interface, the detection result may include fault information; the fault information may be used to indicate a specific fault type, such as a component is missing.
[0026] In some embodiments, the electronic device further comprises: a processor and a controller; The step of detecting at least one component according to the first instruction and determining a detection result includes: The processor receives a first instruction sent by the controller, detects at least one component according to the first instruction, and determines a detection result; Accordingly, generating display information according to the detection result and sending the display information to the display component includes: The controller generates display information according to the detection result, and sends the display information to the display component; The display component is a component of the electronic device, or the display component is connected to the electronic device via a target interface, that is, the display component may be one of the accessories of the electronic device.
[0027] Here, the target interface may be any interface supported by an electronic device, such as a Universal Serial Bus (USB) interface.
[0028] In one example, the electronic device may be installed with or equipped with a display component. For example, the electronic device has a host, and the display component may be fixedly installed on the host as a part of the host.
[0029] In another example, considering the convenience of the operator, the display component may not be fixedly installed. When in use, the display component may be connected to the electronic device through a target interface (such as a USB interface or an interface of other electronic devices). In this way, the operator can install the display component when needed and display the detection results through the display component. The installation is convenient and the operation is simple, and one display component can be applied to multiple electronic devices.
[0030] Here, the processor and the controller can be electrically linked through a communication protocol supported by each other, and the controller can set the components to be detected and the power-on sequence based on actual application requirements; that is, the controller can be used for power-on sequence control of the processor, component presence detection, display component control, etc. Among them, the communication protocol can be any one, as long as the link relationship is achieved, and there is no limitation on the specific protocol used. For example, the communication protocol can be the I2C (Inter-Integrated Circuit, integrated circuit bus) protocol, the SPI (Serial Peripheral Interface, serial peripheral interface) bus protocol, etc. Of course, other communication protocols can also be used.
[0031] The controller can also provide a setting function for the operator to set specific inspection items, such as targeted inspection of a certain component or whether a certain fault exists in a certain time period.
[0032] Here, the processor may be a CPU.
[0033] In one example, a CPU in an LGA package has multiple DUT_PRESENT (Device Under TestPresent) pins, which are generally evenly distributed around the Socket. When the Socket is not installed with the CPU, this pin is left floating. After the Socket is installed with the CPU, this pin corresponding to the Socket is connected to the DUT_PRESENT pin of the CPU.
[0034] Accordingly, the pin signal state can reflect whether it is correctly installed. For example, if the pin signal state is at a low level, it indicates that it is correctly installed; otherwise, if the pin signal state is at a high level, it indicates that it is not correctly installed or does not exist.
[0035] Of course, it can also be designed as follows: if the pin signal state is a high level, it indicates that it has been correctly installed; conversely, if the pin signal state is a low level, it indicates that it has not been correctly installed or does not exist.
[0036] The design of high and low levels can be adjusted here, and other signals reflecting whether the installation is correct can also be used, which is not limited here.
[0037] In some embodiments, if the detection result includes fault information, generating display information according to the detection result includes: determining a fault type according to the fault information; Based on the target rule, determining a display mark representing the fault type according to the fault type; Generate display information according to the determined display identifier; The target rule is used to indicate at least one fault type and a display identifier corresponding to each fault type.
[0038] Here, the fault type indicated by the target rule and the display identifier corresponding to the fault type can be designed based on actual conditions.
[0039] For example, there are the following fault types and the display identifiers corresponding to each fault type: The CPU is not installed properly, and the corresponding display mark is 00; The BIOS (Basic Input / Output System) is not controlled, and the corresponding display mark is 01; The memory is not properly inserted, and the corresponding display mark is 02; If the ambient temperature exceeds the standard, the corresponding display mark is 03; The PCIE (Peripheral Component Interconnect Express, a high-speed serial computer expansion bus standard) card (also called an expansion card or a small plug-in card) is lost. If it is not correctly identified or cannot be detected, the corresponding display mark is 04; If the PCIE card speed is reduced, if the transmission rate is lower than the corresponding standard rate, the corresponding display mark 05 will be displayed; The PCIE card loses bandwidth. For example, the available bandwidth is reduced during data transmission, and the corresponding display mark is 06; A certain USB port is not recognized (can be customized), such as the USB port is damaged and the USB port is not recognized, the corresponding display mark is 07; When a USB port slows down, such as when the transmission rate is lower than its corresponding standard rate, the corresponding display mark 08 is displayed; etc.
[0040] Different manufacturers can define the corresponding relationship between functional failures and display identifiers based on different electronic products. Of course, different manufacturers can define fault judgment criteria based on different electronic products. The above is only an example of a fault and does not limit the solution of the present disclosure.
[0041] Here, after the display identifier is determined, display information is generated according to the determined display identifier, and the display information is used to control the display component to present, for example, present a specific numerical value, which indicates the detection result and the specific fault type.
[0042] Of course, the displayed information may also be a combination of other characters that can be used to reflect the type of fault.
[0043] In some embodiments, if the detection result includes multiple fault information; generating display information according to the detection result includes: Determining multiple fault types according to the multiple fault information; Based on the target rule, determining display identifiers representing the multiple fault types according to the multiple fault types; generating display information according to the determined display identifiers; or, Based on the target rule, determining a display identifier corresponding to each of the fault types according to the multiple fault types; generating display information according to the determined multiple display identifiers; The target rule is further used to indicate at least one fault type combination and a display identifier corresponding to each fault type combination.
[0044] Here, considering the situation where there are multiple faults, the target rule may also indicate at least one fault type combination and a display identifier corresponding to each fault type combination. For example, if two faults may occur at the same time and the probability is high, a specific display identifier may be set for this combination.
[0045] Of course, the display identifier corresponding to each of the fault types may also be determined respectively, and display information may be generated according to the determined multiple display identifiers. Accordingly, the display component may display multiple values in sequence according to the display information, and each value may be displayed for a certain duration.
[0046] In some embodiments, the electronic device further comprises: a memory, and the method further comprises: The fault information is saved in a memory.
[0047] Here, the memory may be Flash. Each failure of the motherboard or the entire electronic device can be recorded in Flash, which is convenient for tracing the product life history, reviewing the frequent failures of the same model components or the large number of single failure problems, and optimizing the hardware design solution in the product iteration upgrade, so as to provide users with a better experience in the future.
[0048] In some embodiments, the method may further include: Upload fault information to the server.
[0049] Here, the server is a server maintained by the manufacturer. When the electronic device is a networked device, the fault information can be uploaded to the server when the electronic device can operate normally.
[0050] Specifically, considering that each user may encounter different failures during user operation, even if the problem is solved, the manufacturer can trace the product life history based on the failure information, review and improve phenomena such as frequent failures of components of the same model or more single failures, and optimize the hardware design solution in a targeted manner during product iteration and upgrade, so as to provide users with a better experience in the future.
[0051] In some embodiments, the display component has a plurality of diodes; sending the display information to the display component comprises: A control signal is sent to each diode according to the display information to control the display component to present different numerical values through the multiple diodes, and the presented numerical values are used to indicate the fault type.
[0052] Here, the display component presents display information, such as different numerical values, and the presented numerical values can indicate the type of fault, so that the operator can intuitively determine the specific type of fault.
[0053] It should be noted that the relationship between each fault type and its corresponding display identifier (ie, the presented value) in the above target rules is pre-set and provided to the operator so that the operator can determine the fault type according to the display identifier (ie, the presented value).
[0054] There are various ways to provide it. For example, if the operator is a developer or maintenance personnel, it can be provided in the form of an operation manual. If the operator is a customer, a website can be provided to the customer. The website provides a query function so that the user can determine the target rules corresponding to each product model through the website. The website can be marked on the display component in the form of a QR code, etc., so that the operator can directly query. There is no limitation on the way to provide the target rules here.
[0055] In some embodiments, the electronic device may further include at least one of the following interface for connecting components: USB interface, high-speed serial computer expansion bus (PCIE, Peripheral Component Interconnect Express) interface, serial ATA (SATA, Serial ATA) interface, VGA data cable (VGA, Video Graphics Array) interface, high-definition multimedia interface (HDMI, High Definition Multimedia Interface) interface, audio interface, serial port interface.
[0056] Among them, the USB interface, PCIE interface, SATA interface, VGA interface, HDMI interface and other interfaces are directly linked to the CPU, and are used to link the CPU with USB devices, PCIE cards, discrete graphics cards, HDD hard disks, monitors and other peripherals respectively; If the CPU does not have corresponding control components integrated into the audio interface and serial port interface, a third-party chip (IC) can be used to link with the CPU through the communication protocol supported by this integrated circuit, such as HDA (High Definition Audio) signal and TTL (Transistor-Transistor Logic) level serial port signal, to further connect peripherals such as headphones and serial cables.
[0057] It should be understood that the electronic device may also use other interfaces, such as Super Input Output (SIO), Low Pin Count Bus (LPC), etc. Examples are not given here one by one.
[0058] Specifically, performing component in-place detection on each of the components may include: Detecting an interface means checking whether the interface itself exists or is in the correct state; Testing components refers to testing whether specific components connected to the interface are correctly installed and connected.
[0059] In one example, taking the CPU self-test as an example, the component in-place detection may include: when the system is powered on, the CPU will perform a self-test (POST, Power-On Self-Test) to confirm its normal working state. If the self-test fails, the fault type is determined. If the CPU is normal, further check whether the communication with other components of the motherboard is normal, including memory, chipset, etc. In addition, the temperature of the CPU can also be monitored to ensure that it is within the safe working range to prevent failures caused by overheating. If overheating occurs, it can also be displayed as a fault type through the display component.
[0060] In another example, taking an HDMI interface and a display as an example, component in-place detection may include: during the power-on process, detecting the physical connection and electrical signal of the HDMI interface to confirm whether the HDMI interface is connected normally; and reading the signal of the display to confirm whether the display is connected to the HDMI interface normally.
[0061] The method provided by the embodiment of the present disclosure can improve the efficiency and accuracy of electronic equipment fault detection, and avoid unnecessary waste of manpower and material resources; moreover, various fault problems can be intuitively displayed through the display component, and the fault point can be clearly pointed out, so that development, production inspection personnel, and even customers can directly locate the problem point, and design optimization, maintenance, replacement of parts, etc. can be carried out, saving manpower, material resources and time costs.
[0062] Figure 2 A schematic diagram of a structure of a LGA package CPU installation fault detection device provided by an application embodiment of the present disclosure; Figure 2 As shown, the device is applied to an electronic device, which uses an LGA packaged CPU. Here, the LGA packaged CPU has multiple DUT_PRESENT pins, which are generally evenly distributed around the CPU Socket. When the CPU Socket is not installed with the CPU, this pin is suspended. After the CPU Socket is installed with the CPU, this pin corresponding to the CPU Socket is connected to the DUT_PRESENT pin of the CPU, and this pin is at a low level.
[0063] In this electronic device, the USB interface, PCIE interface, SATA interface, VGA interface, HDMI interface, etc. are directly connected to the CPU and are used to connect the CPU with USB devices, PCIE cards, discrete graphics cards, HDD hard drives, monitors and other peripherals.
[0064] In this electronic device, if the CPU does not have a corresponding control component integrated into the audio interface and serial port interface, a third-party chip can be used to link with the CPU through the communication protocol supported by this integrated circuit, for example, HDA signal, TTL level serial port signal, and further connect to peripherals such as headphones and serial port lines. Figure 2 Aduio IC (a third-party audio chip) and TTL TO 232 IC (a third-party chip).
[0065] In this electronic device, the CPU (equivalent to the above-mentioned processor) and the control unit (equivalent to the above-mentioned controller) are electrically linked through a communication protocol supported by each other. The control unit is used for CPU power-on timing control, component presence detection, 80port module (equivalent to a display component) control, etc.
[0066] In this electronic device, the CPU and Flash are linked via the Serial Peripheral Interface (SPI) communication protocol. Fault problems encountered by the mainboard or the entire machine will be recorded in the Flash, making it easier to trace the product life cycle and provide data support for product iteration optimization and component compatibility upgrades.
[0067] In the electronic device, the control unit and the 80 port module are electrically linked via a parallel interface (LPT, Line Print Terminal) communication protocol, which is used to perform display control on the 80 port module.
[0068] The CPU can perform component power-on and component presence detection according to the power-on sequence, obtain the detection result, and send it to the control unit. After the control unit determines that there is a fault problem according to the detection result, it controls the display of the 80 port module so that the 80 port module presents different values to indicate different fault types.
[0069] The application embodiment of the present disclosure also provides an example of a display component. Assuming that the display component adopts an 80 port module, its control linking method is as shown in Table 1 below. Table 1 is used to illustrate the relationship between the control unit LPT signal and the connector of the 80 port module.
[0070] Table 1
[0071] Combination Figure 3 The following is a further description of the 80port module.
[0072] The 5 and 10 pins of the 80 port module are connected to the cathode COM (Communication Port) end of the diode. When PD7 and ERR# in the LPT signal output by the control unit are high, the digital tube of the 80 port module does not work, that is, there is no display, otherwise it displays different values; A, B~G of the 80 port module are controlled separately by the PD0~PD7 signals of the LPT. During normal operation, PD7 and ERR# are at low levels. For different fault types, the control unit controls the output high and low levels corresponding to the PD0~7 signals of the LPT. When the output is high, the diode lights up, and different values displayed represent different fault phenomena.
[0073] For example, 00 means that the CPU is not installed properly, 01 means that the BIOS is not in control, 02 means that the memory is not properly inserted, 03 means that the ambient temperature exceeds the standard, 04 means that the PCIE card is lost, 05 means that the PCIE card is slowed down, 06 means that the PCIE card loses bandwidth, 07 means that a certain USB port is not recognized, 08 means that a certain USB port is slowed down, and so on. Different electronic devices can customize the correspondence between functional failures and display values according to the product, and can also customize different fault judgment criteria.
[0074] Based on the signal sent by the control unit, the 80 port module is controlled to display different values to clearly point to the corresponding fault point, so that developers, production maintenance, and even customers can directly locate the fault point by referring to the user manual, perform design optimization, maintenance, and replace parts, etc., saving manpower, material resources and time costs.
[0075] Through the method provided by the embodiment of the present disclosure, the detection accuracy of failures such as failure to boot, shutdown, and loss of function after the CPU is manually installed in the LGA package form is improved, avoiding unnecessary waste of manpower and material resources and customer complaints; through the 80 port module, various fault types are intuitively displayed, and the displayed values accurately point to the fault point, so that development, production maintenance, and even customers can directly locate the fault point, perform design optimization, maintenance, and replace parts, etc., saving time and cost. In this way, the problems of difficulty in fault detection, inability to identify faults and inability to intuitively present problems, and inability of users to determine faults by themselves are solved. In addition, each fault problem can be superimposed and recorded in Flash, which can be used to trace the product life history, review the phenomenon of frequent failures of components of the same model or more single-unit failure problems, and optimize the hardware design solution in product iteration and upgrade.
[0076] Figure 4 A structural diagram of a fault detection device provided in an embodiment of the present disclosure; Figure 4 As shown, the device is applied to an electronic device, and the electronic device includes: at least one component, and the device includes: A processing module, configured to detect at least one component according to a first instruction and determine a detection result; wherein the first instruction is used to instruct the detection of at least one component; The control module is used to generate display information according to the detection result, and send the display information to the display component, wherein the display component is used to present the display information, and the display information is used to reflect the detection result.
[0077] In some embodiments, the first instruction is also used to indicate a component power-on timing; The processing module is used to power on the at least one component according to the component power-on sequence during the startup process of the electronic device; During the power-on process of each of the components, a component in-place detection is performed on each of the components to obtain a detection result.
[0078] In some embodiments, the processing module is used to receive a first instruction sent by the control module, detect at least one component according to the first instruction, and determine a detection result; The control module is used to generate display information according to the detection result, and send the display information to the display component; The display component is a component of the electronic device, or the display component is connected to the electronic device via a target interface.
[0079] In some embodiments, the processing module may be a CPU.
[0080] In some embodiments, if the detection result includes fault information, the control module is used to determine the fault type according to the fault information; Based on the target rule, determining a display mark representing the fault type according to the fault type; Generate display information according to the determined display identifier; The target rule is used to indicate at least one fault type and a display identifier corresponding to each fault type.
[0081] In some embodiments, if the detection result includes multiple fault information; The control module is used to determine multiple fault types according to the multiple fault information; Based on the target rule, determining display identifiers representing the multiple fault types according to the multiple fault types; generating display information according to the determined display identifiers; or, Based on the target rule, determining a display identifier corresponding to each of the fault types according to the multiple fault types; generating display information according to the determined multiple display identifiers; The target rule is further used to indicate at least one fault type combination and a display identifier corresponding to each fault type combination.
[0082] In some embodiments, the display component has multiple diodes; the control module is used to send control signals to the multiple diodes according to the display information, so as to control the display component to present different numerical values through the multiple diodes, and the presented numerical values are used to indicate the fault type.
[0083] In some embodiments, the processing module is further used to save the fault information to a memory; The fault information is uploaded to the server.
[0084] It is understandable that, when implementing the corresponding fault detection method, the fault detection device provided in the above embodiment can distribute the above processing to different program modules as needed to complete all or part of the processing described above. In addition, the device provided in the above embodiment and the embodiment of the corresponding method belong to the same concept, and the specific implementation process is detailed in the method embodiment, which will not be repeated here.
[0085] An embodiment of the present disclosure provides a computer-readable storage medium storing executable instructions, wherein the executable instructions are stored. When the executable instructions are executed by a processor, the processor will be triggered to execute the fault detection method provided by the embodiment of the present disclosure.
[0086] According to an embodiment of the present disclosure, the present disclosure also provides an electronic device and a readable storage medium.
[0087] Figure 5 A schematic diagram of the structure of an electronic device provided in an embodiment of the present disclosure; Figure 5 As shown, the electronic device 50 includes: a processor 501, and a memory 502 connected to the processor 501 in communication; the memory 502 stores instructions that can be executed by the processor 501, and the instructions are executed by the processor 501 so that the processor 501 can execute: Detect at least one component according to a first instruction and determine a detection result; the first instruction is used to instruct to detect at least one component; According to the detection result, display information is generated, and the display information is sent to a display component, the display component is used to present the display information, and the display information is used to reflect the detection result.
[0088] The electronic device 50 further includes: a display component, which is used to present the display information, and the display information is used to reflect the detection result.
[0089] Of course, the electronic device provided in the above embodiments and the embodiments of the corresponding methods belong to the same concept, and the processor 501 can also execute any of the above fault detection methods. The specific implementation process is detailed in the method embodiments and will not be repeated here.
[0090] In actual application, the electronic device 50 may further include: at least one network interface 503. The various components in the electronic device 50 are coupled together via a bus system 504. It is understood that the bus system 504 is used to achieve connection and communication between these components. In addition to the data bus, the bus system 504 also includes a power bus, a control bus, and a status signal bus. However, for the sake of clarity, Figure 5 In the figure, various buses are marked as bus system 504. There may be at least one processor 501 and at least one memory 502. The network interface 503 is used for wired or wireless communication between the electronic device 50 and other devices.
[0091] The memory 502 in the embodiment of the present disclosure is used to store various types of data to support the operation of the electronic device 50 .
[0092] The method disclosed in the above embodiment of the present disclosure can be applied to the processor 501, or implemented by the processor 501. The processor 501 may be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the above method can be completed by the hardware integrated logic circuit in the processor 501 or the instruction in the form of software. The above processor 501 may be a general processor, a digital signal processor (DSP, DiGital Signal Processor), or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components, etc. The processor 501 can implement or execute the disclosed methods, steps and logic block diagrams in the embodiment of the present disclosure. The general processor may be a microprocessor or any conventional processor, etc. The steps of the method disclosed in the embodiment of the present disclosure can be directly embodied as a hardware decoding processor to execute, or a combination of hardware and software modules in the decoding processor to execute. The software module can be located in a storage medium, which is located in the memory 502. The processor 501 reads the information in the memory 502 and completes the steps of the above method in combination with its hardware.
[0093] In some embodiments, the electronic device 50 may be implemented by one or more application specific integrated circuits (ASICs), DSPs, programmable logic devices (PLDs), complex programmable logic devices (CPLDs), field programmable gate arrays (FPGAs), general-purpose processors, controllers, microcontrollers (MCUs), microprocessors, or other electronic components to execute the aforementioned method.
[0094] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps recorded in this disclosure can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solutions disclosed in this disclosure can be achieved, and this document does not limit this.
[0095] In the above description, reference is made to “some embodiments”, which describe a subset of all possible embodiments, but it can be understood that “some embodiments” may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.
[0096] Unless otherwise defined, all technical and scientific terms used in this disclosure have the same meaning as those commonly understood by those skilled in the art to which this disclosure belongs. The terms used in this disclosure are only for the purpose of describing the embodiments of this disclosure and are not intended to limit this disclosure.
[0097] It should be understood that in the various embodiments of the present disclosure, the size of the serial number of each implementation process does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present disclosure.
[0098] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0099] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.
Claims
1. A fault detection method, characterized in that: Applied to an electronic device, the electronic device comprises: at least one component, the method comprises: Detect at least one component according to a first instruction and determine a detection result; the first instruction is used to instruct to detect at least one component; According to the detection result, display information is generated, and the display information is sent to a display component, the display component is used to present the display information, and the display information is used to reflect the detection result.
2. The method according to claim 1, characterized in that The first instruction is also used to indicate the power-on timing of the component; The step of detecting at least one component according to the first instruction and determining a detection result includes: During the startup of the electronic device, powering on the at least one component according to the power-on sequence of the components; During the power-on process of each of the components, a component in-place detection is performed on each of the components to obtain a detection result.
3. The method according to claim 1, characterized in that The electronic device further comprises: a processor and a controller; The step of detecting at least one component according to the first instruction and determining a detection result includes: The processor receives a first instruction sent by the controller, detects at least one component according to the first instruction, and determines a detection result; Accordingly, generating display information according to the detection result and sending the display information to the display component includes: The controller generates display information according to the detection result, and sends the display information to the display component; The display component is a component of the electronic device, or the display component is connected to the electronic device via a target interface.
4. The method according to claim 1, characterized in that If the detection result includes fault information, generating display information according to the detection result includes: determining a fault type according to the fault information; Based on the target rule, determining a display mark representing the fault type according to the fault type; Generate display information according to the determined display identifier; The target rule is used to indicate at least one fault type and a display identifier corresponding to each fault type.
5. The method according to claim 4, characterized in that If the detection result includes multiple fault information; Generating display information according to the detection result includes: Determining multiple fault types according to the multiple fault information; Based on the target rule, determining display identifiers representing the multiple fault types according to the multiple fault types; generating display information according to the determined display identifiers; or, Based on the target rule, determining a display identifier corresponding to each of the fault types according to the multiple fault types; generating display information according to the determined multiple display identifiers; The target rule is further used to indicate at least one fault type combination and a display identifier corresponding to each fault type combination.
6. The method according to claim 1, characterized in that The display component has a plurality of diodes; sending the display information to the display component comprises: A control signal is sent to the plurality of diodes according to the display information to control the display component to present different numerical values through the plurality of diodes, wherein the presented numerical values are used to indicate the fault type.
7. The method according to claim 4, characterized in that The method further comprises: Saving the fault information to a memory; The fault information is uploaded to the server.
8. A fault detection device, characterized in that: The device is applied to an electronic device, the electronic device comprises: at least one component, the device comprises: A processing module, configured to detect at least one component according to a first instruction and determine a detection result; wherein the first instruction is used to instruct the detection of at least one component; The control module is used to generate display information according to the detection result, and send the display information to the display component, wherein the display component is used to present the display information, and the display information is used to reflect the detection result.
9. An electronic device, characterized in that: include: at least one processor; And, a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute the method described in any one of claims 1-7.
10. A non-transitory computer-readable storage medium storing computer instructions, characterized in that: The computer instructions are used to make a computer execute the method according to any one of claims 1 to 7.
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