Design specification simulation system and method suitable for 5G communication circuit board

Abstract

The invention relates to the technical field of electromagnetic field simulation, in particular to a design specification simulation system and method suitable for a 5G communication circuit board. The method comprises the following steps of obtaining 5G communication circuit board design data, and performing laminated structure data extraction and electrical parameter data extraction according to the 5G communication circuit board design data so as to obtain laminated structure data and electrical parameter data; performing signal propagation path analysis according to the laminated structure data and the electrical parameter data so as to obtain signal propagation path data; acquiring high-frequency characteristic data of the 5G communication circuit board; and carrying out electromagnetic compatibility simulation analysis according to the high-frequency characteristic data and the electrical parameter data of the 5G communication circuit board so as to obtain electromagnetic compatibility simulation data. The interference risk in high-frequency signal transmission is reduced based on the electromagnetic field simulation technology, and the 5G system performance is optimized.

Description

Technical Field

[0001] The present invention relates to the field of electromagnetic field simulation technology, and in particular to a simulation system and method applicable to 5G communication circuit board design specifications. Background Art

[0002] Traditional design simulation systems rely on static models and simplified assumptions in electromagnetic compatibility analysis, and cannot fully consider the complex electromagnetic environment in actual operation. Circuit board design specifications are usually based on past experience and fixed parameter settings, lacking flexible adjustment mechanisms for specific application requirements. This incomplete analysis causes the designed circuit board to have unforeseen interference and signal distortion during high-frequency signal transmission, thus affecting the performance of the entire 5G system. Traditional methods of considering circuit board thermal management are often limited to simple power loss calculations, lacking a comprehensive analysis of multi-physical field effects such as heat conduction, convection, and radiation. Therefore, it is impossible to accurately predict the actual temperature distribution of the circuit board under high-power working conditions, resulting in thermal failure and component aging, thereby shortening the service life of the equipment. Summary of the invention

[0003] Based on this, it is necessary for the present invention to provide a simulation method applicable to 5G communication circuit board design specifications to solve at least one of the above-mentioned technical problems.

[0004] To achieve the above purpose, a simulation method for 5G communication circuit board design specifications is provided, comprising the following steps: Step S1: Acquire 5G communication circuit board design data, and extract stacking structure data and electrical parameter data according to the 5G communication circuit board design data, so as to obtain stacking structure data and electrical parameter data; perform signal propagation path analysis according to the stacking structure data and electrical parameter data, so as to obtain signal propagation path data; Step S2: obtaining high-frequency characteristic data of the 5G communication circuit board; performing electromagnetic compatibility simulation analysis according to the high-frequency characteristic data and electrical parameter data of the 5G communication circuit board, thereby obtaining electromagnetic compatibility simulation data; Step S3: performing signal propagation loss analysis on the signal propagation path data according to the electromagnetic compatibility simulation data, thereby obtaining signal propagation loss data; performing propagation path optimization according to the signal propagation loss data, thereby obtaining signal propagation optimized path data; Step S4: extracting circuit board material features according to the 5G communication circuit board design data, thereby obtaining circuit board material data; performing high-frequency operation thermal characteristic simulation analysis on the signal propagation optimization path data according to the circuit board material data, thereby obtaining circuit board thermal characteristic simulation data; Step S5: Perform stacking structure signal attenuation analysis on the signal propagation optimization path data according to the circuit board thermal characteristic simulation data, so as to obtain stacking structure signal attenuation data; optimize the circuit board stacking structure according to the stacking structure signal attenuation data, so as to obtain the circuit board stacking structure optimization data, and upload it to the 5G communication terminal equipment management platform to execute the circuit board stacking structure optimization task.

[0005] By extracting the stacked structure and electrical parameter data of the 5G communication circuit board, the present invention can fully understand the design characteristics of the circuit board, lay the foundation for the subsequent signal propagation path analysis, ensure the accuracy and comprehensiveness of the design data, make the subsequent analysis more accurate, and help to discover potential design defects. The combination of high-frequency characteristic data and electrical parameters for electromagnetic compatibility simulation can accurately simulate the performance of the circuit board in a real environment. The analysis helps to identify electromagnetic interference problems in the design and reduce the risk of signal distortion, thereby improving the overall performance of the 5G system. Effective electromagnetic compatibility analysis can ensure that the circuit board design meets industry standards and reduce the cost of later adjustments and redesign. By analyzing the signal propagation loss data, it is possible to clearly identify which paths have higher losses, so that designers can optimize the signal propagation path, reduce signal attenuation, and improve signal integrity and transmission efficiency. The optimized propagation path can improve the transmission quality of 5G signals, thereby effectively improving the user experience. By extracting the characteristics of the circuit board material and simulating the high-frequency operation thermal characteristics, the temperature distribution of the circuit board under actual operating conditions can be accurately predicted, which not only helps to identify thermal problems, but also optimizes material selection and design structure to improve thermal management effects, reduce the risk of equipment failure, and thus extend the service life of the equipment.

[0006] Optionally, step S1 specifically includes: Step S11: Acquire 5G communication circuit board design data, and extract stacking structure data and electrical parameter data according to the 5G communication circuit board design data, so as to obtain stacking structure data and electrical parameter data; Step S12: performing signal interlayer propagation coupling analysis according to the stacked structure data, thereby obtaining signal interlayer propagation coupling data; Step S13: performing signal propagation loss analysis according to the electrical parameter data, thereby obtaining signal propagation loss data; Step S14: Integrate the signal propagation path according to the signal inter-layer propagation coupling data and the signal propagation loss data, so as to obtain the signal propagation path data.

[0007] The present invention can ensure that the data used is complete and accurate by obtaining the design data of the 5G communication circuit board and extracting the stacked structure and electrical parameters, laying a solid foundation for subsequent analysis, and helping to avoid design defects caused by insufficient or inaccurate data. Compared with traditional methods, this data acquisition method can more flexibly adapt to different design requirements, thereby reducing the cost of later modifications caused by improper design. Conducting signal layer propagation coupling analysis can reveal the mutual influence and coupling mechanism between different signal layers. This analysis helps designers understand the electromagnetic interaction between signals in each layer, and can identify the path that causes signal interference, thereby providing guidance for subsequent design optimization. Compared with traditional static models, this dynamic analysis method can more comprehensively reflect the complexity of the electromagnetic environment and help improve the electromagnetic compatibility of the design. According to the signal propagation loss analysis, the signal loss caused by factors such as impedance mismatch and material loss during the propagation process can be accurately evaluated. This process is crucial for the 5G system because the high-frequency characteristics of the signal make it more susceptible to loss during propagation. Through systematic loss analysis, the circuit board design can be optimized, the risk of signal attenuation can be reduced, and the stability and integrity of the signal under high-frequency conditions can be ensured. By integrating the signal layer propagation coupling data and the signal propagation loss data, we can fully understand the signal propagation path and identify potential interference points or loss areas. This comprehensive analysis can provide a clearer signal flow path for circuit board design, allowing designers to optimize signal transmission routes in a targeted manner, reducing the limitations of traditional design methods that rely on experience, and being able to more flexibly adapt to specific application requirements, thereby improving the performance and reliability of the overall design.

[0008] Optionally, step S12 is specifically: Step S121: extracting signal routing layout features and signal routing geometry features according to the stacked structure data, thereby obtaining signal routing layout data and signal routing geometry data; Step S122: constructing a signal line layout model according to the signal line layout data and the signal line geometry data, thereby obtaining a signal line layout model; Step S123: obtaining dielectric constant data of dielectric layer material; Step S124: performing electromagnetic field distribution analysis on the signal line layout model according to the dielectric constant data of the dielectric layer material, thereby obtaining electromagnetic field distribution data; Step S125: performing electromagnetic field distribution area strength statistics according to the electromagnetic field distribution data, thereby obtaining high electromagnetic field distribution area data; Step S126: performing signal line spacing statistics according to the signal routing layout data, thereby obtaining small-interval signal line data; Step S127: performing an electromagnetic field coupling region intersection operation according to the high electromagnetic field distribution data and the small interval signal line data, thereby obtaining electromagnetic field coupling region data; Step S128: Calculate the interlayer coupling strength of the electromagnetic field coupling region data according to the stacked structure data, thereby obtaining signal interlayer propagation coupling data.

[0009] The present invention can systematically analyze the distribution of signal lines in a circuit board by extracting the layout features and geometric features of signal lines, which helps to identify the complexity and key features of signal lines, and provides an accurate data basis for the subsequent construction of a signal line layout model. This systematic extraction method can effectively improve the accuracy of signal line design and reduce human errors in design. By constructing a signal line layout model based on signal line layout and geometric data, the visualization and analysis of circuit board design can be realized. This model can lay the foundation for subsequent electromagnetic field distribution analysis, enable designers to fully understand the relationship between signal lines, and provide guidance for subsequent optimization, which can reduce experience-based design and ensure that the model can accurately reflect actual design requirements. Obtaining the dielectric constant data of dielectric layer materials is an important part of electromagnetic field analysis. The dielectric constants of different materials have a direct impact on the propagation characteristics of electromagnetic waves, ensuring that designers can use accurate material properties for analysis, improve the effectiveness of electromagnetic compatibility analysis, and reduce design errors caused by inaccurate material properties. By analyzing the electromagnetic field distribution of the signal line layout model, the strength and distribution of the electromagnetic field in the circuit board can be obtained, which helps to identify potential interference sources and signal distortion areas, and provide data support for subsequent design optimization. Compared with traditional methods, this dynamic analysis can more comprehensively consider the complex electromagnetic environment in actual operation and ensure the electromagnetic compatibility of the design. By performing strength statistics on the electromagnetic field distribution area, the high electromagnetic field distribution area can be determined, which provides a basis for further design decisions, can help designers identify high-risk areas, and take corresponding design measures to reduce signal interference and distortion risks, can provide data support for optimized design, and ensure the stability of the design under high-frequency signal conditions. By counting the signal line spacing, the relative position relationship between the signal lines can be understood, which helps to identify the coupling area and potential interference sources, optimize the signal line layout, thereby reducing signal interference, and provide the necessary basis for the subsequent electromagnetic field coupling area analysis, and improve the accuracy of the design. By performing intersection operations on the high electromagnetic field distribution area data and the small-interval signal line data, the electromagnetic field coupling area can be identified, which helps to understand the mutual influence between different signal lines, ensure that the signal is not disturbed by unnecessary interference during transmission, enhance the electromagnetic compatibility of the design, and provide a scientific basis for optimizing the signal transmission path. By calculating the interlayer coupling strength in the electromagnetic field coupling area, the degree of coupling between signal layers can be quantitatively analyzed, which helps designers understand the degree of interference suffered by signals when propagating between different layers, and then conduct effective design optimization, providing strong guarantees for the electromagnetic compatibility and signal integrity of the design, and ensuring the performance of 5G communication circuit boards in complex electromagnetic environments.

[0010] Optionally, step S13 is specifically: Step S131: extracting conductor resistance characteristics and conductor current characteristics according to electrical parameter data, thereby obtaining conductor resistance data and conductor current data; Step S132: Calculating dielectric loss according to the conductor resistance data and the conductor current data, thereby obtaining dielectric loss data; Step S133: Acquire signal source characteristic impedance data and incident power data; Step S134: Calculating reflection loss based on the signal source characteristic impedance data and the incident power data, thereby obtaining reflection loss data; Step S135: Perform comprehensive calculation of signal propagation loss based on the dielectric loss data and the reflection loss data, so as to obtain signal propagation loss data.

[0011] The present invention can obtain more accurate conductor resistance data and conductor current data by extracting the resistance characteristics and current characteristics of the conductor, which is helpful to fully understand the electrical characteristics of the signal when it is transmitted in the conductor, and provide necessary parameter support for the subsequent dielectric loss calculation. Compared with the traditional method, it can more accurately reflect the electrical performance of the actual conductor in the working state, and improve the reliability of signal integrity analysis. Dielectric loss calculation based on conductor resistance and current data can quantitatively analyze the energy loss of the signal when it propagates in the medium, which provides an important basis for understanding the attenuation of electromagnetic signals in materials, helps designers optimize material selection, ensures that the signal reduces losses during propagation, and enhances the scientific nature of circuit board design, which is especially important in high-frequency applications. Obtaining the characteristic impedance and incident power data of the signal source can provide necessary input for the subsequent reflection loss calculation, ensure that the designer can use accurate parameters when performing signal source analysis, and help identify the impact of the signal source on system performance. Compared with traditional methods, it enhances the accuracy of the design and reduces potential problems caused by inaccurate signal source characteristics. Calculating the reflection loss based on the characteristic impedance of the signal source and the incident power can quantify the degree of signal reflection at the interface, which helps designers understand the energy loss that occurs under specific impedance matching conditions, optimize the design to reduce reflection loss, and thus improve signal transmission efficiency, providing a scientific basis for improving the signal integrity and electromagnetic compatibility of the entire system. By comprehensively calculating the dielectric loss and reflection loss, comprehensive signal propagation loss data can be obtained, which helps designers identify the various loss sources encountered during high-frequency signal transmission, ensures a comprehensive performance evaluation throughout the design process, and helps optimize the circuit board design by integrating multiple factors to ensure its stability and reliability in complex electromagnetic environments.

[0012] Optionally, step S2 specifically includes: Step S21: Obtain high-frequency characteristic data of the 5G communication circuit board; Step S22: extracting ground wire structure characteristics and wiring length characteristics according to the electrical parameter data, thereby obtaining ground wire structure data and wiring length data; Step S23: constructing a communication circuit board simulation model according to the ground wire structure data and the wiring length data, thereby obtaining a communication circuit board simulation model; Step S24: performing high-frequency signal electromagnetic simulation on the communication circuit board simulation model according to the high-frequency characteristic data of the 5G communication circuit board, thereby obtaining high-frequency signal electromagnetic simulation data; Step S25: performing electrical noise analysis according to the high-frequency signal electromagnetic simulation data, thereby obtaining electrical noise data; Step S26: locating the electromagnetic interference source according to the high-frequency signal electromagnetic simulation data, thereby obtaining electromagnetic interference source data; Step S27: integrating electromagnetic compatibility simulation data according to the electrical noise data and the electromagnetic interference source data, thereby obtaining electromagnetic compatibility simulation data.

[0013] The present invention can provide an accurate input basis for subsequent analysis by obtaining the high-frequency characteristic data of the 5G communication circuit board, ensuring that the designer can fully understand the behavioral characteristics of the circuit board in high-frequency signal transmission, which is helpful to formulate a more effective design strategy. The acquisition of this data overcomes the lack of high-frequency characteristic considerations in traditional methods, thereby improving the scientificity and accuracy of the simulation system. Extracting the ground wire structure and routing length characteristics helps to understand the electrical connection and signal propagation characteristics of the circuit board, laying the foundation for the subsequent construction of the communication circuit board simulation model, ensuring that the designer can optimize the design based on real data. Compared with the traditional method that relies on static models, it enhances the adaptability to complex electromagnetic environments and reduces signal interference caused by improper routing design. The communication circuit board simulation model is constructed based on the ground wire structure and routing length data to form a dynamic model that can truly reflect the performance of the circuit board. This model can simulate the performance of the circuit board under various operating conditions, provide reliable support for design decisions, and can more realistically reflect complex electromagnetic phenomena compared to traditional simplified models, enhancing the overall compatibility and performance stability of the system. By performing high-frequency signal electromagnetic simulation on the communication circuit board simulation model, the electromagnetic behavior data of the circuit board during high-frequency signal transmission can be obtained, providing a comprehensive analysis of signal propagation in the electromagnetic field, ensuring that designers can identify potential interference problems and performance bottlenecks, supplementing the neglect of dynamic signal behavior in traditional analysis, and enhancing the scientific basis for system design. Electrical noise analysis based on high-frequency signal electromagnetic simulation data can quantify the noise level in the circuit board, help designers understand the impact of noise on signal integrity under specific design conditions, and promote the formulation of noise control measures. Compared with traditional methods, modern noise analysis can provide more detailed noise source location and suppression suggestions, reducing the risk of signal interference. By locating the electromagnetic interference source of high-frequency signal electromagnetic simulation data, the interference source that affects the performance of the circuit board can be identified and analyzed, which can help designers identify potential electromagnetic interference problems in the early stage of design, take measures to optimize in advance, and reduce the risk of repeated modifications in the design cycle. Compared with traditional empirical methods, the use of precise interference source location technology can significantly improve the efficiency of circuit board design. By integrating electrical noise data and electromagnetic interference source data, comprehensive electromagnetic compatibility simulation data can be obtained, providing designers with a comprehensive view of electromagnetic compatibility and helping to develop reasonable optimization plans. Compared with traditional decentralized analysis methods, comprehensive data integration enhances the integrity of system design and ensures stable performance of circuit boards under various working conditions.

[0014] Optionally, step S25 is specifically: Step S251: extracting electromagnetic field strength features according to high-frequency signal electromagnetic simulation data, thereby obtaining electromagnetic field strength data; Step S252: performing fast Fourier transform according to the electromagnetic field intensity data, thereby obtaining electromagnetic field intensity spectrum data; Step S253: performing spectrum amplitude statistics according to the electromagnetic field intensity spectrum data, thereby obtaining high-amplitude electromagnetic field intensity spectrum data; Step S254: performing frequency statistics according to the electromagnetic field intensity spectrum data, thereby obtaining high-frequency electromagnetic field intensity spectrum data; Step S255: performing an electrical noise spectrum intersection operation according to the high-amplitude electromagnetic field intensity spectrum data and the high-frequency electromagnetic field intensity spectrum data, thereby obtaining electrical noise data.

[0015] The present invention can obtain the electromagnetic field strength data of the circuit board under high-frequency working conditions by extracting the electromagnetic field strength characteristics according to the electromagnetic simulation data of the high-frequency signal, so that the designer can accurately understand the distribution of the electromagnetic field in the signal propagation, and provide necessary data support for subsequent analysis. By analyzing the electromagnetic field strength data using the fast Fourier transform (FFT), the time domain signal can be converted into frequency domain information, revealing the frequency characteristics of the electromagnetic field, which is helpful to identify the interference and noise sources existing in a specific frequency range, and providing a theoretical basis for optimizing the design. Compared with the traditional static model, the frequency domain analysis can more comprehensively reflect the behavior of the signal in the electromagnetic environment. According to the electromagnetic field strength spectrum data, the spectrum amplitude statistics are performed to obtain the high-amplitude electromagnetic field strength spectrum data, which helps the designer identify the strong interference components in the signal, and facilitates the subsequent focus and control of these high-amplitude frequencies. By performing frequency statistics to obtain the high-frequency electromagnetic field strength spectrum data, the intensity characteristics of the electromagnetic field at different frequencies can be clarified, which provides an important reference for designers to ensure that the electromagnetic influence of each frequency band can be fully considered during the design process. By performing intersection operations on high-amplitude electromagnetic field intensity spectrum data and high-frequency electromagnetic field intensity spectrum data, electrical noise data is obtained, which can accurately identify the impact of electrical noise on circuit boards during high-frequency signal transmission, providing a scientific basis for subsequent noise suppression and electromagnetic compatibility optimization.

[0016] Optionally, step S26 is specifically: Step S261: Drawing an electromagnetic field distribution map according to the high-frequency signal electromagnetic simulation data, thereby obtaining an electromagnetic field distribution map; Step S262: performing radiation path tracing according to the electromagnetic field distribution diagram, thereby obtaining radiation path tracing data; Step S263: performing path classification according to the radiation path tracing data, thereby obtaining reflection path data and refraction path data; Step S264: performing signal focus area statistics on the reflection path data to obtain signal focus area data; Step S265: performing signal strength consistent path statistics on the refraction path data, thereby obtaining signal strength consistent path data; Step S266: performing an electromagnetic interference source area intersection operation according to the signal focus area data and the signal strength consistent path data, thereby obtaining the electromagnetic interference source data.

[0017] The present invention draws an electromagnetic field distribution map based on high-frequency signal electromagnetic simulation data, which can visualize the electromagnetic field distribution on the circuit board, so that the designer can intuitively identify the distribution characteristics of the electromagnetic field intensity, thereby helping to optimize the signal path design. This visual analysis can more clearly reveal the complexity of the electromagnetic environment and help to formulate a more effective design strategy. Through radiation path tracing, the path of the electromagnetic wave in the propagation process can be determined, which helps to analyze the propagation characteristics of the electromagnetic wave in the actual working environment, including its reflection, refraction and diffraction phenomena, and can more realistically simulate the dynamic changes of the electromagnetic field and enhance the understanding of signal transmission. The radiation path obtained by tracing is classified to obtain the data of the reflection path and the refraction path, so that the designer can better understand the impact of different paths on signal transmission, which helps to formulate targeted optimization strategies. Path classification provides a multi-dimensional analysis perspective and enhances the accuracy of the design. The signal focus area statistics of the reflection path data help to identify the intensity focus of the signal in a specific area, can guide the designer to optimize the signal intensity distribution, ensure that the key area obtains sufficient signal strength, and provide a more refined signal management method. By performing signal strength consistent path statistics on the refraction path data, paths with less signal strength changes can be identified, which helps designers ensure signal consistency on key transmission paths, reduce the risk of signal distortion, and improve the stability of signal transmission. Intersection operations on the electromagnetic interference source area based on the signal focus area data and the signal strength consistent path data can identify the specific location of the electromagnetic interference source, which is crucial for optimizing circuit board design and can help designers take effective measures to reduce interference effects, improve electromagnetic compatibility, and provide a clearer and more effective interference source location capability.

[0018] Optionally, step S4 is specifically: Step S41: extracting circuit board material features according to the 5G communication circuit board design data, thereby obtaining circuit board material data; Step S42: extracting via position features according to the signal propagation optimization path data, thereby obtaining via position data; Step S43: performing high-frequency operation simulation according to the circuit board material data and the via position data, thereby obtaining the circuit board high-frequency operation data; Step S44: performing thermal characteristic simulation analysis based on the high-frequency operation data of the circuit board, thereby obtaining thermal characteristic simulation data of the circuit board.

[0019] By extracting the characteristics of the circuit board material, the present invention can obtain key parameters such as the dielectric constant and thermal conductivity of the material. These material data are crucial for subsequent high-frequency signal simulation and thermal characteristics analysis, providing more accurate material data support to ensure that the design is reliable in practical applications. Extracting the via position characteristics of the signal propagation optimization path data helps to accurately determine the key via positions in signal transmission. This information is very important for optimizing signal routing and reducing signal loss, making the via design more scientific and reasonable, and helping to improve signal integrity. High-frequency operation simulation based on circuit board material data and via position data can truly reflect the behavior of the circuit board under high-frequency signal transmission, taking into account the influence of material properties and vias on signals, so that designers can identify potential problems in the design stage, providing comprehensive operation data support, and ensuring the accuracy and effectiveness of the design. By performing thermal characteristics simulation analysis on the high-frequency operation data of the circuit board, the temperature distribution and thermal management characteristics of the circuit board under high-power working conditions can be obtained, which can help designers evaluate the thermal performance of the equipment, identify the risk of thermal failure in advance, and comprehensively consider multi-physical field effects such as thermal conduction, convection and radiation, and improve the understanding of the overall performance of the circuit board.

[0020] Optionally, step S44 is specifically: Step S441: Calculating power loss according to the high-frequency operation data of the circuit board, thereby obtaining power loss data; Step S442: Acquire thermal conductivity data of circuit board materials; Step S443: constructing a circuit board thermal characteristic simulation model according to the power loss data and the circuit board material thermal conductivity data, thereby obtaining a circuit board thermal characteristic simulation model; Step S444: performing steady-state thermal simulation on the circuit board thermal characteristic simulation model according to the power loss data, thereby obtaining steady-state thermal simulation data; Step S445: drawing a steady-state thermal simulation hotspot area map according to the steady-state thermal simulation data, thereby obtaining a steady-state thermal simulation hotspot area map; Step S446: Obtaining circuit board material safety temperature data; Step S447: dividing the steady-state thermal simulation hotspot area map into high-hotspot simulation areas according to the circuit board material safety temperature data, thereby obtaining the circuit board thermal characteristic simulation data.

[0021] The present invention can obtain the actual power consumption of the circuit board under working condition by calculating the power loss of the high-frequency operation data of the circuit board, which is helpful to understand the energy efficiency of the circuit board, identify potential energy waste areas, provide more accurate power loss evaluation, and lay the foundation for subsequent thermal management analysis. Obtaining the thermal conductivity data of the circuit board material is the key to thermal management analysis. By accurately understanding the thermal conductivity of the material, the designer can effectively predict the conduction of heat in the material and ensure that the thermal effect is fully considered in the design. This process overcomes the simplified assumption of the thermal conductivity of the material in traditional design, making the thermal analysis more scientific and reasonable. Constructing a circuit board thermal characteristic simulation model based on power loss data and thermal conductivity data can provide a comprehensive thermal performance evaluation. This model can help designers analyze the temperature distribution under specific working conditions, provide a basis for optimizing the design, and make the simulation model more detailed and comprehensive. Steady-state thermal simulation of the circuit board thermal characteristic simulation model can obtain the stable temperature distribution of the circuit board under long-term operation, which helps to identify the hot spots that appear in the normal working state of the equipment, provide designers with optimization solutions to reduce thermal risks, and pay more attention to the actual working environment of the circuit board. Drawing a steady-state thermal simulation hotspot area map based on steady-state thermal simulation data can intuitively display the thermal distribution of the circuit board during operation, allowing designers to quickly identify heat-sensitive areas, providing important reference for subsequent heat dissipation design, and significantly improving designers' understanding of thermal characteristics. Obtaining safe temperature data for circuit board materials can provide a safe boundary for thermal management for the design, which is crucial to ensure that the equipment does not fail due to overheating when working under high load. By establishing safe temperature standards for materials, it effectively supplements the deficiencies in thermal risk assessment in traditional methods. Dividing the high-hotspot simulation area of ​​the steady-state thermal simulation hotspot area map based on safe temperature data can clearly indicate which areas are at risk of thermal failure, which helps guide the implementation of heat dissipation design and optimization solutions, ensure the reliability of circuit boards in actual applications, provide more accurate thermal risk assessments, and enhance the safety of designs.

[0022] Optionally, the present specification also provides a 5G communication circuit board design specification simulation system, which is used to execute the 5G communication circuit board design specification simulation method as described above, and the 5G communication circuit board design specification simulation system includes: Signal propagation path analysis module: used to obtain 5G communication circuit board design data, and extract stacking structure data and electrical parameter data according to the 5G communication circuit board design data, so as to obtain stacking structure data and electrical parameter data; perform signal propagation path analysis according to the stacking structure data and electrical parameter data, so as to obtain signal propagation path data; Electromagnetic compatibility simulation module: used to obtain high-frequency characteristic data of 5G communication circuit boards; perform electromagnetic compatibility simulation analysis based on the high-frequency characteristic data and electrical parameter data of 5G communication circuit boards to obtain electromagnetic compatibility simulation data; Signal propagation path optimization module: used to perform signal propagation loss analysis on signal propagation path data according to electromagnetic compatibility simulation data, thereby obtaining signal propagation loss data; perform propagation path optimization according to signal propagation loss data, thereby obtaining signal propagation optimized path data; High-frequency operation thermal characteristics simulation module: used to extract circuit board material characteristics based on 5G communication circuit board design data, so as to obtain circuit board material data; perform high-frequency operation thermal characteristics simulation analysis on signal propagation optimization path data based on circuit board material data, so as to obtain circuit board thermal characteristics simulation data; Circuit board stacking structure optimization module: used to perform stacking structure signal attenuation analysis on signal propagation optimization path data according to circuit board thermal characteristics simulation data, so as to obtain stacking structure signal attenuation data; optimize the circuit board stacking structure according to the stacking structure signal attenuation data, so as to obtain circuit board stacking structure optimization data, and upload it to the 5G communication terminal equipment management platform to execute the circuit board stacking structure optimization task.

[0023] The present invention provides a 5G communication circuit board design specification simulation system, which can implement any 5G communication circuit board design specification simulation method applicable to the present invention, and is used to combine the operation and signal transmission medium between various modules to complete the 5G communication circuit board design specification simulation method applicable to the system. The internal modules of the system cooperate with each other to reduce the interference risk in high-frequency signal transmission and optimize the 5G system performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments thereof made with reference to the following drawings: Figure 1 This is a schematic diagram of the steps of the simulation method for 5G communication circuit board design specifications applicable to the present invention; Figure 2 Detailed step flow diagram of step S1 in the present invention; Figure 3 Detailed step flow diagram of step S13 in the present invention; The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0025] The following is a clear and complete description of the technical method of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by technicians in this field without creative work are within the scope of protection of the present invention.

[0026] In addition, the accompanying drawings are only schematic illustrations of the present invention and are not necessarily drawn to scale. The same reference numerals in the figures represent the same or similar parts, and their repeated description will be omitted. Some of the block diagrams shown in the accompanying drawings are functional entities and do not necessarily correspond to physically or logically independent entities. The functional entities can be implemented in software form, or implemented in one or more hardware modules or integrated circuits, or implemented in different networks and / or processor methods and / or microcontroller methods.

[0027] It should be understood that, although the terms "first", "second", etc. may be used herein to describe various units, these units should not be limited by these terms. These terms are used only to distinguish one unit from another unit. For example, without departing from the scope of the exemplary embodiments, the first unit may be referred to as the second unit, and similarly the second unit may be referred to as the first unit. The term "and / or" used herein includes any and all combinations of one or more of the listed associated items.

[0028] To achieve this, please refer to Figures 1 to 3 The present invention provides a simulation method for 5G communication circuit board design specifications, the method comprising the following steps: Step S1: Acquire 5G communication circuit board design data, and extract stacking structure data and electrical parameter data according to the 5G communication circuit board design data, so as to obtain stacking structure data and electrical parameter data; perform signal propagation path analysis according to the stacking structure data and electrical parameter data, so as to obtain signal propagation path data; In this embodiment, when obtaining the design data of the 5G communication circuit board, the board layer information is extracted from the design database, including key parameters such as material type, thickness, and dielectric constant. The extraction of these data depends on the standardized format of the design file, such as the Gerber file using the IPC standard. Next, the signal propagation path analysis is performed using the extracted stacked structure data. The analysis uses electromagnetic field simulation tools, such as Ansys HFSS or CST Microwave Studio, to model the signal propagation path. By setting the input signal frequency and amplitude, the propagation of the signal between the layers is analyzed, the propagation delay, phase difference, and amplitude change are calculated, and the signal propagation path data is finally obtained. These data will lay the foundation for subsequent electromagnetic compatibility analysis and signal loss optimization.

[0029] Step S2: obtaining high-frequency characteristic data of the 5G communication circuit board; performing electromagnetic compatibility simulation analysis according to the high-frequency characteristic data and electrical parameter data of the 5G communication circuit board, thereby obtaining electromagnetic compatibility simulation data; In this embodiment, the high-frequency characteristic data of the 5G communication circuit board is obtained, mainly including parameters such as signal frequency range, transmission line characteristic impedance and frequency response. These data are usually obtained by testing the manufactured sample through high-frequency test instruments, such as network analyzers (VNA). Subsequently, electromagnetic compatibility simulation is performed using electromagnetic compatibility simulation analysis tools (such as Keysight EMPro or Altair FEKO). The electrical parameters of the input signal and the acquired high-frequency characteristic data are used to simulate the electromagnetic field distribution and calculate the electromagnetic interference and noise sources. Through this analysis, electromagnetic compatibility simulation data is obtained, which is used to evaluate the electromagnetic compatibility of the circuit board and its impact under high-frequency operation.

[0030] Step S3: performing signal propagation loss analysis on the signal propagation path data according to the electromagnetic compatibility simulation data, thereby obtaining signal propagation loss data; performing propagation path optimization according to the signal propagation loss data, thereby obtaining signal propagation optimized path data; In this embodiment, the signal propagation loss analysis is performed on the signal propagation path data based on the electromagnetic compatibility simulation data. Use a special computing tool, such as the communication toolbox in Matlab, to input the data of the signal propagation path, including parameters such as signal amplitude, propagation distance and dielectric loss, and calculate the loss of the signal during the propagation process. The result will be expressed in dB to form the signal propagation loss data. Based on the loss data, an optimization algorithm (such as a genetic algorithm or a particle swarm optimization algorithm) is applied to optimize the signal propagation path, reduce unnecessary signal attenuation, and finally obtain the signal propagation optimization path data. This process ensures the efficiency and stability of the signal in 5G applications.

[0031] Step S4: extracting circuit board material features according to the 5G communication circuit board design data, thereby obtaining circuit board material data; performing high-frequency operation thermal characteristic simulation analysis on the signal propagation optimization path data according to the circuit board material data, thereby obtaining circuit board thermal characteristic simulation data; In this embodiment, the circuit board material feature extraction includes obtaining its electrical conductivity, thermal conductivity, dielectric constant and other parameters. Use material testing instruments (such as thermal analyzers and resistivity testers) to test material samples to ensure accurate material data. These data will be used as input for high-frequency operation thermal characteristics simulation analysis. By using finite element analysis software (such as ANSYS or COMSOL), a circuit board thermal model is constructed, and parameters such as power loss and material thermal conductivity are input to simulate the thermal characteristics under high-frequency operation conditions. This analysis helps to evaluate the temperature distribution of the circuit board when it is running at high power, thereby providing necessary data support for subsequent thermal management.

[0032] Step S5: Perform stacking structure signal attenuation analysis on the signal propagation optimization path data according to the circuit board thermal characteristic simulation data, so as to obtain stacking structure signal attenuation data; optimize the circuit board stacking structure according to the stacking structure signal attenuation data, so as to obtain the circuit board stacking structure optimization data, and upload it to the 5G communication terminal equipment management platform to execute the circuit board stacking structure optimization task.

[0033] In this embodiment, the stacked structure signal attenuation analysis is performed based on the simulation data of the thermal characteristics of the circuit board. By designing a calculation tool, inputting the thermal simulation results and signal propagation parameters, the signal attenuation values ​​under different stacked structures are calculated to form the stacked structure signal attenuation data. Based on this data, an optimization algorithm is used to analyze how to adjust the stacked structure (such as the order, thickness and material selection of the layers) to minimize signal attenuation and obtain the circuit board stacked structure optimization data. The optimized data will be uploaded to the 5G communication terminal equipment management platform to implement the optimization task of the circuit board stacked structure, thereby ensuring its efficiency and reliability in practical applications.

[0034] Optionally, step S1 specifically includes: Step S11: Acquire 5G communication circuit board design data, and extract stacking structure data and electrical parameter data according to the 5G communication circuit board design data, so as to obtain stacking structure data and electrical parameter data; In this embodiment, the design data of the 5G communication circuit board is exported from electronic design automation (EDA) software (such as AltiumDesigner or Cadence). The exported design data contains stacking structure information, including key parameters such as material type, thickness, dielectric constant and conductivity of each layer. After the stacking structure data is extracted, the electrical parameter data is extracted. These electrical parameters include characteristic impedance, parasitic capacitance, signal transmission delay, etc. In order to ensure the accuracy of the data, a simulation-based method is adopted to perform secondary verification of the exported design data using electromagnetic simulation tools (such as Ansys HFSS) to obtain reliable electrical characteristic data. This process provides the necessary basic data for subsequent signal analysis to ensure that the value of each parameter is strictly measured and verified.

[0035] Step S12: performing signal interlayer propagation coupling analysis according to the stacked structure data, thereby obtaining signal interlayer propagation coupling data; In this embodiment, based on the obtained stacked structure data, the signal interlayer propagation coupling analysis is performed. An electromagnetic simulation tool (such as CST Microwave Studio) is used to build a model, and the extracted stacked structure parameters, including dielectric constant, layer thickness and signal frequency range (for example, 1 GHz to 10 GHz) are input. By setting the coupling analysis parameters, the degree of coupling between signals in different layers is calculated, and the results obtained will include important indicators such as coupling coefficient and reflection loss. Special attention is paid to the coupling effect of each layer through which the current flows. By post-processing the coupling data, effective coupling data is extracted to evaluate the propagation loss of the signal between layers. This step ensures a full understanding of the mutual influence of signals between different layers and provides data support for subsequent loss analysis.

[0036] Step S13: performing signal propagation loss analysis according to the electrical parameter data, thereby obtaining signal propagation loss data; In this embodiment, signal propagation loss analysis is performed based on electrical parameter data. Circuit simulation software (such as Keysight ADS) is used to construct a transmission line model, and the input parameters include characteristic impedance, length of the transmission line, operating frequency, and conductivity of the material. By setting simulation conditions, the total loss of the signal during transmission is calculated, which includes dielectric loss, reflection loss, and radiation loss. Special attention is paid to the behavior of high-frequency signals when propagating in materials, and signal propagation loss data is usually output in decibels (dB).

[0037] Step S14: Integrate the signal propagation path according to the signal inter-layer propagation coupling data and the signal propagation loss data, so as to obtain the signal propagation path data.

[0038] In this embodiment, after obtaining the signal layer propagation coupling data and signal propagation loss data, the signal propagation path is integrated. Signal processing tools (such as MATLAB) are used to analyze the coupling and loss data, and the coupling loss and propagation loss data are integrated using the weighted average method. Set a suitable threshold (for example, signal loss less than -3dB is an acceptable range), screen and optimize the signal path, and form the final signal propagation path data. By analyzing the integrated data, the best signal propagation path is identified to improve the signal integrity and performance of the overall circuit board design. This process ensures the reliability of signal transmission and provides a solid data foundation for subsequent circuit board design optimization.

[0039] Optionally, step S12 is specifically: Step S121: extracting signal routing layout features and signal routing geometry features according to the stacked structure data, thereby obtaining signal routing layout data and signal routing geometry data; In this embodiment, the signal routing layout feature extraction is performed based on the stacked structure data, and the 5G communication circuit board design file is opened using EDA software (such as Altium Designer or Cadence) to extract the layout information of the signal routing, including the starting and ending positions of the routing, routing width, routing spacing, and routing shape. The signal routing geometric feature extraction includes geometric parameters such as the curvature, angle, and vertical height of the routing relative to other layers. These data are automatically generated through the script function of the software to ensure that the extraction process is efficient and accurate. The obtained signal routing layout data and geometric data will form a detailed database for subsequent analysis and processing.

[0040] Step S122: constructing a signal line layout model according to the signal line layout data and the signal line geometry data, thereby obtaining a signal line layout model; In this embodiment, a signal line layout model is constructed based on the signal line layout data and the signal line geometry data. A simulation tool (such as CST Microwave Studio) is used for three-dimensional modeling, and the data extracted in the previous step is input to define the layout parameters of the signal line, such as position, width, and thickness. Then, the model parameters are adjusted according to the design requirements and technical standards (for example, the standards of the International Electrotechnical Commission (IEC) or the Electronic Industry Alliance (IPC)) to ensure that the model meets the actual design requirements. After the model is built, a preliminary verification is performed to ensure that the layout data is correct, providing a reliable basis for subsequent electromagnetic field analysis.

[0041] Step S123: obtaining dielectric constant data of dielectric layer material; In this embodiment, the dielectric constant data of the dielectric layer material is obtained, usually through the technical data manual provided by the material supplier. These data manuals contain parameters such as dielectric constants (such as relative dielectric constant ε_r) and loss tangent (tanδ) of different materials (such as FR-4, RO4350B, etc.). In order to improve the accuracy of the data, experimental measurements of the material are carried out, and the dielectric constant of the sample is tested using a network analyzer (such as Agilent E5071C) to obtain the frequency response. Finally, the dielectric constant data obtained will be used as an input parameter for subsequent electromagnetic field analysis.

[0042] Step S124: performing electromagnetic field distribution analysis on the signal line layout model according to the dielectric constant data of the dielectric layer material, thereby obtaining electromagnetic field distribution data; In this embodiment, the obtained dielectric constant data of the dielectric layer material is used to perform electromagnetic field distribution analysis on the signal line layout model. Electromagnetic simulation software (such as Ansys HFSS) is used to set the operating frequency range, input the signal line model and dielectric constant parameters, and run the simulation calculation. This process simulates the electromagnetic field distribution generated when the signal propagates in the signal line and the surrounding dielectric layer. After the analysis is completed, the electromagnetic field distribution data is obtained, including the distribution of electric field intensity (E-field) and magnetic field intensity (H-field), which provides basic data for subsequent statistics and analysis.

[0043] Step S125: performing electromagnetic field distribution area strength statistics according to the electromagnetic field distribution data, thereby obtaining high electromagnetic field distribution area data; In this embodiment, the electromagnetic field distribution area strength statistics are performed based on the electromagnetic field distribution data. First, the electric field strength value in the electromagnetic field distribution data is extracted, and the electromagnetic field is divided into regions by setting a threshold (such as the E-field strength is greater than a specific value, such as 1 V / m). Use statistical tools (such as MATLAB) to analyze the electric field strength, calculate the electric field strength distribution of each region, and identify high electromagnetic field distribution areas. The data in these regions will provide an important basis for subsequent electromagnetic field coupling analysis and help designers understand the coupling effects of signal lines.

[0044] Step S126: performing signal line spacing statistics according to the signal routing layout data, thereby obtaining small-interval signal line data; In this embodiment, the signal line spacing statistics are performed based on the signal routing layout data. The relative position data of all signal lines are extracted, and the distance between each pair of signal lines is calculated. For each distance data, statistical analysis is performed, focusing on signal line pairs that are less than a preset spacing threshold (such as 0.5 mm). Statistical analysis tools (such as Excel or R language) are used to summarize the data to form a small-interval signal line data set. The purpose of this step is to identify potential signal line coupling problems and provide a basis for subsequent electromagnetic field coupling area intersection operations.

[0045] Step S127: performing an electromagnetic field coupling region intersection operation according to the high electromagnetic field distribution data and the small interval signal line data, thereby obtaining electromagnetic field coupling region data; In this embodiment, the intersection operation of the electromagnetic field coupling area is performed based on the high electromagnetic field distribution data and the small interval signal line data. Use a logical operation tool (such as MATLAB or Python) to perform an intersection calculation on the high electromagnetic field distribution area and the small interval signal line data to extract the electromagnetic coupling area. This process will present the electromagnetic coupling area in a graphical way, and facilitate intuitive analysis by setting visualization parameters (such as color mapping, transparency, etc.). This data provides an accurate regional reference for subsequent signal layer propagation coupling calculations.

[0046] Step S128: Calculate the interlayer coupling strength of the electromagnetic field coupling region data according to the stacked structure data, thereby obtaining signal interlayer propagation coupling data.

[0047] In this embodiment, the interlayer coupling strength is calculated for the electromagnetic field coupling area data based on the stacked structure data. First, the electromagnetic properties of each layer in the stacked structure are extracted, including dielectric constant, conductivity, etc. By establishing a mathematical model (such as the coupling matrix method), combined with the electromagnetic field coupling area, the interlayer coupling strength is calculated. The calculation results will output the signal interlayer propagation coupling coefficient (such as dB value) to evaluate the interference and coupling degree between different signal layers. This data will provide a key reference for subsequent optimization design to ensure the stable performance of the circuit board in high-frequency applications.

[0048] Optionally, step S13 is specifically: Step S131: extracting conductor resistance characteristics and conductor current characteristics according to electrical parameter data, thereby obtaining conductor resistance data and conductor current data; In this embodiment, the conductor resistance feature extraction and conductor current feature extraction are performed based on the electrical parameter data. First, the electrical parameter data of the circuit board is obtained, including information such as the conductivity and geometric dimensions of the material, and the formula is used. Calculate the conductor resistance, where ρ is the resistivity of the material, L is the conductor length, and A is the conductor cross-sectional area. The conductor current feature extraction is determined based on the operating conditions in the circuit and the output current of the signal source. Use an oscilloscope or current probe to measure the actual current value in the circuit to ensure accurate conductor current data. These data will serve as an important basis for subsequent dielectric loss calculations.

[0049] Step S132: Calculating dielectric loss according to the conductor resistance data and the conductor current data, thereby obtaining dielectric loss data; In this embodiment, dielectric loss is calculated based on conductor resistance data and conductor current data. Dielectric loss is usually caused by the heat generated when current passes through the dielectric material. The formula is = Calculate, where is the dielectric loss power, I is the conductor current, and R is the conductor resistance. By substituting the conductor current data and the corresponding conductor resistance data into the formula, the dielectric loss data at each frequency is calculated. Ensure that multiple measurements are performed under different working conditions to improve the reliability of the data, and finally obtain stable dielectric loss data to provide a basis for subsequent reflection loss and signal propagation loss calculations.

[0050] Step S133: Acquire signal source characteristic impedance data and incident power data; In this embodiment, the characteristic impedance data and incident power data of the signal source are obtained. The characteristic impedance of the signal source is usually measured through the output port of the signal source, and the characteristic impedance of the signal source is directly measured using an impedance analyzer (such as Agilent E5071C) to ensure that an accurate value is obtained. The incident power data is measured by a power meter to ensure that the power value is the actual output power of the signal source at the operating frequency. After the data is acquired, multiple measurements are required to eliminate random errors and ensure the repeatability of the data to improve the accuracy of subsequent calculations.

[0051] Step S134: Calculating reflection loss based on the signal source characteristic impedance data and the incident power data, thereby obtaining reflection loss data; In this embodiment, the reflection loss is calculated based on the signal source characteristic impedance data and the incident power data. The reflection loss (Return Loss) is used to evaluate the matching degree between the signal source impedance and the load impedance, using the formula RL=20 \cdot \log_{10} \left( \frac{Z_0}{Z_L} \right), where {Z_0} is the signal source characteristic impedance and {Z_L} is the load impedance. According to the signal source characteristic impedance obtained in the previous step and the impedance value obtained by load measurement, substitute them into the formula for calculation. The calculation results will provide reflection loss data for evaluating the efficiency and integrity of signal transmission.

[0052] Step S135: Perform comprehensive calculation of signal propagation loss based on the dielectric loss data and the reflection loss data, so as to obtain signal propagation loss data.

[0053] In this embodiment, the signal transmission loss is comprehensively calculated based on the dielectric loss data and the reflection loss data. The signal transmission loss (Transmission Loss) is usually composed of dielectric loss and reflection loss, and the formula TL= +RL is used for comprehensive calculation, where TL is the signal propagation loss, is the dielectric loss, and RL is the reflection loss. Substitute the dielectric loss data and reflection loss data obtained in the first two steps into the formula to calculate the overall signal propagation loss data. These data will be used to analyze the overall performance of the signal during transmission and ensure the effectiveness of the circuit board in high-frequency applications.

[0054] Optionally, step S2 specifically includes: Step S21: Obtain high frequency characteristic data of the 5G communication circuit board; In this embodiment, high-frequency characteristic data of the 5G communication circuit board is obtained, and the electromagnetic properties of the materials used in the circuit board, including dielectric constant, loss factor and conductivity, are extracted from the design documents and material specifications. Actual measurements are performed using high-frequency measurement equipment (such as a network analyzer) to obtain S parameters within a frequency range (for example, from 1 GHz to 40 GHz), especially the reflection coefficient (S11) and transmission coefficient (S21), to ensure that the measured data can truly reflect the performance of the circuit board at high frequencies. After data collection, data processing is required to eliminate measurement errors and ensure that the obtained high-frequency characteristic data can be used for subsequent simulation analysis.

[0055] Step S22: extracting ground wire structure characteristics and wiring length characteristics according to the electrical parameter data, thereby obtaining ground wire structure data and wiring length data; In this embodiment, the ground wire structure feature extraction and the trace length feature extraction are performed based on the electrical parameter data. The layout information of the ground wire is extracted through the circuit design file, including the width and thickness of the ground wire and its relative position to other signal wires. At the same time, the trace length is measured to ensure that the length of each signal trace is accurately recorded. The electrical design automation (EDA) tool is used to automatically generate a data table of the ground wire structure and trace length. These extracted data provide the necessary basis for the subsequent simulation model construction, ensuring the accuracy and reliability of the electrical characteristics analysis.

[0056] Step S23: constructing a communication circuit board simulation model according to the ground wire structure data and the wiring length data, thereby obtaining a communication circuit board simulation model; In this embodiment, a communication circuit board simulation model is constructed based on the extracted ground wire structure data and routing length data. The extracted data is input using electromagnetic simulation software (such as HFSS or CST) to create a three-dimensional model, ensuring that the model includes all important geometric features and material properties. Appropriate boundary conditions and excitation sources are set to simulate the signal transmission characteristics under the actual working environment. After the model is completed, meshing is performed to ensure that the density of the mesh is sufficient to capture the changes in high-frequency signals. After these steps, an accurate communication circuit board simulation model is finally obtained, which provides a basis for subsequent electromagnetic simulation analysis.

[0057] Step S24: performing high-frequency signal electromagnetic simulation on the communication circuit board simulation model according to the high-frequency characteristic data of the 5G communication circuit board, thereby obtaining high-frequency signal electromagnetic simulation data; In this embodiment, the high-frequency characteristic data of the 5G communication circuit board is used to perform high-frequency signal electromagnetic simulation on the communication circuit board simulation model. The electromagnetic simulation software is run to simulate the propagation of the signal in the circuit board by setting the appropriate frequency range and signal excitation conditions. During the simulation process, the reflection, transmission and other electromagnetic characteristic data are recorded, with special attention paid to the phase change and amplitude change of the signal. These simulation results will show the actual performance of the high-frequency signal in the circuit, help identify potential problem areas, and provide necessary data support for electrical noise analysis.

[0058] Step S25: performing electrical noise analysis according to the high-frequency signal electromagnetic simulation data, thereby obtaining electrical noise data; In this embodiment, electrical noise analysis is performed based on high-frequency signal electromagnetic simulation data. The electromagnetic field distribution data extracted by the simulation software is used to analyze the source and characteristics of electrical noise, and identify which signal lines generate interference during high-frequency signal transmission. The impact of electrical noise on signal integrity is evaluated by analyzing the amplitude and phase changes of the signal. Statistical analysis methods are used to calculate the effective value and peak value of electrical noise so that targeted improvement plans can be formulated later.

[0059] Step S26: locating the electromagnetic interference source according to the high-frequency signal electromagnetic simulation data, thereby obtaining electromagnetic interference source data; In this embodiment, the electromagnetic interference source is located based on the signal electromagnetic simulation data. The signal lines and components that cause interference are determined using the electromagnetic field distribution and noise analysis results. The electromagnetic field visualization tool is used to mark the interference source area and analyze its impact on the surrounding signal lines. By cross-analyzing the high-frequency signal propagation path, the location of the interference source and its corresponding impact area are identified to ensure accurate and reliable identification of the interference source, laying the foundation for electromagnetic compatibility analysis.

[0060] Step S27: integrating electromagnetic compatibility simulation data according to the electrical noise data and the electromagnetic interference source data, thereby obtaining electromagnetic compatibility simulation data.

[0061] In this embodiment, electromagnetic compatibility simulation data is integrated based on electrical noise data and electromagnetic interference source data. During the integration process, the electrical noise data is combined with the interference source location results to form a comprehensive electromagnetic compatibility analysis model. By performing a weighted analysis of interference from different sources, its impact on the overall performance of the system is evaluated. Run the electromagnetic compatibility simulation to obtain the final simulation results, including EMI indicators and EFT performance evaluation at each frequency. The integrated electromagnetic compatibility simulation data will provide a basis for circuit design optimization and ensure the reliability and stability of 5G communication circuit boards in practical applications.

[0062] Optionally, step S25 is specifically: Step S251: extracting electromagnetic field strength features according to high-frequency signal electromagnetic simulation data, thereby obtaining electromagnetic field strength data; In this embodiment, electromagnetic field strength feature extraction is performed based on high-frequency signal electromagnetic simulation data. Electromagnetic field distribution data is exported using electromagnetic simulation software (such as HFSS or CST), and the data includes electric field and magnetic field strength information at a specific frequency. Then, by processing the electromagnetic field data, the electric field strength and magnetic field strength at each key position are extracted to generate a set of electromagnetic field strength data. These data can reflect the distribution characteristics of the electromagnetic field in the circuit and provide a basis for subsequent spectrum analysis, with particular attention to the impact of high-frequency signals on electromagnetic field strength.

[0063] Step S252: performing fast Fourier transform according to the electromagnetic field intensity data, thereby obtaining electromagnetic field intensity spectrum data; In this embodiment, a fast Fourier transform (FFT) is performed on the extracted electromagnetic field intensity data to obtain electromagnetic field intensity spectrum data. Before performing FFT, ensure that the electromagnetic field intensity data is processed by a window function (such as a Hanning window or a Hamming window) to reduce spectrum leakage. Then, the time domain signal is converted into a frequency domain signal using an FFT algorithm to obtain the spectrum of the electromagnetic field intensity. This spectrum data will display the amplitude and phase information of different frequency components, and can reveal the characteristics of the signal at different frequencies, especially the frequency response of high-frequency signals.

[0064] Step S253: performing spectrum amplitude statistics according to the electromagnetic field intensity spectrum data, thereby obtaining high-amplitude electromagnetic field intensity spectrum data; In this embodiment, spectrum amplitude statistics are performed based on the electromagnetic field intensity spectrum data. By processing the spectrum data, the amplitude of each frequency component is calculated to obtain the amplitude value of the corresponding frequency. Statistical methods such as mean, variance and peak analysis are used to evaluate the high amplitude part of the spectrum. The amplitude value is compared with a set threshold (for example, 3 dB or 6 dB) to identify frequency components with amplitudes higher than the threshold. This process will help identify frequency bands that have a significant impact on electrical noise, which is convenient for subsequent analysis and optimization.

[0065] Step S254: performing frequency statistics according to the electromagnetic field intensity spectrum data, thereby obtaining high-frequency electromagnetic field intensity spectrum data; In this embodiment, frequency statistics are performed based on the electromagnetic field intensity spectrum data. By analyzing the distribution of each frequency component in the spectrum, the occurrence frequency of different frequency components and their corresponding amplitude values ​​are counted. The frequency data can be grouped using a histogram method to more clearly display the characteristics of the high-frequency electromagnetic field intensity spectrum. The frequency data is normalized to ensure consistency in comparisons within different frequency ranges. The high-frequency electromagnetic field intensity spectrum data will provide support for subsequent noise analysis, especially focusing on signal integrity and its damaged frequency range.

[0066] Step S255: performing an electrical noise spectrum intersection operation according to the high-amplitude electromagnetic field intensity spectrum data and the high-frequency electromagnetic field intensity spectrum data, thereby obtaining electrical noise data.

[0067] In this embodiment, an electrical noise spectrum intersection operation is performed based on the high-amplitude electromagnetic field intensity spectrum data and the high-frequency electromagnetic field intensity spectrum data. By comparing the two sets of spectrum data, the intersection area of ​​the two is identified, with particular attention paid to the area with higher amplitude and higher frequency. During the intersection operation, logical operations (such as AND operations) are applied to ensure that only frequency components that exist simultaneously in the high-amplitude electromagnetic field spectrum and the high-frequency electromagnetic field spectrum are retained. The electrical noise data finally obtained will reveal the frequency range with the greatest interference risk in the circuit, providing clear guidance for subsequent electromagnetic compatibility design and signal integrity optimization.

[0068] Optionally, step S26 is specifically: Step S261: Drawing an electromagnetic field distribution map according to the high-frequency signal electromagnetic simulation data, thereby obtaining an electromagnetic field distribution map; In this embodiment, an electromagnetic field distribution map is drawn based on the electromagnetic simulation data of the high-frequency signal. The electromagnetic simulation results of the high-frequency signal are loaded using electromagnetic simulation software (such as ANSYS HFSS or CST Microwave Studio) to extract the distribution data of the electric field and the magnetic field in a specific spatial area. These data include electric field strength (expressed in volts per meter) and magnetic field strength (expressed in amperes per meter). Then, through a three-dimensional visualization tool, the distribution information of the electric field and the magnetic field is displayed in the form of a color map or a vector map to form an electromagnetic field distribution map. During the drawing process, color levels are set to distinguish different intensity intervals to ensure that the contrast between high-intensity areas and low-intensity areas is obvious, providing an intuitive basis for subsequent radiation path analysis.

[0069] Step S262: performing radiation path tracing according to the electromagnetic field distribution diagram, thereby obtaining radiation path tracing data; In this embodiment, radiation path tracing is performed based on the electromagnetic field distribution map. By analyzing the electric field strength and direction in the electromagnetic field distribution map, the main path of signal radiation is identified. A path tracing algorithm (such as ray tracing technology) is applied to calculate the propagation path of the electromagnetic wave from the signal source through different dielectric layers. During the calculation process, the refractive index and reflectivity of the medium are considered to accurately simulate the behavior of the signal at the interface of different materials. The radiation path tracing data includes the specific path, refraction and reflection points of the signal and their corresponding intensity changes, providing data support for subsequent path classification and signal focusing analysis.

[0070] Step S263: performing path classification according to the radiation path tracing data, thereby obtaining reflection path data and refraction path data; In this embodiment, path classification is performed based on radiation path tracing data. The paths obtained by tracing are classified, mainly into reflection paths and refraction paths. According to the law of reflection and the law of refraction, specific classification rules are set. For example, when an electromagnetic wave is reflected at an interface, the relationship between the angle of incidence and the angle of reflection is calculated; and in the case of refraction, the angle of refraction is calculated according to Snell's law. Through these classification rules, the radiation path data is sorted into two groups, and the relevant information of the reflection path and the refraction path is recorded separately, including path length, angle of incidence, angle of reflection and angle of refraction. This classification will provide a basis for subsequent signal focusing and intensity consistency analysis.

[0071] Step S264: performing signal focus area statistics on the reflection path data to obtain signal focus area data; In this embodiment, the signal focus area statistics are performed on the reflection path data. By analyzing the reflection path, the focusing effect of the signal at different reflection points is calculated. To this end, a focusing standard is set. For example, if the electric field strength near a specific reflection point exceeds a set threshold (such as 10 V / m), the point is considered to be a signal focus area. All reflection paths that meet the conditions are counted, and the reflection points and electric field strengths corresponding to these paths are recorded. Signal focus area data is generated to facilitate subsequent optimization of signal enhancement and electromagnetic interference protection design.

[0072] Step S265: performing signal strength consistent path statistics on the refraction path data, thereby obtaining signal strength consistent path data; In this embodiment, the signal strength consistent path statistics are performed on the refraction path data. The electric field strength at each point in the refraction path is analyzed to ensure that the signal remains relatively stable during the propagation process. A consistency threshold is set, such as a signal strength change of no more than 5 dB, to identify the refraction paths that meet this standard. The electric field strengths of these paths are relatively consistent, which helps to maintain the integrity of the signal throughout the propagation process. Statistics of refraction paths that meet the conditions are collected to form signal strength consistent path data to provide support for subsequent interference source analysis.

[0073] Step S266: performing an electromagnetic interference source area intersection operation according to the signal focus area data and the signal strength consistent path data, thereby obtaining the electromagnetic interference source data.

[0074] In this embodiment, the intersection operation of the electromagnetic interference source area is performed based on the signal focus area data and the signal strength consistent path data. The signal focus area and the signal strength consistent path are spatially overlapped to identify the area where the two intersect. The geometric intersection algorithm is used to confirm the electric field strength in the intersection area by comparing the coordinate points to ensure that the area is a potential electromagnetic interference source. The electromagnetic interference source data finally obtained provides the key areas where the signal is interfered during the propagation process, providing clear guidance for subsequent electromagnetic compatibility analysis and optimization design.

[0075] Optionally, step S4 is specifically: Step S41: extracting circuit board material features according to the 5G communication circuit board design data, thereby obtaining circuit board material data; In this embodiment, circuit board material feature extraction is performed based on the 5G communication circuit board design data. The electrical and mechanical properties of each material are extracted from the design data, including dielectric constant, conductivity, thermal conductivity, and material thickness. These material data can be obtained through a material database or confirmed through laboratory testing. Next, the extracted data is classified and sorted using a material property extraction tool to form a detailed circuit board material data set to ensure that the material properties can support high-frequency signal transmission. Ultimately, the generated data will provide a basic basis for subsequent high-frequency operation simulations and thermal property analysis.

[0076] Step S42: extracting via position features according to the signal propagation optimization path data, thereby obtaining via position data; In this embodiment, via position feature extraction is performed based on the signal propagation optimization path data. By analyzing the optimized signal propagation path, the necessary via positions in the circuit board design are identified. This process requires the use of design software (such as Altium Designer or Cadence) to check the layout of the circuit board to ensure that the via positions meet the design rules. The extraction process includes recording the number and diameter of the vias and their specific coordinates in the circuit diagram. By using specific thresholds, it is ensured that the selection of vias meets the electrical performance requirements and that high-frequency signals can pass through within an appropriate time, ultimately forming a detailed via position data set.

[0077] Step S43: performing high-frequency operation simulation according to the circuit board material data and the via position data, thereby obtaining the circuit board high-frequency operation data; In this embodiment, high-frequency operation simulation is performed based on the circuit board material data and via position data. High-frequency electromagnetic field simulation software (such as ANSYS HFSS or CST Studio) is selected for simulation, and the circuit board material data and via position data are input. During the simulation, an appropriate frequency range is set (for example, from 24 GHz to 100 GHz), and the electromagnetic wave propagation model is applied to the geometric structure of the circuit board, considering the electromagnetic properties of the material. After calculation, the operation data of the circuit board at high frequency is obtained, including reflection loss, transmission loss, and impedance matching. These data will provide a reference for subsequent thermal characteristics simulation.

[0078] Step S44: performing thermal characteristic simulation analysis based on the high-frequency operation data of the circuit board, thereby obtaining thermal characteristic simulation data of the circuit board.

[0079] In this embodiment, thermal characteristics simulation analysis is performed based on the high-frequency operation data of the circuit board. Use a thermal analysis tool (such as ANSYS Icepak or Flotherm) to import the high-frequency operation data of the circuit board into the simulation environment, and set thermal boundary conditions, such as ambient temperature, heat source power, and heat dissipation requirements. Use thermal simulation software to simulate and calculate the heat distribution and temperature rise of the circuit board during high-frequency signal transmission. Key parameters include maximum temperature, temperature gradient, and heat flux density to ensure that they are within the allowable range (for example, the surface temperature of the circuit board does not exceed 85°C). The generated circuit board thermal characteristics simulation data will provide an important basis for optimizing design and heat dissipation strategies.

[0080] Optionally, step S44 is specifically: Step S441: Calculating power loss according to the high-frequency operation data of the circuit board, thereby obtaining power loss data; In this embodiment, it is first necessary to collect the high-frequency operation data of the circuit board, including parameters such as voltage, current and frequency. These data can be obtained through laboratory testing or on-site monitoring systems. Then, the power loss calculation formula is used to calculate the power loss of the circuit board. The power loss calculation formula is as follows: Ploss = I^2 * R * f, where P_loss is the power loss, I is the current, R is the resistance of the circuit board, and f is the frequency.

[0081] Step S442: Acquire thermal conductivity data of circuit board materials; In this embodiment, it is necessary to obtain the thermal conductivity data of the circuit board material. Thermal conductivity is a parameter that describes the heat transfer capacity of a material, which determines the amount of heat that a material can transfer per unit time. The thermal conductivity data of the circuit board material can be obtained through laboratory testing or by consulting relevant materials. For example, the thermal conductivity of FR4 material is 0.25W / mK.

[0082] Step S443: constructing a circuit board thermal characteristic simulation model according to the power loss data and the circuit board material thermal conductivity data, thereby obtaining a circuit board thermal characteristic simulation model; In this embodiment, it is necessary to use power loss data and thermal conductivity data of the circuit board material to build a thermal characteristic simulation model of the circuit board. The thermal characteristic simulation model is a mathematical model that describes the thermal behavior of the circuit board, which can predict the temperature distribution of the circuit board under different conditions. For example, the thermal characteristic simulation model of the circuit board can be built using ANSYS Workbench software. Create a geometric model of the circuit board and define its materials and boundary conditions. Use power loss data and thermal conductivity data to define the heat source and heat transfer boundary conditions of the circuit board. Finally, run the simulation to obtain the temperature distribution diagram of the circuit board.

[0083] Step S444: performing steady-state thermal simulation on the circuit board thermal characteristic simulation model according to the power loss data, thereby obtaining steady-state thermal simulation data; In this embodiment, it is necessary to use power loss data to perform steady-state thermal simulation on the circuit board thermal characteristic simulation model. Steady-state thermal simulation refers to thermal simulation performed under stable conditions, the purpose of which is to predict the temperature distribution of the circuit board after long-term operation. For example, steady-state thermal simulation can be performed using ANSYS Workbench software. Define simulation conditions, including temperature range and time step. Then, run the simulation to obtain a temperature distribution diagram of the circuit board.

[0084] Step S445: drawing a steady-state thermal simulation hotspot area map according to the steady-state thermal simulation data, thereby obtaining a steady-state thermal simulation hotspot area map; In this embodiment, it is necessary to draw a hotspot area map based on the steady-state thermal simulation data. The hotspot area map is a graph that describes the temperature distribution of the circuit board, which can help engineers quickly identify the hotspot areas of the circuit board. For example, the hotspot area map can be drawn using MATLAB software. Import the steady-state thermal simulation data. Then, use the graphics tool to draw the hotspot area map. Finally, save the graphics file.

[0085] Step S446: Obtaining circuit board material safety temperature data; In this embodiment, it is necessary to obtain the safety temperature data of the circuit board material. The safety temperature refers to the highest temperature at which the material will not be damaged under normal use conditions. The safety temperature data of the circuit board material can be obtained through laboratory testing or by consulting relevant materials. For example, the safety temperature of FR4 material is 125°C.

[0086] Step S447: dividing the steady-state thermal simulation hotspot area map into high-hotspot simulation areas according to the circuit board material safety temperature data, thereby obtaining the circuit board thermal characteristic simulation data.

[0087] In this embodiment, it is necessary to divide the high hot spot simulation area into the steady-state thermal simulation hot spot area map according to the safe temperature data of the circuit board material. The high hot spot simulation area refers to the area where the temperature exceeds the safe temperature, and these areas require special design or improvement. For example, the high hot spot simulation area can be divided using MATLAB software. Import the steady-state thermal simulation hot spot area map. Then, define the safe temperature threshold. Finally, use the graphical tool to divide the high hot spot simulation area.

[0088] Optionally, the present specification also provides a 5G communication circuit board design specification simulation system, which is used to execute the 5G communication circuit board design specification simulation method as described above, and the 5G communication circuit board design specification simulation system includes: Signal propagation path analysis module: used to obtain 5G communication circuit board design data, and extract stacking structure data and electrical parameter data according to the 5G communication circuit board design data, so as to obtain stacking structure data and electrical parameter data; perform signal propagation path analysis according to the stacking structure data and electrical parameter data, so as to obtain signal propagation path data; Electromagnetic compatibility simulation module: used to obtain high-frequency characteristic data of 5G communication circuit boards; perform electromagnetic compatibility simulation analysis based on the high-frequency characteristic data and electrical parameter data of 5G communication circuit boards to obtain electromagnetic compatibility simulation data; Signal propagation path optimization module: used to perform signal propagation loss analysis on signal propagation path data according to electromagnetic compatibility simulation data, thereby obtaining signal propagation loss data; perform propagation path optimization according to signal propagation loss data, thereby obtaining signal propagation optimized path data; High-frequency operation thermal characteristics simulation module: used to extract circuit board material characteristics based on 5G communication circuit board design data, so as to obtain circuit board material data; perform high-frequency operation thermal characteristics simulation analysis on signal propagation optimization path data based on circuit board material data, so as to obtain circuit board thermal characteristics simulation data; Circuit board stacking structure optimization module: used to perform stacking structure signal attenuation analysis on signal propagation optimization path data according to circuit board thermal characteristics simulation data, so as to obtain stacking structure signal attenuation data; optimize the circuit board stacking structure according to the stacking structure signal attenuation data, so as to obtain circuit board stacking structure optimization data, and upload it to the 5G communication terminal equipment management platform to execute the circuit board stacking structure optimization task.

[0089] The present invention provides a 5G communication circuit board design specification simulation system, which can implement any 5G communication circuit board design specification simulation method applicable to the present invention, and is used to combine the operation and signal transmission medium between various modules to complete the 5G communication circuit board design specification simulation method applicable to the system. The internal modules of the system cooperate with each other to reduce the interference risk in high-frequency signal transmission and optimize the 5G system performance.

[0090] Therefore, the embodiments should be regarded as illustrative and non-restrictive from all points, and the scope of the present invention is limited by the appended claims rather than the above description, and it is therefore intended that all changes falling within the meaning and range of equivalent elements of the application documents are included in the present invention.

[0091] The above description is only a specific embodiment of the present invention, so that those skilled in the art can understand or implement the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but should conform to the widest scope consistent with the principles and novel features invented herein.

Claims

1. A simulation method for 5G communication circuit board design specifications, characterized in that: The following steps are involved: Step S1: Acquire 5G communication circuit board design data, and extract stacking structure data and electrical parameter data according to the 5G communication circuit board design data, so as to obtain stacking structure data and electrical parameter data; perform signal propagation path analysis according to the stacking structure data and electrical parameter data, so as to obtain signal propagation path data; Step S2: obtaining high-frequency characteristic data of the 5G communication circuit board; performing electromagnetic compatibility simulation analysis according to the high-frequency characteristic data and electrical parameter data of the 5G communication circuit board, thereby obtaining electromagnetic compatibility simulation data; Step S3: performing signal propagation loss analysis on the signal propagation path data according to the electromagnetic compatibility simulation data, thereby obtaining signal propagation loss data; performing propagation path optimization according to the signal propagation loss data, thereby obtaining signal propagation optimized path data; Step S4: extracting circuit board material features according to the 5G communication circuit board design data, thereby obtaining circuit board material data; Perform high-frequency operation thermal characteristics simulation analysis on the signal propagation optimization path data according to the circuit board material data, so as to obtain the circuit board thermal characteristics simulation data; Step S5: Perform stacking structure signal attenuation analysis on the signal propagation optimization path data according to the circuit board thermal characteristic simulation data, so as to obtain stacking structure signal attenuation data; optimize the circuit board stacking structure according to the stacking structure signal attenuation data, so as to obtain the circuit board stacking structure optimization data, and upload it to the 5G communication terminal equipment management platform to execute the circuit board stacking structure optimization task.

2. The 5G communication circuit board design specification simulation method according to claim 1 is characterized in that: Step S1 is specifically as follows: Step S11: Acquire 5G communication circuit board design data, and extract stacking structure data and electrical parameter data according to the 5G communication circuit board design data, so as to obtain stacking structure data and electrical parameter data; Step S12: performing signal interlayer propagation coupling analysis according to the stacked structure data, thereby obtaining signal interlayer propagation coupling data; Step S13: performing signal propagation loss analysis according to the electrical parameter data, thereby obtaining signal propagation loss data; Step S14: Integrate the signal propagation path according to the signal inter-layer propagation coupling data and the signal propagation loss data, so as to obtain the signal propagation path data.

3. The 5G communication circuit board design specification simulation method according to claim 2 is characterized in that: Step S12 is specifically as follows: Step S121: extracting signal routing layout features and signal routing geometry features according to the stacked structure data, thereby obtaining signal routing layout data and signal routing geometry data; Step S122: constructing a signal line layout model according to the signal line layout data and the signal line geometry data, thereby obtaining a signal line layout model; Step S123: obtaining dielectric constant data of dielectric layer material; Step S124: performing electromagnetic field distribution analysis on the signal line layout model according to the dielectric constant data of the dielectric layer material, thereby obtaining electromagnetic field distribution data; Step S125: performing electromagnetic field distribution area strength statistics according to the electromagnetic field distribution data, thereby obtaining high electromagnetic field distribution area data; Step S126: performing signal line spacing statistics according to the signal routing layout data, thereby obtaining small-interval signal line data; Step S127: performing an electromagnetic field coupling region intersection operation according to the high electromagnetic field distribution data and the small interval signal line data, thereby obtaining electromagnetic field coupling region data; Step S128: Calculate the interlayer coupling strength of the electromagnetic field coupling region data according to the stacked structure data, thereby obtaining signal interlayer propagation coupling data.

4. The 5G communication circuit board design specification simulation method according to claim 2 is characterized in that: Step S13 is specifically as follows: Step S131: extracting conductor resistance characteristics and conductor current characteristics according to electrical parameter data, thereby obtaining conductor resistance data and conductor current data; Step S132: Calculating dielectric loss according to the conductor resistance data and the conductor current data, thereby obtaining dielectric loss data; Step S133: Acquire signal source characteristic impedance data and incident power data; Step S134: Calculating reflection loss based on the signal source characteristic impedance data and the incident power data, thereby obtaining reflection loss data; Step S135: Perform comprehensive calculation of signal propagation loss based on the dielectric loss data and the reflection loss data, so as to obtain signal propagation loss data.

5. The method for simulating the design specification of a 5G communication circuit board according to claim 1, characterized in that: Step S2 is specifically as follows: Step S21: Obtain high-frequency characteristic data of the 5G communication circuit board; Step S22: extracting ground wire structure characteristics and wiring length characteristics according to the electrical parameter data, thereby obtaining ground wire structure data and wiring length data; Step S23: constructing a communication circuit board simulation model according to the ground wire structure data and the wiring length data, thereby obtaining a communication circuit board simulation model; Step S24: performing high-frequency signal electromagnetic simulation on the communication circuit board simulation model according to the high-frequency characteristic data of the 5G communication circuit board, thereby obtaining high-frequency signal electromagnetic simulation data; Step S25: performing electrical noise analysis according to the high-frequency signal electromagnetic simulation data, thereby obtaining electrical noise data; Step S26: locating the electromagnetic interference source according to the high-frequency signal electromagnetic simulation data, thereby obtaining electromagnetic interference source data; Step S27: integrating electromagnetic compatibility simulation data according to the electrical noise data and the electromagnetic interference source data, thereby obtaining electromagnetic compatibility simulation data.

6. The method for simulating the design specification of a 5G communication circuit board according to claim 5, characterized in that: Step S25 is specifically as follows: Step S251: extracting electromagnetic field strength features according to high-frequency signal electromagnetic simulation data, thereby obtaining electromagnetic field strength data; Step S252: performing fast Fourier transform according to the electromagnetic field intensity data, thereby obtaining electromagnetic field intensity spectrum data; Step S253: performing spectrum amplitude statistics according to the electromagnetic field intensity spectrum data, thereby obtaining high-amplitude electromagnetic field intensity spectrum data; Step S254: performing frequency statistics according to the electromagnetic field intensity spectrum data, thereby obtaining high-frequency electromagnetic field intensity spectrum data; Step S255: performing an electrical noise spectrum intersection operation according to the high-amplitude electromagnetic field intensity spectrum data and the high-frequency electromagnetic field intensity spectrum data, thereby obtaining electrical noise data.

7. The method for simulating the design specification of a 5G communication circuit board according to claim 5, characterized in that: Step S26 is specifically as follows: Step S261: Drawing an electromagnetic field distribution map according to the high-frequency signal electromagnetic simulation data, thereby obtaining an electromagnetic field distribution map; Step S262: performing radiation path tracing according to the electromagnetic field distribution diagram, thereby obtaining radiation path tracing data; Step S263: performing path classification according to the radiation path tracing data, thereby obtaining reflection path data and refraction path data; Step S264: performing signal focus area statistics on the reflection path data to obtain signal focus area data; Step S265: performing signal strength consistent path statistics on the refraction path data, thereby obtaining signal strength consistent path data; Step S266: performing an electromagnetic interference source area intersection operation according to the signal focus area data and the signal strength consistent path data, thereby obtaining the electromagnetic interference source data.

8. The method for simulating the design specification of a 5G communication circuit board according to claim 1, characterized in that: Step S4 is specifically as follows: Step S41: extracting circuit board material features according to the 5G communication circuit board design data, thereby obtaining circuit board material data; Step S42: extracting via position features according to the signal propagation optimization path data, thereby obtaining via position data; Step S43: performing high-frequency operation simulation according to the circuit board material data and the via position data, thereby obtaining the circuit board high-frequency operation data; Step S44: performing thermal characteristic simulation analysis based on the high-frequency operation data of the circuit board, thereby obtaining thermal characteristic simulation data of the circuit board.

9. The 5G communication circuit board design specification simulation method according to claim 8 is characterized in that: Step S44 is specifically as follows: Step S441: Calculating power loss according to the high-frequency operation data of the circuit board, thereby obtaining power loss data; Step S442: Acquire thermal conductivity data of circuit board materials; Step S443: constructing a circuit board thermal characteristic simulation model according to the power loss data and the circuit board material thermal conductivity data, thereby obtaining a circuit board thermal characteristic simulation model; Step S444: performing steady-state thermal simulation on the circuit board thermal characteristic simulation model according to the power loss data, thereby obtaining steady-state thermal simulation data; Step S445: drawing a steady-state thermal simulation hotspot area map according to the steady-state thermal simulation data, thereby obtaining a steady-state thermal simulation hotspot area map; Step S446: Obtaining circuit board material safety temperature data; Step S447: dividing the steady-state thermal simulation hotspot area map into high-hotspot simulation areas according to the circuit board material safety temperature data, thereby obtaining the circuit board thermal characteristic simulation data.

10. A simulation system for 5G communication circuit board design specifications, characterized in that: Used to execute the 5G communication circuit board design specification simulation method applicable to claim 1, the 5G communication circuit board design specification simulation system applicable to claim 1 comprises: Signal propagation path analysis module: used to obtain 5G communication circuit board design data, and extract stacking structure data and electrical parameter data according to the 5G communication circuit board design data, so as to obtain stacking structure data and electrical parameter data; perform signal propagation path analysis according to the stacking structure data and electrical parameter data, so as to obtain signal propagation path data; Electromagnetic compatibility simulation module: used to obtain high-frequency characteristic data of 5G communication circuit boards; perform electromagnetic compatibility simulation analysis based on the high-frequency characteristic data and electrical parameter data of 5G communication circuit boards to obtain electromagnetic compatibility simulation data; Signal propagation path optimization module: used to perform signal propagation loss analysis on signal propagation path data according to electromagnetic compatibility simulation data, thereby obtaining signal propagation loss data; perform propagation path optimization according to signal propagation loss data, thereby obtaining signal propagation optimized path data; High-frequency operation thermal characteristics simulation module: used to extract circuit board material characteristics based on 5G communication circuit board design data, so as to obtain circuit board material data; perform high-frequency operation thermal characteristics simulation analysis on signal propagation optimization path data based on circuit board material data, so as to obtain circuit board thermal characteristics simulation data; Circuit board stacking structure optimization module: used to perform stacking structure signal attenuation analysis on signal propagation optimization path data according to circuit board thermal characteristics simulation data, so as to obtain stacking structure signal attenuation data; optimize the circuit board stacking structure according to the stacking structure signal attenuation data, so as to obtain circuit board stacking structure optimization data, and upload it to the 5G communication terminal equipment management platform to execute the circuit board stacking structure optimization task.

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