Display panel, bending structure thereof, preparation method and display device

Abstract

The invention relates to the technical field of display, and provides a display panel, a bending structure of the display panel, a preparation method and a display device.The bending structure of the display panel comprises a substrate and a wiring layer, the wiring layer is located on one side of the substrate and comprises at least one conductive wire, the conductive wire is made of a first material, and the first material is made of a second material. The first material comprises at least one of a low-melting-point conductive metal, a liquid conductive material and a conductive elastomer; wherein the conductive wire comprises a connecting sub-part and a compensation sub-part which are connected, the connecting sub-part extends along a first direction, and the first direction is parallel to the bending direction of the bending structure of the display panel; and the orthographic projection outer contour of the compensation sub-part on the substrate is partially overlapped with the orthographic projection outer contour of the connection sub-part on the substrate. The display panel provided by the invention has relatively good use performance.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and more specifically, relates to a display panel and its bending structure, a preparation method and a display device. Background Art

[0002] With the rapid development of mobile phone products and the continuous improvement of users' requirements for visual experience, high screen-to-body ratio and narrow-edge display screens have gradually become mainstream. Reducing the border width of the display panel is an important means to achieve a high screen-to-body ratio. In related technologies, the display panel can bend the non-display area outside the display panel to the back by bending to achieve the effect of narrowing the border. However, although this technology can reduce the size of the border, it will also cause the wiring in the bending area to be prone to broken wires and cause display abnormalities on the display panel. Summary of the invention

[0003] Based on this, the present application provides a display panel and its bending structure, a preparation method and a display device, so as to improve the disconnection failure of the display panel at least to a certain extent and improve the performance of the display panel.

[0004] To achieve the above-mentioned purpose, the technical solution adopted in the present application is: to provide a bending structure of a display panel, including a substrate and a routing layer, the routing layer is located on one side of the substrate, the routing layer includes at least one conductive routing, the material of the conductive routing includes a first material, the first material includes at least one of a low-melting-point conductive metal, a liquid conductive material and a conductive elastomer; wherein, the conductive routing includes a connected connecting sub-part and a compensating sub-part, the connecting sub-part extends along a first direction, the first direction is parallel to the bending direction of the bending structure of the display panel, and the orthographic outer contour of the compensating sub-part on the substrate partially overlaps with the orthographic outer contour of the connecting sub-part on the substrate.

[0005] In the bending structure of the display panel provided in the embodiment of the present application, by providing a connected connecting sub-part and a compensating sub-part, when the bending structure is bent, the connecting sub-part can be used to connect the wiring structure located in other areas of the display panel to achieve circuit conduction. When the connecting sub-part in the conductive wiring generates a short line or a broken line due to the force of stretching during bending, the first material in the compensating sub-part can effectively repair the shorted part and the broken part of the connecting sub-part, so as to improve the reliability and yield of the bending structure of the display panel.

[0006] Optionally, the compensating sub-part is connected to one end of the connecting sub-part in the first direction;

[0007] From the connecting sub-portion to the compensating sub-portion, the cross-sectional area of ​​the compensating sub-portion is an increasing region, and the plane where the cross-section is located is perpendicular to the first direction.

[0008] Optionally, an outer contour of an orthographic projection of the compensation sub-section on the substrate is a trapezoidal or inverted trapezoidal structure.

[0009] Optionally, the number of the compensating sub-parts is two and they are arranged at intervals on both sides of one end of the connecting sub-part in the first direction.

[0010] Optionally, the plurality of conductive traces are arranged at intervals along a second direction, and the second direction is orthogonal to the first direction.

[0011] Optionally, a blocking dam is further provided on one side of the substrate, a through slot extending along the first direction is formed on the blocking dam, the conductive trace is located in the through slot, and in the first direction, the blocking dam does not overlap with the connecting sub-portion;

[0012] Among them, in the thickness direction of the substrate, the distance between the side of the blocking dam facing away from the substrate and the substrate is a first distance, the distance between the side of the conductive trace facing away from the substrate and the substrate is a second distance, and the first distance is not less than the second distance.

[0013] Optionally, a side of the blocking dam pointing toward the through groove has a blocking side wall, and at least a portion of the conductive trace is in contact with the blocking side wall.

[0014] Optionally, the blocking dam includes a first blocking member and a second blocking member that are arranged opposite to each other, and the through groove is located between the first blocking member and the second blocking member.

[0015] Optionally, a third blocking member is spaced apart from at least one of the first blocking member and the second blocking member on a side facing away from the through slot.

[0016] Optionally, there are multiple third blocking members and they are arranged at intervals.

[0017] Optionally, the low melting point conductive metal includes a gallium-based alloy; and / or the liquid conductive material includes one or more of conductive ink, graphene dispersion, and polyaniline solution; and / or the conductive elastomer includes a conductive OCA material.

[0018] In a second aspect, the present application further provides a display panel, the display panel comprising a display area, a bending area and a bonding area, the bending area being located between the display area and the bonding area, the bending area comprising the bending structure of the display panel described in any one of the above items;

[0019] The display area and the bonding area are respectively located at two ends of the bending area in the first direction, and one end of the conductive trace in the first direction is located in the display area, and the other end is located in the bonding area.

[0020] Optionally, the wiring layer further includes connecting wirings connected to the conductive wirings, and the number of the connecting wirings is two and they are respectively located in the display area and the bonding area;

[0021] The conductive traces are connected along the first direction to the connection traces located in the display area and the bonding area respectively.

[0022] Optionally, any one of the connecting traces includes a mating portion close to the conductive trace and an extending portion away from the conductive trace, the mating portion has a third distance from the substrate on a side facing away from the substrate, the extending portion has a fourth distance from the substrate on a side facing away from the substrate, and the third distance is greater than the fourth distance.

[0023] In a third aspect, the present application further provides a method for preparing a display panel, the method for preparing the display panel described above, the method comprising:

[0024] A substrate, comprising a display area, a bending area and a bonding area, wherein the bending area is located between the display area and the bonding area;

[0025] A routing layer is formed in the bending area, wherein the routing layer includes a conductive routing, and the material of the conductive routing includes a first material, wherein the first material includes at least one of a low-melting-point conductive metal, a liquid conductive material, and a conductive elastomer;

[0026] The bending area is bent so that the bonding area and the display area are overlapped.

[0027] Optionally, the conductive trace only includes a low-melting-point conductive metal, and the preparation method further includes heating the bending area to put the conductive trace in a molten state.

[0028] In a fourth aspect, the present application further provides a display device, comprising the display panel described above, or comprising a display panel prepared by the preparation method described above.

[0029] The display device provided in the embodiment of the present application includes the above-mentioned display panel, so the display device at least includes the beneficial effects of any one or several of the above-mentioned display panels. The specific effects are described above and will not be repeated here.

[0030] The display panel and its bending structure, preparation method and display device provided by the present application have the following beneficial effects: compared with the related art, the bending structure of the display panel provided by the present application is made of a first material and includes a connecting sub-part and a compensating sub-part for realizing the connection and compensation functions respectively; wherein, the first material helps to improve the problem that the conductive trace is prone to cracks or even breaks when bending, and overcomes the problem of wrinkles or breaks caused by stress concentration of the conductive trace when bending by improving its ductility and heating it, and the compensating sub-part can be used to supplement the first material to the connecting sub-part to overcome the short line problem caused by bending and stretching of the connecting sub-part, and ensure that the bent conductive trace has sufficient volume and length to connect the connecting trace at the corresponding position. The bending structure of the display panel can effectively improve the yield and reliability of the bending structure of the display panel, and can further reduce the bending radius of the bending structure of the display panel to a certain extent, so as to further narrow the display frame of the display panel and optimize the performance of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0032] Figure 1 A top view of a display panel provided in an embodiment of the present application;

[0033] Figure 2 A side view of a display panel in a bent state provided by an embodiment of the present application;

[0034] Figure 3 A side view of the bending structure of the display panel provided in an embodiment of the present application;

[0035] Figure 4 A top view of the bending structure of the display panel provided in an embodiment of the present application;

[0036] Figure 5 for Figure 4 AA section view in the figure;

[0037] Figure 6 A top view of a bending structure of a display panel provided in another embodiment of the present application;

[0038] Figure 7 A schematic diagram of the coordination between the connection wiring and the bending structure in the display panel provided in an embodiment of the present application;

[0039] Figure 8A flow chart of a method for preparing a display panel provided in an embodiment of the present application;

[0040] Fig. 9 A flow chart of a method for manufacturing a display panel provided in another embodiment of the present application;

[0041] Fig.10 A schematic diagram of the structure of a display device provided in an embodiment of the present application.

[0042] Among them, the reference numerals in the figure are:

[0043] 1. substrate; 2. conductive trace; 21. connection sub-unit; 22. compensation sub-unit; 3. blocking dam; 301. through slot; 302. blocking sidewall; 31. first blocking member; 32. second blocking member; 33. third blocking member;

[0044] 10. Display panel; 101. Display area; 102. Bending area; 103. Bonding area; 4. Connecting wiring; 41. Matching part; 42. Extension part; 100. Display device.

[0045] X, first direction; Y, second direction. DETAILED DESCRIPTION

[0046] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0047] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0048] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0049] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0050] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0051] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0052] In the present application, the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0053] The term "substrate" as used herein refers to the material on which subsequent material layers are added. The substrate itself can be patterned. The material added on top of the substrate can be patterned, or can remain unpatterned. In addition, the substrate can include a wide range of materials, such as silicon, germanium, gallium arsenide, indium phosphide, etc. Alternatively, the substrate can be made of non-conductive materials (e.g., glass, plastic, or sapphire wafers, etc.). The substrate can be made of flexible materials according to design requirements.

[0054] The term "layer" used in the text may refer to a material portion including an area with a certain thickness. A layer may extend over the entire underlying structure or overlying structure, or may have a range smaller than the range of the underlying or overlying structure. In addition, a layer may be an area of ​​a homogeneous or inhomogeneous continuous structure, the thickness of which is less than the thickness of the continuous structure. For example, a layer may be located between the top surface and the bottom surface of the continuous structure or between any paired lateral planes at the top surface and the bottom surface. A layer may extend laterally, vertically and / or along a tapered surface. A substrate may be a layer, may include one or more layers therein, and / or may have one or more layers located thereon, above it and / or below it. A layer may include multiple layers. For example, an interconnect layer may include one or more conductors and a contact layer (forming contacts, interconnects and / or vias therein) and one or more dielectric layers.

[0055] After long-term research, the inventors found that when the bending structure of the display panel 10 is bent, the common problem faced is that the wiring is easy to break or wrinkle. As the frame of the display panel 10 gradually narrows, the probability of the above problem is getting higher and higher. The existing display panel 10 mainly includes a display area 101, a bending area 102 and a bonding area 103, wherein the bending area 102 is located between the display area 101 and the bonding area 103. The arrangement of the wiring in the bending area 102 can be referred to Figure 1 .

[0056] When the bending area 102 is bent, the structure of the display panel 10 after bending is as shown in FIG. Figure 2 . At this time, the stress on the wiring in the bending area 102 increases. As the frame of the display panel 10 becomes narrower, the bending radius of the bending area 102 gradually decreases. Therefore, the stress on the wiring in the bending area 102 when bending also increases accordingly. When the stress is concentrated to exceed the ultimate strength of the wiring material, the wiring will cause fracture, thereby affecting the normal display of the display panel 10. Therefore, how to reduce the risk of wiring fracture while narrowing the frame of the display panel 10 is a key focus of researchers.

[0057] In order to improve the performance and display effect of the display panel 10 to at least a certain extent, the embodiment of the present application provides a bending structure of the display panel 10, see Figure 3-Figure 5 The bending structure of the display panel 10 can solve or improve the problem that the wiring in the bending structure of the display panel 10 is easily broken.

[0058] Specifically, the bending structure of the display panel 10 includes a substrate 1 and a wiring layer, the wiring layer is located on one side of the substrate 1, the wiring layer includes at least one conductive wiring 2, the material of the conductive wiring 2 includes a first material, and the first material includes at least one of a low-melting-point conductive metal, a liquid conductive material and a conductive elastomer.

[0059] The above-mentioned wiring layer may include a plurality of conductive wirings 2 , at least part of which may extend along a first direction X and be arranged in sequence and spaced apart along a second direction Y, where the second direction Y is orthogonal to the first direction X.

[0060] The above-mentioned conductive trace 2 is prepared from a first material, and the first material includes at least one of a low-melting-point conductive metal, a liquid conductive material, and a conductive elastomer. When the first material is a low-melting-point conductive metal, the conductive trace 2 after bending can be repaired by heating to a molten state and then cooling and solidifying to repair the cracks and wrinkles that may be generated during bending, thereby reducing the risk of the conductive trace 2 breaking. Alternatively, it can be heated before bending, and the conductive trace 2 can be bent when it is in a molten state, and the conductive trace 2 can be cooled and solidified after bending, thereby avoiding the risk of the conductive trace 2 breaking. When the first material is a liquid conductive material and / or a conductive elastomer, the conductive trace 2 does not need to consider stress issues when bending, and there is no risk of breaking.

[0061] In this embodiment, the low melting point in the above-mentioned low melting point conductive metal means that the melting point of the metal is not lower than the maximum daily use temperature of the display panel 10 and the display device having the display panel 10, and its melting point is not higher than the melting points of other materials in the display panel 10. The selection and melting point of the low melting point conductive metal shall be based on not affecting the use of the display panel 10 and the corresponding display device. If the melting point of the low melting point conductive metal is too low, there is a risk that the conductive trace 2 will melt during daily use, which will affect the function of the display panel 10.

[0062] Specifically, in this embodiment, the melting point of the low-melting-point conductive metal can be set to be no less than 85° C. For example, the melting point range of the low-melting-point conductive metal can be set to be 65° C. to 120° C.

[0063] Specifically, the melting point may be 85°C to 120°C.

[0064] The melting point can be adaptively adjusted within this range, for example, 85°C, 90°C, 95°C, 100°C, 105°C, 110°C, 115°C, 120°C, etc.

[0065] See also Figure 3 and Figure 4 After the bending structure of the display panel 10 is bent, the area where the conductive trace 2 is located will be stretched to a certain extent. At this time, the conductive trace 2 may be affected by the tensile force, causing it to fall off from other connected devices, resulting in a short-line risk. In order to solve the above problems and improve the reliability of the bending structure of the display panel 10, the conductive trace 2 includes a connecting sub-portion 21 and a compensating sub-portion 22, wherein the connecting sub-portion 21 extends along a first direction X, and the first direction X is parallel to the bending direction of the bending structure of the display panel 10. The compensating sub-portion 22 is located outside the connecting sub-portion 21 and is connected to the connecting sub-portion 21. At this time, the outer contour of the orthographic projection of the compensating sub-portion 22 on the substrate 1 partially overlaps with the outer contour of the orthographic projection of the connecting sub-portion 21 on the substrate 1.

[0066] The connecting sub-section 21 can be used to connect the wiring structures in other areas on the display panel 10 to achieve circuit conduction. When a short line problem occurs in the connecting sub-section 21, the compensation sub-section 22 connected to the connecting sub-section 21 can be used to compensate for the short line of the connecting sub-section 21 to achieve circuit conduction between the connecting sub-section 21 and the related devices on the display panel 10.

[0067] Specifically, by controlling the first material constituting the connecting sub-part 21 and the compensating sub-part 22 to be in a flowable liquid state, so that the first material used to constitute the compensating sub-part 22 flows into the short line or break of the connecting sub-part 21, the conductive trace 2 can still maintain normal circuit conduction with related devices after bending.

[0068] Taking the first material as a low-melting-point conductive metal as an example, the first material located in the connecting sub-section 21 and the compensating sub-section 22 can be melted by heating the conductive trace 2. At this time, the heating temperature should be controlled to be higher than the melting point of the first material and not exceed the tolerance range of the display panel 10 to avoid damaging the performance of other devices in the display panel 10. The melted connecting sub-section 21 and the compensating sub-section 22 obtain low-melting-point conductive metal droplets, and the low-melting-point conductive metal material droplets flow and can fill the short-line position and the broken line position of the connecting sub-section 21. Finally, stop heating and restore to room temperature, the low-melting-point conductive metal solidifies, and at this time, both ends of the conductive trace 2 can be connected to the corresponding devices and realize circuit conduction.

[0069] In some embodiments, part of the conductive traces 2 in the trace layer are the above structure made of the first material; in other similar embodiments, all the conductive traces 2 in the trace layer are the above structure made of the first material.

[0070] In some embodiments, the low melting point conductive metal can be freely selected as needed, for example, an alloy of one or more of gallium, indium and tin.

[0071] Specifically, in this embodiment, the low melting point conductive metal can be a gallium-based alloy with a melting point of about 85° C. Gallium metal is a low melting point metal with a melting point of 30° C. It is necessary to add a high melting point metal to the pure gallium metal so that its melting point is not less than 85° C. During preparation, the low melting point conductive metal can be prepared by evaporation and etching.

[0072] In some embodiments, the liquid conductive material includes one or more of conductive ink, graphene dispersion, and polyaniline solution; and / or the conductive elastomer includes a conductive OCA material.

[0073] Conductive OCA materials can be obtained by modifying or adding conductive substances (such as metal nanoparticles, carbon nanotubes, conductive polymers, etc.) to the OCA material to make it conductive. OCA material is optically clear adhesive, which has good bonding and curing properties and can be cured at room temperature. Conductive OCA materials have both conductivity and elasticity, and can withstand mechanical stress such as deformation, bending, and stretching to a certain extent, and return to their original shape after the stress is removed.

[0074] See also Figure 4 The compensating sub-section 22 can be connected to the connecting sub-section 21 at one end thereof in the first direction X. From the connecting sub-section 21 to the compensating sub-section 22, the cross-sectional area of ​​the compensating sub-section 22 is an enlarged region, and the plane where the cross-section is located is perpendicular to the first direction X.

[0075] This structure enables the orthographic projection of the compensation sub-portion 22 on the substrate 1 to present a structure similar to a solution pool, which helps the first material to flow from the compensation sub-portion 22 to the connection sub-portion 21 when the first material is in a liquid state.

[0076] Specifically, the outer contour of the orthographic projection of the compensation sub-section 22 on the substrate 1 is a trapezoidal or inverted trapezoidal structure.

[0077] In this embodiment, the number of the compensating sub-portions 22 is two and they are disposed at intervals on both sides of one end of the connecting sub-portion 21 in the first direction X.

[0078] In other similar embodiments, the compensation sub-portion 22 may be located in the middle of the connecting sub-portion 21 in the first direction X. Figure 6 At this time, the number of the compensating sub-sections 22 is two and they are located on both sides of the middle of the connecting sub-section 21 .

[0079] In order to better define the area where the conductive trace 2 is located and control the flow direction and range of the first material constituting the conductive trace 2 when in liquid state to avoid short circuit problems, in this embodiment, one side of the substrate 1 is also provided with a blocking dam 3 that limits the range of the first material constituting the conductive trace 2.

[0080] It should be noted that the barrier dam 3 can be made of insulating material, such as organic material.

[0081] See also Figure 4 The blocking dam 3 and the wiring layer are located on the same side of the substrate 1 , and a through slot 301 extending along the first direction X is formed on the blocking dam 3 , and the conductive wiring 2 is located in the through slot 301 .

[0082] See also Figure 5 The surface of the barrier dam 3 facing away from the substrate 1 should be higher than the surface of the conductive trace 2 facing away from the substrate 1, so as to limit the distribution range of the conductive trace 2 and prevent overflow failure to a certain extent, thereby improving the packaging effect of the conductive trace 2.

[0083] Specifically, in the thickness direction of the substrate 1, the distance between the side of the barrier dam 3 facing away from the substrate 1 and the substrate 1 is a first distance h1, and the distance between the side of the conductive trace 2 facing away from the substrate 1 and the substrate 1 is a second distance h2, and the first distance is not less than the second distance, that is, h1≥h2. Of course, in order to ensure the effectiveness of the package, h1>h2 should generally be controlled.

[0084] See also Figure 4 In the first direction X, the blocking dam 3 does not overlap with the connecting sub-portion 21 . At this time, both ends of the connecting sub-portion 21 in the first direction X can be used to electrically connect with other devices located in the display area 101 and the bonding area 103 .

[0085] See also Figure 5 The side of the blocking dam 3 pointing to the through slot 301 has a blocking sidewall 302 , and at least part of the conductive trace 2 is in contact with the blocking sidewall 302 .

[0086] When the conductive trace 2 is in a solidified state, a gap may exist between part of the side walls of the conductive trace 2 and the blocking side wall 302. When the conductive trace 2 is heated to make it liquid, the conductive trace 2 in a molten state can adhere to the blocking side wall 302 and maintain the state of adhering to the blocking side wall 302 after cooling and solidifying.

[0087] Specifically, the barrier dam 3 includes a first barrier 31, a second barrier 32 and a third barrier 33, see Figure 5 The first blocking member 31, the second blocking member 32 and the third blocking member 33 are all embankment-like structures with a certain height and width.

[0088] The first blocking member 31 and the second blocking member 32 are arranged opposite to each other, and the through slot 301 for accommodating the conductive trace 2 is located between the first blocking member 31 and the second blocking member 32 .

[0089] The third blocking member 33 is disposed on a side of at least one of the first blocking member 31 and the second blocking member 32 that is away from the through slot 301 and is spaced apart from the first blocking member 31 and the second blocking member 32 .

[0090] The first barrier 31 and the second barrier 32 can directly contact the conductive trace 2 and can play a good blocking role on the first material constituting the conductive trace 2. The third barrier 33 can help enhance the resistance to leakage and diffusion of the first material in a liquid or flowable state, and continue to play a blocking role on the first material when the first barrier 31 and the second barrier 32 fail. In addition, the above three barriers cooperate with each other to help enhance the fault tolerance of the barrier dam 3 structure. When there are certain deviations in the preparation amount or distribution position of the first material, these anomalies can be better accommodated and adjusted, reducing product defects caused by process fluctuations, thereby better improving production yield and product stability.

[0091] See also Figure 5 In this embodiment, the distance between the side of the third blocking member 33 facing away from the substrate 1 and the substrate 1 is not less than the distance between the side of the first blocking member 31 facing away from the substrate 1 and the substrate 1, and is also not less than the distance between the side of the second blocking member 32 facing away from the substrate 1 and the substrate 1, so as to provide a better blocking effect.

[0092] The barrier dam 3 can be obtained by etching.

[0093] In order to better improve the packaging of the conductive traces 2, in some embodiments, the bending structure of the display panel 10 further includes a packaging layer.

[0094] The encapsulation layer is located on a side of the wiring layer facing away from the substrate 1 , and the orthographic projection of the encapsulation layer on the substrate 1 at least covers the orthographic projection of the conductive wiring 2 on the substrate 1 .

[0095] Specifically, the encapsulation layer can cover the barrier dam 3 , and the encapsulation layer and the barrier dam 3 cooperate with each other to provide better sealing and blocking effects for other parts of the conductive trace 2 outside the first direction X.

[0096] In some embodiments, the encapsulation layer may be made of BPL adhesive (Bending Protection Layer Adhesive).

[0097] The BPL glue has certain flexibility and good adhesion, and has a good protective effect on the bending structure of the display panel 10. When the BPL glue covers the surface of the conductive trace 2 on the side facing away from the substrate 1, it can provide a good packaging and protection effect for the conductive trace 2, and can reduce the stress concentration and deformation of the conductive trace 2 caused by bending; the BPL glue cooperates with the barrier dam 3 to further improve the packaging effect of the conductive trace 2.

[0098] It can be understood that the bending structure of the display panel 10 provided in the embodiment of the present application is made of the first material and includes a connecting sub-section 21 and a compensating sub-section 22 for realizing the connection and compensation functions respectively; wherein, the first material helps to improve the problem that the conductive trace 2 is prone to cracks or even breaks when bent, and overcomes the wrinkles or breaks of the conductive trace 2 caused by stress concentration when bent by improving its ductility and heating it, and the compensating sub-section 22 can be used to supplement the first material to the connecting sub-section 21 to overcome the short line problem caused by bending and stretching of the connecting sub-section 21, and ensure that the bent conductive trace 2 has sufficient volume and length to connect the connecting trace 4 at the corresponding position. The bending structure of the display panel 10 can effectively improve the yield and reliability of the bending structure of the display panel 10, and can further reduce the bending radius of the bending structure of the display panel 10 to a certain extent, so as to further narrow the display frame of the display panel 10 and optimize the performance of the display panel 10.

[0099] The present application also provides a display panel 10. Figure 1 and Figure 2 The display panel 10 includes a display area 101, a bending area 102 and a bonding area 103, the bending area 102 is located between the display area 101 and the bonding area 103, and the bending area 102 includes any one of the above-mentioned bending structures of the display panel 10; wherein the display area 101 and the bonding area 103 are respectively located at two ends of the bending area 102 in the first direction X, and one end of the conductive trace 2 in the first direction X is located in the display area 101, and the other end is located in the bonding area 103.

[0100] See also Figure 2 The two ends of the conductive trace 2 in the bending structure of the display panel 10 in the first direction X extend into the display area 101 and the bonding area 103 respectively, and are electrically connected to the related devices in the corresponding areas.

[0101] Specifically, the wiring layer disposed on one side of the substrate 1 further includes connecting wirings 4, and both the display area 101 and the bonding area 103 include the connecting wirings 4. The number of the connecting wirings 4 is at least two, and at least one connecting wiring 4 can be connected to different connecting wirings 4 at both ends.

[0102] The end of the conductive trace 2 extending into the display area 101 is connected to the connecting trace 4 located in the display area 101, and the end extending into the bonding area 103 is connected to the connecting trace 4 located in the bonding area 103. Figure 2 .

[0103] In some embodiments, the compensation sub-portion 22 in the conductive trace 2 may be arranged to extend into the display area 101 of the display panel 10. When the display panel 10 is bent, the bonding area 103 is bent 180° toward the bottom of the display area 101. At this time, the first material extending into the display area 101 and constituting the compensation sub-portion 22 can flow downward under the action of gravity in a liquid state and replenish the connection sub-portion 21 to overcome the short line or disconnection defects that may occur in the connection sub-portion 21.

[0104] In some embodiments, taking the display area 101 as an example, a plurality of connecting traces 4 arranged at intervals along the second direction Y are distributed in the display area 101, wherein at least one connecting trace 4 can be connected to the conductive trace 2 extending from the bending area 102; correspondingly, a plurality of connecting traces 4 arranged at intervals along the second direction Y can also be distributed in the bonding area 103, wherein at least one connecting trace 4 can be connected to the conductive trace 2 extending from the bending area 102.

[0105] In order to provide a certain sealing and limiting effect on the conductive trace 2 made of the first material in the first direction X, in some embodiments, any connecting trace 4 can be set to include a matching portion 41 close to the conductive trace 2 and an extending portion 42 away from the conductive trace 2, and the matching portion 41 has a third distance from the substrate 1 on the side facing away from the substrate 1, and the extending portion 42 has a fourth distance from the substrate 1 on the side facing away from the substrate 1, and the third distance is greater than the fourth distance.

[0106] In the thickness direction of the display panel 10 , the thickness of the matching portion 41 is greater than the thickness of the extending portion 42 .

[0107] See also Figure 7 The matching portion 41 formed on the connecting trace 4 can cooperate with the blocking dam 3 provided in the bending area 102 to form a sealing structure around the conductive trace 2 to prevent overflow or short circuit failure of the conductive trace 2.

[0108] Specifically, the orthographic projection of the matching portion 41 on the substrate 1 is connected to the orthographic projection of the blocking dam 3 on the substrate 1 and forms at least one closed figure.

[0109] The orthographic projection of the conductive trace 2 on the substrate 1 is located within the closed figure.

[0110] Alternatively, the thickness of the connecting trace 4 may be greater than that of the conductive trace 2 , and the orthographic projection of the connecting trace 4 on the substrate 1 may be directly connected to the orthographic projection of the blocking dam 3 on the substrate 1 and form at least one closed figure arranged around the conductive trace 2 .

[0111] When the first material is in a liquid or flowable state, the above structure can be arranged around the first material and limit the first material without affecting the normal connection between the first material and the connecting trace 4, thereby avoiding short circuit problems in the conductive trace 2 composed of the first material during bending or use.

[0112] In a third aspect, the present application further provides a method for preparing a display panel 10, the method for preparing the display panel 10 described above, the method comprising:

[0113] The substrate 1 comprises a display area 101, a bending area 102 and a bonding area 103, wherein the bending area 102 is located between the display area 101 and the bonding area 103;

[0114] A routing layer is formed in the bending area 102, the routing layer includes a conductive routing 2, the material of the conductive routing 2 includes a first material, and the first material includes at least one of a low melting point conductive metal, a liquid conductive material and a conductive elastomer;

[0115] The bending region 102 is bent so that the bonding region 103 and the display region 101 are overlapped.

[0116] When the first material is at least one of a liquid conductive material and a conductive elastomer, the bending area 102 can be directly bent.

[0117] When the first material includes a low-melting-point conductive metal, the preparation method further includes: heating the bending region 102 to put the conductive trace 2 in a molten state.

[0118] Specifically, the above preparation method can refer to Figure 8 :

[0119] Step S1, substrate 1, comprising a display area 101, a bending area 102 and a bonding area 103, wherein the bending area 102 is located between the display area 101 and the bonding area 103;

[0120] Step S2, forming a wiring layer in the bending area 102, the wiring layer including the conductive wiring 2, the material of the conductive wiring 2 includes a first material, and the first material includes at least one of a low melting point conductive metal, a liquid conductive material and a conductive elastomer;

[0121] Step S3, heating the bending area 102 to make the conductive trace 2 in a molten state;

[0122] Step S4, bending the bending area 102 so that the bonding area 103 and the display area 101 overlap;

[0123] Step S5, cooling the bending area 102 to make the conductive trace 2 become solid.

[0124] Alternatively, in other similar embodiments, the above preparation method can refer to Fig. 9 :

[0125] Step S1, substrate 1, comprising a display area 101, a bending area 102 and a bonding area 103, wherein the bending area 102 is located between the display area 101 and the bonding area 103;

[0126] Step S2, forming a wiring layer in the bending area 102, the wiring layer including the conductive wiring 2, the material of the conductive wiring 2 includes a first material, and the first material includes at least one of a low melting point conductive metal, a liquid conductive material and a conductive elastomer;

[0127] Step S3, bending the bending area 102 so that the bonding area 103 and the display area 101 overlap.

[0128] Step S4, heating the bending area 102 to make the conductive trace 2 in a molten state;

[0129] Step S5, cooling the bending area 102 to make the conductive trace 2 become solid.

[0130] The display panel 10 can be manufactured by the above-mentioned manufacturing methods.

[0131] In the above step S2, a wiring layer is formed in the bending area 102, and the wiring layer includes a conductive wiring 2, including:

[0132] Step S21, forming a barrier dam 3 in the bending area 102;

[0133] Step S22 , forming a conductive trace 2 in the groove of the barrier dam 3 .

[0134] The conductive trace 2 is connected to the connection trace 4 located in the display area 101 and the bonding area 103 .

[0135] In a fourth aspect, the present application further provides a display device 100, comprising the display panel 10 described above, or comprising the display panel 10 prepared by the preparation method described above.

[0136] The display device structure provided in the embodiment of the present application can be found in Fig.10 .

[0137] The display device 100 provided in the embodiment of the present application can be a mobile phone, a notebook, a tablet computer, a smart watch, a smart bracelet, a navigator, a display, a personal digital assistant (PDA), and other products or components with display functions.

[0138] Since the display panel 10 in the display device 100 has any one or several of the above-mentioned beneficial effects of the display panel 10 , the display device 100 at least includes any one or several of the above-mentioned beneficial effects of the display panel 10 . The specific effects are described above and will not be repeated here.

[0139] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A bending structure of a display panel, characterized in that: include: Substrate (1); A wiring layer, located on one side of the substrate (1), the wiring layer comprising at least one conductive wiring (2), the material of the conductive wiring (2) comprising a first material, the first material comprising at least one of a low melting point conductive metal, a liquid conductive material and a conductive elastomer; The conductive trace (2) comprises a connecting sub-portion (21) and a compensating sub-portion (22) which are connected to each other; the connecting sub-portion (21) extends along a first direction, the first direction is parallel to a bending direction of the bending structure of the display panel; and an orthographic projection outer contour of the compensating sub-portion (22) on the substrate (1) partially overlaps with an orthographic projection outer contour of the connecting sub-portion (21) on the substrate (1).

2. The bending structure of the display panel according to claim 1, characterized in that: The compensating sub-portion (22) is connected to one end of the connecting sub-portion (21) in the first direction; From the connecting sub-portion (21) to the compensating sub-portion (22), the cross-sectional area of ​​the compensating sub-portion (22) is an increasing region, and the plane where the cross-sectional area is located is perpendicular to the first direction; Preferably, the outer contour of the orthographic projection of the compensating sub-section (22) on the substrate (1) is a trapezoidal or inverted trapezoidal structure; Preferably, the number of the compensating sub-parts (22) is two and they are arranged at intervals on both sides of one end of the connecting sub-part (21) in the first direction.

3. The bending structure of the display panel according to claim 1, characterized in that: The plurality of conductive traces (2) are arranged at intervals along a second direction, and the second direction is orthogonal to the first direction.

4. The bending structure of the display panel according to claim 1, characterized in that: A blocking dam (3) is further provided on one side of the substrate (1); a through slot (301) extending along the first direction is formed on the blocking dam (3); the conductive trace (2) is located in the through slot (301); and in the first direction, the blocking dam (3) and the connecting sub-portion (21) do not overlap; wherein, in the thickness direction of the substrate (1), the distance between the side of the blocking dam (3) facing away from the substrate (1) and the substrate (1) is a first distance, the distance between the side of the conductive trace (2) facing away from the substrate (1) and the substrate (1) is a second distance, and the first distance is not less than the second distance; Preferably, the blocking dam (3) has a blocking side wall (302) on the side pointing to the through slot (301), and at least part of the conductive trace (2) is in contact with the blocking side wall (302); Preferably, the blocking dam (3) comprises a first blocking member (31) and a second blocking member (32) which are arranged opposite to each other, and the through groove (301) is located between the first blocking member (31) and the second blocking member (32); Preferably, a third blocking member (33) is arranged at a distance from at least one of the first blocking member (31) and the second blocking member (32) on a side facing away from the through slot (301); Preferably, the third blocking members (33) are multiple in number and arranged at intervals.

5. The bending structure of the display panel according to claim 1, characterized in that: The low melting point conductive metal includes a gallium-based alloy; and / or the liquid conductive material includes one or more of conductive ink, graphene dispersion, and polyaniline solution; and / or the conductive elastomer includes a conductive OCA material.

6. A display panel, characterized in that: The display panel (10) comprises a display area (101), a bending area (102) and a bonding area (103), wherein the bending area (102) is located between the display area (101) and the bonding area (103), and the bending area (102) comprises the bending structure of the display panel according to any one of claims 1 to 5; The display area (101) and the bonding area (103) are respectively located at two ends of the bending area (102) in the first direction, and one end of the conductive trace (2) in the first direction is located in the display area (101), and the other end is located in the bonding area (103).

7. The display panel according to claim 6, characterized in that: The wiring layer further comprises connecting wirings (4) connected to the conductive wirings (2), wherein the number of the connecting wirings (4) is two and they are respectively located in the display area (101) and the bonding area (103); The conductive trace (2) is connected along the first direction to the connection traces (4) respectively located in the display area (101) and the bonding area (103); Preferably, any one of the connecting traces (4) comprises a matching portion (41) close to the conductive trace (2) and an extending portion (42) away from the conductive trace (2), a third distance between the matching portion (41) and the substrate (1) on a side facing away from the substrate (1), a fourth distance between the extending portion (42) and the substrate (1) on a side facing away from the substrate (1), and the third distance is greater than the fourth distance.

8. A method for preparing a display panel, characterized in that: Used for preparing the display panel (10) according to claim 6 or 7, the preparation method comprising: A substrate (1) comprising a display area (101), a bending area (102) and a bonding area (103), wherein the bending area (102) is located between the display area (101) and the bonding area (103); A routing layer is formed in the bending area (102), the routing layer comprises a conductive routing (2), the material of the conductive routing (2) comprises a first material, and the first material comprises at least one of a low melting point conductive metal, a liquid conductive material and a conductive elastomer; The bending area (102) is bent so that the bonding area (103) and the display area (101) are overlapped.

9. The method for preparing a display panel according to claim 8, characterized in that: The conductive trace (2) comprises only a low-melting-point conductive metal, and the preparation method further comprises heating the bending region (102) to place the conductive trace (2) in a molten state.

10. A display device, characterized in that: It comprises the display panel (10) according to claim 6 or 7, or comprises the display panel (10) prepared by the preparation method according to claim 8 or 9.

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