A method, device, medium and product for predicting the thermal crack propagation direction of a single crystal high-temperature alloy air film pore structure

Abstract

This application discloses a method, device, medium, and product for predicting the direction of thermal crack propagation in a single-crystal superalloy air-film pore structure, relating to the field of crack detection. The method comprises: constructing a finite element model of the single-crystal superalloy air-film pore structure to be predicted; obtaining the stress field at the crack tip in the single-crystal superalloy air-film pore structure to be predicted based on the finite element model; determining the maximum J-integral at the crack tip in the single-crystal superalloy air-film pore structure to be predicted based on the stress field at the crack tip; and determining the direction of thermal crack propagation in the single-crystal superalloy air-film pore structure based on the maximum J-integral at the crack tip in the single-crystal superalloy air-film pore structure to be predicted. This application can improve the accuracy of predicting the direction of thermal crack propagation in a single-crystal superalloy air-film pore structure while saving time and cost.

Description

Technical Field

[0001] The present application relates to the field of crack detection, and in particular to a method, equipment, medium and product for predicting the propagation direction of thermal cracks in a single crystal high-temperature alloy air film pore structure. Background Art

[0002] With the continuous advancement of aero-engine technology, the performance requirements for turbine blade materials are becoming increasingly stringent. Turbine blades operate in high-temperature, high-pressure, and high-stress environments. To extend blade life and improve engine efficiency, film pore structures are typically designed on the blade surface to reduce blade surface temperature through film cooling. However, under long-term high-temperature cycles and complex stresses, film pore structures are prone to thermal fatigue cracking, posing a serious threat to blade safety and stability.

[0003] Predicting the propagation direction of thermal fatigue cracks in film pore structures can effectively prevent turbine blade failure, extend blade service life, and ensure the safety and reliability of aircraft engines. This prediction can help engineers optimize designs and select appropriate materials and manufacturing processes, thereby improving engine performance and efficiency and reducing maintenance costs and risks. Accurate predictions can also guide repair and maintenance work, enabling timely detection and treatment of potential cracks and preventing catastrophic accidents.

[0004] Currently, methods for predicting the thermal fatigue crack propagation direction of film hole structures in aircraft engine turbine blades rely primarily on extensive experiments and empirical formulas. However, the accuracy of these methods decreases significantly when environmental and material conditions vary. Thermal fatigue crack propagation is a key failure mode in engineering materials and structures, particularly under high temperatures and cyclic stress environments, where it can significantly impact the lifespan and safety of materials and structures. Predicting crack propagation direction is crucial for preventing structural failure and optimizing design.

[0005] The existing prediction of thermal crack propagation direction is mainly carried out by conducting thermal fatigue tests at different temperatures and different shapes. This method requires a large number of tests and data collection under different conditions. This traditional experimental method is time-consuming and costly.

[0006] Moreover, experimental data and empirical formulas are usually only accurate and reliable under similar conditions. Once new materials, structural shapes or extreme working conditions (such as higher temperatures or more complex loads) appear, these data and experience may no longer be applicable, and the prediction accuracy will be greatly reduced. Summary of the Invention

[0007] The purpose of this application is to provide a method, equipment, medium and product for predicting the thermal crack propagation direction of a single crystal high-temperature alloy air film pore structure, which can improve the prediction accuracy while saving time and cost.

[0008] To achieve the above objectives, this application provides the following solutions:

[0009] In a first aspect, the present application provides a method for predicting the thermal crack propagation direction of a single crystal high-temperature alloy air film pore structure, comprising:

[0010] Construct a finite element model of the air film pore structure of the single crystal superalloy to be predicted;

[0011] Obtaining a stress field at a crack tip in a gas film pore structure of a single crystal high-temperature alloy to be predicted based on the finite element model;

[0012] Determining the maximum J-integral of the crack tip in the single crystal high-temperature alloy air film pore structure to be predicted based on the stress field at the crack tip;

[0013] Based on the maximum J-integral of the crack tip in the single crystal superalloy air film pore structure to be predicted, the thermal crack propagation direction of the single crystal superalloy air film pore structure is determined.

[0014] Optionally, determining the maximum J-integral at the crack tip in the single crystal high-temperature alloy air film pore structure to be predicted based on the stress field at the crack tip includes:

[0015] The maximum J-integral at the crack tip is determined based on the stress field at the crack tip using a contour integration method.

[0016] Optionally, a finite element model of the air film pore structure of the single crystal high-temperature alloy to be predicted is constructed in Abaqus software.

[0017] Optionally, a finite element model of the air film pore structure of the single crystal superalloy to be predicted is constructed in Abaqus software, including:

[0018] Defining alloy properties and elastic behaviors of the single crystal high-temperature alloy air film pore structure to be predicted at different temperatures; the alloy properties include one or more of conductivity, elastic modulus, shear modulus, yield strength, thermal expansion coefficient, and specific heat;

[0019] Create a model instance of the single crystal superalloy film pore structure to be predicted based on the defined alloy properties and elastic behavior;

[0020] With reference to the thermal fatigue test method, an analysis step is created, and the thermal fatigue test parameters are loaded into the model instance of the single crystal high-temperature alloy air film pore structure to be predicted using the analysis step to obtain an initial thermal fatigue temperature field model;

[0021] Meshing the initial thermal fatigue temperature field model to obtain a thermal fatigue temperature field model;

[0022] A sequential thermal-mechanical coupling method is used to obtain the temperature field results of the single crystal high-temperature alloy air film pore structure to be predicted based on the thermal fatigue temperature field model;

[0023] The stress time length is defined, and a crack is created in the model instance of the single crystal high temperature alloy film pore structure to be predicted to obtain a crack model;

[0024] Importing the temperature field result of the single crystal high temperature alloy air film pore structure to be predicted into the crack model to complete the temperature field definition of the crack model;

[0025] The crack model with the temperature field definition is meshed to obtain a thermal fatigue stress field model with cracks, and the thermal fatigue stress field model with cracks is used as the finite element model.

[0026] Optionally, determining the maximum J-integral at the crack tip in the single crystal high-temperature alloy air film pore structure to be predicted based on the stress field at the crack tip includes:

[0027] Changing the position of the crack in the crack model and re-meshing to obtain a new finite element model;

[0028] Using the same temperature field results, a new finite element model was run to obtain stress fields at different crack tips;

[0029] The J integral of different crack tips is obtained based on the stress field at different crack tips using the contour integration method;

[0030] The maximum J integral at the crack tip is obtained from the J integrals of different crack tips.

[0031] Optionally, the elastic behavior is determined based on an elastic coefficient matrix; the elastic coefficient matrix is ​​determined based on elastic modulus, Poisson's ratio and shear modulus.

[0032] Optionally, the analysis step includes a heating phase and a cooling phase.

[0033] In a second aspect, the present application provides a computer device comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the above-mentioned method for predicting the thermal crack propagation direction of the single crystal high-temperature alloy air film pore structure.

[0034] In a third aspect, the present application provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the above-mentioned method for predicting the thermal crack propagation direction of the single crystal high-temperature alloy air film pore structure.

[0035] In a fourth aspect, the present application provides a computer program product, comprising a computer program, which, when executed by a processor, implements the above-mentioned method for predicting the thermal crack propagation direction of the single crystal high-temperature alloy air film pore structure.

[0036] According to the specific embodiments provided in this application, this application discloses the following technical effects:

[0037] This application provides a method, device, medium, and product for predicting the direction of thermal crack propagation in a single-crystal superalloy film pore structure. By determining the J-integral at the crack tip through numerical simulation and finite element analysis, this method provides priority information on the crack propagation direction, accurately predicting the direction of thermal fatigue crack propagation, and thus guiding structural design and life assessment. Furthermore, by determining the thermal crack propagation direction based on the maximum J-integral, directional prediction can be achieved without extensive testing, significantly reducing prediction time and costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0039] Figure 1 This is an application environment diagram of a method for predicting the thermal crack propagation direction of a single crystal high-temperature alloy air film pore structure in one embodiment of the present application;

[0040] Figure 2 A schematic flow chart of a method for predicting the thermal crack propagation direction of a single crystal high-temperature alloy air film pore structure provided in one embodiment of the present application;

[0041] Figure 3 Schematic diagram of thermal fatigue test of air film holes in a plate provided in one embodiment of the present application;

[0042] Figure 4 A schematic diagram of a temperature field model of a thermal fatigue unit provided in another embodiment of the present application;

[0043] Figure 5 A schematic diagram of a temperature field model after assembly is provided for an embodiment of the present application;

[0044] Figure 6 A schematic diagram of a thermal fatigue temperature field model is provided for an embodiment of the present application;

[0045] Figure 7 A schematic diagram of thermal fatigue temperature field results is provided for another embodiment of the present application;

[0046] Figure 8 A schematic diagram of a thermal fatigue stress field model with thermal cracks is provided for another embodiment of the present application;

[0047] Figure 9 A schematic diagram of a crack assignment interface is provided for another embodiment of the present application;

[0048] Figure 10 A schematic diagram of an interface for creating a predefined scene is provided for another embodiment of the present application;

[0049] Figure 11 A schematic diagram of a thermal fatigue stress field model with cracks is provided for another embodiment of the present application;

[0050] Figure 12 A schematic diagram of thermal fatigue stress field results with cracks is provided for another embodiment of the present application;

[0051] Figure 13 A schematic diagram of a curve showing the change of the J-integral at the thermal crack tip over time is provided for another embodiment of the present application;

[0052] Figure 14 A schematic diagram of cracks at different positions is provided for another embodiment of the present application;

[0053] Figure 15 A schematic diagram of the structure of a computer device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0054] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0055] The J-integral, a key parameter in fracture mechanics, effectively describes the stress and strain state near the crack tip and is used to predict crack propagation behavior. Finite element analysis (FEA) reduces the need for extensive experimental data, saving time and costs. Furthermore, FEA simulations allow for rapid evaluation of various operating conditions and materials, significantly shortening design cycles.

[0056] Based on the above description, numerical simulation and finite element analysis can be used to calculate the J-integral of the crack tip to provide priority information on the direction of crack propagation. When the J-integral of the crack tip reaches a certain critical value (usually denoted as JIC), the crack will propagate along the direction of maximum stress intensity. By analyzing the J-integral distribution on different crack propagation paths, the direction in which the crack is most likely to propagate can be determined. This method can not only be applied to conventional materials, but is also particularly suitable for engineering practices such as complex air film pore structures. By simulating the J-integral of the crack tip, the propagation direction of thermal fatigue cracks can be effectively predicted, thereby guiding structural design and life assessment.

[0057] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0058] The method for predicting the thermal crack propagation direction of the single crystal high temperature alloy air film pore structure provided in the embodiment of the present application can be applied to Figure 1 In the application environment shown. Among them, the terminal 102 communicates with the server 104 through the network. The data storage system can store the data that the server 104 needs to process. The data storage system can be set up separately, integrated on the server 104, or placed on the cloud or other servers. The terminal 102 can send the structural parameters of the single crystal high-temperature alloy air film pore structure to be predicted to the server 104. After the server 104 receives the structural parameters of the single crystal high-temperature alloy air film pore structure to be predicted, it constructs a finite element model of the single crystal high-temperature alloy air film pore structure to be predicted. Based on the finite element model, the stress field of the crack tip in the single crystal high-temperature alloy air film pore structure to be predicted is obtained. Based on the stress field of the crack tip, the maximum J integral of the crack tip in the single crystal high-temperature alloy air film pore structure to be predicted is determined. Based on the maximum J integral of the crack tip in the single crystal high-temperature alloy air film pore structure to be predicted, the thermal crack propagation direction of the single crystal high-temperature alloy air film pore structure is determined. The server 104 can feed back the obtained thermal crack propagation direction prediction result to the terminal 102. In addition, in some embodiments, the method for predicting the thermal crack propagation direction of the single crystal high-temperature alloy air film pore structure provided in the present application can also be implemented independently by the server 104 or the terminal 102. For example, the terminal 102 can directly predict the thermal crack propagation direction based on the structural parameters of the single crystal high-temperature alloy air film pore structure to be predicted, or the server 104 can obtain the structural parameters of the single crystal high-temperature alloy air film pore structure to be predicted from the data storage system, and predict the thermal crack propagation direction based on the structural parameters of the single crystal high-temperature alloy air film pore structure to be predicted.

[0059] Terminal 102 may include, but is not limited to, various desktop computers, laptops, smartphones, tablet computers, IoT devices, and portable wearable devices. IoT devices may include smart speakers, smart TVs, smart air conditioners, and smart car devices. Portable wearable devices may include smart watches, smart bracelets, and head-mounted devices. Server 104 may be implemented as a standalone server or a server cluster consisting of multiple servers, or may be a cloud server.

[0060] In an exemplary embodiment, Figure 2 As shown, a method for predicting the thermal crack propagation direction of a single crystal high temperature alloy film pore structure is provided. The method is executed by a computer device, specifically, it can be executed by a computer device such as a terminal or a server alone, or it can be executed by a terminal and a server together. In the embodiment of the present application, the method is applied to Figure 1 The server 104 in the example is used as an example to illustrate the process, including the following steps 200 to 203.

[0061] Step 200: Construct a finite element model of the single crystal high temperature alloy air film pore structure to be predicted.

[0062] Step 201: Obtaining the stress field at the crack tip in the air film pore structure of the single crystal high-temperature alloy to be predicted based on the finite element model.

[0063] Step 202: Determine the maximum J-integral at the crack tip in the single crystal high-temperature alloy air film pore structure to be predicted based on the stress field at the crack tip.

[0064] Step 203: Determine the thermal crack propagation direction of the single crystal high temperature alloy air film pore structure based on the maximum J-integral of the crack tip in the single crystal high temperature alloy air film pore structure to be predicted.

[0065] Implementing the above steps 200 to 203 can improve prediction accuracy while saving time and cost, thereby guiding structural design and life assessment.

[0066] In another exemplary embodiment of the present application, in order to accurately predict the crack propagation path and overcome the prediction inaccuracy problem in traditional methods, the present application determines the maximum J integral of the crack tip based on the stress field of the crack tip through the contour integration method.

[0067] In another exemplary embodiment of the present application, in order to significantly reduce the cost and time consumption of actual experiments, the present application constructs a finite element model of the single crystal high-temperature alloy air film pore structure to be predicted in Abaqus software.

[0068] In another exemplary embodiment of the present application, Figure 3The V-notch thermal fatigue specimen (hereinafter referred to as the specimen) shown in FIG3 is used as an example to illustrate the visual process of the prediction method provided above. The thickness of the specimen and the diameter of the air film holes can be adjusted according to actual conditions and are not limited to those shown in FIG3. Compared to a traditional V-notch, the specimen's air film hole structure better simulates thermal fatigue under actual use conditions.

[0069] The sequential thermal-mechanical coupling method is used to first calculate the specimen's temperature field, followed by the specimen's stress field. The maximum J-integral at the crack tip near the film hole is calculated using the contour integral method, denoted as Jmax. The Jmax value typically represents the driving force for crack propagation and can be used to predict the propagation direction of thermal fatigue cracks in film holes.

[0070] In another exemplary embodiment of the present application, Figure 3 Taking the plate V-notch thermal fatigue specimen (hereinafter referred to as the specimen) as an example, referring to the above thermal fatigue test method, and using Abaqus software as the implementation object, the process of constructing the finite element model in the above step 200 is described.

[0071] (1) Create components: In the component module of Abaqus software, draw Figure 4 Model example shown.

[0072] (2) Property definition: Create a new material in the property module of Abaqus software. Taking the second-generation Ni-based single crystal high-temperature alloy IC21 as an example, define the properties of the alloy at different temperatures in the material properties, such as conductivity λ, elastic modulus E, shear modulus G, yield strength σ 0.2 , thermal expansion coefficient α and specific heat C. The specific parameters are shown in Table 1. Since single crystal high temperature alloys have significant mechanical anisotropy, anisotropy needs to be considered when defining their elastic behavior. The orthogonal elastic module is used to define their elastic behavior through the elastic coefficient matrix.

[0073] This step essentially defines the alloy properties and elastic behavior of the single crystal superalloy film pore structure to be predicted at different temperatures. Alloy properties include one or more of conductivity, elastic modulus, shear modulus, yield strength, thermal expansion coefficient, and specific heat.

[0074] Table 1 Thermophysical parameters required for thermal fatigue finite element model

[0075] T / ℃ <![CDATA[σ 0.2 / MPa]]> E / GPa G / GPa ν <![CDATA[α / 10 -6 ·℃ -1 ]]> λ / mW / (mm·K) C / kJ / (t·℃) 20 537 129 127 0.39 / 10.24 / 100 / 127 125 0.39 11.68 11.03 497 500 / 117 113 0.40 12.98 11.64 391 760 974 / / / / / / 980 670 / / / / / / 1000 / 92.8 92.8 0.41 14.72 17.97 539 1100 330 83.2 90.1 0.42 15.37 / 588

[0076] The mechanical properties of single crystal superalloys show obvious anisotropy, and their elastic coefficient matrix can be expressed as:

[0077]

[0078] Among them, C represents the elastic coefficient matrix, and the elastic constant C 11 、C 12 、C 44 According to the elastic modulus E, Poisson's ratio υ and shear modulus G of the alloy, we have:

[0079]

[0080]

[0081] C 44 =G.

[0082] (3) Assemble components: Click “Create Instance” in the assembly module of Abaqus software. Figure 4 As shown in the figure, it can be assembled directly. Figure 5 shown.

[0083] This step is mainly to create a model instance of the single crystal high-temperature alloy air film pore structure to be predicted based on the defined alloy properties and elastic behavior.

[0084] (4) With reference to the thermal fatigue test method, an analysis step is created, and the thermal fatigue test parameters are loaded into the model instance of the single crystal high-temperature alloy air film pore structure to be predicted using the analysis step to obtain the initial thermal fatigue temperature field model.

[0085] For example, in the Abaqus software, click "Create Analysis Step" to create two analysis steps, Step-1 and Step-2. Referring to the thermal fatigue test method, Step-1 is the heating phase, with a duration set to t1. Step-2 is the cooling phase, with a duration set to t2, corresponding to the thermal fatigue heating phase and thermal fatigue cooling phase, respectively.

[0086] To set up the interaction, in the Abaqus interaction module, click "Create Interaction Properties" to define the surface heat exchange conditions between the model and the environment. For the heating phase of Step-1, the heat transfer coefficient can be set to a fixed value of 0.2. For the cooling phase of Step-2, due to the complex heat exchange between the model and water, the heat transfer coefficient should be set as a temperature-dependent function as shown in Table 2. Finally, click "Create Interaction" and select "Surface Heat Exchange Conditions." Define the ambient temperature of Step-1 to 1000 and the heat transfer coefficient to 0.2. Define the ambient temperature of Step-2 to 25 and the heat transfer coefficient to the function shown in Table 2.

[0087] Table 2 Heat exchange coefficient between cooling stage model and water

[0088]

[0089]

[0090] (5) The initial thermal fatigue temperature field model is meshed to obtain the thermal fatigue temperature field model.

[0091] For example, in the mesh module of Abaqus software, the initial thermal fatigue temperature field model is meshed. The sequential thermal-mechanical coupling needs to simulate the temperature field of the initial thermal fatigue temperature field model first. Therefore, the unit type selected is the DC3D8R hexahedron unit of the heat transfer type, and the mesh at the film hole is refined, such as Figure 6 shown.

[0092] (6) The temperature field results of the single crystal high-temperature alloy air film pore structure to be predicted are obtained by using the sequential thermomechanical coupling method based on the thermal fatigue temperature field model.

[0093] For example, calculate the thermal fatigue temperature field model. In the job module of Abaqus software, select the thermal fatigue temperature field model just established, create a job and click "Submit", run the thermal fatigue temperature field model, and obtain the temperature field results (the software will automatically output the result file). The effect is as follows Figure 7 shown.

[0094] (7) The stress time length is defined, and a crack is created in the model instance of the single crystal high temperature alloy air film pore structure to be predicted to obtain a crack model.

[0095] For example, in the component module of Abaqus software, a crack plane is created on the edge of the air film hole by cutting and splitting the original component (i.e., model instance), such as Figure 8 As shown, the length of the crack is 100 μm.

[0096] Set the analysis step. In the analysis step module of the Abaqus software, set the time lengths of the original Step-1 and Step-2 to 1. This is because the temperature field at each moment has been output during the temperature field simulation, so the time length can be set to 1 when simulating stress. Select "J integral" to output in the history output.

[0097] Define the crack. In the interaction module of Abaqus software, create a plane (such as Figure 8 The red dotted box in the middle is assigned as a crack, and the crack type is selected as cloud integral. This behavior lets the software know that the newly created plane exists in the form of a crack. The crack assignment method is as follows Figure 9 shown.

[0098] (8) The temperature field results of the single crystal high-temperature alloy air film pore structure to be predicted are imported into the crack model to complete the temperature field definition of the crack model.

[0099] For example, in the load module of Abaqus software, the temperature field results calculated by the corresponding temperature field model are imported, wherein the temperature field results are imported into the "Load" module of the crack model. Click "Create Predefined Field", select the predefined temperature, read from the result or output database file, and then select the previously output temperature field result file to complete the temperature field definition of the crack model. Among them, the interface for creating a predefined field is as follows Figure 10 shown.

[0100] (9) The crack model with the temperature field definition is meshed to obtain a thermal fatigue stress field model with cracks, and the thermal fatigue stress field model with cracks is used as a finite element model.

[0101] For example, in the mesh module of Abaqus software, the crack model is re-meshed to obtain the thermal fatigue stress field model with cracks. The thermal fatigue stress field model with cracks is as follows: Figure 11 As shown in the figure, since the J-integral at the crack tip requires the contour integration method, the mesh around the crack tip is specially divided, with numerous circles (i.e., contours) drawn around the thermal fatigue crack tip. The element properties are defined as C3D8R under the 3D stress type for stress field calculations and crack tip J-integral calculations.

[0102] Based on the above description, the J integral at the crack tip can be calculated by running the thermal fatigue stress field model with cracks. For example, in the job module of Abaqus software, select the thermal fatigue stress field model with cracks just established, create a job and click "Submit", run the thermal fatigue stress field model with cracks, and get the following Figure 12 The stress field results shown are Figure 13 The J-integral data shown here. The first 55 seconds represent the thermal fatigue heating phase, while the last 5 seconds represent the thermal fatigue cooling phase. The maximum J-integral (i.e., the maximum J-integral) occurs at the beginning of the cooling phase, with a value of 0.30.

[0103] Furthermore, the J integral of the crack tip is calculated when the thermal crack is at different positions. For example, the position of the thermal crack is changed, and the meshing and the J integral of the crack tip are re-calculated. Figure 14 As shown, the crack is defined at different locations along the edge of the film hole. Since the dimensions of the thermal fatigue stress field model with the crack remain unchanged, the stress field and J-integral can be recalculated using the same temperature field results. Since the thermal fatigue stress field model with the crack is symmetrical from top to bottom, only the upper half of the film hole needs to be calculated. Ultimately, the Jmax at the crack tip can be determined for different locations of the thermal fatigue crack.

[0104] Based on the above description, by comparing the Jmax values ​​at the thermal crack tip at different locations, the preferred direction of thermal crack propagation can be determined. Specifically, by comparing the Jmax values ​​at the crack tip when the thermal fatigue crack is at different locations, the thermal fatigue crack tends to propagate along the direction with the maximum Jmax value.

[0105] In summary, this application introduces an air-film pore structure in the design of thermal fatigue specimens, which can more accurately simulate the thermal fatigue conditions experienced in actual use compared to traditional V-notch specimens. Using finite element simulation technology, combined with the sequential thermal-mechanical coupling method and the contour integration method, the J-integral at the crack tip is calculated, providing a novel method for predicting the direction of thermal crack growth, significantly improving the accuracy and reliability of thermal crack growth prediction.

[0106] Furthermore, compared to traditional methods, this application can more realistically reflect the fatigue behavior of materials in high-temperature environments, and significantly reduces the cost and time of actual experiments through finite element simulation. Furthermore, the contour integral method accurately predicts the crack propagation path, overcoming the inaccurate predictions in traditional methods and significantly improving experimental efficiency, providing a more efficient and economical solution for related research fields.

[0107] Furthermore, in the aerospace field, this application can be used to evaluate and improve the thermal fatigue performance of high-temperature components such as aircraft engine turbine blades. By simulating the high-temperature and high-pressure environments of actual flight conditions, fatigue crack propagation paths in components can be predicted, assisting in targeted design of the preferred directions and areas of thermal crack propagation, thereby improving component safety and reliability.

[0108] In an exemplary embodiment, a computer device is provided. The computer device may be a server or a terminal. The internal structure diagram thereof may be as follows: Figure 15 As shown. The computer device includes a processor, a memory, an input / output interface (Input / Output, abbreviated as I / O) and a communication interface. The processor, memory and input / output interface are connected through a system bus, and the communication interface is connected to the system bus through the input / output interface. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and computer program in the non-volatile storage medium. The database of the computer device is used to store prediction data of the thermal crack extension direction. The input / output interface of the computer device is used to exchange information between the processor and an external device. The communication interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a method for predicting the thermal crack extension direction of a single crystal high-temperature alloy air film pore structure is realized.

[0109] Those skilled in the art will understand that Figure 15 The structure shown in the figure is merely a block diagram of a portion of the structure related to the solution of the present application and does not constitute a limitation on the computer device to which the solution of the present application is applied. A specific computer device may include more or fewer components than shown in the figure, or combine certain components, or have a different component arrangement. In an exemplary embodiment, a computer device is provided, including a memory and a processor. The memory stores a computer program, and the processor implements the steps of the above-mentioned method embodiments when executing the computer program.

[0110] In an exemplary embodiment, a computer-readable storage medium is provided, storing a computer program. When the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0111] In an exemplary embodiment, a computer program product is provided, including a computer program. When the computer program is executed by a processor, the steps in the above method embodiments are implemented.

[0112] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with relevant regulations.

[0113] Those skilled in the art will understand that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, database or other media used in the embodiments provided in this application may include at least one of non-volatile and volatile memory. Non-volatile memory may include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory may include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM may be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0114] The databases involved in the various embodiments provided herein may include at least one of a relational database and a non-relational database. Non-relational databases may include, but are not limited to, distributed databases based on blockchains. The processors involved in the various embodiments provided herein may include, but are not limited to, general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic units, data processing logic units based on quantum computing, and the like.

[0115] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0116] This document uses specific examples to illustrate the principles and implementation methods of this application. The description of the above examples is only intended to help understand the method and core concept of this application. At the same time, for those skilled in the art, based on the concept of this application, there may be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting this application.

Claims

1. A method for predicting the thermal crack propagation direction of a single crystal high-temperature alloy air film pore structure, characterized in that: The method for predicting the thermal crack propagation direction of the single crystal high-temperature alloy air film pore structure includes: Construct a finite element model of the air film pore structure of the single crystal superalloy to be predicted; Obtaining a stress field at a crack tip in a gas film pore structure of a single crystal high-temperature alloy to be predicted based on the finite element model; Determining the maximum J-integral of the crack tip in the single crystal high-temperature alloy air film pore structure to be predicted based on the stress field at the crack tip; Determine the thermal crack propagation direction of the single crystal superalloy air film pore structure based on the maximum J-integral of the crack tip in the air film pore structure to be predicted; Among them, in Abaqus software, a finite element model of the single crystal superalloy air film pore structure to be predicted is constructed, including: Defining alloy properties and elastic behaviors of the single crystal high-temperature alloy air film pore structure to be predicted at different temperatures; the alloy properties include one or more of conductivity, elastic modulus, shear modulus, yield strength, thermal expansion coefficient, and specific heat; Create a model instance of the single crystal superalloy film pore structure to be predicted based on the defined alloy properties and elastic behavior; With reference to the thermal fatigue test method, an analysis step is created, and the thermal fatigue test parameters are loaded into the model instance of the single crystal high-temperature alloy air film pore structure to be predicted using the analysis step to obtain an initial thermal fatigue temperature field model; Meshing the initial thermal fatigue temperature field model to obtain a thermal fatigue temperature field model; A sequential thermal-mechanical coupling method is used to obtain the temperature field results of the single crystal high-temperature alloy air film pore structure to be predicted based on the thermal fatigue temperature field model; The stress time length is defined, and a crack is created in the model instance of the single crystal high temperature alloy film pore structure to be predicted to obtain a crack model; Importing the temperature field result of the single crystal high temperature alloy air film pore structure to be predicted into the crack model to complete the temperature field definition of the crack model; The crack model with the temperature field definition is meshed to obtain a thermal fatigue stress field model with cracks, and the thermal fatigue stress field model with cracks is used as the finite element model.

2. The method for predicting the thermal crack propagation direction of a single crystal high-temperature alloy film pore structure according to claim 1, characterized in that: Determining the maximum J-integral of the crack tip in the single crystal high-temperature alloy air film pore structure to be predicted based on the stress field at the crack tip includes: The maximum J-integral at the crack tip is determined based on the stress field at the crack tip using a contour integration method.

3. The method for predicting the thermal crack propagation direction of the single crystal high-temperature alloy film pore structure according to claim 1, characterized in that: Determining the maximum J-integral of the crack tip in the single crystal high-temperature alloy air film pore structure to be predicted based on the stress field at the crack tip includes: Changing the position of the crack in the crack model and re-meshing to obtain a new finite element model; Using the same temperature field results, a new finite element model was run to obtain stress fields at different crack tips; The J integral of different crack tips is obtained based on the stress field at different crack tips using the contour integration method; The maximum J integral at the crack tip is obtained from the J integrals of different crack tips.

4. The method for predicting the thermal crack propagation direction of a single crystal high-temperature alloy film pore structure according to claim 1, characterized in that: The elastic behavior is determined based on an elastic coefficient matrix; the elastic coefficient matrix is ​​determined based on elastic modulus, Poisson's ratio and shear modulus.

5. The method for predicting the thermal crack propagation direction of the single crystal high-temperature alloy film pore structure according to claim 1, characterized in that: The analysis step includes a heating phase and a cooling phase.

6. A computer device comprising: A memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the method for predicting the thermal crack propagation direction of the single crystal high-temperature alloy air film pore structure according to any one of claims 1 to 5.

7. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method for predicting the thermal crack propagation direction of the single crystal high-temperature alloy air film pore structure according to any one of claims 1 to 5 is implemented.

8. A computer program product comprising a computer program, characterized in that When the computer program is executed by a processor, the method for predicting the thermal crack propagation direction of the single crystal high-temperature alloy air film pore structure according to any one of claims 1 to 5 is implemented.

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