Preparation process of self-repairing intelligent cable and intelligent repairing system thereof

Abstract

The invention discloses a preparation process of a self-repairing intelligent cable and an intelligent repairing system of the self-repairing intelligent cable. The preparation process of the self-repairing intelligent cable comprises the steps of conductor pretreatment, preparation of the inner-layer basic insulating layer, preparation of the middle intelligent regulation and control layer, preparation of the outer-layer repairing layer and preparation of the outermost-layer protective layer. The intelligent repairing system of the self-repairing intelligent cable comprises the steps of damage sensing, repairing strategy selection, repairing triggering and dynamic modeling, performance optimization and closed-loop feedback. The preparation technology of the self-repairing intelligent cable has the following beneficial effects that the preparation technology of the self-repairing intelligent cable can have efficient self-repairing capability and a long-acting protection effect in an extreme environment. The intelligent repairing system can automatically adjust a repairing strategy according to changes of environmental conditions, and it is ensured that the cable can keep good self-repairing capacity in various severe environments.

Description

Technical Field

[0001] The present invention relates to the field of cable preparation, and in particular to a preparation process of a self-repairing intelligent cable and an intelligent repair system thereof. Background Art

[0002] Cable self-repair technology is an important means to improve the service life and reliability of cables. Currently, it mainly adopts two methods: microcapsule repair and dynamic key repair. These repair methods perform well in conventional environments, but face serious challenges under extreme environmental conditions.

[0003] The existing microcapsule repair process is to add microcapsules containing repair agents to the cable insulation material. When the cable is damaged, the microcapsules rupture and release the repair agent to achieve self-repair. However, in extreme environments, this repair method has obvious defects: in high temperature environments, the microcapsule wall is easy to soften and deform, causing the repair agent to leak prematurely; in low temperature environments, the fluidity of the repair agent is significantly reduced, making it difficult to fully fill the damaged area; and in strong vibration or high pressure environments, the microcapsules may rupture in a concentrated manner, causing the repair capacity to be exhausted prematurely.

[0004] The dynamic bond repair process achieves repair by introducing reversible chemical bonds into the molecular structure of the material. However, in extreme environments, this repair mechanism also faces serious problems: high temperatures will accelerate the degradation of dynamic bonds, resulting in unstable material structures; low temperatures will inhibit the recombination reaction of dynamic bonds, causing the repair process to stagnate; and in strong radiation or chemical corrosion environments, the reversibility of dynamic bonds may be permanently lost, completely losing the ability to repair.

[0005] Under extreme conditions, environmental factors have different effects on the two repair mechanisms, which may lead to an imbalance in the repair process: for example, under high temperature conditions, the repair agent released by the premature rupture of the microcapsules will interfere with the reorganization process of the dynamic bonds, which will reduce the overall repair effect. Secondly, the two repair mechanisms have different adaptability ranges to environmental conditions, making it difficult to find the best working window: when the environmental parameters are adjusted to ensure the effect of one repair mechanism, the performance of another repair mechanism may be impaired.

[0006] In addition, the synergy of the two repair methods is more difficult to control in extreme environments, which can easily lead to uneven repair or unstable repair quality. Especially in situations where environmental conditions change rapidly, it is difficult for the repair system to adjust its response strategy in time and cannot guarantee a sustained and effective repair effect.

[0007] Therefore, it is of great significance to develop an intelligent repair system that can maintain stable repair performance in extreme environments and achieve the coordinated work of two repair mechanisms. Summary of the invention

[0008] One of the purposes of the present invention is to provide a preparation process of a self-repairing intelligent cable and an intelligent repair system thereof. The preparation process of the self-repairing intelligent cable can have efficient self-repairing ability and long-term protection in extreme environments.

[0009] The above technical objectives of the present invention are achieved through the following technical solutions: A preparation process of a self-repairing intelligent cable, prepared from the inner layer to the outside according to the weight ratio, includes the following steps: Step 1, conductor pretreatment, including: annealing in an inert atmosphere to eliminate the internal stress of the conductor, removing the oxide on the surface of the conductor by acid solution and neutralizing and rinsing, treating the cleaned conductor with argon plasma, arranging and fixing the optical fiber sensor coated with a 10-20μm thick polyimide protective layer along the surface of the conductor, and coating the outer layer with a 20-30μm thick polyurethane or polyimide protective film; Step 2, preparation of the inner basic insulating layer, including: stirring at 100-120°C 1-1.5 hours, prepare a dynamic bond network prepolymer composed of 60-70 parts of unsaturated polyester resin, 15-20 parts of maleimide modifier, 10-15 parts of diene monomer, 2-3 parts of photoinitiator, 1-2 parts of thermal initiator and 0.5-1 parts of free radical scavenger; UV curing, extrusion; Step three, preparation of the intermediate intelligent control layer, including: preparing a thermosensitive phase change material, composed of 45-50 parts of n-octadecane, 25-30 parts of paraffin, 15-20 parts of polyethylene glycol and 3-5 parts of nano carbon fiber, at 70-75 ° C for 1000-1200s -1The method comprises mixing at a shear rate and forced cooling at 5-10°C / min; preparing a stress dispersion network, which is made by mixing 55-60 parts of a thermoplastic elastomer and 8-10 parts of a nano-layered silicate at 160-180°C for 15-20 minutes; preparing and arranging a micro-heating unit, including sputtering a 10-20μm thick nickel-chromium alloy film or spin-coating a 1-5μm thick gold nanorod coating, laser etching into a serpentine or grid shape, and coating a 10-20μm thick polyimide insulating layer to obtain a micro-heating unit; using a multi-layer co-extrusion technology to co-extrude the above materials at a rate of 10-15m / min at 150-160°C; step four, preparing an outer repair layer, including: preparing a double-walled microcapsule under an emulsion polymerization method, the inner layer repair agent is composed of 70-80 parts of an epoxy resin, 20-25 parts of an imidazole curing agent, 3-5 parts of nano-silica and 2-3 parts of a polyether-modified silicone oil, and the inner wall material is composed of octadecyl normal structure The invention discloses a composite insulating layer comprising 60-70 parts of alkane, 25-30 parts of polyvinyl alcohol, 5-8 parts of nano-alumina and 2-3 parts of glutaraldehyde, wherein the outer wall material comprises 65-75 parts of melamine-formaldehyde prepolymer, 3-5 parts of nano-graphene oxide and 8-10 parts of nano-zirconium oxide; and a composite insulating layer comprising 50-60 parts of low-density polyethylene, 20-20 parts of ethylene-vinyl acetate copolymer and 10 parts of ethylene-vinyl acetate copolymer. 5 parts, double-walled microcapsules 10-15 parts, nano aluminum nitride 3-5 parts, antioxidant 0.5-1 parts and maleic anhydride grafted PE compatibilizer 1-2 parts; extrusion molding at 140-150 ° C at a rate of 12-15m / min; step five, the outermost protective layer preparation, including: plasma treatment, post-coating with silicone modified acrylic resin coating, sealing packaging, and using polytetrafluoroethylene tube to encapsulate the optical fiber and the heating unit interface and connect the external demodulator.

[0010] The present invention is further configured as follows: the annealing, cleaning and plasma treatment in the conductor pretreatment step are specifically: annealing treatment in an inert atmosphere or vacuum environment at 300-400°C for 10-20 minutes; chemical cleaning with 5%-10% dilute nitric acid or 5%-8% phosphoric acid solution and then neutralization, and rinsing with deionized water; surface activation by 60-80W argon plasma treatment for 30-60 seconds.

[0011] The present invention is further configured as follows: the UV curing and extrusion steps are: using 2000-2500mW / cm² intensity UV light for 15-20 minutes, then thermally curing at 140-150°C for 30-40 minutes; and extruding and molding at 100-110°C at a rate of 15-20m / min.

[0012] The present invention is further configured such that the particle size of the double-walled microcapsules is controlled within the range of 5-10 μm.

[0013] The present invention is further configured as follows: the plasma treatment in the outermost protective layer preparation step and the coating of the silicone-modified acrylic resin coating are specifically as follows: 80-100W argon plasma treatment is used for 15-20 seconds, and the working gas pressure is 30-40Pa; a 20-25μm thick silicone-modified acrylic resin coating is coated, pre-dried at 60-65°C for 10-15 minutes, and then cured at 120-130°C for 20-30 minutes.

[0014] One of the purposes of the present invention is to provide a self-repairing intelligent cable, and the technical effects in each step are as follows: Step 1: Conductor pretreatment 1. Annealing treatment: Annealing in an inert atmosphere or vacuum environment at 300-400℃ effectively eliminates the internal stress of the conductor material, improves the structural uniformity and stability of the conductor, and provides a good foundation for the subsequent coating and repair functions.

[0015] 2. Chemical cleaning: Dilute nitric acid or phosphoric acid solution is used to remove oxides, pollutants and impurities on the surface of the conductor, improve the cleanliness of the conductor surface, improve the adhesion of subsequent coatings, and enhance the bonding effect between the optical fiber sensor and the conductor.

[0016] 3. Argon plasma treatment: Plasma treatment further improves the surface energy and chemical activity of the conductor by introducing active groups on the conductor surface, providing stronger bonding force for the coating of the optical fiber sensor and the protective layer.

[0017] 4. Fiber optic sensor layout and protection: The coating and fixation of the optical fiber sensor provides real-time damage monitoring function for the cable. The polyimide or polyurethane protective film coated on the outside not only ensures the mechanical protection of the sensor, but also ensures its long-term operation stability in extreme environments.

[0018] Step 2: Preparation of the inner basic insulation layer 1. Preparation of dynamic bond network prepolymer: In the inner basic insulation layer, a dynamic bond network (based on Diels-Alder reaction) is introduced to construct a reversible chemical bond structure through the synergistic effect of unsaturated polyester resin, maleimide modifier and diene monomer. This network gives the material molecular-level self-repairing ability, which can break and reassemble in high temperature environment to repair microcracks and material damage.

[0019] 2. Photoinitiation and thermal curing: The combination of UV light and thermal curing ensures complete crosslinking of the dynamic bond prepolymer, forming a base insulation layer with high strength and high stability. The photoinitiation stage controls the uniformity of the initial polymerization reaction, while thermal curing further enhances the mechanical properties and heat resistance of the material.

[0020] 3. Extrusion molding: It is formed at a certain speed at 100-110℃ to ensure the uniformity and dimensional stability of the inner insulation layer, while providing a reliable basic support for the subsequent multi-layer structure.

[0021] Step 3: Preparation of the intermediate intelligent control layer 1. Preparation of temperature-sensitive phase change materials: The thermosensitive phase change material is designed with a ratio of n-octadecane, paraffin and polyethylene glycol, which gives the control layer the ability to absorb and release heat. In a high temperature environment, the material absorbs heat through phase change to reduce local thermal stress; in a low temperature environment, it releases heat to maintain the temperature conditions required for the repair reaction.

[0022] 2. Preparation of stress dispersion network: Thermoplastic elastomers and nano-layered silicates synergistically construct a stress dispersion network that can disperse concentrated stress under strong vibration or mechanical shock, prevent rapid crack expansion, and provide a stable mechanical environment for the repair process.

[0023] 3. Arrangement of micro heating unit: The micro-heating unit achieves precise heating of the crack area through the serpentine grid design of nickel-chromium alloy film or gold nanorods. The unit can actively trigger dynamic bond breaking and recombination reactions, while causing the outer wall of the microcapsule to rupture, releasing the repair agent, and providing thermodynamic support for the repair reaction.

[0024] 4. Multi-layer co-extrusion molding: The multi-layer co-extrusion technology is used at 150-160°C to form the intelligent control layer, ensuring the close integration of the temperature-sensitive material, stress dispersion network and heating unit, avoiding interlayer separation and improving the overall structural stability.

[0025] Step 4: Preparation of the outer repair layer 1. Preparation of double-walled microcapsules: The double-wall design of the microcapsules (inner and outer wall materials) enhances their stability in extreme environments such as high temperature and vibration. The outer wall (melamine-formaldehyde prepolymer and nanofiller) ensures that the microcapsules do not break prematurely under extreme conditions, while the inner wall (octadecyl n-alkane and polyvinyl alcohol) releases repair agents at the cracks. The inner layer repair agent (epoxy resin and imidazole curing agent) forms a highly cross-linked network through chemical reaction, quickly filling cracks and restoring material properties.

[0026] 2. Preparation of composite insulation layer: In the composite insulation layer, the microcapsules are combined with matrix materials such as low-density polyethylene and ethylene-vinyl acetate copolymer, which not only improves the mechanical properties and anti-aging properties of the layer, but also enhances the thermal conductivity and heat resistance through nanofillers (such as nano-aluminum nitride).

[0027] 3. Extrusion molding: Extrusion at 140-150℃ ensures the uniformity and stability of the outer repair layer, while ensuring its ability to resist crack propagation in extreme environments.

[0028] Step 5: Preparation of the outermost protective layer 1. Plasma treatment: Plasma treatment cleans and activates the surface, enhancing the bonding between the outermost protective coating and the repair layer, avoiding interface delamination problems and improving the durability of the overall structure.

[0029] 2. Silicone modified acrylic resin coating: The outermost coating provides excellent chemical corrosion resistance, UV resistance and oxidation resistance, effectively shielding the external environment from erosion of the internal materials. The high flexibility and chemical stability of the coating ensure the long-term performance of the cable in high and low temperature and chemical corrosion environments.

[0030] 3. Interface encapsulation: The interface between the optical fiber and the heating unit is encapsulated by a polytetrafluoroethylene tube, which prevents the interface from being damaged by the external environment. At the same time, real-time monitoring and control functions are realized by connecting an external demodulator.

[0031] Through the effects of the above steps, the present invention realizes the efficient self-repair function of the cable material. The inner dynamic bond network provides molecular-level self-repair capabilities, the middle intelligent control layer optimizes the repair environment through thermal regulation and stress dispersion, and the outer repair layer and protective layer provide long-term protection and crack healing capabilities for the material. The multi-level intelligent repair system significantly improves the performance stability and service life of the cable under extreme conditions such as high temperature, low temperature, strong vibration, radiation and chemical corrosion. At the same time, optical fiber sensors are arranged at the conductor layer to provide real-time monitoring functions, and cooperate with the micro-heating units at the middle intelligent control layer to control the micro-heating units at various positions according to changes in environmental information, the repair effect of the internally controllable dynamic bonds, and the rupture repair effect of the externally controllable microcapsules, to achieve the technical effect of intelligent control of cable repair.

[0032] The second purpose of the present invention is to provide an intelligent repair system that can automatically adjust the repair strategy according to changes in environmental conditions to ensure that the cable can maintain good self-repair capabilities in various harsh environments.

[0033] The above technical objectives of the present invention are achieved through the following technical solutions: An intelligent repair system for a self-repairing intelligent cable comprises the following steps: Step 1: Damage perception: monitor the damage status in real time and calculate the comprehensive damage amount.

[0034] Step 2: Repair strategy selection: Dynamically allocate repair resources, combining microcapsule repair and dynamic bond repair.

[0035] Step 3: Repair triggering and dynamic modeling: precise heating triggers microcapsule release and dynamic bond reaction; Step 4: Performance optimization: optimize repair efficiency and cost by minimizing the objective function. Step 5: Closed-loop feedback: real-time monitoring of repair effects, dynamic adjustment of repair strategies and trigger parameters; after the closed-loop feedback is completed, the closed-loop cycle of steps 1 to 5 is dynamically repeated.

[0036] The present invention is further configured as follows: the damage sensing stage further includes: the optical fiber sensor detects the spatial distribution of stress σ(x, y, z) and strain ε(x, y, z), and calculates the comprehensive damage amount D total :

[0037] Where, σ(x,y,z): stress distribution, measured by optical fiber sensor; ε(x,y,z): strain distribution, measured by optical fiber sensor; V: Spatial volume of the damaged area.

[0038] The present invention is further configured as follows: the repair strategy selection stage further includes: according to the degree of damage, the system dynamically determines the allocation ratio of the repair resources and adopts the following comprehensive repair strategy: ; Among them, S repair : Comprehensive repair strategy; S microcapsule : Repair contribution of microcapsule repair layer; S dynamic : The repair contribution of the dynamic key repair layer; α1, α2: weight coefficients, satisfying α1+α2=1; The weight coefficients in the repair strategy control stage are dynamically adjusted: when D total When D is smaller, the microcapsule repair layer is triggered first; total When the crack is large and accompanied by crack expansion, the dynamic bond repair layer is activated first.

[0039] The present invention is further configured as follows: the repair triggering stage further includes: accurately controlling the local temperature through a micro-heating unit to achieve the triggering of microcapsule release and dynamic bond reaction; The formula of the release amount R(t) of the microcapsule repair agent over time t is as follows: ; Where, R(t): the amount of repair agent released at time t; Rmax : Maximum amount of repair agent released; λ: Release rate constant, which depends on the temperature control of the micro-heating unit; The breaking and recombination of dynamic bonds follow the chemical reaction kinetics, and the reaction rate v(t) is expressed as follows: ; Among them, k f : bond formation rate constant, which increases with increasing temperature; k r : bond breaking rate constant, which increases with increasing temperature; [A], [B]: concentrations of reactants; [AB]: concentration of dynamic bonds.

[0040] The present invention is further configured as follows: the repair performance optimization stage includes: optimizing by minimizing the comprehensive damage evaluation index J: Among them, C repair is the repair cost, η repair is the repair efficiency, w1, w2, w3 are weight coefficients; At the same time, the following constraints are met: Repair response time t repair ≤t threshold ;Performance retention rate after repair P repair ≥P initial ×β;t threshold is the repair time threshold, P initial is the initial performance, β is the performance retention rate threshold; The closed-loop feedback control stage also includes: monitoring the repair effect in real time through the optical fiber sensor; when φ(t)≥1 and η repair ≥η threshold ; If the condition is not met, adjust the repair strategy S repair and the working parameters of the micro-heating unit until the repair completion criteria are met.

[0041] In summary, the present invention has the following beneficial effects: In the present invention, through the design of a multi-level intelligent collaborative self-repairing system, the problem of insufficient adaptability of existing technologies in extreme environments is solved from the levels of molecular structure and chemical reaction mechanism. The technical effect is reflected in the significant improvement of self-repairing performance and material stability under complex conditions such as high temperature, low temperature, strong vibration, radiation and chemical corrosion.

[0042] Under high temperature conditions, the present invention utilizes the reversible Diels-Alder reaction of the dynamic bond network to demonstrate self-healing capabilities. In a high temperature environment, after the cross-linked chemical bonds of the dynamic bond structure are broken, the healing of the cracks is achieved through high-temperature reorganization of the molecular chains, thereby restoring the integrity and mechanical properties of the material. In addition, the micro-heating unit further enhances the repair efficiency of the dynamic bonds through precise local heating, while triggering the outer double-wall microcapsules to release the repair agent, quickly forming a highly cross-linked chemically cured network at the crack. Thermosensitive phase change materials absorb excess heat and reduce the concentration of thermal stress in the crack area, thereby avoiding degradation of the overall performance of the material. The multi-layer synergistic effect in a high temperature environment effectively guarantees the functional stability of the material.

[0043] Under low temperature conditions, the present invention ensures the healing ability of cracks through dynamic thermal energy regulation and chemical repair reactions. Low temperature usually causes the molecular chains of the material to freeze and the chemical reaction rate to decrease, but the thermosensitive phase change material of the present invention releases stored heat to regulate the temperature of the crack area to a range suitable for the repair reaction, thereby overcoming the inhibitory effect of the low temperature environment on the repair reaction. At the same time, the design of the microcapsule repair agent optimizes low-temperature fluidity, allowing it to expand rapidly at the crack and form a strong cross-linked network through the ring-opening polymerization reaction of the curing agent, thereby restoring the material performance. The dynamic bond network maintains the flexibility of the molecular chain at low temperatures, effectively slowing down the expansion of cracks and ensuring the integrity of the inner basic insulation layer.

[0044] Under strong vibration conditions, the present invention significantly improves the vibration resistance through the stress dispersion ability of multi-layer materials. The stress dispersion network formed by the nano-layered silicate and thermoplastic elastomer in the middle intelligent control layer effectively absorbs and disperses vibration energy at the molecular level, reducing the risk of crack propagation caused by damage concentration. At the same time, the dynamic bond network further absorbs vibration energy and repairs damaged areas through the reversible fracture and recombination of chain segments during the vibration process. The microcapsule repair agent is triggered and released at the crack due to the stress concentration caused by vibration, and its curing reaction forms a cross-linked structure at the molecular level, which enhances the fatigue resistance at the crack, thereby significantly improving the service life of the cable in a strong vibration environment.

[0045] In a radiation environment, the present invention achieves the radiation resistance of the material through the synergistic effect of multifunctional nanofillers and dynamic bond networks. The nano-graphene oxide and nano-zirconium oxide in the outermost protective coating have excellent radiation shielding capabilities, protecting the inner layer materials from direct damage by high-energy radiation at the molecular level. The chemical structure of the dynamic bond network is naturally stable to radiation, and can still maintain reversible reaction characteristics in a radiation environment, ensuring the self-healing ability of cracks. At the same time, the multi-layer design of the outer wall of the microcapsule enhances its mechanical strength against radiation, avoiding premature rupture caused by high-energy radiation, thereby ensuring that the release of the repair agent can be carried out according to the cable repair requirements.

[0046] In a chemically corrosive environment, the present invention achieves excellent corrosion resistance through the chemical stability design of the multi-layer structure. The outermost silicone-modified acrylic resin coating has excellent acid and alkali resistance and antioxidant properties at the molecular level, and can block the invasion of corrosive media for a long time. Even if local damage occurs, the microcapsule repair agent quickly fills the cracks through the curing reaction of the epoxy resin and forms a dense cross-linked network to prevent the further diffusion of the corrosive medium. Nanofillers (such as aluminum oxide and graphene oxide) further enhance the chemical corrosion resistance of the overall material, ensuring that the performance of the repaired material can be stable for a long time.

[0047] Through the organic integration of dynamic bond networks, microcapsule repair technology, thermosensitive phase change materials and micro-heating units, a multi-level intelligent collaborative repair system has been constructed. The dynamic bond network provides reversible repair capabilities at the molecular level, the microcapsules achieve rapid crack filling through chemical reactions, the thermosensitive phase change materials regulate the thermodynamic environment of the crack area, and the micro-heating units accurately trigger key repair reactions. This multifunctional collaborative repair mechanism significantly improves the adaptability, repair efficiency and long-term performance stability of the material in extreme environments such as high temperature, low temperature, strong vibration, radiation and chemical corrosion.

[0048] In addition, the intelligent repair system described in the present invention constructs a complete closed-loop control system of perception-analysis-decision-execution-feedback through the organic combination of optical fiber sensors and micro-heating units. The system uses optical fiber sensors to monitor the stress and strain distribution of cables in real time, calculates the comprehensive damage amount, and realizes accurate positioning and rapid response of damage; dynamically adjusts the weight ratio of microcapsule repair and dynamic bond repair through intelligent algorithms to ensure the optimal allocation of repair resources; uses micro-heating units for local precision heating to control the release rate of repair agents and dynamic bond reaction kinetics, avoiding energy waste caused by global heating. At the same time, the system realizes multi-objective optimization by minimizing comprehensive evaluation indicators, which not only ensures the quality of repair but also controls the cost of repair, and continuously monitors and dynamically adjusts the repair strategy during the repair process to ensure that the repair effect reaches the expected goal. This intelligent repair solution breaks through the limitations of traditional passive repair and realizes intelligent control of the entire process from damage discovery-damage analysis-optimization strategy-execution of repair-evaluation of effect. The system can not only adapt to different types and degrees of damage, but also adaptively adjust the repair parameters according to actual conditions, significantly improving the reliability and service life of cables in extreme environments. Through local precision heating and optimized allocation of repair resources, the system also minimizes energy consumption and material usage, with good economic benefits and environmental protection effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 Flowchart of the intelligent repair system. DETAILED DESCRIPTION

[0050] The present invention is further described in detail below in conjunction with the accompanying drawings.

[0051] A preparation process of a self-repairing intelligent cable comprises the following steps: Step 1: Conductor pretreatment, including: annealing in an inert atmosphere or vacuum environment at 300-400℃ for 10-20 minutes; chemical cleaning with 5%-10% dilute nitric acid or 5%-8% phosphoric acid solution, neutralization, and rinsing with deionized water; surface activation by 60-80W argon plasma treatment for 30-60 seconds. Arrange and fix the optical fiber sensor coated with a 10-20μm thick polyimide protective layer along the conductor surface, and cover it with a 20-30μm thick polyurethane or polyimide protective film; Step 2: Preparation of the inner basic insulation layer, including: The prepolymer is prepared by stirring at 100-120°C for 1-1.5 hours and is composed of 60-70 parts of unsaturated polyester resin, 15-20 parts of maleimide modifier, 10-15 parts of diene monomer, 2-3 parts of photoinitiator, 1-2 parts of thermal initiator and 0.5-1 parts of free radical scavenger; the prepolymer is irradiated with UV light at an intensity of 2000-2500mW / cm² for 15-20 minutes, and then heat-cured at 140-150°C for 30-40 minutes; the prepolymer is extruded at 100-110°C and at a rate of 15-20m / min.

[0052] The above-mentioned photoinitiator (2-3 parts) can be selected from 1,1-dimethyl-2-hydroxybenzophenone, 2-hydroxy-2-methyl-1-phenylacetone (Darocur® 1116), 2,4,6-trimethylbenzoyldiphenylphosphine oxide (TPO), isopropylthioxanthone (ITX). The thermal initiator (1-2 parts) can be selected from dibenzoyl peroxide (BPO), dicumyl peroxide (DCB), azobisisobutyronitrile (AIBN), di-tert-butyl peroxide (DTBP). The free radical scavenger (0.5-1 parts) can be selected from 2,2,6,6-tetramethylpiperidinoxide (TEMPO), 2,6-di-tert-butyl-4-methylphenol (BHT), hydroquinone (Hydroquinone).

[0053] Step 3: Preparation of the intermediate intelligent control layer, including: The thermosensitive phase change material is prepared by mixing 45-50 parts of n-octadecane, 25-30 parts of paraffin wax, 15-20 parts of polyethylene glycol and 3-5 parts of nano-carbon fibers at 70-75°C for 1000-1200s -1 Shear rate mixing and forced cooling at 5-10℃ / min; A stress dispersion network is prepared by mixing 55-60 parts of a thermoplastic elastomer and 8-10 parts of a nano-layered silicate at 160-180° C. for 15-20 minutes; Prepare and arrange the micro heating unit, including sputtering a 10-20 μm thick nickel-chromium alloy film or spin coating a 1-5 μm thick gold nanorod coating, laser etching into a serpentine or grid shape, and coating a 10-20 μm thick polyimide insulating layer to obtain the micro heating unit; The above materials are co-extruded at 150-160°C and at a rate of 10-15m / min by using a multi-layer co-extrusion technology; Among them, the thermoplastic elastomer (55-60 parts) can be selected from: SBS (styrene-butadiene-styrene block copolymer), SEBS (hydrogenated styrene-butadiene-styrene block copolymer), TPU (thermoplastic polyurethane elastomer), POE (polyolefin elastomer). The nano-layered silicate (8-10 parts) can be selected from: montmorillonite (MMT), kaolin, hydrotalcite, layered lithium silicate.

[0054] Step 4: Preparation of the outer repair layer, including: Double-walled microcapsules are prepared by emulsion polymerization. The inner layer repair agent consists of 70-80 parts of epoxy resin, 20-25 parts of imidazole curing agent, 3-5 parts of nano silicon dioxide and 2-3 parts of polyether modified silicone oil. The inner wall material consists of 60-70 parts of octadecyl normal alkane, 25-30 parts of polyvinyl alcohol, 5-8 parts of nano aluminum oxide and 2-3 parts of glutaraldehyde. The outer wall material consists of 65-75 parts of melamine-formaldehyde prepolymer, 3-5 parts of nano graphene oxide and 8-10 parts of nano zirconium oxide. The particle size of the double-walled microcapsules is controlled within the range of 5-10 μm.

[0055] In a twin-screw mixer, mixing at 125-135° C. for 15-20 minutes prepares a composite insulation layer comprising 50-60 parts of low-density polyethylene, 20-25 parts of ethylene-vinyl acetate copolymer, 10-15 parts of double-wall microcapsules, 3-5 parts of nano-aluminum nitride, 0.5-1 parts of an antioxidant and 1-2 parts of a maleic anhydride grafted PE compatibilizer; Extrusion molding at 140-150°C at a rate of 12-15m / min; Among them, antioxidants (0.5-1 part) can be selected: BHT (2,6-di-tert-butyl-p-cresol), Irganox 1010 (pentaerythritol tetrakis [3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate]), Irganox 1076 (octyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate), Irgafos 168 (tris (2,4-di-tert-butylphenyl) phosphite).

[0056] Maleic anhydride grafted PE compatibilizer (1-2 parts) optional: POE-g-MAH (maleic anhydride grafted polyolefin elastomer), HDPE-g-MAH (maleic anhydride grafted high density polyethylene), LLDPE-g-MAH (maleic anhydride grafted linear low density polyethylene), PE-g-MAH (maleic anhydride grafted polyethylene).

[0057] Step 5, the outermost protective layer is prepared, including: using 80-100W argon plasma treatment for 15-20 seconds, working gas pressure 30-40Pa; applying a 20-25μm thick silicone modified acrylic resin coating, pre-drying at 60-65℃ for 10-15 minutes, curing at 120-130℃ for 20-30 minutes, sealing and packaging, and using a polytetrafluoroethylene tube to encapsulate the optical fiber and the heating unit interface and connect the external demodulator.

[0058] Based on the above content, the present invention provides the following experiments to verify the performance of the above self-repairing cable, as follows: 1. Group design: Five experimental groups:

[0059] Three control groups:

[0060] 2. Test equipment and standards Table 1: High temperature environment test standards (120°C)

[0061] Table 2: Low temperature environment test standards (-20℃)

[0062] Table 3: Vibration environment test standards

[0063] Table 4: Chemical corrosion test standards

[0064] Table 5: Radiation environment test standards

[0065] Quality control requirements: 1. All test equipment has passed annual inspection and calibration 2. Test at least 5 parallel samples in each group 3. Use 95% confidence interval 4. Outliers are eliminated using the Q test method 5. Data analysis using standard statistical methods 3. Experimental data: Table 6: Comparison of repair performance under high temperature environment (120℃)

[0066] Table 7: Comparison of repair performance under low temperature environment (-20℃)

[0067] Table 8: Comparison of fatigue performance under strong vibration environment (50Hz, 2g acceleration)

[0068] Table 9: Comparison of corrosion resistance under chemical corrosion environment (5% HCl solution, 168h)

[0069] Table 10: Comparison of radiation resistance performance under radiation environment (γ-ray, 100kGy)

[0070] IV. Conclusion 1. Group A4 (with increased dynamic bond network components) performed best under high temperature and strong vibration environments, showing higher repair efficiency and mechanical stability.

[0071] 2. Group A2 (increased carbon fiber content) performs well in low temperature environments, providing better low temperature toughness and thermal conductivity.

[0072] 3. Group A3 (increased nano-zirconia content) has better protection performance in radiation environment, but the overall repair performance is slightly lower than the A1 standard formula.

[0073] 4. Although the content of repair agent was increased in group A5 (increasing the content of microcapsules), the overall performance was slightly lower than that of other experimental groups due to the impact on the integrity of the matrix material.

[0074] 5. All experimental groups were significantly better than the control group, verifying the effectiveness of the multi-level intelligent collaborative repair system.

[0075] like Figure 1 As shown, an intelligent repair system for a self-repairing intelligent cable, in conjunction with the optical fiber sensor and micro-heating unit in the above-mentioned self-repairing intelligent cable, realizes the selection of the optimal repair scheme to self-repair the cable under damage, and the specific steps are as follows: Damage perception (fiber optic sensor): real-time monitoring of damage status and calculation of comprehensive damage amount.

[0076] Repair strategy selection: Dynamic allocation of repair resources, combining microcapsule repair and dynamic bond repair.

[0077] Repair Trigger (Micro Heating Unit): Precise heating triggers microcapsule release and dynamic bond response.

[0078] Performance optimization: Optimize repair efficiency and cost by minimizing the objective function.

[0079] Closed-loop feedback: Real-time monitoring of repair effects and dynamic adjustment of repair strategies and trigger parameters.

[0080] Through the above closed-loop algorithm, a complete closed-loop process of the intelligent repair system is realized, which improves the repair performance and reliability. The details are as follows: 1. Damage perception stage Fiber optic sensors are used to monitor the damage status of cables in real time and collect data on the location, size and severity of the damage.

[0081] Calculation of comprehensive damage: The optical fiber sensor detects the spatial distribution of stress σ(x,y,z) and strain ε(x,y,z) and calculates the comprehensive damage amount D total : ; Where, σ(x,y,z): stress distribution, measured by fiber optic sensor.

[0082] ε(x,y,z): strain distribution, measured by fiber optic sensor.

[0083] V: Spatial volume of the damaged area.

[0084] 2. Repair strategy selection stage According to the degree of damage, the system dynamically determines the allocation ratio of repair resources and optimizes it by combining microcapsule repair and dynamic bond repair mechanisms.

[0085] Repair strategy control: Comprehensive Restoration Strategy repair Defined as:

[0086] Among them, S repair : Comprehensive restoration strategy.

[0087] S microcapsule : Restoration contribution of microcapsule repair layer.

[0088] S dynamic : The repair contribution of the dynamic key repair layer.

[0089] α1, α2: weight coefficients, satisfying α1+α2=1.

[0090] The weight coefficients in the repair strategy regulation phase are dynamically adjusted: When D total When it is smaller, the microcapsule repair layer is triggered preferentially (i.e., α1 is increased).

[0091] When D total When it is larger and accompanied by crack extension, the dynamic bond repair layer is preferentially activated (i.e., α2 is increased).

[0092] 3. Repair trigger and dynamic modeling stage The micro-heating unit acts as a precise trigger in the repair mechanism, and its triggering process is related to the dynamic release of microcapsules and the dynamic bond chemical reaction.

[0093] (1) Microcapsule repair layer The microcapsule release model is as follows: The release amount R(t) of the microcapsule repair agent over time t is expressed as follows:

[0094] Where, R(t): the amount of repair agent released at time t.

[0095] R max : Maximum release of repair agent.

[0096] λ: release rate constant, which depends on the temperature control of the micro-heating unit.

[0097] Secondly, when releasing the repair agent, the crack filling rate is defined for the filling of the crack. The crack filling rate φ(t) is defined as:

[0098] V repair (t): Volume filled with restorative agent.

[0099] V crack : The initial volume of the crack.

[0100] When φ(t)≥1, it indicates that the crack repair is completed.

[0101] As described above, the micro-heating unit optimizes the release of the microcapsule repair agent by controlling the local temperature, so that the cracks are quickly filled.

[0102] (2) Dynamic key repair layer model The breaking and recombination of dynamic bonds follow the chemical reaction kinetics, and the reaction rate v(t) is expressed as follows:

[0103] Among them, k f : The bond formation rate constant increases with increasing temperature.

[0104] k r: The bond breaking rate constant increases with increasing temperature.

[0105] [A],[B]: concentrations of reactants.

[0106] [AB]: Concentration of dynamic bonds.

[0107] As mentioned above, the micro heating unit provides precise heating and regulates local temperature, making k f and k r Achieve an optimal balance and promote rapid reorganization of dynamic bonds.

[0108] Secondly, for the repair effect of dynamic bonds, the repair efficiency is defined as η repair , the formula is as follows:

[0109] Among them, [AB] final : The concentration of dynamic bonds formed after repair is completed.

[0110] [AB] total : The total concentration of dynamic bonds in the system.

[0111] The dynamic bond repair layer completes the breaking and reorganization of the molecular chain under the triggering of the micro-heating unit, improving the repair efficiency η repair .

[0112] 4. Repair performance optimization phase The core of repair performance optimization is to minimize the amount of damage and repair cost while maximizing the repair efficiency, and dynamically adjust the repair strategy and resource allocation. Therefore, combining the above factors, the optimization goal is defined as minimizing the comprehensive damage evaluation index J:

[0113] Among them, D total : Comprehensive damage amount, detected by optical fiber sensor. w1, w2, w3 are weight coefficients.

[0114] C repair : Repair cost, including the accumulation of energy consumption, material consumption and repair time, is as follows:

[0115] η repair : Repair efficiency, calculated by the performance recovery ratio after the microcapsule and dynamic bond repair is completed.

[0116] In addition, during the repair process, constraints need to be defined to limit the limit of the self-repair process. The constraints are as follows:

[0117] Repair response time: trepair ≤t threshold Repair performance retention rate: P repair ≥P initial *β t repair :The time required for repair is determined by the heating rate of the micro-heating unit and the release rate of the repair agent.

[0118] t threshold : The threshold of the repair response time, which indicates the longest repair time that the repair system can accept.

[0119] P initial : Initial performance before repair, indicating the performance baseline value of the cable when it is not damaged.

[0120] β: Performance retention rate threshold, which indicates the minimum requirement of the performance after repair relative to the initial performance, and its value range is 0≤β≤1.

[0121] R final : Performance parameters after repair (such as insulation resistance, thermal conductivity, etc.).

[0122] R initial : Performance parameters before repair, indicating the benchmark performance value of the cable in its initial state.

[0123] P repair : The performance after repair (such as insulation performance) is calculated by the performance recovery rate formula: 5. Closed-loop control and feedback After the repair is completed, the stress and strain distribution in the repair area is detected by the optical fiber sensor, and D total , determine whether the repair completion conditions are met: The repair completion conditions are as follows: φ(t)≥1 and η repair ≥η threshold .

[0124] If the condition is not met, adjust the repair strategy S repair and the working parameters of the micro-heating unit until the repair completion criteria are met.

[0125] The above-mentioned intelligent repair system realizes the organic combination of fiber optic sensors and micro heating units, and realizes intelligent, adaptive and efficient repair functions through a complete closed-loop process of perception, triggering, repair and optimization.

[0126] First, the system uses optical fiber sensors to sense material damage in real time. By accurately measuring stress σ(x, y, z) and strain ε(x, y, z), combined with the spatial volume V of the damaged area, the comprehensive damage amount D is calculated.total , achieving comprehensive quantification of damage location, size and severity, providing a data basis for subsequent repair. Unlike traditional repair methods that rely on manual inspection or offline measurement, this real-time online monitoring method significantly improves efficiency and accuracy, and can trigger the repair process in time at the early stage of damage to prevent further crack expansion.

[0127] In the repair mechanism selection stage, the system is total The size of the dynamic adjustment repair strategy combines the two mechanisms of microcapsule repair and dynamic bond repair, and through the comprehensive repair strategy formula S repair The repair resources are weighted. When the damage is small, the system preferentially triggers the microcapsule repair layer (increases α1) to quickly fill the crack by releasing the repair agent; when the damage is large or the crack expands, the system preferentially activates the dynamic bond repair layer (increases α2) to restore the mechanical properties of the material by breaking and reorganizing the bonds. Compared with a single repair mechanism, this collaborative repair method significantly improves the adaptability and repair effect of the system.

[0128] During the repair triggering and dynamic modeling stage, the micro-heating unit triggers the repair process through precise local heating, dynamically regulates the temperature of the repair area, and controls the repair agent release rate R(t) of the microcapsule repair layer, so that the repair agent is efficiently released and fills the cracks; in addition, it can also optimize the bond breaking and recombination rate by adjusting the chemical reaction rate v(t) of the dynamic bond repair layer. Precision heating not only accelerates the repair process, but also significantly reduces energy consumption. Compared with traditional global heating technology, it is more efficient and energy-saving. In addition, the micro-heating unit avoids heating the entire material, reducing potential damage to the material's intrinsic properties.

[0129] The optimization phase of the system realizes the dynamic optimization of the repair process by introducing mathematical modeling and objective function J. The objective function comprehensively considers the damage amount D total , Repair cost C repair and repair efficiency η repair , by minimizing J to ensure the balance between the repair effect and the use of repair resources. At the same time, the system also sets the repair time t repair ≤ t threshold and performance retention rate P repair ≥ P initial · β and other constraints to ensure that the repair process is completed within the specified time and restore the material performance to a level that meets the requirements. Through real-time feedback from the optical fiber sensor, the system can dynamically adjust the repair strategy S repair And the working parameters of the micro heating unit form an optimized closed loop to ensure that the repair effect meets the standards.

[0130] The combination of fiber optic sensors and micro-heating units enables the system to form a complete closed-loop process from damage perception, repair triggering, repair implementation to performance optimization. Compared with traditional repair methods, the system significantly reduces energy consumption and material waste, while avoiding secondary damage caused by overheating or excessive repair agents, and protecting the overall performance and service life of the material to the greatest extent. The multi-layer repair mechanism enables the system to adapt to different types and degrees of damage, and can achieve efficient repair from minor cracks to complex structural damage.

[0131] In summary, the intelligent repair system improves repair efficiency and reliability, reduces repair costs, and is flexible and adaptable through a closed-loop process of perception, triggering, repair, and optimization.

[0132] The following example calculates the operation process of the above algorithm: 1. Known parameters and scene settings Stress and strain distribution measured by optical fiber sensors: Stress σ(x, y, z) = 50 MPa (uniform distribution, crack region is a rectangular volume).

[0133] Strain ε(x, y, z) = 0.002.

[0134] The crack area volume V = 10 mm³.

[0135] Microcapsule repair layer parameters: Maximum repair agent release R max = 5 mm³.

[0136] Release rate constant λ = 0.1 s -1 .

[0137] Dynamic Key Repair Layer Parameters: Total dynamic bond concentration [AB] total = 1.0 mol / L.

[0138] Initial dynamic bond concentration [AB] initial = 0.6 mol / L.

[0139] Bond formation rate constant k f = 0.05 L / (mol·s).

[0140] Bond breakage rate constant k r = 0.02 s -1 .

[0141] System goals and constraints: Repair response time threshold t threshold = 30 min.

[0142] The performance retention rate threshold β = 0.8.

[0143] Initial performance P initial = 100 MPa.

[0144] 2. Damage-Aware Computing formula:

[0145] Since the damage area is uniformly distributed, the formula is simplified to: D total = σ * ε * V Substitute the known parameters: D total = 50 MPa * 0.002 * 10 mm³ D total = 1.0 MPa mm³ That is: the comprehensive damage amount is D total = 1.0 MPa mm³.

[0146] 3. Calculation of microcapsule repair layer 3.1 Calculation of the amount of repair agent released formula:

[0147] Assume t = 20 s and substitute the parameters: R(20) = 5 mm³ * (1 e^(-0.1 * 20)) R(20) = 5 mm³ * (1 e^(-2)) R(20) ≈ 5 mm³ * (1 0.1353) R(20) ≈ 5 mm³ * 0.8647 R(20) ≈ 4.32 mm³ At t = 20 s, the amount of healing agent released from the microcapsules was R(20) ≈ 4.32 mm³.

[0148] 3.2 Calculation of crack filling rate formula:

[0149] Substitute the parameters: φ(20) = 4.32 mm³ / 10 mm³ φ(20) = 0.432 Results: At t = 20 s, the crack filling ratio is φ(20) = 0.432. The crack is not yet completely filled.

[0150] 4. Dynamic key repair layer calculation 4.1 Kinetic model formula:

[0151] Assuming the initial concentration [A] = [B] = 0.2 mol / L, substitute the parameters: v(t) = 0.05 * 0.2 * 0.2-0.02 * 0.6 v(t) = 0.05 * 0.04-0.012 v(t) = 0.002-0.012 v(t) = -0.01 mol / (L·s) Results: The dynamic bond breaking rate is slightly greater than the formation rate, and the temperature needs to be increased by a micro-heating unit to increase k f .

[0152] 4.2 Repair efficiency calculation formula:

[0153] Assume that after heating, the reaction equilibrium adjusts, [AB] final = 0.9 mol / L, substitute the parameters: η repair = 0.9 / 1.0 η repair = 0.9 Results: Dynamic bond repair efficiency is η repair = 90%.

[0154] 5. Objective function calculation formula:

[0155] Assume weights w1 = 0.5, w2 = 0.3, w3 = 0.2, and the repair cost C repair = 100 units, substituting the parameters: J = 0.5 * 1.0 + 0.3 * 100 + 0.2 * (1 0.9) J = 0.5 + 30 + 0.2 * 0.1 J = 0.5 + 30 + 0.02 J = 30.52 Results: The comprehensive damage repair evaluation index was J = 30.52.

[0156] 6. Closed-loop feedback and adjustment Determine the repair completion conditions: The crack filling rate φ(t) = 0.432 < 1, and the repair agent needs to be released further.

[0157] Dynamic bond repair efficiency η repair = 0.9 ≥ β = 0.8, which meets the performance retention requirement.

[0158] Adjust the repair strategy: Increasing the power of the micro-heating unit can improve the microcapsule release rate constant λ.

[0159] The optical fiber sensor monitors in real time and stops heating after confirming that the crack is filled.

[0160] By adjusting the power and timing of the micro-heating units, the system can continue to optimize the repair process and ultimately achieve complete repair.

[0161] This specific embodiment is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed. However, as long as they are within the scope of the claims of the present invention, they are protected by the patent law.

Claims

1. A preparation process of a self-repairing intelligent cable, characterized in that: According to the weight ratio, the preparation from the inner layer to the outside includes the following steps: Step 1: Conductor pretreatment; Step 2: Preparation of the inner basic insulation layer, including: Stirring at 100-120° C. for 1-1.5 hours to prepare a dynamic bond network prepolymer consisting of 60-70 parts of unsaturated polyester resin, 15-20 parts of maleimide modifier, 10-15 parts of diene monomer, 2-3 parts of photoinitiator, 1-2 parts of thermal initiator and 0.5-1 parts of free radical scavenger; UV curing, extrusion; Step 3: Preparation of the intermediate intelligent control layer, including: The thermosensitive phase change material is prepared by mixing 45-50 parts of n-octadecane, 25-30 parts of paraffin wax, 15-20 parts of polyethylene glycol and 3-5 parts of nano-carbon fibers at 70-75°C for 1000-1200s -1 Shear rate mixing and forced cooling at 5-10℃ / min; A stress dispersion network is prepared by mixing 55-60 parts of a thermoplastic elastomer and 8-10 parts of a nano-layered silicate at 160-180° C. for 15-20 minutes; Prepare and arrange the micro heating unit, including sputtering a 10-20 μm thick nickel-chromium alloy film or spin coating a 1-5 μm thick gold nanorod coating, laser etching into a serpentine or grid shape, and coating a 10-20 μm thick polyimide insulating layer to obtain the micro heating unit; The above materials are co-extruded at 150-160°C and at a rate of 10-15m / min by using a multi-layer co-extrusion technology; Step 4: Preparation of the outer repair layer, including: Double-walled microcapsules are prepared by emulsion polymerization, wherein the inner layer repair agent is composed of 70-80 parts of epoxy resin, 20-25 parts of imidazole curing agent, 3-5 parts of nano-silicon dioxide and 2-3 parts of polyether modified silicone oil, the inner wall material is composed of 60-70 parts of octadecyl normal alkane, 25-30 parts of polyvinyl alcohol, 5-8 parts of nano-alumina and 2-3 parts of glutaraldehyde, and the outer wall material is composed of 65-75 parts of melamine-formaldehyde prepolymer, 3-5 parts of nano-graphene oxide and 8-10 parts of nano-zirconium oxide; In a twin-screw mixer, mixing at 125-135° C. for 15-20 minutes prepares a composite insulation layer comprising 50-60 parts of low-density polyethylene, 20-25 parts of ethylene-vinyl acetate copolymer, 10-15 parts of double-wall microcapsules, 3-5 parts of nano-aluminum nitride, 0.5-1 parts of an antioxidant and 1-2 parts of a maleic anhydride grafted PE compatibilizer; Extrusion molding at 140-150°C at a rate of 12-15m / min; Step 5: Preparation of the outermost protective layer, including: plasma treatment, post-coating with a silicone-modified acrylic resin coating, sealing and packaging, and using a polytetrafluoroethylene tube to encapsulate the optical fiber and the heating unit interface and connect to an external demodulator.

2. The preparation process according to claim 1, characterized in that: The conductor pretreatment steps are: annealing in an inert atmosphere to eliminate the internal stress of the conductor, removing the oxide on the surface of the conductor by acid solution and neutralizing and rinsing, treating the cleaned conductor with argon plasma, arranging and fixing the optical fiber sensor coated with a 10-20 μm thick polyimide protective layer along the surface of the conductor, and covering it with a 20-30 μm thick polyurethane or polyimide protective film; Annealing, cleaning and plasma treatment are specifically as follows: annealing in an inert atmosphere or vacuum environment at 300-400°C for 10-20 minutes; chemical cleaning with 5%-10% dilute nitric acid or 5%-8% phosphoric acid solution, neutralization, and rinsing with deionized water; surface activation by 60-80W argon plasma treatment for 30-60 seconds.

3. The preparation process according to claim 1, characterized in that: The UV curing and extrusion steps are: using UV light with an intensity of 2000-2500mW / cm² for 15-20 minutes, then heat curing at 140-150°C for 30-40 minutes; and extruding at 100-110°C at a speed of 15-20m / min.

4. The preparation process according to claim 1, characterized in that: The particle size of the double-wall microcapsules is controlled within the range of 5-10 μm.

5. The preparation process according to claim 1, characterized in that: The plasma treatment in the outermost protective layer preparation step and the coating of the organosilicon-modified acrylic resin coating are specifically as follows: 80-100W argon plasma treatment for 15-20 seconds, working gas pressure 30-40Pa; coating a 20-25μm thick organosilicon-modified acrylic resin coating, pre-drying at 60-65°C for 10-15 minutes, and curing at 120-130°C for 20-30 minutes.

6. An intelligent repair system for a self-repairing intelligent cable, characterized in that: The steps include: Step 1: Damage perception: Use optical fiber sensors to monitor the damage status in real time and calculate the comprehensive damage amount; Step 2: Repair strategy selection: Dynamic allocation of repair resources, combining microcapsule repair and dynamic bond repair; Step 3: Repair triggering and dynamic modeling: precise heating triggers microcapsule release and dynamic bond response; Step 4: Performance optimization: optimize the repair efficiency and cost by minimizing the objective function; Step 5: Closed-loop feedback: real-time monitoring of repair effects, dynamic adjustment of repair strategies and trigger parameters; After the closed-loop feedback is completed, the closed-loop cycle of steps one to five is dynamically repeated.

7. The intelligent repair system of the self-repairing intelligent cable according to claim 6, characterized in that: The damage sensing stage also includes: the optical fiber sensor detects the spatial distribution of stress σ(x, y, z) and strain ε(x, y, z), and calculates the comprehensive damage amount D total : ； Where, σ(x,y,z): stress distribution, measured by optical fiber sensor; ε(x,y,z): strain distribution, measured by optical fiber sensor; V: Spatial volume of the damaged area.

8. The intelligent repair system of the self-repairing intelligent cable according to claim 6, characterized in that: The repair strategy selection stage also includes: according to the degree of damage, the system dynamically determines the allocation ratio of repair resources and adopts the following comprehensive repair strategy: ; Among them, S repair : Comprehensive repair strategy; S microcapsule : Repair contribution of microcapsule repair layer; S dynamic : repair contribution of the dynamic key repair layer; α1, α2: weight coefficients, satisfying α1+α2=1; The weight coefficient in the repair strategy regulation stage is dynamically adjusted: when D total When D is smaller, the microcapsule repair layer is triggered first; total When the crack is large and accompanied by crack expansion, the dynamic bond repair layer is activated first.

9. The intelligent repair system of the self-repairing intelligent cable according to claim 6, characterized in that: The repair triggering stage also includes: accurately controlling the local temperature through a micro-heating unit to achieve the triggering of microcapsule release and dynamic bond reaction; The formula of the release amount R(t) of the microcapsule repair agent over time t is as follows: ; Where, R(t): the amount of repair agent released at time t; R max : Maximum amount of repair agent released; λ: Release rate constant, which depends on the temperature control of the micro-heating unit; The breaking and recombination of dynamic bonds follow the chemical reaction kinetics, and the reaction rate v(t) is expressed as follows: ; where k f : bond formation rate constant, which increases with increasing temperature; k r : bond breaking rate constant, which increases with increasing temperature; [A], [B]: concentrations of reactants; [AB]: concentration of dynamic bonds.

10. The intelligent repair system of the self-repairing intelligent cable according to claim 6, characterized in that: The repair performance optimization stage includes: optimizing by minimizing the comprehensive damage evaluation index J: Among them, C repair is the repair cost, η repair is the repair efficiency, w1, w2, w3 are weight coefficients; At the same time, the following constraints are met: Repair response time t repair ≤t threshold ; Performance retention rate after repair P repair ≥P initial ×β;t threshold is the repair time threshold, P initial is the initial performance, β is the performance retention rate threshold; The closed-loop feedback control stage also includes: monitoring the repair effect in real time through the optical fiber sensor; when φ(t)≥1 and η repair ≥η threshold ; If the condition is not met, adjust the repair strategy S repair and the working parameters of the micro-heating unit until the repair completion criteria are met.

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